A processing and preparation process for a combination of a heat-resistant hot melt adhesive and an electronic paper light guide plate

Abstract

The present invention relates to a processing and preparation process for a high-temperature resistant hot melt adhesive electronic paper light guide plate combination, and relates to the technical field of light guide plate production; it includes the following steps: S10. Sequentially laminating a protection panel, an optical hot melt adhesive, a light guide plate, an optical hot melt adhesive, and an electronic paper in order to form a laminated body; S20. Placing the laminated body in a closed environment for heating and pressurizing to remove bubbles; S30. Placing the laminated body in a closed environment for heating and storage; S40. Placing the laminated body in a closed environment again for heating and pressurizing to remove bubbles; S50. Curing the optical hot melt adhesive in the laminated body; S60. Placing the laminated body in a closed environment for heating and storage, and observing whether bubbles and rebound phenomena occur on the light guide plate after a period of time. If there are no bubbles, rebound, and cracking phenomena, the product is qualified. If bubbles, rebound, and cracking phenomena occur, return to step S40. The beneficial effect of the present invention is that by applying pressure and heat to the light guide plate multiple times before leaving the factory, it can adapt to the high-temperature environment it will face after leaving the factory, thereby improving the product stability.

Description

Technical Field

[0001] The present invention relates to the technical field of light guide plate production, and more specifically, to a processing and preparation process for a combination of a heat-resistant hot melt adhesive electronic paper light guide plate. Background Art

[0002] The light guide plate is a PC-based optical plastic plate with evenly arranged particle points on one side surface. The particles on the surface are used to achieve a better light guiding effect. Characteristics of the light guide plate: Small molecules are released at a high temperature of 60 °C. The release of small molecules on the surface of the adhesive will cause poor appearance of the product. It has significant expansion and contraction under the influence of temperature and cannot be wiped with reagents, and its service life is easily reduced in a high-temperature environment. Summary of the Invention

[0003] In order to overcome the deficiencies of the prior art, the present invention provides a processing and preparation process for a combination of a heat-resistant hot melt adhesive electronic paper light guide plate.

[0004] The technical solution adopted by the present invention to solve its technical problems is: A processing and preparation process for a combination of a heat-resistant hot melt adhesive electronic paper light guide plate, which is improved in that it includes the following steps:

[0005] S10. Sequentially laminate a protection panel, an optical hot melt adhesive, a light guide plate, an optical hot melt adhesive, and an electronic paper in order to form a laminated body;

[0006] S20. Place the laminated body in a closed environment for heating, pressurization, and defoaming;

[0007] S30. Place the laminated body in a closed environment for heating and storage;

[0008] S40. Place the laminated body in a closed environment again for heating, pressurization, and defoaming;

[0009] S50. Cure the optical hot melt adhesive in the laminated body;

[0010] S60. Place the laminated body in a closed environment for heating and storage. After a period of time, observe whether there are bubbles and rebound cracking phenomena on the light guide plate. If there are no bubbles and rebound cracking phenomena, the product is qualified. If there are bubbles and rebound cracking phenomena, return to step S40.

[0011] In the above technical solution, before step S10, there is also step S1, and step S1 is to heat and dehumidify the light guide plate, the heating temperature is 60 °C - 65 °C, and it lasts for more than one hour.

[0012] In the above technical solution, the light guide plate has a smooth surface and a particle surface, and the light guide plate is laminated with the smooth surface facing the protection panel.

[0013] Between the above-mentioned step S10 and step S20, there is also a step S11, and step S11 is to place the laminate in a vacuum environment for hot pressing.

[0014] In the above-mentioned step S20, the temperature is 60°C - 65°C, and the duration is more than one hour.

[0015] In the above-mentioned step S30, the temperature is 65°C - 70°C, and the duration is more than two hours.

[0016] In the above-mentioned step S40, the temperature is 60°C - 65°C, and the duration is more than 30 minutes.

[0017] In the above-mentioned step S50, the curing is UV curing.

[0018] In the above-mentioned step S60, the temperature is 65°C - 70°C, and the duration is more than one hour.

[0019] The above-mentioned optical hot melt adhesive is also a glue with the function of resisting ultraviolet rays.

[0020] The beneficial effect of the present invention is that before the optical hot melt adhesive completely adheres the protection panel, the light guide plate and the electronic paper, by performing degassing at the temperature that causes adverse reactions on the light guide plate multiple times, making it tolerate higher temperatures, and then curing the optical hot melt adhesive to make it adhere and leave the factory, the product has better high-temperature resistance effect. Description of the Drawings

[0021] Figure 1 It is a process flow chart of a processing and preparation process of a high-temperature resistant hot melt adhesive electronic paper light guide plate combination of the present invention.

[0022] Figure 2 It is a structural schematic diagram of a laminate in a processing and preparation process of a high-temperature resistant hot melt adhesive electronic paper light guide plate combination of the present invention. Detailed Embodiments

[0023] The present invention will be further described below with reference to the drawings and embodiments.

[0024] The concept, specific structure and technical effects of the present invention will be clearly and completely described below in conjunction with the embodiments and the drawings, so as to fully understand the purpose, features and effects of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, other embodiments obtained by those skilled in the art without creative efforts belong to the scope of protection of the present invention. In addition, all the connection / linkage relationships involved in the patent do not simply refer to the direct connection of components, but refer to the formation of a better connection structure by adding or reducing connection accessories according to the specific implementation situation. The various technical features in the present invention can be interactively combined without conflicting with each other.

[0025] Embodiment 1: Refer to Figure 1 and Figure 2 , as shown in the figure, the present invention provides a processing and preparation process for a high-temperature resistant hot melt adhesive electronic paper light guide plate combination, including the following steps:

[0026] S10. The protection panel 1, the optical hot melt adhesive 2, the light guide plate 3, the optical hot melt adhesive 2 and the electronic paper 4 are sequentially laminated in order to form a laminated body. The light guide plate 3 has a smooth surface and a granular surface. The light guide plate 3 is laminated with the smooth surface facing the protection panel 1, which meets the actual needs.

[0027] S20. The laminated body is placed in a closed environment for heating and pressurizing to remove bubbles. The light guide plate 3 will release small molecules at a high temperature of 60°C. At this time, to adapt to the common high-temperature environment after leaving the factory, the temperature in this embodiment is 60°C and the duration is one hour, initially discharging the bubbles and small molecules in the laminated body.

[0028] S30. After initially discharging the bubbles in the laminated body, the laminated body is placed in a closed environment for heating and storage. At this time, the temperature should be greater than 65°C to discharge the small molecules and bubbles that the light guide plate 3 will discharge when it is at a high temperature above 60°C after leaving the factory, improving the ultimate temperature resistance of the light guide plate 3. In this embodiment, the temperature is 65°C and the duration is two hours.

[0029] S40. The laminated body is placed in a closed environment again for heating and pressurizing to remove bubbles. In this embodiment, the temperature is 65°C and the duration is 30 minutes. Step S40 is to absorb the bubbles and small molecules discharged in step S30 again. If this step is not handled well, it can be easily repaired because the optical hot melt adhesive 2 has not undergone a chemical reaction and has strong plasticity.

[0030] S50. The optical hot melt adhesive 2 in the laminated body is cured. The curing method is UV curing. The optical hot melt adhesive 2 is cured under UV irradiation, so that the optical hot melt adhesive 2 has a certain adhesive force to improve the bonding strength between the two components in the laminated body.

[0031] S60. Place the laminate in a sealed environment for heating and storage to further expel the air bubbles and small molecules within the laminate. In this embodiment, the temperature is 65 °C, and after one and a half hours, observe whether there are air bubbles or rebound cracking phenomena on the light guide plate 3. If there are no air bubbles or rebound cracking phenomena, the product is qualified. If there are air bubbles or rebound cracking phenomena, return to step S40 to further continuously expel the air bubbles and small molecules within the laminate until no or very few air bubbles and small molecules are expelled, which meets the factory requirements and can also work stably in subsequent actual high-temperature usage scenarios.

[0032] Between step S10 and step S20, there is also step S11, and step S11 is to place the laminate in a vacuum environment for hot pressing to make the protective panel 1, optical hot melt adhesive 2, light guide plate 3, optical hot melt adhesive 2, and electronic paper 4 within the laminate fit more closely and can also initially expel the air bubbles within the laminate.

[0033] Before step S10, there is also step S1, and step S1 is to heat and dehumidify the light guide plate 3. In this embodiment, the temperature is 60 °C and it lasts for one hour to thoroughly dehumidify the light guide plate 3 before expelling the air bubbles and small molecules that are likely to be generated inside the light guide plate 3 to avoid affecting subsequent processes.

[0034] Through the above steps, the laminate is subjected to multiple extreme high-temperature pressure heating, and before leaving the factory, it can adapt to the environment where air bubbles, small molecules, and rebound cracking may be released at extreme temperatures after leaving the factory, making it more stable in a high-temperature environment after leaving the factory.

[0035] In a high-temperature environment after the laminate leaves the factory, there is often direct sunlight. Long-term outdoor ultraviolet irradiation causes phenomena such as yellowing and catalysis of the light guide plate, and different stresses are generated on the plastic or glass surfaces to be laminated after heating, resulting in air bubbles, rebound, and cracking phenomena. Therefore, the optical hot melt adhesive 2 used in the present invention is also a glue with ultraviolet resistance function (Thermoplastic Optically Clear Adhesive, TOCA), and ultraviolet resistance can also effectively protect the electronic display surface protective layer from yellowing and catalysis.

[0036] Example 2: Refer to Figure 1 and Figure 2 , as shown in the figure, this embodiment provides a processing and preparation process for a high-temperature-resistant hot melt adhesive electronic paper light guide plate combination, including the following steps:

[0037] S10. Sequentially laminate the protective panel 1, optical hot melt adhesive 2, light guide plate 3, optical hot melt adhesive 2, and electronic paper 4 in order to form a laminate. The light guide plate 3 has a smooth surface and a granular surface, and the light guide plate 3 is laminated with the smooth surface facing the protective panel 1, which meets the actual needs.

[0038] S20. Place the laminate in a sealed environment for heating and pressure application to remove air bubbles. The light guide plate 3 will release small molecules at a high temperature of 60°C. To adapt to the common high-temperature environment after leaving the factory, the temperature in this embodiment is 62°C, and the duration is one hour to initially remove the air bubbles and small molecules inside the laminate.

[0039] S30. After initially removing the air bubbles inside the laminate, place the laminate in a sealed environment for heating and storage. At this time, the temperature should be greater than 65°C to remove the small molecules and air bubbles that the light guide plate 3 will emit at a high temperature above 60°C after leaving the factory, and improve the ultimate heat resistance of the light guide plate 3. In this embodiment, the temperature is 67°C, and the duration is two and a half hours.

[0040] S40. Place the laminate in a sealed environment again for heating and pressure application to remove air bubbles. In this embodiment, the temperature is 63°C, and the duration is 50 minutes. Step S40 is to absorb the air bubbles and small molecules discharged in step S30 again. If not handled well in this step, it can be easily repaired because the optical hot melt adhesive 2 has not undergone a chemical reaction and has strong plasticity.

[0041] S50. Cure the optical hot melt adhesive 2 inside the laminate. The curing method is UV curing. The optical hot melt adhesive 2 cures under UV irradiation to make the optical hot melt adhesive 2 have a certain adhesive force to improve the bonding strength between the two components inside the laminate.

[0042] S60. Place the laminate in a sealed environment for heating and storage to further remove the air bubbles and small molecules inside the laminate. In this embodiment, the temperature is 68°C, and the duration is one and a half hours. Then observe whether there are air bubbles and rebound cracking phenomena on the light guide plate 3. If there are no air bubbles and rebound cracking phenomena, the product is qualified. If there are air bubbles and rebound cracking phenomena, return to step S40 to continuously remove the air bubbles and small molecules inside the laminate until no or very few air bubbles and small molecules are discharged, which meets the factory requirements and can also work stably in subsequent actual high-temperature use scenarios.

[0043] There is also a step S11 between step S10 and step S20. Step S11 is to place the laminate in a vacuum environment for hot pressing to make the protective panel 1, optical hot melt adhesive 2, light guide plate 3, optical hot melt adhesive 2, and electronic paper 4 inside the laminate fit better and can also initially remove the air bubbles inside the laminate.

[0044] Before step S10, there is also a step S1. The step S1 is to heat and dehumidify the light guide plate 3. In this embodiment, the temperature is 63°C, and the duration is one hour to thoroughly dehumidify the light guide plate 3 before removing the air bubbles and small molecules that are easily generated inside the light guide plate 3 to avoid affecting the subsequent process.

[0045] Through the above steps, the bonded body is subjected to extreme high-temperature pressing and heating multiple times, so that it can adapt to the environment of releasing bubbles, small molecules and rebound cracking at extreme temperatures after leaving the factory before leaving the factory, making it more stable in high-temperature environments after leaving the factory.

[0046] In the high-temperature environment after the bonded body leaves the factory, direct sunlight is often accompanied. Long-term outdoor ultraviolet irradiation causes phenomena such as yellowing and catalysis of the light guide plate, and different stresses are generated on the bonded surface (plastic or glass) after bonding when heated, resulting in bubbles, rebound and cracking phenomena. Therefore, the optical hot melt adhesive 2 used in the present invention is also a glue with ultraviolet resistance function (Thermoplastic Optically Clear Adhesive, TOCA), and ultraviolet resistance can also effectively protect the surface protective layer of the electronic display from yellowing and catalysis.

[0047] Example 3: Refer to Figure 1 and Figure 2 , as shown in the figure, the present invention provides a processing and preparation process for a high-temperature resistant hot melt adhesive electronic paper light guide plate combination, including the following steps:

[0048] S10. The protection panel 1, the optical hot melt adhesive 2, the light guide plate 3, the optical hot melt adhesive 2 and the electronic paper 4 are sequentially bonded in order to form a bonded body. The light guide plate 3 has a smooth surface and a granular surface, and the light guide plate 3 is bonded with the smooth surface facing the protection panel 1, which meets the actual needs.

[0049] S20. The bonded body is placed in a closed environment for heating and pressurizing to remove bubbles. The light guide plate 3 will release small molecules at a high temperature of 60°C. At this time, in order to adapt to the common high-temperature environment after leaving the factory, the temperature in this embodiment is 65°C, and the duration is one and a half hours, initially discharging the bubbles and small molecules in the bonded body.

[0050] S30. After initially discharging the bubbles in the bonded body, the bonded body is placed in a closed environment for heating and storage. At this time, the temperature should be higher than 65°C to discharge the small molecules and bubbles that the light guide plate 3 will discharge at a high temperature above 60°C after leaving the factory, improving the ultimate temperature resistance of the light guide plate 3. In this embodiment, the temperature is 70°C, and the duration is two and a half hours.

[0051] S40. The bonded body is placed in a closed environment again for heating and pressurizing to remove bubbles. In this embodiment, the temperature is 65°C, and the duration is 55 minutes. Step S40 is to absorb the bubbles and small molecules discharged in step S30 again. If not handled well in this step, it can be easily repaired because the optical hot melt adhesive 2 has not yet undergone a chemical reaction and has strong plasticity.

[0052] S50. Cure the optical hot melt adhesive 2 that fits inside the body. The curing method is UV curing. The optical hot melt adhesive 2 cures under UV irradiation, enabling the optical hot melt adhesive 2 to have a certain adhesive force to improve the bonding strength between two components inside the body.

[0053] S60. Place the body in a closed environment for heating and storage to further expel the air bubbles and small molecules inside the body. In this embodiment, the temperature is 70 °C and the duration is two hours. Then observe whether there are air bubbles, rebound, and cracking phenomena on the light guide plate 3. If there are no air bubbles, rebound, and cracking phenomena, the product is qualified. If there are air bubbles, rebound, and cracking phenomena, return to step S40 to continuously expel the air bubbles and small molecules inside the body until no or very few air bubbles and small molecules are expelled, which meets the factory requirements and can also work stably in subsequent actual high-temperature usage scenarios.

[0054] Between step S10 and step S20, there is also step S11. Step S11 is to place the body in a vacuum environment for hot pressing to make the protection panel 1, optical hot melt adhesive 2, light guide plate 3, optical hot melt adhesive 2, and electronic paper 4 inside the body fit better and can also initially expel the air bubbles inside the body.

[0055] Before step S10, there is also step S1. Step S1 is to heat and dehumidify the light guide plate 3. In this embodiment, the temperature is 65 °C and the duration is one and a half hours. Thoroughly dehumidify the light guide plate 3 before removing the air bubbles and small molecules that are likely to be generated inside the light guide plate 3 to avoid affecting subsequent processes.

[0056] Through the above steps, the body is subjected to multiple extreme high-temperature pressure heating. Before leaving the factory, it can adapt to the environment where air bubbles, small molecules, and rebound cracking may be released at extreme temperatures after leaving the factory, making it more stable in high-temperature environments after leaving the factory.

[0057] In high-temperature environments after the body leaves the factory, there is often direct sunlight. Long-term outdoor UV irradiation causes phenomena such as yellowing and catalysis of the light guide plate, and different stresses are generated on the bonded surfaces of plastics or glasses after bonding, resulting in air bubbles, rebound, and cracking phenomena. Therefore, the optical hot melt adhesive 2 used in the present invention is also a glue with UV resistance function (Thermoplastic Optically Clear Adhesive, TOCA). UV resistance can also effectively protect the electronic display surface protective layer from yellowing and catalysis.

[0058] The above is a specific description of the preferred embodiment of the present invention. However, the present invention is not limited to the described embodiment. Those skilled in the art can make various equivalent deformations or substitutions without departing from the spirit of the present invention, and these equivalent deformations or substitutions are all included within the scope defined by the claims of this application.

Claims

1. A processing and preparation process for a combination of a heat-resistant hot melt adhesive electronic paper light guide plate, characterized in that, It includes the following steps: S10. Bond the protection panel, optical hot melt adhesive, light guide plate, optical hot melt adhesive, and electronic paper in sequence to form a bonded body; S20. Place the bonded body in a closed environment for heating, pressurizing, and degassing to initially discharge the bubbles in the bonded body and the small molecules released by the light guide plate. The temperature in step S20 is 60°C - 65°C; S30. Place the bonded body in a closed environment for heating and storage to discharge the small molecules and bubbles that the light guide plate will discharge at a high temperature above 60°C after leaving the factory. The temperature in step S30 is 65°C - 70°C; S40. Place the bonded body in a closed environment again for heating, pressurizing, and degassing to absorb the bubbles and small molecules discharged in step S30 again. The temperature in step S40 is 60°C - 65°C; S50. Cure the optical hot melt adhesive in the bonded body; S60. Place the bonded body in a closed environment for heating and storage to further discharge the bubbles and small molecules in the bonded body. After a certain period of time, observe whether there are bubbles, rebound, and cracking phenomena on the light guide plate. If there are no bubbles, rebound, and cracking phenomena, the product is qualified. If there are bubbles, rebound, and cracking phenomena, return to step S40 to continuously discharge the bubbles and small molecules in the bonded body until no or very few bubbles and small molecules are discharged, which meets the factory requirements. The temperature in step S60 is 65°C - 70°C.

2. The processing and preparation process of a heat-resistant hot melt adhesive electronic paper light guide plate combination according to claim 1, characterized in that: Before step S10, there is also step S1. Step S1 is to heat and dehumidify the light guide plate, and the heating temperature is 60°C - 65°C and lasts for more than one hour.

3. The processing and preparation process of a heat-resistant hot melt adhesive electronic paper light guide plate combination according to claim 1, characterized in that: The light guide plate has a smooth surface and a granular surface, and the light guide plate is bonded with the smooth surface facing the protection panel.

4. A processing and preparation process for a heat-resistant hot-melt adhesive electronic paper light guide plate combination according to claim 1, characterized in that: Between step S10 and step S20, there is also step S11. Step S11 is to place the bonded body in a vacuum environment for hot pressing.

5. A processing and preparation process for a high-temperature resistant hot melt adhesive electronic paper light guide plate combination according to claim 1, characterized in that: In step S20, the duration is more than one hour.

6. A processing and preparation process for a high-temperature resistant hot melt adhesive electronic paper light guide plate combination according to claim 1, characterized in that: In step S30, the duration is more than two hours.

7. A processing and preparation process for a heat-resistant hot melt adhesive electronic paper light guide plate combination according to claim 1, characterized in that: In step S40, the duration is more than 30 minutes.

8. A processing and preparation process for a high-temperature resistant hot melt adhesive electronic paper light guide plate combination according to claim 1, characterized in that: The curing in step S50 is UV curing.

9. The processing and preparation process of a heat-resistant hot melt adhesive electronic paper light guide plate combination according to claim 1, characterized in that: In step S60, the duration is more than one hour.

10. A processing and preparation process for a high-temperature resistant hot melt adhesive electronic paper light guide plate combination according to claim 1, characterized in that: The optical hot melt adhesive is also a glue with ultraviolet resistance function.

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