A process step end point detection method and semiconductor process apparatus

Abstract

The embodiment of the present application provides a process step endpoint detection method and a semiconductor process equipment, the method comprises the following steps: in the process of executing a process step, obtaining an executed process time and an expected process time of the process step; according to the expected process time and the executed process time, calculating a delay end detection time of the process step; according to the delay end detection time, triggering a first timing monitor to start timing monitoring, and triggering a skip processing for the process step when the timing time of the first timing monitor reaches the delay end detection time. The flexible variation of the process step endpoint time can be realized according to the expected process time set by the user, and the actual execution time of the process step can meet the expected process time of the user; when the timing time of the timing monitor reaches the delay end detection time, the skip can be automatically executed, and the button of manual end detection does not need to be manually triggered, so that the automation is higher.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor process, in particular to a process step endpoint detection method and a semiconductor process equipment. BACKGROUND

[0002] In the process of etching process step, the current manual endpoint detection method is to provide a manual operation endpoint detection button for user in software interface, user can click this button at any time during the process step running, so that the process will end the current process step and enter the next step execution.

[0003] The use scenarios of this scheme mainly have two kinds, one is when the machine is in local mode, the user will click the manual operation endpoint detection button in the software interface to end the current step immediately when the endpoint detection software of the end point detector (EPD, which detects the most appropriate endpoint of etching by using the change of light intensity of specific wavelength from the beginning to the end of etching) captures the etching endpoint; the second is that user cannot accurately predict the etching time when editing process recipe, at this time, the step etching time will be set longer, and the user will click the manual endpoint detection button to end the current step at any time according to the process execution effect during the actual process execution.

[0004] The existing manual endpoint detection technology has simple design and single application scenario, only one manual operation endpoint detection button is opened for user to execute manual endpoint detection operation, and the manual endpoint detection function lacks intelligence. Due to the complex and diverse etching machine types and process types, the existing manual endpoint detection function cannot meet the special process of user. SUMMARY

[0005] In view of the above problems, the embodiments of the present application are proposed to provide a process step endpoint detection method and a corresponding semiconductor process equipment which can overcome the above problems or at least partially solve the above problems.

[0006] In order to solve the above problems, the embodiments of the present application disclose a process step endpoint detection method, comprising:

[0007] In the process of executing a process step, an executed process time and an expected process time for the process step are acquired;

[0008] According to the expected process time and the executed process time, a delay endpoint detection time of the process step is calculated;

[0009] According to the delay endpoint detection time, a first timing monitor is triggered to start timing monitoring, and when the timing time of the first timing monitor reaches the delay endpoint detection time, a skip step processing for the process step is triggered.

[0010] Optionally, the method further comprises:

[0011] acquiring a recipe setup time of completing the plurality of process steps;

[0012] the calculating the delay final check time of the process step according to the expected process time and the executed process time comprises:

[0013] judging whether the expected process time is less than or equal to the recipe setup time and greater than or equal to the executed process time;

[0014] when the expected process time is less than or equal to the recipe setup time and greater than or equal to the executed process time, calculating the delay final check time of the process step according to the expected process time and the executed process time.

[0015] Optionally, the method further comprises:

[0016] if the expected process time is less than the executed process time, issuing an alarm to remind that the expected process time is unreasonable.

[0017] Optionally, the method further comprises:

[0018] if the expected process time is greater than the recipe setup time, issuing an alarm to remind that the expected process time is unreasonable.

[0019] Optionally, the calculating the delay final check time of the process step according to the expected process time and the executed process time comprises:

[0020] subtracting the executed process time from the expected process time to obtain the delay final check time.

[0021] Optionally, after the calculating the delay final check time of the current process step according to the expected process time and the executed process time, the method further comprises:

[0022] zero processing the expected process time according to the delay final check time.

[0023] Optionally, the method further comprises:

[0024] when the process step starts, starting a second timing monitor, the second timing monitor being used for timing the process step and monitoring an abnormal process state, a process execution delay time, and an abnormal state duration of the process step;

[0025] when the process step ends, closing the second timing monitor.

[0026] Optionally, the method further comprises:

[0027] In the process of executing the process step, whether the process step needs to shorten the process time is judged based on the monitored spectrum curve and etching effect of the wafer;

[0028] When the process step needs to shorten the process time, the expected process time is set.

[0029] Optionally, applied to the lower machine, the method further comprises:

[0030] After the lower machine is started, the preset code module is loaded in sequence; the preset code module comprises a final inspection module and a timing monitoring module; the timing monitoring module is used for triggering the first timing monitor to start timing monitoring;

[0031] Before loading the timing monitoring module, the logic channel of the final inspection module which is not dynamically generated is assigned as a string variable indicating a preset path, so that the timing monitoring module is loaded based on the logic channel assigned as the preset string variable;

[0032] When the preset code module is loaded, the logic channel of the final inspection module is generated according to the preset string variable, so as to execute the instruction of jumping out of the process step through the logic channel of the final inspection module.

[0033] Embodiments of the present application also disclose a semiconductor process equipment, which comprises:

[0034] The controller is used for acquiring an executed process time and an expected process time of the process step in the process of executing the process step; calculating a delay final inspection time of the process step according to the expected process time and the executed process time; triggering a first timing monitor to start timing monitoring according to the delay final inspection time, and triggering a skip processing for the process step when the timing time of the first timing monitor reaches the delay final inspection time.

[0035] Optionally, the controller is further used for acquiring a recipe setting time of completing a plurality of process steps; judging whether the expected process time is less than or equal to the recipe setting time and greater than or equal to the executed process time; when the expected process time is less than or equal to the recipe setting time and greater than or equal to the executed process time, calculating the delay final inspection time of the process step according to the expected process time and the executed process time.

[0036] Optionally, the controller is further used for issuing an alarm to remind that the expected process time is unreasonable if the expected process time is less than the executed process time.

[0037] Optionally, the controller is further configured to issue an alarm to remind that the expected process time is unreasonable if the expected process time is greater than the recipe setting time.

[0038] Optionally, the controller is configured to subtract the executed process time from the expected process time to obtain the delay end-of-line time.

[0039] Optionally, after the delay end-of-line time of the current process step is calculated according to the expected process time and the executed process time, the controller is further configured to reset the expected process time according to the delay end-of-line time.

[0040] Optionally, the controller is further configured to start a second timing monitor when the process step starts, the second timing monitor being configured to time the process step and monitor abnormal process state, process execution delay time and abnormal state duration of the process step, and the second timing monitor being closed when the process step ends.

[0041] Optionally, the controller is further configured to determine whether the process time of the process step needs to be shortened based on the monitored spectrum curve and etching effect of the wafer during execution of the process step, and set the expected process time when the process time of the process step needs to be shortened.

[0042] Optionally, the controller applied to the lower computer is further configured to load preset code modules in sequence after the lower computer is started, the preset code modules including an end-of-line module and a timing monitoring module, the timing monitoring module being configured to trigger the first timing monitor to start timing monitoring, and the logic channel of the end-of-line module not dynamically generated being assigned to a string variable indicating a preset path before the timing monitoring module is loaded, so that the timing monitoring module is loaded based on the logic channel assigned to the preset string variable, and the logic channel of the end-of-line module being generated according to the preset string variable after the preset code modules are loaded, so that the end-of-line module is used to execute the instruction of jumping out of the process step.

[0043] Embodiments of the present application have the following advantages:

[0044] In the embodiment of the present application, during the execution of a process step, the executed process time and the expected process time for the process step are obtained; according to the expected process time and the executed process time, the delay end check time of the process step is calculated; according to the delay end check time, the first time monitoring device is triggered to start time monitoring, and when the time of the first time monitoring device reaches the delay end check time, the skip processing for the process step is triggered, so that the flexible variation of the process step end time can be realized according to the expected process time set by the user, and the actual execution time of the process step can meet the expected process time of the user; the present application can enable the user to flexibly set the expected process time on the software operation interface, and when the time of the time monitoring device reaches the end delay time, the skip function can be automatically executed, without the need of manually triggering the button of the manual end check, and the automation is improved. BRIEF DESCRIPTION OF DRAWINGS

[0045] Figure 1 is a step flow chart of a process step end detection method provided by the embodiment of the present application;

[0046] Figure 2 is a schematic diagram of a delay end check scheme for realizing the expected process time provided by the embodiment of the present application;

[0047] Figure 3 is a flow chart of a process step execution time scheme provided by the embodiment of the present application;

[0048] Figure 4 is a structural block diagram of a semiconductor process equipment provided by the embodiment of the present application. DETAILED DESCRIPTION

[0049] In order to make the above-mentioned objects, features and advantages of the present application more apparent and easy to understand, the present application will be further described in detail below with reference to the drawings and specific embodiments.

[0050] The existing manual endpoint detection scheme is that the process engineer pre-edits the EPD configuration file that needs to collect spectral data in the recipe setting. The EPD configuration file is a file that pre-sets the spectral parameter collection in the EPD endpoint detection software, mainly including setting the monitoring element spectrum line and wavelength, setting the data collection interval time and spectral collection intensity, setting the filtering method and endpoint judgment method, etc. Then, according to different process types, the endpoint detection mode (EndMode) is selected to wait for the endpoint signal. Then, the process is executed and the process monitor (Monitor) and step timer are started, the EPD software collects spectral data and waits for the process endpoint condition, and the operator will receive the endpoint signal in the EPD software Local mode to execute manual process step abortion. If it is judged that the process step is manually aborted by the user, the control software flow will skip the execution of the current step and enter the next process step, otherwise the process monitor and step timer will be stopped after the current entire process step time is executed, and the process step is normally ended.

[0051] The existing manual endpoint detection function of the etching machine only provides a button for manually skipping step execution in the software interface, and the function design is single and lacks intelligence. With the continuous development and progress of etching process, this manual endpoint detection scheme relying on customer experience cannot meet the process requirements of some infrared etching machines. Therefore, it is necessary to develop a more intelligent manual endpoint detection scheme. Therefore, it is necessary to develop a more intelligent manual endpoint detection scheme.

[0052] Through the analysis of the user's needs, it is found that the user needs the machine to have the function of manually detecting the endpoint by predicting the etching time. For example, when the infrared etching machine is performing wafer etching process, it can monitor the etching of the wafer in real time through the camera installed in the etching chamber, and can collect spectral data in real time through the endpoint detection detection software. When the user observes that the etching curve of the wafer reaches a certain etching peak, the process etching time needs to be adjusted, and the existing manual operation endpoint detection function and the function of grabbing the endpoint of the optical emission spectrometer (OES) cannot meet the needs.

[0053] Because the existing OES grabbed endpoint spectral curve has a delay, and the wafer includes multiple layers of materials, the accuracy requirement for etching is high, the user will observe the etching effect of the actual wafer during etching to ensure that it will not be over-etched. Therefore, a control scheme is needed to develop a user-modified desired etching process time to delay the execution of manual endpoint detection to meet the accuracy requirements of some military product etching machines for wafer topography effect.

[0054] One of the core ideas of the embodiment of the present application is to provide a process step endpoint detection method, which can enable a user to change the desired process time flexibly according to the observed process, and the lower computer can calculate the delay endpoint detection time according to the changed desired process time, and trigger the monitor to count the delay endpoint detection time of the process step, and automatically execute the skip step function when the counting time reaches the delay endpoint detection time.

[0055] The embodiment of the present application takes the etching process step as an example for illustration, but the present application is not limited thereto, for example, it can be a process gas input and chamber pressure control process step, a load radio frequency power ignition process step, a desorption wafer process step, a blowing process step (for blowing helium gas back to the wafer for detecting whether the wafer is stuck), a deposition process step, etc., and the present application can support the prediction of the desired process execution time in each process step, which is not limited in the embodiment of the present application.

[0056] Referring to Figure 1 , a step flow chart of a process step endpoint detection method provided by the embodiment of the present application is shown, which can specifically include the following steps:

[0057] Step 101, in the process of executing a process step, the executed process time and the desired process time for the process step are acquired.

[0058] As an example, as Figure 2 shown, a pre-judgment desired process time implementation delay endpoint detection scheme diagram provided by the embodiment of the present application is shown, which is realized by the cooperation of the acquisition module, the monitoring module, the upper computer and the lower computer to realize the delay endpoint detection skip step. In the process of the etching process step, the acquisition module can acquire the spectrum curve of the wafer etching in real time through the endpoint detector software, the monitoring module can monitor the wafer etching morphology image in real time through the camera in the process chamber, and the user can predict the execution time of the current process step according to the observed spectrum curve of the wafer wafer etching morphology image. The upper computer can provide an operation button capable of setting the desired process time to the user, and the user can input the desired process time of the current process step in the upper computer interface. The upper computer can set the desired process time according to the desired process time input by the user and deliver it to the lower computer.

[0059] As an example, the upper computer can transmit the desired process time parameter to the lower computer through the TCP / IP network port communication mode.

[0060] In the embodiment of the present application, a function class (the class name can be defined as EndStepDelayTimeSetter) for predicting the expected execution time of a process step can be added to the lower machine software, a service (call_SetExpectStepTime) for setting the user's expected process time is encapsulated in the class, and a plurality of readable and writable pointer type member variables can be defined for obtaining some key time parameters in the process step. The pointer type is a data type commonly used in software programming, and by defining the pointer type member variable, the relevant time parameter values of the current process step execution can be obtained in real time in the code control flow. For example, a recipe setting time parameter (m_pSetStepTime) is set, which is the total time of all process steps; an executed process time parameter (m_pElapsedStepTime) is set, which is the time of the current process step that has been executed; a delay final inspection time parameter (m_pManualDelayTime) is set, which is the time that the current process step needs to delay the final inspection; and an expected process time parameter (m_pExpectStepTime) is set, which is the expected process step execution time set by the user after prediction.

[0061] As an example, the interface and button of the service call can be added to the software interface of the upper machine for setting the expected process time on the software interface of the upper machine.

[0062] In an embodiment of the present application, during the execution of the process step, whether the process step needs to shorten the process time is judged based on the monitored spectrum curve and the etching effect of the wafer; and when the process step needs to shorten the process time, the expected process time is set.

[0063] As an example, a relatively long expected step time can be set in advance and the spectrum curve of the wafer etching and the wafer etching topography image captured in real time are monitored in real time, the etching rate of the current process step is determined according to the spectrum curve of the wafer etching and the wafer etching topography image captured in real time, and if the etching rate is fast, the execution of the current process step needs to be ended in advance, and the expected process time can be modified again.

[0064] In an embodiment of the present application, when the process step starts, a second timing monitor is started, which is used for timing the process step and monitoring the abnormal process state, process execution delay time and abnormal state duration of the process step; and when the process step ends, the second timing monitor is closed.

[0065] As an example, the timing monitoring of the process step can be implemented by a second timing monitor, which can be started and stopped in units of process steps. When the process step starts, the second timing monitor is triggered to open, and when the process step ends, the second timing monitor is triggered to close.

[0066] As an example, at the start of the process step, the second timing monitor can start monitoring the inspection items to monitor the abnormal process state during the process step, the process execution delay time, and the abnormal state duration. For example, if the gas flow during the process step exceeds the preset range, the abnormal process state condition is triggered, and the duration of the gas flow abnormality is monitored. For example, at the start of the process step, the corresponding software has been opened, and due to the response of the hardware, there is a certain time delay in the timely start of the process execution, and it is necessary to monitor how long the delay is after the start of the process step.

[0067] Step 102, according to the expected process time and the executed process time, calculating the delay final inspection time of the process step.

[0068] As an example, as shown in the figure, the delay final inspection scheme provided by the embodiment of the present application is a schematic diagram for realizing the delay final inspection of the expected process time. The lower machine can calculate the delay final inspection time according to the obtained expected process time and the executed process time, and obtain the current remaining etching time after the expected process time is set. Figure 2

[0069] In an embodiment of the present application, the delay final inspection time of the process step is calculated according to the expected process time and the executed process time, including: subtracting the executed process time from the expected process time to obtain the delay final inspection time.

[0070] In an embodiment of the present application, the recipe setting time of completing a plurality of process steps is obtained; and the delay final inspection time of the process step is calculated according to the expected process time and the executed process time, including: judging whether the expected process time is less than or equal to the recipe setting time and greater than or equal to the executed process time; and when the expected process time is less than or equal to the recipe setting time and greater than or equal to the executed process time, the delay final inspection time of the process step is calculated according to the expected process time and the executed process time.

[0071] As an example, the wafer can include a plurality of process steps during the process, and the user can input the recipe setting time of completing a plurality of process steps in advance in the recipe editing interface of the upper machine.

[0072] ​In the embodiment of the present application, whether the expected process time meets the preset condition can be determined according to the obtained expected process time. If the expected process time meets the preset condition, it indicates that the expected process time set by the user is reasonable.

[0073] In the case of meeting the preset condition, the delay final inspection time of the process step is calculated according to the expected process time and the executed process time.

[0074] For example, when the lower machine obtains the expected process time set by the user, whether the expected process time set by the user is less than or equal to the recipe setting time and greater than or equal to the executed process time can be determined. In the case of whether the expected process time is less than or equal to the recipe setting time and greater than or equal to the executed process time, the manual final inspection process time that needs to be delayed can be calculated according to the expected process time and the executed process time.

[0075] In an embodiment of the present application, if the expected process time is less than the executed process time, an alarm is issued to remind that the expected process time is unreasonable.

[0076] For example, the process time of the etching process step is 100 seconds, the executed process time is 50 seconds, and the user sets the expected process time of the etching process step as 20 seconds. Therefore, the setting of the expected process time is unreasonable, and an alarm can be issued to remind the user that the setting of the expected process time is unreasonable.

[0077] In an embodiment of the present application, if the expected process time is greater than the recipe setting time, an alarm is issued to remind that the expected process time is unreasonable.

[0078] For example, the recipe setting time set by the user in advance in the recipe editing interface is 200 seconds. During the process of the etching process step, the user sets the expected process time as 300 seconds. Therefore, the etching equipment cannot complete all the process steps, and the setting of the expected process time is unreasonable. An alarm can be issued to remind the user that the setting of the expected process time is unreasonable.

[0079] As an example, the lower machine can check the expected process time parameter passed by the upper machine before executing the service of setting the expected process time (call_SetExpectStepTime). The checking condition is as follows:

[0080] a. When the expected process time in the process step is less than the executed process time, the lower machine control software throws an alarm to prompt that the parameter is unreasonable.

[0081] b. When the expected process time in the process step is greater than the recipe setting time set in advance, the lower machine control software throws an alarm to prompt that the parameter is unreasonable.

[0082] Step 103, according to the delay end inspection time, triggering the first timing monitor to start timing monitoring, and when the timing time of the first timing monitor reaches the delay end inspection time, triggering the skip processing for the process step.

[0083] Exemplarily, when the delay end inspection time is calculated, the first timing monitor can be started, the first timing monitor starts timing when the delay end inspection time changes, and the lower machine control software can issue a command to stop the current process step until the timing time of the first timing monitor reaches the delay end inspection time, ending the execution of the current process step and immediately jumping to the next process step.

[0084] As an example, the timing monitoring of the delay end inspection can be monitored at the beginning of the process step, without setting the delay monitoring time, so as to meet the prediction of the process time and the setting of the expected step time at any time in the process step. After the user sets the expected process time, the monitoring condition of the delay end inspection is triggered, the first timing monitor is started, the original execution end inspection action is delayed according to the calculated delay end inspection time, and after the process of the delay end inspection time is executed, the current process step is jumped out.

[0085] The timing monitoring scheme of the embodiment of the application can support multiple settings of the expected process time, and has high flexibility. For example, the user sets the first expected step time and finds that the etching effect of the wafer is poor and the etching time must be increased before the corresponding delay end inspection time is reached, and then the new expected process time can be set again in the software interface. The first timing monitor can calculate the new delay end inspection time according to the new expected process time and the executed process time, and execute the end inspection and skip when the timing time of the first timing monitor reaches the new delay end inspection time.

[0086] In an embodiment of the application, after the lower machine is started, the preset code module is loaded in sequence; the preset code module includes an end inspection module and a timing monitoring module; the timing monitoring module is used to trigger the first timing monitor to start timing monitoring; before the timing monitoring module is loaded, the logic channel of the end inspection module which is not dynamically generated is assigned to a string variable indicating a preset path, so that the timing monitoring module is loaded based on the logic channel assigned to the preset string variable; when the preset code module is loaded, the logic channel of the end inspection module is generated according to the preset string variable, so as to execute the instruction of jumping out of the process step through the logic channel of the end inspection module.

[0087] As an example, the timing monitoring part of the first timing monitor of the present application can be implemented by a configuration file. The start of the lower machine software is completed by different code modules in a certain order and steps, and after the start of the lower machine, the preset code modules can be loaded in sequence. The preset code modules can include a final inspection module and a timing monitoring module, and the timing monitoring module is generated before the final inspection module (ManualEndStep). When the timing monitoring module is generated, the logical channel resource of the final inspection module (ManualEndStep) needs to be used, at this time, the lower machine has not dynamically created the logical channel of the final inspection module (ManualEndStep), and the start of the lower machine software fails.

[0088] As an example, the logical channel of the final inspection module which is not dynamically generated can be assigned to a string variable indicating a preset path before the timing monitoring module is loaded. For example, the ManualEndStepActuator class (final inspection actuator class) is designed to set the value of the logical channel of the final inspection module (ManualEndStep) which is not dynamically generated, and the SetManualEndStepActuatorCh method is defined. The logical channel of the final inspection module (ManualEndStep) which is not dynamically generated can be assigned to a string variable indicating a preset path by the SetManualEndStepActuatorCh function, so that the timing monitoring module is loaded based on the logical channel assigned to the preset string variable. In this way, the lower machine does not access the logical channel of the final inspection module (ManualEndStep) which is not dynamically generated when starting, and the problem of software start failure caused by failure to access the logical channel which is not dynamically generated is avoided.

[0089] Since the logical channel of the final inspection module (ManualEndStep) is the actuator channel of the execution of the delay final inspection step of the present scheme, it must be created. Therefore, the timing of creating the logical channel of the final inspection module (ManualEndStep) can be delayed to the end of the lower machine software start process by accessing the string variable after the software starts, so as to avoid the problem of logical confusion caused by different start orders of the software code modules.

[0090] As an example, when the preset code modules are loaded, the logical channel of the final inspection module can be generated according to the preset string variable, so as to execute the instruction of sending the step out of the process through the logical channel of the final inspection module.

[0091] In an embodiment of the present application, after the delay final inspection time of the current process step is calculated according to the expected process time and the executed process time, the expected process time is further processed to zero according to the delay final inspection time.

[0092] Exemplarily, the expected process time can be reset to zero after the lower computer calculates the delay end inspection time, so as to ensure the timing accuracy of the first timing monitor each time a new expected step time is set.

[0093] For example, a user performs an etching process step with a time of 200 seconds, and when the etching process step runs to 15 seconds, the user sets the expected process time of the etching process step to 20 seconds in the software interface of the upper computer. At this time, the lower computer control software immediately resets the set expected process time to zero, and the first timing monitor starts timing the remaining 5 seconds from 0. When the 5-second time is timed, the lower computer control software can issue a command to jump out of the current step to realize delay end inspection step jumping. If the user modifies the set expected process time 20 seconds to 40 seconds again, the lower computer control software resets the set expected process time to zero again, and then the first timing monitor re-timings the remaining etching process time, so as to ensure the timing accuracy of each delay end inspection step jumping.

[0094] As an example, as shown in Figure 3 Fig. 1 is a flowchart of a process step execution time prediction scheme provided by an embodiment of the present application.

[0095] S301, start.

[0096] S302, a user edits a process recipe, selects an EPD configuration file containing spectrum collection parameters and an endpoint mode, and then performs a process.

[0097] As an example, a user can pre-edit an EPD configuration file in EPD endpoint detection software, for example, selects an element spectrum line and a wavelength range to be collected according to the actual wafer etching material, and sets a filtering method and an endpoint judgment method; selects the edited EPD configuration file and endpoint detection mode in the etching machine recipe editing interface, and then issues a process task to perform a process according to the recipe setting.

[0098] S303, the lower computer software starts collecting process data, and the second timing monitor starts.

[0099] As an example, the lower computer can start performing a process according to a process recipe, and control the second monitoring timer to turn on. The second monitoring timer can include a monitor and a timer.

[0100] S304, collect spectrum data and real-time monitor and shoot wafer etching morphology images.

[0101] As an example, the endpoint detector can start collecting spectrum data according to the configuration parameters of the EPD configuration file; at the same time, a camera in the etching machine process chamber starts real-time monitoring and shooting wafer etching morphology images.

[0102] S305, the user predicts the remaining etching time, and sets the desired process time.

[0103] As an example, when the EPD software spectrum curve changes at a certain moment of the process step execution (for example, a certain etching curve peak value appears), the user predicts the desired process time for the current process step to achieve the target etching effect in combination with the observed spectrum curve and wafer etching morphology image, and sets the desired process time through the operation button on the host computer interface.

[0104] For example, the user can first set a longer desired step time and continuously track the observation curve and take photos of the effect. If the etching rate is faster and the current step needs to be ended in advance, the user can modify the desired step time again.

[0105] S306, determine whether the desired process time is greater than or equal to the executed process time and less than or equal to the recipe setting time.

[0106] As an example, when the lower computer receives the desired process time sent by the upper computer, the desired process time can be checked for parameter legality.

[0107] S307, if the desired process time is less than the executed process time or greater than the recipe setting time, an alarm is thrown to prompt the user that the desired process time setting is unreasonable.

[0108] S308, if the desired process time is greater than or equal to the executed process time and less than or equal to the recipe setting time, calculate the remaining etching time.

[0109] S309, reset the desired process time to zero.

[0110] As an example, if the set desired process time meets the legality check, the lower computer software can calculate the remaining etching time, and reset the trigger time of the desired step time monitoring event to zero to ensure the accuracy of the first timer monitor.

[0111] S310, start the first timer monitor for timing monitoring.

[0112] As an example, when the remaining etching time is calculated, the lower computer starts the timer monitoring mechanism of the delay time, and accurately counts the remaining etching time.

[0113] S311, when the calculated remaining time is executed, the lower computer issues a command to stop the process step.

[0114] As an example, when the timing time reaches the delay end check time, the lower machine issues a command to jump out of the current step by executing the delay end check executor, ends the execution of the current process step and immediately jumps to the next process step for execution, so as to ensure that the actual execution time of the process step meets the expected step time set by the user, and to achieve the purpose of pre-judging the step time and performing the delay end check.

[0115] The next process step can be a deposition step, or a new etching using another process gas and ignition power, or wafer desorption, and the like. Those skilled in the art can determine the next process step according to the actual process requirement, and the embodiments of the present application are not limited herein.

[0116] S312, the second timing monitor stops timing monitoring and updates the actual process step time.

[0117] S313, end.

[0118] In the embodiments of the present application, during the execution of a process step, the executed process time and the expected process time for the process step are obtained; the delay end check time of the process step is calculated according to the expected process time and the executed process time; the first timing monitor is triggered to start timing monitoring according to the delay end check time, and when the timing time of the first timing monitor reaches the delay end check time, the step jump processing for the process step is triggered, so that the flexible variation of the process step end time can be realized according to the expected process time set by the user, and the actual execution time of the process step can meet the expected process time of the user; the user can flexibly set the expected process time on the software operation interface, and when the timing time of the timing monitor reaches the end delay time, the step jump function can be automatically executed without manually triggering the manual end check button, which is more automatic.

[0119] It should be noted that, for the method embodiments, in order to simply describe, they are all described as a series of action combinations, but those skilled in the art should know that the embodiments of the present application are not limited to the action sequence described, because according to the embodiments of the present application, certain steps can be performed in other sequences or simultaneously. Secondly, those skilled in the art should know that the embodiments described in the specification all belong to preferred embodiments, and the actions involved are not necessarily necessary for the embodiments of the present application.

[0120] Referring to Figure 4 , a structural block diagram of a semiconductor process equipment provided by the embodiments of the present application is shown, the semiconductor process equipment 401 can include:

[0121] The controller 4011 is configured to acquire an executed process time and an expected process time of a process step during execution of the process step, calculate a delay end-of-test time of the process step according to the expected process time and the executed process time, trigger a first timing monitor to start timing monitoring according to the delay end-of-test time, and trigger a skip process for the process step when a timing time of the first timing monitor reaches the delay end-of-test time.

[0122] In an optional embodiment, the controller is further configured to acquire a recipe setup time of completing the plurality of process steps, determine whether the expected process time is less than or equal to the recipe setup time and greater than or equal to the executed process time, and calculate the delay end-of-test time of the process step according to the expected process time and the executed process time when the expected process time is less than or equal to the recipe setup time and greater than or equal to the executed process time.

[0123] In an optional embodiment, the controller is further configured to issue an alarm to remind that the expected process time is unreasonable when the expected process time is less than the executed process time.

[0124] In an optional embodiment, the controller is further configured to issue an alarm to remind that the expected process time is unreasonable when the expected process time is greater than the recipe setup time.

[0125] In an optional embodiment, the controller is configured to subtract the executed process time from the expected process time to obtain the delay end-of-test time.

[0126] In an optional embodiment, after the delay end-of-test time of the current process step is calculated according to the expected process time and the executed process time, the controller is further configured to reset the expected process time according to the delay end-of-test time.

[0127] In an optional embodiment, the controller is further configured to start a second timing monitor when the process step starts, the second timing monitor being configured to time the process step and monitor an abnormal process state, a process execution delay time, and an abnormal state duration of the process step, and close the second timing monitor when the process step ends.

[0128] In an optional embodiment, the controller is further configured to acquire a spectrum curve and an etching effect of a wafer during execution of a process step, determine whether the process step needs to shorten a process time based on the spectrum curve and the etching effect, and set the expected process time when the process step needs to shorten the process time.

[0129] In an alternative embodiment, applied to the lower computer, the controller is further configured to sequentially load preset code modules after the lower computer is started; the preset code modules include a final inspection module and a timing monitoring module; the timing monitoring module is configured to trigger the first timing monitor to start timing monitoring; before the timing monitoring module is loaded, a logical channel of the final inspection module that is not dynamically generated is assigned a string variable indicating a preset path, so that the timing monitoring module is loaded based on the logical channel assigned the preset string variable; and after the preset code modules are loaded, a logical channel of the final inspection module is generated according to the preset string variable, so that an instruction for jumping out of the process step is executed through the logical channel of the final inspection module.

[0130] For the device embodiment, since it is basically similar to the method embodiment, the description is relatively simple, and the relevant parts are described in the part of the method embodiment.

[0131] Each embodiment in the specification is described in a progressive manner, and each embodiment focuses on the difference from other embodiments. The same and similar parts between the embodiments can be referred to each other.

[0132] Those skilled in the art should understand that the embodiments of the embodiments of the present application can be provided as a method, device, or computer program product. Therefore, the embodiments of the present application can be in the form of a complete hardware embodiment, a complete software embodiment, or an embodiment combining software and hardware aspects. Moreover, the embodiments of the present application can be in the form of a computer program product implemented on one or more computer usable storage media (including but not limited to magnetic disk storage, CD-ROM, optical storage, etc.) containing computer usable program code.

[0133] The embodiments of the present application are described with reference to flowcharts and / or block diagrams according to the method, terminal device (system), and computer program product of the embodiments of the present application. It should be understood that each flow and / or block in the flowchart and / or block diagram, and the combination of the flows and / or blocks in the flowchart and / or block diagram can be implemented by computer program instructions. These computer program instructions can be provided to a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing terminal device to produce a machine, so that the instructions executed by the computer or other programmable data processing terminal device produce a device that implements the functions specified in the flowchart and / or block diagram. Figure 1 The functions specified in one flow or multiple flows and / or blocks Figure 1 The device that implements the functions specified in one flow or multiple flows and / or blocks.

[0134] These computer program instructions can also be stored in a computer- readable memory that can direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the computer-readable memory produce an article of manufacture including instructions which implement the flow Figure 1 one or more flow or block Figure 1 one or more blocks or blocks specified in the flow.

[0135] These computer program instructions can also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the flow Figure 1 one or more flow or block Figure 1 one or more blocks or blocks specified in the flow.

[0136] Although preferred embodiments of the present application have been described, those skilled in the art will be able to make additional modifications and variations to these embodiments without departing from the scope of the present application. Accordingly, the appended claims are intended to encompass all such modifications and variations as falling within the scope of the present application.

[0137] Finally, it should be noted that, in this document, the terms "first", "second", and the like, merely denote different categories, and do not necessarily imply or require any actual relationship or order between such entities or operations. Also, the terms "comprises", "comprising", or any other variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus. An element proceeded by "comprises... a" does not, without more constraints, exclude the presence of additional identical elements in the process, method, article, or apparatus that includes the element.

[0138] The process endpoint detection method and the semiconductor processing equipment provided by the present application are described in detail above, and the principles and implementation manners of the present application are described by using specific examples in this document. The above description of the embodiments is only used to help understand the method of the present application and its core idea; meanwhile, for those skilled in the art, according to the idea of the present application, the specific implementation manners and application ranges can be changed, and the above description of the present application should not be understood as a limitation.

Claims

1. A method for detecting the endpoint of a process step, characterized in that, include: During the execution of the process steps, the executed process time and the expected process time for the process steps are obtained; Calculate the delayed final inspection time of the process step based on the expected process time and the executed process time; Based on the delayed final inspection time, the first timing monitor is triggered to start timing monitoring, and when the timing time of the first timing monitor reaches the delayed final inspection time, a skip step processing for the process step is triggered; The step of calculating the delayed final inspection time of the process step based on the expected process time and the already executed process time includes: The delayed final inspection time is obtained by subtracting the already executed process time from the expected process time.

2. The method according to claim 1, characterized in that, The method further includes: Obtain the formula setting time for completing multiple of the aforementioned process steps; The step of calculating the delayed final inspection time of the process step based on the expected process time and the already executed process time includes: Determine whether the expected process time is less than or equal to the formula setting time and greater than or equal to the already executed process time; When the expected process time is less than or equal to the formula setting time and greater than or equal to the executed process time, the delayed final inspection time of the process step is calculated based on the expected process time and the executed process time.

3. The method according to claim 2, characterized in that, Also includes: If the expected process time is less than the already executed process time, an alarm is issued to indicate that the expected process time is unreasonable.

4. The method according to claim 2, characterized in that, Also includes: If the expected process time is longer than the time set in the formula, an alarm will be issued to remind that the expected process time is unreasonable.

5. The method according to claim 1, characterized in that, After calculating the delayed final inspection time of the current process step based on the expected process time and the already executed process time, the method further includes: Based on the delayed final inspection time, the expected process time is reset to zero.

6. The method according to claim 1, characterized in that, Also includes: When the process step begins, a second timing monitor is activated. The second timing monitor is used to time the process step and monitor the abnormal process state, process execution delay time, and abnormal state duration of the process step. When the process step is completed, the second timing monitor is turned off.

7. The method according to claim 1, characterized in that, Also includes: During the execution of the process steps, based on the monitored spectral curves and the etching effect of the wafer, it is determined whether the process time needs to be shortened for the process steps. When the process step requires a shorter process time, the desired process time is set.

8. The method according to claim 1, characterized in that, Applied to a lower-level machine, the method further includes: After the lower-level machine starts up, a preset code module is loaded sequentially; the preset code module includes a final inspection module and a timing monitoring module; the timing monitoring module is used to trigger the first timing monitor to start timing monitoring; Before loading the timing monitoring module, the logical channel of the final inspection module that is not dynamically generated is assigned a string variable indicating a preset path, so that the timing monitoring module is loaded based on the logical channel assigned the preset string variable; Once the preset code module is loaded, a logical channel for the final inspection module is generated based on the preset string variable, so as to execute and send an instruction to skip the process step through the logical channel of the final inspection module.

9. A semiconductor process apparatus, characterized in that, The semiconductor process equipment includes: The controller is configured to, during the execution of a process step, acquire the executed process time and the expected process time for the process step; calculate the delayed final inspection time for the process step based on the expected process time and the executed process time; trigger a first timing monitor to start timing monitoring based on the delayed final inspection time, and trigger a skip process for the process step when the timing time of the first timing monitor reaches the delayed final inspection time; and subtract the executed process time from the expected process time to obtain the delayed final inspection time.

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