Stage device, exposure device, flat panel display manufacturing method, and device manufacturing method

Abstract

Stage device, exposure device, flat panel display manufacturing method, and device manufacturing method for improving positioning accuracy of a stage. The stage device includes a moving body having a first support surface that supports an object; a support portion having a prescribed thickness that supports the moving body and is capable of elastic deformation; a support device having a second support surface that supports the support portion; and a drive portion that moves the moving body to change an angle formed by the first support surface and the second support surface, and in conjunction with a change in the angle based on the drive portion, the support portion elastically deforms to support the moving body in a manner in which the prescribed thickness on a side where the first support surface and the second support surface are narrow is thinned and the prescribed thickness on another side where the first support surface and the second support surface are wide is thickened.

Description

Technical Field

[0001] This invention relates to a stage device, an exposure device, a flat panel display manufacturing method, and a component manufacturing method. Background Technology

[0002] With the increasing size of the substrates to be exposed and the increasing precision of the patterns to be drawn, there is a need to improve the positioning accuracy of the stage in scanning exposure apparatus.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2011-249555 Summary of the Invention

[0006] According to a first embodiment, a platform device is provided, comprising: a movable body having a first support surface for supporting an object; a support portion having a predetermined thickness for supporting the movable body and capable of elastic deformation; a support device having a second support surface for supporting the support portion; and a drive portion for moving the movable body to change the angle between the first support surface and the second support surface. Accompanying the change in angle based on the drive portion, the support portion elastically deforms such that the predetermined thickness on the side with a narrower gap between the first support surface and the second support surface becomes thinner, and the predetermined thickness on the side with a wider gap between the first support surface and the second support surface becomes thicker to support the movable body.

[0007] According to a second embodiment, a platform device is provided, comprising: a movable body having a first support surface for supporting an object; a support portion having a first support member and a second support member capable of elastic deformation that support the movable body from below; a support device having a second support surface for supporting the support portion; and a drive portion for moving the movable body to change the angle between the first support surface and the second support surface. Accompanying the change in angle based on the drive portion, the support portion elastically deforms to support the movable body in such a manner that the first support portion supporting the side with a narrow gap between the first support surface and the second support surface contracts, and the second support portion supporting the side with a wide gap between the first support surface and the second support surface extends.

[0008] According to a third embodiment, a platform device is provided, comprising: a movable body having a first support surface for supporting an object; a support portion for applying an upward force in the direction of gravity toward a second support surface different from the first support surface to support the movable body; and a drive portion for moving the movable body to change the movable body from a first state to a second state in which the tilt angle of the first support surface has changed, wherein, relative to the movable body in the second state, the support portion supports the movable body with different forces at different first and second positions on the second support surface in a direction intersecting the direction of gravity.

[0009] According to a fourth embodiment, a platform device is provided, comprising: a movable body having a first support surface for supporting an object; a support device having a second support surface for supporting the movable body; and a support portion disposed between the movable body and the support device in the direction of gravity, supporting the movable body, and having a thinner thickness on the side where the distance between the first support surface and the second support surface is narrower, and a thicker thickness on the side where the distance between the first support surface and the second support surface is wider.

[0010] According to a fifth embodiment, a platform device is provided, comprising: a movable body for carrying an object; a support portion for supporting the movable body from below; and a drive portion for driving the movable body to change the posture of the movable body from a first state to a second state. The support portion includes an elastic member capable of elastic deformation relative to a load applied to the support portion from the movable body, wherein the height distribution of the elastic member changes in accordance with the posture change of the movable body based on the drive portion.

[0011] According to a sixth embodiment, a platform device is provided, comprising: a movable body for carrying an object; a support portion for supporting the movable body from below; and a drive portion for driving the movable body to change the posture of the movable body from a first state to a second state. The support portion includes an elastic member capable of elastic deformation relative to a load applied to the support portion from the movable body. The height of the elastic member in the direction of gravity at different positions in a direction orthogonal to the direction of gravity changes to different heights in response to the posture change of the movable body based on the drive portion.

[0012] According to a seventh embodiment, a platform device is provided, comprising: a movable body for carrying an object; a support portion for supporting the movable body from below; and a drive portion for driving the movable body to change the posture of the movable body from a first state to a second state. The support portion includes an elastic member capable of elastic deformation relative to a load applied to the support portion from the movable body. The ratio of the height of the elastic member in the direction of gravity at a first position and a second position, which are different from each other in a direction orthogonal to the direction of gravity, varies with different magnitudes in the first state and the second state.

[0013] According to an eighth embodiment, an exposure apparatus is provided, comprising: a stage device of any one of the above, and a pattern forming apparatus for forming a predetermined pattern on an object by means of an energy beam.

[0014] According to a ninth embodiment, a method for manufacturing a flat panel display is provided, comprising: exposing an object using the exposure apparatus, and developing the exposed object.

[0015] According to a tenth embodiment, a method for manufacturing an element is provided, comprising: exposing the object using the exposure apparatus, and developing the exposed object.

[0016] Furthermore, the structure of the embodiments described later can be appropriately modified, and at least a portion can be replaced by other structures. Moreover, the constituent elements, whose arrangement is not particularly limited, are not limited to the configuration disclosed in the embodiments and can be arranged in positions where their function can be achieved. Attached Figure Description

[0017] Figure 1 This is a diagram that schematically illustrates the structure of the exposure apparatus according to the first embodiment.

[0018] Figure 2 It is a general representation Figure 1 A diagram showing the structure of the microstage in the exposure apparatus.

[0019] Figure 3(A) is a plan view of the substrate stage assembly, and Figure 3(B) is a plan view of the substrate stage assembly with the micro-motion stage removed.

[0020] Figure 4 This is a plan view of the substrate stage assembly after the micro-motion stage and the Y-coarse motion stage have been removed.

[0021] Figures 5(A) and 5(B) are used to illustrate the vibration damping performance of the gas spring.

[0022] Figure 6 This diagram illustrates the transmission of external interference to the micro-motion stage.

[0023] Figure 7(A) is a diagram showing the structure of the substrate stage device of Modified Example 1 of the first embodiment, and Figure 7(B) is a diagram showing the micro-motion stage of Modified Example 1.

[0024] Figure 8 This is a diagram that schematically illustrates the structure of the substrate stage device of Modified Example 2 of the first embodiment.

[0025] Figure 9(A) is a diagram showing the structure of the substrate stage device of Modification 3-1 of the first embodiment, and Figure 9(B) is a diagram showing the structure of the substrate stage device of Modification 3-2 of the first embodiment.

[0026] Figure 10 This is a diagram that schematically illustrates the structure of the substrate stage device of Modification 4 of the first embodiment.

[0027] Figure 11 This is a diagram that schematically illustrates the structure of the substrate stage device of Modification 5 of the first embodiment.

[0028] Figure 12 This is a diagram that schematically illustrates the structure of the substrate stage device of Modification 6 of the first embodiment.

[0029] Figure 13 This is a diagram that schematically illustrates the structure of the substrate stage device according to the second embodiment.

[0030] Figure 14 This is a diagram showing the structure of the substrate stage device in a modified example of the second embodiment.

[0031] [Explanation of Symbols]

[0032] 1: Base

[0033] 2: X-guide

[0034] 3: X-bracket

[0035] 4: Y-beam guide

[0036] 4a: Side view

[0037] 5: Gas bearings

[0038] 6: Gas bearing

[0039] 7: Y-bracket

[0040] 7a: Side view

[0041] 8, 9: Gas bearings

[0042] 10A: Exposure apparatus

[0043] 12: Lighting System

[0044] 14: Mask stage

[0045] 16: Projection Optical System

[0046] 17: Vibration damping device

[0047] 18: Cylinder

[0048] 19: Pressing plate

[0049] 20A, 20B, 20C, 20D1, 20D2, 20E, 20F, 20G, 20H, 20J: Substrate stage assembly 30: Y coarse stage (coarse stage)

[0050] 40:X Coarse Actuation Table (Coarse Actuation Table)

[0051] 41: Linear guidance device

[0052] 50A, 50B, 50C, 50D1, 50D2, 50E, 50F, 50G, 50H, 50J: Micro-motion stage

[0053] 51A, 51H: Substrate holder

[0054] 52A, 52B, 52C, 52H: Substrate Stage

[0055] 53A, 53B, 53D1, 53D2, 53E, 53F, 53G, 53H, 53J: Supporting mechanisms

[0056] 501: Leaf Spring

[0057] 521: Cover

[0058] 522: Connecting part

[0059] 523: Connecting components

[0060] 531, 531H: Gas springs

[0061] 533: Support section

[0062] 534: Coil Spring

[0063] 54A, 54C: Attenuation mechanism

[0064] 54B: Damping mechanism

[0065] 541: Throttling section

[0066] 542: Pressure Loss Element

[0067] 55A, 55B, 55C, 55H: Holding devices

[0068] 56: Gas bearing (base pad)

[0069] 57X, 57Y: Mirror base

[0070] 58: Gas bearing

[0071] 58X: X-Moving Mirror

[0072] 58Y: Y-axis moving mirror (strip mirror)

[0073] 61X: X voice coil motor

[0074] 61Y: Y-voice coil motor (voice coil motor)

[0075] 61Z: Z voice coil motor

[0076] 62Z: Z voice coil motor

[0077] 70: Base frame

[0078] 71: Linear guidance device

[0079] 80A, 80B: Micro-motion stage support mechanism

[0080] 81: Gas bearing (sealing gasket)

[0081] 82: Gas bearing

[0082] 83: Workbench Section

[0083] 85: Gas bearing

[0084] 90: Connecting device (flexible device)

[0085] 91: Laser interferometer system (substrate interferometer system)

[0086] A1, A2, A3: Arrows

[0087] G: Center of gravity

[0088] F: Floor (Ground)

[0089] P: Substrate (glass substrate)

[0090] IL: Illumination light for exposure (light source)

[0091] M: Mask

[0092] X, Y, Z: Axes Detailed Implementation

[0093] First Implementation Method

[0094] First, based on Figures 1-6 The first embodiment of the present invention will be described.

[0095] Figure 1This is a diagram that schematically illustrates the structure of the exposure apparatus 10A according to the first embodiment. Figure 2 Figure 3(A) is a plan view of the substrate stage 20A and Figure 3(B) is a plan view of the substrate stage 20A with the micro stage 50A removed. Figure 4 This is a plan view of the substrate stage device 20A with the micro-motion stage 50A and the coarse-motion stage 30 removed.

[0096] The exposure apparatus 10A is a projection exposure apparatus that uses a step and scan method to set a rectangular (square) glass substrate P (hereinafter referred to as substrate P) used in liquid crystal display devices (flat panel displays) as the object of exposure, also known as a scanner.

[0097] Exposure apparatus 10A includes an illumination system 12, a mask stage 14 for holding a mask M with a pattern such as a circuit pattern, a projection optical system 16, and a holding surface ( Figure 1 The assembly includes a substrate stage apparatus 20A on which a resist (sensor) is coated on a substrate P (facing towards the +Z side), and a control system for the aforementioned components. Hereinafter, the direction in which the mask M and substrate P are scanned relative to the projection optical system 16 during exposure will be defined as the X-axis direction, the direction orthogonal to the X-axis in the horizontal plane will be defined as the Y-axis direction, and the direction orthogonal to both the X-axis and Y-axis will be defined as the Z-axis direction. Furthermore, the directions of rotation (tilt) around the X-axis, Y-axis, and Z-axis will be defined as the θx direction, θy direction, and θz direction, respectively. Additionally, the positions in the X-axis, Y-axis, and Z-axis directions will be defined as the X position, Y position, and Z position, respectively.

[0098] The illumination system 12 is configured similarly to the illumination system disclosed in, for example, U.S. Patent No. 5,729,331. The illumination system 12 directs light emitted from a light source (e.g., a mercury lamp) (not shown) through a reflector (not shown), a dichroic mirror, a shutter, a wavelength-selective filter, various lenses, etc., to form an exposure illumination light (illumination light) IL, which is then projected onto the mask M. The illumination light IL can be, for example, i-line (wavelength 365 nm), g-line (wavelength 436 nm), h-line (wavelength 405 nm), etc. (or, a composite light of the i-line, g-line, and h-line).

[0099] The mask stage 14 holds the transparent mask M. The mask stage 14 drives the mask M with a predetermined long stroke in the X-axis direction (scanning direction) relative to the illumination system 12 (illumination light IL), for example, via a drive system (not shown) including a linear motor, while simultaneously performing minor actuation in the Y-axis and θz directions. The position information of the mask M in the horizontal plane is obtained, for example, by a mask stage position measurement system (not shown) including a laser interferometer or encoder.

[0100] The projection optical system 16 is disposed below the mask stage 14. The projection optical system 16 is a so-called multi-lens projection optical system with the same configuration as that disclosed in, for example, U.S. Patent No. 6,552,775, etc., including multiple optical systems with bilateral telecentricity that form an upright image.

[0101] In the exposure apparatus 10A, if a mask M located within a predetermined illumination area is illuminated by illumination light IL from the illumination system 12, a projected image (partial image of the pattern) of the mask M within the illumination area is formed on the exposure area of ​​the substrate P via the projection optics system 16 using the illumination light that has passed through the mask M. Then, by moving the mask M relative to the illumination area (illumination light IL) along the scanning direction, and by moving the substrate P relative to the exposure area (illumination light IL) along the scanning direction, a scanning exposure of one irradiation area on the substrate P is performed, transferring the pattern formed on the mask M (corresponding to the entire pattern within the scanning range of the mask M) to the irradiation area. Here, the illumination area on the mask M and the exposure area (irradiation area of ​​the illumination light) on the substrate P are optically conjugate to each other via the projection optics system.

[0102] (Substrate stage device 20A)

[0103] The substrate stage device 20A is used to perform high-precision position control of the substrate P relative to the projection optical system 16 (illumination light IL), driving the substrate P with a defined long stroke in the X-axis and Y-axis directions, and performing micro-drive in six degrees of freedom directions. The structure of the substrate stage device used in the exposure apparatus 10A is not particularly limited, but in this first embodiment, as an example, a substrate stage device 20A with a so-called coarse-fine motion structure, such as that disclosed in U.S. Patent Application Publication No. 2012 / 0057140, can be used, including a gantry-type two-dimensional coarse stage and a micro-stage that performs micro-drive relative to the two-dimensional coarse stage.

[0104] like Figure 1As shown, the substrate stage device 20A includes: a pair of columns 18, a pressure plate 19, a micro stage 50A, a pair of base frames 70, a Y coarse stage 30, an X coarse stage 40, a substrate driving system for driving each component constituting the substrate stage device 20A, and a measurement system for measuring the position information of each component, etc.

[0105] A pair of cylinders 18 each contain a component extending along the Y-axis (see Figure 3(A) etc.), and their two ends in the longitudinal direction are supported from below by vibration damping devices 17 provided on the floor (ground) F (see Figure 3(A) etc.). Figure 1 A pair of cylinders 18 are arranged parallel to each other at a predetermined interval along the X-axis. The pair of cylinders 18 on the vibration damping device 17 are separately mounted on the floor (ground) F from the pair of base frames 70.

[0106] The pressure plate 19 includes a component extending along the X-axis (see Figure 3(A) etc.), whose two ends in the longitudinal direction are supported from below by a pair of cylinders 18. The flatness of the upper surface (the surface on the +Z side) of the pressure plate 19 is machined to a very high degree. The upper surface of the pressure plate 19 functions as a support surface for the support mechanism 53A.

[0107] like Figure 2 As shown, the micro-stage 50A includes a holding device 55A for holding the substrate P and a support mechanism 53A for supporting the holding device 55A. Details will be described later. The micro-stage 50A is non-contactly supported by the pressure plate 19.

[0108] The holding device 55A includes a substrate holder 51A and a substrate stage 52A.

[0109] A substrate P is placed on the upper surface of a substrate holder 51A. The upper surface of the substrate holder 51A functions as a support surface for the substrate P. The dimensions of the upper surface of the substrate holder 51A in the X and Y axes are set to be the same as (actually slightly shorter than) those of the substrate P. The flatness of the upper surface (the +Z side) of the substrate holder 51A is processed to be very high. The substrate P is held on the substrate holder 51A by vacuum adsorption in a state where it is placed on the upper surface of the substrate holder 51A, and the entire surface is planarized along the upper surface of the substrate holder 51A, which has been processed to be very flat.

[0110] The substrate stage 52A supports the substrate holder 51A. A portion of the voice coil motors 61X, 61Y, and 61Z (described later) are mounted on the substrate stage 52A.

[0111] like Figure 2As shown, the support mechanism 53A is disposed between the holding device 55A and the pressure plate 19, and is fixed to the substrate stage 52A. The support mechanism 53A exerts an upward force in the direction of gravity toward the lower surface of the substrate stage 52A, supporting the holding device 55A. In addition, the support mechanism 53A is supported by the pressure plate 19 in a non-contact manner.

[0112] In this first embodiment, the support mechanism 53A includes, for example, a so-called gas spring 531 filled with high-pressure gas inside a rubber frame. Figure 2 As shown, the gas spring 531 has a specified thickness, and its upper end is connected to the base plate 52A via a connecting part 522, while its lower end is connected to a support part 533 disposed above the pressure plate 19 in a non-contact manner. A gas bearing (hereinafter referred to as a bottom pad) 56 with its bearing surface facing the -Z side is mounted on the lower surface of the support part 533. Furthermore, in Figure 3(B) and Figure 4 In the diagram, the base pad 56 is shown in dashed lines. Thus, the substrate stage 52A is non-contactly supported by the pressure plate 19 via the support mechanism 53A. Furthermore, while three gas bearings 56 are described in this embodiment, the number is not limited to three; there may be one or more.

[0113] Gas spring 531, for example, can be Figure 1 and Figure 2 The bellows-type gas spring shown can also be a diaphragm-type gas spring. A gas valve is connected to the gas spring 531, which changes its internal pressure in response to changes in the load. As a result, the upward force of gravity generated by the gas spring 531 balances the weight of the system, including the holding device 55A (the downward force of gravity).

[0114] In this first embodiment, the support mechanism 53A generates an upward force in the direction of gravity by changing the internal pressure of the gas spring 531, which in turn changes the volume of air within the gas spring. However, this structure is not limited to the aforementioned structure. As long as it is configured to elastically deform with changes in the posture of the holding device 55A, a compression spring or the like can be used instead of the gas spring 531. Furthermore, the compression spring can be a single spring or multiple springs.

[0115] The gas spring 531 has degrees of freedom of motion in the X-axis, Y-axis, Z-axis, θx, θy, and θz directions. That is, the gas spring 531 deforms as the angle between the upper surface of the substrate holder 51A and the upper surface of the pressure plate 19 changes (the change in the posture of the holding device 55A relative to the upper surface of the pressure plate 19), i.e., as the holding device 55A swings (tilts) in the θx and θy directions. For example, when the holding device 55A changes from a predetermined state to a state rotated by a predetermined angle along the θx direction (in the case of rotating about the X-axis), one side (e.g., the +Y side) of the gas spring 531 contracts, and the other side (e.g., the -Y side) extends, thereby deforming along the posture change of the holding device 55A. Here, since the micro-stage 50A does not have a mechanical center of rotation, the micro-stage 50A swings (tilts) about its center of gravity G. Furthermore, the angle between the upper surface of the substrate holder 51A and the upper surface of the pressure plate 19 refers to the angle between the surface of the substrate holder 51A extended to the side of the pressure plate 19 and the plane containing the upper surface of the pressure plate 19.

[0116] Here, the deformation of the gas spring 531 will be explained in more detail as the angle between the upper surface of the substrate holder 51A and the upper surface of the pressure plate 19 changes (the change in the posture of the holding device 55A relative to the upper surface of the pressure plate 19).

[0117] As the angle between the upper surface of the substrate holder 51A and the upper surface of the pressure plate 19 changes, the gas spring 531 elastically deforms to support the holding device 55A by thinning the thickness (thickness in the gravity direction) on the side where the gap between the upper surface of the substrate holder 51A and the upper surface of the pressure plate 19 is narrow, and thickening the thickness on the other side where the gap between the upper surface of the substrate holder 51A and the upper surface of the pressure plate 19 is wide. That is, the change in posture of the gas spring 531 and the holding device 55A correspondingly causes a change in height in the gravity direction at different positions (the position where the gap between the upper surface of the substrate holder 51A and the upper surface of the plate 19 is narrow and wide) in a direction orthogonal to the gravity direction. In other words, the change in posture of the gas spring 531 and the holding device 55A correspondingly causes a change in their height distribution. Furthermore, the angle between the upper surface of the substrate holder 51A and the upper surface of the pressure plate 19 includes 0 degrees, which makes the upper surface of the substrate holder 51A parallel to the upper surface of the pressure plate 19.

[0118] Furthermore, the height of the gas spring 531 changes at the narrow and wide intervals between the upper surface of the substrate holder 51A and the upper surface of the pressure plate 19, resulting in different restoring forces of the gas spring 531. Therefore, as the angle between the upper surface of the substrate holder 51A and the upper surface of the pressure plate 19 changes, the gas spring 531 supports the holding device 55A with different forces at the narrow and wide intervals between the upper surface of the substrate holder 51A and the upper surface of the pressure plate 19.

[0119] Furthermore, when the holding device 55A changes from a predetermined state to another state, the ratio of the heights of the gas springs 531 in the direction of gravity at different positions orthogonal to the direction of gravity varies between the predetermined state and other states. More specifically, for example, when the upper surface of the substrate holder 51A is parallel to the upper surface of the pressure plate 19, and the heights of the gas springs 531 in the direction of gravity at different positions orthogonal to the direction of gravity are L1 and L2 (L1 = L2), the ratio of the heights in the direction of gravity (e.g., L1 / L2) is 1. Here, if the upper surface of the substrate holder 51A is rotated by a predetermined angle along the θx direction, the gas springs 531 deform, and the heights of the gas springs 531 in the direction of gravity at the different positions become, for example, L1' (< L1) and L2' (> L2), respectively, and the ratio of the heights in the direction of gravity (L1' / L2') is less than 1. Thus, the ratio of the height of the gas spring 531 in the direction of gravity changes in accordance with the change in the posture of the holding device 55A relative to the pressure plate 19. Furthermore, the ratio of the height in the direction of gravity has been described with the upper surface of the substrate holder 51A being parallel to the upper surface of the pressure plate 19 as a reference, but it is not limited to this.

[0120] By deforming the gas spring 531, the upper surface of the substrate holder 51A can move freely along the Z-axis, θx-axis and θy-axis.

[0121] like Figure 1 and Figure 2 As shown, for lightweight and high rigidity, the substrate 52A is a hollow, airtight structure with internal ribs. In this first embodiment, the interior of the substrate 52A and the interior of the gas spring 531 are connected by a hollow connecting portion 522, thereby enabling the substrate 52A to function as a storage tank for the gas spring 531. This reduces the spring constant of the gas spring 531 and improves the vibration damping performance of the support mechanism 53A.

[0122] Figures 5(A) and 5(B) illustrate the vibration damping performance of the gas spring. In Figure 5(A), k represents the spring constant, c represents the damping coefficient, and m represents the mass. Additionally, Z0 represents the displacement of the floor, and Z represents the displacement of the mass.

[0123] As shown in Figure 5(A), if a mass is mounted on the spring, as shown in Figure 5(B), the external disturbance entering from the spring's mounting surface will follow without delay in the frequency band below the spring's natural vibration frequency, amplify the vibration in the frequency band near the natural vibration frequency (vibration transmissibility greater than 0), and attenuate the vibration in the frequency band above the natural vibration frequency (vibration transmissibility less than 0). The smaller the spring constant, the larger the vibration damping area and the higher the damping rate.

[0124] In this first embodiment, since the substrate stage 52A functions as a storage tank for the gas spring 531, the spring constant of the gas spring 531 can be reduced. Because the weight of the micro-stage 50A is supported by the gas spring 531 with its small spring constant, the support mechanism 53A has high vibration damping performance. Therefore, as... Figure 6 As shown, external interference transmitted from other units within the exposure apparatus 10A to the microstage 50A (refer to arrow A1) and external interference transmitted from outside the exposure apparatus 10A to the microstage 50A (refer to arrow A2) can be effectively attenuated. This improves the controllability of the microstage 50A.

[0125] Furthermore, since gas is constantly supplied to the gas spring 531 via a gas valve, the airtightness of the substrate stage 52A may not be tight. For example, the substrate stage 52A may be made of casting. Figure 1 and Figure 2 The structure shown is a sealed structure with a cover 521 installed on the casting hole.

[0126] Return to Figure 1 The coarse stage 40 is positioned below (on the -Z side) the fine stage 50A via a pair of linear guides 71, i.e., on a pair of base frames 70. For example... Figure 4 As shown, the X coarse stage 40 includes a rectangular plate-shaped member when viewed from above, with an opening formed in its central portion. A pair of linear guide devices 41 are provided at both ends of the X coarse stage 40 in the X-axis direction.

[0127] The Y-coarse stage 30 is positioned above (on the +Z side) the X-coarse stage 40, that is, below the fine stage 50A (between the fine stage 50A and the X-coarse stage 40). As shown in Figure 3(B), the Y-coarse stage 30 includes a rectangular plate-shaped member in top view, with an opening formed in its center. The Y-coarse stage 30 is mounted on the X-coarse stage 40 via a pair of linear guide devices 41 provided by the X-coarse stage 40, and is freely movable relative to the X-coarse stage 40 in the Y-axis direction, and moves integrally with the X-coarse stage 40 in the X-axis direction.

[0128] The substrate driving system includes: a first driving system for slightly driving the micro stage 50A relative to the pressure plate 19 in six degrees of freedom directions (X-axis, Y-axis, Z-axis, θx, θy, and θz directions); a second driving system for driving the X coarse stage 40 on the base frame 70 along the X-axis direction with a long stroke; and a third driving system for driving the Y coarse stage 30 on the X coarse stage 40 along the Y-axis direction with a long stroke. The types of actuators constituting the second and third driving systems are not particularly limited; for example, linear motors or ball screw drives can be used. The driving force for driving the X coarse stage 40 and Y coarse stage 30 by the second and third driving systems is applied to the micro stage 50A via the voice coil motor constituting the first driving system, described later. The micro stage 50A moves in the X-axis direction by the driving force of the second driving system that moves the X coarse stage 40 in the X-axis direction. In addition, the micro stage 50A moves in the Y-axis direction by using the driving force of the third drive system to move the coarse stage 30 in the Y-axis direction.

[0129] There is no particular limitation on the type of actuator that constitutes the first drive system; for example, in Figure 2 In the figure, multiple voice coil motors are shown as thrust-generating devices that generate thrust in the X, Y, and Z directions.

[0130] Multiple voice coil motors include: an X voice coil motor 61X (see Figure 3(A)) that slightly drives the holding device 55A along the X-axis direction, and a Y voice coil motor 61Y (see Figure 3(A)) that slightly drives the holding device 55A along the Y-axis direction. Figure 2 Figure 3(A) shows the multiple Z voice coil motors 61Z used to slightly drive the holding device 55A in the three degrees of freedom directions of θx, θy and Z-axis (see Figure 3(A)). Figure 2 The stators of each voice coil motor 61X, 61Y, and 61Z are mounted on the coarse stage 30 (Y), and the movers are mounted on the base plate stage 52A of the holding device 55A.

[0131] As shown in Figure 3(A), a pair of X voice coil motors 61X and a pair of Y voice coil motors 61Y are separately arranged in the Y-axis direction. Furthermore, to prevent torque from being generated relative to the micro stage 50A, the X voice coil motors 61X and Y voice coil motors 61Y are arranged as follows: Figure 2 As shown, the coarse stage 30 and the micro stage 50A are mounted on the micro stage 50A at approximately the center of gravity G in the Z-axis direction. As a result, the micro stage 50A can be translated (horizontally moved in the X-axis and / or Y-axis directions) by gravity drive. Additionally, as described above, the micro stage 50A oscillates (tilts, rotates) around the center of gravity G. Therefore, the micro stage 50A can be translated and rotated by gravity drive. Assuming that the micro stage 50A has a mechanical center of rotation, sometimes its center of rotation is not the same as its center of gravity. Thus, the reference point for the micro stage 50A in translational and rotational movements (the center of gravity G for translational movement, and the mechanical center of rotation for rotational movement) differs, resulting in poor controllability of the drive stage. In contrast, the translational and rotational movements of the micro stage 50A are based on the same center of gravity G, thus improving the controllability of the drive stage.

[0132] Multiple Z-voice coil motors 61Z are positioned at the four corners corresponding to the bottom surface of the substrate 52A (in... Figure 2 (Only two of the four Z voice coil motors 61Z are shown in the diagram; the other two are omitted.) Furthermore, the number of Z voice coil motors 61Z is not limited to four; it can be three or more.

[0133] Relative to the coarse stage 30, the fine stage 50A (holding device 55A) is subjected to (transmitted) thrust in six degrees of freedom directions via each voice coil motor 61X, 61Y, and 61Z. The fine stage 50A changes its position or orientation by the thrust from each voice coil motor 61X, 61Y, and 61Z so that the projected image of the pattern on the mask M is imaged on the substrate P.

[0134] The surface of the seemingly flat substrate P also has microscopic irregularities. Due to these irregularities, the projected image sometimes fails to form on the surface of substrate P. Furthermore, for example, in the case of a second exposure on substrate P, substrate P may be deformed due to the first exposure, and the projected image may fail to form on the surface of substrate P due to this deformation. Therefore, the Z position and tilt angle (the angle between the upper surface of the substrate holder 51A and the upper surface of the pressure plate 19) of the micro-stage 50A (holding device 55A) are adjusted by the Z voice coil motor 61Z to make the imaging plane of the projection optical system 16 coincide with the surface of substrate P (the surface of substrate P enters the focal depth range of the optimal imaging plane of the projection optical system 16). It has been explained that even if the flatness of the upper surface of the pressure plate 19 is processed to be very high, assuming that deformation occurs on its upper surface, the imaging plane of the projection optical system 16 may not coincide with the surface of substrate P. In this case, the micro-stage 50A adjusts the Z position and tilt angle by the Z voice coil motor 61Z.

[0135] The detailed configuration of the first to third drive systems is disclosed as an example in U.S. Patent Application Publication No. 2010 / 0018950, etc., and therefore will not be described in detail. The mover mounted on the substrate stage 52A and the stator mounted on the Y coarse stage 30 are connected in a non-contact manner, which can impart the generated thrust to the micro stage 50A.

[0136] Thus, in this first embodiment, since the micro-motion stage 50A is mechanically separated from the X coarse-motion stage 40 and the Y coarse-motion stage 30 (since they are not mechanically connected), external interference transmitted from the coarse-motion stage 30 and the coarse-motion stage 40 to the micro-motion stage 50A can be suppressed. Figure 6 (arrow A3). In addition, the pair of base frames 70 supporting the coarse stage 40 are separately arranged on the floor (on the floor) F relative to the vibration damping device 17 supporting the fine stage 50A, which can suppress the transmission of external interference generated by the coarse stage 30 and coarse stage 40 to the fine stage 50A via the base frames 70 or the vibration damping device 17.

[0137] Return to Figure 2 On the -Y side of the substrate stage 52A, a Y-moving mirror (strip mirror) 58Y with a reflective surface orthogonal to the Y-axis is fixed via a mirror base 57Y. Additionally, as shown in FIG3(A), on the +X side of the substrate stage 52A, an X-moving mirror 58X with a reflective surface orthogonal to the X-axis is fixed via a mirror base 57X. The position information of the micro-stage 50A in the XY plane is obtained using a laser interferometer system (hereinafter referred to as the substrate interferometer system) 91 (refer to the X-moving mirror 58X and Y-moving mirror 58Y). Figure 2It is often detected at a resolution of, for example, around 0.5 nm to 1 nm. Furthermore, in practice, the substrate interferometer system 91 has multiple X-ray interferometers corresponding to the X-moving mirror 58X and multiple Y-ray interferometers corresponding to the Y-moving mirror 58Y, but... Figure 2 The diagram only represents a typical example of a Y-laser interferometer. Multiple laser interferometers are fixed to the main body of the device. Furthermore, the position information of the micro-stage 50A can also be detected not through laser interferometers, but through, for example, a one-dimensional or higher encoder.

[0138] Furthermore, the position information of the micro-stage 50A in the θx, θy, and Z-axis directions is obtained using a sensor (Z sensor, not shown) fixed to the lower surface of the substrate stage 52A, and using, for example, a target fixed to the support 533. The structure of the position measurement system for the micro-stage 50A is disclosed, for example, in U.S. Patent Application Publication No. 2010 / 0018950, and therefore a detailed description is omitted.

[0139] As described in the detailed description above, the substrate stage apparatus 20A of the first embodiment includes: a holding device 55A having a support surface (the upper surface of the substrate holder 51A) for supporting the substrate P; a support mechanism 53A having a predetermined thickness, supporting the holding device 55A and capable of elastic deformation; a pressure plate 19 having a support surface (the upper surface of the pressure plate 19) for supporting the support mechanism 53A; and a Z-voice coil motor 61Z for moving the holding device 55A to change the angle between the upper surface of the substrate holder 51A and the upper surface of the pressure plate 19. With the change in angle based on the Z-voice coil motor 61Z, the support mechanism 53A elastically deforms to support the holding device 55A in such a way that the thickness on the side with a narrower gap between the upper surface of the substrate holder 51A and the upper surface of the pressure plate 19 becomes thinner, and the thickness on the side with a wider gap between the upper surface of the substrate holder 51A and the upper surface of the pressure plate 19 becomes thicker.

[0140] As described above, the micro stage 50A does not have a mechanical center of rotation, so the micro stage 50A swings (tilts) around the center of gravity G. Therefore, the position of the center of rotation of the micro stage 50A coincides with the position of the center of gravity G, which serves as the reference for translational movement. As a result, the micro stage 50A has high controllability and improved positioning accuracy.

[0141] Furthermore, according to this first embodiment, the substrate stage assembly 20A includes: a holding device 55A having a support surface (the upper surface of the substrate holder 51A) for supporting the substrate P; a support mechanism 53A that applies an upward force in the direction of gravity to the lower surface of the substrate stage 52A to support the holding device 55A; and a Z-voice coil motor 61Z that moves the holding device 55A to change it from a first state (e.g., a state where the upper surface of the substrate holder 51A is parallel to the upper surface of the pressure plate 19) to a second state where the tilt angle of the upper surface of the substrate holder 51A has changed. Compared to the holding device 55A in the second state, the support mechanism 53A supports the holding device 55A with different forces at different positions on the lower surface of the substrate stage 52A in a direction intersecting the direction of gravity. Thus, similarly to the above, the positioning accuracy of the micro-motion stage 50A is improved.

[0142] Furthermore, according to this first embodiment, the substrate stage apparatus 20A includes: a holding device 55A having a support surface (the upper surface of the substrate holder 51A) for supporting the substrate P; a pressure plate 19 having a support surface for supporting the holding device 55A; and a support mechanism 53A disposed in the gravity direction between the holding device 55A and the pressure plate 19, supporting the holding device 55A. The thickness of the side with a narrow gap between the upper surface of the substrate holder 51A and the upper surface of the pressure plate 19 is reduced, while the thickness of the side with a wide gap between the upper surface of the substrate holder 51A and the upper surface of the pressure plate 19 is increased. Thus, similarly to the above description, the positioning accuracy of the micro-stage 50A is improved.

[0143] Furthermore, according to this first embodiment, the substrate stage device 20A includes: a holding device 55A for holding a substrate P; a support mechanism 53A for supporting the holding device 55A from below; and a Z-voice coil motor 61Z for driving the holding device 55A to change the posture of the holding device 55A from a first state (e.g., a state where it is not tilted in the θx direction) to a second state (a state where it has been rotated by a predetermined angle in the θx direction). The support mechanism 53A includes a gas spring 531 that is elastically deformable relative to the load applied to the support mechanism 53A by the holding device 55A. The height distribution of the gas spring 531 changes in accordance with the posture change of the holding device 55A based on the Z-voice coil motor 61Z. Thus, similarly to the above, the positioning accuracy of the micro-stage 50A is improved. Furthermore, the height distribution can be a thickness distribution or an elastic force distribution.

[0144] Furthermore, according to this first embodiment, the substrate stage device 20A includes: a holding device 55A for holding the substrate P; a support mechanism 53A for supporting the holding device 55A from below; and a Z-voice coil motor 61Z for driving the holding device 55A to change the posture of the holding device 55A from a first state (e.g., a state where it is not tilted in the θx direction) to a second state (a state where it has been rotated by a predetermined angle in the θx direction). The support mechanism 53A includes a gas spring 531 that is elastically deformable relative to the load applied to the support mechanism 53A by the holding device 55A. The gas spring 531, corresponding to the posture change of the holding device 55A based on the Z-voice coil motor 61Z, causes the height of the gas spring 531 in the gravity direction at different positions in a direction orthogonal to the gravity direction to change to different heights. Thus, similarly to the above, the positioning accuracy of the micro-stage 50A is improved. Furthermore, the height in the gravity direction can be the thickness in the gravity direction or the elastic force in the gravity direction.

[0145] Furthermore, according to this first embodiment, it includes: a holding device 55A for mounting a substrate P; a support mechanism 53A for supporting the holding device 55A from below; and a Z-voice coil motor 61Z for driving the holding device 55A to change the posture of the holding device 55A from a first state (e.g., a state where it is not tilted in the θx direction) to a second state (a state where it has been rotated by a predetermined angle in the θx direction). The support mechanism 53A includes a gas spring 531 capable of elastic deformation relative to the load applied to the support mechanism 53A from the holding device 55A. The ratio of the height of the gas spring 531 in the gravity direction at different positions in a direction orthogonal to the gravity direction varies with different magnitudes in the first and second states. Thus, similarly to the above, the positioning accuracy of the micro-motion stage 50A is improved. Furthermore, the height ratio can be a ratio of thickness in the gravity direction or a ratio of elastic force in the gravity direction.

[0146] Furthermore, in this first embodiment, the support mechanism 53A is connected to the holding device 55A. Since the holding device 55A and the support mechanism 53A are integrated, the support mechanism 53A moves when the holding device 55A moves. Therefore, it is unnecessary to provide a structure for moving the support mechanism 53A that is different from the structure for moving the holding device 55A. The holding device 55A moves via a voice coil motor whose stator and mover are connected in a non-contact manner. The holding device 55A and the coarse adjustment stages 30 and 40 are not mechanically connected, which can suppress the transmission of external interference from the coarse adjustment stages 30 and 40 to the fine adjustment stage 50A.

[0147] Furthermore, in this first embodiment, the substrate stage assembly 20A includes: a Y-coarse stage 30 and an X-coarse stage 40, which allow the holding device 55A, supported by the support mechanism 53A, to move relative to the pressure plate 19; and voice coil motors 61X, 61Y, and 61Z, each including a stator disposed on the Y-coarse stage 30 and a mover disposed on the holding device 55A, and the holding device 55A is moved relative to the Y-coarse stage 30 and the X-coarse stage 40 via the mover and stator, which are arranged in a non-contact manner. This allows the substrate P to be moved to a desired position, and the imaging surface of the projection optical system 16 to align with the surface of the substrate P.

[0148] Furthermore, in this first embodiment, the voice coil motors 61X, 61Y, and 61Z transmit the driving force used to move the holding device 55A relative to the pressure plate 19 via the Y coarse stage 30 and the X coarse stage 40 to the holding device 55A through the mover and stator. The micro stage 50A and the Y coarse stage 30 and X coarse stage 40 can be connected non-contactly via the stator and mover, thus suppressing the transmission of vibrations from the Y coarse stage 30 and X coarse stage 40 to the micro stage 50A.

[0149] Furthermore, when the holding device 55A is mechanically separated from the support mechanism 53A, and the support mechanism 53A is pulled by the Y coarse stage 30, vibrations from the Y coarse stage 30 may be transmitted to the support mechanism 53A. Since a target material for a Z sensor is, for example, provided on the support portion 533 of the support mechanism 53A, vibrations transmitted to the support mechanism 53A will affect the measurement of the Z sensor. Therefore, the impact of vibration transmission on the support mechanism 53A must be considered. In a micro-motion stage where the substrate stage 52A and the support mechanism 53A are mechanically separated, it is difficult to simulate the movement of the micro-motion stage relative to the control.

[0150] On the other hand, in the micro-motion stage 50A of this first embodiment, the holding device 55A is connected to the support mechanism 53A and becomes an integral unit, so the vibration of the Y coarse stage 30 is not transmitted to the support mechanism 53A. Therefore, since the vibration of the Y coarse stage 30 does not affect the measurement of the Z sensor, it is easy to simulate the movement of the micro-motion stage relative to the control in the micro-motion stage 50A.

[0151] Furthermore, when the micro-stage has a rotation mechanism for rotating the substrate stage in the θx and θy directions, it is necessary to reduce the rigidity of the micro-stage in order to align the rotation center with the center of gravity of the micro-stage (specifically, to thin the central portion and place the rotation mechanism at the top as much as possible). On the other hand, in this first embodiment, since there is no need to provide a rotation mechanism, the rigidity of the substrate stage can be increased, thereby improving the flatness of the substrate holder. Furthermore, by increasing the rigidity of the substrate stage, the positioning accuracy of the substrate stage can also be improved.

[0152] Furthermore, since the support mechanism 53A supports (cancels) the weight of the micro-stage 50A, the thrust of the Z-voice coil motor 61Z required to drive the substrate stage 52A in the Z-axis, θx, and θy directions can be reduced. This reduces the heat generated by the Z-voice coil motor 61Z, thus reducing temperature fluctuations caused by its heat generation. Temperature fluctuations can affect position measurement, but according to the first embodiment, these fluctuations are reduced, thereby improving the accuracy of position measurement.

[0153] Furthermore, in this first embodiment, the support mechanism 53A is a gas spring 531 filled with gas. Since the only component of the support mechanism 53A is the gas spring 531, the micro stage 50A can be easily and inexpensively made thinner. Additionally, because the support mechanism 53A is small, the micro stage 50A can be made lighter. Furthermore, because the gas spring 531 has low rigidity, the substrate stage 52A can be tilted and driven with a small thrust, thus reducing the heat generated by the voice coil motors 61X, 61Y, and 61Z. Therefore, performance degradation of the exposure apparatus 10A due to heat can be suppressed.

[0154] Furthermore, in this first embodiment, the substrate stage 52A is hollow, and the interior of the substrate stage 52A communicates with the interior of the gas spring 531. Therefore, the substrate stage 52A functions as a storage tank for the gas spring 531, thereby reducing the spring constant of the gas spring 531 and improving its vibration damping performance.

[0155] Furthermore, since the gas spring 531 has a small spring constant, the thrust required to counteract the restoring force of the spring is reduced when the substrate stage 52A is driven along the Z-axis, θx, and θz directions. This reduces the thrust of the voice coil motor used for driving in the Z-axis, θx, and θy directions. Consequently, the heat generated by the voice coil motor is reduced, thus minimizing the impact of heat on the exposure apparatus 10A.

[0156] Furthermore, in this first embodiment, a portion of the voice coil motors 61X and 61Y, which exert thrust on the holding device 55A in at least one of the X-axis and Y-axis directions (e.g., stators), are positioned on the Y coarse stage 30 in the Z-axis direction at a position substantially aligned with the center of gravity G of the micro stage 50A, which includes the holding device 55A and the support mechanism 53A. Thus, with respect to both the X-axis and Y-axis directions, the position of the thrust generation point of the voice coil motors 61X and 61Y in the Z-axis direction is substantially aligned with the center of gravity G of the micro stage 50A. Therefore, with respect to both the X-axis and Y-axis directions, the micro stage 50A can be driven without interfering with movement in other directions. That is, when driving the micro stage 50A in the X-axis direction, for example, it can be driven in the X-axis direction without interfering with movement in the θy direction. Similarly, when driving the micro stage 50A in the Y-axis direction, for example, it can be driven in the Y-axis direction without interfering with movement in the θx direction.

[0157] Regarding the Z-axis direction, the Z-voice coil motor 61Z generates thrust while maintaining torque balance, driving the micro-stage 50A without interfering with other axes. Regarding the θz direction, by applying a torque in that direction to the micro-stage 50A, the micro-stage 50A moves around the center of gravity G in the most stable manner. The movement of the gas spring 531 in the θx and θy directions is not restricted, therefore, by applying a torque in those directions to the substrate stage 52A, the substrate stage 52A moves around the center of gravity G in the most stable manner. Thus, since there is no interference between axes, the positioning accuracy of the micro-stage 50A can be improved.

[0158] Furthermore, in this first embodiment, the Z-voice coil motor 61Z rotates the micro stage 50A around its center of gravity G. Therefore, the translational and rotational movements of the micro stage 50A are based on the same center of gravity G, thus improving the controllability of the drive stage.

[0159] (Variation Example 1)

[0160] Figure 7(A) is a diagram showing the structure of the substrate stage device 20B of the modified example 1 of the first embodiment, and Figure 7(B) is a diagram showing the micro-motion stage 50B of the modified example 1.

[0161] As shown in Figure 7(B), the micro-motion stage 50B of Modified Example 1 includes a leaf spring 501. One end of the leaf spring 501 is connected to the lower end of a connecting member 523 extending from the lower surface of the base plate stage 52A along the direction of gravity (Z-axis direction), and the other end is connected to a support portion 533. The leaf spring 501 is arranged in a direction (i.e., Z-axis direction) that is orthogonal to the upper surface of the pressure plate 19 (the moving reference plane of the micro-motion stage 50B). Other structures are the same as in the first embodiment, so detailed descriptions are omitted.

[0162] The micro-stage 50B of the first embodiment's variation 1 includes a leaf spring 501, which is arranged such that one end is connected to the substrate stage 52A and the other end is connected to the support portion 533, with its thickness direction parallel to the Z-axis direction. The leaf spring 501, thus arranged, has high rigidity in the X-axis and Y-axis directions and low rigidity in the Z-axis direction. Therefore, the leaf spring 501 does not hinder the driving of the micro-stage 50B in the θx and θy directions. On the other hand, the leaf spring 501 improves the following performance of the support mechanism 53A to the substrate stage 52A and increases the natural vibration frequency of the lower part of the gas spring 531. Therefore, even if the support mechanism 53A oscillates due to external interference, the amplitude is small, thus reducing the force (excitation force) transmitted to the exposure apparatus 10A via the pressure plate 19, thereby improving the overall performance of the exposure apparatus 10A.

[0163] (Variation Example 2)

[0164] In the first embodiment and its variation 1, the substrate stage 52A functions as a storage tank for the gas spring 531, but it is not limited thereto.

[0165] Figure 8 This is a diagram that schematically illustrates the structure of the substrate stage device 20C of the modified example 2 of the first embodiment. (See diagram below.) Figure 8 As shown, in Modification 2, the interior of the gas spring 531 of the support mechanism 53B is not connected to the interior of the base plate 52B of the holding device 55B; only the gas spring 531 functions as a storage tank. Other structures are the same as in the first embodiment, therefore detailed descriptions are omitted.

[0166] Compared to using the substrate stage 52B as a storage tank, when the substrate stage 52B is not used as a storage tank for the gas spring 531, the spring constant of the gas spring 531 becomes larger, making it easier to construct the micro-motion stage 50C. Furthermore, since the storage tank is smaller, the amount of gas supplied relative to the internal pressure changes of the gas spring 531 can be reduced.

[0167] Furthermore, in Modification 2, although the upper end of the gas spring 531 is connected to the substrate stage 52B via the connecting portion 522, the connecting portion 522 can be omitted, and the gas spring 531 can be directly connected to the substrate stage 52B. This is not limited to Modification 2 of the first embodiment; the same applies to other embodiments and their modifications.

[0168] (Variation 3-1)

[0169] Figure 9(A) is a diagram showing the structure of the substrate stage device 20D1 in Modified Example 3-1. In the substrate stage device 20D1 of Modified Example 3-1, the support mechanism 53D1 includes a gas spring 531 and an attenuation mechanism 54A. The attenuation mechanism 54A generates an attenuating force in a direction perpendicular to the moving reference plane (XY plane) (Z-axis direction).

[0170] In Modification 3-1, the attenuation mechanism 54A includes a throttling section 541 and a pressure loss element 542 formed on the substrate stage 52C of the holding device 55C. When the gas spring 531 deforms, gas flows between the interior of the substrate stage 52C (storage tank) and the interior of the gas spring 531. Attenuation is achieved by utilizing the pressure loss of the gas passing through the throttling section 541. This further attenuates external disturbances transmitted to the micro-motion stage 50D1.

[0171] The pressure loss element 542 is, for example, a filter, as shown in FIG9(A), and is arranged in series with the throttling section 541. The pressure loss element 542 attenuates the piping resonance caused by the throttling section 541. Alternatively, the pressure loss element 542 may be omitted. Since other structures are the same as in the first embodiment, detailed description is omitted.

[0172] Throttling section 541 is formed on the lower surface of substrate stage 52C, and pressure loss element 542 is disposed inside substrate stage 52C (in storage tank). Therefore, the support mechanism 53D1 will not be enlarged, that is, the micro stage 50D1 will not be enlarged, and the external interference transmitted to micro stage 50D1 can be further attenuated.

[0173] (Variation Example 3-2)

[0174] Figure 9(B) is a schematic diagram showing the structure of the substrate stage device 20D2 of the first embodiment, variant 3-2. In the substrate stage device 20D2 of variant 3-2, the support mechanism 53D2 includes not only the gas spring 531 but also a damping mechanism 54B as an attenuation mechanism. This further attenuates external interference transmitted to the micro-motion stage 50D2. Since other structures are the same as in the first embodiment, detailed descriptions are omitted.

[0175] Since the damping mechanism 54B can be installed inside the storage tank formed by the gas spring 531 and the substrate stage 52A, the support mechanism 53D2 will not be enlarged, that is, the micro stage 50D2 will not be enlarged, and the external interference transmitted to the micro stage 50D2 can be further attenuated.

[0176] (Variation Example 4)

[0177] Figure 10 This is a diagram that schematically illustrates the structure of the substrate stage device 20E in Modification 4 of the first embodiment. (See diagram below.) Figure 10 As shown, the substrate stage device 20E of Modified Example 4 includes a micro-motion stage support mechanism 80A that supports the micro-motion stage 50E.

[0178] The micro-motion stage support mechanism 80A includes a worktable section 83 and gas bearings 81 and 82. The worktable section 83 is inserted into an opening formed on the Y coarse stage 30 (see Figure 3(B)). The worktable section 83 is mechanically connected to the Y coarse stage 30 via multiple connecting devices 90 (also called flexure devices). The micro-motion stage support mechanism 80A moves integrally with the Y coarse stage 30 along the XY plane by being pulled by the worktable section 83.

[0179] A gas bearing 82 with its bearing surface facing the -Z side is mounted on the lower surface (the surface on the -Z side) of the worktable section 83. Thus, the micro-motion stage support mechanism 80A is mounted in a non-contact state on the pressure plate 19, whose upper surface has been machined to a very high degree of flatness, via the gas bearing 82. A gas bearing 81 (referred to as a sealing gasket) with its bearing surface facing the +Z side is mounted on the upper surface (the surface on the +Z side) of the worktable section 83.

[0180] In addition, in Modification 4, the flatness of the lower surface of the support portion 533 of the supporting gas spring 531 is processed to be very high, so as to function as the guide surface of the sealing gasket 81 of the micro-motion stage support mechanism 80A.

[0181] In variation 4, the gas spring 531 of the support mechanism 53E is directly connected to the substrate stage 52A, and the interior of the substrate stage 52A communicates with the interior of the gas spring 531. Since other structures are the same as in the first embodiment, detailed descriptions are omitted.

[0182] Even using the micro-motion stage 50E of Modification 4, the same effect as in the first embodiment can be obtained. Furthermore, similar to Modification 1, in Modification 4, a leaf spring can be used to connect the substrate stage 52A and the support portion 533. Thus, the same effect as in Modification 1 can be obtained. Additionally, similar to Modification 2, in Modification 4, the interior of the substrate stage 52A may not be in communication with the interior of the gas spring 531. Furthermore, similar to Modifications 3-1 and 3-2, in Modification 4, the support mechanism 53E includes not only the gas spring 531 but also a damping mechanism 54A or a damping mechanism 54B.

[0183] (Variation Example 5)

[0184] Figure 11This is a diagram that schematically illustrates the structure of the substrate stage device 20F of Modification 5 of the first embodiment. In Modification 5, the upper surface (+Z side) of the worktable portion 83 of the micro-stage support mechanism 80B functions as the guide surface of the micro-stage 50F, and a gas bearing 85 with its bearing surface facing the -Z side is installed between the worktable portion 83 and the support portion 533 of the support mechanism 53F. Since other structures are the same as in Modification 4, detailed descriptions are omitted. Even with the micro-stage 50F of Modification 5, the same effects as in the first embodiment can be obtained.

[0185] (Variation Example 6)

[0186] The support mechanisms 53A, 53B, 53D1, 53D2, 53E, and 53F of the first embodiment and its variations 1 to 5 include a gas spring 531, but the support mechanisms may also have other structures.

[0187] Figure 12 This is a diagram that schematically illustrates the structure of the substrate stage device 20G of the modified example 6 of the first embodiment. Figure 12 As shown, the support mechanism 53G of the micro-motion stage 50G in Modified Example 6 includes multiple helical springs 534 and a damping mechanism 54C.

[0188] Multiple helical springs 534 are disposed at different positions on the lower surface of the substrate stage 52B. One end of each helical spring 534 is fixed to the lower surface of the substrate stage 52B, and the other end is fixed to the support portion 533. As the posture of the holding device 55B relative to the upper surface of the pressure plate 19 changes, i.e., as the holding device 55B swings (tilts) in the θx and θy directions, the multiple helical springs 534 deform. For example, when the holding device 55B rotates by a predetermined angle in the θx direction from a predetermined state (rotating about the X-axis), one helical spring 534 (e.g., a helical spring 534 disposed on the +Y side closer to the center of the holding device 55B in the Y-axis direction) contracts, while another helical spring 534 (e.g., a helical spring 534 disposed on the -Y side closer to the center of the holding device 55B in the Y-axis direction) extends.

[0189] That is, as the angle between the upper surface of the substrate holder 51A and the upper surface of the pressure plate 19 changes, a plurality of helical springs 534 elastically deform in such a way that the height of the helical springs 534 on the side with a narrow gap between the upper surface of the substrate holder 51A and the upper surface of the pressure plate 19 decreases in the direction of gravity, and the height of the helical springs 534 on the other side with a wide gap between the upper surface of the substrate holder 51A and the upper surface of the pressure plate 19 increases in the direction of gravity to support the holding device 55B.

[0190] Furthermore, the height of the helical spring 534 changes at the narrow and wide intervals between the upper surface of the substrate holder 51A and the upper surface of the pressure plate 19, resulting in different restoring forces of the helical spring 534. Therefore, as the angle between the upper surface of the substrate holder 51A and the upper surface of the pressure plate 19 changes, the multiple helical springs 534 disposed at different positions on the lower surface of the substrate stage 52B support the holding device 55B with different forces at the narrow and wide intervals between the upper surface of the substrate holder 51A and the upper surface of the pressure plate 19.

[0191] The attenuation mechanism 54C generates an attenuation force in a direction perpendicular to the moving reference plane (XY plane) (Z-axis direction). Since the other structures are the same as in variant 4, detailed descriptions are omitted.

[0192] The substrate stage assembly 20G of Variation 6 includes: a holding device 55B having a support surface (the upper surface of the substrate holder 51A) for supporting the substrate P; a support mechanism 53G having a plurality of elastically deformable helical springs 534 supporting the holding device 55B from below; a pressure plate 19 having a support surface for supporting the support mechanism 53G; and a Z-voice coil motor 61Z that moves the holding device 55B to change the angle between the upper surface of the substrate holder 51A and the upper surface of the pressure plate 19. As the angle of the Z-voice coil motor 61Z changes, the support mechanism 53G elastically deforms to support the holding device 55B in such a way that the helical spring 534 supporting the narrower gap between the upper surface of the substrate holder 51A and the upper surface of the pressure plate 19 contracts, and the helical spring 534 supporting the wider gap between the upper surface of the substrate holder 51A and the upper surface of the pressure plate 19 extends. Thus, even if a helical spring 534 is used instead of a gas spring 531, the same effect as the first embodiment can be obtained.

[0193] When using a helical spring 534, the spring constant is larger than that of a gas spring, making it easier to construct the support mechanism 53G. Furthermore, since a storage tank is unnecessary, energy consumption is reduced. Additionally, external disturbances transmitted to the micro-stage 50G can be attenuated by the damping mechanism 54C. The damping mechanism 54C is preferably a damping mechanism utilizing a viscous fluid or a solid damper utilizing a viscoelastic body.

[0194] Second Implementation Method

[0195] The micro-motion stage of the first embodiment can tilt in the θx and θy directions, but the micro-motion stage of the second embodiment does not tilt in the θx and θy directions.

[0196] Figure 13This is a schematic diagram showing the structure of the substrate stage device 20H according to the second embodiment. The substrate stage device 20H includes a pressure plate 19 and a micro-motion stage 50H.

[0197] The micro-stage 50H is disposed on the pressure plate 19. The micro-stage 50H includes a holding device 55H having a substrate holder 51H and a substrate stage 52H, a support mechanism 53H, and a gas bearing 58.

[0198] The support mechanism 53H includes multiple (e.g., three) gas springs 531H and a support portion 533. The multiple gas springs 531H are arranged to surround the center of gravity G of the micro stage 50H and generate a force in the direction of gravity (Z-axis direction) that balances the weight of the system including the substrate holder 51H and the substrate stage 52H.

[0199] In the second embodiment, the micro-stage 50H includes a Z-voice coil motor 62Z for driving the substrate stage 52H along the Z-axis direction. The mover of the Z-voice coil motor 62Z is ​​mounted, for example, on the lower surface of the substrate stage 52H, and the stator is mounted on the upper surface of the support portion 533. The Z-voice coil motor 62Z exerts thrust on the substrate stage 52H in the Z-axis direction. The Z-voice coil motor 62Z has a Z-guide (not shown) that restricts the driving direction of the Z-voice coil motor 62Z on the substrate stage 52H to the Z-axis direction. Therefore, the micro-stage 50H cannot tilt in the θx and θy directions. Alternatively, the Z-voice coil motor 62Z, which exerts thrust on the substrate stage 52H in the Z-axis direction, and the Z-guide, which restricts the driving direction of the substrate stage 52H to the Z-axis direction, can be provided separately.

[0200] Thus, the substrate stage device 20H of the second embodiment includes: a substrate stage 52H for holding and moving the substrate P; and a support mechanism 53H connected to the substrate stage 52H, and supporting the substrate stage 52H in a direction orthogonal to the moving reference plane (the upper surface of the pressure plate 19) that serves as a reference when moving relative to the substrate stage 52H (Z-axis direction) without contact with the moving reference plane. The support mechanism 53H includes: a plurality of gas springs 531H, the upper ends of which are connected to the substrate stage 52H and the lower ends of which are connected to a support portion 533 disposed above the moving reference plane without contact. Thus, similar to the first embodiment and its variations 1 to 5, external interference transmitted from the pressure plate 19 can be attenuated by the gas springs 531H.

[0201] Furthermore, since multiple gas springs 531H support the weight of the retaining device 55H, the Z-voice coil motor 62Z can drive the retaining device 55H in the Z-axis direction with a small thrust. This reduces the heat generated by the Z-voice coil motor 62Z, thereby preventing deterioration of the position measurement system due to temperature variations.

[0202] Furthermore, compared to the case where a ball screw drive is used to drive the substrate stage 52H in the Z-axis direction, the position control accuracy of the micro stage 50H can be improved by using a Z voice coil motor 62Z.

[0203] (Modified Example)

[0204] Figure 14 This diagram illustrates the structure of the substrate stage device 20J, a modified example of the second embodiment. In this modified example, the micro-motion stage 50H of the second embodiment is applied to a support stage, and the substrate stage 52H is configured to be tiltable in both the θx and θy directions.

[0205] like Figure 14 As shown, the substrate stage device 20J includes a pair of X guides 2 (in Figure 14 The diagram only shows one of the X brackets, X bracket 3, Y crossbeam guide 4, and Y bracket 7.

[0206] A pair of X-guide members 2 extending along the X-axis are laid parallel to each other at intervals along the Y-axis on the upper surface of the base 1, and each is equipped with an X-bracket 3 that engages with each X-guide member 2. A bridge-shaped Y-beam guide member 4 extending along the Y-axis and connecting the two brackets 3 is suspended and fastened on the upper part of the X-bracket 3.

[0207] exist Figure 14 As shown by the dotted lines, multiple gas bearings 5 ​​are arranged between the upper surface of the X-bracket 3 and the X-guide 2, and multiple gas bearings 6 are arranged between the sides of the X-bracket 3 and the X-guide 2. The gas bearings 5 ​​and 6 are fixed to the X-bracket 3, and the X-bracket 3 (and the Y-beam guide 4 fixed to the X-bracket 3), which is non-contactly supported relative to the X-guide 2, is configured to move freely in the X-axis direction guided by the X-guide 2. Alternatively, the gas bearings 6 of any of the X-brackets 3 can be omitted.

[0208] A Y-bracket 7 is mounted on the upper part of the Y-beam guide 4. For example... Figure 14 As shown, multiple gas bearings 8 are arranged between the upper surfaces of the Y-bracket 7 and the Y-beam guide 4, and multiple gas bearings 9 are arranged between the side surface 7a of the Y-bracket 7 and the side surface 4a of the Y-beam guide 4. These gas bearings 8 and 9 are fixed to the Y-bracket 7, and the Y-bracket 7, which is non-contactly supported by the Y-beam guide 4, is configured to move freely in the Y-axis direction guided by the Y-beam guide 4. The flatness of the upper surface of the Y-beam guide 4 is machined to a very high degree. In a variation of the second embodiment, the upper surface of the Y-beam guide 4 is a moving reference surface.

[0209] On the upper surface of the Y-bracket 7, a substrate stage 52H is mounted via a plurality of gas springs 531H serving as a support mechanism 53J. The plurality of gas springs 531H are arranged at different positions within the lower surface of the substrate stage 52H, with one end of each gas spring 531H fixed to the lower surface of the substrate stage 52H and the other end fixed to the upper surface of the Y-bracket 7.

[0210] Additionally, a mover of a Z voice coil motor 61Z is mounted on the lower surface of the substrate stage 52H, and a stator of a Z voice coil motor 61Z is mounted on the upper surface of the Y bracket 7.

[0211] Unlike the Z-voice coil motor 61Z in the second embodiment, the Z-voice coil motor 61Z in the modified example does not have a Z-guide that restricts the drive of the substrate stage 52H only in the Z-axis direction. Therefore, the substrate stage 52H can tilt in both the θx and θy directions.

[0212] As the posture of the substrate stage 52H relative to the upper surface of the Y-beam guide 4 changes, i.e., the substrate stage 52H swings (tilts) in the θx and θy directions, the multiple gas springs 531H deform. For example, when the substrate stage 52H rotates by a predetermined angle in the θx direction from a predetermined state (when rotating about the X-axis), one gas spring 531H (e.g., a gas spring 531H located on the +Y side of the center of the substrate stage 52H in the Y-axis direction) contracts, while another gas spring 531H (e.g., a gas spring 531H located on the -Y side of the center of the substrate stage 52H in the Y-axis direction) extends. As a result, the multiple gas springs 531H disposed at different positions within the lower surface of the substrate stage 52H support the substrate stage 52H with mutually different forces.

[0213] Additionally, the modified micro-motion stage 50J includes a leaf spring 501. One end of the leaf spring 501 is connected to the lower end of a connecting member 523 extending from the lower surface of the base stage 52H along the direction of gravity (Z-axis direction), and the other end is connected to the Y-bracket 7. The leaf spring 501 is arranged such that its thickness direction is parallel to the Z-axis direction.

[0214] The leaf spring 501 configured in this way has low stiffness in the Z-axis direction and high stiffness in the X-axis and Y-axis directions. Therefore, the leaf spring 501 constrains the substrate stage 52H in the XY plane, but does not hinder the driving of the substrate stage 52H in the θx and θy directions. Since the natural vibration frequency of the lower part of the gas spring 531 can be increased by the leaf spring 501, the overall performance of the exposure apparatus can be improved, similar to the modified example 1 of the first embodiment.

[0215] The substrate stage assembly 20J of the second embodiment includes: a holding device 55H having a support surface for supporting a substrate P; a support mechanism 53J that applies an upward force in the direction of gravity toward the lower surface of the substrate stage 52H included in the holding device 55H, supporting the holding device 55H; and a Z-voice coil motor 61Z that moves the holding device 55H to change the tilt angle of the moving body from a first state (e.g., a state in which the upper surface of the substrate holder 51A is parallel to the upper surface of the pressure plate 19) to a second state in which the tilt angle of the support surface of the holding device 55H (the upper surface of the substrate holder 51A) is changed. Relative to the holding device 55H in the second state, the support mechanism 53J supports the holding device 55H with different forces at different positions on the lower surface of the substrate stage 52H in a direction intersecting the direction of gravity.

[0216] Since the weight of the retaining device 55H is supported by multiple gas springs 531H, the Z-voice coil motor 61Z can drive the retaining device 55H along the Z-axis with a small thrust. This reduces the heat generated by the Z-voice coil motor 61Z, thereby preventing deterioration of the position measurement system due to temperature variations.

[0217] Furthermore, in the second embodiment and its variations, instead of multiple gas springs 531, a single gas spring 531 may be provided below the center of gravity G of the micro-motion stage, similar to the first embodiment. Additionally, similar to variation 3 of the first embodiment, in addition to multiple gas springs 531, a damping mechanism or other attenuation mechanism may also be provided. Alternatively, instead of multiple gas springs 531, multiple helical springs and an attenuation mechanism may be used as a support mechanism, similar to variation 6 of the first embodiment. Furthermore, a structure may be constructed that uses both gas springs and helical springs to support the substrate stage. Moreover, an attenuation mechanism may also be used in conjunction.

[0218] Furthermore, in the first embodiment and its variations 1 to 5, the case where the micro-motion stage has one gas spring 531 was described, but it is not limited thereto. Similar to the second embodiment and its variations, the micro-motion stage may also have multiple gas springs.

[0219] Furthermore, in the first embodiment, the second embodiment, and their variations, the substrate stage may be magnetically levitated on the support portion 533 without using a gas spring or a helical spring. Alternatively, the substrate stage may be supported on the support portion 533 using both a gas spring or a helical spring and magnetic levitation.

[0220] Furthermore, in the various embodiments described, an equal magnification system is used as the projection optical system 16, but it is not limited to this; a reduction system or a magnification system may also be used.

[0221] The applications of exposure apparatus are not limited to those used for transferring patterns of liquid crystal display devices onto square glass plates. For example, they can be widely used in exposure apparatuses for manufacturing electroluminescent (EL) panels, semiconductor manufacturing, and for manufacturing thin-film magnetic heads, micromachines, and deoxyribonucleic acid (DNA) chips. Furthermore, in addition to micro-components such as semiconductor devices, they can also be used to transfer circuit patterns onto glass substrates or silicon dioxide wafers for manufacturing masks or photomasks used in photoexposure apparatuses, extreme ultraviolet (EUV) exposure apparatuses, X-ray exposure apparatuses, and electron beam exposure apparatuses.

[0222] Furthermore, the substrate to be exposed is not limited to glass plates; it can be other objects such as wafers, ceramic substrates, film components, or mask blanks. Additionally, when the substrate to be exposed is a substrate for a flat panel display, the thickness of the substrate is not particularly limited, and it may include film-like (flexible sheet-like components). Moreover, the exposure apparatus of this embodiment is particularly effective when the substrate to be exposed has a side length or diagonal length of 500 mm or more. Furthermore, when the substrate to be exposed is a flexible sheet, the sheet may also be formed in a roller shape.

[0223] Furthermore, the exposure apparatus described in each of the embodiments can be used to manufacture liquid crystal display devices as micro-elements. First, a so-called photolithography process is performed to form a pattern image on a photosensitive substrate (such as a glass substrate coated with resist). Through this photolithography process, a predetermined pattern including multiple electrodes is formed on the photosensitive substrate. Then, the exposed substrate is subjected to various processes such as a development process, an etching process, and a resist stripping process, thereby forming the predetermined pattern on the substrate. Subsequently, by performing processes such as a color filter formation process, a unit assembly process, and a module assembly process, a liquid crystal display device as a micro-element can be obtained.

[0224] Furthermore, all publications, international publications, U.S. patent application publications, and U.S. patent specifications relating to the exposure apparatus cited in the preceding description are incorporated into this specification as part of its record.

[0225] The embodiments described above are preferred embodiments of the present invention. However, they are not limited thereto, and various modifications can be made without departing from the spirit of the present invention.

Claims

1. A stage device comprising: a moving body having a first support surface that supports an object; a support portion having a prescribed thickness that contacts and supports the moving body so as to be elastically deformable; a support device having a second support surface that supports the support portion; a first drive portion that causes the moving body that is supported by the support portion to relatively move with respect to the support device; and a second drive portion that moves the moving body so as to change an angle that the first support surface makes with the second support surface, the support portion is not linked to the first drive portion, and in conjunction with a change in the angle based on the second drive portion, the support portion supports the moving body in a manner in which the prescribed thickness on one side where the first support surface and the second support surface are narrow is thinned, and the prescribed thickness on the other side where the first support surface and the second support surface are wide is thickened.

2. A stage device comprising: a moving body having a first support surface that supports an object; a support portion having a first support member and a second support member that are elastically deformable and contact and support the moving body from below; a support device having a second support surface that supports the support portion; a first drive portion that causes the moving body that is supported by the support portion to relatively move with respect to the support device; and a second drive portion that moves the moving body so as to change an angle that the first support surface makes with the second support surface, the support portion is not linked to the first drive portion, and in conjunction with a change in the angle based on the second drive portion, the support portion supports the moving body in a manner in which the first support member that supports one side where the first support surface and the second support surface are narrow is contracted, and the second support member that supports the other side where the first support surface and the second support surface are wide is elongated.

3. A stage device comprising: a moving body having a first support surface that supports an object; a support portion that contacts and supports the moving body in a manner in which a force in a direction upward from a gravitational direction is imparted toward a second support surface that is different from the first support surface; a first drive portion that moves the moving body that is supported by the support portion in a horizontal plane; a second drive portion that moves the moving body so as to change the moving body from a first state to a second state in which an inclination angle of the first support surface is changed, the support portion is not linked to the first drive portion, and with respect to the moving body that becomes the second state, the support portion supports the moving body in mutually different forces at mutually different first and second positions on the second support surface in a direction that intersects the gravitational direction.

4. The stage device according to claim 3, wherein the support portion has a first support member that supports the moving body at the first position, and a second support member that supports the moving body at the second position.

5. The stage device according to claim 4, wherein the first support member and the second support member support the moving body by different elastic forces with respect to the moving body. ​ ​ ​ 6. The table device according to claim 3, comprising a support device that supports the support portion from below.

7. A table device comprising: a mobile body having a first support surface that supports an object; a support device having a second support surface that supports the mobile body; a first drive portion that moves the mobile body in a horizontal plane; and a support portion that is not linked to the first drive portion, is disposed between the mobile body and the support device in a direction of gravity, contacts and supports the mobile body, and is thinner in thickness on a side where a distance between the first support surface and the second support surface is narrow and is thicker in thickness on another side where the distance between the first support surface and the second support surface is wide.

8. The table device according to claim 7, wherein a second drive portion that moves the mobile body to change an angle formed by the first support surface and the second support surface is further included.

9. A table device comprising: a mobile body that places an object; a support portion that contacts and supports the mobile body from below; a first drive portion that moves the mobile body that is contacted and supported by the support portion in a horizontal plane; and a second drive portion that drives the mobile body to change a posture of the mobile body from a first state to a second state, the support portion is not linked to the first drive portion, the support portion includes an elastic member that is elastically deformable with respect to a load applied from the mobile body to the support portion, the elastic member changes a distribution of heights of the elastic member in correspondence with a change in the posture of the mobile body based on the second drive portion.

10. A table device comprising: a mobile body that places an object; a support portion that contacts and supports the mobile body from below; a first drive portion that moves the mobile body that is contacted and supported by the support portion in a horizontal plane; and a second drive portion that drives the mobile body to change a posture of the mobile body from a first state to a second state, the support portion is not linked to the first drive portion, the support portion includes an elastic member that is elastically deformable with respect to a load applied from the mobile body to the support portion, the elastic member changes heights of the elastic member in a direction orthogonal to a direction of gravity at mutually different positions in correspondence with a change in the posture of the mobile body based on the second drive portion.

11. A table device comprising: a mobile body that places an object; a support portion that contacts and supports the mobile body from below; a first drive portion that moves the mobile body that is contacted and supported by the support portion in a horizontal plane; and a second drive portion that drives the mobile body to change a posture of the mobile body from a first state to a second state, the support portion is not linked to the first drive portion, the support portion includes an elastic member that is elastically deformable with respect to a load applied from the mobile body to the support portion, the elastic member changes a ratio of heights of the elastic member in a direction of gravity at a first position and a second position that are mutually different in a direction orthogonal to the direction of gravity to different magnitudes in the first state and the second state.

12. The stage device according to any one of claims 1 to 11, wherein the first drive section includes a first member, the moving body includes a second member, the second drive section causes the moving body to relatively move with respect to the first drive section via the first member and the second member which are disposed in non-contact with each other.

13. The stage device according to claim 12, wherein the second drive section transmits a driving force to relatively move the moving body with respect to the support device by the first drive section to the moving body via the first member and the second member.

14. The stage device according to claim 13, wherein the first member is disposed at a position substantially coinciding with a center of gravity of a structure including the moving body and the support section.

15. The stage device according to claim 14, wherein the second drive section rotates the structure with the center of gravity as a center of rotation.

16. The stage device according to claim 12, wherein a plate spring is included, the plate spring being disposed with one end connected to the moving body, the other end connected to the support section, and a thickness direction parallel to a direction orthogonal to a movement reference surface of the moving body.

17. The stage device according to any one of claims 1 to 11, wherein the support section is connected to the moving body.

18. The stage device according to any one of claims 1 to 11, wherein the support section has a damping mechanism which generates a damping force in a direction of gravity with respect to the moving body.

19. The stage device according to any one of claims 1 to 11, wherein the support section is a gas spring in which a gas is filled inside.

20. The stage device according to claim 19, wherein the moving body is hollow, an inside of the moving body communicates with an inside of the gas spring.

21. The stage device according to any one of claims 1 to 11, wherein the support section is a coil spring.

22. An exposure device comprising: the stage device according to any one of claims 1 to 21; and a pattern formation device which forms a prescribed pattern on the object by an energy beam.

23. The exposure device according to claim 22, wherein the object is a substrate for a flat panel display.

24. The exposure device according to claim 23, wherein at least one side of the substrate has a length or a diagonal length of 500 mm or more.

25. A manufacturing method of a flat panel display, comprising: exposing the object using the exposure device according to any one of claims 22 to 24; and developing the exposed object.

26. A device manufacturing method, comprising: exposing the object using the exposure device according to any one of claims 22 to 24; and developing the exposed object.

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