Substrate holder and method for fixing and bonding a substrate

Abstract

The invention relates to a substrate holder (1, 1', 1'', 1''', 1'''', 1''''' ) for receiving a substrate (13), having fixing elements (6, 6', 6'') for fixing a substrate (13), wherein the fixing elements (6, 6', 6'') are groupable into regions (7, 7' ) and a corresponding method.

Description

Technical Field

[0001] This invention describes a substrate retainer and a method for securing and bonding substrates. Background Technology

[0002] In the prior art, there are documents that disclose how to optimally interconnect substrates. In particular, document WO2017162272A1 discloses a substrate retainer having various regions. In addition, documents WO2013023708A1, WO2012083978A1, and WO 2018028801 A1 should be mentioned.

[0003] A major problem in the prior art is the asymmetric deformation of the substrate. Many substrates exhibit mechanical anisotropy, meaning their E-modulus is strongly orientation-dependent. Due to the orientation dependence of the E-modulus, other mechanical properties, especially strain, also depend on orientation. If forces, especially gravity, are applied to these substrates, asymmetric deformation occurs. This asymmetric deformation persists during the contact period between the two substrates and / or during bonding, and necessarily leads to asymmetric propagation of the bond well front, thus resulting in undesirable run-out effects.

[0004] For many years in the semiconductor industry, substrates have been interconnected through a process known as bonding. Before bonding, these substrates must be aligned with each other as precisely as possible, where deviations in the nanometer range now come into play. Substrate alignment is typically achieved via alignment marks. In addition to alignment marks, other components, particularly functional components, exist on the substrate, which must also be aligned with each other during the bonding process. This alignment precision between the individual functional components is required across the entire substrate surface. Therefore, it is insufficient, for example, if the alignment precision is very good at the center of the substrate but decreases towards the edges.

[0005] As previously mentioned, there are various methods and devices in the prior art that can be used to attempt to influence the bonding process, such as documents WO2017162272A1, EP2656378B1, or WO2014191033A1.

[0006] One of the biggest challenges in bonding is the time required for two substrates to bond to each other on their own. This is the period from the start of bonding until the substrate contact surfaces are fully in contact. During this time, the alignment of the two substrates is still significantly different from the previous alignment. Although it is theoretically possible to separate the two substrate surfaces again once they are bonded, this is associated with high cost, low throughput, and error-proneness. Summary of the Invention

[0007] The object of the present invention is to provide an apparatus and method for bonding two substrates, which eliminates the problems of the prior art and, in particular, improves bonding accuracy, especially at the edges of the substrates.

[0008] This objective is achieved using the features described in this disclosure. Advantageous improvements of the invention are described in other parts of this disclosure. All combinations consisting of at least two features described in the specification, claims, and / or drawings also fall within the scope of the invention. Where ranges are specified, values ​​within the mentioned limits should also be applied as disclosed limits and can be claimed in any combination.

[0009] The present invention relates to a substrate holder for receiving a substrate, having fixing elements for fixing the substrate, wherein the fixing elements can be grouped into regions, wherein the regions are preferably arranged in a ring shape, and more preferably in a circular shape.

[0010] A region is any number of fixed elements, regardless of whether the fixed elements are locally adjacent or on opposite edge regions. Because a region represents a certain number of fixed elements, its definition or stipulation can also change over time.

[0011] The shape or location of a region will be discussed later in this document. This refers to the shape and location of the envelope of all fixed elements within such a region. When discussing the switching capability of a region, this means the switching capability of all fixed elements within the region. In particular, closing a region means closing all fixed elements within that region. Unaffected by this, preferably, all fixed elements within a region can also be switched individually. In extreme cases, a region may contain only one fixed element.

[0012] All fixtures in the same area can preferably be operated by a single control element, especially when using vacuum fixtures, by a control valve. This allows for the advantageous simultaneous switching of all fixtures in a single area.

[0013] Different fixed elements or regions can be switched, especially in a time-staggered manner, in order to advantageously deform the advancing bonding wave in a targeted manner.

[0014] The present invention also relates to a method for securing and bonding one or more substrates, particularly utilizing a substrate retainer according to the invention, wherein securing elements are grouped into regions, wherein the regions are preferably annular, and more preferably circularly annularly constructed.

[0015] Due to the annular arrangement, the substrate can be optimally fixed and separated during the bonding process, thereby minimizing "bounce" errors and significantly improving bonding accuracy. In the case of a preferred annular arrangement, fixation and separation are even better because the bonding wave typically propagates in an annular pattern as well.

[0016] Preferably, a substrate retainer is provided, wherein the regions are arranged symmetrically with respect to the center of the substrate retainer. Since the bonding wave typically propagates symmetrically with respect to the center of the substrate retainer, this advantageously allows for further improvement in bonding accuracy.

[0017] Preferably, a base retainer is also provided, wherein the regions are arranged in multiple rings, preferably circular rings, around the center of the base retainer. Thus, optimal separation can also be advantageously achieved in the radial direction of the base retainer.

[0018] Preferably, a base retainer is also provided, wherein the regions are uniformly spaced apart from each other in the radial direction and / or azimuth direction. This allows for particularly precise control of the separation.

[0019] Preferably, a substrate retainer is also provided, wherein the region is constructed with a varying width, particularly a larger width, from the center of the substrate retainer toward the edge of the substrate retainer. This varying width may be necessary to obtain better bonding results, since the propagation speed of the bonding wave can also vary with the distance from the center.

[0020] Preferably, a substrate retainer is also provided, wherein the regions can be switched individually. Thus, the regions can be advantageously and flexibly controlled according to the desired separation.

[0021] Preferably, a substrate retainer is also provided, wherein multiple regions can be grouped and switched together. Therefore, it is advantageous to switch larger areas as needed, making separation more flexible and precise.

[0022] Preferably, a substrate retainer is also provided, wherein the number of fixing elements in the regions can be flexibly varied. Therefore, for example, the attractive force in each region can be increased or decreased, thereby allowing for advantageous and precise control of separation.

[0023] Preferably, a base retainer is also provided, wherein the fixing element can be flexibly assigned to different areas. Furthermore, alternatively or additionally, the fixing element can be manipulated in a cross-area manner. Therefore, the retaining force in the area can be advantageously adjusted flexibly as needed.

[0024] In particular, the present invention describes an apparatus and method for generating a bond between two substrates with minimal bounce. The invention is based, in particular, on the concept of using at least one substrate holder having specially shaped regions composed of a plurality of fixing elements for securing the substrate, especially asymmetrically deformed substrates. By the specially shaped regions and their fixing elements, and especially by the switching of these regions or their fixing elements according to the invention, and especially by compensating for the asymmetric deformation of the substrate during the bonding process, an optimal bonding wavefront is generated, and thus an optimal bond is achieved.

[0025] Typically, it is unknown which substrates will be fixed to the substrate retainer next, what their mechanical anisotropy is, or how strongly they will be twisted during fixation. Furthermore, substrates of different thicknesses often deform to varying degrees due to gravity when fixed to the upper substrate retainer. Therefore, it is impossible to create a new substrate retainer for every type of asymmetry that occurs.

[0026] By means of the substrate retainer according to the invention, asymmetric deformation of the substrate is advantageously compensated, particularly by means of a targeted switching technique of regions, so that asymmetry can also be compensated during the bonding process. Thus, it is advantageous to construct only one type of substrate retainer, which can be used for different substrates with different degrees of asymmetric deformation.

[0027] This invention is based on the concept of providing a substrate retainer with specially shaped regions whose shape, arrangement, and manipulation improve bonding performance. As described in detail in document WO2017162272A1, adjustment of substrate curvature is crucial for a successful, error-free bonding process. Therefore, this invention specifically describes a very special substrate retainer, the development of which has been completed in recent months and years. In particular, reference is also made to the method steps disclosed in WO2017162272A1.

[0028] The base retainer according to the invention is primarily used as an upper base retainer, but it can also be used to fix a lower base at the bottom side of the bonding device. In particular, the base retainer according to the invention can be used as an upper base retainer and as a lower base retainer, respectively. The targeted adjustment of curvature, detailed and disclosed in WO2017162272A1, is further improved by the construction scheme of the novel base retainer according to the invention.

[0029] The change in curvature refers specifically to the deviation from the initial state of the substrate (especially the curvature adjusted before contact). According to the invention, bonding is controlled, particularly by controlled fixation of the substrate, after contact with the contact surface. Specifically, appropriate fixing devices are provided according to the apparatus.

[0030] Another particularly independent aspect of the invention lies in the use of particularly individually switchable fixing elements, grouped into specially shaped regions, by means of which the advancing bonding wave between the contact surfaces can be controlled or adjusted. The shape of the disclosed regions is so specific that it gives rise to an important distinguishing feature of document WO2017162272A1.

[0031] The area typically has at least one fixed element, but in particular, it has multiple fixed elements that can be operated individually.

[0032] This idea is particularly based on the concept that by selectively controlling, regulating, or adjusting the curvature and / or fixing and / or separating at least one of the two substrates, the advancing bonding wave is controlled, regulated, or adjusted to achieve optimal, sequential, and especially inside-out contact between the two substrates along the contact surface. By the method according to the invention, particularly mechanical asymmetries of the substrates existing before and / or during bonding should be compensated so that the bonding wave has a desired, especially radially symmetrical shape. According to the invention, this effect is achieved by the manipulation of specially shaped regions and the fixing elements of those regions according to the invention. Optimal contact is particularly understood to mean that "runaway" error is minimized at each location of the contact interface between the two substrates, or even eliminated in the best case.

[0033] Typically, the substrate retainer according to the invention allows for influence on the propagation of the bonding wave based on orientation. In particular, a bonding wavefront that propagates radially symmetrically, i.e., circularly, can be generated using the substrate retainer according to the invention. The substrate held by the substrate retainer according to the invention can thus be selectively and anisotropically deformed by manipulating various specially shaped regions.

[0034] Depending on whether the substrate retainer according to the invention is used on the upper or lower side, it has different effects on the substrate it is fixed to. The biggest difference between the two substrates is the direction of gravity during the bonding process. After activating and / or deactivating at least some areas, gravity causes generally anisotropic sagging in the fixed upper substrate. This is not the case in the lower substrate.

[0035] sensor

[0036] Preferably, a sensor for monitoring the distance between the substrate and the substrate holder is installed in the substrate holder according to the invention. With the aid of the sensor, the propagation speed and, in particular, symmetrical shape of the bonding wave can also be monitored during the bonding process, and adaptive fitting can be performed if necessary. If the extension according to the invention is installed in two substrate holders, the two substrates can thus be measured simultaneously, and especially adapted during the bonding process, to minimize their runout errors. This adaptation is achieved, in particular, through the targeted switching of different, specially shaped regions.

[0037] Fixed components

[0038] All the fixing elements mentioned in this invention can be switched individually, i.e., switched to a fixed or non-fixed state. In particular, the clamping force of the base on the fixing element can be adjusted in a targeted manner, thereby determining the normal force or normal stress.

[0039] The retaining elements can be separated from each other by sealing elements. However, in a particularly preferred embodiment according to the invention, the retaining elements are retracted, in particular milled, relative to the surface of the base retainer. This embodiment is particularly suitable when using vacuum retaining elements. In an extension according to the invention, small protrusions, leads, pins, or strips are present in the recess, their surfaces conforming to the surface of the base retainer.

[0040] Individual fixing elements (e.g., circular segments on the same radius) within a region can be flexibly controlled, thus allowing the substrate to be fixed almost along the entire circumference during the loading process. Consequently, the substrate is as flat as possible at that point in time. For the bonding process itself, multiple fixing elements along the same radius can then be deactivated.

[0041] The fixing characteristics of the fixing elements can also be simultaneously or with a defined delay cut-off region, which enables finer control of the bonding speed. In particular, if a non-radial symmetrical advance of the bonding wavefront is measured, the individual fixing elements can be switched so that the bonding wavefront becomes radially symmetrical again.

[0042] If the fixing element is designed as a vacuum fixing element, then the vacuum fixing element contains a pressure between 0.01 mbar and 1000 mbar, preferably between 0.01 mbar and 800 mbar, even more preferably between 0.01 mbar and 500 mbar, most preferably between 0.01 mbar and 100 mbar, and most preferably between 0.01 mbar and 10 mbar. The pressure difference between the larger external pressure and the smaller internal pressure in the vacuum fixing element is the clamping pressure on the substrate, which leads to the fixing of the substrate.

[0043] area

[0044] Each fixed component can be grouped into a region.

[0045] In a first embodiment of the invention, multiple regions exist only around the periphery of the base retainer. The regions are separated from each other radially and / or azimuthally. Specifically, there are both radial and azimuthal divisions.

[0046] The regions are preferably arranged symmetrically around a rotational axis with n-fold symmetry. The value of n is greater than 1, preferably greater than 4, even more preferably greater than 6, most preferably greater than 12, and most preferably greater than 24. The larger the number of rotational axes, the more regions exist along the circumference, but the smaller the regions along its azimuth angle. The optimal number of regions per circumference and the optimal number of regions along the radial direction are determined, in particular, by empirical measurement and / or by simulation.

[0047] In a first embodiment of the invention, multiple regions consisting of a plurality of fixing elements exist around the substrate holder, and a larger region consisting of a single fixing element exists in the center. This central region occupies the largest portion of the substrate surface and is used to securely fix the substrate. The region around the substrate holder is used for fine control, and particularly for targeted influence on the bonding waveform.

[0048] In a second embodiment of the invention, the base retainer consists only of a region, particularly disposed in the periphery, which is composed of a plurality of fixing elements. The base retainer, in terms of area, does not have a region in the largest part.

[0049] In a third embodiment of the invention, the base retainer consists only of a particularly centrally located area (which consists of multiple fixing elements) and a particularly complete, closed single area (which consists of at least one, preferably exactly one fixing element).

[0050] In a fourth embodiment according to the invention, the substrate is secured at the outer edge by a complete, particularly closed, and most preferably annular region, said region consisting of at least one fixing element. The regions located within the outer region can be switched such that they deform the substrate. This is particularly possible if the fixing function of the individual fixing elements is based on the possibility of vacuum suction or fluid flushing.

[0051] In a fifth embodiment of the invention, at least some of the regions are shaped such that they surround or at least encircle other regions.

[0052] Areas and / or fixed elements can be arranged, in particular, in the following configurations:

[0053] 1. Ring

[0054] 2. Spiral

[0055] 3. Grid shape

[0056] 4. Radial beam

[0057] 5. The above combinations (especially rings connected by radial beams)

[0058] Load pin

[0059] If the base retainer has loading pins, there must be holes on the surface of the base retainer. If the area is switched via a vacuum fixture, precautions may have to be taken to ensure a tight seal. Due to the holes in which these loading pins move, several variations are derived for applying overpressure to the area:

[0060] In the first variant, the orifice is simply kept open (where the implementation is optimized for small leaks), and overpressure (balance between inflow and outflow) must be maintained by corresponding continuous flow of fluid in the region between the substrate and the substrate retainer.

[0061] In the second variant, the loading pin is equipped with a seal that enables the establishment of static overpressure in the enclosed area between the wafer and the holding device.

[0062] If the substrate holder according to the invention is implemented as an upper substrate holder, the loading pins may be pins with internal boreholes, hoses, or other fluid systems that create a vacuum at the surface of the loading pins, thereby fixing and lifting the substrate to be loaded in a reversible direction of gravity. During loading, these loading pins pull the fixed substrate upward until the substrate contacts the surface of the substrate holder and is ultimately fixed by the substrate holder.

[0063] concave

[0064] The substrate holder according to the invention particularly has a channel or recess, which can be vitrified in particular, to allow observation of the back side of the fixed substrate. The channel can preferably be automatically closed using a cap.

[0065] Deformable elements

[0066] Another particularly independent concept, or one that can be combined with the inventions described above, involves using a deformable element as a bending device and / or curvature-changing device, specifically configured as a gas outlet. Therefore, there is no mechanical contact with the substrate. By combining these features, curvature can be controlled even more precisely.

[0067] All embodiments described according to the invention can have deformation elements that deform the fixed substrate. In particular, each individual region, provided it has a vacuum fixing element, can use fluid to deform the substrate.

[0068] If the deformable element works with a fluid, the fluid pressure is between 0.1 bar and 10 bar, preferably between 0.2 bar and 8 bar, even more preferably between 0.3 bar and 7 bar, most preferably between 0.4 bar and 6 bar, and most preferably between 0.5 bar and 5 bar.

[0069] The force applied to the substrate by the deformable element is between 0.1N and 1000N, preferably between 0.2N and 500N, more preferably between 0.3N and 250N, most preferably between 0.4N and 200N, and most preferably between 0.5N and 100N.

[0070] Bond wave monitoring

[0071] To determine the propagation velocity of the bonding wavefront based on its direction, a sensor can be integrated into the substrate retainer to measure the distance between the substrate retainer surface and the loaded substrate at any given time point:

[0072] 1. Multiple sensors along the radius to determine the speed based on the distance from the center, especially along the radius extending through the center of each region.

[0073] 2. Multiple sensors located along the radii mentioned in point 1. This allows the determination of velocities in different directions.

[0074] The propagation of the bonding wave can be monitored using existing sensors (which determine the distance between the substrate and the substrate holder surface). Before the bonding process begins, each sensor has a specific initial value. For example, the initial value is zero when the substrate is in contact with the substrate holder surface in the sensor region. If the substrate is not uniformly fixed and, for example, locally sags or bends, the initial value has a value greater than zero. Specifically, each sensor obtains a final value after the bonding process ends. If the sensor value changes accordingly, it can be determined whether the substrate is bonded in the region of the corresponding sensor. This results in a change in the bonding wave position over time. Depending on the precise arrangement of the sensors, it is also possible to detect data on the bonding wave position over time in different directions.

[0075] method

[0076] According to the present invention, a preferred first method of bonding measurement is as follows, by means of which the bonding wavefronts of two substrates to be bonded can be measured and adapted.

[0077] In the first method step, the first substrate is fixed at the first substrate holder, particularly according to the invention.

[0078] In the second method step, the second base is fixed at the second base holder, particularly according to the invention.

[0079] In the third method step, the values ​​of the sensors on the back side of the first and / or second substrates are determined and / or zeroed. In particular, the sensors are distance sensors.

[0080] In the fourth method step according to the invention, the two substrates are brought closer together until a desired distance exists between the substrate surfaces that should be bonded to each other.

[0081] In the fifth method step according to the invention, the upper and / or lower bases are deformed using the aforementioned deformation element, such that the two bases contact at at least one, particularly exactly one, point. Specifically, during the deformation of the upper and / or lower bases, measurements of the back side of the base surfaces are performed using sensors, so that the curvature of the upper and / or lower bases is precisely known before and / or during contact. Thus, any asymmetry that may occur during bending can be identified.

[0082] In the sixth method step according to the invention, the first substrate and / or the second substrate are separated, particularly in a targeted and controlled manner, induced by individually switching the fixing elements of each region, so that the bonding wavefront develops temporally as desired. Specifically, the bonding wavefront between the two substrates should exhibit a radially symmetrical shape at all time points. During the propagation of the bonding wavefront, sensors continuously measure the back side of the substrate surfaces of the first and / or second substrates, so that if the bonding wavefront deviates undesirably, it can be brought back to its desired shape by targeted manipulation of the fixing elements of each region.

[0083] The alternative, preferred second method according to the invention implements the fourth and fifth method steps of the first method according to the invention in reverse order. First, the first substrate and / or the second substrate are deformed without contacting each other. Thereafter, the two substrates are brought closer together relative to each other until contact is made. In particular, once contact is made, the relative approach of the two substrates through the relative translational movement of the two substrate holders is terminated.

[0084] In a particular embodiment of the method according to the invention, the lower base is always fixed along the entire surface, and therefore does not bend.

[0085] In addition to the bonding wave measurement method according to the invention, there are also bonding wave manipulation methods according to the invention. In particular, these methods can be combined with the bonding wave measurement method described above, especially in step 6. These methods according to the invention are very specific and depend particularly on the substrate retainer with a specific region according to the invention. They are described in detail herein.

[0086] The first method for bonded wave manipulation according to the present invention further comprises the following method steps:

[0087] First bonding method

[0088] In the first method step according to the invention, the lower base is fixed in one surface, i.e., without bending.

[0089] In the second method step according to the invention, the upper base is fixed to a base holder having multiple regions, particularly existing only in the periphery of the base holder. Preferably, so many regions are present that a 2*n-fold symmetry can be produced. Base holders having eight peripheral regions are particularly preferred. Four regions are then, for example, at 0°, 90°, 180°, and 270°, hereinafter referred to as the normal positions. The remaining four particularly longer regions are located in between, i.e., at 45°, 135°, 225°, and 315°, hereinafter referred to as the diagonal positions. Initially, all 2n regions are in a switching state and the upper base is fixed, thereby firmly securing the base and minimizing the bending effects due to gravity.

[0090] In the third method step according to the invention, n out of the 2*n regions are now deactivated. In particular, the longer regions at the diagonal positions are deactivated. By deactivating n regions, the substrate is preferably deformed in such a way that the asymmetry caused by mechanical anisotropy and gravity is compensated, and the bonding wavefront acquires the desired shape, especially radial symmetry, during the bonding process.

[0091] In the fourth method step according to the invention, the substrate is contacted, particularly by means of a deformation device and / or by bringing the substrate holders relatively close to each other.

[0092] In the fifth method step according to the invention, the back side of the base holder of the first substrate and / or the second substrate is measured, and if necessary, the bonding wavefront is adapted accordingly by switching the fixing elements of the respective regions.

[0093] Second bonding method

[0094] The second keywave manipulation method according to the present invention further comprises the following method steps:

[0095] In the first method step according to the invention, the lower base is fixed to a base holder having multiple regions, particularly existing only in the periphery of the base holder. Preferably, so many regions are present that a 2*n-fold symmetry can be produced. A base holder having eight peripheral regions is particularly preferred. Four regions are then, for example, at 0°, 90°, 180°, and 270°, hereinafter referred to as the normal positions. The remaining four particularly longer regions are located in between, i.e., at 45°, 135°, 225°, and 315°, hereinafter referred to as the diagonal positions. Initially, all 2n regions are in a switching state and the lower base is fixed.

[0096] In the second method step according to the invention, the upper base is fixed to a base holder having multiple regions, particularly existing only in the periphery of the base holder. Preferably, so many regions are present that a 2*n-fold symmetry can be produced. Base holders having eight peripheral regions are particularly preferred. Four regions are then, for example, at 0°, 90°, 180°, and 270°, hereinafter referred to as the normal positions. The remaining four particularly longer regions are located in between, i.e., at 45°, 135°, 225°, and 315°, hereinafter referred to as the diagonal positions. Initially, all 2n regions are in a switching state and the upper base is fixed, thereby firmly securing the base and minimizing the bending effects due to gravity.

[0097] In the third method step according to the invention, the area at the diagonal position is deactivated.

[0098] In the fourth method step according to the invention, the substrate is contacted, particularly by means of a deformation device and / or by bringing the substrate holders relatively close to each other.

[0099] In the fifth method step according to the invention, the back side of the base holder of the first substrate and / or the second substrate is measured, and if necessary, the bonding wavefront is adapted accordingly by switching the fixing elements of the respective regions.

[0100] The distance between adjacent substrates is between 0 μm and 2000 μm, preferably between 0 μm and 1500 μm, even more preferably between 0 μm and 1000 μm, and most preferably between 0 μm and 500 μm. Attached Figure Description

[0101] Other advantages, features and details of the invention will become apparent from the following description of preferred embodiments and with the aid of the accompanying drawings.

[0102] in:

[0103] Figure 1 A base retainer according to the invention in a first embodiment is shown.

[0104] Figure 2 A base retainer according to the invention in a second embodiment is shown.

[0105] Figure 3 A base retainer according to the invention in a third embodiment is shown.

[0106] Figure 4 A simplified illustration of the substrate retainer according to the invention, based on a fourth embodiment, is shown.

[0107] Figure 5 A simplified illustration of the substrate retainer according to the invention, based on a fifth embodiment, is shown.

[0108] Figure 6 A simplified illustration of the base retainer according to the invention, as shown in the sixth embodiment of the invention, is presented. Figure 7 It shows that according to Figure 4 The simplified illustration shows a base retainer according to the invention, which has a fixed base.

[0109] In the figures, the same components or components with the same function are represented by the same reference numerals. Detailed Implementation

[0110] All the figures shown are schematic diagrams of the base surface and its area, and the fixing elements, and are not necessarily drawn to scale. Complete illustrations of the base retainer with all its components have been intentionally omitted, as they offer no additional value to the concept according to the invention. In particular, the first three base retainers according to the invention are shown in more detail than the latter three.

[0111] Figure 1 The mounting surface of the base holder 1 according to the invention, according to a first embodiment, is shown. The base holder 1 has a base 2, particularly a plate. The base 2 can be mounted at the device using a fastener 3. In the base 2, there are two recesses 4, particularly elongated holes, in the mounting area, through which the back side of the base (not shown) can be observed.

[0112] A deformable element 5, particularly a pin or nozzle, is present at the center of the base holder 1. The base holder has two fixing elements 6, 6' according to the invention, implemented in a particularly different manner. The outer fixing element 6 is constructed in a particularly complete and circular manner. The fixing elements 6, 6' are particularly thin recesses 11, which can preferably be evacuated via fluid openings 12 and thus serve as vacuum fixing elements.

[0113] The internal fixing element 6' is implemented as a network of recesses 11 on the remaining surface of the substrate 2. The fixing element 6' is also implemented, in particular, as a vacuum fixing element. Therefore, the external fixing element 6 is the only fixing element belonging to region 7. The internal fixing element 6' is the only fixing element belonging to region 7'. The substrate retainer 1 may also have different sensors 8, particularly pressure measuring sensors.

[0114] In all the embodiments shown, regions 7,7' are arranged in a ring shape, especially in a circular shape.

[0115] The number of pins 9 shown in the figure below is much smaller than the number in the actual base holder. According to the base holder of the invention, each fixing element 6” can have hundreds, or even thousands, of such pins 9.

[0116] Figure 2 The mounting surface of the base retainer 1' according to the invention is shown in a second embodiment. The base 2 can be mounted at the device using fasteners 3. The base retainer 1' has a plurality of fixing elements 6, particularly limited in the radial and azimuth directions.

[0117] The fixing element 6” is in particular a retracted, preferably milled, recess 11, in which pins 9 are present at several locations. The pin surface of the pins 9 particularly matches the strip surface of the strip 10. The fixing element 6” is particularly implemented as a vacuum fixing element. The recess 11 can be evacuated via the fluid outlet 12, particularly individually and independently of each other due to being separated by the strip 10. If the fixing element 6” is also used as a deformation element, fluid can also flow in through the fluid opening 12, which causes deformation of the fixing substrate, particularly localized deformation.

[0118] Multiple fixing elements 6” are combined to form region 7, while another differently shaped central fixing element 6” forms a central second region 7'. A deformable element 5 is preferably present at the center of the base holder 1', which can deform the fixed base, especially at the center. Pins 9 are particularly used to reduce the contact area of ​​the fixed base, preferably to avoid contamination. Multiple sensors 8, especially pressure sensors, can be distributed on the fixing surface of the base holder 1'.

[0119] Figure 3Another, more advantageous embodiment of the base retainer 1” according to the invention is shown. Fixing elements 6, 6” are present around the periphery of the base retainer 1” and are azimuthally separated from each other. The fixing elements 6 are particularly simple recesses 11, grooves, again implemented very thinly, while the fixing elements 6” are again constructed as recesses 11 having pins 9 and fluid outlets 12. Regions with recesses 11 having pins 9 may exist between the fixing elements 6, 6”. These regions may also, but are not necessarily, constructed as fixing elements. Similarly, the central region may simply be constructed as a recess 11 with pins 9 and / or may again serve as a fixing element. As shown, it is also conceivable that the central region has a flat surface. In this case, this view is chosen to focus on and better highlight the peripheral fixing elements 6, 6”. The base retainer 1” may also have sensors 8 and / or deformable elements 5. In particular, each fixing element 6, 6” may again serve as a fixing element and / or a deformable element.

[0120] All embodiments of the invention shown should disclose schemes for grouping multiple fixing elements 6,6',6” into regions 7,7'. However, the schemes for forming regions extend far beyond grouping adjacent fixing elements. That is, according to the invention, fixing elements that are not adjacent to each other can be grouped into regions. To clarify this aspect of the invention, the base retainer with all details is not shown in the other figures. Instead, fixing elements are indicated only by reference numerals 6,6',6”, and regions are indicated by reference numerals 7,7',7”,7””.

[0121] The regions shown, which are separated from each other in azimuth angle, have a rounded segment angle between 5° and 90°, preferably between 10° and 70°, even more preferably between 20° and 50°, most preferably between 22° and 30°, and most preferably about 22.5°.

[0122] The region has a radial length between 50 mm and 1 mm, preferably between 50 mm and 10 mm, even more preferably between 50 mm and 20 mm, most preferably between 50 mm and 30 mm, and most preferably between 50 mm and 40 mm.

[0123] Figure 4Another specific embodiment of the base retainer according to the invention is shown, wherein there are three distinct regions. The first region 7 consists of a total of 12 fixing elements 6, which are arranged diagonally in groups of three. The second region 7' ​​consists of a total of 12 fixing elements 6, which are arranged in groups of three on the left, right, upper, and lower sides of the base retainer according to the invention. A larger central region 7' ​​also exists, which consists, in particular, of only a single fixing element 6.

[0124] Figure 5 Another particular embodiment of the base retainer according to the invention is shown, wherein there are four distinct regions 7, 7', 7”, 7”'. The outermost first region consists of four fixing elements 6 positioned along a circle. Similarly, this also applies to regions 7' and 7”, which are each located at a smaller radius. The fourth region 7”' is a larger, particularly fully enclosed region with an even smaller radius, consisting primarily of only one fixing element 6.

[0125] Figure 6 Another particular embodiment of the base retainer according to the invention is shown, wherein there are three distinct regions 7, 7', 7'". The first region 7 consists of six fixing elements 6. These fixing elements 6 are arranged in groups of three, in two groups located at the upper and lower positions. The second region 7' ​​consists of six fixing elements 6. These fixing elements 6 are arranged in groups of three, in two groups located at the left and right positions. Another large area, particularly consisting of only one fixing element 6, region 7' ​​fills most of the remaining area and even partially surrounds the two regions 7, 7'.

[0126] As can be seen from the diagram, any number of fixed elements 6 can be combined to form any region. The reason why such region formation is necessary will now be explained in another diagram.

[0127] Figure 7 An example is shown Figure 4The substrate retainer 1”' according to the invention is shown. However, the substrate retainer 1”' now secures the substrate 13 that covers the fixing element 6. The positions of regions 7, 7' are still shown. Arrow 14 indicates mechanical anisotropy, which is suitable for compensation by means of regions 7, 7', 7” according to the invention, i.e., before and / or during the bonding process. For example, the substrate 13 shown may have an E modulus that depends on the orientation, as is the case with cubic materials in the crystallographic (100) plane. Thus, the forces (e.g., gravity) that cause the substrate 13 to sag uniformly will result in anisotropic strain within the substrate. It is also conceivable that a twist occurs due to the substrate being secured only by region 7', which is then also called mechanical anisotropy. This may perhaps be compensated by additional switching regions 7" (covered by the substrate 13). The correct switching of the various regions for optimal and desirable compensation of mechanical anisotropy 14 is ideally determined by trial. It is also mentioned that the various fixing elements 6 of a region can be constructed in particular such that they are arranged radially. In particular, this arrangement allows for radial adjustment as the bonding wave moves from the center to the edge.

[0128] List of reference numerals

[0129] 1,1',1”,1”',1””,1””'Base retainer

[0130] 2. Matrix

[0131] 3. Fasteners

[0132] 4. Recessed area

[0133] 5 Deformable elements

[0134] 6,6',6” Fixing element

[0135] 7,7' area

[0136] 8 sensors

[0137] 9-pin

[0138] 10 joints

[0139] 11 recess

[0140] 12 fluid outlets, especially in boreholes

[0141] 13 Base

[0142] 14. Mechanical anisotropy.

Claims

1. A substrate retainer (1,1',1”,1”',1””,1””') for receiving a substrate (13), having fixing elements (6,6',6”) for fixing the substrate (13), wherein, The fixing elements (6,6',6”) can be grouped into regions (7,7'), wherein the regions (7,7') are arranged in a ring shape, wherein multiple regions exist only around the periphery of the substrate holder, wherein the multiple regions are separated from each other in azimuth, wherein the fixing elements (6,6',6”) are recessed and pins (9) are positioned in all fixing elements (6,6',6”), wherein the shape, arrangement and manipulation of the regions (7,7') can be changed to improve the bonding effect of the substrate (13), wherein the fixing elements (6,6',6”) can be switched individually, and by means of such switching the advancing bonding wave between the contact surfaces can be controlled or adjusted, wherein the fixing elements (6,6',6”) and the regions (7,7') can compensate for the mechanical asymmetry of the substrate (13) before and / or during bonding such that the bonding wave has a radially symmetrical shape.

2. The substrate retainer (1,1',1”,1”',1””,1””') according to claim 1, wherein, The region (7,7') is arranged symmetrically with respect to the center of the base retainer (1,1',1”,1”',1””,1””').

3. The substrate retainer (1,1',1”,1”',1””,1””') according to claim 1, wherein, The region (7,7') is arranged in multiple rings around the center of the base retainer (1,1',1”,1”',1””,1””').

4. The substrate retainer (1,1',1”,1”',1””,1””') according to claim 1, wherein, The regions (7,7') are spaced apart from each other uniformly in the radial direction and / or in the azimuth direction.

5. The substrate retainer (1,1',1”,1”',1””,1””') according to claim 1, wherein, The region (7,7') has a varying width from the center of the base retainer (1,1',1”,1”',1””,1””') toward the edge of the base retainer (1,1',1”,1””,1””').

6. The substrate retainer (1,1',1”,1”',1””,1"”') according to claim 1, wherein, The region (7,7') can be switched individually.

7. The substrate retainer (1,1',1”,1”',1””,1””') according to claim 1, wherein, Multiple regions (7,7') can be grouped and switched together.

8. The substrate retainer (1,1',1”,1”',1””,1””') according to claim 1, wherein, The number of the fixing elements (6, 6', 6") in the region (7, 7') can be flexibly varied.

9. The substrate retainer (1,1',1”,1”',1””,1””') according to claim 1, wherein, The fixing element (6,6') can be flexibly assigned to different regions (7,7').

10. The substrate retainer (1,1',1”,1”',1””,1””') according to claim 1, wherein, The fixing element (6, 6') can be manipulated in a cross-regional manner.

11. The substrate retainer (1,1',1”,1”',1””,1””') according to claim 1, wherein, The region (7,7') is arranged in multiple rings around the center of the base retainer (1,1',1”,1”',1””,1””').

12. The substrate retainer (1,1',1”,1”',1””,1””') according to claim 1, wherein, The region (7,7') has an increased width from the center of the base retainer (1,1',1”,1”',1””,1””') toward the edge of the base retainer (1,1',1”,1”’,1””,1””').

13. A method for securing and bonding one or more substrates (13), utilizing a substrate retainer (1,1',1”,1”',1””,1””') according to any one of claims 1 to 12, wherein, The fixing elements (6,6',6") are grouped into regions (7,7'), wherein the regions (7,7') are constructed in a ring shape.

14. The method according to claim 13, wherein, Switch the region (7,7') separately.

15. The method according to claim 13, wherein, Group multiple regions (7,7') together and switch them together.

16. The method according to claim 13, wherein, The number of the fixed elements (6,6',6") in the region (7,7') can be flexibly changed.

17. The method according to claim 13, wherein, The fixing elements (6, 6') are flexibly assigned to different regions (7, 7').

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