Preheating method of components and substrate processing apparatus

Abstract

The present application provides a preheating method of a component and a substrate processing apparatus, which can appropriately preheat a component arranged on a stage to improve uniformity of processing of a substrate. In the preheating method of the component, a component which can contact a stage for placing a substrate of a substrate processing apparatus and which can relatively move with respect to the stage is preheated. The preheating method of the component includes a process of positioning the component at a preheating position which does not contact the stage, preheating the component by radiation heat from the stage, and a process of bringing the component preheated in the process of preheating the component into contact with the stage. Thus, the component can be appropriately preheated to improve the uniformity of processing of the substrate.

Description

Technical Field

[0001] This disclosure relates to a method for preheating a component and an apparatus for processing a substrate. Background Technology

[0002] Patent Document 1 discloses a substrate heating device (substrate processing device) that suppresses deformation caused by thermal deformation of the substrate by heating the upper and lower surfaces of the substrate while the substrate is floating off the stage before placing the substrate on the substrate support stage (stage).

[0003] In addition, film deposition apparatuses, as one type of substrate processing apparatus, sometimes have a frame-shaped component (frame member) disposed around the periphery of the substrate to suppress film deposition at the periphery of the substrate. The frame member is configured to be movable relative to the stage and to contact the stage during substrate processing to cover the periphery of the substrate.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Application Publication No. 5-160046 Summary of the Invention

[0007] The problem the invention aims to solve

[0008] This disclosure provides a technique for improving the uniformity of substrate processing by properly preheating components disposed on a stage.

[0009] Solution for solving the problem

[0010] According to one aspect of this disclosure, a method for preheating a component is provided, the component being capable of contacting and moving relative to a stage of a substrate processing apparatus for placing a substrate. The method for preheating a component is characterized by comprising the following steps: positioning the component in a preheating position where it is not in contact with the stage; preheating the component by radiant heat from the stage; and bringing the component, preheated in the preheating step, into contact with the stage.

[0011] The effects of the invention

[0012] According to one method, the components disposed on the stage can be properly preheated to improve the uniformity of the substrate processing. Attached Figure Description

[0013] Figure 1 This is a cross-sectional view showing an example of a substrate processing apparatus according to one embodiment.

[0014] Figure 2This is a diagram showing the stage and frame components of the substrate processing apparatus.

[0015] Figure 3 It is a cross-sectional view showing the frame member positioned in the preheating position.

[0016] Figure 4 This is a block diagram representing the functional blocks of the control unit that implements the preheating treatment method.

[0017] Figure 5 This is an example diagram illustrating the screen information displayed on the frame components of a display device.

[0018] Figure 6 This is a diagram illustrating the location information area and preheating information when monitoring preheating is ineffective.

[0019] Figure 7 This is a flowchart illustrating the preheating treatment method for the frame components.

[0020] Figure 8 This is a flowchart representing the substrate processing routine. Detailed Implementation

[0021] The embodiments for carrying out this disclosure will now be described with reference to the accompanying drawings. In the drawings, the same structural parts are labeled with the same reference numerals, and sometimes repeated descriptions are omitted.

[0022] Figure 1 This is a cross-sectional view showing an example of a substrate processing apparatus 1 according to one embodiment. For example... Figure 1 As shown, one embodiment of the substrate processing apparatus 1 is an inductively coupled plasma (ICP) processing apparatus for performing various substrate processing on an FPD substrate (hereinafter referred to as substrate W).

[0023] Examples of FPDs that perform substrate processing include liquid crystal displays (LCDs), electroluminescent displays (ELs), and plasma display panels (PDPs). In these cases, glass or synthetic resin is used as the material for the substrate W. The substrate W can include a substrate with circuit patterns formed on its surface or a support substrate without circuits. The planar dimensions of the substrate W can be approximately 1800 mm to 3400 mm on the long side and approximately 1500 mm to 3000 mm on the short side. Furthermore, the thickness of the substrate W can be approximately 0.2 mm to 4.0 mm. Substrate processing performed by the substrate processing apparatus 1 can include film deposition processing using CVD (Chemical Vapor Deposition) methods, etching processing, etc. The substrate processing apparatus 1 for film deposition processing will now be described.

[0024] The substrate processing apparatus 1 includes a rectangular box-shaped processing container 10. The processing container 10 is formed of a metal such as aluminum or an aluminum alloy. Furthermore, the processing container 10 can be formed into an appropriate shape depending on the shape of the substrate W. For example, if the substrate W is a circular plate or an elliptical plate, the processing container 10 is preferably formed into a cylindrical shape or an elliptical cylindrical shape.

[0025] The processing container 10 has a rectangular support frame 11 protruding inward at a predetermined position in the vertical direction, which supports the dielectric plate 12 in the horizontal direction. The processing container 10 is divided into an upper chamber 13 and a lower chamber 14 separated by the dielectric plate 12. An antenna chamber 13a is formed inside the upper chamber 13. A processing space 14a for placing the substrate W and performing substrate processing is formed inside the lower chamber 14.

[0026] The side wall 15 of the lower chamber 14 has an inlet / outlet 17 that is opened and closed by a gate valve 16. When the gate valve 16 is open, the substrate processing apparatus 1 loads and unloads the substrate W through the inlet / outlet 17 by a conveying device (not shown).

[0027] Additionally, the sidewalls 15 of the lower chamber 14 are grounded (connected to the grounding potential) via a grounding wire 18. The four sidewalls 15 of the lower chamber 14 have annular sealing grooves 19 at their upper ends. By arranging sealing members 20 such as O-rings in the sealing grooves 19, the support frame 11 and the lower chamber 14 airtightly seal the processing space 14a.

[0028] The support frame 11 is made of metals such as aluminum or aluminum alloy. In addition, the dielectric plate 12 is made of ceramics such as alumina (Al2O3) or quartz.

[0029] A spray head 21 is provided inside the support frame 11 and is connected to the support frame 11 for spraying gas into the processing space 14a. A dielectric plate 12 is supported on the upper surface of the spray head 21. The spray head 21 is formed of a metal such as aluminum, and preferably has its surface treated by anodizing. A gas flow path 21a is formed horizontally inside the spray head 21. Furthermore, the spray head 21 has a plurality of gas ejection holes 21b that communicate with the gas flow path 21a and the lower surface of the spray head 21 (processing space 14a).

[0030] A gas inlet pipe 22, which communicates with the gas flow path 21a, is connected to the upper surface of the spray head 21. The gas inlet pipe 22 extends upward in the upper chamber 13, airtightly penetrating the upper chamber 13, and is connected to the gas supply section 23 located outside the processing container 10.

[0031] The gas supply unit 23 has a gas supply pipe 24 connected to the gas inlet pipe 22, and a gas supply source 25, a mass flow controller 26, and an on / off valve 27 are sequentially provided from upstream to downstream of the gas supply pipe 24. During substrate processing, gas is supplied from the gas supply source 25, the gas flow rate is controlled by the mass flow controller 26, and the gas supply timing is controlled by the on / off valve 27. The gas flows from the gas supply pipe 24 into the gas flow path 21a through the gas inlet pipe 22, and is sprayed out into the processing space 14a through each gas ejection hole 21b.

[0032] A high-frequency antenna 28 is disposed within the upper cavity 13 that forms the antenna chamber 13a. The high-frequency antenna 28 is formed by routing antenna wires made of a conductive metal such as copper in a loop or spiral shape. Alternatively, the high-frequency antenna 28 may be obtained by providing multiple loops of antenna wires. A power supply member 29 extending upward within the upper cavity 13 is connected to the terminals of the high-frequency antenna 28.

[0033] The power supply component 29 has an upper end protruding outward from the processing container 10, to which a power supply line 30 is connected. The power supply line 30 is connected to a high-frequency power supply 32 via a matching device 31 for impedance matching. The high-frequency power supply 32 applies high-frequency power (e.g., 13.56 MHz) to the high-frequency antenna 28 at a frequency corresponding to the substrate processing. As a result, the high-frequency antenna 28 forms an induced electric field within the lower chamber 14. The substrate processing apparatus 1 plasma-injects the gas supplied from the spray head 21 to the processing space 14a through the induced electric field formed within the lower chamber 14, and provides precursors in the plasma to the substrate W.

[0034] Furthermore, a plurality of exhaust ports 33a are formed on the bottom wall 33 of the lower chamber 14, and a gas exhaust section 34 is provided in each exhaust port 33a. The exhaust section 34 has a gas exhaust pipe 35, and an exhaust mechanism 37 is provided in the gas exhaust pipe 35. The exhaust mechanism 37 has an on / off valve 36 and a vacuum pump 38 arranged sequentially from upstream to downstream of the gas exhaust pipe 35. Regarding the vacuum pump 38, a turbomolecular pump or the like can be used to evacuate the lower chamber 14 to a preset vacuum level during substrate processing.

[0035] Furthermore, the processing container 10 has a stage 40 (placement stage) in the lower chamber 14 for placing the substrate W that is moved in from the loading / unloading outlet 17.

[0036] The stage 40 has a stage body 41, an insulating member 42, multiple lifting pins 43, and multiple lifting pin lifting mechanisms 44. The substrate W to be moved into the lower chamber 14 is handed over to each lifting pin 43 which has been raised by each lifting pin lifting mechanism 44, and the substrate W is placed on the stage body 41 by lowering each lifting pin 43.

[0037] The stage body 41 is rectangular in shape when viewed from above, and has a mounting surface 411 with planar dimensions similar to those of the substrate W. For example, the planar dimensions of the mounting surface 411 may be in the range of approximately 1800 mm to 3400 mm for the long side and approximately 1500 mm to 3000 mm for the short side. The stage body 41 has a stepped surface 412 on the outer side of the mounting surface 411 that is lower than the mounting surface 411. The stepped surface 412 surrounds the outer edge of the stage body 41 and supports the frame member 50 described later. In addition, the stage body 41 has a side peripheral surface 413 that is approximately parallel to the vertical direction between the mounting surface 411 and the stepped surface 412.

[0038] The stage body 41 is made of aluminum, aluminum alloy, or the like, and contains a heating wire 45 inside as a resistive element. The heating wire 45 is wired in a manner that uniformly heats the entire mounting surface 411. Preferably, the heating wire 45 is also positioned below the stepped surface 412, creating a structure where the temperature of the stepped surface 412 is the same as the temperature of the mounting surface 411. The heating wire 45 is formed of a compound of tungsten, molybdenum, nickel, chromium, or any of these metals with aluminum oxide, titanium, or the like.

[0039] Heating wire 45 is connected to heater drive unit 46 and is heated based on the power supply of heater drive unit 46. Heater drive unit 46 is connected to control unit 70 of substrate processing apparatus 1 and outputs power corresponding to the temperature command of control unit 70. For example, when performing substrate processing (film formation processing), substrate processing apparatus 1 heats the mounting surface 411 of stage 40 to about 300°C and maintains this temperature. The substrate W placed on mounting surface 411 is also heated to 300°C through stage body 41. In addition, substrate processing apparatus 1 can have a meandering flow path (not shown) inside stage body 41 instead of heating wire 45, and perform temperature control including heating and cooling by circulating a temperature control medium in the flow path.

[0040] A temperature sensor 47, such as a thermocouple, is installed on the stage body 41. The temperature sensor 47 continuously transmits the measured temperature of the stage body 41 to the control unit 70. The control unit 70 adjusts the temperature of the stage body 41 to the target temperature based on the transmitted measured temperature.

[0041] The insulating member 42 is formed of insulating material and is disposed at multiple locations on the bottom wall 33 of the lower chamber 14. The insulating member 42 fixes and supports the stage body 41 in a state where the stage body 41 is slightly floating relative to the bottom wall 33.

[0042] Furthermore, the substrate processing apparatus 1 has a frame member 50 and a frame member lifting part 60 around the stage 40. The frame member 50 is a component that can contact the stage 40 and move relative to the stage 40. The frame member lifting part 60 causes the frame member 50 to move up and down relative to the stage 40 in the vertical direction (height direction). Figure 2 This is a diagram showing the stage 40 and frame member 50 of the substrate processing apparatus 1. Figure 2 (a) is a 3D diagram. Figure 2 (b) is a cross-sectional view showing the state of contact between the frame member 50 and the step surface 412 of the platform 40.

[0043] like Figure 2 As shown, the frame member 50 is a component that prevents the precursor from forming a film on the periphery wp of the substrate W or from wrapping around the back side of the substrate W by covering the area above the periphery wp of the substrate W in a non-contact manner. The frame member 50 is also referred to as a shadow ring. The frame member 50 is formed into a rectangular shape that overlaps with the stepped surface 412 of the stage 40 when viewed from above. Furthermore, the frame member 50 can be formed into an appropriate shape corresponding to the shape of the substrate W, and can be square, circular, etc.

[0044] The frame member 50 is preferably made of aluminum or its alloys, ceramics such as alumina, or glass. It can be formed of aluminum or its alloys that are as lightweight as possible and have both elasticity (flexibility) and rigidity. When the frame member 50 is aluminum or its alloy, it is preferable to perform aluminum anodizing treatment on the frame member 50 or to have a yttrium oxide or other spray coating on the frame member 50 to prevent corrosion and improve plasma resistance.

[0045] The frame member 50 has an outer periphery 51 surrounding the outer side of the frame, and an eave 52 protruding inward from the upper part of the inner side surface 512 of the outer periphery 51. Furthermore, the frame member 50 has a reinforcing portion 53 on the upper surface of the eave 52 at the corner where the long side and short side intersect, for strengthening the connection between the eaves 52. In this embodiment, the outer periphery 51 and the eave 52 are integrally formed from the same material. Alternatively, the outer periphery 51 and the eave 52 may be formed from different materials, and the frame member 50 may also have a structure without the reinforcing portion 53.

[0046] like Figure 2 As shown in (b), the outer peripheral portion 51 moves from the frame member lifting portion 60 through... Figure 1 When the substrate moves downward, it contacts and is supported on the stepped surface 412 of the stage body 41. With the outer peripheral portion 51 supported by the stepped surface 412, the eaves 52 is positioned further upward and away from the mounting surface 411 than the substrate W placed on the mounting surface 411 (not in contact with the substrate W). The eaves 52 overlaps with the periphery wp of the substrate W along the entire circumference of the outer peripheral side of the substrate W in the vertical direction, thereby blocking film formation at the periphery wp of the substrate W.

[0047] The thickness T1 of the outer periphery 51 is greater than the distance D between the mounting surface 411 and the step surface 412 of the stage body 41. The thickness T1 of the outer periphery 51 also depends on the size of the frame member 50 (base plate W). For example, if the long side of the frame member 50 is 3000 mm or more, it is preferable to set the thickness T1 to 20 mm or more. As a result, the rigidity of the frame member 50 is improved, and the frame member 50 can be supported linearly by the frame member lifting part 60.

[0048] The lower surface 511 of the outer peripheral portion 51 is formed flat to make surface contact with the step surface 412. When the outer peripheral portion 51 is supported on the step surface 412, the inner surface 512 of the outer peripheral portion 51 faces the side peripheral surface 413 between the mounting surface 411 and the step surface 412 in a non-contact manner. Conversely, when the outer peripheral portion 51 is supported on the step surface 412, the outer surface 513 of the outer peripheral portion 51 protrudes further outward in the horizontal direction than the step surface 412. The frame member lifting portion 60 supports the lower surface 511 of the protruding portion of the outer peripheral portion 51. Furthermore, the upper surface 514 of the outer peripheral portion 51 is formed flat in the horizontal direction and smoothly continuous with the upper surface of the eaves portion 52 at the boundary between it and the inner surface 512.

[0049] The eaves 52 is formed to be sufficiently thin relative to the thickness T1 of the outer periphery 51, and protrudes relatively shortly from the outer periphery 51 toward the inner side of the frame member 50. The ratio of the thickness T2 of the eaves 52 (the thickness of the root portion connected to the outer periphery 51) to the thickness T1 of the outer periphery 51 can be, for example, in the range of about 1 / 10 to 1 / 3. In addition, the amount of protrusion of the eaves 52 relative to the outer periphery 51 also depends on the relative distance between the mounting surface 411 and the outer periphery 51, and is preferably set in the range of about 20 mm to 50 mm.

[0050] The inner edge 523 of the upper surface 521 of the eaves 52 becomes an inclined surface that gradually slopes downwards towards the horizontal direction when the frame member 50 is disposed on the stepped surface 412. On the other hand, the lower surface 522 of the eaves 52 is formed to be flat in the horizontal direction from the inner side 512 of the outer periphery 51 when the frame member 50 is disposed on the stepped surface 412, and extends to the inner edge 523. In the supported state where the stepped surface 412 supports the outer periphery 51, the lower surface 522 of the eaves 52 is separated from the mounting surface 411 by a gap C, which is a quantity obtained by adding a predetermined margin height to the thickness of the substrate W. The gap C can be set, for example, to about 0.3 mm to 5 mm. In this way, the frame member 50 covers the periphery wp of the substrate W with the eaves 52 in a non-contact manner with the gap C, thereby avoiding interference between the eaves 52 and the substrate W, and effectively suppressing the movement of the precursor towards the periphery wp of the substrate W.

[0051] return Figure 1The frame member lifting unit 60 includes multiple unit lifting mechanisms 61 that support the lower surface of the outer periphery 51 of the frame member 50. Under the control of the control unit 70, each unit lifting mechanism 61 operates in conjunction with the others. Thus, while supporting the frame member 50 in the horizontal direction, the frame member lifting unit 60 raises and lowers the frame member 50 in the vertical direction (height direction). For example, the frame member lifting unit 60 has a total of four unit lifting mechanisms 61 to support two portions of the frame member 50 spaced apart at a predetermined interval on one long side and two portions of the frame member 50 spaced apart at a predetermined interval on the other long side.

[0052] Each unit lifting mechanism 61 has a support column 62 (movable part) that can be detachably contacted with the frame member 50, a guide cylinder 63 that guides the lifting of the support column 62, and a mechanism body 64 that causes the support column 62 to lift.

[0053] The support column 62 has a support plate 65 at its upper end that contacts the lower surface of the outer periphery 51 of the frame member 50. The support plate 65 is a flat, disc-shaped upper surface that contacts the frame member 50. The support plate 65 is raised and lowered by the mechanism body 64 between an upper limit position (load-in / load-out standby position) that is higher than the mounting surface 411 and close to the spray head 21, and a lower limit position (reference position) that is lower than the step surface 412 and close to the bottom wall 33. When the support plate 65 is moved to a position higher than the step surface 412, it supports the outer periphery 51 of the frame member 50; on the other hand, when the support plate 65 is moved to a position lower than the step surface 412, it moves away from the frame member 50 supported on the step surface 412. The guide cylinder 63 is fixed to an opening 33b provided in the bottom wall 33 and guides the raising and lowering of the support column 62 along the inner wall on the axial side.

[0054] The main body 64 can utilize various mechanisms (cylinder mechanisms, ball screw mechanisms, motor- and rack-and-pinion mechanisms, etc.) capable of raising and lowering the support column 62. For example, when a cylinder mechanism is used as the main body 64, the support column 62, which acts as a lever, is slidable by a hydraulic cylinder or a pneumatic cylinder. When a ball screw mechanism is used as the main body 64, the ball screw is rotated by a motor, causing the support column 62, which is connected to a nut on the ball screw, to slide. When a motor- and rack-and-pinion mechanism is used as the main body 64, the support column 62, which is composed of a rack, is slidable by a motor.

[0055] The frame member lifting unit 60 electrically connects each mechanism body 64 to the power distribution drive unit 66. The power distribution drive unit 66 causes each mechanism body 64 to operate (interlock) by providing power pulses corresponding to the command signals from the control unit 70 to each mechanism body 64. In addition, the power distribution drive unit 66 identifies the height position of the frame member 50 (each support plate 65) by monitoring the power pulses provided to each mechanism body 64, and moves the frame member 50 to the target position based on the identification result.

[0056] The control unit 70 of the substrate processing apparatus 1 is a control computer having one or more processors 71, a memory 72, an input / output interface (not shown), and electronic circuitry. Additionally, the control unit 70 includes input devices such as a keyboard and mouse for inputting commands, a display device such as a monitor for visually displaying the operating status of the substrate processing apparatus 1, and an output device such as a printer (all not shown).

[0057] The control unit 70 controls the operation of various components of the board processing apparatus 1 (e.g., high-frequency power supply 32, gas supply unit 23, exhaust unit 34, lifting pin lifting mechanism 44, heater drive unit 46, frame member lifting unit 60, etc.) to perform board processing. One or more processors 71 are combinations of one or more of the following: CPU, ASIC, FPGA, and circuits composed of multiple discrete semiconductors. The memory 72 includes non-volatile memory and volatile memory, forming the storage unit of the control unit 70. Furthermore, a portion of the memory 72 may be integrated into one or more processors 71.

[0058] The processor 71 executes a pre-set process according to the program and process (process) stored in the memory 72. The process includes control settings for the substrate processing apparatus 1 based on the process conditions. These control settings include, for example, gas flow rate, pressure within the processing container 10, temperature within the processing container 10, temperature of the stage body 41, and process time. Furthermore, the process, etc., can be installed and read into the control unit 70 while housed in a computer-readable storage medium such as a CD-ROM, DVD, or memory card.

[0059] Figure 3 This is a cross-sectional view showing the frame member 50 positioned in the preheating position HP. See below for reference. Figure 2 and Figure 3 This will illustrate the effect of the heat from the stage 40 on the frame component 50.

[0060] The frame member 50, a component of the substrate processing apparatus 1, is affected by heat from the stage 40. For example, when the stage body 41 is heated by the heating wire 45, causing the temperature of the frame member 50 to be relatively lower than that of the stage body 41, the frame member 50 (outer periphery 51 and eaves 52) deforms outward in a horizontal direction due to the heat from the stage 40. As a result, there are shielding areas where the periphery wp of the substrate W is shielded by the frame member 50, which has a relatively lower temperature than the stage body 41 and a large temperature difference with the stage 41, and there are shielding areas where the periphery wp of the substrate W is shielded by the frame member 50, which has no temperature difference with the stage body, thus the shielding area becomes uneven. If it is assumed that deformation occurs on the stage 40 due to temperature changes in the frame member 50, uneven film formation will occur due to the changes in the shielding area, and the accuracy of substrate processing will decrease.

[0061] Furthermore, assuming that the frame member 50 deforms while in contact with the stage 40, friction will occur between the stage 40 and the frame member 50 due to the difference in materials. When scratches, dents, etc., occur on the stage 40 or the frame member 50 due to this friction, the relative position (e.g., gap C) of the eaves 52 relative to the substrate W may change, affecting the substrate processing. In addition, depending on the situation, this may also become a major cause of contact between the eaves 52 and the substrate W. Although it is conceivable to arrange a heater on the frame member 50 side, since the frame member 50 contacts the stage 40 and the support plate 65 leaves the frame member 50 when it moves to a position lower than the step surface 412, it is difficult to install a heater on the frame member 50 side.

[0062] Therefore, the control unit 70 of this embodiment performs the following preheating process before film formation in the substrate processing apparatus 1: the frame member 50 is positioned at a preheating position HP that is not in contact with the stage 40 and is close to the stage 40, and the frame member 50 is preheated by the radiant heat of the stage 40. Before the preheated frame member 50 comes into contact with the stage 40, the frame member 50 is deformed outward in the horizontal direction, thereby preventing the frame member 50 from deforming after contacting the stage 40.

[0063] Below, refer to Figure 4 The functional parts of the control unit 70 that implements this preheating treatment method will be explained. Figure 4 This is a block diagram representing the functional blocks of the control unit 70 that implements the preheating treatment method.

[0064] The control unit 70 includes a stage temperature control unit 80, an initial control unit 81, a preheating condition determination unit 82, a preheating execution unit 83, a preheating invalid monitoring unit 84, an interlock unit 85, a substrate processing determination unit 86, and a substrate processing control unit 87.

[0065] The stage temperature control unit 80 adjusts the temperature of the stage 40 based on the target temperature set by the user and the process. At this time, the stage temperature control unit 80 adjusts the power supply of the heater drive unit 46 based on the measured temperature obtained from the temperature sensor 47, so that the temperature of the stage 40 is consistent with the target temperature.

[0066] The initial control unit 81 is a functional unit that performs the initial operation of each structure before the substrate processing apparatus 1. During the initial operation of the frame member 50 and the frame member lifting unit 60, the initial control unit 81 drives the mechanism body 64 of each unit lifting mechanism 61 to lower the support column 62 to the lower limit position (reference position) and aligns the height position of the support plate 65 relative to the reference position (zero point calibration).

[0067] Furthermore, preferably, after the support column 62 reaches the zero-point calibration at the lower limit position, the initial control unit 81 immediately raises the frame member 50. Thus, during the initial operation of the frame member lifting unit 60, as the frame member lifting unit 60 descends, the frame member 50 contacts the step surface 412, but the implementation time of this initial operation is very short. For example, approximately 3 seconds after contact, the initial control unit 81 activates the frame member lifting unit 60 to raise the support column 62, thereby causing the frame member 50 to float off the step surface 412. Therefore, the substrate processing apparatus 1 can suppress deformation of the frame member 50 during the contact of the frame member 50 with the stage body 41, where a temperature difference exists between them.

[0068] After zero-point calibration and during the initial operation of other structures, the initial control unit 81 only needs to ensure that the frame member 50 does not contact the step surface 412, and the frame member 50 can be positioned at any height. Alternatively, during the initial operation of other structures, the initial control unit 81 can position the frame member 50 in the preheating position HP (see reference). Figure 3 The substrate processing apparatus 1 can then be put into standby mode. This shortens the preheating time. Alternatively, the control unit 70 may perform zero-point calibration at the end of the initial operation, and then immediately switch to the operation of the preheating execution unit 83 (preheating of the frame member 50) after the zero-point calibration.

[0069] The preheating condition determination unit 82 determines whether to preheat the frame member 50. For example, the control unit 70 outputs the frame member screen information 90 for implementing the preheating process of the frame member 50 to the display device of the control unit 70, and performs the preheating of the frame member 50 based on the user's manual operation.

[0070] Figure 5 This is an example diagram illustrating screen information 90 displayed on a frame component of a display device. For example... Figure 5As shown, the frame member screen information 90 includes a button 91 for setting the operation of the frame member 50 during substrate processing, a button 92 for setting the loading / unloading standby position, a button 93 for specifying various positions of the frame member 50, and a button 94 for manually performing preheating. When the button 93 for specifying the position of the frame member 50 is operated, the control unit 70 displays setting screen information such as preheating position HP (not shown). Furthermore, when the button 94 for manually performing preheating is operated, the control unit 70 performs preheating of the frame member 50 under the control of the preheating execution unit 83, which will be described later.

[0071] return Figure 4 The preheating condition determination unit 82 stores multiple preheating conditions for preheating the frame member 50. If any one of the multiple preheating conditions is met, the preheating of the frame member 50 is automatically performed. If none of the multiple preheating conditions are met, the preheating of the frame member 50 is not performed. For example, the following [a] to [c] can be listed as multiple preheating conditions.

[0072] [a] An initial operation was performed when the operation of the substrate processing apparatus 1 started (up) or when the operation started again.

[0073] [b]The temperature of the stage 40 was changed based on events such as user operation, operation of the substrate processing device 1, or occurrence of abnormality.

[0074] [c] The preheating of frame member 50 is invalid (the preheating invalid flag F2 in the status register is 1).

[0075] Additionally, the preheating actuator 83 moves the frame member 50 relative to the step surface 412 to position the frame member 50 at the set preheating position HP (see also...). Figure 3 The preheating position HP is a position where the frame member 50 will not interfere with the stage 40 even if it deforms, and it is also a position where the frame member 50 can effectively receive the radiant heat from the stage 40. The separation distance X of the preheating position HP relative to the step surface 412 of the stage body 41 is shorter than the distance D between the mounting surface 411 and the step surface 412. Preferably, the actual separation distance X of the preheating position HP is preset through experiments, simulations, etc., and is preferably set in the range of about 0.3 mm to 3 mm. Alternatively, as described above, the separation distance X of the preheating position HP can be set by the user via setting screen information.

[0076] The preheating actuator 83 can also be configured to automatically change the preheating position HP based on the temperature of the stage 40. For example, the preheating actuator 83 stores correspondence information (not shown) that maps the temperature of the stage 40 to the preheating position HP, and sets the preheating position HP by referring to the temperature of the stage 40 measured by the temperature sensor 47 and the corresponding information. That is, when the temperature of the stage 40 is high, the preheating position HP is set to a first distance from the step surface 412; on the other hand, when the temperature of the stage 40 is low, the preheating position HP becomes a second distance from the step surface 412 that is shorter than the first distance.

[0077] The preheating execution unit 83 automatically starts operating upon receiving a determination from the preheating condition determination unit 82 that the preheating conditions have been met (e.g., information indicating the initial operation has ended), causing the frame member lifting unit 60 to operate and position the frame member 50 in the preheating position HP. At this time, the control unit 70 monitors the current height position of the frame member 50 by acquiring the operating status of the frame member lifting unit 60. Furthermore, the control unit 70... Figure 5 The position information area 95 in the frame member screen information 90 shows the position of the support plate 65 and the position of the frame member 50 relative to the step surface 412. Furthermore, in Figure 5 In the position information area 95, the axis position column 951 is the relative distance of the support plate 65 to the reference position, and the frame member position column 952 is the relative distance of the frame member 50 to the step surface 412.

[0078] After the frame member 50 is positioned at the preheating position HP, the preheating execution unit 83 keeps the frame member 50 in standby position HP until the preheating completion time is reached, which is sufficient to fully heat up the frame member 50. The preheating completion time also depends on the temperature of the stage 40 and the preheating position HP, and is preferably set to about 3 to 60 seconds. The preheating completion time can be automatically changed according to the temperature of the stage 40 and the preheating position HP. For example, the preheating execution unit 83 stores corresponding information (not shown) that associates the temperature of the stage 40 with the preheating position HP through the preheating completion time, sets the preheating completion time with reference to the corresponding information, and starts timing until the preheating completion time is reached.

[0079] Furthermore, during the preheating of the frame member 50, the preheating execution unit 83 sets the preheating incomplete flag F1 in the status register representing the status information of the frame member 50 (setting the preheating incomplete flag F1 from 0 to 1). On the other hand, after the preheating of the frame member 50 is completed, the preheating incomplete flag F1 is set from 1 to 0. During the preheating period, the preheating execution unit 83 monitors the preheating status (elapsed time), for example, at... Figure 5The preheating information area 96 in the frame component screen information 90 shows the elapsed time. The preheating information area 96 includes a status bar 961 that shows the current status such as currently executing (preheating not completed), preheating completed, and preheating not executed; a preheating time bar 962 that shows the elapsed time of preheating of frame component 50; and a cooling time bar 963 that shows the elapsed time of temperature drop of frame component 50.

[0080] Furthermore, the substrate processing apparatus 1 may include a detection unit (not shown) for detecting the temperature of the frame member 50, and the preheating of the frame member 50 is determined based on the temperature detected by the detection unit. Additionally, it is preferable that when the substrate processing apparatus 1 is operating (in production use), even if the preheating completion time has elapsed and the substrate W is not being transported to the stage 40, the control unit 70 keeps the frame member 50 positioned at the preheating position HP in a standby state at the preheating position HP. In other words, the frame member 50 is positioned at the preheating position HP even if the preheating incomplete flag F1 is 0. This prevents an unexpected drop in the temperature of the frame member 50 after preheating is completed.

[0081] When the substrate processing apparatus 1 is operating, the preheating failure monitoring unit 84 monitors for preheating failure when the temperature of the frame member 50, which has become temporarily preheated, drops. The preheating failure monitoring unit 84 obtains the height position (vertical position) of the frame member 50 from the power distribution drive unit 66, etc., and measures the time when the frame member 50 is at a position higher than the preheating position HP relative to the stage 40 and the temperature of the frame member 50 drops (e.g., the loading / unloading standby position).

[0082] Figure 6 This is a diagram illustrating the location information area and preheating information when monitoring preheating is ineffective. Figure 6 In the location information area 95 shown, the frame member location field 952 has a larger value, indicating the location where the temperature drop of the frame member 50 occurred. Additionally, in... Figure 6 The cooling time column 963 in the preheating information area 96 shows the time during which preheating is ineffective.

[0083] When the preheating failure monitoring unit 84 detects that the elapsed time is longer than the preset preheating failure time, it determines that the temperature of the frame member 50 has dropped, i.e., the preheating of the frame member 50 is ineffective. The preheating failure time also depends on the temperature within the processing space 14a (the temperature of the stage 40), and is, for example, set to a value of 3 minutes or more. Furthermore, the preheating failure time can be automatically adjusted based on the temperature within the processing container 10 or the stage 40. In the case of determining that the preheating of the frame member 50 is ineffective, the preheating failure monitoring unit 84 sets the preheating failure flag F2 (from 0 to 1).

[0084] When the preheating invalid flag F2 is set to 1, the control unit 70 switches the preheating completed status display to the no-preheating status display in the status bar 961 of the preheating information area 96. Furthermore, the control unit 70 re-preheats the frame member 50 by activating the preheating execution unit 83. For example, when the timing for loading and unloading the substrate W is not being performed, the control unit 70 activates the frame member lifting unit 60 under the control of the preheating execution unit 83 to position the frame member 50 at the preheating position HP. Moreover, when the preheating execution unit 83 starts preheating, the preheating invalid monitoring unit 84 sets the preheating invalid flag F2 from 1 to 0. On the other hand, the preheating execution unit 83 sets the preheating incomplete flag F1 from 0 to 1.

[0085] return Figure 4 When the preheating incomplete flag F1 or the preheating invalid flag F2 is set to 1 (preheating incomplete, preheating invalid, etc.), the interlocking unit 85 of the control unit 70 implements a preheating interlock. For example, in the preheating interlock, except for the initial operation, the interlocking unit 85 prevents the frame member 50 from contacting the step surface 412 of the stage 40. As an example, the interlocking unit 85 stops the operation of functional units other than the preheating execution unit 83 in the software, thereby preventing the frame member 50 from contacting the step surface 412. Alternatively, the interlocking unit 85 can mechanically prevent the frame member 50 from contacting the step surface 412 by making the insertion member or the like contact the frame member 50.

[0086] Furthermore, if the preheating incomplete flag F1 or the preheating invalid flag F2 is set to 1, the interlock unit 85 prohibits substrate processing (process execution). For example, when substrate processing is prohibited, the substrate processing apparatus 1 is prohibited from loading the substrate W, supplying gas into the processing container 10, and operating the high-frequency power supply 32, etc.

[0087] Furthermore, the interlocking unit 85 can perform contact interlocking to prevent changes in the temperature of the stage 40 while the frame member 50 is in contact with the stage 40. Regarding temperature changes in the stage, examples include stopping the heating wire 45 and creating a vacuum inside the processing container 10. This prevents the frame member 50 from deforming while in contact with the step surface 412 due to temperature changes received from the step surface 412 of the stage 40.

[0088] Furthermore, when a temperature change of the stage 40 is required, the control unit 70 can perform a release action to lift the frame member 50 from the step surface 412, and then perform a temperature change of the stage 40. Through this release action, the substrate processing apparatus 1 can reliably avoid friction between the stage 40 and the frame member 50, and can smoothly perform a temperature change of the stage 40.

[0089] The substrate processing determination unit 86 of the control unit 70 determines whether to perform substrate processing based on whether the implementation conditions for substrate processing are met. For example, the substrate processing determination unit 86 sets the implementation condition for substrate processing as the interlocking unit 85 not interlocking (preheating incomplete flag F1 is 0 and preheating invalid flag F2 is 0). Other implementation conditions for substrate processing include substrate processing being performed in the manufacturing process, the substrate W being prepared for transport by the transport device, and no abnormal events occurring.

[0090] When the substrate processing determination unit 86 determines that the implementation conditions are met, the substrate processing control unit 87 of the control unit 70 controls each structure of the substrate processing apparatus 1 to perform substrate processing. Specifically, the substrate processing control unit 87 raises the preheated frame member 50 to position it in the loading / unloading standby position. After loading the substrate W onto the mounting surface 411, the frame member 50 is lowered to contact the step surface 412 of the stage 40. Furthermore, the substrate processing control unit 87 sets a pre-set vacuum atmosphere inside the processing container 10, supplies gas to the processing space 14a, and plasma-infuses the gas, thereby performing actual substrate processing by providing precursors in the plasma to the substrate W. This substrate processing includes film deposition processing using CVD, etching processing, etc.

[0091] The substrate processing apparatus 1 according to one embodiment is formed basically as described above. Hereinafter, referring to... Figure 7 and Figure 8 To explain this action. Figure 7 This is a flowchart illustrating the preheating treatment method for frame component 50. Figure 8 This is a flowchart representing the substrate processing routine.

[0092] When the substrate processing apparatus 1 is in operation (e.g., during startup or operation), it performs a preheating process to preheat the frame member 50. In the implementation of the preheating process, the stage temperature control unit 80 of the control unit 70 controls the heater drive unit 46 to adjust the temperature of the stage 40 so that the temperature of the stage 40 becomes the target temperature of the stage 40 set by the user or the process (step S1).

[0093] Additionally, the initial control unit 81 of the control unit 70 controls the initial operation of each structure of the substrate processing apparatus 1 (step S2). During the initial operation of the frame member lifting unit 60, the initial control unit 81 lowers the support column 62 of each unit lifting mechanism 61 to the lower limit position, thereby aligning the zero position of the support plate 65. Furthermore, the substrate processing apparatus 1 can perform initial operation control (step S2) and temperature adjustment of the stage 40 (step S1) at the same timing.

[0094] Furthermore, the preheating condition determination unit 82 of the control unit 70 confirms the aforementioned preheating conditions for preheating the frame member 50 and determines whether the preheating conditions are met (step S3). In step S3, if the preheating conditions are not met (step S3: "No"), steps S4 to S9 are skipped, and step S10 is performed without preheating the frame member 50.

[0095] In step S3, if the preheating condition is met (step S3: "Yes"), the preheating execution unit 83 of the control unit 70 sets the preheating incomplete flag F1 to 1 (step S4). When the interlock unit 85 detects that the preheating incomplete flag F1 is 1, it performs a preheating interlock. During the preheating interlock, the interlock unit 85 performs interlocks as described above, such as preventing the frame member 50 from contacting the stage 40 and preventing processing of the substrate W, to restrict the operation (step S5).

[0096] Furthermore, the preheating actuator 83 controls the operation of the frame member lifting unit 60 to position the frame member 50 in the preheating position HP, which is separated from the step surface 412 of the stage 40 (step S6).

[0097] Furthermore, the preheating execution unit 83 preheats the frame member 50 by maintaining the frame member 50 in the preheating position HP and supplying heat from the stage 40 to the frame member 50 (step S7).

[0098] During step S7, the preheating execution unit 83 starts timing from the time the frame member 50 is placed at the preheating position HP, and determines whether the standby time at the preheating position HP has reached the preheating completion time (step S8). If the standby time has not reached the preheating completion time (step S8: "No"), the preheating execution unit 83 returns to step S7 and continues preheating the frame member 50. On the other hand, if the standby time has reached the preheating completion time (step S8: "Yes"), the preheating execution unit 83 detects that the temperature difference between the stage 40 and the frame member 50 has disappeared, restores the preheating incomplete flag F1 to 0, and completes the preheating (step S9). Based on the preheating incomplete flag F1 becoming 0, the interlocking unit 85 releases the interlock between the frame member 50 and the step surface 412 and the substrate processing.

[0099] After preheating is completed, the substrate processing determination unit 86 of the control unit 70 confirms the process, the setting status of the substrate W relative to the conveying device, the fault status, etc., and determines whether to switch to substrate processing (step S10). If the switch is not to substrate processing (step S10: "No"), the control unit 70 keeps the frame member 50 in standby at the preheating position HP (step S11) and returns to step S10.

[0100] On the other hand, when switching to substrate processing (step S10: "No"), the substrate processing control unit 87 of the control unit 70 performs the above-mentioned substrate processing operation (substrate processing routine) (step S12).

[0101] like Figure 8 As shown, in the substrate processing routine, the substrate processing control unit 87 first controls the operation of the frame member lifting unit 60 to position the frame member 50 in the loading / unloading standby position (step S21). In this state, the substrate processing control unit 87, in conjunction with the conveying device, performs loading of the substrate W into the processing container 10 and placement of the substrate W onto the loading surface 411 of the stage 40 (step S22).

[0102] Subsequently, the substrate processing control unit 87 controls the operation of the frame member lifting unit 60, causing the frame member 50 to descend relative to the stage 40 and the substrate W, so that the lower surface 511 of the outer peripheral portion 51 of the frame member 50 contacts the step surface 412 of the stage 40 (step S23). As a result, the eaves 52 of the frame member 50 covers the upper part of the edge of the substrate W without contacting it.

[0103] Subsequently, the substrate processing control unit 87 sets the processing container 10 to a preset vacuum atmosphere, supplies gas to the processing space 14a and plasmas the gas, thereby performing actual substrate processing (step S24) by providing precursors in plasma to the substrate W.

[0104] Furthermore, after substrate processing, the substrate processing control unit 87 activates the frame member lifting unit 60 to raise the frame member 50 to the loading / unloading standby position (step S25), and removes the processed substrate W from the processing container 10 (step S26). The substrate processing determination unit 86 then determines whether to continue substrate processing (step S27). If it determines that substrate processing is complete (step S27: "No"), the processing flow ends. On the other hand, if substrate processing continues (step S27: "Yes"), the substrate processing determination unit 86 determines whether the substrate W can be loaded into the processing container 10 (step S28). If the substrate W can be loaded (step S28: "Yes"), the substrate processing control unit 87 returns to step S22 while maintaining the frame member 50 in the loading / unloading standby position, repeating the same actions as described above after loading the substrate W. The time for moving the substrate W out and in relative to the mounting surface 411 is not the time during which the temperature of the frame member 50 will drop significantly (it is a time shorter than the ineffective preheating time), for example, it is about tens of seconds to two minutes.

[0105] On the other hand, if the substrate W cannot be immediately transferred (step S28: "No"), the preheating failure monitoring unit 84 starts timing and determines whether the measurement time is longer than the preheating failure time (step S29). If the measurement time is shorter than the preheating failure time (step S29: "No"), the process returns to step S28 and repeats the monitoring of the transfer of the substrate W. Moreover, if the measurement time is longer than the preheating failure time (step S29: "Yes"), the preheating failure monitoring unit 84 determines that the preheating is invalid and sets the preheating failure flag F2 to 1 (step S30).

[0106] When the preheating invalid flag F2 is 1, the preheating conditions for step S3 are met. Therefore, the preheating execution unit 83 of the control unit 70 re-executes the processing flow after step S4. When returning to step S4, the control unit 70 sets the preheating invalid flag to 0, and on the other hand, sets the preheating incomplete flag to 1. Furthermore, if it is impossible to transfer the substrate W into the processing container 10, the control unit 70 can move the frame member 50 to the preheating position HP and put it into standby mode without waiting for the preheating invalid time, thereby preheating the frame member 50. As a result, the temperature drop of the frame member 50 can be effectively suppressed. Moreover, when it is possible to transfer the substrate W, the control unit 70 raises the frame member 50 at the preheating position HP back to the transfer-in / transfer-out standby position.

[0107] As described above, the component preheating method and the substrate processing apparatus 1 can appropriately preheat the frame member 50, which is a component capable of contacting and moving relative to the stage 40. Furthermore, by preheating the frame member 50, the component preheating method and the substrate processing apparatus 1 cause the frame member 50 to deform with temperature changes, thereby preventing deformation of the frame member 50 when it is in contact with the stage 40. Therefore, the relative position of the frame member 50 with respect to the substrate W on the stage 40 becomes stable, and the uniformity of the processing of the substrate W can be improved.

[0108] Furthermore, during the preheating process of the component, the component (frame member 50) is kept in the preheating position HP until a preset preheating completion time has elapsed. Thus, the component preheating method allows for adjustment of the temperature of the frame member 50 during preheating until the temperature difference between the frame member 50 and the stage 40 is sufficiently eliminated.

[0109] Furthermore, after the preheating process of the component, the following steps are included: measuring the time it takes for the component (frame member 50) to be located further away from the stage 40 than the preheating position HP; determining whether the measurement time has exceeded the invalid preheating time; and if the measurement time has exceeded the invalid preheating time, identifying the preheating of the component as invalid, and re-performing the preheating process of the component. Therefore, the component preheating method allows for easy reheating of the component as needed, even if the component has only been temporarily preheated.

[0110] Furthermore, the substrate processing apparatus 1 includes a component lifting unit (frame member lifting unit 60). This component lifting unit (frame member lifting unit 60) lifts and lowers the component by raising and lowering a movable part (support plate 65) that supports the component (frame member 50) in a detachable manner. Before the component preheating process, the following initial action is performed: the movable part is lowered to bring the component into contact with the stage 40, thereby detaching the component from the movable part and aligning the movable part with a reference position. As a result, the component preheating process can precisely control the position of the component when the frame member 50 is raised and lowered, thereby enabling more appropriate preheating of the component.

[0111] Furthermore, the stage 40 has a contact surface (stepped surface 412) that contacts the component (frame member 50), and the preheating position HP is set within a range of 0.3 mm to 3 mm from the contact surface. Therefore, the component preheating method can efficiently adjust the temperature of the component positioned at the preheating position HP.

[0112] Furthermore, during the preheating process of the component, a preheating interlock process is included to restrict the operation of the substrate processing apparatus 1. As a result, the preheating process of the component can be performed more safely.

[0113] Furthermore, as a restriction on the operation of the interlock during preheating, contact between the component (frame member 50) and the stage 40 is prohibited. Therefore, the component preheating method reliably prevents unpreheated components from contacting the stage 40.

[0114] Furthermore, as a restriction on the operation during preheating interlocking, processing of the substrate W is prohibited. Therefore, in the case of components (frame members 50) that have not been preheated, the preheating process can avoid processing of the substrate W, thereby preventing friction between the components and the stage 40 or the substrate W.

[0115] Furthermore, during the contact between the component (frame member 50) and the stage, a contact interlock is performed to prevent temperature changes in the stage 40. Thus, the preheating treatment method for the component can suppress deformation of the component in contact with the stage 40 due to temperature changes in the stage 40.

[0116] Furthermore, the component is a frame member 50 with an eave 52, which covers the periphery wp of the substrate W placed on the stage 40 when the component is in contact with the stage 40. Thus, the preheating process of the component can stably cover the periphery of the substrate W by means of the preheated eave 52 of the frame member 50.

[0117] Another aspect of this disclosure is a substrate processing apparatus 1, comprising a stage 40 for placing a substrate W, and a component (frame member 50) capable of contacting and moving relative to the stage 40. The substrate processing apparatus 1 includes a control unit 70 that controls the movement of the component. The control unit 70 positions the component at a preheating position HP where it is not in contact with the stage 40, preheats the component using radiant heat from the stage 40, and then brings the preheated component into contact with the stage 40. Thus, the substrate processing apparatus 1 can appropriately preheat the component, thereby improving the uniformity of processing the substrate W.

[0118] The preheating treatment method for the frame member 50 and the substrate processing apparatus 1 disclosed herein are illustrative in all respects and not restrictive. The embodiments can be modified and improved in various ways without departing from the appended claims and their spirit. Other structures can be adopted for the matters described in the above embodiments without contradiction, and combinations can also be made without contradiction.

[0119] The substrate processing apparatus 1 disclosed herein can also be applied to any type of apparatus such as ALD (Atomic Layer Deposition), CCP (Capacitively Coupled Plasma), ICP (Inductively Coupled Plasma), RLSA (Radial Line Slot Antenna), ECR (Electron Cyclotron Resonance Plasma), and HWP (Helicon Wave Plasma).

[0120] Explanation of reference numerals in the attached figures

[0121] 1: Substrate processing apparatus; 10: Processing container; 40: Stage; 50: Frame member; 60: Frame member lifting part; 70: Control unit; HP: Preheating position; W: Substrate.

Claims

1. A method for preheating a component, the component being capable of contacting and moving relative to a stage of a substrate processing apparatus for placing a substrate, the method being characterized in that... The process includes the following steps: The frame member, which is the component, is positioned in a preheating position where it does not contact the stage, and the frame member is preheated by radiant heat from the stage. as well as The preheated frame component is brought into contact with the stage in a state where it is not in contact with the substrate during the preheating process.

2. The preheating treatment method for the component according to claim 1, characterized in that, In the process of preheating the frame component, the frame component is left idle at the preheating position until a preset preheating completion time has elapsed.

3. The preheating treatment method for the component according to claim 1 or 2, characterized in that, After the preheating process of the frame component, the following steps are included: measuring the time it takes for the frame component to be located further away from the stage than the preheating position, and determining whether the measurement time has exceeded the invalid preheating time. If the measurement time exceeds the preheating invalid time, the preheating of the frame component is identified as invalid, and the process of preheating the frame component is repeated.

4. The preheating treatment method for the component according to claim 1 or 2, characterized in that, The substrate processing apparatus includes a frame member lifting unit, which lifts or lowers the frame member by raising or lowering a support column that supports the frame member in a detachable manner. Before the preheating process of the frame member, the following initial action is performed: the support is lowered to bring the frame member into contact with the platform, thereby detaching the frame member from the support and aligning the support with the reference position.

5. The preheating treatment method for the component according to claim 1 or 2, characterized in that, The stage has a contact surface that contacts the frame member. The preheating position is set within a range of 0.3mm to 3mm from the contact surface.

6. The preheating treatment method for the component according to claim 1 or 2, characterized in that, During the process of preheating the frame member, a preheating interlock is performed to restrict the operation of the substrate processing apparatus.

7. The preheating treatment method for the component according to claim 6, characterized in that, As a restriction on the action of the interlock during preheating, the frame member is prohibited from contacting the stage.

8. The preheating treatment method for the component according to claim 6, characterized in that, As a restriction on the action of the interlock during preheating, processing of the substrate is prohibited.

9. The preheating treatment method for the component according to claim 1 or 2, characterized in that, During the process of bringing the frame member into contact with the stage, an interlock is performed to prevent changes in the temperature of the stage during contact.

10. The preheating treatment method for the component according to claim 1 or 2, characterized in that, The frame member is a frame member with an eaves, and when the member is in contact with the stage, the eaves cover the periphery of the substrate placed on the stage.

11. A substrate processing apparatus comprising a stage for placing a substrate, and a frame member as a component capable of contacting and moving relative to the stage, characterized in that... It also includes a control unit that controls the movement of the frame member. in, The control unit positions the frame member in a preheating position where it is not in contact with the stage, and preheats the frame member using radiant heat from the stage. The control unit causes the preheated frame member to contact the stage without contacting the substrate.

Images