Display panel, display device and packaging method

Abstract

An embodiment of the present invention discloses a display panel, a display device and a packaging method, wherein the display panel includes: a first substrate and a second substrate arranged opposite to each other, a display area and a first non-display area extending along a first direction; a metal layer located between the first substrate and the second substrate, including a first metal layer extending along the first direction; the orthographic projection of the first metal layer on the first substrate is located within the first non-display area; the first metal layer includes a first area, a second area and a third area; along the second direction, the first area and the third area are located on both sides of the second area; the transmittance of the second area is greater than the transmittance of the first area and the transmittance of the third area; the laser energy in the first area, the second area and the third area on the first metal layer is relatively uniform, thereby reducing the stress caused by the uneven melting rate of the packaging glue, improving the packaging effect of the display panel, and ensuring the reliability of the display.

Description

[0001] This application is a divisional application with the application date of December 22, 2020, application number 202011526208.9, and the name of the invention being "A display panel, display device and packaging method". Technical Field

[0002] The present invention relates to the field of display technology, and in particular to a display panel, a display device and a packaging method. Background Art

[0003] Organic Light Emitting Display (OLED) panels have excellent properties such as low power consumption, fast response speed, ultra-thinness, light weight, wide viewing angle, and high brightness. Therefore, OLED display panels are widely used in the field of display technology and will become the mainstream product of display devices in the future.

[0004] Currently, glass welding technology can be used for OLED packaging, that is, using laser to irradiate glass glue and then bond the upper and lower substrates. In order to improve the utilization rate of laser energy, make the packaging glue absorb more light, and achieve a better melting effect, packaging metal is usually set on the packaging area. The packaging metal layer can reflect the laser spot, and the reflected laser spot is irradiated on the glass glue again, increasing the irradiation temperature, promoting the glass glue's ability to absorb laser light, and thus achieving a more ideal melting effect. However, due to the uneven distribution of laser energy, the energy of the laser spot irradiated on the glass glue is uneven, resulting in inconsistent melting speeds of glass glue in different areas, causing stress in the packaging area and uneven packaging, which in turn makes the glass glue prone to cracks, causing packaging failure and affecting the display effect. Summary of the Invention

[0005] In view of this, the present invention provides a display panel, a display device, and a packaging method, which can effectively solve the problem of packaging failure and thus affecting display.

[0006] In a first aspect, the present invention provides a display panel, comprising: a first substrate, the first substrate comprising a display area and a non-display area surrounding the display area; the non-display area comprising a first non-display area extending along a first direction; a second substrate, the second substrate being arranged opposite to the first substrate; a metal layer, located between the first substrate and the second substrate, the orthographic projection of the metal layer on the first substrate being located in the non-display area, comprising a first metal layer extending along the first direction; the orthographic projection of the first metal layer on the first substrate being located within the first non-display area; the first metal layer comprising a first area, a second area and a third area; in the second direction, the first area and the third area are located on both sides of the second area, the first area is located on a side of the second area away from the display area, and the second direction intersects with the first direction; the transmittance of the second area is greater than the transmittance of the first area and the transmittance of the third area; and encapsulation glue, the encapsulation glue is located between the first substrate and the second substrate.

[0007] In a second aspect, the present invention provides a display device comprising the display panel as described in the first aspect.

[0008] In a third aspect, the present invention further provides a display panel packaging method, applicable to manufacturing the aforementioned display panel. The method comprises: providing the display panel described in the first aspect; providing a laser source; and sintering the packaging adhesive using the laser, with the laser irradiating from the packaging adhesive toward the metal layer.

[0009] Compared with the prior art, the display panel and display device provided by the present invention achieve the following beneficial effects: the transmittance of the second area of ​​the metal layer is designed to be greater than the transmittance of the first area and the transmittance of the third area, so that different areas of the metal layer reflect the laser energy to different degrees, the area with high laser energy reflects the laser to a low degree, and the area with low laser energy reflects the laser to a high degree, further matching the distribution of laser energy, and ultimately making the laser energy received by the packaging glue in different packaging areas uniform, so that the melting speed of the packaging glue in different packaging areas is relatively uniform, thereby reducing the stress caused by the uneven melting speed of the packaging glue, improving the packaging effect of the display panel, and ensuring the reliability of the display. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 This is a schematic diagram of the packaging process of a display panel in the prior art;

[0011] Figure 2 is a structural schematic diagram of a display panel provided by an embodiment of the present invention;

[0012] Figure 3 yes Figure 2 Cross-sectional view in the middle BB direction;

[0013] Figure 4 is a schematic diagram of the structure of a first metal layer of a display panel provided by an embodiment of the present invention;

[0014] Figure 5 is a schematic diagram of the first metal layer structure of another display panel provided by an embodiment of the present invention;

[0015] Figure 6 is a schematic diagram of the first metal layer structure of another display panel provided by an embodiment of the present invention;

[0016] Figure 7 is a schematic diagram of the first metal layer structure of another display panel provided by an embodiment of the present invention;

[0017] Figure 8 is a schematic diagram of the first metal layer structure of another display panel provided by an embodiment of the present invention;

[0018] Figure 9 is a schematic diagram of the first metal layer structure of another display panel provided by an embodiment of the present invention;

[0019] Figure 10 is a structural diagram of another display panel provided by an embodiment of the present invention;

[0020] Figure 11 1 is a schematic diagram of a corner metal layer structure of a display panel provided by an embodiment of the present invention;

[0021] Figure 12 1 is a schematic diagram of a corner metal layer structure of another display panel provided by an embodiment of the present invention;

[0022] Figure 13 is a structural diagram of another display panel provided by an embodiment of the present invention;

[0023] Figure 14 yes Figure 10 A partial schematic diagram of another display panel area C provided in ;

[0024] Figure 15 is a schematic diagram of a display device provided by an embodiment of the present invention;

[0025] Figure 16 It is a schematic diagram of a display panel packaging method provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0026] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present invention. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute a separate or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0027] It should be understood that the preferred embodiments described below are intended only to illustrate and explain the present invention and are not intended to limit the present invention. Furthermore, the embodiments and features within the embodiments may be combined unless there is a conflict. Furthermore, the shapes and sizes of the components in the drawings do not reflect actual proportions and are intended only to illustrate the present invention.

[0028] In order to better understand the above technical solution, the technical solution of the present invention is described in detail below with the help of the accompanying drawings and specific embodiments. It should be understood that the embodiments of the present invention and the specific features in the embodiments are detailed descriptions of the technical solution of the present invention, rather than limitations on the technical solution of the present invention. In the absence of conflict, the embodiments of the present invention and the technical features in the embodiments can be combined with each other.

[0029] Please refer to Figure 1 、 Figure 1 Schematic diagram of the packaging process of the display panel in the prior art. In the prior art, the first substrate 1' and the second substrate 2' are packaged with a packaging glue 4'. In order to improve the utilization rate of the laser 6' energy, a packaging metal 3' is generally provided on the side of the packaging glue 4' away from the second substrate 2'. The first substrate 1' and the second substrate 2' are usually glass. According to the needs of the product, different functional structures (not shown in the figure) may exist on the first substrate 1' and the second substrate 2', such as an array structure, a light-emitting structure and a touch structure. There are other film layers between the packaging glue 4' and the packaging metal 3', such as some insulating film layers. Figure 1 The positional relationship between the encapsulation adhesive 4' and the encapsulation metal 3' is shown for illustrative purposes only. Laser light 6 is irradiated from the encapsulation adhesive 4' toward the encapsulation metal 3', allowing the encapsulation adhesive 4' to utilize the laser energy reflected by the encapsulation metal 3'. However, the laser spot energy has a Gaussian distribution, while the encapsulation metal 3' reflects the laser light 6' uniformly. This results in inconsistent melting rates of the encapsulation adhesive 4' in different areas, causing stress in the encapsulation adhesive 4' in corresponding areas. This, in turn, can easily cause cracks in the encapsulation adhesive 4', leading to encapsulation failure and poor display quality.

[0030] To solve the above problems, the present invention provides a display panel. Figure 2-3The display panel 100 includes: a first substrate 1, the first substrate 1 including a display area AA and a non-display area NA surrounding the display area AA; the non-display area NA including a first non-display area NA1 extending along a first direction X; a second substrate 2, the second substrate 2 being arranged opposite to the first substrate 1; a metal layer 3, located between the first substrate 1 and the second substrate 2, the orthographic projection of the metal layer 3 on the first substrate 1 being located in the non-display area NA, and including a first metal layer 31 extending along the first direction X; the orthographic projection of the first metal layer 31 on the first substrate 1 being located within the first non-display area NA1; the first metal layer 31 including a first region 31a, a second region 31b, and a third region 31c; along a second direction Y, the first region 31a and the third region 31c are located on either side of the second region 31b, the first region 31a is located on a side of the second region 31b away from the display area, and the second direction Y intersects the first direction X; the transmittance of the second region 31b is greater than the transmittance of the first region 31a and the transmittance of the third region 31c; and an encapsulant 4, located between the first substrate 1 and the second substrate 2.

[0031] It should be explained that the first substrate 1 includes a display area AA and a non-display area NA surrounding the display area AA. The first substrate can have a variety of functional film layers (not shown in the figure), such as an array film layer, a light-emitting film layer, etc., according to the needs of the display panel. The display area AA refers to the area where the image can be displayed and is provided with pixel units. The non-display area NA refers to the area where the image cannot be displayed and is generally used for routing or placing binding terminals, test terminals, VSR circuits, etc. The non-display area NA includes a first non-display area NA1 extending along a first direction X. The first direction X here can be the direction in which the data lines in the display panel 100 extend, or it can be the direction in which the scan lines in the display panel 100 extend. In the embodiment of the present invention, only the first direction X is used as an example to illustrate the direction in which the data lines in the display panel 100 extend.

[0032] The first metal layer 31 includes a first region 31a, a second region 31b, and a third region 31c. Along the second direction Y, the first region 31a and the third region 31c are located on either side of the second region 31b, with the first region 31a located on the side of the second region 31b away from the display area. It should be noted that the second direction Y can be the direction in which data lines extend within the display panel 100, or the direction in which scan lines extend within the display panel 100. In the embodiments of the present invention, only the second direction Y is used as the direction in which scan lines extend within the display panel 100. The first region 31a is located near the outer edge of the first metal layer 31, the second region 31b is located in the middle of the first metal layer 31 along the second direction Y, and the third region 31c is located near the outer edge of the display area of ​​the first metal layer 31.

[0033] The transmittance of the second region 31b is greater than that of the first region 31a and the transmittance of the third region 31c. It is understood that the first metal layer 31 is provided with multiple through-holes. The shape of the through-holes is not limited here and can be circular or square, etc. There is also no limitation on the size and distribution density of the through-holes in different regions and they can be the same or different. It is only necessary to ensure that the ratio of the total through-hole area of ​​the second region 31b to the total area of ​​the second region 31b is greater than the ratio of the total through-hole area of ​​the first region 31a to the total area of ​​the first region 31a, and greater than the ratio of the total through-hole area of ​​the third region 31c to the total area of ​​the third region 31c. That is, per unit area, the total through-hole area of ​​the second region 31b is greater than the total through-hole area of ​​the first region 31a, and the total through-hole area of ​​the second region 31b is greater than the total through-hole area of ​​the third region 31c. This configuration can match the Gaussian-distributed laser spot energy and improve the reliability of the package. The energy of the laser spot is distributed in a state of high in the middle and low on both sides. In this embodiment, the transmittance of the middle area (second area 31b) of the first metal layer 31 is high, that is, the metal's reflection of the laser is low, and the energy received by the encapsulant at the corresponding position is low. The transmittance of the two sides (first area 31a and third area 31b) is low, that is, the metal's reflection of the laser is high, and the energy received by the encapsulant at the corresponding position is high. Therefore, in areas with high laser energy, the metal reflects the laser less, and in areas with low laser energy, the metal reflects the laser more. This makes the laser energy received by the encapsulant 4 in the first area 31a, second area 31b, and third area 31c of the first metal layer 31 relatively uniform, thereby reducing the stress caused by the uneven melting rate of the encapsulant, improving the encapsulation effect of the display panel, and ensuring the reliability of the display.

[0034] There are many ways to achieve that the light transmittance of the second region 31b in the first metal layer 31 is greater than the light transmittance of the first region 31a and the light transmittance of the third region 31c. The embodiments of the present invention are described in the following cases.

[0035] Please refer to Figure 4In some optional embodiments, the transmittance of the second area 31b is 100%. It is understandable that the second area 31b at this time is the central area with the highest laser energy in the corresponding packaging process. The laser energy here is sufficient to melt the packaging glue in the corresponding area, and there is no need to further irradiate the packaging glue through the metal reflection laser. Therefore, the metal in the second area 31b of the first metal layer 31 is completely hollowed out to achieve a transmittance of 100% in the second area 31b. According to the Gaussian distribution of the energy of the laser spot, the laser energy corresponding to the first area 31a and the third area 31c is relatively low. The metal layer needs to reflect the laser energy to make the packaging glue in the corresponding place melt further evenly. Therefore, multiple through holes can be set in the first area 31a and the second area 31b to retain part of the metal, so that the laser energy received by the packaging glue in its corresponding area is relatively consistent with the laser energy received by the packaging glue corresponding to the second area. Such a setting can reduce the stress caused by the uneven melting rate of the packaging glue, improve the packaging effect of the display panel, and ensure the reliability of the display.

[0036] Please refer to Figure 5 In some optional embodiments, the first region 31a and the third region 31c are provided with a plurality of first through holes 311, and the second region 31b is provided with a plurality of second through holes 312. The area of ​​the first through holes 311 is equal to the area of ​​the second through holes 312, and the distribution density of the first through holes 311 in the first region 31a and the third region 31c is less than the distribution density of the second through holes 312 in the second region 31b. Here, whether the shapes of the first through holes 311 and the second through holes 312 are the same or not is not limited, and they can be the same or different. In some optional embodiments, the shapes of the first through holes 311 and the second through holes 312 are the same. The same shape facilitates preparation, reduces preparation steps, and improves efficiency. There is no limitation on the shapes of the first through holes 311 and the second through holes 312, and they can be any graphics according to the existing process. Figure 5 Taking the example of the first through hole and the second through hole being circular, it is only necessary to ensure that the areas of the first through hole 311 and the second through hole 312 are the same, so that the transmittance of the second region 31b is greater than the transmittance of the first region 31a and the transmittance of the third region 31c. Such a setting can not only achieve that the transmittance of the second region 31b in the first metal layer 31 is greater than the transmittance of the first region 31a and the transmittance of the third region 31c, but also make the laser energy received by the encapsulant in the first region 31a, the second region 31b and the third region 31c on the first metal layer 31 relatively uniform, thereby reducing the stress caused by the uneven melting speed of the encapsulant, improving the encapsulation effect of the display panel, and ensuring the reliability of the display.

[0037] Please refer to Figure 2 and Figure 6In some optional embodiments, the first region 31a and the third region 31c are provided with a plurality of first through holes 311, and the second region 31b is provided with a plurality of second through holes 312, and the area of ​​the first through holes 311 is smaller than the area of ​​the second through holes 312. It should be noted that the distribution state of the second through holes 312 in the second region 31b is not limited here, and can be scattered, orderly and staggered, or distributed in a straight line. It is only necessary to ensure that the distribution density of the second through holes 312 in the second region 31b is the same as the distribution density of the first through holes 311 in the first region 31a and the distribution density of the first through holes 311 in the third region 31c, so that the light transmittance of the second region 31b is greater than the light transmittance of the first region 31a and the light transmittance of the third region 31c. Figure 6 Taking the example of the first through holes 311 and the second through holes 312 being arranged in a straight line along the first direction X, this arrangement can achieve a light transmittance of the second region 31b of the first metal layer 31 greater than the light transmittance of the first region 31a and the light transmittance of the third region 31c, so that the laser energy received by the encapsulant in the first region 31a, the second region 31b, and the third region 31c of the first metal layer 31 is relatively uniform, thereby reducing the stress caused by the uneven melting speed of the encapsulant, improving the encapsulation effect of the display panel, and ensuring the reliability of the display.

[0038] Please refer to Figure 7 In some optional embodiments, the area of ​​the first through hole 311 is smaller than the area of ​​the second through hole 312, and the centers of the plurality of second through holes 312 arranged along the first direction X are on a first virtual center line L1 extending along the first direction X; in the direction from the display area AA to the first non-display area NA1, the area of ​​the first through holes 311 located in the first area 31a gradually decreases; and the area of ​​the first through holes 311 located in the third area 31c gradually increases.

[0039] It should be understood that the first virtual centerline L1 is a line connecting the centers of the second through-holes 312, not an actual line on the first metal layer 31. Here, the center of the second through-hole 312 represents its geometric center. The direction from the display area AA toward the first non-display area NA1 is also the second direction Y. During the display panel packaging process, the laser path above the first non-display area NA1 is a straight line. Therefore, the linear distribution of the second through-holes matches the laser's path, ensuring that areas with high laser energy correspond to metal layers 3 with larger through-hole areas, reducing laser reflection and ensuring uniform packaging. At the same time, the laser energy distribution exhibits a state of high energy in the center and gradually decreasing energy from the center to the sides. Therefore, in this embodiment, the area of ​​the second through-hole 312 in the center region (second region 31b) of the first metal layer 31 is larger than the area of ​​the first through-hole 311 in the two side regions (first region 31a and third region 31c), matching the high energy in the center. Furthermore, in the direction from the display area AA toward the first non-display area NA1, the area of ​​the first through-hole 311 in the first region 31a gradually decreases, while the area of ​​the first through-hole 311 in the third region 31c gradually increases. In other words, the transmittance gradually decreases from the center to the two side regions of the first metal layer 31, while the laser reflection intensity gradually increases, matching the gradual decrease in laser energy from the center to the two sides. Ultimately, the energy received by the encapsulant across the entire area of ​​the first metal layer 31 is uniform. This design can reduce the stress risk caused by uneven melting speed of the encapsulant, improve the encapsulation effect of the display panel, and ensure display reliability.

[0040] Please refer to Figure 8 In some optional embodiments, the center line of the first metal layer 31 extending along the first direction X is the first center line L2, and the first virtual center line L1 is located on a side of the first center line L2 away from the display area AA.

[0041] It will be appreciated that the first metal layer 31 is an axisymmetric pattern having multiple axes of symmetry, with the first center line L2 being the axis of symmetry of the first metal layer 31 extending along the first direction X. The line L1 connecting the centers of the plurality of second through holes 312 is located on the side of the first center line L2 of the first metal layer 31 extending along the first direction X, away from the display area AA. This design can shift the laser path away from the display area during the packaging process of the display panel 100, thereby displacing areas of high laser energy away from the display area AA, preventing laser burns to devices within the display area AA and thereby ensuring display reliability.

[0042] Please refer to Figure 2 and Figure 9In some optional embodiments, the first metal layer 31 includes a plurality of main portions 31A extending along the first direction X and a plurality of connecting portions 31B extending along the second direction Y. The connecting portion 31B connects two adjacent main portions 31A. A gap S exists in the first direction X between two adjacent connecting portions 31B in the second direction Y. The light transmittance of the second region 31b is greater than the light transmittance of the first region 31a and the light transmittance of the third region 31c.

[0043] It is understood that the main body 31A and connecting portion 31B are integrally formed, manufactured through a single process, and are represented by the same fill pattern. Along the second direction Y, a gap S is defined between at least two connecting portions 31B. It should be noted that the gap S between two adjacent connecting portions 31B need not be zero. The gaps S between multiple adjacent connecting portions 32 can be equal or unequal, without limitation.

[0044] It should be noted that the display panel 100 is prone to static electricity during the manufacturing process. For example, cutting can cause static electricity to accumulate within the display panel. Considering that the path for static electricity to enter the display panel 100 is from the non-display area NA to the display area AA, and the metal layer 3 is located in the non-display area NA and arranged around the display area AA, static electricity can easily be transmitted to the display panel through the package metal, increasing the risk of static electricity in the display panel and thus affecting the display effect. However, in the embodiment of the present invention, the arrangement of the main portion 31A and the connecting portion 32B of the first metal layer 31, and the presence of a gap S between two adjacent connecting portions 31B, can extend the path for static electricity to enter the display area AA through the first non-display area NA1, allowing static electricity to dissipate on the first metal layer, reducing the risk of static electricity accumulated in the display panel entering the display area and enhancing the reliability of the display effect. At the same time, the transmittance of the second region 31b is greater than the transmittance of the first region 31a and the transmittance of the third region 31c, further matching the laser energy distribution during the packaging process and improving the reliability of the packaging. The different designs for the transmittance of the second region 31b and the transmittance of the first and third regions 31a and 31c can be controlled by adjusting the width of the main body portions 31A in different regions, the spacing between adjacent main body portions 31A, and the number of connecting portions 31B. It should be noted that the design of the entire metal layer 3 can be similar to that of the first metal layer 31. The first metal layer 31 is used as an example for illustration.

[0045] Please continue to refer to Figure 9 In some optional embodiments, the width of the main body 31A along the second direction Y is W1, the width of the connecting portion 31B along the first direction X is W2, and W1=W2; the spacing between two adjacent main body portions 31A in the second area 31ba is greater than the spacing between two adjacent main body portions 31A in the first area 31a and the third area 31c.

[0046] It will be appreciated that in this embodiment, the spacing h2 between two adjacent main body portions 31A in the second region 31b is greater than the spacing h1 between two adjacent main body portions 31A in the first region 31a and the spacing h3 between two adjacent main body portions 31A in the third region 31c. Furthermore, the width W1 of the main body portion 31A along the second direction Y and the width W2 of the connecting portion 31B along the first direction X are equal. By controlling the spacing between adjacent main body portions 31A in different regions, the light transmittance of the second region 31b is greater than that of the first region 31a and the third region 31c. This reduces the risk of stress caused by uneven melting of the encapsulant, improves the encapsulation of the display panel, and ensures display reliability.

[0047] It should be further explained that the width W1 of the main portion 31A along the second direction Y and the width W2 of the connecting portion 31B along the first direction X represent the width of the path during static electricity transmission. The width of the path further determines the resistance. Sudden changes in resistance during static electricity transmission within the display panel can easily cause damage. In the embodiment of the present invention, the equal width W1 of the main portion 31A along the second direction Y and the width W2 of the connecting portion 31B along the first direction X ensure uniform resistance from the main portion 31A to the connecting portion 31B during static electricity transmission, further reducing the risk of static electricity damaging the first metal layer 31 and causing package failure.

[0048] In summary, this embodiment not only ensures the reliability of the package, but also extends the path of static electricity from the non-display area to the display area, and at the same time makes the resistance in the first metal layer 31 uniform, thereby effectively preventing static electricity from damaging the pad metal.

[0049] Please refer to Figure 10-11 In some optional embodiments, the non-display area NA of the display panel 100 further includes a second non-display area NA2 extending along the second direction Y, and a corner non-display area NA3 connecting the first non-display area NA1 and the second non-display area NA2, the corner non-display area NA3 includes a connecting edge 330, and the shape of the connecting edge 330 is an arc; the metal layer 3 further includes a second metal layer 32 extending along the second direction Y and a corner metal layer 33 connecting the first metal layer 31 and the second metal layer 32, the orthographic projection of the corner metal layer 33 on the first substrate (not shown in the figure) is located within the corner non-display area NA3; the corner metal layer 33 includes a fourth area 33a and a fifth area 33b, the fourth area 33a is located on the side of the fifth area 33b close to the display area AA; the transmittance of the fourth area 33a is greater than the transmittance of the fifth area 33b.

[0050] It is understood that the display panel 100 may be Figure 10The rounded rectangle shown in the figure has two adjacent sides connected by curved edges. The non-display area NA corresponding to the rounded rectangular display panel 100 is naturally also a rounded rectangular area. The path of the laser during the display panel encapsulation process is also a rounded rectangular area. Therefore, the metal layer 3 that reflects the laser energy is also arranged in a rounded rectangular shape around the display area AA, including a first metal layer 31 extending along a first direction X, a second metal layer 32 extending along a second direction Y, and a corner metal layer 33 connecting the first metal layer 31 and the second metal layer 32. When the laser passes through the corner non-display area NA3, the path of the corner non-display area NA3 closer to the display area AA is shorter than the path farther from the display area AA. However, the laser spot remains the same throughout the entire corner non-display area NA3. The shorter path receives more laser energy per unit length than the longer path. Therefore, the laser energy received by the side closer to the display area AA is higher than the laser energy received by the side farther from the display area AA. This inconsistent laser energy can lead to inconsistent melting rates of the encapsulant, which in turn can easily crack the encapsulant due to stress, leading to encapsulation failure. To avoid the above problems, this embodiment features a special design for the corner metal layer 33, such that the transmittance of the fourth region 33a near the display area AA is greater than the transmittance of the fifth region 33b away from the display area AA. This design reduces the reflection of laser light from the corner metal layer 33 in the fourth region 33a and enhances the reflection of laser light from the corner metal layer 33 in the fifth region 33b. This ensures that the laser energy received by the encapsulant corresponding to the entire corner metal layer 33 is relatively uniform, reducing the risk of stress caused by uneven melting speed of the encapsulant, improving the encapsulation effect of the display panel, and ensuring display reliability. Furthermore, reducing the reflection of laser light from the corner metal layer 33 in the fourth region 33a near the display area AA further protects the devices in the display area AA, further ensuring display reliability.

[0051] For the design in which the light transmittance of the fourth region 33a is greater than the light transmittance of the fifth region 33b, in some optional embodiments, please continue to refer to Figure 11 A plurality of third through holes 331 with equal areas are provided in the fourth region 33a, and a plurality of fourth through holes 332 with equal areas are provided in the fifth region; the area of ​​the third through holes 331 is greater than that of the fourth through holes 332.

[0052] It is understood that the shape of the third through hole 331 and the shape of the fourth through hole 332 can be the same or different. At the same time, the shapes of the first through hole 331 and the second through hole 332 are not limited and can be circular, square, or star-shaped. In this embodiment, the third through hole 331 and the fourth through hole 332 have the same shape and are circular. This design can make the process relatively simple and reduce production costs.

[0053] Please refer to Figure 10 and Figure 12 In some optional embodiments, the third through hole 331 and the fourth through hole 332 have different shapes. The fourth through hole 332 is a closed shape, and the third through hole 331 is a non-closed shape with an opening toward the display area AA.

[0054] It is understood that the shape of the fourth through hole 332 is not limited. Figure 12 Taking the fourth through hole 332 as a closed circular pattern as an example, the third through hole 331 is a non-enclosed wavy through hole, and its opening faces the display area. This arrangement ensures that the light transmittance of the fourth region is higher than that of the fifth region, ensuring the reliability of the package. It also extends the transmission path of static electricity, enhancing the ESD resistance of the display panel. Furthermore, the design of the third through hole 331 near the display area can also prevent the display area from being burned, which may affect the display.

[0055] Please refer to Figure 13 In some optional embodiments, the non-display area NA further includes a step area NA4, and along the first direction X, the step area NA4 and the second non-display area NA2 are respectively located on both sides of the display area AA; the step area NA4 includes a first metal line 5 and a second metal line 6, at least one second metal line 6 is located between adjacent first metal lines 5, the first metal line 5 transmits a display signal to the display area AA, and the second metal line 6 is floating.

[0056] It can be understood that the step area NA4 and the first non-display area NA1, the second non-display area NA2 and the corner display area NA3 surround the display area AA. The step area NA4 is not provided with a packaging metal, that is, the metal layer in this embodiment. The first metal wire 5 and the second metal wire 6 are used as packaging metal to reflect the laser. Such a design can save the amount of metal layer 31 and reduce material costs. The first metal wire 5 transmits signals to the display area AA, and can be a connecting line connecting the test circuit, a fan-out line of the data line, and other connecting lines with the binding terminal (or driver chip). One or more second metal wires 6 are located between the first metal wires 5 and are in a floating state. The setting of the second metal wire 6 can adjust the transmittance of the step area, so that the transmittance of the step area matches the laser energy, so that the melting speed of the encapsulation glue is uniform, and the reliability of the package is improved.

[0057] Please refer to Figure 14 , Figure 14 for Figure 10A partial schematic diagram of area C in another display panel is provided. In some optional embodiments, the display panel 100 further includes a power signal line 8, and the metal layer 3 is electrically connected to the power signal line 8. It should be explained that the setting of the metal layer 3 can reflect the laser, but at the same time, because the metal layer 3 is located in the non-display area and the material is metal, its position and the particularity of the material make it easy to transmit the static electricity generated by the display panel during the preparation process to the display area. In this embodiment, the metal layer 3 is electrically connected to the power signal line 8 through the bridge portion 7. The power signal line 8 here can be PVEE, which is connected to a fixed potential. After the metal layer 3 is electrically connected to the power signal line 8, the static electricity can be better dispersed to prevent static electricity from accumulating in the display panel 100 and affecting the display effect. It can be understood that, according to product requirements, there can be multiple bridge portions 7, and the position of the bridge portion 7 can be set at the four corners of the display panel or in the step area, which is not limited here.

[0058] Please refer to Figure 15 , the embodiment of the present invention further provides a display device 200, comprising any display panel 100 in the above embodiment. It should be noted that, although Figure 15 While a mobile phone is used as an example, the display device is not limited to mobile phones. It can also include tablet computers, computer displays, displays used in smart wearable devices, and display devices used in vehicles such as automobiles. As long as the display device includes the display panel included in the display device disclosed in this application, it is deemed to fall within the scope of protection of this application.

[0059] The present invention also provides a packaging method for a display panel, which includes providing the above-mentioned display panel, providing a laser source, sintering the packaging glue with a laser, and irradiating the laser from the packaging glue toward the metal layer. On a plane perpendicular to the metal layer, during the overlap of the laser spot and the packaging glue, the energy and rate of the laser remain unchanged. In existing packaging technologies, the packaging metal at special positions (such as corners) of special-shaped products is not specially designed, and the laser is required to continuously adjust the power and rate of the laser according to different positions. However, the packaging glue is prone to cracks at the changes in laser rate and power, resulting in packaging failure. In the packaging method provided by the present invention, there is no need to adjust the speed and power of the laser. Instead, the above-mentioned display panel is used to match the same laser path and rate by different designs of the transmittance of the metal layer at different positions, which can improve the packaging uniformity, improve the problem of packaging glue cracks caused by the need to adjust the laser energy and rate at special positions, and improve the packaging reliability of the display panel.

[0060] Please refer to Figure 16In order to ensure the reliability of the display panel packaging, during the packaging process, the starting point S of the laser and the ending point F of the laser overlap on the metal layer, and the metal layer in the overlapping area is hollowed out 34. It is understandable that during the packaging process, due to process errors, it is impossible to ensure that the starting point and ending point of the laser exactly coincide. In order to ensure that the laser path can completely cover the entire display panel packaging area, along the direction of the laser scanning path, the ending point F of the laser is located in front of the starting point S, so that the starting point S and the ending point F of the laser overlap on the metal layer. It is understandable that the laser in the overlapping area has been scanned twice, and the laser energy received by the packaging glue in the corresponding area is higher than that in the area without laser overlap, which will cause uneven stress on the packaging glue and cracks, and then lead to packaging failure. In the embodiment of the present invention, the metal layer in the overlapping area is set as a hollow 34, which can reduce the reflection of the laser by the metal in the overlapping area, thereby making the energy received by the packaging glue in the overlapping area and other areas relatively uniform. This reduces the stress risk caused by uneven melting speed of the packaging glue, improves the packaging effect of the display panel, and ensures the reliability of the display.

[0061] Compared with the prior art, the display panel, display device, and packaging method provided by the present invention achieve the following beneficial effects: On the one hand, by specially designing the transmittance of the second area of ​​the metal layer to be greater than the transmittance of the first area and the transmittance of the third area, different areas of the metal layer reflect different degrees of laser energy, with areas with high laser energy reflecting the laser less, and areas with low laser energy reflecting the laser more. This further matches the distribution of laser energy, ultimately making the laser energy received by the packaging glue in different packaging areas uniform. In this way, the melting rate of the packaging glue in different packaging areas is relatively uniform, thereby reducing the stress caused by the uneven melting rate of the packaging glue, improving the packaging effect of the display panel, and ensuring the reliability of the display. On the other hand, the design of the main body and the connection part in the metal layer can extend the path for static electricity to enter the display area, enhancing the ESD capability of the display panel.

[0062] The display panel, display device and packaging method provided in the embodiments of the present invention are introduced in detail above. Specific examples are used herein to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea. At the same time, for those skilled in the art, according to the ideas of the present invention, there will be changes in the specific implementation methods and application scopes. In summary, the content of this specification should not be understood as limiting the present invention.

Claims

1. A display panel, comprising: a first substrate comprising a display area and a non-display area surrounding the display area; The non-display area includes a first non-display area extending along a first direction; a second substrate, the second substrate being arranged opposite to the first substrate; a metal layer, located between the first substrate and the second substrate, wherein an orthographic projection of the metal layer on the first substrate is located in the non-display area, and comprising a first metal layer extending along the first direction; The orthographic projection of the first metal layer on the first substrate is located in the first non-display area; The first metal layer includes a first region, a second region, and a third region; along a second direction, the first region and the third region are located on both sides of the second region, the first region is located on a side of the second region away from the display area, and the second direction intersects the first direction; and a packaging adhesive is located between the first substrate and the second substrate; It is characterized in that The first region and the third region are provided with a plurality of first through holes, the second region is provided with a plurality of second through holes, the area of ​​the first through holes is smaller than the area of ​​the second through holes, and the ratio of the total area of ​​the through holes in the second region to the total area of ​​the second region is greater than the ratio of the total area of ​​the through holes in the first region to the total area of ​​the first region, and greater than the ratio of the total area of ​​the through holes in the third region to the total area of ​​the third region; Alternatively, the first region and the third region are provided with a plurality of first through holes, the second region is provided with a plurality of second through holes, the distribution density of the first through holes in the first region and the third region is less than the distribution density of the second through holes in the second region, and the ratio of the total area of ​​the through holes in the second region to the total area of ​​the second region is greater than the ratio of the total area of ​​the through holes in the first region to the total area of ​​the first region, and greater than the ratio of the total area of ​​the through holes in the third region to the total area of ​​the third region; Alternatively, the second region is a hollow structure, and the ratio of the total area of ​​the through holes in the second region to the total area of ​​the second region is greater than the ratio of the total area of ​​the through holes in the first region to the total area of ​​the first region, and greater than the ratio of the total area of ​​the through holes in the third region to the total area of ​​the third region; And / or, the non-display area also includes a second non-display area extending along the second direction, and a corner non-display area connecting the first non-display area and the second non-display area, the corner non-display area includes a connecting edge, and the shape of the connecting edge is an arc; the metal layer also includes a second metal layer extending along the second direction and a corner metal layer connecting the first metal layer and the second metal layer, and the positive projection of the corner metal layer on the first substrate is located in the corner non-display area; the corner metal layer includes a fourth area and a fifth area, the fourth area is located on the side of the fifth area close to the display area; the fourth area is provided with a plurality of third through holes, and the fifth area is provided with a plurality of fourth through holes; the area of ​​the third through holes is larger than the area of ​​the fourth through holes, and the transmittance of the fourth area is larger than the transmittance of the fifth area.

2. The display panel according to claim 1, wherein: The first region and the third region are provided with a plurality of first through holes, and the second region is provided with a plurality of second through holes. Centers of the plurality of second through holes arranged along the first direction are on a first virtual center line extending along the first direction; In a direction from the display area to the first non-display area, the area of ​​the first through hole located in the first area gradually decreases; and the area of ​​the first through hole located in the third area gradually increases.

3. The display panel according to claim 2, wherein: A center line of the first metal layer extending along the first direction is a first center line, and the first virtual center line is located on a side of the first center line away from the display area.

4. The display panel according to claim 1, wherein: The first region and the third region are provided with a plurality of first through holes, and the second region is provided with a plurality of second through holes. The first through hole and the second through hole have the same shape.

5. The display panel according to claim 1, wherein: The metal layer further includes a second metal layer extending along the second direction and a corner metal layer connecting the first metal layer and the second metal layer, the corner metal layer includes a fourth region and a fifth region, the fourth region is located on a side of the fifth region close to the display area; the fourth region is provided with a plurality of third through holes, and the fifth region is provided with a plurality of fourth through holes; The third through hole is a non-enclosed figure with an opening facing the display area.

6. The display panel according to any one of claims 1 to 5, characterized in that: The non-display area also includes a step area, and along the first direction, the step area and the second non-display area are respectively located on both sides of the display area; the step area includes a first metal line and a second metal line, at least one second metal line is located between adjacent first metal lines, the first metal line transmits a display signal to the display area, and the second metal line is floating.

7. The display panel according to any one of claims 1 to 5, characterized in that: The display panel further includes a power signal line, and the metal layer is electrically connected to the power signal line.

8. A display device, characterized in that: The display panel comprises the display panel according to any one of claims 1 to 7.

9. A method for packaging a display panel, characterized in that: Providing a display panel according to any one of claims 1 to 7; providing a laser source; The packaging glue is sintered by laser, and the laser is irradiated from the packaging glue toward the metal layer.

10. The packaging method according to claim 9, wherein: On a plane perpendicular to the metal layer, during the packaging process in which the laser spot overlaps with the packaging adhesive, the energy and speed of the laser remain unchanged.

11. The packaging method according to claim 10, characterized in that: During the packaging process, there is an overlapping area between the starting point of the laser and the ending point of the laser on the metal layer, and the metal layer in the overlapping area is hollow.

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