Transfer head and chip transfer device

Abstract

The present invention discloses a transfer head and a chip transfer device. The transfer head includes a substrate and multiple transfer units; the transfer units include a sensing unit, an adjustment structure, and a transfer structure; the transfer structure is connected to the sensing unit via the adjustment structure, the adjustment structure being disposed on the substrate, the adjustment structure being used to transmit the force between the transfer structure and the chip to be transferred, and the sensing unit being used to generate a control signal based on the force transmitted by the adjustment structure; the adjustment structure is further used to adjust the force between the transfer structure and the chip to be transferred based on the control signal, thereby adjusting the force between the transfer structure and the chip to be transferred within a preset range, improving the reliability of each transfer unit in picking up and releasing the chip to be transferred when transferring the corresponding chip to be transferred, and thereby improving the reliability of the transfer head in batch transfer of the chips to be transferred.

Description

Technical Field

[0001] The embodiments of the present invention relate to the technical field of chip transfer, and in particular to a transfer head and a chip transfer device. Background Art

[0002] Micro-LED (micro-light-emitting diode) display panels are attracting increasing interest. The production process of micro-LED display panels requires the transfer of a massive number of micro-LED chips using a transfer head. For example, the transfer head can transfer tens of thousands or more micro-LED chips at a time. Due to manufacturing process limitations, the force applied by the transfer head when picking up and releasing the massive number of micro-LED chips varies, resulting in some micro-LED chips being unable to be picked up or released, reducing the reliability of the transfer head when transferring large quantities of micro-LED chips. Summary of the Invention

[0003] The embodiments of the present invention provide a transfer head and a chip transfer device to improve the reliability of the transfer head when transferring chips in batches.

[0004] In a first aspect, an embodiment of the present invention provides a transfer head, comprising a substrate and a plurality of transfer units; the transfer units comprise a sensing unit, an adjustment structure, and a transfer structure;

[0005] The transfer structure is connected to the sensing unit through the adjustment structure. The adjustment structure is arranged on the substrate. The adjustment structure is used to transmit the force between the transfer structure and the chip to be transferred. The sensing unit is used to form a control signal according to the force transmitted by the adjustment structure; the adjustment structure is also used to adjust the force between the transfer structure and the chip to be transferred according to the control signal.

[0006] Optionally, the adjustment structure includes a connecting member and a first linkage unit;

[0007] The first end of the connecting member is fixedly connected to the transfer structure, and the second end of the connecting member is fixedly connected to the sensing unit through the first linkage unit. The first linkage unit is also electrically connected to the sensing unit. The first linkage unit is used to act according to the control signal to link the connecting member to adjust the force between the transfer structure and the chip to be transferred.

[0008] Optionally, the connecting member includes at least one nanoscale helical elastic structure, and two ends of the helical elastic structure serve as a first end and a second end of the connecting member respectively;

[0009] Preferably, the connecting member comprises a plurality of the helical elastic structures, and the plurality of the helical elastic structures are connected in series and / or in parallel;

[0010] Preferably, the helical elastic structure comprises a helical spring.

[0011] Optionally, the transfer unit further comprises a clamping structure and a second linkage unit;

[0012] The second linkage unit is linked with the clamping structure and points along the vertical direction of the transfer structure to the adjustment structure. The clamping structure is arranged on both sides of the transfer structure; the second linkage unit is connected to the sensing unit, and the second linkage unit is used to act according to the control signal and link the clamping structure to clamp or loosen the transfer structure.

[0013] Optionally, the clamping structure includes a first clamping member and a second clamping member, the first clamping member and the second clamping member are respectively arranged on both sides of the transfer structure, and the first clamping member and the second clamping member are provided with buckles, which are used to lock the transfer structure.

[0014] Optionally, the sensing unit includes a pressure sensor and a data processor;

[0015] The pressure sensor is fixedly connected to the regulating structure, and is used to form a pressure signal according to the force between the regulating structure and the pressure sensor; the data processor is connected to the pressure sensor, and is used to form the control signal according to the pressure signal.

[0016] Optionally, the data processor includes a comparison module, which is used to compare the pressure signal with a preset pressure signal to form the control signal; wherein the control signal includes movement direction information, movement distance information and movement angle information of the adjustment structure.

[0017] Optionally, the connector includes a rigid connector, which is partially embedded in the substrate and fixedly connected to the sensing unit via the first linkage unit, and the hardness of the rigid connector is greater than the hardness of the transfer structure.

[0018] Optionally, the length of the rigid connector embedded in the substrate is less than half of the length of the transfer structure and greater than one third of the length of the transfer structure.

[0019] In a second aspect, an embodiment of the present invention further provides a chip transfer device, comprising the transfer head provided in the first aspect.

[0020] According to the technical solution of the embodiment of the present invention, the adjustment unit in each transfer unit can transmit the force between the transfer structure and the chip to be transferred, the sensing unit can obtain the force between the transfer structure and the chip to be transferred transmitted by the adjustment structure, and form a control signal according to the force between the transfer structure and the chip to be transferred, so as to control the adjustment structure to adjust the force between the adjustment structure and the transfer structure, thereby adjusting the force between the transfer structure and the chip to be transferred so that the force between the transfer structure and the chip to be transferred is within a preset range, thereby improving the reliability of picking up and releasing the chip to be transferred when each transfer unit transfers the corresponding chip to be transferred, thereby improving the reliability of the transfer head in batch transferring the chips to be transferred. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A schematic structural diagram of a transfer head provided by an embodiment of the present invention;

[0022] Figure 2 A schematic structural diagram of another transfer head provided by an embodiment of the present invention;

[0023] Figure 3 A schematic structural diagram of another transfer head provided by an embodiment of the present invention;

[0024] Figure 4 A schematic structural diagram of another transfer head provided by an embodiment of the present invention;

[0025] Figure 5 A schematic structural diagram of another transfer head provided by an embodiment of the present invention;

[0026] Figure 6 A schematic structural diagram of another transfer head provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0027] The present invention will be further described in detail below with reference to the accompanying drawings and examples. It will be understood that the specific embodiments described herein are intended only to illustrate the present invention and are not intended to limit the present invention. It should also be noted that, for ease of description, the accompanying drawings only illustrate portions relevant to the present invention, not all structures.

[0028] In the prior art, tens of thousands of transfer posts are provided on the transfer head. When manufacturing a micro LED display panel, each transfer post corresponds to a micro LED chip and is used to pick up and release the micro LED chip to achieve the transfer of the micro LED chip. When the transfer post picks up and releases the micro LED chip, there is a van der Waals force between the transfer post and the micro LED chip. The magnitude of the van der Waals force must ensure that the micro LED chip does not fall off during the transfer post picking up and transferring the micro LED chip, and at the same time, it must be smaller than the bonding force between the micro LED chip and the backplane, ensuring that the micro LED chip can be released on the backplane when the transfer post releases the micro LED chip; the backplane is the substrate used to carry the micro LED chip in the micro LED display panel. There are multiple transfer posts provided on the transfer head. When manufacturing the transfer posts on the transfer head, due to process errors, different transfer posts have different heights or viscosities. When the transfer head transfers a large number of micro LED chips, the van der Waals forces between different transfer pillars and the corresponding micro LED chips are different. It is easy for the van der Waals forces between some transfer pillars and the micro LED chips to be unable to simultaneously meet the force range required to pick up and release the micro LED chips, resulting in some micro LED chips being unable to be picked up and released, reducing the reliability of the transfer head in transferring a large number of micro LED chips.

[0029] In response to the above technical problems, an embodiment of the present invention provides a transfer head. Figure 1 Schematic diagram of the structure of a transfer head provided by an embodiment of the present invention. Figure 1 As shown, the transfer head includes a substrate 110 and a plurality of transfer units 120; the transfer unit 120 includes a sensing unit 121, an adjusting structure 122 and a transfer structure 123; the transfer structure 123 is connected to the sensing unit 121 through the adjusting structure 122, the adjusting structure 122 is used to transmit the force between the transfer structure 123 and the chip to be transferred, and the sensing unit 121 is used to form a control signal according to the force transmitted by the adjusting structure 122; the adjusting structure 122 is also used to adjust the force between the transfer structure 123 and the chip to be transferred according to the control signal.

[0030] Specifically, the substrate 110 can be a hard substrate, used to provide a carrying platform for the transfer unit 120. Exemplarily, the material of the substrate 110 can be glass. A plurality of transfer units 120 are provided on the substrate 110, each transfer unit 120 corresponds to a chip to be transferred, and is used to transfer the corresponding chip to be transferred. Exemplarily, the transfer units 120 can be arranged in an array, and the chip to be transferred can be a micro LED chip. The transfer structure 123 can be a part of the transfer head that generates a force with the chip to be transferred. Exemplarily, when the transfer head transfers the chip to be transferred, the transfer structure 123 contacts the chip to be transferred to form a van der Waals force. The adjustment structure 122 can physically connect the transfer structure 123 and the sensing unit 121. The adjustment structure 122 can be provided on the substrate 110, and the force on the adjustment structure 122 can be generated by interaction with the transfer structure 123. When a force is exerted between the transfer structure 123 and the chip to be transferred, since the force is mutual, the force can be transmitted through the transfer structure 123 to the adjustment structure 122, which can then transmit the force to the sensor unit 121. The sensor unit 121 can determine the magnitude of the force, thereby determining the force between each transfer structure 123 and the chip to be transferred. When the transfer structures 123 in different transfer units 120 are different, the force between the transfer structure 123 and the chip to be transferred is different, resulting in different forces between the transfer structure 123 and the chip to be transferred determined by the sensor unit 121. In this case, the sensor unit 121 can generate a control signal based on whether the force between the transfer structure 123 and the chip to be transferred is within a preset range. The force within the preset range can be greater than the gravity of the chip to be transferred, ensuring that the transfer structure 123 can prevent the chip to be transferred from falling off when picking up the chip to be transferred, while being less than the bonding force between the chip to be transferred and the carrier substrate, ensuring that the transfer structure 123 can prevent the chip from being released when releasing the chip.

[0031] The adjustment structure 122 is also electrically connected to the sensing unit 121. When the force between the transfer structure 123 and the chip to be transferred is greater than the force within a preset range, the transfer structure 123 may be unable to release the chip to be transferred when releasing it. By controlling the action of the adjustment structure 122 through a control signal, the force between the adjustment structure 122 and the transfer structure 123 can be reduced. By force transmission, the force between the transfer structure 123 and the chip to be transferred can be reduced, and the force between the transfer structure 123 and the chip to be transferred can be adjusted to be within a preset range. When the force between the transfer structure 123 and the chip to be transferred is less than the force within a preset range, the transfer structure 123 may cause the chip to be transferred to fall off when picking up the chip to be transferred. By controlling the action of the adjustment structure 122 through a control signal, the force between the adjustment structure 122 and the transfer structure 123 can be increased. By force transmission, the force between the transfer structure 123 and the chip to be transferred can be increased, and the force between the transfer structure 123 and the chip to be transferred can be adjusted to be within a preset range.

[0032] The sensing unit 121 generates a control signal based on the force between the transfer structure 123 and the chip to be transferred, and controls the movement of the adjustment structure 122, thereby adjusting the force between the adjustment structure 122 and the transfer structure 123, and further adjusting the force between the transfer structure 123 and the chip to be transferred, so that the force between the transfer structure 123 and the chip to be transferred is within a preset range, thereby improving the reliability of each transfer unit 120 in picking up and releasing the chip to be transferred when transferring the corresponding chip to be transferred, thereby improving the reliability of the transfer head in batch transferring the chips to be transferred.

[0033] Figure 2 FIG2 is a schematic diagram of another transfer head provided by an embodiment of the present invention. Figure 2 As shown, the adjustment structure 122 includes a connector 122A and a first linkage unit 122B; the first end of the connector 122A is fixedly connected to the transfer structure 123, and the second end of the connector 122A is fixedly connected to the sensing unit 121 through the first linkage unit 122B. The first linkage unit 122B is also electrically connected to the sensing unit 121. The first linkage unit 122B is used to act according to a control signal, and the linkage connector 122A adjusts the force between the transfer structure 123 and the chip to be transferred.

[0034] Specifically, the connector 122A is fixedly connected to the transfer structure 123. When a force is applied between the transfer structure 123 and the chip to be transferred, the force can be transmitted to the connector 122A through the fixed connection surface between the transfer structure 123 and the connector 122A. Simultaneously, the connector 122A is also fixedly connected to the sensor unit 121 via a first linkage unit 122B. The first linkage unit 122B can be disposed on the substrate 110 and is configured to transmit the force applied to the connector 122A. This allows the force received by the connector 122A to be transmitted to the sensor unit 121 via the first drive unit 122B. The sensor unit 121 generates a control signal based on the received force, and transmits the signal to the first linkage unit 122B via a circuit formed by the electrical connection between the sensor unit 121 and the first linkage unit 122B. The first linkage unit 122B operates based on the control signal and, in conjunction with the connector 122A, can thereby adjust the force applied between the transfer structure 123 and the chip to be transferred.

[0035] Exemplarily, the first linkage unit 122B may have two ends, which are fixedly connected to the connector 122A and the sensing unit 121, respectively, so as to achieve a fixed connection between the connector 122A and the sensing unit 121. The first linkage unit 122B may be a power structure such as a motor. When the force between the transfer structure 123 and the chip to be transferred is less than a preset range, the first linkage unit 122B may squeeze the connector 122A along the direction X in which the connector extends toward the transfer structure, thereby increasing the force applied by the connector 122A to the transfer structure 123, thereby increasing the force applied by the connector 122A to the transfer structure 123 and the chip to be transferred. When the force applied by the connector 123 to the chip to be transferred is greater than a preset range, the first linkage unit 122B may contract the connector 122A along the direction X in which the connector extends toward the transfer structure, thereby reducing the force applied by the connector 122A to the transfer structure 123 and the chip to be transferred. When the movement directions of the first linkage unit 122B are different, the first linkage unit 122B may squeeze or shrink the connection member 122A along the direction X in which the connection member extends toward the transfer structure according to the movement direction of the first linkage unit 122B.

[0036] Figure 3 FIG2 is a schematic diagram of another transfer head provided by an embodiment of the present invention. Figure 2 and Figure 3 As shown, the adjustment structure 122 includes at least one nanoscale helical elastic structure F, and two ends of the helical elastic structure F serve as a first end and a second end of the connecting member respectively.

[0037] Specifically, the size of the chip to be transferred is relatively small, and the size of the transfer structure 123 matches the size grade of the chip to be transferred, so as to ensure that the multiple transfer units 120 on the transfer head correspond to one chip to be transferred respectively. At this time, the connector 122A can be set to a nano-scale spiral elastic structure F, so that the size of the connector 122A can match the size grade of the transfer structure 123, thereby satisfying the size requirements of the adjustment structure 122 connecting the transfer structure 123. Moreover, the spiral elastic structure F has good storage performance and strong load-bearing capacity, and within the range of elastic deformation, along the central axis direction of the spiral elastic structure F, the stress of the spiral elastic structure F is proportional to the amount of expansion and contraction. At this time, the expansion and contraction amount of the spiral elastic structure F can be adjusted by the first linkage unit 122B, and the force acting on the transfer structure 123 can be quantitatively adjusted, so that the force between the transfer structure 123 and the chip to be transferred can be quantitatively adjusted.

[0038] Preferably, continue to refer to Figure 2 and Figure 3 The connecting member 122A includes a plurality of the spiral elastic structures F. The connecting member 122A can adjust the size of the adjustment structure 122 and the elastic coefficient between the stress and the expansion and contraction of the spiral elastic structure F in series and / or in parallel through the plurality of spiral elastic structures F, and then the length of the spiral elastic structure F and the elastic coefficient between the stress and the expansion and contraction can be set as needed.

[0039] It should be noted that the embodiment of the present invention does not limit the size of each spiral coil in the spiral elastic structure F. In the same spiral elastic structure F, the distances from different spiral coils to the central axis may be equal or unequal. The distances between the center planes of different spiral coils may be equal or unequal. The center plane of the spiral coil is perpendicular to the central axis of the spiral coil, and the distances from the starting point and the end point of the spiral coil to the center plane are equal. Moreover, the size of the spiral coils in different spiral elastic structures F is also not limited. When the size of each spiral coil in the spiral elastic structure F is unequal, the elastic coefficient between the stress and the expansion and contraction of the spiral elastic structure F can be determined by measurement. At this time, the elastic coefficient between the stress and the expansion and contraction of the spiral elastic structure F is related to the size and number of each spiral coil.

[0040] In other embodiments, the spiral coils of the helical elastic structure F can be set to be of equal size, that is, the distances from the central axis of the different spiral coils are equal, and the distances between the center planes of the different spiral coils are also equal. This allows the elastic coefficient of the helical elastic structure F within the elastic deformation range to be directly obtained using the elastic coefficient calculation formula, simplifying the process of quantitatively adjusting the force between the transfer structure and the chip to be transferred. For example, if the helical elastic structure F includes a helical spring, the elastic coefficient of the helical elastic structure F is the elastic coefficient of the spring.

[0041] Figure 4 FIG2 is a schematic diagram of another transfer head provided by an embodiment of the present invention. Figures 2 to 4 As shown, the transfer unit 120 also includes a clamping structure 124 and a second linkage unit 125; the second linkage unit 125 is linked with the clamping structure 124, and points along the vertical direction of the transfer structure to the adjustment structure, and the clamping structure 124 is arranged on both sides of the transfer structure 123; the second linkage unit 125 is connected to the sensing unit 121, and the second linkage unit 125 is used to act according to the control signal, and link the clamping structure 124 to clamp or loosen the transfer structure 123.

[0042] Specifically, when the elasticity of the adjustment structure 122 is relatively large, when the transfer structure 123 transfers the chip to be transferred, the adjustment structure 122 is prone to swaying in the direction perpendicular to the transfer structure pointing to the adjustment structure. Exemplarily, when the adjustment structure 122 includes a connector 122A, the direction in which the transfer structure 123 points to the connector 122A can be a vertical direction, and the direction perpendicular thereto is a horizontal direction. At this time, the connector 122A is prone to swaying in the horizontal direction, especially when the transfer structure 123 transfers the chip to be transferred, the connector 122A sways in the moving direction of the moving structure due to inertia. For example, the connector 122A includes a spiral elastic structure F, and the hardness of the spiral elastic structure F is relatively small. When the spiral elastic structure F is connected to the transfer structure 123, the spiral elastic structure F is prone to swaying when the transfer structure 123 transfers the chip to be transferred. At this time, along the moving direction of the transfer structure 123, a clamping structure 124 is set on both sides of the transfer structure 123. The clamping structure 124 is set on the substrate 110 through the second linkage unit 125. When the transfer structure 123 transfers the chip to be transferred, the clamping structure 124 clamps the transfer structure 123 on both sides of the transfer structure 123, so that the transfer structure 123 is fixed, thereby avoiding the swing of the spiral elastic structure F caused by the swing of the transfer structure 123 when transferring the chip to be transferred, which is beneficial to improving the reliability of the transfer structure 123 in transferring the chip to be transferred. In addition, the transfer unit 120 also includes a second linkage unit 125, which is connected to the sensor unit 121. When the sensor unit 121 generates a control signal based on whether the force between the transfer structure 123 and the chip to be transferred is within a preset range, if the control signal controls the adjustment structure 122 to operate, the control signal first controls the second linkage unit 125 to operate before the adjustment structure 122 operates. This causes the second linkage unit 125 to activate the clamping structure 124, which releases the transfer structure 123. The adjustment structure 122 then activates to adjust the force between the adjustment structure 122 and the transfer structure 123. After the adjustment is completed, the second linkage unit 125 is activated again, and the clamping structure 124 is activated to clamp the transfer structure 123, and the chip to be transferred is transferred via the transfer structure 123.

[0043] For example, the material of the clamping structure 124 can be soft rubber. When the clamping structure 124 clamps the transfer structure 123, the clamping structure 124 moves from the sides of the transfer structure 123 toward the transfer structure 123, and the clamping structure 124 deforms under the action of the transfer structure 123. When the clamping structure 124 releases the transfer structure 123, the clamping structure 124 moves from the sides of the transfer structure 123 toward the transfer structure 123. The force between the clamping structure 124 and the transfer structure 123 gradually decreases until it reaches zero, at which point the deformation of the clamping structure 124 gradually disappears.

[0044] Continue to refer Figure 4 In other embodiments, the clamping structure 124 includes a first clamping member 1241 and a second clamping member 1242. The first clamping member 1241 and the second clamping member 1242 are respectively arranged on both sides of the transfer structure 122. The first clamping member 1241 and the second clamping member 1242 are provided with buckles ( Figure 3 (not shown), the buckle is used to lock the transfer structure 122.

[0045] Specifically, the first clamping member 1241 and the second clamping member 1242 can be rigid clamping members. For example, the hardness of the first clamping member 1241 and the second clamping member 1242 can be greater than or equal to that of the transfer structure 123. A buckle is provided on the side of the first clamping member 1241 near the transfer structure 123, and a buckle is also provided on the side of the second clamping member 1242 near the transfer structure 123. The two buckles can be symmetrically arranged relative to the transfer structure 123. When the first clamping member 1241 and the second clamping member 1242 clamp the transfer structure 123, the second linkage unit 125 can be used to link the first clamping member 1241 and the second clamping member 1242 to move toward the transfer structure 123. After the first clamping member 1241 and the second clamping member 1242 move to a preset distance from the transfer structure 123, the two buckles on both sides of the transfer structure 123 lock the transfer structure 123, thereby achieving the clamping of the transfer structure 123 by the first clamping member 1241 and the second clamping member 1242. The preset distance between the first clamping member 1241 and the second clamping member 1242 and the transfer structure 123 is the distance at which the buckles can lock the transfer structure 123. When the first clamping member 1241 and the second clamping member 1242 release the transfer structure 123, the two buckles open, loosening the transfer structure 123, and the second linkage unit 125 links the first clamping member 1241 and the second clamping member 1242 to move away from the transfer structure 123, thereby facilitating the adjustment of the force between the transfer structure 123 and the adjustment structure 122.

[0046] Figure 5 FIG2 is a schematic diagram of another transfer head provided by an embodiment of the present invention. Figure 5 As shown, the sensing unit 121 includes a pressure sensor 1211 and a data processor 1212; the pressure sensor 1211 is fixedly connected to the regulating structure 122, and the pressure sensor 1211 is used to form a pressure signal according to the force between the regulating structure 122 and the pressure sensor 1211; the data processor 1212 is connected to the pressure sensor 1211, and the data processor 1212 is used to form a control signal according to the pressure signal.

[0047] Specifically, pressure sensor 1211 is fixedly connected to adjustment structure 122 and can sense the force acting on adjustment structure 122, the magnitude of which is equal to the force acting between transfer structure 123 and the chip to be transferred. Pressure sensor 1211 converts the force into a pressure signal and transmits it to data processor 1212. The pressure signal value can reflect the magnitude of the force sensed by pressure sensor 1211. Data processor 1212 is provided with a preset pressure signal for converting force within a preset range. The mapping relationship between the preset pressure signal and the force within the preset range is the same as the mapping relationship between the force sensed by pressure sensor 1211 and the pressure signal. Based on the pressure signal and the preset pressure signal, data processor 1212 can determine whether the force sensed by pressure sensor 1211 is within the preset range and generate a control signal based on the determination result. Based on the control signal, the adjustment structure 122 is then controlled to adjust the force between the adjustment structure 122 and transfer structure 123, and thus the force between transfer structure 123 and the chip to be transferred, thereby improving the reliability of the transfer head when transferring batches of chips to be transferred.

[0048] Based on the above technical solution, the data processor includes a comparison module, which is used to compare the pressure signal with a preset pressure signal to form a control signal; wherein the control signal includes movement direction information, movement distance information and movement angle information of the adjustment structure.

[0049] Specifically, when the data processor determines whether the pressure signal is within the preset pressure signal range, a comparison module can be used to compare and judge and form a control signal. The control signal includes movement direction information, which can be represented by the positive and negative difference between the pressure signal and the preset pressure signal, and is used to characterize the movement direction of the regulating structure and realize the extrusion or contraction of the regulating structure. The control signal can also include movement distance information, which can be represented by the difference between the pressure signal and the preset pressure signal, and is used to characterize the movement distance of the regulating structure. The force between the regulating structure and the transfer structure can be quantitatively adjusted by the movement distance. The control signal can also include movement angle information, which can be represented by the difference (including positive and negative and size) between the pressure signal and the preset pressure signal in different quadrants, and is used to characterize the angle between the transfer surface of the transfer structure and the chip to be transferred, wherein the transfer surface is the surface that the transfer structure contacts with the chip to be transferred. The angle between the transfer surface and the chip to be transferred can be adjusted to be parallel to the surface that the transfer structure contacts with the chip to be transferred, thereby facilitating the balanced distribution of the force between the transfer structure and the chip to be transferred, and then facilitating the transfer structure to transfer the chip to be transferred. The quadrants are divided into four quadrants with the geometric center of the transfer surface of the transfer structure as the origin and the horizontal direction and the vertical direction in the horizontal plane as the axes.

[0050] Exemplarily, the pressure signal has a positive correlation with the force sensed by the pressure sensor, and the preset pressure signal has a positive correlation with the force within a preset range. Before the comparison module compares the pressure signal with the preset pressure signal, it first determines whether the pressure signals in the first to fourth quadrants are equal based on the pressure signal. When the pressure signals in the first to fourth quadrants are not equal, the pressure signals in the other quadrants are adjusted to the standard pressure signal based on one of the pressure signals in the first to fourth quadrants. When adjusting the pressure signals in other quadrants, the comparison module can be used to compare the pressure signals in different quadrants with the preset pressure signal to form control signals corresponding to different quadrants. The control signals corresponding to different quadrants all include movement direction information and movement distance information. By adjusting the adjustment structure through the control signals in different quadrants, the angle between the transfer surface of the transfer structure and the chip to be transferred can be adjusted until the surfaces of the transfer structure and the chip to be transferred that contact each other are parallel.

[0051] After the pressure signals in the first to fourth quadrants are equal, the pressure signal is compared with the preset pressure signal through the comparison module. When the pressure signal is greater than the maximum preset pressure signal, the force sensed by the pressure sensor is greater than the maximum force within the preset range, and the difference between the pressure signal and the preset pressure signal is greater than zero. At this time, the movement direction information of the control signal can be set to positive, which is used to characterize the contraction of the regulating structure. At the same time, the difference between the pressure signal and the preset pressure signal is used as the movement distance information to characterize the distance of the contraction movement of the regulating structure, so that the force sensed by the pressure sensor can be quantitatively reduced by shrinking the distance of the regulating structure movement, so that the force sensed by the pressure sensor is within the preset range, ensuring the reliability of the transfer structure in transferring the chip to be transferred. When the pressure signal is less than the minimum preset pressure signal, the force sensed by the pressure sensor is less than the minimum force within the preset range, and the difference between the pressure signal and the preset pressure signal is less than zero. At this time, the movement direction information of the control signal can be set to negative, which is used to characterize the squeezing of the transfer structure by the regulating structure. At the same time, the difference between the pressure signal and the preset pressure signal is used as the movement distance information to characterize the distance of the extrusion movement of the adjustment structure, so that the force sensed by the pressure sensor can be quantitatively increased by squeezing the distance of the movement of the adjustment structure, so that the force sensed by the pressure sensor is within the preset range, ensuring the reliability of the transfer structure in transferring the chip to be transferred.

[0052] It should be noted that, when the adjustment structure is a spiral elastic structure, the movement distance information may be the expansion and contraction amount of the spiral elastic structure.

[0053] Figure 6 FIG2 is a schematic diagram of another transfer head provided by an embodiment of the present invention. Figure 6 As shown, in other embodiments, the connector includes a rigid connector 1221, which is partially embedded in the substrate 110 and fixedly connected to the sensing unit 121 through the first linkage unit. The hardness of the rigid connector 1221 is greater than the hardness of the transfer structure 123.

[0054] Specifically, the hardness of the rigid connector 1221 is greater than the hardness of the transfer structure 123, which can provide stability when the transfer structure 123 transfers the chip to be transferred and experiences a swinging phenomenon. On the basis of ensuring the reliability of the transfer structure 123 in transferring the chip to be transferred, it avoids the need for an additional clamping structure, which is conducive to simplifying the structure of the transfer head. Exemplarily, the material of the rigid connector 1221 can be a metal oxide. In addition, the rigid connector 1221 is partially embedded in the substrate 110 and is fixedly connected to the sensing unit 121 via the first linkage unit, so that the first connection surface S1 of the rigid connector 1221 can be in contact with the transfer structure 123. Exemplarily, the first connection surface S1 is in full contact with the transfer structure 123, and the force acting on the transfer structure 123 can be transmitted through the force transmission effect. At the same time, the second connection surface S2 of the rigid connection member 1221 is in contact with the sensing unit 121. Exemplarily, the second connection surface S2 is in complete contact with the pressure sensing surface of the sensing unit 121. The sensing unit 121 can sense the force acting on the transfer structure 123, that is, the force between the transfer structure 123 and the chip to be transferred, through force transmission.

[0055] It should be noted that when the adjustment structure is a rigid connector 1221, the rigid connector 1221 is partially embedded in the substrate 110, and the movement distance information can be obtained by the rigid connector 1221 in the first linkage unit ( Figure 5 The distance moved along the thickness of the substrate under the linkage action (not shown), at this time, the force between the hard connector 1221 and the transfer structure 123 can be adjusted by adjusting the length of the hard connector 1221 buried in the substrate 110.

[0056] Optionally, the length of the rigid connector 1221 embedded in the substrate 110 is less than half the length of the transfer structure 123 and greater than one third the length of the transfer structure 123 .

[0057] Specifically, a portion of the rigid connector 1221 can be embedded in the substrate 110. When the first linkage unit links the rigid connector 1221 to extend or retract, by setting the length of the rigid connector 1221 embedded in the substrate 110 to be greater than one-third of the length of the transfer structure 123, the rigid connector 1221 can be prevented from falling off the substrate 110 during extension, while still satisfying the adjustable range of the force between the transfer structure 123 and the chip to be transferred. The length of the transfer structure 123 is the length of the transfer structure along the direction of extension and retraction of the rigid connector 1221. Furthermore, by setting the length of the rigid connector 1221 embedded in the substrate 110 to be less than one-half of the length of the transfer structure 123, the rigid connector 1221 still partially protrudes from the substrate 110 even when embedded in the substrate 110 at its longest length. This prevents the rigid connector 1221 from causing the transfer structure 123 to collide with the substrate 110 during contraction, thereby ensuring the accuracy of the force between the transfer structure 123 and the chip to be transferred.

[0058] An embodiment of the present invention further provides a chip transfer device, which includes the transfer head provided by any embodiment of the present invention.

[0059] Note that the above are only preferred embodiments of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and that various obvious changes, readjustments, and substitutions can be made by those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments and may include many other equivalent embodiments without departing from the concept of the present invention. The scope of the present invention is determined by the scope of the appended claims.

Claims

1. A transfer head, characterized in that: It includes a substrate and a plurality of transfer units; the transfer unit includes a sensing unit, an adjustment structure and a transfer structure; The transfer structure is connected to the sensing unit via the adjustment structure, and the transfer structure is arranged in a one-to-one correspondence with the chip to be transferred, and is used to pick up and release the chip to be transferred; The adjustment structure is arranged on the substrate, and the adjustment structure is used to transmit the force between the transfer structure and the chip to be transferred. The sensing unit is used to form a control signal according to the force transmitted by the adjustment structure; the adjustment structure is also used to adjust the force between the transfer structure and the chip to be transferred according to the control signal.

2. The transfer head according to claim 1, wherein: The adjustment structure includes a connecting member and a first linkage unit; The first end of the connecting member is fixedly connected to the transfer structure, and the second end of the connecting member is fixedly connected to the sensing unit through the first linkage unit. The first linkage unit is also electrically connected to the sensing unit. The first linkage unit is used to act according to the control signal to link the connecting member to adjust the force between the transfer structure and the chip to be transferred.

3. The transfer head according to claim 2, wherein: The connecting member includes at least one nano-scale helical elastic structure, and two ends of the helical elastic structure serve as a first end and a second end of the connecting member respectively.

4. The transfer head according to claim 3, wherein: The connecting member includes a plurality of the helical elastic structures, and the plurality of the helical elastic structures are connected in series and / or in parallel.

5. The transfer head according to claim 3, wherein: The helical elastic structure includes a helical spring.

6. The transfer head according to any one of claims 1 to 5, characterized in that: The transfer unit further comprises a clamping structure and a second linkage unit; The second linkage unit is linked with the clamping structure and points along the transfer structure in a vertical direction to the adjustment structure, and the clamping structure is arranged on both sides of the transfer structure; The second linkage unit is connected to the sensing unit, and is configured to operate according to the control signal and to link the clamping structure to clamp or release the transfer structure.

7. The transfer head according to claim 6, wherein: The clamping structure includes a first clamping member and a second clamping member, the first clamping member and the second clamping member are respectively arranged on both sides of the transfer structure, and the first clamping member and the second clamping member are provided with buckles, which are used to lock the transfer structure.

8. The transfer head according to any one of claims 1 to 5, characterized in that: The sensing unit includes a pressure sensor and a data processor; The pressure sensor is fixedly connected to the regulating structure, and is used to form a pressure signal according to the force between the regulating structure and the pressure sensor; the data processor is connected to the pressure sensor, and is used to form the control signal according to the pressure signal.

9. The transfer head according to claim 8, wherein: The data processor includes a comparison module, which is used to compare the pressure signal with a preset pressure signal to form the control signal; wherein the control signal includes movement direction information, movement distance information and movement angle information of the adjustment structure.

10. The transfer head according to claim 2, wherein: The connecting member includes a rigid connecting member, which is partially embedded in the substrate and fixedly connected to the sensing unit via the first linkage unit. The rigid connecting member has a hardness greater than that of the transfer structure.

11. The transfer head according to claim 10, wherein: The length of the rigid connection member embedded in the substrate is less than half of the length of the transfer structure and greater than one third of the length of the transfer structure.

12. A chip transfer device, characterized in that: The transfer head comprises the transfer head according to any one of claims 1 to 11.

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