Laser cutting method, electronic device, system and storage medium

Abstract

This application discloses a laser cutting method, electronic device, system, and storage medium. The laser cutting method includes the following steps: detecting the actual material and actual thickness of a plate to be cut; if it is determined that the actual material matches a preset target material and the actual thickness matches a preset target thickness, determining target process parameters for this laser cutting based on the actual thickness and the actual material; and laser cutting the plate to be cut based on the target process parameters. This application solves the technical problem of the long process parameter debugging time of conventional laser cutting.

Description

Technical Field

[0001] The present application relates to the field of laser cutting technology, and in particular to a laser cutting method, electronic equipment, system and storage medium. Background Art

[0002] Laser cutting is the most important application technology in the laser processing industry, accounting for more than 70% of the entire laser processing industry. Laser cutting is currently the world's most advanced cutting process. Due to its advantages of precision manufacturing, flexible cutting, special-shaped processing, one-time forming, fast speed and high efficiency, it has solved many problems in industrial production that cannot be solved by conventional methods. Laser can cut most metal materials.

[0003] However, the current laser cutting process parameters are mostly determined by manually observing the plate to be cut and performing trial cutting based on experience. The process parameters are adjusted according to the trial cutting results and are finally determined through repeated debugging, which takes a long time. Summary of the Invention

[0004] The main purpose of this application is to provide a laser cutting method, electronic equipment, system and storage medium, aiming to solve the technical problem of long process parameter debugging time in the prior art laser cutting.

[0005] To achieve the above objectives, the present application provides a laser cutting method, which includes the following steps:

[0006] Detect the actual material and thickness of the plate to be cut;

[0007] If it is determined that the actual material matches the preset target material, and the actual thickness matches the preset target thickness, then the target process parameters for this laser cutting are determined based on the actual thickness and the actual material;

[0008] Laser cutting is performed on the plate to be cut according to the target process parameters.

[0009] Optionally, the step of detecting the actual material and actual thickness of the plate to be cut includes:

[0010] The detection probe of the plate detection device emits X-ray fluorescence and ultrasonic waves to the plate to be cut, generating X-ray fluorescence detection results and ultrasonic detection results;

[0011] The actual material of the plate to be cut is determined based on the X-ray fluorescence detection result, and the actual thickness of the plate to be cut is determined based on the ultrasonic detection result.

[0012] Optionally, before the step of emitting X-ray fluorescence and ultrasonic waves to the plate to be cut by the detection probe of the plate detection device and generating X-ray fluorescence detection results and ultrasonic detection results, the step further includes:

[0013] The detection probe of the plate detection device is moved to a position where the detection window on the detection probe is in contact with the plate to be cut.

[0014] Optionally, the step of moving the detection probe of the plate detection device to a position where the detection window on the detection probe is in contact with the plate to be cut includes:

[0015] Move the detection probe of the plate detection device toward the direction of the plate to be cut, and detect the first current capacitance in real time through the capacitance sensor on the detection probe;

[0016] When it is detected that the first current capacitance decreases to 0, the movement of the detection probe is stopped.

[0017] Optionally, the detection probe and the cutting head of the laser cutting device are arranged on a movable back plate, and the detection probe is slidably connected to the movable back plate;

[0018] Before the step of moving the detection probe of the plate detection device toward the plate to be cut and detecting the first current capacitance in real time by the capacitance sensor on the detection probe, the method further includes:

[0019] Moving the detection probe to a preset initial position so that the distance between the detection probe and the plate to be cut is greater than the distance between the cutting head and the plate to be cut;

[0020] Moving the movable back plate toward the plate to be cut, and detecting the second current capacitance in real time by the capacitance sensor on the cutting head;

[0021] When detecting that the second current capacitance decreases to 0, stopping moving the mobile backplate;

[0022] Moving the movable back plate away from the plate to be cut by a preset distance;

[0023] Compressed gas is blown toward the plate to be cut through the laser nozzle on the cutting head.

[0024] Optionally, the step of determining target process parameters for this laser cutting according to the actual thickness and the actual material includes:

[0025] According to the actual thickness and the actual material, corresponding target process parameters are matched from a preset database, wherein the target process parameters include a target focal length, a target laser nozzle model, and a target auxiliary gas.

[0026] The present application also provides an electronic device, which is a physical device, and includes: a memory, a processor, and a program of the laser cutting method stored in the memory and runnable on the processor. When the program of the laser cutting method is executed by the processor, the steps of the laser cutting method as described above can be implemented.

[0027] The present application also provides a laser cutting system, which includes a laser cutting device, a plate detection device, and the electronic device as described above, wherein:

[0028] The plate detection device is used to detect the actual thickness and actual material of the plate to be cut;

[0029] The laser cutting device is used to perform laser cutting on the plate to be cut.

[0030] Optionally, the plate detection device includes a detection probe and a capacitive sensor, and the detection probe includes an ultrasonic detection module and an X-ray fluorescence detection module;

[0031] Wherein, the ultrasonic detection module is used to detect the actual thickness of the plate to be cut;

[0032] The X-ray fluorescence detection module is used to detect the actual material of the plate to be cut;

[0033] The capacitive sensor is provided on the detection probe of the plate detection device and is used to detect the distance between the detection probe and the plate to be detected.

[0034] The present application also provides a storage medium, which is a computer-readable storage medium. The computer-readable storage medium stores a program for implementing the laser cutting method. When the program of the laser cutting method is executed by a processor, the steps of the laser cutting method as described above are implemented.

[0035] The present application provides a laser cutting method, electronic device, system and storage medium, which realize accurate determination of the actual thickness and actual material of the plate to be cut before laser cutting by detecting the actual thickness and actual material of the plate to be cut, and then, if it is determined that the actual material matches the preset target material, and the actual thickness matches the preset target thickness, the target process parameters of this laser cutting are determined according to the actual thickness and the actual material, and the plate to be cut is laser cut according to the target process parameters, thereby realizing confirmation of whether the actual material and actual thickness of the plate to be cut meet the expected requirements. Only when the actual material matches the preset target material and the actual thickness matches the preset target thickness, the corresponding process parameters are further automatically matched and the plate to be cut is laser cut. Compared with the method of manual observation and manual debugging, on the one hand, the present application can effectively reduce the errors caused by manual judgment through automatic detection and confirmation of actual thickness and actual material, avoiding the situation where the entire batch has to be reprocessed due to incorrect selection of the plate to be cut due to manual judgment errors. On the other hand, after automatically matching the corresponding process parameters according to the actual thickness and actual material, laser cutting processing can be carried out directly, effectively saving the steps and time of repeated process parameter debugging, and overcoming the technical problem of long process parameter debugging time in the existing laser cutting technology. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0037] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0038] Figure 1 This is a schematic flow chart of an embodiment of the laser cutting method of the present application;

[0039] Figure 2 This is a schematic structural diagram of a possible implementation method of the movable backplane in the embodiment of the present application;

[0040] Figure 3 Schematic diagram of the equipment structure of the hardware operating environment involved in the laser cutting method in the embodiment of the present application;

[0041] Figure 4 Schematic diagram of the structure of an embodiment of the laser cutting system in this application.

[0042] Description of Figure Numbers:

[0043] Label name Label name 10 Plate detection device 11 Detection probe 12 Detection Window 20 Laser cutting device 21 cutting head 22 Laser nozzle 30 track 40 Mobile backplane 50 electronic devices

[0044] The purpose, features and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0045] To make the above-mentioned objects, features, and advantages of the present invention more clearly understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts shall fall within the scope of protection of the present invention.

[0046] Laser cutting is the most important application technology in the laser processing industry, accounting for more than 70% of the entire laser processing industry. Laser cutting is currently the world's most advanced cutting process. Due to its advantages of precision manufacturing, flexible cutting, special-shaped processing, one-time forming, fast speed and high efficiency, it has solved many problems in industrial production that cannot be solved by conventional methods. Laser can cut most metal materials.

[0047] However, currently, most laser cutting process parameters are determined by manually observing the sheet material to be cut and conducting trial cuts based on experience. The process parameters are then adjusted based on the test cut results, and the final determination is made through repeated debugging, which takes a long time. Furthermore, when adjusting the process parameters, basic information about the sheet material to be cut is usually confirmed by visual observation or rough measurement. For example, manual calipers are used to measure the sheet material's thickness, and label information is used to check the sheet material's components and model numbers. Manual thickness measurements can have large errors, and since the sheet material's components, model numbers, and other information are numerous and vary slightly, manual observation is prone to errors. Therefore, errors are often discovered only after the cutting is complete and during bending or other processing, resulting in the scrapping of an entire batch of materials and a waste of time and resources.

[0048] Based on this, the present application proposes a laser cutting method, electronic device, system and storage medium, which realizes accurate determination of the actual thickness and actual material of the plate to be cut before laser cutting by detecting the actual thickness and actual material of the plate to be cut. Then, if it is determined that the actual material matches the preset target material, and the actual thickness matches the preset target thickness, the target process parameters of this laser cutting are determined according to the actual thickness and the actual material, and the plate to be cut is laser cut according to the target process parameters, thereby realizing confirmation of whether the actual material and actual thickness of the plate to be cut meet the expected requirements. Only when the actual material matches the preset target material and the actual thickness matches the preset target thickness, the corresponding process parameters are further automatically matched, and the plate to be cut is laser cut. Before laser cutting, the present application can accurately determine the actual thickness and actual material of the plate to be cut. If the actual material and the actual material are different from the predetermined one, it can be discovered and processed in time. If the actual material and the actual material are the same as the predetermined one, subsequent operations will be performed. Compared with manual observation and manual debugging, on the one hand, the present application can effectively reduce the errors caused by manual judgment through automatic detection and confirmation of the actual thickness and actual material, and avoid the situation where the plate to be cut itself is incorrectly selected due to manual judgment errors, which in turn leads to the reprocessing of the entire batch. On the other hand, after automatically matching the corresponding process parameters according to the actual thickness and actual material, laser cutting processing can be carried out directly, which effectively saves the steps and time of repeated process parameter debugging, and overcomes the technical problem of long process parameter debugging time for laser cutting in the prior art.

[0049] The present application provides a laser cutting method. In one embodiment of the laser cutting method of the present application, referring to Figure 1 , the laser cutting method comprises the following steps:

[0050] Step S10, detecting the actual material and actual thickness of the plate to be cut;

[0051] In this embodiment, it should be noted that the laser cutting method is applied to a laser cutting system, which at least includes a laser cutting device, a plate detection device and an electronic device. The laser cutting device and the plate detection device are respectively connected to the electronic device for communication, and the communication connection method includes a wireless communication connection or a wired communication connection. In an implementable method, the laser cutting device and the plate detection device are respectively connected to the electronic device through optical fibers for data transmission. Among them, the plate detection device is used to detect the actual thickness and actual material of the plate to be cut. The plate detection device at least includes a detection probe, and the detection probe at least includes a thickness detection module and a material detection module. The thickness detection module can be an ultrasonic detection module, a laser detection module, an X-ray detection module, etc. The material detection module can be an X-ray fluorescence detection module, etc. The detection device can also include a capacitive sensor, which is arranged on the detection probe to detect the distance between the detection probe and the plate to be detected; the laser cutting device is used to perform laser cutting on the plate to be cut, and at least includes a cutting head. A laser nozzle installation position is provided on the cutting head, and different models of laser nozzles can be installed or removed according to actual needs. The laser nozzle is used to emit laser to cut the plate to be cut.

[0052] The laser nozzle can be perpendicular to the plate to be cut, or it can be at any desired angle to the plate to be cut. For the sake of convenience, the following description will assume that the laser nozzle is perpendicular to the plate to be cut. If the laser nozzle is at a certain angle to the plate to be cut, the process parameters can be adjusted accordingly through angle conversion, and this embodiment does not impose any restrictions on this.

[0053] The plate to be cut refers to a metal plate, and the material refers to the type of metal plate determined according to the composition of the metal plate. Metal plates are divided into various types according to their specific components, such as stainless steel, carbon steel, aluminum alloy, brass, copper alloy, etc., and each type can be further subdivided. For example, stainless steel can be divided into austenitic stainless steel (which can be divided into 201, 202, 301, 304, 309, 309S, 310, 310S, 316, 316L, 317, 317L, 321, 347, 409, etc. according to material number), super austenitic stainless steel (which can be divided into 904L, 254SMo, etc. according to material number), martensitic stainless steel (which can be divided into 410, 420, 431, etc. according to material number), etc. Different types of metals may need to set the same or different process parameters when performing laser cutting.

[0054] Specifically, the actual thickness of the plate to be cut is detected by the thickness detection module in the laser cutting system, and the actual material of the plate to be cut is detected by the material detection module in the laser cutting system, wherein the thickness detection module can be an existing thickness detection instrument, and the material detection module can be an existing material detection instrument. The specific detection method is similar to the existing technology and will not be elaborated here.

[0055] Optionally, the step of detecting the actual material and actual thickness of the plate to be cut includes:

[0056] Step S11, emitting X-ray fluorescence and ultrasonic waves to the plate to be cut by a detection probe of the plate detection device, and generating X-ray fluorescence detection results and ultrasonic detection results;

[0057] In this embodiment, specifically, X-ray fluorescence and ultrasonic waves are emitted to the plate to be cut by the detection probe of the plate detection device, and the attenuation of the intensity of the X-ray fluorescence after passing through the plate to be cut is detected by the detection probe, thereby determining the components in the plate to be cut and generating an X-ray fluorescence detection result. The detection probe also detects the time elapsed between the emission of the ultrasonic wave and the reception of the reflected ultrasonic wave to generate an ultrasonic detection result. The method of performing X-ray fluorescence detection and ultrasonic detection on the material to be cut by the detection probe is similar to the prior art and will not be repeated here.

[0058] Optionally, before the step of emitting X-ray fluorescence and ultrasonic waves to the plate to be cut by the detection probe of the plate detection device and generating X-ray fluorescence detection results and ultrasonic detection results, the step further includes:

[0059] The detection probe of the plate detection device is moved to a position where the detection window on the detection probe is in contact with the plate to be cut.

[0060] In this embodiment, specifically, the detection probe of the plate detection device is moved toward the plate to be cut until the detection window on the detection probe is just in contact with the plate to be cut, and then the movement of the detection probe is stopped. The movement speed of the detection probe can be a preset slow speed to prevent the detection window from colliding with the plate to be cut and causing wear or damage. The preset slow speed can be set according to actual conditions. The movement speed of the detection probe can also be adjusted according to the distance between the detection probe and the plate to be cut. For example, the movement speed can be proportional to the distance between the detection probe and the plate to be cut, or different distance ranges can be preset, each distance range corresponding to a different movement speed, and the smaller the distance, the slower the movement speed. For example, when the distance is 0, v is 0; when the distance is in the range of a1-a2, the movement speed is v1; when the distance is in the range of a2-a3, the movement speed is v2; when the distance is greater than a2, the movement speed is v3, wherein a1 is less than a2 less than a3, and v1 is less than v2 less than v3.

[0061] Optionally, the step of moving the detection probe of the plate detection device to a position where the detection window on the detection probe is in contact with the plate to be cut includes:

[0062] Step A10: moving the detection probe of the plate detection device toward the plate to be cut, and detecting a first current capacitance in real time using a capacitance sensor on the detection probe;

[0063] Step A20: When it is detected that the first current capacitance decreases to 0, stop moving the detection probe.

[0064] In this embodiment, it should be noted that a capacitive sensor is provided on the detection probe of the plate detection device, and the position of the capacitive sensor is on the same horizontal plane as the position of the detection window of the detection probe. The capacitive sensor can measure the capacitance value between the capacitive sensor and the plate to be cut, that is, the capacitance value between the detection window and the plate to be cut can be measured. The closer the capacitive sensor is to the plate to be cut, the larger the capacitance value is. However, when the capacitive sensor contacts the plate to be cut, the capacitance value becomes 0.

[0065] Specifically, the detection probe of the plate detection device is moved toward the direction of the plate to be cut, and the first current capacitance is detected in real time by the capacitive sensor on the detection probe. As the distance between the detection probe and the plate to be detected becomes smaller and smaller, the capacitance becomes larger and larger. When the detection probe contacts the plate to be detected, the capacitance becomes 0. Therefore, when it is detected that the first current capacitance is reduced to 0, the movement of the detection probe is immediately stopped.

[0066] In one practicable manner, after the step of moving the detection probe of the plate detection device toward the plate to be cut and detecting the first current capacitance in real time through the capacitive sensor on the detection probe, it may also include: determining the moving speed of the detection probe based on the first current capacitance, the moving speed may be inversely proportional to the first current capacitance, or different capacitance value ranges may be preset, each capacitance value range corresponding to a different moving speed, the larger the capacitance value, the slower the moving speed, for example, when the capacitance is 0, v is 0, when the capacitance is greater than b3, the moving speed is v4, when the distance is in the range of b2 to b3, the moving speed is v5, and when the capacitance is in the range of b1 to b2, the moving speed is v6, wherein b1 is less than b2 less than b3, and v4 is less than v5 less than v6.

[0067] Optionally, the detection probe and the cutting head of the laser cutting device are arranged on a movable back plate, and the detection probe is slidably connected to the movable back plate;

[0068] Before the step of moving the detection probe of the plate detection device toward the plate to be cut and detecting the first current capacitance in real time by the capacitance sensor on the detection probe, the method further includes:

[0069] Step B10, moving the detection probe to a preset initial position so that the distance between the detection probe and the plate to be cut is greater than the distance between the cutting head and the plate to be cut;

[0070] In this embodiment, it should be noted that the detection probe and the cutting head of the laser cutting device are arranged on the movable backplane, wherein the cutting head is fixed on the movable backplane and moves with the movable backplane, and the detection probe is slidingly connected to the movable backplane and can either move with the movable backplane or move relative to the movable backplane.

[0071] In one practicable manner, referring to Figure 2 , Figure 2 The movable back plate 40 is slidably connected to a vertical axis through a sliding track 30, and can move up and down along the vertical axis. A cutting head 21 is fixed on the movable back plate 40, and a laser nozzle 22 is installed at the lower part of the cutting head 21. The laser nozzle 22 can emit laser vertically downward to laser cut the plate to be cut below the laser nozzle 22. The cutting head 11 is slidably connected to the movable back plate 40 through the sliding track 30, and can move up and down along the vertical axis. A detection window 12 is provided at the lower part of the cutting head. When the detection window 12 is in contact with the plate to be cut, X-ray fluorescence and / or ultrasound can be emitted through the detection window 12 to detect the actual thickness and actual material of the plate to be cut.

[0072] The distance between the detection probe and the plate to be cut refers to the minimum distance between the detection probe and the plate to be cut. Normally, the detection window on the detection probe is parallel to the plate to be cut and the distance between the detection window and the plate to be cut is the minimum. In this case, the distance between the detection window and the plate to be cut can be used as the distance between the detection probe and the plate to be cut. The distance between the cutting head and the plate to be cut refers to the minimum distance between the cutting head and the plate to be cut. Normally, the distance between the nozzle outlet of the laser nozzle on the cutting head and the plate to be cut is the minimum. In this case, the distance between the nozzle outlet of the laser nozzle and the plate to be cut can be used as the distance between the cutting head and the plate to be cut.

[0073] Specifically, the detection probe can be moved to a preset initial position at any time when the detection probe is not needed for detection, for example, after each detection is completed, after the program is completed, or when the program is initialized, so that the distance between the detection probe and the plate to be cut is greater than the distance between the cutting head and the plate to be cut, so as to avoid the detection probe and the plate to be cut from colliding when the movable backplate moves.

[0074] Step B20, moving the movable back plate toward the plate to be cut, and detecting a second current capacitance in real time by a capacitance sensor on the cutting head;

[0075] Step B30: when it is detected that the second current capacitance decreases to 0, stop moving the movable backplate;

[0076] In this embodiment, specifically, the movable backplane is moved toward the direction of the plate to be cut, and the second current capacitance is detected in real time by the capacitive sensor on the cutting head. As the distance between the cutting head and the plate to be cut becomes smaller and smaller, the capacitance becomes larger and larger. When the cutting head contacts the plate to be cut, the capacitance becomes 0. Therefore, when it is detected that the second current capacitance is reduced to 0, the movement of the movable backplane is stopped.

[0077] Step B40, moving the movable back plate a preset distance away from the plate to be cut;

[0078] Step B50: blowing compressed gas toward the plate to be cut through the laser nozzle on the cutting head.

[0079] In this embodiment, specifically, when it is detected that the first current capacitance is reduced to 0, it indicates that the cutting head is in contact with the plate to be cut. At this time, the movable back plate is moved a preset distance away from the plate to be cut, for example, lifted by 20 mm, etc., and compressed gas is blown toward the plate to be cut through the laser nozzle on the cutting head to blow away metal debris and floating on the surface of the plate to be cut, thereby reducing the wear of the detection window during subsequent detection of the plate to be cut. In one feasible method, the compressed gas is compressed air.

[0080] Step S12: determining the actual material of the plate to be cut according to the X-ray fluorescence detection result, and determining the actual thickness of the plate to be cut according to the ultrasonic detection result.

[0081] In this embodiment, specifically, the X-ray fluorescence detection result includes the various components and their contents in the plate to be cut. By querying the preset mapping relationship between the material and the component, the actual material corresponding to the X-ray fluorescence detection result can be determined. The ultrasonic detection result includes the time elapsed between the emission of the ultrasonic wave and the reception of the reflected ultrasonic wave. The distance traveled by the ultrasonic wave can be calculated based on the sound speed and time, and the thickness of the material to be cut can be determined. The sound speed can be preset to a fixed value, or the actual sound speed corresponding to the actual material can be determined by querying the preset mapping relationship between the material and the sound speed based on the actual material determined by the X-ray fluorescence detection result.

[0082] Step S20: If it is determined that the actual material matches the preset target material, and the actual thickness matches the preset target thickness, then target process parameters for this laser cutting are determined based on the actual thickness and the actual material.

[0083] In this embodiment, it should be noted that the process parameters refer to the process parameters required to be determined for laser cutting, including focal length, laser nozzle model, auxiliary gas type, laser movement speed, laser power, laser movement path, etc. After the process parameters are input into the laser cutting device, the laser cutting device can automatically adjust and process according to the process parameters.

[0084] Specifically, it is determined whether the actual material matches the preset target material, and whether the actual thickness matches the preset target thickness, wherein whether the actual thickness matches the preset target thickness means that the actual thickness is the same as the preset target thickness, or the difference between the actual thickness and the preset target thickness is within a preset error value range.

[0085] If it is determined that the actual material does not match the preset target material, and / or the actual thickness does not match the preset target thickness, the laser cutting method process can be terminated, and a prompt message can be output to remind relevant personnel to deal with it in time. The prompt message can also include relevant information about the actual material and actual thickness detected, so that relevant personnel can confirm whether it is a detection error and deal with it in time.

[0086] If it is determined that the actual material matches the preset target material, and the actual thickness matches the preset target thickness, target process parameters for this laser cutting are determined based on the actual thickness and the actual material. The target process parameters for this laser cutting can be determined based on the actual thickness and the actual material by inputting the actual thickness and the actual material into a preset prediction model for prediction to obtain the laser cutting process parameters.

[0087] Optionally, the step of determining target process parameters for this laser cutting according to the actual thickness and the actual material includes:

[0088] According to the actual thickness and the actual material, corresponding target process parameters are matched from a preset database, wherein the target process parameters include a target focal length, a target laser nozzle model, and a target auxiliary gas.

[0089] In this embodiment, it should be noted that the database stores process parameters for metal materials of different materials and thicknesses, which can be set in advance based on big data or historical debugging results. The focal length, laser nozzle model and auxiliary gas type required for laser cutting can be determined by the actual thickness and the actual material. The auxiliary gas types include air, nitrogen, oxygen, etc. The diameters and shapes of laser nozzles of different models may be different. When actually performing laser cutting, other process parameters required for laser cutting can also be determined by other means, for example, obtaining process parameters manually input by the user, etc. This embodiment does not limit this.

[0090] Specifically, according to the mapping relationship between the preset material and thickness and the process parameters, a search is performed in the preset database, and the target process parameters that match the actual thickness and the actual material are determined from the process parameters in the preset database, wherein the target process parameters include the target focal length, the target laser nozzle model and the target auxiliary gas.

[0091] Step S30 , laser cutting the plate to be cut according to the target process parameters.

[0092] In this embodiment, specifically, the laser cutting device is adjusted according to the target process parameters, so that the laser cutting device performs laser cutting on the plate to be cut based on the target process parameters.

[0093] In one practicable manner, the target process parameters include a target focal length, and the step of adjusting the laser cutting device according to the target process parameters includes: focusing based on the target focal length by an automatic focusing unit on the laser cutting device.

[0094] In one practicable manner, the target process parameters include a target laser nozzle model, and the step of adjusting the laser cutting device according to the target process parameters includes: determining a target nozzle position of the target laser nozzle in a preset nozzle placement area based on the target laser nozzle model, moving the cutting head of the laser cutting device to the target nozzle position, and installing the target nozzle to a laser nozzle mounting position set on the cutting head by means of a robot, pressure, or movement. In a real-time manner, before the step of moving the cutting head of the laser cutting device to the target nozzle position, if it is detected that a laser nozzle is already installed in the laser nozzle mounting position, then determining the vacant nozzle position of the installed laser nozzle in the preset nozzle placement area, moving the cutting head of the laser cutting device to the vacant nozzle position, and removing the installed laser nozzle from the laser nozzle mounting position and placing it in the vacant nozzle position by means of a robot, pulling force, or movement.

[0095] In one feasible embodiment, the target process parameters include a target auxiliary gas, and the step of adjusting the laser cutting device according to the target process parameters includes: switching the connection method of the gas pipeline in the laser cutting device according to the target auxiliary gas so that the storage device of the target auxiliary gas is connected to the auxiliary gas injection pipeline.

[0096] In this embodiment, by detecting the actual thickness and actual material of the plate to be cut, the actual thickness and actual material of the plate to be cut are accurately determined before laser cutting. If it is determined that the actual material matches the preset target material and the actual thickness matches the preset target thickness, the target process parameters of this laser cutting are determined according to the actual thickness and the actual material. The plate to be cut is laser cut according to the target process parameters, thereby confirming whether the actual material and actual thickness of the plate to be cut meet the expected requirements. Only when the actual material matches the preset target material and the actual thickness matches the preset target thickness, the corresponding process parameters are further automatically matched and the plate to be cut is laser cut. Compared with the method of manual observation and manual debugging, on the one hand, the present application can effectively reduce the errors caused by manual judgment through automatic detection and confirmation of actual thickness and actual material, avoiding the situation where the entire batch has to be reprocessed due to incorrect selection of the plate to be cut due to manual judgment errors. On the other hand, after automatically matching the corresponding process parameters according to the actual thickness and actual material, laser cutting processing can be carried out directly, effectively saving the steps and time of repeated process parameter debugging, and overcoming the technical problem of long process parameter debugging time in the existing laser cutting technology.

[0097] Furthermore, an embodiment of the present invention provides an electronic device, which includes: at least one processor; and a memory communicatively connected to the at least one processor; wherein the memory stores instructions that can be executed by the at least one processor, and the instructions are executed by the at least one processor so that the at least one processor can execute the laser cutting method in the above embodiment.

[0098] Reference below Figure 3 , which shows a schematic diagram of the structure of an electronic device suitable for implementing the embodiments of the present disclosure. The electronic devices in the embodiments of the present disclosure may include, but are not limited to, mobile terminals such as mobile phones, laptop computers, digital broadcast receivers, PDAs (personal digital assistants), PADs (tablet computers), PMPs (portable multimedia players), in-vehicle terminals (e.g., in-vehicle navigation terminals), and fixed terminals such as digital TVs and desktop computers. Figure 3 The electronic device shown is only an example and should not limit the functions and scope of use of the embodiments of the present disclosure.

[0099] like Figure 3As shown, the electronic device may include a processing device (such as a central processing unit, a graphics processing unit, etc.), which can perform various appropriate actions and processes according to a program stored in a read-only memory (ROM) or a program loaded from a storage device into a random access memory (RAM). In the RAM, various programs and data required for the operation of the electronic device are also stored. The processing device, ROM, and RAM are connected to each other via a bus. An input / output (I / O) interface is also connected to the bus.

[0100] Typically, the following systems can be connected to the I / O interface: input devices such as a touch screen, touchpad, keyboard, mouse, image sensor, microphone, accelerometer, gyroscope, etc.; output devices such as a liquid crystal display (LCD), speaker, vibrator, etc.; storage devices such as a magnetic tape, hard disk, etc.; and communication devices. The communication device can allow the electronic device to communicate with other devices wirelessly or by wire to exchange data. Although the figures show electronic devices with various systems, it should be understood that it is not required to implement or have all of the systems shown. More or fewer systems may be implemented or have instead.

[0101] In particular, according to an embodiment of the present disclosure, the process described above with reference to the flowchart can be implemented as a computer software program. For example, an embodiment of the present disclosure includes a computer program product, which includes a computer program carried on a computer-readable medium, and the computer program includes program code for executing the method shown in the flowchart. In such an embodiment, the computer program can be downloaded and installed from a network via a communication device, or installed from a storage device, or installed from a ROM. When the computer program is executed by a processing device, the above-mentioned functions defined in the method of the embodiment of the present disclosure are performed.

[0102] The electronic device provided by the present invention utilizes the laser cutting method of the aforementioned embodiment, resolving the technical issue of the long process parameter adjustment time associated with conventional laser cutting. Compared to the prior art, the electronic device provided by the present invention achieves the same beneficial effects as the laser cutting method provided by the aforementioned embodiment. Other technical features of the electronic device are the same as those disclosed in the aforementioned embodiment and are not further detailed here.

[0103] It should be understood that various parts of the present disclosure can be implemented with hardware, software, firmware or a combination thereof. In the description of the above embodiments, specific features, structures, materials or characteristics can be combined in any one or more embodiments or examples in an appropriate manner.

[0104] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any modifications or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in the present invention should be included in the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be based on the scope of protection of the claims.

[0105] Further, refer to Figure 4 The present invention also provides a laser cutting system, which includes a laser cutting device 20, a plate detection device 10 and the electronic device 50 as described above, wherein:

[0106] The plate detection device 10 is used to detect the actual thickness and actual material of the plate to be cut;

[0107] The laser cutting device 20 is used to perform laser cutting on the plate to be cut.

[0108] In this embodiment, the laser cutting system includes at least a laser cutting device 20, a plate detection device 10 and an electronic device 50. The laser cutting device 20 and the plate detection device 10 are respectively connected to the electronic device 50 for communication. The communication connection method includes a wireless communication connection or a wired communication connection. In an operative method, the laser cutting device 20 and the plate detection device 10 are respectively connected to the electronic device 50 via optical fiber for data transmission. Among them, the plate detection device 10 is used to detect the actual thickness and actual material of the plate to be cut. The plate detection device 10 includes at least a detection probe, and the detection probe includes at least a thickness detection module and a material detection module. The thickness detection module can be an ultrasonic detection module, a laser detection module, an X-ray detection module, etc., and the material detection module can be an X-ray fluorescence detection module, etc. The detection device can also include a capacitive sensor, which is arranged on the detection probe to detect the distance between the detection probe and the plate to be detected; the laser cutting device 20 is used to perform laser cutting on the plate to be cut, and at least includes a cutting head. A laser nozzle installation position is provided on the cutting head, and different models of laser nozzles can be installed or removed according to actual needs. The laser nozzle is used to emit laser to cut the plate to be cut.

[0109] Optionally, the plate detection device 10 includes a detection probe and a capacitive sensor, and the detection probe includes an ultrasonic detection module and an X-ray fluorescence detection module;

[0110] Wherein, the ultrasonic detection module is used to detect the actual thickness of the plate to be cut;

[0111] The X-ray fluorescence detection module is used to detect the actual material of the plate to be cut;

[0112] The capacitive sensor is provided on the detection probe of the plate detection device 10 and is used to detect the distance between the detection probe and the plate to be detected.

[0113] The laser cutting system provided by this application solves the technical problem of long process parameter debugging time in conventional laser cutting. Compared with the prior art, the beneficial effects of the laser cutting equipment provided by the embodiment of the present invention are the same as those of the laser cutting method of the above embodiment, and will not be elaborated here.

[0114] Furthermore, this embodiment provides a computer-readable storage medium having computer-readable program instructions stored thereon, and the computer-readable program instructions are used to execute the laser cutting method in the above embodiment.

[0115] The computer-readable storage medium provided in the embodiment of the present invention can be, for example, a USB flash drive, but is not limited to electrical, magnetic, optical, electromagnetic, infrared, or semiconductor systems, systems or devices, or any combination thereof. More specific examples of computer-readable storage media can include, but are not limited to: an electrical connection with one or more wires, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination thereof. In this embodiment, the computer-readable storage medium can be any tangible medium that contains or stores a program that can be used by or in combination with an instruction execution system, system or device. The program code contained on the computer-readable storage medium can be transmitted using any appropriate medium, including but not limited to: wires, optical cables, RF (radio frequency), etc., or any suitable combination thereof.

[0116] The computer-readable storage medium may be included in the electronic device, or may exist independently without being incorporated into the electronic device.

[0117] The above-mentioned computer-readable storage medium carries one or more programs. When the above-mentioned one or more programs are executed by an electronic device, the electronic device: detects the actual material and actual thickness of the plate to be cut; if it is determined that the actual material matches the preset target material, and the actual thickness matches the preset target thickness, then determines the target process parameters of this laser cutting based on the actual thickness and the actual material; and laser cuts the plate to be cut according to the target process parameters.

[0118] Computer program code for performing the operations of the present disclosure may be written in one or more programming languages, or a combination thereof, including object-oriented programming languages such as Java, Smalltalk, C++, and conventional procedural programming languages such as "C" or similar programming languages. The program code may be executed entirely on the user's computer, partially on the user's computer, as a stand-alone software package, partially on the user's computer and partially on a remote computer, or entirely on the remote computer or server. In cases involving a remote computer, the remote computer may be connected to the user's computer through any type of network, including a local area network (LAN) or a wide area network (WAN), or may be connected to an external computer (e.g., through the Internet using an Internet service provider).

[0119] The flow charts and block diagrams in the accompanying drawings illustrate the possible implementation architecture, functions and operations of the system, method and computer program product according to various embodiments of the present invention. In this regard, each box in the flow chart or block diagram can represent a module, program segment, or a part of code, and the module, program segment, or a part of code contains one or more executable instructions for realizing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the box can also occur in a different order than that marked in the accompanying drawings. For example, two boxes represented in succession can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram and / or flow chart, and the combination of the boxes in the block diagram and / or flow chart, can be implemented with a dedicated hardware-based system that performs the specified function or operation, or can be implemented with a combination of dedicated hardware and computer instructions.

[0120] The modules involved in the embodiments described in this disclosure may be implemented in software or hardware, wherein the name of a module does not necessarily limit the unit itself.

[0121] The computer-readable storage medium provided by the present invention stores computer-readable program instructions for executing the aforementioned laser cutting method, resolving the technical issue of the long time required to debug process parameters in conventional laser cutting techniques. Compared to the prior art, the beneficial effects of the computer-readable storage medium provided by the present invention are similar to those of the laser cutting method provided by the aforementioned embodiment and are not further elaborated here.

[0122] Furthermore, the present application also provides a computer program product, comprising a computer program, which implements the steps of the laser cutting method as described above when executed by a processor.

[0123] The computer program product provided in this application solves the technical problem of the long debugging time of process parameters in laser cutting in the prior art. Compared with the prior art, the beneficial effects of the computer program product provided by the embodiment of the present invention are the same as the beneficial effects of the laser cutting method provided by the above embodiment, and will not be repeated here.

[0124] The above are only preferred embodiments of the present application and do not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent processing scope of the present application.

Claims

1. A laser cutting method, characterized in that: The laser cutting method comprises the following steps: Moving a detection probe of a plate detection device to a preset initial position so that the distance between the detection probe and the plate to be cut is greater than the distance between the cutting head of a laser cutting device and the plate to be cut, wherein the detection probe and the cutting head are disposed on a movable back plate and are slidably connected to the movable back plate, and the plate to be cut is a metal plate; Moving the movable back plate toward the plate to be cut, and detecting the second current capacitance in real time by the capacitance sensor on the cutting head; When detecting that the second current capacitance decreases to 0, stopping moving the mobile backplate; Moving the movable back plate away from the plate to be cut by a preset distance; Blowing compressed gas toward the plate to be cut through the laser nozzle on the cutting head; Move the detection probe to a position where the detection window on the detection probe is aligned with the plate to be cut, wherein the moving speed of the detection probe is proportional to the distance between the detection probe and the plate to be cut, or different distance ranges are preset, each distance range corresponding to a different moving speed, and the smaller the distance, the slower the moving speed; Detect the actual material and thickness of the plate to be cut; If it is determined that the actual material matches the preset target material, and the actual thickness matches the preset target thickness, then the target process parameters for this laser cutting are determined based on the actual thickness and the actual material; Laser cutting the plate to be cut according to the target process parameters; The step of detecting the actual material and actual thickness of the plate to be cut includes: The detection probe of the plate detection device emits X-ray fluorescence and ultrasonic waves to the plate to be cut, generating X-ray fluorescence detection results and ultrasonic detection results; The actual material of the plate to be cut is determined according to the X-ray fluorescence detection result, and the actual thickness of the plate to be cut is determined according to the ultrasonic detection result.

2. The laser cutting method according to claim 1, wherein: The step of moving the detection probe of the plate detection device to a position where the detection window on the detection probe is in contact with the plate to be cut comprises: Move the detection probe of the plate detection device toward the direction of the plate to be cut, and detect the first current capacitance in real time through the capacitance sensor on the detection probe; When it is detected that the first current capacitance decreases to 0, the movement of the detection probe is stopped.

3. The laser cutting method according to claim 1, wherein: The step of determining target process parameters for this laser cutting according to the actual thickness and the actual material includes: According to the actual thickness and the actual material, corresponding target process parameters are matched from a preset database, wherein the target process parameters include a target focal length, a target laser nozzle model, and a target auxiliary gas.

4. An electronic device, characterized in that: The electronic device comprises: at least one processor; and, a memory communicatively connected to the at least one processor; wherein, The memory stores instructions that can be executed by the at least one processor. The instructions are executed by the at least one processor to enable the at least one processor to perform the steps of the laser cutting method according to any one of claims 1 to 3.

5. A laser cutting system, characterized in that: The laser cutting system comprises a laser cutting device, a plate detection device and the electronic device according to claim 4, wherein: The plate detection device is used to detect the actual thickness and actual material of the plate to be cut; The laser cutting device is used to perform laser cutting on the plate to be cut.

6. The laser cutting system according to claim 5, wherein: The plate detection device includes a detection probe and a capacitive sensor, and the detection probe includes an ultrasonic detection module and an X-ray fluorescence detection module; Wherein, the ultrasonic detection module is used to detect the actual thickness of the plate to be cut; The X-ray fluorescence detection module is used to detect the actual material of the plate to be cut; The capacitive sensor is provided on the detection probe of the plate detection device and is used to detect the distance between the detection probe and the plate to be cut.

7. A storage medium, characterized in that: The storage medium is a computer-readable storage medium, on which a program for implementing the laser cutting method is stored. The program for implementing the laser cutting method is executed by a processor to implement the steps of the laser cutting method according to any one of claims 1 to 3.

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