A semiconductor component testing process and testing mechanism

Abstract

The present invention discloses a semiconductor component testing process and testing mechanism, including a first turntable material transport mechanism and a second turntable material transport mechanism; the first turntable material transport mechanism includes a main turntable, a lifting plate arranged above the main turntable, and a first drive device for driving the main turntable to rotate indexably and driving the lifting plate to rise and fall; the second turntable material transport mechanism includes a sub-disk arranged beside the main turntable and a second drive device for driving the sub-disk to rotate indexably, and one of the indexing areas of the sub-disk is provided with a performance test station. The semiconductor component testing mechanism provided by the present invention only sets one performance test station on the sub-disk, taking advantage of the long static time of the sub-disk, only needs to clamp the semiconductor component once, and all test items can be completed at one time, without the need to split the test items. Not only can the number of testers set up be reduced by half, greatly reducing equipment costs, but it can also avoid the problem of reduced yield due to multiple clamping of the pins of the semiconductor component.

Description

Technical Field

[0001] The present invention relates to the technical field of component testing, and in particular to a semiconductor component testing process and a testing mechanism. Background Art

[0002] After semiconductor components are manufactured, they generally need to be transferred to multiple workstations in sequence for performance testing. In order to reduce the floor space and arrange the equipment reasonably, a turntable test structure is generally adopted, and the workstations are arranged on the periphery of the main turntable. The rotation and downward pressure of the cam divider with lifting function drives the suction nozzle on the main turntable to be pressed down to the corresponding workstation.

[0003] The current common practice is to set up the performance test station under the main turntable. The performance test of the components can only be performed when the main turntable is at a static angle. Since the cam divider is designed to perform angle division, lifting, and static at a certain angle position, the main turntable's indexing static time is fixed and short. When the test time of the complete performance test item of the component is longer than the main turntable's indexing static time, the complete performance test item of the component needs to be split into multiple test items. For example, if the static angle of the main turntable is 100° and the time for each degree is 1ms, the indexing static time is 100ms, and the complete performance test time of the component is 200ms, then it is necessary to split the test into two test items, each of which is 100ms long. However, in reality, many test items are difficult to split evenly. If the main turntable uses a single suction nozzle to transport materials according to the above test plan, then the main turntable needs to be equipped with two test stations, each test station needs to be equipped with a tester, for a total of two testers. In addition, semiconductor components require two contact probe clamping to complete all project tests. The increase in the number of contact clamping may cause deformation of component pins and increase the test failure rate. Similarly, if the main turntable uses a dual suction nozzle to transport materials according to the above test plan, then the main turntable needs to be equipped with four test stations, each test station needs to be equipped with a tester, for a total of four testers.

[0004] In actual procurement and production, the equipment cost of the tester is very expensive. If the number of testers configured cannot be reduced, the production cost and selling price of the entire test equipment will be greatly increased, which is not conducive to improving the market competitiveness of the equipment. Summary of the Invention

[0005] In view of the above-mentioned deficiencies in the prior art, the purpose of the present invention is to provide a semiconductor component testing process and testing mechanism, which aims to complete all test items of semiconductor components in one clamping test, reduce the number of semiconductor component clamping tests and reduce the number of tester settings.

[0006] In order to achieve the above object, the present invention adopts the following technical solutions:

[0007] A semiconductor component testing mechanism includes a first turntable material transport mechanism and a second turntable material transport mechanism; the first turntable material transport mechanism includes a main turntable, a lifting plate arranged above the main turntable, and a first driving device for driving the main turntable to rotate indexed and the lifting plate to rise and fall; the second turntable material transport mechanism includes a sub-plate arranged beside the main turntable and a second driving device for driving the sub-plate to rotate indexed, the edge of the main turntable is provided with a plurality of groups of grasping mechanisms arranged in a circumferential array, the grasping mechanisms can grasp at least one semiconductor component; the lifting plate is provided with a plurality of groups of grasping mechanisms for grasping ... The pressure rod assembly drives the grasping mechanism to descend, and the edge of the sub-disk is provided with multiple groups of receiving areas arranged in a circular array, and each group of receiving areas is provided with at least one positioning seat. A handover station is formed between the main turntable and the sub-disk, and the grasping mechanism located at the handover station can transfer the semiconductor components to the positioning seat of the sub-disk. One of the dividing areas of the sub-disk is provided with a performance testing station, and the performance testing station includes a clamping device and a tester electrically connected to the clamping device. The clamping device is provided with clamping stations with the same number and one-to-one corresponding to the positioning seats of each group of receiving areas.

[0008] The clamping device includes a base, a movable frame, a clamping drive mechanism, a connecting rod mechanism, a clamping mechanism, a power module, a vertical linkage mechanism and an opening and closing control mechanism. The movable frame is arranged on the base through a vertical slide rail assembly. The clamping mechanism includes a first clamping assembly and a second clamping assembly respectively arranged on the top of the movable frame through a longitudinal slide rail assembly. The first clamping assembly and the second clamping assembly are respectively provided with a power module on the opposite inner sides. The connecting rod mechanism is arranged between the first clamping assembly and the second clamping assembly for linking the first clamping assembly and the second clamping assembly to be relatively close or Separately, the clamping drive mechanism includes a clamping drive motor and a transmission shaft. The vertical linkage mechanism is arranged between the movable frame and the transmission shaft. The vertical linkage mechanism is used to link the clamping mechanism to perform lifting and lowering activities in the vertical direction. The opening and closing control mechanism is arranged between the connecting rod mechanism and the transmission shaft. The opening and closing control mechanism is used to link the connecting rod mechanism to control the opening or clamping of the clamping mechanism. The clamping drive motor drives the transmission shaft to operate, so that the clamping mechanism clamps the semiconductor components for electrical performance testing when it is in the lowered position, and releases the semiconductor components when it is in the raised position.

[0009] The vertical linkage mechanism includes a cam component provided on the transmission shaft and a first pulley provided on the movable frame and matched with the cam component. The outer contour of the cam component is provided with a protrusion corresponding to the gripping mechanism in the ascending state.

[0010] The opening and closing control mechanism includes a cylindrical cam mechanism, which includes a cylindrical cam member arranged on a transmission shaft and a second pulley connected to the connecting rod mechanism. A guide groove is provided on the outer periphery of the cylindrical cam member, and the guide groove is provided with a driving part corresponding to the clamping state of the clamping mechanism and a reset part corresponding to the open state of the clamping mechanism. The second pulley extends into the guide groove and works with the drive of the cylindrical cam member.

[0011] The connecting rod mechanism includes a transmission connecting rod with a middle portion rotatably connected to the movable frame, one end of the transmission connecting rod is transmission-connected to the first clamping assembly, the other end of the transmission connecting rod is transmission-connected to the second clamping assembly, and the first clamping assembly is transmission-connected to the opening and closing control mechanism.

[0012] The first clamping and grabbing assembly includes a first connecting seat, a first connecting arm and two first grabbing arms, one end of the first connecting arm is connected to the first connecting seat, and the two first grabbing arms are arranged at the other end of the first connecting arm; the second clamping and grabbing assembly includes a second connecting seat, a second connecting arm and two second grabbing arms, one end of the second connecting arm is connected to the second connecting seat, and the two second grabbing arms are arranged at the other end of the second connecting arm; the first connecting seat and the second connecting seat are arranged on the same longitudinal slide rail assembly, the two ends of the transmission connecting rod are respectively rotatably connected to the first connecting seat and the second connecting seat, and the first connecting arm and the second connecting arm are arranged on the same straight line.

[0013] A fixed plate is provided above the lifting plate, and a fixed frequency pull rod mechanism is provided on the fixed plate for limiting the downward pressure of the pressure rod assembly. The fixed frequency pull rod mechanism includes a pull plate support, a pull plate that can move up and down relative to the pull plate support, a turning block fixedly connected to the pull plate, and a pull rod drive motor provided beside the pull plate support; a fixed frequency cam is provided on the output end of the pull rod drive motor, and a follower wheel is provided on the turning block, and the follower wheel presses against the side of the fixed frequency cam to realize transmission; the pull plate is used to limit the descent of the two guide blocks.

[0014] Each group of the grasping mechanism includes a first suction component and a second suction component arranged in parallel, each group of the receiving area is provided with 4 positioning seats, the performance testing station is provided with two of the testers, and the clamping device is provided with 4 clamping stations. Each tester is used to test the semiconductor components on the two clamping stations in turn.

[0015] A loading station is provided upstream of the handover station, and a loading device is provided at the loading station; the first driving device includes a first cam divider and a first driving motor that is transmission-connected to the first cam divider; the second driving device includes a second cam divider and a second driving motor that is transmission-connected to the second cam divider, and the indexing stationary time length of the second cam divider is greater than the indexing stationary time length of the first cam divider.

[0016] A testing process for a semiconductor component testing mechanism comprises the following steps:

[0017] S01: The first driving device drives the lifting plate to descend, and the gripping mechanism located at the loading station grips the semiconductor component on the loading device. The gripping mechanism is set as the first gripping mechanism, and the gripping mechanism before the first gripping mechanism is set as the second gripping mechanism. The first suction component and the second suction component on the first gripping mechanism each pick up a semiconductor component;

[0018] S02: The first drive device drives the lifting plate to rise, and then the main turntable indexes and rotates. The second gripping mechanism rotates to the loading station. The first drive device drives the lifting plate to descend, and the second gripping mechanism grabs the semiconductor component on the loading device. The first suction component and the second suction component on the second gripping mechanism each grab a semiconductor component.

[0019] S03: After the first driving device drives the main turntable and the lifting plate to perform several cycles, the semiconductor components on the first grasping mechanism are first adjusted in position by the positioning and correction device, and then the semiconductor components on the second grasping mechanism are adjusted in position by the positioning and correction device;

[0020] S04: The first drive device drives the main turntable to rotate indexingly, causing the first gripping mechanism to enter the handover station. The first receiving area on the sub-disk is located at the handover station. The first gripping mechanism is located directly above the first and second positioning seats. The fixed-frequency pull rod mechanism limits the movement of the pressure rod assembly. When the lifting plate descends, the pressure rod assembly on the lifting plate remains stationary. The semiconductor components on the first gripping mechanism maintain their original height and are away from the first and second positioning seats. Then the main turntable enters the indexing static state.

[0021] S05: The first receiving area of the sub-disc is located at the handover station and is in an indexing static state. The first driving device drives the lifting disk to rise, and then the main turntable indexes and rotates. The first gripping mechanism rotates to directly above the third and fourth positioning seats. At the same time, the second gripping mechanism rotates to directly above the first and second positioning seats. The fixed-frequency pull rod mechanism releases the restriction on the pressure rod assembly. Then the first driving device drives the lifting disk to descend. The pressure rod assembly on the lifting disk presses down to drive the first gripping mechanism and the second gripping mechanism on the main turntable to descend at the same time. The semiconductor components of the first gripping mechanism are transferred to the third and fourth positioning seats, and the semiconductor components of the second gripping mechanism are transferred to the first and second positioning seats.

[0022] S06: The first gripping mechanism and the second gripping mechanism release the semiconductor component; then the second driving device drives the secondary tray to rotate indexingly, and the receiving area of the secondary tray enters the handover station. The semiconductor components that have completed the performance test are placed on the four positioning seats on the receiving area of the secondary tray. Then, the first gripping mechanism and the second gripping mechanism respectively grasp the semiconductor components that have completed the performance test;

[0023] S07: The second driving device drives the sub-disk to rotate in an indexing manner, so that the semiconductor components on the first positioning seat, the second positioning seat, the third positioning seat and the fourth positioning seat are rotated to the first clamping station, the second clamping station, the third clamping station and the fourth clamping station on the clamping device respectively, and then the sub-disk is in an indexing static state, the clamping device clamps the semiconductor components, and then the first tester performs a performance test on the semiconductor components on the first clamping station, and the second tester performs a performance test on the semiconductor components on the second clamping station at the same time; when the semiconductor components on the first clamping station and the second clamping station are tested, the first tester performs a performance test on the semiconductor components on the third clamping station, and the second tester performs a performance test on the semiconductor components on the fourth clamping station at the same time; when all semiconductor components on the first receiving area are tested, the second driving device drives the sub-disk to rotate in an indexing manner.

[0024] Beneficial effects:

[0025] Compared with setting up several performance test stations on the main turntable, the semiconductor component testing mechanism provided by the present invention only sets up one performance test station on the sub-disc. Taking advantage of the long static time of the sub-disc, the semiconductor component only needs to be clamped once to complete all test items at one time, without the need to split the test items. Not only can the number of testers set up be reduced by half, greatly reducing equipment costs; it can also avoid the problem of reduced yield due to multiple clamping of the pins of the semiconductor components. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 Schematic diagram of the structure of the semiconductor component testing mechanism Figure 1 .

[0027] Figure 2 Schematic diagram of the structure of the semiconductor component testing mechanism Figure 2 .

[0028] Figure 3 It is a three-dimensional diagram of the clamping device.

[0029] Figure 4 This is an exploded view of the clamping device.

[0030] Figure 5 It is a structural diagram of the clamping drive mechanism.

[0031] Figure 6It is a structural diagram of the clamping mechanism.

[0032] Figure 7 for Figure 1 A partial magnified view of the middle L area.

[0033] Figure 8 It is a three-dimensional diagram of the fixed-frequency pull rod mechanism.

[0034] Figure 9 It is a structural diagram of the grasping mechanism.

[0035] Figure 10 It is a structural diagram of the pressure rod mechanism.

[0036] Figure 11 It is a pulse signal status diagram of the operation status of each mechanism.

[0037] Main component symbols: 1-first turntable transport mechanism, 11-main turntable, 12-lifting plate, 13-handover station, 14-loading device, 2-second turntable transport mechanism, 21-sub-plate, 22-second driving device, 3-grabbing mechanism, 31-first suction assembly, 32-second suction assembly, 301-first spring fixing seat, 302-suction pipe, 303-suction nozzle, 304-spring limit block, 305-first spring, 306-first washer, 307-air connection head, 3 08-Battery pin, 4-Press rod assembly, 40-Fixed plate, 41-Press rod, 42-Press head, 43-Limiting head, 44-Second washer, 45-Guide block, 46-Second spring fixing seat, 47-Second spring, 48-Bushing, 49-Guide rod, 5-Clamping device, 50-Test station, 511-Base, 512-Movable frame, 513-Clamping drive mechanism, 52-Clamping mechanism, 515-Transmission connecting rod, 516-Vertical linkage mechanism, 517-Opening and closing control mechanism, 5111 -longitudinal slide rail assembly, 521-first clamping assembly, 522-second clamping assembly, 5131-clamping drive motor, 5132-transmission shaft, 5161-cam member, 5162-first pulley, 5163-protrusion, 5171-cylindrical cam member, 5172-second pulley, 5173-guide groove, 5174-driving part, 5175-reset part, 5211-first connecting seat, 5212-first connecting arm, 5213-first gripping arm, 5221-second Connecting seat, 5222-second connecting arm, 5223-second grabbing arm, 5181-first electrical connector, 5182-second electrical connector, 5176-bar movable hole, 5177-third pulley, 5178-connecting frame, 5112-vertical slide rail assembly, 6-fixed frequency pull rod mechanism, 61-pull plate support, 62-pull plate, 621-notch, 63-turning block, 64-pull rod drive motor, 65-fixed frequency cam, 66-follower wheel, 67-low position sensor, 68-low position contact piece. DETAILED DESCRIPTION

[0038] The present invention provides a semiconductor component testing process and testing mechanism. To make the objectives, technical solutions, and effects of the present invention more clear and explicit, the present invention is further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are intended only to illustrate the present invention and are not intended to limit the scope of protection of the present invention.

[0039] See also Figures 1 to 2 The present invention provides a semiconductor component testing mechanism, comprising a first turntable material transport mechanism 1 and a second turntable material transport mechanism 2; the first turntable material transport mechanism 1 comprises a main turntable 11, a lifting plate 12 arranged above the main turntable 11, and a first driving device (not shown in the figure) for driving the main turntable 11 to rotate indexingly and driving the lifting plate 12 to rise and fall; the second turntable material transport mechanism 2 comprises a sub-plate 21 arranged beside the main turntable 11 and a second driving device 22 for driving the sub-plate 21 to rotate indexingly, a plurality of groups of grasping mechanisms 3 arranged in a circular array are provided on the edge of the main turntable 11, and the grasping mechanism 3 can grasp at least one semiconductor component 10; the lifting plate 12 is provided with a pressure rod assembly 4 for driving the grasping mechanism to descend, and the edge of the sub-disk 21 is provided with multiple groups of receiving areas arranged in a circular array, and each group of receiving areas is provided with at least one positioning seat, and a handover station 13 is formed between the main turntable 11 and the sub-disk 21. The grasping mechanism 3 located at the handover station 13 can transfer the semiconductor components to the positioning seats of the sub-disk 21, and one of the dividing areas of the sub-disk 21 is provided with a performance testing station, and the performance testing station 50 includes a clamping device 5 and a tester electrically connected to the clamping device 5 (not visible in the figure), and the clamping device 5 is provided with clamping stations with the same number and one-to-one corresponding to the positioning seats in each group of receiving areas.

[0040] In this embodiment, a loading station is provided upstream of the handover station 13, and a loading device 14 is provided at the loading station; the first driving device includes a first cam divider and a first driving motor connected to the first cam divider; the second driving device 22 includes a second cam divider and a second driving motor connected to the second cam divider, and the indexing static time length of the second cam divider is greater than the indexing static time length of the first cam divider. The first turntable material transport mechanism 1 performs cyclic motion in the following action sequence, T1: the lifting plate 12 rises; T2: the main turntable 11 indexes and rotates, T3: the lifting plate 12 descends, T4: the main turntable 11 indexes and remains stationary, correspondingly making the grasping mechanism 3 perform cyclic motion in the four actions of "rising", "indexing and rotating", "descending", and "stationary" in sequence. From Figure 11 It can be seen that the duration of each stop of the auxiliary disk 21 is basically the same as the total duration of two indexing rotations of the main turntable, two lifting and lowering of the lifting disk 12 and one stop of the main turntable 11, which greatly prolongs the test time.

[0041] The test process is briefly described below: the first drive device drives the main turntable 11 and the lifting plate 12 to move according to the set action sequence; after the grasping mechanism located upstream of the sub-disc 21 grasps the semiconductor component at the loading station, the first turntable transport mechanism 1 transports the semiconductor component to the handover station 13. At this time, the sub-disc 21 is in a stationary state, and one of the receiving areas of the sub-disc 21 is located at the handover station 13. The first drive device drives the lifting plate 12 to descend, thereby driving the grasping mechanism to descend, so that the semiconductor component to be tested on the main turntable 11 is transferred to the positioning seat of the sub-disc 21, and then the sub-disc 21 rotates indexingly, and the receiving area carrying the semiconductor component to be tested leaves the handover station 13 and moves toward the performance test station 50. At the same time, the receiving area carrying the semiconductor component that has completed the test enters the handover station 13, and the grasping mechanism grasps the semiconductor component that has completed the test; finally, the clamping device 5 in the performance test station clamps the semiconductor component located at the clamping workpiece, so that the semiconductor component is electrically connected to the tester, and the tester performs all performance item tests on the semiconductor component.

[0042] Compared with setting up several performance test stations 50 on the main turntable 11, the semiconductor component testing mechanism provided by the present invention only sets up one performance test station 50 on the sub-disk 21. Taking advantage of the long static time of the sub-disk 21, the semiconductor component 10 only needs to be clamped once to complete all test items at one time, without the need to split the test items. Not only can the number of testers set up be reduced by half, greatly reducing the equipment cost; it can also avoid the problem of reduced yield due to multiple clamping of the pins of the semiconductor components.

[0043] For details, please refer to Figures 3 to 6The clamping device 5 includes a base 511, a movable frame 512, a clamping drive mechanism 513, a connecting rod mechanism, a clamping mechanism 52, a power connection module, a vertical linkage mechanism 516 and an opening and closing control mechanism 517. The movable frame 512 is arranged on the base 511 through a vertical slide rail assembly 5112. The clamping mechanism 52 includes a first clamping assembly 521 and a second clamping assembly 522 respectively arranged on the top of the movable frame 512 through a longitudinal slide rail assembly 5111. The opposite inner sides of the first clamping assembly 521 and the second clamping assembly 522 are respectively provided with a power connection module. The connecting rod mechanism is arranged between the first clamping assembly 521 and the second clamping assembly 522 for linking the first clamping assembly 521 and the second clamping assembly 522. Relatively close or separated, the clamping drive mechanism 513 includes a clamping drive motor 5131 and a transmission shaft 5132, and a vertical linkage mechanism 516 is provided between the movable frame 512 and the transmission shaft 5132, and the vertical linkage mechanism 516 is used to link the clamping mechanism 52 to perform lifting and lowering activities in the vertical direction, and the opening and closing control mechanism 517 is provided between the connecting rod mechanism and the transmission shaft 5132, and the opening and closing control mechanism 517 is used to link the connecting rod mechanism to control the opening or clamping of the clamping mechanism 52, and the clamping drive motor 5131 drives the transmission shaft 5132 to operate, so that the clamping mechanism 52 clamps the semiconductor components for low-voltage performance testing when it is in the lowered position, and releases the semiconductor components when the clamping mechanism 52 is in the raised position.

[0044] When the clamping device 5 is working, a vertical linkage mechanism 516 and an opening and closing control mechanism 517 are simultaneously set in the clamping drive mechanism 513 to respectively control the vertical movement of the clamping mechanism 52 and the opening or clamping of the clamping mechanism 52, so that the clamping mechanism 52 clamps the semiconductor component for low-voltage performance testing when it is in the descending position, and releases the semiconductor component when it is in the ascending position. This can better avoid the clamping mechanism 52 from colliding and interfering with the clamping mechanism 52 due to the position switching of the next semiconductor component in the descending position, and has good reliability.

[0045] See also Figures 3 to 6In one embodiment, the vertical linkage mechanism 516 includes a cam member 5161 provided on the transmission shaft 5132 and a first pulley 5162 provided on the movable frame 512 and coordinated with the cam member 5161. The outer contour of the cam member 5161 is provided with a protrusion 5163 corresponding to the clamping mechanism 52 in the ascending state. When the clamping drive motor 5131 drives the transmission shaft 5132 to rotate until the first pulley 5162 cooperates with the protrusion 5163 of the cam member 5161, the clamping mechanism 52 is in the ascending position. When the clamping drive motor 5131 drives the transmission shaft 5132 to rotate until the first pulley 5162 cooperates with other parts of the cam member 5161, the clamping mechanism 52 is in the descending position. Through such an arrangement, the vertical linkage mechanism 516 is simply arranged and the effect of driving the clamping mechanism 52 to move in the vertical direction is good.

[0046] See also Figures 3 to 6 In one embodiment, the opening and closing control mechanism 517 includes a cylindrical cam mechanism, which includes a cylindrical cam member 5171 provided on the transmission shaft 5132 and a second pulley 5172 connected to the connecting rod mechanism. The outer periphery of the cylindrical cam member 5171 is provided with a guide groove 5173, and the guide groove 5173 is provided with a driving portion 5174 corresponding to the clamping state of the clamping mechanism 52 and a reset portion 5175 corresponding to the open state of the clamping mechanism 52. The second pulley 5172 extends into the guide groove 5173 and works with the cylindrical cam member 5171. The protrusion 51 63 is correspondingly arranged in the same rotation angle range of the transmission shaft 5132 as the reset portion 5175. When the clamping drive motor 5131 drives the transmission shaft 5132 to rotate until the second pulley 5172 cooperates with the driving portion 5174 of the guide groove 5173, the clamping mechanism 52 is driven to form a clamping state through the connecting rod mechanism, and when the second pulley 5172 cooperates with the reset portion 5175 of the guide groove 5173, the clamping mechanism 52 is driven to form an open state through the connecting rod mechanism. Through such an arrangement, the cylindrical cam mechanism is simply arranged, and the effect of driving the clamping mechanism 52 to open or clamp is good.

[0047] See also Figures 3 to 6 In one embodiment, the connecting rod mechanism includes a transmission connecting rod 515 that is rotatably connected to the movable frame 512 in the middle, one end of the transmission connecting rod 515 is transmission-connected to the first clamping assembly 521, and the other end of the transmission connecting rod 515 is transmission-connected to the second clamping assembly 522, and the first clamping assembly 521 is transmission-connected to the opening and closing control mechanism 517; through such an arrangement, the connection rod mechanism is simply arranged and the transmission effect is good.

[0048] See also Figures 3 to 6In one embodiment, the first clamping and grabbing assembly 521 includes a first connecting seat 5211, a first connecting arm 5212 and two first grabbing arms 5213, one end of the first connecting arm 5212 is connected to the first connecting seat 5211, and the two first grabbing arms 5213 are arranged at the other end of the first connecting arm 5212; the second clamping and grabbing assembly 522 includes a second connecting seat 5221, a second connecting arm 5222 and two second grabbing arms 5223, one end of the second connecting arm 5222 is connected to the second connecting seat 522 1, two second grasping arms 5223 are arranged at the other end of the second connecting arm 5222; the first connecting seat 5211 and the second connecting seat 5221 are arranged on the same longitudinal slide rail assembly 5111, and the two ends of the transmission connecting rod 515 are rotatably connected to the first connecting seat 5211 and the second connecting seat 5221 respectively, and the first connecting arm 5212 and the second connecting arm 5222 are arranged on the same straight line; through this arrangement, the clamping effect of the first grasping arm 5213 and the second grasping arm 5223 on the same straight line is ensured.

[0049] In one embodiment, the semiconductor component has two pins on each side, for a total of four pins. The power connection module includes a first electrical connector 5181 mounted on a first gripping arm 5213 and a second electrical connector 5182 mounted on a second gripping arm 5223. The same gripping mechanism 52 is symmetrically provided with two sets of first gripping arms 5213 and second gripping arms 5223, enabling a single gripping mechanism 52 to simultaneously perform electrical performance testing on all four pins of a semiconductor component.

[0050] See also Figures 3 to 6 In one embodiment, the first clamping assembly 521 is transmitted to the opening and closing control mechanism 517 through a connecting frame 5178, and the connecting frame 5178 is slidably arranged on the base 511 through a longitudinal slide rail assembly 5111. The connecting frame 5178 is provided with a vertically arranged strip movable hole 5176, and the first clamping assembly 521 is provided with a third pulley 5177 extending into the strip movable hole 5176, and the third pulley 5177 is slidably provided in the strip movable hole 5176. The purpose of setting the strip movable hole 5176 and the third pulley 5177 is to provide avoidance space for the corresponding clamping mechanism 52 when it moves vertically, thereby ensuring the normal vertical movement of the clamping mechanism 52.

[0051] See also Figures 3 to 6 In one embodiment, the clamping mechanism 52 is located on the movable frame 512 and is provided with two groups; through such an arrangement, the clamping device 5 can simultaneously clamp four semiconductor components for electrical performance testing, thereby improving the testing efficiency of the semiconductor components.

[0052] In this example, see Figure 9Each group of the grasping mechanism 3 includes a first suction component 31 and a second suction component 32 arranged in parallel, and each group of receiving areas is provided with 4 positioning seats. The performance testing station is provided with two of the testers mentioned above, and the clamping device 5 is provided with 4 clamping stations. Each tester is used to test the semiconductor components on the two clamping stations in turn.

[0053] Furthermore, the first suction assembly 31 and the second suction assembly 32 have the same structure. The first suction assembly 31 and the second suction assembly 32 both include a first spring fixing seat 301 fixed on the main turntable 11, a vertically extending suction pipe 302, and a suction nozzle 303 fixed at the bottom end of the suction pipe 302; a spring stopper 304, a first spring 305 and a first washer 306 are sleeved on the suction pipe 302, and the first washer 306 is located below the turntable. A spring 305 is located above the turntable. The suction pipe 302 is provided with an air inlet. An air connector 307 is fixed to the suction pipe 302 and connects to the air inlet. The air connector 307 is located below the first gasket 306. The first spring 305 is disposed between the first spring retainer 301 and the spring stopper 304. The suction pipe 302 passes through the first spring retainer 301. The top of the suction pipe 302 is sealed and provided with a latch 308 for retaining the spring stopper 304. Negative pressure enters the suction pipe 302 from the input end of the air connector 307, giving the suction nozzle 303 of the suction pipe 302 a negative suction force, capable of continuously sucking in light and small semiconductor components. It should be understood that when positive pressure air is introduced into the air connector 307, the negative pressure environment within the suction pipe can be destroyed, causing the suction nozzle 303 to release the semiconductor component.

[0054] In its natural state, the first spring 305 is in an open position. The bottom end of the first spring 305 presses against the first spring retainer 301, and the top end of the first spring 305 pushes the spring stopper 304 upward, causing the spring stopper 304, the straw 302, and the first washer 306 to be at their highest point. The first washer 306 presses against the bottom surface of the main turntable 11, limiting the upward travel of the straw 302. When the pressure rod assembly 4 presses down on the top of the straw 302, the first spring 305 gradually compresses, causing the straw 302 to descend vertically relative to the first spring retainer 301 and the main turntable 11, enabling the suction or processing placement of the semiconductor component. When the pressure rod assembly 4 is released from the straw 302, the first spring 305 deforms and returns to its open position, driving the straw 302 and the semiconductor component to rise and return to their original position.

[0055] Specifically, the pressure rod assembly 4 includes a vertically extending pressure rod 41, a pressure head 42 fixed at the bottom end of the pressure rod 41, a limit head 43 fixed in the middle of the pressure rod 41, a second washer 44 fixed on the pressure rod 41, and a guide block 45 arranged at the top end of the pressure rod 41; a bushing 48 and a second spring fixing seat 46 are fixed on the lifting plate 12, the second washer 44 is located above the pressure head 42, and a second spring 47 is provided between the second spring fixing seat 46 and the second washer 44, and the pressure rod 41 passes through the bushing 48, the lifting plate 12, the second spring fixing seat 46 and the second spring 47 from top to bottom.

[0056] Under normal conditions, the pressure rod assembly 4 moves with the lifting plate 12, and the lifting plate 12 will drive the entire pressure rod assembly 4 to descend. The pressure head 42 on the pressure rod 41 acts on the top of the straw 302, pushing the straw 302 down. Since the elastic force of the second spring 47 is much greater than that of the first spring 305, the second spring 47 can buffer the rigid impact between the pressure rod 41 and the straw 302, and the first spring 305 will be compressed.

[0057] When the fixed-frequency pull rod mechanism 6 pulls the guide block 45, it limits the guide block 45 and the pressure rod 41 from descending. Although the lifting plate 12 descends, the pressure rod 41 still maintains its original height and remains motionless, that is, the lifting plate 12 descends relative to the pressure rod 41, causing the second spring 47 to be compressed, and the pressure rod 41 does not contact the suction tube 302, and the first suction component 31 and the second suction component 32 remain motionless.

[0058] Specifically, a fixed plate 40 is provided above the lifting plate 12, and a fixed frequency pull rod mechanism 6 is provided on the fixed plate 40 for limiting the downward pressure of the pressure rod assembly 4. The fixed frequency pull rod mechanism 6 includes a pull plate support 61, a pull plate 62 that can move up and down relative to the pull plate support 61, a turning block 63 fixed to the pull plate 62, and a pull rod drive motor 64 provided next to the pull plate support 61; a fixed frequency cam 65 is provided on the output end of the pull rod drive motor 64, and a follower wheel 66 is provided on the turning block 63. The follower wheel 66 presses against the side of the fixed frequency cam 65 to realize transmission; the pull plate 62 is used to limit the descent of the two guide blocks 45. In the initial state, the pull plate 62 and the turning block 63 descend under the action of their own weight, and the pull plate 62 is at the lowest point. At this time, the follower wheel 66 presses against the circular part of the fixed frequency cam 65, and the pull plate 62 is away from the guide block 45 and does not interfere with the lifting and lowering of the guide block 45 and the pressure rod 41. As the pull rod drive motor 64 drives the fixed frequency cam 65 to rotate until the follower wheel 66 engages with the raised portion 5163 of the fixed frequency cam 65, the pull plate 62 is at its highest point. The pull plate 62 supports the bottom of the guide block 45 upward, thereby pulling the guide block 45 when the guide block 45 and the pressure rod 41 tend to move downward, thereby keeping the pressure rod 41 stationary. It is understandable that during the test, the pull rod drive motor 64 is in continuous motion, and the speed of the pull rod drive motor 64 will be adaptively adjusted according to the duration and frequency of the lifting plate 12.

[0059] The fixed plate 40 is provided with a guide rod 49 for guiding the vertical movement of the guide block 45. On the one hand, it prevents the guide block 45 and the pressure rod 41 from self-rotating during operation; on the other hand, it ensures that the guide rod 49 always slides vertically, thereby improving the lifting and lowering stability of the pressure rod 41.

[0060] Furthermore, the pull plate 62 is slidably connected to the pull plate support 61 through the guide rail 691 and the slider 692 to ensure that the pull plate 62 moves up and down smoothly; the pull plate 62 is an L-shaped structure, and two notches 621 for the pressure rod 41 to extend into are provided on the horizontal part of the pull plate 62, that is, one pull plate 62 can restrict two pressure rods 41 at the same time.

[0061] Preferably, a low-position sensor 67 is provided on the top of the pull plate support 61, and a low-position contact piece 68 is provided on the top of the pull plate 62. If the low-position contact piece 68 cannot trigger the low-position sensor 67, it means that the pull plate 62 is in the lowest position, and the signal can be fed back to the control system for further logical control; if the low-position contact piece 68 can trigger the low-position sensor 67, it means that the pull plate 62 is in the lifting state.

[0062] It should be understood that the main turntable 11 and the lifting plate 12 perform cyclic motions in the following order: T1: the lifting plate 12 rises; T2: the main turntable 11 rotates at an indexing rate; T3: the lifting plate 12 descends; T4: the main turntable 11 stops at an indexing rate;

[0063] The auxiliary disk 21 only rotates in a circular indexing manner; one receiving area of the auxiliary disk 21 is set as the first receiving area A1, the receiving area before the first receiving area A1 is set as the second receiving area A2, and the four positioning seats in the first receiving area A1 are the first positioning seat C1, the second positioning seat C2, the third positioning seat C3, and the fourth positioning seat C4, respectively. The first positioning seat C1 is closest to the positioning correction device, and the fourth positioning seat C4 is farthest from the positioning correction device; one of the testers is set as the first tester, and the other tester is set as the second tester;

[0064] A testing process for the semiconductor component testing mechanism provided in this embodiment includes the following steps:

[0065] S01: The first driving device drives the lifting plate 12 to descend, and the grabbing mechanism located at the loading station grabs the semiconductor component on the loading device. The grabbing mechanism is set as the first grabbing mechanism D1, and the grabbing mechanism before the first grabbing mechanism D1 is set as the second grabbing mechanism D2. The first suction component 31 and the second suction component 32 on the first grabbing mechanism D1 each grab a semiconductor component;

[0066] S02: The first drive device drives the lifting plate 12 to rise, and then the main turntable 11 indexes and rotates. The second grabbing mechanism D2 rotates to the loading station. The first drive device drives the lifting plate 12 to descend. The second grabbing mechanism D2 grabs the semiconductor component on the loading device. The first suction component 31 and the second suction component 32 on the second grabbing mechanism D2 each grab a semiconductor component.

[0067] S03: After the first driving device drives the main turntable 11 and the lifting plate 12 to perform several cycles, the semiconductor components on the first grabbing mechanism D1 are first adjusted in position by the positioning and correction device, and then the semiconductor components on the second grabbing mechanism D2 are adjusted in position by the positioning and correction device again;

[0068] S04: The first drive device drives the main turntable 11 to rotate at an indexing rate, causing the first gripping mechanism D1 to enter the transfer station 13. The first receiving area A1 on the sub-disk 21 is located at the transfer station 13. The first gripping mechanism D1 is located directly above the first positioning seat C1 and the second positioning seat C2. The fixed-frequency pull rod mechanism 6 restricts the movement of the pressure rod assembly 4. When the lifting plate 12 descends, the pressure rod assembly 4 on the lifting plate 12 remains stationary. The semiconductor components on the first gripping mechanism D1 maintain their original height and are away from the first positioning seat C1 and the second positioning seat C2. Then, the main turntable 11 enters an indexing static state.

[0069] S05: The first receiving area A1 of the sub-disc 21 is located at the handover station 13 and is in an indexed static state. The first driving device drives the lifting disk 12 to rise, and then the main turntable 11 indexes and rotates. The first grabbing mechanism D1 rotates to directly above the third positioning seat C3 and the fourth positioning seat C4. At the same time, the second grabbing mechanism D2 rotates to directly above the first positioning seat C1 and the second positioning seat C2. The fixed-frequency pull rod mechanism 6 releases the restriction on the pressure rod assembly 4. Then the first driving device drives the lifting disk 12 to descend. The pressure rod assembly 4 on the lifting disk 12 presses down to drive the first grabbing mechanism D1 and the second grabbing mechanism D2 on the main turntable 11 to descend at the same time. The semiconductor components of the first grabbing mechanism D1 are transferred to the third positioning seat C3 and the fourth positioning seat C4, and the semiconductor components of the second grabbing mechanism D2 are transferred to the first positioning seat C1 and the second positioning seat C2.

[0070] S06: The first gripping mechanism D1 and the second gripping mechanism D2 release the semiconductor components. The second driving device 22 then drives the sub-disc 21 to index and rotate. The receiving area A2 of the sub-disc 21 enters the transfer station 13. The semiconductor components that have completed the performance test are placed on the four positioning seats on the receiving area A2 of the sub-disc 21. Then, the first gripping mechanism D1 and the second gripping mechanism D2 respectively grasp the semiconductor components that have completed the performance test.

[0071] S07: The second driving device 22 drives the sub-disk 21 to rotate in an indexing manner, so that the semiconductor components on the first positioning seat C1, the second positioning seat C2, the third positioning seat C3 and the fourth positioning seat C4 are rotated to the first clamping station J1, the second clamping station J2, the third clamping station J4 and the fourth clamping station J4 on the clamping device 5 respectively, and then the sub-disk 21 is in an indexing static state, the clamping device 5 clamps the semiconductor components, and then the first tester performs a performance test on the semiconductor components on the first clamping station J1, and the second tester performs a performance test on the semiconductor components on the second clamping station J2 at the same time; when the semiconductor components on the first clamping station J1 and the second clamping station J2 are tested, the first tester performs a performance test on the semiconductor components on the third clamping station J3, and the second tester performs a performance test on the semiconductor components on the fourth clamping station J4 at the same time; when all semiconductor components on the first receiving area A1 are tested, the second driving device 22 drives the sub-disk 21 to rotate in an indexing manner.

[0072] Each gripping mechanism (i.e., gripping station) in the above-mentioned test process adopts a "double suction" design. Each gripping mechanism 3 can pick up two semiconductor components 10 at a time, that is, the first turntable material transport mechanism 1 transports two semiconductor components 10 per transport cycle, which doubles the test capacity compared to the conventional method of only transporting one semiconductor component per transport cycle. In addition, by taking advantage of the long static time of the sub-disk 21, the performance test station can complete the test of all performance items when the semiconductor component is clamped only once, without the need for batch testing, thereby minimizing the number of clamping times for the semiconductor component and improving the yield rate; preferably, two testers and a clamping device 5 are set up in the performance test station to test four semiconductor components in turn, greatly reducing equipment costs and improving the company's market competitiveness.

[0073] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0074] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections, or mutual communication; direct connections or indirect connections through an intermediate medium; and internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0075] It is understandable that those skilled in the art can make equivalent substitutions or changes based on the technical solution and inventive concept of the present invention, and all such changes or substitutions should fall within the scope of protection of the present invention.

Claims

1. A semiconductor component testing mechanism, characterized in that: It includes a first turntable material transport mechanism and a second turntable material transport mechanism; the first turntable material transport mechanism includes a main turntable, a lifting plate arranged above the main turntable, and a first driving device for driving the main turntable to rotate indexingly and driving the lifting plate to move up and down; The lifting mechanism is provided with a pressure rod assembly for driving the grasping mechanism to descend, and the edge of the sub-disk is provided with a plurality of receiving areas arranged in a circumferential array, and each receiving area is provided with at least one positioning seat, and a handover station is formed between the main turntable and the sub-disk, and the grasping mechanism located at the handover station can transfer the semiconductor element to the positioning seat of the sub-disk, and one of the indexing areas of the sub-disk is provided with a performance testing station, and the performance testing station includes a clamping device and a tester electrically connected to the clamping device, and the clamping device is provided with a clamping station with the same number and one-to-one corresponding to the positioning seats of each receiving area; the clamping device includes a base, a movable frame, a clamping drive mechanism, a connecting rod mechanism, a clamping mechanism, a power connection module, a vertical ... The cam is connected to the chassis to move the first and second clamping assemblies closer together or apart, and the cam is connected to the chassis to move the first and second clamping assemblies closer together or apart.

2. The semiconductor component testing mechanism according to claim 1, wherein: The vertical linkage mechanism includes a cam component provided on the transmission shaft and a first pulley provided on the movable frame and matched with the cam component. The outer contour of the cam component is provided with a protrusion corresponding to the gripping mechanism in the ascending state.

3. The semiconductor component testing mechanism according to claim 1, wherein: The opening and closing control mechanism includes a cylindrical cam mechanism, which includes a cylindrical cam member arranged on a transmission shaft and a second pulley connected to the connecting rod mechanism. A guide groove is provided on the outer periphery of the cylindrical cam member, and the guide groove is provided with a driving part corresponding to the clamping state of the clamping mechanism and a reset part corresponding to the open state of the clamping mechanism. The second pulley extends into the guide groove and works with the drive of the cylindrical cam member.

4. The semiconductor component testing mechanism according to claim 2, wherein: The connecting rod mechanism includes a transmission connecting rod with a middle portion rotatably connected to the movable frame, one end of the transmission connecting rod is transmission-connected to the first clamping assembly, the other end of the transmission connecting rod is transmission-connected to the second clamping assembly, and the first clamping assembly is transmission-connected to the opening and closing control mechanism.

5. The semiconductor component testing mechanism according to claim 4, wherein: The first clamping and grabbing assembly includes a first connecting seat, a first connecting arm and two first grabbing arms, one end of the first connecting arm is connected to the first connecting seat, and the two first grabbing arms are arranged at the other end of the first connecting arm; the second clamping and grabbing assembly includes a second connecting seat, a second connecting arm and two second grabbing arms, one end of the second connecting arm is connected to the second connecting seat, and the two second grabbing arms are arranged at the other end of the second connecting arm; the first connecting seat and the second connecting seat are arranged on the same longitudinal slide rail assembly, the two ends of the transmission connecting rod are respectively rotatably connected to the first connecting seat and the second connecting seat, and the first connecting arm and the second connecting arm are arranged on the same straight line.

6. The semiconductor component testing mechanism according to claim 1, wherein: A fixed plate is provided above the lifting plate, and a fixed frequency pull rod mechanism is provided on the fixed plate for limiting the downward pressure of the pressure rod assembly. The fixed frequency pull rod mechanism includes a pull plate support, a pull plate that can move up and down relative to the pull plate support, a turning block fixedly connected to the pull plate, and a pull rod drive motor provided beside the pull plate support; a fixed frequency cam is provided on the output end of the pull rod drive motor, and a follower wheel is provided on the turning block, and the follower wheel presses against the side of the fixed frequency cam to realize transmission; the pull plate is used to limit the descent of the two guide blocks.

7. The semiconductor component testing mechanism according to claim 6, wherein: Each group of the grasping mechanism includes a first suction component and a second suction component arranged in parallel, each group of the receiving area is provided with 4 positioning seats, the performance testing station is provided with two of the testers, and the clamping device is provided with 4 clamping stations. Each tester is used to test the semiconductor components on the two clamping stations in turn.

8. The semiconductor component testing mechanism according to claim 7, wherein: A loading station is provided upstream of the handover station, and a loading device is provided at the loading station; the first driving device includes a first cam divider and a first driving motor that is transmission-connected to the first cam divider; the second driving device includes a second cam divider and a second driving motor that is transmission-connected to the second cam divider, and the indexing stationary time length of the second cam divider is greater than the indexing stationary time length of the first cam divider.

9. A testing process based on the semiconductor component testing mechanism according to claim 8, characterized in that: The main turntable and the lifting plate perform cyclic motion according to the following action sequence: T1: the lifting plate rises; T2: the main turntable rotates at an indexing rate; T3: the lifting plate descends; T4: the main turntable stops at an indexing rate; The auxiliary disk only rotates in a circular indexing manner; one receiving area of the auxiliary disk is set as the first receiving area, the receiving area before the first receiving area is set as the second receiving area, and the four positioning seats in the first receiving area are the first positioning seat, the second positioning seat, the third positioning seat, and the fourth positioning seat in sequence, with the first positioning seat being closest to the positioning correction device and the fourth positioning seat being farthest from the positioning correction device; one of the testers is set as the first tester, and the other tester is set as the second tester; The testing process includes the following steps: S01: The first driving device drives the lifting plate to descend, and the gripping mechanism located at the loading station grips the semiconductor component on the loading device. The gripping mechanism is set as the first gripping mechanism, and the gripping mechanism before the first gripping mechanism is set as the second gripping mechanism. The first suction component and the second suction component on the first gripping mechanism each pick up a semiconductor component; S02: The first drive device drives the lifting plate to rise, and then the main turntable indexes and rotates. The second gripping mechanism rotates to the loading station. The first drive device drives the lifting plate to descend, and the second gripping mechanism grabs the semiconductor component on the loading device. The first suction component and the second suction component on the second gripping mechanism each grab a semiconductor component. S03: After the first driving device drives the main turntable and the lifting plate to perform several cycles, the semiconductor components on the first grasping mechanism are first adjusted in position by the positioning and correction device, and then the semiconductor components on the second grasping mechanism are adjusted in position by the positioning and correction device; S04: The first drive device drives the main turntable to rotate indexingly, causing the first gripping mechanism to enter the handover station. The first receiving area on the sub-disk is located at the handover station. The first gripping mechanism is located directly above the first and second positioning seats. The fixed-frequency pull rod mechanism limits the movement of the pressure rod assembly. When the lifting plate descends, the pressure rod assembly on the lifting plate remains stationary. The semiconductor components on the first gripping mechanism maintain their original height and are away from the first and second positioning seats. Then the main turntable enters the indexing static state. S05: The first receiving area of the sub-disc is located at the handover station and is in an indexing static state. The first driving device drives the lifting disk to rise, and then the main turntable indexes and rotates. The first gripping mechanism rotates to directly above the third and fourth positioning seats. At the same time, the second gripping mechanism rotates to directly above the first and second positioning seats. The fixed-frequency pull rod mechanism releases the restriction on the pressure rod assembly. Then the first driving device drives the lifting disk to descend. The pressure rod assembly on the lifting disk presses down to drive the first gripping mechanism and the second gripping mechanism on the main turntable to descend at the same time. The semiconductor components of the first gripping mechanism are transferred to the third and fourth positioning seats, and the semiconductor components of the second gripping mechanism are transferred to the first and second positioning seats. S06: The first gripping mechanism and the second gripping mechanism release the semiconductor component; then the second driving device drives the secondary tray to rotate indexingly, and the receiving area of the secondary tray enters the handover station. The semiconductor components that have completed the performance test are placed on the four positioning seats on the receiving area of the secondary tray. Then, the first gripping mechanism and the second gripping mechanism respectively grasp the semiconductor components that have completed the performance test; S07: The second driving device drives the sub-disk to rotate in an indexing manner, so that the semiconductor components on the first positioning seat, the second positioning seat, the third positioning seat and the fourth positioning seat are rotated to the first clamping station, the second clamping station, the third clamping station and the fourth clamping station on the clamping device respectively, and then the sub-disk is in an indexing static state, the clamping device clamps the semiconductor components, and then the first tester performs a performance test on the semiconductor components on the first clamping station, and the second tester performs a performance test on the semiconductor components on the second clamping station at the same time; when the semiconductor components on the first clamping station and the second clamping station are tested, the first tester performs a performance test on the semiconductor components on the third clamping station, and the second tester performs a performance test on the semiconductor components on the fourth clamping station at the same time; when all semiconductor components on the first receiving area are tested, the second driving device drives the sub-disk to rotate in an indexing manner.

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