heat dissipating device

Abstract

A heat dissipation device includes: a housing, a distribution layer, a heat exchange layer, a fan, and a pump. The housing includes: a liquid storage section, a liquid-gas mixing section, a liquid inlet, a liquid outlet, an air inlet, and an air outlet. The liquid-gas mixing section is located above the liquid storage section, the liquid inlet is located on the liquid-gas mixing section, and the air inlet and outlet are located on opposite sides of the liquid-gas mixing section. The distribution layer is disposed within the liquid-gas mixing section and has multiple through holes. The heat exchange layer is disposed within the liquid-gas mixing section and has a continuous phase framework and pores. The fan is disposed outside the housing and is connected to the air inlet. The pump is connected to the liquid outlet. The heat dissipation device of the present invention forcibly disperses high-temperature liquid and prolongs the falling time of high-temperature liquid, allowing low-temperature airflow to directly exchange heat with the liquid, significantly improving heat dissipation efficiency and meeting the heat dissipation needs of industries such as electronics and air conditioning.

Description

Technical Field

[0001] The present invention relates to a heat dissipation device, and more particularly to a heat dissipation device comprising a liquid-gas heat exchange structure. Background Technology

[0002] With the increasing performance of various chips, including logic, graphics, memory, and cooling chips, the heat generated during chip operation has increased significantly. If this heat cannot be removed, excessively high temperatures will affect chip performance and lifespan. Air cooling methods using heat sinks and fans are no longer sufficient to meet the heat dissipation requirements of high-performance chips. Water-cooled cooling devices for chips are now available. Figure 1 This is a schematic diagram of an existing water-cooled heat dissipation device. Figure 1 As shown, the existing water-cooled heat dissipation device 1 includes a heat absorption plate 11, a heat exchange box 12, a pipe 13, a fan 14, and a pump 15. The heat absorption plate 1 is disposed on the heating surface of the chip 10. The pipe 13 connects the heat absorption plate 11, the heat exchange box 12, and the pump 15. The fan 14 is disposed on the heat exchange box 12. The heat exchange box 12 includes a water storage chamber 121, a water outlet chamber 122, a closed flow channel 123, and a heat-conducting plate 124 connected to the closed flow channel 123.

[0003] When the existing water-cooled heat dissipation device 1 dissipates heat, the pump 15 delivers the cooler water in the outlet chamber 122 through the pipe 13 to the heat absorber plate 11 to absorb the heat generated by the chip 10. The water after absorbing heat flows out of the heat absorber plate 11 and into the storage chamber 121 through the pipe 13. The cooler water in the storage chamber 121 flows into the closed flow channel 123 and conducts heat to the wall of the closed flow channel 123 and the heat-conducting plate 124. The fan 14 introduces cooler external air into the heat exchange box 12 to remove the heat from the closed flow channel 123 and the heat-conducting plate 124. The water after the temperature drops flows into the outlet chamber 122 and is once again delivered by the pump 15 to the heat absorber plate 11 to absorb the heat generated by the chip 10.

[0004] In the aforementioned water-cooled heat dissipation device, if the heat absorption plate and water absorb less heat than the chip releases heat, or if the closed flow channel and heat-conducting plate absorb less heat than the water releases heat, the chip temperature will gradually rise, affecting performance. To ensure heat dissipation, existing water-cooled heat dissipation devices must use a large amount of water, a large-volume heat exchange box, and energy-intensive pumps and fans, which not only limits the applicable space and uses of water-cooled heat dissipation devices but also increases manufacturing and operating costs. Solving these problems of existing heat dissipation devices is the main objective of this invention. Summary of the Invention

[0005] To address the various problems of existing heat dissipation devices, this invention provides a heat dissipation device comprising: a housing, a distribution layer, a heat exchange layer, a fan, and a pump. The housing includes a liquid storage section, a liquid-gas mixing section, a liquid inlet, a liquid outlet, an air inlet, and an air outlet. The liquid-gas mixing section is located above the liquid storage section, the liquid inlet is located on the liquid-gas mixing section, and the air inlet and air outlet are located on opposite sides of the liquid-gas mixing section. The distribution layer is disposed within the liquid-gas mixing section and has multiple through holes. The heat exchange layer is disposed within the liquid-gas mixing section and has a continuous phase frame and multiple pores. The fan is disposed outside the housing and is connected to the air inlet. The pump is connected to the liquid outlet. The liquid that absorbs heat from the heat source flows into the through holes of the distribution layer through the liquid inlet and disperses into multiple droplets. The fan introduces air with a temperature lower than the droplets into the heat exchange layer through the air inlet. The droplets flow into the heat exchange layer and exchange heat with the air in the continuous phase skeleton and pores. The air flowing out of the heat exchange layer flows out of the box through the air outlet. The droplets flowing out of the heat exchange layer flow to the liquid storage section and gather into a heat-releasing liquid. The pump delivers the heat-releasing liquid to the heat source through the liquid outlet.

[0006] In one embodiment, along the vertical direction of the aforementioned housing, the horizontal width of the aforementioned liquid-gas mixing section gradually increases towards the side of the aforementioned liquid storage section.

[0007] In one embodiment, the height of the air outlet is greater than the height of the air inlet.

[0008] In one embodiment, the pores occupy 70% to 90% of the volume of the heat exchange layer.

[0009] In one embodiment, the heat exchange layer comprises at least one foam metal block, metal mesh, or metal cluster.

[0010] In one embodiment, the pump is disposed in the liquid storage section, and the liquid outlet is located in the liquid-gas mixing section.

[0011] In one embodiment, the pump is disposed outside the housing, and the liquid outlet is located in the liquid storage section.

[0012] In one embodiment, the heat dissipation device further includes: a guide vane disposed on the air inlet and the air outlet to guide the air through the heat exchange layer.

[0013] In one embodiment, the heat dissipation device further includes an air filter connected to the fan.

[0014] In one embodiment, the heat dissipation device further includes a liquid level sensor disposed in the liquid storage section, which generates a signal to replenish liquid when the liquid level sensor detects that the heat-releasing liquid is below a lower limit.

[0015] In the heat dissipation device of the present invention, the flow distribution layer has multiple through holes, and the heat exchange layer has a continuous phase framework and pores. The through holes can force the heat-absorbing liquid to disperse into droplets, thereby increasing the heat dissipation surface area of ​​the liquid. The continuous phase framework can prolong the falling time of the high-temperature liquid while absorbing the heat of the high-temperature liquid. The pores allow the low-temperature air introduced by the fan to circulate and exchange heat with the droplets and the continuous phase framework, greatly improving the heat dissipation rate of the droplets. The heat-absorbing air flows out of the box, and the heat-released liquid can be transported back to the heat source for heat absorption. Compared with the prior art, the heat dissipation device of the present invention significantly improves the heat dissipation efficiency while reducing the amount of liquid used, meeting the heat dissipation needs of industries such as electronics and air conditioning. Attached Figure Description

[0016] Figure 1 A schematic diagram of an existing water-cooled heat dissipation device;

[0017] Figure 2A This is a perspective view of the first embodiment of the heat dissipation device of the present invention. Figure 2B This is a side sectional view of the first embodiment of the heat dissipation device of the present invention; and

[0018] Figure 3A This is a perspective view of a second embodiment of the heat dissipation device of the present invention. Figure 3B This is a side sectional view of a second embodiment of the heat dissipation device of the present invention.

[0019] The reference numerals in the attached figures are explained as follows:

[0020] 1: Existing water-cooled heat dissipation device

[0021] 10: Chips

[0022] 11: Heat Absorber Plate

[0023] 12: Heat exchange box

[0024] 13: Piping

[0025] 14: Fan

[0026] 15: Pump

[0027] 121: Water Storage Room

[0028] 122: Water outlet chamber

[0029] 123: Closed flow channel

[0030] 124: Thermal conductive sheet

[0031] 2,3: Heat dissipation device

[0032] 21,31: Box

[0033] 22,32: Diversion Layer

[0034] 23,33: Heat exchange layer

[0035] 24,34: Fans

[0036] 25, 35: Pumps

[0037] 26: Air Shield

[0038] 211,311: Liquid storage department

[0039] 212, 312: Liquid-gas mixing section

[0040] 213,313: Liquid inlet

[0041] 214,314: Liquid outlet

[0042] 215, 315: Air inlet

[0043] 216, 316: Air outlet

[0044] 217, 218: Deflector Plates

[0045] 221, 321: Through holes

[0046] 231,331 continuous phase skeleton

[0047] 232,332: Pores Detailed Implementation

[0048] The following detailed description, in conjunction with drawings and component symbols, illustrates embodiments of the present invention in more detail, enabling those skilled in the art to implement the invention upon reading this specification. The terminology used herein is for illustrating specific embodiments only and is not intended to limit the invention. Unless clearly indicated otherwise in the context, the terms herein include singular and plural forms, the term "and / or" includes any and all combinations of one or more of the associated listed items, and when a component is "connected" or "communicated" to another component, it includes a direct connection between the two components or a connection via an intermediate component allowing fluid to pass through the two components.

[0049] Figure 2A and 2B This is a perspective and side sectional view of a first embodiment of the heat dissipation device of the present invention. Figure 2A and 2BAs shown, in this embodiment, the heat dissipation device 2 includes: a housing 21, a distribution layer 22, a heat exchange layer 23, a fan 24, a pump 25, and an air shroud 26. The housing 21 includes a liquid storage section 211, a liquid-gas mixing section 212, a liquid inlet 213, a liquid outlet 214, an air inlet 215, and an air outlet 216. The liquid-gas mixing section 212 is located above the liquid storage section 211, the liquid inlet 213 and the liquid outlet 214 are located on the liquid-gas mixing section 212, and the air inlet 215 and the air outlet 216 are located on opposite sides of the liquid-gas mixing section 212. The distribution layer 22 and the heat exchange layer 23 are disposed within the liquid-gas mixing section 212. The distribution layer 22 has multiple through holes 221, and the heat exchange layer 23 has a continuous phase framework 231 and multiple pores 232 formed within the continuous phase framework 231. The air hood 26 is connected to the outer surface of one side of the housing 21 and has an air inlet 215. The fan 24 is located inside the air hood 26 and can be connected to an external power source (not shown). The pump 25 is located inside the liquid storage section 211 and can be connected to an external power source (not shown).

[0050] Pipes (not shown) connect the heat source (not shown) and the inlet 213 and outlet 214 of the heat dissipation device 2. The liquid (e.g., water or an aqueous solution with added ethylene glycol) absorbs heat from the heat source (e.g., the central processing unit, graphics processor or cooling chip of a server) and flows through the inlet 213 into the through hole 221 of the distribution layer 22, dispersing into multiple droplets. The fan 24 introduces air outside the housing 21, whose temperature is lower than that of the droplets, into the heat exchange layer 23 through the air inlet 215. The droplets flow into the heat exchange layer 23 and exchange heat with the air in the continuous phase skeleton 231 and pores 232 of the heat exchange layer 23. The heat-absorbing air flows out of the heat exchange layer 23 and out of the housing 21 through the air outlet 216. The heat-releasing droplets flowing out of the heat exchange layer 23 flow to the liquid storage section 211 and gather into heat-releasing liquid. The pump 25 delivers the heat-releasing liquid back to the heat source through the outlet 214 for heat absorption.

[0051] The material of the container 21 is not particularly limited, such as engineering plastics or rust-resistant metal. The water storage section 211 can be cuboid or cylindrical, and its volume depends on the required liquid volume, for example, 3 liters to 15 liters or more. Along the vertical direction of the container 21 (e.g., Figure 2B As shown on the Y-axis), the horizontal width of the liquid-gas mixing section 212 (as shown on the Y-axis) Figure 2BThe gas-liquid mixing section 212 gradually increases in width towards the liquid storage section 211 (in the X-axis direction); that is, the side profile of the gas-liquid mixing section 212 is roughly trapezoidal, wider at the top and narrower at the bottom. The air inlet 215 is located on the side of the gas-liquid mixing section 212 where the width does not increase (vertical side), and the air outlet 216 is located on the side of the gas-liquid mixing section where the width increases (inclined side), with the height of the air outlet 216 greater than the height of the air inlet 215. By using a larger volume gas-liquid mixing section 212 and a higher air outlet 216, the size and number of heat exchange layers can be adjusted according to heat dissipation requirements. Furthermore, some tiny droplets carried away from the heat exchange layer 23 by the air collide with the inclined inner wall of the gas-liquid mixing section 212 and flow downwards to the liquid storage section 211, effectively preventing the airflow from carrying away the heat-released droplets. When applied to indoor or automotive air conditioning cooling, insulation or buffer components can be added to the outside of the housing 21 to prevent the cooling device from being affected by ambient temperature or vibration.

[0052] The flow divider layer 22 can be made of plastic or rust-resistant metal. The through-holes 221 of the flow divider layer 22 serve to divert the heat-absorbing liquid into droplets as much as possible. The total surface area of ​​the droplets is much larger than the surface area of ​​the liquid, which can promote heat dissipation. The through-holes 221 should disperse the liquid as much as possible while avoiding excessively slowing down the liquid flow rate and affecting the liquid circulation rate. There are no particular restrictions on the shape of the through-holes 221, such as, but not limited to, conical, cylindrical, and spiral shapes. The size of the droplets produced is between that produced by a shower head and a water mist nozzle (e.g., 0.1 to 5 mm).

[0053] The heat dissipation device 2 may include one or more heat exchange layers 23. The heat exchange layers 23 may be made of a high thermal conductivity and rust-resistant metal material (e.g., nickel, aluminum, nickel alloys, aluminum alloys, etc.) and formed into a blocky structure with a continuous phase framework 231 and pores 232 formed within the continuous phase framework 231. Examples include: foamed metal, multiple horizontally or vertically arranged metal meshes, or multiple intertwined metal strips forming a metal mass. The continuous phase framework 231 has a large thermal conductivity area and high thermal conductivity, which can significantly increase the heat dissipation of the droplets and the heat dissipation rate (heat dissipation flow rate). The pores 232 allow air and droplets to pass through, and allow the cooler air to absorb heat from the droplets and the continuous phase framework 231. Depending on the heat dissipation requirements, heat exchange layers 23 with different sizes of continuous phase frameworks and pores can be used. Taking foamed metal as an example, the thickness is between 10 and 200 mm, the porosity is between 70 and 90% by volume, and the pore diameter is between 0.5 and 3.0 mm. 2 .

[0054] The fan 24 can be an axial fan, centrifugal fan, blower fan, or crossflow fan. The speed, air volume, power, and number of fans 24 can be determined according to factors such as the required airflow for heat dissipation through the airflow path of the heat exchange layer 23. In this embodiment, an axial fan is selected for the fan 24. Guide vanes 217 and 218 are respectively provided on the air inlet 215 and the air outlet 216. The air shroud 26, together with the guide vanes 217 and 218, can concentrate and guide the air through the heat exchange layer 23, further improving the liquid-gas heat exchange efficiency.

[0055] The heat dissipation device 2 can be selected from either a submersible pump installed inside the tank or a pump installed outside the tank, depending on the available space. In this embodiment, the pump 25 is a submersible pump installed in the liquid storage section 211, connected to the outlet 214 via a conduit. The head and flow rate of the pump 25 can be determined based on factors such as the heat source generating heat, the amount of liquid required for temperature control, and the length of the pipeline. The head is, for example, but not limited to, 8 to 25 m, and the maximum flow rate is, for example, but not limited to, 50 to 500 L / min. In other embodiments, the outlet is located on the lower side of the liquid storage section, and the pump is a pump installed outside the tank and connected to the outlet via a pipeline, which can increase the liquid storage capacity of the liquid storage section or reduce the volume of the tank.

[0056] Figure 3A and 3B This is a perspective and side sectional view of a second embodiment of the heat dissipation device of the present invention. Figure 3A and 3B As shown, in this embodiment, the heat dissipation device 3 includes: a housing 31, a distribution layer 32, a heat exchange layer 33, a fan 34, and a pump 35. The housing 31 includes a liquid storage section 311, a liquid-gas mixing section 312, a liquid inlet 313, a liquid outlet 314, an air inlet 315, and an air outlet 316. The liquid-gas mixing section 312 is located above the liquid storage section 311, the liquid inlet 313 and the liquid outlet 314 are located on the liquid-gas mixing section 312, and the air inlet 315 and the air outlet 316 are located on opposite sides of the liquid-gas mixing section 312. The distribution layer 32 and the heat exchange layer 33 are disposed within the liquid-gas mixing section 312. The distribution layer 32 has multiple through holes 321, and the heat exchange layer 33 has a continuous phase framework 331 and pores 332. The fan 34 is located outside the housing 31 and is connected to the air inlet 315. The pump 35 is located inside the liquid storage section 311. The fan 34 and the pump 35 can be connected to an external power source (not shown).

[0057] The structure, specifications, operation, and function of the housing 31, the distribution layer 32, the heat exchange layer 33, and the pump 35 are as described in the first embodiment. In this embodiment, the fan 34 is a blower fan or a centrifugal fan. The air outlet of the fan 34 is directly connected to the air inlet 315, which can reduce the back pressure of the air flow and increase the air velocity. The heat-absorbing liquid is dispersed into multiple droplets through the liquid inlet 313 and the through holes 321 of the distribution layer 32. The droplets flow into the heat exchange layer 33 and exchange heat with the high-velocity air introduced by the fan 34 in the continuous phase skeleton 331 and pores 332 of the heat exchange layer 33. The heat-absorbing air flowing out of the heat exchange layer 33 flows out of the housing 31 through the air outlet 316. The heat-releasing droplets flowing out of the heat exchange layer 33 flow to the liquid storage section 311 and gather into heat-releasing liquid. The pump 35 transports the heat-releasing liquid to the heat source again through the liquid outlet 314 for heat absorption.

[0058] If the accumulation of impurities in the external air on the heat exchange layer or liquid affects the heat exchange efficiency, an air filter (not shown) can be installed at the air inlet of the fan 34. Since the housing, distribution layer, and heat exchange layer are not closed channels, the liquid will gradually evaporate. Therefore, the heat dissipation devices 2 and 3 of the present invention can be equipped with liquid level sensors (not shown) in the liquid storage sections 211 and 311. When the liquid level sensor detects that the liquid in the liquid storage sections 211 and 311 is lower than the lower limit, it generates a signal to replenish the liquid to notify the user to replenish the liquid and maintain the liquid level within the safe operating range.

[0059] Under ideal conditions of complete heat exchange, if the heat generated by the heat source per unit time (-H) source ) equals the heat absorbed by the liquid (+H) liuid And the heat released by the liquid (-H) liuid ) equals the heat absorbed by the air (+H) air If the heat exchange results in only the temperature of the external air rising, while the temperatures of the heat source and the liquid after heat release do not rise; if the heat generated by the heat source per unit time (-H) source The heat absorbed by the liquid is greater than the heat absorbed by the liquid (+H). liquid ) or the heat released by the liquid (-H) liquid The heat absorbed by the air is greater than the heat absorbed by the air (+H). air If the heat exchange occurs, the result is that the heat source or the liquid after heat release accumulates heat, causing the temperature of both the heat source and the liquid to gradually increase. The gradually increasing temperature of the liquid affects the amount of heat absorbed in the next heat exchange. Therefore, the temperature of the liquid after heat release can be used as one of the indicators for judging the heat dissipation efficiency of the heat dissipation device.

[0060] A cooling chip relies on the temperature difference between the P and N electrodes of a semiconductor particle after an input voltage is applied, creating a cold and hot surface. If the hot surface fails to dissipate heat effectively, the cold surface cannot generate sufficient cooling, potentially leading to the chip burning out. Therefore, the heat dissipation requirements for cooling chips are higher than those for the central processing units (CPUs) or graphics processing units (GPUs) of computers and servers. Under the same volume conditions, the heat exchange area of ​​the heat dissipation device of this invention is at least tens of times larger than that of existing water-cooled heat dissipation devices. Furthermore, the liquid and air directly contact each other in the heat exchange layer for heat exchange. Therefore, when applied to the hot surface of a cooling chip, in applications with limited space (e.g., automotive air conditioning), a minimal volume of liquid can be used for repeated heat absorption / release, ensuring that sufficiently cooled liquid at room temperature is returned to the hot surface for heat absorption. Even during prolonged operation, the temperature difference between the liquid inside the device and the environment can be maintained within 5°C, resulting in a heat dissipation efficiency far exceeding that of existing water-cooled heat dissipation devices.

[0061] In actual testing of the cooling chip, existing water-cooled heat dissipation devices and the heat dissipation device of the present invention were compared. After the cooling chip connected to the existing water-cooled heat dissipation device operated for 2 minutes, the cold surface could only generate a cooling temperature of about 0 to 5°C at most. Because the heat dissipation performance of the existing water-cooled heat dissipation device could not meet the heat dissipation requirements of the cooling chip, the temperature of the cold surface would rise and could not provide sufficient cooling. After the cooling chip connected to the heat dissipation device of the present invention operated for 10 seconds, the cold surface could quickly generate a cooling temperature below -30°C and maintain the cooling temperature. After the heat was released, the temperature of the liquid was no higher than the temperature of the outside air by 5°C, and could even be close to the temperature of the outside air (i.e., the ambient temperature). This indicates that the heat dissipation performance of the hot surface of the cooling chip is excellent. The heat dissipation performance of the heat dissipation device of the present invention can meet the heat dissipation requirements of the cooling chip, the central processing unit, and the graphics processing unit.

[0062] In summary, the heat dissipation device of the present invention uses a diversion layer to forcibly disperse the heat-absorbing liquid into droplets and a heat exchange layer to extend the falling time of the high-temperature liquid, so that the low-temperature airflow can directly exchange heat with the droplets. Compared with the prior art, it greatly improves the heat dissipation efficiency and reduces the amount of liquid used, which meets the heat dissipation needs of industries such as electronics and air conditioning.

[0063] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the invention. Any person skilled in the art can modify, combine, and alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications, combinations, or alterations made by those skilled in the art without departing from the spirit and technical principles disclosed in the present invention should still be covered by the scope of the patent application of the present invention.

Claims

1. A heat dissipation device, characterized in that, Include: The housing includes a liquid storage section, a liquid-gas mixing section, a liquid inlet, a liquid outlet, a gas inlet, and a gas outlet. The liquid-gas mixing section is located above the liquid storage section, the liquid inlet is located on the liquid-gas mixing section, and the gas inlet and the gas outlet are located on opposite sides of the liquid-gas mixing section. Along the vertical direction of the housing, the horizontal width of the liquid-gas mixing section gradually increases towards the liquid storage section. The side cross-section of the liquid-gas mixing section is a trapezoid, wider at the top and narrower at the bottom. The height of the gas outlet is greater than the height of the gas inlet. The flow divider is disposed within the liquid-gas mixing section and has multiple through holes; A heat exchange layer, disposed within the liquid-gas mixing section, has a continuous phase framework and multiple pores. The heat exchange layer is a foamed metal with a thickness between 10 and 200 mm, a porosity between 70 and 90% by volume, and pore diameters between 0.5 and 3.0 mm. 2 ; A fan, located outside the enclosure and connected to the air inlet; and Pump, connected to the liquid outlet; The liquid that absorbs heat from the heat source flows into the through-hole of the distribution layer through the liquid inlet and disperses into multiple droplets. The fan introduces air with a temperature lower than the droplets into the heat exchange layer through the air inlet. The droplets flow into the heat exchange layer and exchange heat with the air in the continuous phase skeleton and the pores. The air flowing out of the heat exchange layer flows out of the box through the air outlet. The droplets flowing out of the heat exchange layer flow to the liquid storage section and gather into the heat-releasing liquid. The pump delivers the heat-releasing liquid to the heat source through the liquid outlet.

2. The heat dissipation device as described in claim 1, characterized in that, The pump is located in the liquid storage section, and the outlet is located in the liquid-gas mixing section.

3. The heat dissipation device as described in claim 1, characterized in that, The pump is located outside the tank, and the outlet is located in the liquid storage section.

4. The heat dissipation device as described in claim 1, characterized in that, It also includes: a guide vane, disposed on the air inlet and the air outlet, for guiding the air through the heat exchange layer.

5. The heat dissipation device as described in claim 1, characterized in that, It also includes: an air filter, which connects to the fan.

6. The heat dissipation device as described in claim 1, characterized in that, It also includes: a liquid level sensor, which is installed in the liquid storage section, and generates a signal to replenish the liquid when the liquid level sensor detects that the exothermic liquid is below the lower limit.

Images