inductor component

Abstract

This invention relates to an inductor component. When mounting the inductor component onto a substrate, the orientation of the inductor component relative to the substrate is stabilized. The inductor component includes a cuboid-shaped substrate and inductor wiring extending inside the substrate. The substrate has a first electrode. The first electrode is exposed to the outside of the substrate in a region from the bottom surface to the first end surface. The inductor wiring has: a first wiring portion extending parallel to the first main surface from the first end; and a via extending from the first wiring portion in a direction perpendicular to the first main surface. In the direction perpendicular to the first main surface, the layer containing the first wiring portion is designated as the first wiring layer, and the layer containing the via extending from the first wiring portion is designated as the first via layer. In this case, the maximum height dimension of the first electrode in the first wiring layer, i.e., the height of the first wiring layer, is greater than the maximum height dimension of the first electrode in the first via layer, i.e., the height of the first via layer.

Description

Technical Field

[0001] This invention relates to inductor components. Background Technology

[0002] Patent Document 1 discloses an inductor component comprising a cuboid substrate having six outer surfaces. The six outer surfaces of the substrate are a first main surface (with the largest area), a second main surface parallel to the first main surface, a first end surface perpendicular to the first main surface, a second end surface parallel to the first end surface, a bottom surface perpendicular to both the first main surface and the first end surface, and a top surface parallel to the first bottom surface. Furthermore, the inductor component includes inductor wiring. The inductor wiring is located inside the substrate. The substrate has a first electrode and a second electrode. A first end of the inductor wiring is connected to the first electrode. A second end of the inductor wiring is connected to the second electrode. The first electrode protrudes to the outside of the substrate in the region from the first end surface to the bottom surface.

[0003] Patent Document 1: Japanese Patent Application Publication No. 2012-79870

[0004] In the inductor component described in Patent Document 1, from the viewpoint of reducing stray capacitance generated between the first electrode and the inductor wiring, it is preferable that the area of ​​the first electrode exposed outside the substrate is small. On the other hand, when the area of ​​the first electrode exposed outside the substrate is small, the posture of the inductor component is unstable when it is mounted on the substrate, so there is a concern that the inductor component may be mounted on the substrate in an inclined state. Summary of the Invention

[0005] To address the aforementioned issues, the present invention provides an inductor component comprising: a cuboid-shaped substrate having six outer surfaces; and inductor wiring extending within the substrate. The substrate has a first electrode connected to a first end of the inductor wiring and a second electrode connected to a second end of the inductor wiring. When a specific surface among the six outer surfaces of the substrate is designated as a main surface, a surface perpendicular to the main surface is designated as a first end surface, a surface parallel to the first end surface is designated as a second end surface, and a surface perpendicular to both the main surface and the first end surface is designated as a bottom surface, the first electrode extends from the first end surface to the bottom surface... The area of ​​the surface is exposed to the outside of the substrate, and the second electrode is exposed to the outside of the substrate in the area from the second end face to the bottom face. The inductor wiring has: a wiring portion extending parallel to the main surface from the first end; and a via extending from the wiring portion in a direction perpendicular to the main surface. In the direction perpendicular to the main surface, when the layer containing the wiring portion is designated as the wiring layer and the layer containing the via is designated as the via layer, and when the dimension in the direction perpendicular to the bottom face is designated as the height dimension, the maximum height dimension of the first electrode in the wiring layer is larger than the maximum height dimension of the first electrode in the via layer.

[0006] According to the above structure, for example, compared to the case where the maximum height dimension of the first electrode in the wiring layer is equal to the maximum height dimension of the first electrode in the via layer, the exposed area of ​​the first electrode can be increased. Therefore, when the inductor component is mounted on a substrate, solder or the like wets and spreads on the surface of the first electrode, and the orientation of the inductor component relative to the substrate is stable.

[0007] When the inductor component is mounted on the substrate, the inductor component is in a stable position relative to the substrate. Attached Figure Description

[0008] Figure 1 This is a perspective view of the inductor component according to the first embodiment.

[0009] Figure 2 This is an exploded perspective view of the inductor component according to the first embodiment.

[0010] Figure 3 This is a diagram showing the first layer of the inductor component in the first embodiment.

[0011] Figure 4 This is a diagram showing the first end face of the substrate of the inductor component according to the first embodiment.

[0012] Figure 5 This is a diagram showing the first end face of the substrate of the inductor component according to the second embodiment.

[0013] Figure 6 This is a diagram showing the first end face of the substrate of the inductor component according to the third embodiment.

[0014] Figure 7 This is a diagram showing the first end face of the substrate of the inductor component according to the fourth embodiment.

[0015] Explanation of reference numerals in the attached figures

[0016] 10, 110, 210, 310…Inductor components; 11…Substrate; 20…Insulation portion; 30…Inductor wiring; 31…First wiring portion; 32, 34, 36, 38…Through holes; 33…Second wiring portion; 35…Third wiring portion; 37…Fourth wiring portion; 39…Fifth wiring portion; 40…First electrode; 50…Second electrode; 61…First covering insulation layer; 62…Second covering insulation layer; 71…First covering electrode; 72…Second covering electrode. Detailed Implementation

[0017] <First Implementation>

[0018] The first embodiment of the inductor component will now be described. Furthermore, the components are sometimes shown enlarged for ease of understanding in the accompanying drawings. The dimensional ratios of the components may sometimes differ from the actual values ​​or from those in other drawings.

[0019] (Regarding the overall structure)

[0020] like Figure 1 As shown, the inductor component 10 has a cuboid-shaped base 11. Additionally, as... Figure 3 As shown, the inductor component 10 includes: an inductor wiring 30 extending inside the substrate 11; a first electrode 40 connected to a first end of the inductor wiring 30; and a second electrode 50 connected to a second end of the inductor wiring 30.

[0021] like Figure 2 As shown, the inductor component 10 is constructed as a whole of multiple stacked plate-like layers. Furthermore, each layer is rectangular in shape when viewed from above. Moreover, the substrate 11 is cuboid in shape and therefore has six outer surfaces. Figure 1 As shown, a specific surface among the six outer surfaces that is parallel to the main surface of each layer is designated as the first main surface 11A. A surface parallel to the first main surface 11A is designated as the second main surface 11B. A specific surface perpendicular to the first main surface 11A is designated as the first end surface 11C. A surface parallel to the first end surface 11C is designated as the second end surface 11D. A specific surface perpendicular to both the first main surface 11A and the first end surface 11C is designated as the bottom surface 11E. A surface parallel to the bottom surface 11E is designated as the top surface 11F.

[0022] Furthermore, in the following description, the axis perpendicular to the first main surface 11A along the direction of multiple layers is designated as the first axis X. The axis perpendicular to the first end surface 11C is designated as the second axis Y. The axis perpendicular to the bottom surface 11E is designated as the third axis Z. Furthermore, the direction facing the first main surface 11A along the first axis X is designated as the first positive direction X1, and the direction opposite to the first positive direction X1 is designated as the first negative direction X2. Similarly, the direction facing the first end surface 11C along the second axis Y is designated as the second positive direction Y1, and the direction opposite to the second positive direction Y1 is designated as the second negative direction Y2. Finally, the direction facing the top surface 11F along the third axis Z is designated as the third positive direction Z1, and the direction opposite to the third positive direction Z1 is designated as the third negative direction Z2.

[0023] like Figure 2 As shown, the inductor component 10 has a first layer L1 to a ninth layer L9. The first layers L1 to the ninth layers L9 are arranged sequentially in the first negative direction X2. The thickness of the first layers L1 to the ninth layers L9, i.e., the dimension along the X-axis, is all approximately the same. Figure 3As shown, the first layer L1 is composed of a first electrode portion 41, a second electrode portion 51, a first wiring portion 31, and a first insulating portion 21.

[0024] The first electrode portion 41 is made of a conductive material such as silver. When the first layer L1 is viewed in the first negative direction X2, the first electrode portion 41 is L-shaped. When the first layer L1 is viewed in the first negative direction X2, the first electrode portion 41 is located closer to the second positive direction Y1 and closer to the third negative direction Z2 than the center of the first layer L1. That is, when the first layer L1 is viewed in the first negative direction X2, the first electrode portion 41 is located at a portion that includes the angle between the center of the first layer L1 and the second positive direction Y1 and the third negative direction Z2.

[0025] The maximum dimension of the first electrode portion 41 along the third axis Z is larger than half the dimension of the first layer L1 along the third axis Z. The maximum dimension of the first electrode portion 41 along the third axis Z is the dimension of the portion of the first electrode portion 41 extending along the first end face 11C along the third axis Z. That is, the end of the first electrode portion 41 on the third positive direction Z1 side is located closer to the third positive direction Z1 side than the center of the first layer L1 along the third axis Z. The maximum dimension of the first electrode portion 41 along the second axis Y is smaller than half the dimension of the first layer L1 along the second axis Y. The maximum dimension of the first electrode portion 41 along the second axis Y is the dimension of the portion of the first electrode portion 41 extending along the bottom surface 11E along the second axis Y. That is, the end of the first electrode portion 41 on the second negative direction Y2 side is located closer to the second positive direction Y1 side than the center of the first layer L1 along the second axis Y.

[0026] The second electrode portion 51 is made of a conductive material such as silver. When the first layer L1 is viewed in the first negative direction X2, the second electrode portion 51 is L-shaped. When the first layer L1 is viewed in the first negative direction X2, the second electrode portion 51 is located closer to the second negative direction Y2 and closer to the third negative direction Z2 than the center of the first layer L1. That is, when the first layer L1 is viewed in the first negative direction X2, the second electrode portion 51 is located in a portion including the corner that is closer to the second negative direction Y2 and closer to the third negative direction Z2 than the center of the first layer L1.

[0027] The maximum dimension of the second electrode portion 51 along the third axis Z is larger than half the dimension of the first layer L1 along the third axis Z. The maximum dimension of the second electrode portion 51 along the third axis Z is the dimension of the portion of the second electrode portion 51 extending along the second end face 11D along the third axis Z. That is, the end of the second electrode portion 51 on the third positive direction Z1 side is located closer to the third positive direction Z1 side than the center of the first layer L1 along the third axis Z. The maximum dimension of the second electrode portion 51 along the second axis Y is smaller than half the dimension of the first layer L1 along the second axis Y. The maximum dimension of the second electrode portion 51 along the second axis Y is the dimension of the portion of the second electrode portion 51 extending along the bottom surface 11E along the second axis Y. That is, the end of the second electrode portion 51 on the second positive direction Y1 side is located closer to the second negative direction Y2 side than the center of the first layer L1 along the second axis Y.

[0028] The first wiring portion 31 is made of a conductive material such as silver. When the first layer L1 is viewed in the first negative direction X2, the first wiring portion 31 extends in a spiral shape centered on the center of the first layer L1. Specifically, the first end 31A of the first wiring portion 31 is connected to the end of the first electrode portion 41 on the third positive direction Z1 side along the third axis Z. That is, the first end 31A is the first end of the inductor wiring 30. The wiring width of the first wiring portion 31 is approximately constant except for the second end 31B. The second end 31B of the first wiring portion 31 is positioned closer to the third positive direction Z1 side than the center along the third axis Z, and closer to the third negative direction Z2 side than the first end 31A. In addition, the second end 31B of the first wiring portion 31 is positioned closer to the second positive direction Y1 side than the center along the second axis Y. Moreover, when the first wiring portion 31 is viewed in the first negative direction X2, the first wiring portion 31 extends clockwise from the first end 31A toward the second end 31B.

[0029] The second end 31B of the first wiring portion 31 functions as a pad for connection with the via 32 described later. When the first layer L1 is viewed in the first negative direction X2, the second end 31B has a generally circular shape. In addition, the wiring width of the second end 31B of the first wiring portion 31 is larger than that of other parts of the first wiring portion 31.

[0030] In the first layer L1, the portion other than the first electrode portion 41, the second electrode portion 51, and the first wiring portion 31 is the first insulating portion 21. The first insulating portion 21 is made of a non-magnetic insulator such as glass, resin, or alumina.

[0031] like Figure 2As shown, the second layer L2 is stacked on the main surface of the first layer L1 facing the first negative direction X2. When viewed facing the first negative direction X2, the second layer L2 has the same rectangular shape as the first layer L1. The second layer L2 is composed of a third electrode portion 42, a fourth electrode portion 52, a through hole 32, and a second insulating portion 22.

[0032] The third electrode portion 42 is made of the same material as the first electrode portion 41. When the second layer L2 is viewed in the first negative direction X2, the third electrode portion 42 is L-shaped. When the second layer L2 is viewed in the first negative direction X2, the third electrode portion 42 is located closer to the second positive direction Y1 and closer to the third negative direction Z2 than the center of the second layer L2. That is, when the second layer L2 is viewed in the first negative direction X2, the third electrode portion 42 is located in a portion including the corner closer to the second positive direction Y1 and closer to the third negative direction Z2 than the center of the second layer L2. Therefore, the third electrode portion 42 is stacked on the surface of the first electrode portion 41 facing the first negative direction X2.

[0033] The maximum dimension of the third electrode portion 42 along the third axis Z is smaller than the dimension of the first electrode portion 41 along the third axis Z. The maximum dimension of the third electrode portion 42 along the third axis Z is the dimension of the portion of the third electrode portion 42 extending along the first end face 11C along the third axis Z. Specifically, the end of the third electrode portion 42 on the third positive direction Z1 side is located at the center of the second layer L2 along the third axis Z. The maximum dimension of the third electrode portion 42 along the second axis Y is equal to the maximum dimension of the first electrode portion 41 along the second axis Y.

[0034] The fourth electrode portion 52 is made of the same material as the second electrode portion 51. When the second layer L2 is viewed in the first negative direction X2, the fourth electrode portion 52 is L-shaped. When the second layer L2 is viewed in the first negative direction X2, the fourth electrode portion 52 is located closer to the second negative direction Y2 and closer to the third negative direction Z2 than the center of the second layer L2. That is, when the second layer L2 is viewed in the first negative direction X2, the fourth electrode portion 52 is located in a portion including the corner closer to the second negative direction Y2 and closer to the third negative direction Z2 than the center of the second layer L2. Therefore, the fourth electrode portion 52 is stacked on the surface of the second electrode portion 51 facing the first negative direction X2.

[0035] The maximum dimension of the fourth electrode portion 52 along the third axis Z is smaller than the dimension of the second electrode portion 51 along the third axis Z. The maximum dimension of the fourth electrode portion 52 along the third axis Z is the dimension of the portion of the fourth electrode portion 52 extending along the second end face 11D along the third axis Z. Specifically, the end of the fourth electrode portion 52 on the third positive direction Z1 side is located at the center of the second layer L2 along the third axis Z. The maximum dimension of the fourth electrode portion 52 along the second axis Y is equal to the maximum dimension of the second electrode portion 51 along the second axis Y.

[0036] The through-hole 32 is made of the same material as the first wiring portion 31. The through-hole 32 is cylindrical and extends along the first axis X. The through-hole 32 is stacked on the surface of the second end portion 31B of the first wiring portion 31 facing the first negative direction X2. Therefore, the through-hole 32 is electrically connected to the second end portion 31B of the first wiring portion 31. Furthermore, the through-hole 32 extends from the second end portion 31B of the first wiring portion 31 in the first negative direction X2.

[0037] In the second layer L2, the portion excluding the third electrode portion 42, the fourth electrode portion 52, and the through hole 32 is the second insulating portion 22. The second insulating portion 22 is made of the same material as the first insulating portion 21, namely a non-magnetic insulator.

[0038] The third layer L3 is stacked on the main surface of the second layer L2 facing the first negative direction X2. When viewed facing the first negative direction X2, the third layer L3 has the same rectangular shape as the first layer L1. The third layer L3 is composed of a fifth electrode part 43, a sixth electrode part 53, a second wiring part 33, and a third insulating part 23.

[0039] The fifth electrode portion 43 is made of the same material as the first electrode portion 41. When the third layer L3 is viewed towards the first negative direction X2, the fifth electrode portion 43 is L-shaped with the same dimensions as the third electrode portion 42 and is located at the same position as the third electrode portion 42. Therefore, the fifth electrode portion 43 is stacked on the surface of the third electrode portion 42 facing the first negative direction X2. Furthermore, the dimensions of the fifth electrode portion 43 are the same as those of the third electrode portion 42, so the maximum dimension of the fifth electrode portion 43 along the third axis Z is smaller than the maximum dimension of the first electrode portion 41 along the third axis Z.

[0040] The sixth electrode portion 53 is made of the same material as the second electrode portion 51. When the third layer L3 is viewed towards the first negative direction X2, the sixth electrode portion 53 is L-shaped with the same dimensions as the fourth electrode portion 52 and is located at the same position as the fourth electrode portion 52. Therefore, the sixth electrode portion 53 is stacked on the surface of the fourth electrode portion 52 facing the first negative direction X2. Furthermore, since the sixth electrode portion 53 has the same dimensions as the fourth electrode portion 52, the maximum dimension of the sixth electrode portion 53 along the third axis Z is smaller than the maximum dimension of the second electrode portion 51 along the third axis Z.

[0041] The second wiring portion 33 is made of the same material as the first wiring portion 31. When viewed towards the third layer L3 in the first negative direction X2, the second wiring portion 33 extends in a spiral shape centered on the center of the third layer L3. Specifically, the first end portion 33A of the second wiring portion 33 is located on the surface of the through hole 32 facing the first negative direction X2. Therefore, the first end portion 33A of the second wiring portion 33 is connected to the through hole 32. The wiring width of the second wiring portion 33 is approximately constant except for the first end portion 33A and the second end portion 33B. The position of the second end portion 33B of the second wiring portion 33 in the direction along the third axis Z is closer to the third negative direction Z2 than the center in the direction along the third axis Z. In addition, the position of the second end portion 33B of the second wiring portion 33 in the direction along the second axis Y is closer to the second positive direction Y1 than the center in the direction along the second axis Y, and closer to the center in the direction along the second axis Y than the position of the second end portion 31B of the first wiring portion 31 in the direction along the second axis Y. Furthermore, when the second wiring portion 33 is viewed in the first negative direction X2, the second wiring portion 33 extends clockwise from the first end 33A toward the second end 33B.

[0042] In the third layer L3, the portion other than the fifth electrode portion 43, the sixth electrode portion 53, and the second wiring portion 33 is the third insulating portion 23. The third insulating portion 23 is made of the same material as the first insulating portion 21, namely a non-magnetic insulator.

[0043] The fourth layer L4 is stacked on the main surface of the third layer L3 facing the first negative direction X2. When viewed facing the first negative direction X2, the fourth layer L4 has the same rectangular shape as the first layer L1. The fourth layer L4 is composed of a seventh electrode part 44, an eighth electrode part 54, a through hole 34, and a fourth insulating part 24.

[0044] The seventh electrode portion 44 is made of the same material as the first electrode portion 41. When the fourth layer L4 is viewed towards the first negative direction X2, the seventh electrode portion 44 is L-shaped with the same dimensions as the fifth electrode portion 43 and is located at the same position as the fifth electrode portion 43. Therefore, the seventh electrode portion 44 is stacked on the surface of the fifth electrode portion 43 facing the first negative direction X2. Furthermore, the dimensions of the seventh electrode portion 44 are the same as those of the fifth electrode portion 43, so the maximum dimension of the seventh electrode portion 44 along the third axis Z is smaller than the maximum dimension of the first electrode portion 41 along the third axis Z.

[0045] The eighth electrode portion 54 is made of the same material as the second electrode portion 51. When the fourth layer L4 is viewed towards the first negative direction X2, the eighth electrode portion 54 is L-shaped with the same dimensions as the sixth electrode portion 53 and is located at the same position as the sixth electrode portion 53. Therefore, the eighth electrode portion 54 is stacked on the surface of the sixth electrode portion 53 facing the first negative direction X2. Furthermore, since the eighth electrode portion 54 has the same dimensions as the sixth electrode portion 53, the maximum dimension of the eighth electrode portion 54 along the third axis Z is smaller than the maximum dimension of the second electrode portion 51 along the third axis Z.

[0046] The through-hole 34 is made of the same material as the first wiring portion 31. The through-hole 34 is cylindrical and extends along the first axis X. The through-hole 34 is stacked on the surface of the second end portion 33B of the second wiring portion 33 facing the first negative direction X2. Therefore, the through-hole 34 is electrically connected to the second end portion 33B of the second wiring portion 33. Furthermore, the through-hole 34 extends from the second end portion 33B of the second wiring portion 33 in the first negative direction X2.

[0047] In the fourth layer L4, the portion excluding the seventh electrode portion 44, the eighth electrode portion 54, and the through hole 34 is the fourth insulating portion 24. The fourth insulating portion 24 is made of the same material as the first insulating portion 21, namely a non-magnetic insulator.

[0048] The fifth layer L5 is stacked on the main surface of the fourth layer L4 facing the first negative direction X2. When viewed facing the first negative direction X2, the fifth layer L5 has the same rectangular shape as the first layer L1. The fifth layer L5 is composed of the ninth electrode part 45, the tenth electrode part 55, the third wiring part 35, and the fifth insulation part 25.

[0049] The ninth electrode portion 45 is made of the same material as the first electrode portion 41. When the fifth layer L5 is viewed towards the first negative direction X2, the ninth electrode portion 45 is L-shaped with the same dimensions as the seventh electrode portion 44 and is located at the same position as the seventh electrode portion 44. Therefore, the ninth electrode portion 45 is stacked on the surface of the seventh electrode portion 44 facing the first negative direction X2. Furthermore, the dimensions of the ninth electrode portion 45 are the same as those of the seventh electrode portion 44, so the maximum dimension of the ninth electrode portion 45 along the third axis Z is smaller than the maximum dimension of the first electrode portion 41 along the third axis Z.

[0050] The tenth electrode portion 55 is made of the same material as the second electrode portion 51. When the fifth layer L5 is viewed towards the first negative direction X2, the tenth electrode portion 55 is L-shaped with the same dimensions as the eighth electrode portion 54 and is located at the same position as the eighth electrode portion 54. Therefore, the tenth electrode portion 55 is stacked on the surface of the eighth electrode portion 54 facing the first negative direction X2. Furthermore, since the tenth electrode portion 55 has the same dimensions as the eighth electrode portion 54, the maximum dimension of the tenth electrode portion 55 along the third axis Z is smaller than the maximum dimension of the second electrode portion 51 along the third axis Z.

[0051] The third wiring section 35 is made of the same material as the first wiring section 31. When viewed towards the fifth layer L5 in the first negative direction X2, the third wiring section 35 extends in a spiral shape centered on the center of the fifth layer L5. Specifically, the first end 35A of the third wiring section 35 is located on the surface of the through hole 34 facing the first negative direction X2. Therefore, the first end 35A of the third wiring section 35 is connected to the through hole 34. The wiring width of the third wiring section 35 is approximately constant except for the first end 35A and the second end 35B. The second end 33B of the third wiring section 35 is positioned closer to the third negative direction Z2 in the direction along the third axis Z than the center in the direction along the third axis Z. In addition, the second end 33B of the second wiring section 33 is positioned closer to the second negative direction Y2 in the direction along the second axis Y than the center in the direction along the second axis Y. Moreover, when viewed towards the first negative direction X2, the third wiring section 35 extends clockwise from the first end 35A towards the second end 35B.

[0052] In the fifth layer L5, the portion excluding the ninth electrode section 45, the tenth electrode section 55, and the third wiring section 35 is the fifth insulating section 25. The fifth insulating section 25 is made of the same material as the first insulating section 21, namely a non-magnetic insulator.

[0053] The sixth layer L6 is stacked on the main surface of the fifth layer L5 facing the first negative direction X2. When viewed facing the first negative direction X2, the sixth layer L6 has the same rectangular shape as the first layer L1. The sixth layer L6 is composed of the eleventh electrode part 46, the twelfth electrode part 56, the through hole 36, and the sixth insulating part 26.

[0054] The eleventh electrode portion 46 is made of the same material as the first electrode portion 41. When the sixth layer L6 is viewed towards the first negative direction X2, the eleventh electrode portion 46 is L-shaped with the same dimensions as the ninth electrode portion 45 and is located at the same position as the ninth electrode portion 45. Therefore, the eleventh electrode portion 46 is stacked on the surface of the ninth electrode portion 45 facing the first negative direction X2. Furthermore, the dimensions of the eleventh electrode portion 46 are the same as those of the ninth electrode portion 45, so the maximum dimension of the eleventh electrode portion 46 along the third axis Z is smaller than the maximum dimension of the first electrode portion 41 along the third axis Z.

[0055] The twelfth electrode portion 56 is made of the same material as the second electrode portion 51. When the sixth layer L6 is viewed towards the first negative direction X2, the twelfth electrode portion 56 is L-shaped with the same dimensions as the tenth electrode portion 55 and is located at the same position as the tenth electrode portion 55. Therefore, the twelfth electrode portion 56 is stacked on the surface of the tenth electrode portion 55 facing the first negative direction X2. Furthermore, the dimensions of the twelfth electrode portion 56 are the same as those of the tenth electrode portion 55, so the dimension of the twelfth electrode portion 56 along the third axis Z is smaller than the dimension of the second electrode portion 51 along the third axis Z.

[0056] The through-hole 36 is made of the same material as the first wiring portion 31. The through-hole 36 is cylindrical and extends along the first axis X. The through-hole 36 is stacked on the surface of the second end portion 35B of the third wiring portion 35 facing the first negative direction X2. Therefore, the through-hole 36 is electrically connected to the second end portion 35B of the third wiring portion 35. Furthermore, the through-hole 36 extends from the second end portion 35B of the third wiring portion 35 in the first negative direction X2.

[0057] In the sixth layer L6, the portion excluding the eleventh electrode portion 46, the twelfth electrode portion 56, and the through hole 36 is the sixth insulating portion 26. The sixth insulating portion 26 is made of the same material as the first insulating portion 21, namely a non-magnetic insulator.

[0058] The seventh layer L7 is stacked on the main surface of the sixth layer L6 facing the first negative direction X2. When viewed facing the first negative direction X2, the seventh layer L7 has the same rectangular shape as the first layer L1. The seventh layer L7 is composed of the thirteenth electrode part 47, the fourteenth electrode part 57, the fourth wiring part 37, and the seventh insulation part 27.

[0059] The thirteenth electrode portion 47 is made of the same material as the first electrode portion 41. When the seventh layer L7 is viewed towards the first negative direction X2, the thirteenth electrode portion 47 is L-shaped with the same dimensions as the eleventh electrode portion 46 and is located at the same position as the eleventh electrode portion 46. Therefore, the thirteenth electrode portion 47 is stacked on the surface of the eleventh electrode portion 46 facing the first negative direction X2. Furthermore, the dimensions of the thirteenth electrode portion 47 are the same as those of the eleventh electrode portion 46, so the maximum dimension of the thirteenth electrode portion 47 along the third axis Z is smaller than the maximum dimension of the first electrode portion 41 along the third axis Z.

[0060] The fourteenth electrode portion 57 is made of the same material as the second electrode portion 51. When the seventh layer L7 is viewed towards the first negative direction X2, the fourteenth electrode portion 57 is L-shaped with the same dimensions as the twelfth electrode portion 56 and is located at the same position as the twelfth electrode portion 56. Therefore, the fourteenth electrode portion 57 is stacked on the surface of the twelfth electrode portion 56 facing the first negative direction X2. Furthermore, since the dimensions of the fourteenth electrode portion 57 are the same as those of the twelfth electrode portion 56, the maximum dimension of the fourteenth electrode portion 57 along the third axis Z is smaller than the maximum dimension of the second electrode portion 51 along the third axis Z.

[0061] The fourth wiring section 37 is made of the same material as the first wiring section 31. When viewed towards the seventh layer L7 in the first negative direction X2, the fourth wiring section 37 extends in a spiral shape centered on the center of the seventh layer L7. Specifically, the first end 37A of the fourth wiring section 37 is located on the surface of the through hole 36 facing the first negative direction X2. Therefore, the first end 37A of the fourth wiring section 37 is connected to the through hole 36. The wiring width of the fourth wiring section 37 is approximately constant except for the first end 37A and the second end 37B. The second end 37B of the fourth wiring section 37 is positioned closer to the third positive direction Z1 than the center in the direction along the third axis Z. In addition, the second end 37B of the fourth wiring section 37 is positioned closer to the second negative direction Y2 than the center in the direction along the second axis Y, and also closer to the second negative direction Y2 than the first end 37A in the direction along the second axis Y. Furthermore, when viewed in the first negative direction X2, the fourth wiring portion 37 extends clockwise from the first end 37A toward the second end 37B. In addition, the fourth wiring portion 37 and the second wiring portion 33 are rotationally symmetrical about an axis along the third axis Z that passes through the center of the extension direction of the inductor wiring 30.

[0062] In the seventh layer L7, the portion excluding the thirteenth electrode section 47, the fourteenth electrode section 57, and the fourth wiring section 37 is the seventh insulating section 27. The seventh insulating section 27 is made of the same material as the first insulating section 21, namely a non-magnetic insulator.

[0063] The eighth layer L8 is stacked on the main surface of the seventh layer L7 facing the first negative direction X2. When viewed facing the first negative direction X2, the eighth layer L8 has the same rectangular shape as the first layer L1. The eighth layer L8 is composed of the fifteenth electrode part 48, the sixteenth electrode part 58, the through hole 38, and the eighth insulating part 28.

[0064] The fifteenth electrode portion 48 is made of the same material as the first electrode portion 41. When the eighth layer L8 is viewed towards the first negative direction X2, the fifteenth electrode portion 48 is L-shaped with the same dimensions as the thirteenth electrode portion 47 and is located at the same position as the thirteenth electrode portion 47. Therefore, the fifteenth electrode portion 48 is stacked on the surface of the thirteenth electrode portion 47 facing the first negative direction X2. Furthermore, since the dimensions of the fifteenth electrode portion 48 are the same as those of the thirteenth electrode portion 47, the maximum dimension of the fifteenth electrode portion 48 along the third axis Z is smaller than the maximum dimension of the first electrode portion 41 along the third axis Z.

[0065] The sixteenth electrode portion 58 is made of the same material as the second electrode portion 51. When the eighth layer L8 is viewed towards the first negative direction X2, the sixteenth electrode portion 58 is L-shaped with the same dimensions as the fourteenth electrode portion 57 and is located at the same position as the fourteenth electrode portion 57. Therefore, the sixteenth electrode portion 58 is stacked on the surface of the fourteenth electrode portion 57 facing the first negative direction X2. Furthermore, since the dimensions of the sixteenth electrode portion 58 are the same as those of the fourteenth electrode portion 57, the maximum dimension of the sixteenth electrode portion 58 along the third axis Z is smaller than the maximum dimension of the second electrode portion 51 along the third axis Z.

[0066] The via 38 is made of the same material as the first wiring portion 31. The via 38 is cylindrical and extends along the first axis X. The via 38 is stacked on the surface of the second end portion 37B of the fourth wiring portion 37 facing the first negative direction X2. Therefore, the via 38 is electrically connected to the second end portion 37B of the fourth wiring portion 37. Furthermore, the via 38 extends from the second end portion 37B of the fourth wiring portion 37 in the first negative direction X2.

[0067] In the eighth layer L8, the portion excluding the fifteenth electrode section 48, the sixteenth electrode section 58, and the through hole 38 is the eighth insulating section 28. The eighth insulating section 28 is made of the same material as the first insulating section 21, namely a non-magnetic insulator.

[0068] The ninth layer L9 is stacked on the main surface of the eighth layer L8 facing the first negative direction X2. When viewed facing the first negative direction X2, the ninth layer L9 has the same rectangular shape as the first layer L1. The ninth layer L9 is composed of the seventeenth electrode part 49, the eighteenth electrode part 59, the fifth wiring part 39, and the ninth insulating part 29.

[0069] The seventeenth electrode portion 49 is made of the same material as the first electrode portion 41. When the ninth layer L9 is viewed in the first negative direction X2, the seventeenth electrode portion 49 is L-shaped with the same size as the first electrode portion 41 and is located in the same position as the first electrode portion 41. Therefore, the seventeenth electrode portion 49 is stacked on the surface of the fifteenth electrode portion 48 facing the first negative direction X2.

[0070] The eighteenth electrode portion 59 is made of the same material as the second electrode portion 51. When the ninth layer L9 is viewed in the first negative direction X2, the eighteenth electrode portion 59 is L-shaped with the same size as the second electrode portion 51 and is located in the same position as the second electrode portion 51. Therefore, the eighteenth electrode portion 59 is stacked on the surface of the sixteenth electrode portion 58 facing the first negative direction X2.

[0071] The fifth wiring section 39 is made of the same material as the first wiring section 31. When viewed towards the ninth layer L9 in the first negative direction X2, the fifth wiring section 39 extends in a spiral shape centered on the center of the ninth layer L9. Specifically, the first end 39A of the fifth wiring section 39 is located on the surface of the via 38 facing the first negative direction X2. Therefore, the first end 39A of the fifth wiring section 39 is connected to the via 38. The wiring width of the fifth wiring section 39 is approximately constant except for the first end 39A. The second end 39B of the fifth wiring section 39 is connected to the end of the eighteenth electrode section 59 on the third positive direction Z1 side along the third axis Z. Moreover, when viewed towards the first negative direction X2, the fifth wiring section 39 extends clockwise from the first end 39A towards the second end 39B. Furthermore, the second end 39B of the fifth wiring section 39 is the second end of the inductor wiring 30. Furthermore, the fifth wiring section 39 and the first wiring section 31 are rotationally symmetrical about an axis along the third axis Z that passes through the center of the extension direction of the inductor wiring 30.

[0072] In the ninth layer L9, the portion excluding the seventeenth electrode section 49, the eighteenth electrode section 59, and the fifth wiring section 39 is the ninth insulating section 29. The ninth insulating section 29 is made of the same material as the first insulating section 21, namely an insulator.

[0073] The substrate 11 has a first insulating layer 61 and a second insulating layer 62. When viewed towards the first negative direction X2, the first insulating layer 61 has the same rectangular shape as the first layer L1. The first insulating layer 61 is stacked on the main surface of the first layer L1 facing the first positive direction X1. When viewed towards the first positive direction X1, the second insulating layer 62 has the same rectangular shape as the first layer L1. The second insulating layer 62 is stacked on the main surface of the ninth layer L9 facing the first negative direction X2.

[0074] The colors of the first insulating layer 61 and the second insulating layer 62 are different from those of the first insulating portion 21 to the ninth insulating portion 29. For example, the first insulating layer 61 and the second insulating layer 62 contain pigments such as blue and black. As a result, the orientation of the inductor component 10 can be determined from the outer surface of the substrate 11.

[0075] The first insulating portion 21 to the ninth insulating portion 29, the first covering insulating layer 61, and the second covering insulating layer 62 described above are integrated. Hereinafter, they will be collectively referred to as insulating portion 20 unless there is a need to distinguish them.

[0076] Furthermore, the first wiring section 31, the second wiring section 33, the third wiring section 35, the fourth wiring section 37, the fifth wiring section 39, the through hole 32, the through hole 34, the through hole 36, and the through hole 38 are integrated into one unit. Hereinafter, without distinction, they will be collectively referred to as the inductor wiring 30. Moreover, the inductor wiring 30 is generally spirally wound. Furthermore, the central axis of the inductor wiring 30 when wound is an axis extending along the first axis X.

[0077] Furthermore, the aforementioned first electrode section 41, third electrode section 42, fifth electrode section 43, seventh electrode section 44, ninth electrode section 45, eleventh electrode section 46, thirteenth electrode section 47, fifteenth electrode section 48, and seventeenth electrode section 49 are integrated into one unit. Moreover, they are combined together to form the first electrode 40.

[0078] Similarly, the aforementioned second electrode section 51, fourth electrode section 52, sixth electrode section 53, eighth electrode section 54, tenth electrode section 55, twelfth electrode section 56, fourteenth electrode section 57, sixteenth electrode section 58, and eighteenth electrode section 59 are integrated into one unit. Furthermore, they are combined together to form the second electrode 50.

[0079] Furthermore, in this embodiment, the base 11 of the inductor component 10 is composed of an insulating portion 20, a first electrode 40, and a second electrode 50. Moreover, the inductor wiring 30 extends inside the base 11. Additionally, the inductor wiring 30, the first electrode 40, and the second electrode 50 can also be integrated. That is, there may be no physical boundary between the inductor wiring 30 and the first electrode 40.

[0080] The result of stacking the first layer L1 to the ninth layer L9, the first covering insulation layer 61, and the second covering insulation layer 62 is as follows: Figure 1 As shown, the substrate 11 is rectangular in shape. Figure 3 As shown, the first electrode 40 is exposed to the outside of the substrate 11 in the region from the first end face 11C to the bottom face 11E. Additionally, the second electrode 50 is exposed to the outside of the substrate 11 in the region from the second end face 11D to the bottom face 11E.

[0081] like Figure 1 As shown, the inductor component 10 includes a first coated electrode 71 and a second coated electrode 72. The first coated electrode 71 covers the surface of the first electrode 40 that is exposed from the substrate 11 to the outside. Although not shown in the figure, the first coated electrode 71 has a two-layer structure consisting of a nickel plating and a tin plating.

[0082] The second coated electrode 72 covers the surface of the second electrode 50 exposed from the substrate 11. Although not shown in the figure, the second coated electrode 72 has a two-layer structure consisting of a nickel plating and a tin plating. Furthermore, in... Figure 2 The illustrations of the first coated electrode 71 and the second coated electrode 72 are omitted in the text.

[0083] (Regarding the height of the first electrode)

[0084] As described above, the first wiring portion 31 extends from the first end of the inductor wiring 30 parallel to the direction along the first main surface 11A. Furthermore, the via 32 extends from the first wiring portion 31 in a direction perpendicular to the first main surface 11A, that is, along the first axis X.

[0085] Here, as Figure 4 As shown, in the direction along the first axis X, the layer containing the first wiring portion 31, i.e., the first layer L1, is designated as the first wiring layer LW1. Additionally, the second layer L2, containing the vias 32 extending from the first wiring portion 31 in the direction along the first axis X, is designated as the first via layer LV1. Furthermore, the dimension in the direction perpendicular to the bottom surface 11E is designated as the height dimension.

[0086] Furthermore, the range of the first wiring layer LW1 along the first axis X is from the end of the first wiring portion 31 on the first positive direction X1 side to the end on the first negative direction X2 side. That is, the range of the first wiring layer LW1 along the first axis X is the same as the size of the first wiring portion 31 along the first axis X. Similarly, the range of the first via layer LV1 along the first axis X is from the end of the first wiring portion 31 on the first negative direction X2 side to the end of the second wiring portion 33 on the first positive direction X1 side. That is, the range of the first via layer LV1 along the first axis X is from the end of the via 32 on the first positive direction X1 side to the end on the first negative direction X2 side. Therefore, the range of the first via layer LV1 along the first axis X is the same as the size of the via 32 along the first axis X.

[0087] The maximum height of the first electrode 40 in the first wiring layer LW1 is defined as the first wiring layer height WH1. That is, the first wiring layer height WH1 is the dimension along the third axis Z of the portion of the first electrode portion 41 extending along the first end face 11C in the first wiring layer LW1. The maximum height of the first electrode 40 in the first via layer LV1 is defined as the first via layer height VH1. That is, the first via layer height VH1 is the dimension along the third axis Z of the portion of the third electrode portion 42 extending along the first end face 11C in the first via layer LV1. The first wiring layer height WH1 is larger than the first via layer height VH1. Furthermore, the value obtained by dividing the first wiring layer height WH1 by the first via layer height VH1 is more than 1.05 times and less than 1.95 times. Specifically, the value obtained by dividing the first wiring layer height WH1 by the first via layer height VH1 is 1.8.

[0088] In addition, such as Figure 2 As shown, the distance from the bottom surface 11E to the end of the via 32 on the third negative direction Z2 along the third axis Z is defined as the first via height D1. The first wiring layer height WH1 is greater than the first via height D1. Additionally, as... Figure 2 As shown, the height VH1 of the first via layer is smaller than the height D1 of the first via.

[0089] Here, as Figure 4As shown, the axis passing through the center of the first electrode 40 along the first axis X and parallel to the third axis Z is designated as the first axis of symmetry AX1. Furthermore, the layer symmetrical to the first wiring layer LW1 across the first axis of symmetry AX1, namely the ninth layer L9, is designated as the first symmetry layer LS1. In this case, the maximum height dimension of the first electrode 40 in the first symmetry layer LS1 is set as the first symmetry layer height SH1. Therefore, the first symmetry layer height SH1 is the dimension along the third axis Z of the portion of the seventeenth electrode portion 49 extending along the first end face 11C in the first symmetry layer LS1. The first symmetry layer height SH1 is larger than the first via layer height VH1, and also equal to the first wiring layer height WH1. That is, in this embodiment, the shape of the portion of the first electrode 40 exposed to the outside of the substrate 11 is a linearly symmetrical shape with the first axis of symmetry AX1 as the axis of symmetry.

[0090] As described above, the fifth wiring portion 39 extends from the second end of the inductor wiring 30 parallel to the direction along the first main surface 11A. Furthermore, the via 38 extends from the fifth wiring portion 39 in a direction perpendicular to the first main surface 11A, that is, along the first axis X.

[0091] like Figure 2 As shown, in the direction along the first axis X, the layer containing the fifth wiring portion 39, i.e., the ninth layer L9, is designated as the second wiring layer LW2. Additionally, the eighth layer L8, containing the via 38 extending from the fifth wiring portion 39 in the direction along the first axis X, is designated as the second via layer LV2.

[0092] At this time, the maximum height dimension of the first electrode 40 in the second wiring layer LW2 is the dimension along the third axis Z of the portion of the seventeenth electrode portion 49 extending along the first end face 11C in the second wiring layer LW2. In this embodiment, the maximum height dimension of the first electrode 40 in the second wiring layer LW2 is consistent with the height SH1 of the first symmetry layer. Moreover, the maximum height dimension of the first electrode 40 in the second wiring layer LW2 is larger than the height VH1 of the first via layer.

[0093] (Regarding the height of the second electrode)

[0094] The maximum height of the second electrode 50 in the second wiring layer LW2 is set as the second wiring layer height WH2. That is, the second wiring layer height WH2 is the dimension along the third axis Z of the portion extending along the second end face 11D of the eighteenth electrode portion 59 in the second wiring layer LW2. Furthermore, the maximum height of the second electrode 50 in the second via layer LV2 is set as the second via layer height VH2. That is, the second via layer height VH2 is the dimension along the third axis Z of the portion extending along the second end face 11D of the sixteenth electrode portion 58 in the second via layer LV2. The second wiring layer height WH2 is larger than the second via layer height VH2. Moreover, the value obtained by dividing the second wiring layer height WH2 by the second via layer height VH2 is more than 1.05 times and less than 1.95 times. Specifically, the value obtained by dividing the second wiring layer height WH2 by the second via layer height VH2 is 1.8. Furthermore, for the second wiring layer height WH2, the distance from the bottom surface 11E to the end of the third negative direction Z2 of the via 38 along the third axis Z is defined as the second via height D2. The second wiring layer height WH2 is greater than the second via height D2. Additionally, the second via layer height VH2 is smaller than the second via height D2.

[0095] Here, the axis passing through the center of the second electrode 50 along the first axis X and parallel to the third axis Z is designated as the second axis of symmetry. Furthermore, the layer located symmetrical to the second wiring layer LW2 across the second axis of symmetry, namely the first layer L1, is designated as the second symmetry layer LS2. In this case, the height dimension of the second electrode 50 in the second symmetry layer LS2, i.e., the height SH2 of the second symmetry layer, is greater than the height VH2 of the second via layer. Additionally, the height SH2 of the second symmetry layer is equal to the height WH2 of the second wiring layer. That is, in this embodiment, the shape of the portion of the second electrode 50 exposed to the outside of the substrate 11 is linearly symmetrical about the second axis of symmetry.

[0096] Furthermore, the axis parallel to the third axis Z, which is the center of the substrate 11 when viewed from the third negative direction Z2, is taken as the rotation center axis. At this time, the first electrode 40 and the second electrode 50 have a double symmetrical shape centered on the rotation center axis.

[0097] Furthermore, the maximum height dimension of the second electrode 50 in the first wiring layer LW1 is the dimension along the third axis Z of the portion of the second electrode portion 51 extending along the second end face 11D in the first wiring layer LW1. In this embodiment, the maximum height dimension of the second electrode 50 in the first wiring layer LW1 is consistent with the height SH2 of the second symmetry layer. Moreover, the maximum height dimension of the second electrode 50 in the first wiring layer LW1 is larger than the height VH2 of the second via layer.

[0098] (Regarding the height of the coated electrode)

[0099] The portion of the first coated electrode 71 located within the area where the first wiring layer LW1 exists in the direction along the first axis X, when the inductor component 10 is viewed towards the second negative direction Y2, is defined as the position corresponding to the first wiring layer LW1. In this case, the maximum height dimension of the first coated electrode 71 at the position corresponding to the first wiring layer LW1 is larger than the maximum height dimension of the first coated electrode 71 at the position corresponding to the first via layer LV1. Furthermore, the maximum height dimension of the first coated electrode 71 at the position corresponding to the first wiring layer LW1 is smaller than the maximum height dimension of the first end face 11C of the substrate 11.

[0100] The portion of the second coating electrode 72 located within the area where the second wiring layer LW2 exists in the direction along the first axis X, when the inductor component 10 is viewed in the second positive direction Y1, is defined as the position corresponding to the second wiring layer LW2. In this case, the maximum height dimension of the second coating electrode 72 at the position corresponding to the second wiring layer LW2 is larger than the maximum height dimension of the second coating electrode 72 at the position corresponding to the second via layer LV2. Furthermore, the maximum height dimension of the second coating electrode 72 at the position corresponding to the second wiring layer LW2 is smaller than the maximum height dimension of the second end face 11D of the substrate 11.

[0101] Assume that the first electrode portion 41 and the seventeenth electrode portion 49 have the same shape as the third electrode portion 42, and the second electrode portion 51 and the eighteenth electrode portion 59 have the same shape as the fourth electrode portion 52. That is, the first electrode 40 and the second electrode 50 are formed by bending a rectangular plate into a right-angled L-shape. In this case, the height dimension of the first electrode 40 is the same and is independent of its position along the first axis X. Moreover, if the height dimension of the first electrode 40 is small, the area of ​​the first electrode 40 exposed outside the substrate 11 becomes smaller. In this case, when the inductor component 10 is mounted on the substrate, the amount of solder attached to the first electrode 40 becomes less, or the solder is only partially attached to the first electrode 40. As a result, the posture of the inductor component 10 relative to the substrate is unstable, and therefore the inductor component 10 is mounted on the substrate in an inclined state. The same applies to the second electrode 50.

[0102] (Regarding the effects of the first embodiment)

[0103] According to the first embodiment described above, the following effects are achieved. Furthermore, the effects common to both the first electrode 40 and the second electrode 50 will be explained using the first electrode 40 as an example, and the description of the second electrode 50 will be omitted.

[0104] (1-1) According to the first embodiment described above, the height WH1 of the first wiring layer is greater than the height VH1 of the first via layer. Therefore, for example, compared to the case where the height WH1 of the first wiring layer is equal to the height VH1 of the first via layer, the area of ​​the first electrode 40 exposed outside the substrate 11 can be increased. Therefore, when the inductor component 10 is mounted on a substrate or the like, solder or the like wets and spreads on the surface of the first electrode 40, thereby stabilizing the posture of the inductor component 10 relative to the substrate.

[0105] (1-2) According to the first embodiment described above, the height VH1 of the first via layer is smaller than the height WH1 of the first wiring layer. Therefore, for example, compared to the case where the height VH1 of the first via layer is the same as the height WH1 of the first wiring layer, the stray capacitance generated between the first electrode 40 and the via 32 in the first via layer LV1 can be reduced.

[0106] (1-3) According to the first embodiment described above, the height VH1 of the first via layer is smaller than the height D1 of the first via. Therefore, when the inductor component 10 is viewed in the second negative direction Y2, the first electrode 40 does not overlap with the via 32. Therefore, the stray capacitance generated between the first electrode 40 and the via 32 can be reduced.

[0107] (1-4) According to the first embodiment described above, the height SH1 of the first symmetry layer is greater than the height VH1 of the first via layer. That is, the height dimensions of the first electrode 40 in the first wiring layer LW1 and the first electrode 40 in the first symmetry layer LS1, which are symmetrically positioned, are both greater than the height VH1 of the first via layer. In other words, at positions symmetrically positioned across the first axis of symmetry AX1, there are portions of the first electrode 40 that are significantly exposed to the outside of the substrate 11. Therefore, the inductor component 10 can be securely fixed to the substrate at portions on both sides of the first axis of symmetry AX1.

[0108] (1-5) According to the first embodiment described above, the height SH1 of the first symmetry layer is equal to the height VH1 of the first via layer. Therefore, in the portions on both sides separated by the first axis of symmetry AX1, the inductor component 10 can be easily and firmly fixed relative to the substrate to the same degree. In addition, by making the height dimension of the first electrode 40 consistent on both sides separated by the first axis of symmetry AX1, the amount of solder is uniform on the first positive direction X1 side and the first negative direction X2 side, which helps to stabilize the posture of the inductor component 10.

[0109] (1-6) According to the first embodiment described above, the value obtained by dividing the height of the first wiring layer WH1 by the height of the first via layer VH1 is more than 1.05 times and less than 1.95 times. Since the height of the first wiring layer WH1 is more than 5% greater than the height of the first via layer VH1, the area of ​​the first electrode 40 exposed to the outside of the substrate 11 in the first wiring layer LW1 can be further ensured. In addition, since the height of the first wiring layer WH1 is not greater than 95% of the height of the first via layer VH1, the area of ​​the first electrode 40 exposed to the outside of the substrate 11 in the first via layer LV1 does not need to be excessively reduced.

[0110] (1-7) According to the first embodiment described above, the first electrode 40 and the second electrode 50 are double-symmetrical shapes centered on an axis that is parallel to the third axis Z when the substrate 11 is viewed from the center of the substrate 11 in the third negative direction Z2. Therefore, when the inductor component 10 is mounted on the substrate, the tilt of the first electrode 40 side and the second electrode 50 side can be suppressed when viewed from the rotation center axis.

[0111] (1-8) According to the first embodiment described above, the maximum height dimension of the first electrode 40 in the second wiring layer LW2 is larger than the height VH1 of the first via layer. That is, the maximum height dimension of the first electrode 40 in both the first wiring layer LW1 and the second wiring layer LW2, located at both ends along the first axis X, is larger than the height VH1 of the first via layer. On both sides of the first via layer LV1, there are portions of the first electrode 40 that are significantly exposed outside the substrate 11. Therefore, the inductor component 10 can be firmly fixed relative to the substrate in portions on both sides of the first axis of symmetry AX1.

[0112] (1-9) According to the first embodiment described above, the maximum height dimension of the first covering electrode 71 at the position corresponding to the first wiring layer LW1 is larger than the maximum height dimension of the first covering electrode 71 at the position corresponding to the first via layer LV1. Therefore, even if the first covering electrode 71 covers the first electrode 40, the posture of the inductor component 10 relative to the substrate is stable when the inductor component 10 is mounted on the substrate or the like.

[0113] (1-10) According to the first embodiment described above, the maximum height dimension of the first covering electrode 71 at the position corresponding to the first wiring layer LW1 is smaller than the maximum height dimension of the first end face 11C of the substrate 11. Therefore, the first covering electrode 71 does not reach the top surface 11F. Consequently, leakage current from the first covering electrode 71 to the top surface 11F side can be prevented in the inductor component 10. For example, when the inductor component 10 is mounted on a substrate or the like, short circuits with components disposed on the top surface 11F side of the inductor component 10 can be prevented.

[0114] <Second Implementation>

[0115] Hereinafter, a second embodiment of the inductor component will be described with reference to the accompanying drawings. The inductor component 110 of the second embodiment differs from the inductor component 10 of the first embodiment in the shape of the portion of the first electrode 40 exposed to the outside of the substrate 11. Furthermore, the following description will focus on the points that differ from the inductor component 10 of the first embodiment, and will simplify or omit descriptions of points that are identical.

[0116] like Figure 5 As shown, in the inductor wiring 30 of the inductor component 110, compared to the first embodiment, the position of the first wiring layer LW1 in the direction along the first axis X is different. More specifically, compared to the inductor wiring 30 of the first embodiment, the first wiring layer LW1 is located on the central side in the direction along the first axis X. Similarly, in the inductor wiring 30 of the inductor component 110, compared to the first embodiment, the position of the first symmetry layer LS1 in the direction along the first axis X is different. More specifically, compared to the inductor wiring 30 of the first embodiment, the first symmetry layer LS1 is located on the central side in the direction along the first axis X. Furthermore, although the figures are omitted, the inductor wiring 30 of the second embodiment has fewer windings compared to the inductor wiring 30 of the first embodiment. Therefore, compared to the first embodiment, the positions of the first wiring layer LW1 and the first symmetry layer LS1 are closer to the center in the direction along the first axis X.

[0117] Furthermore, when viewed from the first wiring layer LW1 along the first axis X, the end of the first electrode 40 on the first main surface 11A side is located on the first main surface 11A side. Additionally, when viewed from the first symmetry layer LS1 along the first axis X, the end of the first electrode 40 on the second main surface 11B side is located on the second main surface 11B side. That is, the dimension of the first electrode 40 along the first axis X is larger than the distance from the end of the first wiring layer LW1 on the first main surface 11A side to the end of the first symmetry layer LS1 on the second main surface 11B side. Furthermore, the second electrode 50 also has the same structure as the first electrode 40.

[0118] (Regarding the effects of the second embodiment)

[0119] According to the second embodiment described above, in addition to the effects of (1-1) to (1-10) of the first embodiment, the following effects are also achieved.

[0120] (2-1) According to the second embodiment described above, compared to the case where the end of the first main surface 11A side of the first electrode 40 is consistent with the end of the first main surface 11A side of the first wiring layer LW1, the dimension of the first electrode 40 along the first axis X can be increased. Therefore, it is easy to increase the area of ​​the first electrode 40 exposed to the outside of the substrate 11.

[0121] <Third Implementation Method>

[0122] Hereinafter, a third embodiment of the inductor component will be described with reference to the accompanying drawings. The inductor component 210 of the third embodiment differs from the inductor component 10 of the first embodiment in that the first symmetry layer height SH1 and the second symmetry layer height SH2 are [not specified]. Furthermore, the following description will focus on the points that differ from the inductor component 10 of the first embodiment, and will simplify or omit descriptions of points that are identical.

[0123] like Figure 6 As shown, the height SH1 of the first symmetry layer is smaller than the height WH1 of the first wiring layer. Specifically, the seventeenth electrode portion 49 has the same size and the same L-shape as the third electrode portion 42. Therefore, the height dimensions of the first electrode 40 are all the same except for the first wiring layer LW1. Consequently, the maximum height dimension of the first electrode 40 in the portion excluding the first wiring layer LW1 is smaller than the height WH1 of the first wiring layer. Similarly, for the second electrode 50, the maximum height dimension of the second electrode 50 in the portion excluding the second wiring layer LW2 is smaller than the height WH2 of the second wiring layer.

[0124] (Regarding the effects of the third embodiment)

[0125] According to the third embodiment described above, in addition to the effects of (1-1) to (1-3) and (1-6) to (1-10) of the first embodiment, the following effects are also achieved.

[0126] (3-1) According to the third embodiment described above, regarding the first electrode 40, the area of ​​the first electrode 40 exposed to the outside of the substrate 11 in the portion other than the first wiring layer LW1 is relatively small. Therefore, the stray capacitance generated between the inductor wiring 30 and the first electrode 40 can be reduced.

[0127] <Other Implementation Methods>

[0128] The above-described embodiments can be modified as follows. The above-described embodiments and the following modifications can be combined and implemented within the scope of technical non-contradiction. Furthermore, the common points of the first electrode 40 and the second electrode 50 will be described using the first electrode 40 as an example, and the description of the second electrode 50 will be omitted.

[0129] • The thicknesses of layers L1 through L9, i.e., the dimensions along the X-axis, may not all be the same. Alternatively, all layers may have different thicknesses, or some layers may have different thicknesses than the others.

[0130] The base 11 can be a cuboid that is longer along the first axis X, or it can be a cuboid that is longer along the third axis Z. Alternatively, the base 11 can be a cuboid whose dimensions along the first axis X, the second axis Y, and the third axis Z are equal. For example, regarding the dimensions of the base 11 along each axis, the dimensions along the first axis X and the third axis Z can be equal, and the dimensions along the second axis Y can be larger than the dimensions along the first axis X. Alternatively, for example, regarding the dimensions of the base 11 along each axis, the dimensions along the second axis Y can be larger than the dimensions along the third axis Z, and the dimensions along the third axis Z can be larger than the dimensions along the first axis X. Alternatively, for example, the dimensions along the second axis Y can be larger than the dimensions along the first axis X, and the dimensions along the first axis X can be larger than the dimensions along the third axis Z.

[0131] The material of the insulating part 20 is not limited to the examples of the above embodiments; it can be any insulator. For example, the material of the insulating part 20 can also be a magnetic insulator. In addition, a part of the insulating part 20 can be an insulator different from the other parts.

[0132] The size of the first coated electrode 71 is not limited to the examples of the above embodiments. For example, the maximum height of the first coated electrode 71 may be larger than the maximum height of the first electrode 40. In addition, the maximum height of the first coated electrode 71 may be larger than the height of the first end face 11C of the substrate 11.

[0133] • The first coating electrode 71 and the second coating electrode 72 can be omitted. Furthermore, when the first coating electrode 71 is plated relative to the first electrode 40, it sometimes extends to the top surface 11F during its formation. From the viewpoint of preventing this, it is preferable that the height WH1 of the first wiring layer is at least 5 μm smaller than the height of the substrate 11.

[0134] The value obtained by dividing the first wiring layer height WH1 by the first via layer height VH1 can be greater than 1 and less than 1.05, or greater than 1.95. Furthermore, it is preferable that the value obtained by dividing the first wiring layer height WH1 by the first via layer height VH1 is 1.10 or more and 1.90 or less. More preferably, the value obtained by dividing the first wiring layer height WH1 by the first via layer height VH1 is 1.20 or more and 1.80 or less.

[0135] • The second and third embodiments can also be combined. That is, in Figure 7 In the inductor component 310 shown, the height of the first electrode 40 in the portion other than the first wiring layer LW1 is a constant height less than the height WH1 of the first wiring layer. Furthermore, in this modified inductor component 310, when viewed from the end of the first electrode 40 on the first positive direction X1 side, the first wiring layer LW1 is located on the first negative direction X2 side.

[0136] Regarding the height of the first electrode 40, as long as the height WH1 of the first wiring layer is greater than the height VH1 of the first via layer, the heights of other parts can be appropriately changed. For example, in the first embodiment, the height of the first electrode 40 in the fourth layer L4 including via 34 and the sixth layer L6 including via 36 can also be less than the distance from the bottom surface 11E to each via.

[0137] Here, when the inductor wiring 30 has multiple vias, the shortest distance is the distance from the bottom surface 11E to the via closest to the bottom surface 11E in the direction along the third axis Z. In this case, the height of the first electrode 40 in any part other than the first wiring layer LW1 can also be equal to the height VH1 of the first via layer at any location, and the height VH1 of the first via layer is smaller than the aforementioned shortest distance. In these cases, when the inductor component 10 is viewed towards the second negative direction Y2, the first electrode 40 does not overlap with any via. Therefore, the stray capacitance generated between the first electrode 40 and each via can be reduced.

[0138] In the first embodiment, the height SH1 of the first symmetry layer may not be equal to the height WH1 of the first wiring layer. If the height SH1 of the first symmetry layer is greater than the height VH1 of the first via layer, the area of ​​the first electrode 40 exposed to the outside of the substrate 11 on both sides of the first axis of symmetry AX1 can be increased. Alternatively, the height SH1 of the first symmetry layer may be less than or equal to the height VH1 of the first via layer.

[0139] In the first embodiment, the first symmetry layer LS1 and the second wiring layer LW2 are consistent with the ninth layer L9, but the second wiring layer LW2 may not be consistent with the first symmetry layer LS1. That is, a layer that is not located symmetrical to the first wiring layer LW1 with the first symmetry axis AX1 as the symmetry axis can also be the second wiring layer LW2.

[0140] • The height VH1 of the first via layer can also be greater than the distance from the bottom surface 11E to the via 32 along the direction of the third axis Z. This is only necessary as long as the height WH1 of the first wiring layer is greater than the height VH1 of the first via layer.

[0141] The via 32 is cylindrical in shape, but is not limited to the examples of the above embodiments. The cross-sectional shape of the via 32 can be not only approximately circular, but also approximately elliptical, approximately fan-shaped, approximately polygonal, or a combination thereof. In addition, the above-mentioned cylindrical shape includes not only shapes whose cross-sectional area and shape are constant along the third axis Z, but also shapes whose cross-sectional area and shape vary along the third axis Z, such as approximately frustum conical.

[0142] Furthermore, the ends of each wiring portion that function as pads, such as the second end 31B of the first wiring portion 31, are generally circular pads, but are not limited to this. These ends may also be generally circular, generally fan-shaped, generally polygonal, or combinations thereof.

[0143] In various embodiments, the second electrode 50 has the same structure as the first electrode 40, but the second electrode 50 is not limited to this. For example, in the first embodiment, the height SH2 of the second symmetry layer in the second electrode 50 may not be equal to the height WH2 of the second wiring layer. That is, the first electrode 40 and the second electrode 50 may not be a double symmetry shape centered on the rotation axis.

[0144] The second embodiment has fewer windings of the inductor wiring 30 compared to the first embodiment, but it is not limited to this. For example, in the second embodiment, even if the number of windings of the inductor wiring 30 is the same as in the first embodiment, the dimension of the substrate 11 along the first axis X can be larger than in the first embodiment. Furthermore, even if the size of the substrate 11 is the same, only the size of the first electrode 40 can be increased.

Claims

1. An inductor component, wherein, have: A rectangular base with six outer surfaces; and Inductor wiring extends inside the substrate. The substrate has a first electrode connected to a first end of the inductor wiring and a second electrode connected to a second end of the inductor wiring. When a specific surface among the six outer surfaces of the substrate is designated as the main surface, a surface perpendicular to the main surface is designated as the first end surface, a surface parallel to the first end surface is designated as the second end surface, a surface perpendicular to both the main surface and the first end surface is designated as the bottom surface, and a surface parallel to the bottom surface is designated as the top surface, The first electrode is exposed to the outside of the substrate in the region from the first end face to the bottom face. The second electrode is exposed to the outside of the substrate in the region from the second end face to the bottom face. The inductor wiring has: a first wiring portion extending parallel to the main surface from the first end; a second wiring portion extending parallel to the main surface from the second end; and a first through-hole extending from the first wiring portion in a direction perpendicular to the main surface, i.e., in a direction toward the second wiring portion. The layer containing the first wiring portion in a direction perpendicular to the main surface is designated as the first wiring layer; the layer containing the second wiring portion in a direction perpendicular to the main surface is designated as the second wiring layer; the layer containing the first via is designated as the via layer; and the dimension of the exposed portion of the substrate in a direction perpendicular to the bottom surface is designated as the height dimension. The maximum height dimension of the first electrode in the first wiring layer is larger than the maximum height dimension of the first electrode in the via layer. When the end of the first wiring section that is connected to the first through hole is used as a solder pad... The pad is located on the side of the substrate closer to the first end face than the center of the substrate, in a direction perpendicular to the first end face, and is located on the side of the top surface closer to the end of the first electrode in the via layer.

2. The inductor component according to claim 1, wherein, The value obtained by dividing the maximum height dimension of the first electrode in the first wiring layer by the maximum height dimension of the first electrode in the via layer is greater than 1.05 and less than 1.

95.

3. The inductor component according to claim 1 or 2, wherein, In a direction perpendicular to the main surface, the end of the first electrode on the main surface side is located closer to the main surface side than the first wiring layer.

4. The inductor component according to claim 1 or 2, wherein, When we take the axis perpendicular to the bottom surface and passing through the center of the first electrode in a direction perpendicular to the main surface as the axis of symmetry, and take the layer symmetrical to the first wiring layer across the axis of symmetry as the symmetry layer, The maximum height dimension of the first electrode in the symmetry layer is larger than the maximum height dimension of the first electrode in the via layer.

5. The inductor component according to claim 4, wherein, The maximum height dimension of the first electrode in the symmetry layer is equal to the maximum height dimension of the first electrode in the first wiring layer.

6. The inductor component according to claim 1 or 2, wherein, The maximum height dimension of the first electrode in the portion excluding the wiring layer is smaller than the maximum height dimension of the first electrode in the first wiring layer.

7. The inductor component according to claim 1 or 2, wherein, The maximum height dimension of the first electrode in the via layer is smaller than the distance from the bottom surface to the via in the direction perpendicular to the bottom surface.

8. The inductor component according to claim 1 or 2, wherein, When the via layer is used as the first via layer The inductor wiring has the following characteristics: The second through hole extends from the second wiring portion in a direction perpendicular to the main surface. When the layer containing the second via is used as the second via layer... The maximum height dimension of the second electrode in the second wiring layer is larger than the maximum height dimension of the second electrode in the second via layer.

9. The inductor component according to claim 1 or 2, wherein, When the via layer is used as the first via layer The inductor wiring has the following characteristics: The second through hole extends from the second wiring portion in a direction perpendicular to the main surface. When the layer containing the second via is used as the second via layer... The maximum height dimension of the first electrode in the second wiring layer is larger than the maximum height dimension of the first electrode in the second via layer.

10. The inductor component according to claim 1 or 2, wherein, When the axis perpendicular to the bottom surface and located at the center of the substrate as viewed from a direction perpendicular to the bottom surface, is taken as the axis of rotation... The first electrode and the second electrode have a double symmetrical shape centered on the rotation axis.

11. The inductor component according to claim 1 or 2, wherein, It also has: A first coated electrode, covering the first electrode, and located on the outer side of the outer surface of the substrate; and The second coated electrode covers the second electrode and is located on the outer side of the outer surface of the substrate. The maximum height dimension of the first cladding electrode at the location corresponding to the first wiring layer is larger than the maximum height dimension of the first cladding electrode at the location corresponding to the via layer.

12. The inductor component according to claim 11, wherein, The maximum height dimension of the first coated electrode is smaller than the maximum height dimension of the first end face.

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