Heat dissipation device

Abstract

This invention provides a heat dissipation device. The heat dissipation device includes a first heat spreader plate, which is filled with a first working fluid and is used to contact at least one heat source; at least one heat transfer structure is disposed on the side of the first heat spreader plate; and a second heat spreader plate, which is filled with a second working fluid and is connected to the first heat spreader plate through the heat transfer structure; wherein the first working fluid absorbs heat from the heat source and vaporizes, and the vaporized first working fluid transfers heat to the second working fluid through the heat transfer structure.

Description

Technical Field

[0001] This invention relates to a heat dissipation device for notebook computers. Background Technology

[0002] To meet modern demands, computers and various electronic devices are developing rapidly and their performance is constantly improving. However, this process also brings with it the problem of heat dissipation caused by high-performance hardware. Generally, computers and various electronic devices typically use heat dissipation components, such as thermal paste or heat sinks, to absorb and dissipate heat from the electronic components. However, this method of heat dissipation has limited effectiveness, leading to the development of heat dissipation components that utilize the phase change of the working fluid to promote heat conduction.

[0003] The aforementioned heat dissipation elements achieve heat transfer through the phase change and flow direction of the working fluid. However, existing heat dissipation elements can only be simply attached to a single electronic component that needs heat dissipation, and cannot be applied to two electronic components that can rotate relative to each other and both need heat dissipation (such as the motherboard where the keyboard of a notebook computer is located and the screen). As a result, the heat generated by the motherboard of the notebook computer can only be dissipated in the same mechanical space where the heat energy is located, and cannot transfer its heat energy to another mechanical space (such as the screen) for heat dissipation, resulting in limited overall heat dissipation effect.

[0004] Therefore, how to provide a heat dissipation device that can solve the above problems is one of the issues that the industry urgently needs to overcome. Summary of the Invention

[0005] One object of the present invention is to provide a heat dissipation device to solve at least one of the above-mentioned problems.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] According to one aspect of the present invention, a heat dissipation device is provided, comprising: a first heat spreader having a first chamber filled with a first working fluid and used to contact at least one heat source; at least one heat transfer structure disposed on the side of the first heat spreader; and a second heat spreader having a second chamber filled with a second working fluid and connected to the first heat spreader via the heat transfer structure; wherein the first working fluid absorbs heat from the heat source and vaporizes, and the vaporized first working fluid transfers heat to the second working fluid via the heat transfer structure.

[0008] As described above, the first heat dissipation plate includes: an upper plate; a lower plate, which, when combined with the upper plate, forms the first chamber, and has at least one opening on its side communicating with the first chamber; at least one heat pipe connected to the opening; at least one liquid channel formed in the first chamber; and at least one flow guiding structure formed on the liquid channel in the first chamber to guide the first working fluid to flow between the heat source and the heat pipe.

[0009] As described above, the heat pipe has an open end and a closed end located at its two opposite ends, and the interior of the heat pipe has a hollow portion. The open end is used to connect the hollow portion and the opening, so that the hollow portion and the first chamber are in communication with each other.

[0010] In the aforementioned heat dissipation device, the flow guiding structure includes at least one first capillary structure disposed in the first chamber and extending from around the heat source toward the heat pipe, and extending through the open end into the hollow portion.

[0011] In the aforementioned heat dissipation device, the first capillary structure is a strip-shaped structure made of fibers or a metal mesh.

[0012] As described above in the heat dissipation device, the flow guiding structure includes a plurality of second capillary structures that extend from around the heat source toward the heat pipe and guide the first working fluid in a capillary manner.

[0013] In the aforementioned heat dissipation device, the plurality of second capillary structures are strip-shaped sintered particles.

[0014] As described above, the heat dissipation device includes a plurality of metal blocks that extend from around the heat source toward the heat pipe and guide the first working fluid in a blocking manner.

[0015] As described above, the liquid channel includes a first liquid channel and a second liquid channel. The first liquid channel is disposed on the inner surface of the lower plate, and the second liquid channel is disposed on the inner surface of the upper plate.

[0016] In the aforementioned heat dissipation device, the first liquid channel and the second liquid channel are sintered granular bodies, metal meshes, grooves, or combinations thereof.

[0017] As described above, the first heat dissipation device further includes a plurality of third capillary structures disposed between and in contact with the first liquid channel and the second liquid channel, for the purpose of allowing the first working fluid to flow between the first liquid channel and the second liquid channel.

[0018] In the aforementioned heat dissipation device, a portion of the plurality of third capillary structures is arranged in an array corresponding to the heat source.

[0019] In the aforementioned heat dissipation device, the plurality of third capillary structures are cylindrical sintered particles.

[0020] As described above, the heat transfer structure includes a heat transfer element and a fastening element. The heat transfer element contacts both the heat pipe and the second heat spreader to transfer the heat absorbed by the vaporized first working fluid in the heat pipe to the second working fluid. The fastening element is used to fix the heat pipe to the heat transfer element.

[0021] As described above, the heat transfer element has a first block, a second block, and a support connecting the first block and the second block. The surface of the first block has a groove for the heat pipe to be disposed thereon and for the heat pipe to rotate relative to the heat transfer element. The second block is disposed on the second heat spreader plate, and a snap-fit ​​space is formed between the first block, the second block, and the support.

[0022] As described above, the heat dissipation device has a bent portion and two snap-fit ​​portions. The bent portion is attached to the surface of the heat pipe, and the two snap-fit ​​portions are formed at the two ends of the bent portion and extend into the snap-fit ​​space, and are attached to the first block.

[0023] In the aforementioned heat dissipation device, a heat transfer medium is coated between the heat transfer element and the heat pipe.

[0024] As described above, the second heat dissipation device includes: two plates that are combined to form the second chamber; at least one liquid channel formed on the inner surface of one of the two plates; and a plurality of capillary structures formed on the liquid channel and extending arcuately from the middle of the two plates toward the heat transfer structure, thereby guiding the second working fluid in a capillary manner.

[0025] In the aforementioned heat dissipation device, the liquid channel is a sintered particulate body, a metal mesh, a groove, or a combination thereof.

[0026] In the aforementioned heat dissipation device, the multiple capillary structures are strip-shaped structures made of fibers or metal mesh.

[0027] The beneficial effects of the present invention are that the heat spreader plate of the present invention can transfer the heat generated by the heat source it contacts to the heat pipe for heat dissipation, and the heat dissipation device formed by the heat spreader plate of the present invention, another heat spreader plate and heat transfer structure can transfer the heat of the heat source contacted by the heat spreader plate to another heat spreader plate in sequence through the heat pipe and heat transfer structure for heat dissipation, thereby effectively improving the overall heat dissipation efficiency. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the overall temperature distribution plate of the present invention.

[0029] Figure 2 This is an exploded view of the heat spreader of the present invention.

[0030] Figure 3 for Figure 1 A schematic diagram of the AA section line.

[0031] Figure 4 This is a schematic diagram of the overall heat dissipation device of the present invention.

[0032] Figure 5 This is an exploded view of the heat dissipation device of the present invention.

[0033] Figure 6 for Figure 4 A schematic diagram of the BB section.

[0034] The attached figures are labeled as follows:

[0035] 1: Heat dissipation device

[0036] 10: Heat spreader

[0037] 10': First heat spreader

[0038] 11:On the board

[0039] 111: Inner surface

[0040] 12: Lower board

[0041] 121: Inner surface

[0042] 13: Chamber

[0043] 13': First Chamber

[0044] 14: Opening

[0045] 15: Liquid Channel

[0046] 151: First Liquid Channel

[0047] 152: Second liquid channel

[0048] 16: Flow guiding structure

[0049] 161: First capillary structure

[0050] 162: Second capillary structure

[0051] 163: Metal Block

[0052] 17,17': Third capillary structure

[0053] 18: Heat pipe

[0054] 181: Open end

[0055] 182: Closed end

[0056] 183: Hollow section

[0057] 20: Second heat spreader

[0058] 21,22: Plates

[0059] 23: Second Chamber

[0060] 24: Liquid Channel

[0061] 25: Capillary structure

[0062] 30: Heat transfer structure

[0063] 31: Heat transfer components

[0064] 311: First block

[0065] 312: Second block

[0066] 313: Support

[0067] 314: Groove

[0068] 315: Clip Space

[0069] 32: Fasteners

[0070] 321: Bending section

[0071] 322: Buckle section

[0072] 40: Heat source Detailed Implementation

[0073] The following describes the implementation of the present invention through specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification, and can also implement or apply it through other different specific embodiments.

[0074] Please also refer to Figure 1 , Figure 2 and Figure 3 The heat spreader 10 of the present invention is used to contact at least one heat source 40, and the heat spreader 10 includes an upper plate 11, a lower plate 12, at least one heat pipe 18, at least one liquid channel 15 and at least one flow guiding structure 16.

[0075] The upper plate 11 has an inner surface 111, and the lower plate 12 also has an inner surface 121. When the upper plate 11 and the lower plate 12 are combined with their inner surfaces 111 and 121 facing each other, a chamber 13 can be formed inside them. The chamber 13 can be filled with working fluid. In addition, at least one side of the lower plate 12 has an opening. In this embodiment, an opening 14 is formed on each of the two opposite sides of the lower plate 12. The openings 14 can communicate with the chamber 13.

[0076] Additionally, liquid channels 15 are formed in chamber 13. Specifically, liquid channels 15 may include a first liquid channel 151 and a second liquid channel 152. The first liquid channel 151 may be disposed on the inner surface 121 of the lower plate 12, while the second liquid channel 152 may be disposed on the inner surface 111 of the upper plate 11. The liquid channels 15, the first liquid channel 151, and the second liquid channel 152 referred to herein can be considered as capillary layers for adsorbing working fluid. For example, the specific structure may be formed by sintered particles, metal mesh, grooves, or combinations thereof. Sintered particles refer to a tissue or structure with multiple capillary pores or interconnected pores formed by sintering metal powder. Metal mesh refers to a woven mesh with multiple meshes made of metal. Grooves refer to multiple pillars formed by wet etching, and the gaps between the multiple pillars can form multiple interconnected grooves to allow the working fluid to fill them. However, the present invention is not limited to the above.

[0077] The heat pipe 18 can be connected to the opening 14. Specifically, the heat pipe 18 has an open end 181 and a closed end 182 located at its two opposite ends, and the interior of the heat pipe 18 has a hollow portion 183. The open end 181 can be used to connect to the hollow portion 183, and the shape of the open end 181 can match the opening 14 (e.g., rectangular). This allows the open end 181 to simultaneously seal the opening 14 when it is located at the opening 14, so that the chamber 13 and the hollow portion 183 form a closed space that is interconnected. In addition, the radial cross-section of the closed end 182 of the heat pipe 18 can be circular, and the number of heat pipes 18 can be matched with the number of openings 14. For example, in this embodiment, there are two heat pipes 18 and two openings 14, but the present invention is not limited to this.

[0078] A flow guiding structure 16 may be formed on the liquid channel 15 in the chamber 13 to guide the working fluid between the heat source 40 and the heat pipe 18. Specifically, the flow guiding structure 16 may include at least one first capillary structure 161 and a plurality of second capillary structures 162. The first capillary structure 161 may be a strip-shaped structure made of fiber or the aforementioned metal mesh, disposed in the chamber 13, extending from around the heat source 40 toward the heat pipe 18, and extending through the open end 181 to the hollow portion 183. The second capillary structures 162 also extend from around the heat source 40 toward the heat pipe 18, and may be strip-shaped sintered particles. In one embodiment, the first liquid channel 151 and the second capillary structure 162 may be integrally formed as sintered particles, so the second capillary structure 162, having a structure of multiple capillary pores or interconnected pores, can guide the working fluid capillarily.

[0079] In one embodiment, the flow guiding structure 16 may also include a plurality of metal blocks 163 extending from around the heat source 40 toward the heat pipe 18 to guide the working fluid at different positions in the first liquid channel 151 in a blocking manner, thereby improving the effect of uniform distribution of the working fluid. The flow guiding structure 16 in the heat spreader 10 of the present invention may use only the second capillary structure 162, or only the metal blocks 163, or both the second capillary structure 162 and the metal blocks 163 may be used at different positions in the first liquid channel 151. The present invention is not limited thereto.

[0080] In this embodiment, the heat spreader 10 of the present invention further includes a plurality of third capillary structures 17, 17', which are disposed between and in contact with the first liquid channel 151 and the second liquid channel 152, so as to allow the liquid working fluid in the second liquid channel 152 to flow to the first liquid channel 151. In one embodiment, the third capillary structures 17, 17' may be cylindrical sintered particles and may be integrally formed with the first liquid channel 151, but the present invention is not limited thereto. In addition, the third capillary structures 17 may be uniformly distributed on the first liquid channel 151, and a portion of the third capillary structures 17' may be arranged in an array corresponding to the first liquid channel 151 at the heat source 40, so as to collect more liquid working fluid from the second liquid channel 152 to the top of the heat source 40.

[0081] In this embodiment, the operation of the vapor chamber 10 of the present invention involves distributing the liquid working fluid in the chamber 13, which then vaporizes after absorbing heat from the heat source 40. The vaporized working fluid can flow to the heat pipe 18 via the guide structure 16. After condensation, the vaporized working fluid in the heat pipe 18 returns to a liquid state. This liquid working fluid can then flow back to the heat source 40 in the chamber 13 via the first capillary structure 161 for the next heat dissipation cycle. In other words, the area of ​​the third capillary structure 17' located in the first liquid channel 151 can serve as an evaporation zone, while the heat pipe 18 can serve as a condensation zone. Additionally, the second liquid channel 152 can absorb the condensed working fluid, which can then flow back to the heat source 40 in the chamber 13 via the third capillary structures 17, 17' or the second capillary structure 162 for the next heat dissipation cycle.

[0082] Please also refer to Figure 4 , Figure 5 and Figure 6 The present invention further provides a heat dissipation device 1, including a first heat spreader 10', at least one heat transfer structure 30 and a second heat spreader 20, wherein the technical content of the first heat spreader 10' is the same as described above. Figures 1 to 3 The temperature distribution plate 10 described herein will not be elaborated upon here.

[0083] In this embodiment, the second heat spreader 20 includes two plates 21 and 22, at least one liquid channel 24, and multiple capillary structures 25. The two plates 21 and 22, when combined, form a second chamber 23 within each plate, which can be filled with a second working fluid. The liquid channel 24 can be formed on the inner surface of one of the two plates 21 and 22, or simultaneously on the inner surfaces of both plates 21 and 22, but this invention is not limited thereto. Furthermore, the liquid channel 24 can also be the same as the aforementioned liquid channel 15, first liquid channel 151, and second liquid channel 152, and can be a sintered particulate body, a metal mesh, a groove, or a combination thereof. Multiple capillary structures 25 are formed on the liquid channel 24 and extend from the middle of the two plates 21 and 22 toward their corners, for example, extending in an arc towards the heat transfer structure 30 installed at the corners of the two plates 21 and 22, and capillarily guiding the second working fluid. In addition, the capillary structure 25 may be the same as the first capillary structure 161 mentioned above, and may be a strip structure made of fibers or metal mesh.

[0084] In this embodiment, the heat transfer structure 30 is disposed on two opposite sides of the first heat spreader 10' and also near the corner of the second heat spreader 20, so that the second heat spreader 20 can be connected to the first heat spreader 10' through the heat transfer structure 30. The heat transfer structure 30 may include a heat transfer element 31 and a fastening element 32. The heat transfer element 31 can simultaneously contact the heat pipe 18 and the second heat spreader 20, and is used to transfer the heat absorbed by the vaporized first working fluid in the heat pipe 18 to the second working fluid, while the fastening element 32 is used to fix the heat pipe 18 to the heat transfer element 31.

[0085] In detail, the heat transfer element 31 has a first block 311, a second block 312, and a support 313. The support 313 connects the first block 311 and the second block 312. The width of the support 313 is smaller than that of the first block 311 and the second block 312, so that the overall structure of the heat transfer element 31 can be I-shaped or H-shaped, and a snap-fit ​​space 315 is formed between the first block 311, the second block 312, and the support 313. The surface of the first block 311 has a groove 314, on which the heat pipe 18 can be disposed. The second block 312 is disposed on the second heat spreader 20. In one embodiment, the groove 314 can conform to the shape of the heat pipe 18, for example, an arc-shaped groove, so that after the heat pipe 18 is disposed in the groove 314, the heat pipe 18 can rotate relative to the heat transfer element 31.

[0086] The fastener 32 may have a bent portion 321 and two fastening portions 322. The bent portion 321 is attached to the surface of the heat pipe 18, and the two fastening portions 322 are respectively formed at the two ends of the bent portion 321 and extend into the fastening space 315 and are attached to the first block 311. That is, a right angle may be formed between the fastening portion 322 and the bent portion 321, but the present invention is not limited thereto.

[0087] In one embodiment, a heat transfer medium may be coated between the heat transfer element 31 and the heat pipe 18 (e.g., in the groove 314 of the first block 311) to facilitate the transfer of heat absorbed by the vaporized first working fluid in the heat pipe 18 to the heat transfer element 31, and then from the heat transfer element 31 to the second working fluid in the second heat spreader 20.

[0088] In this embodiment, the heat dissipation device 1 of the present invention operates by distributing the liquid first working fluid in the first heat spreader 10' into the chamber 13, and vaporizing it after absorbing heat from the heat source 40. The vaporized first working fluid can flow into the heat pipe 18 through the guide structure 16. The vaporized first working fluid in the heat pipe 18 can transfer heat to the heat transfer element 31 in the heat transfer structure 30. At this time, the vaporized first working fluid will condense back into a liquid state. The condensed liquid first working fluid can flow back into the chamber 13 around the heat source 40 through the first capillary structure 161 for the next heat dissipation cycle. Furthermore, after the heat transfer element 31 absorbs heat, this heat can be absorbed by the liquid second working fluid within the second heat spreader 20, causing the second working fluid to vaporize. The vaporized second working fluid will then be distributed throughout the second heat spreader 20 for heat dissipation. After heat dissipation, the second working fluid will condense back into a liquid state. The condensed liquid second working fluid can then flow back to the connection point of the heat transfer structure 30 within the second heat spreader 20 via multiple capillary structures 25, for the next heat dissipation cycle. In other words, the heat transfer structure 30 acts as the heat source in contact with the second heat spreader 20. Therefore, the heat generated by the heat source 40 in contact with the first heat spreader 10' can be gradually conducted to the second heat spreader 20 for heat dissipation.

[0089] In one embodiment, the materials of the above-mentioned heat spreader 10, the upper plate 11 and the lower plate 12 of the first heat spreader 10', and the two plates 21 and 22 of the second heat spreader 20 may be copper, aluminum, stainless steel, dissimilar metals or combinations thereof, but the present invention is not limited thereto.

[0090] In summary, the vapor chamber of this invention can transfer the heat generated by the heat source it contacts to the heat pipe for heat dissipation. Furthermore, the heat dissipation device formed by combining the vapor chamber of this invention with another vapor chamber and a heat transfer structure can sequentially transfer the heat from the heat source in contact with the vapor chamber to the other vapor chamber via the heat pipe and heat transfer structure for heat dissipation, effectively improving overall heat dissipation efficiency. In addition, the vapor chambers in the heat dissipation device of this invention are connected by a heat transfer structure, allowing one vapor chamber to rotate relative to the other using the heat transfer structure as a fulcrum. Therefore, the heat dissipation device of this invention can be effectively applied to two electronic components that can rotate relative to each other and both require heat dissipation, such as in a laptop computer, where one vapor chamber is attached to the motherboard where the keyboard is located, and the other vapor chamber is attached to the back of the screen, thereby improving overall heat dissipation performance.

[0091] The above embodiments are merely illustrative of the technical principles, features, and effects of the present invention, and are not intended to limit the scope of implementation of the present invention. Those skilled in the art can modify and alter the above embodiments without departing from the spirit and scope of the present invention. However, any equivalent modifications and alterations made using the teachings of this invention should still be covered by the scope of the claims. The scope of protection of this invention should be as set forth in the claims.

Claims

1. A heat dissipation device, characterized in that, include: The first heat spreader has a first chamber filled with a first working fluid inside and is used to contact at least one heat source. At least one heat transfer structure is disposed on the side of the first heat exchange plate; as well as The second heat exchanger has a second chamber filled with a second working fluid inside, and is connected to the first heat exchanger through the heat transfer structure. The first working fluid absorbs heat from the heat source and then vaporizes. The vaporized first working fluid then transfers heat to the second working fluid through the heat transfer structure. The first heat spreader includes: upper plate; The lower plate, when combined with the upper plate, forms the first chamber, and its side has at least one opening communicating with the first chamber; At least one heat pipe is connected to the opening; At least one liquid channel is formed in the first chamber; and At least one flow guiding structure is formed on the liquid channel in the first chamber to guide the first working fluid to flow between the heat source and the heat pipe; The heat transfer structure includes a heat transfer element and a fastening element. The heat transfer element contacts both the heat pipe and the second heat spreader to transfer the heat absorbed by the vaporized first working fluid in the heat pipe to the second working fluid. The fastening element is used to fix the heat pipe to the heat transfer element.

2. The heat dissipation device as described in claim 1, characterized in that, The heat pipe has an open end and a closed end located at its two opposite ends, and the interior of the heat pipe has a hollow portion. The open end is used to connect the hollow portion and the opening, so that the hollow portion and the first chamber are in communication with each other.

3. The heat dissipation device as described in claim 2, characterized in that, The flow guiding structure includes at least one first capillary structure disposed in the first chamber and extending from the heat source toward the heat pipe, and extending through the open end into the hollow portion.

4. The heat dissipation device as described in claim 3, characterized in that, The first capillary structure is a strip-shaped structure made of fibers or metal mesh.

5. The heat dissipation device as described in claim 1, characterized in that, The flow guiding structure includes a plurality of second capillary structures that extend from around the heat source toward the heat pipe and guide the first working fluid in a capillary manner.

6. The heat dissipation device as described in claim 5, characterized in that, These multiple second capillary structures are strip-shaped sintered particles.

7. The heat dissipation device as described in claim 1, characterized in that, The flow guiding structure includes multiple metal blocks that extend from around the heat source toward the heat pipe and guide the first working fluid in a blocking manner.

8. The heat dissipation device as described in claim 1, characterized in that, The liquid channel includes a first liquid channel and a second liquid channel. The first liquid channel is disposed on the inner surface of the lower plate, and the second liquid channel is disposed on the inner surface of the upper plate.

9. The heat dissipation device as described in claim 8, characterized in that, The first liquid channel and the second liquid channel are sintered granular bodies, metal meshes, grooves, or combinations thereof.

10. The heat dissipation device as described in claim 8, characterized in that, The first heat spreader also includes a plurality of third capillary structures disposed between and in contact with the first liquid channel and the second liquid channel, for allowing the first working fluid to flow between the first liquid channel and the second liquid channel.

11. The heat dissipation device as described in claim 10, characterized in that, A portion of the multiple third capillary structures is arranged in an array corresponding to the heat source.

12. The heat dissipation device as described in claim 10, characterized in that, These multiple third capillary structures are cylindrical sintered particles.

13. The heat dissipation device as claimed in claim 1, characterized in that, The heat transfer element has a first block, a second block, and a support connecting the first block and the second block. The surface of the first block has a groove for the heat pipe to be disposed thereon and for the heat pipe to rotate relative to the heat transfer element. The second block is disposed on the second heat spreader plate, and a snap-fit ​​space is formed between the first block, the second block, and the support.

14. The heat dissipation device as described in claim 13, characterized in that, The fastener has a bent portion and two fastening portions. The bent portion is attached to the surface of the heat pipe, and the two fastening portions are formed at the two ends of the bent portion and extend into the fastening space, and are attached to the first block.

15. The heat dissipation device as claimed in claim 1, characterized in that, A heat transfer medium is coated between the heat transfer element and the heat pipe.

16. The heat dissipation device as claimed in claim 1, characterized in that, The second heat spreader includes: The two plates, when assembled, form the second chamber; At least one liquid channel is formed on the inner surface of one of the two plates; and Multiple capillary structures are formed on the liquid channel and extend arc-shaped from the middle of the two plates toward the heat transfer structure, guiding the second working fluid in a capillary manner.

17. The heat dissipation device as described in claim 16, characterized in that, The liquid channel is a sintered particulate body, a metal mesh, a groove, or a combination thereof.

18. The heat dissipation device as described in claim 16, characterized in that, These multiple capillary structures are strip-shaped structures made of fibers or metal meshes.

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