Preparation process and device for tec semiconductor particle bonding

Abstract

The application discloses a preparation process and device for tec semiconductor particle attachment, which comprises the following steps: obtaining a carrier, separating the carrier from a master batch to obtain the carrier; carrier pretreatment, moving the carrier to a coating device, and coating tin paste on the left and right sides of the carrier; installing P particles, moving the carrier to a P particle installation table, and installing P particles on one side of the carrier coated with tin paste, and regarding the other side without P particles as a blank side; installing N particles, moving the carrier to an N particle installation table, and installing N particles on the blank side of the carrier coated with tin paste to obtain a semiconductor refrigeration sheet; and discharging, moving the semiconductor refrigeration sheet to a discharge port to complete the discharging. The application adopts a method of simultaneously installing P particles and N particles on a carrier on one machine to become a semiconductor refrigeration sheet, reduces resource loss, saves manpower, and improves work efficiency.

Description

Technical Field

[0001] This invention relates to the field of semiconductor refrigeration, and in particular to a preparation process and apparatus for bonding TEC semiconductor particles. Background Technology

[0002] A thermoelectric cooler (TEC) utilizes the Peltier effect of semiconductor materials. The Peltier effect refers to the phenomenon where, when a direct current passes through a thermocouple composed of two semiconductor materials, one end absorbs heat while the other releases heat. Heavily doped N-type and P-type bismuth telluride is primarily used as the semiconductor material in TECs. Bismuth telluride elements are connected in series and generate heat in parallel. A TEC consists of pairs (or groups) of P-type and N-type particles connected by electrodes and sandwiched between two ceramic electrodes. When current flows through the TEC, the heat generated is transferred from one side to the other, creating a "hot" side and a "cold" side, thus achieving cooling.

[0003] Currently, the manufacturing of semiconductor refrigeration chips relies heavily on manual labor. The cut substrate must first be manually transferred to a separate coating device, then manually transferred to a device for installing N particles after the adhesive is applied, and finally manually transferred to a device for installing P particles. Therefore, the production of semiconductor refrigeration chips requires a large amount of manpower, resulting in low work efficiency and high production costs.

[0004] Therefore, there is an urgent need for a fabrication process and apparatus for bonding TEC semiconductor particles that can save labor and improve work efficiency. Summary of the Invention

[0005] The main objective of this invention is to provide a preparation process and apparatus for bonding TEC semiconductor particles, which aims to save labor and improve work efficiency.

[0006] To achieve the above objectives, the present invention proposes an apparatus for bonding TEC semiconductor particles, applied to a semiconductor cooling chip, comprising:

[0007] Main body of the device;

[0008] A coating device, which is disposed on the main body of the device, is used to coat solder paste;

[0009] P-particle mounting platform, which is connected to the main body of the device, is used to mount P-particles;

[0010] N-particle mounting platform, which is connected to the main body of the device, is used to mount N-particles;

[0011] A mobile platform is disposed on the main body of the device. The mobile platform includes a first platform and a second platform, which are movably connected to the main body of the device. The first platform and the second platform are used to transfer the semiconductor cooling chip.

[0012] To achieve the above objectives, the present invention also proposes a fabrication process for bonding TEC semiconductor particles, the fabrication process for bonding TEC semiconductor particles comprising:

[0013] The carrier is obtained by separating it from the masterbatch.

[0014] Carrier pretreatment involves moving the carrier to the coating device and applying solder paste to both sides of the carrier.

[0015] To install P-particles, move the carrier to the P-particle mounting stage and install the P-particles onto one side of the carrier that is coated with solder paste, while treating the other side without P-particles as the blank side.

[0016] Install N-particles, move the carrier to the N-particle mounting stage, and install the N-particles onto the blank side of the carrier coated with solder paste to obtain a semiconductor cooling chip;

[0017] Discharge: Move the semiconductor cooling chip to the discharge port to complete the discharge process.

[0018] Preferably, the step of obtaining the carrier includes:

[0019] Divide the masterbatch into multiple carriers;

[0020] The robotic arm grasps the carrier by identifying the identification points on the masterbatch through the identification component and then grasping the carrier using preset coordinates.

[0021] Stack the carriers by placing them on a transfer tray with multiple grooves corresponding to the shape and size of the carriers; place multiple carriers in the grooves of the transfer tray.

[0022] The transfer carrier moves the transfer tray to the coating device via the first platform.

[0023] Preferably, the step of using the transfer vector includes:

[0024] When identification is successful, the transfer tray is moved to the coating device via the first platform;

[0025] If identification fails, the first platform is adjusted to move the transfer tray so that the identification site on the transfer tray can be identified by the identification component. Then, the transfer tray is moved to the coating device by the first platform.

[0026] Preferably, the step of obtaining the carrier includes:

[0027] Cut the master material into multiple carriers, and separate each carrier one by one;

[0028] The carrier is identified by placing it one by one on the identification area using a robotic arm, and the carrier is identified by the identification component.

[0029] Correction carrier: Analyze each carrier identified by the recognition component. If a carrier is deflected, adjust the deflected carrier. If no carrier is deflected, proceed directly to the next step.

[0030] The transfer carriers are transferred one by one to the carrier tray by a robotic arm, and then the transfer trays are moved to the coating device by the first platform.

[0031] Preferably, the carrier pretreatment step includes:

[0032] Stack the carriers, transfer them from the transfer tray to the coating device, and move the coating device to the corresponding coating location;

[0033] Solder paste is applied to both ends of the same side of a carrier using a mechanical scraper of a coating device, creating a blank carrier.

[0034] Transfer the blank carrier to the first platform, and then move the first platform to the corresponding P particle mounting stage.

[0035] Preferably, the step of installing P particles includes:

[0036] Receive blank carriers and transfer them from the first platform to the P particle mounting stage using a robotic arm;

[0037] P-particles are installed by a robotic arm that picks up the P-particles and installs them onto a blank carrier. The blank carrier after installing the P-particles becomes a semi-blank carrier.

[0038] The semi-blank carrier is transferred to the N-particle mounting stage via the first platform.

[0039] Preferably, the step of installing N particles includes:

[0040] Receive the semi-blank carrier and transfer the semi-blank carrier on the first platform to the N-particle mounting stage via a robotic arm;

[0041] N-particles are installed by a robotic arm that picks up N-particles and installs them onto a blank carrier. The blank carrier after installing N-particles becomes a semiconductor refrigeration chip.

[0042] The semiconductor refrigeration chip is transferred to the discharge conveyor belt.

[0043] Preferably, the step of receiving the semi-blank carrier includes:

[0044] Grasp the semi-blank carrier and use a vacuum gripper to pick up the semi-blank carrier from the first platform;

[0045] The semi-blank carrier is transferred to the second platform and picked up by a vacuum gripper. At this time, the second platform moves under the vacuum gripper, the first platform returns to the coating device, the vacuum gripper is released, and the semi-blank carrier is placed on the second platform.

[0046] Preferably, the discharging step includes:

[0047] The process involves receiving a thermoelectric cooler, lifting it to a position flush with the discharge conveyor belt, and then placing the thermoelectric cooler onto the discharge conveyor belt using a robotic arm.

[0048] The discharge conveyor belt transfers the semiconductor cooling wafers to the subsequent packaging stage, completing the discharge process.

[0049] This invention proposes a preparation process and apparatus for bonding semiconductor particles in TEC. By cutting a masterbatch into multiple carriers, coating the carriers with solder paste, and finally attaching P particles and N particles to form a semiconductor refrigeration chip, the prepared semiconductor refrigeration chip is then discharged. This invention can reduce manual intervention, save human resources, improve work efficiency, increase the production efficiency of semiconductor refrigeration chips, and increase production capacity. Attached Figure Description

[0050] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0051] Figure 1 This is a schematic diagram of the device for bonding TEC semiconductor particles provided in this embodiment;

[0052] Figure 2 This is a schematic flowchart of the fabrication process for bonding TEC semiconductor particles provided in this embodiment.

[0053] Explanation of icon numbers:

[0054] label name label name 10 Semiconductor particle bonding device 100 main body of the device 200 Coating device 300 P-particle mounting platform 400 N-particle mounting platform 500 Mobile Platform 510 First Platform 520 Second Platform

[0055] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0056] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0057] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly.

[0058] Furthermore, the use of terms such as "first" and "second" in this invention is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. Additionally, the technical solutions of the various embodiments can be combined with each other, but only on the basis of being achievable by those skilled in the art. When the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed by this invention.

[0059] like Figure 1 As shown, the present invention proposes a semiconductor particle bonding device 10 for TEC, the device comprising:

[0060] The device includes a main body 100; a coating device 200, which is disposed on the main body 100 and is used to coat solder paste; a P-particle mounting stage 300, which is connected to the main body 100 and is used to mount P-particles; an N-particle mounting stage 400, which is connected to the main body 100 and is used to mount N-particles; and a moving platform 500, which is disposed on the main body 100 and includes a first platform 510 and a second platform 520, which are movably connected to the main body 100 and are used to transfer semiconductor cooling wafers.

[0061] Specifically, the mobile platform 500 can move back and forth on the main body 100 of the device. By setting it, it can automatically move the carrier to the coating device 200, the P particle mounting stage 300 and the N particle mounting stage 400 in sequence, thereby completing the steps of coating the carrier with glue, attaching P particles and attaching N particles, avoiding the carrier to be moved back and forth between multiple devices or manually, and improving work efficiency.

[0062] like Figure 2 As shown, the present invention also proposes a fabrication process for bonding TEC semiconductor particles, which includes the following steps:

[0063] Step S1: Obtain the carrier by separating the carrier from the masterbatch.

[0064] Specifically, the carrier is made of a rigid material to ensure mechanical properties and prevent electrostatic discharge from affecting the operation of semiconductor particles. The carrier is cut by technicians using lasers or water jets from the masterbatch.

[0065] Furthermore, step S1 also includes the following steps:

[0066] Step S11: Divide the masterbatch into multiple carriers;

[0067] Step S12: Grasp the carrier. The identification component identifies the identification points on the masterbatch, and the robot grabs the carrier using preset coordinates.

[0068] Step S13: Stack the carriers. Place the carriers on the transfer tray. The transfer tray has multiple grooves that correspond to the shape and size of the carriers. Place multiple carriers in the grooves.

[0069] Step S14: Transfer carrier, move the transfer tray to the coating device via the first platform;

[0070] Furthermore, step S14 also includes the following steps:

[0071] Step S141: When identification is successful, the transfer tray is moved to the coating device via the first platform;

[0072] In step S142, if the identification fails, the first platform is adjusted to move the transfer tray so that the identification site on the transfer tray can be identified by the identification component. Then, the transfer tray is moved to the coating device by the first platform.

[0073] Specifically, the masterbatch can be segmented by laser cutting and / or water jet cutting. After cutting, the identification components on the cutting device can identify the identification sites on the masterbatch. Then, the robotic arm uses built-in coordinates to grab the segmented carriers. This step can quickly obtain a large number of carriers.

[0074] Furthermore, step S1 can also be implemented in the following ways:

[0075] Step S15: Divide the masterbatch into multiple carriers;

[0076] Step S16: Identify the carrier. The robotic arm places the carriers one by one on the identification area and identifies the carriers through the identification component.

[0077] Step S17, Correcting the carrier: Analyze each carrier identified by the identification component. If a carrier is deflected, adjust the deflected carrier. If the carrier is not deflected, proceed directly to the next step.

[0078] Step S18: Transfer carriers. Carriers are transferred one by one to carrier trays by a robotic arm and moved to the coating device by the first platform 510.

[0079] Specifically, after the carrier is cut, the identification component can first identify the individual carrier. If the carrier is found to be misaligned after identification, it can be corrected by a robot. The corrected carrier can then be transferred to the subsequent steps by the robot. Using this step, a carrier with a more accurate positional relationship can be obtained.

[0080] Step S2, carrier pretreatment: the carrier is moved to the coating device 200 and solder paste is applied to the left and right sides of the carrier.

[0081] Furthermore, step S2 also includes the following steps:

[0082] Step S21: Place the carrier, transfer the carrier from the transfer tray to the coating device, and move the coating device to the corresponding coating device location;

[0083] Step S22: Apply solder paste. The solder paste is applied to both ends of the same side of the carrier by the mechanical scraper of the coating device, forming a blank carrier.

[0084] Step S23: Transfer the blank carrier to the first platform 510, and move the first platform 510 to the corresponding P particle installation location.

[0085] Specifically, after the carrier is transferred to the coating device, solder paste is applied to both ends of the carrier. The solder paste helps the P particles and N particles prepared from the bismuth telluride compound solid solution to exchange heat through the Peltier effect, thereby achieving a cooling effect.

[0086] Step S3: Install P particles. Move the carrier to the P particle mounting stage 300 and install the P particles on one side of the carrier that is coated with solder paste, and regard the other side without P particles as the blank side.

[0087] Furthermore, step S3 also includes the following steps:

[0088] Step S31: Receive the blank carrier and transfer the blank carrier on the first platform 510 to the P particle mounting stage via a robotic arm;

[0089] Step S32: Install P particles. The P particles are picked up by a robotic arm and installed on a blank carrier. The blank carrier after installing the P particles becomes a semi-blank carrier.

[0090] Step S33: Transfer the semi-blank carrier by transferring the semi-blank carrier to the N-particle mounting stage 400 via the first platform 510.

[0091] Specifically, the P-particle mounting station includes a P-particle tray. The robotic arm can grab the P-particles from the tray through a built-in program and then install the P-particles onto the carrier. The robotic arm can install P-particles onto each carrier one by one or install P-particles onto multiple carriers at once. After one end of the carrier is installed with P-particles, it becomes a semi-blank carrier. The semi-blank carriers are then neatly stacked on the first platform 510 by the robotic arm, and then transferred to the N-particle mounting station 400 through the first platform 510.

[0092] Step S4: Install N particles. Move the carrier to the N particle mounting stage 400 and install the N particles onto the blank side of the carrier coated with solder paste to obtain a semiconductor cooling chip.

[0093] Furthermore, step S4 also includes the following steps:

[0094] Step S41: Receive the semi-blank carrier and transfer the semi-blank carrier on the first platform 510 to the N-particle mounting stage via a robotic arm;

[0095] Furthermore, step S41 also includes the following steps:

[0096] Step S411: Grab the semi-blank carrier and pick it up from the first platform 510 using a vacuum gripper.

[0097] In step S412, the semi-blank carrier is transferred to the second platform 520 and picked up by the vacuum gripper. At this time, the second platform 520 moves under the vacuum gripper, the first platform 510 returns to the coating device 200, the vacuum gripper is released, and the semi-blank carrier is placed on the second platform 520.

[0098] Specifically, the vacuum gripper lifts the carrier with P particles already installed on the first platform 510 by vacuum adsorption. After being lifted, the first platform 510 moves toward the coating device 200. At this time, the second platform 520 moves toward the vacuum gripper. When the second platform 520 moves to the vacuum gripper, the vacuum gripper places the carrier on the second platform 520 and turns the side of the carrier without P particles to the side closer to the N particle mounting stage 400, which helps to install N particles.

[0099] Step S42: Install N particles. The N particles are picked up by a robotic arm and installed on a blank carrier. The blank carrier after installing the N particles becomes a semiconductor refrigeration chip.

[0100] Step S43: Transfer the semiconductor refrigeration chip to the discharge conveyor belt.

[0101] Specifically, the N-particle mounting station includes an N-particle tray. The robotic arm can grab N-particles from the tray through a built-in program and then mount them onto a carrier. The robotic arm can mount N-particles onto each carrier one by one or onto multiple carriers at once. After N-particles are mounted on one end of the carrier, it becomes a semiconductor refrigeration chip. The semiconductor refrigeration chips are then neatly stacked on the second platform 520 by the robotic arm, and the semi-blank carrier is then transferred to the discharge port through the second platform 520.

[0102] Step S5, Discharge: Move the semiconductor refrigeration chip to the discharge port to complete the discharge.

[0103] Furthermore, step S5 also includes the following steps:

[0104] Step S51: Receive the thermoelectric cooler, lift the thermoelectric cooler to a position flush with the discharge conveyor belt, and then place the thermoelectric cooler on the discharge conveyor belt using a robotic arm;

[0105] In step S52, the discharge conveyor belt transfers the semiconductor cooling wafer to the subsequent packaging stage, completing the discharge process.

[0106] Specifically, the second platform 520 transfers the manufactured semiconductor refrigeration wafers one by one to the discharge conveyor belt. The discharge conveyor belt transfers the semiconductor refrigeration wafers to subsequent steps according to the built-in operating program. The subsequent steps can be packaging, quality inspection, or assembly into other products, etc. The subsequent steps do not affect the technology to be protected by this technical solution.

[0107] In combination with all the above embodiments, the present invention proposes a preparation process and apparatus for bonding TEC semiconductor particles. By cutting the masterbatch into multiple carriers, coating the carriers with solder paste, and finally attaching P particles and N particles to form a semiconductor refrigeration chip, and then unloading the prepared semiconductor refrigeration chip, the present invention can reduce manual intervention, save human resources, improve work efficiency, improve the production efficiency of semiconductor refrigeration chips, and increase production capacity.

[0108] The above description is merely a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention's specification and drawings under the inventive concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. An apparatus (10) for bonding semiconductor particles in a TEC semiconductor refrigeration wafer, characterized in that, include: Device body (100); A coating device (200) is disposed on the main body (100) of the device and is used to coat solder paste; P particle mounting stage (300), which is connected to the main body of the device (100), is used to mount P particles; N-particle mounting platform (400), which is connected to the main body of the device (100), is used to mount N-particles; A mobile platform (500) is disposed on the device body (100). The mobile platform (500) includes a first platform (510) and a second platform (520). The first platform (510) and the second platform (520) are movably connected to the device body (100). The first platform (510) and the second platform (520) are used to transfer the semiconductor cooling chip. The apparatus is also configured to perform a fabrication process for bonding TEC semiconductor particles, the fabrication process comprising the following steps: The carrier is obtained by separating it from the masterbatch. Carrier pretreatment involves moving the carrier to the coating device (200) and coating the left and right sides of the carrier with solder paste. To install P particles, move the carrier to the P particle mounting stage (300) and install the P particles onto one side of the carrier that is coated with solder paste, while treating the other side without P particles as the blank side. Install N-particles, move the carrier to the N-particle mounting stage (400), and install the N-particles onto the blank side of the carrier coated with solder paste to obtain a semiconductor cooling chip; Discharge: Move the semiconductor cooling chip to the discharge port to complete the discharge process.

2. A fabrication process for bonding TEC semiconductor particles, characterized in that, Includes the following steps: The carrier is obtained by separating it from the masterbatch. Carrier pretreatment involves moving the carrier to the coating device (200) and coating the left and right sides of the carrier with solder paste. To install P particles, move the carrier to the P particle mounting stage (300) and install the P particles onto one side of the carrier that is coated with solder paste, while treating the other side without P particles as the blank side. Install N-particles, move the carrier to the N-particle mounting stage (400), and install the N-particles onto the blank side of the carrier coated with solder paste to obtain a semiconductor cooling chip; Discharge: Move the semiconductor cooling chip to the discharge port to complete the discharge process.

3. The fabrication process for bonding TEC semiconductor particles as described in claim 2, characterized in that, The steps for obtaining the carrier include: Divide the masterbatch into multiple carriers; The robotic arm grasps the carrier by identifying the identification points on the masterbatch through the identification component and then grasping the carrier using preset coordinates. Stack the carriers by placing them on a transfer tray with multiple grooves corresponding to the shape and size of the carriers; place multiple carriers in the grooves of the transfer tray. The transfer carrier moves the transfer tray to the coating device (200) via the first platform (510).

4. The fabrication process for bonding TEC semiconductor particles as described in claim 3, characterized in that, The steps of the transfer vector include: When identification is successful, the transfer tray is moved to the coating device (200) via the first platform (510). If identification fails, the transfer tray is adjusted by adjusting the first platform (510) so that the identification site on the transfer tray can be identified by the identification component. Then the transfer tray is moved to the coating device (200) by the first platform (510).

5. The fabrication process for bonding TEC semiconductor particles as described in claim 2, characterized in that, The steps for obtaining the carrier include: Cut the master material into multiple carriers, and separate each carrier one by one; The carrier is identified by placing it one by one on the identification area using a robotic arm, and the carrier is identified by the identification component. Correction carrier: Analyze each carrier identified by the recognition component. If a carrier is deflected, adjust the deflected carrier. If no carrier is deflected, proceed directly to the next step. The transfer carrier is transferred one by one to the carrier tray by a robotic arm and moved to the coating device (200) by the first platform (510).

6. The fabrication process for bonding TEC semiconductor particles as described in claim 2, characterized in that, The carrier pretreatment steps include: The carrier is placed on the transfer tray and transferred to the coating device (200), and the coating device (200) is moved to the corresponding coating device (200); Solder paste is applied to both ends of the same side of the carrier by the mechanical scraper of the coating device (200), thus creating a blank carrier; Transfer the blank carrier to the first platform (510), and move the first platform (510) to the corresponding P particle mounting stage (300).

7. The fabrication process for bonding TEC semiconductor particles as described in claim 2, characterized in that, The steps for installing P particles include: Receive blank carrier and transfer the blank carrier on the first platform (510) to the P particle mounting stage (300) via a robotic arm. P-particles are installed by a robotic arm that picks up the P-particles and installs them onto a blank carrier. The blank carrier after installing the P-particles becomes a semi-blank carrier. The semi-blank carrier is transferred to the N-particle mounting stage (400) via the first platform (510).

8. The fabrication process for bonding TEC semiconductor particles as described in claim 7, characterized in that, The steps for installing N particles include: Receive the semi-blank carrier and transfer the semi-blank carrier on the first platform (510) to the N-particle mounting stage (400) via a robotic arm. N-particles are installed by a robotic arm that picks up N-particles and installs them onto a blank carrier. The blank carrier after installing N-particles becomes a semiconductor refrigeration chip. The semiconductor refrigeration chip is transferred to the discharge conveyor belt.

9. The fabrication process for bonding TEC semiconductor particles as described in claim 8, characterized in that, The step of receiving the semi-blank carrier includes: Grasp the semi-blank carrier and use a vacuum gripper to pick up the semi-blank carrier from the first platform (510); The semi-blank carrier is transferred to the second platform (520) and picked up by the vacuum gripper. At this time, the second platform (520) moves under the vacuum gripper, and the first platform (510) returns to the coating device (200). The vacuum gripper is released, and the semi-blank carrier is placed on the second platform (520).

10. The fabrication process for bonding TEC semiconductor particles as described in claim 2, characterized in that, The discharge step includes: The process involves receiving a thermoelectric cooler, lifting it to a position flush with the discharge conveyor belt, and then placing the thermoelectric cooler onto the discharge conveyor belt using a robotic arm. The discharge conveyor belt transfers the semiconductor cooling wafers to the subsequent packaging stage, completing the discharge process.

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