A conveying mechanism and loading / unloading method based on silicon wafer pitch adjustment

Abstract

The present invention discloses a conveying mechanism and a loading and unloading method based on variable distance adjustment of silicon wafers, relating to the technical field of silicon wafer processing equipment, wherein the conveying mechanism includes a frame, and a loading and conveying mechanism, a processing platform and a unloading and conveying mechanism are arranged in sequence between the frames on both sides; the loading and conveying mechanism is used to convey the silicon wafers to be polished to the conveying end in preparation for loading, and the unloading and conveying mechanism is used to convey the silicon wafers after polishing; wherein, a conveying platform is provided on the top of the frame; and also includes a conveying component, said conveying component including an adjustment plate arranged on the conveying platform toward the processing platform, the adjustment plate is connected to the adjustment component for driving it to adjust its position, and an adsorption loading mechanism is provided on one side of the adjustment plate. The conveying mechanism of the present invention adopts a suction cup for adsorption and fixation during the loading process, and adopts a clamping method to fix the silicon wafer, so that the suction cup will not directly contact the silicon wafer with polishing agent remaining on the surface, thereby avoiding corrosion of the suction cup by the polishing agent.

Description

Technical Field

[0001] This invention relates to the field of silicon wafer processing equipment technology, specifically to a handling mechanism and loading / unloading method based on silicon wafer pitch adjustment. Background Technology

[0002] Silicon wafers are the material used to manufacture semiconductor devices. Generally, polycrystalline silicon is processed through remelting and crystal pulling, slicing, chamfering, grinding, polishing, and cleaning to obtain chip-level silicon wafers with smooth, flat surfaces and neat edges. As silicon wafer diameters increase and integrated circuit feature sizes decrease, higher requirements are placed on wafer surface flatness, cleanliness, and damage levels.

[0003] Silicon wafers require polishing during actual processing. When transferring silicon wafers to polishing machinery, a robotic arm is usually used to transfer the wafers to the polishing machinery for polishing. Before the silicon wafers are loaded and transferred, a negative pressure mechanism is first installed at the end of the robotic arm to fix the wafers. However, during the polishing process, polishing agents are usually used. After polishing, when the wafers are picked up again for unloading, the suction cups are easily corroded because they are made of flexible material. Summary of the Invention

[0004] The purpose of this invention is to provide a conveying mechanism and loading / unloading method based on silicon wafer pitch adjustment, solving the following technical problems:

[0005] After polishing, when the silicon wafer is picked up again for unloading, the suction cup is made of a flexible material, which makes it easy for the suction cup to corrode.

[0006] The purpose of the present invention can be achieved through the following technical solutions:

[0007] A handling mechanism and loading / unloading method based on silicon wafer pitch adjustment includes a frame, with a loading conveyor, a processing platform and an unloading conveyor arranged sequentially between the two frames; the loading conveyor is used to transport the silicon wafer to be polished to the handling end for loading, and the unloading conveyor is used to transport the polished silicon wafer out.

[0008] The top of the rack is equipped with a handling platform;

[0009] It also includes a conveying assembly, which includes an adjustment plate arranged on the conveying platform facing the processing platform. The adjustment plate is connected to an adjustment component that drives it to adjust its position. One side of the adjustment plate is provided with an adsorption feeding mechanism, which is used to adsorb and fix the silicon wafers conveyed by the feeding conveyor and then convey them to the processing platform. The other side is provided with a clamping and unloading mechanism, which is used to clamp and transfer the polished silicon wafers to the unloading conveyor.

[0010] Preferably, the processing platform is provided with a support platform for receiving silicon wafers, and the support platform is connected to a sliding mechanism that drives the wafers to move along the processing platform.

[0011] Preferably, the adsorption feeding mechanism includes a first positioning plate fixedly connected to the adjusting plate via a first support rod. A suction cup is provided on the side of the first positioning plate away from the adjusting plate, and the suction cup is connected to a negative pressure mechanism provided on the first positioning plate.

[0012] Preferably, the clamping and unloading mechanism includes a second positioning plate fixedly connected to the adjusting plate via a second support rod. An L-shaped rack plate is slidably arranged on the second positioning plate, and the two L-shaped rack plates on both sides respectively mesh with a first gear rotatably arranged on the second positioning plate. The first gear is fixedly connected to the output end of the first motor.

[0013] The L-shaped rack plates on both sides are fixedly connected to the clamping plate by limiting plates.

[0014] Preferably, it also includes a lifting mechanism installed on the support platform;

[0015] The lifting mechanism includes a lifting column that is slidably arranged between the bearing platforms. Baffles are arranged opposite each other on both sides of the bottom of the processing platform, and a second rack plate is arranged opposite each other between the two side baffles. The lifting column is fixedly connected to the lifting plate arranged at the bottom of the processing platform.

[0016] Preferably, the lifting mechanism further includes a screw with opposite threads on both sides. Nuts are fitted onto the screw with opposite threads, and the nuts are rotatably connected to a push rod. The end of the push rod is rotatably connected to the lifting plate. The screw is also provided with a second gear at both ends that meshes with the second rack plate. The inner end face of the baffle is also provided with a slide rail. The end of the second gear away from the screw is rotatably connected to a movable seat that is slidably arranged in the slide rail.

[0017] Preferably, the adjustment assembly includes a lifting mechanism for driving the adjustment plate to rise and fall. The lifting mechanism includes a sliding plate that is slidably arranged on the transport platform. An electric telescopic rod is arranged on the sliding plate. The telescopic end of the electric telescopic rod is fixedly connected to the adjustment seat. Both ends of the adjustment seat are fixedly connected to the adjustment plate through guide rods.

[0018] A loading and unloading method for a silicon wafer-based variable-pitch handling mechanism includes the following steps:

[0019] Step 1: First, place the silicon wafer to be polished on the feeding conveyor mechanism, and then transfer the silicon wafer to the transport end through the feeding conveyor mechanism;

[0020] Step 2: The adsorption and feeding mechanism adsorbs and fixes the silicon wafer. The adjustment component drives the adjustment plate to move, and the adsorption and feeding mechanism is moved to the processing platform. The adjustment mechanism drives the adjustment plate to reset.

[0021] Step 4: Polish the silicon wafer using the polishing equipment installed on the processing platform. At this time, the clamping and unloading mechanism is positioned on the processing platform. The clamping and unloading mechanism clamps and fixes the silicon wafer. Simultaneously, the adsorption and loading mechanism picks up and fixes the silicon wafer on the loading and conveying mechanism.

[0022] Step 5: The adjustment component drives the adjustment plate to move. The adjustment plate transports the clamping and unloading mechanism to the top of the unloading conveyor mechanism, places the silicon wafer on the unloading conveyor mechanism, and transports it out through the unloading conveyor mechanism.

[0023] The beneficial effects of this invention are:

[0024] (1) The silicon wafer is placed on the unloading conveyor and conveyed out through the unloading conveyor to realize automated material conveying. At the same time, the material handling mechanism of the present invention uses a suction cup to adsorb and fix it during the loading process, and uses a clamping method to fix the silicon wafer during the unloading process, so that the suction cup will not directly contact the silicon wafer with residual polishing agent on the surface, thus avoiding the polishing agent from corroding the suction cup.

[0025] (2) By setting the first gear and the L-shaped rack and pinion clamping mechanism, when facing silicon wafers of different sizes, only the rotation angle of the first gear needs to be adjusted to adjust the distance between the limiting plate and the clamping plate, and thus the distance can be varied based on the size of the silicon wafer, making it more applicable. Attached Figure Description

[0026] The invention will now be further described with reference to the accompanying drawings.

[0027] Figure 1 This is a schematic diagram of the structure of a conveying mechanism based on silicon wafer for variable pitch adjustment according to the present invention. Figure 1 ;

[0028] Figure 2 This is a schematic diagram of the structure of a conveying mechanism based on silicon wafer for variable pitch adjustment according to the present invention. Figure 2 ;

[0029] Figure 3 This is a schematic diagram of the structure of a conveying mechanism based on silicon wafer for variable pitch adjustment according to the present invention. Figure 3 ;

[0030] Figure 4 This is a schematic diagram of the structure of a conveying mechanism based on silicon wafer for variable pitch adjustment according to the present invention. Figure 4 ;

[0031] Figure 5 This is a schematic diagram of the structure of a conveying mechanism based on silicon wafer for variable pitch adjustment according to the present invention. Figure 5 ;

[0032] Figure 6This invention relates to a handling mechanism based on silicon wafers for variable pitch adjustment. Figure 3 Enlarged structural diagram at point A;

[0033] Figure 7 This is a schematic diagram of the sliding mechanism in a silicon wafer-based variable-pitch adjustment conveying mechanism of the present invention;

[0034] Figure 8 This is a schematic diagram of the clamping and unloading mechanism in a silicon wafer-based variable-pitch handling mechanism of the present invention.

[0035] In the diagram: 1. Frame; 2. Electric telescopic rod; 3. Third motor; 4. Loading conveyor mechanism; 5. Unloading conveyor mechanism; 6. Polishing equipment; 7. Adjusting plate; 8. Silicon wafer; 9. Negative pressure mechanism; 101. Handling platform; 201. Adjusting seat; 202. Guide rod; 203. Sliding plate; 301. Fourth gear; 302. Synchronous belt bracket; 303. Synchronous belt; 601. Processing platform; 602. Guide groove; 603. Slide groove; 604. Baffle; 605. Lifting plate; 606. Push rod; 607. Nut; 608. Second gear; 609. Second rack plate; 610. Screw; 701. First support rod; 702. Clamping plate; 703. Second positioning plate; 704. Second support rod; 705. Limiting plate; 706. L-shaped rack plate; 707. First gear; 708. First motor; 801. Lifting column; 802. Bearing platform; 901. First positioning plate; 902. Buffer seat; 903. Buffer rod; 904. Buffer plate; 905. Buffer spring; 906. Suction cup. Detailed Implementation

[0036] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0037] Example 1

[0038] Please see Figures 1-3 As shown, the present invention is a handling mechanism based on silicon wafer pitch adjustment, including a frame 1, with a feeding conveyor 4, a processing platform 601 and a discharging conveyor 5 arranged sequentially between the two frames 1; in one embodiment of the present invention, the feeding conveyor 4 and the discharging conveyor 5 are existing conveyor belt conveying equipment, the feeding conveyor 4 is used to transport the silicon wafer 8 to be polished to the handling end for loading, and the discharging conveyor 5 is used to transport the polished silicon wafer 8 out;

[0039] Among them, the top of the frame 1 is equipped with a handling platform 101;

[0040] It also includes a handling assembly, which includes an adjustment plate 7 arranged on the handling platform 101 facing the processing platform 601. The adjustment plate 7 is connected to an adjustment assembly that drives its position adjustment. One side of the adjustment plate 7 is provided with an adsorption loading mechanism, which is used to adsorb and fix the silicon wafer 8 conveyed by the loading conveyor 4 and then transport it to the processing platform 601. The other side is provided with a clamping and unloading mechanism, which is used to clamp and transfer the polished silicon wafer 8 to the unloading conveyor 5. Specifically, in actual operation, the operator first places the silicon wafer 8 to be polished on the loading conveyor 4, which conveys the silicon wafer 8 to the handling end. Then, the adsorption loading mechanism adsorbs and fixes the silicon wafer 8. Next, the adjustment assembly drives the adjustment plate 7 to move, moving the adsorption loading mechanism to the processing platform 601. Then, the adjustment mechanism drives the adjustment plate 7 to reset, and the adjustment plate 7 is moved to the processing platform 601. The polishing equipment 6 on 01 polishes the silicon wafer 8. In one embodiment of the present invention, the polishing equipment 6 is a grinding wheel polishing mechanism, which will not be described again. After the silicon wafer 8 is polished, the clamping and unloading mechanism is just on the processing platform 601. The clamping and unloading mechanism clamps and fixes the silicon wafer 8. At the same time, the adsorption and loading mechanism picks up and fixes the silicon wafer 8 on the loading and conveying mechanism 4. Finally, the adjusting plate 7 is driven to move by the adjusting component. The adjusting plate 7 transports the clamping and unloading mechanism to the top of the unloading and conveying mechanism 5, places the silicon wafer 8 on the unloading and conveying mechanism 5, and transports it out through the unloading and conveying mechanism 5 to realize automated material conveying. At the same time, the handling mechanism of the present invention uses a suction cup for adsorption and fixation during the loading process and uses a clamping method to fix the silicon wafer 8 during the unloading process, so that the suction cup will not directly contact the silicon wafer 8 with residual polishing agent on the surface, and avoid the polishing agent from corroding the suction cup.

[0041] The processing platform 601 is equipped with a support platform 802 for receiving silicon wafers 8. The support platform 802 is connected to a sliding mechanism that drives it to move along the processing platform 601. During the loading and unloading process, the adsorption loading mechanism places the silicon wafers 8 on the support platform 802. The sliding mechanism slides the support platform 802 to the polishing equipment 6 for polishing. After polishing, the sliding mechanism pushes out the support platform 802, and the clamping unloading mechanism can then clamp the silicon wafers 8.

[0042] The sliding mechanism includes a slide groove 603 formed on the processing platform 601, and the bearing platform 802 is slidably connected to the slide groove 603 through a slide block. It also includes a cylinder connected to the bearing platform 802. When the cylinder is activated, it drives the bearing platform 802 to slide on the processing platform 601 while extending and retracting.

[0043] Please see Figure 4 The adsorption and feeding mechanism includes a first positioning plate 901 fixedly connected to the adjusting plate 7 via a first support rod 701. A suction cup 906 is arranged on the side of the first positioning plate 901 away from the adjusting plate 7. The suction cup 906 is connected to a negative pressure mechanism 9 arranged on the first positioning plate 901. When adsorbing and fixing the silicon wafer 8, the suction cup 906 is first driven to precisely fit with the silicon wafer 8 by the adjusting component. Then, the negative pressure mechanism 9 is activated. The negative pressure mechanism 9 generates negative pressure at the contact end between the suction cup 906 and the silicon wafer 8, thereby adsorbing and fixing the silicon wafer 8.

[0044] In addition, a buffer mechanism is provided at the connection end between the suction cup 906 and the negative pressure mechanism 9. The buffer mechanism includes buffer seats 902 arranged in a circumferential array on the first positioning plate 901. The buffer seats 902 have buffer grooves, and buffer rods 903 are provided between the buffer grooves. Buffer springs 905 are provided on the buffer rods 903. The buffer springs 905 are fixedly connected to buffer plates 904 that are slidably arranged on the buffer rods 903. The buffer plates 904 are fixedly connected to the pipe arranged between the suction cup 906 and the negative pressure mechanism 9. In another embodiment, when the suction cup 906 is driven to adhere to the silicon wafer 8, since the pipe is telescopic, the pipe drives the buffer plate 904 to slide on the buffer rods 903 during the telescopic process, thereby squeezing the buffer springs 905 to convert the external force into elastic force and achieve a buffering effect.

[0045] Please see Figure 5 The clamping and unloading mechanism includes a second positioning plate 703 fixedly connected to the adjusting plate 7 via a second support rod 704. An L-shaped rack plate 706 is slidably arranged on the second positioning plate 703. The L-shaped rack plates 706 on both sides mesh with a first gear 707 rotatably arranged on the second positioning plate 703. The first gear 707 is fixedly connected to the output end of the first motor 708.

[0046] The L-shaped rack plates 706 on both sides are fixedly connected to the clamping plate 702 via the limiting plate 705. Specifically, when clamping the polished silicon wafer 8, the position of the second positioning plate 703 is adjusted so that the limiting plate 705 is located on both sides of the silicon wafer 8. The first motor 708 is started, and the first motor 708 drives the first gear 707 to rotate. The first gear 707 meshes with the L-shaped rack plates 706 on both sides to drive the limiting plate 705 and the clamping plate 702 to move closer to each other, thereby positioning and clamping the silicon wafer 8. Similarly, when placing the silicon wafer 8, the first motor 708 is started to reverse. In one embodiment of the present invention, by setting the clamping mechanism of the first gear 707 and the L-shaped rack plate 706, when facing silicon wafers 8 of different sizes, only the rotation angle of the first gear 707 needs to be adjusted to realize the adjustment of the distance between the limiting plate 705 and the clamping plate 702, thereby allowing for variable distance based on the size of the silicon wafer, and thus having a wider range of applications.

[0047] Please see Figure 6 Another embodiment of this invention also includes a lifting mechanism arranged on the support platform 802. When the clamping and unloading mechanism clamps the silicon wafer 8, the lifting mechanism lifts the silicon wafer 8 to a preset height for clamping.

[0048] The lifting mechanism includes a lifting column 801 that is slidably arranged between the bearing platforms 802. Baffles 604 are arranged opposite each other on both sides of the bottom of the processing platform 601. A second rack plate 609 is arranged opposite each other between the two side baffles 604. A guide groove 602 is opened on the processing platform 601. The lifting column 801 passes through the guide groove 602 and is fixedly connected to the lifting plate 605 arranged at the bottom of the processing platform 601.

[0049] The lifting mechanism also includes a screw 610 with opposite threads on both sides. A nut 607 is fitted onto the screw 610 with opposite threads. The nut 607 is rotatably connected to a push rod 606. The end of the push rod 606 is rotatably connected to a lifting plate 605. The screw 610 also has second gears 608 at both ends that mesh with a second rack plate 609. A slide rail is provided on the inner end face of the baffle 604. The end of the second gear 608 away from the screw 610 is rotatably connected to a movable seat slidably arranged in the slide rail. The lifting mechanism also includes a screw 610 with opposite threads on both sides. During the movement of platform 601, since the second rack plate 609 is located on the side near the loading and unloading position, as the bearing platform 802 moves toward the loading end position, the second gear 608 drives the screw 610 to rotate by meshing with the second rack plate 609. As the nut 607 moves on the screw 610, it drives the lifting plate 605 to rise and fall through the push rod 606. In turn, the lifting plate 605 lifts the lifting column 801 and pushes the silicon wafer 8 to the preset height position so that the clamping plate 702 can clamp it.

[0050] Please see Figure 7 The adjustment assembly includes a lifting mechanism for driving the adjustment plate 7 to rise and fall. The lifting mechanism includes a sliding plate 203 slidably arranged on the transport platform 101. An electric telescopic rod 2 is arranged on the sliding plate 203. The telescopic end of the electric telescopic rod 2 is fixedly connected to the adjustment seat 201. Both ends of the adjustment seat 201 are fixedly connected to the adjustment plate 7 through guide rods 202. When adjusting the height of the adjustment plate 7, the electric telescopic rod 2 is activated. During the process of driving the adjustment seat 201 to rise and fall, the electric telescopic rod 2 adjusts the height of the adjustment plate 7 through the guide rods 202.

[0051] Please see Figure 8The adjustment assembly also includes a translation mechanism for driving the adjustment plate 7 to move along the transport platform 101. The translation mechanism includes a synchronous belt bracket 302 arranged between the transport platforms 101. Synchronous belt pulleys are arranged opposite each other on both sides of the synchronous belt bracket 302. A synchronous belt 303 fixedly connected to the sliding plate 203 is sleeved on the synchronous belt pulley. One of the synchronous belt pulleys is fixedly connected to a third gear. A third motor 3 is also provided on the transport platform 101. A fourth gear 301 meshing with the third gear is fixedly connected to the output end of the third motor 3. When adjusting the horizontal position of the adjustment plate 7, the third motor 3 is started. The third motor 3 drives the fourth gear 301 to rotate. The fourth gear 301 drives the synchronous pulley to rotate by meshing with the third gear, and then drives the sliding plate 203 to move through the synchronous belt 303 to achieve the adjustment of the horizontal position of the adjustment plate 7.

[0052] Example 2

[0053] A loading and unloading method for a silicon wafer-based variable-pitch handling mechanism includes the following steps:

[0054] Step 1: First, place the silicon wafer 8 to be polished on the feeding conveyor 4, and then transfer the silicon wafer 8 to the transport end through the feeding conveyor 4.

[0055] Step 2: The adsorption and feeding mechanism adsorbs and fixes the silicon wafer 8. The adjustment component drives the adjustment plate 7 to move, and the adsorption and feeding mechanism is transferred to the processing platform 601. The adjustment mechanism drives the adjustment plate 7 to reset.

[0056] Step 4: Polishing is performed on the silicon wafer 8 by the polishing equipment 6 installed on the processing platform 601. At this time, the clamping and unloading mechanism is just on the processing platform 601. The clamping and unloading mechanism clamps and fixes the silicon wafer 8. Simultaneously, the adsorption and loading mechanism picks up and fixes the silicon wafer 8 on the loading and conveying mechanism 4 again.

[0057] Step 5: The adjustment component drives the adjustment plate 7 to move. The adjustment plate 7 transports the clamping and unloading mechanism to the top of the unloading conveyor 5, places the silicon wafer 8 on the unloading conveyor 5, and transports it out through the unloading conveyor 5.

[0058] In the description of this invention, it should be understood that the terms "upper," "lower," "left," and "right," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or a specific orientational structure and operation. Therefore, they should not be construed as limitations on the invention. Furthermore, "first" and "second" are only for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, unless otherwise stated, "multiple" means two or more.

[0059] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0060] The foregoing has provided a detailed description of one embodiment of the present invention, but this description is merely a preferred embodiment and should not be construed as limiting the scope of the invention. All equivalent variations and modifications made within the scope of the claims of this invention should still fall within the patent coverage of this invention.

Claims

1. A conveying mechanism based on silicon wafer for variable pitch adjustment, characterized in that, Includes a frame (1), with a feeding conveyor (4), a processing platform (601) and a discharging conveyor (5) arranged sequentially between the two frames (1); the feeding conveyor (4) is used to transport the silicon wafer (8) to be polished to the transport end for loading, and the discharging conveyor (5) is used to transport the polished silicon wafer (8) out. Among them, the top of the frame (1) is provided with a handling platform (101). It also includes a transport assembly, which includes an adjustment plate (7) arranged on the transport platform (101) facing the processing platform (601). The adjustment plate (7) is connected to an adjustment assembly that drives it to adjust its position. One side of the adjustment plate (7) is provided with an adsorption loading mechanism, which is used to adsorb and fix the silicon wafer (8) delivered by the loading conveyor (4) and then transport it to the processing platform (601). The other side is provided with a clamping unloading mechanism, which is used to clamp and transfer the polished silicon wafer (8) to the unloading conveyor (5). The adsorption feeding mechanism includes a first positioning plate (901) fixedly connected to the adjusting plate (7) via a first support rod (701). A suction cup (906) is provided on the side of the first positioning plate (901) away from the adjusting plate (7). The suction cup (906) is connected to a negative pressure mechanism (9) provided on the first positioning plate (901). The clamping unloading mechanism includes a second positioning plate (703) fixedly connected to the adjusting plate (7) via a second support rod (704). An L-shaped rack plate (706) is slidably provided on the second positioning plate (703). The two L-shaped rack plates (706) on both sides mesh with a first gear (707) rotatably provided on the second positioning plate (703). The first gear (707) is fixedly connected to the output end of a first motor (708). The two L-shaped rack plates (706) on both sides are fixedly connected to a clamping plate (702) via a limiting plate (705). The processing platform (601) is provided with a support platform (802) for receiving the silicon wafer (8), and the support platform (802) is connected to a sliding mechanism that drives it to move along the processing platform (601); The silicon wafer-based variable-pitch handling mechanism also includes a lifting mechanism mounted on the support platform (802). The lifting mechanism includes a lifting column (801) slidably mounted between the support platforms (802). Baffles (604) are arranged opposite each other on both sides of the bottom of the processing platform (601), and a second rack plate (609) is arranged opposite each other between the two side baffles (604). The lifting column (801) is fixedly connected to the lifting plate (605) mounted on the bottom of the processing platform (601). The lifting mechanism also includes a screw (610). The screw (610) has opposite threads on both sides. A nut (607) is fitted on the screw (610) with opposite threads. The nut (607) is rotatably connected to the push rod (606). The end of the push rod (606) is rotatably connected to the lifting plate (605). The screw (610) is also provided with a second gear (608) at both ends that meshes with the second rack plate (609). The inner end face of the baffle (604) is also provided with a slide rail. The end of the second gear (608) away from the screw (610) is rotatably connected to the movable seat that is slidably arranged in the slide rail. The adjustment assembly includes a lifting mechanism for driving the adjustment plate (7) to rise and fall. The lifting mechanism includes a sliding plate (203) that is slidably arranged on the transport platform (101). An electric telescopic rod (2) is arranged on the sliding plate (203). The telescopic end of the electric telescopic rod (2) is fixedly connected to the adjustment seat (201). Both ends of the adjustment seat (201) are fixedly connected to the adjustment plate (7) through guide rods (202).

2. A loading and unloading method for a conveying mechanism based on silicon wafer pitch adjustment, characterized in that: The conveying mechanism based on silicon wafer pitch adjustment as described in claim 1 includes the following steps: Step 1: First, place the silicon wafer (8) to be polished on the feeding conveyor (4) and transfer the silicon wafer (8) to the transport end through the feeding conveyor (4); Step 2: The adsorption feeding mechanism adsorbs and fixes the silicon wafer (8), the adjustment component drives the adjustment plate (7) to move, and the adsorption feeding mechanism is moved to the processing platform (601). The adjustment mechanism drives the adjustment plate (7) to reset. Step 4: Polish the silicon wafer (8) using the polishing equipment (6) installed on the processing platform (601). At this time, the clamping and unloading mechanism is just on the processing platform (601). The clamping and unloading mechanism clamps and fixes the silicon wafer (8). Simultaneously, the adsorption and loading mechanism once again picks up and fixes the silicon wafer (8) on the loading and conveying mechanism (4). Step 5: Adjust the component to drive the adjustment plate (7) to move. The adjustment plate (7) will transport the clamping and unloading mechanism to the top of the unloading conveyor (5), place the silicon wafer (8) on the unloading conveyor (5), and transport it out through the unloading conveyor (5).

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