Integrated circuit design method and device, electronic device, and storage medium

Abstract

A design method and device for an integrated circuit, an electronic device, and a storage medium. The integrated circuit design method includes: obtaining a power configuration file and a register transfer level description file for the integrated circuit; in response to cross-voltage domain communication between a first physical function module and a second physical function module, inserting a cross-voltage bridge module between the first physical function module and the second physical function module according to the power configuration file and the register transfer level description file to obtain an updated register transfer level description file; wherein the cross-voltage bridge module is a multi-power domain function module, the first physical function module and the second physical function module are both single-power domain function modules, and the cross-voltage bridge module is used to provide level conversion and / or power-off isolation protection for cross-voltage domain communication between the first physical function module and the second physical function module. The integrated circuit design method can reduce the time for synthesis, physical implementation, and low-power verification, shortening the iteration cycle in chip research and development.

Description

Technical Field

[0001] Embodiments of the present disclosure relate to a method for designing an integrated circuit, an apparatus for designing an integrated circuit, an electronic device, and a non-transitory computer-readable storage medium. Background Art

[0002] The integrated circuit design process consists of front-end design and back-end design. Front-end design primarily encompasses algorithm or hardware architecture design and analysis, RTL (Register Transfer Level) implementation, functional verification, and logic synthesis. Back-end design encompasses layout and routing, timing closure, and physical verification. Each stage of the integrated circuit design process involves complex design processes, and each stage can require weeks or even months of development time. Summary of the Invention

[0003] At least one embodiment of the present disclosure provides a design method for an integrated circuit, wherein the integrated circuit includes multiple physical function modules, and the multiple physical function modules include a first physical function module and a second physical function module. The design method includes: obtaining a power configuration file and a register transfer level description file of the integrated circuit; in response to the existence of cross-voltage domain communication between the first physical function module and the second physical function module, inserting a cross-voltage bridge module between the first physical function module and the second physical function module according to the power configuration file and the register transfer level description file to obtain an updated register transfer level description file; wherein, in the updated register transfer level description file, the cross-voltage bridge module is a multi-power domain function module, the first physical function module and the second physical function module are both single-power domain function modules, and the cross-voltage bridge module is used to provide level conversion and / or power-off isolation protection for the cross-voltage domain communication between the first physical function module and the second physical function module.

[0004] For example, in the design method of an integrated circuit provided in at least one embodiment of the present disclosure, a cross-voltage bridge module is inserted between the first physical function module and the second physical function module according to the power configuration file and the register transfer level description file to obtain an updated register transfer level description file, including: creating a cross-voltage bridge module according to the power configuration file; establishing a cross-voltage signal channel in the cross-voltage bridge module for the port for cross-voltage domain signal transmission between the first physical function module and the second physical function module according to the power configuration file; and adding the cross-voltage bridge module to the corresponding position in the register transfer level description file to obtain the updated register transfer level description file.

[0005] For example, in the integrated circuit design method provided by at least one embodiment of the present disclosure, the power profile includes power information of a first power supply that supplies power to a first power domain where the first physical function module is located, and power information of a second power supply that supplies power to a second power domain where the second physical function module is located. Creating a cross-voltage bridge module based on the power profile includes: creating a first buffer array and a second buffer array based on the power profile, wherein the first buffer array is located in the first power domain, the second buffer array is located in the second power domain, and the first buffer array and the second buffer array are used to provide a buffer unit; determining whether a cross-voltage domain processing unit between the first physical function module and the second physical function module requires an enable signal and the source of the enable signal based on the power information of the first power supply and the power information of the second power supply, wherein the cross-voltage domain processing unit is used to provide level conversion and / or power-off isolation protection for a port for cross-voltage domain communication between the first physical function module and the second physical function module; and creating an enable unit in the corresponding power domain to provide the enable signal in response to the enable signal source indicating that the enable signal comes from the cross-voltage bridge module.

[0006] For example, in the design method of an integrated circuit provided in at least one embodiment of the present disclosure, according to the power configuration file, a cross-voltage signal channel is established in the cross-voltage bridge module for the port for cross-voltage domain signal transmission between the first physical function module and the second physical function module, including: determining at least one pair of cross-voltage domain ports for cross-voltage domain signal transmission between the first physical function module and the second physical function module, wherein each pair of cross-voltage domain ports includes a first port located in the first physical function module and a second port located in the second physical function module, the first port is connected to the second port and performs data communication, and the first port and the second port are located at the same level in the integrated circuit; according to the power configuration file, in the cross-voltage bridge module, a cross-voltage signal channel is established between each pair of cross-voltage domain ports for connecting the first port and the second port in each pair of cross-voltage domain ports.

[0007] For example, in the design method of an integrated circuit provided in at least one embodiment of the present disclosure, the cross-voltage signal channel includes a first buffer unit located in a first buffer array, a second buffer unit located in a second buffer array, and a cross-voltage domain processing unit located between the first buffer unit and the second buffer unit, and the cross-voltage domain processing unit is used to provide level conversion and / or power-off isolation protection for the first port and the second port.

[0008] For example, in the design method of an integrated circuit provided in at least one embodiment of the present disclosure, the configuration file includes power configuration information of the first physical function module and power configuration information of the second physical function module. The power configuration information of the first physical function module includes the name of the first power supply for supplying power to the first physical function module and the power-off retention value expected to be output when the first power supply is in a power-off state. The power information of the first power supply includes the voltage value configuration and power status of the first power supply. The power information of the second power supply includes the voltage value configuration and power status of the second power supply. According to the power configuration file, in the cross-voltage bridge module, a cross-voltage signal channel is established between each pair of cross-voltage domain ports for connecting each pair of cross-voltage domain ports. The first port and the second port in the circuit include: obtaining the first buffer unit located in the first buffer array and the second buffer unit located in the second buffer array; connecting the first buffer unit to the first port and the second buffer unit to the second port; determining the cross-voltage domain processing unit located between the first buffer unit and the second buffer unit according to the voltage value configuration, power supply status and power-off retention value of the first power supply and the second power supply; electrically connecting the cross-voltage domain processing unit to the first power supply and the second power supply; and connecting the enable port of the cross-voltage domain processing unit to the corresponding enable unit in the cross-voltage bridge module in response to the enable signal of the cross-voltage domain processing unit coming from the cross-voltage bridge module.

[0009] For example, in the design method of an integrated circuit provided by at least one embodiment of the present disclosure, the power configuration file also includes the type of the cross-voltage domain processing unit and the name of the cross-voltage domain processing standard unit under each type, and the cross-voltage domain processing unit located between the first buffer unit and the second buffer unit is determined according to the voltage value configuration, power state and power-off retention value of the first power supply and the second power supply, including: determining the type of the cross-voltage domain processing unit according to the voltage value configuration and power state of the first power supply and the second power supply; and selecting the corresponding cross-voltage domain processing standard unit under the type of the cross-voltage domain processing unit to be inserted between the first buffer unit and the second buffer unit according to the power-off retention value of the first power supply and the second power supply.

[0010] For example, in the integrated circuit design method provided in at least one embodiment of the present disclosure, the buffer unit is in the form of a buffer, a register, or a FIFO queue.

[0011] For example, in the design method of an integrated circuit provided in at least one embodiment of the present disclosure, the types of the cross-voltage domain processing units include level converters, power-off isolators and level conversion isolators, the level converters are configured to perform level conversion; the power-off isolators are configured to perform power-off isolation protection; the level conversion isolators are configured to perform level conversion and power-off isolation protection.

[0012] For example, the integrated circuit design method provided by at least one embodiment of the present disclosure further includes: determining, based on the power profile, whether there is cross-voltage domain communication between the first physical function module and the second physical function module.

[0013] For example, in the design method of an integrated circuit provided in at least one embodiment of the present disclosure, the power profile includes power information of a first power supply that supplies power to a first power domain where the first physical function module is located, and power information of a second power supply that supplies power to a second power domain where the second physical function module is located. The power profile also includes power configuration information of the first physical function module and power configuration information of the second physical function module. According to the power profile, determining whether there is cross-voltage domain communication between the first physical function module and the second physical function module includes: determining the first power domain where the first physical function module is located and the second power domain where the second physical function module is located according to the power configuration information of the first physical function module and the power configuration information of the second physical function module; and determining whether the first physical function module and the second physical module belong to the same power domain according to the power information of the first power supply and the power information of the second power supply.

[0014] For example, in the design method of an integrated circuit provided in at least one embodiment of the present disclosure, the power information of the first power supply includes the voltage value configuration and power status of the first power supply, and the power information of the second power supply includes the voltage value configuration and power status of the second power supply, and the power status includes a power-down state or a non-power-down state. Based on the power information of the first power supply and the power information of the second power supply, determining whether the first physical function module and the second physical module belong to the same power domain includes: in response to at least one of the voltage value configuration and power status of the first power supply and the second power supply being different, determining that the first physical function module and the second physical module do not belong to the same power domain; in response to the voltage value configuration and power status of the first power supply and the second power supply being the same, determining that the first physical function module and the second physical module belong to the same power domain.

[0015] For example, the integrated circuit design method provided in at least one embodiment of the present disclosure further includes: generating a power intent description file of the integrated circuit according to the power configuration file and the updated register transfer level description file.

[0016] For example, in the design method of an integrated circuit provided by at least one embodiment of the present disclosure, the updated register transfer level description file includes the first physical function module, the second physical function module and the cross-voltage bridge module, the power configuration file includes power information of the first power supply for the first power domain where the first physical function module is located, and power information of the second power supply for the second power domain where the second physical function module is located, the power configuration file also includes power configuration information of the first physical function module and power configuration information of the second physical function module, and the power intention description file of the integrated circuit is generated according to the power configuration file and the updated register transfer level description file, including: generating a first power intention description sub-file corresponding to the first physical function module according to the power configuration file, wherein the first power intention description sub-file includes the power network definition of the first power domain, the power domain definition of the first power domain and the description of the a power state table for the power state combination of the first power domain; generating a second power intention description subfile corresponding to the second physical function module according to the power configuration file, wherein the second power intention description subfile includes the power network definition of the second power domain, the power domain definition of the second power domain and the power state table describing the power state combination of the second power domain; generating a third power intention description subfile corresponding to the cross-voltage bridge module according to the power configuration file, wherein the third power intention description subfile includes the power network definition of the first power and the second power, the power domain definition of the first power domain and the second power domain, the power state table describing the power state combination of the first power domain and the second power domain, and the cross-voltage domain strategy of the cross-voltage bridge module; generating a power intention description file for the integrated circuit according to the first power intention description subfile, the second power intention description subfile and the third power intention description subfile.

[0017] For example, in the design method of an integrated circuit provided by at least one embodiment of the present disclosure, in the updated register transfer level description file, the naming of the cross-voltage bridge module indicates that the cross-voltage bridge module is connected to the first power domain and the second power domain; according to the power configuration file, a third power intention description sub-file corresponding to the cross-voltage bridge module is generated, including: according to the naming of the cross-voltage bridge module, determining that the cross-voltage bridge module is connected to the first voltage domain and the second voltage domain; according to the power information of the first power supply and the power information of the second power supply in the power configuration file, generating the third power intention description sub-file.

[0018] For example, the design method of an integrated circuit provided in at least one embodiment of the present disclosure also includes: synthesizing the updated register transfer level description file according to the power intention description file and the updated register transfer level description file, wherein, during the synthesis process, in response to the fact that a cross-voltage domain processing unit is not inserted on at least one cross-voltage signal channel in the cross-voltage bridge module, a cross-voltage domain processing unit is respectively inserted on the at least one cross-voltage signal channel according to the power intention description file.

[0019] For example, in the integrated circuit design method provided by at least one embodiment of the present disclosure, the power profile includes power information of a first power supply that supplies power to a first power domain where the first physical function module is located, and power information of a second power supply that supplies power to a second power domain where the second physical function module is located, the power information including a power name, a voltage value configuration, a power state, an enable signal source, and an enable signal valid level, and the power state includes a power-down state or a non-power-down state; the power profile also includes power configuration information of the first physical function module and power configuration information of the second physical function module, the power configuration information of the first physical function module includes a name of the first power supply and a power-down retention value expected to be output when the first power supply is in a power-down state, and the power configuration information of the second physical function module includes a name of the second power supply and a power-down retention value expected to be output when the second power supply is in a power-down state; the power profile also includes the type of the cross-voltage domain processing unit and the name of the cross-voltage domain processing standard unit under each type.

[0020] At least one embodiment of the present disclosure provides a design device for an integrated circuit, wherein the integrated circuit includes multiple physical function modules, and the multiple physical function modules include a first physical function module and a second physical function module. The design device includes: an acquisition unit, configured to acquire a power configuration file and a register transfer level description file of the integrated circuit; an insertion unit, configured to, in response to the existence of cross-voltage domain communication between the first physical function module and the second physical function module, insert a cross-voltage bridge module between the first physical function module and the second physical function module according to the power configuration file and the register transfer level description file to obtain an updated register transfer level description file; wherein, in the updated register transfer level description file, the cross-voltage bridge module is a multi-power domain function module, the first physical function module and the second physical function module are both single-power domain function modules, and the cross-voltage bridge module is used to provide level conversion and / or power-off isolation protection for the cross-voltage domain communication between the first physical function module and the second physical function module.

[0021] For example, in the design device of an integrated circuit provided by at least one embodiment of the present disclosure, when the insertion unit executes the insertion of a cross-voltage bridge module between the first physical function module and the second physical function module according to the power configuration file and the register transfer level description file to obtain an updated register transfer level description file, the insertion unit includes performing the following operations: creating a cross-voltage bridge module according to the power configuration file; establishing a cross-voltage signal channel in the cross-voltage bridge module for the port for cross-voltage domain signal transmission between the first physical function module and the second physical function module according to the power configuration file; and adding the cross-voltage bridge module to the corresponding position in the register transfer level description file to obtain the updated register transfer level description file.

[0022] For example, in the integrated circuit design device provided by at least one embodiment of the present disclosure, the power profile includes power information of a first power supply that supplies power to a first power domain where the first physical function module is located, and power information of a second power supply that supplies power to a second power domain where the second physical function module is located. The insertion unit executes creation of a cross-voltage bridge module according to the power profile, including the following operations: creating a first buffer array and a second buffer array according to the power profile, wherein the first buffer array is located in the first power domain, the second buffer array is located in the second power domain, and the first buffer array and the second buffer array are used to provide a buffer unit; determining whether a cross-voltage domain processing unit between the first physical function module and the second physical function module requires an enable signal and the source of the enable signal according to the power information of the first power supply and the power information of the second power supply, wherein the cross-voltage domain processing unit is used to provide level conversion and / or power-off isolation protection for a port for cross-voltage domain communication between the first physical function module and the second physical function module; and creating an enable unit in the corresponding power domain to provide the enable signal in response to the enable signal source indicating that the enable signal comes from the cross-voltage bridge module.

[0023] For example, in the design device of an integrated circuit provided by at least one embodiment of the present disclosure, when the insertion unit executes the establishment of a cross-voltage signal channel for the port for cross-voltage domain signal transmission between the first physical function module and the second physical function module in the cross-voltage bridge module according to the power configuration file, the operation includes the following operations: determining at least one pair of cross-voltage domain ports for cross-voltage domain signal transmission between the first physical function module and the second physical function module, wherein each pair of cross-voltage domain ports includes a first port located in the first physical function module and a second port located in the second physical function module, the first port is connected to the second port and performs data communication, and the first port and the second port are located at the same level in the integrated circuit; according to the power configuration file, in the cross-voltage bridge module, a cross-voltage signal channel is established between each pair of cross-voltage domain ports for connecting the first port and the second port in each pair of cross-voltage domain ports.

[0024] For example, in the design device of an integrated circuit provided in at least one embodiment of the present disclosure, the cross-voltage signal channel includes a first buffer unit located in a first buffer array, a second buffer unit located in a second buffer array, and a cross-voltage domain processing unit located between the first buffer unit and the second buffer unit, and the cross-voltage domain processing unit is used to provide level conversion and / or power-off isolation protection for the first port and the second port.

[0025] For example, in the design device of the integrated circuit provided by at least one embodiment of the present disclosure, the configuration file includes power supply configuration information of the first physical function module and power supply configuration information of the second physical function module, the power supply configuration information of the first physical function module includes the name of the first power supply for powering the first physical function module and the power-off retention value expected to be output when the first power supply is in a power-off state, the power supply information of the first power supply includes the voltage value configuration and power supply state of the first power supply, and the power supply information of the second power supply includes the voltage value configuration and power supply state of the second power supply, and the insertion unit executes, according to the power supply configuration file, to establish a cross-voltage signal channel between each pair of cross-voltage domain ports in the cross-voltage bridge module for connecting each pair of cross-voltage domain ports When the first port and the second port in the port are connected, the following operations are performed: obtaining the first buffer unit located in the first buffer array and the second buffer unit located in the second buffer array; connecting the first buffer unit to the first port and the second buffer unit to the second port; determining the cross-voltage domain processing unit located between the first buffer unit and the second buffer unit according to the voltage value configuration, power supply status and power-off retention value of the first power supply and the second power supply; electrically connecting the cross-voltage domain processing unit to the first power supply and the second power supply; and connecting the enable port of the cross-voltage domain processing unit to the corresponding enable unit in the cross-voltage bridge module in response to the enable signal of the cross-voltage domain processing unit coming from the cross-voltage bridge module.

[0026] For example, in the design device of an integrated circuit provided by at least one embodiment of the present disclosure, the power configuration file also includes the type of the cross-voltage domain processing unit and the name of the cross-voltage domain processing standard unit under each type. When the insertion unit determines the cross-voltage domain processing unit located between the first buffer unit and the second buffer unit based on the voltage value configuration, power state and power-off retention value of the first power supply and the second power supply, the following operations are performed: determining the type of the cross-voltage domain processing unit based on the voltage value configuration and power state of the first power supply and the second power supply; and selecting the corresponding cross-voltage domain processing standard unit under the type of the cross-voltage domain processing unit based on the power-off retention value of the first power supply and the second power supply to insert between the first buffer unit and the second buffer unit.

[0027] For example, the integrated circuit design device provided by at least one embodiment of the present disclosure further includes a determining unit, and the generating unit is configured to generate a power intent description file of the integrated circuit based on the power configuration file and the updated register transfer level description file.

[0028] For example, the design device of an integrated circuit provided by at least one embodiment of the present disclosure also includes a generation unit, and the synthesis unit is configured to synthesize the updated register transfer level description file based on the power intention description file and the updated register transfer level description file, wherein, during the synthesis process, in response to the fact that a cross-voltage domain processing unit is not inserted on at least one cross-voltage signal channel in the cross-voltage bridge module, a cross-voltage domain processing unit is respectively inserted on the at least one cross-voltage signal channel according to the power intention description file.

[0029] At least one embodiment of the present disclosure provides an electronic device, comprising: a memory, which non-transitorily stores computer-executable instructions; and a processor, configured to execute the computer-executable instructions, wherein the computer-executable instructions, when executed by the processor, implement the integrated circuit design method according to any embodiment of the present disclosure.

[0030] At least one embodiment of the present disclosure provides a non-transitory computer-readable storage medium, wherein the non-transitory computer-readable storage medium stores computer-executable instructions, and when the computer-executable instructions are executed by a processor, the integrated circuit design method according to any embodiment of the present disclosure is implemented. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings of the embodiments will be briefly introduced below. Obviously, the drawings in the following description only relate to some embodiments of the present disclosure, rather than limiting the present disclosure.

[0032] Figure 1 A schematic diagram of an integrated circuit design is shown;

[0033] Figure 2 A schematic flowchart of a method for designing an integrated circuit provided in at least one embodiment of the present disclosure;

[0034] Figure 3 A schematic flowchart of step S20 in a method for designing an integrated circuit according to at least one embodiment of the present disclosure;

[0035] Figure 4 A schematic structural diagram of a cross-voltage bridge module provided in at least one embodiment of the present disclosure;

[0036] Figure 5 An improved integrated circuit design process provided for at least one embodiment of the present disclosure;

[0037] Figure 6 A flowchart of an implementation method for designing an integrated circuit according to at least one embodiment of the present disclosure;

[0038] Figures 7A-7DA schematic diagram of the circuit structure of an integrated circuit provided in at least one embodiment of the present disclosure;

[0039] Figures 8A-8C A schematic diagram of a power intent description sub-file provided for at least one embodiment of the present disclosure;

[0040] Figure 9 A schematic block diagram of a design apparatus for an integrated circuit provided in at least one embodiment of the present disclosure;

[0041] Figure 10 A schematic diagram of an electronic device provided in at least one embodiment of the present disclosure;

[0042] Figure 11 A schematic diagram of a non-transitory computer-readable storage medium provided for at least one embodiment of the present disclosure. DETAILED DESCRIPTION

[0043] In order to make the purpose, technical solutions and advantages of the embodiments of the present disclosure more clear, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0044] Unless otherwise defined, the technical or scientific terms used in this disclosure should have the usual meanings understood by people with ordinary skills in the field to which this disclosure belongs. The "first", "second" and similar words used in this disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. "Include" or "comprise" and similar words mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly. In order to keep the following description of the embodiments of the present disclosure clear and concise, the present disclosure omits detailed descriptions of some known functions and known components.

[0045] With the ever-increasing demand for computing power, integrated circuits are becoming larger and larger, and their power consumption is also increasing. For example, a system-on-a-chip (SOC) is a purpose-built integrated circuit that contains the entire system and embedded software. With the development of embedded systems, SOCs are becoming increasingly powerful and larger in scale.

[0046] Large-scale integrated circuits (LSIs) are typically divided into multiple physical functional blocks (tiles) based on their functionality and layout. A physical functional block is a general term for the physical implementation modules within an LSI. Physical functional blocks are connected to each other via data signal lines for communication. For example, in front-end logic design, integrated circuits are typically designed based on intellectual property cores (IP cores). In back-end physical implementation, one physical functional block can correspond to one IP core, or, if the IP core is large, multiple physical functional blocks can correspond to one IP core.

[0047] Current integrated circuit design generally employs a variety of low-power technologies to reduce power consumption. Multi-voltage design is an effective low-power technology. This technology uses power supplies with different voltages for different physical functional modules within the integrated circuit, achieving a balanced power consumption and performance, ultimately achieving the optimal performance-to-power ratio for the chip.

[0048] Multi-voltage technology, as an effective means of reducing power consumption, has been widely adopted in current integrated circuit design. DVFS (Dynamic Voltage Frequency Scaling) and power shutdown technologies, which are extensions of multi-voltage technology, are also widely used in high-performance, large-scale integrated circuits such as CPUs (central processing units) and GPUs (graphics processing units).

[0049] DVFS technology dynamically adjusts the voltage and frequency of the power supply based on workload changes to balance integrated circuit performance and power consumption. For example, when high performance is required, the voltage and frequency provided to the chip are increased, while when high performance is not required, the voltage and frequency provided to the chip are decreased to reduce power consumption.

[0050] Power shutdown technology reduces power consumption by selectively shutting down certain power domains based on the workload of the integrated circuit when multiple power domains exist within a chip. For example, if a chip has two CPU cores, each using a different power supply, when the chip is idle, only the smaller CPU core needs to maintain minimum operating status, so the larger CPU core can be powered down.

[0051] In order to meet the requirements of performance and power consumption, multiple power domains (also called voltage domains) may exist in integrated circuits using multi-voltage technology. A power domain is a logically divided area. An area powered by an independent power supply is a power domain. Each power domain may include one or more physical functional modules. The physical functional modules in each power domain are powered by the same power supply, and different power domains use different power supplies. Here, different power supplies can be: different power supply voltage values, or different power supply states. The power supply states include a power-down state and a non-power-down state. The power-down state means that the power supply can be turned off in some cases without workload, and the non-power-down state means that the power supply remains powered on.

[0052] Figure 1 A schematic diagram of an integrated circuit design is shown.

[0053] like Figure 1 As shown in FIG, the integrated circuit includes nine physical function modules, of which physical function modules A, B, C, and D are all powered by power supply VDD_W (referred to as power supply W). These four physical function modules constitute power domain W. Physical function modules E and F are powered by power supply VDD_X (referred to as power supply X) and constitute power domain X. Similarly, physical function modules G and H constitute power domain Y, and physical function module K uses an independent power supply VDD_Z and independently constitutes power domain Z.

[0054] Depending on the functions and power consumption requirements of different physical function modules, the voltage values ​​of different power supplies may vary. For example, physical function modules A, B, C, and D need to dynamically adjust their voltage and frequency based on workload to implement DVFS low-power technology. Therefore, the voltage of power supply VDD_W can be dynamically adjusted from 0.6V to 0.9V. Physical function modules G and H, on the other hand, have lower performance requirements and only need to operate at a lower voltage. Therefore, the voltage of power supply VDD_Y can be fixed at 0.6V. Similarly, physical function modules E and F operate at a fixed voltage of 0.8V, that is, the voltage of power supply VDD_X is fixed at 0.8V. Physical function module K operates at a fixed voltage of 0.9V, that is, the voltage of power supply VDD_Z is fixed at 0.9V.

[0055] Furthermore, based on application requirements, when the IC is idle for extended periods, only physical function modules E and F are required to operate, while the other physical function modules may not be required to operate at all. Therefore, power domains W, Y, and Z are designated as power-down domains, with power supplies VDD_W, VDD_Y, and VDD_Z in a power-down state and capable of being shut down. Power domain X, on the other hand, is designated as a normally-on domain, with power supply VDD_X in a non-power-down state and required to remain powered on at all times.

[0056] If data communication exists between physical functional modules in different power domains, due to the different voltage states (such as voltage value and power state) of different power domains, voltage value conversion and power-off isolation protection must be provided for the communication data signals. Otherwise, data transmission errors may occur, or even damage to the integrated circuit may occur.

[0057] For example Figure 1 In the example, the voltage values ​​of the power domains where physical function modules H and K are located are 0.6V and 0.9V, respectively. A high-level signal is sent from physical function module H to physical function module K. Because the high-level signal of physical function module H is 0.6V and the high-level signal of physical function module K is 0.9V, the high-level signal from physical function module H may not be recognized as a high-level signal in physical function module K, resulting in data transmission errors.

[0058] In addition, the power domain Y and power domain Z where the physical function module H and the physical function module K are located can both be turned off. Assuming that the power domain Y is in the off state but the power domain Z is in the on state, the data signal line from the physical function module H to the physical function module K is in an unknown state, which may cause large leakage, and in severe cases even cause permanent damage to the integrated circuit.

[0059] Therefore, it is usually necessary to add additional cross-voltage domain processing circuitry for data signal transmission between two different power domains. Common cross-voltage domain processing units include level shifters (LS), power-off isolators (Isolation), and enable level shifters (ELS).

[0060] A level converter is used to convert voltages between two different power domains, converting the voltage of the signal output by the source physical module to the voltage of the destination physical functional module. A power-off isolator provides power-off isolation protection. When the power supply to the source functional module is shut off, the power-off isolator maintains the output signal at a fixed value (such as a fixed low or high level), preventing the output of unknown signals when the power supply is off. A level converter isolator combines the functions of a level converter and a power-off isolator to provide both level conversion and power-off isolation protection.

[0061] The layout planning of physical functional modules and the definition of power domains are completed during the IC's architecture definition phase. For example, the physical functional modules divided into according to chip functionality, the power supply for each physical functional module, the voltage level of each power supply, and whether it can be shut down are all initially determined during this phase. During chip development, the architecture may change due to improved requirements and the discovery of problems, requiring the re-layout planning of physical functional modules and changes to power domains.

[0062] Due to the different combinations of power domains, different cross-voltage domain processing circuits need to be added for different signals. If these circuits are added manually, the workload is huge and error-prone. Once the power domain definition or physical functional module layout changes, the modification workload is very large.

[0063] Currently, synthesis tools can be used to insert cross-voltage domain processing units, but synthesis tools can only insert them during the synthesis stage and need to know information about the power domain, such as voltage value, whether the power can be turned off, etc. This information is passed to the synthesis tool through the power intent description file.

[0064] Common power intent description files are UPF (Uniform Power Format) and CPF (Common Power Format), both of which can be used to describe all information related to the power supply of integrated circuits, including power information, power domain information, cross-voltage domain strategies (such as power-off isolation strategy, level conversion strategy), etc. Power intent description files usually contain the following four main parts:

[0065] (1) Power network definition: Define the power network of the designed physical functional modules, including power ports, power lines and their connection relationships, power groups, etc.

[0066] (2) Power domain definition: Define the power domain to which the physical functional module of the design belongs, including the relationship between the submodules in the physical functional module and the power lines;

[0067] (3) Power status table: defines the power status, power domain status and combination in the physical functional modules of the design.

[0068] (4) Cross-voltage domain strategy: When the physical function module is a multi-power domain module, define the strategy for inserting cross-voltage processing circuits when multiple power domains in the designed physical function module interact. This section is optional and only exists when the physical function module is a multi-power domain module and the power domains are different (different voltage values ​​and power states).

[0069] A typical integrated circuit design process includes: first, in the architecture definition stage, the layout planning of functions, power domains, and physical functional modules are defined according to the requirements of the integrated circuit (such as a chip). These definitions are output in the form of specification documents to guide the processes of subsequent stages.

[0070] Next, after the architecture definition is completed, the RTL of each IP is developed according to the function of the chip, and then SoC integration is carried out, that is, all IPs are integrated together and the physical functional modules are divided according to the layout plan.

[0071] Next, based on the chip's power domain specifications and low-power design requirements, power intent description files (such as UPF or CPF) are compiled for all physical functional modules and the top layer of the chip. The power intent description files are then used to perform logical synthesis and physical implementation of the physical functional modules in the RTL files of the integrated circuit that has been divided into physical functional modules. Functional verification is also performed on all physical functional modules, as well as low-power verification of multi-power domain physical functional modules. Low-power design verification verifies whether the low-power design in the physical functional modules meets specifications (such as multi-voltage design). This step requires performing this step on the RTL code, synthesis netlist, and physical implementation netlist.

[0072] Next, for problems found in functional / low-power verification, logic synthesis, and physical implementation, local modifications may be made to the chip architecture (such as power domain definition or physical functional module layout planning), IP RTL design, and power intent description files.

[0073] Repeat the above iterative process until the chip requirements are met and there are no design issues, and then send it to the factory for tape-out.

[0074] As can be seen from the above, the power intent description file is indispensable for the logic synthesis, physical implementation, functional verification, and low-power verification of integrated circuits. The power intent description file is required for logic synthesis, physical implementation, functional verification, and low-power verification. Furthermore, the entire integrated circuit development process may involve multiple iterations, each of which may involve manual modification of the power intent description file for one or more physical functional modules. After the power intent description file is modified, the logic synthesis, physical implementation, and functional / low-power verification of the physical functional modules must be repeated. These steps are the most time-consuming stages in the chip design process.

[0075] The power intent description file for a multi-power domain functional module is significantly more complex than that for a single power domain. Furthermore, logic synthesis, physical implementation, and verification of a multi-power domain functional module are also significantly more complex than for a single power domain functional module, especially when the physical functional module is large. For example, logic synthesis for a medium-sized multi-power domain functional module takes approximately 20 hours, physical re-implementation takes 2-3 weeks, and low-power verification takes about one week. Reducing the number of iterations and the time required for physical functional module synthesis, physical implementation, and verification, thereby shortening chip development time, is crucial for rapid product launch and market entry.

[0076] Currently, there are two common methods for inserting a cross-voltage domain processing circuit into a data signal line between different power domains.

[0077] In one approach, a power intent description file is written for the entire integrated circuit. Then, during the synthesis phase, all physical functional modules of the integrated circuit are synthesized together to ensure that the synthesis tool can accurately insert cross-voltage domain processing units on the top layer of the chip. The unit structure type of the inserted cross-voltage domain processing unit is determined by the information of the two interacting power domains. For example, Figure 1 As shown, physical function modules B and D in power domain W exchange data with physical function modules E and F in power domain X, respectively. Because power domain W can be shut down while power domain X cannot, the data signal line from physical function module B to physical function module E requires a level shifter isolator, while the data signal line from physical function module E to physical function module B only requires a level shifter. In this approach, low-power verification of the entire integrated circuit also needs to be performed at the chip level, which is very time-consuming.

[0078] This approach requires synthesis, physical implementation, and low-power verification of the entire chip top layer, making it extremely time-consuming for large-scale integrated circuits. Modifications to a physical functional module require re-synthesis of the entire chip, even if other physical functional modules do not need to be modified, resulting in unnecessary waste of time and manpower. Furthermore, this approach requires manual compilation of a power intent description file for the entire chip, which is labor-intensive and prone to errors. In summary, this approach is unsuitable for large-scale integrated circuit design and can only be used for smaller-scale chip designs.

[0079] In another approach, the cross-voltage domain processing unit may be placed inside one of the two interacting physical function modules.

[0080] For example, in this way, combined with Figure 1Physical function modules B and D in power domain W interact with physical function modules E and F in power domain X, respectively. Therefore, a cross-voltage domain processing unit can be placed in physical function modules E and F in power domain X. Similarly, physical function module K interacts with both physical function modules F and H. Therefore, a cross-voltage domain processing unit can be placed in physical function module K. The type of the inserted cross-voltage domain processing unit is determined by the information of the two interacting power domains.

[0081] The physical function modules inserted into the cross-voltage domain processing unit require two power supplies and are therefore called multi-power domain function modules, such as physical function module E, physical function module F, physical function module G, physical function module H, and physical function module K. Physical function modules A, physical function module B, physical function module C, and physical function module D are called single-power domain function modules.

[0082] This approach eliminates the need for top-level chip synthesis; instead, each physical functional module undergoes independent synthesis, physical implementation, and low-power verification. However, as chip size and the number of power domains increase, large-scale integrated circuits (ICs) contain numerous multi-power domain functional modules. Each iteration requires logic synthesis, physical implementation, and low-power verification of the modified physical functional modules, which is extremely time-consuming. For example, the synthesis of multi-power domain functional modules takes at least 30% longer than that of single-power domain functional modules. Furthermore, the physical implementation of multi-power domain functional modules also requires consideration and implementation of multiple power networks, significantly increasing complexity and time. The same applies to low-power verification of multi-power domain functional modules, requiring low-power design verification across the RTL design, synthesized netlist, and physical netlist. The time and complexity of low-power verification for multi-power domain functional modules is several times that of single-power domain functional modules, and this time difference increases with the complexity of the physical functional modules. Furthermore, this approach requires manual writing of power intent description files for the entire chip, which is labor-intensive and prone to errors.

[0083] In summary, multi-voltage design in large-scale integrated circuits currently faces two major challenges:

[0084] First, as chip size and complexity increase, data communication across multiple power domains within a single chip requires cross-voltage domain processing circuitry for conversion and protection. These circuits are typically inserted by logic synthesis tools during the synthesis phase based on power intent description files, necessitating the creation of numerous power intent description files. In the current design process, these files are typically manually compiled by experienced engineers, resulting in a high workload and prone to errors. Furthermore, modifications require re-synthesis of the chip's top layer, which is time-consuming and labor-intensive.

[0085] Second, during the chip development process, changes in requirements (architecture changes) or corrections to problems encountered in the design lead to modifications to the power intent description file. Due to the existence of a large number of large-scale multi-power domain functional modules, the re-logic synthesis, physical implementation, and low-power verification of these physical functional modules are very time-consuming and labor-intensive.

[0086] At least one embodiment of the present disclosure provides an integrated circuit design method, an integrated circuit design device, an electronic device, and a non-transitory computer-readable storage medium. The integrated circuit design method includes: obtaining a power configuration file and a register transfer level description file of the integrated circuit; in response to cross-voltage domain communication between a first physical function module and a second physical function module, inserting a cross-voltage bridge module between the first physical function module and the second physical function module according to the power configuration file and the register transfer level description file to obtain an updated register transfer level description file; wherein, in the updated register transfer level description file, the cross-voltage bridge module is a multi-power domain function module, the first physical function module and the second physical function module are both single-power domain function modules, and the cross-voltage bridge module is used to provide level conversion and / or power-off isolation protection for the cross-voltage domain communication between the first physical function module and the second physical function module.

[0087] The design method of the integrated circuit can automatically insert a cross-voltage bridge module into the register transfer level description file (RTL file) of the integrated circuit according to the power configuration file during the logic design phase. The cross-voltage bridge module is used to provide level conversion and / or power-off isolation protection for two physical functional modules that have cross-voltage domain communication, and obtain an updated register transfer level description file, so that in the updated register transfer level description file, the cross-voltage bridge module is a multi-power domain functional module and the physical functional module is a single power domain functional module. As a result, there is no need to synthesize the top layer of the chip, and only needs to independently perform synthesis, physical implementation and low-power verification on each physical functional module, reducing the time for synthesis, physical implementation and low-power verification; reducing the number and scale of multi-power domain functional modules, simplifying the original complex multi-power domain functional modules into a single power domain design, enabling efficient and accurate multi-voltage design, greatly simplifying the process of logic synthesis, physical implementation and low-power verification in multi-voltage design, reducing the number of iterations, reducing the time for chip development, shortening the iteration cycle in chip research and development, and facilitating the rapid launch of products into the market.

[0088] The embodiments of the present disclosure are described in detail below with reference to the accompanying drawings, but the present disclosure is not limited to these specific embodiments.

[0089] Figure 2 A schematic flowchart of a method for designing an integrated circuit provided in at least one embodiment of the present disclosure.

[0090] For example, the integrated circuit includes multiple physical function modules, and the multiple physical function modules include a first physical function module and a second physical function module. The definition of the physical function module can be referred to the above content and will not be repeated here.

[0091] For example, the first physical function module and the second physical function module may be two physical function modules among a plurality of physical function modules that execute the integrated circuit design method provided by at least one embodiment of the present disclosure.

[0092] For example, the first physical function module and the second physical function module can be any two physical function modules among multiple physical function modules. The multiple physical function modules can also include a third physical function module, a fourth physical function module, etc. The third physical function module, the fourth physical function module, etc. can all apply the integrated circuit design method provided by at least one embodiment of the present disclosure. The present disclosure does not impose any specific restrictions on this.

[0093] like Figure 2 As shown, the integrated circuit design method provided by at least one embodiment of the present disclosure includes steps S10 to S20.

[0094] In step S10 , a power configuration file and a register transfer level description file of the integrated circuit are obtained.

[0095] For example, in the front-end design process, a register transfer level description file (RTL file) of an integrated circuit can be obtained.

[0096] During the architecture definition phase, a power domain definition specification is specified, which defines all power-related information. Based on the power domain definition specification, a power configuration file is generated.

[0097] For example, a power profile may include power information for a first power supply that supplies power to a first power domain where a first physical functional module is located, and power information for a second power supply that supplies power to a second power domain where a second physical functional module is located. For example, a power profile may include power information for all power supplies in an integrated circuit.

[0098] For example, the power supply information may include the power supply name, voltage value configuration, power supply status, enable signal source, and enable signal valid level.

[0099] For example, the voltage value configuration may include a turn-on voltage value and a turn-off voltage value. For example, the turn-on voltage value is the voltage value when the power supply is powered. The turn-on voltage value may be a fixed voltage value or a dynamic voltage value. For example, the turn-off voltage value may represent the power state. For example, if the turn-off voltage value is empty, it may indicate that the power supply does not support power off and its power state is a non-power-off state. For example, if the turn-off voltage value is 0, it may indicate that the power supply supports power off and its power state is a power-off state. Of course, other methods may also be used to represent the power state, and this disclosure does not impose specific limitations on this.

[0100] For example, the enable signal source and the enable signal valid level provide information related to the enable signal of the cross-voltage domain processing unit operating when the power is off. For example, a power-off isolator and a level-shifting isolator both require an enable signal to control whether power-off isolation protection is enabled. For example, the power-off isolator and the level-shifting isolator have an enable port connected to the enable signal source. When the enable signal provided by the enable signal source is at the enable signal valid level, the power-off isolator and the level-shifting isolator begin to output a preset fixed-level signal to fix the signal level output from the power-off domain to a certain value.

[0101] For example, the enable signal active level may be a high level (H) or a low level (L).

[0102] For example, the enable signal source can come from a cross-voltage bridge module, such as creating an enable unit in the cross-voltage bridge module to generate an enable signal. The specific process can be referred to in the following content. For example, the enable signal source can come from an external source, such as another physical functional module or an external input of the chip. For example, the enable signal source can also be empty, indicating that the power supply does not require an enable signal, such as when the power state of the power supply is a non-power-down state and is always in a powered-on state.

[0103] For example, a power configuration file may also include power configuration information for a first physical function module and power configuration information for a second physical function module. For example, the power configuration information for the first physical function module includes the name of the first power supply and the power-off hold value that is expected to be output when the first power supply is in a power-off state; the power configuration information for the second physical function module includes the name of the second power supply and the power-off hold value that is expected to be output when the second power supply is in a power-off state. For example, a power configuration file may include power configuration information for all physical function modules in an integrated circuit.

[0104] The power-off retention value is when the power supply of the power domain where a physical function module is located is turned off, the output signal of the physical function module needs to be maintained at a fixed value by the cross-voltage domain processing unit, and this fixed value is the power-off retention value. The power-off retention value is determined by the value of the integrated circuit where the output signal is located when it is reset, or by the state when the power domain where the physical function module is located is idle (for example, the state before the power supply is turned off). For example, the power-off retention value can use the signal output by the driver port connected to the cross-voltage domain processing unit when the integrated circuit is reset as the power-off retention value. For example, the reset value is maintained by the register in the circuit and can be obtained from the register transfer level description file of the integrated circuit. For example, the power-off retention value can specify a port list, such as specifying that the power-off retention value of certain ports is high (for example, 1), and the power-off retention value of the remaining ports is low (for example, 0). For example, the power-off retention value can be empty, indicating that the power domain where the physical function module is located will not be powered off.

[0105] For example, the power profile also includes the type of the cross-voltage domain processing unit and the name of the cross-voltage domain processing standard unit under each type.

[0106] For example, there are three types of cross-voltage domain processing units, including level converters, power-off isolators, and level-shifting isolators. Level converters are configured to perform level conversion; power-off isolators are configured to provide power-off isolation protection; and level-shifting isolators are configured to perform both level conversion and power-off isolation protection.

[0107] The name of the cross-voltage domain processing standard cell is the name of the circuit cell in the standard cell library, and can be used directly when inserting the cross-voltage domain processing cell, for example, when inserting the cross-voltage domain processing cell when building a cross-voltage signal channel, or in the synthesis stage, it can be inserted by the synthesis tool through this name.

[0108] Both the power-off isolator and the level conversion isolator have two types of cross-voltage domain processing standard units. One cross-voltage domain processing standard unit outputs a signal with a power-off retention value of a low level (corresponding to 0), and the other cross-voltage domain processing standard unit outputs a signal with a power-off retention value of a high level (corresponding to 1). When inserting a cross-voltage domain processing standard unit, the corresponding voltage domain processing standard unit can be selected according to the power-off retention value.

[0109] Table 1 is a power profile provided by at least one embodiment of the present disclosure. The power profile can be Figure 1 The power domain definition specification of the chip in the example shown is obtained.

[0110] As shown in Table 1, the power configuration file mainly includes three pieces of information: a power information table that records the power information of all power supplies in the integrated circuit, a physical function module power table that records the power configuration information of all physical function modules in the integrated circuit, and a cross-voltage domain processing unit table that records the relevant information of the cross-voltage domain processing unit.

[0111] Table 1 Power profile

[0112]

[0113] As shown in Table 1, the power information table records Figure 1 Power supply information for all power supplies in the chip shown.

[0114] For example, for power domain W, the turn-on voltage of its power supply W (also known as VDD_W) is dynamically adjustable and can be 0.6V, 0.8V, and 0.9V. The turn-off voltage is 0, indicating that power supply W is in a power-down state. The enable signal source is "#AUTO#," indicating that the enable signal comes from the enable unit in the cross-voltage bridge module. Therefore, the enable unit must be created in the cross-voltage bridge module. The enable signal active level is "L," indicating that a low level is valid.

[0115] For example, for power domain Y, the turn-on voltage of power supply Y (VDD_Y) is fixed at 0.6V. The turn-off voltage is 0, indicating that power supply Y is in a power-down state. The enable signal source is "VDD_Y_ISOn," indicating that the enable signal comes from an external input signal, such as the chip top-level signal "VDD_Y_ISOn." The enable signal active level is "L," indicating that a low level is valid.

[0116] For example, for power domain X, the turn-on voltage of power supply X (also known as VDD_X) is a fixed value of 0.8V. The turn-off voltage value is blank, indicating that power supply X cannot be powered off. Since power supply X is always powered on, power-off isolation protection is not required. The enable signal source and enable signal valid level are both blank.

[0117] As shown in Table 1, the physical function module power supply table records the power supply configuration information of all physical function modules of the integrated circuit.

[0118] For example, the "DEFAULT" in the physical function module name indicates that the power configuration information of all unspecified physical function modules is classified under this category. Figure 1 The power configuration information of physical function modules E and F in the figure is specified by the "DEFAULT" line. That is, they are powered by power supply X, and the power-off retention value is empty.

[0119] For example, for physical function modules A, B, C, and D, whose power supply is power supply W, the power-loss retention value is "#AUTO#," indicating that the signal output by the driver port connected to the cross-voltage domain processing unit during the integrated circuit reset is used as the power-loss retention value. In practice, although physical function module A is powered down, it does not communicate with other power domains and, therefore, does not have a cross-voltage domain processing unit inserted. Therefore, the power-loss retention value "#AUTO#" for physical function module A has no practical meaning. Of course, other representations are possible.

[0120] For example, for physical function module K, whose power supply is Z, the power failure retention value specifies ports k_out0 and k_out1, indicating that the power failure retention value of ports k_out0 and k_out1 is 1, and the power failure retention value of all ports in physical function module K except ports k_out0 and k_out1 is 0. Of course, the power failure retention value of a port can also be specified as 0 in the physical function module power supply table, and the power failure retention value of other ports can be 1, and this disclosure does not impose any specific limitations on this.

[0121] As shown in Table 1, the cross-voltage domain processing unit table records the types of cross-voltage domain processing units and the names of cross-voltage domain processing standard units under each type.

[0122] For example, "LS" indicates the type is a level shifter, "ISO" indicates the type is a power-down isolator, and "ELS" indicates the type is a level-translating isolator.

[0123] For the level converter, the name of the corresponding cross-voltage domain processing standard cell in the standard cell library is "LVLDBUF"; for the power-off isolator, the name of the corresponding cross-voltage domain processing standard cell in the standard cell library that outputs a low-level signal (for example, the corresponding power-off retention value is 0) is "ISODBUF0", and the name of the corresponding cross-voltage domain processing standard cell in the standard cell library that outputs a high-level signal (for example, the corresponding power-off retention value is 1) is "ISODBUF1"; for the level conversion isolator, the name of the corresponding cross-voltage domain processing standard cell in the standard cell library that outputs a low-level signal (for example, the corresponding power-off retention value is 0) is "LVLDBUFE0", and the name of the corresponding cross-voltage domain processing standard cell in the standard cell library that outputs a high-level signal (for example, the corresponding power-off retention value is 1) is "LVLDBUFE1". Of course, the types of cross-voltage domain processing units and the names of the cross-voltage domain processing standard cells under each type shown in Table 1 are examples, and the present disclosure is not limited thereto.

[0124] In addition, it should be noted that Table 1 shows an exemplary representation of a power configuration file. The information in the power configuration file may also be provided in other forms and formats as needed, and this disclosure does not impose any specific limitation on this.

[0125] Afterwards, after obtaining the power configuration file and the register transfer level description file, a voltage crossing bridge (VCB) module can be inserted between the physical functional modules that need to communicate across power domains based on the power information provided in the power configuration file, thereby transferring the power domain interaction from the physical functional module to the VCB module and obtaining the updated register transfer level description file.

[0126] In step S20, in response to the existence of cross-voltage domain communication between the first physical function module and the second physical function module, a cross-voltage bridge module is inserted between the first physical function module and the second physical function module according to the power configuration file and the register transfer level description file to obtain an updated register transfer level description file.

[0127] For example, in the updated register transfer level description file, the cross-voltage bridge module is a multi-power domain functional module, the first physical function module and the second physical function module are both single power domain functional modules, and the cross-voltage bridge module is used to provide level conversion and / or power-off isolation protection for cross-voltage domain communication between the first physical function module and the second physical function module.

[0128] For example, after step S20, the updated register transfer level description file can still maintain the physical functional modules in the integrated circuit as single-power domain functional modules, that is, powered by only one power supply, while only the cross-voltage bridge module is a multi-power domain functional module, powered by multiple power supplies. Because the cross-voltage bridge module is much smaller than an ordinary physical functional module, the time for synthesis, physical implementation, and low-power verification brought about by multi-voltage design can be greatly reduced. Moreover, when the power domain changes (such as architecture changes), only the cross-voltage bridge module needs to be re-synthesized, reducing iteration time.

[0129] The following takes the first physical function module and the second physical function module as examples to illustrate the specific process of inserting the cross-voltage bridge block.

[0130] Of course, the design method provided by at least one embodiment of the present disclosure can also be applied to other physical function modules among the multiple physical function modules, and will not be described one by one.

[0131] For example, before step S20, the integrated circuit design method provided by at least one embodiment of the present disclosure further includes: determining whether there is cross-voltage domain communication between the first physical function module and the second physical function module according to the power configuration file.

[0132] For example, determining whether there is cross-voltage domain communication between the first physical function module and the second physical function module based on the power configuration file can include: determining the first power domain where the first physical function module is located and the second power domain where the second physical function module is located based on the power configuration information of the first physical function module and the power configuration information of the second physical function module; determining whether the first physical function module and the second physical module belong to the same power domain based on the power information of the first power supply and the power information of the second power supply.

[0133] As described in step S10, the power profile includes power information of a first power supply that supplies power to a first power domain where a first physical function module is located, and power information of a second power supply that supplies power to a second power domain where a second physical function module is located. In addition, the power profile also includes power configuration information of the first physical function module and the second physical function module, and the power configuration information records the name of the power supply that supplies power to the physical function modules.

[0134] Therefore, according to the power configuration file, the power domain, power supply and power information of the power supply where the physical function module is located can be determined. According to the power information, it can be determined whether the first physical function module and the second physical module belong to the same power domain.

[0135] For example, different power domains include two power domains with different voltage values ​​of power supplies and different power states. The power information records the voltage value configuration and power state of the power supply. Therefore, based on the power information of the first power supply and the power information of the second power supply, determining whether the first physical function module and the second physical module belong to the same power domain may include: in response to at least one of the voltage value configuration and power state of the first power supply and the second power supply being different, determining that the first physical function module and the second physical module do not belong to the same power domain; in response to the voltage value configuration and power state of the first power supply and the second power supply being the same, determining that the first physical function module and the second physical module belong to the same power domain.

[0136] For example, for Figure 1 In the shown integrated circuit, power domain W, power domain X, power domain Y, and power domain Z have different voltage values ​​and therefore belong to four different power domains.

[0137] It should be noted that whether there is cross-voltage domain communication between the first physical function module and the second physical function module may also be determined in other ways, such as recording the physical function modules that need to communicate across voltage domains, etc. This disclosure does not limit this.

[0138] For example, if it is determined that the first physical function module and the second physical function module have cross-voltage domain communication, a cross-voltage domain module needs to be inserted between the first physical function module and the second physical function module.

[0139] Figure 3 This is a schematic flowchart of step S20 in a method for designing an integrated circuit according to at least one embodiment of the present disclosure.

[0140] like Figure 3 As shown, step S20 may include steps S201-S203.

[0141] In step S201 , a cross-voltage bridge module is created according to a power configuration file.

[0142] In step S202 , according to the power configuration file, a cross-voltage signal channel is established in the cross-voltage bridge module for a port for cross-voltage domain signal transmission between the first physical function module and the second physical function module.

[0143] In step S203 , a cross-voltage bridge module is added to a corresponding position in the register transfer level description file to obtain an updated register transfer level description file.

[0144] For example, step S201 may include: creating a first buffer array and a second buffer array according to a power profile, wherein the first buffer array is located in a first power domain, the second buffer array is located in a second power domain, and the first buffer array and the second buffer array are used to provide a buffer unit; determining whether a cross-voltage domain processing unit between the first physical function module and the second physical function module requires an enable signal and the source of the enable signal according to the power information of the first power supply and the power information of the second power supply, wherein the cross-voltage domain processing unit is used to provide level conversion and / or power-off isolation protection for the port for cross-voltage domain communication between the first physical function module and the second physical function module; in response to the enable signal source indicating that the enable signal comes from the cross-voltage bridge module, creating an enable unit in the corresponding power domain to provide an enable signal.

[0145] For example, each cross-voltage bridge module includes at least two parts: an enabling unit and a buffer array.

[0146] For example, based on the voltage value configuration and power state between two power supplies performing cross-voltage domain communication provided in the power configuration file, the type of the cross-voltage domain processing unit that needs to be inserted between the two power supplies can be determined.

[0147] Table 2 shows the relationship between the voltage value configuration and power state of the two power supplies and the type of cross-voltage domain processing unit. For example, when the first power supply and the second power supply are both in a non-power-off state, if the voltage values ​​are different, only level conversion is required, so the cross-voltage domain processing unit is a level converter. When the first power supply is in a power-off state and the second power supply is in a non-power-off state, the signal output by the first power supply needs to be isolated and protected by power-off, and a power-off isolator needs to be used to stabilize the output signal at a fixed value. Therefore, the signal output from the first power supply to the second power supply needs power-off isolation protection, and the signal output from the second power supply to the first power supply does not need power-off isolation protection, and level conversion can be performed when needed.

[0148] Table 2 Converter circuits required for data signals between different power domains

[0149]

[0150] When the type of the cross-voltage domain processing unit is a power-off isolator and a level conversion isolator, it is determined that the cross-voltage domain processing unit between the first physical function module and the second physical function module requires an enable signal, and the power information of each power supply provides the source of the enable signal of each power supply.

[0151] In a cross-voltage bridge module, the number of enable units can be 0, 1, or 2. As shown in Table 2, the enable unit is optional. If neither the first power supply nor the second power supply experiences power failure, a power failure isolator and a level shifter isolator are not required, and the enable unit is not required to generate an enable signal. Furthermore, if the enable signal source indicates the use of an external input signal, the enable unit is also not required.

[0152] For example, the enable unit is used to control the power-off isolator and level-conversion isolator input from the other power domain to the power domain where the enable unit is located.

[0153] For example, assuming that both the first power supply and the second power supply can be powered off, and the enable signal source indicates that the enable signal comes from the cross-voltage bridge module, then in step S201, two enable units are generated in each of the first power domain and the second power domain. For example, the first enable unit is located in the first power domain, and the second enable unit is located in the second power domain. The first enable unit is used to control the power-off isolator or level conversion isolator from the second power supply to the first power supply, and the second enable unit is used to control the power-off isolator or level conversion isolator from the first power supply to the second power supply.

[0154] Regarding the source of the enable signal, please refer to the relevant description in step S10 and will not be repeated here.

[0155] For example, the cross-voltage bridge module includes two buffer arrays, one located in each of the two interacting power domains. The buffer arrays include buffer units, which can be buffers, registers, or FIFO (First Input First Output) queues.

[0156] For example, the buffer has no timing delay and mainly serves as a placeholder. If there is no buffer and no cross-voltage domain processing unit is inserted, the cross-voltage signal channel becomes a wire, which may be optimized by the tool during the synthesis stage. If there is a timing problem, the buffer unit can be a register to adjust the timing. If a cache function is required, for example, the first port of the first physical function module will continue to send data, but the second port receiving the data in the second physical function module cannot continue to receive data, a FIFO queue can be used as a buffer unit to achieve the purpose of caching data. Of course, according to actual needs, the buffer unit can also be adapted to be set to other structural types, and the present disclosure does not impose specific restrictions on this.

[0157] For example, multiple buffer units are instantiated in the buffer array, and the multiple buffer units can be set in pairs and located in two different power domains to connect the ports for cross-voltage domain communication between the first physical function module and the second physical function module to form a series of cross-voltage signal channels (Voltage Crossing Channel, abbreviated as VCC).

[0158] For example, step S202 may include: determining at least one pair of cross-voltage domain ports for cross-voltage domain signal transmission between the first physical function module and the second physical function module, wherein each pair of cross-voltage domain ports includes a first port located in the first physical function module and a second port located in the second physical function module, the first port is connected to the second port and performs data communication, and the first port and the second port are located at the same level in the integrated circuit; according to the power supply configuration file, in the cross-voltage bridge module, establishing a cross-voltage signal channel between each pair of cross-voltage domain ports for connecting the first port and the second port in each pair of cross-voltage domain ports.

[0159] For example, a cross-voltage domain port is related to the direction of signal transmission, that is, the first port and the second port transmit data unidirectionally. For example, the first port can be a driving port and the second port can be an input port, and the first port sends data to the second port, or the first port can be an input port and the second port can be a driving port, and the second port sends data to the first port.

[0160] For example, the integrated circuit may include multiple hierarchies, and the first port and the second port are located at the same hierarchy in the integrated circuit, for example, both are located at the top hierarchy.

[0161] For example, for each pair of ports communicating across voltage domains, a cross-voltage signal channel is established between the ports.

[0162] For example, in some embodiments, the cross-voltage signal channel includes a first buffer unit located in a first buffer array and a second buffer unit located in a second buffer array. For example, the first buffer unit is connected to a first port in a first physical function module, and the second buffer unit is connected to a second port in a second physical function module. The first buffer unit and the second buffer unit can be directly connected to each other for data exchange between the first port and the second port, thereby forming a cross-voltage signal channel between the first port and the second port.

[0163] In this embodiment, cross-voltage domain processing units are not inserted into cross-voltage signal channels. Instead, cross-voltage domain processing units are inserted by the synthesis tool during the synthesis process, subject to the constraints of the power intent profile. For example, during the synthesis process, in response to the absence of a cross-voltage domain processing unit on at least one cross-voltage signal channel in a cross-voltage bridge module, cross-voltage domain processing units are inserted into each of these cross-voltage signal channels according to the power intent profile. In this embodiment, synthesis of the cross-voltage bridge module is required, but because the logic of the cross-voltage bridge module is very simple and synthesis time is short, the time consumed in logic synthesis is reduced.

[0164] For example, in some other embodiments, the cross-voltage signal channel includes a first buffer unit located in a first buffer array, a second buffer unit located in a second buffer array, and a cross-voltage domain processing unit located between the first buffer unit and the second buffer unit, wherein the cross-voltage domain processing unit is configured to provide level conversion and / or power-off isolation protection for the first port and the second port. For example, one end of the first buffer unit is connected to the first port in the first physical function module, the other end of the first buffer unit is connected to one end of the cross-voltage domain processing unit, the other end of the cross-voltage domain processing unit is connected to one end of the second buffer unit, and the other end of the second buffer unit is connected to the second port in the second physical function module, thereby forming a cross-voltage signal channel between the first port and the second port.

[0165] In this embodiment, the cross-voltage domain processing unit can be automatically inserted when the cross-voltage bridge module is inserted, so that the cross-voltage bridge module does not need to be synthesized in the subsequent synthesis stage, further reducing the time spent on physical synthesis, reducing chip iteration time, and shortening the R&D cycle.

[0166] For example, according to the power supply configuration file, in the cross-voltage bridge module, a cross-voltage signal channel is established between each pair of cross-voltage domain ports for connecting the first port and the second port in each pair of cross-voltage domain ports, which may include: obtaining a first buffer unit located in the first buffer array and a second buffer unit located in the second buffer array; connecting the first buffer unit to the first port, and connecting the second buffer unit to the second port; determining the cross-voltage domain processing unit located between the first buffer unit and the second buffer unit according to the voltage value configuration, power supply status and power-off retention value of the first power supply and the second power supply; electrically connecting the cross-voltage domain processing unit to the first power supply and the second power supply; in response to the enable signal of the cross-voltage domain processing unit coming from the cross-voltage bridge module, connecting the enable port of the cross-voltage domain processing unit to the corresponding enable unit in the cross-voltage bridge module.

[0167] For example, determining the cross-voltage domain processing unit located between the first buffer unit and the second buffer unit based on the voltage value configuration, power supply status and power-off retention value of the first power supply and the second power supply may include: determining the type of the cross-voltage domain processing unit based on the voltage value configuration and power supply status of the first power supply and the second power supply; and selecting the corresponding cross-voltage domain processing standard unit under the type of the cross-voltage domain processing unit to be inserted between the first buffer unit and the second buffer unit based on the power-off retention value of the first power supply and the second power supply.

[0168] For example, as shown in Table 2, the type of the cross-voltage domain processing unit can be determined based on the voltage values ​​and power supply states of the two power supplies. For example, referring to step S10, the name of the cross-voltage domain processing standard unit for each type of cross-voltage domain processing unit is recorded in the power supply configuration file, and the corresponding cross-voltage domain processing standard unit is selected based on the power-off retention value and inserted between the first buffer unit and the second buffer unit.

[0169] For example, the enable port of the cross-voltage domain processing unit is connected to the enable signal source. For example, if the enable signal comes from the outside, a corresponding port is provided in the cross-voltage bridge module and connected to the enable port of the cross-voltage domain processing unit to provide the enable signal.

[0170] It should be noted that for step S202, the ports of the first physical functional module can also be traversed. When it is determined that there is cross-voltage domain communication between the current port (first port) and the second port, a cross-voltage signal channel is created between the first port and the second port. The present disclosure does not limit the specific implementation process.

[0171] Figure 4 This is a schematic structural diagram of a cross-voltage bridge module provided in at least one embodiment of the present disclosure.

[0172] For example, Figure 4The cross-voltage bridge module shown is used to connect a first physical function module and a second physical function module. The first physical function module is located in a first power domain and powered by a first power supply, and the second physical function module is located in a second power domain and powered by a second power supply.

[0173] For example, the power state of the first power supply is a non-power-off state, the power state of the second power supply is a power-off state, and the voltage value of the first power supply is different from the voltage value of the second power supply.

[0174] like Figure 4 As shown, the cross-voltage bridge module includes a first buffer array located in a first power domain, comprising first buffer units BUF1, BUF3, BUF5, and a first buffer power supply BUF7. The cross-voltage bridge module also includes a second buffer array located in a second power domain, comprising second buffer units BUF2, BUF4, BUF6, and a second buffer power supply BUF8.

[0175] like Figure 4 As shown, for example, the first physical function module includes a first port 1, a first port 2, a first port 3, and a first port 4, and the second physical function module includes a second port 1, a second port 2, a second port 3, and a second port 4. For example, the first port 1 and the second port 1 form a pair of cross-voltage domain ports. Similarly, the first port 2 and the second port 2 form a pair of cross-voltage domain ports, the first port 3 and the second port 3 form a pair of cross-voltage domain ports, and the first port 4 and the second port 4 form a pair of cross-voltage domain ports. Of course, the first physical function module and the second physical function module may also include more ports, which will not be repeated here.

[0176] like Figure 4 As shown, VCC1 is the cross-voltage signal channel between the first port 1 and the second port 1, VCC2 is the cross-voltage signal channel between the first port 2 and the second port 2, VCC3 is the cross-voltage signal channel between the first port 3 and the second port 3, and VCC4 is the cross-voltage signal channel between the first port 4 and the second port 4.

[0177] Because the first power domain is non-power-down and the second power domain is power-down, signal transmission from the second power domain to the first power domain requires power-down isolation protection, while signal transmission from the first power domain to the second power domain does not require power-down isolation protection. Because the voltage values ​​of the first power domain and the second power domain differ, level conversion is required both from the first power domain to the second power domain and from the second power domain to the first power domain.

[0178] Therefore, the type of the cross-voltage domain processing unit on the cross-voltage signal path from the first power supply to the second power supply is a level converter (eg Figure 4 LS in the cross-voltage signal path from the second power supply to the first power supply), the type of cross-voltage domain processing unit on the cross-voltage signal path is a level shifter isolator. The specific type of the level shifter isolator is determined by the signal output by the driver port during reset. For example, if the second port 1 outputs a low-level signal during reset, the level isolator on the cross-voltage signal path VCC1 selects the cross-voltage processing standard unit ELS0 (a level shifter isolator that outputs a low-level signal). If the second port 2 outputs a high-level signal during reset, the level isolator on the cross-voltage signal path VCC2 selects the cross-voltage processing standard unit ELS1 (a level shifter isolator that outputs a high-level signal).

[0179] For example, if the enable signal source of the second power supply is indicated as coming from the cross-voltage bridge module, an enable unit is set in the first power domain to provide an enable signal to the cross-voltage domain processing unit on the cross-voltage signal channel with the signal transmission direction from the second power supply to the first power supply. Figure 4 As shown, the enabling unit is used to provide an enabling signal for the cross-voltage domain processing unit ELS0 on the cross-voltage signal channel VCC1 and the cross-voltage domain processing unit ELS1 on the cross-voltage signal channel VCC2.

[0180] like Figure 4 As shown, a cross-voltage signal channel is composed of a first buffer unit located in a first buffer array, a cross-voltage domain processing unit, and a second buffer unit located in a second buffer array.

[0181] like Figure 4 As shown, on the cross-voltage signal channel VCC1, there are a first buffer unit BUF1, a second buffer unit BUF2 and a cross-voltage domain processing unit ELS0. The first buffer unit BUF1, the second buffer unit BUF2 and the cross-voltage domain processing unit ELS0 are connected in sequence and connected to the first port 1 and the second port 1, thereby forming a cross-voltage signal channel VCC1 between the first port 1 and the first port 2.

[0182] like Figure 4 As shown, the cross-voltage signal channel VCC3 includes a first buffer unit BUF5, a second buffer unit BUF6 and a cross-voltage domain processing unit LS. The first buffer unit BUF5, the second buffer unit BUF6 and the cross-voltage domain processing unit LS are connected in sequence and connected to the first port 3 and the second port 3, thereby forming the cross-voltage signal channel VCC3 between the first port 3 and the first port 3.

[0183] like Figure 4 As shown, the cross-voltage domain processing unit is connected to the buffer unit and the enabling unit (if necessary), as well as the first power supply and the second power supply. Therefore, the cross-voltage bridge module is a multi-power domain functional module.

[0184] The inter-voltage signal channel VCC2 and the inter-voltage signal channel VCC4 are similar to the inter-voltage signal channel VCC1 and the inter-voltage signal channel VCC3 , and are not described in detail here.

[0185] According to the embodiments described above, it can be seen that, taking the cross-voltage bridge module between the first physical function module and the second physical function module as an example, the cross-voltage bridge module includes a first buffer array located in the first power domain, a second buffer array located in the second power domain, and multiple cross-voltage signal channels. The multiple cross-voltage signal channels are connected one-to-one with multiple pairs of cross-voltage ports for cross-voltage signal transmission between the first physical function module and the second physical function module; and when the cross-voltage domain processing unit requires an enable signal and the enable signal needs to come from the cross-voltage bridge module, the cross-voltage bridge module may also include an enable unit for providing the enable signal.

[0186] The cross-voltage bridge module can be regarded as an independent physical functional module. The internal structures of different cross-voltage bridge modules are similar, but the specific type of the cross-voltage domain processing unit may vary depending on the connected power domain, which will not be repeated here.

[0187] Therefore, through this structural design of the cross-voltage bridge module, compared with the solution of placing the cross-voltage domain processing unit inside one of the two interacting physical functional modules as mentioned above, the physical functional module of the multi-power domain design can be simplified to a single power domain design, simplifying the time and complexity of the logic synthesis, physical implementation and low-power verification of the physical functional module.

[0188] For example, after obtaining the cross-voltage bridge module, it is inserted into the corresponding position in the register transfer level description file to obtain the updated register transfer level description file.

[0189] After obtaining the updated register transfer level description file, the updated register transfer level description file adds at least one cross-voltage bridge module relative to the register transfer level description file of the original integrated circuit and modifies the connection relationship of the ports related to the cross-voltage bridge module. These cross-voltage bridge modules are used to provide power-off isolation protection and / or level conversion for physical functional modules that communicate across voltage domains.

[0190] The integrated circuit design method provided by at least one embodiment of the present disclosure further includes: generating a power intent description file of the integrated circuit based on the power configuration file and the updated register transfer level description file.

[0191] For example, the updated register transfer level description file includes a first physical function module, a second physical function module and a cross-voltage bridge module. According to the power configuration file and the updated register transfer level description file, a power intention description file of the integrated circuit is generated, which may include: according to the power configuration file, generating a first power intention description sub-file corresponding to the first physical function module, wherein the first power intention description sub-file includes a power network definition of the first power domain, a power domain definition of the first power domain and a power state table describing the power state combination of the first power domain; according to the power configuration file, generating a second power intention description sub-file corresponding to the second physical function module, wherein the second ... The file includes the power network definition of the second power domain, the power domain definition of the second power domain, and a power status table describing the power status combination of the second power domain; based on the power configuration file, a third power intention description sub-file corresponding to the cross-voltage bridge module is generated, wherein the third power intention description sub-file includes the power network definition of the first power supply and the second power supply, the power domain definition of the first power domain and the second power domain, a power status table describing the power status combination of the first power domain and the second power domain, and the cross-voltage domain strategy of the cross-voltage bridge module; based on the first power intention description sub-file, the second power intention description sub-file and the third power intention description sub-file, a power intention description file of the integrated circuit is generated.

[0192] Because the first and second physical function modules operate in a single power domain, their power intent description subfiles are relatively simple, containing only three main components: power domain definition, power network connection, and power state table. The cross-voltage bridge module operates in multiple power domains, and its power intent description subfile is relatively complex. In addition to the power domain definition, power network connection, and power state table, it also contains information such as cross-voltage domain strategies (level conversion strategy, power-off isolation strategy), and a power state transition table.

[0193] For example, in the updated register transfer level description file, the naming of the cross-voltage bridge module indicates that the cross-voltage bridge module connects the first power domain and the second power domain.

[0194] For example, when creating a voltage bridge module, the name of each voltage bridge module includes the names of the two physical function modules across the power domains and related information about the power domains. For example, for a voltage bridge module connecting physical function module H and physical function module K, the two connected power domains are power domain Y and power domain Z, so it can be named VCB_H2K_Y2Z. Of course, this is only a feasible embodiment, and the present disclosure does not impose any specific restrictions on the naming format.

[0195] For example, generating a third power intent description sub-file corresponding to the cross-voltage bridge module based on the power configuration file may include: determining that the cross-voltage bridge module connects the first voltage domain and the second voltage domain based on the naming of the cross-voltage bridge module; generating the third power intent description sub-file based on the power information of the first power supply and the power information of the second power supply in the power configuration file.

[0196] For example, the power domain definition, power network connection and power status table can be determined based on the power information of the first power supply and the power information of the second power supply, and the cross-voltage strategy can be determined based on the internal structure of the cross-voltage bridge, the power information of the first power supply and the power information of the second power supply.

[0197] For the power network definition, power domain definition, and power state table cross-voltage strategy, please refer to the above content, as well as Figures 8A-8C The illustrated embodiments will not be described in detail here.

[0198] For example, the power intent description file may adopt the UPF file format or the CPF file format, or adopt other feasible formats, and the present disclosure does not impose specific limitations on this.

[0199] Of course, it should be noted that if the integrated circuit also includes a third physical function module, a fourth physical function module and other cross-voltage bridge modules, a similar method can also be applied in this embodiment to obtain the power intention description sub-files of each physical function module and the cross-voltage bridge module, and form the power intention description file of the integrated circuit, which will not be repeated here.

[0200] Therefore, in the integrated circuit design method provided in at least one embodiment of the present disclosure, the power intent description file of the integrated circuit can be automatically generated, and there is no need to manually write the power intent description file, which reduces manpower and lowers the probability of errors, greatly simplifies the logic synthesis, physical implementation and low-power verification processes in multi-voltage chip design, and shortens the iteration cycle in chip research and development.

[0201] Figure 5 An improved integrated circuit design process is provided in at least one embodiment of the present disclosure.

[0202] The integrated circuit design method provided by at least one embodiment of the present disclosure does not require manual writing of a power intent description file, but can automatically insert a cross-voltage bridge module and generate a power intent description file. When modifications or version iterations occur, there is no need to modify the power intent description file, but directly modify the power configuration file and re-execute the process as described above to complete the iterative update. The insertion of the cross-voltage bridge module is completed in the front-end design stage, so that the three longest processes in the integrated circuit design process, namely logic synthesis, physical implementation and low-power verification, are simplified; and the power intent description file of the integrated circuit can be automatically generated, which also greatly reduces manpower and time costs.

[0203] Specifically, for logic synthesis, since all physical functional modules are single-power domain physical functional modules, the required synthesis time is greatly reduced. For example, when inserting a cross-voltage bridge module, the cross-voltage domain processing unit can be automatically inserted, eliminating the need to synthesize the cross-voltage bridge module, further reducing the iteration time of integrated circuit design.

[0204] For physical implementation, similar to logic synthesis, since the physical functional modules are all single-power domain physical functional modules, only one power network needs to be built during physical implementation, which greatly reduces the complexity of physical implementation. In addition, although the cross-voltage bridge module is a multi-power domain functional module, the logic of the cross-voltage bridge module is very simple, so it does not increase the time of physical implementation too much.

[0205] For low-power verification, low-power verification (such as checking whether the cross-voltage domain processing unit is correctly inserted, etc.) only needs to be completed when the cross-voltage bridge module is complete. All physical functional modules in the single power domain do not need to verify their low-power design, which also greatly reduces the low-power verification time.

[0206] For example, when it is necessary to insert a cross-voltage bridge module into all the functional modules in the integrated circuit that have cross-voltage domain communication, this can be achieved through a two-layer traversal.

[0207] For example, first traverse all physical function modules, and for the current physical function module, then traverse all input ports (ports that receive external input signals) of the current physical function module, find input ports that have cross-voltage domain communication among all input ports, and establish cross-voltage signal channels for these input ports that have cross-voltage domain communication.

[0208] Afterwards, after obtaining the updated RTL file of the integrated circuit, all physical function modules and cross-voltage bridge modules in the updated RTL file are traversed according to the updated RTL file and the power configuration file, and the power intent description sub-files of each physical function module and cross-voltage bridge module are automatically generated, and finally combined into the power intent description file of the integrated circuit.

[0209] Figure 6 A flowchart of an execution method for designing an integrated circuit provided in at least one embodiment of the present disclosure.

[0210] The following combination Figure 6 , specifically describing the specific execution process of inserting the cross-voltage bridge module into all the functional modules that have cross-voltage domain communication in the physical functional modules of the integrated circuit.

[0211] like Figure 6 As shown, firstly, the power configuration file and the register transfer level description file (RTL) of the integrated circuit are obtained and read in. The specific process is as described in step S10 and will not be repeated here.

[0212] Afterwards, all physical function modules are traversed, and for the first physical function module T1 currently being processed, the power supply PS1 of the first physical function module T1 is obtained from the power supply configuration file. For example, the physical function module power supply configuration table in the power supply configuration file records the names of the power supplies of each physical function module, thereby obtaining the first power supply PS1 that supplies power to the first physical function module T1.

[0213] Afterwards, all input ports of the first physical function module T1 are traversed. For the currently processed input port P1, the driver port P2 corresponding to the input port P1 is determined according to the RTL file of the integrated circuit. The driver port P2 sends data to the input port P1 to provide driving function.

[0214] Afterwards, the power supply PS2 and the power-off retention value CV2 of the second physical function module T2 where the driving port P2 is located are determined from the power configuration file.

[0215] Specifically, when determining the power-off retention value, it can be obtained based on the power-off retention value in the power configuration information of the physical functional module. For example, as shown in Table 1, if the power-off retention value is "#AUTO#," it indicates that the signal RV output by the integrated circuit driving port P2 during reset is used as the power-off retention value CV2. For example, if the power-off retention value is a port list, then if the driving port P2 is in the port list, the power-off retention value CV2 is 1, otherwise it is 0.

[0216] Afterwards, it is determined whether the first physical function module T1 and the second physical function module T2 are the same physical function module, and whether the first power supply PS1 and the second power supply PS2 are the same.

[0217] If the first physical function module T1 and the second physical function module T2 are the same physical function module, and the first power supply PS1 and the second power supply PS2 are the same, then the above operation is continued to be performed on the next input port in the first physical function module T1.

[0218] Otherwise, determine whether a cross-voltage domain module has been created between the first physical function module T1 and the second physical function module T2. The cross-voltage domain module includes at least a buffer array located in the two power domains and the required enabling unit. If not, refer to step S201 to create a cross-voltage domain module. If it has been created, refer to step S202 to establish a cross-voltage signal channel for the input port P1 and the driver port P2 in the cross-voltage domain module between the first physical function module T1 and the second physical function module T2.

[0219] Afterwards, the next input port of the first physical function module is traversed continuously until all input ports of the first physical function module T1 are traversed, thereby completing the traversal of the first physical function module T1.

[0220] After that, continue to traverse other physical function modules and perform the above operations until all physical function modules are traversed to obtain the updated RTL file.

[0221] Afterwards, all physical function modules and cross-voltage bridge modules in the updated RTL file are traversed, and power intent description sub-files are generated for each physical function module and cross-voltage bridge module according to the power configuration file. Based on the power intent description sub-files corresponding to multiple physical function modules and the power intent description sub-files corresponding to the cross-voltage bridge modules, the power intent description file of the integrated circuit is generated.

[0222] In this embodiment, the original complex multi-power domain physical functional module is simplified into a single power domain design, which greatly simplifies the process of logic synthesis, physical implementation and low-power verification in multi-voltage chip design, reduces the time and complexity of logic synthesis, physical implementation and low-power verification of functional modules, and shortens the iteration cycle in chip research and development; it can also automatically generate power intent description files for all physical functional modules, greatly reducing manpower and time costs, and improving the efficiency and accuracy of multi-voltage design; the entire process is fully automated, shortening the iteration time caused by modifying requirements or correcting problems in chip design, and improving the efficiency of multi-voltage design in integrated circuits, especially the multi-voltage design efficiency in large-scale integrated circuit development.

[0223] When the power domain changes (for example, the architecture changes), modify the power configuration file and then re-execute the above process to obtain the updated register transfer level description file and the power intent description file of the integrated circuit, which greatly reduces manpower and time costs and shortens iteration time.

[0224] Figures 7A-7D This is a schematic diagram of the circuit structure of an integrated circuit provided in at least one embodiment of the present disclosure. For example, Figures 7A-7D For Figure 1The circuit structure diagram shown is a schematic diagram of an integrated circuit in which a design method provided by at least one embodiment of the present disclosure is inserted into a cross-voltage bridge module.

[0225] Below is Figure 1 Taking the chip circuit structure shown as an example, the implementation process of the integrated circuit design method provided by at least one embodiment of the present disclosure is explained in combination with specific embodiments.

[0226] For example, the physical functional module division and power domain division in the RTL file of the integrated circuit are as follows: Figure 1 The power profile is shown in Table 1.

[0227] Figures 7A-7D It is shown that a cross-voltage bridge module is inserted between physical function module E, physical function module F, physical function module K and physical function module H, but it should be noted that for other physical function modules such as physical function module B, a similar method can also be used to execute the design method of the integrated circuit provided by at least one embodiment of the present disclosure, which will not be repeated here.

[0228] And, in Figures 7A-7D In the figure, each black solid box represents a port. Of course, the physical function module can also include more ports, and the execution method is similar, which is not repeated here.

[0229] Traverse multiple physical function modules. For physical function module F, T1 = physical function module F. Obtain the power supply PS1 = X of physical function module F from the power configuration file (obtained from the "#DEFAULT#" line). Traverse all input ports of physical function module F.

[0230] like Figure 7A As shown, for Figure 7A Input port P1 = p0_F in the example. The corresponding driver port P2 is determined to be port p0_E of physical function module E. From the power configuration file, the power supply PS2 of physical function module E is obtained as X. The power-failure retention value is empty (obtained from the #DEFAULT# line). Because PS1 = PS2, input port P1 and driver port P2 belong to the same power domain, eliminating the need for a cross-voltage bridge module or cross-voltage signal channel.

[0231] Afterwards, the input port P1=p1_F is traversed, and the processing process is the same as that of the input port p0_F. There is no need to insert the cross-voltage bridge module and the cross-voltage signal channel, which will not be repeated here.

[0232] After that, traverse to the input port P1 = k_rdy', such as Figure 7AAs shown, the driver port P2 corresponding to the input port k_rdy' is determined to be the k_rdy port located in physical function module K. Therefore, T2 = physical function module K and the driver port P2 = k_rdy. From the power configuration file, the power supply PS2 of physical function module K is obtained as Z, and the power-off retention value is the port list [k_out0, k_out1]. Since the driver port k_rdy is not in the port list [k_out0, k_out1], the power-off retention value CV2 of the driver port P2 = k_rdy is 0. Because PS2! = PS1 and T2! = T1, a cross-voltage signal channel must be established between the input port k_rdy' and the driver port k_rdy.

[0233] Because a voltage bridge module has not yet been created between physical function modules K and F, a new voltage bridge module is created and named VCB_F2K_X2Z. This indicates that it is a voltage bridge module between physical function modules F and K, and it connects power domains X and Z. Creating a voltage bridge module includes the following steps:

[0234] 1) Create a first buffer array X and a second buffer array Z in the voltage bridge module VCB_F2K_X2Z, which are located in power domain X and power domain Z respectively.

[0235] 2) Obtain the information in the Enable Signal Source column for Power Supply X and Power Supply Z from the Power Information table in the power profile. Power Supply Z is #AUTO#, so an enable cell is generated and placed in Power Domain X. The enable cell generates an enable signal to control the power-down isolator or level-shifting isolator from Power Domain Z to Power Domain X. The Enable Signal Source column for Power Domain X is empty, indicating that no enable signal needs to be prepared for the cross-voltage domain processing unit from Power Domain X to Power Domain Z.

[0236] Afterwards, a cross-voltage signal channel VCC1 is inserted from the physical function module K to the physical function module F to connect the input port k_rdy′ and the driving port k_rdy.

[0237] like Figure 7AAs shown, the cross-voltage signal channel VCC1 includes a first buffer unit BUF1, a second buffer unit BUF2, and a cross-voltage domain processing unit ELS0. According to the power information table in the power configuration file, the shutdown voltage value of power supply Z is 0, so power supply Z is in a power-down state. Furthermore, the startup voltage values ​​of power supplies X and Z are 0.8V and 0.9V, respectively. Therefore, the cross-voltage domain processing unit in the cross-voltage signal channel from power supply Z to power supply X requires a level shifter isolator. As mentioned above, since the power-down retention value CV2 = 0, the ELS0 type cross-voltage processing standard unit is used. Based on the power-down retention value, the cross-voltage processing standard unit LVLDBUFE0 is selected from the cross-voltage domain processing unit table ELS in the power configuration file as the cross-voltage domain processing unit for the cross-voltage signal channel VCC1. The enable port of this cross-voltage domain processing unit ELS0 is connected to the enable unit, and the input and output power supplies are connected to power supply Z and power supply X, respectively.

[0238] Next, we traverse to input port P1 = k_out1' and determine that the driver port P2 corresponding to input port k_out1' is located at port k_out1 of physical function module K. Therefore, T2 = physical function module K and driver port P2 = k_out1. From the power supply configuration file, we obtain the power supply PS2 = Z for physical function module K, and the power-off retention value is the port list [k_out0, k_out1]. Since driver port k_out1 is in the port list [k_out0, k_out1], the power-off retention value CV2 of driver port P2 = k_out1 is 1. Because PS2! = PS1 and T2! = T1, a cross-voltage signal channel must be established between input port k_out1' and driver port k_out1.

[0239] Since a cross-voltage bridge module (VCB_F2K_X2Z) has been created between the physical function module F and the physical function module K, a cross-voltage signal channel VCC2 is established for the input port k_out1 ′ and the driving port k_out1 in the cross-voltage bridge module.

[0240] like Figure 7AAs shown, the cross-voltage signal channel VCC2 includes a first buffer unit BUF3, a second buffer unit BUF4, and a cross-voltage domain processing unit ELS1. Similar to the cross-voltage signal channel VCC1, the cross-voltage domain processing unit uses a level conversion isolator. Because the power-off retention value CV2 = 1, the cross-voltage processing standard unit of type ELS1 is used. Based on the power-off retention value, the cross-voltage processing standard unit LVLDBUFE1 is selected from the cross-voltage domain processing unit table type ELS in the power configuration file as the cross-voltage domain processing unit for the cross-voltage signal channel VCC2. The enable port of the cross-voltage domain processing unit ELS1 is connected to the enable unit, and the input and output power supplies are connected to power supply Z and power supply X, respectively.

[0241] For the cross-voltage signal channel inserted into the cross-voltage domain processing standard unit LVLDBUFE1, both the input port and the driver port are marked with "_H" so that when the cross-voltage domain processing unit is inserted during the synthesis stage, the power intent description file can be used to guide the synthesis tool to insert the ELS1 type circuit unit. Figure 7B-7D The same applies, so I won’t repeat it.

[0242] Afterwards, the above process is continued to be performed on other input ports of the physical function module F until the traversal of all input ports of the physical function module F is completed, and then the traversal of the physical function module K is continued.

[0243] For the physical function module K, T1 = physical function module K, obtain the power supply PS1 = Z of the physical function module K from the power configuration file, and traverse all input ports of the physical function module K.

[0244] like Figure 7B As shown, for input port P1 = p3_K, the corresponding driver port P2 is located at port p3_F of physical function module F. Therefore, T2 = physical function module F and driver port P2 = p3_F. From the power configuration file, the power supply PS2 of physical function module F is obtained as X. The power-failure retention value is empty, indicating that power-failure isolation protection is not required. Because PS2! = PS1 and T2! = T1, a cross-voltage signal channel must be established between input port p3_K and driver port p3_F.

[0245] Since a cross-voltage bridge module (VCB_F2K_X2Z) has been created between the physical function module F and the physical function module K, a cross-voltage signal channel VCC3 is established for the input port p3_K and the driving port p3_F in the cross-voltage bridge module.

[0246] like Figure 7BAs shown, the cross-voltage signal channel VCC3 includes a first buffer unit BUF5, a second buffer unit BUF7, and a cross-voltage domain processing unit LS. Since power supply X is in a non-power-down state, a level shifter can be selected as the cross-voltage domain processing unit. From the cross-voltage domain processing unit table type LS in the power supply configuration file, a cross-voltage processing standard unit LVLDBUF is selected as the cross-voltage domain processing unit for the cross-voltage signal channel VCC3. The input and output power supplies of the cross-voltage domain processing unit LS are connected to power supply X and power supply Z, respectively.

[0247] After that, it traverses to the input port P1=p2_K, and determines that the driving port P2 corresponding to the input port p2_K is located at the p2_F port of the physical function module F. Figure 7B As shown, a cross-voltage signal channel VCC4 is established for the input port p2_K and the driving port p2_F in the cross-voltage bridge module. The specific process is similar to that of the input port p3_K and will not be repeated here.

[0248] Afterwards, continue to refer to Figure 7C ,like Figure 7C As shown, traverse to the input port P1 = h_in0, determine that the driver port P2 corresponding to the input port h_in0 is located at the h_out0 port of the physical function module H, so T2 = physical function module H, and the driver port P2 = h_out0; from the power configuration file, get the power supply PS2 = Y of the physical function module H, and the power-off retention value is "#AUTO#", indicating that the signal RV output by the driver port h_out0 during reset is used as the power-off retention value CV2. Figure 7C As shown, for the driving port h_out0, RV = 1, that is, the power-off retention value CV2 = 1. Because PS2! = PS1 and T2! = T1, it is necessary to establish a cross-voltage signal channel between the input port h_in0 and the driving port h_out0.

[0249] Because a voltage bridge module has not yet been created between physical function modules K and H, a new voltage bridge module is created and named VCB_H2K_Y2Z. This indicates that it is a voltage bridge module between physical function modules H and K, and it connects power domains Y and Z. Creating a voltage bridge module includes the following steps:

[0250] 1) If Figure 7C As shown, a first buffer array Y and a second buffer array Z are created in the cross-voltage bridge module VCB_F2K_X2Z, which are located in the power domain Y and the power domain Z respectively.

[0251] 2) If Figure 7CAs shown, the information in the Enable Signal Source column for Power Supplies Y and Z is obtained from the Power Information table in the power profile. Power Supplies Z is #AUTO#, so an enable unit is generated and placed in Power Domain Y. The enable unit generates an enable signal to control the power-down isolator or level-shifting isolator from Power Domain Z to Power Domain Y. The Enable Signal Source column for Power Domain Y is VDD_Y_ISOn, indicating an external input from Power Domain Y, such as from physical function module K. The enable signal Y_ISOn controls the power-down isolator or level-shifting isolator from Power Domain Y to Power Domain Z.

[0252] Afterwards, a cross-voltage signal channel VCC5 is inserted from the physical function module H to the physical function module K to connect the input port h_in0 and the driving port h_out0.

[0253] like Figure 7C As shown, the cross-voltage signal channel VCC5 includes a first buffer unit BUF1, a second buffer unit BUF2, and a cross-voltage domain processing unit ELS1. According to the power information table in the power configuration file, the shutdown voltage values ​​of power supply Z and power supply Y are 0, so both power supplies Z and Y are in a power-down state. Furthermore, the startup voltage values ​​of power supply Y are 0.6V and 0.9V, respectively. Since the startup voltage values ​​of power supplies Y and Z are different, the cross-voltage domain processing units in the cross-voltage signal channel from power supply Z to power supply Y and from power supply Y to power supply Z require level shifting isolators. As previously mentioned, since the power-down retention value CV2 of the driver port h_out0 is 1, an ELS1-type cross-voltage processing standard unit is used. Based on the power-down retention value, the cross-voltage processing standard unit LVLDBUFE1 is selected from the cross-voltage domain processing unit table ELS in the power configuration file as the cross-voltage domain processing unit for the cross-voltage signal channel VCC5. The enable port of the cross-voltage domain processing unit ELS1 is connected to the external input port Y_ISOn, and the input and output power supplies are connected to the power supply Y and the power supply Z respectively.

[0254] Afterwards, if Figure 7C As shown, traverse to the input port P1 = h_in1, determine that the driver port P2 corresponding to the input port h_in1 is located at the h_out1 port of the physical function module H, so T2 = physical function module H, and the driver port P2 = h_out1; from the power configuration file, obtain the power supply PS2 = Y of the physical function module H, and the power-off retention value is "#AUTO#", indicating that the signal RV output by the driver port h_out0 during reset is used as the power-off retention value CV2. Figure 7CAs shown, for the driving port h_out1, RV = 0, that is, the power-off retention value CV2 = 0. Because PS2! = PS1 and T2! = T1, it is necessary to establish a cross-voltage signal channel between the input port h_in1 and the driving port h_out1.

[0255] Since a cross-voltage bridge module (VCB_H2K_Y2Z) has been created between the physical function module H and the physical function module K, a cross-voltage signal channel VCC6 is established for the input port h_in1 and the driving port h_out1 in the cross-voltage bridge module.

[0256] like Figure 7C As shown, cross-voltage signal channel VCC6 includes a first buffer unit BUF3, a second buffer unit BUF4, and a cross-voltage domain processing unit ELS0. Similar to cross-voltage signal channel VCC5, the cross-voltage domain processing unit uses a level conversion isolator. Because the power-off retention value CV2 = 0, the cross-voltage processing standard unit of type ELS0 is used. Based on the power-off retention value, the cross-voltage processing standard unit LVLDBUFE0 is selected from the cross-voltage domain processing unit table type ELS in the power configuration file as the cross-voltage domain processing unit for cross-voltage signal channel VCC6. The enable port of cross-voltage domain processing unit ELS0 is connected to the external input port Y_ISOn, and the input and output power supplies are connected to power supply Y and power supply Z, respectively.

[0257] Afterwards, the above process is continued to be executed on other input ports of the physical function module K until the traversal of all input ports of the physical function module K is completed, and then the traversal of the physical function module H is continued.

[0258] For the physical function module H, T1 = physical function module H, obtain the power supply PS1 = Y of the physical function module H from the power configuration file, and traverse all input ports of the physical function module H.

[0259] Continue to refer Figure 7D For input port P1 = k_in0, the corresponding driver port P2 is located at the k_out0 port of physical function module K. Therefore, T2 = physical function module K and driver port P2 = k_out0. From the power configuration file, the power supply PS2 = Z for physical function module K is obtained, and the power-off retention value is the port list [k_out0, k_out1]. Since driver port k_out0 is in the port list [k_out0, k_out1], the power-off retention value CV2 of driver port P2 = k_out0 is 1. Because PS2! = PS1 and T2! = T1, a cross-voltage signal channel needs to be established between input port k_in0 and driver port k_out0.

[0260] Since a cross-voltage bridge module (VCB_H2K_Y2Z) has been created between the physical function module H and the physical function module K, a cross-voltage signal channel VCC7 is established for the input port k_in0 and the driving port k_out0 in the cross-voltage bridge module.

[0261] like Figure 7D As shown, the cross-voltage signal channel VCC7 includes a first buffer unit BUF5, a second buffer unit BUF6, and a cross-voltage domain processing unit ELS1. Similar to the cross-voltage signal channel VCC6, the cross-voltage domain processing unit uses a level conversion isolator. Because the power-off retention value CV2 = 1, the cross-voltage processing standard unit of type ELS1 is used. Based on the power-off retention value, the cross-voltage processing standard unit LVLDBUFE1 is selected from the cross-voltage domain processing unit type ELS in the power configuration file as the cross-voltage domain processing unit for the cross-voltage signal channel VCC7. The enable port of the cross-voltage domain processing unit ELS1 is connected to the enable unit in power domain Y, and the input and output power supplies are connected to power supply Z and power supply Y, respectively.

[0262] Afterwards, continue to execute the above process for other input ports of the physical function module H until all input ports of the physical function module H are traversed, and continue to traverse the next physical function module until all physical function modules are traversed to obtain the updated register transfer level description file.

[0263] After obtaining the updated register transfer level description file, all physical function modules and cross-voltage bridge modules in the updated RTL file can be traversed, and combined with the power configuration file, the power intent description sub-files of each physical function module and cross-voltage bridge module can be automatically generated.

[0264] Figures 8A-8C A schematic diagram of a power intent description subfile provided for at least one embodiment of the present disclosure.

[0265] Figure 8A This is the power intent description subfile of the physical function module F.

[0266] like Figure 8A As shown, since the physical function module F is a single power domain (powered only by power supply X), the power intent description sub-file of the physical function module F only contains three main parts: power network definition, power domain definition and power status table.

[0267] like Figure 8AAs shown, the power network section describes the power supply information for physical function module F, which can be obtained based on the power configuration file in Table 2. For example, the power supply X is defined as a power line, power network, and power port, where VSS is the ground port. This is the same for all physical function modules. The supply set is automatically generated based on the power and ground signals.

[0268] like Figure 8A As shown in FIG, the power domain part describes the power domain of the physical function module F, which can also be directly obtained according to the power configuration file in Table 2. For example, because the physical function module F is a single power domain function module, its main power supply is connected to the only power supply group (SS_X).

[0269] like Figure 8A As shown in the figure, the power state table describes all power state combinations in physical function module F. This can be obtained based on the power information table in the power configuration file. "-supply" defines the power line state, where the start-up voltage of power supply X is defined as 0.8V; "-domain" defines the power domain state, which is determined by the power line state; and "-group" defines the power state table, which is determined by the power domain state.

[0270] Figure 8B This is the power intent description subfile of the physical function module K.

[0271] like Figure 8B As shown, since the physical function module K is a single power domain (powered only by power supply Z), the power intent description sub-file of the physical function module K only contains three main parts: power network definition, power domain definition and power status table.

[0272] The power intent description subfile of physical function module K is similar to that of physical function module F. The difference lies in the different power names and the fact that the power state of power supply Z is a power-down state. Therefore, when defining the power state table, there are two states: on (ON) and off (OFF). The repeated parts will not be repeated here.

[0273] The power intent description subfiles of other physical function modules are similar to those of physical function module K and physical function module F, and are not described in detail here.

[0274] Figure 8C This is the power intent description subfile for the voltage bridge module VCB_H2K_Y2Z. The power intent description subfiles for other voltage bridge modules are similar and will not be described here.

[0275] like Figure 8CAs shown, since the cross-voltage bridge module VCB_H2K_Y2Z is ​​a multi-power domain (powered by power supply Z and power supply Y), the power intent description sub-file of the cross-voltage bridge module VCB_H2K_Y2Z contains four main parts: power network definition, power domain definition, power status table and cross-voltage domain strategy.

[0276] like Figure 8C As shown, the power network section describes the power supply information for the voltage bridge module VCB_H2K_Y2Z. The "Y2Z" in its name indicates that it is powered by power supplies Y and Z. The power supply information for power supplies Y and Z can be obtained using the power configuration file in Table 2. For example, the power network section defines the creation of two power ports, power supplies Y and Z, and their corresponding power lines. A supply set is automatically generated based on the power and ground signals.

[0277] like Figure 8C As shown in the figure, the naming of the voltage bridge module shows that it connects two power supplies, namely power supply Y and power supply Z, thus creating two power domains, PD_Y and PD_Z. Figure 8C As shown, the power domain PD_Y includes the first buffer array Y and the enable unit, whose primary power supply is the power supply group SS_Y; the power domain PD_Z includes the remaining units, such as the second buffer array Z, whose primary power supply is the power supply group SS_Z.

[0278] like Figure 8C As shown in the figure, the power state table describes all power state combinations in the voltage bridge module VCB_H2K_Y2Z. According to the power information table in the power configuration file, the start-up voltages of power supplies Y and Z are 0.6V and 0.9V, respectively. Both can be powered down. Therefore, each power supply has two states (ON and OFF), and the two power domains have a total of four state combinations (ON-ON, ON-OFF, OFF-ON, and OFF).

[0279] like Figure 8C As shown, the cross-voltage domain strategy part describes the insertion strategy of the cross-voltage domain processing unit, and the relevant information comes from the power configuration file and the internal design of the cross-voltage bridge module VCB_H2K_Y2Z.

[0280] Referring to Table 1, since both power supply Y and power supply Z can be powered off and have different start-up voltage values, an ELS type (level conversion isolator) cross-voltage domain processing unit is required. The level conversion isolator includes two types: ELS0 and ELS1. Figure 8C As shown, you can use the set_isolation command to define four isolation strategies, which are used to describe the use of ELS0 ( Figure 8C ISO0_Y2Z) and ELS1( Figure 8C There are two strategies for inserting cross-voltage domain processing units, ISO1_Y2Z in the , and ELS0 ( Figure 8C ISO0_Z2Y) and ELS1 ( Figure 8C There are two strategies for inserting cross-voltage domain processing units (ISO1_Z2Y in ).

[0281] For example, Figure 8C Take ISO1_Y2Z in the example to illustrate the defined insertion strategy from power supply Y to power supply Z.

[0282] ISO1_Y2Z defines the use of ELS1-type cross-domain standard cell processing from power supply Y to power supply Z. Because the strategy defined by ISO1_Y2Z is ​​used to protect the transition from a powered-down power domain to an active power domain, it applies to scenarios where power supply Y is powered-down (OFF) and power supply Z is powered-on (ON).

[0283] like Figure 8C As shown, the main parameters of the set_isolation command are defined as follows:

[0284] "clamp_value" specifies the power-off hold value of 1, indicating that the ELS1 type cross-voltage processing standard cell is required. "isolation_sense" indicates the enable signal valid level. As shown in Table 1, it should be low. "iso_signal" specifies the enable signal source, which is Y_ISOn. This information can be obtained from the enable signal source column in Table 1. "isolation_supply" specifies the power supply source. Since the connection is from power supply Y to power supply Z, power supply Y is currently powered off while power supply Z is on, so "isolation_supply" is "SS_Z." "elements" specifies which signals require this strategy. According to the process of inserting the cross-voltage bridge module, all signals that require a power-off hold value of 1 end with a suffix. Therefore, "elements" are all output ports in the first buffer array Y_Bufs that end with "_H", that is, Y_Bufs / *_H.

[0285] "use_interface_cell" is used to tell the synthesis tool which cross-voltage domain processing units can be used to handle the four strategies for inserting cross-voltage domain processing units defined above. Because both power supply Y and power supply Z can be powered off, ELS type cross-voltage domain processing units are required. The value of the "lib_cell" option can be obtained by querying the cross-voltage domain processing unit table from the power configuration file. For example, "lib_cell" is {LVLDBUFE0 LVLDVUFE1}.

[0286] Therefore, in this embodiment, a cross-voltage bridge module can be automatically inserted between any two physical functional modules in an integrated circuit that need to communicate across voltage domains. The cross-voltage bridge module is used to provide level conversion and / or power-off isolation protection for the two physical functional modules. As a result, the physical functional modules all remain single-power domain functional modules, and only the cross-voltage bridge module is a multi-voltage domain functional module. The scale of the cross-voltage domain module is much smaller than that of the physical functional module, which can greatly reduce the time for synthesis, physical implementation, and low-power verification brought about by multi-voltage design. In addition, the cross-voltage domain processing unit has been automatically inserted into the cross-voltage bridge module, and there is no need to synthesize the cross-voltage bridge module. This can further reduce the synthesis time and shorten the iteration time caused by modifying requirements or correcting problems in chip design.

[0287] In addition, the solution can also automatically generate power intent description files for integrated circuits, greatly reducing manpower and time costs and improving the efficiency and accuracy of multi-voltage design.

[0288] At least one embodiment of the present disclosure further provides a design device for an integrated circuit. Figure 9 A schematic block diagram of a design apparatus for an integrated circuit provided in at least one embodiment of the present disclosure.

[0289] For example, the integrated circuit includes multiple physical function modules, which include a first physical function module and a second physical function module. For details about the physical function modules, the first physical function module and the second physical function module, please refer to the introduction of the integrated circuit design method, and the repeated parts will not be repeated here.

[0290] like Figure 9 As shown, the integrated circuit design device 100 may include: an acquisition unit 101 and an insertion unit 102 .

[0291] For example, these units may be implemented by hardware (e.g., circuit) modules, software modules, or any combination thereof, and the following embodiments are the same and will not be described in detail. For example, these units may be implemented by a central processing unit (CPU), a graphics processing unit (GPU), a tensor processing unit (TPU), a field programmable gate array (FPGA), or other forms of processing units with data processing capabilities and / or instruction execution capabilities, and corresponding computer instructions.

[0292] The acquiring unit 101 is configured to acquire a power configuration file and a register transfer level description file of the integrated circuit.

[0293] The insertion unit 102 is configured to, in response to the existence of cross-voltage domain communication between the first physical function module and the second physical function module, insert a cross-voltage bridge module between the first physical function module and the second physical function module according to the power profile and the register transfer level description file to obtain an updated register transfer level description file.

[0294] For example, in the updated register transfer level description file, the cross-voltage bridge module is a multi-power domain functional module, the first physical function module and the second physical function module are both single power domain functional modules, and the cross-voltage bridge module is used to provide level conversion and / or power-off isolation protection for cross-voltage domain communication between the first physical function module and the second physical function module.

[0295] For example, inserting a unit 102 includes creating a subunit, establishing a subunit, and adding a subunit.

[0296] For example, create a subunit configuration to create a cross-voltage bridge module based on a power profile.

[0297] The establishing subunit is configured to establish, in the cross-voltage bridge module, a cross-voltage signal channel for a port for cross-voltage domain signal transmission between the first physical function module and the second physical function module according to the power configuration file.

[0298] The adding subunit is configured to add a cross-voltage bridge module at a corresponding position in the register transfer level description file to obtain an updated register transfer level description file.

[0299] For example, when the creation sub-unit executes the creation of a cross-voltage bridge module according to the power profile, the creation sub-unit includes the following operations: creating a first buffer array and a second buffer array according to the power profile, wherein the first buffer array is located in the first power domain and the second buffer array is located in the second power domain, and the first buffer array and the second buffer array are used to provide buffer units; determining whether the cross-voltage domain processing unit between the first physical function module and the second physical function module requires an enable signal and the source of the enable signal according to the power information of the first power supply and the power information of the second power supply, wherein the cross-voltage domain processing unit is used to provide level conversion and / or power-off isolation protection for the port for cross-voltage domain communication between the first physical function module and the second physical function module; in response to the enable signal source indicating that the enable signal comes from the cross-voltage bridge module, creating an enable unit in the corresponding power domain to provide an enable signal.

[0300] For example, when the establishment sub-unit executes, according to the power configuration file, to establish a cross-voltage signal channel for the port for cross-voltage domain signal transmission between the first physical function module and the second physical function module in the cross-voltage bridge module, the establishment sub-unit includes the following operations: determining at least one pair of cross-voltage domain ports for cross-voltage domain signal transmission between the first physical function module and the second physical function module, wherein each pair of cross-voltage domain ports includes a first port located in the first physical function module and a second port located in the second physical function module, the first port is connected to the second port and performs data communication, and the first port and the second port are located at the same level in the integrated circuit; according to the power configuration file, in the cross-voltage bridge module, a cross-voltage signal channel is established between each pair of cross-voltage domain ports for connecting the first port and the second port in each pair of cross-voltage domain ports.

[0301] For example, the cross-voltage signal channel includes a first buffer unit located in a first buffer array, a second buffer unit located in a second buffer array, and a cross-voltage domain processing unit located between the first buffer unit and the second buffer unit. The cross-voltage domain processing unit is used to provide level conversion and / or power-off isolation protection for the first port and the second port.

[0302] For example, when establishing a sub-unit to execute, according to a power supply configuration file, in a cross-voltage bridge module, establishing a cross-voltage signal channel between each pair of cross-voltage domain ports for connecting the first port and the second port in each pair of cross-voltage domain ports, the following operations are included: obtaining a first buffer unit located in a first buffer array and a second buffer unit located in a second buffer array; connecting the first buffer unit to the first port, and connecting the second buffer unit to the second port; determining a cross-voltage domain processing unit located between the first buffer unit and the second buffer unit according to the voltage value configuration, power supply status and power-off retention value of the first power supply and the second power supply; electrically connecting the cross-voltage domain processing unit to the first power supply and the second power supply; and connecting the enable port of the cross-voltage domain processing unit to the corresponding enable unit in the cross-voltage bridge module in response to an enable signal of the cross-voltage domain processing unit coming from the cross-voltage bridge module.

[0303] For example, when establishing a sub-unit to execute the construction of a cross-voltage domain processing unit based on the voltage value configuration, power state and power-off retention value of the first power supply and the second power supply, the following operations are performed: determining the type of the cross-voltage domain processing unit based on the voltage value configuration and power state of the first power supply and the second power supply; and selecting the corresponding cross-voltage domain processing standard unit under the type of the cross-voltage domain processing unit and inserting it between the first buffer unit and the second buffer unit based on the power-off retention value of the first power supply and the second power supply.

[0304] For example, the buffer unit is in the form of a buffer, a register or a FIFO queue.

[0305] For example, the types of cross-voltage domain processing units include level converters, power-off isolators, and level conversion isolators. The level converters are configured to perform level conversion; the power-off isolators are configured to perform power-off isolation protection; and the level conversion isolators are configured to perform level conversion and power-off isolation protection.

[0306] For example, Figure 9 As shown, the integrated circuit design device 100 may further include: a determining unit 103 .

[0307] The determining unit 103 is configured to determine whether there is cross-voltage domain communication between the first physical function module and the second physical function module according to the power profile.

[0308] For example, when the determination unit 103 executes the determination of whether there is cross-voltage domain communication between the first physical function module and the second physical function module based on the power configuration information of the first physical function module and the power configuration information of the second physical function module, it includes performing the following operations: determining the first power domain where the first physical function module is located and the second power domain where the second physical function module is located based on the power configuration information of the first physical function module and the power configuration information of the second physical function module; determining whether the first physical function module and the second physical module belong to the same power domain based on the power information of the first power supply and the power information of the second power supply.

[0309] For example, when the determination unit 103 determines whether the first physical function module and the second physical module belong to the same power domain based on the power information of the first power supply and the power information of the second power supply, it includes performing the following operations: in response to at least one of the voltage value configuration and power supply status of the first power supply and the second power supply being different, determining that the first physical function module and the second physical module do not belong to the same power domain; in response to the voltage value configuration and power supply status of the first power supply and the second power supply being the same, determining that the first physical function module and the second physical module belong to the same power domain.

[0310] For example, Figure 9 As shown, the integrated circuit design device 100 may further include: a generating unit 104 .

[0311] For example, the generating unit 104 is configured to generate a power intent description file of the integrated circuit according to the power configuration file and the updated register transfer level description file.

[0312] For example, when the generation unit 104 generates a power intent description file of an integrated circuit based on the power configuration file and the updated register transfer level description file, the generation unit 104 performs the following operations: generating a first power intent description subfile corresponding to the first physical function module based on the power configuration file, wherein the first power intent description subfile includes a power network definition of the first power domain, a power domain definition of the first power domain, and a power state table describing the power state combination of the first power domain; generating a second power intent description subfile corresponding to the second physical function module based on the power configuration file, wherein the second power intent description subfile includes a power network definition of the second power domain, a power domain definition of the second power domain, and a power state table describing the power state combination of the second power domain; generating a third power intent description subfile corresponding to the cross-voltage bridge module based on the power configuration file, wherein the third power intent description subfile includes a power network definition of the first power supply and the second power supply, a power domain definition of the first power domain and the second power domain, a power state table describing the power state combination of the first power domain and the second power domain, and a cross-voltage domain strategy of the cross-voltage bridge module; and generating the power intent description file of the integrated circuit based on the first power intent description subfile, the second power intent description subfile, and the third power intent description subfile.

[0313] For example, when the generation unit 104 generates a third power intention description sub-file corresponding to the cross-voltage bridge module based on the power configuration file, it includes performing the following operations: determining that the cross-voltage bridge module connects the first voltage domain and the second voltage domain based on the naming of the cross-voltage bridge module; and generating the third power intention description sub-file based on the power information of the first power supply and the power information of the second power supply in the power configuration file.

[0314] For example, the integrated circuit design apparatus 100 may further include a synthesis unit ( Figure 9 not shown).

[0315] The synthesis unit is configured to synthesize the updated register transfer level description file according to the power intent description file and the updated register transfer level description file, wherein, during the synthesis process, in response to the fact that the cross-voltage domain processing unit is not inserted into at least one cross-voltage signal channel in the cross-voltage bridge module, the cross-voltage domain processing unit is respectively inserted into at least one cross-voltage signal channel according to the power intent description file.

[0316] In addition, the integrated circuit design device 100 can achieve technical effects similar to those of the aforementioned integrated circuit design method, which will not be described in detail here.

[0317] It should be noted that in the embodiments of the present disclosure, the integrated circuit design device 100 may include more or fewer circuits or units, and the connection relationship between the various circuits or units is not limited and can be determined according to actual needs. The specific configuration of each circuit or unit is not limited and can be composed of analog devices according to circuit principles, or can be composed of digital chips, or constructed in other applicable ways.

[0318] At least one embodiment of the present disclosure further provides an electronic device, Figure 10 A schematic diagram of an electronic device provided according to at least one embodiment of the present disclosure.

[0319] For example, Figure 10 As shown, the electronic device includes a processor 201, a communication interface 202, a memory 203, and a communication bus 204. The processor 201, the communication interface 202, and the memory 203 communicate with each other via the communication bus 204. The processor 201, the communication interface 202, the memory 203 and other components can also communicate with each other via a network connection. The present disclosure does not limit the type and function of the network. It should be noted that Figure 10 The components of the electronic device shown are merely exemplary and non-limiting. The electronic device may further include other components according to actual application requirements.

[0320] For example, the memory 203 is configured to non-transiently store computer-readable instructions. When the processor 201 executes the computer-readable instructions, it implements the integrated circuit design method described in any of the aforementioned embodiments. The specific implementation and related explanations of each step of the integrated circuit design method can be found in the aforementioned embodiments of the integrated circuit design method and are not further elaborated here.

[0321] For example, other implementations of the integrated circuit design method implemented by the processor 201 executing computer-readable instructions stored in the memory 203 are the same as the implementations mentioned in the aforementioned method embodiment part and will not be repeated here.

[0322] For example, the communication bus 204 may be a Peripheral Component Interconnect (PCI) bus or an Extended Industrial Standard Architecture (EISA) bus. The communication bus may be divided into an address bus, a data bus, a control bus, etc. For ease of illustration, only one thick line is used in the figure, but this does not mean that there is only one bus or only one type of bus.

[0323] For example, the communication interface 202 is used to implement communication between the electronic device and other devices.

[0324] For example, the processor 201 can control other components in the electronic device to perform the desired functions. The processor 201 can be a device with data processing capabilities and / or program execution capabilities, such as a central processing unit (CPU), a network processor (NP), a tensor processing unit (TPU), or a graphics processing unit (GPU); it can also be a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, or discrete hardware components. The central processing unit (CPU) can be an X86 or ARM architecture, etc.

[0325] For example, the memory 203 may include any combination of one or more computer program products, which may include various forms of computer-readable storage media, such as volatile memory and / or non-volatile memory. Volatile memory may include, for example, random access memory (RAM) and / or cache memory. Non-volatile memory may include, for example, read-only memory (ROM), a hard disk, an erasable programmable read-only memory (EPROM), a portable compact disk read-only memory (CD-ROM), a USB memory, a flash memory, etc. One or more computer-readable instructions may be stored on the computer-readable storage medium, and the processor 201 may execute the computer-readable instructions to implement various functions of the electronic device. Various applications and various data may also be stored in the storage medium.

[0326] For example, for a detailed description of the process of performing data processing by an electronic device, reference may be made to the relevant description in the embodiment of the design method of an integrated circuit, and repeated parts will be omitted.

[0327] Figure 11 A schematic diagram of a non-transitory computer-readable storage medium provided for at least one embodiment of the present disclosure. Figure 11 As shown, the storage medium 300 may be a non-transitory computer-readable storage medium, and one or more computer-readable instructions 301 may be non-transitory stored on the storage medium 300. For example, when the computer-readable instructions 301 are executed by a processor, one or more steps in the integrated circuit design method described above may be performed.

[0328] For example, the storage medium 300 may be applied to the above-mentioned electronic device. For example, the storage medium 300 may include a memory in the electronic device.

[0329] For example, the storage medium may include a memory card of a smart phone, a storage component of a tablet computer, a hard disk of a personal computer, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM), a portable compact disk read-only memory (CD-ROM), a flash memory, or any combination of the above storage media, or other applicable storage media.

[0330] For example, the description of the storage medium 300 may refer to the description of the memory in the embodiment of the electronic device, and the repeated parts will be omitted.

[0331] Those skilled in the art will appreciate that the contents disclosed in this disclosure may be subject to various modifications and improvements. For example, the various devices or components described above may be implemented through hardware, software, firmware, or a combination of some or all of the three.

[0332] In addition, although the present disclosure makes various references to certain units in the system according to embodiments of the present disclosure, any number of different units can be used and run on the client and / or server. The units are only illustrative, and different aspects of the system and method can use different units.

[0333] Flowcharts are used in this disclosure to illustrate the steps of the methods according to the embodiments of the present disclosure. It should be understood that the preceding or following steps do not necessarily need to be performed in exact order. Instead, the various steps may be performed in reverse order or simultaneously. Furthermore, other operations may be added to these processes.

[0334] Those skilled in the art will appreciate that all or part of the steps in the above method can be performed by instructing the relevant hardware through a computer program, and the program can be stored in a computer-readable storage medium, such as a read-only memory, a magnetic disk, or an optical disk. Alternatively, all or part of the steps in the above embodiment can also be implemented using one or more integrated circuits. Accordingly, each module / unit in the above embodiment can be implemented in the form of hardware or in the form of software functional modules. The present disclosure is not limited to any particular combination of hardware and software.

[0335] Unless otherwise defined, all terms used herein have the same meaning as commonly understood by those skilled in the art to which the present disclosure belongs. It should also be understood that terms such as those defined in common dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and should not be interpreted in an idealized or highly formal sense unless expressly defined as such herein.

[0336] The above is an illustration of the present disclosure and should not be considered as a limitation thereof. Although several exemplary embodiments of the present disclosure have been described, it will be readily understood by those skilled in the art that many modifications may be made to the exemplary embodiments without departing from the novel teachings and advantages of the present disclosure. Therefore, all such modifications are intended to be included within the scope of the present disclosure as defined by the claims. It should be understood that the above is an illustration of the present disclosure and should not be considered as limited to the specific embodiments disclosed, and modifications to the disclosed embodiments and other embodiments are intended to be included within the scope of the appended claims. The present disclosure is defined by the claims and their equivalents.

Claims

1. A method for designing integrated circuits, wherein: The integrated circuit includes a plurality of physical function modules, wherein the plurality of physical function modules include a first physical function module and a second physical function module. The design method includes: Obtaining a power configuration file and a register transfer level description file of the integrated circuit; In response to cross-voltage domain communication between the first physical function module and the second physical function module, inserting a cross-voltage bridge module between the first physical function module and the second physical function module according to the power configuration file and the register transfer level description file to obtain an updated register transfer level description file; Wherein, in the updated register transfer level description file, the cross-voltage bridge module is a multi-power domain functional module, the first physical function module and the second physical function module are both single-power domain functional modules, and the cross-voltage bridge module is used to provide level conversion and / or power-off isolation protection for cross-voltage domain communication between the first physical function module and the second physical function module; The power profile includes power information of a first power supply that supplies power to a first power domain where the first physical function module is located, and power information of a second power supply that supplies power to a second power domain where the second physical function module is located. The step of inserting a voltage bridge module between the first physical function module and the second physical function module according to the power configuration file and the register transfer level description file to obtain an updated register transfer level description file includes: Creating a cross-voltage bridge module according to the power profile; The step of creating a cross-voltage bridge module according to the power configuration file includes: A first buffer array and a second buffer array are created according to the power configuration file, wherein the first buffer array is located in the first power domain, the second buffer array is located in the second power domain, and the first buffer array and the second buffer array are used to provide a buffer unit.

2. The design method according to claim 1, wherein: The method further comprises inserting a voltage bridge module between the first physical function module and the second physical function module according to the power configuration file and the register transfer level description file to obtain an updated register transfer level description file, and further comprising: establishing, in the cross-voltage bridge module, a cross-voltage signal channel for a port for performing cross-voltage domain signal transmission between the first physical function module and the second physical function module according to the power configuration file; The cross-voltage bridge module is added to the corresponding position in the register transfer level description file to obtain the updated register transfer level description file.

3. The design method according to claim 2, wherein: The step of creating a cross-voltage bridge module according to the power configuration file further includes: Determining, based on the power supply information of the first power supply and the power supply information of the second power supply, whether a cross-voltage domain processing unit between the first physical function module and the second physical function module requires an enable signal and a source of the enable signal, wherein the cross-voltage domain processing unit is used to provide level conversion and / or power-off isolation protection for a port performing cross-voltage domain communication between the first physical function module and the second physical function module; In response to the enable signal source indicating that the enable signal comes from the cross-voltage bridge module, an enable unit is created in the corresponding power domain to provide the enable signal.

4. The design method according to claim 2, wherein: The step of establishing, in the cross-voltage bridge module, a cross-voltage signal channel for a port for performing cross-voltage domain signal transmission between the first physical function module and the second physical function module according to the power configuration file includes: Determining at least one pair of cross-voltage domain ports for cross-voltage domain signal transmission between the first physical function module and the second physical function module, wherein each pair of cross-voltage domain ports includes a first port located in the first physical function module and a second port located in the second physical function module, the first port is connected to the second port for data communication, and the first port and the second port are located at the same level in the integrated circuit; According to the power configuration file, in the cross-voltage bridge module, a cross-voltage signal channel is established between each pair of cross-voltage domain ports to connect the first port and the second port in each pair of cross-voltage domain ports.

5. The design method according to claim 4, wherein: The cross-voltage signal channel includes a first buffer unit located in a first buffer array, a second buffer unit located in a second buffer array, and a cross-voltage domain processing unit located between the first buffer unit and the second buffer unit. The cross-voltage domain processing unit is used to provide level conversion and / or power-off isolation protection for the first port and the second port.

6. The design method according to claim 5, wherein: The configuration file includes power supply configuration information of the first physical function module and power supply configuration information of the second physical function module. The power configuration information of the first physical function module includes the name of the first power supply for supplying power to the first physical function module and a power-off retention value expected to be output when the first power supply is in a power-off state. The power supply information of the first power supply includes the voltage value configuration and power state of the first power supply, and the power supply information of the second power supply includes the voltage value configuration and power state of the second power supply. The step of establishing, in the cross-voltage bridge module, a cross-voltage signal channel between each pair of cross-voltage domain ports according to the power configuration file to connect the first port and the second port in each pair of cross-voltage domain ports includes: Acquire the first buffer unit located in the first buffer array and the second buffer unit located in the second buffer array; connecting the first buffer unit to the first port, and connecting the second buffer unit to the second port; Determining the cross-voltage domain processing unit located between the first buffer unit and the second buffer unit according to the voltage value configuration, power state, and power-off retention value of the first power supply and the second power supply; electrically connecting the cross-voltage domain processing unit to the first power supply and the second power supply; In response to an enable signal of the cross-voltage domain processing unit coming from the cross-voltage bridge module, the enable port of the cross-voltage domain processing unit is connected to a corresponding enable unit in the cross-voltage bridge module.

7. The design method according to claim 6, wherein: The power configuration file further includes the type of the cross-voltage domain processing unit and the name of the cross-voltage domain processing standard unit under each type. The step of determining the cross-voltage domain processing unit located between the first buffer unit and the second buffer unit according to the voltage value configuration, power state, and power-off retention value of the first power supply and the second power supply includes: determining a type of the cross-voltage domain processing unit according to voltage value configurations and power supply states of the first power supply and the second power supply; and According to the power-off retention values ​​of the first power supply and the second power supply, a corresponding cross-voltage domain processing standard unit under the type of the cross-voltage domain processing unit is selected and inserted between the first buffer unit and the second buffer unit.

8. The design method according to claim 3, wherein: The buffer unit is in the form of a buffer, a register or a FIFO queue.

9. The design method according to claim 7, wherein: The types of the cross-voltage domain processing unit include level converters, power-down isolators and level conversion isolators. The level converter is configured to perform level conversion; The power-off isolator is configured to perform power-off isolation protection; The level conversion isolator is configured to perform level conversion and power-off isolation protection.

10. The design method according to claim 1, further comprising: Determine, according to the power profile, whether cross-voltage domain communication exists between the first physical function module and the second physical function module.

11. The design method according to claim 10, wherein: The power profile includes power information of a first power supply that supplies power to a first power domain where the first physical function module is located, and power information of a second power supply that supplies power to a second power domain where the second physical function module is located. The power configuration file also includes power configuration information of the first physical function module and power configuration information of the second physical function module. Determining, according to the power profile, whether cross-voltage domain communication occurs between the first physical function module and the second physical function module includes: Determine, according to the power configuration information of the first physical function module and the power configuration information of the second physical function module, a first power domain where the first physical function module is located and a second power domain where the second physical function module is located; It is determined whether the first physical function module and the second physical module belong to the same power domain according to the power information of the first power supply and the power information of the second power supply.

12. The design method according to claim 11, wherein: The power supply information of the first power supply includes the voltage value configuration and power supply status of the first power supply, and the power supply information of the second power supply includes the voltage value configuration and power supply status of the second power supply, wherein the power supply status includes a power-down state or a non-power-down state. The determining, based on the power information of the first power supply and the power information of the second power supply, whether the first physical functional module and the second physical module belong to the same power domain includes: In response to at least one of a voltage value configuration and a power state of the first power supply and the second power supply being different, determining that the first physical function module and the second physical module do not belong to the same power domain; In response to the first power supply and the second power supply having the same voltage value configuration and the same power state, it is determined that the first physical functional module and the second physical module belong to the same power domain.

13. The design method according to any one of claims 1 to 12, further comprising: A power intent description file of the integrated circuit is generated according to the power configuration file and the updated register transfer level description file.

14. The design method according to claim 13, wherein: The updated register transfer level description file includes the first physical function module, the second physical function module and the cross-voltage bridge module, The power profile includes power information of a first power supply that supplies power to a first power domain where the first physical function module is located, and power information of a second power supply that supplies power to a second power domain where the second physical function module is located. The power configuration file also includes power configuration information of the first physical function module and power configuration information of the second physical function module. Generating a power intent description file of the integrated circuit according to the power configuration file and the updated register transfer level description file includes: Generate a first power intent description subfile corresponding to the first physical function module according to the power configuration file, wherein the first power intent description subfile includes a power network definition of the first power domain, a power domain definition of the first power domain, and a power state table describing a power state combination of the first power domain; Generate a second power intent description subfile corresponding to the second physical function module according to the power configuration file, wherein the second power intent description subfile includes a power network definition of the second power domain, a power domain definition of the second power domain, and a power state table describing a power state combination of the second power domain; Generate a third power intent description subfile corresponding to the cross-voltage bridge module according to the power configuration file, wherein the third power intent description subfile includes power network definitions of the first power supply and the second power supply, power domain definitions of the first power domain and the second power domain, a power state table describing a power state combination of the first power domain and the second power domain, and a cross-voltage domain strategy of the cross-voltage bridge module; A power intent description file of the integrated circuit is generated according to the first power intent description subfile, the second power intent description subfile, and the third power intent description subfile.

15. The design method according to claim 14, wherein: In the updated register transfer level description file, the naming of the cross-voltage bridge module indicates that the cross-voltage bridge module connects the first power domain and the second power domain; Generating a third power intent description sub-file corresponding to the cross-voltage bridge module according to the power configuration file includes: Determining, according to the name of the cross-voltage bridge module, that the cross-voltage bridge module connects the first voltage domain and the second voltage domain; The third power intent description sub-file is generated according to the power information of the first power source and the power information of the second power source in the power configuration file.

16. The design method according to claim 13, further comprising: synthesizing the updated register transfer level description file according to the power intent description file and the updated register transfer level description file, In the synthesis process, in response to the fact that a cross-voltage domain processing unit is not inserted into at least one cross-voltage signal channel in the cross-voltage bridge module, a cross-voltage domain processing unit is respectively inserted into the at least one cross-voltage signal channel according to the power intent description file.

17. The design method according to any one of claims 1 to 12, wherein: The power profile includes power information of a first power supply that supplies power to a first power domain where the first physical function module is located, and power information of a second power supply that supplies power to a second power domain where the second physical function module is located. The power supply information includes the power supply name, voltage value configuration, power supply status, enable signal source and enable signal effective level, and the power supply status includes a power-down state or a non-power-down state; The power configuration file also includes power configuration information of the first physical function module and power configuration information of the second physical function module. The power supply configuration information of the first physical function module includes the name of the first power supply and a power-off retention value expected to be output when the first power supply is in a power-off state. The power supply configuration information of the second physical function module includes a name of the second power supply and a power-off retention value expected to be output when the second power supply is in a power-off state; The power configuration file further includes the type of the cross-voltage domain processing unit and the name of the cross-voltage domain processing standard unit under each type.

18. A design device for an integrated circuit, wherein: The integrated circuit includes a plurality of physical function modules, wherein the plurality of physical function modules include a first physical function module and a second physical function module. The design device comprises: an acquiring unit configured to acquire a power configuration file and a register transfer level description file of the integrated circuit; an inserting unit configured to, in response to cross-voltage domain communication between the first physical function module and the second physical function module, insert a cross-voltage bridge module between the first physical function module and the second physical function module according to the power configuration file and the register transfer level description file, so as to obtain an updated register transfer level description file; Wherein, in the updated register transfer level description file, the cross-voltage bridge module is a multi-power domain functional module, the first physical function module and the second physical function module are both single-power domain functional modules, and the cross-voltage bridge module is used to provide level conversion and / or power-off isolation protection for cross-voltage domain communication between the first physical function module and the second physical function module; Wherein, the inserting unit includes creating a subunit, The creation subunit is configured to create a cross-voltage bridge module according to the power configuration file; The power profile includes power information of a first power supply that supplies power to a first power domain where the first physical function module is located, and power information of a second power supply that supplies power to a second power domain where the second physical function module is located. The creation subunit creates a cross-voltage bridge module according to the power configuration file, including: A first buffer array and a second buffer array are created according to the power configuration file, wherein the first buffer array is located in the first power domain, the second buffer array is located in the second power domain, and the first buffer array and the second buffer array are used to provide a buffer unit.

19. The integrated circuit design apparatus according to claim 18, wherein: The insertion unit also includes a creation subunit and an addition subunit, The establishing subunit is configured to establish, in the cross-voltage bridge module, a cross-voltage signal channel for a port for cross-voltage domain signal transmission between the first physical function module and the second physical function module according to the power profile; The adding subunit is configured to add the cross-voltage bridge module to a corresponding position in the register transfer level description file to obtain the updated register transfer level description file.

20. The design device according to claim 19, wherein The creation subunit creates a cross-voltage bridge module according to the power profile, and further comprises performing the following operations: Determining, based on the power supply information of the first power supply and the power supply information of the second power supply, whether a cross-voltage domain processing unit between the first physical function module and the second physical function module requires an enable signal and a source of the enable signal, wherein the cross-voltage domain processing unit is used to provide level conversion and / or power-off isolation protection for a port performing cross-voltage domain communication between the first physical function module and the second physical function module; In response to the enable signal source indicating that the enable signal comes from the cross-voltage bridge module, an enable unit is created in the corresponding power domain to provide the enable signal.

21. The design device according to claim 19, wherein When the establishing subunit establishes, according to the power profile, a cross-voltage signal channel for a port for cross-voltage domain signal transmission between the first physical function module and the second physical function module in the cross-voltage bridge module, the establishment subunit includes performing the following operations: Determining at least one pair of cross-voltage domain ports for cross-voltage domain signal transmission between the first physical function module and the second physical function module, wherein each pair of cross-voltage domain ports includes a first port located in the first physical function module and a second port located in the second physical function module, the first port is connected to the second port for data communication, and the first port and the second port are located at the same level in the integrated circuit; According to the power configuration file, in the cross-voltage bridge module, a cross-voltage signal channel is established between each pair of cross-voltage domain ports to connect the first port and the second port in each pair of cross-voltage domain ports.

22. The design device according to claim 21, wherein The cross-voltage signal channel includes a first buffer unit located in a first buffer array, a second buffer unit located in a second buffer array, and a cross-voltage domain processing unit located between the first buffer unit and the second buffer unit. The cross-voltage domain processing unit is used to provide level conversion and / or power-off isolation protection for the first port and the second port.

23. The design device according to claim 22, wherein: The configuration file includes power supply configuration information of the first physical function module and power supply configuration information of the second physical function module. The power configuration information of the first physical function module includes the name of the first power supply for supplying power to the first physical function module and a power-off retention value expected to be output when the first power supply is in a power-off state. The power supply information of the first power supply includes the voltage value configuration and power state of the first power supply, and the power supply information of the second power supply includes the voltage value configuration and power state of the second power supply. When the establishing subunit establishes, in the cross-voltage bridge module, a cross-voltage signal channel between each pair of cross-voltage domain ports according to the power configuration file, for connecting the first port and the second port in each pair of cross-voltage domain ports, the establishing subunit performs the following operations: Acquire the first buffer unit located in the first buffer array and the second buffer unit located in the second buffer array; connecting the first buffer unit to the first port, and connecting the second buffer unit to the second port; Determining the cross-voltage domain processing unit located between the first buffer unit and the second buffer unit according to the voltage value configuration, power state, and power-off retention value of the first power supply and the second power supply; electrically connecting the cross-voltage domain processing unit to the first power supply and the second power supply; In response to an enable signal of the cross-voltage domain processing unit coming from the cross-voltage bridge module, the enable port of the cross-voltage domain processing unit is connected to a corresponding enable unit in the cross-voltage bridge module.

24. The design device according to claim 23, wherein The power configuration file further includes the type of the cross-voltage domain processing unit and the name of the cross-voltage domain processing standard unit under each type. When the establishing subunit determines the cross-voltage domain processing unit located between the first buffer unit and the second buffer unit according to the voltage value configuration, power state, and power-off retention value of the first power supply and the second power supply, the establishment subunit includes performing the following operations: determining a type of the cross-voltage domain processing unit according to a voltage value configuration and a power supply state of the first power supply and the second power supply; as well as According to the power-off retention values ​​of the first power supply and the second power supply, a corresponding cross-voltage domain processing standard unit under the type of the cross-voltage domain processing unit is selected and inserted between the first buffer unit and the second buffer unit.

25. The design device according to any one of claims 18 to 24, further comprising a generating unit, The generating unit is configured to generate a power intent description file of the integrated circuit according to the power configuration file and the updated register transfer level description file.

26. The design device according to any one of claims 18 to 24, further comprising a synthesis unit, The synthesis unit is configured to synthesize the updated register transfer level description file according to the power intent description file and the updated register transfer level description file, in, In the synthesis process, in response to the fact that a cross-voltage domain processing unit is not inserted into at least one cross-voltage signal channel in the cross-voltage bridge module, a cross-voltage domain processing unit is respectively inserted into the at least one cross-voltage signal channel according to the power intent description file.

27. An electronic device comprising: a memory that non-transitorily stores computer-executable instructions; a processor configured to execute the computer-executable instructions, The computer executable instructions, when executed by the processor, implement the integrated circuit design method according to any one of claims 1 to 17.

28. A non-transitory computer-readable storage medium, wherein: The non-transitory computer-readable storage medium stores computer-executable instructions, which, when executed by a processor, implement the method for designing an integrated circuit according to any one of claims 1 to 17.

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