A graphene-aluminum composite heat sink for high-power integrated circuits and its fabrication method

Abstract

This invention discloses a graphene-aluminum composite heat sink for high-power integrated circuits and its fabrication method. The method includes an aluminum film mold, inside which a graphene film is disposed. The graphene film has lateral and longitudinal heat dissipation channels. A second graphene film is disposed on the first graphene film, and an aluminum film frame is disposed outside the second graphene film. The second graphene film has heat conduction channels. In this invention, by combining graphene material with traditional aluminum alloy material, the extremely high thermal conductivity and thermal emissivity of graphene, together with the aluminum structure, form a unique and highly efficient heat conduction channel on a macroscopic scale.

Description

Technical Field

[0001] This invention relates to the field of heat sink technology, and in particular to a graphene-aluminum composite heat sink for high-power integrated circuits and its preparation method. Background Technology

[0002] The operating temperature of critical equipment and chips has a significant impact on their performance. To quickly transfer heat from components to the external environment, heat sinks have become an indispensable component in integrated circuits and heat treatment equipment. Due to aluminum's high heat capacity, good thermal conductivity, and strong heat exchange capacity, aluminum heat sinks are currently the most common. However, with the continuous development of electronic information technology, the power consumption of integrated circuits is becoming increasingly high. To improve heat dissipation, the common methods are to increase the heat dissipation area (increasing the number of heat sinks, increasing the size of the fins) or to increase the convective heat dissipation with air (using more powerful fans to increase airflow speed, etc.). These two methods not only increase the overall cost of the device but also make the overall size and weight of the device larger, which goes against the current trend of lightweight circuit development. Therefore, there is an urgent market demand for a heat sink that is small in size, lightweight, and has better heat dissipation performance for the current component cooling. To this end, this invention proposes a graphene-aluminum composite heat sink for high-power integrated circuits and its preparation method. Summary of the Invention

[0003] The purpose of this invention is to provide a graphene-aluminum composite heat sink for high-power integrated circuits and its preparation method in order to solve the above-mentioned problems.

[0004] To achieve the above objectives, the present invention adopts the following technical solution:

[0005] A graphene-aluminum composite heat sink for high-power integrated circuits and its preparation method are disclosed. The heat sink includes an aluminum film mold, a graphene film disposed inside the aluminum film mold, a transverse heat dissipation channel and a longitudinal heat dissipation channel disposed on the graphene film, a second graphene film disposed on the graphene film, an aluminum film frame disposed outside the second graphene film, and a heat conduction channel disposed on the second graphene film.

[0006] Preferably, both the graphene film and the second graphene film are provided with circular holes.

[0007] Preferably, the graphene film has a lateral thermal conductivity of 1500 W / mK and a longitudinal thermal conductivity of 20 W / mK.

[0008] A method for fabricating a graphene-aluminum composite heat sink for high-power integrated circuits includes the following steps:

[0009] S1. Cut the graphene sheet into graphene film II with a specification of 190mm*14mm*0.5mm, and punch holes in the graphene film II to obtain round holes with a radius of 1mm.

[0010] S2. Then, the graphene film is embedded in a 200mm*15mm*1mm aluminum frame and subjected to preliminary air compression under an air compressor at d=1mm and 100MPa to obtain the initial assembled fins.

[0011] S3. Cut the graphene film into square graphene film sheets of 198mm*198mm, and punch holes in the graphene film sheets to obtain round holes of the same specifications as in S1.

[0012] S4. Embed the graphene film into an aluminum mold measuring 200mm*200mm*2mm;

[0013] S5. Cover with a 200mm*200mm*1.5mm aluminum mold, and then embed a layer of graphene sheet from step three;

[0014] S6. Cover with the upper substrate to complete the assembly of the graphene-aluminum composite heat sink.

[0015] In summary, due to the adoption of the above technical solution, the beneficial effects of the present invention are:

[0016] 1. In this application, the graphene-aluminum composite heat sink has a good heat dissipation effect, which is nearly 10°C higher than the traditional heat sink under the same conditions. Even when the traditional heat sink is combined with a fan for strong convection, it is still 1.88°C higher than the composite heat sink, which greatly improves the heat dissipation efficiency of the heat sink.

[0017] 2. In this application, the number of fins in the traditional heat sink exceeds that of the graphene-aluminum composite heat sink by 16. The composite heat sink achieves better heat dissipation performance with fewer heat dissipation fins.

[0018] 3. The heat conduction channels built using aluminum-graphene in the composite heat sink can conduct heat efficiently and quickly transfer heat from the heat source to the air, reducing the need for auxiliary fans and simplifying the construction of the heat dissipation system. At the same time, it has a lighter weight and smaller size, meeting the market demand for heat sinks with small size, low weight and high thermal conductivity. Attached Figure Description

[0019] Figure 1 A three-dimensional structural schematic diagram of a graphene-aluminum composite heat sink for a high-power integrated circuit and its fabrication method provided according to an embodiment of the present invention is shown.

[0020] Figure 2The diagram shows a front cross-sectional view of a graphene-aluminum composite heat sink for a high-power integrated circuit and its fabrication method according to an embodiment of the present invention.

[0021] Figure 3 A schematic diagram of the graphene film structure is shown in the graphene-aluminum composite heat sink and its preparation method for a high-power integrated circuit according to an embodiment of the present invention.

[0022] Figure 4 A schematic diagram of the graphene film structure of a graphene-aluminum composite heat sink for a high-power integrated circuit and its preparation method provided by an embodiment of the present invention is shown.

[0023] Figure 5 The diagram shows a comparative test of a graphene-aluminum composite heat sink for a high-power integrated circuit and its preparation method, provided by an embodiment of the present invention.

[0024] Legend:

[0025] 1. Aluminum film mold; 2. Aluminum film frame; 3. Graphene film; 4. Graphene film II; 5. Round hole; 6. Heat conduction channel. Detailed Implementation

[0026] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0027] Please see Figure 1-5 The present invention provides a technical solution:

[0028] A graphene-aluminum composite heat sink for high-power integrated circuits and its preparation method are disclosed. The heat sink includes an aluminum film mold 1, a graphene film 3 disposed inside the aluminum film mold 1, a transverse heat dissipation channel 7 and a longitudinal heat dissipation channel 8 disposed on the graphene film 3, a second graphene film 4 disposed on the graphene film 3, an aluminum film frame shell 2 disposed outside the second graphene film 4, and a heat conduction channel 6 disposed on the second graphene film 4.

[0029] Specifically, such as Figure 3 and Figure 4 As shown, both graphene film 3 and graphene film 4 have circular holes 5.

[0030] Specifically, such as Figure 4 As shown, the transverse thermal conductivity of graphene film 3 is 1500 W / mK, and the longitudinal thermal conductivity of aluminum is 20 W / mK.

[0031] A method for fabricating a graphene-aluminum composite heat sink for high-power integrated circuits includes the following steps:

[0032] S1. Cut the graphene sheet into graphene film 4 with a specification of 190mm*14mm*0.5mm, and punch holes in the graphene film 4 to obtain circular holes 5 with a radius of 1mm.

[0033] S2. Then, the graphene film 24 is embedded in a 200mm*15mm*1mm aluminum frame and subjected to preliminary air compression under an air compressor at d=1mm and 100MPa to obtain the initial assembled fins.

[0034] S3. Cut the graphene film into square graphene film sheets 3 of 198mm*198mm, and punch holes in the graphene film sheets 3 to obtain round holes 5 of the same specifications as in S1.

[0035] S4. Embed the graphene film 3 into an aluminum mold with a diameter of 200mm*200mm*2mm;

[0036] S5. Cover with a 200mm*200mm*1.5mm aluminum mold, and then embed a layer of graphene sheet from step three;

[0037] S6. Cover with the upper base plate to complete the heat sink base assembly;

[0038] S7. Embed twenty-one graphene film heat dissipation fins on the heat sink base, then place the whole thing into the corresponding mold, and perform vacuum hot pressing at 670℃ and 20MPa. After cooling, the heat sink sample is obtained.

[0039] The heatsinks prepared in the above steps were tested under a 100W thermal power. The heat dissipation effect of the heatsinks was judged by measuring the stable temperature of the heat-generating components. Simultaneously, heat dissipation tests were conducted on commonly available aluminum-based heatsinks (200mm*200mm*24mm, 37 fins, 2mm fin thickness). (The aluminum-based heatsinks were tested under two conditions: forced air convection with a fan and natural convection without a fan; the composite heatsink was only tested under natural convection). The test results are shown in the figure below. Figure 5 .

[0040] Therefore, the final temperature of the aluminum-graphene composite heat sink is 34.19℃, compared to 36.07℃ for a traditional heat sink under strong convection conditions with a fan and 43.17℃ under natural convection conditions. By combining graphene with traditional aluminum alloy, the extremely high thermal conductivity and thermal emissivity of graphene, along with the aluminum structure, form a unique and highly efficient heat conduction channel on a macroscopic scale. This rapidly transfers heat from the heat source to the air. Heat sinks with this heat conduction structure do not increase the number of overall heat dissipation fins. Without increasing airflow without a fan, their heat dissipation effect is essentially the same as traditional heat sinks with fans. This fundamentally solves the problem of insufficient heat dissipation in traditional heat sinks, reduces the need for fan installation, and significantly reduces the overall size and weight of the device. It fully meets the current heat dissipation requirements of electronic components.

[0041] The above description of the embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A graphene-aluminum composite heat sink for high-power integrated circuits, comprising an aluminum film mold (1), characterized in that, The aluminum film mold (1) is provided with a graphene film (3) inside. The graphene film (3) is provided with a horizontal heat dissipation channel (7) and a vertical heat dissipation channel (8). The graphene film (3) is provided with a second graphene film (4). The graphene film (4) is provided with an aluminum film frame shell (2) outside. The graphene film (4) is provided with a heat conduction channel (6). Its preparation method includes the following steps: S1. Cut the graphene sheet into graphene film II (4) with a specification of 190mm*14mm*0.5mm, and punch holes in the graphene film II (4) to obtain round holes (5) with a radius of 1mm. S2. Then the graphene film (4) is embedded in a 200mm*15mm*1mm aluminum frame and subjected to initial air compression under the conditions of d=1mm and 100MPa to obtain the initial assembled fins. S3. Cut the graphene film into square graphene film sheets (3) of 198mm*198mm, and punch holes in the graphene film sheets (3) to obtain round holes (5) of the same specifications as in S1. S4. Embed the graphene film (3) into an aluminum mold with a diameter of 200mm*200mm*2mm; S5. Cover with a 200mm*200mm*1.5mm aluminum mold, and then embed a layer of graphene sheet from step three; S6. Cover with the upper base plate to complete the heat sink base assembly; S7. Embed twenty-one graphene film 2 (4) heat dissipation fins on the heat sink base, then put the whole into the corresponding mold, perform vacuum hot pressing at 670℃ and 20MPa, and obtain the heat sink sample after cooling.

2. The graphene-aluminum composite heat sink for high-power integrated circuits according to claim 1, characterized in that, Both the graphene film (3) and the graphene film (4) are provided with circular holes (5).

3. The graphene-aluminum composite heat sink for high-power integrated circuits according to claim 1, characterized in that, The graphene film (3) has a transverse thermal conductivity of 1500 W / mK and a longitudinal thermal conductivity of 20 W / mK.

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