Ultra-precision polishing device and polishing method for hemispherical resonator

Abstract

The present invention relates to an ultra-precision polishing device and polishing method for a hemispherical resonator. The device includes an outer polishing module, an inner polishing module, a liquid inlet block, two locking blocks, and a base. The outer polishing module is used to polish the outer spherical surface and outer fillet of a workpiece. The inner polishing module is used to polish the inner spherical surface, inner cylindrical surface, inner fillet, inner cylindrical end face, and lip end face of the workpiece. The liquid inlet block, inner polishing module, and outer polishing module are sequentially placed in parallel contact with each other and aligned at both ends at the upper end of the base. The two locking blocks are symmetrically mounted on the outside of the liquid inlet block, inner polishing module, and outer polishing module from both sides and fixedly connected by locking screws connecting the locking blocks and the base. The outer convex polishing surface of the inner polishing module extends into the inner concave polishing surface of the outer polishing module. The liquid inlet buffer zone on the liquid inlet block is located on a side close to the inner polishing module and is aligned and connected to the liquid inlet through-hole on the inner polishing module. The present invention achieves efficient and high-quality polishing of the workpiece.

Description

Technical Field

[0001] The invention belongs to the technical field of ultra-precision polishing of a quartz hemispherical resonator, and in particular relates to an ultra-precision polishing device and a polishing method for a hemispherical resonator. Background Art

[0002] The hemispherical resonant gyroscope is a Coriolis effect gyroscope without rotating parts. Compared with traditional mechanical gyroscopes and optical gyroscopes, it has the advantages of strong impact resistance and radiation resistance, fast startup, small size, light weight, low energy consumption, high working reliability and long working life.

[0003] The operating principle of a hemispherical resonator (HRG) is that when a hemispherical resonator continuously vibrates at a certain frequency, a four-amplitude pattern forms on the edge of the spherical shell. Therefore, the HRG's core and sensitive component, the HRG's machining quality, directly impacts its performance. The HRG is made of high-purity fused quartz glass, a hard, brittle material with high hardness and difficulty in machining. To further improve the machining accuracy of the HRG and meet the performance requirements of a high-precision HRG, a polishing process is required. Based on the actual process requirements, a dedicated polishing device and method must be designed. Summary of the Invention

[0004] The purpose of the present invention is to overcome the deficiencies of the prior art and to provide an ultra-precision polishing device and a polishing method for a hemispherical resonator.

[0005] One of the above-mentioned purposes of the present invention is achieved through the following technical solution:

[0006] A hemispherical resonator ultra-precision polishing device, characterized by comprising an outer polishing module, an inner polishing module, a liquid inlet block, two locking blocks and a base;

[0007] The outer polishing module is a module structure with an inner concave polishing surface provided on a rectangular block. The inner concave polishing surface is composed of a hemispherical concave surface and a rounded surface connected to the small end of the hemispherical concave surface. The hemispherical concave surface and the rounded surface respectively constitute the outer spherical surface polishing working surface and the outer rounded corner polishing action surface. A plurality of liquid guide grooves are evenly distributed on the inner concave polishing surface.

[0008] The inner polishing module is a modular structure with an outer convex polishing surface provided on one side of a rectangular block. The outer convex polishing surface is composed of a hemispherical convex surface, a semi-cylindrical surface provided at the center of the hemispherical convex surface, and a rounded surface connecting the hemispherical convex surface and the semi-cylindrical surface. The hemispherical convex surface, the semi-cylindrical surface, the rounded surface of the inner polishing module, the bottom surface of the semi-cylindrical surface, and the side surface of one side of the rectangular block of the inner polishing module respectively constitute the inner spherical surface polishing working surface, the inner cylindrical surface polishing surface, the inner rounded corner polishing surface, the inner column end surface polishing working surface, and the lip end surface polishing surface. A plurality of liquid guide grooves are evenly distributed on the outer convex polishing surface, and a liquid inlet through hole is provided on the rectangular block of the inner polishing module at a position corresponding to each liquid guide groove.

[0009] The liquid inlet block is in the shape of a rectangular block, and a countersunk hole is provided on each of the liquid inlet block near both ends in the up and down directions. A groove is provided on one side of the liquid inlet block to form a liquid inlet buffer zone, and a liquid inlet hole connected to the groove is provided on the other side of the liquid inlet block.

[0010] The two locking blocks are U-shaped blocks of the same shape, and locking threaded holes are provided on the two parallel sides of the locking blocks;

[0011] The base is a square column base, and two threaded holes are provided at the upper end of the base near one side;

[0012] The liquid inlet block, the inner polishing module and the outer polishing module are placed on the upper end of the base in a manner that they are in parallel contact with each other and aligned at both ends; the two locking blocks are symmetrically sleeved on the outside of the liquid inlet block, the inner polishing module and the outer polishing module from both sides, and the liquid inlet block, the inner polishing module and the outer polishing module are fixedly connected by locking screws installed in the locking threaded holes on the two locking blocks; the liquid inlet block is fixedly connected to the base by screws installed in the countersunk holes and the corresponding threaded holes on the base; the outer convex polishing surface of the inner polishing module extends into the inner concave polishing surface of the outer polishing module; the liquid inlet buffer zone on the liquid inlet block is located on the side close to the inner polishing module and is aligned and connected to the liquid inlet through hole on the inner polishing module.

[0013] Furthermore: the materials of the outer polishing module and the inner polishing module are both polyurethane.

[0014] The second object of the present invention is achieved by the following technical solution:

[0015] A hemispherical resonator ultra-precision polishing method, characterized by using the above-mentioned hemispherical resonator ultra-precision polishing device and using an external polishing liquid circulation device in conjunction with it, wherein the polishing liquid circulation device is provided with three outlets;

[0016] The polishing method comprises the following steps:

[0017] Step 1: The hemispherical resonator is horizontally mounted on the main shaft of the polishing equipment;

[0018] Step 2: Place the base on the polishing equipment;

[0019] Step 3: Place the outer polishing module on the upper end of the base and attach it to the outside of the hemispherical resonator, so that its outer fillet polishing surface fits the outer fillet of the workpiece, and its outer spherical surface polishing working surface fits the outer spherical surface of the workpiece;

[0020] Step 4: Place the inner polishing module on the upper end of the base and attach it to the inside of the hemispherical resonator, so that the inner column end face polishing working surface is in contact with the inner column end face of the workpiece, the lip end face active surface is in contact with the lip end face of the workpiece, the inner cylinder polishing active surface is in contact with the inner cylinder surface of the workpiece, the inner fillet polishing active surface is in contact with the inner fillet of the workpiece, and the inner spherical surface polishing working surface is in contact with the inner spherical surface of the workpiece;

[0021] Step 5: Place the liquid inlet block on the base and, while ensuring that the positions of the inner and outer polishing modules remain unchanged, adjust the position of the liquid inlet block so that its liquid inlet buffer area faces the liquid inlet through hole on the inner polishing module and its edge is aligned with the inner polishing module;

[0022] Step 6: Use two locking blocks to surround the outer polishing module, inner polishing module, and liquid inlet block from both sides, and install locking screws on both sides of the two locking blocks to fix the relative positions of the three to form a tight connection;

[0023] Step 7. Screw the two screws through the two countersunk holes on the inlet block into the two threaded holes on the base to connect and secure the inlet block to the base.

[0024] Step 8. After completing the above steps, fix the base on the workbench of the polishing equipment;

[0025] Step 8: Add the prepared polishing liquid to the polishing liquid circulation device, pour the polishing liquid onto the outer spherical surface and the inner spherical surface of the workpiece through the two outlets, and input the polishing liquid into the liquid inlet port of the liquid inlet block through the other outlet;

[0026] Step 9: After the polishing liquid circulation is stable, start the polishing equipment to drive the hemispherical resonator to rotate and perform the polishing operation until the polishing is completed; the rotation speed of the hemispherical resonator is preferably 60 rpm.

[0027] Furthermore, the polishing liquid used is prepared by mixing cerium oxide polishing powder, sodium hydroxide powder and pure water in a ratio of 1:0.5:20.

[0028] Further: in step 9, the rotation speed of the hemispherical resonator is 60 rpm.

[0029] The present invention has the following advantages and positive effects:

[0030] 1. The present invention realizes the one-time polishing and forming of all surfaces of the hemispherical resonator after one-time clamping through the combination of the external polishing module and the internal polishing module, which greatly improves the polishing efficiency and polishing accuracy. The external polishing module and the internal polishing module are preferably made of polyurethane material, which has certain elasticity and strength and can be designed into a shape that is conducive to polishing. At the same time, it has a porous structure, which is conducive to the adhesion of the polishing liquid and can effectively promote the polishing work.

[0031] 2. The present invention provides a liquid inlet hole and a liquid inlet buffer zone on the liquid inlet block, and provides multiple liquid guide grooves on the outer polishing module and the inner polishing module to form a liquid guide connection. In this way, the polishing liquid can be transported to each polishing part. In addition, the polishing liquid is directly poured on the outer spherical surface and the inner spherical surface of the workpiece, which can better ensure the polishing quality of the polished resonator surface.

[0032] 3. The polishing device of the present invention has few components. The three key components, namely the outer polishing module, the inner polishing module and the liquid inlet block, are clamped and connected by two locking blocks, which has the advantages of easy use, quick disassembly and convenient turnover. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 It is a schematic structural diagram of the hemispherical resonator workpiece to be polished according to the present invention;

[0034] Figure 2 It is a schematic diagram of the overall structure of the polishing device of the present invention;

[0035] Figure 3a is a perspective view of the external polishing module of the present invention;

[0036] Figure 3b is a front view of the external polishing module of the present invention;

[0037] Figure 3c is a side sectional view of the external polishing module of the present invention;

[0038] Figure 4a is a three-dimensional diagram of the polishing module of the present invention;

[0039] Figure 4b is a front view of the polishing module of the present invention;

[0040] Figure 4c is a side cross-sectional view of the inner polishing module of the present invention;

[0041] Figure 5a It is a three-dimensional diagram of the liquid inlet block of the present invention;

[0042] Figure 5b It is a front view of the liquid inlet block of the present invention;

[0043] Figure 5c is a side sectional view of the liquid inlet block of the present invention;

[0044] Figure 6 It is a structural schematic diagram of the base of the present invention;

[0045] Figure 7 It is a structural schematic diagram of the locking block of the present invention. DETAILED DESCRIPTION

[0046] The structure of the present invention will be further described below with reference to the accompanying drawings and through examples. It should be noted that the present examples are descriptive rather than restrictive.

[0047] A hemispherical resonator ultra-precision polishing device, see Figure 1-7 The invention point is: it includes an external polishing module 2, an internal polishing module 3, a liquid inlet block 4, two locking blocks 6 and a base 5.

[0048] The external polishing module is used to polish the outer spherical surface and outer fillet of the hemispherical resonator workpiece. The external polishing module is a modular structure with an inner concave polishing surface 2.1 provided on a rectangular block. The inner concave polishing surface is composed of a hemispherical concave surface 2.1.3 and a fillet surface 2.1.2 connected to the small end of the hemispherical concave surface. The hemispherical surface matches the outer spherical surface 1.3 of the hemispherical resonator to form an outer spherical polishing working surface. The fillet surface matches the outer fillet 1.2 of the hemispherical resonator workpiece to form an outer fillet polishing active surface. A plurality of liquid guide grooves 2.1.1 are evenly distributed on the inner concave polishing surface.

[0049] The internal polishing module is used to polish the inner spherical surface, inner cylindrical surface, inner fillet, inner cylindrical end face, and lip end face of the hemispherical resonator workpiece. The internal polishing module is a modular structure with an external convex polishing surface 3.1 provided on one side of a rectangular block 3.2. The external convex polishing surface is composed of a hemispherical convex surface 3.1.6, a semi-cylindrical surface 3.1.4 located at the center of the hemispherical convex surface, and a fillet surface 3.1.5 connecting the hemispherical convex surface and the semi-cylindrical surface. The hemispherical convex surface matches the inner spherical surface 1.5 of the hemispherical resonant workpiece to form an inner spherical surface polishing working surface; the semi-cylindrical surface matches the inner cylindrical surface 1.7 of the hemispherical resonator to form an inner cylindrical polishing action surface; the rounded corner surface matches the inner rounded corner 1.8 of the hemispherical resonator to form an inner rounded corner polishing action surface; the bottom surface 3.1.1 of the semi-cylindrical surface matches the end surface 1.6 of the inner cylinder of the hemispherical resonator to form an inner cylinder end surface polishing working surface. In addition, a lip end surface polishing action surface is formed on one side of the rectangular block of the inner polishing module; a plurality of liquid guide grooves 3.1.3 are evenly distributed on the outer convex polishing surface, and a liquid inlet hole 3.1.2 is connected to the position corresponding to each liquid guide groove on the rectangular block of the inner polishing module.

[0050] The inlet block is used to supply polishing liquid. It has a rectangular shape. Countersunk holes 4.1 are provided on the inlet block, located near each end in the vertical direction, for receiving screws to securely connect it to the base. A groove 4.3 is provided on one side of the inlet block. This groove is not limited to the rectangular groove shown in the accompanying drawings. The groove serves as a buffer for liquid inflow. On the other side of the inlet block, an inlet hole 4.2 is provided, connected to the groove, for supplying polishing liquid.

[0051] The outer polishing module, the inner polishing module and the liquid inlet block are blocks of equal length, which makes it convenient to clamp and fix the three by two locking blocks.

[0052] The two locking blocks are used to secure the outer polishing module, inner polishing module, and liquid inlet block as a whole. The locking blocks are U-shaped, with threaded holes 6.1 provided on two parallel sides of the locking blocks for mounting locking screws relative to each other to achieve clamping and securing of the outer polishing module, inner polishing module, and liquid inlet block.

[0053] The base is the foundation for supporting the outer polishing module, the inner polishing module, and the liquid inlet block. The base is a square column with two threaded holes 5.1 located near one side of the upper end. These holes mate with two countersunk holes in the liquid inlet block, allowing screws to securely connect the liquid inlet block to the base.

[0054] The liquid inlet block, inner polishing module, and outer polishing module are positioned at the top of the base in a parallel, aligned arrangement. Two locking blocks are symmetrically positioned over the outer portions of the liquid inlet block, inner polishing module, and outer polishing module, respectively. Locking screws mounted on the locking blocks secure the liquid inlet block, inner polishing module, and outer polishing module to each other. The convex polishing surface of the inner polishing module extends into the concave polishing surface of the outer polishing module. The liquid inlet buffer zone on the liquid inlet block is located adjacent to the inner polishing module and is aligned and connected to the liquid inlet through-hole on the inner polishing module.

[0055] The outer and inner polishing modules are both made of polyurethane. Polyurethane is highly plastic, elastic, and strong, allowing it to be designed into shapes that are conducive to polishing. Its porous structure also facilitates the adhesion of polishing liquid, effectively facilitating polishing.

[0056] In addition to the above main structural features, the polishing device also needs to be equipped with a polishing liquid circulation device. In this embodiment, the polishing liquid circulation device has three outlets, of which the first outlet is poured above the outer sphere of the hemispherical resonator, the second outlet is poured inside the inner sphere of the hemispherical resonator, and the third outlet is connected to the liquid inlet of the liquid inlet block. When the circulation is turned on, in addition to the polishing liquid from the inner and outer spheres participating in the polishing work, in order to ensure the smooth progress of polishing, the polishing liquid entering from the liquid inlet of the liquid inlet block passes through the liquid inlet buffer and flows into the liquid inlet of the inner polishing module. It passes through the liquid guide groove on the inner polishing module and the liquid guide groove on the outer polishing module in turn. The excess polishing liquid is discharged from the outer end of the outer polishing module, and after reflux filtration, it is recycled again, thereby providing sufficient polishing liquid for the polishing of the hemispherical resonator.

[0057] The polishing liquid used in this embodiment is preferably, but not limited to, prepared in a ratio of cerium oxide polishing powder: sodium hydroxide powder: pure water = 1:0.5:20. The cerium oxide in the polishing liquid primarily reacts with the quartz glass to produce a chemical mechanical polishing effect, while the sodium hydroxide serves to alkaline the polishing liquid, promoting the reaction between the cerium oxide and the quartz glass surface and improving polishing efficiency.

[0058] A polishing method based on the above-mentioned hemispherical resonator ultra-precision polishing device comprises the following steps:

[0059] Step 1: The hemispherical resonator is horizontally mounted on the main shaft of the polishing equipment. The polishing equipment is a machine tool, grinder or other processing equipment that can rotate the workpiece horizontally around the central axis.

[0060] Step 2: Place the base on the polishing equipment;

[0061] Step 3: Place the outer polishing module on the upper end of the base and attach it to the outside of the hemispherical resonator, so that the outer fillet polishing surface fits the outer fillet of the workpiece, and the outer spherical polishing working surface fits the outer spherical surface of the workpiece;

[0062] Step 4: Place the inner polishing module on the upper end of the base and attach it to the inside of the hemispherical resonator, so that the inner column end face polishing working surface is in contact with the inner column end face of the workpiece, the lip end face active surface is in contact with the lip end face of the workpiece, the inner cylinder polishing active surface is in contact with the inner cylinder surface of the workpiece, the inner fillet polishing active surface is in contact with the inner fillet of the workpiece, and the inner spherical surface polishing working surface is in contact with the inner spherical surface of the workpiece;

[0063] Step 5: Place the liquid inlet block on the base and, while ensuring that the positions of the inner and outer polishing modules remain unchanged, adjust the position of the liquid inlet block so that its liquid inlet buffer area faces the liquid inlet through hole on the inner polishing module and its edge is aligned with the inner polishing module;

[0064] Step 6: Use two locking blocks to surround the outer polishing module, inner polishing module, and liquid inlet block from both sides, and install locking screws on both sides of the two locking blocks to fix the relative positions of the three to form a tight connection;

[0065] Step 7. Screw the two screws through the two countersunk holes on the inlet block into the two threaded holes on the base to connect and secure the inlet block to the base.

[0066] Step 8. After completing the above steps, fix the base on the workbench of the polishing equipment. You can install a small vise on the workbench to clamp it or install a tightening block on the workbench and fix it by pre-tightening screws.

[0067] Step 8: Add the prepared polishing liquid to the polishing liquid circulation device, pour the polishing liquid onto the outer spherical surface and the inner spherical surface of the workpiece through the two outlets, and input the polishing liquid into the liquid inlet port of the liquid inlet block through the other outlet;

[0068] Step 9: After the polishing liquid circulation is stable, start the polishing equipment to drive the hemispherical resonator to rotate and perform the polishing operation until the polishing is completed. The rotation speed of the hemispherical resonator is preferably 60 rpm.

[0069] Although the embodiments and drawings of the present invention are disclosed for illustrative purposes, those skilled in the art will understand that various replacements, changes and modifications are possible without departing from the spirit of the present invention and the appended claims. Therefore, the scope of the present invention is not limited to the contents disclosed in the embodiments and drawings.

Claims

1. A hemispherical resonator ultra-precision polishing device, characterized by: It includes an external polishing module, an internal polishing module, a liquid inlet block, two locking blocks and a base; The outer polishing module is a module structure with an inner concave polishing surface provided on a rectangular block. The inner concave polishing surface is composed of a hemispherical concave surface and a rounded surface connected to the small end of the hemispherical concave surface. The hemispherical concave surface and the rounded surface respectively constitute the outer spherical surface polishing working surface and the outer rounded corner polishing action surface. A plurality of liquid guide grooves are evenly distributed on the inner concave polishing surface. The inner polishing module is a modular structure with an outer convex polishing surface provided on one side of a rectangular block. The outer convex polishing surface is composed of a hemispherical convex surface, a semi-cylindrical surface provided at the center of the hemispherical convex surface, and a rounded surface connecting the hemispherical convex surface and the semi-cylindrical surface. The hemispherical convex surface, the semi-cylindrical surface, the rounded surface of the inner polishing module, the bottom surface of the semi-cylindrical surface, and the side surface of one side of the rectangular block of the inner polishing module respectively constitute the inner spherical surface polishing working surface, the inner cylindrical surface polishing surface, the inner rounded corner polishing surface, the inner column end surface polishing working surface, and the lip end surface polishing surface. A plurality of liquid guide grooves are evenly distributed on the outer convex polishing surface, and a liquid inlet through hole is provided on the rectangular block of the inner polishing module at a position corresponding to each liquid guide groove. The liquid inlet block is in the shape of a rectangular block, and a countersunk hole is provided on each of the liquid inlet block near both ends in the up and down directions. A groove is provided on one side of the liquid inlet block to form a liquid inlet buffer zone, and a liquid inlet hole connected to the groove is provided on the other side of the liquid inlet block. The two locking blocks are U-shaped blocks of the same shape, and locking threaded holes are provided on the two parallel sides of the locking blocks; The base is a square column base, and two threaded holes are provided at the upper end of the base near one side; The liquid inlet block, the inner polishing module and the outer polishing module are placed on the upper end of the base in a manner that they are in parallel contact with each other and aligned at both ends; the two locking blocks are symmetrically sleeved on the outside of the liquid inlet block, the inner polishing module and the outer polishing module from both sides, and the liquid inlet block, the inner polishing module and the outer polishing module are fixedly connected by locking screws installed in the locking threaded holes on the two locking blocks; the liquid inlet block is fixedly connected to the base by screws installed in the countersunk holes and the corresponding threaded holes on the base; the outer convex polishing surface of the inner polishing module extends into the inner concave polishing surface of the outer polishing module; the liquid inlet buffer zone on the liquid inlet block is located on the side close to the inner polishing module and is aligned and connected to the liquid inlet through hole on the inner polishing module.

2. The hemispherical resonator ultra-precision polishing device according to claim 1, characterized in that: The outer polishing module and the inner polishing module are both made of polyurethane.

3. A method for ultra-precision polishing of a hemispherical resonator, characterized in that: The hemispherical resonator ultra-precision polishing device according to claim 1 or 2 is used in conjunction with an external polishing liquid circulation device, wherein the polishing liquid circulation device is provided with three outlets; The polishing method comprises the following steps: Step 1: The hemispherical resonator is horizontally mounted on the main shaft of the polishing equipment; Step 2: Place the base on the polishing equipment; Step 3: Place the outer polishing module on the upper end of the base and attach it to the outside of the hemispherical resonator, so that its outer fillet polishing surface fits the outer fillet of the workpiece, and its outer spherical surface polishing working surface fits the outer spherical surface of the workpiece; Step 4: Place the inner polishing module on the upper end of the base and attach it to the inside of the hemispherical resonator, so that the inner column end face polishing working surface is in contact with the inner column end face of the workpiece, the lip end face active surface is in contact with the lip end face of the workpiece, the inner cylinder polishing active surface is in contact with the inner cylinder surface of the workpiece, the inner fillet polishing active surface is in contact with the inner fillet of the workpiece, and the inner spherical surface polishing working surface is in contact with the inner spherical surface of the workpiece; Step 5: Place the liquid inlet block on the base and, while ensuring that the positions of the inner and outer polishing modules remain unchanged, adjust the position of the liquid inlet block so that its liquid inlet buffer area faces the liquid inlet through hole on the inner polishing module and its edge is aligned with the inner polishing module; Step 6: Use two locking blocks to surround the outer polishing module, inner polishing module, and liquid inlet block from both sides, and install locking screws on both sides of the two locking blocks to fix the relative positions of the three to form a tight connection; Step 7. Screw the two screws through the two countersunk holes on the inlet block into the two threaded holes on the base to connect and secure the inlet block to the base. Step 8. After completing the above steps, fix the base on the workbench of the polishing equipment; Step 8: Add the prepared polishing liquid to the polishing liquid circulation device, pour the polishing liquid onto the outer spherical surface and the inner spherical surface of the workpiece through the two outlets, and input the polishing liquid into the liquid inlet port of the liquid inlet block through the other outlet; Step 9: After the polishing liquid circulation is stable, start the polishing equipment to drive the hemispherical resonator to rotate and perform the polishing operation until the polishing is completed; the rotation speed of the hemispherical resonator is 60 rpm.

4. The ultra-precision polishing method for a hemispherical resonator according to claim 3, wherein: The polishing liquid used is prepared by mixing cerium oxide polishing powder, sodium hydroxide powder and pure water in a ratio of 1:0.5:20.

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