Mach-zehnder modulator with heat dissipation structure and packaging method

Abstract

The disclosure provides a Mach-Zehnder modulator with a heat dissipation structure and a packaging method, the modulator comprising: a modulator body; a heat dissipation structure, the lower end of the heat dissipation structure being in close contact with the ground-signal-ground electrode of the modulator body, the material of the heat dissipation structure comprising diamond; the modulator body and the heat dissipation structure are packaged in a tube shell; the upper end of the heat dissipation structure is in close contact with the tube shell.

Description

Technical Field

[0001] This disclosure relates to the field of optoelectronic device technology, and in particular to a Mach-Zehnder modulator with a heat dissipation structure and a packaging method thereof. Background Technology

[0002] With the booming development of mobile internet, cloud computing, and big data, and the emergence of new applications such as 5G communication, people are demanding increasingly larger volumes of information transmission and processing. Integrated optoelectronics has become an essential pathway for information transmission. The Mach-Zehnder modulator is one of the main structures of optoelectronic integrated chips.

[0003] However, in the process of realizing the present invention, the inventors discovered that in the related technology, there is a problem of limited bandwidth of Mach-Zehnder modulators.

[0004] Public content

[0005] This disclosure provides a Mach-Zehnder modulator with a heat dissipation structure to at least partially solve the technical problems mentioned above.

[0006] According to a first aspect of this disclosure, a Mach-Zehnder modulator with a heat dissipation structure is provided, comprising:

[0007] Modulator body;

[0008] The heat dissipation structure has its lower end in close contact with the ground-signal-ground electrode of the modulator body, and the material of the heat dissipation structure includes diamond.

[0009] The modulator body and the heat dissipation structure are encapsulated in a housing; the upper end of the heat dissipation structure is in close contact with the housing.

[0010] According to an embodiment of this disclosure, the lower end of the heat dissipation structure that contacts the ground-signal-ground electrode is a combination of two H-shaped structures, and the two H-shaped structures are in close contact with the signal electrode and the ground electrode of the ground-signal-ground electrode, respectively.

[0011] According to embodiments of this disclosure, the shape of the upper end of the heat dissipation structure that contacts the casing includes a circular enlarged structure or a square enlarged structure.

[0012] According to embodiments of this disclosure, the heat dissipation structure is based on a cylindrical shaft with heat dissipation fins on its sidewalls. The shape of the vertical cross-section of the heat dissipation fins includes a rectangle or an arc shape with a protruding center.

[0013] According to an embodiment of this disclosure, the length of the lower end of the heat dissipation structure that contacts the ground-to-signal-to-ground electrode is greater than or equal to 2 / 3 of the electrode length.

[0014] The width of the lower end of the heat dissipation structure that contacts the signal electrode is greater than or equal to 4 / 5 of the width of the signal electrode.

[0015] The lower end of the aforementioned heat dissipation structure that contacts the aforementioned signal electrode is located at the center of the signal electrode;

[0016] The width of the lower end of the heat dissipation structure that contacts the ground electrode is greater than or equal to 1 / 2 of the width of the ground electrode.

[0017] According to embodiments of this disclosure, the cross-sectional shape of the upper end of the modulator body that contacts the heat dissipation structure includes a rectangle or a trapezoid.

[0018] According to embodiments of this disclosure, the material of the aforementioned ground-to-signal-to-ground electrode is selected from gold, and the material of the aforementioned casing is selected from ceramics and Kovar metal.

[0019] According to embodiments of this disclosure, the materials used in the above-described heat dissipation structure are also selected from ALN and Bi2Te3.

[0020] According to embodiments of this disclosure, the substrate material of the modulator body is selected from Si or SiO2;

[0021] The modulation layer of the modulator body is made of lithium niobate.

[0022] According to a second aspect of this disclosure, a packaging method for a modulator described in any of the preceding claims is provided, comprising:

[0023] Etching and cutting diamond to obtain a heat dissipation structure;

[0024] The heat dissipation structure is flipped and fixed in the tube cover using flip welding or fixing adhesive.

[0025] The modulator body is fixedly encapsulated in the aforementioned tubular housing;

[0026] The aforementioned tube cover is placed on the aforementioned tube housing, so that the lower end of the aforementioned heat dissipation structure is in close contact with the ground-signal-ground electrode of the aforementioned modulator body, and the aforementioned heat dissipation structure and the aforementioned modulator body are encapsulated in the tube housing.

[0027] According to the Mach-Zehnder modulator method and packaging method with heat dissipation structure provided in this disclosure, by making close contact between the lower end of the heat dissipation structure and the ground-signal-ground electrode of the modulator body, the heat generated by the ground-signal-ground electrode can be guided to the heat dissipation structure for heat dissipation. Then, by making close contact between the upper end of the heat dissipation structure and the shell, the heat in the heat dissipation structure can be guided to the shell for heat dissipation through the shell. Since diamond is selected as the material of the heat dissipation structure, the heat dissipation capacity of the heat dissipation structure itself is enhanced. Furthermore, since the heat generated by the modulator body is dissipated through the heat dissipation structure and the shell, the heat dissipation capacity of the Mach-Zehnder modulator is improved, so that the heat of the modulator meets the requirements, the impact of heat generated by the propagation of high-frequency signals in the metal electrodes on the modulator performance is reduced, and the bandwidth limitation of the modulator during operation is alleviated. Attached Figure Description

[0028] Figure 1 A schematic diagram of a Mach-Zehnder modulator with a heat dissipation structure according to an embodiment of the present disclosure is shown.

[0029] Figure 2 A schematic diagram illustrating the upper end of a heat dissipation structure according to an embodiment of the present disclosure being in close contact with the casing;

[0030] Figure 3 A schematic diagram illustrating a modulator body disposed in a tube housing according to an embodiment of the present disclosure is shown.

[0031] Figure 4 A flowchart illustrating an encapsulation method according to an embodiment of the present disclosure is shown schematically.

[0032] Figure 5 A schematic diagram illustrating the packaging process according to an embodiment of the present disclosure is shown.

[0033] Explanation of reference numerals in the attached figures

[0034] 1-Heat dissipation structure;

[0035] 11 - Upper end of the heat dissipation structure;

[0036] 12 - Lower end of the heat dissipation structure;

[0037] 121 - The lower end of the heat dissipation structure that contacts the signal electrode;

[0038] 122 - The lower end of the heat dissipation structure that contacts the ground electrode;

[0039] 131-Main Body;

[0040] 132 - Heatsink;

[0041] 2- Modulator body;

[0042] 21-Ground electrode;

[0043] 211 - First ground electrode;

[0044] 212 - Second ground electrode;

[0045] 22 - Signal electrode;

[0046] 23-Modulation layer;

[0047] 24-substrate;

[0048] 3-Tube shell;

[0049] 31-Tube shell cover;

[0050] 32 - Tube shell. Detailed Implementation

[0051] The embodiments of the present disclosure will now be described with reference to the accompanying drawings. However, it should be understood that these descriptions are exemplary only and are not intended to limit the scope of the disclosure. In the following detailed description, numerous specific details are set forth to provide a thorough understanding of the embodiments of the present disclosure for ease of explanation. However, it will be apparent that one or more embodiments may be practiced without these specific details. Furthermore, descriptions of well-known structures and techniques are omitted in the following description to avoid unnecessarily obscuring the concepts of the present disclosure.

[0052] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit this disclosure. The terms “comprising,” “including,” etc., as used herein indicate the presence of the stated features, steps, operations, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, or components.

[0053] All terms used herein (including technical and scientific terms) have the meanings commonly understood by those skilled in the art, unless otherwise defined. It should be noted that the terms used herein are to be interpreted in a manner consistent with the context of this specification, and not in an idealized or overly rigid way.

[0054] Certain embodiments of this disclosure will be described more fully below with reference to the accompanying drawings, some of which, but not all, will be shown. In fact, various embodiments of this disclosure may be implemented in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided to enable this disclosure to meet applicable legal requirements.

[0055] In related technologies, as modulation rates increase, the frequency of the microwave signal applied to the electrodes of the Mach-Zehnder modulator also increases, leading to greater heat generation from the high-frequency signal. This heat generated by the high-frequency microwave signal affects the conductivity of the electrodes and the refractive index of the optical waveguide, causing a wave velocity mismatch and limiting the modulator bandwidth.

[0056] In realizing the inventive concept disclosed herein, the inventors discovered that by selecting diamond, which has good thermal conductivity, as the heat dissipation structure and combining the heat dissipation structure with the modulator, the heat generation of the modulator can be effectively reduced, thereby reducing the impact of heat generation during the propagation of high-frequency signals in the metal electrodes on the modulator performance and improving the modulation rate and bandwidth of the modulator.

[0057] In view of this, the present disclosure provides a Mach-Zehnder modulator method with a heat dissipation structure, including: a modulator body and a heat dissipation structure.

[0058] The lower end of the heat dissipation structure is in close contact with the ground-to-signal-to-ground electrode of the modulator body, and the material of the heat dissipation structure includes diamond;

[0059] The modulator body and the heat dissipation structure are encapsulated in a housing; the upper end of the heat dissipation structure is in close contact with the housing.

[0060] Figure 1 A schematic diagram of a Mach-Zehnder modulator with a heat dissipation structure according to an embodiment of the present disclosure is shown.

[0061] Figure 2 The diagram schematically shows the upper end of the heat dissipation structure according to an embodiment of the present disclosure being in close contact with the casing.

[0062] Figure 3 A schematic diagram illustrating a modulator body disposed in a tube housing according to an embodiment of the present disclosure is shown.

[0063] like Figure 1 , Figure 2 and Figure 3 As shown, the Mach-Zehnder modulator with a heat dissipation structure provided in this embodiment includes: a modulator body 2, a heat dissipation structure 1, and a housing 3.

[0064] The lower end 12 of the heat dissipation structure 1 is in close contact with the ground-to-signal-to-ground electrode of the modulator body 2, and the material of the heat dissipation structure 1 includes diamond.

[0065] The modulator body 2 and the heat dissipation structure 1 are encapsulated in the tube shell 3; the upper end 11 of the heat dissipation structure is in close contact with the tube shell 3.

[0066] According to embodiments of this disclosure, the ground-to-signal-to-ground electrode includes a first ground electrode 211, a signal electrode 22, and a second ground electrode 212.

[0067] According to embodiments of this disclosure, by making close contact between the lower end 12 of the heat dissipation structure 1 and the ground-to-ground electrode of the modulator body 2, the heat generated by the ground-to-ground electrode of the modulator can be diverted to the heat dissipation mechanism.

[0068] According to the embodiments of this disclosure, by making the upper end 11 of the heat dissipation structure 1 in close contact with the shell 3, the heat energy received by the heat dissipation structure 1 from the modulator body 2 can be diverted to the shell 3, and then dissipated through the shell 3.

[0069] According to the embodiments of this disclosure, by making the lower end 12 of the heat dissipation structure 1 in close contact with the ground-to-ground electrode of the modulator body 2, the heat generated by the ground-to-ground electrode can be guided to the heat dissipation structure 1 for heat dissipation. Then, by making the upper end 11 of the heat dissipation structure 1 in close contact with the shell 3, the heat in the heat dissipation structure 1 can be guided to the shell 3 for heat dissipation through the shell 3. Since diamond is selected as the material of the heat dissipation structure, the heat dissipation capacity of the heat dissipation structure itself is enhanced. Furthermore, since the heat generated by the modulator body 2 is dissipated through the heat dissipation structure 1 and the shell 3, the heat dissipation capacity of the Mach-Zehnder modulator is improved, so that the heat of the modulator meets the requirements, the impact of heat generated by the propagation of high-frequency signals in the metal electrodes on the modulator performance is reduced, and the bandwidth limitation of the modulator during operation is alleviated.

[0070] According to embodiments of this disclosure, the ground-to-communication-to-ground electrode can be a GSG electrode.

[0071] According to an embodiment of this disclosure, the heat dissipation structure 1 can be fixed inside the casing cover 31.

[0072] According to embodiments of this disclosure, the heat dissipation structure 1 may be composed of an upper end 11, a middle section, and a lower end 12, wherein the middle section may include a main body 131 and a heat sink 132. The upper end 11, the main body 131, the heat sink 132, and the lower end 12 are connected to each other. Heat from the ground-to-signal-to-ground electrode can be conducted through the lower end 12 to the main body 131 and the heat sink 132 in the middle section for heat dissipation through the heat sink 132, and then the heat is conducted through the main body 131 and the heat sink 132 to the upper end 11 for heat dissipation through the upper end 11.

[0073] According to an embodiment of this disclosure, the lower end 12 of the heat dissipation structure 1 that contacts the ground-signal-ground electrode is a combination of two H-shaped structures, and the two H-shaped structures are in close contact with the signal electrode 22 and the ground electrode 21 of the ground-signal-ground electrode, respectively.

[0074] According to embodiments of this disclosure, by designing the heat dissipation structure 1 as a combination of two H-shaped structures to correspond to the shape of the aforementioned ground-signal-ground electrode, the heat generated by the ground-signal-ground electrode can be directed to the heat dissipation structure 1 to the maximum extent, thereby improving the heat dissipation capacity of the modulator.

[0075] According to an embodiment of this disclosure, the length of the lower end 12 of the heat dissipation structure 1 that contacts the ground-to-signal-to-ground electrode is greater than or equal to 2 / 3 of the electrode length;

[0076] The width of the lower end 121 of the heat dissipation structure 1 that contacts the signal electrode 22 is greater than or equal to 4 / 5 of the width of the signal electrode 22;

[0077] The lower end of the heat dissipation structure 1 that contacts the signal electrode 22 is located at the center of the signal electrode 22;

[0078] The width of the lower end of the heat dissipation structure 1 that contacts the ground electrode 21 is greater than or equal to 1 / 2 of the width of the ground electrode 21.

[0079] According to the embodiments of this disclosure, by making the width of the lower end 121 of the heat dissipation structure 1 in contact with the signal electrode 22 greater than or equal to 4 / 5 of the width of the signal electrode 22, and by making the width of the lower end 122 of the heat dissipation structure 1 in contact with the ground electrode 21 greater than or equal to 1 / 2 of the width of the ground electrode 21, the effective contact area between the heat dissipation structure 1 and the ground-signal-ground electrode can be guaranteed, thereby ensuring the heat conduction effect of the heat dissipation structure 1.

[0080] According to the embodiments of this disclosure, since the heat generation of the signal electrode 22 is more severe than that of the ground electrode 21, the lower end 121 of the heat dissipation structure 1 that contacts the signal electrode 22 is located at the center of the signal electrode 22, which can provide targeted heat dissipation to the center of the signal electrode 22.

[0081] According to the embodiments of this disclosure, by making the width of the lower end 121 of the heat dissipation structure 1 in contact with the signal electrode 22 greater than or equal to 4 / 5 of the width of the signal electrode 22, and by setting the lower end 121 of the heat dissipation structure 1 in contact with the signal electrode 22 at the center of the signal electrode 22, and by making the width of the lower end 122 of the heat dissipation structure 1 in contact with the ground electrode 21 greater than or equal to 1 / 2 of the width of the ground electrode 21, targeted heat dissipation can be performed on the ground-signal-ground electrode, thereby increasing the heat dissipation efficiency of the heat dissipation structure 1 in dissipating heat from the modulator body 2.

[0082] According to embodiments of this disclosure, the shape of the upper end 11 of the heat dissipation structure 1 in contact with the casing 3 includes a circular expansion structure or a square expansion structure.

[0083] According to the embodiments of this disclosure, since the upper end 11 of the heat dissipation structure 1 in contact with the shell 3 is designed as a circular or square enlarged structure, the heat conduction between the heat dissipation structure 1 and the shell 3 can be increased, thereby increasing the heat dissipation performance of the modulator.

[0084] According to the embodiments of this disclosure, the above-mentioned enlarged structure is designed as a circle or a square, which can increase the adaptability of the enlarged structure to the shell 3. The shape of the upper end 11 of the heat dissipation structure 1 can be selected according to the size and shape of the shell 3.

[0085] According to an embodiment of this disclosure, the heat dissipation structure 1 has a cylindrical shaft as the main body 131, and heat dissipation fins 132 are extended on the side wall. The shape of the vertical cross section of the heat dissipation fins 132 includes a rectangle or an arc shape with a protrusion in the middle.

[0086] According to embodiments of this disclosure, by designing the heat dissipation structure 1 with a cylindrical shaft as the main body 131, it can be compatible with heat sinks 132 in different horizontal directions.

[0087] According to embodiments of this disclosure, by designing the shape of the vertical cross-section of the heat sink 132 as a rectangle or an arc protruding in the middle, the heat dissipation area of ​​the heat dissipation structure 1 can be increased, thereby enhancing the heat dissipation capability of the modulator.

[0088] According to embodiments of this disclosure, the number of heat sinks 132 can be adjusted according to the heat generation of the modulator body 2, and can be 2 or 4, etc. It should be noted that the number of heat sinks 132 can be determined according to actual needs; the above is merely an example and does not constitute a limitation of this disclosure.

[0089] According to embodiments of this disclosure, the cross-sectional shape of the upper end of the modulator body 2 that contacts the heat dissipation structure 1 includes a rectangle or a trapezoid.

[0090] According to the embodiments of this disclosure, designing the cross-section of the upper end of the modulator body 2 as rectangular or trapezoidal can help the modulator body 2 to dissipate heat. Furthermore, when the lower end 12 of the heat dissipation structure 1 is also set as rectangular or trapezoidal, the upper end of the modulator body 2 can correspond to the lower end 12 of the heat dissipation structure 1, increasing the contact area between the two and thereby improving the heat dissipation capacity of the modulator.

[0091] According to embodiments of this disclosure, since the front end of the signal electrode 22 of the modulator body 2 has a stronger heat dissipation capacity than the rear end, the cross-section of the upper end of the modulator body 2 can be designed as a trapezoid with the front end larger than the rear end to increase the heat dissipation of the front end of the signal electrode 22. When the heat dissipation structure 1 is also designed as a trapezoid with the front end larger than the rear end, it can correspond to the shape of the upper end of the modulator body 2, thereby enhancing the heat dissipation capacity.

[0092] According to embodiments of this disclosure, the cross-sectional shape of the upper end of the modulator body 2 that contacts the heat dissipation structure 1 also includes a T-shape or other shapes.

[0093] According to embodiments of this disclosure, the material of the ground-to-signal-to-ground electrode is selected from gold, and the material of the casing 3 is selected from ceramic and Kovar metal.

[0094] According to embodiments of this disclosure, by using a material with strong heat dissipation capacity, such as ceramic or Kovar metal, as the material of the casing 3, the thermal conductivity between the heat dissipation structure 1 and the casing 3 can be enhanced, thereby improving the heat dissipation capacity of the modulator and enabling the heat dissipation of the modulator to meet the requirements.

[0095] According to embodiments of this disclosure, the heat dissipation structure 1 can also be made of other materials with good heat dissipation performance.

[0096] According to embodiments of this disclosure, the materials used in the heat dissipation structure 1 are also selected from ALN and Bi2Te3.

[0097] According to an embodiment of the present disclosure, the modulator body 2 includes a modulation layer 23 and a substrate 24.

[0098] According to embodiments of this disclosure, the substrate 24 of the modulator body 2 is made of Si or SiO2.

[0099] The modulation layer 23 of the modulator body 2 is made of lithium niobate.

[0100] According to embodiments of this disclosure, lithium niobate or other materials with significant electro-optic effects are selected as the material of the modulation layer 23 to achieve the conversion of electric field signals onto optical signals.

[0101] According to embodiments of this disclosure, the substrate 24 is made of Si or SiO2 and is used to support the modulation layer 23 and the heat dissipation structure 1. Furthermore, the substrate 24 can form a waveguide structure together with the modulation layer 23.

[0102] It should be noted that the materials, dimensions, and shapes described above are merely embodiments shown in this disclosure. Those skilled in the art can make changes and adjustments as needed without compromising the inventive concept of this application.

[0103] Figure 4 A flowchart illustrating an embodiment of the packaging method according to this disclosure is shown schematically.

[0104] Figure 5 A schematic diagram illustrating the packaging process according to an embodiment of the present disclosure is shown.

[0105] like Figure 4 and Figure 5 As shown, a packaging method for a modulator applied in an embodiment of this disclosure includes:

[0106] By operating the S410, diamond is etched and cut to obtain heat dissipation structure 1.

[0107] In operation of S420, the heat dissipation structure 1 is flipped and fixed in the tube cover 31 using flip welding or fixing glue.

[0108] In operation S430, the modulator body 2 is fixedly encapsulated in the tube housing 32.

[0109] In operation S440, the tube cover 31 is placed on the tube housing 32, so that the lower end 12 of the heat dissipation structure 1 is in close contact with the ground-signal-ground electrode of the modulator body 2, and the heat dissipation structure 1 and the modulator body 2 are encapsulated in the tube housing 3.

[0110] According to the embodiments of this disclosure, the Mach-Zehnder modulator of this disclosure can be constructed by flipping and fixing the diamond heat dissipation structure 1 in the tube cover 31, fixing the modulator body 2 in the tube housing 32, and then splicing and encapsulating the tube cover 31 and the tube housing 32.

[0111] According to the embodiments of this disclosure, by making the lower end 12 of the heat dissipation structure 1 in close contact with the ground-to-ground electrode of the modulator body 2, the heat generated by the ground-to-ground electrode can be guided to the heat dissipation structure 1 for heat dissipation. Then, by making the upper end 11 of the heat dissipation structure 1 in close contact with the shell 3, the heat in the heat dissipation structure 1 can be guided to the shell 3 for heat dissipation through the shell 3. Since diamond is selected as the material of the heat dissipation structure, the heat dissipation capacity of the heat dissipation structure itself is enhanced. Furthermore, since the heat generated by the modulator body 2 is dissipated through the heat dissipation structure 1 and the shell 3, the heat dissipation capacity of the Mach-Zehnder modulator is improved, so that the heat of the modulator meets the requirements, the impact of heat generated by the propagation of high-frequency signals in the metal electrodes on the modulator performance is reduced, and the bandwidth limitation of the modulator during operation is alleviated.

[0112] It should also be noted that the directional terms mentioned in the embodiments, such as "up," "down," "front," "back," "left," and "right," are only for reference to the directions in the accompanying drawings and are not intended to limit the scope of protection of this disclosure. Throughout the drawings, the same elements are represented by the same or similar reference numerals. Conventional structures or constructions will be omitted where they may cause confusion in understanding this disclosure.

[0113] Furthermore, the shapes and dimensions of the components in the figures do not reflect actual size and proportion, but are merely illustrative of embodiments of this disclosure. Additionally, any reference numerals placed between parentheses in the claims should not be construed as limiting the scope of the claims.

[0114] Unless otherwise stated, the numerical parameters in this specification and the appended claims are approximate values ​​and can be varied according to desired characteristics derived from the content of this disclosure. Specifically, all figures used in the specification and claims to indicate composition, reaction conditions, etc., should be understood to be modified by the term "about" in all cases. Generally, this means that a specific amount may vary by ±10% in some embodiments, ±5% in some embodiments, ±1% in some embodiments, and ±0.5% in some embodiments.

[0115] Furthermore, the word "comprising" does not exclude the presence of elements or steps not listed in the claims. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements.

[0116] The use of ordinal numbers such as "first," "second," "third," etc., in the specification and claims to modify the corresponding elements does not imply that the element has any ordinal number, nor does it represent the order of one element with another element, or the order of manufacturing methods. The use of these ordinal numbers is only to enable a named element to be clearly distinguished from another element with the same name.

[0117] Furthermore, unless specifically described or required to occur in a specific order, the order of the above steps is not limited to those listed above and can be varied or rearranged according to the desired design. Moreover, the above embodiments can be used in combination with each other or with other embodiments based on design and reliability considerations; that is, technical features from different embodiments can be freely combined to form more embodiments.

[0118] It should be noted that, unless it is explicitly stated that there is a sequential order of execution between different operations, or that there is a sequential order of execution between different operations in terms of technical implementation, the execution order between multiple operations may not be significant, and multiple operations may be executed simultaneously.

[0119] Similarly, it should be understood that, in order to simplify this disclosure and aid in understanding one or more of the various aspects of the disclosure, in the foregoing description of exemplary embodiments of the disclosure, various features of the disclosure are sometimes grouped together in a single embodiment, figure, or description thereof. However, this approach to disclosure should not be construed as reflecting an intention that the claimed disclosure requires more features than are expressly recited in each claim. Rather, as reflected in the following claims, the aspects of the disclosure consist of fewer than all features of a single foregoing disclosed embodiment. Therefore, the claims following the detailed description are hereby expressly incorporated into that detailed description, wherein each claim itself is a separate embodiment of the disclosure.

[0120] The specific embodiments described above further illustrate the purpose, technical solutions, and beneficial effects of this disclosure. It should be understood that the above descriptions are merely specific embodiments of this disclosure and are not intended to limit this disclosure. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this disclosure should be included within the protection scope of this disclosure.

Claims

1. A Mach-Zehnder modulator with a heat dissipation structure, comprising: Modulator body; A heat dissipation structure, the lower end of which is in close contact with the ground-signal-ground electrode of the modulator body, wherein the material of the heat dissipation structure includes diamond; The modulator body and the heat dissipation structure are encapsulated in a housing; the upper end of the heat dissipation structure is in close contact with the housing. The shape of the upper end of the heat dissipation structure that contacts the shell includes a circular expansion structure or a square expansion structure. The lower end of the heat dissipation structure that contacts the ground-signal-ground electrode is a combination of two H-shaped structures, and the two H-shaped structures are in close contact with the signal electrode and the ground electrode of the ground-signal-ground electrode, respectively. The heat dissipation structure is based on a cylindrical shaft, with heat dissipation fins extending on the side walls. The shape of the vertical cross-section of the heat dissipation fins includes a rectangle or an arc shape with a protruding center. The length of the lower end of the heat dissipation structure that contacts the ground-to-signal-to-ground electrode is greater than or equal to 2 / 3 of the electrode length; The width of the lower end of the heat dissipation structure that contacts the signal electrode is greater than or equal to 4 / 5 of the width of the signal electrode; The lower end of the heat dissipation structure that contacts the signal electrode is located at the center of the signal electrode; The width of the lower end of the heat dissipation structure that contacts the ground electrode is greater than or equal to 1 / 2 of the width of the ground electrode.

2. The modulator according to claim 1, characterized in that, The cross-sectional shape of the upper end of the modulator body that contacts the heat dissipation structure includes a rectangle or a trapezoid.

3. The modulator according to claim 1, characterized in that, The material of the ground-to-message-to-ground electrode is selected from gold, and the material of the casing is selected from ceramics and Kovar metal.

4. The modulator according to claim 1, characterized in that, The materials used in the heat dissipation structure are also selected from ALN and Bi2Te3.

5. The modulator according to claim 1, characterized in that, The substrate material of the modulator body is selected from Si or SiO2; The modulation layer of the modulator body is made of lithium niobate.

6. A packaging method for a modulator as described in any one of claims 1 to 5, comprising: Etching and cutting diamond to obtain a heat dissipation structure; The heat dissipation structure is flipped and fixed in the tube cover using flip welding or fixing adhesive. The modulator body is fixedly encapsulated in the tube housing; The tube cover is placed on the tube housing, so that the lower end of the heat dissipation structure is in close contact with the ground-signal-ground electrode of the modulator body, and the heat dissipation structure and the modulator body are encapsulated in the tube housing.

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