A heat dissipation device, power equipment and photovoltaic system

Abstract

The application provides a heat dissipation device, a power device and a photovoltaic system, which have an optimal heat exchange effect. The heat dissipation device can comprise a shell (110); the outer surface of the first side wall (1101) of the shell (110) is fixed with a heat source, or the first side wall of the shell has a window, and the outer surface of a heat-conducting base plate embedded in the window is fixed with the heat source; the shell (110) is internally provided with a first partition plate (111); the first partition plate (111) divides the first shell (110) into a first cavity (112) and a second cavity (113), and the first partition plate (111) is provided with one or more channels (1111), each channel (1111) is used for connecting the first cavity (112) and the second cavity (113), and one end of each channel close to the first side wall (1101) is fixed with a region where the heat source is located or a heat-conducting base plate towards the first side wall (1101).

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology, and in particular to a heat dissipation device, power equipment and photovoltaic system. Background Technology

[0002] Immersion liquid cooling is a typical direct-contact type of liquid cooling. The heat-generating elements are in direct contact with the refrigerant, resulting in high heat dissipation efficiency. Immersion liquid cooling is mainly divided into single-phase liquid cooling and two-phase liquid cooling. In single-phase liquid cooling, the coolant remains liquid throughout the circulation process without undergoing a phase change. In two-phase liquid cooling, the coolant undergoes a phase change during circulation, with the liquid coolant vaporizing under the influence of heat. As inverter power increases and heat density rises, two-phase liquid cooling is increasingly being adopted for inverter cooling. Summary of the Invention

[0003] This application provides a heat dissipation device, a power device, and a photovoltaic system, which can achieve better heat exchange performance. It also provides good heat dissipation even under high heat loads.

[0004] In a first aspect, this application provides a heat dissipation device, which may include: a housing; a heat source is fixed to the outer surface of a first sidewall of the housing, or the first sidewall of the housing has a window, and a heat-conducting substrate embedded in the window of the first sidewall is fixed to the heat source; an air outlet is provided on a second sidewall of the housing, and a liquid inlet is provided on a third sidewall of the housing. The housing has a first partition plate inside, one side of the first partition plate facing the first sidewall and the other side facing away from the first sidewall; the first partition plate divides the first housing into a first cavity and a second cavity, and the first partition plate is provided with one or more channels, each channel connecting the first cavity and the second cavity, and one end of each channel near the first sidewall faces either the area of ​​the first sidewall where the heat source is fixed or the heat-conducting substrate.

[0005] In this embodiment, liquid refrigerant enters the housing through the liquid inlet, and gaseous refrigerant exits through the gas outlet. For clarity, it is assumed that the cavity closer to the heat source in the first and second cavities is the first cavity, and the cavity farther from the heat source is the second cavity. In the first cavity, the refrigerant undergoes phase conversion, changing from a liquid to a gaseous state. After vaporization, the first cavity is under low pressure. Liquid refrigerant in the second cavity flows into the first cavity through a channel on the first partition, replenishing the liquid refrigerant in the first cavity. Furthermore, the channel's orientation towards the heat source creates the effect of injecting liquid refrigerant into the heat source, thus replenishing the refrigerant at the heat source and improving heat dissipation efficiency.

[0006] In one possible design, a window is provided on the first sidewall of the housing, and a heat-conducting substrate embedded in the window can bear a heat source. The inner peripheral wall of the window on the first sidewall is sealed to the outer peripheral wall of the heat-conducting substrate to prevent air or liquid leakage at the window.

[0007] In one possible design, the first partition has one or more protrusions on the side near the first sidewall, and at least one of the protrusions is provided with at least one of the channels. The protrusions can shorten the distance between the heat source and the channel on the protrusion, so that the liquid refrigerant in the channel on the protrusion can flow to the heat source more quickly.

[0008] In one possible design, the heat source includes at least one wafer, wherein the projection of each wafer onto the first partition (111) avoids each of the channels. In scenarios where the heat source includes wafers, the wafer is typically the primary heat-generating component in the heat source. The avoidance of each channel on the first partition from the wafer facilitates the removal of gaseous refrigerant from the heat source.

[0009] In one possible design, the second sidewall and the third sidewall are positioned opposite each other along the direction of gravity, with the first sidewall located between the second and third sidewalls. Furthermore, along the direction of gravity, the second sidewall is above the third sidewall, and the third sidewall is below the second sidewall. This design allows the condenser to be positioned above the heat dissipation device, and eliminates the need for power equipment such as pumps or motors to drive the flow of liquid or gas within the heat dissipation device.

[0010] In one possible design, multiple heat sources are fixed to the outer surface of the first sidewall, and the multiple heat sources are spaced apart; one or more second partitions are built into the cavity between the first partition and the first sidewall, and the second partitions are used to separate two adjacent heat sources to avoid crosstalk between the gases generated at the two adjacent heat sources.

[0011] In some examples, the second sidewall and the third sidewall are arranged opposite each other in the direction of gravity, the first sidewall is located between the second sidewall and the third sidewall, and one surface of at least one of the second partitions faces the second sidewall and the other surface faces the third sidewall.

[0012] In some examples, the second sidewall and the third sidewall are arranged opposite each other along the direction of gravity, the first sidewall is located between the second sidewall and the third sidewall, the length direction of at least one second partition is the direction of gravity, and one sidewall of at least one second partition is fixed to the first sidewall, with the opposite sidewall extending toward the first partition.

[0013] In one possible design, the first sidewall has multiple openings; at least one second partition is built into the cavity between the first partition and the first sidewall, and each second partition is used to separate two adjacent openings, which can prevent crosstalk between gases generated at two adjacent heat sources.

[0014] In some examples, the second sidewall and the third sidewall are arranged opposite each other in the direction of gravity, the first sidewall is located between the second sidewall and the third sidewall, and one surface of at least one of the second partitions faces the second sidewall and the other surface faces the third sidewall.

[0015] In some examples, the second sidewall and the third sidewall are arranged opposite each other along the direction of gravity, the first sidewall is located between the second sidewall and the third sidewall, the length direction of at least one second partition is the direction of gravity, and one sidewall of at least one second partition is fixed to the first sidewall, with the opposite sidewall extending toward the first partition.

[0016] In one possible design, the end of the first partition away from the air outlet is connected to the first sidewall of the housing via a third partition, with one side of the third partition facing the second sidewall and the other side facing the third sidewall. The third partition can seal the space between the first sidewall and the first partition, increasing the velocity of liquid flowing from the second cavity into the first cavity through the channel, enhancing the impact effect of the liquid flowing into the first cavity, strengthening boiling heat transfer, and improving heat dissipation.

[0017] In one possible design, the end of the first partition near the air outlet is connected to the sidewall opposite the first sidewall via a fourth partition. One side of the fourth partition faces the second sidewall, and the other side faces the third sidewall. The fourth partition can block the space between the first partition and the sidewall opposite the first sidewall, thereby increasing the velocity of liquid flowing from the second cavity into the first cavity through the channel, enhancing the impact effect of the liquid flowing into the first cavity, strengthening boiling heat transfer, and improving heat dissipation.

[0018] In one possible design, the end of the first partition away from the air outlet is connected to the first sidewall of the housing via a third partition, with one side of the third partition facing the second sidewall and the other side facing the third sidewall. The end of the first partition near the air outlet is connected to the opposite sidewall of the first sidewall via a fourth partition, with one side of the fourth partition facing the second sidewall and the other side facing the third sidewall. The third partition can seal the space between the first sidewall and the first partition, and the fourth partition can seal the space between the first partition and the opposite sidewall of the first sidewall. This increases the velocity of liquid flowing from the second cavity into the first cavity through the channel, enhances the impact effect of the liquid flowing into the first cavity, strengthens boiling heat transfer, and improves heat dissipation.

[0019] In one possible design, at least one channel on the first partition is a through hole. Optionally, each channel on the first partition can be a through hole. Optionally, the first partition may include a protrusion, and at least one through hole may be disposed on the protrusion.

[0020] In one possible design, at least one of the first partitions is a flow guide tube, and the flow guide tube is disposed on the side of the first partition facing the first sidewall. Optionally, each channel on the first partition is a flow guide tube. In some examples, a portion of the channels on the first partition are through holes, and another portion of the channels are flow guide tubes. Optionally, the first partition may include a protrusion, and at least one flow guide tube may be disposed on the protrusion.

[0021] In one possible design, a heat-conducting element extending into the first cavity is disposed on the inner surface of the heat-conducting substrate. The heat-conducting element can promote or enhance the change of the refrigerant from liquid to gaseous state within the first cavity, improving the heat dissipation effect on the heat source. The projection of the heat-conducting element onto the first partition avoids each of the channels.

[0022] In one possible design, the projection of the free end of the heat-conducting element onto the second sidewall overlaps with the projection of the guide tube onto the second sidewall, which makes it easier for the liquid refrigerant flowing out of the guide tube to reach the inner surface of the heat-conducting substrate.

[0023] In one possible design, the second sidewall and the third sidewall are positioned opposite each other along the direction of gravity, with the first sidewall located between the second and third sidewalls. Furthermore, along the direction of gravity, the second sidewall is above the third sidewall, and the third sidewall is below the second sidewall. The first partition is connected to or abuts against the third sidewall (1104), and the liquid inlet is located in the region of the third sidewall between the first sidewall and the first partition. This design can increase the velocity of liquid flowing from the second chamber into the first chamber through the channel, enhance the impact effect of liquid flowing into the first chamber, strengthen boiling heat transfer, and improve heat dissipation.

[0024] Secondly, this application provides a power device that may include at least one power module and a heat dissipation device provided by the first aspect and any possible design thereof. The outer surface of the first sidewall of the housing of the heat dissipation device may be used to fix the power module. Alternatively, a thermally conductive substrate within an opening in the first sidewall may support the power module.

[0025] In one possible design, the power device may further include a condenser for liquefying the gaseous refrigerant into a liquid refrigerant. The condenser may be coupled to both the outlet and inlet of the heat dissipation device. Optionally, the second sidewall containing the outlet and the third sidewall containing the inlet are positioned opposite each other along the direction of gravity, with the second sidewall above the third sidewall. In this power device, the condenser is positioned above the heat dissipation device along the direction of gravity. The condenser, coupled to both the outlet and inlet of the heat dissipation device, is used to convert the gaseous refrigerant into a liquid refrigerant. In this design, the power device may not require a pump or motor to drive the flow of liquid or gas within the heat dissipation device.

[0026] Thirdly, this application provides a photovoltaic system including a solar panel and the aforementioned power device, wherein the solar panel is used to convert solar energy into electrical energy, and the power device is used to convert the current and / or voltage from the solar panel. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of a heat dissipation device.

[0028] Figure 2 This illustrates an application scenario for a heat dissipation device;

[0029] Figure 3 A partial structural schematic diagram of a heat dissipation device is shown;

[0030] Figure 4A This is a side sectional view of a heat dissipation device provided in an embodiment of this application;

[0031] Figure 4B for Figure 4A A schematic diagram of the heat dissipation device shown in the front view;

[0032] Figure 5A This is a side sectional view of a heat dissipation device provided in an embodiment of this application;

[0033] Figure 5B for Figure 5A A schematic diagram of the heat dissipation device shown in the front view;

[0034] Figure 6A This is a schematic diagram of a first type of partition;

[0035] Figure 6B This is a schematic diagram of another type of first partition;

[0036] Figure 7A This is a schematic diagram of yet another type of first partition;

[0037] Figure 7B This is a schematic diagram of yet another type of first partition;

[0038] Figure 7C This is a schematic diagram of yet another type of first partition;

[0039] Figure 7D This is a schematic diagram of yet another type of first partition;

[0040] Figure 7E This is a schematic diagram of yet another type of first partition;

[0041] Figure 8A This is a schematic diagram of yet another type of first partition;

[0042] Figure 8B This is a schematic diagram of yet another type of first partition;

[0043] Figure 8C This is a schematic diagram of yet another type of first partition;

[0044] Figure 9A This is a schematic diagram of yet another type of first partition;

[0045] Figure 9B This is a schematic diagram of yet another type of first partition;

[0046] Figure 9C This is a schematic diagram of yet another type of first partition;

[0047] Figure 9D This is a schematic diagram of yet another type of first partition;

[0048] Figure 9E This is a schematic diagram of yet another type of first partition;

[0049] Figure 10A This is a side sectional view of a heat dissipation device provided in an embodiment of this application;

[0050] Figure 10B for Figure 10A A schematic diagram of the heat dissipation device shown in the front view;

[0051] Figure 10C A schematic diagram of a heat dissipation device in a frontal view, provided in an embodiment of this application;

[0052] Figure 10D A schematic diagram of another heat dissipation device provided in an embodiment of this application, viewed from the front.

[0053] Figure 11A This is a side sectional view of a heat dissipation device provided in an embodiment of this application;

[0054] Figure 11B for Figure 11A A schematic diagram of the heat dissipation device shown in the front view;

[0055] Figure 11CA schematic diagram of another heat dissipation device provided in an embodiment of this application, viewed from the front.

[0056] Figure 11D A schematic diagram of another heat dissipation device provided in an embodiment of this application, viewed from the front.

[0057] Figure 12 A side sectional view of another heat dissipation device provided in an embodiment of this application;

[0058] Figure 13 A side sectional view of another heat dissipation device provided in an embodiment of this application;

[0059] Figure 14 A side sectional view of another heat dissipation device provided in an embodiment of this application;

[0060] Figure 15 This is a side sectional view of another heat dissipation device provided in an embodiment of this application.

[0061] Figure label:

[0062] 100 - Heat dissipation device;

[0063] 110 - Housing; 1101 - First sidewall; 1103 - Second sidewall; 1104 - Third sidewall; 1102 - Fourth sidewall; 1105 - Fifth sidewall; 1106 - Sixth sidewall; 1131 - Heat dissipation area; 1131a - Window; 1132 - Air outlet; 1133 - Liquid inlet; 1101b - Thermally conductive substrate; 21 - Thermally conductive component;

[0064] 111-First partition; 1111-Channel; 1111a-Through hole; 1111b-Guide pipe; 1111c-Protrusion;

[0065] 112-First cavity; 113-Second cavity; 114a-Horizontal heat source partition; 114b-Vertical heat source partition; 116-Third partition; 117-Fourth partition. Detailed Implementation

[0066] To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings. However, the exemplary embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein. The same reference numerals in the figures denote the same or similar structures, and therefore repeated descriptions of them will be omitted. The terms expressing position and direction described in the embodiments of this application are illustrative based on the accompanying drawings, but changes can be made as needed, and all such changes are included within the scope of protection of this application. The accompanying drawings of the embodiments of this application are for illustrating relative positional relationships only and do not represent actual scale.

[0067] It should be noted that specific details are set forth in the following description to facilitate understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0068] Loop thermosyphon (LTS) cooling systems are an important application in two-phase liquid cooling. Please see [link / reference]. Figure 1 LTS heat dissipation devices typically consist of an evaporator, a condenser, and steam piping (such as...). Figure 1 (As shown by arrow A in the image), return line (such as...) Figure 1 As shown by arrow B, the heat dissipation device is filled with refrigerant, and the heat source is installed on the evaporator. When heated, the liquid refrigerant boils and becomes vapor, which enters the condenser along the vapor pipeline. In the condenser, it is cooled and liquefied, and then flows back to the evaporator along the return pipeline under the drive of gravity, completing the cycle.

[0069] Figure 2 This illustrates an application scenario for a heat dissipation device. The LTS heat dissipation device can be applied to inverter heat dissipation scenarios. For example... Figure 2 As shown, the heat dissipation device can be fixedly mounted on the inverter chassis, and the evaporator is located inside the inverter chassis. Optionally, the condenser can be located on the top of the inverter chassis. At least one return liquid line and at least one steam line are provided between the condenser and the evaporator. The heat dissipation device is used to dissipate heat from the power modules in the inverter. The power modules can be fixedly mounted on one side wall surface of the evaporator, and the heat dissipation device can dissipate heat from the substrate (such as a thermally conductive substrate) on which the power modules are located. Figure 3 A partial structural schematic diagram of a heat dissipation device is shown. A heat dissipation area is provided on one side wall of the evaporator of the heat dissipation device, and the substrate of the power module can be fixed on the heat dissipation area. The heat dissipation area can be used to dissipate heat from the substrate. Optionally, the heat dissipation area is provided with an opening that can accommodate the substrate of the power module. At least one wafer is integrated on a first side of the substrate. The second side of the substrate can be in contact with the refrigerant inside the evaporator. Typically, the wafer on the substrate is the main heat source of the power module.

[0070] Under high heat loads, the LTS heat dissipation device faces difficulties in replenishing the liquid in the evaporator, limiting heat exchange efficiency and easily leading to overheating of the evaporator wall under high heat load conditions. To address these issues, this application embodiment improves the heat dissipation device, enhancing its heat exchange efficiency and achieving better heat dissipation under high heat loads. The power device provided in this application embodiment will now be described in detail with reference to the accompanying drawings.

[0071] Please refer to this as well. Figure 4A and Figure 4B , Figure 4AThis is a side sectional view of a heat dissipation device 100 provided in an embodiment of this application. Figure 4B This is a schematic diagram of the heat dissipation device in a frontal view. In this embodiment, the heat dissipation device 100 may include a housing 110. Exemplarily, the housing 110 may be generally a cuboid structure, including a first sidewall 1101, a second sidewall 1103, a third sidewall 1104, a fourth sidewall 1102, a fifth sidewall 1105, and a sixth sidewall 1106. It should be noted that these represent six different sidewalls of the housing 110.

[0072] Optionally, the first sidewall 1101 and the fourth sidewall 1102 may be arranged opposite each other along a third direction, the second sidewall 1103 and the third sidewall 1104 may be arranged opposite each other along a second direction, and the fifth sidewall 1105 and the sixth sidewall 1106 may be arranged opposite each other along a first direction. Optionally, the minimum included angle between the third direction and the second direction may be greater than 0° and less than or equal to 90°, the minimum included angle between the second direction and the first direction may be greater than 0° and less than or equal to 90°, and the minimum included angle between the third direction and the first direction may be greater than 0° and less than or equal to 90°.

[0073] It should be known that, Figure 4A and Figure 4B The heat dissipation device 100 shown is merely one embodiment; other embodiments exist within this application. Fundamentally, the first sidewall 1101, fourth sidewall 1102, second sidewall 1103, third sidewall 1104, fifth sidewall 1105, and sixth sidewall 1106 are simply illustrative, referring to six different sidewalls of the housing 110. In some embodiments, the first sidewall 1101 may be opposite to the third sidewall 1104. In some embodiments, the first sidewall 1101 may be opposite to the second sidewall 1103. Other embodiments exist within this application, which will not be listed here.

[0074] Optionally, the first direction, the second direction, and the third direction are perpendicular to each other.

[0075] Optionally, in the scenario where the heat dissipation device 100 is used to dissipate heat from the power devices inside the inverter, the first direction is the width direction of the inverter, the second direction is the height direction of the inverter, and the third direction is the thickness direction of the inverter.

[0076] A first partition 111 may be provided inside the housing 110. One side of the first partition 111 faces the first sidewall 1101, and the other side faces away from the first sidewall 1101. The first partition 111 can divide the housing 110 into two cavities, namely a first cavity 112 and a second cavity 113. One or more channels 1111 are provided on the first partition 111, and each channel 1111 is used to connect the first cavity 112 and the second cavity 113. For ease of explanation, the cavity between the first partition 111 and the first sidewall 1101 is referred to as the first cavity 112. The cavity between the sidewall opposite to the first sidewall 1101 and the first partition 111 is referred to as the second cavity 113. For example, Figure 4A In the middle, the cavity between the fourth side wall 1102 and the first partition 111 is the second cavity 113.

[0077] An air outlet 1132 is provided on one side wall of the housing 110 other than the first side wall 1101, and a liquid inlet 1133 may be provided on one of the other side walls of the housing 110 besides the first side wall 1101 and the side wall with the air outlet 1132. In some embodiments, the side wall with the air outlet 1132 may not be opposite to the side wall with the liquid inlet 1133. In other embodiments, the side wall with the air outlet 1132 may be opposite to the side wall with the liquid inlet 1133. Optionally, the side wall with the air outlet 1132 may be opposite to the side wall with the liquid inlet 1133 along the direction of gravity. Optionally, the side wall with the air outlet 1132 may be opposite to the side wall with the liquid inlet 1133 in a direction perpendicular to the direction of gravity.

[0078] For example, Figure 4A An air outlet 1132 is provided on the second sidewall 1103. A liquid inlet 1133 may be provided on one of the other sidewalls of the housing 110 besides the first sidewall 1101 and the second sidewall 1103. Optionally, a liquid inlet 1133 may be provided on the third sidewall 1104.

[0079] The heat dissipation device 100 can dissipate heat for at least one heat source. In one possible design, a heat source may be fixed to the outer surface of the first sidewall 1101 of the housing 110. Figure 4A and Figure 4B The area 1131 on the first sidewall 1101 where a heat source is fixed can be referred to as the heat dissipation area 1131.

[0080] In one possible scenario, the heat dissipation area 1131 is formed on a first surface of the first sidewall 1101, which is the surface of the first sidewall 1101 away from the second sidewall 1103. A heat source can be fixedly mounted on the heat dissipation area 1131, and the heat source can contact or adhere to the heat dissipation area 1131. For example, the heat source is a power module, and the thermally conductive substrate of the power module can be fixedly mounted on the heat dissipation area 1131, such that the thermally conductive substrate contacts or adheres to the heat dissipation area 1131.

[0081] Optionally, each channel 1111 on the first partition 111 has a heat source area fixed at one end near the first sidewall 1101, i.e., facing the heat dissipation area 1131. In scenarios where the heat dissipation device 100 can dissipate heat from multiple heat sources, the outer surface of the first sidewall 1101 can form multiple heat dissipation areas 1131, each of which can be used to fix a heat source. Each heat dissipation area 1131 is directly opposite to at least one first channel 1111. In other words, the projection of a heat dissipation area 1131 onto the first partition 111 includes at least one first channel 1111.

[0082] Refrigerant can be introduced into the interior of the first housing 110 through the liquid inlet 1133. Typically, the refrigerant inside the housing 110 can submerge all the channels 1111 on the first partition 111. Each channel 1111 connects the second chamber 113 and the first chamber 112. The refrigerant in the second chamber 113 can enter the first chamber 112 through the channel 1111. The first chamber 112 is close to the heat source, and the refrigerant typically undergoes a phase change within it. Within the first chamber 112, after absorbing a significant amount of heat, the refrigerant changes from a liquid to a gaseous state; therefore, the first chamber 112 can also be called a boiling chamber. The second chamber 113 can also be called a liquid collecting chamber.

[0083] In this design, the first partition 111 has at least one channel 1111. Each channel 1111 connects the first cavity 112 and the second cavity 113. The end of each channel 1111 closest to the first sidewall 1101 faces the area where the heat source is fixed to the first sidewall 1101. The refrigerant undergoes a phase change within the first cavity 112, resulting in a lower density of refrigerant in the first cavity 112 compared to the second cavity 113, creating pressure. Under this pressure, the liquid refrigerant in the second cavity 113 flows into the first cavity 112 through the channel 1111. The liquid working fluid (such as coolant or refrigerant) in the first cavity 112 undergoes a phase change and vaporizes under the influence of the heat source, cooling the heat source. Furthermore, the channel 1111 facing the area where the heat source is fixed to the first sidewall 1101 allows the coolant in the second cavity 113 to flow directly to the heat source through the channel 1111, improving heat dissipation efficiency.

[0084] In one possible design, please refer to [the following] as well. Figure 5A and Figure 5B A window 1131a is provided on the first sidewall 1101 of the housing 110. A heat source is fixed on the outer surface of a heat-conducting substrate embedded in the window 1131a, such that the heat-conducting substrate embedded in the window 1131a can be used to carry the heat source. Each channel 1111 on the first partition 111 has one end near the first sidewall 1101 facing the heat-conducting substrate, that is, facing the window 1131a.

[0085] The inner peripheral wall of the opening 1131a can be sealed to the outer peripheral wall of the thermally conductive substrate embedded in the opening 1131a. In some examples, the inner peripheral wall of the opening 1131a is in direct contact with the outer peripheral wall of the thermally conductive substrate embedded in the opening 1131a. Optionally, the opening 1131a and the thermally conductive substrate embedded in the opening 1131a are interference-fitted. Alternatively, the inner peripheral wall of the opening 1131a and the outer peripheral wall of the thermally conductive substrate embedded in the opening 1131a are sealed to each other by a sealing material. Exemplarily, a sealing ring is provided between the inner peripheral wall of the opening 1131a and the outer peripheral wall of the thermally conductive substrate embedded in the opening 1131a. It is understandable that the window 1131a and the heat-conducting substrate embedded in the window 1131a are sealed together to prevent the inside of the housing 110 from communicating with the outside of the housing 110 through the window 1131a, thereby reducing the risk of air or liquid leakage at the window 1131a. Figure 5A , Figure 5B and Figure 4A , Figure 4B For similarities, please refer to Figure 4A , Figure 4B The relevant information will not be repeated here.

[0086] In this design, the first partition 111 has at least one channel 1111. Each channel 1111 connects the first cavity 112 and the second cavity 113. One end of each channel 1111 near the first sidewall 1101 faces the heat-conducting substrate embedded in the window 1131a of the first sidewall 1101. The refrigerant undergoes a phase change within the first cavity 112, resulting in a lower density of refrigerant in the first cavity 112 compared to the second cavity 113, thus creating pressure. Under this pressure, the liquid refrigerant in the second cavity 113 flows into the first cavity 112 through the channel 1111. The liquid working fluid (such as coolant) in the first cavity 112 undergoes a phase change and vaporizes under the influence of heat from the heat source, thus cooling the heat source. Furthermore, the channel 1111 faces the heat-conducting substrate embedded in the window 1131a of the first sidewall 1101, which allows the coolant in the second cavity 113 to flow directly to the heat-conducting substrate through the channel 1111, thereby improving the heat dissipation efficiency of the heat source carried on the heat-conducting substrate.

[0087] In one possible design of the heat dissipation device 100 provided based on any of the above designs, the second sidewall 1103 and the third sidewall 1104 of the housing 110 are arranged opposite each other along the direction of gravity, and the first sidewall 1101 is located between the second sidewall 1103 and the third sidewall 1104. The second sidewall 1103 is above the third sidewall 1104. Please refer to... Figure 4A The outlet 1132 and the liquid inlet 1133 are respectively disposed on the sidewalls opposite to each other along the direction of gravity, with the outlet 1132 above the liquid inlet 1133. In some applications, along the direction of gravity, the condenser can be disposed above the heat dissipation device 100, coupled to the outlet 1132 and the liquid inlet 1133 of the heat dissipation device, to convert gaseous refrigerant into liquid refrigerant. This design eliminates the need for power equipment such as pumps or motors to drive the flow of liquid or gas within the housing 110.

[0088] In the heat dissipation device 100 provided in this application embodiment, the channel 1111 provided on the first partition 111 can have various forms. For a specific implementation, please refer to... Figure 6A In the channels 1111 on the first partition 111, at least one channel 1111 can be a through hole 1111a. In the embodiments of this application, the through hole 1111a on the first partition 111 can also be called a jet hole. Figure 6A and Figure 4A The similarities will not be repeated here. Because the refrigerant density in the first cavity 112 is lower than that in the second cavity 113, pressure is created. Under this pressure, the liquid refrigerant in the second cavity 113 flows into the first cavity 112 through the through-hole 1111a. Optionally, each channel 1111 on the first partition 111 is a through-hole 1111a.

[0089] Please refer to Figure 6B In the channel 1111 on the first partition 111, at least one channel can be a guide tube 1111b, which can also be called a jet tube in this application. Figure 6B and Figure 4A The similarities will not be repeated here. Because the refrigerant density in the first cavity 112 is lower than that in the second cavity 113, pressure is created. Under this pressure, the liquid refrigerant in the second cavity 113 flows into the first cavity 112 through the guide pipe 1111b. The guide pipe 1111b can increase the flow rate of refrigerant from the second cavity 113 into the first cavity 112, improving the liquid replenishment efficiency in the first cavity 112, thereby improving the heat dissipation effect. Optionally, each channel 1111 on the first partition 111 is a guide pipe 1111b.

[0090] In one possible scenario, among the channels 1111 on the first partition 111, a portion of the channels 1111 are through holes 1111a, and another portion of the channels 1111 are guide pipes 1111b. This application embodiment does not impose excessive limitations on this.

[0091] In one specific implementation, the side of the first partition 111 closest to the first sidewall 1101 may have a protrusion. Figure 7A The diagram shows a protrusion 1111c on the side of the first partition 111 near the first sidewall 1101. One or more channels 1111 are provided on the protrusion 1111c, and one end of each channel 1111 near the first sidewall 1101 faces either toward the area of ​​the first sidewall 1101 where the heat source is fixed or toward the heat-conducting substrate embedded in the opening of the first sidewall 1101.

[0092] In one possible scenario, please refer to [further details]. Figure 7A All channels 1111 on the first partition 111 are disposed on the single protrusion 1111c. In this design, the protrusion 1111c can shorten the distance from the liquid in the channel 1111 to the heat source. In some examples, the first partition 111 has one channel 1111 disposed on the single protrusion 1111c, wherein the single channel 1111 can be a through hole or a flow guide. In some examples, the first partition 111 has multiple channels 1111, and all channels 1111 on the first partition 111 are disposed on the single protrusion 1111c. Optionally, among all channels 1111 on the single protrusion 1111c, some channels 1111 can be through holes, and other channels 1111 can be flow guides. Alternatively, each channel 1111 among all channels 1111 on the single protrusion 1111c can be a flow guide. Alternatively, each of the channels 1111 in the single protrusion 1111c can be a through hole. For example, Figure 7A In the first partition 111, each of the channels 1111 is a through hole 1111a. Each through hole 1111a on the first partition 111 is provided on the protrusion 1111c.

[0093] In another possible scenario, the first partition 111 is provided with multiple channels 1111, wherein a portion of the channels 1111 on the first partition 111 are located on the protrusion 1111c, while another portion of the channels 1111 avoid the protrusion 1111c. In this design, the protrusion 1111c can shorten the distance from the liquid in a portion of the channels 1111 to the heat source or thermally conductive substrate. For example, the channels 1111 on the first partition 111 are all through holes 1111a. Figure 7BAs shown, the through hole 1111a in the dashed circle is a through hole that avoids the protrusion 1111c. Optionally, the number of channels 1111 that avoid the protrusion 1111c among all the channels 1111 on the first partition 111.

[0094] In some examples, the number of channels 1111 on the protrusion 1111c is one, in which case the channel 1111 on the protrusion 1111c can be a via or a guide tube. In some examples, the number of channels 1111 on the protrusion 1111c is greater than one. Optionally, of all the channels 1111 on the protrusion 1111c, some channels 1111 can be vias, and others can be guide tubes. Alternatively, of all the channels 1111 on the protrusion 1111c, each channel 1111 can be a guide tube. Alternatively, of all the channels 1111 on the protrusion 1111c, each channel 1111 can be a via. For example, Figure 7B In the first partition 111, each of the channels 1111 is a through hole 1111a. Each through hole 1111a on the first partition 111 is provided on the protrusion 1111c.

[0095] In some examples, the number of channels 1111 on the first partition 111 that avoid the protrusion 1111c is one. In this case, the channel 1111 on the first partition 111 that avoids the protrusion 1111c can be a through hole or a guide tube. In some examples, the number of channels 1111 on the first partition 111 that avoids the protrusion 1111c is greater than one. Optionally, some of the channels 1111 on the first partition 111 that avoid the protrusion 1111c can be through holes, and others can be guide tubes. Alternatively, each channel 1111 on the first partition 111 that avoids the protrusion 1111c can be a guide tube. Alternatively, each channel 1111 on the first partition 111 that avoids the protrusion 1111c can be a through hole. For example, Figure 7B In the first partition 111, in the channel 1111 that avoids the protrusion 1111c, each channel is a through hole 1111a.

[0096] In one specific implementation, the side of the first partition 111 closest to the first sidewall 1101 may have multiple protrusions. Figure 7CThe diagram shows a first partition 111 with a plurality of protrusions 1111c on the side near the first sidewall 1101. Any one of the protrusions 1111c can be a first protrusion. One or more channels 1111 can be provided on the first protrusion. The channel 1111 on the first protrusion can be located near the first sidewall 1101, facing either the area where the heat source is fixed to the first sidewall 1101 or towards the heat-conducting substrate embedded in the opening of the first sidewall 1101. The channel on the first protrusion can be, but is not limited to, any of the following examples. In some examples, the first protrusion 1111c has only one channel 1111, in which case the channel 1111 on the first protrusion 1111c can be a through-hole or a flow guide. In some examples, the first protrusion 1111c has more than one channel 1111. Optionally, among all the channels 1111 on the first protrusion 1111c, some channels 1111 can be through holes, and other channels 1111 can be guide tubes. Alternatively, each channel 1111 on the first protrusion 1111c can be a guide tube. Alternatively, each channel 1111 on the first protrusion 1111c can be a through hole.

[0097] In one possible scenario, please refer to [further details]. Figure 7C All channels 1111 on the first partition 111 are provided on the protrusions 1111c on the first partition 111. The number of channels 1111 on each of the plurality of protrusions 1111c on the first partition 111 can be the same or different. For example, each channel 1111 on the first partition 111 is a through hole 1111a.

[0098] In another possible scenario, please see Figure 7D Of all the channels 1111 on the first partition 111, a portion of the channels 1111 are located on the protrusions 1111c on the first partition 111, while the other portion of the channels 1111 avoid each protrusion 1111c on the first partition 111.

[0099] In one specific implementation, please refer to Figure 7E The first partition 111 has multiple protrusions 1111c on the side near the first sidewall 1101. All channels 1111 on the first partition 111 are provided on the multiple protrusions 1111c. Optionally, the number of channels on each protrusion 1111c can be the same or different. Each channel 1111 on each protrusion 1111c can be a guide tube 1111b. In this design, the guide tubes 1111b on the protrusions 1111c can shorten the distance between the refrigerant and the heat source.

[0100] Based on the heat dissipation device 100 provided in any of the above embodiments, a heat source is fixed on the outer surface of the first sidewall 1101 of the heat dissipation device 100, or a heat-conducting substrate embedded in the opening of the first sidewall 1101 carries the heat source. In some application scenarios, the heat source may include at least one wafer. In the scenario where the heat dissipation device is for cooling the inverter, the wafer in the power module of the inverter is the main heat-generating component.

[0101] In one embodiment, at least one channel 1111 on the first partition 111 may be directly opposite the wafer. Alternatively, at least one channel 1111 on the protrusion 1111c of the first partition 111 may be directly opposite the wafer. Optionally, at least one channel 1111 on the first partition 111 may be a via 1111a, and at least one via 1111a may be directly opposite the wafer.

[0102] For example, please see Figure 8A The wafer in the heat source is supported by a thermally conductive substrate 1101b embedded in an opening in the first sidewall 1101. The channels 1111 on the first partition 111 are all vias 1111a. Figure 8A The arrow in the diagram shows the projection of the wafer onto the first partition 111. The projection of the wafer onto the first partition 111 overlaps with part or all of at least one via 1111a, that is, at least one via 1111a on the first partition 111 is directly opposite the wafer in the heat source.

[0103] In one specific embodiment, to facilitate the detachment of gaseous refrigerant from the area where a heat source is fixed on the outer surface of the first sidewall 1101, or to facilitate the detachment of gaseous refrigerant from the heat-conducting substrate embedded in the window of the first sidewall 1101, each channel 1111 on the first partition 111 can avoid contact with each wafer in the heat source. For example, the projection of each wafer in the heat source onto the first partition 111 avoids contact with each channel 1111 on the first partition 111. Optionally, each channel 1111 on the first partition 111 can be a via 1111a. Alternatively, each channel 1111 on the first partition 111 can be a flow guide 1111b. Alternatively, the first partition 111 has multiple channels 1111, wherein at least one channel is a via 1111a and at least one channel is a flow guide 1111b.

[0104] In some examples, such as Figure 8B As shown, the channels 1111 on the first partition 111 are all through holes 1111a. Figure 8B The arrows in the diagram show the projection of the wafer onto the first partition 111, and the projection of the wafer onto the first partition 111 avoids each via 1111a, that is, the projection of the wafer onto the first partition 111 does not overlap with each via 1111a.

[0105] In some examples, such as Figure 8C As shown, the first partition 111 has one or more protrusions 1111c on the side near the first sidewall 1101. The channels 1111 on each protrusion 1111c are through holes 1111a. Figure 8C The arrows in the diagram show the projection of the wafer onto the first partition 111, and the projection of the wafer onto the first partition 111 avoids each other with the vias 1111a on each protrusion 1111c, meaning that the projection of the wafer onto the first partition 111 does not overlap with each via 1111a.

[0106] In one possible scenario, the first sidewall 1101 of the heat dissipation device 100 has one or more openings, and a heat-conducting substrate embedded in the opening of the first sidewall 1101 carries a heat source. In a possible application scenario, such as... Figure 9A As shown, the inner surface of the thermally conductive substrate 1101b embedded in the window is provided with a thermally conductive element 21 extending into the first cavity 112 or the first partition 111. The inner surface of the thermally conductive substrate 1101b is the surface of the thermally conductive substrate 1101b that is away from the heat source and close to the first cavity 112. The thermally conductive element 21 on the inner surface of the thermally conductive substrate 1101b can generally be referred to as a surface structure on the inner surface. The thermally conductive element 21 on the inner surface of the thermally conductive substrate 1101b can be used to promote or enhance the change of the refrigerant from liquid to gas in the first cavity 112, thereby improving the heat dissipation effect on the heat source. The thermally conductive element 21 can be a three-dimensional structure or a layered structure disposed on the inner surface of the thermally conductive substrate 1101b, and this application does not impose excessive limitations on it. Optionally, the thermally conductive element 21 can be in the form of, but is not limited to, micro-rib arrays, sintered metal powder, etc.

[0107] In one specific implementation, the projection of the heat-conducting element 21 on the inner surface of the heat-conducting substrate 1101b embedded in the window avoids each channel 1111 on the first partition 111.

[0108] See some examples. Figure 9A Each channel 1111 on the first partition 111 is a through hole 1111a. Furthermore, the projection of the heat-conducting element 21 on the inner surface of the heat-conducting substrate 1101b embedded in the window onto the first partition 111 avoids each through hole 1111a on the first partition 111, that is, the projection of the heat-conducting element 21 on the inner surface of the heat-conducting substrate 1101b embedded in the window onto the first partition 111 does not overlap with each through hole 1111a on the first partition 111.

[0109] See some examples. Figure 9BEach channel 1111 on the first partition 111 is a flow guide tube 1111b. Furthermore, the projection of the heat-conducting element 21 on the inner surface of the heat-conducting substrate 1101b embedded in the window onto the first partition 111 avoids each flow guide tube 1111b on the first partition 111, that is, the projection of the heat-conducting element 21 on the inner surface of the heat-conducting substrate 1101b embedded in the window onto the first partition 111 does not overlap with each flow guide tube 1111b on the first partition 111.

[0110] In some examples, to improve the replenishment effect of liquid refrigerant in the first cavity 112, the guide pipe 1111b on the first partition 111 can cooperate with the heat-conducting element 21. For example, Figure 9C As shown, the second sidewall 1103 and the third sidewall 1104 are arranged opposite each other along the direction of gravity, with the second sidewall 1103 above the third sidewall 1104, i.e., the third sidewall 1104 below the second sidewall 1103. Each channel 1111 on the first partition 111 can be a flow guide tube 1111b. The projection of the heat-conducting element 21 on the inner surface of the heat-conducting substrate 1101b embedded in the window avoids each other on the first partition 111, and the projection of the free end of each heat-conducting element 21 on the second sidewall 1103 overlaps with the projection portion of each flow guide tube 1111b on the second sidewall 1103.

[0111] Optionally, one or more protrusions 1111c may be provided on the first partition 111. Some or all of the channels 1111 on the first partition 111 may be located on the protrusions 1111c on the first partition 111; this embodiment does not impose excessive limitations on this. For example, Figure 9D An exemplary illustration shows the positional relationship between the heat-conducting element 21 and the through hole 1111a on the protrusion 1111c, wherein the protrusion 1111c on the first partition 111 has the through hole 1111a. The projection of the heat-conducting element 21 on the inner surface of the heat-conducting substrate 1101b embedded in the window avoids each through hole 1111a on the protrusion 1111c.

[0112] For example, Figure 9EAn exemplary illustration shows the positional relationship between the heat-conducting element 21 and the through-hole 1111a on the protrusion 1111c. A jet tube 1111b is provided on the protrusion 1111c of the first partition 111. The projection of the heat-conducting element 21 on the inner surface of the heat-conducting substrate 1101b embedded in the window of the first partition 111 avoids each other with respect to the jet tube 1111b on the protrusion 1111c. Optionally, the second sidewall 1103 and the third sidewall 1104 are arranged opposite each other along the direction of gravity, with the second sidewall 1103 above the third sidewall 1104, i.e., the third sidewall 1104 below the second sidewall 1103. Each channel 1111 on the first partition 111 can be a jet tube 1111b. The projection of the heat-conducting element 21 on the inner surface of the heat-conducting substrate 1101b embedded in the window avoids each other with the projection of the first partition 111 and each guide tube 1111b on the protrusion 1111c. The projection of each heat-conducting element 21 on the second side wall 1103 overlaps with the projection of each guide tube 1111b on the protrusion 1111c on the second side wall 1103.

[0113] Based on the first partition 111 provided in any of the above embodiments, in one possible design, a heat source is fixed to the outer surface of the first sidewall 1101 in the heat dissipation device 100. Multiple heat sources are fixed to the outer surface of the first sidewall 1101, and these heat sources are spaced apart. One or more second partitions are built into the cavity between the first partition 111 and the first sidewall 1101, and the second partitions are used to separate two adjacent heat sources. That is, the heat dissipation areas 1131 with heat sources fixed to the outer surface of the first sidewall 1101 in the heat dissipation device 100 are spaced apart, and two adjacent heat dissipation areas 1131 are spaced apart.

[0114] In one specific implementation, the second sidewall 1103 and the third sidewall 1104 are disposed opposite each other along the direction of gravity, and the first sidewall 1101 is located between the second sidewall 1103 and the third sidewall 1104. Optionally, the second sidewall 1103 may be above the third sidewall 1104, or the second sidewall 1103 may be below the third sidewall 1104. This embodiment does not impose excessive limitations on this.

[0115] In some examples, in the heat dissipation device 100, at least one of the second partitions built into the cavity between the first partition 111 and the first sidewall 1101 is a horizontal heat partition, or each second partition is a horizontal heat source partition. One surface of the horizontal heat source partition faces the second sidewall 1103, and the other surface faces the third sidewall 1104. Please refer to [further details]. Figure 10A and Figure 10BThe second direction is the direction of gravity. Taking the second sidewall 1103 above the third sidewall 1104 as an example, the first cavity 112 has at least one horizontal heat source partition 114a inside. One surface of the horizontal heat source partition 114a faces the second sidewall 1103 and the other surface faces the third sidewall 1104.

[0116] The plurality of heat sources fixed to the outer surface of the first sidewall 1101 may include at least one set of heat sources. A set of heat sources may include at least two heat sources, and said at least two heat sources are arranged along the direction of gravity. For any heat source along the direction of gravity (also...) Figure 10A A horizontal heat source partition 114a is provided between two adjacent heat sources arranged in the second direction (as shown in the diagram). One surface of the horizontal heat source partition 114a faces the second sidewall 1103, and the other surface faces the third sidewall 1104. For ease of explanation, the two adjacent heat sources arranged along the direction of gravity are referred to as the first heat source and the second heat source, respectively, with the first heat source above the second heat source. The horizontal heat source partition 114a can isolate air bubbles at the second heat source from the first heat source, thus preventing difficulties in replenishing liquid at the first heat source due to air bubbles rising from the second heat source. Optionally, to reduce air bubble flow resistance, the horizontal heat source partition 114a can be configured in various forms such as arc or V-shape. Alternatively, the projection of the horizontal heat source partition 114a onto the first sidewall 1101 can be arc, V, or other shapes. This application does not impose excessive limitations on the shape of the horizontal heat source partition 114a.

[0117] In some examples, in the heat dissipation device 100, at least one of the second partitions built into the cavity between the first partition 111 and the first sidewall 1101 is a vertical heat partition, or each second partition is a vertical heat source partition. The length direction of the vertical heat source partition is the direction of gravity, and the first sidewall of the vertical heat source partition is fixed to the first sidewall 1101 of the housing 110. The sidewalls of the opposing first sidewalls of the vertical heat source partitions extend toward the first partition 111, with one side of the vertical heat source partition facing the fifth sidewall 1105 and the other side facing the sixth sidewall 1106. Please refer to [reference needed]. Figure 10C The second direction is the direction of gravity, with the second sidewall 1103 above the third sidewall 1104 as an example. The length direction of the vertical heat source partition 114b is the direction of gravity, and the first sidewall of the vertical heat source partition 114b is fixed to the first sidewall 1101 of the housing 110. The sidewalls of the opposite first sidewalls of the vertical heat source partition 114b extend toward the first partition 111. At this time, one side of the vertical heat source partition 114b faces the fifth sidewall 1105, and the other side faces the sixth sidewall 1106.

[0118] Multiple heat sources fixed to the outer surface of the first sidewall 1101 may include multiple sets of heat sources. These sets of heat sources may be arranged along a first direction. Each set of heat sources may include one heat source, or each set may include at least two heat sources arranged along the direction of gravity. A vertical heat source partition 114b may separate two adjacent sets of heat sources arranged along the first direction. Alternatively, the vertical heat source partition 114b may separate two adjacent heat sources arranged along the first direction. The vertical heat source partition may separate the gas generated at the separated heat sources, preventing crosstalk between bubbles generated by different heat sources and affecting the liquid replenishment effect at each heat source.

[0119] See some examples. Figure 10D In the heat dissipation device 100, multiple heat sources fixed to the outer surface of the first sidewall 1101 may include multiple sets of heat sources. These multiple sets of heat sources include at least two heat sources, and the at least two heat sources are arranged along the direction of gravity. The multiple sets of heat sources are arranged along a first direction. Multiple second partitions are built into the cavity between the first partition 111 and the first sidewall 1101. These multiple second partitions may consist of a portion of horizontal heat source partitions 114a and another portion of vertical heat source partitions 114b. The portion along the direction of gravity (also...) Figure 10D A horizontal heat source partition 114a is provided between each pair of adjacent heat sources arranged in the second direction. A vertical heat source partition 114b is provided between each pair of adjacent heat sources arranged in the first direction within the cavity between the first partition 111 and the first sidewall 1101. This design avoids crosstalk between air bubbles generated at each heat source.

[0120] Based on the first partition 111 provided in any of the above embodiments, in one possible design, the first sidewall 1101 of the heat dissipation device 100 has a plurality of openings 1131a. At least one second partition is housed within the cavity between the first partition 111 and the first sidewall 1101, each second partition separating two adjacent openings. Alternatively, one or more second partitions can be housed within the cavity between the first partition 111 and the first sidewall 1101, separating two adjacent openings 1131a; that is, the second partitions can separate the heat-conducting substrates within two adjacent openings 1131a.

[0121] In one specific implementation, the second sidewall 1103 and the third sidewall 1104 are disposed opposite each other along the direction of gravity, and the first sidewall 1101 is located between the second sidewall 1103 and the third sidewall 1104. Optionally, the second sidewall 1103 may be above the third sidewall 1104, or the second sidewall 1103 may be below the third sidewall 1104. This embodiment does not impose excessive limitations on this.

[0122] In some examples, in the heat dissipation device 100, at least one of the second partitions built into the cavity between the first partition 111 and the first sidewall 1101 is a horizontal heat partition, or each second partition is a horizontal heat source partition. One surface of the horizontal heat source partition faces the second sidewall 1103, and the other surface faces the third sidewall 1104. Please refer to [further details]. Figure 11A and Figure 11B The second direction is the direction of gravity. Taking the second sidewall 1103 above the third sidewall 1104 as an example, the first cavity 112 has at least one horizontal heat source partition 114a inside. One surface of the horizontal heat source partition 114a faces the second sidewall 1103 and the other surface faces the third sidewall 1104.

[0123] The plurality of openings 1131a on the first sidewall 1101 includes at least one set of openings 1131a. The at least one set of openings 1131a includes at least two openings 1131a, and the at least two openings 1131a are arranged along the direction of gravity. For any opening along the direction of gravity (also... Figure 11A A horizontal heat source partition 114a is disposed between two adjacent openings 1131a arranged in the second direction (in the middle), with one surface of the horizontal heat source partition 114a facing the second sidewall 1103 and the other surface facing the third sidewall 1104. For ease of explanation, the two adjacent openings 1131a arranged along the direction of gravity are referred to as the first opening 1131a and the second opening 1131a, respectively, with the first opening 1131a above the second opening 1131a. The horizontal heat source partition 114a can isolate air bubbles at the heat-conducting substrate in the second opening 1131a from the first opening 1131a, thus avoiding difficulties in replenishing liquid at the first opening 1131a caused by the floating of air bubbles at the heat-conducting substrate in the second opening 1131a. Optionally, to reduce air bubble flow resistance, the horizontal heat source partition 114a can be configured in various forms such as arc shape and V-shape. Alternatively, the projection of the horizontal heat source partition 114a onto the first sidewall 1101 can be an arc shape, a V shape, or other shapes. This application does not impose too many limitations on the shape of the horizontal heat source partition 114a.

[0124] In some examples, in the heat dissipation device 100, at least one of the second partitions built into the cavity between the first partition 111 and the first sidewall 1101 is a vertical heat partition, or each second partition is a vertical heat source partition. The length direction of the vertical heat source partition is the direction of gravity, and the first sidewall of the vertical heat source partition is fixed to the first sidewall 1101 of the housing 110. The sidewalls of the opposing first sidewalls of the vertical heat source partitions extend toward the first partition 111, with one side of the vertical heat source partition facing the fifth sidewall 1105 and the other side facing the sixth sidewall 1106. Please refer to [reference needed]. Figure 11CThe second direction is the direction of gravity, with the second sidewall 1103 above the third sidewall 1104 as an example. The length direction of the vertical heat source partition 114b is the direction of gravity, and the first sidewall of the vertical heat source partition 114b is fixed to the first sidewall 1101 of the housing 110. The sidewalls of the opposite first sidewalls of the vertical heat source partition 114b extend toward the first partition 111. At this time, one side of the vertical heat source partition 114b faces the fifth sidewall 1105, and the other side faces the sixth sidewall 1106.

[0125] The multiple openings 1131a of the first sidewall 1101 may include multiple sets of openings 1131a. These multiple sets of openings 1131a may be arranged along a first direction. Each set of openings 1131a may include one opening 1131a, or each set of openings 1131a may include at least two openings 1131a arranged along the direction of gravity. The vertical heat source partition 114b may separate two adjacent sets of openings 1131a arranged along the first direction. Alternatively, the vertical heat source partition 114b may separate two adjacent openings 1131a arranged along the first direction. The vertical heat source partition may separate the gas generated at the heat-conducting substrate within the separated two openings 1131a, preventing crosstalk between bubbles generated at the heat-conducting substrate within different openings 1131a and affecting the liquid replenishment effect at the heat-conducting substrate within each opening 1131a.

[0126] See some examples. Figure 11D In the heat dissipation device 100, the plurality of openings 1131a fixed on the outer surface of the first sidewall 1101 may include multiple sets of openings 1131a. The multiple sets of openings 1131a include at least two openings 1131a, and the at least two openings 1131a are arranged along the direction of gravity. The multiple sets of openings 1131a are arranged along a first direction. A plurality of second partitions are built into the cavity between the first partition 111 and the first sidewall 1101. The plurality of second partitions may be partly horizontal heat source partitions 114a and partly vertical heat source partitions 114b. Wherein, along the direction of gravity (also... Figure 10D A horizontal heat source baffle 114a is provided between each two adjacent windows 1131a arranged in the second direction. In the cavity between the first baffle 111 and the first sidewall 1101, a vertical heat source baffle 114b is provided between each two adjacent windows 1131a arranged in the first direction. This design can prevent crosstalk between air bubbles generated at each heat source.

[0127] Based on the heat dissipation device 100 provided by any of the above designs, and the first partition 111 provided by any of the above embodiments, the second sidewall 1103 and the third sidewall 1104 are arranged opposite to each other along the direction of gravity, and the first sidewall 1101 is located between the second sidewall 1103 and the third sidewall 1104.

[0128] In some examples, the heat dissipation device 100 further includes a third partition, one side of which faces the second sidewall 1103 and the other side of which faces the third sidewall 1104. The end of the first partition 111 away from the air outlet 1132 is connected to the first sidewall 1101 of the housing via the third partition. Optionally, the second sidewall 1103 may be above the third sidewall 1104, or below the third sidewall 1104. See [link to specific implementation] for details. Figure 12 The second sidewall 1103 and the third sidewall 1104 are arranged opposite each other along the direction of gravity, that is... Figure 12 The second direction is the direction of gravity. The second sidewall 1103 is above the third sidewall 1104. The heat dissipation device 100 also includes a third partition 116, one side of which faces the second sidewall 1103, and the other side faces the third sidewall 1104. The end of the first partition 111 furthest from the air outlet 1132 is connected to the first sidewall 1101 of the housing via the third partition 116. In this design, the third partition 116 can be used to seal the space between the first sidewall 1101 and the first partition 111, increasing the velocity of liquid flowing from the second cavity 113 into the first cavity 112 through the channel 1111, enhancing the impact effect of the liquid flowing into the first cavity 112, strengthening boiling heat transfer, and improving the heat dissipation effect.

[0129] In some examples, the heat dissipation device 100 further includes a fourth partition, one side of which faces the second sidewall 1103 and the other side of which faces the third sidewall 1104. One end of the first partition 111 near the air outlet 1132 is connected to the sidewall opposite the first sidewall 1101 via the fourth partition. Optionally, the second sidewall 1103 may be above the third sidewall 1104, or below the third sidewall 1104. See [link to specific implementation] for details. Figure 13 The second sidewall 1103 and the third sidewall 1104 are arranged opposite each other along the direction of gravity, that is... Figure 13 The second direction is the direction of gravity. The second sidewall 1103 is above the third sidewall 1104. The sidewall opposite the first sidewall 1101 is designated as the fourth sidewall 1102. The heat dissipation device 100 also includes a fourth partition 117, one side of which faces the second sidewall 1103, and the other side faces the third sidewall 1104. The end of the first partition 111 near the air outlet 1132 is connected to the first sidewall 1101 of the housing via the fourth partition 117. In this design, the fourth partition 117 can be used to seal the space between the fourth sidewall 1102 and the first partition 111, increasing the velocity of the liquid flowing from the second cavity 113 into the first cavity 112 through the channel 1111, enhancing the impact effect of the liquid flowing into the first cavity 112, strengthening boiling heat transfer, and improving the heat dissipation effect.

[0130] In some examples, the heat dissipation device 100 may include the aforementioned third and fourth partitions. For a specific implementation, please refer to... Figure 14 The second sidewall 1103 and the third sidewall 1104 are arranged opposite each other along the direction of gravity, that is... Figure 14 The second direction is the direction of gravity. The second sidewall 1103 is above the third sidewall 1104. The sidewall opposite to the first sidewall 1101 is designated as the fourth sidewall 1102. The heat dissipation device 100 also includes a third partition 116 and a fourth partition 117. One side of the third partition 116 faces the second sidewall 1103, and the other side faces the third sidewall 1104. The end of the first partition 111 away from the air outlet 1132 is connected to the first sidewall 1101 of the housing via the third partition 116. One side of the fourth partition 117 faces the second sidewall 1103, and the other side faces the third sidewall 1104. The end of the first partition 111 near the air outlet 1132 is connected to the first sidewall 1101 of the housing via the fourth partition 117. The third partition 116 can be used to seal the space between the first sidewall 1101 and the first partition 111. The fourth partition 117 can be used to seal the space between the fourth sidewall 1102 and the first partition 111. This design can increase the speed at which the liquid in the second cavity 113 flows into the first cavity 112 through the channel 1111, enhance the impact effect of the liquid flowing into the first cavity 112, strengthen boiling heat transfer, and improve the heat dissipation effect.

[0131] In some examples, the second sidewall 1103 and the third sidewall 1104 are positioned opposite each other along the direction of gravity, with the second sidewall 1103 above the third sidewall 1104 and the third sidewall 1104 below the second sidewall 1103. For a specific implementation, please refer to [link to specific implementation details]. Figure 15 The first partition 111 is connected to or abuts against the third sidewall 1104, and the liquid inlet 1133 is located in the area of ​​the third sidewall 1104 between the first sidewall 1101 and the first partition 111. This design can accelerate the flow of liquid refrigerant to the second sidewall 1103, creating a flow boiling effect and enhancing heat dissipation.

[0132] This application also provides a power device, which may include at least one power module and a heat dissipation device 100 as described in any of the foregoing embodiments. The outer surface of the first sidewall 1101 of the housing 110 of the heat dissipation device 100 may be used to fix the power module. Alternatively, a heat-conducting substrate within an opening in the first sidewall 1101 may support the power module.

[0133] Optionally, the power device may also include a condenser for liquefying the gaseous refrigerant into a liquid refrigerant. The condenser may be coupled to the gas outlet 1132 and the liquid inlet 1133 of the heat dissipation device 100, respectively.

[0134] Optionally, the second sidewall 1103, where the air outlet 1132 is located, and the third sidewall 1104, where the liquid inlet 1133 is located, are arranged opposite each other along the direction of gravity, with the second sidewall 1103 above the third sidewall 1104. In the power device, the condenser is located above the heat dissipation device 100 along the direction of gravity. The condenser is coupled to the air outlet 1132 and the liquid inlet 1133 of the heat dissipation device to convert gaseous refrigerant into liquid refrigerant. In this design, the power device does not need to use power equipment such as pumps or motors to drive the flow of liquid or gas within the heat dissipation device 100.

[0135] This application also provides a photovoltaic system, including a solar panel and the aforementioned power device, wherein the solar panel is used to convert solar energy into electrical energy, and the power device is used to convert the current and / or voltage from the solar panel.

[0136] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A heat dissipation device (100), characterized in that, include: A housing (110); a heat source is fixed on the outer surface of the first sidewall (1101) of the housing (110), or the first sidewall (1101) of the housing (110) has a window (1131a), and the heat source is fixed on the outer surface of a heat-conducting substrate (1101b) embedded in the window (1131a); an air outlet (1132) is provided on the second sidewall (1103) of the housing (110), and a liquid inlet (1133) is provided on the third sidewall (1104) of the housing (110); The housing (110) has a first partition (111) inside, one side of the first partition (111) facing the first sidewall (1101) and the other side facing away from the first sidewall (1101); the first partition (111) divides the housing (110) into a first cavity (112) and a second cavity (113), and the first partition (111) is provided with one or more channels (1111), each channel (1111) for connecting the first cavity (112) and the second cavity (113) so that the liquid refrigerant in the second cavity (113) flows into the first cavity (112) through the channel (1111), and the end of each channel (1111) near the first sidewall (1101) faces the area where the heat source is fixed on the first sidewall (1101) or faces the heat-conducting substrate (1101b).

2. The heat dissipation device (100) as described in claim 1, characterized in that, The inner peripheral wall of the window (1131a) of the first sidewall (1101) is sealed to the outer peripheral wall of the heat-conducting substrate (1101b).

3. The heat dissipation device (100) as described in claim 1 or 2, characterized in that, The first partition (111) has one or more protrusions (1111c) on the side near the first sidewall (1101); at least one of the protrusions (1111c) is provided with at least one of the channels (1111).

4. The heat dissipation device (100) as described in claim 1, characterized in that, The heat source includes at least one wafer, wherein the projection of each wafer on the first partition (111) avoids each of the channels (1111).

5. The heat dissipation device (100) as described in claim 1, characterized in that, Multiple heat sources are fixed on the outer surface of the first sidewall (1101), and the multiple heat sources are spaced apart; One or more second partitions are built into the cavity between the first partition (111) and the first sidewall (1101), the second partitions being used to separate two adjacent heat sources.

6. The heat dissipation device (100) as described in claim 1, characterized in that, The first sidewall (1101) has a plurality of windows (1131a); At least one second partition is built into the cavity between the first partition (111) and the first sidewall (1101), and each second partition is used to separate two adjacent openings (1131a).

7. The heat dissipation device (100) as described in claim 6, characterized in that, The second sidewall (1103) and the third sidewall (1104) are arranged opposite each other along the direction of gravity, and the first sidewall (1101) is located between the second sidewall (1103) and the third sidewall (1104).

8. The heat dissipation device (100) as described in claim 7, characterized in that, At least one of the surfaces of the second partition faces the second sidewall (1103), and the other surface faces the third sidewall (1104).

9. The heat dissipation device (100) as described in claim 7, characterized in that, At least one of the second partitions has its length direction aligned with the direction of gravity, and one sidewall of at least one of the second partitions (114) is fixed to the first sidewall (1101), with the opposite sidewall of the first partition (111) extending toward the first partition (111).

10. The heat dissipation device (100) as claimed in claim 7, characterized in that, The end of the first partition (111) away from the air outlet (1132) is connected to the first side wall (1101) through the third partition (116). One side of the third partition (116) faces the second side wall (1103), and the other side faces the third side wall (1104).

11. The heat dissipation device (100) as claimed in claim 7, characterized in that, The first partition (111) is connected to the side wall opposite to the first side wall (1101) via a fourth partition (117) near the air outlet (1132). One side of the fourth partition (117) faces the second side wall (1103), and the other side faces the third side wall (1104).

12. The heat dissipation device (100) as claimed in claim 1, characterized in that, At least one of the channels (1111) is a via (1111a).

13. The heat dissipation device (100) as claimed in claim 1, characterized in that, At least one of the channels (1111) is a guide tube (1111b), and the guide tube (1111b) is disposed on the side of the first partition (111) facing the first sidewall (1101).

14. The heat dissipation device (100) as described in claim 13, characterized in that, A heat-conducting element (21) extending into the first cavity (112) is provided on the inner surface of the heat-conducting substrate (1101b); the projection of the heat-conducting element (21) on the first partition (111) avoids each of the channels (1111).

15. The heat dissipation device (100) as described in claim 14, characterized in that, The projection of the free end of the heat-conducting element (21) onto the second sidewall (1103) overlaps with the projection of the guide tube (1111b) onto the second sidewall (1103).

16. The heat dissipation device (100) as claimed in claim 7, characterized in that, Along the direction of gravity, the third sidewall (1104) is located below the second sidewall (1103); The first partition (111) is connected to or abuts against the third sidewall (1104), and the liquid inlet (1133) is located in the area of ​​the third sidewall (1104) between the first sidewall (1101) and the first partition (111).

17. A power device, characterized in that... It includes at least one power module and a heat dissipation device (100) as described in any one of claims 1-16, the heat dissipation device (100) being used to dissipate heat for each power module.

18. A photovoltaic system, characterized in that, It includes a solar panel and a power device as described in claim 17, the solar panel being used to convert solar energy into electrical energy, and the power device being used to convert current and / or voltage from the solar panel.

Images