LED chip rapid detection system

Abstract

The application provides a kind of LED chip rapid detection system, the core component is column conductive module, column conductive module is transversely arranged in the surface of the LED chip array to be measured, the cylindrical axis of column conductive module is parallel to the LED chip array to be measured, so that the curved surface of column conductive module directly contacts with a plurality of LEDs arranged in a linear manner on the surface of the LED chip array to be measured, and in the detection process, column conductive module rolls relative to the LED chip array in the direction perpendicular to the cylindrical axis of column conductive module and keeps in contact with the LED chip array to be measured, without frequent vertical movement, which can effectively improve the detection speed.

Description

Technical Field

[0001] This invention belongs to the field of LED chip testing technology, and in particular to a rapid LED chip testing system, especially a rapid testing method and system for Micro-LED chips. Background Technology

[0002] With the continuous development of LED technology, numerous cutting-edge display technologies have emerged. To ensure the yield of finished devices, the quality of LED chips must meet standards. Therefore, LED chips must be inspected before being transferred to devices. Currently, most inspection methods are probe testing, which involves contact. However, probe testing requires contact with the LED electrodes, potentially causing some damage. As LED chip sizes shrink, the number of LED chips required for a single display increases daily, and probe testing efficiency cannot meet the demands of high-volume LED chip inspection. For example, an 8K TV requires approximately 90 million Micro-LED chips. Even with a defect rate of 0.5%, inspecting nearly 500,000 chips would require a significant amount of time. To improve probe testing efficiency, sampling inspection is often the only option, but for such a large number of LED chips, the reliability of sampling inspection is often unsatisfactory. Therefore, improving existing LED inspection technologies is essential. Summary of the Invention

[0003] To address the shortcomings and deficiencies of existing technologies, particularly the low testing efficiency of LED chips, especially highly integrated Micro-LED chips, this invention proposes a rapid LED chip testing system. Its core component is a cylindrical conductive module, which is horizontally placed on the surface of the LED chip array under test. The cylindrical axis of the conductive module is parallel to the LED chip array, allowing the curved surface of the conductive module to directly contact a number of LEDs arranged in a straight line on the surface of the array. During testing, the conductive module rolls relative to the LED chip array along a direction perpendicular to its cylindrical axis, maintaining continuous contact with the array. This eliminates the need for frequent vertical movements, effectively improving testing speed.

[0004] The present invention specifically adopts the following technical solution:

[0005] A rapid testing system for LED chips, characterized in that:

[0006] An electric field is applied to the LED chip array under test through a columnar conductive module;

[0007] The cylindrical conductive module is placed horizontally on the surface of the LED chip array under test. The cylindrical axis of the cylindrical conductive module is parallel to the LED chip array under test, so that the curved surface of the cylindrical conductive module is in direct contact with a number of LEDs arranged in a straight line on the surface of the LED chip array under test.

[0008] During the testing process, the cylindrical conductive module rolls relative to the LED chip array along a direction perpendicular to the cylindrical axis of the cylindrical conductive module and maintains continuous contact with the LED chip array under test; this eliminates the need for frequent vertical movement and effectively improves the testing speed.

[0009] The system includes: a first substrate, a first conductive layer disposed on the first substrate, a columnar conductive module, a displacement module, an optical signal measurement module, an electrical signal measurement module, and a power supply module;

[0010] The first substrate is used to place the LED chip array under test;

[0011] The power supply module applies an electrical signal between the first conductive layer and the columnar conductive module, causing multiple LEDs arranged in a straight line and in contact with the columnar conductive module to produce electroluminescence.

[0012] Driven by the displacement module, the columnar conductive module contacts the LED chip array under test and directly contacts any one of the linear LED chip arrays.

[0013] The optical signal measurement module is used to collect optical information, including brightness and luminous flux, of the LED chip under test;

[0014] The electrical signal measurement module is used to collect electrical information, including current and voltage, from the LED chip under test;

[0015] The rapid testing steps for its LED chip array are as follows:

[0016] Step S1: Place the LED chip array to be tested on the surface of the first substrate;

[0017] Step S2: Driven by the displacement module, the columnar conductive module contacts the LED chip array under test, directly contacting any one of the linear LED chip arrays;

[0018] Step S3: The power supply module applies an electrical signal between the first conductive layer and the columnar conductive module to cause multiple LEDs arranged in a straight line in contact with the columnar conductive module to produce electroluminescence. The light signal measurement module records the light emission information of the detected LED chip, and the electrical signal measurement module records the electrical signal of the detected LED chip.

[0019] Step S4: The displacement module causes the cylindrical conductive module to roll relative to the LED chip array along the direction perpendicular to the cylindrical axis of the cylindrical conductive module, so that the cylindrical axis of the cylindrical conductive module is aligned with another linear LED chip array adjacent to the linear LED chip array that has been tested in step S3. The light signal measurement module records the light emission information of the detected LED chip, and the electrical signal measurement module records the electrical signal of the detected LED chip.

[0020] Step S5: Repeat steps S3 and S4 until all LED chips on the plane that rolls perpendicular to the cylindrical axis of the cylindrical conductive module have been detected.

[0021] Step S6: The displacement module drives the cylindrical conductive module and the LED chip array, causing the cylindrical conductive module to move to another undetected area on the surface of the LED chip array;

[0022] Step S7: Repeat steps S5 and S6 until all LED chips on the LED chip array surface have been detected.

[0023] Furthermore, the curved surface of the cylindrical conductive module is covered with a functional layer for transporting charge carriers or generating induced charges in the LED chip that is in contact with the cylindrical conductive module.

[0024] Furthermore, the distance between the two equivalent circular bottom surfaces of the cylindrical conductive module ranges from 1μm to 50cm; the diameter of the circular cross-section of the cylindrical conductive module ranges from 1μm to 50cm.

[0025] Furthermore, the displacement module enables the cylindrical conductive module to selectively roll or move in three-dimensional space.

[0026] Furthermore, the electrical signal applied by the power supply module between the first conductive layer and the columnar conductive module is an alternating voltage.

[0027] Furthermore, the first conductive layer is disposed on the upper or lower surface of the first substrate.

[0028] Furthermore, the LED chip array under test is an LED epitaxial wafer forming a light-emitting array, an LED chip array disposed on a substrate, or an LED chip array disposed on a driving backplane.

[0029] Furthermore, the LED chip array under test is placed on the upper surface of the first substrate, and the columnar conductive module is placed on top of the LED chip array.

[0030] Furthermore, the LED chip array under test is placed on the lower surface of the first substrate, and the columnar conductive module is placed below the LED chip array.

[0031] Furthermore, after the columnar conductive module has finished detecting a number of LEDs arranged in a straight line, the power supply module can continue to supply power until all the LED chips to be tested on the LED chip array surface have been detected; the power supply module can also interrupt the power supply after the columnar conductive module has finished detecting a number of LEDs arranged in a straight line, and resume the power supply after the columnar conductive module rolls to another undetected area.

[0032] The present invention and its preferred embodiment achieve efficient detection of LED chips by having a columnar conductive module, driven by a displacement module, directly contact a plurality of LEDs arranged in a straight line on the surface of the LED chip array to be tested. Attached Figure Description

[0033] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments:

[0034] Figure 1 This is a schematic diagram of the overall structure of an embodiment of the present invention; it shows that the LED chip rapid testing system includes: a first substrate, a first conductive layer disposed on the upper surface of the first substrate, a columnar conductive module, a displacement module, an optical signal measurement module, an electrical signal measurement module, and a power supply module. The first conductive layer may also be disposed on the lower surface of the first substrate to enable the power supply module to establish an electrical connection with the LED chip array under test.

[0035] Figure 2 This is a schematic diagram of the working state of an embodiment of the present invention. Figure 1 This indicates that the LED chip array to be tested is located on the upper surface of the first conductive layer, and the cylindrical conductive module is placed horizontally on the LED chip array to be tested. The cylindrical axis of the cylindrical conductive module is parallel to the LED chip array to be tested, so that the curved surface of the cylindrical conductive module is in direct contact with a certain number of LEDs arranged in a straight line on the LED chip array to be tested.

[0036] Figure 3 This is a schematic diagram of the working state of an embodiment of the present invention. Figure 2 This indicates that during the detection process, the cylindrical conductive module rolls relative to the LED chip array along a direction perpendicular to the cylindrical axis of the cylindrical conductive module, eliminating the need for frequent vertical movements and effectively improving the detection speed.

[0037] Figure 4 The distance L between the two equivalent circular base surfaces of the cylindrical conductive module ranges from 1μm to 50cm.

[0038] Figure 5 This indicates that the diameter D of the circular cross-section of the cylindrical conductive module ranges from 1μm to 50cm.

[0039] Figure 6 This is a schematic diagram of the working state of an embodiment of the present invention. Figure 3This indicates that the area covered by the plane that rolls perpendicular to the cylindrical axis of the cylindrical conductive module is smaller than the area of ​​the LED chip array under test.

[0040] Figure 7 This is a three-dimensional schematic diagram of an embodiment of the present invention; it shows that the displacement module is required to selectively directionally roll or move the cylindrical conductive module in three-dimensional space.

[0041] Figure 8 This is a schematic diagram of the overall structure of an embodiment of the present invention. Figure 2 This indicates that the electrical signal applied by the power supply module between the first conductive layer and the columnar conductive module is an alternating voltage.

[0042] Figures 9 to 11 This indicates that the tested LED chip array can be, but is not limited to, LED epitaxial wafers (such as...). Figure 9 (representation), an array of LED chips (such as) set on the surface of sapphire. Figure 13 (representation), LED chip arrays disposed on other transitional substrates (such as...) Figure 10 (representation), an LED chip array (such as) mounted on the driver backplane. Figure 11 express).

[0043] Figure 12 This indicates that the LED chip array being tested is placed on the upper surface of the first substrate, and the columnar conductive module is placed on top of the LED chip array.

[0044] Figure 13 This means that an LED chip array is placed on the surface of the first substrate.

[0045] Figure 14 This means that, driven by the displacement module, the columnar conductive module contacts the LED chip array under test, directly contacting any one of the linear LED chip arrays.

[0046] Figure 15 This means that the power supply module applies an electrical signal between the first conductive layer and the columnar conductive module, causing multiple LEDs arranged in a straight line and in contact with the columnar conductive module to produce electroluminescence. The light signal measurement module records the light emission information of the detected LED chip, and the electrical signal measurement module records the electrical signal of the detected LED chip.

[0047] Figure 16 This means that the displacement module causes the cylindrical conductive module to roll relative to the LED chip array along a direction perpendicular to the cylindrical axis of the cylindrical conductive module, thereby aligning the cylindrical axis of the cylindrical conductive module with the LED chip array. Figure 15 In the steps described above, the linear LED chip array that has been tested is adjacent to another linear LED chip array. The optical signal measurement module records the light emission information of the tested LED chip, and the electrical signal measurement module records the electrical signal of the tested LED chip.

[0048] Figure 17 Indicates repetition Figure 15 , Figure 16 The described steps continue until all LED chips on the plane that rolls perpendicular to the cylindrical axis of the cylindrical conductive module have been detected.

[0049] Figure 18 This means that the displacement module drives the cylindrical conductive module and the LED chip array, causing the cylindrical conductive module to move to another undetected area on the surface of the LED chip array.

[0050] Figure 19 Indicates repetition Figure 17 , Figure 18 The described steps continue until all LED chips on the surface of the LED chip array have been inspected.

[0051] Figure 20 This indicates that the curved surface of the cylindrical conductive module can cover a functional layer, which can be a conductive material, a semiconductor material, or an insulating material.

[0052] Figure 21 This indicates that the first conductive layer can also be disposed on the lower surface of the first substrate.

[0053] Figure 22 This indicates that the LED chip array being tested can be placed on the lower surface of the first substrate, with the cylindrical conductive module positioned below the LED chip array. The cylindrical conductive module should move with the LED chip array, ensuring contact between the cylindrical conductive module and the LED chips on the surface of the LED chip array.

[0054] Figure 23 This indicates that the plane covering the area of ​​the LED chip array under test is larger than the area of ​​the cylindrical conductive module that rolls perpendicular to the 400 cylindrical axis. This ensures that all LEDs on the surface of the LED chip array under test will exhibit electroluminescence or hyperluminescence after one roll of the cylindrical conductive module. However, this results in higher power consumption and places more stringent demands on the equipment. Detailed Implementation

[0055] To make the features and advantages of this patent more apparent and understandable, specific embodiments are provided below for detailed explanation:

[0056] To enable those skilled in the art to further understand the method proposed in this invention, specific embodiments are described below. The preferred embodiments provided are for further illustrative purposes only and should not be considered as limiting the scope of the invention to the embodiments described herein, nor should they be construed as restricting the scope of protection of this invention. Non-essential improvements and adjustments made to this invention by those skilled in the art based on the above description are still within the scope of protection of this invention.

[0057] It should be noted that the following detailed descriptions are exemplary and intended to provide further explanation of this application. Unless otherwise specified, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0058] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0059] In a first embodiment of the present invention, the LED chip rapid detection system includes: a first substrate 300, a first conductive layer 200 disposed on the upper surface of the first substrate, a cylindrical conductive module 400, a displacement module 500, an optical signal measurement module 800, an electrical signal measurement module 600, and a power supply module 700 (e.g., ...). Figure 1 (As shown). The first conductive layer 200 can also be disposed on the lower surface of the first substrate 300 to enable the power supply module 700 to establish an electrical connection with the LED chip array 100 under test (e.g.). Figure 21 (As shown). In this embodiment, the first conductive layer is preferably disposed on the upper surface of the first substrate.

[0060] The LED chip array 100 to be tested is located on the upper surface of the first conductive layer 200. A cylindrical conductive module 400 is horizontally placed on the LED chip array 100, with its cylindrical axis parallel to the LED chip array 100, allowing the curved surface of the cylindrical conductive module 400 to directly contact one of the multiple LEDs arranged in a straight line on the LED chip array 100 (e.g.,...). Figure 2 As shown). During the detection process, the cylindrical conductive module 400 rolls relative to the LED chip array 100 along a direction perpendicular to its cylindrical axis, eliminating the need for frequent vertical movements and effectively improving the detection speed (e.g.). Figure 3 As shown). The distance L between the two equivalent circular base surfaces of the cylindrical conductive module 400 is 100 μm (as shown). Figure 4 As shown). The diameter D of the circular cross-section of the cylindrical conductive module 400 is 10 μm (as shown). Figure 5 (As shown).

[0061] The area covered by the plane that rolls perpendicular to the cylindrical axis of the cylindrical conductive module 400 is smaller than the area of ​​the LED chip array 100 under test (e.g., Figure 6 (As shown).

[0062] The displacement module 500 is required to be able to selectively directionally roll or move the cylindrical conductive module 400 in three-dimensional space (e.g., ...). Figure 7 (As shown).

[0063] The electrical signal applied by the power supply module 700 between the first conductive layer 200 and the pillar-shaped conductive module 400 is an alternating voltage (e.g., Figure 8 (As shown).

[0064] The tested LED chip array can be, but is not limited to, LED epitaxial wafers 900 (e.g., Figure 9 As shown), an LED chip array 100 disposed on the surface of sapphire (e.g. Figure 13 As shown), an LED chip array disposed on other transitional substrates 1000 (such as... Figure 10 As shown), an LED chip array (such as) is disposed on the driver backplane 1100. Figure 11 (As shown). In this embodiment, the LED chip array 100 is preferably disposed on the surface of sapphire.

[0065] The LED chip array being tested is placed on the upper surface of the first conductive layer 200, at which point the columnar conductive module 400 is placed on top of the LED chip array (e.g., Figure 12 (As shown).

[0066] An LED chip array is placed on the surface of a first substrate. In the figure, 100 represents the LED chip array, 200 represents the first conductive layer, and 300 represents the first substrate (e.g., ...). Figure 13 (As shown).

[0067] Driven by the displacement module 500, the columnar conductive module 400 contacts the LED chip array 100 under test, directly contacting any linear LED chip array (e.g., ...). Figure 14 (As shown).

[0068] The power supply module 700 applies an electrical signal between the first conductive layer 200 and the columnar conductive module 400, causing multiple LEDs arranged in a straight line and in contact with the columnar conductive module 400 to produce electroluminescence. The light signal measurement module 800 records the light emission information of the detected LED chip, and the electrical signal measurement module 600 records the electrical signal of the detected LED chip (e.g., ...). Figure 15 (As shown).

[0069] The displacement module 500 causes the cylindrical conductive module 400 to roll relative to the LED chip array 100 along a direction perpendicular to its cylindrical axis, thereby aligning the cylindrical axis of the cylindrical conductive module 400 with the LED chip array 100. Figure 15In the described steps, for the linear LED chip array that has already been tested, another linear LED chip array adjacent to it, the optical signal measurement module 800 records the light emission information of the tested LED chip, and the electrical signal measurement module 600 records the electrical signal of the tested LED chip (such as...). Figure 16 (As shown).

[0070] repeat Figure 15 , Figure 16 The described steps continue until all LED chips on the plane rolling perpendicular to the cylindrical axis of the cylindrical conductive module 400 have been detected (e.g. Figure 17 (As shown).

[0071] Displacement module 500 drives columnar conductive module 400 and LED chip array 100, causing columnar conductive module 400 to move to another undetected area on the surface of LED chip array (e.g., Figure 18 (As shown).

[0072] repeat Figure 17 , Figure 18 The described steps continue until all LED chips on the surface of the LED chip array have been detected (e.g., Figure 19 (As shown).

[0073] In the second embodiment of the present invention, the curved surface of the cylindrical conductive module 400 can be covered with a functional layer, which can be a conductive material, a semiconductor material, or an insulating material. 401 in the figure represents the functional layer. The functional layer needs to function as a carrier transporter or to induce charges in the LED chip that is in contact with the cylindrical conductive module (e.g., ...). Figure 20 (As shown).

[0074] In the third embodiment of the present invention, the detected LED chip array can be placed on the lower surface of the first substrate 300, at which time the columnar conductive module 400 is placed below the LED chip array. The columnar conductive module should move with the LED chip array, and it is necessary to ensure that the columnar conductive module is in contact with the LED chips on the surface of the LED chip array (e.g., Figure 22 (As shown).

[0075] In the fourth embodiment of the present invention, the plane covering the area of ​​the rolling motion perpendicular to the cylindrical axis of the cylindrical conductive module 400 is larger than the area of ​​the LED chip array 100 under test. This ensures that all LEDs on the surface of the LED chip array under test will exhibit electroluminescence or hyperluminescence after one rolling motion of the cylindrical conductive module. However, the power generated is greater, placing more stringent requirements on the equipment (e.g., ...). Figure 23 (As shown).

[0076] The preferred embodiments of the present invention have been described in detail above. However, the present invention is not limited to the specific details of the above embodiments. Within the scope of the technical concept of the present invention, various equivalent transformations (such as quantity, shape, position, etc.) can be made to the technical solution of the present invention, and these equivalent transformations all fall within the protection scope of the present invention.

[0077] The above descriptions of the embodiments are merely illustrative of the methods and core ideas of the present invention. Furthermore, the above are only preferred embodiments of the present invention and are not intended to limit the invention in any other way. Any person skilled in the art may make changes or modifications to the disclosed technical content to create equivalent embodiments. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present invention without departing from the scope of the present invention's technical solution shall still fall within the protection scope of the present invention.

Claims

1. A LED chip rapid detection system, characterized in that: an electric field is applied to a LED chip array to be detected by a cylindrical conductive module; the cylindrical conductive module is horizontally placed on the surface of the LED chip array to be detected, and the cylindrical axis of the cylindrical conductive module is parallel to the LED chip array to be detected, so that the curved surface of the cylindrical conductive module directly contacts a plurality of LEDs arranged in a straight line on the surface of the LED chip array to be detected; during the detection, the cylindrical conductive module rolls relative to the LED chip array in a direction perpendicular to the cylindrical axis of the cylindrical conductive module and keeps in contact with the LED chip array to be detected; the curved surface of the cylindrical conductive module is covered with a functional layer for transmitting carriers or generating induced charges in the LED chips in contact with the cylindrical conductive module; the system comprises a first substrate, a first conductive layer arranged on the first substrate, a cylindrical conductive module, a displacement module, a light signal measurement module, an electric signal measurement module and a power supply module; the electric signal applied between the first conductive layer and the cylindrical conductive module by the power supply module is an alternating voltage; the first substrate is used for placing the LED chip array to be detected; the electric signal applied between the first conductive layer and the cylindrical conductive module by the power supply module causes the plurality of LEDs arranged in a straight line and in contact with the cylindrical conductive module to generate electroluminescence; the cylindrical conductive module is driven by the displacement module to contact the LED chip array to be detected and directly contact any linear LED chip array; the light signal measurement module is used for collecting light information of the LED chip to be detected, including brightness and luminous flux; the electric signal measurement module is used for collecting electric information of the LED chip to be detected, including current and voltage; the rapid detection steps of the LED chip array are as follows: step S1: placing the LED chip array to be detected on the surface of the first substrate; step S2: driving the cylindrical conductive module by the displacement module to contact the LED chip array to be detected and directly contact any linear LED chip array; step S3: applying an electric signal between the first conductive layer and the cylindrical conductive module by the power supply module to cause the plurality of LEDs arranged in a straight line and in contact with the cylindrical conductive module to generate electroluminescence, recording the light emission information of the detected LED chip by the light signal measurement module, and recording the electric signal of the detected LED chip by the electric signal measurement module; step S4: rolling the cylindrical conductive module relative to the LED chip array in a direction perpendicular to the cylindrical axis of the cylindrical conductive module by the displacement module, aligning the cylindrical axis of the cylindrical conductive module with another linear LED chip array adjacent to the linear LED chip array that has completed the test in step S3, recording the light emission information of the detected LED chip by the light signal measurement module, and recording the electric signal of the detected LED chip by the electric signal measurement module; step S5: repeating step S3 and step S4 until all the LED chips on the plane rolling in the direction perpendicular to the cylindrical axis of the cylindrical conductive module are detected; and step S6: driving the cylindrical conductive module and the LED chip array by the displacement module to move the cylindrical conductive module to another undetected area on the surface of the LED chip array. ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ Step S7: repeating step S5 and step S6 until all LED chips on the LED chip array surface are detected.

2. The LED chip rapid detection system of claim 1, wherein: The distance between the two equivalent circular bottom surfaces of the columnar conductive module is in the range of 1 μm-50 cm; the diameter of the cross-section circle of the columnar conductive module is in the range of 1 μm-50 cm.

3. The LED chip rapid detection system of claim 1, wherein: The displacement module enables the columnar conductive module to selectively roll or move in three-dimensional space.

4. The LED chip rapid detection system of claim 1, wherein: The first conductive layer is arranged on the upper surface or lower surface of the first substrate.

5. The LED chip rapid detection system of claim 1, wherein: The LED chip array to be detected is an LED epitaxial wafer forming a light-emitting array, an LED chip array arranged on a substrate base, or an LED chip array arranged on a driving backplane.

6. The LED chip rapid detection system of claim 1, wherein: The LED chip array to be detected is arranged on the upper surface of the first substrate, and the columnar conductive module is arranged above the LED chip array.

7. The LED chip rapid detection system of claim 1, wherein: The LED chip array to be detected is arranged on the lower surface of the first substrate, and the columnar conductive module is arranged below the LED chip array.

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