Motherboard components and electronic devices
By setting up support components in the cavity between printed circuit boards and welding them together, the problems of large area occupation and few components in the printed circuit board stacking structure are solved, thereby improving structural strength and space utilization efficiency.
CN115604918BActive Publication Date: 2026-05-26VIVO MOBILE COMM CO LTD
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- VIVO MOBILE COMM CO LTD
- Filing Date
- 2022-10-31
- Publication Date
- 2026-05-26
Smart Images
Figure CN115604918B_ABST
Abstract
This application discloses a motherboard assembly and an electronic device, wherein the motherboard assembly includes: a first printed circuit board; a second printed circuit board located on one side of the first printed circuit board, the side of the second printed circuit board facing the first printed circuit board having a first groove, the first groove and the first printed circuit board enclosing a cavity; a support member, at least a portion of the support member being located within the cavity, the portion of the support member located within the cavity being soldered to the first printed circuit board, and the support member being soldered to the second printed circuit board.
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