A method of sandblasting cleaning

Abstract

The application discloses a sand blasting cleaning method, which comprises the following steps: providing a substrate and sand particles; chemically modifying the sand particles to form charged sand particles; performing sand blasting treatment on the substrate by using the charged sand particles; and applying an electric field to the substrate containing the charged sand particles after sand blasting, so that the charged sand particles are repelled and then fall off. The method is simple in operation, convenient in sand particle cleaning and recycling, and less in influence on the substrate. Compared with polishing sand blasting, the method does not cause sand particle residues on the surface of the substrate, and does not cause secondary pollution to the substrate. Compared with laser polishing, the method can uniformly treat the substrate to be cleaned, and avoids damage to the substrate caused by local high-temperature treatment.

Description

Technical Field

[0001] This invention relates to the field of semiconductors, and more specifically to a sandblasting cleaning method. Background Technology

[0002] Yttrium-based coatings, such as Y₂O₃, are frequently coated or grown on semiconductor components. Since the roughness of the substrate used for semiconductor components directly affects important parameters such as coating thickness and surface morphology, sandblasting and polishing are used to control the substrate roughness before coating or growing the yttrium-based coating. However, the substrate material is usually a metal, such as aluminum. During sandblasting, some alumina, zirconium oxide, and other abrasive particles embedded in the soft aluminum substrate are difficult to remove through cleaning, leading to substrate contamination and affecting subsequent yttrium-based coating application or growth. Summary of the Invention

[0003] The purpose of this invention is to remove sand particles embedded in a substrate that are difficult to remove by cleaning.

[0004] To achieve the above objectives, the present invention provides a sandblasting cleaning method, comprising:

[0005] Provide a substrate and sand;

[0006] The sand grains are chemically modified to form charged sand grains;

[0007] The substrate is sandblasted using the charged abrasive grains.

[0008] An electric field is applied to the substrate containing the charged sand particles after sandblasting, causing the charged sand particles to be repelled and fall off.

[0009] Optionally, the charged sand particles are repelled and detached, which includes placing the sandblasted substrate in an electrostatic field.

[0010] Optionally, the charged sand particles are repelled and detached, including energizing one electrode of the electrolytic cell using the sandblasted substrate as an example.

[0011] Optionally, the method includes applying current to the sandblasted substrate as the cathode and graphite as the anode, placing the sandblasted substrate and graphite in an electrolyte, and applying a voltage.

[0012] Optionally, the electrolyte is water as a medium, and the medium contains at least sodium chloride and / or potassium chloride.

[0013] Optionally, a voltage of 5V or higher is applied to the electrolyte.

[0014] Optionally, a voltage is applied to the electrolyte for more than half an hour.

[0015] Optionally, the sand grains can be charged by immersing them in a solution containing anions or cations.

[0016] Optionally, in the solution containing anions, the solute is at least one of polyacrylamide, sodium alkyl sulfonate, and sodium secondary alkyl sulfate; in the solution containing cations, the solute is at least one of alkyl trimethylammonium salt, dialkyl dimethylammonium salt, and alkyl dimethyl benzylammonium salt.

[0017] Optionally, the hardness of the sand particles is greater than the hardness of the substrate.

[0018] Optionally, the substrate is at least one of metal, metal alloy or ceramic material.

[0019] Optionally, the substrate is a component of a plasma treatment device, which includes at least one of the following: a ceramic plate, an inner liner, a gas nozzle, a gas distribution plate, a gas pipe flange, an electrostatic chuck assembly, a cover ring, an insulating ring, a focusing ring, a gas spray head, an upper grounding ring, a moving ring, a gas buffer plate, a lower grounding ring, or a plasma confinement device.

[0020] Optionally, the sand particles contain at least alumina and / or zirconium oxide.

[0021] The beneficial effects of this invention are as follows:

[0022] This invention first modifies the surface of abrasive particles, then treats the substrate with the modified abrasive particles, and finally removes the abrasive particles from the substrate surface using an electric field. This method is simple to operate, facilitates the cleaning and recycling of abrasive particles, and has minimal impact on the substrate. Compared to polishing and sandblasting, this method leaves no abrasive particles on the substrate surface, preventing secondary contamination. Compared to laser polishing, this method can uniformly treat the substrate to be cleaned, avoiding damage caused by localized high-temperature treatment. Attached Figure Description

[0023] Figure 1 The flowchart of the sandblasting cleaning method provided by the present invention.

[0024] Figure 2 This is a schematic diagram of charged sand grains provided by the present invention.

[0025] Figure 3 This is a schematic diagram of the electrolytic cell in Embodiment 1 of the present invention.

[0026] Figure 4 This is a scanning electron microscope image of the substrate after cleaning by the method of Embodiment 1 of the present invention.

[0027] Figure 5 This is a comparative scanning electron microscope image of the substrate after treatment with uncharged sand particles, based on Example 1.

[0028] Figure 6 This is a comparison chart of the residual sand content in Example 1 and Comparative Example 1 of the present invention.

[0029] Figure 7 This is a schematic diagram of the electrostatic field in Embodiment 2 of the present invention.

[0030] In the figure, 1-charged sand grains, 2-ionic groups, 3-substrate, 4-anode, 5-electrolyte, 6-unmodified sand grains, 7-positive electrode. Detailed Implementation

[0031] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0032] In the description of this invention, it should be noted that the terms "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0033] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0034] Because sand particles are harder than the substrate, they are often used to sandblast the substrate surface to facilitate subsequent growth or coating. During sandblasting, hard sand particles may become embedded in the soft substrate. Current technology typically uses cleaning to remove these particles. However, some deeply embedded or small-sized sand particles remain, making cleaning difficult and causing substrate contamination. Alternatively, due to the difference in expansion coefficients between sand particles and coatings, residual sand particles on the substrate can lead to weak adhesion and easy coating peeling.

[0035] The technical concept of this invention is as follows: First, the sand particles are pretreated to adjust their chemical state so that they are charged. After the sandblasting process is completed, the charged sand particles are removed from the substrate surface by electrostatic force through the action of an electric field, so as to obtain a clean and uncontaminated substrate.

[0036] like Figure 1 As shown, the present invention provides a sandblasting cleaning method, comprising:

[0037] S1 provides a substrate and abrasive particles.

[0038] The substrate is at least one of a metal, a metal alloy, or a ceramic material. Optionally, the substrate is an aluminum substrate.

[0039] In some embodiments, the substrate processed by the present invention is a component of a plasma treatment equipment, including: a ceramic plate, an inner liner, a gas nozzle, a gas distribution plate, a gas pipe flange, an electrostatic chuck assembly, a cover ring, an insulating ring, a focusing ring, a gas spray head, an upper grounding ring, a moving ring, a gas buffer plate, a lower grounding ring, or at least one of a plasma confinement device.

[0040] The sand particles contain at least alumina and / or zirconium oxide.

[0041] S2 is used to chemically modify sand particles, forming charged sand particles.

[0042] like Figure 2 As shown, before treating the substrate with sand particles, the sand particles are pretreated to obtain charged sand particles 1. In some embodiments, the sand particles are impregnated in a solution containing anions or cations by an impregnation method, so that the sand particles are equipped with ionic groups 2, thereby giving the sand particles a negative or positive charge. Optionally, the solute in the solution containing anions is at least one of polyacrylamide, sodium alkyl sulfonate, and sodium secondary alkyl sulfate, and the solute in the solution containing cations is at least one of alkyl trimethylammonium salt, dialkyl dimethylammonium salt, and alkyl dimethyl benzylammonium salt.

[0043] S3 involves sandblasting the substrate with charged abrasive particles.

[0044] The hardness of abrasive particles is greater than that of the substrate. Using abrasive particles to treat the surface of the substrate can make the surface roughness meet the desired standard, which is beneficial to improving the subsequent coating process.

[0045] S4, apply an electric field to the substrate containing the charged sand particles after sandblasting, causing the charged sand particles to be repelled and fall off.

[0046] After sandblasting, some sand particles remain in the substrate and cannot be completely removed by conventional methods such as cleaning. Since the sand particles are charged during the pretreatment in step S2, for sand particles embedded in the soft substrate that cannot be removed by existing methods, the principle of "like charges repel" can be used to remove them from the substrate by applying an electric field.

[0047] In some embodiments, the sandblasted substrate is directly placed in an electrostatic field to cause the sand particles to fall off. For example, the direction of the electrostatic field is set so that the charged sand particles move in the direction of escaping the substrate surface until they are completely removed. The direction of the electrostatic field depends on the charge properties of the sand particles and the surface orientation of the substrate.

[0048] In some embodiments, the substrate is used as the negative or positive electrode of the electrolytic cell before energizing, causing the sand particles to detach. If the sand particles are impregnated with a solution containing cations in step S2, the substrate is used as the positive electrode of the electrolytic cell; if the sand particles are impregnated with a solution containing anions in step S2, the substrate is used as the negative electrode of the electrolytic cell. Optionally, the electrolyte is water as the medium, and the medium contains at least sodium chloride and / or potassium chloride. A voltage of 5V or higher is applied to the electrolyte and the voltage is continuously applied for at least half an hour.

[0049] Example 1

[0050] In this example, sand particles are impregnated with an anion-containing solution to impart a negative charge. An electrolytic cell is formed using the sandblasted substrate 3 as the cathode, graphite as the anode 4, and water as the electrolyte 5. Electricity is applied to this electrolytic cell to cause the sand particles to detach. In some embodiments, the anode 4 can be positioned on the left side of the substrate to remove sand particles from different surfaces of different substrates. In some embodiments, the sand particles can also be impregnated with a cation-containing solution to impart a positive charge, using the sandblasted substrate 3 as the anode, graphite as the cathode 4, and water as the electrolyte 5 to form the electrolytic cell.

[0051] S11 provides a substrate and abrasive particles.

[0052] The substrate is a gas spray head made of aluminum; the provided abrasive particles contain alumina and zirconium oxide. In some embodiments, the substrate may be an aluminum alloy or other metals and their alloys.

[0053] S12 is used to chemically modify sand particles, forming charged sand particles.

[0054] The sand grains are impregnated in a solution containing anions, giving them a negative charge. The solutes in the impregnation solution are polyacrylamide, sodium alkyl sulfonate, and sodium secondary alkyl sulfate.

[0055] S13, the substrate is sandblasted with charged abrasive particles.

[0056] The hardness of the sand particles is greater than that of the substrate, and the sand particles are used to treat the surface of the substrate 3.

[0057] S14, an electric field is applied to the substrate containing the charged sand particles after sandblasting, causing the charged sand particles to be repelled and fall off.

[0058] like Figure 3 As shown, using the sandblasted substrate 3 as the cathode and graphite as the anode 4, the sandblasted substrate and graphite were placed in the electrolyte 5, and a voltage was applied. The electrolyte 5 used water as a medium and contained sodium chloride and potassium chloride. A voltage of 5V or higher was applied to the electrolyte and maintained for at least half an hour. The cleaning results are as follows. Figure 4 As shown, the aluminum substrate cleaned using this method has almost no residual alumina particles.

[0059] Comparative Example 1

[0060] The effect of surface modification on cleaning sand particles was verified through comparative examples. The only difference between Comparative Example 1 and Example 1 is that the sand particles used in the comparative example were not surface-modified, i.e., step S12 in Example 1 was omitted. Figure 5 As shown, residual abrasive particles can still be observed in the aluminum substrate blasted with untreated abrasive particles (6). However, after cleaning using this method, as shown... Figure 4 As shown, under 1000x electron microscopy, the number of alumina particles embedded in the matrix was significantly reduced, approximately 1 / 7 of that observed in conventional sandblasting methods (e.g., ...). Figure 6 (As shown).

[0061] Example 2

[0062] In this example, the sand grains are impregnated with an anionic solution to impart a negative charge. The sandblasted substrate is then placed in an electrostatic field, causing the sand grains to detach. In some embodiments, the sand grains can also be impregnated with a cation-containing solution to impart a positive charge.

[0063] S21 provides a substrate and abrasive particles.

[0064] The substrate is an electrostatic chuck assembly made of aluminum; the provided abrasive particles contain alumina. In some embodiments, the substrate is an aluminum alloy, other metals and their alloys, or ceramic materials.

[0065] S22 is used to chemically modify sand particles, forming charged sand particles.

[0066] The sand grains are impregnated in a solution containing anions, giving them a negative charge. The solutes in the impregnation solution are polyacrylamide, sodium alkyl sulfonate, and sodium secondary alkyl sulfate.

[0067] S23, the substrate is sandblasted with charged abrasive particles.

[0068] The hardness of sand particles is greater than that of the substrate, and sand particles are used to treat the surface of the substrate.

[0069] S24, an electric field is applied to the substrate containing the charged sand particles after sandblasting, causing the charged sand particles to be repelled and fall off.

[0070] The sandblasted substrate is placed directly in an electrostatic field, and the electrostatic force causes the sand particles to fall off.

[0071] like Figure 7 As shown, the sandblasted substrate 3 is used as the negative electrode and the graphite is used as the positive electrode 7. The sandblasted substrate and graphite are placed in an electrostatic field and a voltage is applied. In some embodiments, the positive electrode 7 can be located on the left side of the substrate 3.

[0072] In summary, this invention provides a sandblasting cleaning method that first modifies the surface of sand particles to make them charge, then treats the substrate with the modified sand particles, and finally removes the sand particles from the substrate surface using an electric field. This method is simple to operate, facilitates the cleaning and recycling of sand particles, and has minimal impact on the substrate.

[0073] Although the present invention has been described in detail through the preferred embodiments above, it should be understood that the above description should not be considered as a limitation of the present invention. Various modifications and substitutions to the present invention will be apparent to those skilled in the art after reading the above description. Therefore, the scope of protection of the present invention should be defined by the appended claims.

Claims

1. A sandblasting cleaning method, characterized in that, include: Provide a substrate and sand; The sand grains are chemically modified to form charged sand grains; The substrate is sandblasted using the charged abrasive grains. Applying an electric field to a substrate containing the charged sand particles after sandblasting includes energizing one electrode of an electrolytic cell with the sandblasted substrate, causing the charged sand particles to be repelled and detached.

2. The cleaning method as described in claim 1, characterized in that, This involves using a sandblasted substrate as the cathode and applying electricity to it, with graphite as the anode, placing the sandblasted substrate and graphite in an electrolyte, and applying voltage.

3. The cleaning method as described in claim 2, characterized in that, The electrolyte is water as a medium, and the medium contains at least sodium chloride and / or potassium chloride.

4. The cleaning method as described in claim 2, characterized in that, A voltage of 5V or higher is applied to the electrolyte.

5. The cleaning method as described in claim 2, characterized in that, Apply voltage to the electrolyte for more than half an hour.

6. The cleaning method as described in claim 1, characterized in that, Imbuing sand grains with an electrical charge can be achieved by immersing them in a solution containing anions or cations.

7. The cleaning method as described in claim 6, characterized in that, In the solution containing anions, the solute is at least one of polyacrylamide, sodium alkyl sulfonate, and sodium secondary alkyl sulfate; in the solution containing cations, the solute is at least one of alkyl trimethylammonium salt, dialkyl dimethylammonium salt, and alkyl dimethyl benzylammonium salt.

8. The cleaning method as described in claim 1, characterized in that, The hardness of the sand particles is greater than the hardness of the substrate.

9. The cleaning method as described in claim 1, characterized in that, The substrate is at least one of metal, metal alloy or ceramic material.

10. The cleaning method as described in claim 9, characterized in that, The substrate is a component of a plasma treatment equipment, and the component includes at least one of the following: a ceramic plate, an inner liner, a gas nozzle, a gas distribution plate, a gas pipe flange, an electrostatic chuck assembly, a cover ring, an insulating ring, a focusing ring, a gas spray head, an upper grounding ring, a moving ring, a gas buffer plate, a lower grounding ring, or a plasma confinement device.

11. The cleaning method as described in claim 1, characterized in that, The sand particles contain at least alumina and / or zirconium oxide.

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