Receptacle connector

Abstract

A socket connector includes a housing made of insulating resin and having a peripheral wall projecting upward from an edge of a bottom plate, a plurality of contact pieces held by the bottom plate, an upper cover member disposed above a semiconductor package received in the housing, pressing the semiconductor package downward, thereby making the semiconductor package electrically contact with the plurality of contact pieces, and a protrusion and a protrusion projecting upward beyond the peripheral wall. The upper cover member has clearance holes into which the protrusion and the protrusion are inserted at positions facing the protrusion and the protrusion in a vertical direction.

Description

Technical Field

[0001] This invention relates to a socket connector. Background Technology

[0002] As in the present invention Figure 16 As shown, Patent Document 1 (Japanese Patent Application Publication No. 2011-165512) discloses a socket connector 100 for mounting an LGA (Land Grid Array) type semiconductor module onto a circuit board. The socket connector 100 includes: a housing 102 made of insulating resin, in which a recess 101 for receiving the semiconductor module is formed; and a plurality of contacts 104 integrated into the bottom portion 103 of the recess 101. When viewed from above, the housing 102 has a rectangular shape and four module guide posts 105 are formed at its four corners. The four module guide posts 105 function to temporarily hold the semiconductor module and to position the semiconductor module relative to the socket connector 100. According to paragraph

[0039] of Patent Document 1, a cover for pressing the module is attached to the upper part of the socket connector 100 so that the semiconductor module is pressed into the recess 101 of the socket connector 100, thereby electrically connecting the semiconductor module to the plurality of contacts 104. Summary of the Invention

[0003] However, in terms of reducing height, the structure of Patent Document 1 has room for improvement.

[0004] One object of the present invention is to provide a technique for reducing the height of a socket connector even if the socket connector has a protrusion that extends upward beyond the peripheral wall, wherein the socket connector is of the type that presses the object to be connected against a cover.

[0005] According to one aspect of the present invention, a socket connector is provided, the socket connector comprising: a housing made of insulating resin having a peripheral wall and a base plate, the peripheral wall projecting upward from an edge of the base plate; a plurality of contacts held by the base plate; a cover disposed above an object to be connected housed in the housing and configured to press downward against the object to be connected and to make the object to be connected electrically contact the plurality of contacts; and a protrusion projecting upward beyond the peripheral wall, wherein the cover has a hole or notch in a vertical direction opposite to the protrusion into which the protrusion is inserted.

[0006] According to the present invention, even if the socket connector has a protrusion that extends upward beyond the peripheral wall, it is still possible to reduce the height of the socket connector, wherein the type of socket connector presses the object to be connected by a cover.

[0007] The above and other objects, features and advantages of the present invention will be more fully understood from the following detailed description and the accompanying drawings, which are for illustrative purposes only and are not intended to limit the scope of the invention. Attached Figure Description

[0008] Figure 1 This is a perspective view of the information processing device (first embodiment);

[0009] Figure 2 This is an exploded perspective view of an information processing device (first embodiment);

[0010] Figure 3 This is an exploded perspective view of the information processing device from another angle (first embodiment);

[0011] Figure 4 This is a perspective view of the connector body (first embodiment);

[0012] Figure 5 This is a perspective view of the connector body from another angle (first embodiment);

[0013] Figure 6 Is it like this? Figure 5 An enlarged view of part A shown (first embodiment);

[0014] Figure 7 It is along Figure 6 Cross-sectional view of arrow VII-VII (first embodiment);

[0015] Figure 8 This is a perspective view of the contact element (first embodiment);

[0016] Figure 9 It is along Figure 6 Cross-sectional view of arrow IX-IX (first embodiment);

[0017] Figure 10 This is a perspective view of the connector body housing the semiconductor package (first embodiment);

[0018] Figure 11 It is along Figure 10 A cross-sectional oblique view of arrow XI-XI (first embodiment);

[0019] Figure 12 It is along Figure 10 Cross-sectional view of arrow XI-XI (first embodiment);

[0020] Figure 13 It is a cross-sectional view showing the state in which the semiconductor package is pressed down by the cover (first embodiment);

[0021] Figure 14 This is a top view of the socket connector (first embodiment);

[0022] Figure 15 This is a top view of the socket connector (second embodiment); and

[0023] Figure 16 It is patent document 1 Figure 1 A schematic diagram of A. Detailed Implementation

[0024] [First Embodiment]

[0025] The following is for reference Figures 1 to 14 The embodiments of the present invention are described below. Figure 1 This is a perspective view of information processing device 1. Figure 2 and Figure 3 This is an exploded perspective view of information processing device 1. For example... Figures 1 to 3 As shown, the information processing device 1 includes: a semiconductor package 2 (the object to be connected), a socket connector 3, and a substrate 4. The socket connector 3 mechanically and electrically connects the semiconductor package 2 to the substrate 4.

[0026] like Figure 2 and Figure 3 As shown, the socket connector 3 includes: connector body 5, upper cover 6 (cover), and lower cover 7.

[0027] The upper cover 6 and the lower cover 7 are coupled to each other using bolts (not shown) to clamp the semiconductor package 2, the connector body 5, and the substrate 4.

[0028] When viewed from above, the connector body 5 has a rectangular flat plate shape.

[0029] The thickness direction of the connector body 5 is defined as the vertical direction. The vertical direction includes the upward direction and the downward direction. The upward direction is the direction from which the connector body 5 is viewed from the substrate 4. The downward direction is the direction from which the connector body 5 is viewed from the substrate 4. The upper cover 6, the semiconductor package 2, the connector body 5, the substrate 4, and the lower cover 7 are arranged sequentially in the downward direction.

[0030] Furthermore, when viewed from above, the connector body 5 has a rectangular shape, and the direction parallel to the long side of the connector body 5 is defined as the longitudinal direction, and the direction parallel to the short side of the connector body 5 is defined as the transverse direction. However, if the connector body 5 has a square shape when viewed from above, for convenience, the direction parallel to any side of the connector body 5 can be defined as the longitudinal direction, and for convenience, the direction parallel to the side adjacent to that side can be defined as the transverse direction.

[0031] The longitudinal direction includes: the inner longitudinal direction and the outer longitudinal direction. The inner longitudinal direction is the direction closer to the center of the connector body 5 in the longitudinal direction. The outer longitudinal direction is the direction farther away from the center of the connector body 5 in the longitudinal direction.

[0032] Similarly, the lateral direction includes: the inner side and the outer side. The inner side is the direction in the lateral direction closer to the center of the connector body 5. The outer side is the direction in the lateral direction farther from the center of the connector body 5.

[0033] It should be noted that the vertical direction, longitudinal direction, and transverse direction defined above are only defined for the purpose of simplifying the description and should not be interpreted as limiting the actual orientation of the information processing device 1 and the socket connector 3.

[0034] [Semiconductor Packaging 2]

[0035] Semiconductor package 2 is typically an LGA (Land Grid Array) type. Alternatively, semiconductor package 2 can also be a BGA (Ball Grid Array) type. Figure 2 and Figure 3 As shown, when viewed from above, the semiconductor package 2 has a rectangular flat plate shape. The semiconductor package 2 includes an upper surface 2A and a lower surface 2B. As... Figure 3 As shown, a plurality of pads 2C are formed on the lower surface 2B of the semiconductor package 2. The semiconductor package 2 is a specific example of an object to be connected. The object to be connected is not limited to a semiconductor package and can also be other electronic components.

[0036] [Substrate 4]

[0037] Refer back Figure 2 The substrate 4 is a rigid substrate, for example, such as a paper phenolic board or a glass epoxy board. Alternatively, the substrate 4 can also be a flexible substrate. The substrate 4 includes an upper surface 4A and a lower surface 4B. The connector body 5 of the socket connector 3 is typically mounted on the upper surface 4A by reflow soldering. A plurality of pads 4C are formed on the upper surface 4A. The substrate 4 has: two longitudinal through holes 4D, separated from each other in the longitudinal direction, thereby housing the plurality of pads 4C in the longitudinal direction; and two transverse through holes 4E, separated from each other in the transverse direction, thereby housing the plurality of pads 4C in the transverse direction.

[0038] [Connector Socket Connector 3]

[0039] like Figure 2 and Figure 3As shown, the socket connector 3 consists of the connector body 5, the upper cover 6, and the lower cover 7 as described above.

[0040] Figure 4 and Figure 5 This is a perspective view of connector body 5. (Example) Figure 4 and Figure 5 As shown, the connector body 5 includes a housing 8 and a plurality of contacts 9 held by the housing 8. It should be noted that... Figure 4 and Figure 5 In the text, the revelation of certain multiple contact elements 9 is omitted.

[0041] like Figure 4 As shown, the housing 8 is made of insulating resin. The housing 8 includes a base plate 10 and a peripheral wall 11 surrounding the base plate 10.

[0042] When viewed from above, the base plate 10 is a rectangular flat plate, and the base plate 10 includes an upper surface 10A and a lower surface 10B. A plurality of contact member receiving portions 12 are formed on the base plate 10. The plurality of contact member receiving portions 12 respectively receive a plurality of contact members 9.

[0043] The peripheral wall 11 protrudes upward from the edge of the base plate 10. The peripheral wall 11 includes two transverse sidewalls 13 and two longitudinal sidewalls 14.

[0044] The two transverse sidewalls 13 are portions of the peripheral wall 11 that extend in the transverse direction. The two transverse sidewalls 13 include a movable transverse sidewall 15 (first sidewall) and a fixed transverse sidewall 16 (second sidewall). The movable transverse sidewall 15 and the fixed transverse sidewall 16 face each other in the longitudinal direction, and the base plate 10 is embedded between them.

[0045] The two longitudinal sidewalls 14 are portions of the peripheral wall 11 extending in the longitudinal direction. The two longitudinal sidewalls 14 include a movable longitudinal sidewall 17 (first sidewall) and a fixed longitudinal sidewall 18 (second sidewall). The movable longitudinal sidewall 17 and the fixed longitudinal sidewall 18 face each other in the transverse direction, and the base plate 10 is embedded between them.

[0046] Therefore, when viewed from above, the fixed side transverse sidewall 16 and the fixed side longitudinal sidewall 18 are continuously connected to form an L-shape. Similarly, when viewed from above, the movable side transverse sidewall 15 and the movable side longitudinal sidewall 17 are continuously connected to form an L-shape.

[0047] The fixed-side transverse sidewall 16 is a flat plate whose thickness direction is parallel to the longitudinal direction. The upper surface 16A of the fixed-side transverse sidewall 16 has an inclined surface 16B at its inner edge in the longitudinal direction, the inclined surface 16B sloping downwards towards the inner edge in the longitudinal direction. A notch 16C is formed at the center of the fixed-side transverse sidewall 16 in the transverse direction. The notch 16C may be omitted. The fixed-side transverse sidewall 16 includes an inner surface 16D facing inwards in the longitudinal direction.

[0048] The fixed-side longitudinal sidewall 18 is a flat plate whose thickness direction is parallel to the transverse direction. The upper surface 18A of the fixed-side longitudinal sidewall 18 has an inclined surface 18B at its inner edge in the transverse direction, the inclined surface 18B sloping downwards towards the inner side in the transverse direction. A notch 18C is formed at the center of the fixed-side longitudinal sidewall 18 in the longitudinal direction. The notch 18C may be omitted. The fixed-side longitudinal sidewall 18 includes an inner surface 18D facing inwards in the transverse direction.

[0049] Next refer to Figure 5 The movable side transverse sidewall 15 is a flat plate whose thickness direction is parallel to the longitudinal direction. The upper surface 15A of the movable side transverse sidewall 15 has an inclined surface 15B at its inner edge in the longitudinal direction, the inclined surface 15B sloping downwards towards the inner edge in the longitudinal direction. A notch 15C is formed at the center of the movable side transverse sidewall 15 in the transverse direction. The inclined surface 15B and the notch 15C may be omitted.

[0050] The movable longitudinal sidewall 17 is a flat plate whose thickness direction is parallel to the transverse direction. The upper surface 17A of the movable longitudinal sidewall 17 has an inclined surface 17B at its inner edge in the transverse direction, the inclined surface 17B sloping downwards towards the inner side in the transverse direction. A notch 17C is formed at the center of the movable longitudinal sidewall 17 in the longitudinal direction. The inclined surface 17B and the notch 17C may be omitted.

[0051] like Figure 4 The upper surface 16A of the fixed side transverse sidewall 16 and the upper surface 18A of the fixed side longitudinal sidewall 18 are shown as follows: Figure 5 The upper surface 15A of the movable transverse sidewall 15 and the upper surface 17A of the movable longitudinal sidewall 17 shown have the same height.

[0052] Similarly, refer to Figure 5The movable side transverse sidewall 15 includes two elastic plates 20. The two elastic plates 20 are configured to be separated from each other in the transverse direction. Each elastic plate 20 is a double fixed beam capable of elastic deformation in the longitudinal direction. Accordingly, the movable side transverse sidewall 15 can elastically deform in the longitudinal direction. Each elastic plate 20 is formed by cutting and thinning a slit located between the base plate 10 and the movable side transverse sidewall 15 and extending in the transverse direction. Each elastic plate 20 is made of insulating resin and integrally molded with the housing 8. Each elastic plate 20 may be a cantilever beam, rather than a double fixed beam.

[0053] Similarly, the movable longitudinal sidewall 17 includes two elastic plates 21. The two elastic plates 21 are configured to be separated from each other in the longitudinal direction. Each elastic plate 21 is a double-fixed beam capable of elastic deformation in the transverse direction. Accordingly, the movable longitudinal sidewall 17 can elastically deform in the transverse direction. Each elastic plate 21 is formed by cutting and thinning a slit located between the base plate 10 and the movable longitudinal sidewall 17 and extending in the longitudinal direction. Each elastic plate 21 is made of insulating resin and integrally molded with the housing 8. Each elastic plate 21 may be a cantilever beam, rather than a double-fixed beam.

[0054] A protrusion 22 (protrusion) is formed at the center of each elastic sheet 20 in the transverse direction. Each protrusion 22 is formed to protrude upward from each elastic sheet 20 and toward the inner side in the longitudinal direction. Each protrusion 22 is made of insulating resin and is integrally molded with each elastic sheet 20. Alternatively, each protrusion 22 may be made of metal. In this case, each protrusion 22 is attached to the corresponding elastic sheet 20 by insert molding or press fitting.

[0055] Similarly, protrusions 23 (protrusions) are formed at the center of each elastic sheet 21 in the longitudinal direction. Each protrusion 23 is formed to protrude upward from each elastic sheet 21 and toward the inner side in the transverse direction. Each protrusion 23 is made of insulating resin and is integrally molded with each elastic sheet 21. Alternatively, each protrusion 23 may be made of metal. In this case, each protrusion 23 is attached to the corresponding elastic sheet 21 by insert molding or press fitting.

[0056] The following is for reference Figures 5 to 7 The description of each protrusion 22 and each protrusion 23 is provided. However, it should be noted that since the two protrusions 23 have the same shape, only one of the protrusions 23, namely the protrusion 23 near the movable side transverse sidewall 15, is described, and the description of the other protrusion 23 is omitted.

[0057] Furthermore, each protrusion 22 protrudes from the corresponding elastic sheet 20 toward the inner side in the longitudinal direction, and each protrusion 23 protrudes from the corresponding elastic sheet 21 toward the inner side in the transverse direction. Therefore, since each protrusion 22 differs from each protrusion 23 only in its protrusion direction and has the same shape as each protrusion 23, the description of each protrusion 22 is omitted.

[0058] like Figure 6 As shown, protrusion 23 protrudes upward beyond the peripheral wall 11. Protrusion 23 protrudes upward beyond the upper surface of the peripheral wall 11. Protrusion 23 protrudes upward beyond the movable longitudinal sidewall 17. Protrusion 23 protrudes upward beyond the upper surface 17A of the movable longitudinal sidewall 17. Protrusion 23 protrudes upward beyond the elastic sheet 21.

[0059] like Figure 7 As shown, the protrusion 23 includes a positioning pressing part 30 and a receiving guide part 31 disposed above the positioning pressing part 30.

[0060] The positioning pressing part 30 includes a pressing surface 30A facing inward in the lateral direction. The pressing surface 30A is a surface perpendicular to the lateral direction. The pressing surface 30A is completely located below the upper surface 17A of the movable longitudinal sidewall 17.

[0061] The receiving guide portion 31 protrudes upward from the positioning press portion 30. The receiving guide portion 31 protrudes upward beyond the peripheral wall 11. The receiving guide portion 31 protrudes upward beyond the upper surface of the peripheral wall 11. The receiving guide portion 31 protrudes upward beyond the movable longitudinal sidewall 17. The receiving guide portion 31 protrudes upward beyond the upper surface 17A of the movable longitudinal sidewall 17. The receiving guide portion 31 protrudes upward from the positioning press portion 30 located below the upper surface 17A of the movable longitudinal sidewall 17, and protrudes upward beyond the upper surface 17A of the movable longitudinal sidewall 17. The receiving guide portion 31 includes an inclined guide surface 31A, which is inclined downward toward the lateral direction inward. The lower end of the inclined guide surface 31A and the lower end of the inclined surface 18B are located at the same position in the vertical direction. The distance from the lower end to the upper end of the inclined guide surface 31A in the vertical direction is defined as distance 31B. The receiving guide portion 31 has an upper end 31C. The inclined guide surface 31A extends obliquely from below the upper surface 17A of the movable longitudinal sidewall 17 to above the upper surface 17A of the movable longitudinal sidewall 17.

[0062] Refer back Figure 4 The plurality of contacts 9 are made of metal, and, for example, are formed by stamping and bending a copper-plated metal sheet or copper alloy. The plurality of contacts 9 include: a plurality of longitudinal contacts 40 and a plurality of transverse contacts 41.

[0063] Each longitudinal contact 40 and each lateral contact 41 has the same shape. When viewed from above, each longitudinal contact 40 and each lateral contact 41 has a different orientation. Specifically, each longitudinal contact 40 is configured to extend in the longitudinal direction. Each lateral contact 41 is configured to extend in the lateral direction. Only two of the plurality of contacts 9 are lateral contacts 41, and the other contacts 9 are longitudinal contacts 40.

[0064] Figure 8 These are oblique views of each contact element 9. Figure 9 It is along Figure 6 The cross-sectional view of arrow IX-IX in the diagram.

[0065] like Figure 8 and Figure 9 As shown, each contact 9 includes: a contact fixing portion 42, fixed to the base plate 10; a contact contact portion 43, protruding upward beyond the upper surface 10A of the base plate 10, thereby contacting the semiconductor package 2; a contact connecting portion 44, which is elastically deformable and connects the contact fixing portion 42 and the contact contact portion 43 in a manner that allows the contact contact portion 43 to be displaced in the vertical direction; and a welding portion 45, welded to the substrate 4. The welding portion 45, the contact fixing portion 42, the contact connecting portion 44, and the contact contact portion 43 are sequentially connected.

[0066] Figure 9 This reveals the state in which the contact 9 is housed in the corresponding contact housing 12 of the base plate 10. For example... Figure 9 As shown, the contact fixing part 42 is press-fitted onto the inner surface of the corresponding contact receiving part 12, thereby fixing it to the base plate 10.

[0067] The contact portion 43 has a downwardly open U-shape and protrudes upward beyond the upper surface 10A of the base plate 10 when no load is applied to the contact connection portion 44. The upward protrusion height of the contact portion 43 from the upper surface 10A of the base plate 10 when no load is applied to the contact connection portion 44 is defined as the protrusion height 43H.

[0068] When viewed from the side, the contact member connection 44 has a U-shape that is open in the longitudinal or transverse direction.

[0069] When viewed from the side, the contact member connection portion 44 of each longitudinal contact member 40 has a U-shape that is open in the longitudinal direction. Specifically, the contact member connection portion 44 of each longitudinal contact member 40 has, as shown in the figure... Figure 5 The U-shape shown opens towards the fixed-side transverse sidewall 16. Therefore, as... Figure 9 As shown by the double-point chain line, the contact portion 43 of each longitudinal contact member 40 approaches the fixed side transverse sidewall 16 while moving downward.

[0070] On the other hand, when viewed from the side, the contact member connection portion 44 of each lateral contact member 41 has a U-shape that is open in the lateral direction. Specifically, the contact member connection portion 44 of each lateral contact member 41 has, as shown in the figure... Figure 4 The U-shape shown opens toward the fixed longitudinal sidewall 18. Therefore, the contact portion 43 of each lateral contact 41 approaches the fixed longitudinal sidewall 18 while displacing downward.

[0071] Refer back Figure 7 The distance from the upper end of the contact portion 43 in the vertical direction to the upper end of the pressing surface 30A is defined as distance 30B.

[0072] The distance 30B is a crucial dimension for clamping the semiconductor package 2 between the positioning press portion 30 and the fixed longitudinal sidewall 18 in the lateral direction, thereby positioning and temporarily holding the semiconductor package 2. If the distance 30B is too short, the semiconductor package 2 cannot be reliably clamped between the positioning press portion 30 and the fixed longitudinal sidewall 18, resulting in the inability to reliably perform the positioning and temporary holding functions described above. Therefore, a longer distance 30B is preferred.

[0073] The distance 31B is an important dimension for allowing the semiconductor package 2 to enter the inner side of the peripheral wall 11. If the distance 31B is too short, the guiding effect of the receiving guide 31 is reduced, thereby reducing the workability of clamping the semiconductor package 2 between the positioning pressing part 30 and the fixed longitudinal sidewall 18. Therefore, a longer distance 31B is preferred.

[0074] The protrusion height 43H is a crucial dimension for maximizing the wiping effect between the contact portion 43 of the contact element and the pad 2C of the semiconductor package 2. If the protrusion height 43H is too small, the wiping effect is reduced, leading to decreased contact stability between the pad 2C of the semiconductor package 2 and the contact element 9. Furthermore, if the protrusion height 43H is too small, the change in contact force between the contact portion 43 and the pad 2C will increase corresponding to changes in the size of the contact element 9 as a component, also resulting in decreased contact stability. Therefore, a larger protrusion height 43H is generally preferred.

[0075] The following is for reference Figure 2 and Figure 3 This describes the upper cover 6 and the lower cover 7.

[0076] The top cover 6 is disposed above the semiconductor package 2 housed in the housing 8 and presses down on the semiconductor package 2, thereby making the semiconductor package 2 electrically contacted with a plurality of contacts 9. The top cover 6 is a specific example of a cover.

[0077] The lower cover 7 is located below the base plate 4 and is coupled to the upper cover 6 by bolts.

[0078] Therefore, in this embodiment, the upper cover 6 and the lower cover 7 are coupled to each other, and the semiconductor package 2, the connector body 5, and the substrate 4 are built between the upper cover 6 and the lower cover 7, so that the upper cover 6 presses down on the semiconductor package 2. Alternatively, when the substrate 4 has sufficient rigidity, the lower cover 7 can be omitted, and the upper cover 6 can be locked to the substrate 4.

[0079] The cover 6 is made of metal, and, for example, is formed by stamping and bending a piece of stainless steel. The cover 6 includes a cover body 50 and two feet 51.

[0080] The cover body 50 includes: an encapsulation contact portion 50A and an opposing peripheral wall portion 50B.

[0081] The packaging contact portion 50A faces the upper surface 2A of the semiconductor package 2 in the vertical direction, and contacts the upper surface 2A of the semiconductor package 2 when the semiconductor package 2 is engaged with the socket connector 3.

[0082] The opposing peripheral wall portion 50B faces the peripheral wall 11 of the housing 8 in the vertical direction and surrounds the encapsulation contact portion 50A in an annular shape.

[0083] The encapsulation contact portion 50A is recessed downwards beyond the opposing peripheral wall portion 50B.

[0084] Furthermore, the opposing peripheral wall portion 50B has a clearance hole 50C (hole) in the vertical direction facing the four receiving guide portions 31, into which each receiving guide portion 31 can be inserted. Each clearance hole 50C is formed to penetrate the opposing peripheral wall portion 50B in the vertical direction.

[0085] Each of the two feet 51 protrudes outward from the cover body 50 in the lateral direction. A bolt locking hole 51A is formed at the center of each foot 51 in the longitudinal direction. The bolt locking hole 51A has an inner edge 51B (substrate fixing portion). Each bolt locking hole 51A corresponds to a lateral through hole 4E in the substrate 4.

[0086] The lower cover 7 is made of metal, and, for example, is formed by stamping and bending a piece of stainless steel sheet.

[0087] The lower cover 7 has four bolt locking holes 7A. The four bolt locking holes 7A correspond to the two longitudinal through holes 4D and the two transverse through holes 4E of the substrate 4, respectively.

[0088] The following describes the use of socket connector 3.

[0089] [Installation Steps]

[0090] First, in order to mount the connector body 5 onto the upper surface 4A of the substrate 4, an appropriate amount of solder paste is applied to the surface as follows: Figure 2 The plurality of pads 4C of the substrate 4 shown are then used to mount the connector body 5 onto the upper surface 4A of the substrate 4 by reflow soldering.

[0091] [Matching Steps]

[0092] Next, in order to fit the semiconductor package 2 and the connector body 5, the semiconductor package 2 is housed in, as shown in... Figure 10 The connector body 5 shown is located within its peripheral wall 11. Specifically, with the semiconductor package 2 pressed against the inner surface 16D of the fixed-side transverse sidewall 16 and the inner surface 18D of the fixed-side longitudinal sidewall 18, the semiconductor package 2 is pressed downwards. Accordingly, as shown... Figure 11 The edge of the lower surface 2B of the semiconductor package 2 contacts the inclined guide surface 31A of the receiving guide portion 31 of each bump 22, and slides downward on the inclined guide surface 31A, thereby displacing each bump 22 outward in the longitudinal direction. Simultaneously, the edge of the lower surface 2B of the semiconductor package 2 contacts the inclined guide surface 31A of the receiving guide portion 31 of each bump 23, and slides downward on the inclined guide surface 31A, thereby displacing each bump 23 outward in the lateral direction. As a result, the semiconductor package 2 changes from a state of contact with the inclined guide surface 31A of the receiving guide portion 31 of each bump 22 to a state of contact with the pressing surface 30A of the positioning pressing portion 30 of each bump 22. Similarly, the semiconductor package 2 changes from a state of contact with the inclined guide surface 31A of the receiving guide portion 31 of each bump 23 to a state of contact with the pressing surface 30A of the positioning pressing portion 30 of each bump 23.

[0093] At this time, as Figure 12 As shown, in the lateral direction, the pressing surfaces 30A of the positioning pressing portions 30 of each bump 23 contact the side surface 2D of the semiconductor package 2, and the semiconductor package 2 is pressed inward in the lateral direction (i.e., towards the fixed side longitudinal sidewall 18) by the elastic restoring force of each elastic sheet 21 of the movable side longitudinal sidewall 17. This pressing force is received by the inner surface 18D of the fixed side longitudinal sidewall 18 through the semiconductor package 2. As a result, the semiconductor package 2 is clamped in the lateral direction between the pressing surfaces 30A of the positioning pressing portions 30 of each bump 23 and the inner surface 18D of the fixed side longitudinal sidewall 18, so as to be temporarily fixed, and is positioned relative to the connector body 5 in the lateral direction.

[0094] Similarly, as Figure 5As shown, in the longitudinal direction, the pressing surface 30A of the positioning pressing portion 30 of each bump 22 contacts the side surface 2D of the semiconductor package 2, and the semiconductor package 2 is pressed inward in the longitudinal direction (i.e., towards the fixed side transverse sidewall 16) by the elastic restoring force of each elastic piece 20 of the movable side transverse sidewall 15. This pressing force is received by the inner surface 16D of the fixed side transverse sidewall 16 through the semiconductor package 2. As a result, the semiconductor package 2 is clamped in the longitudinal direction between the pressing surface 30A of the positioning pressing portion 30 of each bump 22 and the inner surface 16D of the fixed side transverse sidewall 16 to be temporarily held, and is positioned relative to the connector body 5 in the longitudinal direction.

[0095] Under the aforementioned temporarily fixed state, such as Figure 12 As shown, the semiconductor package 2 abuts against the contact contact portion 43 of the plurality of contacts 9 in the vertical direction, and the contact connection portion 44 of the plurality of contacts 9 has not been elastically deformed.

[0096] Next, refer to Figures 1 to 3 The upper cover 6 is disposed above the semiconductor package 2, and the lower cover 7 is disposed below the substrate 4. The upper cover 6 and the lower cover 7 are then coupled together by bolts. Figure 12 and Figure 13 As shown, the two feet 51 are thus brought close to the substrate 4, and the encapsulation contact portion 50A of the cover body 50 of the upper cover 6 presses downward against the semiconductor package 2. The lower surface 2B of the semiconductor package 2 thus contacts... Figure 13 The upper surface 10A of the base plate 10 shown, and as Figure 9 The contact portion 43 of each contact 9 is displaced downwards with a protrusion height 43H as shown by the double-point chain line. At this time, since the contact portion 43 also displaces in the longitudinal or transverse direction as described above, the pads 2C formed on the lower surface 2B of the semiconductor package 2 rub against each other with the contact portion 43 of each contact 9, thereby achieving a so-called wiping effect. The frictional force generated between each contact 9 and the semiconductor package 2 acts in the direction toward the fixed-side transverse sidewall 16 or the fixed-side longitudinal sidewall 18. Therefore, the semiconductor package 2 does not move in the longitudinal or transverse direction due to this frictional force, thereby fully utilizing the wiping effect.

[0097] like Figure 13As shown, each receiving guide 31 is inserted into a corresponding clearance hole 50C. Specifically, the upper end 31C of each receiving guide 31 is located within the internal space of the corresponding clearance hole 50C. If the clearance hole 50C is not formed, the opposing peripheral wall portion 50B must be sufficiently separated from the substrate 4 when the semiconductor package 2 is fitted into the connector body 5 to avoid the upper end 31C of each receiving guide 31 physically interfering with the opposing peripheral wall portion 50B. Therefore, by forming a clearance hole 50C in the opposing peripheral wall portion 50B, even if the opposing peripheral wall portion 50B is close to the substrate 4, the upper end 31C of each receiving guide 31 will not physically interfere with the opposing peripheral wall portion 50B, thereby achieving a reduction in the height of the socket connector 3. In practice, the height of the socket connector 3 is reduced by the thickness of the upper cover 6.

[0098] Other techniques for reducing the height of the socket connector 3 are as follows. Since the reduction in the height of the socket connector 3 is limited by the protrusion 23 protruding upwards beyond the peripheral wall 11, it is possible to simply reduce the height of the socket connector 3 by lowering the height of the protrusion 23. Specifically, by lowering... Figure 7 As shown, any one or more of the protrusion height 43H, distance 30B, and distance 31B, the upper end 31C of the receiving guide portion 31 may be located below the upper surface 17A of the movable longitudinal sidewall 17. However, since the protrusion height 43H, distance 30B, and distance 31B all have special technical significance as described above, it is difficult to reduce these dimensions simply to reduce the height. Therefore, by forming such in the opposing peripheral wall portions 50B... Figure 13 The aforementioned clearance hole 50C simultaneously achieves the reduction of the height of the socket connector 3 and has technical significance related to the protrusion height 43H, distance 30B, and distance 31B.

[0099] Figure 14 This is a top view of socket connector 3. (Example) Figure 14 As shown, the four clearance holes 50C in the opposing peripheral wall portion 50B of the cover body 50 of the upper cover 6 are all formed at positions that do not overlap with the straight line L connecting the center points of the inner edges 51B of the two bolt locking holes 51A, which are respectively formed at the two feet 51 of the upper cover 6. In other words, the two protrusions 22 and the two protrusions 23 are all formed at positions that do not overlap with the straight line L. In this structure, the following effect is achieved.

[0100] Specifically, when the upper cover 6 presses down on the semiconductor package 2, the upper cover 6 deforms into an upward bending shape, with the package contact portion 50A protruding upward. To reliably press the semiconductor package 2 down with the upper cover 6, the rigidity of the P portion along the straight line L must be ensured to suppress the aforementioned bending deformation. Therefore, the four clearance holes 50C are all formed at positions that do not overlap with the straight line L, thereby not reducing the rigidity of the P portion. This allows the semiconductor package 2 to be reliably pressed down with the upper cover 6 without increasing its thickness.

[0101] The first embodiment is as described above. The above embodiment has the following characteristics.

[0102] like Figures 1 to 14 As shown, the socket connector 3 includes: a housing 8 made of insulating resin, having a peripheral wall 11 and a base plate 10, the peripheral wall 11 protruding upward from the edge of the base plate 10; a plurality of contacts 9 held by the base plate 10; a top cover 6 (cover) disposed above a semiconductor package 2 (the object to be connected) housed in the housing 8, and pressing down on the semiconductor package 2, thereby making electrical contact between the semiconductor package 2 and the plurality of contacts 9; and protrusions 22 and 23 (protrusions) protruding upward beyond the peripheral wall 11. In the top cover 6, clearance holes 50C (holes) into which the protrusions 22 and 23 are inserted are formed at a position facing the protrusions 22 and 23 in the vertical direction. In this structure, even though the protrusions 22 and 23 protrude upward beyond the peripheral wall 11, the height of the socket connector 3 can still be reduced, the type of socket connector 3 being that presses down on the semiconductor package 2 by the top cover 6.

[0103] It should be noted that, such as Figure 13 As shown, in the above embodiment, the upper cover 6 has clearance holes 50C in which protrusions 22 and 23 are inserted. Alternatively, the upper cover 6 may have notches in which protrusions 22 and 23 are inserted. Furthermore, when the semiconductor package 2 is pressed down, protrusions 22 and 23 do not need to be inserted into the corresponding clearance holes 50C. In this case, the vertical gap between protrusions 22 and 23 and the upper cover 6 can be set to be practically uncontrollable small, thereby achieving a reduction in the height of the socket connector 3 in the same manner.

[0104] And, as Figure 12 As shown, when the semiconductor package 2 is housed in the housing 8, the inclined guide surface 31A guiding the semiconductor package 2 is formed on the bumps 22 and 23. In this structure, the operability when the semiconductor package 2 is housed in the housing 8 is high.

[0105] And, as Figure 5As shown, when viewed from above, the housing 8 has a rectangular shape. The peripheral wall 11 includes a movable longitudinal sidewall 17 (first sidewall) and a fixed longitudinal sidewall 18 (second sidewall) facing each other, with the base plate 10 housed between them. The movable longitudinal sidewall 17 is elastically deformable in the transverse direction (first direction), and the movable longitudinal sidewall 17 and the fixed longitudinal sidewall 18 face each other in the transverse direction. A protrusion 23 is located on the movable longitudinal sidewall 17, thereby being configured to be displaceable in the transverse direction. In this structure, the protrusion 23 can be displaced in the transverse direction through a mechanically simple structure.

[0106] And, as Figure 12 As shown, the semiconductor package 2 housed in the housing 8 is pressed against the fixed longitudinal sidewall 18 by the elastic restoring force of the movable longitudinal sidewall 17, thereby positioning the semiconductor package 2 relative to the housing 8 in the lateral direction. In this structure, the positioning of the semiconductor package 2 relative to the housing 8 is achieved through a mechanically simple structure.

[0107] And, as Figure 8 and Figure 9 As shown, each contact 9 includes: a contact fixing portion 42 fixed to the base plate 10; a contact contact portion 43 protruding upward beyond the upper surface 10A of the base plate 10, thereby contacting the semiconductor package 2; and a contact connecting portion 44 that can elastically deform, connecting the contact fixing portion 42 and the contact contact portion 43 in a manner that allows the contact contact portion 43 to be displaced in the vertical direction. Each longitudinal contact 40 is configured such that the contact contact portion 43 approaches the fixed-side transverse sidewall 16 while displacing downward. In this structure, since the frictional force received by the semiconductor package 2 from the plurality of contacts 9 when the semiconductor package 2 is pressed downward acts to press the semiconductor package 2 against the fixed-side transverse sidewall 16, this frictional force is received through the fixed-side transverse sidewall 16 and does not cause the semiconductor package 2 to move in the longitudinal direction. The same applies to each transverse contact 41.

[0108] And, as Figure 9 As shown, the contact member connection portion 44 of each longitudinal contact member 40 has a U-shape that opens toward the fixed-side transverse sidewall 16. In this structure, a mechanically simple structure can be achieved, wherein the contact member contact portion 43 approaches the fixed-side transverse sidewall 16 while displacing downward.

[0109] And, as Figure 14As shown, the upper cover 6 has inner edges 51B (substrate fixing portions) with two bolt locking holes 51A, which are fixed immovably in the vertical direction to the substrate 4 on which the socket connector 3 is mounted. When viewed from above, the clearance holes 50C are all formed at positions that do not overlap with the straight line L connecting the two inner edges 51B. In this structure, the rigidity of portion P along the straight line L is not reduced by the clearance holes 50C. It should be noted that the upper cover 6 may have three or more bolt locking holes 51A.

[0110] And, as Figure 14 As shown, when viewed from above, the inner edges 51B of the two bolt locking holes 51A are located on both sides of the base plate 10. In this structure, portion P passes over the semiconductor package 2 along a straight line L to firmly press the semiconductor package 2 downward.

[0111] [Second Embodiment]

[0112] The following is for reference Figure 15 The second embodiment of the present invention will be described below. The differences between this embodiment and the first embodiment described above will be mainly described below, and repeated descriptions will be omitted.

[0113] In the first embodiment described above, as Figure 14 As shown, the upper cover 6 includes a cover body 50 and two feet 51, and the two feet 51 are configured such that the cover body 50 is built into the cover body 50 in the lateral direction.

[0114] In contrast, in this embodiment, the upper cover 6 further includes: Figure 15 The two second feet 52 are shown. The two second feet 52 are configured such that the cover body 50 is internally mounted between them in the longitudinal direction. Each of the two second feet 52 has a bolt locking hole 52A. Each bolt locking hole 52A has an inner edge 52B (second substrate fixing portion). When viewed from above, the straight line M connecting the centers of the inner edges 52B of the two bolt locking holes 52A is perpendicular to the straight line L. In this structure, since the upper cover 6 is locked to the lower cover 7 not only by using the two bolt locking holes 51A but also by using the two bolt locking holes 52A, the upper cover 6 is stabilized in its attitude about the straight line L as a rotation axis.

[0115] And, as Figure 15As shown, the four clearance holes 50C in the opposing peripheral wall portion 50B of the cover body 50 of the upper cover 6 are all formed at positions that do not overlap with any one of the straight lines L and M. The straight line L connects the centers of the inner edges 51B of the two bolt locking holes 51A of the two feet 51 of the upper cover 6, and the straight line M connects the centers of the inner edges 52B of the two bolt locking holes 52A of the second foot 52. In other words, the two protrusions 22 and the two protrusions 23 are all formed at positions that do not overlap with any one of the straight lines L and M. In this structure, the rigidity of the P portion along the straight line L and the rigidity of the Q portion along the straight line M are not reduced, allowing the semiconductor package 2 to be reliably pressed downwards without increasing the thickness of the upper cover 6.

[0116] The second embodiment of the present invention is as described above. The second embodiment described above has the following characteristics.

[0117] The top cover 6 includes two inner edges 51B (first substrate fixing portions), which are disposed on both sides of the bottom plate 10 when viewed from above; and two inner edges 52B (second substrate fixing portions), which are disposed on both sides of the bottom plate 10 when viewed from above. A straight line L (first straight line) connecting the two inner edges 51B and a straight line M (second straight line) connecting the two inner edges 52B are perpendicular to each other. In this structure, the attitude of the top cover 6 is stabilized when the semiconductor package 2 is pressed downwards.

[0118] It should be noted that when the upper cover 6 forms three or more substrate fixing portions that are fixed to the substrate 4 in a vertical direction without being movable, it is preferable that the clearance holes 50C are all formed so as not to overlap with any straight line connecting two of the three or more substrate fixing portions. For example, such as Figure 15 As shown, a clearance hole 50C is formed to overlap with a straight line N connecting the two closest substrate fixing portions (inner edge 51B and inner edge 52B) on the upper cover 6. These two substrate fixing portions correspond to adjacent sides of the base plate 10. In this case, it is preferable to form this clearance hole 50C in a manner that avoids the straight line N, typically by arranging the clearance hole 50C slightly outward in the transverse or longitudinal direction.

[0119] Those skilled in the art can combine the first embodiment and the second embodiment as needed.

[0120] As will be apparent from the invention described herein, embodiments of the invention can be modified in various ways. Such modifications should not be considered contrary to the spirit and scope of the invention, and it will be apparent to those skilled in the art that all such modifications are intended to be included within the scope of the following claims.

Claims

1. A socket connector, characterized in that, Include: The housing is made of insulating resin and has a peripheral wall and a bottom plate, the peripheral wall protruding upward from the edge of the bottom plate; Multiple contact elements are held in place by the base plate; A cover is disposed above the object to be connected, which is housed in the housing, and is configured to press down on the object to be connected and make the object to be connected electrically contact the plurality of contacts; as well as The protrusion protrudes upward from the peripheral wall, wherein, The cover has a hole or notch in the vertical direction opposite to the protrusion, into which the protrusion is inserted, and, When viewed from above, the housing has a rectangular shape. The peripheral wall includes a first sidewall and a second sidewall facing each other, and the base plate is embedded between the first sidewall and the second sidewall. The first sidewall can elastically deform in a first direction, and the first sidewall and the second sidewall face each other in the first direction.

2. The socket connector as described in claim 1, characterized in that, The protrusion has an inclined guide surface to guide the object to be connected when it is received in the housing.

3. The socket connector as described in claim 1, characterized in that, The protrusion is located on the first sidewall, thereby being configured to be displaceable in the first direction.

4. The socket connector as described in claim 3, characterized in that, The object to be connected, housed in the housing, is pressed against the second sidewall by the elastic restoring force of the first sidewall, thereby positioning the object to be connected relative to the housing in the first direction.

5. The socket connector as described in claim 3, characterized in that, Each of the aforementioned contact elements includes: a contact element fixing portion fixed to the base plate; a contact element contact portion protruding upward beyond the upper surface of the base plate to contact the object to be connected; and a contact element connecting portion that can elastically deform to connect the contact element fixing portion and the contact element contact portion in a manner that allows the contact element contact portion to be displaced in the vertical direction. Each of the contact elements is configured such that the contact portion of the contact element moves downward as it approaches the second sidewall.

6. The socket connector as described in claim 5, characterized in that, The contact member connection portion has a U-shape that opens toward the second sidewall.

7. The socket connector as claimed in any one of claims 1 to 6, characterized in that, The cover includes: at least two base plate fixing portions, which are fixed immovably in the vertical direction to the base plate on which the socket connector is mounted, and... When viewed from above, the hole or the notch is located in a position that does not overlap with the straight line connecting the at least two substrate fixing portions.

8. The socket connector as claimed in claim 7, characterized in that, The at least two substrate fixing parts include: two substrate fixing parts, which are disposed on both sides of the base plate when viewed from above.

9. The socket connector as claimed in claim 7, characterized in that, The at least two substrate fixing portions include: two first substrate fixing portions, which, when viewed from above, are disposed on both sides of the base plate; and two second substrate fixing portions, which, when viewed from above, are disposed on both sides of the base plate; and, The first straight line connecting the two first substrate fixing parts is perpendicular to the second straight line connecting the two second substrate fixing parts.

10. The socket connector as claimed in any one of claims 1 to 6, characterized in that, The cover includes: at least three base plate fixing portions, which are fixed immovably in the vertical direction to the base plate on which the socket connector is mounted, and... When viewed from above, the hole or the notch is located at a position that does not overlap with any straight line connecting two of the at least three substrate fixing parts.

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