A method, apparatus and readable storage medium for simulating adhesive curing

Abstract

This invention provides a method, apparatus, and readable storage medium for simulating adhesive curing. By acquiring the curing process parameters and a first temperature change parameter of the adhesive to be evaluated, and the second temperature change parameter of the camera module, a thermosetting model and a thermodynamic model for the adhesive to be evaluated are established based on these parameters. Next, the thermosetting model and the thermodynamic model are correlated to establish a heat transfer enthalpy change thermodynamic deformation model. Based on this model, the simulation model of the camera module, and the simulation model of the adhesive to be evaluated, a target simulation model for the camera module can be established. Furthermore, when performing adhesive curing simulation on the target simulation model, the effects of any one or more of the following—camera module deformation, overall temperature change, and the degree of adhesive curing—can be calculated, resulting in more accurate simulation curing results.

Description

Technical Field

[0001] This invention relates to the field of computer simulation technology, and in particular to a method, apparatus and readable storage medium for simulating adhesive curing. Background Technology

[0002] For camera modules, lens locking adhesive is needed to bond the lens to the voice coil motor, or to fix multiple lenses within the lens barrel. During the curing process, the lens locking adhesive shrinks and deforms due to the temperature of the working environment, causing deformation of the lens barrel or individual lenses within it. This results in a decrease in the camera module's resolution. Furthermore, there is currently no suitable method to measure this deformation; the impact can only be determined through curing simulations of the lens locking adhesive.

[0003] Current simulation software defines thermal parameters in the thermal module to calculate the temperature field, and then inputs the temperature field as initial conditions and mechanical parameters into the structural mechanics module to calculate the stress field. Because the part connecting the lens and the adhesive expands and deforms due to the temperature of the adhesive, lens deformation (lens or barrel deformation) can easily squeeze out uncured adhesive. This squeezed adhesive can seep deeper into the lens, and due to lack of light, it may not cure completely. Therefore, the presence of adhesive causing lens structural deformation, which in turn affects the curing process of the bonding adhesive, is a phenomenon where structural deformation, in turn, affects the degree of adhesive curing and temperature.

[0004] Existing simulation methods cannot account for the interaction between glue temperature changes or curing degree and lens deformation. Therefore, it is necessary to correlate the parameters of temperature, glue curing, and structure to obtain more accurate results in the simulation calculation of lens deformation caused by glue curing. Summary of the Invention

[0005] This invention provides a method, apparatus, and readable storage medium for simulating adhesive curing, which solves the technical problem that when simulating the curing of adhesive for camera modules, the deformation of the camera module structure makes it impossible to calculate the impact of temperature changes or the degree of adhesive curing, resulting in inaccurate curing simulation results.

[0006] In a first aspect, the present invention provides an adhesive curing simulation method, applied to a camera module, through an embodiment of the present invention, the method comprising:

[0007] Obtain the curing process parameters and first temperature change parameters of the adhesive to be evaluated, and obtain the second temperature change parameters of the camera module;

[0008] Based on the curing process parameters, the first temperature change parameter, and the second temperature change parameter, a thermosetting model and a thermodynamic model are established for the adhesive to be evaluated.

[0009] The thermosetting model and the thermodynamic model are associated to establish a heat transfer enthalpy change thermodynamic deformation model. Based on the heat transfer enthalpy change thermodynamic deformation model, the simulation model of the camera module, and the simulation model of the adhesive to be evaluated, a target simulation model for the camera module is established.

[0010] The target simulation model is subjected to glue curing simulation to obtain the simulation curing results of the glue to be evaluated.

[0011] Optionally, the curing process parameters include curing heat release, shrinkage coefficient, elastic modulus and Poisson's ratio, the first temperature change parameter includes the density, specific heat capacity and thermal conductivity of the adhesive to be evaluated, and the second temperature change parameter includes the density, specific heat capacity and thermal conductivity of the camera module.

[0012] The step of establishing a thermosetting model and a thermodynamic model for the adhesive to be evaluated based on the curing process parameters, the first temperature change parameter, and the second temperature change parameter includes: establishing the thermosetting model based on the density, specific heat capacity, and thermal conductivity of the adhesive to be evaluated, the density, specific heat capacity, and thermal conductivity of the camera module, the heat release during curing, and the shrinkage coefficient; and establishing the thermodynamic model based on the elastic modulus and the Poisson's ratio.

[0013] Optionally, before associating the thermosetting model with the thermodynamic model, the method further includes: establishing a set of enthalpy difference equations based on the specific heat capacity and thermal conductivity of the adhesive to be evaluated, so as to determine the degree of curing of the adhesive to be evaluated through the set of enthalpy difference equations.

[0014] Optionally, associating the thermosetting model with the thermodynamic model to establish a heat transfer enthalpy change thermodynamic deformation model includes: associating the thermosetting model, the enthalpy difference equation set, and the thermodynamic model with each other to establish the heat transfer enthalpy change thermodynamic deformation model.

[0015] Optionally, the glue curing simulation of the target simulation model includes: applying boundary conditions to the target simulation model to perform glue curing simulation; the boundary conditions include light energy, ambient temperature, and displacement constraints.

[0016] Optionally, after obtaining the simulated curing result of the adhesive to be evaluated, the method further includes: determining the curing difference result based on the simulated curing result and the result before curing; the result before curing is obtained before the adhesive to be evaluated is subjected to adhesive curing simulation; and modifying the actual curing conditions of the adhesive to be evaluated using the curing difference result.

[0017] Secondly, through one embodiment of the present invention, the present invention provides an adhesive curing simulation device for use in a camera module, the device comprising:

[0018] The parameter acquisition unit is used to acquire the curing process parameters and the first temperature change parameter of the adhesive to be evaluated, as well as the second temperature change parameter of the camera module.

[0019] The first model creation unit is used to establish a thermo-curing model and a thermodynamic model for the adhesive to be evaluated based on the curing process parameters, the first temperature change parameter and the second temperature change parameter.

[0020] The second model creation unit is used to associate the thermosetting model with the thermodynamic model to establish a heat transfer enthalpy change thermodynamic deformation model, and based on the heat transfer enthalpy change thermodynamic deformation model, the simulation model of the camera module and the simulation model of the adhesive to be evaluated, to establish a target simulation model for the camera module.

[0021] The curing simulation unit is used to perform glue curing simulation on the target simulation model to obtain the simulation curing results of the glue to be evaluated.

[0022] Optionally, the curing process parameters include curing heat release, shrinkage coefficient, elastic modulus and Poisson's ratio, the first temperature change parameter includes the density, specific heat capacity and thermal conductivity of the adhesive to be evaluated, and the second temperature change parameter includes the density, specific heat capacity and thermal conductivity of the camera module.

[0023] The first model creation unit is specifically used to: establish the thermosetting model based on the density, specific heat capacity, thermal conductivity of the adhesive to be evaluated, the density, specific heat capacity, thermal conductivity of the camera module, the heat release during curing, and the shrinkage coefficient;

[0024] The thermodynamic model is established based on the elastic modulus and the Poisson's ratio.

[0025] Optionally, the first model creation unit is further configured to: establish a set of enthalpy difference equations based on the specific heat capacity and thermal conductivity of the adhesive to be evaluated, so as to determine the degree of curing of the adhesive to be evaluated through the set of enthalpy difference equations.

[0026] Thirdly, through one embodiment of the present invention, a readable storage medium is provided having a program stored thereon, which, when executed by a processor, implements any of the embodiments of the first aspect.

[0027] One or more technical solutions provided in the embodiments of the present invention have at least the following technical effects or advantages:

[0028] First, the curing process parameters and first temperature change parameter of the adhesive to be evaluated are obtained, as well as the second temperature change parameter of the camera module. Then, based on the curing process parameters, the first temperature change parameter, and the second temperature change parameter, a thermosetting model and a thermodynamic model for the adhesive to be evaluated are established. Next, the thermosetting model and the thermodynamic model are linked to establish a heat transfer enthalpy change thermodynamic deformation model. Based on the heat transfer enthalpy change thermodynamic deformation model, the simulation model of the camera module, and the simulation model of the adhesive to be evaluated, a target simulation model for the camera module can be established. Because the simulation models of the camera module, the adhesive to be evaluated, and the heat transfer enthalpy change thermodynamic deformation model are linked, when performing adhesive curing simulation on the target simulation model, the effects of any one or more of the following—camera module deformation, overall temperature change, and the degree of adhesive curing—can be calculated, resulting in more accurate simulation curing results. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0030] Figure 1 This is a flowchart of the glue curing simulation method in an embodiment of the present invention;

[0031] Figure 2 This is a temperature gradient cloud map obtained through a curing simulation of the adhesive to be evaluated in an embodiment of the present invention;

[0032] Figure 3 This is a curing state cloud map obtained by simulating the curing of the adhesive to be evaluated in an embodiment of the present invention;

[0033] Figure 4 This is a cloud map of the initial lens displacement deformation obtained through a simulation of the curing of the adhesive to be evaluated in an embodiment of the present invention.

[0034] Figure 5 This is a cloud map of the mid-term lens displacement deformation obtained through a simulation of the curing of the adhesive to be evaluated in an embodiment of the present invention.

[0035] Figure 6This is a cloud map of the final lens displacement deformation obtained through a simulation of the curing of the adhesive to be evaluated in an embodiment of the present invention.

[0036] Figure 7 This is a stress cloud diagram of the camera module obtained through a simulation of the curing of the adhesive to be evaluated in an embodiment of the present invention.

[0037] Figure 8 This is a schematic diagram of the structure of the curing simulation device in an embodiment of the present invention;

[0038] Figure 9 This is a schematic diagram of a readable storage medium structure in an embodiment of the present invention. Detailed Implementation

[0039] This invention provides a method, apparatus, and readable storage medium for simulating adhesive curing, thereby solving the technical problem of inaccurate curing simulation results obtained when performing curing simulation on the adhesive used to attach camera modules.

[0040] The technical solution provided by the embodiments of the present invention is to solve the above-mentioned technical problems, and the general idea is as follows:

[0041] First, the curing process parameters and first temperature change parameter of the adhesive to be evaluated are obtained, as well as the second temperature change parameter of the camera module. Then, based on the curing process parameters, the first temperature change parameter, and the second temperature change parameter, a thermosetting model and a thermodynamic model for the adhesive to be evaluated are established. Next, the thermosetting model and the thermodynamic model are linked to establish a heat transfer enthalpy change thermodynamic deformation model. Based on the heat transfer enthalpy change thermodynamic deformation model, the simulation model of the camera module, and the simulation model of the adhesive to be evaluated, a target simulation model for the camera module can be established. Finally, adhesive curing simulation is performed on the target simulation model to obtain the simulated curing results.

[0042] To better understand the above technical solutions, the following will provide a detailed explanation of the technical solutions in conjunction with the accompanying drawings and specific implementation methods.

[0043] First, it should be clarified that the term "and / or" in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this article generally indicates that the preceding and following related objects have an "or" relationship.

[0044] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that embodiments of the invention described herein can be implemented in sequences other than those illustrated or described herein.

[0045] In a first aspect, the present invention provides a glue curing simulation method applied to a camera module. The camera module includes a lens composed of multiple lenses and a lens barrel, as well as a motor. During the assembly of the lenses and lens barrel, glue is used to bond and fix the multiple lenses to designated positions on the lens barrel, and glue is also used to fix the voice coil motor to the lens.

[0046] However, the adhesive shrinks during the curing process, causing lens deformation and potentially leading to displacement between multiple lens elements, thus affecting the actual bonding effect. Furthermore, due to varying depths of adhesive penetration and the heat released during curing, the degree of adhesive curing within the lens can easily become inconsistent.

[0047] Given that at least two of the above situations exist, the current simulation of the curing of adhesive in camera modules often fails to yield accurate simulation results.

[0048] The adhesive curing simulation method provided in this invention can effectively solve the above problems. Please refer to [link / reference]. Figure 1 As shown, the method includes the following steps:

[0049] Step S101: Obtain the curing process parameters and first temperature change parameters of the adhesive to be evaluated, and obtain the second temperature change parameters of the camera module.

[0050] Specifically, the adhesive to be evaluated can be any type of adhesive capable of attaching to the camera module. For example, the adhesive to be evaluated can be UV (Ultraviolet Rays) adhesive.

[0051] Taking UV adhesives as an example, the pre-curing principle of UV adhesives is that the photoinitiator in the adhesive is exposed to light of a specific wavelength, triggering a chemical reaction in the adhesive molecules. The intensity of the specific wavelength light and subsequent baking continuously provide energy for this chemical reaction. For example, the recommended curing condition for a certain adhesive is 3000 mJ / cm. 2 ×10min+80℃×60min, that is, the energy used is 3000mJ / cm 2 The glue was exposed to ultraviolet light for 10 minutes, and then baked in an oven at 80°C for 60 minutes.

[0052] Specifically, the curing process parameters may include the heat release during curing, the coefficient of shrinkage, the elastic modulus, and Poisson's ratio; the first temperature change parameter may include the density, specific heat capacity, and thermal conductivity of the adhesive to be evaluated; and the second temperature change parameter may include the density, specific heat capacity, and thermal conductivity of the camera module.

[0053] In practice, a calorimeter can be used to measure parameters such as the latent heat of phase change and specific heat capacity related to the temperature gradient during the curing process of the adhesive being evaluated. For example, a differential scanning calorimeter can be used to obtain the heat release and specific heat capacity during the curing process of the adhesive being evaluated, as well as the specific heat capacity of the camera module.

[0054] In practice, a thermal conductivity meter can be used to measure the thermal conductivity of the adhesive being evaluated under different curing conditions at various ambient temperatures, as well as the thermal conductivity of the camera module under different ambient temperatures. For example, a DRE-Ⅲ multifunctional rapid thermal conductivity meter can be used.

[0055] In the specific implementation process, the volume shrinkage rate of the adhesive to be evaluated at different curing degrees can be measured by using the specific gravity bottle method, which can then determine the shrinkage coefficient of the adhesive to be evaluated.

[0056] In practice, a thermomechanical analyzer can be used to measure the thermal expansion coefficients of the motor and the lens, thereby determining the shrinkage coefficient of the adhesive-bonded object to be evaluated.

[0057] As for the density of the adhesive to be evaluated, it can be obtained using a liquid density meter before the adhesive cures, and can be measured using a specific gravity bottle method after the adhesive has cured. The density of the motor can be obtained based on the ratio of its mass to its volume; similarly, the density of the lens can be obtained.

[0058] In the specific implementation process, a dynamic thermomechanical analyzer can be used to measure the elastic modulus of the adhesive to be evaluated at different temperatures; alternatively, a variable temperature device can be used to measure the elastic modulus and Poisson's ratio of the adhesive to be evaluated at critical temperatures using a tensile testing machine.

[0059] Step S102: Based on the curing process parameters, the first temperature change parameter, and the second temperature change parameter, establish a thermosetting model and a thermodynamic model for the adhesive to be evaluated.

[0060] Specifically, a thermosetting model can be established based on the density, specific heat capacity, thermal conductivity of the adhesive to be evaluated, the density, specific heat capacity, thermal conductivity of the camera module, heat release during curing, and shrinkage coefficient.

[0061] In the specific implementation process, since the adhesive to be evaluated is fluid before curing, it is necessary to consider the influence of the degree of curing of the adhesive on temperature conduction based on Fourier's law of heat conduction, and to determine the relationship between the exothermic reaction inside the adhesive and its flow rate.

[0062] For example, you can write a custom material subroutine for simulation software. Taking Abaqus finite element simulation analysis software as an example, you can write a material subroutine UMAT (User-Defined Material). In this UMAT subroutine, you can define the relationship between the exothermic reaction inside the adhesive being evaluated and its flow rate according to the following formula:

[0063]

[0064]

[0065] Where ρ is the density of the adhesive to be evaluated, C is the specific heat capacity of the adhesive to be evaluated, and K is the density of the adhesive to be evaluated. ii ρ is the thermal conductivity coefficient of the adhesive to be evaluated. r For the density of the bonded component (lens or motor), C r V represents the specific heat capacity of the bonded component. i Let Q be the flow rate of the adhesive to be evaluated, and let v be the heat of curing of the adhesive to be evaluated. r Here, denoted by volume fraction, H represents the total heat released during solidification, a is the shrinkage coefficient, and i = 1, 2, 3... indicates the reaction stage.

[0066] Since the adhesive being evaluated in the simulation model only has two phases, molten and solid, and the curing process is a slow process, it is necessary to assume more phases to characterize the degree of curing of the adhesive being evaluated.

[0067] Specifically, before associating the thermosetting model with the thermodynamic model, an enthalpy difference equation set can be established based on the specific heat capacity and thermal conductivity of the adhesive to be evaluated, so as to determine the degree of curing of the adhesive to be evaluated through the enthalpy difference equation set.

[0068] In the specific implementation process, the enthalpy difference equation set can also be introduced into the subroutine UMAT to define the degree of curing of the glue to be evaluated, so as to distinguish it from the clear phase transition point that is present in phase transition processes such as melting or fusion.

[0069] For example, the enthalpy difference equation system can be referenced from the following equations:

[0070] ρ=θ1ρ1+θ2ρ2+…+θ i ρ i

[0071]

[0072]

[0073] k = θ1k1 + θ2k2 + ... + θ i k i

[0074] 1 = θ1 + θ2 + ... + θ i

[0075] Where k is the thermal conductivity coefficient, L 1→i Let T be the latent heat of phase change from phase 1 to phase i, where T is the temperature, C is the specific heat capacity, and θ is the proportionality coefficient of each phase.

[0076] Regarding how to establish a thermodynamic model for the adhesive to be evaluated, specifically, a thermodynamic model can be established based on the elastic modulus and Poisson's ratio.

[0077] As an optional implementation, the constitutive equations for the solid mechanical field can be established in the materials subroutine UMAT according to the following formula:

[0078]

[0079] Where ε represents the strain component, σ represents the stress component, E represents the elastic modulus, and v represents Poisson's ratio.

[0080] Step S103: Link the thermosetting model and the thermodynamic model to establish a heat transfer enthalpy change thermodynamic deformation model, and based on the heat transfer enthalpy change thermodynamic deformation model, the simulation model of the camera module and the simulation model of the adhesive to be evaluated, establish a target simulation model for the camera module.

[0081] Specifically, to establish a heat transfer enthalpy change thermodynamic deformation model, the thermosetting model, the enthalpy difference equation set, and the thermodynamic model can be interconnected to establish the heat transfer enthalpy change thermodynamic deformation model.

[0082] For example, a heat transfer enthalpy change thermodynamic deformation model can be established in the materials subroutine UMAT according to the following formula:

[0083]

[0084] Where σ is stress, a is curing shrinkage coefficient, E is elastic modulus, v is Poisson's ratio, and T is temperature.

[0085] The simulation model of the camera module can be established based on its three-dimensional dimensional data. Similarly, a simulation model of the adhesive to be evaluated can be established. Furthermore, based on the heat transfer enthalpy change thermodynamic deformation model, the simulation model of the camera module, and the simulation model of the adhesive to be evaluated, a target simulation model for the camera module can be established.

[0086] Write the programmatic code according to the above relationships to form the target simulation model, and then insert the target simulation model into the main program. The main program can be Abaqus finite element simulation analysis software.

[0087] In some implementations, the partial curing process parameters and the first temperature change parameters of the adhesive to be evaluated can be found in Table 1 below:

[0088] Table 1. Partial curing process parameters and first temperature change parameters of the adhesive to be evaluated

[0089] temperature enthalpy Curing shrinkage elastic modulus thermal conductivity Specific heat capacity density 0 <![CDATA[88.1×10 6 ]]> 0 0.001 0.522 5600 1530 25 <![CDATA[141.8×10 6 ]]> 0 0.004 0.521 5600 1530 35 <![CDATA[182.5×10 6 ]]> 0.15 0.02 0.518 5600 1530 45 <![CDATA[225.6×10 6 ]]> 0.21 20 0.514 5600 1530 55 <![CDATA[268.3×10 6 ]]> 0.35 120 0.508 5600 1530 65 <![CDATA[306.8×10 6 ]]> 1.22 642 0.502 5600 1530 75 <![CDATA[342.5×10 6 ]]> 2.31 1262 0.495 5600 1530 85 <![CDATA[390.2×10 6 ]]> 3.33 1910 0.492 5600 1530

[0090] Step S104: Perform a curing simulation of the adhesive to be evaluated on the target simulation model to obtain the simulation curing results of the adhesive to be evaluated.

[0091] Specifically, boundary conditions can be applied to the target simulation model to simulate the curing of the adhesive being evaluated. For example, boundary conditions may include light energy, ambient temperature, and displacement constraints.

[0092] In one implementation, by applying boundary conditions to the target simulation model and performing a solidification simulation, the following can be obtained: Figure 2 The temperature gradient cloud map shown below yields the following results: Figure 3 The solidification state cloud diagram shown below yields the following results: Figure 4-6 The image shows the lens displacement distortion cloud map, and the result is as follows: Figure 7 The stress contour plot shown.

[0093] As an alternative implementation, in order to calculate the deformation effect of the adhesive to be evaluated on the lens after curing, after obtaining the simulated curing results of the adhesive to be evaluated, the curing difference results can also be determined based on the simulated curing results and the results before curing.

[0094] The pre-curing results are obtained before the curing simulation of the adhesive to be evaluated. After determining the curing difference results, the actual curing conditions of the adhesive to be evaluated (light energy, ambient temperature, and displacement constraints, etc.) can be modified using the curing difference results, thereby improving the subsequent deformation impact of the adhesive on the camera module.

[0095] Secondly, based on the same inventive concept, this invention provides an adhesive curing simulation device through one embodiment, applied to a camera module, as shown in the figure below. Figure 8 As shown, the adhesive curing simulation device includes:

[0096] The parameter acquisition unit 801 is used to acquire the curing process parameters and the first temperature change parameter of the adhesive to be evaluated, as well as the second temperature change parameter of the camera module.

[0097] The first model creation unit 802 is used to establish a thermosetting model and a thermodynamic model for the adhesive to be evaluated based on the curing process parameters, the first temperature change parameter and the second temperature change parameter.

[0098] The second model creation unit 803 is used to associate the thermosetting model and the thermodynamic model to establish a heat transfer enthalpy change thermodynamic deformation model, and based on the heat transfer enthalpy change thermodynamic deformation model, the simulation model of the camera module and the simulation model of the adhesive to be evaluated, to establish a target simulation model for the camera module.

[0099] The curing simulation unit 804 is used to perform curing simulation of the adhesive to be evaluated on the target simulation model and obtain the simulation curing results of the adhesive to be evaluated.

[0100] The curing process parameters include curing heat release, shrinkage coefficient, elastic modulus and Poisson's ratio; the first temperature change parameter includes the density, specific heat capacity and thermal conductivity of the adhesive to be evaluated; and the second temperature change parameter includes the density, specific heat capacity and thermal conductivity of the camera module.

[0101] As an optional implementation, the first model creation unit 802 is specifically used to: establish a thermosetting model based on the density, specific heat capacity, thermal conductivity, camera module density, specific heat capacity, thermal conductivity, heat release during curing, and shrinkage coefficient of the adhesive to be evaluated; and establish a thermodynamic model based on the elastic modulus and Poisson's ratio.

[0102] As an optional implementation, the first model creation unit 802 is also used to: establish a set of enthalpy difference equations based on the specific heat capacity and thermal conductivity of the adhesive to be evaluated, so as to determine the degree of curing of the adhesive to be evaluated through the set of enthalpy difference equations.

[0103] As an optional implementation, the second model creation unit 803 is specifically used for:

[0104] The thermosetting model, the enthalpy difference equations, and the thermodynamic model are interconnected to establish a heat transfer enthalpy change thermodynamic deformation model.

[0105] As an optional implementation, the solidified simulation unit 804 is specifically used for:

[0106] Boundary conditions are applied to the target simulation model to simulate glue curing; the boundary conditions include light energy, ambient temperature, and displacement constraints.

[0107] As an optional implementation, the above-described apparatus further includes:

[0108] The curing evaluation unit 805 is used to determine the curing difference results based on the simulation curing results and the results before curing. The results before curing are obtained before the glue to be evaluated is subjected to glue curing simulation. The actual curing conditions of the glue to be evaluated are modified using the curing difference results.

[0109] Since the glue curing simulation device described in this embodiment is an electronic device used to implement the glue curing simulation method in this embodiment of the invention, those skilled in the art can understand the specific implementation and various variations of the electronic device in this embodiment based on the glue curing simulation method described in this embodiment of the invention. Therefore, how the electronic device implements the method in this embodiment of the invention will not be described in detail here. Any electronic device used by those skilled in the art to implement the glue curing simulation method in this embodiment of the invention falls within the scope of protection of this invention.

[0110] Thirdly, based on the same inventive concept, such as Figure 9 As shown, through one embodiment of the present invention, a readable storage medium 900 is provided, on which a program 901 is stored, which, when executed by a processor, implements any of the embodiments of the glue curing simulation method described above.

[0111] The technical solutions in the above embodiments of the present invention have at least the following technical effects or advantages:

[0112] By linking the simulation models of the camera module, the adhesive to be evaluated, and the heat transfer enthalpy change thermodynamic deformation model, the effects of any one or more of the following—camera module deformation, overall temperature change, and adhesive curing degree—can be calculated when simulating adhesive curing on the target simulation model. Therefore, the obtained simulation curing results are more accurate. Furthermore, the curing conditions of the adhesive to be evaluated (light energy, ambient temperature, and displacement constraints, etc.) can be modified more easily, thereby improving the subsequent deformation impact of the adhesive on the camera module.

[0113] Those skilled in the art will understand that embodiments of the present invention can be provided as methods, systems, or computer products. Therefore, the present invention can take the form of a completely hardware embodiment, a completely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, the present invention can take the form of a computer product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, etc.) containing computer-usable code.

[0114] This invention is described with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer products according to embodiments of the invention. It will be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer instructions. These computer instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, generate instructions for implementing the flowchart illustrations and / or block diagrams. Figure 1One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.

[0115] These computer instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing device to function in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1 One or more processes and / or boxes Figure 1 The function specified in one or more boxes.

[0116] These computer instructions may also be loaded onto a computer or other programmable data processing equipment to cause a series of operational steps to be performed on the computer or other programmable equipment to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable equipment for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.

[0117] Although preferred embodiments of the invention have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including both the preferred embodiments and all changes and modifications falling within the scope of the invention.

[0118] Obviously, those skilled in the art can make various modifications and variations to this invention without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the claims of this invention and their equivalents, this invention also intends to include these modifications and variations.

Claims

1. A method of glue solidification simulation, characterized by, The method is applied to a camera module, and the method comprises the following steps: obtaining curing process parameters and first temperature change parameters of a to-be-evaluated glue, and obtaining second temperature change parameters of the camera module; based on the curing process parameters, the first temperature change parameters and the second temperature change parameters, a thermal curing model and a thermodynamic model for the to-be-evaluated glue are established; wherein the curing process parameters include curing heat release, shrinkage coefficient, elastic modulus and Poisson's ratio, the first temperature change parameters include the density, specific heat capacity and thermal conductivity coefficient of the to-be-evaluated glue, and the second temperature change parameters include the density, specific heat capacity and thermal conductivity coefficient of the camera module; based on the curing process parameters, the first temperature change parameters and the second temperature change parameters, the thermal curing model and the thermodynamic model for the to-be-evaluated glue are established, including: based on the density, specific heat capacity, thermal conductivity coefficient of the to-be-evaluated glue, the density, specific heat capacity, thermal conductivity coefficient of the camera module, the curing heat release and the shrinkage coefficient, the thermal curing model is established; based on the elastic modulus and Poisson's ratio, the thermodynamic model is established; the thermal curing model and the thermodynamic model are associated to establish a heat transfer enthalpy change thermodynamic deformation model, and based on the heat transfer enthalpy change thermodynamic deformation model, a simulation model of the camera module and a simulation model of the to-be-evaluated glue, a target simulation model for the camera module is established; wherein, before the thermal curing model and the thermodynamic model are associated, it further includes: based on the specific heat capacity and thermal conductivity coefficient of the to-be-evaluated glue, an enthalpy difference equation set is established to determine the curing degree of the to-be-evaluated glue through the enthalpy difference equation set; the thermal curing model and the thermodynamic model are associated to establish a heat transfer enthalpy change thermodynamic deformation model, including: the thermal curing model, the enthalpy difference equation set and the thermodynamic model are associated with each other to establish the heat transfer enthalpy change thermodynamic deformation model; the target simulation model is subjected to glue curing simulation to obtain a simulation curing result of the to-be-evaluated glue.

2. The method of claim 1, wherein, the target simulation model is subjected to glue curing simulation, including: the target simulation model is subjected to glue curing simulation by applying boundary conditions, and the boundary conditions include illumination energy, environmental temperature and displacement constraint.

3. The method of claim 2, wherein, after the simulation curing result of the to-be-evaluated glue is obtained, it further includes: based on the simulation curing result and a pre-curing result, a curing difference result is determined, and the pre-curing result is obtained before the to-be-evaluated glue is subjected to glue curing simulation; the actual curing conditions of the to-be-evaluated glue are modified by using the curing difference result.

4. A glue solidification simulation apparatus characterized by, The device is applied to a camera module, and the device comprises the following: a parameter acquisition unit configured to obtain curing process parameters and first temperature change parameters of a to-be-evaluated glue, and obtain second temperature change parameters of the camera module; The first model creating unit is configured to establish a thermal curing model and a thermodynamic model for the to-be-evaluated glue based on the curing process parameters, the first temperature change parameters, and the second temperature change parameters. The curing process parameters include a curing exothermic quantity, a shrinkage coefficient, an elastic modulus, and a Poisson's ratio. The first temperature change parameters include a density, a specific heat capacity, and a thermal conductivity of the to-be-evaluated glue. The second temperature change parameters include a density, a specific heat capacity, and a thermal conductivity of the camera module. The first model creating unit establishes the thermal curing model and the thermodynamic model for the to-be-evaluated glue based on the density, the specific heat capacity, the thermal conductivity of the to-be-evaluated glue, the density, the specific heat capacity, the thermal conductivity of the camera module, the curing exothermic quantity, and the shrinkage coefficient. The first model creating unit establishes the thermodynamic model based on the elastic modulus and the Poisson's ratio. The second model creating unit is configured to associate the thermal curing model and the thermodynamic model to establish a heat transfer enthalpy change thermodynamic deformation model, and establish a target simulation model for the camera module based on the heat transfer enthalpy change thermodynamic deformation model, a simulation model of the camera module, and a simulation model of the to-be-evaluated glue. Before the association of the thermal curing model and the thermodynamic model, the second model creating unit is further configured to establish an enthalpy difference value equation set based on the specific heat capacity and the thermal conductivity of the to-be-evaluated glue, so as to determine a curing degree of the to-be-evaluated glue by using the enthalpy difference value equation set. The second model creating unit associates the thermal curing model, the enthalpy difference value equation set, and the thermodynamic model to establish the heat transfer enthalpy change thermodynamic deformation model. The curing simulation unit is configured to perform glue curing simulation on the target simulation model to obtain a simulation curing result of the to-be-evaluated glue.

5. The apparatus of claim 4, wherein, The first model creating unit is further configured to: establish an enthalpy difference value equation set based on the specific heat capacity and the thermal conductivity of the to-be-evaluated glue, so as to determine a curing degree of the to-be-evaluated glue by using the enthalpy difference value equation set.

6. A readable storage medium, having stored thereon a program, characterized in that, The program is executed by the processor to implement the method in any one of claims 1-3.

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