Meniscus measurement device and method, and substrate processing device

Abstract

The present invention provides a meniscus measurement method capable of quickly and accurately measuring the position of the meniscus in multiple nozzles of an inkjet head. The meniscus measurement method includes: providing a head unit capable of ejecting ink through multiple nozzles; bringing a film into close contact with the multiple nozzles so that ink remaining in the multiple nozzles adheres to the film, thereby forming a detection pattern on the film; and measuring the meniscus of the ink remaining in the multiple nozzles based on the detection pattern.

Description

Technical Field

[0001] The present invention relates to a meniscus measuring device and method, and a substrate processing device. Background Art

[0002] To manufacture display devices such as LCD panels, PDP panels, and LED panels, a printing process (e.g., RGB patterning) is performed on a substrate. Inkjet printing can be used to spray ink onto the substrate. The jetting characteristics of the ink are determined by the pressure distribution of the inkjet nozzle and the physical properties of the ink. In particular, the position of the meniscus in the inkjet nozzle is one of the key factors determining the jetting characteristics. Summary of the Invention

[0003] Problems to be solved by the invention

[0004] An object of the present invention is to provide a meniscus measuring method capable of quickly and accurately measuring the positions of menisci in a plurality of nozzles of an inkjet head.

[0005] Another problem to be solved by the present invention is to provide a meniscus measuring device that can quickly and accurately measure the positions of menisci in a plurality of nozzles of an inkjet head.

[0006] Another problem to be solved by the present invention is to provide a substrate processing apparatus for adjusting a voltage for ejecting ink from a plurality of nozzles by using a meniscus measured using the meniscus measurement method.

[0007] The subjects of the present invention are not limited to the above-mentioned subjects, and those skilled in the art can clearly understand other unmentioned subjects from the following description.

[0008] Solutions to the Problem

[0009] One aspect of the meniscus measurement method of the present invention for achieving the above-mentioned problem includes: providing a head unit capable of ejecting ink through a plurality of nozzles; bringing a membrane into close contact with the plurality of nozzles so that the ink remaining in the plurality of nozzles is stained on the membrane, thereby forming a detection pattern on the membrane; and measuring the meniscus of the ink remaining in the plurality of nozzles based on the detection pattern.

[0010] One aspect of the meniscus measuring device of the present invention for achieving the above-mentioned other problem may include: a base member; a pressure sensor, arranged on the base member; and a membrane, arranged on the pressure sensor, the membrane being in close contact with multiple nozzles of the head unit, so that the ink remaining in the multiple nozzles is stained on the membrane, thereby forming a detection pattern on the membrane.

[0011] One aspect of the substrate processing device of the present invention for achieving the above-mentioned further problem may include: a head unit capable of ejecting ink through a plurality of nozzles; a measuring unit including a membrane for measuring the meniscus of the ink remaining in the plurality of nozzles; and a control module for controlling the head unit or the measuring unit to make the membrane in close contact with the plurality of nozzles, so that the ink remaining in the plurality of nozzles is stained on the membrane, thereby forming a detection pattern on the membrane, and calculating the meniscus of the ink remaining in the plurality of nozzles based on the detection pattern.

[0012] Details of other embodiments are included in the detailed description and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is a conceptual diagram for explaining a substrate processing apparatus according to an embodiment of the present invention.

[0014] Figure 2 It will Figure 1 A magnified view of area A in the middle.

[0015] Figure 3 is a flowchart for illustrating a meniscus measurement method according to an embodiment of the present invention.

[0016] Figure 4 It is a diagram for explaining a detection pattern formed on a film.

[0017] Figure 5 Is used to illustrate Figure 3 FIG. 1 shows a diagram of step S30 in FIG.

[0018] Figure 6 This is a conceptual diagram for explaining the operation of a substrate processing apparatus according to an embodiment of the present invention.

[0019] Figure 7 is a flowchart for illustrating a meniscus measurement method according to another embodiment of the present invention.

[0020] Figure 8 FIG. 1 is a diagram for explaining another substrate processing apparatus according to another embodiment of the present invention.

[0021] Figure 9 This is a diagram used to explain the debugging method.

[0022] Figure 10 FIG. 1 is a diagram for explaining a substrate processing apparatus according to still another embodiment of the present invention.

[0023] Figure 11 FIG. 1 is a conceptual diagram for explaining a substrate processing apparatus according to another embodiment of the present invention. DETAILED DESCRIPTION

[0024] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. By referring to the accompanying drawings and the embodiments described in detail below, the advantages and features of the present invention and the methods for achieving them will become clear. However, the present invention is not limited to the embodiments disclosed below and can be implemented in various different ways. This embodiment is provided only to fully disclose the present invention and to fully inform the scope of the invention to those skilled in the art to which the present invention belongs. The present invention is defined only by the scope of the claims. Throughout the specification, the same reference numerals refer to the same constituent elements.

[0025] Spatially relative terms such as “below,” “beneath,” “lower,” “above,” and “upper” can be used to more easily record the relationship between an element or constituent element as shown in the figure and other elements or constituent elements. Spatially relative terms should be understood as terms that include different directions of elements when in use or in operation in addition to the directions shown in the figure. For example, when the elements shown in the figure are turned over, the element described as “below” or “beneath” another element can be placed “above” another element. Therefore, the exemplary term “below” can include all of below and above. Elements can also be aligned along other directions, so that spatially relative terms can be interpreted according to the alignment direction.

[0026] It should be understood that although the terms first, second, etc. are used herein to describe various elements, constituent elements and / or parts, these elements, constituent elements and / or parts are of course not limited by these terms. These terms are only used to distinguish one element, constituent element or part from another element, constituent element or part. Therefore, it is natural that the first element, first constituent element or first part mentioned below can also be the second element, second constituent element or second part within the technical concept of the present invention.

[0027] Figure 1 This is a conceptual diagram for explaining a substrate processing apparatus according to an embodiment of the present invention. Figure 2 It will Figure 1 A magnified view of area A in the middle.

[0028] First, refer to Figure 1 The substrate processing apparatus according to the embodiment of the present invention includes a meniscus measurement unit 110, a head unit 120, a control module 150, an image generation unit 160, and the like.

[0029] The meniscus measurement unit 110 includes a base member 112 and a membrane 114. The base member 112, as a member for fixing the membrane 114, may have a flat shape as a whole.

[0030] Membrane 114 can be made of a hydrophobic material capable of absorbing ink remaining in the multiple nozzles. Alternatively, membrane 114 can be coated with a hydrophobic material to prevent it from absorbing ink remaining in the multiple nozzles. However, membrane 114 can be coated with a material that prevents ink remaining in the multiple nozzles from spreading to the surrounding area. If membrane 114 is made of a hydrophobic material, it is difficult to reuse. However, if membrane 114 is coated with a hydrophobic material, it can be reused after cleaning the surface.

[0031] The image generation module 160 is used to capture the ink (ie, the detection pattern) stained on the film 114. The image generation module 160 may include a camera, but is not limited thereto.

[0032] The head unit 120 may include at least one pack, each pack including a plurality of heads, and each head including a plurality of nozzles.

[0033] Reference here Figure 2 The head unit 120 includes a plurality of nozzles N1 to Nn (n is a natural number). Ink may remain in each of the nozzles N1 to Nn. The heights of the menisci (M1 to Mn) of the ink remaining in each of the nozzles N1 to Nn may not be constant. For example, the meniscus M2 of the second nozzle N2 and the meniscus (M5) of the fifth nozzle (N5) may be relatively high, while the meniscus M3 of the third nozzle N3 and the meniscus (M4) of the fourth nozzle (N4) may be relatively low.

[0034] Figure 3 is a flowchart for illustrating a meniscus measurement method according to an embodiment of the present invention. Figure 4 It is a diagram for explaining a detection pattern formed on a film. Figure 5 Is used to illustrate Figure 3 FIG. 1 shows a diagram of step S30 in FIG.

[0035] refer to Figure 1 and Figure 3 , an inkjet head (ie, head unit 120) capable of ejecting ink through a plurality of nozzles is provided (S10). Figure 1 The meniscus measurement unit 110 of the substrate processing apparatus includes a base member 112 and a membrane 114 .

[0036] Next, the film 114 is brought into contact with a plurality of nozzles ( Figure 2 The ink remaining in the plurality of nozzles N1 to Nn is brought into close contact with each other so that the ink is stained on the film 114, thereby forming a detection pattern on the film 114 (refer to Figure 4 114a)(S20).

[0037] Specifically, the base member 112 of the meniscus measurement unit 110 presses the head unit 120 with a uniform force (or pressure) over the entire surface. The base member 112 and the head unit 120 can be in contact with each other in a state where the upper surface of the base member 112 and the bottom surface of the head unit 120 face each other and the upper surface of the base member 112 and the bottom surface of the head unit 120 are parallel to each other. By the force of the base member 112 pressing the head unit 120, the film 114 can come into contact with the ink remaining in the plurality of nozzles N1 to Nn. Therefore, an ink mark ( Figure 4 Q in ).

[0038] Although the description describes a case where the base member 112 moves upward to press the head unit 120 while the head unit 120 is not moving, the present invention is not limited thereto. Conversely, the head unit 120 may move downward to press the base member 112 while the base member 112 is not moving. Alternatively, the base member 112 and the head unit 120 may move toward each other to bring the base member 112 into contact with the head unit 120.

[0039] Reference here Figure 4 The detection pattern 114a formed on the film 114 includes a plurality of ink marks Q spaced apart from each other, and the plurality of ink marks Q correspond to the plurality of nozzles N1 to Nn. Therefore, as shown in the figure, the plurality of ink marks Q may form a plurality of columns L1 to L4. Figure 4 In the above description, an example is given in which four ink marks Q are formed in one row L1 to L4 , but the present invention is not limited to this.

[0040] Next, based on the detection pattern 114 a , the meniscus of the ink remaining in the plurality of nozzles N1 to Nn is measured ( S30 ).

[0041] Specifically, measuring the meniscus of the residual ink includes measuring the size of the plurality of ink marks Q. For example, the size of the ink mark Q may include at least one of the area, diameter, and radius of the ink mark Q.

[0042] The image generation unit 160 captures the detection pattern 114a, and the control module 150 measures the size of each of the plurality of ink marks Q of the detection pattern 114a. The control module 150 separates the plurality of ink marks Q of the detection pattern 114a into virtual parts ( Figure 4 The plurality of parts P11 to P14 correspond to the plurality of nozzles N1 to Nn. The control module 150 measures the size of the ink mark Q in each part P11 to P14. Figure 5 As shown, the control module 150 may measure the diameter W13 of the ink mark Q within the portion P13.

[0043] Despite Figure 4, the ink mark Q is formed in all of the portions P11 to P14, but the present invention is not limited thereto.

[0044] Figure 6 A conceptual diagram for explaining the operation of a substrate processing apparatus according to an embodiment of the present invention.

[0045] refer to Figure 6 The meniscus measured in the above-described manner is stored in the memory 165. The memory 165 stores the nozzle number (ie, nozzle position information) and the meniscus corresponding to the nozzle number.

[0046] The head unit 120 includes a plurality of nozzles N1 to Nn and a plurality of piezoelectric elements P1 to Pn corresponding to the plurality of nozzles N1 to Nn, respectively.

[0047] The control module 150 can receive the measured meniscus from the memory 165 and control the ink ejection from the plurality of nozzles N1 to Nn based on the meniscus. Specifically, the control module 150 provides a control signal CNT to the voltage generator 170. The voltage generator 170 provides voltages V1 to Vn corresponding to the plurality of nozzles N1 to Nn based on the control signal CNT. The plurality of piezoelectric elements P1 to Pn receive the voltages V1 to Vn and eject ink through the corresponding nozzles N1 to Nn.

[0048] If the meniscus M3 of the ink remaining in the third nozzle (e.g., N3) is low, the third voltage V3 supplied to the third piezoelectric element P3 corresponding to the third nozzle N3 may be relatively small. Conversely, if the meniscus M2 of the ink remaining in the second nozzle (e.g., N2) is high, the second voltage V2 supplied to the second piezoelectric element P2 corresponding to the second nozzle N2 may be relatively large.

[0049] Alternatively, if the meniscus M2 of ink remaining in the second nozzle N2 is higher than the meniscus M3 of ink remaining in the third nozzle N3, the second voltage supplied to the second piezoelectric element P2 may be greater than the third voltage supplied to the third piezoelectric element P3.

[0050] This voltage control can be implemented for each nozzle, or by grouping multiple nozzles into nozzle groups. For example, a nozzle group can include nozzles forming a column or a row.

[0051] Figure 7 is a flowchart for illustrating another meniscus measurement method according to another embodiment of the present invention. Figure 8 FIG. 1 is a diagram for explaining a substrate processing apparatus according to another embodiment of the present invention. Figure 9 This is a diagram used to explain the debugging method.

[0052] As described above, the membrane (ref. Figure 1 The head unit 120 (or head unit 120) is in close contact with the plurality of nozzles N1 to Nn, and the ink remaining in the plurality of nozzles N1 to Nn forms an ink mark Q on the film 114. Only by pressing the head unit 120 with a uniform force (or pressure) over the entire surface of the base member 112 can the size of the ink mark Q be determined so as to be proportional to the position (or height) of the meniscus.

[0053] More specifically, even if the position (or height) of the meniscus of ink remaining in a particular nozzle (e.g., N1) remains unchanged, the size of the ink mark Q will vary depending on the pressure at which the film 114 contacts the nozzle N1. This is because, if the film 114 contacts the nozzle N1 with a greater pressure, more ink can be absorbed by the film 114. In other words, if an ink mark Q of a first size is produced when the film 114 contacts the nozzle N1 with a first pressure, then an ink mark Q of a second size larger than the first size can be produced when the film 114 contacts the nozzle N1 with a second pressure greater than the first pressure.

[0054] Therefore, it is necessary to press the head unit 120 with a uniform force (or pressure) over the entire surface of the base member 112. For this purpose, in the meniscus measurement operation (ie, Figure 3 Before S10, S20, S30 in the Figure 7 ), so that the bottom surface of the head unit 120 is parallel to the upper surface of the base member 112.

[0055] Specifically, refer to Figure 7 and Figure 8 , a plurality of pressure sensors 116 are provided on the base member 112 (S51).

[0056] Optionally, to protect the multiple pressure sensors 116, a protective member 118 may be provided on the multiple pressure sensors 116. The pressure sensors 116 may be arranged in a matrix, but the present invention is not limited thereto. The protective member 118 may be in the form of a film and made of a material that does not interfere with the sensing operation of the pressure sensors 116. A member in which the multiple pressure sensors 116 are provided on the base member 112, or a member in which the multiple pressure sensors 116 and the protective member 118 are provided, is referred to as a "tuning member (119)".

[0057] Next, the plurality of pressure sensors 116 provided on the base member 112 are brought into close contact with the bottom surface 120 a of the head unit 120 , and the sensing values of the plurality of pressure sensors 116 are measured ( S52 ).

[0058] Specifically, the base member 112 is pressed against the head unit 120 with uniform force (or pressure) over the entire surface. The control module 150 checks whether the upper surface 1121 of the base member 112 is tilted based on sensing values measured by the plurality of pressure sensors 116 provided on the base member 112.

[0059] For example, Figure 9 As shown, the left side of the upper surface 1121 of the base member 112 may be tilted downward relative to the right side. In this case, even if the base member 112 presses the bottom surface of the head unit 120 with uniform force (or pressure) across the entire surface, the sensed value of the pressure sensor 116 disposed on the left side of the base member 112 may be smaller than the sensed value of the pressure sensor 116 disposed on the right side of the base member 112.

[0060] Based on the sensing value thus measured, adjustment is performed so that the upper surface of the base member 112 is parallel to the bottom surface of the head unit 120. That is, adjustment is performed so that the position of the upper surface of the base member 112 changes from 1121 to 1122.

[0061] After the debugging is completed, the plurality of pressure sensors 116 of the base member 112 can be removed and a measuring membrane (see Figure 1 114) to prepare the meniscus measurement unit ( Figure 1 Alternatively, the meniscus measurement unit 110 may be prepared by providing the measurement film 114 on the plurality of pressure sensors 116 without removing the plurality of pressure sensors 116 from the base member 112. Then, the meniscus measurement operation ( Figure 3 S10, S20, S30 in ).

[0062] Figure 10 FIG is a diagram for explaining a substrate processing apparatus according to another embodiment of the present invention. Figure 8 The differences are mainly explained.

[0063] Figure 8 The debugging component 119 used in the embodiment includes a plurality of pressure sensors 116 provided on the base component 112 .

[0064] on the other hand, Figure 10 The debugging component used in the embodiment includes a plurality of laser displacement sensors 117 provided on a base component 112 .

[0065] The plurality of laser displacement sensors 117 are used to measure distances G1 to Gn between the plurality of laser displacement sensors 117 and the bottom surface of the head unit 120 .

[0066] For example, Figure 9As shown, the left side of the top surface of base member 112 may be tilted downward more than the right side. In this case, the distance between the laser displacement sensor 117 located on the left side of base member 112 and the bottom surface of head unit 120 (e.g., G1) may be greater than the distance between the laser displacement sensor 117 located on the right side of base member 112 and the bottom surface of head unit 120 (e.g., Gn). Based on the distances thus measured, adjustments are made so that the top surface of base member 112 and the bottom surface of head unit 120 are parallel.

[0067] After the debugging is completed, the plurality of laser displacement sensors 117 of the base member 112 may be removed and then the measuring film 114 may be set to prepare the meniscus measurement unit ( Figure 1 Alternatively, the meniscus measurement unit 110 may be prepared by placing the measurement film 114 on the plurality of laser displacement sensors 117 without removing the plurality of laser displacement sensors 117 from the base member 112. Then, the meniscus measurement operation ( Figure 3 S10, S20, S30 in ).

[0068] Figure 11 This is a conceptual diagram for explaining a substrate processing apparatus according to another embodiment of the present invention. Figure 1 The differences are mainly explained.

[0069] refer to Figure 11 The meniscus measurement unit 110 used in the substrate processing apparatus according to another embodiment of the present invention may include a plurality of pressure sensors 116 disposed between the base member 112 and the membrane 114 .

[0070] Among them, if you use Figure 8 As shown in the description, the pressure sensor 116 may be used during commissioning operations.

[0071] This pressure sensor 116 can also be used during the meniscus measurement operation. As described above, the base member 112 is pressed against the head unit 120 with a uniform force (or pressure) over the entire surface to form a detection pattern on the membrane 114. When forming the detection pattern, a plurality of pressure sensors 116 are used to measure the sensing values. Based on the sensing values measured in this way, the validity of the detection pattern is checked. If the sensing values detected by the plurality of pressure sensors 116 are within the reference range (i.e., the range initially set), the detection pattern can be judged to be valid. If at least part of the sensing values sensed by the plurality of pressure sensors 116 exceeds the reference range, the detection pattern can be judged to be invalid. If the detection pattern is invalid, the meniscus measurement operation is performed again. If the detection pattern is still invalid even after repeated multiple times, the debugging operation is re-executed.

[0072] While the embodiments of the present invention have been described above and with reference to the accompanying drawings, it will be understood by those skilled in the art that the present invention can be implemented in other specific ways without changing the technical concept or essential features of the present invention. Therefore, it should be understood that the embodiments described above are illustrative in all respects and are not restrictive.

Claims

1. A meniscus measurement method, comprising: providing a head unit capable of ejecting ink through a plurality of nozzles; bringing the film into close contact with the plurality of nozzles so that ink remaining in the plurality of nozzles when the nozzles are not ejecting ink adheres to the film, thereby forming a detection pattern on the film; as well as measuring the meniscus of ink remaining in the plurality of nozzles based on the detection pattern, The detection pattern includes a plurality of ink marks spaced apart from each other, the plurality of ink marks corresponding to the plurality of nozzles, Measuring the meniscus of the remaining ink includes measuring a size of the ink mark.

2. The meniscus measurement method according to claim 1, wherein: The size of the ink mark includes at least one of an area, a diameter, and a radius of the ink mark.

3. The meniscus measurement method according to claim 1, wherein: The head unit includes the plurality of nozzles and a plurality of piezoelectric elements corresponding to the plurality of nozzles, respectively. The meniscus measurement method further includes adjusting voltages supplied to the plurality of piezoelectric elements based on the measured meniscus.

4. The meniscus measurement method according to claim 3, wherein: The head unit includes a first nozzle, a second nozzle, a first piezoelectric element corresponding to the first nozzle, and a second piezoelectric element corresponding to the second nozzle. The meniscus of the ink remaining in the first nozzle is located at a higher position than the meniscus of the ink remaining in the second nozzle, A first voltage supplied to the first piezoelectric element is greater than a second voltage supplied to the second piezoelectric element.

5. The meniscus measurement method according to claim 1, wherein: The bringing the film into close contact with the plurality of nozzles includes: bringing a base member provided with the film into contact with the head unit; The meniscus measurement method further includes, before bringing the film into close contact with the plurality of nozzles, performing adjustment so that a bottom surface of the head unit is parallel to an upper surface of the base member.

6. The meniscus measurement method according to claim 5, wherein: The debugging includes: providing a plurality of pressure sensors on the base member before providing the membrane; measuring sensing values of the plurality of pressure sensors provided on the base member by bringing the plurality of pressure sensors into close contact with the bottom surface of the head unit; and Adjustment is performed based on the measured sensing value so that the bottom surface of the head unit is parallel to the upper surface of the base member.

7. The meniscus measurement method according to claim 5, wherein: The debugging includes: Arrange a plurality of laser displacement sensors on the base member; measuring the distance between the plurality of laser displacement sensors and the bottom surface of the head unit using the plurality of laser displacement sensors provided on the base member; and Adjustment is performed based on the measured distance so that the bottom surface of the head unit is parallel to the upper surface of the base member.

8. A meniscus measurement device comprising: base member; a pressure sensor, disposed on the base member; as well as a membrane disposed on the pressure sensor, The film is in close contact with the plurality of nozzles of the head unit so that ink remaining in the plurality of nozzles when the nozzles are not ejecting ink adheres to the film, thereby forming a detection pattern on the film. The detection pattern includes a plurality of ink marks spaced apart from each other, the plurality of ink marks corresponding to the plurality of nozzles, The meniscus measurement device measures the size of the ink mark.

9. The meniscus measurement device according to claim 8, wherein: The film has a water-absorbing material capable of absorbing ink remaining in the plurality of nozzles.

10. A substrate processing device comprising: a head unit capable of ejecting ink through a plurality of nozzles; a measuring unit including a membrane for measuring a meniscus of ink remaining in the plurality of nozzles; as well as a control module that controls the head unit or the measurement unit to bring the film into close contact with the plurality of nozzles, so that ink remaining in the plurality of nozzles when the nozzles are not ejecting ink adheres to the film, thereby forming a detection pattern on the film, and calculates a meniscus of the ink remaining in the plurality of nozzles based on the detection pattern; The detection pattern includes a plurality of ink marks spaced apart from each other, the plurality of ink marks corresponding to the plurality of nozzles, Measuring, by the control module, the meniscus of the remaining ink includes: measuring, by the control module, the size of the ink mark.

11. The substrate processing apparatus according to claim 10, wherein: The substrate processing apparatus further includes an image generating unit for photographing the detection pattern. The control module calculating the meniscus of the ink remaining in the plurality of nozzles includes: the control module calculating the sizes of the plurality of ink marks in the photographed detection pattern.

12. The substrate processing apparatus according to claim 11, wherein: The size of the ink mark includes at least one of an area, a diameter, and a radius of the ink mark.

13. The substrate processing apparatus according to claim 10, wherein: The head unit includes the plurality of nozzles and a plurality of piezoelectric elements corresponding to the plurality of nozzles, respectively. The control module adjusts the voltage provided to the plurality of piezoelectric elements based on the measured meniscus.

14. The substrate processing apparatus according to claim 13, wherein: The head unit includes a first nozzle, a second nozzle, a first piezoelectric element corresponding to the first nozzle, and a second piezoelectric element corresponding to the second nozzle. The meniscus of the ink remaining in the first nozzle is located at a position lower than the meniscus of the ink remaining in the second nozzle, The control module controls so that a first voltage is provided to the first piezoelectric element, and a second voltage greater than the first voltage is provided to the second piezoelectric element.

15. The substrate processing apparatus according to claim 10, wherein: The measuring unit includes a base member and the membrane provided on the base member, The substrate processing apparatus further includes performing adjustment so that a bottom surface of the head unit is parallel to an upper surface of the base member before the film is brought into close contact with the plurality of nozzles.

16. The substrate processing apparatus according to claim 15, wherein: The debugging includes: providing a plurality of pressure sensors on the base member before providing the membrane; measuring sensing values of the plurality of pressure sensors provided on the base member by bringing the plurality of pressure sensors into close contact with the bottom surface of the head unit; and performing adjustment based on the measured sensing value so that the bottom surface of the head unit is parallel to the upper surface of the base member, The substrate processing apparatus further includes: after the debugging, disposing the film on the base member.

17. The substrate processing apparatus according to claim 15, wherein: The debugging includes: providing a plurality of laser displacement sensors on the base member before providing the membrane; measuring the distance between the plurality of laser displacement sensors and the bottom surface of the head unit using the plurality of laser displacement sensors provided on the base member; and Adjusting based on the measured distance so that the bottom surface of the head unit is parallel to the upper surface of the base member, The substrate processing apparatus further includes: after the debugging, disposing the film on the base member.

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