Semiconductor special gas adjusting module

Abstract

The application discloses a kind of semiconductor special gas adjusting module, comprising: bottom fixed plate, valve, the bottom fixed plate is fixedly installed with base module assembly, several valves are installed on base module assembly, valve includes pressure reducing valve, inlet air manual switch valve, check valve, outlet air manual switch valve, flow controller;Base module assembly includes base module one, base module two and base module three;Air passage is opened in base module one, base module two and base module three;The air passage in base module one and base module two is divided into two independently;Air hole, air passage, air cavity and plug-in surface in base module assembly are all treated with electro-polishing.The application occupies less space, realizes the series connection of multiple valve bodies, reduces the gas movement path, and further reduces the possibility of dust pollution, the structure is smaller, the air passage is connected after metal-to-metal sealing plug-in, reduces the connection mode of thread, welding, further reduces the possibility of gas being contaminated by dust.

Description

Technical Field

[0001] This invention relates to the field of valve technology, specifically to a semiconductor special gas regulating module. Background Technology

[0002] Special gas source valves for semiconductor equipment must meet the ultra-high cleanliness requirements of low leakage rate and minimal flow channel area for semiconductor gas delivery.

[0003] To meet the ever-increasing demands for precision and cleanliness, the existing gas source valve structure for semiconductor equipment has a large overall volume and flow channel area ratio. In addition to occupying a lot of space, it also increases the risk of contamination. Since space is precious in semiconductor product manufacturing equipment, the current general-purpose valve body is too large and has low practicality, which no longer meets the needs of advanced process equipment.

[0004] Gas source valves are interconnected through pipelines. To reduce leakage, threaded seals or welding are often used at the connections. This results in an excessively large flow area for the gas as it passes through the valve body and pipelines, increasing the likelihood of dust contamination. This leads to insufficient gas cleanliness for semiconductors, thus reducing product yield. Therefore, the ratio of flow channel area to solder bead volume needs to be minimized to reduce the possibility of chip contamination, and curved flow channels should be used to prevent dust accumulation.

[0005] Therefore, we propose a semiconductor special gas regulation module to solve the problems mentioned above. Summary of the Invention

[0006] The purpose of this invention is to provide a semiconductor special gas regulating module to solve the problems mentioned in the background art.

[0007] To achieve the above objectives, the present invention provides the following technical solution: a semiconductor special gas regulating module, comprising: a bottom fixing plate and valves, wherein a base module assembly is fixedly installed on the bottom fixing plate, and a plurality of valves are installed on the base module assembly, the valves including a pressure reducing valve, an inlet manual switch valve, a check valve, an outlet manual switch valve, and a flow controller;

[0008] The base module assembly includes base module one, base module two, and base module three;

[0009] Air passages are opened in base module one, base module two and base module three and connected by metal-to-metal sealed plug-in;

[0010] The air passages within base module one and base module two are separate and connected by valve bodies on them;

[0011] The surfaces of the air holes, air passages, air chambers, and connectors within the base module are all electropolished, and the air passages are bent with a large arc at bends.

[0012] Preferably, the base module has an external port integrally provided on one side for connecting to an external air pumping device. The upper surface of the base module has an air hole 1 and an air hole 2. The external port and the air hole 1 are connected through an air passage opened inside the base module. The base module has an insertion air chamber 1 inside. One end of the insertion air chamber 1 is connected to the air hole 2, and the other end of the insertion air chamber 1 penetrates through the right surface of the base module.

[0013] Preferably, the base module 2 has a plug 1 integrally provided on one side, the plug 1 has an air hole 3, the upper surface of the base module 2 has an air hole 4 and an air hole 5, the air hole 3 and the air hole 4 are connected through an air passage opened in the base module 2, the base module 2 has a plug-in air chamber 2, one end of the plug-in air chamber 2 is connected to the air hole 5, and the other end of the plug-in air chamber 2 passes through the side of the base module 2.

[0014] Preferably, the base module three is designed at a right angle, and a plug two is integrally provided on one side of the base module three. An air hole six is ​​opened on the plug two. An air passage is opened inside the base module three. One end of the air passage is connected to the air hole six, and the other end of the air passage penetrates through the side surface of the base module three to form an air hole seven. The base module three is symmetrically arranged on both sides of the flow controller.

[0015] Preferably, the base module one is connected to the plug one of the base module two through the internal plug-in air chamber one, and the base module two is connected to the plug two of the base module three through the internal plug-in air chamber two.

[0016] Preferably, the air inlet and outlet ports of the valve are connected to the air ports of base module one and base module two.

[0017] Preferably, the pressure reducing valve includes a pressure regulating cover, an upper valve body, a lower valve body, and a foot. The foot is integrally designed with the lower valve body, the upper valve body is threadedly connected to the lower valve body, and the upper valve body is rotatably connected to the pressure regulating cover.

[0018] Preferably, the lower valve body has an open inner cavity, an air inlet cavity, and an air outlet cavity. The air inlet cavity and the air outlet cavity are connected to the open inner cavity. The air outlet cavity is located on the central axis of the lower valve body. The connection between the air outlet cavity and the open inner cavity is designed as a bottleneck. The air outlet cavity is equipped with a pin assembly. The air inlet cavity and the air outlet cavity pass through the foot seat.

[0019] The ejector assembly includes an ejector pin and a sealing cone. The ejector pin has a thread on its middle surface. The ejector pin slides and fits the sealing cone. The sealing cone is located below the thread of the ejector pin. The sealing cone fits into the bottleneck of the air outlet channel. The maximum diameter of the sealing cone is smaller than the inner diameter of the air outlet channel.

[0020] The upper valve body has a diaphragm assembly inside its open inner cavity, an elastic pressure regulating assembly above the diaphragm assembly, a pin assembly fixedly connected to the diaphragm assembly, and the diaphragm assembly abutting against the elastic pressure regulating assembly.

[0021] The diaphragm assembly includes a diaphragm assembly fixing rod, a diaphragm assembly base, a diaphragm assembly mounting seat, and a diaphragm fixing component. The diaphragm assembly mounting seat is fixedly installed in the open inner cavity of the lower valve body. The lower surface of the diaphragm assembly mounting seat has a concave design, which allows the open inner cavity to retain a portion of space that communicates with the air outlet and air inlet channels. The diaphragm assembly base is slidably connected through the middle of the diaphragm assembly mounting seat. The lower edge of the diaphragm assembly base has a retaining edge that snaps into the diaphragm assembly mounting seat, limiting the sliding distance of the diaphragm assembly base. The upper end of the diaphragm assembly base has an integrally formed diaphragm assembly fixing rod. The diaphragm fixing component is fixedly threaded on the lower surface of the diaphragm assembly base. A diaphragm is sandwiched between the diaphragm fixing component and the diaphragm assembly base. The ejector pin is threadedly connected to the diaphragm fixing component.

[0022] Preferably, the surfaces of the diaphragm assembly, ejector assembly, open inner cavity, air inlet channel, and air outlet channel are electropolished.

[0023] Preferably, the elastic pressure regulating assembly includes a pressure regulating cover, a pressure regulating rod, a pressure transmission plate, a spring, a pressure ring, a corrugated spring, a gasket, and a spring seat. The spring seat is slidably disposed within the upper valve body. A corrugated spring is sleeved on the outside of the spring seat. The lower end of the corrugated spring abuts against the diaphragm assembly mounting seat, and the upper end of the corrugated spring abuts against the spring seat. A diaphragm assembly fixing rod is threadedly connected to the middle of the spring seat. The diaphragm assembly fixing rod passes through the upper and lower surfaces of the spring seat. The upper end of the spring seat abuts against the pressure ring, which is sleeved on the upper end of the diaphragm assembly fixing rod. A gasket is provided on the upper surface of the pressure ring, and the upper surface of the gasket abuts against the spring. A pressure transmission plate is inserted into the upper end of the spring. The upper surface of the pressure transmission plate abuts against the pressure regulating rod. The upper end of the pressure regulating rod is fixedly connected to the pressure regulating cover. A circular pressure head is integrally provided at the connection between the lower end of the pressure regulating rod and the pressure transmission plate. A groove is provided on the upper surface of the pressure transmission plate to limit the circular pressure head and prevent it from shifting away from the pressure transmission plate when it moves downward.

[0024] The pressure regulating rod passes through the upper end face of the upper valve body, and the surface of the pressure regulating rod is threaded, and the pressure regulating rod is threadedly connected to the upper end face of the upper valve body;

[0025] A sealing ring is fitted on the upper side surface of the upper valve body for sliding sealing between the upper valve body and the pressure regulating cover.

[0026] Compared with the prior art, the beneficial effects of the present invention are:

[0027] 1. The base module assembly is fixedly installed on the bottom fixing plate. The base module assembly is equipped with valves. The overall volume is smaller and occupies less space. The air inlet and outlet of the valve are connected to the air holes of base module one and base module two to realize the series connection of multiple valves, reduce the gas movement path, and thus reduce the possibility of dust contamination, meeting the cleanliness and precise control requirements of semiconductor valves.

[0028] 2. Pressure reducing valves control gas flow and pressure, have a smaller structure, ensure stable gas pressure discharge, and reduce gas flow path.

[0029] 3. Base module one connects to plug one of base module two through internal plug-in air chamber one, and base module two connects to plug two of base module three through internal plug-in air chamber two. The air passages are connected after metal-to-metal sealing plug-in, reducing threaded and welded connection methods and further reducing the possibility of gas being contaminated by dust. Attached Figure Description

[0030] Figure 1 This is a schematic diagram of the structure of the present invention;

[0031] Figure 2 This is a schematic diagram of the bottom fixing plate and base module assembly in this invention;

[0032] Figure 3 This is a cross-sectional view of the base module component in this invention;

[0033] Figure 4 This is a structural schematic diagram of the base module one in this invention;

[0034] Figure 5 This is a cross-sectional view of the base module one in this invention;

[0035] Figure 6 This is a schematic diagram of the structure of base module two in this invention;

[0036] Figure 7 This is a cross-sectional view of the base module two in this invention;

[0037] Figure 8 This is a structural schematic diagram of base module three in this invention;

[0038] Figure 9 This is a cross-sectional view of the pressure reducing valve in this invention.

[0039] In the diagram: 1. Bottom fixing plate; 2. Base module assembly; 3. Pressure reducing valve; 4. Base module one; 5. Base module two; 6. Base module three; 7. External port; 8. Air port one; 9. Air port two; 10. Plug one; 11. Air port three; 12. Air port four; 13. Air port five; 14. Plug two; 15. Air port six; 16. Air port seven; 17. Plug-in air chamber one; 18. Plug-in air chamber two; 21. Pressure regulating cover; 22. Upper valve body; 23. Lower valve body; 24. Foot; 25. Pressure regulating valve. 26. Rod; 27. Sealing ring; 28. Pressure transmission plate; 29. ​​Circular pressure head; 30. Spring; 31. Pressure ring; 32. Diaphragm assembly fixing rod; 33. Corrugated spring; 34. Diaphragm assembly base; 35. Diaphragm assembly mounting base; 36. Diaphragm fixing component; 37. Ejector pin; 38. Air inlet channel; 39. Air outlet channel; 40. Sealing cone; 41. Gasket; 42. Spring seat; 50. Diaphragm; 51. Inlet manual switch valve; 52. Check valve; 53. Outlet manual switch valve; 54. Flow controller. Detailed Implementation

[0040] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0041] Please see Figure 1-9 The present invention provides a technical solution: a semiconductor special gas regulating module, comprising: a bottom fixing plate 1 and valves, wherein a base module assembly 2 is fixedly installed on the bottom fixing plate 1, and a plurality of valves are installed on the base module assembly 2, the valves including a pressure reducing valve 3, an inlet manual switch valve 50, a check valve 51, an outlet manual switch valve 52, and a flow controller 53.

[0042] The base module assembly 2 includes base module one 4, base module two 5, and base module three 6. Base module one 4 has an external port 7 integrally provided on one side. The external port 7 is provided with a sealing ring and is used to connect to an external air pump device. The upper surface of base module one 4 has air hole one 8 and air hole two 9. The external port 7 and air hole one 8 are connected through an air passage opened inside base module one 4. The base module one 4 has an insertion air chamber one 17. One end of the insertion air chamber one 17 is connected to air hole two 9, and the other end of the insertion air chamber one 17 penetrates through the right surface of base module one 4.

[0043] The base module 25 has a plug 10 integrated on one side, and the plug 10 has an air hole 3 11. The upper surface of the base module 25 has an air hole 4 12 and an air hole 5 13. The air hole 3 11 and the air hole 4 12 are connected through an air passage opened in the base module 25. The base module 25 has a plug-in air chamber 2 18. One end of the plug-in air chamber 2 18 is connected to the air hole 5 13, and the other end of the plug-in air chamber 2 18 passes through the side of the base module 25.

[0044] The base module 36 is designed at a right angle. A plug 214 is integrally provided on one side of the base module 36. An air hole 615 is opened on the plug 214. An air passage is opened inside the base module 36. One end of the air passage is connected to the air hole 615, and the other end of the air passage passes through the side surface of the base module 36 to form an air hole 716.

[0045] The base module 3 is symmetrically arranged on both sides of the flow controller.

[0046] The base module 1 4 is connected to the plug 10 of the base module 2 5 through the internal plug-in air chamber 17, so that the air hole 2 9 is connected to the air hole 3 11 and the air hole 4 12 in sequence, so that the base module 1 4 and the base module 2 5 cooperate to form a gas passage.

[0047] The base module 2 5 connects to the plug 2 14 of the base module 3 6 through the internal plug-in air chamber 2 18, so that the air hole 5 13 is connected to the air hole 6 15 and the air hole 7 16 at the same time, so that the base module 2 5 and the base module 3 6 cooperate to form a gas passage.

[0048] The air holes, air passages and air chambers inside the base module assembly 2, as well as the external ports 7, plug one 10 and plug two 14 on the outside of the base module assembly 2, are all electropolished to achieve the high cleanliness requirements of the semiconductor metal to metal sealing shut-off. Large-radius bends are used at the bends of the air passages.

[0049] The valve's air inlet and outlet ports are connected to the air ports of base module 4 and base module 5, enabling multiple valve bodies to be connected in series, reducing the gas movement path, thereby reducing the possibility of dust contamination and meeting the cleanliness and precise control requirements of valves used in semiconductors.

[0050] The pressure reducing valve 3 includes a pressure regulating cover 21, an upper valve body 22, a lower valve body 23, and a foot 24. The foot 24 is integrally designed with the lower valve body 23. The upper valve body 22 is threadedly connected to the lower valve body 23. The upper valve body 22 is rotatably connected to the pressure regulating cover 21.

[0051] The lower valve body 23 has an open inner cavity, an air inlet channel 37 and an air outlet channel 38. Both the air inlet channel 37 and the air outlet channel 38 are connected to the open inner cavity. The air outlet channel 38 is located on the central axis of the lower valve body 23. The connection between the air outlet channel 38 and the open inner cavity is designed as a bottleneck. The air outlet channel 38 is equipped with a pin assembly. The air inlet channel 37 and the air outlet channel 38 pass through the foot seat 24.

[0052] The ejector assembly includes an ejector pin 36 and a sealing cone 39. The middle surface of the ejector pin 36 is threaded. The ejector pin 36 is slidably fitted with the sealing cone 39. The sealing cone 39 is located below the thread of the ejector pin 36. The sealing cone 39 fits into the bottleneck of the air outlet channel 38. The maximum diameter of the sealing cone 39 is smaller than the inner diameter of the air outlet channel 38.

[0053] A diaphragm assembly is provided in the open inner cavity of the upper valve body 22. An elastic pressure regulating assembly is provided above the diaphragm assembly. The ejector pin assembly is fixedly connected to the diaphragm assembly and the elastic pressure regulating assembly abuts against each other. High-pressure gas enters from the inlet chamber 37, passes through the open inner cavity of the lower valve body 23, and enters the outlet chamber 38. The elastic pressure regulating assembly generates elastic pressure on the diaphragm assembly, which offsets part of the pressure relative to the gas pressure, thereby reducing the gas pressure. The diaphragm assembly presses the ejector pin assembly downward, causing the ejector pin assembly to separate from the bottleneck of the outlet chamber 38, so that the outlet chamber 38 is connected vertically, and the gas is discharged from the outlet chamber 38.

[0054] The diaphragm assembly includes a diaphragm assembly fixing rod 31, a diaphragm assembly base 33, a diaphragm assembly mounting seat 34, and a diaphragm fixing member 35. The diaphragm assembly mounting seat 34 is fixedly installed in the open inner cavity of the lower valve body 23. The lower surface of the diaphragm assembly mounting seat 34 is concave, so that the open inner cavity retains a part of the space to communicate with the air outlet 38 and the air inlet 37. The diaphragm assembly mounting seat 34 is slidably connected to the diaphragm assembly base 33 through the middle. The lower edge of the diaphragm assembly base 33 is provided with a retaining edge, which is snapped with the diaphragm assembly mounting seat 34 to limit the sliding distance of the diaphragm assembly base 33. The upper end of the diaphragm assembly base 33 is integrally provided with a diaphragm assembly fixing rod 31. The diaphragm fixing member 35 is fixedly threaded on the lower surface of the diaphragm assembly base 33. A diaphragm 42 is sandwiched between the diaphragm fixing member 35 and the diaphragm assembly base 33.

[0055] The ejector pin 36 is threadedly connected to the diaphragm fixing member 35 and is used to adjust the relative position of the ejector pin 36 and the diaphragm fixing member 35.

[0056] The surfaces of the diaphragm assembly, ejector assembly, open inner cavity, air inlet 37 and air outlet 38 are electropolished.

[0057] The elastic pressure regulating assembly includes a pressure regulating cover 21, a pressure regulating lever 25, a pressure transmission plate 27, a spring 29, a pressure ring 30, a corrugated spring 32, a gasket 40, and a spring seat 41. The spring seat 41 is slidably mounted up and down within the upper valve body 22. A corrugated spring 32 is sleeved on the outside of the spring seat 41. The lower end of the corrugated spring 32 abuts against the diaphragm assembly mounting base 34, and the upper end of the corrugated spring 32 abuts against the spring seat 41. A diaphragm assembly fixing rod 31 is threadedly connected to the middle of the spring seat 41. The diaphragm assembly fixing rod 31 passes through both the upper and lower surfaces of the spring seat 41 and is used to adjust the relative position of the diaphragm assembly fixing rod 31 and the spring seat 41. The upper end of the spring seat 41 abuts against the pressure ring 30, which is sleeved on the upper end of the diaphragm assembly fixing rod 31. A gasket 40 is provided on the upper surface of the pressure ring 30, and the upper surface of the gasket 40 abuts against the spring 29. The upper end of the spring 29 is inserted into the pressure transmission plate 27, and the upper surface of the pressure transmission plate 27 abuts against the pressure adjusting rod 25. The upper end of the pressure adjusting rod 25 is fixedly connected to the pressure adjusting cover 21. A circular pressure head 28 is integrally provided at the connection between the lower end of the pressure adjusting rod 25 and the pressure transmission plate 27. A groove is provided on the upper surface of the pressure transmission plate 27 to limit the circular pressure head 28 and prevent it from shifting away from the pressure transmission plate 27 when it moves down.

[0058] The pressure regulating lever 25 passes through the upper end face of the upper valve body 22, and the surface of the pressure regulating lever 25 is threaded, and the pressure regulating lever 25 is threadedly connected to the upper end face of the upper valve body 22.

[0059] A sealing ring 26 is fitted on the upper side surface of the upper valve body 22 for sliding sealing between the upper valve body 22 and the pressure regulating cover 21.

[0060] Rotating the pressure regulating cover 21 causes the pressure regulating lever 25 to rotate, moving it up and down within the upper valve body 22. This causes the pressure transmission plate 27 to move up and down, compressing the spring 29. Adjusting the spring 29's elastic force on the gasket 40 and pressure ring 30, the pressure ring 30 transmits this elastic force to the spring seat 41. The spring seat 41 applies a buffering elastic force through the wave spring 32, thereby controlling the up and down movement of the diaphragm assembly fixing rod 31. The diaphragm assembly fixing rod 31 applies an elastic force to the ejector pin 36 through the diaphragm fixing member 35. High-pressure gas enters the base module 4 through the external port 7, enters the valve body's inlet chamber 37 through the air hole 8, and then enters the outlet chamber 38 through the open inner cavity of the lower valve body 23. The diaphragm assembly counteracts a portion of the gas pressure, thus controlling the gas... The pressure is reduced, and at the same time, the diaphragm fixing member 35 presses down the ejector pin 36, causing the sealing cone 39 to separate from the bottleneck of the outlet channel 38, so that the outlet channel 38 is connected from top to bottom. The gas is discharged from the outlet channel 38 and is led out from the second air hole 9 connected to the outlet channel 38. It enters the third air hole 11 of the base module 2 5 through the third air hole 11, and then is introduced into the inlet channel 37 of the second valve body through the fourth air hole 12. It is then led out from the outlet channel 38 of the second valve body. After passing through several base modules 2 5 in sequence, the gas enters the flow controller through the base module 3 6. The gas is then led out from the other side of the base module 3 6, base module 2 5 and base module 1 4 in sequence, realizing the flow rate and pressure reduction control of the gas, realizing the stable discharge of the gas pressure, and reducing the gas flow path.

[0061] The base module assembly 2 is fixedly installed on the bottom fixing plate 1 of this invention. The base module assembly 2 is composed of several modules, which can be used with pressure reducing valve 3, inlet manual switch valve 50, check valve 51, outlet manual switch valve 52, flow controller 53, and can also be used with filter, pressure gauge and other components to form a valve group model. Its overall volume is smaller and occupies less space. The inlet and outlet of the valve are connected to the air holes of the base module to realize the series connection of multiple valve bodies, reduce the gas movement path, and thus reduce the possibility of dust pollution, meeting the cleanliness requirements and precise control requirements of semiconductor valves.

[0062] The contents not described in detail in this specification are existing technologies known to those skilled in the art.

[0063] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A semiconductor special gas conditioning module, comprising: The bottom fixed plate (1) is fixedly installed with a base module assembly (2), and the base module assembly (2) is installed with a plurality of valves, including a pressure reducing valve (3), an air inlet manual switch valve (50), a check valve (51), an air outlet manual switch valve (52) and a flow controller (53). The base module assembly (2) comprises a base module one (4), a base module two (5) and a base module three (6), air passages are formed in the base module one (4), the base module two (5) and the base module three (6), and the air passages are connected in communication after being plugged and sealed by metal-to-metal sealing, the air passages in the base module one (4) and the base module two (5) are divided into two independent parts and are connected in communication through valve bodies thereon, the air holes, the air passages, the air cavities and the surfaces of the plugged parts in the base module assembly (2) are all subjected to electro-polishing treatment, and the air passages are all bent with large radii. The pressure reducing valve (3) comprises a pressure adjusting cover (21), an upper valve body (22), a lower valve body (23) and a foot base (24), the foot base (24) is designed in one piece with the lower valve body (23), the upper valve body (22) is threadedly connected with the lower valve body (23), and the upper valve body (22) is rotatably connected with the pressure adjusting cover (21). An open inner cavity, an air inlet passage (37) and an air outlet passage (38) are formed in the lower valve body (23), the air inlet passage (37) and the air outlet passage (38) are in communication with the open inner cavity, the air outlet passage (38) is located on the central axis of the lower valve body (23), the communication part of the air outlet passage (38) with the open inner cavity is designed in a bottle-neck shape, a thimble assembly is arranged in the air outlet passage (38), and the air inlet passage (37) and the air outlet passage (38) penetrate through the foot base (24). The thimble assembly comprises a thimble (36) and a sealing cone (39), the thimble (36) is provided with a thread on the middle surface, the thimble (36) is slidably sleeved with the sealing cone (39), the sealing cone (39) is located below the thread of the thimble (36), and the sealing cone (39) is engaged with the bottle neck of the air outlet passage (38). A diaphragm assembly is arranged in the open inner cavity of the upper valve body (22), an elastic pressure adjusting assembly is arranged above the diaphragm assembly, the thimble assembly is fixedly connected with the diaphragm assembly, and the diaphragm assembly is in abutment connection with the elastic pressure adjusting assembly.

2. The semiconductor special gas adjusting module according to claim 1, characterized in that, An external port (7) is integrally arranged on one side of the base module one (4), the external port (7) is used for being connected with an external pump air device, air holes one (8) and two (9) are formed on the upper surface of the base module one (4), the external port (7) and the air hole one (8) are in communication through an air passage formed in the base module one (4), a plugged air cavity one (17) is formed in the base module one (4), one end of the plugged air cavity one (17) is in communication with the air hole two (9), and the other end of the plugged air cavity one (17) penetrates through the right surface of the base module one (4).

3. The semiconductor special gas adjusting module according to claim 2, characterized in that, The base module two (5) is integrally provided with a plug one (10) on one side, the plug one (10) is provided with a gas hole three (11), the upper surface of the base module two (5) is provided with a gas hole four (12) and a gas hole five (13), the gas hole three (11) and the gas hole four (12) are communicated through the gas channel provided in the base module two (5), the base module two (5) is provided with a plug-in air cavity two (18), one end of the plug-in air cavity two (18) is communicated with the gas hole five (13), the other end of the plug-in air cavity two (18) penetrates the side surface of the base module two (5).

4. The semiconductor special gas adjusting module according to claim 3, characterized in that, The base module three (6) is designed at right angles, the base module three (6) is integrally provided with a plug two (14) on one side, the plug two (14) is provided with a gas hole six (15), the base module three (6) is provided with a gas channel, one end of the gas channel is communicated with the gas hole six (15), the other end of the gas channel penetrates the side surface of the base module three (6) to form a gas hole seven (16), the base module three (6) is symmetrically arranged on both sides of the flow controller.

5. The semiconductor special gas conditioning module according to any one of claims 1-4, wherein The base module one (4) is plugged with the plug one (10) of the base module two (5) through the internal plug-in air cavity one (17), the base module two (5) is plugged with the plug two (14) of the base module three (6) through the internal plug-in air cavity two (18).

6. The semiconductor special gas adjusting module according to claim 1, characterized in that, The gas inlet and outlet holes of the valve are butted with the gas holes of the base module one (4) and the base module two (5).

7. The semiconductor special gas adjusting module according to claim 1, characterized in that, The diaphragm assembly comprises a diaphragm assembly fixing rod (31), a diaphragm assembly base (33), a diaphragm assembly mounting seat (34) and a diaphragm fixing piece (35), the diaphragm assembly mounting seat (34) is fixedly arranged in the open inner cavity of the lower valve body (23), the lower surface of the diaphragm assembly mounting seat (34) is designed in a recessed manner, so that a part of the space of the open inner cavity is communicated with the gas outlet channel (38) and the gas inlet channel (37), the diaphragm assembly base (33) is slidably connected to the diaphragm assembly mounting seat (34) in a penetrating manner, the diaphragm assembly base (33) is provided with a clamping edge at the lower end edge, which is buckled with the diaphragm assembly mounting seat (34) to limit the sliding distance of the diaphragm assembly base (33), the diaphragm assembly base (33) is integrally provided with the diaphragm assembly fixing rod (31) at the upper end, the diaphragm fixing piece (35) is fixedly screwed on the lower surface of the diaphragm assembly base (33), the diaphragm (42) is clamped between the diaphragm fixing piece (35) and the diaphragm assembly base (33), and the thimble (36) is screwed with the diaphragm fixing piece (35).

8. The semiconductor special gas adjusting module according to claim 7, characterized in that, The surfaces of the diaphragm assembly, the thimble assembly, the open inner cavity, the gas inlet channel (37) and the gas outlet channel (38) are subjected to electro-polishing treatment.

9. The semiconductor special gas adjusting module according to claim 1, characterized in that, The elastic pressure regulating assembly comprises a pressure regulating cover (21), a pressure regulating pressure rod (25), a pressure transmission sheet (27), a spring (29), a pressure ring (30), a wave spring sheet (32), a gasket (40) and a spring seat (41), the spring seat (41) is arranged to slide up and down in the upper valve body (22), the wave spring sheet (32) is sleeved outside the spring seat (41), the lower end of the wave spring sheet (32) abuts against the diaphragm assembly mounting seat (34), the upper end of the wave spring sheet (32) abuts against the spring seat (41), the diaphragm assembly fixing rod (31) is threadedly connected in the middle of the spring seat (41), the diaphragm assembly fixing rod (31) penetrates through the upper and lower two faces of the spring seat (41), the upper end of the spring seat (41) is connected to the pressure ring (30), the pressure ring (30) is sleeved on the upper end of the diaphragm assembly fixing rod (31), the upper surface of the pressure ring (30) is provided with the gasket (40), the upper surface of the gasket (40) is connected to the spring (29), the upper end of the spring (29) is inserted into the pressure transmission sheet (27), the upper surface of the pressure transmission sheet (27) is connected to the pressure regulating pressure rod (25), the upper end of the pressure regulating pressure rod (25) is fixedly connected to the pressure regulating cover (21), the lower end of the pressure regulating pressure rod (25) is integrally provided with a circular pressure head (28) at the connection position with the pressure transmission sheet (27), a groove is formed in the upper surface of the pressure transmission sheet (27) for limiting the circular pressure head (28) and preventing the circular pressure head (28) from deviating from the pressure transmission sheet (27) when moving downward; The pressure regulating pressure rod (25) penetrates through the upper end surface of the upper valve body (22), and the surface of the pressure regulating pressure rod (25) is provided with threads, the pressure regulating pressure rod (25) is threadedly connected with the upper end surface of the upper valve body (22); The upper valve body (22) is sleeved with a sealing ring (26) on the upper side surface, for sliding sealing of the upper valve body (22) and the pressure regulating cover (21).

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