A copper wire soft stent packaging equipment

Abstract

The application relates to a copper wire soft support packaging equipment, which comprises a work platform, a wire moving device, a tin point station and a heat elimination module. The work platform comprises a support frame and a visual detection module mounted on the support frame. The support frame is provided with a positioning heating device, a wire pressing module and a tin paste disc module. The wire pressing module is matched with the positioning heating device. The wire moving device is arranged below the work platform. The heat elimination module is in communication connection with the visual detection module. The tin point station is arranged on one side of the work platform. The tin point station comprises a mounting frame, a driving frame mounted on the mounting frame, a tin point needle detachably mounted on the driving frame and a cross slide arranged on one side of the mounting frame and connected with the driving frame. The driving frame drives the tin point needle to perform a tin paste taking action on the tin paste disc module and then is transferred to the positioning heating device to perform a packaging action. The application adopts a single-shaft driving tin point scheme, realizes a point-to-point tin feeding motion control mode, greatly simplifies the structure of the equipment and reduces the production cost.

Description

Technical Field

[0001] This invention relates to the field of copper wire flexible bracket packaging, specifically a copper wire flexible bracket packaging device. Background Technology

[0002] In the market, copper wire lamp packaging is formed by laser soldering. Since SMD (Surface Mount Device) LED chips are used, and the chips themselves undergo die-bonding, their electrodes have strong soldering capabilities, making this approach feasible. This project uses flip-chip technology, requiring the chip electrodes to be flip-chip soldered onto copper wires. Because chips are much more fragile, laser soldering is unsuitable; therefore, an alloy support structure needs to be fabricated on the copper wire beforehand. During packaging, the support structure is first melted, and then the chip is mounted onto the molten surface, achieving packaging through eutectic deposition. The fabrication of the copper wire-based alloy support structure is crucial. This project studies the application of SnAgCu solder to ground copper wires to construct two relatively uniform electrodes, forming a series of flexible supports for subsequent surface mount packaging.

[0003] Currently, copper wire bonding supports are manufactured using traditional die bonding processes, where a rotating shaft and a lifting shaft work together to apply molten solder. This system has the following problems:

[0004] 1) Dual-axis systems occupy a large amount of space and are not economical;

[0005] 2) Traditional soldering methods lack visual perception and feedback, and in inappropriate situations, there is a lack of follow-up processing, which makes the manufacturing of flexible substrates lack quality control and easily leads to short circuits in subsequent packaging. Summary of the Invention

[0006] The problem to be solved by the embodiments of the present invention is to provide a copper wire flexible lead packaging device. By adopting a single-axis drive soldering scheme, a point-to-point soldering motion control method is realized, which greatly simplifies the structure of the device. At the same time, visual monitoring is used to monitor the forming effect of the flexible lead and to perform heat elimination and reconstruction on unqualified flexible leads, thereby improving the manufacturing quality of the flexible lead.

[0007] To achieve the above objectives, the present invention provides the following technical solution:

[0008] A copper wire flexible support packaging device, comprising:

[0009] The working platform includes a support frame and a vision inspection module mounted on the support frame. The vision inspection module is used to detect the amount of solder paste on the copper wire. The support frame is equipped with a positioning heating device, a wire pressing module and a solder paste tray module. The solder paste tray module is used to provide solder paste. The wire pressing module cooperates with the positioning heating device to press the copper wire onto the positioning heating device.

[0010] The soldering station is located on one side of the work platform. The soldering station includes a mounting frame, a drive frame mounted on the mounting frame, soldering pins detachably mounted on the drive frame, and a cross slide located on one side of the mounting frame and connected to the drive frame. The drive frame drives the soldering pins to perform a solder paste picking action on the solder paste tray module, and then transfers it to the positioning heating device to perform the encapsulation action.

[0011] Furthermore, the positioning heating device includes a base plate, an adjustable limiting block disposed on the base plate, and a fixed limiting block fixedly mounted on the base plate. The adjustable limiting block is connected to a fine-threaded bolt disposed on the base plate, and the fine-threaded bolt is used to change the slit between the adjustable limiting block and the fixed limiting block.

[0012] Furthermore, the wire pressing module includes a miniature cylinder fixed to the base plate, and the base plate is provided with a heating plate for preheating the copper wire. The telescopic end of the miniature cylinder passes through the base plate and is connected to a small pressing plate for cooperating with the heating plate to press the copper wire.

[0013] Furthermore, the solder paste tray module includes a drive device fixedly mounted on the base plate. The output shaft of the drive device passes through the base plate and is coaxially connected to the solder paste tray. The drive device is used to drive the solder paste tray to rotate.

[0014] Furthermore, the drive frame includes a first motor bracket and a first motor mounted on the first motor bracket. The output shaft of the first motor passes through the first motor bracket and is connected to a connecting rod fixed to the cross slide via an eccentric wheel. A clamp is provided at the end of the connecting rod.

[0015] Furthermore, the cross slide includes a vertical slide rail fixedly installed on the first motor bracket, a connecting block slidably disposed on the vertical slide rail, and a horizontal slide rail fixedly disposed on the connecting block and slidably connected to the connecting rod.

[0016] Furthermore, it also includes a heat elimination module, which is communicatively connected to the vision inspection module. The heat elimination module includes a first support frame, a second motor, and a hot air gun. The second motor is mounted on the first support frame, and the output shaft of the second motor is connected to a threaded linear module. The hot air gun is connected to the threaded linear module through a retainer, and one end of the hot air gun is provided with a bent fine-hole sealing nozzle.

[0017] Furthermore, it also includes a wire-shifting device, which is disposed below the working platform. The wire-shifting device includes a clamping assembly and a stepping assembly that drives the clamping assembly to move. The stepping assembly drives the clamping assembly to move, and the clamping assembly is used to clamp or release the copper wire.

[0018] The stepper assembly includes a third motor, the output shaft of which is connected to a synchronous belt linear module fixed to the clamping assembly.

[0019] Furthermore, the clamping assembly includes two secondary support frames fixed to the synchronous belt linear module. Each secondary support frame is provided with a fixed clamping jaw, and a cylinder is fixedly installed on the secondary support frame. The telescopic end of the cylinder is equipped with a follow-up clamping jaw that cooperates with the fixed clamping jaw to clamp the copper wire.

[0020] Furthermore, it also includes a winding device for winding up the encapsulated copper wire. The winding device includes a winding structure and a No. 5 motor. The output shaft of the No. 5 motor is connected to a lead screw and slider linear module. The winding structure is mounted on the lead screw and slider linear module.

[0021] The winding structure includes a spool, and the drive shaft of the spool is connected to a No. 4 motor mounted on the lead screw slider linear module via a pulley system.

[0022] Compared with the prior art, the beneficial effects of the present invention are:

[0023] This invention employs a single-axis drive soldering scheme, utilizing an eccentric wheel mechanism to achieve point-to-point soldering motion control. By using a single-axis drive to achieve point-to-point soldering, the structure of the equipment is greatly simplified and the cost is reduced. At the same time, visual monitoring is used to monitor the molding effect of the flexible bracket, and heat elimination and reconstruction are performed on unqualified flexible brackets, thereby improving the manufacturing quality of the flexible bracket. Attached Figure Description

[0024] Figure 1 A schematic diagram of one embodiment of a copper wire flexible support packaging device;

[0025] Figure 2 A schematic diagram of the working platform in one embodiment of a copper wire flexible bracket packaging device;

[0026] Figure 3 A schematic diagram of the positioning heating device in one embodiment of a copper wire flexible bracket packaging device;

[0027] Figure 4 A schematic diagram of the soldering station in one embodiment of a copper wire flexible bracket packaging device;

[0028] Figure 5 A schematic diagram of the heat dissipation module in one embodiment of a copper wire flexible bracket packaging device;

[0029] Figure 6 A schematic diagram of the wire shifting device in one embodiment of a copper wire flexible bracket packaging device;

[0030] Figure 7 This is a schematic diagram of the take-up device in one embodiment of a copper wire flexible bracket encapsulation device.

[0031] In the diagram: 1. Tensioning device; 2. Working platform; 20. Vision inspection module; 21. Positioning heating device; 210. Fine thread bolt; 211. Adjustable limit block; 212. Fixed limit block; 213. Heating element; 214. Base plate; 22. Wire pressing module; 23. Solder paste tray module; 3. Soldering station; 30. Motor No. 1; 31. Motor No. 1 bracket; 32. Eccentric wheel; 33. Connecting rod; 34. Clamp; 35. Base; 36. Cross slide. 4. Heat elimination module; 40. Support frame 1; 41. Motor 2; 42. Threaded linear module; 43. Hot air gun; 44. Fixing device; 45. Elbow fine hole sealing nozzle; 5. Thread transfer device; 50. Motor 3; 51. Synchronous belt linear module; 52. Support frame 2; 53. Cylinder; 6. Thread take-up device; 60. Thread spool; 61. Belt pulley system; 62. Drive shaft; 63. Motor 4; 64. Screw slider linear module; 65. Motor 5. Detailed Implementation

[0032] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0033] Furthermore, elements in this invention are referred to as being "fixed to" or "set on" another element, which may be directly on the other element or may also include an intervening element. When an element is considered to be "connected" to another element, it may be directly connected to the other element or may also include an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0034] Reference Figure 1 As shown in the embodiment of the present invention, a copper wire flexible bracket packaging device includes: a working platform 2 and a soldering station 3.

[0035] Reference Figure 1, Figure 2 As shown, the working platform 2 includes a support frame and a vision inspection module 20 installed on the support frame. The vision inspection module 20 is used to detect the amount of solder paste on the copper wire. The support frame is provided with a positioning heating device 21, a wire pressing module 22 and a solder paste tray module 23. The wire pressing module 22 cooperates with the positioning heating device 21 to press the copper wire onto the positioning heating device 21.

[0036] Combination Figure 3 As shown, the positioning heating device 21 includes a base plate 214, an adjustable limiting block 211 disposed on the base plate 214, and a fixed limiting block 212 fixedly installed on the base plate 214. The base plate 214 and the adjustable limiting block 211 are fitted together by a "U"-shaped hole structure, and the adjustable limiting block 211 is connected to a fine thread bolt 210 disposed on the base plate 214. The fine thread bolt 210 is used to change the slit between the adjustable limiting block 211 and the fixed limiting block 212.

[0037] The base plate 214 is also provided with a heating element 213 for preheating the copper wire. The wire pressing module 22 includes a miniature cylinder fixed to the bottom of the base plate 214. The telescopic end of the miniature cylinder passes through the base plate 214 and is connected to a small pressing plate for cooperating with the heating element 213 to press the copper wire.

[0038] The solder paste tray module 23 includes a drive device fixedly mounted on the base plate 214. In this embodiment, the drive device is preferably a motor. The output shaft of the drive device passes through the base plate 214 and is coaxially connected to the solder paste tray. The drive device can drive the solder paste tray to rotate.

[0039] The copper wire is located between the adjustable limiting block 211 and the fixed limiting block 212, and between the heating plate 213 and the small pressure plate. When the copper wire is being transported, it is limited by the adjustable limiting block 211 and the fixed limiting block 212. At the same time, when processing copper wires of different widths, the position of the adjustable limiting block 211 can be adjusted by the fine thread bolt 210, so that the slit between it and the fixed limiting block 212 is adjustable. This enables the production of copper wires of different widths, improving the applicability of the equipment. By controlling the micro cylinder to drive the small pressure plate to press the copper wire against the heating plate 213 to fix it, the heating plate 213 preheats the copper wire to prevent the copper wire from moving during the packaging process, which could result in poor packaging effect or even packaging failure.

[0040] Compared to the existing working platform 2, the positioning and constraint of the copper wire in three directions are achieved. Specifically, the adjustable limit block 211 and the fixed limit block 212 make the copper wire located in the slit, achieving horizontal positioning. At the same time, the micro cylinder drives the small pressing plate to press the copper wire against the heating plate 213, achieving vertical positioning.

[0041] Reference Figure 2 , Figure 4 As shown, the soldering station 3 is located on one side of the working platform 2 and includes:

[0042] A mounting bracket, specifically, the mounting bracket includes a base 35 and a first motor bracket 31 disposed on the base 35;

[0043] A drive frame is mounted on the mounting bracket;

[0044] A soldering pin is detachably mounted on the drive frame, which drives the soldering pin to perform the following actions: pick up solder paste from the solder paste tray module 23 and transfer it to the positioning heating device 21 to perform the encapsulation action;

[0045] A cross slide 36 is provided on one side of the mounting bracket and connected to the drive bracket. It is used to keep the soldering needle moving vertically downward when the soldering needle performs solder paste picking and encapsulation operations. It should be noted that the soldering needle makes a circular motion. When the soldering needle performs solder paste picking and encapsulation operations, it is in a state where its circular motion is tangent to the vertical plane. At this time, the soldering needle can be regarded as making a vertical downward motion.

[0046] The drive frame includes a first motor bracket 31 and a first motor 30 mounted on the first motor bracket 31. The output shaft of the first motor 30 passes through the first motor bracket 31 and is connected to a connecting rod 33 fixed to a cross slide 36 via an eccentric wheel 32. A clamp 34 is provided at the end of the connecting rod 33. Specifically, the soldering pin and the clamp 34 are detachably connected. For example, the detachable connection can be a bolt and nut connection or a snap-fit ​​connection. The base 35 also has a "U" shaped hole structure and fine thread bolts, which can be adjusted in three directions.

[0047] In this embodiment, the cross slide 36 includes a vertical slide fixedly installed on the first motor bracket 31, a connecting block slidably disposed on the vertical slide, and a horizontal slide fixed on the connecting block and slidably connected to the connecting rod 33.

[0048] Once the copper wire is fixed, motor 30 operates, driving eccentric wheel 32 to rotate. Eccentric wheel 32 features a coupling to lock the output shaft of motor 30. Simultaneously, eccentric wheel 32 connects to connecting rod 33, with a pin and bearing between connecting rod 33 and eccentric wheel 32, functioning as a movable hinge pair. During the rotation of eccentric wheel 32, connecting rod 33 moves, and under the action of cross slide 36, connecting rod 33 remains vertical and reciprocates, completing the process of taking solder paste from the solder paste tray and applying it to the copper wire. Since the solder paste tray is connected to the output shaft of the drive device, it effectively prevents the soldering needle from taking solder paste from the same position on the solder paste tray, meaning the solder paste tray is in a movable state.

[0049] Compared to existing technologies, firstly, single-axis control enables both solder picking and soldering actions, significantly simplifying the structure. Secondly, the landing speed is vertically downward, eliminating the horizontal velocity component, thus improving soldering efficiency. Furthermore, the device itself offers increased adjustability, providing a certain range of adjustment in the XYZ directions via U-shaped hole connections, allowing for adjustable landing points. Additionally, the end-effector's motion trajectory radius is adjustable, achievable by equipping eccentric wheels 32 with varying eccentric radii. Simultaneously, the guide function of the cross slide 36 ensures a predetermined motion trajectory, guaranteeing reliable movement—a key feature of single-axis drive.

[0050] Reference Figure 1 As shown, the copper wire flexible support packaging equipment also includes: a heat elimination module 4, a wire transfer device 5, a wire take-up device 6, and a tensioning device 1.

[0051] Reference Figure 2 , Figure 5 As shown, the heat elimination module 4 is connected to the vision inspection module 20. The vision inspection module 20 has a built-in XYZ three-axis micrometer adjuster to achieve small-amplitude high-precision adjustment of the center of the field of view of the vision inspection module 20.

[0052] The heat elimination module 4 includes a first support frame 40, a second motor 41, a threaded linear module 42, and a hot air gun 43. The second motor 41 is mounted on the first support frame 40. The output shaft of the second motor 41 is connected to the threaded linear module 42. The hot air gun 43 is connected to the threaded linear module through a retainer 44, and one end of the hot air gun 43 is provided with a bent fine hole sealing nozzle 45.

[0053] After the soldering needle places the solder paste onto the copper wire, the heating element 213 heats the copper wire. After the solder paste melts, the heating element 213 stops heating. After the solder paste cools down, the vision inspection module 20 inspects it. If a defect is detected, the vision inspection module 20 controls the second motor 41 to work, causing the threaded linear module 42 to drive the hot air gun 43 to move to the solder paste on the copper wire. The hot air gun 43 generates hot air, which melts and removes the solder paste on the copper wire through the bent fine hole sealing nozzle 45.

[0054] Compared to existing technologies, firstly, a vision inspection module 20 is arranged above the processing position, which can visually inspect the positioning accuracy of the copper wire and provide feedback to guide the movement of the copper wire. Secondly, it can intelligently detect the processing status online, reducing the impact of manual troubleshooting on machine efficiency. At the same time, a hot air blowing method is adopted, which improves both the effect and efficiency and avoids damage to the strength of the copper wire caused by grinding.

[0055] Reference Figure 6 As shown, the wire transfer device 5 is used to transport copper wires, including a clamping component and a stepping component that drives the clamping component to move. When the stepping component drives the clamping component to move to the end of its stroke, the clamping component clamps or releases the copper wire.

[0056] The stepper assembly includes a third motor 50, the output shaft of which is connected to a synchronous belt linear module 51 fixed to the clamping assembly. In this embodiment, the synchronous belt linear module preferably adopts a synchronous belt drive method.

[0057] The clamping assembly includes two secondary support frames 52 fixed on the synchronous belt linear module 51. Each secondary support frame 52 is provided with a fixed gripper jaw, and a cylinder 53 is fixedly installed on the secondary support frame 52. The telescopic end of the cylinder 53 is equipped with a follow-up gripper jaw that cooperates with the fixed gripper jaw to clamp the copper wire.

[0058] In use, motor 50 drives the fixed gripper jaw and its cooperating follower gripper jaw to the end of the stroke of the synchronous belt linear module 51 via the synchronous belt linear module 51. At this time, the follower gripper jaw moves down under the action of cylinder 53 and cooperates with the fixed gripper jaw to clamp the copper wire. Then the synchronous belt linear module 51 continues to operate, driving the fixed gripper jaw and the follower gripper jaw to move in the direction and pulling the copper wire to move laterally. Under the action of tensioning device 1, it maintains a taut state. When the fixed gripper jaw and the follower gripper jaw move to the other end of the synchronous belt linear module 51, the follower gripper jaw moves up under the action of cylinder 53 to release the copper wire.

[0059] Compared to existing technologies, the copper wire transfer mode is achieved by setting two sets of fixed gripper jaws and follower gripper jaws, which avoids tensile stress on the heated copper wire in the middle processing section, thus preventing deformation and errors. Furthermore, the follower gripper jaws are driven by cylinder 53, and the clamping action and clamping force can be adjusted by air circuit components and air pressure. At the same time, a synchronous belt is used as a linear movement module, which is relatively stable during start-up and shutdown, reducing the interference of vibration on the position of the flexible wire.

[0060] Reference Figure 1 , Figure 7 As shown, the take-up device 6 is used to take up the encapsulated copper wire.

[0061] The take-up device 6 includes a take-up structure and a No. 5 motor 65. The output shaft of the No. 5 motor 65 is connected to a lead screw and slider linear module 64, and the take-up structure is mounted on the lead screw and slider linear module 64.

[0062] The winding structure includes a spool 60, and the drive shaft 62 of the spool 60 is connected to a No. 4 motor 63 mounted on the lead screw and slider linear module 64 via a pulley system 61. In this embodiment, the lead screw and slider linear module preferably adopts a lead screw and nut transmission method.

[0063] When the packaged copper wire is conveyed to one side of the reel 60 by the fixed gripper jaws and the follower gripper jaws, motor 63 operates and drives the reel 60 to wind the copper wire through the pulley system 61. At the same time, during the winding process, motor 65 drives the reel 60 to reciprocate through the lead screw slider linear module 64, so that the copper wire can be neatly wound on the reel 60, avoiding the copper wire from getting tangled in a certain position on the reel 60, reducing the winding rate of the reel 60, and preventing the structure of the copper wire after packaging from being damaged.

[0064] Compared to traditional technology, the wire spool 60 is given a horizontal degree of freedom, which can achieve better collection and organization of copper wires. At the same time, the lead screw slider linear module 64 adopts lead screw drive, which has higher precision. By reducing the lead, the horizontal movement distance per unit time can be reduced, achieving precise winding and horizontal movement linkage.

[0065] Combination Figures 1-7As shown above, during use, the No. 3 motor 50 drives the fixed gripper jaw and the cooperating follower gripper jaw to the end of the stroke of the synchronous belt linear module 51 via the synchronous belt linear module 51. At this time, the follower gripper jaw moves down under the action of the cylinder 53 and cooperates with the fixed gripper jaw to clamp the copper wire. Then, the synchronous belt linear module 51 continues to operate, driving the fixed gripper jaw and the follower gripper jaw to move towards the wire spool 60 and pull the copper wire to move laterally. Under the action of the tensioning device 1, it maintains a taut state. When the fixed gripper jaw and the follower gripper jaw move to the other end of the synchronous belt linear module 51, the follower gripper jaw moves up under the action of the cylinder 53 to release the copper wire.

[0066] When the packaged copper wire is conveyed to one side of the reel 60 by the fixed gripper jaws and the follower gripper jaws, motor 63 operates and connects to the reel 60 via pulley system 61 to perform a winding action on the copper wire. At the same time, during the winding process, motor 65 drives the reel 60 to reciprocate through the lead screw slider linear module 64, so that the copper wire can be neatly wound on the reel 60, avoiding the copper wire from getting tangled in a certain position on the reel 60, reducing the winding rate of the reel 60, and preventing the structure of the copper wire after packaging from being damaged.

[0067] The copper wire is located between the adjustable limiting block 211 and the fixed limiting block 212, and between the heating plate 213 and the small pressure plate. When the copper wire is being transported, it is limited by the adjustable limiting block 211 and the fixed limiting block 212. At the same time, when processing copper wires of different widths, the position of the adjustable limiting block 211 can be adjusted by the fine thread bolt 210, so that the slit between it and the fixed limiting block 212 is adjustable, thereby realizing the production of copper wires of different widths and improving the applicability of the equipment. At the same time, when the cylinder 53 drives the follower gripper to move upward to release the copper wire, the small pressure plate is controlled by the micro cylinder to apply pressure to the heating plate 213 to fix the copper wire. Meanwhile, the heating plate 213 preheats the copper wire to prevent the copper wire from moving during the packaging process, which would result in poor packaging effect or even packaging failure.

[0068] Once the copper wire is fixed, motor 30 starts working and drives eccentric wheel 32 to rotate. During the rotation of eccentric wheel 32, connecting rod 33 moves. Under the action of cross slide 36, connecting rod 33 remains vertical and reciprocates, completing the process of taking solder paste from solder paste tray and applying it to copper wire. Since solder paste tray is connected to the output shaft of drive device, it effectively avoids soldering needles taking solder paste from the same position on solder paste tray, meaning that solder paste tray is in a movable state.

[0069] After the solder paste is placed on the copper wire by the soldering needle, the heating plate 213 heats the copper wire. After the solder paste melts, the heating plate 213 stops heating. After the solder paste cools down, the vision inspection module 20 performs inspection. If a defect is detected, the vision inspection module 20 controls the second motor 41 to work and drives the hot air gun 43 to move to the solder paste on the copper wire through the threaded linear module 42. The hot air gun 43 generates hot air, which melts and removes the solder paste on the copper wire through the bent fine hole sealing nozzle 45.

[0070] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0071] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A copper wire soft stent packaging device, characterized in that, The application relates to a copper wire tin-plating device, which comprises the following parts: a working platform (2) comprising a support frame and a visual detection module (20) installed on the support frame, the visual detection module (20) being used for detecting the amount of tin paste on a copper wire, the support frame being provided with a positioning and heating device (21), a wire pressing module (22) and a tin paste disc module (23), the tin paste disc module (23) being used for providing tin paste, and the wire pressing module (22) being matched with the positioning and heating device (21) to press the copper wire on the positioning and heating device (21); a wire moving device (5) arranged below the working platform (2), the wire moving device (5) comprising a clamping assembly and a stepping assembly for driving the clamping assembly to move, and the clamping assembly being used for clamping or releasing the copper wire; a tin-plating station (3) arranged on one side of the working platform (2), the tin-plating station comprising a mounting frame, a driving frame installed on the mounting frame, a tin-plating needle detachably installed on the driving frame, and a cross slide (36) arranged on one side of the mounting frame and connected with the driving frame, the driving frame driving the tin-plating needle to perform a tin paste taking action on the tin paste disc module (23) and then to perform a packaging action on the positioning and heating device (21); the driving frame comprises a first motor support (31) and a first motor (30) installed on the first motor support (31), the output shaft of the first motor (30) penetrating through the first motor support (31) and being connected with a fixed connecting rod (33) of the cross slide (36) through an eccentric wheel (32), and the end of the connecting rod (33) is provided with a clamping device (34); the cross slide (36) comprises a vertical slide way fixedly installed on the first motor support (31), a connecting block slidingly arranged on the vertical slide way, and a horizontal slide way fixedly arranged on the connecting block and slidingly connected with the connecting rod (33); a heat elimination module (4) in communication connection with the visual detection module (20), the heat elimination module (4) being used for melting and removing the tin paste on the copper wire which is detected as unqualified by the visual detection module (20) after the tin paste is cooled. The positioning and heating device (21) comprises a bottom plate (214), an adjustable limiting block (211) arranged on the bottom plate (214), and a fixed limiting block (212) fixedly installed on the bottom plate (214), the adjustable limiting block (211) is connected with a fine thread bolt (210) arranged on the bottom plate (214), and the fine thread bolt (210) is used for changing the gap between the adjustable limiting block (211) and the fixed limiting block (212). The wire pressing module (22) comprises a micro air cylinder fixed on the bottom plate (214), the bottom plate (214) is provided with a heating piece (213) used for preheating the copper wire, and the telescopic end of the micro air cylinder penetrates through the bottom plate (214) and is connected with a small pressing piece used for cooperating with the heating piece to press the copper wire. ​ ​ ​ ​ 2. The copper wire stent encapsulating device of claim 1, wherein, ​ 3. The copper wire stent encapsulating device of claim 2, wherein, ​ 4. The copper wire stent encapsulating device of claim 2, wherein, The tin paste disc module (23) comprises a driving device fixedly installed on the bottom plate (214), an output shaft of the driving device penetrates through the bottom plate (214) and is coaxially connected with a tin paste disc, and the driving device is used for driving the tin paste disc to rotate.

5. The copper wire stent encapsulation apparatus of claim 1, wherein, The heat elimination module (4) comprises a first support frame (40) and a second motor (41), the second motor (41) is arranged on the first support frame (40), a threaded linear module (42) is connected with an output shaft of the second motor (41), a heat gun (43) is connected between the threaded linear module (42) and the fixed device (44), and one end of the heat gun (43) is provided with a bent hole sealing nozzle (45).

6. The copper wire stent encapsulation apparatus of claim 1, wherein, The stepping assembly comprises a third motor (50), and an output shaft of the third motor (50) is drivingly connected with a synchronous belt linear module (51) fixed with the clamping assembly.

7. The copper wire stent encapsulating device of claim 6, wherein, The clamping assembly comprises two second support frames (52) fixed on the synchronous belt linear module (51), each of the second support frames (52) is provided with a fixed jaw tiger mouth, a cylinder (53) is fixedly installed on the second support frame (52), and a follow-up jaw tiger mouth matched with the fixed jaw tiger mouth is installed at an extension end of the cylinder (53) to clamp the copper wire.

8. The copper wire stent encapsulation apparatus of claim 1, wherein, The winding device (6) is used for winding the copper wire after encapsulation, and comprises a winding structure and a fifth motor (65), an output shaft of the fifth motor (65) is connected with a screw block linear module (64), and the winding structure is arranged on the screw block linear module (64). The winding structure comprises a wire disc (60), a transmission shaft (62) of the wire disc (60) is connected and arranged on the screw block linear module (64) through a belt wheel system (61), and a fourth motor (63) is arranged on the screw block linear module (64).

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