Through-hole reflow soldering apparatus

Abstract

The application provides a through-hole reflow soldering device, which comprises a first furnace body with a first furnace cavity; a second furnace body which is arranged on the first furnace body in an openable and closable manner and has a second furnace cavity corresponding to the first furnace cavity; a soldering track which is arranged at an upper end opening of the first furnace cavity along an extension direction of the first furnace body, and when the second furnace body is closed on the first furnace body, a lower end opening of the second furnace cavity is located above the soldering track, and the soldering track has a carrier placement position; and a transverse heat insulation barrier which comprises a first heat insulation barrier arranged in the first furnace cavity and a second heat insulation barrier arranged in the second furnace cavity, the first heat insulation barrier divides the first furnace cavity into a plurality of first sub-furnace cavities along the extension direction of the first furnace cavity, and the second heat insulation barrier divides the second furnace cavity into a plurality of second sub-furnace cavities corresponding to the plurality of first sub-furnace cavities. Through the technical scheme, the problem of poor product compatibility of the through-hole reflow soldering device in the related art can be solved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of PCB reflow soldering, in particular to a through-hole reflow soldering device. BACKGROUND

[0002] Current electronic products are developing towards miniaturization, lightness and high density, and product structures with surface mount components (SMC) and surface mount devices (SMD) double-sided mounting or mixed mounting have appeared. The double-sided mounting or mixed mounting products are generally welded on the upper surface (component surface) by reflow soldering, and then welded on the lower surface (pin surface) by wave soldering. With the gradual rise of through-hole reflow soldering, THR (Through-hole Reflow) replaces the process of reflow soldering followed by wave soldering, and becomes an important process in the PCB mixed mounting technology due to its advantages such as firm solder joints and good heat dissipation.

[0003] In the related art, the through-hole reflow soldering device adopts a hot air pressure balance process to weld the PCB. Due to different materials, the thermal expansion coefficients and other thermal performance parameters of the products differ greatly.

[0004] However, in the related art, the through-hole reflow soldering device cannot match different furnace temperature curves for each furnace cavity when welding the PCB, resulting in poor product compatibility of the through-hole reflow soldering device in the related art. SUMMARY

[0005] The present application provides a through-hole reflow soldering device to solve the problem of poor product compatibility of the through-hole reflow soldering device in the related art.

[0006] The present application provides a through-hole reflow soldering device, which comprises: a first furnace body having a first furnace cavity; a second furnace body being openably and closably arranged on the first furnace body, the second furnace body having a second furnace cavity corresponding to the first furnace cavity; a welding track arranged at an upper end opening of the first furnace cavity along an extension direction of the first furnace body, when the second furnace body is closed on the first furnace body, a lower end opening of the second furnace cavity is located above the welding track, and the welding track has a carrier placement position; a transverse heat insulation barrier comprising a first heat insulation barrier arranged in the first furnace cavity and a second heat insulation barrier arranged in the second furnace cavity, the first heat insulation barrier divides the first furnace cavity into a plurality of first sub-furnace cavities along the extension direction of the first furnace cavity, and the second heat insulation barrier divides the second furnace cavity into a plurality of second sub-furnace cavities corresponding to the plurality of first sub-furnace cavities one by one.

[0007] Further, the through-hole reflow soldering device further comprises a longitudinal heat insulation barrier, the longitudinal heat insulation barrier comprises a heat insulation plate arranged on the welding track, one end of the heat insulation plate is connected with an outer side wall of the welding track, and the other end of the heat insulation plate extends to an inner wall of the first furnace body and is connected with the first furnace body.

[0008] Further, the first heat insulation barrier comprises a plurality of front-to-back extending lower wind baffles, the lower ends of the lower wind baffles are connected to the inner wall of the first furnace cavity, the upper ends of the lower wind baffles extend upward, the plurality of lower wind baffles are arranged in intervals along the extension direction of the first furnace cavity and divide the first furnace cavity into a plurality of first sub-furnace cavities; and / or, the second heat insulation barrier comprises a plurality of front-to-back extending upper wind baffles, the upper ends of the upper wind baffles are connected to the inner wall of the second furnace cavity, the lower ends of the upper wind baffles extend downward, the plurality of upper wind baffles are arranged in intervals along the extension direction of the second furnace cavity and divide the second furnace cavity into a plurality of second sub-furnace cavities.

[0009] Further, the lower end of the upper wind baffle is provided with a carrier gap corresponding to the carrier placement position.

[0010] Further, the inner bottom wall of the first sub-furnace cavity is provided with a first air inlet and a first air outlet communicating with the first sub-furnace cavity, the first air inlet is located directly below the welding track, and the projection of the first air outlet on the horizontal plane is located on the outer side of the welding track; and / or, the inner top wall of the second sub-furnace cavity is provided with a second air inlet and a second air outlet communicating with the second sub-furnace cavity, when the second furnace body is closed on the first furnace body, the second air inlet is located directly above the welding track, and the projection of the second air outlet on the horizontal plane is located on the outer side of the welding track.

[0011] Further, the first heat insulation barrier further comprises a plurality of lower air baffles extending along the length direction of the first furnace body, the lower ends of the lower air baffles are connected to the inner wall of the first furnace cavity, the upper ends of the lower air baffles extend upward, the front end and the rear end of the lower air baffle are connected to the adjacent two lower wind baffles respectively, and the lower air baffle is located between the first air inlet and the first air outlet; and / or, the second heat insulation barrier further comprises a plurality of upper air baffles extending along the length direction of the second furnace body, the upper ends of the upper air baffles are connected to the inner wall of the second furnace cavity, the lower ends of the upper air baffles extend downward, the front end and the rear end of the upper air baffle are connected to the adjacent two upper wind baffles respectively, and the upper air baffle is located between the second air inlet and the second air outlet.

[0012] Further, the through-hole reflow soldering equipment further comprises a plurality of air inlet tubes, the inner bottom wall of the first sub-furnace cavity is provided with a plurality of air inlet holes, and the lower ends of the plurality of air inlet tubes communicate with the plurality of air inlet holes one by one.

[0013] Further, the longitudinal heat insulation barrier further comprises a plurality of heat insulation carriers and a plurality of heat insulation small plates, the welding track is provided with a conveying belt, the conveying belt is movably arranged on the welding track along the extension direction of the welding track, the carrier placement position is arranged on the conveying belt, the plurality of heat insulation carriers are arranged in intervals on the carrier placement position along the extension direction of the welding track, and one heat insulation small plate is arranged between the adjacent two heat insulation carriers.

[0014] Further, the heat insulation carrier comprises a carrier base body, a carrier substrate and a bearing frame, the bearing frame is arranged at the edge of the carrier substrate and connected with the carrier substrate, the upper end of the bearing frame protrudes upward from the upper surface of the carrier substrate, the carrier substrate is provided with a ventilation hole, and the upper end of the bearing frame is provided with a jig mounting position; a sliding plate assembly is slidably arranged above the carrier substrate, the bearing frame is provided with a sliding plate passage for the sliding plate assembly, and the sliding plate assembly has a closed position for blocking the ventilation hole and an open position for avoiding the ventilation hole.

[0015] Further, the through-hole reflow soldering device further comprises a heat insulation carrier opening mechanism arranged at the entrance end of the soldering track and a heat insulation carrier closing mechanism arranged at the exit end of the soldering track; and / or the through-hole reflow soldering device further comprises a carrier opening detection member arranged at the entrance end of the soldering track and a carrier closing detection member arranged at the exit end of the soldering track.

[0016] Further, the through-hole reflow soldering device further comprises two baffle walls extending along the extension direction of the first furnace body, the two baffle walls are respectively arranged at the two sides of the extension direction of the first furnace cavity and outside the longitudinal heat insulation barrier, the lower end of the baffle wall is connected with the upper end of the first furnace body, and when the second furnace body is covered on the first furnace body, the upper end of the baffle wall abuts against the lower end of the second furnace body.

[0017] Further, the through-hole reflow soldering device further comprises: a plurality of first heating members, the plurality of first heating members are arranged in one-to-one correspondence with the plurality of first sub-furnace cavities; a plurality of second heating members, the plurality of second heating members are arranged in one-to-one correspondence with the plurality of second sub-furnace cavities; a plurality of first temperature measuring members, the plurality of first temperature measuring members are arranged in one-to-one correspondence in the plurality of first sub-furnace cavities; a plurality of second temperature measuring members, the plurality of second temperature measuring members are arranged in one-to-one correspondence in the plurality of second sub-furnace cavities; and a control member, the control member is electrically connected with the first heating member, the second heating member, the first temperature measuring member and the second temperature measuring member.

[0018] The technical scheme of the application is applied to the through-hole reflow soldering equipment, which comprises a first furnace body, a second furnace body, a soldering track and a transverse heat insulation barrier, in the process of reflow soldering by using the through-hole reflow soldering equipment, the second furnace body is covered on the first furnace body, the carrier carrying the product is placed on the carrier placing position, the carrier is moved along the soldering track to complete the soldering, the first furnace cavity is divided into a plurality of first sub-furnace cavities along the extension direction of the first furnace cavity by using the first heat insulation barrier, the second furnace cavity is divided into a plurality of second sub-furnace cavities along the extension direction of the second furnace cavity by using the second heat insulation barrier, the first heat insulation barrier is used for physically insulating between adjacent first sub-furnace cavities, the second heat insulation barrier is used for physically insulating between adjacent second sub-furnace cavities, the problem of serious heat leakage between adjacent first sub-furnace cavities is avoided, the problem of serious heat leakage between adjacent second sub-furnace cavities is avoided, and thus the temperature of the plurality of first sub-furnace cavities and the plurality of second sub-furnace cavities can be accurately controlled according to the required soldering furnace temperature curve of different products, and the product compatibility of the through-hole reflow soldering equipment is improved. BRIEF DESCRIPTION OF DRAWINGS

[0019] The drawings accompanying the specification of this application form a part thereof, serve to provide further understanding of the application, and together with the description of the exemplary embodiments of the application given below, make an explanation of the application complete, and do not constitute an improper limitation of the application. In the drawings:

[0020] Figure 1 A structure schematic view of the through-hole reflow soldering equipment provided by the embodiment of the application is shown;

[0021] Figure 2 A structure schematic view of the through-hole reflow soldering equipment provided by the embodiment of the application is shown; Figure 1 A partial enlarged view of A in FIG. 4 is shown;

[0022] Figure 3 A structure schematic view of the first furnace body of the through-hole reflow soldering equipment provided by the embodiment of the application is shown;

[0023] Figure 4 A structure schematic view of the through-hole reflow soldering equipment provided by the embodiment of the application is shown; Figure 3 A partial enlarged view of B in FIG. 5 is shown;

[0024] Figure 5 A structure schematic view of the through-hole reflow soldering equipment provided by the embodiment of the application is shown;

[0025] Figure 6 A structure schematic view of the through-hole reflow soldering equipment provided by the embodiment of the application is shown; Figure 5 A partial enlarged view of C in FIG. 6 is shown;

[0026] Figure 7 A structure schematic view of the heat insulation carrier of the through-hole reflow soldering equipment provided by the embodiment of the application is shown;

[0027] Figure 8 A structure schematic view of the heat insulation carrier and the product of the through-hole reflow soldering equipment provided by the embodiment of the application is shown;

[0028] Figure 9 Fig. 6 shows a structural schematic diagram of another perspective view of the universal reflow soldering apparatus according to an embodiment of the present application;

[0029] Figure 10 Fig. 7 shows a top view of the universal reflow soldering apparatus according to an embodiment of the present application;

[0030] Figure 11 Fig. 8 shows a partial enlarged view of the area D in Fig. 7; Figure 10

[0031] Figure 12 Fig. 9 shows a schematic diagram of the lower layer (soldering surface) and upper layer (non-soldering surface) test data of the universal reflow soldering apparatus according to the present application;

[0032] Figure 13 Fig. 10 shows a schematic diagram of the lower layer (soldering surface) and upper layer (non-soldering surface) test data of the common universal reflow soldering apparatus not using the present application.

[0033] In the above drawings, the following reference signs are used:

[0034] 10, first furnace body; 11, first furnace cavity; 111, first sub-furnace cavity; 1111, first air inlet; 1112, first air outlet; 1113, air inlet hole;

[0035] 20, second furnace body; 21, second furnace cavity; 211, second sub-furnace cavity; 2111, second air inlet; 2112, second air outlet;

[0036] 30, soldering track; 31, carrier placement position; 32, conveyor belt; 33, forward transmission layer; 34, backward transmission layer;

[0037] 40, transverse heat insulation barrier; 41, first heat insulation barrier; 411, lower wind deflector; 412, lower air deflector; 42, second heat insulation barrier; 421, upper wind deflector; 4211, carrier gap; 422, upper air deflector;

[0038] 50, longitudinal heat insulation barrier; 51, heat insulation plate; 52, heat insulation carrier; 521, carrier base; 522, sliding plate assembly; 53, heat insulation small plate;

[0039] 61, air inlet cylinder; 62, retaining wall;

[0040] 71, heat insulation carrier opening mechanism; 72, heat insulation carrier closing mechanism;

[0041] 80, control member; 90, product;

[0042] S1, soldering surface temperature-time curve; ​

[0043] S2, non-welding surface temperature-time curve. DETAILED DESCRIPTION

[0044] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments of the present application. The description of the at least one exemplary embodiment is actually only illustrative in nature and by no means as any limitation to the present application and its application or use. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without any creative effort fall within the scope of protection of the present application.

[0045] As shown in Figures 1 to 11 The embodiment of the present application provides a through-hole reflow soldering device, which comprises a first furnace body 10, a second furnace body 20, a soldering track 30 and a transverse heat shield 40. The first furnace body 10 has a first furnace cavity 11. The second furnace body 20 is arranged on the first furnace body 10 in an openable and closable manner. The second furnace body 20 has a second furnace cavity 21 corresponding to the first furnace cavity 11. The soldering track 30 is arranged at an upper end opening of the first furnace cavity 11 along an extension direction of the first furnace body 10. When the second furnace body 20 is closed on the first furnace body 10, a lower end opening of the second furnace cavity 21 is located above the soldering track 30. The soldering track 30 has a carrier placement position 31. The transverse heat shield 40 comprises a first heat shield 41 arranged in the first furnace cavity 11 and a second heat shield 42 arranged in the second furnace cavity 21. The first heat shield 41 divides the first furnace cavity 11 into a plurality of first sub-furnace cavities 111 along the extension direction of the first furnace cavity 11. The second heat shield 42 divides the second furnace cavity 21 into a plurality of second sub-furnace cavities 211 corresponding to the plurality of first sub-furnace cavities 111 one by one.

[0046] The through-hole reflow soldering device provided in the embodiment comprises a first furnace body 10, a second furnace body 20, a soldering track 30, and a transverse heat insulation barrier 40. In the process of reflow soldering by using the through-hole reflow soldering device, the second furnace body 20 is closed on the first furnace body 10, a carrier carrying products 90 is placed on the carrier placing position 31, and the carrier is moved along the soldering track 30 to complete the soldering. The first heat insulation barrier 41 is used to divide the first furnace cavity 11 into a plurality of first sub-furnace cavities 111 along the extension direction of the first furnace cavity 11. The second heat insulation barrier 42 is used to divide the second furnace cavity 21 into a plurality of second sub-furnace cavities 211 along the extension direction of the second furnace cavity 21. The first heat insulation barrier 41 physically insulates between adjacent first sub-furnace cavities 111, and the second heat insulation barrier 42 physically insulates between adjacent second sub-furnace cavities 211, so as to avoid the problem of serious heat leakage between adjacent first sub-furnace cavities 111 and the problem of serious heat leakage between adjacent second sub-furnace cavities 211, thereby accurately controlling the temperature of the plurality of first sub-furnace cavities 111 and the plurality of second sub-furnace cavities 211 according to the required soldering furnace temperature curve of different products, and improving the product compatibility of the through-hole reflow soldering device.

[0047] In the embodiment, the number of the first sub-furnace cavities 111 and the second sub-furnace cavities 211 can be set according to different through-hole reflow soldering processes.

[0048] Specifically, the second sub-furnace cavities 211 can be selected to be naturally air-cooled, cold air-cooled, or low-temperature hot air-cooled according to actual needs.

[0049] At present, the products include PCBs and components and devices soldered on the PCBs. Some components and devices have high reliability requirements for soldering points, and the soldering points of the patch components and devices have low reliability, and some are replaced by through-hole plug-in components and devices:

[0050] (1) The soldering points of the patch components and devices have low reliability, so that the patch components and devices cannot meet the high reliability requirements of most interface components (USB connectors, various components requiring quick plugging, some large components, etc.) in military electronic products and civil electronic products;

[0051] (2) The soldering points of the patch components and devices have poor heat dissipation, so that the patch components and devices cannot meet the heat dissipation requirements of various power devices, MOS tubes, power resistors, heat sinks, etc.

[0052] (3) Combined with the current development of electronic products in the direction of miniaturization, lightness, and high density, there are product structures in which patch components and devices and through-hole plug-in components and devices are mixed.

[0053] The product mixed with the patch component and the through-hole plug-in component is generally welded with the patch component by reflow soldering, and then welded with the through-hole plug-in component by hand soldering or wave soldering. However, the hand soldering has low production efficiency and high production cost. The current wave soldering (reflow soldering by means of molten liquid tin in a tin furnace) has the following defects:

[0054] (1) The wave soldering needs to spray flux, then preheat, solder and cool, and the flux will pollute the PCB after soldering, so a process of washing the PCB is needed, which is complex. The wave soldering has large consumption of soldering tin and flux, and large consumption of cleaning agent, which increases the manufacturing cost and pollutes the environment;

[0055] (2) The surface of the wave soldering cannot have SMT tin paste components, and the compatibility is poor;

[0056] (3) The wave soldering has many defects, especially for high-density electronic products, the wave soldering effect is poor, the soldering yield is low, and defects such as missing soldering, virtual soldering and tin connection are difficult to avoid, so a large amount of detection is needed in the later stage, and manual repair is needed, which needs a large number of manpower.

[0057] However, with the gradual rise of tin paste type through-hole reflow soldering (hereinafter referred to as through-hole reflow soldering), the through-hole reflow soldering can realize high-density product soldering, flux-free and cleaning-free, so the through-hole reflow soldering has good soldering compatibility, is environmentally friendly, and has high soldering yield.

[0058] As shown in Figure 11 The through-hole reflow soldering equipment also includes a longitudinal heat insulation barrier 50, which includes a heat insulation plate 51 arranged on the soldering track 30, one end of the heat insulation plate 51 is connected with the outer side wall of the soldering track 30, and the other end of the heat insulation plate 51 extends to the inner wall of the first furnace body 10 and is connected with the first furnace body 10. In the process of reflow soldering by the through-hole reflow soldering equipment, the second furnace body 20 is covered on the first furnace body 10, so that the hot air in the first furnace chamber 11 contacts with the lower surface of the product 90, and the cold air in the second furnace chamber 21 contacts with the upper surface of the product 90, thereby completing the soldering of the product 90. The first furnace chamber 11 and the second furnace chamber 21 are physically insulated by the heat insulation plate 51, so as to avoid serious heat transfer between the first furnace chamber 11 and the second furnace chamber 21, improve the temperature difference between the soldering surface (the surface opposite to the through-hole plug-in component body, i.e. the lower surface of the product in the embodiment) and the non-soldering surface (the surface where the through-hole plug-in component body is located, i.e. the upper surface of the product in the embodiment) of the product, so that the soldering surface and the non-soldering surface have good heat insulation effect and a large temperature difference, the soldering surface meets the high-temperature environment, the tin paste is melted and reflow soldered, the non-soldering surface meets the low-temperature environment, the components are protected from being damaged by heat shock, and the through-hole reflow soldering of the components which are not resistant to high temperature is met. The reliability of the through-hole reflow soldering equipment is improved, and the production flexibility is good.

[0059] And, the first furnace cavity 11 and the second furnace cavity 21 are physically insulated by the heat insulation plate 51, which meets the environmental protection requirements and reduces the use of lead-containing substances. Since the melting point temperature of lead-free solder paste is higher than that of lead-containing solder paste, when the lead-free solder paste is used for reflow soldering, the first furnace cavity 11 and the second furnace cavity 21 are physically insulated by the heat insulation plate 51, which can further increase the temperature difference between the soldering surface and the non-soldering surface.

[0060] As shown in Figure 4 , the first heat insulation barrier 41 includes a plurality of front and rear extending lower wind baffles 411, the lower ends of the lower wind baffles 411 are connected with the inner wall of the first furnace cavity 11, the upper ends of the lower wind baffles 411 extend upward, and the plurality of lower wind baffles 411 are arranged along the extension direction of the first furnace cavity 11 and divide the first furnace cavity 11 into a plurality of first sub-furnace cavities 111. The first furnace cavity 11 is divided into a plurality of first sub-furnace cavities 111 by the plurality of lower wind baffles 411 arranged along the extension direction of the first furnace cavity 11, so that the lower wind baffles 411 can physically insulate the two first sub-furnace cavities 111 on both sides, and in the process of through-hole reflow soldering, the heat transfer between the adjacent two first sub-furnace cavities 111 is avoided, the temperature of the plurality of first sub-furnace cavities 111 can be accurately controlled, the reliability of the through-hole reflow soldering equipment is improved, and the lower wind baffles 411 in a plate structure can simplify the structure of the first heat insulation barrier 41 and shorten the space occupied by the first heat insulation barrier 41 in the extension direction of the first furnace cavity 11.

[0061] As shown in Figure 2 , the second heat insulation barrier 42 includes a plurality of front and rear extending upper wind baffles 421, the upper ends of the upper wind baffles 421 are connected with the inner wall of the second furnace cavity 21, the lower ends of the upper wind baffles 421 extend downward, and the plurality of upper wind baffles 421 are arranged along the extension direction of the second furnace cavity 21 and divide the second furnace cavity 21 into a plurality of second sub-furnace cavities 211. The second furnace cavity 21 is divided into a plurality of second sub-furnace cavities 211 by the plurality of upper wind baffles 421 arranged along the extension direction of the second furnace cavity 21, so that the upper wind baffles 421 can physically insulate the two second sub-furnace cavities 211 on both sides, and in the process of through-hole reflow soldering, the heat transfer between the adjacent two second sub-furnace cavities 211 is avoided, the temperature of the plurality of second sub-furnace cavities 211 can be accurately controlled, the reliability of the through-hole reflow soldering equipment is improved, and the upper wind baffles 421 in a plate structure can simplify the structure of the second heat insulation barrier 42 and shorten the space occupied by the second heat insulation barrier 42 in the extension direction of the second furnace cavity 21.

[0062] As shown in Figure 2As shown, the lower end of the upper baffle 421 is provided with a carrier gap 4211 corresponding to the carrier placement position 31. By providing the carrier gap 4211 at the lower end of the upper baffle 421, in the process of reflow soldering by using the through-flow reflow soldering equipment, the second furnace body 20 is covered on the first furnace body 10, the carrier carrying the product 90 is placed on the carrier placement position 31 and moved along the soldering track 30, while the two first sub-furnace cavities 111 on both sides thereof are physically insulated by using the upper baffle 421, the carrier gap 4211 is used to avoid the carrier carrying the product 90, thereby improving the reliability of the through-flow reflow soldering equipment.

[0063] As shown, Figure 4 the inner bottom wall of the first sub-furnace cavity 111 is provided with a first air inlet 1111 and a first air outlet 1112 in communication with the first sub-furnace cavity 111, the first air inlet 1111 is located directly below the soldering track 30, and the projection of the first air outlet 1112 on the horizontal plane is located outside the soldering track 30. In the process of through-flow reflow soldering, the carrier carrying the product 90 is placed on the carrier placement position 31, since the first air inlet 1111 is located directly below the soldering track 30 and the projection of the first air outlet 1112 on the horizontal plane is located outside the soldering track 30, the hot air blown by the first air inlet 1111 is first blown to the product 90 on the soldering track 30 and then discharged from the first air outlet 1112 outside, thereby fully utilizing the heat of the hot air blown by the first air inlet 1111, avoiding heat loss, and improving energy use efficiency.

[0064] As shown, Figure 2 the inner top wall of the second sub-furnace cavity 211 is provided with a second air inlet 2111 and a second air outlet 2112 in communication with the second sub-furnace cavity 211, when the second furnace body 20 is covered on the first furnace body 10, the second air inlet 2111 is located directly above the soldering track 30, and the projection of the second air outlet 2112 on the horizontal plane is located outside the soldering track 30. In the process of through-flow reflow soldering, the carrier carrying the product 90 is placed on the carrier placement position 31, since the second air inlet 2111 is located directly above the soldering track 30 and the projection of the second air outlet 2112 on the horizontal plane is located outside the soldering track 30, the air blown by the second air inlet 2111 is first blown to the product 90 on the soldering track 30 and then discharged from the second air outlet 2112 outside, thereby fully utilizing the air blown by the second air inlet 2111 to cool the upper surface of the product 90, avoiding damage to the components on the upper surface of the product 90, avoiding heat loss, and improving energy use efficiency.

[0065] As shown, Figure 4As shown, the first heat insulation barrier 41 further comprises a plurality of lower air baffle plates 412 extending along the length direction of the first furnace body 10, the lower ends of the lower air baffle plates 412 are connected with the inner wall of the first furnace cavity 11, the upper ends of the lower air baffle plates 412 extend upwards, the front end and the rear end of each lower air baffle plate 412 are connected with the adjacent two lower air baffle plates 411 respectively, and the lower air baffle plates 412 are located between the first air inlet 1111 and the first air outlet 1112. By arranging the lower air baffle plates 412 between the first air inlet 1111 and the first air outlet 1112, the hot air blown by the first air inlet 1111 can be guided to blow to the product 90 on the welding track 30, and then discharged from the outer first air outlet 1112 after contacting the product 90, so that the heat of the hot air blown by the first air inlet 1111 is fully utilized, heat loss is avoided, and energy use efficiency is improved.

[0066] As shown in Figure 2 , the second heat insulation barrier 42 further comprises a plurality of upper air baffle plates 422 extending along the length direction of the second furnace body 20, the upper ends of the upper air baffle plates 422 are connected with the inner wall of the second furnace cavity 21, the lower ends of the upper air baffle plates 422 extend downwards, the front end and the rear end of each upper air baffle plate 422 are connected with the adjacent two upper air baffle plates 421 respectively, and the upper air baffle plates 422 are located between the second air inlet 2111 and the second air outlet 2112. By arranging the upper air baffle plates 422 between the second air inlet 2111 and the second air outlet 2112, the air blown by the second air inlet 2111 can be guided to blow to the product 90 on the welding track 30 first, and then discharged from the outer second air outlet 2112 after contacting the product 90, so that the product 90 is cooled on the upper surface by the air blown by the second air inlet 2111, the components on the upper surface of the product 90 are prevented from being damaged, heat loss is avoided, and energy use efficiency is improved.

[0067] As shown in Figure 6 , the through-hole reflow soldering device further comprises a plurality of air inlet tubes 61, the inner bottom wall of the first sub-furnace cavity 111 is provided with a plurality of air inlet holes 1113, and the lower ends of the plurality of air inlet tubes 61 are in one-to-one correspondence with the plurality of air inlet holes 1113. With the use of the through-hole reflow soldering, the welding slag of the product 90 falls into the first sub-furnace cavity 111. By arranging the plurality of air inlet tubes 61, the lower ends of the plurality of air inlet tubes 61 are in one-to-one correspondence with the plurality of air inlet holes 1113, and the height difference between the upper end of the air inlet tube 61 and the inner bottom wall of the first sub-furnace cavity 111 is utilized to prevent the welding slag from blocking the air inlet hole 1113, ensure the air inlet effect of the first air inlet hole 1113, and improve the reliability of the through-hole reflow soldering device.

[0068] As shown in Figure 4 and Figure 11As shown, the longitudinal heat insulation barrier 50 further comprises a plurality of heat insulation carriers 52 and a plurality of heat insulation plates 53, the welding track 30 is provided with a conveying belt 32 movably arranged on the welding track 30 along the extension direction of the welding track 30, the carrier placement position 31 is arranged on the conveying belt 32, and the plurality of heat insulation carriers 52 are arranged on the carrier placement position 31 along the extension direction of the welding track 30, and one heat insulation plate 53 is arranged between any two adjacent heat insulation carriers 52.

[0069] As shown in Figure 7 and Figure 8 As shown, the heat insulation carrier 52 comprises a carrier base 521 and a sliding plate assembly 522, the carrier base 521 comprises a carrier base plate and a bearing frame, the bearing frame is arranged around the edge of the carrier base plate and connected with the carrier base plate, the upper end of the bearing frame protrudes upwardly from the upper surface of the carrier base plate, the carrier base plate is provided with a ventilation hole, the upper end of the bearing frame is provided with a jig mounting position, and the sliding plate assembly 522 is slidably arranged above the carrier base plate, the bearing frame is provided with a sliding plate passage through which the sliding plate assembly 522 passes, and the sliding plate assembly 522 has a closed position for blocking the ventilation hole and an open position for avoiding the ventilation hole. The heat insulation carrier 52 is arranged on the carrier placement position 31, the product is placed on the jig mounting position and above the ventilation hole and the sliding plate assembly 522, in the welding environment, the sliding plate assembly 522 is opened to avoid the ventilation hole, so that the hot air in the first furnace cavity 11 contacts the lower surface of the product 90 through the ventilation hole, and the cold air in the second furnace cavity 21 contacts the upper surface of the product 90, thereby completing the welding of the product 90, and in the non-welding environment, the sliding plate assembly 522 is closed to block the ventilation hole, thereby avoiding serious heat leakage between the first furnace cavity 11 and the second furnace cavity 21 and improving the reliability of the through-hole reflow soldering equipment.

[0070] As shown in Figure 1 As shown, the through-hole reflow soldering equipment further comprises a heat insulation carrier opening mechanism 71 and a heat insulation carrier closing mechanism 72, the heat insulation carrier opening mechanism 71 is arranged at the inlet end of the welding track 30, and the heat insulation carrier closing mechanism 72 is arranged at the outlet end of the welding track 30. The sliding plate assembly 522 is opened by the heat insulation carrier opening mechanism 71 at the inlet end of the welding track 30 to avoid the ventilation hole, the heat insulation carrier 52 enters the first furnace cavity 11 and the second furnace cavity 21, and the sliding plate assembly 522 is closed by the heat insulation carrier closing mechanism 72 at the outlet end of the welding track 30 to block the ventilation hole. By using the heat insulation carrier opening mechanism 71 and the heat insulation carrier closing mechanism 72, the opening and closing of the sliding plate assembly 522 of any heat insulation carrier 52 can be controlled separately.

[0071] In the embodiment, the through-flow reflow soldering device further comprises a carrier opening detection member and a carrier closing detection member for detecting the opening and closing states of the heat-insulating carrier 52. The carrier opening detection member is arranged at the entrance end of the soldering track 30, and the carrier closing detection member is arranged at the exit end of the soldering track 30. The carrier opening detection member comprises an opening position detection member and a product presence detection member. When the carrier opening detection member detects that the heat-insulating carrier 52 moves to the carrier opening position, and the product presence detection member detects that the product 90 is loaded on the heat-insulating carrier 52, the heat-insulating carrier opening mechanism 71 opens the sliding plate assembly 522 to avoid the ventilation hole, and the heat-insulating carrier 52 enters the first furnace chamber 11 and the second furnace chamber 21, so that the hot air in the first furnace chamber 11 contacts the lower surface of the product 90 through the ventilation hole, and the cold air in the second furnace chamber 21 contacts the upper surface of the product 90, thereby completing the soldering of the product 90. The carrier closing detection member comprises a carrier opening and closing detection member and a closing position detection member. When the carrier opening and closing detection member detects that the sliding plate assembly 522 is in the opening state, and the closing position detection member detects that the heat-insulating carrier 52 is in the closing position, the heat-insulating carrier closing mechanism 72 closes the sliding plate assembly 522 to block the ventilation hole, thereby avoiding serious heat leakage between the first furnace chamber 11 and the second furnace chamber 21, and improving the reliability of the through-flow reflow soldering device.

[0072] In other embodiments, the carrier closing detection member comprises a carrier opening and closing detection member and a timer. The timer is set to the time for the heat-insulating carrier 52 to move from the opening position to the closing position. The timer starts counting down when the heat-insulating carrier opening mechanism 71 operates. When the carrier opening and closing detection member detects that the sliding plate assembly 522 is in the opening state, and the counting down of the timer ends, the heat-insulating carrier closing mechanism 72 closes the sliding plate assembly 522 to block the ventilation hole.

[0073] In other embodiments, the carrier closing detection member comprises a carrier opening and closing detection member and a timer. The timer is set to the time for the heat-insulating carrier 52 to move from the opening position to the closing position. The timer starts counting down when the heat-insulating carrier opening mechanism 71 operates. When the carrier opening and closing detection member detects that the sliding plate assembly 522 is in the opening state, and the counting down of the timer ends, the heat-insulating carrier closing mechanism 72 closes the sliding plate assembly 522 to block the ventilation hole.

[0074] As shown in FIG. 1, Figure 1 The soldering track 30 comprises a forward transmission layer 33 arranged above the first furnace chamber 11 and a backward transmission layer 34 arranged below the first furnace chamber 11. The transmission belt 32 is sleeved on the soldering track 30. Part of the transmission belt 32 is located above the forward transmission layer 33, and part of the transmission belt 32 is located below the backward transmission layer 34.

[0075] As shown in FIG. 1, Figure 4As shown, the through-hole reflow soldering device further comprises two baffle walls 62 extending along the extension direction of the first furnace body 10, the two baffle walls 62 are respectively located on both sides of the extension direction of the first furnace cavity 11 and outside the longitudinal heat insulation barrier 50, the lower end of the baffle wall 62 is connected with the upper end of the first furnace body 10, and the upper end of the baffle wall 62 abuts against the lower end of the second furnace body 20 when the second furnace body 20 is covered on the first furnace body 10. In the process of reflow soldering by using the through-hole reflow soldering device, the second furnace body 20 is covered on the first furnace body 10, so that the lower end of the baffle wall 62 is connected with the upper end of the first furnace body 10, and the upper end of the baffle wall 62 abuts against the lower end of the second furnace body 20, so that the hot air blown by the first air inlet 1111 is guided by the baffle wall 62 to be discharged from the outer first air outlet 1112 after contacting the product 90, and the air blown by the second air inlet 2111 is guided by the baffle wall 62 to be discharged from the outer second air outlet 2112 after contacting the product 90, thereby forming a cycle from the first air inlet 1111 to the product 90 and then to the first air outlet 1112 and a cycle from the second air inlet 2111 to the product 90 and then to the second air outlet 2112.

[0076] In the embodiment, the through-hole reflow soldering device can always maintain physical thermal isolation between the plurality of first sub-furnace cavities 111 and the plurality of second sub-furnace cavities 211 in the continuous product passing state or the non-continuous product passing state or the product-free passing state by using the transverse heat insulation barrier 40, the longitudinal heat insulation barrier 50 and the baffle wall 62, so that the through-hole reflow soldering device can adapt to the high-temperature-resistant components passing through the furnace and accurately control the temperature of each first sub-furnace cavity 111 and the temperature of each second sub-furnace cavity 211, thereby realizing the compatibility of the through-hole reflow soldering device for different soldering curves, realizing lead-free through-hole reflow soldering of the high-temperature-resistant components, quickly and freely switching different soldering curves, having strong component and product soldering compatibility, strong solder paste type compatibility, environmental protection, cleaning-free, good soldering effect, low energy consumption and high-density product soldering.

[0077] As shown in FIG. 1, the through-hole reflow soldering device comprises a first furnace body 10 and a second furnace body 20. Figure 1As shown, the through-hole reflow soldering equipment also includes multiple first heating elements, multiple second heating elements, multiple first temperature measuring elements, multiple second temperature measuring elements, and a control unit 80. The multiple first heating elements are arranged one-to-one with multiple first sub-furnace cavities 111, the multiple second heating elements are arranged one-to-one with multiple second sub-furnace cavities 211, the multiple first temperature measuring elements are arranged one-to-one with multiple first sub-furnace cavities 111, the multiple second temperature measuring elements are arranged one-to-one with multiple second sub-furnace cavities 211, and the control unit 80 is electrically connected to the first heating elements, the second heating elements, the first temperature measuring elements, and the second temperature measuring elements respectively. Based on the required welding furnace temperature profiles for different products, the controller 80 inputs the required conveyor belt speed, the temperatures of multiple first sub-furnace cavities 111, and the temperatures of multiple second sub-furnace cavities 211. This allows the controller 80 to control the temperatures of the first and second heating elements. The controller 80 can also display the real-time furnace temperatures of the first and second sub-furnace cavities 111 and 211 as detected by the first and second temperature sensors, respectively, facilitating confirmation that the temperatures of the first and second sub-furnace cavities 111 and 211 meet the welding requirements. Furthermore, under the same welding furnace temperature profile, reflow welding only requires adaptation to the furnace temperature profile once. Once the parameters meet the requirements, the data can be saved to the system, providing excellent flexibility for production and use.

[0078] In this embodiment, the first and second temperature measuring elements are thermocouples.

[0079] In this embodiment, the control unit 80 is a computer host, which includes a computer display screen, keyboard and mouse.

[0080] like Figure 13 As shown, in conventional hot air through-hole reflow soldering equipment without the present invention, the peak furnace temperature of the lower layer (welding surface) is 250°C, while the peak furnace temperature of the upper layer (non-welding surface) is only 190°C, resulting in poor heat insulation. It is unsuitable for reflow soldering of components that are not resistant to high temperatures through through-holes, and the temperature fluctuation of the upper layer (non-welding surface) is large, causing significant thermal shock to the components and making them prone to damage. S1 represents the temperature-time curve of the welding surface, and S2 represents the temperature-time curve of the non-welding surface.

[0081] like Figure 12 As shown, the through-hole reflow soldering equipment of this invention has a peak furnace temperature of 250°C on the lower layer (welding surface) and a peak furnace temperature of 120°C on the upper layer (non-welding surface), exhibiting good heat insulation. It is suitable for through-hole reflow soldering of components that are not resistant to high temperatures, and the temperature fluctuation of the upper layer (non-welding surface) is small, resulting in less thermal shock to the components and reducing the risk of damage. S1 represents the temperature-time curve of the welding surface, and S2 represents the temperature-time curve of the non-welding surface.

[0082] The through-hole reflow soldering equipment provided in this embodiment has the following beneficial effects:

[0083] (1) The first furnace cavity 11 is divided into a plurality of first sub-furnace cavities 111 along its extension direction by the first heat insulation barrier 41, and the second furnace cavity 21 is divided into a plurality of second sub-furnace cavities 211 along its extension direction by the second heat insulation barrier 42, so that the first heat insulation barrier 41 physically insulates between adjacent first sub-furnace cavities 111, and the second heat insulation barrier 42 physically insulates between adjacent second sub-furnace cavities 211, avoiding serious heat channeling between adjacent first sub-furnace cavities 111 and serious heat channeling between adjacent second sub-furnace cavities 211, so that the temperature of the plurality of first sub-furnace cavities 111 and the plurality of second sub-furnace cavities 211 can be accurately controlled according to the required welding furnace temperature curve of different products, and the product compatibility of the through-hole reflow soldering equipment is improved;

[0084] (2) The first furnace cavity 11 and the second furnace cavity 21 are physically insulated by the heat insulation plate 51, avoiding serious heat channeling between the first furnace cavity 11 and the second furnace cavity 21, improving the reliability of the through-hole reflow soldering equipment, and having good production flexibility;

[0085] (3) The through-hole reflow soldering equipment can always maintain physical thermal insulation between the plurality of first sub-furnace cavities 111 and the plurality of second sub-furnace cavities 211 no matter in the product continuous furnace passing state or the non-continuous furnace passing state or the product-free furnace passing state, so that the through-hole reflow soldering equipment can adapt to the high-temperature-resistant components passing through the furnace and accurately control the temperature of each first sub-furnace cavity 111 and the temperature of each second sub-furnace cavity 211, thereby realizing the compatibility of the through-hole reflow soldering equipment for different welding curves;

[0086] (4) By setting the lower air baffle 412 between the first air inlet 1111 and the first air outlet 1112, the hot air blown by the first air inlet 1111 can be guided to blow to the product 90 on the welding track 30, and then discharged from the outer first air outlet 1112 after contacting the product 90. By setting the upper air baffle 422 between the second air inlet 2111 and the second air outlet 2112, the air blown by the second air inlet 2111 can be guided to blow to the product 90 on the welding track 30 first, and then discharged from the outer second air outlet 2112 after contacting the product 90, so as to fully utilize the heat of the hot air blown by the first air outlet 1112, avoid heat loss, improve energy use efficiency, and fully utilize the air blown by the second air outlet 2112 to cool the upper surface of the product 90, avoid damage to the components on the upper surface of the product 90, avoid heat loss, and improve energy use efficiency;

[0087] (5) With the use of the through-hole reflow soldering, the welding slag of the product 90 falls in the first sub-chamber 111, by arranging the plurality of air inlet tubes 61, the lower ends of the plurality of air inlet tubes 61 are communicated with the plurality of air inlet holes 1113 one by one, by using the height difference between the upper end of the air inlet tube 61 and the inner bottom wall of the first sub-chamber 111, the welding slag is prevented from blocking the air inlet hole 1113, the air inlet effect of the air inlet hole 1113 is ensured, and the reliability of the through-hole reflow soldering equipment is improved.

[0088] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments in accordance with the present application. As used herein, "and / or" means and or, unless context clearly indicates otherwise. In addition, as used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. Further, it will be understood that the terms "comprises" and / or "comprising," when used in this specification, specify the presence of stated features, steps, operations, devices, components and / or combinations thereof, but do not preclude the presence or addition of one or more other features, steps, operations, devices, components and / or combinations thereof.

[0089] The relative arrangement of parts and steps, numerical expressions, and numerical values set forth in the examples are not intended to limit the scope of the application unless otherwise specifically stated. It is to be understood that the drawings are not necessarily to scale as the dimensions of the parts shown are for the purpose of illustration and description only and not to limit the scope of the application. Techniques, methods, and apparatus known to those of ordinary skill in the relevant art can not be discussed in detail, but should be understood to be part of the specification, where appropriate. In all examples shown and discussed herein, any specific values are to be interpreted as illustrative only and not as limiting. Thus, other examples of the example embodiments can have different values. It is noted that like numbers and letters on the figures identify like parts throughout the several views, and therefore, further discussion of the same will not be repeated.

[0090] In the description of the application, it should be understood that the orientation words such as "front, back, up, down, left, right", "transverse, vertical, perpendicular, horizontal" and "top, bottom" and the like indicated orientation or position relationship are generally based on the orientation or position relationship shown in the drawings, only for the convenience of describing the application and simplifying the description, without the opposite indication, these orientation words do not indicate and imply that the indicated device or element must have a specific orientation or be constructed and operated in a specific orientation, therefore, it cannot be understood as a limitation on the scope of protection of the application; the orientation words "inner, outer" refer to the inner and outer of the contour of each component itself.

[0091] For purposes of the description hereinafter, the terms "upper", "lower", "right", "left", "rear", "front", "vertical", "horizontal", and derivatives thereof shall relate to the application as oriented in the drawing. The terms "on", "above", "under", "below" and derivatives thereof shall relate to the application as oriented in the drawing, with the test of "above" and "under" being determined based on the position of the device in the drawing. Where the word "comprise" or variations such as "comprises" or "comprising" are used in the following description, it specifically expressly stated that other elements can also be present. Like reference numerals refer to like elements throughout. The term "coupled" as used herein is intended to mean either a direct connection between two elements or an indirect connection through one or more intervening elements. The term "associated with" as used herein is intended to mean either a direct connection between two elements or an indirect connection through one or more intervening elements.

[0092] In addition, it should be pointed out that the use of "first", "second" and the like words to qualify parts, is only for the convenience of distinguishing the corresponding parts, and the above words have no special meaning unless otherwise stated, and therefore cannot be understood as limiting the scope of protection of the present application.

[0093] The preferred embodiments of the application are described above, and are not intended to limit the scope of the application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the application shall be included in the scope of protection of the application.

Claims

1. A through-hole reflow soldering device, characterized in that, The through-hole reflow soldering equipment includes: The first furnace body (10) has a first furnace cavity (11); The second furnace body (20) is detachably mounted on the first furnace body (10), and the second furnace body (20) has a second furnace cavity (21) corresponding to the first furnace cavity (11). The welding track (30) is set at the upper opening of the first furnace cavity (11) along the extension direction of the first furnace body (10). When the second furnace body (20) is covered by the first furnace body (10), the lower opening of the second furnace cavity (21) is located above the welding track (30). The welding track (30) has a carrier placement position (31). The transverse heat insulation barrier (40) includes a first heat insulation barrier (41) disposed in the first furnace cavity (11) and a second heat insulation barrier (42) disposed in the second furnace cavity (21). The first heat insulation barrier (41) divides the first furnace cavity (11) into a plurality of first sub-furnace cavities (111) along the extension direction of the first furnace cavity (11). The second heat insulation barrier (42) divides the second furnace cavity (21) into a plurality of second sub-furnace cavities (211) corresponding one-to-one with the plurality of first sub-furnace cavities (111). The through-hole reflow soldering equipment also includes a longitudinal heat insulation barrier (50), which includes a heat insulation plate (51) disposed on the welding track (30). One end of the heat insulation plate (51) is connected to the outer wall of the welding track (30), and the other end of the heat insulation plate (51) extends to the inner wall of the first furnace body (10) and is connected to the first furnace body (10). The longitudinal heat insulation barrier (50) also includes multiple heat insulation carriers (52) and multiple heat insulation panels (53). A conveyor belt (32) is provided on the welding track (30). The conveyor belt (32) is movably provided on the welding track (30) along the extension direction of the welding track (30). The carrier placement position (31) is provided on the conveyor belt (32). Multiple heat insulation carriers (52) are spaced apart on the carrier placement position (31) along the extension direction of the welding track (30). A heat insulation panel (53) is provided between two adjacent heat insulation carriers (52). The heat insulation carrier (52) includes a carrier base (521) and a sliding plate assembly (522). The carrier base (521) includes a carrier substrate and a support frame. The support frame surrounds the edge of the carrier substrate and is connected to the carrier substrate. The upper end of the support frame protrudes upward from the upper surface of the carrier substrate. The carrier substrate has a through-hole ventilation hole. The upper end of the support frame is provided with a fixture mounting position. The sliding plate assembly (522) is slidably covered above the carrier substrate. The support frame is provided with a sliding plate passage through the sliding plate assembly (522). The sliding plate assembly (522) has a closed position that blocks the ventilation hole and an open position that avoids the ventilation hole.

2. The through-hole reflow soldering equipment according to claim 1, characterized in that, The first heat insulation barrier (41) includes a plurality of lower baffles (411) extending forward and backward. The lower end of each lower baffle (411) is connected to the inner wall of the first furnace cavity (11), and the upper end of each lower baffle (411) extends upward. The plurality of lower baffles (411) are arranged at intervals along the extension direction of the first furnace cavity (11) and divide the first furnace cavity (11) into a plurality of first sub-furnace cavities (111); and / or, The second heat insulation barrier (42) includes a plurality of front and rear extending upper baffles (421). The upper end of the upper baffle (421) is connected to the inner wall of the second furnace cavity (21). The lower end of the upper baffle (421) extends downward. The plurality of upper baffles (421) are arranged at intervals along the extension direction of the second furnace cavity (21) and divide the second furnace cavity (21) into a plurality of second sub-furnace cavities (211).

3. The through-hole reflow soldering equipment according to claim 2, characterized in that, The lower end of the upper windshield (421) is provided with a vehicle notch (4211) corresponding to the vehicle placement position (31).

4. The through-hole reflow soldering equipment according to claim 2, characterized in that, The inner bottom wall of the first sub-furnace cavity (111) is provided with a first air inlet (1111) and a first air outlet (1112) communicating with the first sub-furnace cavity (111). The first air inlet (1111) is located directly below the welding track (30), and the projection of the first air outlet (1112) on the horizontal plane is located outside the welding track (30); and / or, The inner top wall of the second sub-furnace cavity (211) is provided with a second air inlet (2111) and a second air outlet (2112) communicating with the second sub-furnace cavity (211). When the second furnace body (20) covers the first furnace body (10), the second air inlet (2111) is located directly above the welding track (30), and the projection of the second air outlet (2112) on the horizontal plane is located outside the welding track (30).

5. The through-hole reflow soldering equipment according to claim 4, characterized in that, The first heat insulation barrier (41) further includes a plurality of lower baffles (412) extending along the length of the first furnace body (10). The lower end of the lower baffle (412) is connected to the inner wall of the first furnace cavity (11), the upper end of the lower baffle (412) extends upward, and the front end and rear end of the lower baffle (412) are respectively connected to two adjacent lower baffles (411). The lower baffle (412) is located between the first air inlet (1111) and the first air outlet (1112); and / or, The second heat insulation barrier (42) also includes a plurality of upper baffles (422) extending along the length of the second furnace body (20). The upper end of the upper baffle (422) is connected to the inner wall of the second furnace cavity (21), the lower end of the upper baffle (422) extends downward, the front end and the rear end of the upper baffle (422) are respectively connected to two adjacent upper baffles (421), and the upper baffle (422) is located between the second air inlet (2111) and the second air outlet (2112).

6. The through-hole reflow soldering equipment according to claim 4, characterized in that, The through-hole reflow soldering equipment also includes multiple air inlets (61), and multiple air inlets (1113) are provided on the inner bottom wall of the first sub-furnace cavity (111). The lower ends of the multiple air inlets (61) are connected to the multiple air inlets (1113) one by one.

7. The through-hole reflow soldering equipment according to claim 1, characterized in that, The through-hole reflow soldering equipment further includes a heat-insulating carrier opening mechanism (71) and a heat-insulating carrier closing mechanism (72). The heat-insulating carrier opening mechanism (71) is located at the inlet end of the welding track (30), and the heat-insulating carrier closing mechanism (72) is located at the outlet end of the welding track (30); and / or, The through-hole reflow soldering equipment also includes a carrier opening detection device and a carrier closing detection device for detecting the opening and closing status of the heat insulation carrier (52). The carrier opening detection device is located at the entrance end of the welding track (30), and the carrier closing detection device is located at the exit end of the welding track (30).

8. The through-hole reflow soldering equipment according to claim 1, characterized in that, The through-hole reflow soldering equipment also includes two baffles (62) extending along the extension direction of the first furnace body (10). The two baffles (62) are located on both sides of the extension direction of the first furnace cavity (11) and outside the longitudinal heat insulation barrier (50). The lower end of the baffle (62) is connected to the upper end of the first furnace body (10). When the second furnace body (20) is covered by the first furnace body (10), the upper end of the baffle (62) abuts against the lower end of the second furnace body (20).

9. The through-hole reflow soldering equipment according to claim 1, characterized in that, The through-hole reflow soldering equipment also includes: Multiple first heating elements are provided, and each of the multiple first heating elements is configured in a one-to-one correspondence with a multiple first sub-furnace cavities (111); Multiple second heating elements are provided, and each of the multiple second heating elements is configured in a one-to-one correspondence with a multiple second sub-furnace cavities (211); Multiple first temperature measuring elements are arranged one-to-one in multiple first sub-furnace cavities (111); Multiple second temperature measuring elements are arranged one-to-one in multiple second sub-furnace cavities (211); The control element (80) is electrically connected to the first heating element, the second heating element, the first temperature measuring element and the second temperature measuring element respectively.

Images