A method for reducing PCB exposure dry film breakage.

Abstract

This invention provides a method for reducing PCB exposure dry film breakage damage, comprising the following steps: drilling holes in the substrate surface, copper plating the drilled substrate to obtain a copper-clad laminate with a copper foil layer; pressing dry film onto the surface of the copper foil layer, attaching positive film to the surface of the dry film, and after the dry film is attached to the positive film, applying yellow light-blocking tape; exposing the copper-clad laminate; developing the exposed copper-clad laminate to dissolve the unexposed dry film on the surface of the copper foil layer; performing pattern electroplating on the developed copper-clad laminate and filling the drilled holes to form a pattern layer; leveling the pattern layer and removing the exposed dry film from the surface of the copper-clad laminate. This invention provides a method for reducing PCB exposure dry film breakage damage. By attaching yellow light-blocking tape to the surface of the positive film, during development, because both sides are covered with solid patterned light-blocking material during exposure, no optical polymerization reaction occurs, and both react with the developing solution, resulting in complete development and removal of dry film breakage.

Description

Technical Field

[0001] This invention relates to the field of PCB processing, and more particularly to a method for reducing PCB exposure dry film breakage. Background Technology

[0002] Printed circuit boards (PCBs) are the providers of electrical connections for electronic components.

[0003] Currently, the printed circuit board industry mostly uses semi-automatic CCD alignment production for circuit exposure. The target position is usually designed with one side of the film as a solid dot of 1.5mm and the other side as a hole ring of 2.7mm. This is so that it can be identified and aligned on the CCD exposure machine. However, this design will cause the dry film of the target hole to break and fall off during the development process, resulting in dry film fragments and product scrap.

[0004] Therefore, it is necessary to provide a method for reducing PCB exposure dry film breakage to solve the above-mentioned technical problems. Summary of the Invention

[0005] This invention provides a method for reducing PCB exposure dry film breakage during the development process on a CCD exposure machine. This method solves the problem that in existing PCBs, the dry film in the target holes breaks and falls off during the development process, resulting in dry film breakage and product scrap.

[0006] To solve the above-mentioned technical problems, the present invention provides a method for reducing PCB exposure dry film breakage, comprising the following steps:

[0007] S1. Drill holes on the surface of the substrate, and plate copper on the substrate after drilling to obtain a copper-clad laminate with a copper foil layer.

[0008] S2. Press the dry film onto the surface of the copper foil layer, attach a positive film to the surface of the dry film, and after the dry film is attached to the positive film, attach yellow light-blocking tape, expose the copper-clad laminate, develop the exposed copper-clad laminate, and dissolve the unexposed dry film on the surface of the copper foil layer.

[0009] S3. Perform pattern electroplating on the copper-clad laminate after development treatment and fill the drilled holes to form a pattern layer;

[0010] S4. Flatten the pattern layer, remove the exposed dry film on the surface of the copper-clad laminate, and etch the copper-clad laminate to obtain a printed circuit board.

[0011] Preferably, in step S1, a drilling device is required when drilling the substrate. The drilling device includes a worktable, a drilling component is fixedly installed on one side of the worktable surface, a groove is formed on the surface of the worktable, moving components are provided on both sides of the inner wall of the groove, a sliding component is provided between two moving components, the sliding component includes a mounting base, connecting rods are connected between both sides of the inner wall of the mounting base, a sliding seat is provided between two connecting rods, a rotating component is provided on the surface of the sliding seat, a placement plate is provided on the surface of the rotating component, and multiple fixing components are provided on the surface of the placement plate.

[0012] Preferably, the movable component includes a movable groove, and a movable element is disposed inside the movable groove, one side of which is fixedly connected to one side of the bottom of the mounting base.

[0013] Preferably, the rotating assembly includes a rotating seat, and the surface of the rotating seat is provided with a groove.

[0014] Preferably, a slider is slidably connected inside the groove, and the slider is rotatably connected to the placement plate via a rotating shaft.

[0015] Preferably, the fixing component includes a triangular fixing block, and a movable groove is formed on the surface of the placement plate on the side opposite to the triangular fixing block, and the movable block is slidably connected inside the movable groove.

[0016] Preferably, a fixed block is connected to the surface of the movable block.

[0017] Preferably, a collection component is provided inside the groove, the collection component includes a collection box, and a positioning block is connected to the center of the bottom of the collection box.

[0018] Preferably, a positioning groove adapted to the positioning block is formed at the center of the bottom of the inner wall of the groove.

[0019] Preferably, a fixing bolt is provided on one side of the surface of the sliding seat, and a plurality of fixing holes adapted to the fixing bolt are sequentially opened from left to right on one side of the surface of the connecting rod.

[0020] Compared with related technologies, the PCB exposure dry film breakage method provided by the present invention for reducing damage to printed circuit boards has the following beneficial effects:

[0021] This invention provides a method for reducing PCB exposure dry film breakage during printing. By attaching yellow light-blocking tape to the surface of the positive film, during development, the solid pattern on both sides blocks the light, preventing optical polymerization. Both sides react with the developing solution and are completely developed, thus improving the formation of dry film breakage. Attached Figure Description

[0022] Figure 1 A schematic diagram of the structure of a first embodiment of a PCB exposure dry film breakage method for reducing damage to printed circuit boards provided by the present invention;

[0023] Figure 2 for Figure 1 Side view of the circuit board shown;

[0024] Figure 3 This is a schematic diagram of the structure of a second embodiment of a PCB exposure dry film fragmentation method for reducing damage to printed circuit boards provided by the present invention;

[0025] Figure 4 for Figure 3 The enlarged schematic diagram of part A shown below;

[0026] Figure 5 for Figure 3 A schematic diagram of the overall three-dimensional structure of the device shown;

[0027] Figure 6 for Figure 5 The enlarged schematic diagram of section B is shown below;

[0028] Figure 7 for Figure 3 The enlarged schematic diagram of section C is shown.

[0029] Numbered in the diagram: 1. Workbench, 2. Groove, 3. Sliding assembly, 31. Mounting base, 32. Connecting rod, 33. Sliding seat, 4. Rotating assembly, 41. Rotating seat, 42. Slide groove, 43. Slider, 5. Placement plate, 6. Fixing assembly, 61. Triangular fixing block, 62. Movable groove, 63. Movable block, 64. Fixing block, 7. Moving assembly, 71. Movable groove, 72. Moving part, 8. Drilling part, 9. Collection assembly, 91. Collection box, 92. Positioning block, 93. Positioning groove, 10. Base plate, 11. Solid dot, 12. Yellow light-blocking tape. Detailed Implementation

[0030] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0031] First Embodiment

[0032] Please refer to the following: Figure 1 and Figure 2 ,in, Figure 1 A schematic diagram of the structure of a first embodiment of a PCB exposure dry film breakage method for reducing damage to printed circuit boards provided by the present invention; Figure 2 for Figure 1 The diagram shows a side view of the circuit board. A method for reducing PCB exposure dry film breakage damage includes the following steps:

[0033] S1. Drill holes in the surface of substrate 10, and plate copper on the substrate 10 after drilling to obtain a copper-clad laminate with a copper foil layer.

[0034] S2. Press the dry film onto the surface of the copper foil layer, attach a positive film to the surface of the dry film, and after the dry film is attached to the positive film, attach yellow light-blocking tape 12, expose the copper-clad laminate, develop the exposed copper-clad laminate, and dissolve the unexposed dry film on the surface of the copper foil layer.

[0035] S3. Perform pattern electroplating on the copper-clad laminate after development treatment and fill the drilled holes to form a pattern layer;

[0036] S4. Flatten the pattern layer, remove the exposed dry film on the surface of the copper-clad laminate, and etch the copper-clad laminate to obtain a printed circuit board.

[0037] The substrate 10 is a target, and a solid dot 11 is provided at the center of the surface of the substrate 10. Yellow light-shielding tape 12 is attached to the surface of the substrate 10. The solid dot 11 is 1.5mm in size. Alternatively, a ring with a diameter of 2.7mm is provided on the surface of the substrate 10 for use.

[0038] The working principle of the PCB exposure dry film breakage method provided by this invention to reduce damage to printed circuit boards is as follows:

[0039] When using it, with the target design unchanged, before exposure, apply yellow light-blocking tape 12 to the target film position. During development, since there is solid pattern light blocking on both sides during the exposure process, no optical polymerization reaction occurs, and both can react with the developing solution and be completely developed, thereby improving the generation of dry film fragments.

[0040] Compared with related technologies, the PCB exposure dry film breakage method provided by the present invention for reducing damage to printed circuit boards has the following beneficial effects:

[0041] This invention provides a method for reducing PCB exposure dry film breakage during printing. By attaching yellow light-blocking tape 12 to the surface of the positive film, during development, because both sides are covered with solid patterns to block light, no optical polymerization reaction occurs, and both sides can react with the developing solution and be completely developed away, thereby improving the generation of dry film breakage.

[0042] Second Embodiment

[0043] Please refer to the following: Figure 3 , Figure 4 , Figure 5 , Figure 6 and Figure 7Based on the first embodiment of this application, which provides a method for reducing PCB exposure dry film breakage and damage to printed circuit boards, the second embodiment of this application proposes another method for reducing PCB exposure dry film breakage and damage to printed circuit boards. The second embodiment is merely a preferred embodiment of the first embodiment, and the implementation of the second embodiment will not affect the separate implementation of the first embodiment.

[0044] Specifically, the second embodiment of this application provides a method for reducing PCB exposure dry film breakage damage, which differs in that, in step S1, a drilling device is required when drilling the substrate. The drilling device includes a worktable 1, a drilling component 8 is fixedly installed on one side of the surface of the worktable 1, a groove 2 is formed on the surface of the worktable 1, and moving components 7 are provided on both sides of the inner wall of the groove 2. A sliding component 3 is provided between the two moving components 7. The sliding component 3 includes a mounting base 31, a connecting rod 32 is connected between both sides of the inner wall of the mounting base 31, a sliding seat 33 is provided between the two connecting rods 32, a rotating component 4 is provided on the surface of the sliding seat 33, a placement plate 5 is provided on the surface of the rotating component 4, and a plurality of fixing components 6 are provided on the surface of the placement plate 5.

[0045] The sliding seat 33 includes two sliding sleeves, with a rectangular plate connected between the two sliding sleeves. The two sliding sleeves are fitted onto the surfaces of the two connecting rods 32. The connecting rods 32 and the sliding seat 33 facilitate the movement of the rotating assembly 4 to the outside of the worktable 1, which is convenient for fixing the circuit board. In use, by pulling the placement plate 5, the rotating seat 41 drives the sliding seat 33 to move between the two connecting rods 32.

[0046] The movable component 7 includes a movable groove 71, and a movable element 72 is disposed inside the movable groove 71. One side of the movable element 72 is fixedly connected to one side of the bottom of the mounting base 31.

[0047] The movable groove 71 is formed on the side of the inner wall of the groove 2. The use of the movable groove 71 and the movable component 72 facilitates the movement of the sliding component 3. The movable component 72 consists of a movable block and an L-shaped connecting block.

[0048] The rotating assembly 4 includes a rotating seat 41, and the surface of the rotating seat 41 is provided with a sliding groove 42.

[0049] The slide groove 42 is slidably connected to a slider 43, and the slider 43 is rotatably connected to the placement plate 5 via a rotating shaft.

[0050] The center positions of the rotating seat 41 and the sliding seat 33 are rotatably connected by a rotating shaft. The use of the rotating seat 41 facilitates the rotation of multiple placement plates 5, making it easy to move the circuit board to the bottom of the drilling part 8. The use of the slide groove 42 and the slider 43 can adjust the position of the placement plate 5. A positioning block is connected to one side of the slider 43, and a positioning groove that matches the positioning block is opened on one side of the inner wall of the slide groove 42. The use of the positioning block and the positioning groove can prevent the slider 43 from falling out of the slide groove 42.

[0051] The fixing component 6 includes a triangular fixing block 61. A movable groove 62 is provided on the surface of the placement plate 5 on the side opposite to the triangular fixing block 61. A movable block 63 is slidably connected inside the movable groove 62.

[0052] A spring is provided inside the movable slot 62 and on the opposite side of the movable block 63. The spring can be used to drive the fixed block 64 to fix the four corners of the circuit board by pushing the movable block 63 to move inside the movable slot 62.

[0053] The surface of the movable block 63 is connected to the fixed block 64.

[0054] The groove 2 is provided with a collection component 9, which includes a collection box 91, and a positioning block 92 is connected to the center of the bottom of the collection box 91.

[0055] The use of positioning block 92 and positioning groove 93 facilitates the installation of collection box 91 and helps to collect debris generated during circuit board drilling.

[0056] A positioning groove 93, which is adapted to the positioning block 92, is provided at the center of the bottom of the inner wall of the groove 2.

[0057] A fixing bolt is provided on one side of the surface of the sliding seat 33, and a plurality of fixing holes adapted to the fixing bolt are sequentially opened from left to right on one side of the surface of the connecting rod 32.

[0058] The working principle of the PCB exposure dry film breakage method provided by this invention to reduce damage to printed circuit boards is as follows:

[0059] In use, the circuit board is first placed on the surface of the placement plate 5. When placing the circuit board, the fixing block 64 is pressed and moved on the surface of the placement plate 5. When the fixing block 64 moves, it drives the bottom movable block 63 to move inside the movable groove 62. After the circuit board is placed, the placement plate 5 is pushed to drive the slider 43 to move inside the slide groove 42. When the placement plate 5 moves the circuit board to the appropriate position, the rotating seat 41 is used to move the circuit board to the bottom of the drilling part 8 for drilling.

[0060] Compared with related technologies, the PCB exposure dry film breakage method provided by the present invention for reducing damage to printed circuit boards has the following beneficial effects:

[0061] This invention provides a method for reducing PCB exposure dry film breakage by providing a method for reducing damage to printed circuit boards. The method involves setting a moving component 7 on both sides of the inner wall of the groove 2 opened on the surface of the worktable 1, which works in conjunction with a sliding component 3, a rotating component 4 and a placement plate 5 to fix multiple circuit boards at the same time. This method can replace the current method of placing and processing individual circuit boards. At the same time, it can also be rotated and adjusted at will according to the position of the drilled holes on the circuit board, thereby improving the convenience of operation.

[0062] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural or procedural transformations made based on the content of the present invention specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of the present invention.

Claims

1. A PCB exposure dry film breaking method for reducing printed circuit board damage, comprising the following steps: S1. Drilling holes on the surface of a substrate, and plating copper on the substrate after drilling to obtain a copper-clad plate with a copper foil layer; S2. Pressing a dry film on the surface of the copper foil layer, attaching a positive film on the surface of the dry film, and then attaching a yellow light-shielding tape on the surface of the positive film after the dry film is attached to the positive film, exposing the copper-clad plate, developing the exposed copper-clad plate, and dissolving the dry film on the surface of the copper foil layer that is not exposed; S3. Performing pattern plating on the developed copper-clad plate and filling the holes to form a pattern layer; S4. Flattening the pattern layer, removing the dry film exposed on the surface of the copper-clad plate, and etching the copper-clad plate to obtain a printed circuit board, characterized in that a drilling device is used when drilling the substrate in S1, the drilling device comprises a workbench, a drilling part is fixedly installed on one side of the surface of the workbench, a groove is formed on the surface of the workbench, a moving assembly is arranged on both sides of the inner wall of the groove, a sliding assembly is arranged between the two moving assemblies, the sliding assembly comprises a mounting seat, connecting rods are connected between the inner walls of both sides of the mounting seat, a sliding seat is arranged between the two connecting rods, a rotating assembly is arranged on the surface of the sliding seat, a placement plate is arranged on the surface of the rotating assembly, and a plurality of fixing assemblies are arranged on the surface of the placement plate. The moving assembly comprises a moving groove, and a moving part is arranged in the moving groove. The rotating assembly comprises a rotating seat, and a sliding groove is formed on the surface of the rotating seat. A sliding block is slidably connected in the sliding groove, and the sliding block is rotatably connected with the placement plate through a rotating shaft.

2. The method of claim 1, wherein the method further comprises: The fixing assembly comprises a triangular fixing block, and a movable groove is formed on the surface of the placement plate opposite to the triangular fixing block.

3. The method for reducing PCB exposure dry film breakage according to claim 2, characterized in that, A movable block is slidably connected in the movable groove.

4. The method for reducing PCB exposure dry film breakage according to claim 1, characterized in that, The surface of the movable block is connected with a fixing block.

5. The method for reducing PCB exposure dry film breakage according to claim 4, characterized in that, A collecting assembly is arranged in the groove, and the collecting assembly comprises a collecting box.

6. The method for reducing PCB exposure dry film breakage according to claim 1, characterized in that, A positioning groove that is adapted to the positioning block is formed at the center of the bottom of the inner wall of the groove. A fixing bolt is arranged on one side of the surface of the sliding seat, and a plurality of fixing holes that are adapted to the fixing bolt are sequentially formed on one side of the surface of the connecting rod from left to right.

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