Substrate processing apparatus and maintenance method for substrate processing apparatus

Abstract

The present invention provides a technology capable of easily maintaining an inner wall member of a substrate processing apparatus. The substrate processing apparatus of the present invention includes a chamber, a substrate support, a support member, an inner wall member, a contact member, and an actuator. The substrate support is disposed inside the chamber. The support member is disposed above the substrate support. The inner wall member includes a top portion capable of being disposed above the substrate support and below the support member. The contact member is attached to one of the support member and the inner wall member. The contact member is configured to detachably fix the inner wall member to the support member by applying a horizontal spring reaction force to the other of the support member and the inner wall member. The actuator is configured to move the inner wall member downward to release the fixation of the inner wall member to the support member.

Description

TECHNICAL FIELD

[0001] An example embodiment of the present application relates to a substrate processing apparatus and a maintenance method of a substrate processing apparatus. BACKGROUND

[0002] A substrate processing apparatus (also referred to as a substrate processing device) is used for processing of a substrate (also referred to as a wafer). The substrate processing apparatus has a chamber and a substrate support. The substrate support supports a substrate in the chamber. The substrate is processed in the chamber. In a plasma processing apparatus which is one of the substrate processing apparatuses, a substrate is processed in the chamber with chemical species generated from plasma of a processing gas. Patent Literature 1 described below discloses such a plasma processing apparatus.

[0003] PRIOR ART DOCUMENTS

[0004] PATENT LITERATURE

[0005] Patent Literature 1: Japanese Patent Application Publication No. 2019-197849 SUMMARY

[0006] PROBLEMS TO BE SOLVED BY THE INVENTION

[0007] The present application provides a technology capable of easily maintaining an inner wall member of a substrate processing apparatus.

[0008] MEANS OF SOLVING THE PROBLEMS

[0009] In one example embodiment, a substrate processing apparatus is provided. The substrate processing apparatus includes a chamber, a substrate support, a support member, an inner wall member, a contact member, and an actuator. The chamber includes a sidewall that provides an opening. The substrate support is disposed in the chamber. The support member is disposed above the substrate support. The inner wall member includes a top portion that is configurable above the substrate support and below the support member. The contact member is mounted to one of the support member and the inner wall member. The contact member is configured to releasably secure the inner wall member to the support member by applying a horizontal spring reaction force to the other of the support member and the inner wall member. The actuator is configured to move the inner wall member downward to release the securing of the inner wall member to the support member.

[0010] EFFECTS OF THE INVENTION

[0011] According to one example embodiment, an inner wall member of a substrate processing apparatus can be easily maintained. BRIEF DESCRIPTION OF DRAWINGS

[0012] Figure 1 FIG. 1 is a view showing a substrate processing system according to an example embodiment.

[0013] Figure 2 is a diagram schematically showing a substrate processing apparatus of an example embodiment.

[0014] Figure 3 is a partial enlarged sectional view of a substrate processing apparatus of an example embodiment.

[0015] Figure 4 is a partial enlarged sectional view of a substrate processing apparatus of an example embodiment.

[0016] Figure 5 is a plan view showing a contact member in a substrate processing apparatus of an example embodiment.

[0017] Figure 6 is a plan view showing another example of a contact member in a substrate processing apparatus of an example embodiment.

[0018] Figure 7 is a diagram showing a state of a substrate processing apparatus when a maintenance method of an example embodiment is performed.

[0019] Figure 8 is a diagram showing a state of a substrate processing apparatus when a maintenance method of an example embodiment is performed.

[0020] Figure 9 is a diagram showing a state of a substrate processing apparatus when a maintenance method of an example embodiment is performed.

[0021] Figure 10 is a diagram showing a state of a substrate processing apparatus when a maintenance method of an example embodiment is performed.

[0022] Figure 11 is a diagram showing a state of a substrate processing apparatus when a maintenance method of an example embodiment is performed.

[0023] Figure 12 is a diagram showing a state of a substrate processing apparatus when a maintenance method of an example embodiment is performed.

[0024] Figure 13 is a partial enlarged sectional view of a support member, an inner wall member, and a contact member of another example embodiment.

[0025] Figure 14 is a partial enlarged sectional view of a support member, an inner wall member, and a contact member of still another example embodiment.

[0026] Figure 15 is a partial enlarged sectional view of a support member, an inner wall member, and a contact member of still another example embodiment.

[0027] Figure 16 is a diagram schematically showing a substrate processing apparatus of another example embodiment.

[0028] Figure 17 is a diagram schematically showing a substrate processing apparatus of another example embodiment.

[0029] Figure 18 In (a) and (b) of FIG. 10, Figure 18 (a) and (b) of FIG. 11 are plan views each showing a part of a contact mechanism in a substrate processing apparatus of another example embodiment, respectively. Figure 18 (a) and (b) of FIG. 11 are plan views each showing a part of a contact mechanism in a substrate processing apparatus of another example embodiment, respectively.

[0030] Figure 19 is a diagram schematically showing a substrate processing apparatus of another example embodiment.

[0031] Figure 20 is a partial enlarged sectional view of a contact mechanism in a substrate processing apparatus of another example embodiment.

[0032] Figure 21 is a diagram schematically showing a substrate processing apparatus of another example embodiment.

[0033] Figure 22 is a perspective view showing a part of a contact mechanism in a substrate processing apparatus of another example embodiment.

[0034] Figure 23 is a diagram schematically showing a substrate processing apparatus of another example embodiment.

[0035] Figure 24 is a partial enlarged sectional view of a contact mechanism in a substrate processing apparatus of another example embodiment.

[0036] Figure 25 is a partial enlarged sectional view of a contact mechanism of another example embodiment.

[0037] Figure 26 is a diagram schematically showing a substrate processing apparatus of another example embodiment.

[0038] Figure 27 In (a) and (b) of FIG. 10, Figure 27 (a) and (b) of FIG. 11 are plan views each showing a part of a contact mechanism in a substrate processing apparatus of another example embodiment, respectively. Figure 27 (a) and (b) of FIG. 11 are plan views each showing a part of a contact mechanism in a substrate processing apparatus of another example embodiment, respectively.

[0039] Figure 28 is a diagram schematically showing a substrate processing apparatus of another example embodiment.

[0040] Figure 29 is a partial enlarged sectional view of a substrate processing apparatus of another example embodiment.

[0041] Figure 30 is a partial enlarged sectional view of a substrate processing apparatus of another example embodiment.

[0042] Figure 31 is a partial enlarged sectional view of a substrate processing apparatus of another example embodiment.

[0043] Explanation of Reference Numerals

[0044] 1... substrate processing apparatus

[0045] 10... chamber

[0046] 12... substrate support

[0047] 14... support member

[0048] 16... inner wall member

[0049] 16c... top portion

[0050] 18... contact member

[0051] 20... actuator DETAILED DESCRIPTION

[0052] Hereinafter, various example embodiments will be explained in detail with reference to the accompanying drawings. In the drawings, like or equivalent components are designated by like reference numerals.

[0053] Figure 1 is a diagram showing a substrate processing system of one example embodiment. Figure 1 The substrate processing system PS shown includes process modules (also referred to as process modules) PM1 to PM6, a transfer module CTM, and a control section MC.

[0054] The substrate processing system PS can also include stages 2a to 2d, containers 4a to 4d, an aligner AN, load lock modules (also referred to as load lock modules) LL1, LL2, and a transfer module TM. Among them, the number of stages, the number of containers, and the number of load lock modules in the substrate processing system PS can be any number of one or more. In addition, the number of process modules in the substrate processing system PS can be any number of one or more.

[0055] The stages 2a to 2d are arranged along an edge of a loader module LM. The containers 4a to 4d are loaded on the stages 2a to 2d, respectively. The containers 4a to 4d are, for example, containers called FOUPs (Front Opening Unified Pod). The containers 4a to 4d are each configured to accommodate a wafer W inside thereof.

[0056] The loader module LM has a chamber. The pressure inside the chamber of the loader module LM is set to be atmospheric pressure. The loader module LM has a transport device TU1. The transport device TU1 is, for example, a transport robot, which is controlled by the control section MC. The transport device TU1 is configured to transport the wafer W via the chamber of the loader module LM. The transport device TU1 is capable of transporting the wafer W between each of the containers 4a to 4d and an aligner (also called a positioner) AN, between the aligner AN and each of the load lock modules LL1, LL2, and between each of the load lock modules LL1, LL2 and each of the containers 4a to 4d. The aligner AN is connected to the loader module LM. The aligner AN is configured to perform adjustment of the position of the wafer W (correction of the position).

[0057] The load lock module LL1 and the load lock module LL2 are each provided between the loader module LM and a transport module TM. The load lock module LL1 and the load lock module LL2 each provide a preliminary pressure reduction chamber. The load lock module LL1 and the load lock module LL2 are each connected to the loader module LM via a gate valve. In addition, the load lock module LL1 and the load lock module LL2 are each connected to the transport module TM via a gate valve.

[0058] The transport module TM has a transport chamber TC capable of pressure reduction. The transport module TM has a transport device TU2. The transport device TU2 is, for example, a transport robot, which is controlled by the control section MC. The transport device TU2 is configured to transport the wafer W via the transport chamber TC. The transport device TU2 is capable of transporting the wafer W between each of the load lock modules LL1, LL2 and each of the processing modules PM1 to PM6, and between any two of the processing modules PM1 to PM6.

[0059] The processing modules PM1 to PM6 are each connected to the transport module TM via a gate valve. The processing modules PM1 to PM6 are each a device configured to perform a dedicated wafer process. At least one of the processing modules PM1 to PM6 is a wafer processing device of the exemplary embodiment described later.

[0060] The transport assembly CTM has a chamber and a transport device. The transport assembly CTM is controlled by the control section MC. The transport assembly CTM is configured to be movable for connection with the chamber of the substrate processing device. In addition, the transport assembly CTM is configured to connect the inner space of the chamber of the substrate processing device and the inner space of the chamber of the transport assembly CTM with each other in a state where the inner spaces are depressurized. The transport device of the transport assembly CTM has a transport arm CA (see Figure 7 ). The transport arm CA is configured to transport the inner wall member of the substrate processing device between the inner space of the chamber of the substrate processing device and the outside (in one example, the inner space of the chamber of the transport assembly CTM).

[0061] The control section MC is configured to control each part of the substrate processing system PS. The control section MC can be a computer having a processor, a storage device, an input device, a display device, and the like. The control section MC executes a control program stored in the storage device, and controls each part of the substrate processing system PS based on recipe data stored in the storage device. The maintenance method of the example embodiment described later can be executed in the substrate processing system PS by the control of each part of the substrate processing system PS by the control section MC.

[0062] Hereinafter, the substrate processing device of the example embodiment will be described with reference to Figures 2-4 . Figure 2 is a diagram schematically showing a substrate processing device of one example embodiment. Figure 3 and Figure 4 are each a partial enlarged sectional view of a substrate processing device of one example embodiment. Figures 2-4 The substrate processing device 1 shown in the drawings can be used as one or more processing assemblies of a substrate processing system PS.

[0063] The substrate processing device 1 is a plasma processing device of a capacitively coupled type. The substrate processing device 1 includes a chamber 10, a substrate support 12, a support member 14, an inner wall member 16, one or more contact members 18, and an actuator 20.

[0064] The chamber 10 provides an inner space in the inside thereof. The chamber 10 is formed of a metal such as aluminum. The chamber 10 is electrically grounded. A corrosion-resistant film can be formed on the surface of the chamber 10. The corrosion-resistant film is formed of a material such as aluminum oxide or yttrium oxide, for example.

[0065] The chamber 10 includes a side wall 10s. The side wall 10s has a substantially cylindrical shape. The central axis of the side wall 10s extends in the vertical direction, and the inner space of the chamber 10 is provided in the inside of the side wall 10s. Figure 2The side wall 10s provides a passage 10p. The inside space of the chamber 10 is connectable with the inside space of the transfer chamber TC of the transfer assembly TM via the passage 10p. The passage 10p is openable and closable by a gate valve 10g. The substrate W is transferred between the inside space of the chamber 10 and the outside of the chamber 10 (i.e., the inside space of the transfer chamber TC) through the passage 10p.

[0066] The side wall 10s also provides an opening 10o. The opening 10o has a size through which the inner wall member 16 is passable. The inside space of the chamber 10 is connectable with the inside space of the chamber of the transfer assembly CTM via the opening 10o. The opening 10o is openable and closable by a gate valve 10v.

[0067] The chamber 10 can further include an upper portion (also referred to as an upper part) 10u. The upper portion 10u extends from an upper end of the side wall 10s in a direction crossing the axis AX. The upper portion 10u provides an opening in a region crossing the axis AX.

[0068] The substrate processing apparatus 1 further includes an exhaust device 11. The exhaust device 11 includes a pressure regulator such as an auto pressure control valve and a pressure reducing pump such as a turbo molecular pump. The exhaust device 11 is connected with the inside space of the chamber 10 through a bottom portion of the chamber 10.

[0069] A substrate support 12 is provided in the chamber 10. The substrate support 12 is configured to support a substrate W placed thereon. The substrate support 12 can include a susceptor 22 and an electrostatic chuck 24. The susceptor 22 has a substantially disc shape. A central axis of the susceptor 22 is substantially coincident with the axis AX. The susceptor 22 is formed of a conductor such as aluminum. The susceptor 22 has a flow path 22f provided therein. The flow path 22f extends, for example, spirally. The flow path 22f is connected with a cooling unit 23. The cooling unit 23 is provided outside the chamber 10. The cooling unit 23 supplies a heat transfer medium (e.g., a refrigerant) to the flow path 22f. The heat transfer medium supplied to the flow path 22f flows in the flow path 22f and returns to the cooling unit 23.

[0070] An electrostatic chuck 24 is provided on the susceptor 22. The electrostatic chuck 24 includes a main body and a chuck electrode. The main body of the electrostatic chuck 24 has a substantially disc shape. A central axis of the electrostatic chuck 24 substantially coincides with the axis AX. The main body of the electrostatic chuck 24 is formed of ceramic. The wafer W is placed on an upper surface of the main body of the electrostatic chuck 24. The chuck electrode is a film formed of a conductor. The chuck electrode is provided in the main body of the electrostatic chuck 24. The chuck electrode is connected to a direct current power source via a switch. When a voltage from the direct current power source is applied to the chuck electrode, electrostatic attraction is generated between the electrostatic chuck 24 and the wafer W. The wafer W is attracted to the electrostatic chuck 24 by the generated electrostatic attraction, and is thereby held by the electrostatic chuck 24. The wafer processing apparatus 1 can also provide a gas line that supplies a heat transfer gas (e.g., helium) to a gap between the electrostatic chuck 24 and a back surface of the wafer W.

[0071] The wafer support 12 can also support an edge ring (Edge Ring) ER arranged thereon. The wafer W is placed on the electrostatic chuck 24 in an area surrounded by the edge ring ER. The edge ring ER is formed of, for example, silicon, quartz, or silicon carbide.

[0072] The wafer processing apparatus 1 can further include an insulator 26. The insulator 26 is formed of an insulator such as quartz. The insulator 26 has a substantially cylindrical shape. The insulator 26 extends along an outer periphery of the susceptor 22 and an outer periphery of the electrostatic chuck 24.

[0073] The wafer processing apparatus 1 can further include a conductor 28. The conductor 28 is formed of a conductor such as aluminum. The conductor 28 has a substantially cylindrical shape. The conductor 28 extends along an outer peripheral surface of the insulator 26. The conductor 28 extends in a circumferential direction outside the insulator 26 in a radial direction. Here, the radial direction and the circumferential direction are directions with respect to the axis AX. The conductor 28 is grounded. In one example, the conductor 28 is grounded via the chamber 10. The conductor 28 can also be a part of the chamber 10.

[0074] The wafer processing apparatus 1 can further include a high frequency power source 31 and a bias power source 32. The high frequency power source 31 is a power source that generates source high frequency power. The source high frequency power has a frequency suitable for generating plasma. The frequency of the source high frequency power is, for example, 27 MHz or more. The high frequency power source 31 is electrically connected to an electrode in the wafer support 12 via a matcher 31m. The high frequency power source 31 can also be electrically connected to the susceptor 22. The matcher 31m has a matching circuit for matching an impedance on a load side of the high frequency power source 31 to an output impedance of the high frequency power source 31. The high frequency power source 31 can also be electrically connected to another electrode in the wafer support 12. Alternatively, the high frequency power source 31 can be electrically connected to the upper electrode via the matcher 31m.

[0075] The bias power supply 32 is a power supply that generates electric bias energy. The electric bias energy is supplied to the electrodes of the substrate support 12 in order to introduce ions from the plasma to the substrate W. The electric bias energy can also be bias high-frequency power. The waveform of the bias high-frequency power is a sine wave having a bias frequency. The bias frequency is, for example, 13.56 MHz or less. In this case, the bias power supply 32 is electrically connected to the electrodes of the substrate support 12 via a matcher 32m. The bias power supply 32 can also be electrically connected to the susceptor 22. The matcher 32m has a matching circuit for matching the impedance on the load side of the bias power supply 32 to the output impedance of the bias power supply 32. The bias power supply 32 can also be electrically connected to another electrode within the substrate support 12.

[0076] Alternatively, the electric bias energy can also be a pulse of voltage that is periodically generated at a time interval that is the inverse of the above-described bias frequency. The pulse of voltage can have a negative polarity. The pulse of voltage can also be a pulse generated from a negative direct-current voltage.

[0077] The support member 14 is provided above the substrate support 12. The support member 14 is provided below the upper portion 10u of the chamber 10 and inside the side wall 10s. The support member 14 is configured to be movable upward and downward within the chamber 10.

[0078] The substrate processing apparatus 1 can further include a lifting mechanism 34. The lifting mechanism 34 is configured to move the support member 14 upward and downward. The lifting mechanism 34 includes a driving device (e.g., a motor) that generates a motive force for moving the support member 14. The lifting mechanism 34 can also be provided outside the chamber 10 and above or upward of the upper portion 10u.

[0079] The substrate processing apparatus 1 can further include a bellows 36. The bellows 36 is provided between the support member 14 and the upper portion 10u. The bellows 36 separates the internal space of the chamber 10 from the outside of the chamber 10. The lower end of the bellows 36 is fixed to the support member 14. The upper end of the bellows 36 is fixed to the upper portion 10u.

[0080] The support member 14 has a substantially disc shape. The central axis of the support member 14 is the axis AX. The support member 14 is formed of a conductor such as aluminum. In one embodiment, the support member 14 can also constitute an upper electrode of a capacitively coupled plasma processing apparatus. The support member 14 can be grounded in the case where the high-frequency power supply 31 is electrically connected to the electrodes within the substrate support 12. In this case, the support member 14 can also be in contact with the inner wall surface of the chamber 10 via a connecting member 37.

[0081] In one embodiment, the support member 14 can also constitute a shower head (may also be referred to as a shower) together with a top portion of the inner wall member 16, which will be described later. The shower head is configured to supply a gas into the chamber 10 (or a processing space S, which will be described later). In this embodiment, the support member 14 provides (i.e., has) a gas diffusion chamber 14d and a plurality of gas holes 14h.

[0082] The gas diffusion chamber 14d is formed in the support member 14. A gas supply portion 38 is connected to the gas diffusion chamber 14d. The gas supply portion 38 is provided outside the chamber 10. The gas supply portion 38 includes one or more gas sources, one or more flow controllers, and one or more valves used in the substrate processing apparatus 1. The one or more gas sources are connected to the gas diffusion chamber 14d via the corresponding flow controllers and the corresponding valves, respectively. The plurality of gas holes 14h extend downward from the gas diffusion chamber 14d.

[0083] In one embodiment, the support member 14 can also provide a flow path 14f therein. The flow path 14f is connected to a cooling unit 40. The cooling unit 40 is provided outside the chamber 10. The cooling unit 40 supplies a heat transfer medium (e.g., a refrigerant) to the flow path 14f. The heat transfer medium supplied to the flow path 14f flows in the flow path 14f and returns to the cooling unit 40.

[0084] The inner wall member 16 is configured to be transportable between the inside and the outside of the chamber 10. The inner wall member 16 can also be transported between the inside and the outside of the chamber 10 by the transport arm CA via the opening 10o.

[0085] The inner wall member 16 is formed of a metal such as silicon, silicon carbide, or aluminum. A corrosion-resistant film can be formed on the surface of the inner wall member 16. The corrosion-resistant film is formed of a material such as aluminum oxide or yttrium oxide, for example.

[0086] The inner wall member 16 includes a top portion 16c that is configurable above the substrate support 12 and below the support member 14. The top portion 16c is plate-shaped and has a substantially disc shape. The top portion 16c is configured in the chamber 10 with its central axis located on the axis AX. The top portion 16c can also be configured directly below the support member 14 in the chamber 10. Alternatively, as shown in FIG. 2, the heat transfer sheet 42 can be sandwiched between the lower surface of the support member 14 and the top portion 16c of the inner wall member 16. Figure 3

[0087] ​As described above, the top portion 16c can also provide (i.e., constitute) the showerhead together with the support member 14. In this case, the top portion 16c provides a plurality of gas holes 16h. The plurality of gas holes 16h penetrate the top portion 16c. The top portion 16c is disposed in the chamber 10 in such a manner that the plurality of gas holes 16h respectively communicate with the plurality of gas holes 14h. The gas from the gas supply section 38 described above is supplied into the chamber 10 (or the processing space S) via the gas diffusion chamber 14d, the plurality of gas holes 14h, and the plurality of gas holes 16h.

[0088] In one embodiment, the inner wall member 16 can also include a side wall portion 16s. The side wall portion 16s has a substantially cylindrical shape and extends downward from a peripheral portion of the top portion 16c. The side wall portion 16s is disposed in the chamber 10 in such a manner that a central axis thereof is located on the axis AX. The inner wall member 16 can form the processing space S together with the substrate support 12 in which a substrate W placed on the substrate support 12 can be processed. In this case, a lower end of the side wall portion 16s can also be configured to be in contact with the conductor portion 28.

[0089] The side wall portion 16s can also provide a plurality of through holes. The plurality of through holes of the side wall portion 16s intercommunicate the processing space S and a space outside the side wall portion 16s. The gas in the processing space S is exhausted by the exhaust device 11 via the plurality of through holes of the side wall portion 16s and the space outside the side wall portion 16s.

[0090] Hereinafter, a contact member of a substrate processing apparatus according to one example embodiment will be described with reference to Figures 2-4 Figure 5 Figure 6 Figure 5 FIG. 1 is a plan view of a contact member of a substrate processing apparatus according to one example embodiment. Figure 6 FIG. 2 is a plan view of a contact member of a substrate processing apparatus according to another example embodiment. The substrate processing apparatus 1 can include a plurality of contact members 18 as one or more contact members.

[0091] The plurality of contact members 18 can be formed of a conductor such as a metal. The plurality of contact members 18 are mounted in one (one member) of the support member 14 and the inner wall member 16. The plurality of contact members 18 are each deformed in the horizontal direction by the other (the other member) when the one and the other are combined, and exert a spring reaction force in the horizontal direction on the other. Thus, the plurality of contact members 18 fix the inner wall member 16 to the support member 14 in such a manner that the inner wall member 16 is detachable.

[0092] In Figures 2-4 ​​​In the illustrated embodiment, the plurality of contact members 18 are attached to the support member 14. The plurality of contact members 18 are deformed in the horizontal direction by the inner wall member 16 when the inner wall member 16 is combined with the support member 14, and exert a spring reaction force in the horizontal direction on the inner wall member 16. Thus, the plurality of contact members 18 fix the inner wall member 16 to the support member 14 in a manner that the inner wall member 16 is detachable.

[0093] In one embodiment, the lower surface 14b of the support member 14 can also be provided with a plurality of recesses 14r. The plurality of recesses 14r open downward. In addition, the upper surface 16t of the top portion 16c can also be provided with a plurality of recesses 16r. The plurality of recesses 16r open upward. The plurality of contact members 18 can each also include a first portion 181 and a second portion 182. The first portion 181 is fitted into a corresponding recess 14r of the support member 14. The second portion 182 extends downward from the first portion 181 and has a spring. The spring of the second portion 182 exerts a spring reaction force by being fitted into a corresponding recess 16r of the top portion 16c.

[0094] In one embodiment, the plurality of contact members 18 can also be configured to be detachable with respect to the support member 14. The first portion 181 is elastic so that it can be extracted from a corresponding recess 14r by being deformed in the horizontal direction when the contact member 18 is detached from the support member 14. In one embodiment, the plurality of recesses 14r of the support member 14 can each also be formed narrow at their lower ends.

[0095] In one embodiment, the first portion 181 can also be arc-shaped in any cross section including the axis AX, and can have a cavity inside. In addition, the first portion 181 can also open at its lower end. The first portion 181 is elastic in the horizontal direction. The first portion 181 can be extracted from a corresponding recess 14r by being deformed in the horizontal direction and passing through the lower end of the recess 14r in a state in which it is reduced in the horizontal direction.

[0096] In one embodiment, the second portion 182 can also extend downward from the lower end of the first portion 181 and extend obliquely upward from its lower end to provide a leaf spring. The second portion 182 can also be provided with an opening at its lower end. The second portion 182 is deformed in the horizontal direction by a wall surface that forms the recess 16r when it is fitted into a corresponding recess 16r of the top portion 16c, and exerts a spring reaction force on the wall surface. Thus, the plurality of contact members 18 can fix the inner wall member 16 to the support member 14 in a detachable manner.

[0097] In one embodiment, as Figure 5As shown, the plurality of contact members 18 can also have a ring shape extending in the circumferential direction. In this embodiment, the plurality of recesses 14r and the plurality of recesses 16r also have a ring shape extending in the circumferential direction, respectively. In this embodiment, in a state where the inner wall member 16 is fixed with respect to the support member 14 within the chamber 10 (a state where the inner wall member 16 is fixed to the support member 14), the plurality of contact members 18, the plurality of recesses 14r, and the plurality of recesses 16r extend in the circumferential direction around the axis AX.

[0098] In another embodiment, as shown in FIG. 6, the plurality of contact members 18 can also be arranged along one circle or a plurality of concentric circles. In this embodiment, the plurality of recesses 14r and the plurality of recesses 16r also are arranged along one circle or a plurality of concentric circles, respectively. In this embodiment, in a state where the inner wall member 16 is fixed with respect to the support member 14 within the chamber 10 (a state where the inner wall member 16 is fixed to the support member 14), the plurality of contact members 18, the plurality of recesses 14r, and the plurality of recesses 16r are arranged in the circumferential direction around the axis AX. Figure 6

[0099] Referring again to FIG. 1, Figures 2-4 To release the fixation of the inner wall member 16 with respect to the support member 14, the actuator 20 is configured to move the inner wall member 16 downward. In one embodiment, the actuator 20 includes a driving device 20d. The actuator 20 can also include a plurality of rods 20r.

[0100] The driving device 20d is provided outside the chamber 10. The driving device 20d generates a power to move the driving shaft 20m up and down. The driving device 20d can include a power cylinder such as a cylinder or an electric motor. The driving device 20d is fixed to the support member 44 outside the chamber 10.

[0101] The plurality of rods 20r is coupled to the driving shaft 20m. The plurality of rods 20r extends downward from the driving shaft 20m. The plurality of rods 20r is arranged in the circumferential direction around the axis AX. The plurality of rods 20r can be arranged at equal intervals.

[0102] The support member 14 provides a plurality of through holes extending in the vertical direction. The plurality of through holes penetrates the support member 14 from the upper surface of the support member 14 through the gas diffusion chamber 14d to the lower surface of the support member 14. The plurality of rods 20r is inserted into the plurality of through holes of the support member 14. A sealing member 48 such as an O-ring is provided between the support member 14 and each of the plurality of rods 20r. In addition, the plurality of rods 20r passes through the inner hole of the cylindrical member 46 within the gas diffusion chamber 14d.

[0103] ​The plurality of rods 20r are moved up and down by driving of the driving device 20d. The plurality of rods 20r are configured to be located at the same level as the upper surface 16t of the top portion 16c of the inner wall member 16 or above the upper surface 16t in a state where the inner wall member 16 is fixed to the support member 14. The plurality of rods 20r are moved by driving of the driving device 20d so that the inner wall member 16 is moved downward in a state where the lower ends of the plurality of rods 20r are in abutment with the upper surface 16t of the top portion 16c of the inner wall member 16 when the inner wall member 16 is detached from the support member 14.

[0104] According to the substrate processing apparatus 1, the plurality of contact members 18 are deformed by the inner wall member 16, thereby exerting a spring reaction force on the inner wall member 16 in the horizontal direction. Thereby, the inner wall member 16 is fixed to the support member 14. In addition, by moving the inner wall member 16 downward with the actuator 20 against the spring reaction force of the plurality of contact members 18, it is possible to easily release the fixation of the inner wall member 16 with respect to the support member 14. The inner wall member 16, which has released the fixation with respect to the support member 14, can be transported from the inside to the outside of the chamber 10 via the opening 10o of the side wall 10s of the chamber 10. Therefore, according to the substrate processing apparatus 1, it is possible to easily maintain the inner wall member 16.

[0105] Further, the substrate processing apparatus 1 can also include a single contact member 18. In this case, the number of each of the recesses 14r and 16r is one.

[0106] Hereinafter, the maintenance method of the substrate processing apparatus according to one example embodiment will be described with reference to the drawings. Figures 7-12 The maintenance method of the substrate processing apparatus according to one example embodiment will be described. Figures 7-12 Each of the drawings is a view showing a state of the substrate processing apparatus when the maintenance method according to one example embodiment is performed. In the maintenance method, each part (each constituent) of the substrate processing system PS is controlled by the control section MC.

[0107] In the maintenance method, the plurality of contact members 18 are attached to one of the support member 14 and the inner wall member 16. In the case where the maintenance method is applied to the substrate processing apparatus 1, the plurality of contact members 18 are attached to the support member 14. Specifically, as shown in FIG. 6, the base 50 is transported into the chamber 10 from the outside of the chamber 10 by the transport arm CA. The base 50 is provided (formed) with a plurality of recesses on its upper surface. The second portions 182 of the plurality of contact members 18 are embedded in the plurality of recesses of the base 50. The base 50 is transported into the chamber 10 in such a manner that the plurality of contact members 18 are located below the plurality of recesses 14r of the support member 14. Figure 7

[0108] ​Next, the support member 14 is moved upward by the transport arm CA or is moved downward by the lifting mechanism 34. As a result, as shown in Fig. 6, the first portions 181 of the plurality of contact members 18 are fitted in the plurality of recesses 14r of the support member 14, and the plurality of contact members 18 are mounted to the support member 14. Then, the transport arm CA is withdrawn from the inside of the chamber 10 to the outside. Figure 8

[0109] Next, the inner wall member 16 is transported from the outside of the chamber 10 to the inside of the chamber 10 through the opening 10o by the transport arm CA. Next, the support member 14 or the inner wall member 16 is moved in the vertical direction. That is, the support member 14 is moved downward by the lifting mechanism 34, or the inner wall member 16 is moved upward by the transport arm CA. As a result, as shown in Fig. 8, the inner wall member 16 is fixed to the support member 14 in a detachable manner. Figure 9

[0110] The plurality of contact members 18 are deformed in the horizontal direction by the other of the support member 14 and the inner wall member 16 to which the spring reaction force is applied. In the substrate processing apparatus 1, the other is the inner wall member 16. Specifically, the second portions 182 of the plurality of contact members 18 are each fitted in the corresponding recess 16r to be reduced in the horizontal direction, and the spring reaction force is applied to the wall surface that forms the corresponding recess 16r. Thus, the inner wall member 16 is fixed to the support member 14. After the inner wall member 16 is fixed to the support member 14, the transport arm CA is withdrawn from the inside of the chamber 10 to the outside.

[0111] In the maintenance method, the inner wall member 16 is carried from the inside of the chamber 10 to the outside of the chamber 10 in order to maintain (e.g., replace) the inner wall member 16. Therefore, the transport arm CA enters the inside of the chamber 10 from the outside of the chamber 10 through the opening 10o.

[0112] Next, the inner wall member 16 is moved downward by the actuator 20 against the spring reaction force of the plurality of contact members 18. Thus, the fixing of the plurality of contact members 18 to the inner wall member 16 is released. As shown in Fig. 10, the inner wall member 16 moved downward is handed over to the transport arm CA. Next, the inner wall member 16 is carried from the inside of the chamber 10 to the outside of the chamber 10 through the opening 10o by the transport arm CA. Figure 10

[0113] In the maintenance method, the plurality of contact members 18 can be detached in order to maintain (e.g., replace) the plurality of contact members 18. Therefore, as shown in Fig. 11, the plurality of contact members 18 are detached from the support member 14. Figure 11 ​​​As shown, the base 54 is transported from the outside of the chamber 10 to the inside of the chamber 10 via the conveying arm CA through the opening 10o. The base 54 has a plurality of recesses 54r on its upper surface. The openings of the plurality of recesses 54r are each narrowed at their upper ends by a protrusion 54p. The base 54 is configured such that the plurality of recesses 54r are located below the plurality of contact members 18.

[0114] Next, the conveyor arm CA is moved upward, or the support member 14 is moved downward using the lifting mechanism 34. As a result, the second portion 182 of each of the plurality of contact members 18 is embedded in the corresponding recess 54r. The second portion 182 of each of the plurality of contact members 18 expands to have a width greater than the width of the upper opening after passing through the upper opening of the corresponding recess 54r. Next, the conveyor arm CA is moved downward, or the support member 14 is moved upward using the lifting mechanism 34. As a result, as... Figure 12 As shown, multiple contact components 18 are detached from the support component 14 and transferred to the base 54. Then, the multiple contact components 18 are transported from the inside of the chamber 10 to the outside of the chamber 10 via the conveying arm CA.

[0115] The following is for reference Figure 13 The support member, inner wall member, and contact member of another exemplary embodiment will be described. Figure 13 This is a partially enlarged cross-sectional view of the support member, inner wall member, and contact member of another exemplary embodiment. Figure 13 The support member, inner wall member, and contact member of the embodiment shown can be used in the substrate processing apparatus 1.

[0116] exist Figure 13 In the illustrated embodiment, the upper surface 16t of the top 16c is provided with a plurality of protrusions 16p. The plurality of protrusions 16p project upwards compared to other portions of the upper surface 16t of the top 16c. Additionally, in Figure 13 In the embodiment shown, the lower surface 14b of the support member 14 is provided with a plurality of recesses 14r. The plurality of recesses 14r open downward.

[0117] exist Figure 13 In the illustrated embodiment, the plurality of contact members 18 can be formed of a conductor such as metal. The plurality of contact members 18 are fixed within a plurality of recesses 14r. The wall surface of the support member 14 defining (forming) each of the plurality of recesses 14r may also be provided with female threads. The outer peripheral surface of each of the plurality of contact members 18 may also be provided with male threads. The plurality of contact members 18 are respectively fixed within the corresponding recesses 14r by engaging with the female threads in the corresponding recesses 14r.

[0118] Multiple contact members 18 each provide a downwardly opening recess 18r. Each contact member 18 includes a spring 183. The spring 183 is disposed within the recess 18r. The lower end of the spring 183 is directly or indirectly fixed to the wall defining (forming) the recess 18r in such a way that the spring 183 can deform in the horizontal direction. When the corresponding protrusion 16p is inserted into the recess 18r, the spring 183 deforms in the horizontal direction, applying a spring reaction force to the protrusion 16p in the horizontal direction. Thus, the inner wall member 16 is fixed to the support member 14. Figure 13 In the embodiment shown, when the inner wall component 16 is moved downward by the actuator 20, the fixation of the inner wall component 16 relative to the support component 14 can be easily released.

[0119] like Figure 13 As shown, the spring 183 can also be fixed to the wall defining the recess 18r by means of a floating mechanism 184. The floating mechanism 184 can absorb the horizontal displacement of the protrusion 16p.

[0120] The following is for reference Figure 14 The support member, inner wall member, and contact member of another exemplary embodiment will be described. Figure 14 This is a partially enlarged cross-sectional view of the support member, inner wall member, and contact member of yet another exemplary embodiment. Figure 14 The support member, inner wall member, and contact member of the embodiment shown can be used in the substrate processing apparatus 1.

[0121] exist Figure 14 In the illustrated embodiment, the lower surface 14b of the support member 14 is provided with a plurality of recesses 14r. The plurality of recesses 14r open downwards. Figure 14 In the illustrated embodiment, the upper surface of the top 16c is provided with a plurality of protrusions 16p. The plurality of protrusions 16p may also include an upper portion 161 and a lower portion 162. The upper portion 161 is disposed above the lower portion 162. The width of the upper portion 161 may also be greater than the width of the lower portion 162.

[0122] exist Figure 14 In the illustrated embodiment, the plurality of contact members 18 can be formed of a conductor such as metal. The plurality of contact members 18 are respectively fixed to the top 16c in such a way that they cover the corresponding protrusion 16p. Each of the plurality of contact members 18 includes a cover portion 185. The cover portion 185 provides a cavity with an opening at its lower end. The cover portion 185 covers the corresponding protrusion 16p housed within its cavity. The wall surface of the cover portion 185 defining the cavity contacts the outer surfaces of the upper portion 161 and the lower portion 162 of the corresponding protrusion 16p. When the cover portion 185 is installed on the corresponding protrusion 16p, it covers the corresponding protrusion 16p with its lower end opening enlarged.

[0123] Each of the multiple contact members 18 also includes a spring 186. The spring 186 is disposed on the side of the cover 185. The lower end of the spring 186 is fixed to the lower end of the cover 185. The spring 186 extends upward from the lower end of the cover 185 in a manner capable of deforming in the horizontal direction. When each of the multiple contact members 18 and its corresponding protrusion 16p is embedded in its corresponding recess 14r, the spring 186 deforms in the horizontal direction, applying a spring reaction force to the support member 14 in the horizontal direction. Thus, the inner wall member 16 is fixed to the support member 14. Figure 14 In the embodiment shown, when the inner wall component 16 is moved downward by the actuator 20, the fixation of the inner wall component 16 relative to the support component 14 can be easily released.

[0124] The following is for reference Figure 15 The support member, inner wall member, and contact member of another exemplary embodiment will be described. Figure 15 This is a partially enlarged cross-sectional view of the support member, inner wall member, and contact member of yet another exemplary embodiment. Figure 15 The support member, inner wall member, and contact member of the embodiment shown can be used in the substrate processing apparatus 1.

[0125] exist Figure 15 In the illustrated embodiment, the lower surface 14b of the support member 14 provides a single recess. The recess provided on the lower surface 14b of the support member 14 is generally circular when viewed from above. Figure 15 In the illustrated embodiment, the upper surface 16t of the top 16c is provided with a single protrusion. The protrusion provided on the upper surface 16t of the top 16c is generally circular when viewed from above.

[0126] exist Figure 15 In the illustrated embodiment, the contact component 18 is a spiral spring gasket. Figure 15 In the illustrated embodiment, the contact member 18 can be formed of a conductor such as metal. The contact member 18 is arranged to extend circumferentially along the inner wall surface of the recess defining the support member 14. By embedding the protrusion of the top 16c into the recess of the support member 14, the contact member 18, i.e., the helical spring washer, is clamped between the outer peripheral surface of the protrusion of the top 16c and the inner wall surface of the recess defining the support member 14. As a result, the contact member 18 deforms in the horizontal direction, applying a spring reaction force to the inner wall member 16, i.e., the outer peripheral surface of the protrusion of the top 16c. Thus, the inner wall member 16 is fixed to the support member 14. Figure 15 In the embodiment shown, when the inner wall component 16 is moved downward by the actuator 20, the fixation of the inner wall component 16 relative to the support component 14 can be easily released.

[0127] Hereinafter, referring to Figure 16 A substrate processing apparatus of another example embodiment will be described. Figure 16 is a diagram schematically showing a substrate processing apparatus of another example embodiment. Figure 16 The substrate processing apparatus IB shown in the figure has an inner wall member 16B instead of the inner wall member 16, unlike the substrate processing apparatus 1. The inner wall member 16B has a top portion 16c like the inner wall member 16, but does not have a side wall portion 16s. Other structures of the substrate processing apparatus IB are the same as the corresponding structures of the substrate processing apparatus 1.

[0128] Hereinafter, substrate processing apparatuses of several further example embodiments will be described. Each of the example embodiments described hereinafter has a contact mechanism that electrically connects the inner wall member 16 to a conductor portion 28 that is grounded. The inner wall member 16 is formed of a material having electrical conductivity. The conductor portion 28 has a cylindrical shape and extends along the outer periphery of the substrate support 12. The contact mechanism electrically connects the lower end 16e of the side wall portion 16s of the inner wall member 16 to the conductor portion 28.

[0129] Referring to Figure 17 , Figure 18 (a) and Figure 18 (b). Figure 17 is a diagram schematically showing a substrate processing apparatus of yet another example embodiment. Figure 18 (a) and Figure 18 (b) are each a plan view that shows a part of a contact mechanism of a substrate processing apparatus of yet another example embodiment in an enlarged manner. Figure 17 The substrate processing apparatus IC shown in the figure includes a contact mechanism 60C, unlike the substrate processing apparatus 1. As shown in Figure 17 , Figure 18 (a) and Figure 18 (b), the contact mechanism 60C includes a cylindrical body 61, a pressing body 62, and a driving portion 63.

[0130] The cylindrical body 61 is formed of an electrically conductive material such as aluminum. The cylindrical body 61 is electrically connected to the conductor portion 28 and extends along the outer periphery of the conductor portion 28. The pressing body 62 is formed of an electrically conductive material such as aluminum. The pressing body 62 is disposed between the substrate support 12 and the cylindrical body 61. The driving portion 63 is configured to be able to rotate (revolve) the cylindrical body 61 in the circumferential direction. The driving portion 63 includes, for example, a motor. The contact mechanism 60C presses the pressing body 62 to the outer peripheral surface of the lower end 16e of the side wall portion 16s by the rotation of the cylindrical body 61 in the circumferential direction. Thus, the contact mechanism 60C electrically connects the inner wall member 16 to the conductor portion 28 via the pressing body 62 and the cylindrical body 61.

[0131] In one example, the conductor portion 28 includes a plurality of guides 28p protruding in the radial direction. The plurality of guides 28p are arranged in the circumferential direction. In addition, the contact mechanism 60C includes a plurality of press bodies 62. The plurality of press bodies 62 are arranged in the circumferential direction. The plurality of press bodies 62 each provide (form) a hole 62h into which a corresponding guide of the plurality of guides 28p is inserted. The plurality of press bodies 62 each are movable in the radial direction by the corresponding guide inserted in the hole 62h. The plurality of press bodies 62 each further include a protrusion 62p protruding to the radial direction outer side. In the illustrated example, the plurality of press bodies 62 each have a pair of protrusions 62p in the form of ribs on both sides of the hole 62h. The cylindrical body 61 includes a plurality of protrusions 61p protruding to the radial direction inner side. The plurality of protrusions 61p are arranged in the circumferential direction.

[0132] As Figure 18 (a) shows, in a state where a corresponding protrusion of the plurality of protrusions 61p does not abut against the protrusion 62p of each of the plurality of press bodies 62, the plurality of press bodies 62 do not abut against the lower end 16e of the side wall portion 16s. As Figure 18 (b) shows, when the cylindrical body 61 is rotated so that the corresponding protrusion of the plurality of protrusions 61p abuts against the protrusion 62p of each of the plurality of press bodies 62, the press body 62 is pressed against the outer peripheral surface of the lower end 16e of the side wall portion 16s. As a result, the inner wall member 16 is electrically connected to the conductor portion 28 via the press body 62 and the cylindrical body 61. Further, in the state shown in Figure 18 (b), the lower end 16e of the side wall portion 16s can be sandwiched between each of the plurality of press bodies 62 and the insulating portion 26.

[0133] Hereinafter, reference is made to Figure 19 and Figure 20 . Figure 19 is a diagram schematically showing a substrate processing apparatus of still another example embodiment. Figure 20 is a partial enlarged cross-sectional view of a contact mechanism in a substrate processing apparatus of still another example embodiment. Figure 19 The substrate processing apparatus 1D shown in

[0134] As Figure 19 and Figure 20As shown, in the substrate processing apparatus 1D, the conductor portion 28 has a circumferentially extending recess 28r at its upper end. The contact mechanism 60D includes a contact member 64. The contact member 64 is a resilient conductive component, such as a helical spring washer. The contact member 64 extends circumferentially in the recess 28r and is electrically connected to the conductor portion 28. In the contact mechanism 60D, the contact member 64 resiliently contacts the lower end 16e of the sidewall portion 16s disposed in the recess 28r. Thus, the contact mechanism 60D electrically connects the inner wall portion 16 to the conductor portion 28 via the contact member 64. Alternatively, as shown, it can also be configured such that a pair of contact members 64 clamp the lower end 16e of the sidewall portion 16s in the recess 28r.

[0135] Below, refer to Figure 21 and Figure 22 . Figure 21 This is a diagram that schematically illustrates a substrate processing apparatus of yet another exemplary embodiment. Figure 22 This is a perspective view showing an enlarged portion of the contact mechanism in a substrate processing apparatus according to yet another exemplary embodiment. Figure 21 The substrate processing apparatus 1E shown includes a contact mechanism 60E, which is different from the substrate processing apparatus 1.

[0136] like Figure 21 and Figure 22 As shown, the contact mechanism 60E includes a plurality of male connectors 601E and a plurality of female connectors 602E. The plurality of male connectors 601E are mounted on the lower end 16e of the sidewall portion 16s and arranged circumferentially. The plurality of female connectors 602E are mounted on the upper end of the conductor portion 28 and arranged circumferentially. The contact mechanism 60E electrically connects the inner wall member 16 to the conductor portion 28 by engaging each of the plurality of male connectors 601E with a corresponding female connector among the plurality of female connectors 602E. Alternatively, the plurality of male connectors 601E may be mounted on the upper end of the conductor portion 28, and the plurality of female connectors 602E may be mounted on the lower end 16e of the sidewall portion 16s.

[0137] Below, refer to Figure 23 and Figure 24 . Figure 23 This is a diagram that schematically illustrates a substrate processing apparatus of yet another exemplary embodiment. Figure 24 This is a partially enlarged cross-sectional view of the contact mechanism in a substrate processing apparatus according to yet another exemplary embodiment. Figure 23 The substrate processing apparatus 1F shown includes a contact mechanism 60F, which is different from the substrate processing apparatus 1.

[0138] The contact mechanism 60F includes a contact member 65. The contact member 65 is a thin film having flexibility, and is formed of an electrically conductive material. The contact member 65 is provided in a recess provided by the conductor portion 28. The contact member 65 is supported by the conductor portion 28, and is electrically connected to the conductor portion 28. In addition, the contact member 65 is arranged so as to be able to abut against a lower surface provided by the lower end 16e of the side wall portion 16s. The contact mechanism 60F electrically connects the inner wall member 16 to the conductor portion 28 via the contact member 65 by pressing the contact member 65 against the lower surface of the side wall portion 16s. Furthermore, the lower surface of the lower end 16e of the side wall portion 16s can be provided by a film 16f of the lower end 16e. The film 16f can also be formed of a conductor film or a carbon nanotube.

[0139] In one example, the contact mechanism 60F can also press the contact member 65 against the lower surface of the side wall portion 16s by the pressure of a fluid (e.g., a gas). In this example, the contact mechanism 60F can further include a press pin 66. The press pin 66 is arranged so that the contact member 65 is located between the front end of the press pin 66 and the lower surface of the side wall portion 16s. The press pin 66 presses the contact member 65 against the lower surface of the side wall portion 16s by the pressure of a gas supplied from a gas supplier 67. The press pin 66 can be configured to be connected to a spring 66s that exerts a force in a direction in which the press pin 66 is separated from the contact member 65.

[0140] Hereinafter, with reference to Figure 25 . Figure 25 is a partial enlarged sectional view of a contact mechanism of another example embodiment. Figure 25 The contact mechanism illustrated in FIG. 8 includes a piezoelectric element 68. The piezoelectric element 68 is supported by the insulating portion 2, and is arranged below the lower end 16e of the side wall portion 16s. The piezoelectric element 68 includes a piezoelectric ceramic portion 68a and a pair of electrodes 68b, 68c. The piezoelectric ceramic portion 68a is arranged between the pair of electrodes 68b, 68c. An electrically conductive body 69 is fixed to the upper surface of the piezoelectric element 68. The electrically conductive body 69 is electrically connected to the conductor portion 28. By applying a voltage from a power source 68p to the electrode 68c, the piezoelectric element 68 extends toward the lower end 16e of the side wall portion 16s. As a result, the electrically conductive body 69 is pressed against the lower surface of the lower end 16e of the side wall portion 16s. As a result, the inner wall member 16 is electrically connected to the conductor portion 28.

[0141] Hereinafter, with reference to Figure 26 , Figure 27 (a) of FIG. 10 and Figure 27 (b) of FIG. 11. Figure 26 is a diagram schematically showing a substrate processing apparatus of another example embodiment. Figure 27 (a) of FIG. 10 and Figure 27 (b) of FIG. 11 are each a partial enlarged sectional view of a contact mechanism in a substrate processing apparatus of another example embodiment. Figure 26The substrate processing apparatus 1G is different from the substrate processing apparatus 1 in that it includes the contact mechanism 60G.

[0142] In the substrate processing apparatus 1G, the conductor portion 28 has a substantially cylindrical shape. The conductor portion 28 provides a cavity 28h extending in the circumferential direction with respect to a central axis thereof (i.e., the axis AX). In addition, the conductor portion 28 provides a plurality of openings 28o extending between the cavity 28h and a space outside the conductor portion 28. The plurality of openings 28o can be arranged in the circumferential direction. In addition, the plurality of openings 28o can also be arranged at equal intervals.

[0143] The contact mechanism 60G includes an inflatable seal 71, a plurality of press bodies 72, one or more elastic bodies 73, and an air supply portion 74. The inflatable seal 71 is disposed in the cavity 28h. The inflatable seal 71 can have a ring shape, or can extend in the circumferential direction within the cavity 28h. The air supply portion 74 is configured to supply air to the inflatable seal 71. The inflatable seal 71 is configured to expand in the radial direction due to the air from the air supply portion 74.

[0144] The plurality of press bodies 72 are each formed of an electrically conductive material such as metal (e.g., aluminum). The plurality of press bodies 72 each include a first portion 721 and a second portion 722. The first portion 721 is disposed between the inflatable seal 71 and a wall 28w of the conductor portion 28 that defines the plurality of openings 28o. The second portion 722 extends from the first portion 721 to a corresponding one of the plurality of openings 28o. In one embodiment, a front end 723 (radial front end) of the second portion 722 can also be formed of a contact band (also referred to as a contact ring).

[0145] The one or more elastic bodies 73 are each formed of an electrically conductive material. The one or more elastic bodies 73 are disposed between the first portion 721 and the wall 28w. The one or more elastic bodies 73 can each have a ring shape, or can extend in the circumferential direction within the cavity 28h. Each of the one or more elastic bodies 73 can also be, for example, a skew wound coil spring. In addition, in the illustrated example, one of the two elastic bodies 73 is disposed above the second portion 722, and the other of the two elastic bodies 73 is disposed below the second portion 722.

[0146] As shown in (a) of FIG. 27, the second portion 722 of each of the plurality of press bodies 72 is not in contact with the inner peripheral surface of the lower end 12e of the inner wall member 16 in a state in which the inflatable seal 71 is not inflated. On the other hand, as shown in (b) of FIG. 27, the second portion 722 of each of the plurality of press bodies 72 is in contact with the inner peripheral surface of the lower end 12e of the inner wall member 16 in a state in which the inflatable seal 71 is inflated. Figure 27 Figure 27 ​As shown in (b), the expandable seal 71 expands radially, and each of the plurality of pressing bodies 72 clamps one or more elastic bodies 73 between the first part 721 and the wall 28w, so that the front end 723 of the second part 722 abuts against the inner circumferential surface of the lower end 12e.

[0147] The contact mechanism 60G moves multiple pressing bodies 72 radially, causing the front end 723 of the second part 722 to abut against the inner peripheral surface of the lower end 12e, thereby electrically connecting the inner wall component 16 to the conductor portion 28 via the multiple pressing bodies 72 and one or more elastic bodies 73. Therefore, the inner wall component 16 and the conductor portion 28 can be electrically connected without friction between the components of the contact mechanism 60G and the inner wall component 16. Thus, the contact mechanism 60G can suppress the generation of particles caused by friction. In the substrate processing apparatus 1G, the number of pressing bodies 72 and the number of openings 28o can each be one.

[0148] Below, refer to Figure 28 and Figure 29 . Figure 28 This is a diagram that schematically illustrates a substrate processing apparatus of yet another exemplary embodiment. Figure 29 This is a partially enlarged cross-sectional view of a substrate processing apparatus according to yet another exemplary embodiment. Hereinafter, [the following will describe...] Figure 28 The differences between the substrate processing apparatus 1H shown and the substrate processing apparatus 1 will be explained.

[0149] In the substrate processing apparatus 1H, the conductor portion 28 has a generally cylindrical shape. The conductor portion 28 is positioned above the bottom of the chamber 10 and is slidable in any horizontal direction. In one embodiment, the substrate processing apparatus 1H may further include a thrust bearing 77. The thrust bearing 77 is disposed between the bottom of the chamber 10 and the head of a bolt 78 screwed to the bottom. The conductor portion 28 is slidably supported above the bottom of the chamber 10 by the thrust bearing 77. In one embodiment, the conductor portion 28 has a reduced diameter portion (small diameter portion) 28s at its lower end. The reduced diameter portion 28s is disposed between the thrust bearing 77 and the head of the bolt 78. In the illustrated example, two thrust bearings 77 are disposed between the bottom of the chamber 10 and the head of the bolt 78. One of these two thrust bearings 77 is disposed between the bottom of the chamber 10 and the reduced diameter portion 28s. Another thrust bearing of the two thrust bearings 77 is positioned between the reduced diameter portion 28s and the head of the bolt 78. A washer 79 is positioned between the other thrust bearing of the two thrust bearings 77 and the head of the bolt 78.

[0150] The conductor portion 28 has a substantially cylindrical shape, and the outer peripheral surface 28t of the top portion 28u is tapered. The inner peripheral surface 16i of the lower end 16e of the side wall portion 16s of the inner wall member 16 is tapered in correspondence with the outer peripheral surface 28t. The outer peripheral surface 28t and the inner peripheral surface 16i are in direct or indirect contact with each other. Thus, the inner wall member 16 is electrically connected to the conductor portion 28. In one embodiment, a contact strip 28b is provided on the outer peripheral surface 28t. The outer peripheral surface 28t and the inner peripheral surface 16i are in indirect contact with each other via the contact strip 28b. The lower end of the conductor portion 28 can be electrically connected to the bottom of the chamber 10 via a connection member 76. The connection member 76 is a member having elasticity and electrical conductivity, and is fixed to the bottom of the chamber 10. The connection member 76 is, for example, a contact strip or an electrically conductive coil.

[0151] In the substrate processing apparatus 1H, even if the center axis of the inner wall member 16 and the center axis of the conductor portion 28 are offset, the electrical contact between the lower end 16e of the inner wall member 16 and the top portion 28u of the conductor portion 28 can be ensured uniformly in the circumferential direction by the movement of the conductor portion 28 in the horizontal direction. In addition, since the friction between the lower end 16e of the inner wall member 16 and the top portion 28u (or the contact strip 28b) of the conductor portion 28 is small, the generation of particles (dust) can be suppressed.

[0152] Hereinafter, with reference to Figure 30 . Figure 30 is a partial enlarged sectional view of a substrate processing apparatus according to still another example embodiment. Hereinafter, with respect to the structure shown in Figure 30 , the differences from the structure of the substrate processing apparatus shown in Figure 28 , 29 will be described. As shown in Figure 30 , the substrate processing apparatus can be configured such that the bolt 78 is screwed into a thrust nut 78n provided below the reduced diameter portion 28s, and the reduced diameter portion 28s is sandwiched between the head of the bolt 78 and the thrust nut 78n. Further, the substrate processing apparatus can be configured such that the thrust bearing 77 is provided in a cavity in the bottom of the chamber 10, and is disposed between an upper wall defining the cavity and the thrust nut 78n.

[0153] Hereinafter, with reference to Figure 31 . Figure 31 is a partial enlarged sectional view of a substrate processing apparatus according to still another example embodiment. In the above-described various example embodiments, as shown in Figure 31 , in order to release the fixation of the inner wall member 16 with respect to the support member 14, an expandable seal 80 can be used instead of the actuator 20.

[0154] Specifically, the inflatable seal 80 is provided in a recess provided by the lower surface 14b of the support member 14. The inflatable seal 80 is inflated downward by supplying air from an air supply 81. By the inflation of the inflatable seal 80 downward, the inner wall member 16 is moved downward, and the fixation of the inner wall member 16 with respect to the support member 14 is released.

[0155] The above describes various exemplary embodiments, but the present application is not limited to the above-described exemplary embodiments, and various omissions, substitutions, and changes can be made. In addition, elements of different embodiments can be combined to form other embodiments.

[0156] The transport assembly CTM can also be configured to be immovable and can be fixed in connection with the chamber of the substrate processing apparatus of the above-described various exemplary embodiments. In addition, instead of the transport assembly CTM, the transport assembly TM can be used as an assembly that transports the inner wall member 16 between the inside of the chamber 10 and the outside of the chamber 10.

[0157] Here, the various exemplary embodiments included in the present application are described in the following [E1] to [E31].

[0158] [E1] A substrate processing apparatus characterized by comprising:

[0159] a chamber including a side wall that provides an opening;

[0160] a substrate support provided inside the chamber;

[0161] a support member provided above the substrate support;

[0162] an inner wall member including a top portion that can be disposed above the substrate support and below the support member;

[0163] a contact member installed in one of the support member and the inner wall member, and the inner wall member is detachably fixed to the support member by applying a spring reaction force in a horizontal direction to the other of the support member and the inner wall member; and

[0164] an actuator configured to release the fixation of the inner wall member with respect to the support member by moving the inner wall member downward.

[0165] In the substrate processing apparatus of the embodiment of [E1], the contact member is deformed by the other of the support member and the inner wall member, thereby exerting a spring reaction force on the other in the horizontal direction. Thereby, the inner wall member is fixed to the support member. In addition, by overcoming the spring reaction force of the contact member, the inner wall member is moved downward by the actuator, it is possible to easily release the fixation of the inner wall member with respect to the support member. The inner wall member released from the fixation with respect to the support member can be transported from the inside of the chamber to the outside through the opening of the side wall of the chamber. Therefore, according to the embodiment of [E1], it is possible to easily maintain the inner wall member.

[0166] [E2] The substrate processing apparatus according to [E1], wherein

[0167] a lower surface of the support member provides a recess,

[0168] an upper surface of the top portion provides a recess,

[0169] the contact member includes:

[0170] a first portion embedded in the recess of the support member; and

[0171] a second portion extending downward from the first portion, having a spring exerting the spring reaction force by being embedded in the recess of the top portion.

[0172] [E3] The substrate processing apparatus according to [E2], wherein

[0173] the contact member is configured to be detachable with respect to the support member,

[0174] the first portion has elasticity, so that when the contact member is detached from the support member, the first portion can be taken out of the recess of the support member by deformation of the first portion in the horizontal direction.

[0175] [E4] The substrate processing apparatus according to [E3], wherein the recess of the support member is narrowed at an opening of the recess of the support member at a lower end.

[0176] [E5] The substrate processing apparatus according to [E1], wherein

[0177] an upper surface of the top portion provides a protrusion,

[0178] the contact member is fixed in a recess provided by a lower surface of the support member, providing a recess opening downward,

[0179] the contact member includes a spring provided in the recess of the contact member,

[0180] The spring of the contact member exerts the spring reaction force when the protrusion of the top is embedded in the recess of the contact member.

[0181] [E6] The substrate processing apparatus according to [E5], wherein the contact member further includes a floating mechanism that supports the spring.

[0182] [E7] The substrate processing apparatus according to [E5] or [E6], wherein,

[0183] The lower surface of the support member provides a female screw thread,

[0184] The outer peripheral surface of the contact member provides a male screw thread that is screwed with the female screw thread.

[0185] [E8] The substrate processing apparatus according to [E1], wherein,

[0186] The lower surface of the support member provides a recess,

[0187] The upper surface of the top provides a protrusion,

[0188] The contact member is fixed to the top in a manner that covers the protrusion, the contact member having a spring that exerts the spring reaction force when the protrusion and the contact member are embedded in the recess of the support member.

[0189] [E9] The substrate processing apparatus according to [E1], wherein,

[0190] The lower surface of the support member provides a recess,

[0191] The upper surface of the top provides a protrusion,

[0192] The contact member is a spiral spring washer that is disposed along an inner wall surface that defines the recess,

[0193] The spiral spring washer exerts the spring reaction force when the protrusion is embedded in the recess.

[0194] [E10] The substrate processing apparatus according to any one of [E1] to [E9], wherein the inner wall member is configured to be transportable by a transport arm between the inside and the outside of the chamber via the opening.

[0195] [E11] The substrate processing apparatus according to any one of [E1] to [E10], further comprising a heat transfer sheet that is sandwiched between the support member and the top.

[0196] [E12] The substrate processing apparatus according to any one of [El] to [El 1], wherein the support member and the ceiling constitute a shower head that supplies a gas into the chamber.

[0197] [E13] The substrate processing apparatus according to any one of [El] to [E12], wherein the support member provides a flow path in which a heat transfer medium flows.

[0198] [E14] The substrate processing apparatus according to any one of [El] to [E13], wherein the inner wall member further includes a side wall portion that extends downward from a peripheral portion of the ceiling, and the inner wall member and the substrate support together form a processing space in which a substrate placed on the substrate support is processed.

[0199] [E15] The substrate processing apparatus according to [E14], wherein the substrate processing apparatus is a plasma processing apparatus.

[0200] [E16] The substrate processing apparatus according to [E15], comprising:

[0201] a conductor portion that has a cylindrical shape and extends along an outer periphery of the substrate support; and

[0202] a contact mechanism that electrically connects the inner wall member and the conductor portion by electrically connecting a lower end of the side wall portion and the conductor portion.

[0203] [E17] The substrate processing apparatus according to [E16], wherein

[0204] the contact mechanism includes:

[0205] a cylindrical body that is formed of an electrically conductive material, electrically connected to the conductor portion, and extends along an outer periphery of the conductor portion;

[0206] a pressing body that is formed of an electrically conductive material and is disposed between the substrate support and the cylindrical body; and

[0207] a drive portion that rotates the cylindrical body in a circumferential direction,

[0208] the contact mechanism is configured to press the pressing body against an outer peripheral surface of the lower end of the side wall portion by the circumferential rotation of the cylindrical body, thereby electrically connecting the inner wall member and the conductor portion via the pressing body and the cylindrical body.

[0209] [E18] The substrate processing apparatus according to [E16], wherein

[0210] an upper end of the conductor portion provides a recess that extends in a circumferential direction,

[0211] the contact mechanism includes another contact member having elasticity,

[0212] the another contact member extends in a circumferential direction in the recess of the conductor portion and is electrically connected to the conductor portion,

[0213] the another contact member is configured to electrically connect the inner wall member to the conductor portion via the another contact member by elastically contacting the lower end of the side wall portion in the recess.

[0214] [E19] The substrate processing apparatus according to [E16], wherein

[0215] the contact mechanism includes:

[0216] a plurality of male connectors installed at one of the lower end of the side wall portion and the upper end of the conductor portion; and

[0217] a plurality of female connectors installed at the other of the lower end of the side wall portion and the upper end of the conductor portion,

[0218] the contact mechanism is configured to electrically connect the inner wall member to the conductor portion by combining each of the plurality of male connectors with a corresponding one of the plurality of female connectors with each other.

[0219] [E20] The substrate processing apparatus according to [E16], wherein

[0220] the contact mechanism includes another contact member provided so as to be able to abut against a lower surface provided at the lower end of the side wall portion,

[0221] the contact mechanism is configured to electrically connect the inner wall member to the conductor portion via the another contact member by pressing the another contact member against the lower surface of the side wall portion.

[0222] [E21] The substrate processing apparatus according to [E20], wherein the contact mechanism is configured to press the another contact member against the lower surface of the side wall portion by a pressure of a fluid.

[0223] [E22] The substrate processing apparatus according to [E20], wherein the contact mechanism further includes a piezoelectric element configured to press the another contact member against the lower surface of the side wall portion.

[0224] [E23] The substrate processing apparatus according to any one of [E1] to [E22], wherein the support member constitutes an upper electrode of a capacitively coupled plasma processing apparatus.

[0225] [E24] The substrate processing apparatus according to [E16], wherein

[0226] The conductor portion provides a cavity extending in a circumferential direction with respect to a central axis of the conductor portion and an opening extending between the cavity and a space outside the conductor portion,

[0227] The contact mechanism includes:

[0228] An inflatable seal provided in the cavity;

[0229] A presser formed of an electrically conductive material, including a first portion provided in the cavity between the inflatable seal and a wall of the conductor portion that defines the opening, and a second portion extending from the first portion into the opening;

[0230] An elastic body formed of an electrically conductive material provided between the first portion and the wall of the conductor portion; and

[0231] An air supply configured to supply air to the inflatable seal,

[0232] The presser is configured to, by inflating the inflatable seal with the air from the air supply, sandwich the elastic body between the first portion and the wall of the conductor portion, and abut a leading end of the second portion against an inner peripheral surface of the lower end of the side wall portion.

[0233] [E25] The substrate processing apparatus according to [E24], wherein the leading end of the second portion is formed by a contact band.

[0234] [E26] The substrate processing apparatus according to [E24] or [E25], wherein the elastic body is a wrap spring.

[0235] [E27] The substrate processing apparatus according to [E15], further comprising a grounded conductor portion having a cylindrical shape extending along an outer periphery of the substrate support, the conductor portion being provided above a bottom of the chamber so as to be slidable in a horizontal direction,

[0236] An outer peripheral surface of a top portion of the conductor portion is a tapered surface,

[0237] An inner peripheral surface of a lower end of the side wall portion is a tapered surface corresponding to the outer peripheral surface of the top portion of the conductor portion,

[0238] The outer peripheral surface of the top portion of the conductor portion directly or indirectly contacts the inner peripheral surface of the lower end of the side wall portion.

[0239] [E28] The substrate processing apparatus according to [E27], further comprising: a contact tape provided on the outer peripheral surface of the top portion of the conductor portion.

[0240] [E29] The substrate processing apparatus according to [E27] or [E28], wherein,

[0241] a thrust bearing configured between the bottom portion of the chamber and a head portion of a bolt screwed to the bottom portion,

[0242] the conductor portion is slidably supported by the thrust bearing above the bottom portion of the chamber.

[0243] [E30] A maintenance method of a substrate processing apparatus, comprising:

[0244] a process of transporting an inner wall member from an outside of a chamber of a substrate processing apparatus to an inside of the chamber through an opening provided in a side wall of the chamber using a transport arm,

[0245] wherein the substrate processing apparatus includes the chamber, a substrate support provided in the chamber, and a support member provided above the substrate support, the inner wall member includes a top portion configured above the substrate support and below the support member, and

[0246] a process of detachably fixing the inner wall member to the support member by moving one of the support member and the inner wall member in a vertical direction,

[0247] in the process of fixing, the inner wall member is fixed to the support member by a contact member installed in one of the support member and the inner wall member applying a spring reaction force in a horizontal direction to the other of the support member and the inner wall member.

[0248] [E31] A maintenance method of a substrate processing apparatus, comprising:

[0249] a process of making a transport arm enter an inside of a chamber of a substrate processing apparatus from an outside of the chamber through an opening provided in a side wall of the chamber,

[0250] wherein the substrate processing apparatus includes the chamber, a substrate support provided in the chamber, a support member provided above the substrate support, an inner wall member including a top portion configured above the substrate support and below the support member, and a contact member installed in one of the support member and the inner wall member,

[0251] The contact member is configured to detachably fix the inner wall member to the support member by applying a horizontal spring reaction force to the other of the support member and the inner wall member;

[0252] a process of releasing the fixing of the contact member to the inner wall member by moving the inner wall member downward by the actuator, and handing over the inner wall member to the transport arm; and

[0253] a process of transporting the inner wall member from the inside of the chamber to the outside of the chamber through the opening.

[0254] According to the above description, various embodiments of the present application have been described in the present specification for the purpose of illustration, and it should be understood that various changes can be made within the scope and spirit of the present application. Therefore, the various embodiments described in the present specification are not intended to be limiting, and the true scope and spirit are shown by the summary section of the specification and the sections of E1-E31 (claims).

Claims

1. A substrate processing apparatus, characterized in that, include: Includes a chamber with sidewalls providing openings; A substrate support is disposed within the cavity; A support component disposed above the substrate support; An inner wall component, including a top disposed above the substrate support and below the support component; A contact component, which is installed in one of the support component and the inner wall component, detachably fixes the inner wall component to the support component by applying a horizontal spring reaction force to the other of the support component and the inner wall component; and An actuator configured to release the inner wall component from the support component by moving the inner wall component downward.

2. The substrate processing apparatus as described in claim 1, characterized in that: The lower surface of the support member is provided with a recess. The upper surface of the top is provided with a recess. The contact component includes: The first portion embedded in the recess of the support member; and The second part, which extends downward from the first part, has a spring that applies the spring reaction force by being embedded in the recess at the top.

3. The substrate processing apparatus as described in claim 2, characterized in that: The contact component is configured to be detachable relative to the support component. The first part is elastic, so that when the contact member is removed from the support member, the first part can be removed from the recess of the support member by deformation of the first part in the horizontal direction.

4. The substrate processing apparatus as described in claim 3, characterized in that: The recess of the support member narrows at the lower end opening of the recess of the support member.

5. The substrate processing apparatus as described in claim 1, characterized in that: The upper surface of the top is provided with a protrusion. The contact member is fixed within a recess provided by the lower surface of the support member, the recess having a downward opening. The contact component includes a spring disposed in the recess of the contact component. The spring of the contact member applies the spring reaction force by embedding the protrusion of the top into the recess of the contact member.

6. The substrate processing apparatus as described in claim 5, characterized in that: The contact component also includes a floating mechanism that supports the spring.

7. The substrate processing apparatus as described in claim 5, characterized in that: The lower surface of the support member is provided with female threads. The outer peripheral surface of the contact component is provided with a male thread that engages with the female thread.

8. The substrate processing apparatus as described in claim 1, characterized in that: The lower surface of the support member is provided with a recess. The upper surface of the top is provided with a protrusion. The contact member is fixed to the top in a manner that covers the protrusion, and the contact member has a spring that applies the spring reaction force when the protrusion and the contact member are embedded in the recess of the support member.

9. The substrate processing apparatus as described in claim 1, characterized in that: The lower surface of the support member is provided with a recess. The upper surface of the top is provided with a protrusion. The contact component is a helical spring washer disposed along the inner wall surface defining the recess. The helical spring washer applies the spring reaction force when the convex portion is embedded in the concave portion.

10. The substrate processing apparatus according to any one of claims 1 to 9, characterized in that: The inner wall component is configured to be transported between the inside and outside of the chamber by a conveying arm through the opening.

11. The substrate processing apparatus according to any one of claims 1 to 9, characterized in that, Also includes: A heat transfer plate held between the support member and the top.

12. The substrate processing apparatus according to any one of claims 1 to 9, characterized in that: The support component and the top constitute a spray head that can supply gas into the chamber.

13. The substrate processing apparatus according to any one of claims 1 to 9, characterized in that: The support component provides a flow path for the heat transfer medium to flow therethrough.

14. The substrate processing apparatus according to any one of claims 1 to 9, characterized in that: The inner wall component also includes a side wall portion extending downward from the periphery of the top, forming, together with the substrate support, a processing space in which a substrate placed on the substrate support can be processed.

15. The substrate processing apparatus as described in claim 14, characterized in that: The substrate processing device is a plasma processing device.

16. The substrate processing apparatus as claimed in claim 15, characterized in that, Also includes: A grounded conductor portion, having a cylindrical shape, extends along the outer periphery of the substrate support; and A contact mechanism that electrically connects the inner wall component to the conductor by electrically connecting the lower end of the side wall portion to the conductor portion.

17. The substrate processing apparatus as claimed in claim 16, characterized in that: The contact mechanism includes: A cylindrical body, formed of a conductive material, electrically connected to the conductor portion, extending along the outer periphery of the conductor portion; A pressing body, formed of a conductive material, is disposed between the substrate support and the cylindrical body; and The drive unit enables the cylindrical body to rotate circumferentially. The contact mechanism is configured such that when the cylindrical body rotates circumferentially, the pressing body presses the pressing body against the outer peripheral surface of the lower end of the side wall portion, thereby electrically connecting the inner wall component to the conductor portion via the pressing body and the cylindrical body.

18. The substrate processing apparatus as claimed in claim 16, characterized in that: The upper end of the conductor portion is provided with a circumferentially extending recess. The contact mechanism includes another contact component that is elastic. The other contact member extends circumferentially within the recess of the conductor portion and is electrically connected to the conductor portion. The other contact member is configured to elastically contact the lower end of the sidewall portion in the recess, thereby electrically connecting the inner wall portion to the conductor portion via the other contact member.

19. The substrate processing apparatus as claimed in claim 16, characterized in that: The contact mechanism includes: Multiple male connectors installed on one of the lower end of the sidewall portion and the upper end of the conductor portion; and Multiple female connectors are installed on one of the lower ends of the sidewall portion and the upper ends of the conductor portion. The contact mechanism is configured to electrically connect the inner wall component to the conductor portion by engaging each of the male connectors of the plurality of male connectors with a corresponding female connector of the plurality of female connectors.

20. The substrate processing apparatus as claimed in claim 16, characterized in that: The contact mechanism includes another contact member configured to abut against the lower surface provided at the lower end of the sidewall portion. The contact mechanism is configured such that by pressing the other contact member against the lower surface of the side wall portion, the inner wall portion is electrically connected to the conductor portion via the other contact member.

21. The substrate processing apparatus as described in claim 20, characterized in that: The contact mechanism is configured to press the other contact component against the lower surface of the sidewall portion using the pressure of the fluid.

22. The substrate processing apparatus as described in claim 20, characterized in that: The contact mechanism further includes a piezoelectric element configured to press the other contact member against the lower surface of the sidewall portion.

23. The substrate processing apparatus according to any one of claims 1 to 9, characterized in that: The support component constitutes the upper electrode of the capacitively coupled plasma processing device.

24. The substrate processing apparatus as claimed in claim 16, characterized in that: The conductor portion includes: a cavity extending circumferentially relative to the central axis of the conductor portion and an opening extending between the cavity and the space outside the conductor portion. The contact mechanism includes: An expandable seal is disposed in the cavity; A press body formed of a conductive material includes: a first portion disposed in the cavity between the expandable seal and the wall of the conductor portion defining the opening, and a second portion extending from the first portion into the opening; An elastomer formed of a conductive material is disposed between the wall of the first portion and the conductor portion; and An air supply unit configured to supply air to the expandable seal. The pressing body is configured such that the expandable seal is expanded by the air from the air supply unit, the elastomer is clamped between the first part and the wall of the conductor part, and the front end of the second part abuts against the inner circumferential surface of the lower end of the side wall part.

25. The substrate processing apparatus as described in claim 24, characterized in that: The front end of the second part is formed by a contact strip.

26. The substrate processing apparatus as described in claim 24, characterized in that: The elastic body is a helical spring with oblique winding.

27. The substrate processing apparatus as described in claim 15, characterized in that: It also includes a grounded conductor portion having a cylindrical shape, extending along the outer periphery of the substrate support, the conductor portion being configured above the bottom of the chamber to slide in the horizontal direction. The outer peripheral surface of the top of the conductor portion is a conical surface. The inner circumferential surface at the lower end of the sidewall portion is a tapered surface corresponding to the outer circumferential surface at the top of the conductor portion. The outer peripheral surface of the top of the conductor portion is in direct or indirect contact with the inner peripheral surface of the lower end of the sidewall portion.

28. The substrate processing apparatus as claimed in claim 27, characterized in that, Also includes: A contact strip is disposed on the outer peripheral surface of the top of the conductor portion.

29. The substrate processing apparatus as claimed in claim 27, characterized in that: It also includes a thrust bearing disposed between the bottom of the chamber and the head of a bolt screwed to the bottom. The conductor portion is slidably supported by a thrust bearing above the bottom of the chamber.

30. A method for maintaining a substrate processing apparatus, characterized in that, include: The process of using a conveyor arm to transport inner wall components from the outside of the substrate processing apparatus chamber through an opening in the side wall of the chamber into the interior of the chamber. The substrate processing apparatus includes the chamber, a substrate support disposed in the chamber, and a support member disposed above the substrate support. The inner wall member includes a top disposed above the substrate support and below the support member. and The fixing process involves detachably fixing the inner wall component to the support component by moving one of the support component and the inner wall component in a vertical direction. In the fixing process, the inner wall component is fixed to the support component by applying a horizontal spring reaction force to the other of the support component and the inner wall component through a contact component installed on one of the support component and the inner wall component.

31. A method for maintaining a substrate processing apparatus, characterized in that, include: The process of moving a conveyor arm from outside the chamber of the substrate processing apparatus into the interior of the chamber through an opening in the side wall of the chamber. The substrate processing apparatus includes: a chamber, a substrate support disposed within the chamber, a support member disposed above the substrate support, an inner wall member including a top portion positioned above the substrate support and below the support member, and a contact member installed on one of the support member and the inner wall member. The contact member is configured to detachably fix the inner wall member to the support member by applying a horizontal spring reaction force to the other of the support member and the inner wall member. The process of releasing the contact member from the inner wall component by moving the inner wall component downward using an actuator, and handing the inner wall component over to the conveyor arm; and The process of conveying the inner wall component from the inside of the chamber through the opening to the outside of the chamber.

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