Temperature control method for circuit board, laser cutting head and laser cutting system

Abstract

The present invention belongs to the field of laser cutting technology, and in particular relates to a temperature control method for a circuit board, a laser cutting head, and a laser cutting system. The laser cutting head includes a nozzle, a ceramic ring, a circuit board, a semiconductor temperature regulating plate, and a capacitive sensor provided with a mounting groove and a first ventilation hole; one end of the first ventilation hole is connected to the air cooling system, the other end of the first ventilation hole is connected to the ceramic ring, and the end of the ceramic ring away from the first ventilation hole is connected to the nozzle, the semiconductor temperature regulating plate is installed on the inner side wall of the mounting groove near the first ventilation hole, the circuit board is attached to the side of the semiconductor temperature regulating plate away from the first ventilation hole, and the circuit board is electrically connected to the air cooling system and the semiconductor temperature regulating plate. The circuit board has a good cooling effect, and the laser cutting head is small in size, simple in structure, and low in manufacturing cost.

Description

Technical Field

[0001] The present invention belongs to the technical field of laser cutting, and in particular relates to a temperature control method for a circuit board, a laser cutting head and a laser cutting system. Background Art

[0002] With the continuous development of laser technology, the application of laser cutting machines is becoming increasingly widespread. A laser cutting machine uses a pipeline system to focus the laser light emitted from a laser into a high-power density cutting laser beam. This cutting laser beam is then irradiated by a laser cutting head onto the surface of the workpiece, causing the workpiece surface to reach its melting or boiling point, thereby achieving the effect of laser cutting the workpiece. The laser cutting head houses a circuit board, and during operation, the laser cutting head may generate high temperatures or remain low due to environmental factors. To ensure the normal operation of the circuit board, the circuit board must be heated or cooled.

[0003] In the prior art, the circuit board in the laser cutting head is usually cooled by air cooling. However, the air cooling method has problems such as low cooling efficiency and low cooling accuracy. Summary of the Invention

[0004] The embodiments of the present invention solve the problems of low cooling efficiency and low cooling accuracy of a laser circuit board through air cooling in a laser cutting system, and provide a circuit board temperature control method, a laser cutting head and a laser cutting system.

[0005] In view of the above problems, an embodiment of the present invention provides a laser cutting head, including a nozzle, a ceramic ring, a circuit board, a semiconductor thermostat and a capacitive sensor provided with a mounting groove and a first ventilation hole; one end of the first ventilation hole is connected to the air cooling system, the other end of the first ventilation hole is connected to the ceramic ring, the end of the ceramic ring away from the first ventilation hole is connected to the nozzle, the semiconductor thermostat is installed on the inner side wall of the mounting groove close to the first ventilation hole, the circuit board is attached to the side of the semiconductor thermostat away from the first ventilation hole, and the circuit board is electrically connected to the air cooling system and the semiconductor thermostat.

[0006] Optionally, the laser cutting head further includes a locking ring, and the ceramic ring is connected to the capacitive sensor via the locking ring.

[0007] Optionally, the laser cutting head further comprises a sealing gasket for sealing the mounting groove, and the sealing gasket is sealingly installed at the opening of the mounting groove.

[0008] Optionally, a communication hole is further provided on the capacitive sensor, and the laser cutting head further comprises a signal connector and a signal line installed in the communication hole, and the signal connector is connected to the ceramic ring via the signal line.

[0009] In an embodiment of the present invention, the semiconductor thermostat is mounted on the inner sidewall of the mounting slot near the first vent, and the circuit board is attached to the side of the semiconductor thermostat away from the first vent. The air cooling system can cool the circuit board by delivering cooling air into the first vent. The circuit board can control the direction of the current in the semiconductor thermostat, thereby controlling the heating or cooling of the semiconductor thermostat. Furthermore, by controlling the magnitude of the current flowing through the semiconductor thermostat, the cooling or heating rate of the semiconductor thermostat can be controlled, achieving the technical effect of precisely controlling the temperature of the circuit board. Furthermore, the laser cutting head is small in size, simple in structure, and low in manufacturing cost.

[0010] Another embodiment of the present invention further provides a circuit board temperature control method, which is applied to the above-mentioned laser cutting head and includes:

[0011] During the operation of the laser cutting head, detecting a first temperature of the circuit board in real time;

[0012] When it is detected that the first temperature is greater than or equal to a preset high temperature threshold, the air cooling system is controlled to blow cold air from the first ventilation hole to cool the circuit board, and a second temperature of the circuit board is detected after the air cooling process has been performed for a first preset time period;

[0013] After confirming that the second temperature is lower than the first temperature and higher than the maximum value of a preset safety temperature range, if the difference between the first temperature and the second temperature is lower than a preset temperature reduction difference, controlling the air cooling system to blow cold air through the first vents and simultaneously controlling the semiconductor temperature regulating plate to reduce the temperature so as to perform a dual cooling process on the circuit board; and if the maximum value of the preset safety temperature range is lower than a preset high temperature threshold;

[0014] The third temperature of the circuit board after the double refrigeration treatment is detected in real time, and when the third temperature falls within the preset safe temperature range, the air cooling system is controlled to stop blowing cold air and stop cooling the semiconductor temperature regulating plate.

[0015] Optionally, after confirming that the second temperature is lower than the first temperature and higher than a maximum value of a preset safety temperature range, the method further includes:

[0016] If the difference between the first temperature and the second temperature is greater than or equal to a preset temperature drop difference, controlling the air cooling system to continue air cooling the circuit board, and detecting in real time a fourth temperature of the circuit board after the air cooling process;

[0017] When the fourth temperature falls within the preset safety temperature range, the air cooling system is controlled to stop blowing cold air.

[0018] Optionally, after detecting the second temperature of the circuit board after the air cooling treatment for the first preset time, the method further includes:

[0019] When it is confirmed that the second temperature is greater than or equal to the first temperature, detecting whether a temperature acquisition circuit connected to the circuit board is faulty, and detecting whether the air pressure of the air cooling system is within a preset air pressure range;

[0020] When it is detected that the temperature acquisition circuit has a fault, or / and the air pressure of the air cooling system is not within a preset air pressure range, the laser cutting head is controlled to stop working and an alarm operation is performed;

[0021] When it is detected that the temperature acquisition circuit has no faults and the air pressure of the air cooling system is within a preset air pressure range, the semiconductor temperature regulating plate and the air cooling system are controlled to perform dual cooling processing on the circuit board.

[0022] Optionally, after the real-time detection of the first temperature of the circuit board, the method further includes:

[0023] When it is detected that the first temperature is less than or equal to a preset low temperature threshold, controlling the semiconductor temperature regulating plate to heat the circuit board, and detecting a fifth temperature of the circuit board after the heating process has been performed for a second preset time; the preset low temperature threshold is less than a minimum value of the preset safety temperature range;

[0024] When it is confirmed that the fifth temperature falls within the preset safe temperature range, the semiconductor temperature regulating plate is controlled to stop heating the circuit board.

[0025] Optionally, after detecting the fifth temperature of the circuit board after the heating treatment for the second preset time, the method further includes:

[0026] When it is confirmed that the fifth temperature is less than or equal to the first temperature, detecting whether a temperature acquisition circuit connected to the circuit board is faulty;

[0027] When a fault is detected in the temperature acquisition circuit, the laser cutting head is controlled to stop working and an alarm operation is performed;

[0028] When it is detected that there is no fault in the temperature acquisition circuit, the semiconductor temperature regulating piece continues to be controlled to heat the circuit board until it is confirmed that the fifth temperature falls within the preset safety temperature range, and the semiconductor temperature regulating piece is controlled to stop heating the circuit board.

[0029] In an embodiment of the present invention, when it is detected that the first temperature is greater than or equal to a preset high temperature threshold, the air cooling system is controlled to blow cold air through the first vents to cool the circuit board. After a first preset cooling time, a second temperature of the circuit board is detected. After confirming that the second temperature is less than the first temperature and greater than a maximum value within a preset safety temperature range, if the difference between the first and second temperatures is less than a preset temperature rise difference, the air cooling system is controlled to blow cold air through the first vents and simultaneously control the semiconductor temperature regulating plate to reduce the temperature, thereby performing a dual cooling process on the circuit board. A third temperature of the circuit board after the dual cooling process is detected in real time, and when the third temperature falls within the preset safety temperature range, the air cooling system is controlled to stop blowing cold air and stop reducing the temperature of the semiconductor temperature regulating plate. The cooling process for the circuit board is primarily performed by the air cooling system, supplemented by the cooling process of the semiconductor temperature regulating plate. If the air cooling system fails to reduce the temperature of the circuit board to the preset safety temperature range, the semiconductor temperature regulating plate and the air cooling system perform a dual cooling process on the circuit board, thereby increasing the cooling speed of the circuit board and ensuring the cooling effect of the circuit board. In addition, the semiconductor thermostat has the advantages of small size, no pollution, small thermal inertia, and fast cooling and heating. The circuit board can be used to control the current of the semiconductor thermostat, thereby accurately controlling the cooling capacity or heating capacity of the semiconductor thermostat, thereby improving the temperature control accuracy of the circuit board.

[0030] Another embodiment of the present invention also provides a laser cutting system, including an air cooling system, a control module and a laser cutting head; the control module is connected to the circuit board, the semiconductor temperature regulating plate and the air cooling system; the control module is used to execute the above-mentioned circuit board temperature control method. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The present invention will be further described below with reference to the accompanying drawings and examples.

[0032] Figure 1 A cross-sectional view of a laser cutting head provided in one embodiment of the present invention;

[0033] Figure 2 is a schematic diagram of the laser cutting system;

[0034] Figure 3 The figure is a flow chart of a temperature control method for a circuit board.

[0035] The reference numerals in the specification are as follows:

[0036] 1. Nozzle; 11. Third ventilation hole; 2. Ceramic ring; 21. Second ventilation hole; 3. Capacitive sensor; 31. Mounting slot; 32. First ventilation hole; 33. Connecting hole; 4. Circuit board; 5. Semiconductor temperature regulator; 6. Locking ring; 7. Sealing gasket; 8. Signal connector; 9. Signal line; 10. Air cooling system. DETAILED DESCRIPTION

[0037] In order to make the technical problems, technical solutions and beneficial effects solved by the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0038] It should be understood that the terms "upper", "lower", "left", "right", "front", "back", "middle", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention.

[0039] like Figure 1 and Figure 2 As shown, one embodiment of the present invention provides a laser cutting head, comprising a nozzle 1, a ceramic ring 2, a circuit board 4, a semiconductor temperature regulating plate 5, and a capacitive sensor 3 having a mounting slot 31 and a first ventilation hole. One end of the first ventilation hole 32 is connected to the air cooling system 10, the other end of the first ventilation hole 32 is connected to the ceramic ring 2, and the end of the ceramic ring 2 away from the first ventilation hole 32 is connected to the nozzle. The semiconductor temperature regulating plate 5 is mounted on the inner side wall of the mounting slot 31 near the first ventilation hole 32. The circuit board 4 is attached to the side of the semiconductor temperature regulating plate 5 away from the first ventilation hole 32, and the circuit board 4 is electrically connected to the air cooling system 10 and the semiconductor temperature regulating plate 5. It can be understood that the ceramic ring 2 is provided with a second ventilation hole 21, and the nozzle 1 is provided with a third ventilation hole 11. One end of the second ventilation hole 21 is connected to the first ventilation hole 32, and the other end of the second ventilation hole 21 is connected to the third ventilation hole 11. The cooling air introduced by the air cooling system 10 can flow out of the third ventilation hole 11 through the first ventilation hole 32 and the second ventilation hole 21, thereby simultaneously cooling the capacitive sensor 3, the ceramic ring 2, and the nozzle. Furthermore, the laser light emitted by the laser cutting head can sequentially pass through the first ventilation hole 32 and the second ventilation hole 21 and be emitted from the third ventilation hole 11, thereby completing the laser cutting process.

[0040] Specifically, the first ventilation hole 32 is located at the center of the capacitive sensor 3, and the first ventilation hole 32 is not connected to the mounting groove 31; the second ventilation hole 21 is located at the center of the ceramic ring 2, the third ventilation hole 11 is located at the center of the nozzle 1, and the semiconductor temperature regulating plate 5 is attached to the inner wall of the mounting groove 31, and the circuit board 4 is attached to the semiconductor temperature regulating plate 5.

[0041] Furthermore, the circuit board 4 is electrically connected to the air cooling system 10 and the semiconductor temperature regulating plate 5 , so that the circuit board 4 can control the working states of the air cooling system 10 and the semiconductor temperature regulating plate 5 .

[0042] In an embodiment of the present invention, the semiconductor thermostat 5 is mounted on the inner sidewall of the mounting slot 31 near the first ventilation hole 32, and the circuit board 4 is attached to the side of the semiconductor thermostat 5 away from the first ventilation hole 32. The air cooling system 10 can cool the circuit board 4 by delivering cooling air into the first ventilation hole 32. The circuit board 4 can control the direction of the current in the semiconductor thermostat 5, thereby controlling the heating or cooling of the semiconductor thermostat 5. The current magnitude of the semiconductor thermostat 5 can also be controlled to control the cooling rate or heating rate of the semiconductor thermostat 5, thereby achieving the technical effect of precisely controlling the temperature of the circuit board 4. Furthermore, the laser cutting head is small in size, simple in structure, and low in manufacturing cost.

[0043] In one embodiment, if Figure 1 As shown, the laser cutting head further includes a locking ring 6, through which the ceramic ring 2 is connected to the capacitive sensor 3. It is understood that the locking ring 6 is threadedly connected to the capacitive sensor 3 and presses the ceramic ring 2 against the capacitive sensor 3. In this embodiment, the design of the locking ring 6 facilitates assembly and disassembly of the laser cutting head.

[0044] In one embodiment, if Figure 1 As shown, the laser cutting head further includes a sealing gasket 7 for sealing the mounting groove 31. The sealing gasket 7 is sealingly mounted at the opening of the mounting groove 31. As can be understood, the mounting groove 31 is located at the end of the capacitive sensor 3 away from the nozzle and is open. After the semiconductor temperature regulating chip 5 and the circuit board 4 are installed in the mounting groove 31, the sealing gasket 7 seals the mounting groove 31. In this embodiment, the processing of the mounting groove 31 is simple, reducing the manufacturing cost of the laser cutting head.

[0045] In one embodiment, if Figure 1As shown, a connecting hole 33 is also provided on the capacitive sensor 3, and the laser cutting head also includes a signal connector 8 and a signal line 9 installed in the connecting hole 33, and the signal connector 8 is connected to the ceramic ring 2 through the signal line 9. It can be understood that the signal connector 8 is arranged at the interface of the connecting hole 33, and the signal connector 8 is connected to the external control system, so that the distance between the cutting head and the workpiece to be cut can be judged based on the capacitance value between the capacitive sensor 3 and the ceramic ring 2, and the technical effect of automatically controlling the movement of the cutting head can be achieved. Specifically, the probe of the ceramic ring 2 maintains good point contact with the spring pin of the capacitive sensor 3, and the end of the signal line 9 away from the signal connector 8 is connected to the spring pin. In this embodiment, the laser cutting head has a simple structure and low manufacturing cost.

[0046] like Figure 3 As shown, another embodiment of the present invention further provides a circuit board temperature control method, which is applied to the above-mentioned laser cutting head and includes:

[0047] S100. During the operation of the laser cutting head (i.e., during the operation of the circuit board 4), the first temperature of the circuit board 4 is detected in real time. It can be understood that the temperature of the circuit board 4 during operation can be detected in real time by the thermistor on the circuit board 4.

[0048] S200. When it is detected that the first temperature is greater than or equal to a preset high temperature threshold, the air cooling system 10 is controlled to blow cold air from the first ventilation hole 32 to perform air cooling on the circuit board 4, and the second temperature of the circuit board 4 is detected after the first preset time of air cooling. It can be understood that when the circuit board 4 is working, the circuit components on the circuit board 4 will generate heat, causing the temperature of the circuit board 4 to increase (when the circuit board 4 is applied to a laser cutting head, the laser emitted by the laser cutting head will also cause the circuit board 4 to generate heat). In order to avoid the risk of failure of the circuit board 4 at high temperature, the circuit board 4 needs to be cooled.

[0049] Furthermore, when it is detected that the first temperature of the circuit board 4 is greater than a preset high temperature threshold, the circuit board 4 can control the valve of the air cooling system 10 to open, so that the air cooling system 10 can perform air cooling on the circuit board 4; and the preset high temperature threshold and the first preset time can both be set according to actual needs.

[0050] S300: After confirming that the second temperature is lower than the first temperature and higher than the maximum value of the preset safety temperature range, if the difference between the first temperature and the second temperature is lower than the preset temperature rise difference, the air cooling system 10 is controlled to blow cold air from the first ventilation hole 32, and the semiconductor temperature regulating plate 5 is controlled to cool down to perform a dual cooling process on the circuit board 4; the maximum value of the preset safety temperature range is lower than the preset high temperature threshold. It can be understood that when the second temperature is lower than the first temperature, it indicates that the temperature of the circuit board 4 has dropped after the air cooling system 10 cools the circuit board 4; if the difference between the first temperature and the second temperature is lower than the preset temperature rise difference, it indicates that although the temperature of the circuit board 4 has dropped after the air cooling system 10 cools the circuit board 4, the rate of temperature drop is relatively slow (i.e., the air cooling system 10 has a poor cooling effect on the circuit board 4); in this case, it is necessary to control the semiconductor temperature regulating plate 5 and the air cooling system 10 to perform a dual cooling process on the circuit board 4, thereby accelerating the cooling rate of the circuit board 4 and thereby ensuring the cooling effect of the circuit board 4. Furthermore, the preset temperature rise difference can be set according to actual needs.

[0051] S400: Real-time detection of the third temperature of the circuit board 4 after the dual cooling process. When the third temperature falls within the preset safety temperature range, control the air cooling system 10 to stop blowing cold air and to stop cooling the semiconductor temperature regulating plate 5. It will be understood that when the temperature of the circuit board 4 drops to the preset safety temperature range after the dual cooling process, the circuit board 4 controls the air cooling system 10 to stop blowing air and controls the semiconductor temperature regulating plate 5 to stop heating; at this point, it indicates that the circuit board 4 can operate normally at the third temperature.

[0052] In the present invention, when it is detected that the first temperature is greater than or equal to a preset high temperature threshold, the air cooling system 10 is controlled to blow cold air from the first ventilation hole 32 to perform air cooling treatment on the circuit board 4, and the second temperature of the circuit board 4 is detected after the first preset time of air cooling treatment; after confirming that the second temperature is lower than the first temperature and higher than the maximum value of the preset safety temperature range, if the difference between the first temperature and the second temperature is lower than the preset temperature rise difference, the air cooling system 10 is controlled to blow cold air from the first ventilation hole 32, and at the same time the semiconductor temperature regulating plate 5 is controlled to cool down to perform double cooling treatment on the circuit board 4; the third temperature of the circuit board 4 after the double cooling treatment is detected in real time, and when the third temperature belongs to the preset safety temperature range, the air cooling system 10 is controlled to stop blowing cold air and stop cooling the semiconductor temperature regulating plate 5. The cooling treatment of the circuit board 4 is primarily performed by the air cooling system 10, supplemented by the cooling treatment of the semiconductor thermostat 5. When the air cooling treatment of the circuit board 4 by the air cooling system 10 fails to reduce the temperature of the circuit board 4 to a preset safe temperature range, the semiconductor thermostat 5 and the air cooling system 10 perform a dual cooling treatment on the circuit board 4, thereby increasing the cooling speed of the circuit board 4 and ensuring the cooling effect of the circuit board 4. In addition, the semiconductor thermostat 5 has the advantages of being small in size, pollution-free, having low thermal inertia, and fast cooling and heating. The current of the semiconductor thermostat 5 can be controlled by the circuit board 4, thereby precisely controlling the cooling capacity or heating capacity of the semiconductor thermostat 5, thereby improving the temperature control accuracy of the circuit board 4.

[0053] In one embodiment, after confirming that the second temperature is lower than the first temperature and higher than the maximum value of the preset safety temperature range (i.e., after step S300), the method further includes:

[0054] If the difference between the first temperature and the second temperature is greater than or equal to the preset temperature rise difference, the air cooling system 10 is controlled to continue air cooling the circuit board 4, and the fourth temperature of the circuit board 4 after the air cooling treatment is detected in real time; it can be understood that if the difference between the first temperature and the second temperature is greater than or equal to the preset temperature rise difference, it indicates that after the air cooling system 10 performs air cooling treatment on the circuit board 4 alone, the cooling rate of the circuit board 4 within the first preset time period is relatively fast, that is, it indicates that the air cooling system 10 has an obvious cooling effect on the circuit board 4, and the temperature of the circuit board 4 can be reduced to the preset safety temperature range under the air cooling treatment of the air cooling system 10 alone, so there is no need to turn on the semiconductor temperature regulating plate 5.

[0055] When the fourth temperature falls within the preset safety temperature range, the air cooling system 10 is controlled to stop blowing cold air. It can be understood that when the temperature of the circuit board 4 drops to within the preset safety temperature range, the circuit board 4 can control the air cooling system 10 to stop blowing cold air.

[0056] In this embodiment, after the air cooling system 10 performs air cooling on the circuit board 4 alone, when the temperature of the circuit board 4 can drop to within the preset safety temperature range, it is only necessary to control the air cooling system 10 to cool the circuit board 4 alone, thereby saving resources and reducing the cooling cost of the circuit board.

[0057] In one embodiment, after detecting the second temperature of the circuit board 4 after the air cooling treatment for the first preset time (i.e., after step S200), the method further includes:

[0058] When it is confirmed that the second temperature is greater than or equal to the first temperature, the temperature acquisition circuit connected to the circuit board 4 is detected to see if it is faulty, and the air pressure of the air cooling system 10 is detected to see if it is within a preset air pressure range. It is understandable that if the second temperature is greater than or equal to the first temperature, it indicates that after the air cooling system 10 cools the circuit board 4, the temperature of the circuit board 4 will actually increase (that is, it indicates that the cooling rate of the circuit board 4 by the air cooling system 10 may not meet the heating rate of the circuit board 4 itself). Furthermore, whether the temperature acquisition circuit is faulty can be detected by whether there is voltage or current on the temperature acquisition circuit, and whether the air pressure of the air cooling system 10 is normal can be detected by a pressure sensor.

[0059] When it is detected that there is a fault in the temperature acquisition circuit, or / and the air pressure of the air cooling system 10 is not within the preset air pressure range, the laser cutting head is controlled to stop working (that is, the circuit board 4 is controlled to stop working), and an alarm operation is performed; it can be understood that when a fault is detected in the temperature acquisition circuit, it means that the temperature acquisition circuit cannot collect the correct temperature information of the circuit board 4, and thus the laser cutting head needs to be controlled to stop working; the circuit board 4 can also control the alarm device to perform an alarm operation, thereby prompting relevant personnel to inspect the temperature acquisition circuit.

[0060] Furthermore, when it is detected that the air pressure of the air cooling system is not within the preset air pressure range, it indicates that the air cooling system is damaged, and the air cooling treatment of the air cooling system cannot cool the circuit board 4. At this time, the laser cutting head is controlled to stop working; the circuit board 4 simultaneously controls the alarm system to perform an alarm operation, prompting maintenance personnel to repair the air cooling system 10.

[0061] In this embodiment, the temperature control of the circuit board 4 can also avoid the temperature acquisition circuit malfunctioning, or / and the air pressure of the air cooling system 10 being abnormal, thereby avoiding the semiconductor temperature regulating piece 5 failing to meet the cooling effect on the circuit board 4, which may cause the circuit board 4 to be damaged due to untimely cooling; and avoid the problem of waste of resources caused by the semiconductor temperature regulating piece 5 cooling the circuit board 4 alone.

[0062] In one embodiment, after the real-time detection of the first temperature of the circuit board 4 (i.e., after step S100), the method further includes:

[0063] When it is detected that the first temperature is less than or equal to the preset low temperature threshold, the semiconductor thermostat 5 is controlled to heat the circuit board 4, and the fifth temperature of the circuit board 4 is detected after the second preset time of heating; the preset low temperature threshold is less than the minimum value of the preset safety temperature range; it can be understood that the second preset time and the preset low temperature threshold can be set according to actual needs, and the second preset time can be equal to the first preset time, or it can be unequal to the first preset time. Specifically, the temperature of the circuit board 4 may be too low due to environmental reasons, etc. In order to ensure the normal operation of the circuit board 4 in a low temperature environment, the circuit board 4 needs to be heated. It should be noted that the direction of the current in the semiconductor thermostat 5 can be controlled by the circuit board 4 to control the heating or cooling of the semiconductor thermostat 5.

[0064] When the fifth temperature is determined to be within the preset safe temperature range, the semiconductor thermostat 5 is controlled to stop heating the circuit board 4. It is understood that after the semiconductor thermostat 5 has heated the circuit board 4 for the second preset duration, when the temperature of the circuit board 4 rises to the preset installation temperature range, the circuit board 4 can control the semiconductor thermostat 5 to stop heating. In this embodiment, the semiconductor thermostat 5 can also heat the circuit board 4 to prevent it from operating in a low-temperature environment, thereby further extending the service life of the circuit board 4.

[0065] In one embodiment, after detecting the fifth temperature of the circuit board 4 after the second preset heating time, the method further includes:

[0066] When it is confirmed that the fifth temperature is less than or equal to the first temperature, the temperature acquisition circuit connected to the circuit board 4 is detected to see if it is faulty; it can be understood that if the fifth temperature is less than or equal to the first temperature, it indicates that after the semiconductor temperature regulating piece 5 heats the circuit board 4, the temperature of the circuit board 4 continues to drop, or the temperature of the circuit board 4 remains unchanged.

[0067] When a fault is detected in the temperature acquisition circuit, the laser cutting head is controlled to stop working and an alarm operation is performed. It can be understood that when a fault is detected in the temperature acquisition circuit, the circuit board 4 controls the laser cutting head to stop working (that is, controls the circuit board 4 to stop running). At this time, the circuit board 4 can control the alarm system to perform an alarm operation, thereby prompting relevant maintenance personnel to inspect the temperature acquisition circuit. In this embodiment, the risk caused by the laser cutting head continuing to operate when the temperature acquisition circuit is damaged can be avoided.

[0068] When it is detected that the temperature acquisition circuit is not faulty, the semiconductor temperature regulating chip 5 is controlled to continue heating the circuit board 4 until it is confirmed that the fifth temperature is within the preset safe temperature range, at which point the semiconductor temperature regulating chip 5 is controlled to stop heating the circuit board 4. When it is detected that the circuit board 4 is not faulty, but the fifth temperature is less than or equal to the first temperature, possibly due to environmental factors causing the temperature of the circuit board 4 to continue to drop or the temperature of the circuit board 4 to not rise, the semiconductor temperature regulating chip 5 is controlled to continue heating the circuit board 4, thereby further improving the heating effect of the circuit board 4.

[0069] like Figure 2 As shown, another embodiment of the present invention further provides a laser cutting system, comprising an air cooling system 10, a control module, and a laser cutting head; the control module is connected to the circuit board 4, the semiconductor temperature regulating plate 5, and the air cooling system 10; the control module is used to execute the above-mentioned circuit board temperature control method. It is understandable that the control module can be a module on the circuit board 4 or a module in an external control system.

[0070] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A laser cutting head, characterized in that: The device comprises a nozzle, a ceramic ring, a circuit board, a semiconductor temperature regulating plate, and a capacitive sensor provided with a mounting slot and a first ventilation hole; one end of the first ventilation hole is connected to an air cooling system, the other end of the first ventilation hole is connected to the ceramic ring, and the end of the ceramic ring away from the first ventilation hole is connected to the nozzle; the semiconductor temperature regulating plate is mounted on the inner side wall of the mounting slot on a side close to the first ventilation hole; the circuit board is attached to a side of the semiconductor temperature regulating plate away from the first ventilation hole, and the circuit board is electrically connected to the air cooling system and the semiconductor temperature regulating plate; A second ventilation hole is provided on the ceramic ring, and a third ventilation hole is provided on the nozzle, one end of the second ventilation hole is connected to the first ventilation hole, and the other end of the second ventilation hole is connected to the third ventilation hole; the cooling air introduced by the air cooling system can flow out from the third ventilation hole through the first ventilation hole and the second ventilation hole, and the laser emitted by the laser cutting head can pass through the first ventilation hole and the second ventilation hole in sequence and be emitted from the third ventilation hole; The circuit board can control the current in the semiconductor thermostat to control the semiconductor thermostat to heat or cool.

2. The laser cutting head according to claim 1, characterized in that: The laser cutting head further includes a locking ring, and the ceramic ring is connected to the capacitive sensor via the locking ring.

3. The laser cutting head according to claim 1, characterized in that: The laser cutting head further comprises a sealing gasket for sealing the mounting groove, wherein the sealing gasket is sealingly mounted at the opening of the mounting groove.

4. The laser cutting head according to claim 1, characterized in that: The capacitive sensor is further provided with a communication hole, and the laser cutting head further comprises a signal connector and a signal line installed in the communication hole, and the signal connector is connected to the ceramic ring via the signal line.

5. A temperature control method for a circuit board, characterized in that: The temperature control method of the circuit board is applied to the laser cutting head according to any one of claims 1 to 4, and the temperature control method of the circuit board comprises: During the operation of the laser cutting head, detecting a first temperature of the circuit board in real time; When it is detected that the first temperature is greater than or equal to a preset high temperature threshold, the air cooling system is controlled to blow cold air from the first ventilation hole to cool the circuit board, and a second temperature of the circuit board is detected after the air cooling process has been performed for a first preset time period; After confirming that the second temperature is lower than the first temperature and higher than the maximum value of a preset safety temperature range, if the difference between the first temperature and the second temperature is lower than a preset temperature reduction difference, controlling the air cooling system to blow cold air through the first vents and simultaneously controlling the semiconductor temperature regulating plate to reduce the temperature so as to perform a dual cooling process on the circuit board; and if the maximum value of the preset safety temperature range is lower than a preset high temperature threshold; The third temperature of the circuit board after the double refrigeration treatment is detected in real time, and when the third temperature falls within the preset safe temperature range, the air cooling system is controlled to stop blowing cold air and stop cooling the semiconductor temperature regulating plate.

6. The temperature control method of a circuit board according to claim 5, characterized in that: After confirming that the second temperature is lower than the first temperature and higher than a maximum value of a preset safety temperature range, the method further includes: If the difference between the first temperature and the second temperature is greater than or equal to a preset temperature drop difference, controlling the air cooling system to continue air cooling the circuit board, and detecting in real time a fourth temperature of the circuit board after the air cooling process; When the fourth temperature falls within the preset safety temperature range, the air cooling system is controlled to stop blowing cold air.

7. The temperature control method of a circuit board according to claim 5, characterized in that: After detecting the second temperature of the circuit board after the air cooling treatment for the first preset time, the method further includes: When it is confirmed that the second temperature is greater than or equal to the first temperature, detecting whether a temperature acquisition circuit connected to the circuit board is faulty, and detecting whether the air pressure of the air cooling system is within a preset air pressure range; When it is detected that the temperature acquisition circuit has a fault, or / and the air pressure of the air cooling system is not within a preset air pressure range, the laser cutting head is controlled to stop working and an alarm operation is performed; When it is detected that the temperature acquisition circuit has no faults and the air pressure of the air cooling system is within a preset air pressure range, the semiconductor temperature regulating plate and the air cooling system are controlled to perform dual cooling processing on the circuit board.

8. The temperature control method of a circuit board according to claim 5, characterized in that: After the real-time detection of the first temperature of the circuit board, the method further includes: When it is detected that the first temperature is less than or equal to a preset low temperature threshold, controlling the semiconductor temperature regulating plate to heat the circuit board, and detecting a fifth temperature of the circuit board after the heating process has been performed for a second preset time; the preset low temperature threshold is less than a minimum value of the preset safety temperature range; When it is confirmed that the fifth temperature falls within the preset safe temperature range, the semiconductor temperature regulating plate is controlled to stop heating the circuit board.

9. The temperature control method of a circuit board according to claim 8, characterized in that: After detecting the fifth temperature of the circuit board after the second preset heating time, the method further includes: When it is confirmed that the fifth temperature is less than or equal to the first temperature, detecting whether a temperature acquisition circuit connected to the circuit board is faulty; When a fault is detected in the temperature acquisition circuit, the laser cutting head is controlled to stop working and an alarm operation is performed; When it is detected that there is no fault in the temperature acquisition circuit, the semiconductor temperature regulating piece continues to be controlled to heat the circuit board until it is confirmed that the fifth temperature falls within the preset safety temperature range, and the semiconductor temperature regulating piece is controlled to stop heating the circuit board.

10. A laser cutting system, characterized in that: It includes an air cooling system, a control module and a laser cutting head; the control module is connected to the circuit board, the semiconductor temperature regulating plate and the air cooling system; the control module is used to execute the temperature control method of the circuit board as described in any one of claims 5 to 9.

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