Sealed doors and semiconductor equipment
By using a combination technology of U-shaped body and gas channel in the sealing door of semiconductor equipment, the problem of poor sealing of existing equipment is solved, and efficient sealing and unsealing operations are achieved, which is suitable for a variety of semiconductor equipment.
Patent Information
- Application Number
- CN202211344785.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2022-10-31
- Publication Date
- 2025-05-02
- Estimated Expiration
- 2042-10-31
AI Technical Summary
The pressure vessels in existing semiconductor equipment have poor sealing properties, especially when the handwheel transmission fails, which affects process efficiency and safety.
Design a sealed door, including a door body, a door frame, a U-shaped body and a gas passage. Sealing and unsealing are achieved by providing a U-shaped body in the annular groove of the door frame and applying positive and negative pressure to the pressure space using the gas channel to seal the U-shaped body with the door body.
It improves the sealing and versatility of the sealing door, ensures the sealing of the cavity of the semiconductor device, is simple to operate and does not require human intervention, and is suitable for various semiconductor devices.
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Figure CN115749542B_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of semiconductor technology, and in particular to a sealing door and a semiconductor device. Background Art
[0002] In the manufacturing process of the semiconductor industry, pressure equipment is often required. In order to ensure the efficient implementation of the process (heat preservation and pressure maintenance), the space inside the pressure equipment must be sealed.
[0003] The conventional design is to set a handwheel transmission device that is manually operated to drive the electric locking device to lock or unlock the chamber door, so that the pressure vessel remains sealed. At the same time, the handwheel device can avoid the problem that the sealing switch cannot be opened under special conditions such as power failure. However, the operability, sealing and versatility of the handwheel device are poor. Summary of the invention
[0004] Based on this, it is necessary to provide a sealing door and semiconductor equipment to address the above problems.
[0005] According to a first aspect of an embodiment of the present application, there is provided a sealing door, comprising:
[0006] Door body;
[0007] A door frame, connected to the door body, the door frame having an annular groove opening toward the door body;
[0008] A U-shaped body is disposed in the annular groove, the opening of the U-shaped body faces the bottom of the annular groove, and a pressure space is formed between the U-shaped body and the annular groove;
[0009] A gas channel is connected to the pressure space. When positive pressure is applied to the pressure space through the gas channel, the U-shaped body moves toward the door body to be in sealing contact with the door body. When negative pressure is applied to the pressure space through the gas channel, the U-shaped body moves away from the door body to reset.
[0010] In one embodiment, the diameter of the U-shaped body gradually increases along the direction from the bottom to the opening of the U-shaped body.
[0011] In one of the embodiments, when the U-shaped body is in sealing contact with the door body, the U-shaped body is at least partially located in the annular groove.
[0012] In one embodiment, the U-shaped body is made of elastic material.
[0013] In one embodiment, the door frame includes an inner frame and an outer frame connected to each other, the door body is located between the inner frame and the outer frame, and the annular groove is located in the inner frame;
[0014] When the U-shaped body moves toward the door body under the action of positive pressure, the door body is pressed by the U-shaped body to move toward the outer frame and in sealing contact with the outer frame, and the U-shaped body is in sealing contact with the door body;
[0015] When the U-shaped body moves away from the door body due to the negative pressure, the space between the door body and the outer frame and between the door body and the U-shaped body is released.
[0016] In one of the embodiments, the sealed door further comprises an electrically connected door closing sensing device and a control device, wherein the door closing sensing device is capable of outputting a sensing signal in response to a door closing state, and the control device is configured to control the gas passage to apply a positive pressure to the pressure space upon receiving the sensing signal.
[0017] In one embodiment, a pin is provided at the door frame. When the door is closed, the pin is moved by force. The door closing sensing device includes a pressure sensor. The pressure sensor is used to sense the pressure at the pin and output a sensing signal.
[0018] In one embodiment, the control device includes a programmable logic controller.
[0019] In one embodiment, the gas channel includes a pressurizing valve, a vacuum valve and a vacuum generator; when the pressurizing valve is opened, the gas enters the pressure space through the gas channel, and when the vacuum valve and the vacuum generator are opened, the gas is extracted from the pressure space.
[0020] According to a second aspect of an embodiment of the present application, a semiconductor device is provided, comprising a cavity and a sealing door as described above, wherein the sealing door is connected to an opening of the cavity.
[0021] The above-mentioned sealed door and semiconductor equipment, the door body is cooperatively connected with the door frame, and an annular groove with an opening toward the door body is arranged in the door frame, and a U-shaped body is arranged in the annular groove, and the opening of the U-shaped body faces the bottom of the annular groove, so that a pressure space can be formed between the U-shaped body and the annular groove, and a positive pressure can be applied to the pressure space through a gas channel connected to the pressure space, so that the U-shaped body is moved toward the door body, so that the U-shaped body is in sealing contact with the door body, thereby blocking the passage between the door body and the door frame, when the sealed door is connected to the opening of the cavity, it can prevent the material inside the cavity from leaking to the outside through the gap between the door frame and the door body or foreign materials from entering the cavity, thereby ensuring the sealing of the cavity, and the sealing can be achieved by only pressurizing the pressure space, and the U-shaped body can be reset by depressurizing the pressure space, thereby achieving unsealing, simple operation and high versatility. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] Figure 1A schematic diagram of the structure of a sealed door provided in an embodiment of the present application when in a sealed state;
[0023] Figure 2 A schematic diagram of the structure of a sealed door provided in an embodiment of the present application when it is in an unsealed state;
[0024] Figure 3 A schematic diagram of the structure of a gas channel in a sealed door provided in one embodiment of the present application.
[0025] Description of reference numerals:
[0026] 100, door body; 200, door frame; 210, annular groove; 220, pressure space; 230, inner frame; 240, outer frame; 300, U-shaped body; 400, gas channel; 411, pressurizing valve; 421, vacuum valve; 422, vacuum generator; 430, pressure safety switch; 500, door closing sensing device; 600, control device. DETAILED DESCRIPTION
[0027] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present application are given in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to understand the disclosure of the present application more thoroughly and comprehensively.
[0028] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0029] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.
[0030] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.
[0031] An embodiment of the present application provides a sealing door, which can be applied to various semiconductor devices with sealing requirements, wherein the semiconductor equipment includes but is not limited to vacuum laminating machines, defoaming equipment, degassing equipment, etc., which are not listed here one by one.
[0032] Reference Figure 1 and Figure 2 In one embodiment, a sealed door is provided, comprising a door body 100, a door frame 200, a U-shaped body 300 and a gas channel 400. The door frame 200 is connected with the door body 100, and the door frame 200 has an annular groove 210 with an opening toward the door body 100. The U-shaped body 300 is arranged in the annular groove 210, and the opening of the U-shaped body 300 faces the bottom of the annular groove 210, and a pressure space 220 is formed between the U-shaped body 300 and the annular groove 210. The gas channel 400 is connected to the pressure space 220. When a positive pressure is applied to the pressure space 220 through the gas channel 400, the U-shaped body 300 moves toward the door body 100 to be in sealing contact with the door body 100. When a negative pressure is applied to the pressure space 220 through the gas channel 400, the U-shaped body 300 moves away from the door body 100 to reset.
[0033] In the above-mentioned sealed door, the door body 100 is connected with the door frame 200, and an annular groove 210 with an opening toward the door body 100 is provided in the door frame 200, and a U-shaped body 300 is provided in the annular groove 210, and the opening of the U-shaped body 300 is toward the bottom of the annular groove 210, thereby a pressure space 220 can be formed between the U-shaped body 300 and the annular groove 210, and a positive pressure can be applied to the pressure space 220 through the gas channel 400 connected to the pressure space 220, so that the U-shaped body 300 is directed toward the door body 100. Move so that the U-shaped body 300 is in sealing contact with the door body 100, thereby blocking the passage between the door body 100 and the door frame 200. When the sealed door is connected to the opening of the cavity, it can prevent the material inside the cavity from leaking to the outside through the gap between the door frame 200 and the door body 100 or foreign materials from entering the cavity, thereby ensuring the sealing of the cavity. In addition, it only needs to pressurize the pressure space 220 to achieve sealing. When negative pressure is applied to the pressure space 220, the U-shaped body 300 can be reset, thereby achieving unsealing. The operation is simple and the versatility is high.
[0034] Specifically, the door body 100 can be connected to the door frame 200 through a bearing, and the door body 100 can rotate around the bearing at a certain angle to close or open the door. In the conventional technology, when the door is closed, that is, when the door body 100 rotates toward the direction close to the door frame 200 to a position parallel to the door frame 200, there is still a gap between the door body 100 and the door frame 200, that is, there is a passage between the door body 100 and the door frame 200 for gas to flow from one side of the door body 100 to the other side, and it is obvious that a sealing effect cannot be achieved. Therefore, in this embodiment, by arranging the U-shaped body 300 in the annular groove 210 of the door frame 200, a positive pressure can be applied to the U-shaped body 300 after the door is closed, and the U-shaped body 300 can move toward the door body 100, and finally come into sealing contact with the door body 100, thereby cutting off the gas passage between the door body 100 and the door frame 200 that connects the two sides of the door body 100, so that the gas on the two sides of the door body 100 does not communicate with each other, thereby effectively improving the sealing performance of the sealed door. Figure 1 The structure of the sealed door in a sealed state is shown. When the door needs to be opened, the positive pressure can be removed and negative pressure can be applied to make the U-shaped body 300 shrink and reset. At this time, the U-shaped body 300 is separated from the door body 100, and the door body 100 can be opened. Figure 2 The structure of the sealing door is shown in an unsealed state.
[0035] Specifically, the annular groove 210 can be arranged at the outer edge of the door frame 200, that is, a circle of grooves is arranged at the outer edge of the door frame 200, and the depth of the groove is less than the thickness of the door frame 200, which can be determined according to actual needs. The U-shaped body 300 arranged in the annular groove 210 can be made of elastic material, such as rubber, etc., so that it is easy to deform or displace when subjected to force, and can be restored to its original state. The thickness of the bottom of the U-shaped body 300 is greater than the thickness of the side. On the one hand, it can ensure that the U-shaped body 300 has a sufficient caliber, so that the U-shaped body 300 and the annular groove form a sufficiently large pressure space 220 to accommodate the applied gas, so as to facilitate the application of sufficient pressure to the bottom of the U-shaped body 300 to displace the U-shaped body 300; on the other hand, since the bottom of the U-shaped body 300 needs to be in sealing contact with the door body 100, the bottom has sufficient thickness to increase the tightness of the contact between the U-shaped body 300 and the door body 100, ensuring the sealing effect.
[0036] In one embodiment, referring to Figure 1When the U-shaped body 300 is in sealing contact with the door body 100, at least a portion of the U-shaped body 300 is located in the annular groove 210. When the U-shaped body 300 moves to a position where it can be in sealing contact with the door body 100, at least a portion of the U-shaped body 300 is still located in the annular groove 210, thereby preventing the U-shaped body 300 from escaping from the annular groove 210 and falling off, ensuring that before opening the door, when negative pressure is applied to the pressure space 220, the U-shaped body 300 can be retracted back into the annular groove 210 to reset, and after the door is closed next time, the U-shaped body 300 can be used again to achieve a sealing effect.
[0037] In one embodiment, the diameter of the U-shaped body 300 gradually increases along the direction from the bottom to the opening of the U-shaped body 300 . Assuming that the opening direction of the U-shaped body 300 is upward and the bottom direction of the U-shaped body 300 is downward, the U-shaped body 300 is a structure that is wide at the top and narrow at the bottom, and the caliber of the end close to the bottom of the annular groove 210 is larger. Such a configuration can, on the one hand, ensure that the upper part of the U-shaped body 300 can fit more tightly with the side wall of the annular groove 210, and the U-shaped body 300 is not easy to completely separate from the annular groove 210. At least it can ensure that the upper part of the U-shaped body 300 is still located in the annular groove 210. On the other hand, it can improve the sealing of the pressure space 220 between the U-shaped body 300 and the annular groove 210. When positive pressure is applied to the pressure space 220, the gas input into the pressure space 220 will not leak out from the pressure space 220, so that the gas input into the pressure space 220 can be used to provide thrust to the U-shaped body 300, thereby improving the sealing efficiency after closing the door.
[0038] In one embodiment, the door frame 200 includes an inner frame 230 and an outer frame 240 connected to each other, the door body 100 is located between the inner frame 230 and the outer frame 240, and the annular groove 210 is located in the inner frame 230. When the U-shaped body 300 moves toward the door body 100 under the action of positive pressure, the door body 100 is squeezed by the U-shaped body 300 and moves toward the outer frame 240 and is in sealing contact with the outer frame 240, and the U-shaped body 300 is in sealing contact with the door body 100; when the U-shaped body 300 moves away from the door body 100 under the action of negative pressure, the space between the door body 100 and the outer frame 240 and between the door body 100 and the U-shaped body 300 is released.
[0039] Assuming that the sealed door is applied to semiconductor equipment, that is, it is connected to the open part of the cavity of the semiconductor equipment, the inner frame 230 refers to the part of the door frame 200 close to the cavity, and the outer frame 240 refers to the part of the door frame 200 away from the cavity. The inner frame 230 and the outer frame 240 sandwich the door body 100 from the outer circle of the door body 100. When the door body 100 is in a closed state, there is a certain gap between the door body 100 and the inner frame 230 and the outer frame 240, thereby forming a passage connecting the inner and outer sides of the door body 100, and the sealing performance is poor.
[0040] In this embodiment, an annular groove 210 is provided in a circle of the inner frame 230, and a U-shaped body 300 is provided in the annular groove 210. When gas is input into the pressure space 220 formed between the U-shaped body 300 and the annular groove 210, that is, positive pressure is applied, the U-shaped body 300 moves toward the door body 100. When it contacts the door body 100, it will transmit a certain thrust to the door body 100, so that the door body 100 moves toward the outer frame 240 until the door body 100 and the outer frame 240 are tightly fitted. At this time, the outer side of the door body 100 is in sealing contact with the outer frame 240, and the inner side of the door body 100 is in sealing contact with the inner frame 230. The passages between the door body 100 and the inner frame 230 and the outer frame 240 are cut off, thereby effectively improving the sealing performance of the sealed door. When the door needs to be opened, the pressure space 220 between the U-shaped body 300 and the annular groove 210 can be vacuumed. Under the action of negative pressure, the U-shaped body 300 moves away from the door body 100, that is, it is reset to the annular groove 210. At this time, the door body 100 is reset, and a gap is generated between the door body 100 and the inner frame 230 and the outer frame 240, so that the door opening action can be performed.
[0041] In one embodiment, referring to Figure 3 The sealed door also includes an electrically connected door closing sensing device 500 and a control device 600. The door closing sensing device 500 can output a sensing signal in response to a door closing state, and the control device 600 is used to control the gas channel 400 to apply a positive pressure to the pressure space 220 when receiving the sensing signal.
[0042] That is, the door closing sensing device 500 can automatically sense whether the door is closed. When sensing that the door is in a closed state, the door closing sensing device 500 generates a sensing signal and sends it to the control device 600. The control device 600 can control the sealing action according to the received sensing signal, that is, control the gas channel 400 to apply positive pressure to the pressure space 220, so that the U-shaped body 300 moves toward the door body 100 to be in sealing contact with the door body 100. In this way, automatic sealing can be achieved, and the automation degree of the sealed door can be improved.
[0043] In this embodiment, the control device 600 includes but is not limited to a programmable logic controller.
[0044] In one embodiment, a dial pin is provided at the door frame 200. When the door body 100 is closed, the dial pin is moved by force, and the door closing sensing device 500 includes a pressure sensor, which is used to sense the pressure at the dial pin and output a sensing signal.
[0045] Specifically, when the door body 100 is open, the dial pin at the door frame 200 is in a naturally extended state. When the door body 100 is closed, the dial pin will be pressed into the door frame 200. At this time, by setting a pressure sensor, the pressure on the dial pin can be sensed, and then the sensing signal can be output to the control device 600. When the control device 600 receives the sensing signal, it can determine that the door body 100 is in a closed state.
[0046] Of course, in practical applications, in addition to using the method of sensing the needle pressure to determine whether the door body 100 is closed or opened, other methods can also be used, and no absolute limitation is made here.
[0047] In one embodiment, referring to Figure 3 The gas channel 400 includes a pressurizing valve 411, a vacuum valve 421 and a vacuum generator 422; when the pressurizing valve 411 is opened, the gas enters the pressure space 220 through the gas channel 400, and when the vacuum valve 421 and the vacuum generator 422 are opened, the gas is extracted from the pressure space 220.
[0048] Specifically, the gas channel 400 includes a common gas path connected to the pressure space 220, the common gas path is respectively connected to the pressurized gas path and the vacuum gas path in parallel, the pressurizing valve 411 is connected to the pressurized gas path, and the vacuum valve 421 and the vacuum generator 422 are connected to the vacuum gas path. When sealing is required, the pressurizing valve 411 is opened to input gas into the pressure space 220 to apply positive pressure to the U-shaped body 300. During this process, the vacuum valve 421 is in a closed state and the vacuum generator 422 does not work; when unsealing is required, the vacuum valve 421 is opened and the vacuum generator 422 is started to evacuate the pressure space 220 so that the U-shaped body 300 is reset to the annular groove 210. During this process, the pressurizing valve 411 is in a closed state.
[0049] The pressurizing valve 411, the vacuum valve 421 and the vacuum generator 422 may also be electrically connected to the control device 600, that is, the control device 600 may automatically control the opening or closing of the pressurizing valve 411, the vacuum valve 421 and the vacuum generator 422. The pressurizing valve 411 and the vacuum valve 421 may both be electromagnetic valves or the like.
[0050] In order to better control the gas pressure, a pressure safety switch 430 is also provided in the gas channel 400 to provide safety protection for the gas pressure in the gas channel 400. In the sealing process of this embodiment, the pressure in the gas channel 400 can be set according to actual needs, for example, 3kg / cm 2 , 4kg / cm 2 , 5kg / cm 2 etc., preferably 4kg / cm 2 .
[0051] In one of the embodiments, a manual valve is further provided in the gas channel 400, and the pressurization and vacuuming process can be manually controlled by operating the manual valve, so that when an emergency such as a power outage occurs during the process and the gas channel 400 cannot be automatically controlled, the pressure space 220 can be manually pressurized or vacuumed to ensure normal sealing or unsealing.
[0052] According to a second aspect of the embodiment of the present application, a semiconductor device is provided, the semiconductor device comprising a cavity and a sealing door provided in the above embodiment, the sealing door being connected to the open portion of the cavity. The semiconductor device provided in this embodiment includes but is not limited to a vacuum laminating machine, a defoaming device, a degassing device, etc., which are not listed here one by one.
[0053] Among them, refer to Figure 1 and Figure 2 The sealed door includes a door body 100, a door frame 200, a U-shaped body 300 and a gas channel 400. The door frame 200 is connected with the door body 100, and the door frame 200 has an annular groove 210 with an opening toward the door body 100. The U-shaped body 300 is arranged in the annular groove 210, and the opening of the U-shaped body 300 faces the bottom of the annular groove 210, and a pressure space 220 is formed between the U-shaped body 300 and the annular groove 210. The gas channel 400 is connected to the pressure space 220. When a positive pressure is applied to the pressure space 220 through the gas channel 400, the U-shaped body 300 moves toward the door body 100 to be in sealing contact with the door body 100. When a negative pressure is applied to the pressure space 220 through the gas channel 400, the U-shaped body 300 moves away from the door body 100 to reset.
[0054] In the semiconductor device, the door body 100 is connected with the door frame 200, and an annular groove 210 with an opening toward the door body 100 is provided in the door frame 200, and a U-shaped body 300 is provided in the annular groove 210, and the opening of the U-shaped body 300 is toward the bottom of the annular groove 210, thereby a pressure space 220 can be formed between the U-shaped body 300 and the annular groove 210, and a positive pressure can be applied to the pressure space 220 through a gas channel 400 connected to the pressure space 220, thereby causing the U-shaped body 300 to move toward the door body 100. The U-shaped body 300 moves to the front side so as to make the U-shaped body 300 and the door body 100 sealingly contact, thereby blocking the passage between the door body 100 and the door frame 200. When the sealed door is connected to the opening of the cavity, it can prevent the material inside the cavity from leaking to the outside through the gap between the door frame 200 and the door body 100 or the foreign material from entering the cavity, thereby ensuring the sealing of the cavity. The sealing can be achieved by simply pressurizing the pressure space 220. When negative pressure is applied to the pressure space 220, the U-shaped body 300 can be reset, thereby achieving unsealing. The operation is simple and the versatility is high.
[0055] For specific details about the sealing door in the semiconductor device, please refer to the specific description of the sealing door provided in the above embodiment, which will not be repeated here.
[0056] It is necessary to further explain that when the process in the cavity is completed, the control device 600 can receive the relevant instructions of the process completion. At this time, the control device 600 can control the gas channel 400 to evacuate the pressure space 220 according to the instructions. Under the negative pressure, the U-shaped body 300 is reset to the annular groove 210, and the door body 100 is in an unsealed state, and the door opening action can be performed. Combined with the sealing control process described above, it can be seen that the sealing and unsealing actions of the sealing door can be automatically controlled by the control device 600 without human intervention, and the degree of intelligence is relatively high.
[0057] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0058] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent. It should be noted that, for a person of ordinary skill in the art, several modifications and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the attached claims.
Claims
1. A sealed door, characterized in that: include: Door body; A door frame, connected to the door body, the door frame having an annular groove opening toward the door body; A U-shaped body is disposed in the annular groove, the opening of the U-shaped body faces the bottom of the annular groove, and a pressure space is formed between the U-shaped body and the annular groove; A gas channel is connected to the pressure space. When positive pressure is applied to the pressure space through the gas channel, the U-shaped body moves toward the door body to be in sealing contact with the door body. When negative pressure is applied to the pressure space through the gas channel, the U-shaped body moves away from the door body to reset.
2. The sealing door according to claim 1, characterized in that: Along the direction from the bottom to the opening of the U-shaped body, the diameter of the U-shaped body gradually increases.
3. The sealing door according to claim 1, characterized in that: When the U-shaped body is in sealing contact with the door body, the U-shaped body is at least partially located in the annular groove.
4. The sealing door according to claim 1, characterized in that: The U-shaped body is made of elastic material.
5. The sealing door according to claim 1, characterized in that: The door frame comprises an inner frame and an outer frame connected to each other, the door body is located between the inner frame and the outer frame, and the annular groove is located in the inner frame; When the U-shaped body moves toward the door body under the action of positive pressure, the door body is pressed by the U-shaped body to move toward the outer frame and in sealing contact with the outer frame, and the U-shaped body is in sealing contact with the door body; When the U-shaped body moves away from the door body due to the negative pressure, the space between the door body and the outer frame and between the door body and the U-shaped body is released.
6. The sealing door according to claim 1, characterized in that: The sealed door also includes an electrically connected door closing sensing device and a control device, wherein the door closing sensing device can output a sensing signal in response to a door closing state, and the control device is used to control the gas channel to apply positive pressure to the pressure space upon receiving the sensing signal.
7. The sealing door according to claim 6, characterized in that: The door frame is provided with a pin, and when the door is closed, the pin is moved by force, and the door closing sensing device includes a pressure sensor, and the pressure sensor is used to sense the pressure at the pin and output the sensing signal.
8. The sealing door according to claim 6, characterized in that: The control device comprises a programmable logic controller.
9. The sealing door according to claim 6, characterized in that: The gas channel includes a pressurizing valve, a vacuum valve and a vacuum generator; when the pressurizing valve is opened, the gas enters the pressure space through the gas channel, and when the vacuum valve and the vacuum generator are opened, the gas is extracted from the pressure space.
10. A semiconductor device, characterized in that: The semiconductor device comprises a cavity and a sealing door as described in any one of claims 1 to 9, wherein the sealing door is connected to an opening of the cavity.
Citation Information
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