A cleaning apparatus for semiconductor wafers and a cleaning method thereof

Abstract

The application discloses a kind of cleaning device of semiconductor wafer and its cleaning method, the device includes box, box interior is provided with cleaning mechanism, part of cleaning mechanism is set in cleaning basket, and cleaning mechanism includes decontamination roller, and there are several decontamination rollers, and the lower end of several decontamination rollers is movably installed on the bottom surface inside cleaning basket, and the upper end of decontamination roller is arranged in water tank and working tank and is movably connected with the top wall of working tank;Several decontamination rollers are divided into several groups in longitudinal direction, and each group of decontamination rollers is equidistantly spaced arrangement;Cleaning roller, cleaning roller has several, and cleaning roller includes roller, and each roller is arranged between two adjacent decontamination rollers in longitudinal direction, and each roller is arranged on the roller wall inside water tank and is provided with water inlet;Nozzle, nozzle is uniformly distributed on the roller wall of roller inside cleaning basket;The device can achieve good cleaning effect while protecting the quality of semiconductor wafer from being damaged.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of cleaning devices, in particular to a semiconductor wafer cleaning device and a cleaning method thereof. BACKGROUND

[0002] Semiconductor wafers need to be cleaned. Taking sapphire substrates as an example, with the maturation of LED process technology and the continuous reduction of production cost, the application range and market size of sapphire substrates are also increasing. However, the epitaxial material GaN of LED cannot be directly synthesized due to its special physical and chemical properties, and must be attached to a specific substrate material for growth. The mainstream LED substrate material at present is single crystal sapphire substrate, and the growth of epitaxial layer has high requirements for the cleanliness of the patterned sapphire surface, and the patterning process also has high requirements for the cleanliness of the sapphire wafer surface. Therefore, it is essential to control the surface cleanliness of the sapphire substrate before the patterning process and epitaxial growth.

[0003] At present, there are various special cleaning devices for semiconductor wafers in the prior art. However, in order to improve the cleaning intensity, the cleaning mechanism in the prior art cleaning device mostly adopts high-intensity cleaning mechanism, such as strong flushing. Although this can remove stains to some extent, it also introduces another problem, i.e. the surface of the semiconductor crystal is damaged due to inappropriate intensity during the cleaning process, thereby affecting the quality of the semiconductor wafer. SUMMARY

[0004] The purpose of the present application is to provide a semiconductor wafer cleaning device and a cleaning method thereof, which solves the following technical problems:

[0005] The cleaning mechanism in the prior art cleaning device mostly adopts high-intensity cleaning mechanism, such as strong flushing. Although this can remove stains to some extent, it also introduces another problem, i.e. the surface of the semiconductor crystal is damaged due to inappropriate intensity during the cleaning process, thereby affecting the quality of the semiconductor wafer.

[0006] The purpose of the present application can be achieved by the following technical solutions:

[0007] A semiconductor wafer cleaning device, comprising a housing, the housing comprising a box body and a cover body, the cover body being installed on the front side of the box body; the box body is internally provided with

[0008] A support plate, the support plate being fixedly installed on the upper side of the box body and located above the cover body;

[0009] A water tank, the water tank being installed on the upper side of the support plate;

[0010] A working tank, the working tank being installed on the upper side of the water tank;

[0011] The cleaning basket is fixedly installed below the supporting plate and below the cover body.

[0012] The cleaning mechanism, part of which is arranged in the cleaning basket, comprises

[0013] The decontamination rollers are arranged on the inner bottom surface of the cleaning basket and have upper ends penetrating the water tank and the working tank and being movably connected to the top wall of the working tank. The decontamination rollers are divided into groups in the longitudinal direction, and the decontamination rollers in each group are arranged at equal intervals.

[0014] The cleaning rollers are arranged in the cleaning basket and comprise

[0015] The roller columns are arranged between the adjacent decontamination rollers in the longitudinal direction, and each roller column is arranged on the roller wall in the water tank and has a water inlet.

[0016] The spray heads are arranged on the roller wall in the cleaning basket.

[0017] The driving mechanism is used to drive the decontamination rollers and the roller columns to rotate.

[0018] The decontamination rollers are movably sleeved with the cleaning cloths on the outer surfaces in the cleaning basket.

[0019] In a further aspect, the driving mechanism comprises

[0020] The double-shaft motor is installed at the top end in the working tank, and the lower output end of the working tank is fixedly connected to one of the decontamination rollers.

[0021] The first gears are arranged on the roller walls of the decontamination rollers, and the adjacent first gears are meshed with each other.

[0022] The second gears are arranged on the roller walls of the decontamination rollers and the roller columns, and the adjacent second gears are meshed with each other.

[0023] In a further aspect, the shell is provided with a gas feeding mechanism on the upper side.

[0024] In a further aspect, the gas feeding mechanism comprises

[0025] The air cylinder is provided with a one-way valve in the air inlet end, and the air cylinder is provided with a piston mechanism inside. The air cylinder is connected to the air pipe on the upper end.

[0026] The air cavity is arranged in the tank body and comprises

[0027] The air pipe is connected to the cavity away from the air cylinder.

[0028] The nozzle is provided with a plurality of nozzles, and the plurality of nozzles are uniformly distributed on the upper side of the cavity, and a one-way valve is arranged in each nozzle.

[0029] In a further aspect, the piston mechanism comprises

[0030] The upper output end of the double-shaft motor is arranged through the upper wall of the box body and fixedly connected with the rotating disc.

[0031] The eccentric shaft is fixedly connected to the non-central position on the upper side of the rotating disc.

[0032] The transmission rod is movably connected to one end of the eccentric shaft.

[0033] The piston rod is movably connected to the other end of the transmission rod away from the eccentric shaft and movably arranged through the cylinder wall.

[0034] The piston plate is movably arranged in the cylinder, and one end of the piston plate in the cylinder is fixedly connected with the piston plate.

[0035] In a further aspect, the upper side of the box body is fixedly provided with a fixed sleeve through the connecting rod, and the piston rod is movably arranged through the fixed sleeve.

[0036] A semiconductor wafer cleaning method, the semiconductor wafer is cleaned by the cleaning device, comprising the following steps:

[0037] (1) open the cover, place the semiconductor wafer in the compartment in the cleaning basket, and then close the cover;

[0038] (2) turn on the switch of the cleaning device, and the internal part of the cleaning device starts to run cleaning;

[0039] (3) after cleaning, open the cover and take out the semiconductor wafer.

[0040] The beneficial effects of the embodiment of the application are as follows:

[0041] In the cleaning process, the driving mechanism is started to drive the stain-removing roller and the roller column to rotate. When the stain-removing roller rotates, it can rub the surface of the semiconductor wafer. The rubbing force is moderate, so that the dirt on the surface of the semiconductor wafer can be removed. At the same time, when the roller column rotates, the water in the water tank is sucked into the roller column through the water inlet, and the semiconductor wafer in the cleaning basket is washed through the nozzle, so that the dirt on the surface of the semiconductor wafer is further removed. After the double cleaning of the nozzle and the stain-removing roller, the semiconductor wafer can be fully cleaned, and the cleaning force is moderate and soft. The quality of the semiconductor wafer can be protected from being damaged while achieving good cleaning effect. BRIEF DESCRIPTION OF DRAWINGS

[0042] The application will be further described below with reference to the drawings.

[0043] Figure 1 is the internal structure side view of the embodiment of the application;

[0044] Figure 2 is the internal structure schematic view of the cleaning box of the embodiment of the application;

[0045] Figure 3 is the internal structure schematic view of part of the structure of the embodiment of the application;

[0046] Figure 4 is the front view of part of the structure of the embodiment of the application;

[0047] Figure 5 is the three-dimensional structure schematic view of part of the structure of the embodiment of the application.

[0048] The figure marks represent:

[0049] 100, shell; 110, box body; 120, cover body;

[0050] 200, cleaning basket;

[0051] 300, cleaning mechanism; 310, stain-removing roller; 320, cleaning roller; 321, roller column; 322, spray head; 323, water inlet;

[0052] 400, driving mechanism; 410, double-shaft motor; 420, first gear; 430, second gear;

[0053] 500, air feeding mechanism; 510, rotating disc; 520, eccentric shaft; 530, transmission rod; 540, piston rod; 550, fixed sleeve; 560, piston plate; 570, air cylinder; 580, air pipe; 590, air cavity; 591, cavity; 592, spray pipe;

[0054] 600, water tank;

[0055] 700, working tank;

[0056] 800, support plate. DETAILED DESCRIPTION

[0057] The technical solutions in the embodiments of the application will be described clearly and completely below with reference to the drawings in the embodiments of the application. Obviously, the described embodiments are only part of the embodiments of the application, rather than all the embodiments of the application. Based on the embodiments in the application, all other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the application.

[0058] Please refer to Figures 1-5As shown, the present application is a kind of semiconductor wafer cleaning device, shell 100 includes box 110 and cover 120, cover 120 is installed on the front side of box 110, the mounting method of cover 120 is not specifically limited, for example, flip or push-pull, in the embodiment of the application, cover 120 is installed by flip, cover 120 is hinged between the upper side and box 110, and handle is arranged on the outside of cover 120, to facilitate the opening and closing of cover 120;Cover 120 is also provided with sealing lock, to seal the box 110 tightly, to avoid water seepage in the subsequent cleaning process.

[0059] Box 110 is internally provided with support plate 800, support plate 800 is fixedly installed on the inside of box 110 upper side, and is located above cover 120;Water tank 600 is fixedly installed on the upper side of support plate 800, and working tank 700 is fixedly installed on the upper side of water tank 600;Box 110 is internally provided with cleaning basket 200, cleaning basket 200 is fixedly installed below support plate 800, and is located below cover 120, therefore, when cover 120 is opened and closed, the components in the inside of box 110 will not be affected.

[0060] Box 110 is internally provided with cleaning mechanism 300, part of cleaning mechanism 300 is arranged in cleaning basket 200, cleaning mechanism 300 includes decontamination roller 310, decontamination roller 310 has several, the lower end of several decontamination roller 310 is movably installed on the inside bottom surface of cleaning basket 200, and the upper end of decontamination roller 310 is arranged in water tank 600 and working tank 700 and is movably connected with the top wall of working tank 700;Several decontamination roller 310 is divided into several groups in longitudinal direction, and each group of decontamination roller 310 is arranged at equal intervals;Among them, between each adjacent two decontamination roller 310 in longitudinal direction, a cleaning roller 320 is arranged, therefore, the longitudinal decontamination roller 310 and cleaning roller 320 divide the inside of cleaning basket 200 into several cleaning spaces, and each space is used to place semiconductor wafer.

[0061] Cleaning roller 320 includes roller 321, each roller 321 is arranged between adjacent two decontamination roller 310 in longitudinal direction, water inlet 323 is formed on the roller wall in the inside of each roller 321, and several nozzles 322 are arranged on the roller wall in the inside of each roller 321, the model of nozzle 322 is not specifically limited, which can be selected according to actual use demand in the existing market, therefore, it will not be described hereinafter;Driving mechanism 400 is arranged on cleaning mechanism 300, driving mechanism 400 is used to drive decontamination roller 310 and roller 321 to rotate.

[0062] Specifically, in use, the cover 120 is opened, the semiconductor wafer is placed in the cleaning space, and then the cover 120 is closed; the device is connected with a water inlet system and a drainage system, the switch of the device is turned on, and then the water inlet system supplies water into the box body 110 until the water level reaches the cleaning basket 200; then the semiconductor wafer is soaked in the cleaning basket 200, after a period of soaking, the adhesion of the dirt on the surface of the semiconductor wafer is reduced, and the driving mechanism 400 is started to drive the decontamination roller 310 and the roller column 321 to rotate, when the decontamination roller 310 rotates, it can rub the surface of the semiconductor wafer, the rubbing force is moderate, and the dirt on the surface of the semiconductor wafer can be removed; at the same time, when the roller column 321 rotates, the water in the water tank 600 is sucked into the roller column 321 through the water inlet 323, and the semiconductor wafer in the cleaning basket 200 is washed through the nozzle 322, so that the dirt on the surface of the semiconductor wafer is further removed, after the double cleaning of the nozzle 322 and the decontamination roller 310, the semiconductor wafer can be fully cleaned, and the cleaning force is moderate and soft, which can achieve good cleaning effect while protecting the quality of the semiconductor wafer.

[0063] Further, the outer surface of the decontamination roller 310 in the cleaning basket 200 is detachably sleeved with a cleaning cloth, and the cleaning cloth is made of polyester fiber dust-free cloth, which has a soft surface and high cleaning and wiping capacity.

[0064] Further, the driving mechanism 400 includes a double-shaft motor 410 installed at the top of the working box 700, and the lower output end of the working box 700 is fixedly connected with one of the decontamination rollers 310; a first gear 420, the number of the first gears 420 is the same as that of the decontamination rollers 310, and each first gear 420 is fixedly sleeved on the roller wall of each decontamination roller 310, and the adjacent first gears 420 are meshed with each other; and a second gear 430, the second gears 430 are provided in plurality, and each second gear 430 is fixedly sleeved on the roller wall of the adjacent decontamination roller 310 and the roller column 321, and the plurality of second gears 430 are meshed with each other.

[0065] Therefore, when the double-shaft motor 410 is started, the double-shaft motor 410 drives the decontamination roller 310 connected with the double-shaft motor 410 to rotate, the decontamination roller 310 drives the first gear 420 installed thereon to rotate, and then the first gear 420 drives the remaining first gears 420 to rotate synchronously, so that all the first gears 420 rotate, and at this time, the first gear 420 drives the second gear 430 installed thereon to rotate, and the second gear 430 drives the roller column 321 to rotate through the second gear 430 installed on the roller column 321, so that the synchronous rotation of all the decontamination rollers 310 and the roller column 321 is realized.

[0066] Further, the shell 100 is provided with a gas feeding mechanism 500 on the upper side.

[0067] The gas feeding mechanism 500 is used to perform air flushing to the inside of the box 110, so as to generate air pressure on the water in the inside of the box 110, and the water in the inside of the box 110 generates an upward force, which drives the water to generate an impact force on the surface of the semiconductor wafer, so as to remove stubborn stains on the surface of the semiconductor wafer.

[0068] Further, the gas feeding mechanism 500 comprises a gas cylinder 570, a one-way valve is arranged in the gas inlet end of the gas cylinder 570, and a piston mechanism is arranged in the gas cylinder 570; a gas pipe 580 is connected to the end of the gas cylinder 570 on the upper side; a gas cavity 590 is arranged in the inside of the box 110, the gas cavity 590 comprises a cavity 591, and the end of the gas pipe 580 away from the gas cylinder 570 is connected to the cavity 591; a plurality of spray pipes 592 are arranged, the plurality of spray pipes 592 are uniformly distributed on the upper side of the cavity 591, and a one-way valve is arranged in each of the spray pipes 592.

[0069] When the piston mechanism moves in the gas cylinder 570, the gas cylinder 570 continuously sucks in gas, and the gas is transmitted to the cavity 591 through the gas pipe 580, and finally is discharged through the spray pipes 592, so as to perform air flushing to the water in the inside of the box 110.

[0070] Further, the piston mechanism can be any mechanism that can realize piston movement, for example, in the embodiment of the present application, the piston mechanism comprises a rotating disc 510, the upper output end of the double-shaft motor 410 is arranged through the upper wall of the box 110 and is fixedly connected with the rotating disc 510; an eccentric shaft 520 is fixedly connected to the non-central position on the upper side of the rotating disc 510; a transmission rod 530 is movably connected to one end of the eccentric shaft 520; a piston rod 540 is movably connected to one end of the transmission rod 530 away from the eccentric shaft 520, and the other end of the piston rod 540 is movably arranged through the cylinder wall of the gas cylinder 570; and a piston plate 560 is movably arranged in the inside of the gas cylinder 570, and one end of the piston plate 560 in the inside of the gas cylinder 570 is fixedly connected with the piston plate 560.

[0071] In detail, when the double-shaft motor 410 is started, the rotating disc 510 is driven to rotate, the rotating disc 510 drives the eccentric shaft 520 to move, the eccentric shaft 520 drives the piston rod 540 to make reciprocating motion through the transmission rod 530, and the piston rod 540 further drives the piston plate 560 to make piston motion in the inside of the gas cylinder 570.

[0072] Further, the box 110 is fixedly provided with a fixed sleeve 550 on the upper side through a connecting rod, and the piston rod 540 is movably arranged through the fixed sleeve 550.

[0073] When the piston rod 540 reciprocates, the piston rod 540 reciprocates in the fixed sleeve 550, which is beneficial to improve the stability of the piston rod 540 during movement.

[0074] A semiconductor wafer cleaning method based on the above cleaning device, comprising the following steps:

[0075] (1) open the cover 120, place the semiconductor wafer in the compartment in the cleaning basket 200, and then close the cover 120;

[0076] (2) turn on the switch of the cleaning device, and the internal cleaning of the cleaning device starts to run;

[0077] (3) after cleaning, open the cover 120 and take out the semiconductor wafer.

[0078] The working principle of the embodiment of the application is as follows:

[0079] In use, first open the cover 120, place the semiconductor wafer in the cleaning space, and then close the cover 120; the device is connected with a water inlet system and a drainage system, and opening the switch of the device makes the water inlet system inlet water into the box 110 until the water level reaches the cleaning basket 200; then the semiconductor wafer is soaked in the cleaning basket 200, and after a period of soaking, the adhesion of dirt on the surface of the semiconductor wafer is reduced, and the driving mechanism 400 is started to drive the decontamination roller 310 and the roller 321 to rotate, the decontamination roller 310 rubs the surface of the semiconductor wafer when rotating, the friction degree is moderate, and the dirt on the surface of the semiconductor wafer can be removed; at the same time, the roller 321 rotates, water in the water tank 600 is sucked into the roller 321 through the water inlet 323, and the semiconductor wafer in the cleaning basket 200 is washed through the nozzle 322, so as to further remove the dirt on the surface of the semiconductor wafer, and the semiconductor wafer can be fully cleaned through the double cleaning of the nozzle 322 and the decontamination roller 310, and the cleaning degree is moderate and soft, which can achieve good cleaning effect while protecting the quality of the semiconductor wafer from being damaged.

[0080] In the description of the present application, it is to be understood that the terms "upper", "lower", "left", "right", and the like refer to the orientation or positional relationship shown in the drawings, and are only used to facilitate the description of the present application and simplify the description, and do not indicate or imply that the device or element referred to must have a particular orientation, and a particular orientation configuration and operation, therefore, cannot be understood as a limitation on the present application. In addition, "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first", "second" can explicitly or implicitly include one or more features. In the description of the present application, unless otherwise specified, the meaning of "a plurality of" is two or more.

[0081] In the description of the present application, it should be noted that, unless otherwise specified and limited, the terms "mounting", "connecting", "connecting" and the like should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0082] The above describes one embodiment of the present application in detail, but the content described is only the preferred embodiment of the present application, and cannot be considered as limiting the scope of the present application. Any equivalent changes and improvements made within the scope of the present application shall still belong to the scope of the present patent.

Claims

1. A semiconductor wafer cleaning device, comprising a housing (100), the housing (100) comprising a box body (110) and a cover body (120), the cover body (120) being installed on the front side of the box body (110); characterized in that, The box (110) is internally provided with A support plate (800) is fixedly installed on the upper side of the box (110) and above the cover (120); A water tank (600) is installed on the upper side of the support plate (800); A working tank (700) is installed on the upper side of the water tank (600); A cleaning basket (200) is fixedly installed below the support plate (800) and below the cover (120); A cleaning mechanism (300) is partially arranged in the cleaning basket (200), and the cleaning mechanism (300) comprises A plurality of decontamination rollers (310) are movably installed on the bottom surface of the cleaning basket (200), and the upper ends of the decontamination rollers (310) are movably connected with the top wall of the working tank (700) through the water tank (600) and the working tank (700); the decontamination rollers (310) are divided into groups in the longitudinal direction, and each group of decontamination rollers (310) is arranged at equal intervals; A plurality of cleaning rollers (320) are arranged, and the cleaning roller (320) comprises A roller column (321) is arranged between two adjacent decontamination rollers (310) in the longitudinal direction, and a water inlet (323) is formed on the roller wall in the water tank (600); A plurality of nozzles (322) are uniformly distributed on the roller wall of the roller column (321) in the cleaning basket (200); A driving mechanism (400) is used to drive the decontamination rollers (310) and the roller columns (321) to rotate.

2. The apparatus for cleaning a semiconductor wafer according to claim 1, wherein A cleaning cloth is detachably sleeved on the outer surface of the decontamination roller (310) in the cleaning basket (200).

3. The apparatus for cleaning a semiconductor wafer as set forth in claim 1, wherein The driving mechanism (400) comprises A double-shaft motor (410) is installed at the top end of the working tank (700), and the lower output end of the working tank (700) is fixedly connected with one of the decontamination rollers (310); The number of first gears (420) is the same as that of the decontamination rollers (310), the first gears (420) are fixedly sleeved on the roller walls of the decontamination rollers (310), respectively, and the adjacent first gears (420) are meshed with each other; A plurality of second gears (430) are fixedly sleeved on the roller walls of the adjacent decontamination rollers (310) and roller columns (321), respectively, and the second gears (430) are meshed with each other.

4. The apparatus for cleaning a semiconductor wafer according to claim 3, wherein An air feeding mechanism (500) is installed on the upper side of the shell (100).

5. The apparatus for cleaning a semiconductor wafer according to claim 4, wherein The air feeding mechanism (500) comprises The air cylinder (570) is internally provided with a one-way valve at the air inlet end, and is internally provided with a piston mechanism; the air cylinder (570) is connected with an air pipe (580) at the upper end of the terminal end; The air cavity (590) is arranged inside the box body (110), and the air cavity (590) comprises The cavity (591) is connected with the cavity (591) at the end of the air pipe (580) away from the air cylinder (570); The spray pipe (592) has a plurality of spray pipes (592), and the plurality of spray pipes (592) are uniformly distributed on the upper side of the cavity (591), and each spray pipe (592) is provided with a one-way valve.

6. The apparatus for cleaning a semiconductor wafer according to claim 5, wherein The piston mechanism comprises The upper output end of the double-shaft motor (410) is arranged on the upper wall of the box body (110) and is fixedly connected with the rotating disc (510); The eccentric shaft (520) is fixedly connected to the non-central part on the upper side of the rotating disc (510); The transmission rod (530) is movably connected to the eccentric shaft (520) at one end; The piston rod (540) is movably connected to the transmission rod (530) at one end away from the eccentric shaft (520), and the other end is movably arranged in the cylinder wall of the air cylinder (570); The piston plate (560) is movably arranged inside the air cylinder (570), and the end of the piston rod (540) inside the air cylinder (570) is fixedly connected with the piston plate (560).

7. The apparatus for cleaning a semiconductor wafer according to claim 6, wherein The upper side of the box body (110) is fixedly provided with a fixed sleeve (550) through a connecting rod, and the piston rod (540) is movably arranged in the fixed sleeve (550).

8. A method of cleaning a semiconductor wafer, characterized by, The semiconductor wafer is cleaned by the cleaning device of any one of claims 1-7, comprising the following steps: (1) open the cover (120), place the semiconductor wafer in the compartment in the cleaning basket (200), and then close the cover (120); (2) turn on the switch of the cleaning device, and the internal part of the cleaning device starts to run cleaning; (3) after cleaning, open the cover (120) to take out the semiconductor wafer.

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