A manufacturing method of a line board segmented golden finger

Abstract

The application discloses a manufacturing method of a segmented gold finger of a circuit board, which comprises the following steps: arranging a conductive layer on a substrate; etching the conductive layer to form at least two adjacent pre-gold-plated parts and wire parts connected with the two adjacent pre-gold-plated parts respectively; electroplating the pre-gold-plated parts to form gold finger parts; etching the wire parts and forming residual parts protruding from the gold finger parts; forming an anti-gold-chemical-film group on the surface of the gold finger parts and the surface of the substrate, and the residual parts are exposed outside the anti-gold-chemical-film group; soaking the residual parts in a gold-chemical solution to form a gold deposition layer on the surface of the residual parts, and the design reduces the exposed position of the surface of the gold finger parts, prevents external corrosion, and improves the durability of the gold finger parts.

Description

Technical Field

[0001] This invention relates to the field of circuit board manufacturing technology, and in particular to a method for manufacturing segmented gold fingers of a circuit board. Background Technology

[0002] In the manufacturing process of circuit boards, a conductive layer is usually set on the substrate. Etching the conductive layer will form multiple conductive pre-plated gold parts. In order to prevent the pre-plated gold parts from being corroded by external influences during subsequent use, the surface of the pre-plated gold parts needs to be electroplated with a gold plating layer to form gold fingers. During the manufacturing process, multiple adjacent pre-plated gold parts are usually connected by a wire. Powering one pre-plated gold part can power all the pre-plated gold parts. At the same time, an anti-plating film is covered on the surface of the wire to quickly plate the pre-plated gold parts with gold.

[0003] After the gold plating is completed, the conductor part needs to be removed. However, after the conductor part is removed, there will be an exposed part at the connection between the pre-plated part and the conductor part without the gold plating layer. External objects can still corrode the exposed part or even affect the pre-plated part, thus affecting the performance of the gold finger part. Summary of the Invention

[0004] This invention aims to at least solve one of the technical problems existing in the prior art. To this end, this invention proposes a method for manufacturing segmented gold fingers on circuit boards, which reduces the exposed surface area of ​​the gold fingers, prevents external corrosion, and improves the durability of the gold fingers.

[0005] A method for manufacturing segmented gold fingers of a circuit board according to a first aspect of the present invention includes: providing a conductive layer on a substrate; etching the conductive layer to form at least two adjacent pre-plated gold portions and conductive portions respectively connected to the two adjacent pre-plated gold portions; electroplating the pre-plated gold portions to form gold finger portions; etching the conductive portions to form residual portions protruding from the gold finger portions; forming a resist gold film assembly on the surface of the gold finger portions and the surface of the substrate, wherein the residual portions are exposed outside the resist gold film assembly; immersing the residual portions in a gold plating solution to form an immersion gold layer on the surface of the residual portions.

[0006] A method for manufacturing segmented gold fingers of a circuit board according to an embodiment of the present invention has at least the following beneficial effects:

[0007] The present invention discloses a method for manufacturing segmented gold fingers on a circuit board. The method involves etching a conductive portion on a substrate to form at least two adjacent pre-plated gold portions and a conductive portion. After electroplating the pre-plated gold portions to form gold fingers, the conductive portion is etched to form a residual portion protruding from the gold fingers. Then, a resist gold film is formed on the surface of the gold fingers and the surface of the substrate, exposing the residual portion outside the resist gold film. Finally, a gold plating layer is formed on the surface of the residual portion by immersion in a gold plating solution. This reduces the exposed area on the surface of the gold fingers, prevents external corrosion, and improves the durability of the gold fingers.

[0008] According to some embodiments of the present invention, the formation of a resist gold film group on the surface of the gold finger portion and the surface of the substrate, wherein the residual portion exposed in the resist gold film group includes: forming a resist gold wet film on the surface of the gold finger portion using a first resist gold plating material, wherein the outer contour of the resist gold wet film is larger than the outer contour of the gold finger portion; and forming a resist gold dry film on the outer surface of the resist gold wet film and the surface of the substrate using a second resist gold plating material, wherein the resist gold wet film and the resist gold dry film constitute at least a portion of the resist gold film group.

[0009] According to some embodiments of the present invention, the distance between the edge of the anti-metal wet film and the edge of the gold finger portion is in the range of 0.05-mm.

[0010] According to some embodiments of the present invention, the electroplating of the pre-plated gold portion to form a gold finger portion includes: forming an anti-plating gold film group on the surface of the substrate and the surface of the conductive portion; immersing the pre-plated gold portion in a gold-containing electroplating solution; energizing the pre-plated gold portion to cause gold in the gold-containing electroplating solution to precipitate and adhere to the pre-plated gold portion to form a gold plating layer, thereby forming a gold finger portion; and removing the anti-plating gold film group.

[0011] According to some embodiments of the present invention, the etching of the conductor portion and the formation of a residual portion protruding from the gold finger portion includes: forming an anti-corrosion film group on the surface of the substrate and the surface of the gold finger portion; etching the conductor portion with an etching solution to form the residual portion; and removing the anti-corrosion film group.

[0012] According to some embodiments of the present invention, the length of the residual portion protruding from the gold finger portion is between 0 and 0.1 mm.

[0013] According to some embodiments of the present invention, between the etching of the conductive portion and the formation of a residual portion protruding from the gold finger portion and the formation of a gold resist film group on the surface of the gold finger portion and the surface of the substrate, a solder resist treatment of the substrate is further included.

[0014] According to some embodiments of the present invention, the etching of the conductive layer to form at least two adjacent pre-plated gold portions and conductive portions respectively connected to the two adjacent pre-plated gold portions includes: dividing the conductive layer into a pre-plated gold portion region, a conductive portion region, and an area to be etched by patterning; covering the area to be etched with a photosensitive material; immersing the conductive layer in an electroplating solution containing an anti-corrosion material; energizing the conductive layer to cause the anti-corrosion material in the electroplating solution to precipitate and adhere to the pre-plated gold portion region and the conductive portion region of the conductive layer; exposing and developing the photosensitive material and removing the photosensitive material; etching the area to be etched in the conductive layer with an etching solution; and removing the anti-corrosion material to form the pre-plated gold portion and the conductive portion.

[0015] According to some embodiments of the present invention, the conductive layer is further divided into circuit regions by patterning; the conductive layer is energized so that the anti-corrosion material in the electroplating solution containing the anti-corrosion material is deposited and attached to the circuit regions of the conductive layer; after the anti-corrosion material is removed, a circuit region is formed that is electrically connected to the pre-plated gold portion.

[0016] According to some embodiments of the present invention, between the step of covering the area to be etched with photosensitive material and the step of immersing the conductive layer in an electroplating solution containing anti-corrosion material, the method further includes: immersing the conductive layer in an electroplating solution containing conductive material, and energizing the conductive layer so that the conductive material in the electroplating solution containing conductive material is deposited and adheres to the circuit region, the pre-plated gold region, and the conductor region of the conductive layer, wherein the conductive material is the same material as the conductive layer.

[0017] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0018] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0019] Figure 1 This is a main flowchart of one embodiment of the manufacturing method of the present invention;

[0020] Figure 2 This is a flowchart of step S200 of one embodiment of the manufacturing method of the present invention;

[0021] Figure 3 This is a flowchart of step S300 of one embodiment of the manufacturing method of the present invention;

[0022] Figure 4 This is a flowchart of step S400 of one embodiment of the manufacturing method of the present invention;

[0023] Figure 5 This is a flowchart of step S500 of one embodiment of the manufacturing method of the present invention;

[0024] Figure 6 This is a top view of the circuit board in step S500 of one embodiment of the manufacturing method of the present invention;

[0025] Figure 7 for Figure 6 A cross-sectional view of section AA of the circuit board.

[0026] Figure label:

[0027] Substrate 100; pre-plated gold portion 200; residual portion 300; immersion gold layer 400; resist gold wet film 500; resist gold dry film 600; gold plating layer 700. Detailed Implementation

[0028] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0029] In the description of this invention, it should be understood that the orientation descriptions, such as the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer", indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0030] In the description of this invention, "several" means one or more, "more than" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0031] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0032] like Figure 1 As shown, a method for manufacturing segmented gold fingers of a circuit board according to a first aspect embodiment of the present invention includes:

[0033] S100: A conductive layer is formed on the substrate 100;

[0034] S200, Etching the conductive layer to form at least two adjacent pre-plated gold portions 200 and wire portions respectively connected to the two adjacent pre-plated gold portions 200.

[0035] S300, electroplating the pre-plated gold part 200 to form a gold finger part;

[0036] S400, etching the conductor portion and forming a residual portion 300 protruding from the gold finger portion;

[0037] S500: A resist gold film group is formed on the surface of the gold finger portion and the surface of the substrate 100, and the residual portion 300 is exposed outside the resist gold film group.

[0038] S600, the residual part 300 is soaked in a gold plating solution to form a gold plating layer 400 on the surface of the residual part 300.

[0039] The substrate 100 can be an aluminum substrate 100 or a ceramic substrate 100. The substrate 100 can be formed by steps such as blanking, automatic optical inspection, browning, lamination, and milling. The conductive layer can be made of copper. The conductive layer can be formed on the surface of the substrate 100 and on the inner sidewall of the through hole of the substrate 100 through a copper plating step.

[0040] The present invention discloses a method for manufacturing segmented gold fingers on a circuit board. The method involves etching a conductive portion on a substrate 100 to form at least two adjacent pre-plated gold portions 200 and a conductive portion. After electroplating the pre-plated gold portions 200 to form gold fingers, the conductive portion is etched to form a residual portion 300 protruding from the gold fingers. Then, a resist gold film is formed on the surface of the gold fingers and the surface of the substrate 100, exposing the residual portion 300 outside the resist gold film. Finally, a gold plating layer 400 is formed on the surface of the residual portion 300 by immersion in a gold plating solution. This reduces the exposed area on the surface of the gold fingers, prevents external corrosion, and improves the durability of the gold fingers.

[0041] In some embodiments of the present invention, such as Figure 2 As shown, S200, which involves etching a conductive layer to form at least two adjacent pre-plated gold portions 200 and conductive portions respectively connected to the two adjacent pre-plated gold portions 200, includes:

[0042] S210. In the conductive layer, the pre-plated gold part 200 area, the wire part area and the area to be etched are divided by pattern making.

[0043] S220. Cover the area to be etched with photosensitive material;

[0044] S240. The conductive layer is immersed in an electroplating solution containing anti-corrosion material, and an electric current is applied to the conductive layer so that the anti-corrosion material in the electroplating solution containing anti-corrosion material is deposited and attached to the pre-plated gold portion 200 area and the wire portion area of ​​the conductive layer.

[0045] S250, Expose and develop the photosensitive material and remove the photosensitive material;

[0046] S260. Use an etchant to etch the area of ​​the conductive layer to be etched;

[0047] S270, Remove the anti-corrosion material to form the pre-plated gold part 200 and the wire part.

[0048] In actual production, the substrate 100 is also provided with circuit sections for connection between components. Therefore, in some embodiments of the present invention, circuit section areas are further divided in the conductive layer by patterning; the conductive layer is energized so that the anti-corrosion material in the electroplating solution containing the anti-corrosion material is deposited and attached to the circuit section areas of the conductive layer; after the anti-corrosion material is removed, a circuit section is formed that is electrically connected to the pre-plated gold section 200.

[0049] In S210, staff can design circuit diagrams and, based on the design scheme, use graphic production techniques such as silkscreen printing to divide the conductive layer into circuit area, pre-plated gold area 200, conductor area, and area to be etched.

[0050] By covering the area to be etched with a photosensitive material to form a barrier, the conductive layer is immersed in the electroplating solution. Using the conductive layer as one of its electrodes, an electric current is applied to the conductive layer, and the anti-corrosion material is deposited and attached to the circuit area, the pre-plated gold area 200 area, and the wire area of ​​the conductive layer. At the same time, the anti-corrosion material does not cover the area to be etched. The anti-corrosion material can be tin.

[0051] In step S250, the photosensitive material is exposed and developed to solidify it, marking the areas to be etched and removing the film formed by the photosensitive material. Then, in step S260, the conductive layer is etched using an etching solution. Specifically, the etching solution can be selected according to the actual situation. Based on the selection of the aforementioned materials, an etching solution that can etch copper but not tin can be selected. Finally, the anti-corrosion material is removed from the conductive layer to form the circuit section, the pre-plated gold section 200, and the conductive section. Specifically, when the anti-corrosion material is tin, a solution that can remove tin can be used to immerse the conductive layer and remove the tin. This design can quickly form the circuit section, the pre-plated gold section 200, and the conductive section, improving production efficiency and shortening manufacturing time.

[0052] In some embodiments of the present invention, such as Figure 2 As shown, the process includes, between covering the area to be etched with a photosensitive material and immersing the conductive layer in an electroplating solution containing an anti-corrosion material, the following steps are also taken:

[0053] S230. The conductive layer is immersed in an electroplating solution containing conductive material, and an electric current is applied to the conductive layer so that the conductive material in the electroplating solution containing conductive material is deposited and attached to the circuit area, the pre-plated gold area 200 area, and the wire area of ​​the conductive layer, wherein the conductive material is the same material as the conductive layer.

[0054] In step S100, a conductive layer of a predetermined thickness can be first fabricated on the substrate 100. In subsequent steps, in step S220, the area to be etched is first covered with a first photosensitive material. Then, the conductive layer is immersed in an electroplating solution containing a conductive material. When the conductive layer is energized, the conductive material in the electroplating solution is deposited and adheres to the circuit area, the pre-plated gold area 200 area, and the wire area of ​​the conductive layer, thereby thickening the conductive layer in that area to a suitable thickness. For example, when the material of the conductive layer is copper, a copper-containing electroplating solution is used for electroplating. Therefore, since the conductive layer in the area to be etched needs to be etched, a thicker conductive layer is not required in step S100, saving costs and improving the etching efficiency.

[0055] In some embodiments of the present invention, such as Figure 5 , 6 As shown in Figure 7, in step S500, a resist gold film group is formed on the surface of the gold finger portion and the surface of the substrate 100, and the residual portion 300 exposed in the resist gold film group includes:

[0056] S510. A resist gold plating wet film 500 is formed on the surface of the gold finger using a first resist gold plating material, wherein the outer contour of the resist gold plating wet film 500 is larger than the outer contour of the gold finger.

[0057] S520, using a second anti-gold plating material, an anti-gold dry film 600 is formed on the outer surface of the anti-gold wet film 500 and the surface of the substrate 100, wherein the anti-gold wet film 500 and the anti-gold dry film 600 constitute at least a portion of the anti-gold film group.

[0058] The anti-metallic wet film 500 can effectively cover relatively uneven areas, thus providing better coverage for the gold fingers and reducing gaps between the gold fingers and the anti-metallic wet film 500. Furthermore, the outer contour of the anti-metallic wet film 500 is larger than that of the gold fingers, allowing it to completely encapsulate the gold fingers. This prevents the metallization solution from easily penetrating the gold fingers during the metallization process. Understandably, the anti-metallic wet film 500 needs to have a notch corresponding to the residual portion 300 to prevent it from being obscured.

[0059] It should be noted that the gold plating solution can be selected from the conventional options. When the gold plating solution comes into contact with the metal material, it can precipitate gold to form a gold deposit on the surface of the metal material.

[0060] The anti-gold dry film 600 can cover the surface of the substrate 100 and the anti-gold wet film 500, further protecting the gold fingers. Similarly, the anti-gold dry film 600 needs to be provided with a notch corresponding to the residual part 300 so as not to block the residual part 300. The anti-gold dry film 600 has stable anti-gold plating performance and is easy to operate and clean.

[0061] Specifically, the distance between the edge of the anti-metal wet film 500 and the edge of the gold finger portion is in the range of 0.05-mm.

[0062] Both the first and second anti-gold plating materials mentioned above can be photosensitive materials. After exposure and development, they form a wet anti-gold film 500 and a dry anti-gold film 600.

[0063] In some embodiments of the present invention, such as Figure 3 As shown, S300, electroplating the pre-plated gold portion 200 to form a gold finger portion includes:

[0064] S310. An anti-gold plating film group is formed on the surface of the substrate 100 and the surface of the conductive part;

[0065] S320. The pre-plated gold part 200 is immersed in a gold-containing electroplating solution, and an electric current is applied to the pre-plated gold part 200 to cause gold in the gold-containing electroplating solution to precipitate and adhere to the pre-plated gold part 200 to form a gold plating layer 700, thereby forming a gold finger part.

[0066] S330, Remove the anti-gold plating film.

[0067] The anti-gold plating module can be formed by coating the surface of the substrate 100 and the surface of the conductive part with an anti-gold plating photosensitive material, and then exposing and developing it.

[0068] It should be noted that the gold plating layer 700 is formed on the surface of the pre-plated gold part 200 by electroplating, while the immersion gold layer 400 can be formed on the surface of the residual part 300 by using a gold immersion solution.

[0069] In some embodiments of the present invention, such as Figure 4 As shown, S400, which involves etching the conductor portion and forming a residual portion 300 protruding from the gold finger portion, includes:

[0070] S410. An anti-corrosion film group is formed on the surface of the substrate 100 and the surface of the gold finger portion. Specifically, a circuit portion may also exist on the substrate 100, and the anti-corrosion film group may also cover the circuit portion.

[0071] S420, Corroding the wire portion with an etching solution to form a residual portion 300;

[0072] S430, Remove the anti-corrosion membrane.

[0073] The anti-corrosion film can be formed by tin on the surface of the substrate 100 and the surface of the gold fingers. The selection of the etching solution can be made according to the actual situation. Depending on the choice that the conductive layer is formed of copper, a solution that can etch copper but not tin can be selected.

[0074] In some embodiments of the present invention, the length of the residual portion 300 protruding from the gold finger portion is between 0 and 0.1 mm. Controlling the residual portion 300 to a suitable length can prevent the residual portion 300 from contacting other gold fingers and causing a short circuit. At the same time, it can also improve the effect of forming the gold plating portion. Specifically, the nickel thickness on the residual portion 300 can be controlled to be 2-8 μm, and the gold plating thickness can be controlled to be 0.025-1.0 μm.

[0075] In some embodiments of the present invention, between etching the conductor portion and forming a residual portion 300 protruding from the gold finger portion and forming a gold resist film group on the surface of the gold finger portion and the surface of the substrate 100, a solder resist treatment of the substrate 100 is further included.

[0076] After etching the conductive part and forming the residual part 300 protruding from the gold finger part, the substrate 100 can be subjected to solder resist treatment to improve the finished quality of the substrate 100. Specifically, the solder resist treatment may include steps such as sandblasting, pickling, pre-baking, exposure, development and post-baking.

[0077] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0078] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A method of manufacturing a line board segmented gold finger, characterized by, Comprising: forming a conductive layer on a substrate; etching the conductive layer to form at least two adjacent pre-plated gold sections and wire sections respectively connected to the two adjacent pre-plated gold sections; electroplating the pre-plated gold sections to form gold finger sections; etching the wire sections and forming residual sections protruding from the gold finger sections; forming an anti-gold-plating film group on the surface of the gold finger sections and the surface of the substrate, the residual sections being exposed outside the anti-gold-plating film group; immersing the residual sections in a gold-plating solution to form a gold deposition layer on the surface of the residual sections; the forming an anti-gold-plating film group on the surface of the gold finger sections and the surface of the substrate, the residual sections being exposed outside the anti-gold-plating film group comprising: forming an anti-gold-plating wet film on the surface of the gold finger sections using a first anti-gold-plating material, wherein the outer contour of the anti-gold-plating wet film is larger than the outer contour of the gold finger sections; forming an anti-gold-plating dry film on the outer surface of the anti-gold-plating wet film and the surface of the substrate using a second anti-gold-plating material, wherein the anti-gold-plating wet film and the anti-gold-plating dry film constitute at least part of the anti-gold-plating film group; the distance between the edge of the anti-gold-plating wet film and the edge of the gold finger sections is 0.05mm, and the anti-gold-plating dry film is provided with a gap corresponding to the residual sections.

2. The method of claim 1, wherein the method further comprises: the electroplating the pre-plated gold sections to form gold finger sections comprising: forming an anti-gold-plating film group on the surface of the substrate and the surface of the wire sections; immersing the pre-plated gold sections in a gold-containing electroplating solution, and applying electricity to the pre-plated gold sections so that gold in the gold-containing electroplating solution is deposited and adheres to the pre-plated gold sections to form a gold-plating layer, thereby forming gold finger sections; removing the anti-gold-plating film group.

3. The method of claim 1, wherein the method further comprises: the etching the wire sections and forming residual sections protruding from the gold finger sections comprising: forming an anti-corrosion film group on the surface of the substrate and the surface of the gold finger sections; etching the wire sections using an etching solution to form the residual sections; removing the anti-corrosion film group.

4. The method of claim 1, wherein the method further comprises: The length of the residual sections protruding from the gold finger sections ranges between 0-0.1mm.

5. The method of claim 1, wherein the method further comprises: between the etching the wire sections and forming residual sections protruding from the gold finger sections and the forming an anti-gold-plating film group on the surface of the gold finger sections and the surface of the substrate, there is further comprising: applying a solder mask to the substrate.

6. The method of claim 1, wherein the method further comprises: the etching the conductive layer to form at least two adjacent pre-plated gold sections and wire sections respectively connected to the two adjacent pre-plated gold sections comprising: dividing pre-plated gold section areas, wire section areas and etching areas in the conductive layer by graphic production; covering the etching areas with a photosensitive material; immersing the conductive layer in an electroplating solution containing an anti-corrosion material, and applying electricity to the conductive layer so that the anti-corrosion material in the electroplating solution containing the anti-corrosion material is deposited and adheres to the pre-plated gold section areas and the wire section areas of the conductive layer; exposing and developing the photosensitive material and removing the photosensitive material; etching the etching areas of the conductive layer using an etching solution; removing the anti-corrosion material to form the pre-plated gold sections and the wire sections.

7. The method of claim 6, wherein the method further comprises: In the conductive layer, a circuit portion area is also divided by patterning; the conductive layer is electrified to make the anticorrosive material in the electroplating solution containing the anticorrosive material precipitate and also adhere to the circuit portion area of the conductive layer; after the anticorrosive material is removed, a circuit portion electrically connected with the pre-plated gold portion is formed.

8. The method of claim 7, wherein the method further comprises: Between the covering of the area to be corroded by the photosensitive material and the soaking of the conductive layer in the electroplating solution containing the anticorrosive material, there is further included: The conductive layer is soaked in the electroplating solution containing the conductive material, and the conductive layer is electrified to make the conductive material in the electroplating solution containing the conductive material precipitate and adhere to the circuit portion area, the pre-plated gold portion area and the wire portion area of the conductive layer, wherein the conductive material is the same material as the conductive layer.

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