Mounting method and mounting device

Abstract

The mounting method is a mounting method of mounting a component to a board using a suction member that is capable of suctioning the component and is raised and lowered by driving of a driving source, and the mounting method has: a detection step of detecting a case where the suction member that has suctioned the component is lowered to a mounting position of the component on the board and contacts the board via the component; and a setting step of being able to set a detection range based on the detection of the detection step for each mounting position of the component on the board.

Description

Technical Field

[0001] The present disclosure relates to a method and a device for mounting an adsorption component onto a substrate. Background Art

[0002] Patent Document 1 describes a mounting device that mounts components on a substrate by lowering a suction nozzle holding a component via a motor. This mounting device divides the substrate into a first region, which serves as the vicinity of a fixture or a support member, and a second region, which remains outside the first region. The load during mounting is measured, and the nozzle's descent speed is determined based on the measured load.

[0003] Prior art literature

[0004] Patent Document 1: International Publication No. WO2018 / 061146A1 Summary of the Invention

[0005] Problems to be solved by the invention

[0006] However, in the mounting device described in Patent Document 1, the descent speed of the suction nozzle is determined for the purpose of preventing damage to components during mounting, and does not take shortening of mounting time into consideration.

[0007] The present disclosure provides an installation method and an installation device that can further shorten the installation time.

[0008] Technical solutions to problems

[0009] In order to achieve the above-mentioned purpose, the installation method disclosed in the present invention is an installation method for installing components on a substrate using an adsorption component that is driven by a driving source to be raised and lowered and capable of adsorbing components. The above-mentioned installation method has the following steps: a detection step, detecting that the above-mentioned adsorption component with the above-mentioned component adsorbed thereon descends to the installation position of the above-mentioned component on the above-mentioned substrate and contacts the above-mentioned substrate through the above-mentioned component; and a setting step, which can set a detection interval for detection based on the above-mentioned detection step for each installation position of the above-mentioned component on the above-mentioned substrate.

[0010] Effects of the Invention

[0011] According to the present disclosure, a detection interval for detecting the situation where the adsorption component with the adsorbed component contacts the substrate through the component can be set for each installation position of the component on the substrate. That is, the length of the detection interval can be changed according to the condition of the substrate at the position where the component is installed, thereby achieving further shortening of the installation time. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1This is a perspective view showing the appearance of a mounting device according to one embodiment of the present disclosure.

[0013] Figure 2 yes Figure 1 A cross-sectional view of a mounting head included in the mounting device.

[0014] Figure 3 It simply means Figure 1 Block diagram of the control system of the installation device.

[0015] Figure 4 Yes Figure 3 Flowchart of the steps of the installation process executed by the CPU within.

[0016] Figure 5 Yes Figure 4 A flowchart of the subsequent steps of the installation process.

[0017] Figure 6 This is a diagram showing an example of setting a touch detection section for each mounting position.

[0018] Figure 7 This is a diagram showing a schematic structure of another example of a mounting head. DETAILED DESCRIPTION

[0019] Hereinafter, embodiments of the present disclosure will be described in detail based on the drawings.

[0020] Figure 1 The schematic structure of the mounting device 10 is shown. Figure 1 In the figure, the left-right direction is the X-axis direction, the front-back direction is the Y-axis direction, and the up-down direction is the Z-axis direction.

[0021] The mounting device 10 is a device for mounting components P on a substrate S, and includes: a base 11, a housing 12 supported by the base 11, a substrate conveying unit 20, a support unit 30, a component supply unit 40, a mounting head 50, an XY robot 60, and a control device 90 (see Figure 3 ).

[0022] like Figure 1 As shown, the substrate transport unit 20 includes a pair of side frames 22 arranged at a predetermined interval in the Y-axis direction and conveyor belts 24 provided on each of the side frames 22. The conveyor belts 24 are driven to circulate, thereby transporting the substrate S. Furthermore, the substrate transport unit 20 includes a clamp (not shown) that can be raised and lowered. When the substrate S is placed on the conveyor belts 24, the clamp is raised to lift the substrate S, thereby pressing the substrate S against the pressing portion 26 at the upper end of the side frames 22. As a result, the substrate S is clamped between the clamp and the pressing portion 26.

[0023] The support unit 30 includes a support plate 32 that is movable upward and downward by a lifting device (not shown) and a plurality of support pins 34 erected on the support plate 32. The support unit 30 supports the substrate S from the rear side using the support pins 34 by raising the support plate 32 while the substrate S conveyed by the substrate conveying unit 20 is clamped.

[0024] The component supply unit 40 includes a feeder unit 42 and a tray unit 44. The feeder unit 42 supplies components to the supply position by feeding a carrier tape from a reel wound with a carrier tape containing multiple components. The carrier tape consists of a base tape made of paper or the like, with component receiving areas formed at predetermined intervals, and a top film that covers the base tape and is peeled off just before the supply position. The tray unit 44 supplies components to the supply position by arranging and placing multiple components on a tray made of resin or the like.

[0025] The XY robot 60 includes: a pair of left and right Y-axis guide rails 63 provided on the upper portion of the housing 12 along the front-back direction (Y-axis direction); a Y-axis slide 64 mounted on the left and right Y-axis guide rails 63 and capable of moving along the Y-axis guide rails 63; a pair of upper and lower X-axis guide rails 61 provided on the side surfaces of the Y-axis slide 64 along the left-right direction (X-axis direction); and an X-axis slide 62 capable of moving along the X-axis guide rails 61. The X-axis slide 62 can be moved by an X-axis motor 66 (see Figure 3 ) is driven to move, the Y-axis slide 64 can be driven by the Y-axis motor 68 (refer to Figure 3 The mounting head 50 is mounted on the X-axis slide 62, and the control device 90 drives and controls the XY robot 60 (X-axis motor 66 and Y-axis motor 68), thereby enabling the mounting head 50 to move to any position on the XY plane.

[0026] On the lower surface of the mounting head 50, one or more suction nozzles 59 (eight in this embodiment) are mounted detachably and in accordance with the type of component. The suction nozzle 59 is a suction component that uses pressure to adsorb components. In addition, the mounting head 50 is driven by a lifting device 70 (see FIG. 1 ) with the Z-axis motor 55 as the driving source. Figure 2 ) and the suction nozzle 59 is moved up and down along the Z direction. In addition, the mounting head 50 can rotate (rotate) the suction nozzle 59 by the R-axis (rotation axis) motor 51 to adjust the angle of the component adsorbed by the suction nozzle 59.

[0027] like Figure 2 As shown, the mounting head 50 includes a cover 500 , a pair of front and rear lifting devices 70 , a revolving portion 54 , and a rotating portion 55 .

[0028] The cover 500 constitutes the outer shell of the mounting head 50. A pair of front and rear lifting devices 70 are arranged facing each other at 180 degrees with the revolution axis (the revolution axis of the 8 suction nozzles 59) Q as the center. The lifting device 70 has a Z-axis (upper and lower axis) motor 71 and a ball screw part 72. In addition, the lifting device 70 has a Z-axis position sensor 74 (see Figure 3 The ball screw portion 72 includes a shaft portion (fixed portion) 72a and a nut portion (movable portion) 72b. The Z-axis motor 71 is mounted on the cover 500. The shaft portion 72a is connected to the rotating shaft of the Z-axis motor 71. The shaft portion 72a extends in the vertical direction. The nut portion 72b is mounted on the shaft portion 72a via a plurality of balls (not shown). A recessed portion (power transmission portion) 72b1 is provided in the nut portion 72b.

[0029] The revolving portion 54 includes a Q-axis (revolving axis) motor 52, a first revolving gear 541, a second revolving gear 542, a revolving shaft portion 543, a rotating plate 544, and eight collars 545. The Q-axis motor 52 is mounted on the cover 500 via a bracket (not shown). The first revolving gear 541 is coupled to the rotating axis of the Q-axis motor 52. The second revolving gear 542 meshes with the first revolving gear 541. The rotating plate 544 is arranged below the second revolving gear 542 at a predetermined interval. The revolving shaft portion 543 couples the second revolving gear 542 and the revolving plate 544. The eight collars 545 are arranged in sequence at 45° intervals with the revolving axis Q as the center. The collars 545 are cylindrical in shape with a short axis extending in the vertical direction. The collars 545 are embedded in the rotating plate 544.

[0030] The rotation part 55 includes: an R-axis motor 51, a first gear 551 for rotation, a second gear 552 for rotation, and a third gear 553 for rotation. The R-axis motor 51 is mounted on the cover 500 via a bracket (not shown). The first gear 551 for rotation is connected to the rotating shaft of the R-axis motor 350. The second gear 552 for rotation is engaged with the first gear 551 for rotation. The second gear 552 for rotation is annular. The third gear 553 for rotation is connected to the lower side of the second gear 552 for rotation. The third gear 553 for rotation is cylindrical. The above-mentioned revolution shaft portion 543 passes through the second gear 552 for rotation and the third gear 553 for rotation in the up and down directions.

[0031] The eight brackets 58 are each inserted through the collar 545. Each bracket 58 includes a cladding portion 580 and a core portion 581. The cladding portion 580 is movable vertically relative to the collar 545. The cladding portion 580 includes an outer cylindrical member 580a, a convex portion (power transmission portion) 580c, and a bracket gear 580d. The convex portion 580c is disposed on the outer circumference of the outer cylindrical member 580a. The convex portion 580c is vertically engageable with the concave portion 72b1. The bracket gear 580d is disposed on the outer circumference of the outer cylindrical member 580a. The bracket gear 580d meshes with the third rotation gear 553.

[0032] The cladding portion 580 is movable in the vertical direction relative to the core portion 581 by a predetermined press-fitting stroke.

[0033] The core portion 581 includes a detection portion 581a. The detection portion 581a protrudes upward from the outer cylindrical member 580a.

[0034] A suction portion 591 is provided at the lower end of the suction nozzle 59. The suction portion 591 can suction and release the component P by air pressure supplied through a gas passage (not shown).

[0035] A photoelectric sensor 73 is disposed on the nut portion 72b. The photoelectric sensor 73 is movable vertically along with the nut portion 72b. The photoelectric sensor 73 includes a light projector and a light receiver (not shown). The light projector projects light toward the detection portion 581a. The light receiver receives light reflected from the detection portion 581a. A detection area A is defined horizontally near the photoelectric sensor 73 (on the detection portion 581a side).

[0036] The touch detection method includes a reference value setting process and a touch judgment process. Figure 2 In the reference value setting process, the control device 90 detects the light reception rate of the light receiver of the photoelectric sensor 73.

[0037] When the detected portion 581a does not enter the detection area A, the light from the projector does not enter the light receiver at all. This initial state is set to 0%. On the other hand, when the detected portion 581a enters the entire detection area A, all the reflected light from the detected portion 581a enters the light receiver. This final state is set to 100%.

[0038] In contrast, in the non-contact state, the upper end of the detected portion 581a actually enters the detection area A. During the initial value setting process, the control device 90 detects the light reception rate of the light receiver in the non-contact state and sets a reference level a1. For example, if the initial state is set to 0% and the final state is set to 100%, and the light reception rate of the light receiver in the non-contact state is 10%, the control device 90 sets this 10% as the reference level a1. Furthermore, the control device 90 sets the reference level a1 to 100%, for example, 110%, as the threshold value a2.

[0039] The touch judgment process is executed when the non-touch state is switched to the touch state. That is, it is executed when the bracket 58 and the suction nozzle 59 are lowered. In the touch judgment process, the control device 90 drives the Z-axis motor 71 to move the bracket 58 and the suction nozzle 59 relative to the touch state. Figure 2 The mounting head 50 shown is lowered. Furthermore, the control device 90 continuously detects the light receiving rate of the light receiver of the photoelectric sensor 73.

[0040] When the bracket 58 descends and the component P touches the substrate S, the suction nozzle 59 and the core 581 immediately stop descending. However, the cladding portion 580 continues to descend together with the nut portion 72b and the photoelectric sensor 73. Therefore, the suction nozzle 59 and the core 581 rise relatively with respect to the cladding portion 580. When the core 581 rises relatively with respect to the cladding portion 580, the detected portion 581a rises relatively in the detection area A. Therefore, the light receiving rate of the light receiver of the photoelectric sensor 73 increases. When the light receiving rate reaches the threshold value a2, the control device 90 determines that the component P has touched the substrate S. The control device 90 stops the Z-axis motor 71 and stops the descent of the bracket 58 and the suction nozzle 59. The control device 90 releases the touched component P from the suction nozzle 59 and drives the Z-axis motor 71 to rise the bracket 58 and the suction nozzle 59.

[0041] The control device 90 then positions the next holder 58 and suction nozzle 59 (having already sucked the component P) directly above the next mounting coordinate. The control device 90 then executes the aforementioned reference value setting step and the aforementioned contact determination step. In this manner, the control device 90 repeatedly executes the aforementioned contact detection method in accordance with the number of components P held by the mounting head 50.

[0042] like Figure 3As shown, the control device 90 is configured as a microprocessor centered around a CPU 91. In addition to the CPU 91, it also includes a ROM 92, an HDD 93, a RAM 94, an input / output interface 95, and the like. These are connected via a bus 96. Input to the control device 90 via the input / output interface 95 are image signals from the parts camera 80, image signals from the mark camera, detection signals from the X-axis position sensor 67 that detects the X-axis position of the X-axis slide 62, detection signals from the Y-axis position sensor 69 that detects the Y-axis position of the Y-axis slide 64, detection signals from the Z-axis position sensor 74 that detects the Z-axis position of each nut portion 72b, and detection signals from the photoelectric sensor 73 that detects the Z-axis position of each bracket 58. On the other hand, control signals for the substrate conveying unit 20, control signals for the component supply unit 40, drive signals for the XY robot 60 (X-axis motor 66 and Y-axis motor 68), drive signals for the mounting head 50 (R-axis motor 51, Q-axis motor 52 and Z-axis motor 71), etc. are output from the control device 90 via the input / output interface 95.

[0043] Hereinafter, the operation of the mounting device 10 configured in this manner will be described. Figure 4 and Figure 5 1 is a flowchart showing an example of a mounting process. This process is executed by the control device 90 while the substrate S carried in by the substrate conveying unit 20 is clamped and supported by the support unit 30. In the following description of the steps of each process, the step is expressed as "S".

[0044] exist Figure 4 In the process, the CPU 91 of the control device 90 first sets the touch detection interval of each installation position to an initial value (S10). Here, the touch detection interval refers to an interval in which the speed at which the bracket 58 and the suction nozzle 59 descend is slowed down when it is detected that the component P touches the substrate S, that is, when it is judged to be touched in the above-mentioned touch judgment process. In the case where the component P adsorbed on the suction nozzle 59 is located at a position higher than the touch detection interval, if the speed at which the bracket 58 and the suction nozzle 59 descend is increased, the installation time of the component P can be shortened. However, when the touch is detected in this high-speed state, the touch may not be detected smoothly. For this reason, the speed at which the bracket 58 and the suction nozzle 59 descend is slowed down before the touch is detected, so that the touch is detected smoothly.

[0045] Figure 6 (a) shows an example of a touch detection section for each mounting position of a substrate S0 in which the surface of the substrate S is an ideal flat surface. Figure 6 (a) (about Figure 6 (b) Figure 6(c) is also the same), the horizontal direction indicates the installation position, and the vertical direction indicates the height. Furthermore, the installation positions P1 to P5 in the horizontal direction respectively indicate different installation positions. In addition, the height H0 in the vertical direction indicates the target value for making the component P touch the substrate S. In addition, the height H1 indicates the starting point of the touch detection interval for each installation position. That is, in the substrate S0, in the touch detection interval of each installation position, the same interval H1-H0 is set as the initial value for any of the installation positions P1 to P5. This is because the target height H0 at each installation position P1 to P5 is the same as the touch height on the substrate S0.

[0046] Figure 6 (b) shows an example of a touch detection section for each mounting position of a substrate S1 having a warp on its surface. Figure 6 In the example (b), the height H0 also shows the target value for making the component P touch the substrate S. However, in the substrate S1, there is a warp of a height H2 higher than the target height H0 at the mounting position P2, and a warp of a height H3 lower than the target height H0 at the mounting position P4. Therefore, for each of the mounting positions P1 to P5, in order to set Figure 5 For the same or greater length of the touch detection interval for substrate S0 (a), the starting point of the touch detection interval for each mounting position is determined by adding the interval H1-H0 to the height H2. Therefore, for substrate S1, the same interval H4-H0 is set as the initial value for the touch detection interval for each mounting position, for any of mounting positions P1-P5.

[0047] In addition, Figure 4 In the above S10, as the initial value of the touch detection interval for each installation position, the problem is to use Figure 6 (a) The touch detection interval and Figure 6 (b) Which of the following is the touch detection interval? However, if the warping state of the substrate S is unknown before starting the mounting process, Figure 6 (a) can be used to detect the touch interval. If known, use Figure 6 (b) Just touch the detection interval. In this embodiment, use Figure 6 (b) The touch detection interval.

[0048] return Figure 4 The CPU 91 lowers the suction nozzle 59 and controls the mounting head 50 so as to suck the component P supplied to the supply position by the component supply unit 40 (S12).

[0049] Next, when the component is adsorbed by the suction nozzle 59, the CPU 91 moves the mounting head 50 to the substrate S through the XY robot 60, lowers the suction nozzle 59, and controls the mounting head 50 to install the component P at the mounting position of the substrate S (S14).

[0050] Next, the CPU 91 detects the touchdown height and stores the detected touchdown height in association with the current mounting position, for example, in the RAM 94 (S16). Specifically, when the light receiving rate of the light receiver of the photoelectric sensor 73 reaches the threshold value a2, that is, when the control device 90 (CPU 91) determines that the component P has touched the substrate S, the touchdown height is detected by detecting the detection signal from the Z-axis position sensor 74.

[0051] The CPU 91 then determines whether all components have been installed (S18). If it is determined that components to be installed remain (S18: No), the CPU 91 selects the next component to be installed and returns the process to S12. If it is determined that all components have been installed (S18: Yes), the CPU 91 proceeds to S20.

[0052] In S20, CPU91 judges whether the installation of the substrate of the predetermined number of pieces is completed. In this judgment, if it is judged that the installation of the substrate of the predetermined number of pieces is not completed (S20: No), CPU91 enters the processing Figure 5 On the other hand, in this judgment, if it is judged that the installation of the predetermined number of substrates is completed (S20: Yes), the CPU 91 causes the processing to enter S22. Here, the "predetermined number of substrates" refers to the number of substrates of a portion of the total number of substrates to be installed. In this embodiment, as the predetermined number of substrates, for example, 3 substrates ( Figure 6 The substrates S1 to S3 in (c) are taken as an example, but the present invention is not limited thereto.

[0053] exist Figure 5 In S40, the CPU 91 determines whether the installation of all substrates is completed. In this judgment, if it is determined that the installation of all substrates is not completed (S40: No), the CPU 91 waits until the substrate to be installed next is supported by the above-mentioned support unit 30, and then returns the processing to Figure 4 On the other hand, in this determination, when it is determined that the mounting of all substrates is completed (S40: YES), the CPU 91 ends the mounting process.

[0054] exist Figure 4In S22, the CPU 91 calculates an average value of the touchdown height for each mounting position. The average value is calculated by averaging the touchdown heights stored in association with each mounting position over a predetermined number of substrates.

[0055] Next, the CPU 91 calculates the deviation from the average value of the touch height for each installation position (S24). When one installation position is fixed, the touch height is stored with the amount of substrates of a predetermined number of blocks. And, in the above-mentioned S22, the average value of the touch height is calculated for a fixed installation position. Therefore, in S24, the difference from the average value of the touch height is calculated for each of the touch heights of the substrates of the predetermined number of blocks, thereby serving as the deviation of a fixed installation position. And, the calculation of this deviation is performed for all installation positions. In addition, the average value of the touch height of each installation position calculated in S22 and the deviation from the average value of the touch height of each installation position calculated in S24 are also temporarily stored in, for example, RAM 94.

[0056] Next, the CPU 91 initializes the mounting position counter (S26). The mounting position counter is a software counter that counts to indicate the mounting position, namely, in this embodiment, any of the mounting positions P1 to P5. Therefore, in this embodiment, the mounting position counter counts any of 1 to 5, so the initialization means setting the mounting position counter to "1."

[0057] Then, the CPU 91 determines whether the deviation of the mounting position indicated by the mounting position counter exceeds a predetermined range ( Figure 5 In this embodiment, as described above, since the deviation is calculated as a difference from the average value of the touchdown height, the CPU 91 determines whether the deviation exceeds the predetermined range based on whether the maximum value of the calculated differences exceeds the predetermined range.

[0058] In the judgment of S28, when it is judged that the deviation at the installation position indicated by the installation position counter exceeds the predetermined range (S28: Yes), CPU91 adds the maximum value of the deviation, that is, the maximum value of the difference, to the average value of the touch height, and further adds a predetermined margin, establishes a correspondence with the installation position and stores it in, for example, RAM94 (S30), and then enters the processing into S34.

[0059] On the other hand, in the judgment of S28, when it is judged that the deviation at the installation position indicated by the installation position counter does not exceed the predetermined range (S28: No), CPU91 adds a predetermined margin to the average value of the touch height, establishes a correspondence with the installation position and stores it in, for example, RAM94 (S32), and then enters the processing into S34.

[0060] In S34, the CPU 91 determines whether the mounting position counter is counting the last mounting position. If the mounting position counter is not counting the last mounting position (S34: No), the CPU 91 increments the mounting position counter by "1" (S36) and then returns the process to S28. On the other hand, if the mounting position counter is counting the last mounting position (S34: Yes), the CPU 91 proceeds to S38.

[0061] In S38, CPU91 uses the stored value to update the touch detection interval of each installation position. Then, CPU91 causes the processing to enter the above-mentioned S40. The processing of S40 is as described above, so its description is omitted. After the touch detection interval of each installation position is updated through the processing of S38, CPU91 determines the speed at which the bracket 58 and the suction nozzle 59 are lowered based on the updated touch detection interval of each installation position until the installation of all substrates is completed. That is, CPU91 increases the speed at which the bracket 58 and the suction nozzle 59 are lowered at a position higher than the touch detection interval of each installation position, and decreases the speed within the touch detection interval of each installation position.

[0062] Figure 6 (c) shows an example of the touch detection interval for each installation position updated in the process of S38 above. Figure 6 In (c), substrate S1 represents the substrate mounted first by the mounting process, substrate S2 represents the substrate mounted second by the mounting process, and substrate S3 represents the substrate mounted third by the mounting process.

[0063] exist Figure 6 In the example of (c), regarding the mounting positions P1, P3, and P5, the substrates S1 to S3 are not warped, so the average value of the touch height is H0 and the deviation is 0. Therefore, if the "predetermined margin" in the above S30 is set to, for example, the value H1-H0 (refer to Figure 6 (a)), the touch detection interval of each of the mounting positions P1, P3, and P5 is updated from the initial value H4-H0 to the value H1-H0. In addition, H1<H4.

[0064] Meanwhile, at mounting position P2, although substrates S1 to S3 all exhibit warpage, the variation is minimal. For example, if the average touchdown height is set to the height of mounting position P2 on substrate S2 and the maximum variation is set within a predetermined range, the touchdown detection interval for each mounting position at mounting position P2 is updated from the initial value H4 - H0 to the value H5 - H0. Furthermore, height H5 is the value obtained by adding a "predetermined margin," i.e., value H1 - H0, to the height of mounting position P2 on substrate S2, where H5 > H4.

[0065] Furthermore, regarding mounting position P4, substrates S1 to S3 all have warpage and significant deviation. For example, if the average touchdown height is the height of mounting position P4 on substrate S3 = H0, and the maximum deviation exceeds a predetermined range, the touchdown detection interval for each mounting position at mounting position P4 is updated from the initial value H4-H0 to the value H6-H0. Furthermore, height H6 is the value obtained by adding the maximum deviation, i.e., the difference between the height H0 of mounting position P2 on substrate S3 and the height H0 of mounting position P2 on substrate S2, to the "predetermined margin," i.e., the value H1-H0. Thus, H6>H5>H4.

[0066] Thus, the updated touch detection interval for each installation position is longer than the initial value at installation positions P2 and P4, but shorter than the initial value at installation positions P1, P3, and P5. Therefore, the overall touch detection interval is shorter than the initial value for each installation position. This shortens the installation time.

[0067] Furthermore, at mounting positions with relatively low variance in touch height, such as mounting position P2, the touch detection interval for each mounting position is updated to a value obtained by adding a predetermined margin to the average touch height, i.e., shifting the center value of the touch detection interval for each mounting position to the average touch height. Furthermore, at mounting positions with relatively high variance in touch height, such as mounting position P4, the touch detection interval for each mounting position is updated to a value obtained by adding the maximum variance to the average touch height, and further adding a predetermined margin. In this way, the touch detection interval for each mounting position is set to an optimal interval based on the touch height conditions of each substrate S, enabling accurate touch detection on any substrate S.

[0068] Figure 7 Shown with Figure 2 The mounting head 140 has a different structure from the mounting head 50. The mounting head 140 includes: a head body 142, a plurality of nozzle holders 165 (in a direction coaxial with the rotation axis) are arranged at predetermined angle intervals (for example, 30 degrees) Figure 7Only two are shown in the figure); and a suction nozzle 160 is detachably mounted on the lower end of each suction nozzle holder 165. In addition, the mounting head 140 includes: an R-axis motor (not shown) that rotates the head body 142 to rotate (revolve) the multiple suction nozzle holders 165; a Q-axis motor 146 that rotates (rotates) the multiple suction nozzle holders 165; and a lifting device (not shown) that lifts and lowers the suction nozzle holders 165. In addition, the mounting head 140 includes: a negative pressure supply device 170 that supplies negative pressure to the adsorption portion 161; and a positive pressure supply device 180 that supplies positive pressure to the suction nozzle holders 165.

[0069] The head body 142 includes a frame 141 mounted on the X-axis slide 62 (see Figure 1 ); the shaft portion 142a is rotatably supported on the frame 141; and the bracket holding portion 142b is formed into a cylindrical shape with a diameter larger than that of the shaft portion 142a, which holds the multiple nozzle holders 165 so as to be movable along the Z-axis direction. When the R-axis motor is driven, the shaft portion 142a and the bracket holding portion 142b rotate, so that the multiple nozzle holders 165 rotate (revolve). In addition, the head body 142 has: a gear 143, which is supported to be coaxial with the shaft portion 142a and rotatable relative to the shaft portion 142a; and a gear 147, which rotates as the gear 143 rotates. The gear 143 meshes with the gear 145 mounted on the rotating shaft of the Q-axis motor 146, and the gear 147 meshes with the gear 165b mounted on each nozzle holder 165. When the Q-axis motor 146 is driven, each nozzle holder 165 and the nozzles 160 mounted thereon rotate (rotate) in the same direction and by the same amount (rotation angle). Furthermore, a spring 165a is disposed between the lower surface of the gear 165b and the upper surface of the holder holder 142b. The spring 165a biases the nozzle holder 165 upward in the Z-axis direction.

[0070] The nozzle holder 165 is formed as a cylindrical member extending in the Z-axis direction, and has a first gas passage 166a and a second gas passage 167a formed therein. A horizontal portion 165c extending in the radial direction is formed at the upper end of the nozzle holder 165.

[0071] The negative pressure supply device 170 is a device that independently supplies negative pressure from the same negative pressure source 171 to the multiple suction nozzles 160 installed in each suction nozzle holder 165 in the multiple suction nozzle holders 165. The negative pressure supply device 170 includes: a negative pressure source 171 such as a vacuum pump, a frame passage 172, a head passage 173, a negative pressure introduction passage 174, an atmosphere introduction passage 175, a slide valve hole 177, a slide valve 178 and a slide valve drive mechanism (not shown). The frame passage 172 is formed in the frame 141 of the mounting head 140 and is connected to the negative pressure source 171. The head passage 173 is formed to communicate with the frame passage 172 and extends along the central axis of the mounting head 140. The negative pressure introduction passage 174 is communicated with the head passage 173 and is formed in a plurality in a manner extending radially from the central axis of the holder holding portion 142b. A plurality of atmospheric pressure introduction passages 175 are formed corresponding to the negative pressure introduction passages 174 so as to communicate with a positive pressure source (here, the atmosphere).

[0072] The slide valve 178 is a switching valve for selectively connecting the first gas passage 166a provided in each of the multiple suction nozzle holders 165 to any one of the corresponding negative pressure introduction passage 174 and the atmosphere introduction passage 175. The first gas passage 166a is connected to the suction port at the front end of the adsorption portion 161 of the suction nozzle 160. The slide valve 178 is a tubular component that is inserted into the slide valve hole 177 formed in the holder holding portion 142b corresponding to each of the multiple suction nozzle holders 165. The approximately central portion of the slide valve 178 is reduced in diameter, and the area around the reduced diameter portion in the space within the slide valve hole 177 becomes a path for the negative pressure from the negative pressure source 171. The slide valve 178 is in a state of moving upward ( Figure 7 , the first gas passage 166a is connected to the negative pressure introduction passage 174 and the first gas passage 166a is disconnected from the atmospheric pressure introduction passage 175. Meanwhile, the slide valve 178, while moving downward, disconnects the first gas passage 166a from the negative pressure introduction passage 174 and connects the first gas passage 166a to the atmospheric pressure introduction passage 175. The slide valve drive mechanism outputs a driving force to move the slide valve 178 up and down, thereby switching the slide valve 178 so that either the negative pressure introduction passage 174 or the atmospheric pressure introduction passage 175 is connected to the first gas passage 166a.

[0073] The positive pressure supply device 180 is a device that supplies positive pressure to the second gas passage 167a of each of the multiple nozzle holders 165. The positive pressure supply device 180 includes a positive pressure source 181 such as a compressor, a flow sensor 181a, a frame passage 182, a head passage 183, and a positive pressure introduction passage 184. The flow sensor 181a is connected to the positive pressure source 181 and detects the flow rate of gas (here, air) supplied from the positive pressure source 181 and flowing in the second gas passage 167a. The frame passage 182 is formed in a position different from the frame passage 172 within the frame 141 of the mounting head 140 and is connected to the flow sensor 181a and the positive pressure source 181. The head passage 183 is connected to the frame passage 182 and is formed to extend along the central axis of the mounting head 140. When viewed from above, the head passage 183 has an annular shape centered on the head passage 173 and extends in the vertical direction, away from the head passage 173 and surrounding it. Multiple positive pressure introduction passages 184 are connected to the head passage 183 and are formed so as to extend from the central axis side of the holder holding portion 142b toward the outside of the holder holding portion 142b. Each of the multiple positive pressure introduction passages 184 is formed corresponding to each of the multiple nozzle holders 165 and is connected to the second gas passage 167a of the corresponding nozzle holder 165. Furthermore, each of the multiple positive pressure introduction passages 184 is formed to avoid the negative pressure introduction passage 174 and the slide valve hole 177. Furthermore, the frame passage 182, the head passage 183, the positive pressure introduction passage 184, and the second gas passage 167a are not connected to any of the frame passage 172, the head passage 173, the negative pressure introduction passage 174, the atmospheric pressure introduction passage 175, the slide valve hole 177, and the first gas passage 166a. That is, the negative pressure path and the positive pressure (atmospheric pressure) path of the negative pressure supply device 170 are independent of the positive pressure path of the positive pressure supply device 180.

[0074] When the component P is mounted on the substrate S by the mounting head 140, the CPU 91 starts to lower the target suction nozzle by means of the lifting device. Furthermore, the CPU 91 waits until the flow rate detected by the flow sensor 181a exceeds a predetermined threshold value, that is, until the amount of pressure reaches a predetermined amount. When it is determined that the amount of pressure has reached a predetermined amount, the CPU 91 switches the slide valve 178 corresponding to the target suction nozzle by means of the slide valve drive mechanism, so that positive pressure (atmosphere) acts on the adsorption portion 161, thereby releasing the negative pressure, and raises the adsorption portion 161 by means of the lifting device. In this way, when the CPU 91 determines that the amount of pressure has reached a predetermined amount based on the flow rate detected by the flow sensor 181a, the negative pressure of the adsorption portion 161 is released and raised.

[0075] That is to say, in the above Figure 2 In the mounting head 50, the touch detection is performed based on the light receiving rate of the light detected by the light receiver of the photoelectric sensor 73. Figure 7 The difference is that the touch detection is performed based on the flow rate detected by the flow sensor 181a in the mounting head 140. However, the process of setting the touch detection interval for each mounting position, that is, in the above Figure 4 and Figure 5 Among the mounting processes, the processes other than the processes of S12 and S14 do not differ even when the mounting head 50 is changed to the mounting head 140, and therefore, their description is omitted.

[0076] As described above, the mounting method of this embodiment is a mounting method for mounting a component P on a substrate S using a mounting head 50 that is driven by a Z-axis motor 71 and is capable of adsorbing the component P. The method comprises the following steps: a detection step (S16) for detecting that the mounting head 50, 140 adsorbing the component P descends to the mounting position of the component P on the substrate S and contacts the substrate S via the component P; and a setting step (S10, S38) for setting a detection interval for detection based on the detection step for each mounting position of the component P on the substrate S. Incidentally, in this embodiment, the Z-axis motor 71 is an example of a "drive source." The mounting head 50, 140 is an example of an "adsorption component."

[0077] In this way, in the installation method of this embodiment, a detection interval can be set for each installation position of the component P on the substrate S to detect the situation where the installation head 50, 140 with the component P adsorbed contacts the substrate S through the component P. That is, the length of the detection interval can be changed according to the condition of the substrate S at the position where the component P is installed, thereby achieving further shortening of the installation time.

[0078] The mounting method of this embodiment further includes the following steps: a storage step (S16) of storing the height of the mounting head 50 when the detection step detects that the mounting head 50, 140 has contacted the substrate S via the component P, as history information in the RAM 94; and a determination step (S30, S32) of determining a detection range based on the history information stored in the storage step. Incidentally, the RAM 94 is an example of a "memory."

[0079] Thus, the detection section is determined based on the history of the height of the mounting head 50 actually mounted in the past, and therefore an appropriate detection section can be set.

[0080] Furthermore, in the determination steps ( S30 , S32 ), the range of the detection section is determined based on the degree of variation in the height of the mounting head 50 included in the history information.

[0081] This makes it possible to set a more appropriate detection interval.

[0082] Furthermore, in the determination step ( S32 ), when the degree of variation in height is within a predetermined range, the detection interval is determined by shifting the center value of the detection interval to the average value of the height.

[0083] Thus, the length of the detection section is changed while remaining unchanged, and thus it is possible to suppress the detection section from becoming longer.

[0084] The mounting head 50 also includes a suction unit 591 for sucking the component P, and a photoelectric sensor 73 for projecting light toward a detection area A that moves relative to the detection unit 581a and the component P in conjunction with the contact between the component P and the substrate S, and receiving light from the detection area A. In the detection step (S16), the contact of the component P with the mounting position on the substrate S is detected based on the output signal from the photoelectric sensor 73. Incidentally, the suction unit 591 is an example of a "nozzle unit."

[0085] Mounting head 140 also includes a suction unit 161 for sucking component P, and a frame passage 182. The flow rate or pressure of the gas flowing therein varies depending on the amount of pressure applied by suction unit 161. In the detection step (S16), contact between component P and the mounting position on substrate S is detected by detecting at least one of the flow rate or pressure of the gas flowing through frame passage 182. Incidentally, suction unit 161 is an example of a "suction nozzle unit." Frame passage 182 is an example of a "gas passage."

[0086] In addition, the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the present invention.

[0087] (1) In the above embodiment, Figure 2 The number of suction nozzles 59 in the mounting head 50 is set to 8, Figure 7 The number of the suction nozzles 160 in the mounting head 140 is set to 12, but the number of the suction nozzles is not limited thereto.

[0088] (2) In the above embodiment, Figure 5 Although the same "predetermined margin" is added in both S30 and S32, the present invention is not limited thereto. The margin values ​​added in S30 and S32 may be different. Alternatively, the margin value may be set to "0" or a value close to "0." In this case, the installation time can be further shortened.

[0089] Description of Reference Numerals

[0090] 10. Mounting device; 50, 140. Mounting head; 58. Bracket; 580. Cladding unit; 581. Core unit; 59, 160. Suction nozzle; 591, 161. Adsorption unit; 60. XY robot; 70. Lifting device; 71. Z-axis motor; 72a. Shaft unit; 72b. Nut unit; 73. Photoelectric sensor; 90. Control unit; 91. CPU; 92. ROM; 93. HDD; 94. RAM; 95. Input / output interface; 161a. Suction nozzle passage; 161 b. Branch passage of the nozzle part; 165. Nozzle bracket; 166. First gas passage; 167a. Second gas passage; 170. Negative pressure supply device; 171. Negative pressure source; 172. Frame passage; 173. Head passage; 174. Negative pressure introduction passage; 175. Atmosphere introduction passage; 177. Sliding valve hole; 178. Sliding valve; 180. Positive pressure supply device; 181. Positive pressure source; 181a. Flow sensor; 182. Frame passage; 183. Head passage; 184. Positive pressure introduction passage.

Claims

1. A mounting method for mounting a component on a substrate using a suction member that is driven by a driving source to be raised and lowered and capable of sucking the component. The installation method has the following steps: a detection step of detecting that the adsorption member having the component adsorbed thereon descends to a mounting position of the component on the substrate and contacts the substrate via the component; a setting step of setting a contact detection interval for detecting the contact in the detecting step by varying the length of the contact detection interval for each mounting position of the component on the substrate according to the height condition of the substrate at each mounting position, the contact detection interval being a interval for decelerating the speed at which the adsorption member descends when the contact is detected; a storing step of storing, in a memory, as history information, the height of the adsorption member when the adsorption member is detected to have contacted the substrate via the element in the detecting step; and a determination step of determining the detection interval based on the history information stored in the storage step, In the determining step, the range of the detection interval is determined based on the degree of variation in the height of the adsorption member included in the history information. Furthermore, in the determination step, when the degree of variation in the height is within a predetermined range, the detection interval is determined by shifting the center value of the detection interval to the average value of the height.

2. The installation method according to claim 1, wherein: The adsorption component comprises: a nozzle portion for adsorbing the component; and a photoelectric sensor for projecting light onto a detection area in which the detection portion and the component move relative to the substrate in contact with each other, and receiving the light from the detection area. In the detecting step, contact of the component with the mounting position on the substrate is detected based on an output signal from the photosensor.

3. The installation method according to claim 1 or 2, wherein: The adsorption component comprises: a nozzle portion for adsorbing the component; and a gas passage, wherein the flow rate or pressure of the flowing gas varies according to the amount of pressure injected by the nozzle portion. In the detecting step, contact between the component and the mounting position on the substrate is detected by detecting at least one of a flow rate and a pressure of the gas flowing through the gas passage.

4. A mounting device comprising a suction member that is driven by a driving source to be raised and lowered and capable of sucking a component, and mounting the component sucked by the suction member on a substrate. The mounting device comprises: a detection unit for detecting that the adsorption member having the component adsorbed thereon descends to a mounting position of the component on the substrate and contacts the substrate via the component; a setting unit that sets, for each mounting position of the component on the substrate, a contact detection interval for detecting the contact of the detection unit by changing the length of the contact detection interval according to the height condition of the substrate at each mounting position, the contact detection interval being a interval for decelerating the speed at which the suction member descends when the contact is detected; a storage unit that stores, as history information, a height of the adsorption member when the detection unit detects that the adsorption member has come into contact with the substrate via the element; and a determination unit that determines the detection interval based on the history information stored in the storage unit, The determination unit is configured to determine the range of the detection interval based on the degree of variation in the height of the adsorption member included in the history information. Furthermore, the determination unit is configured to determine the detection interval by shifting the center value of the detection interval to the average value of the height when the degree of variation in the height is within a predetermined range.

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