A miniature temperature measuring device for ultrasonic surgical scalpels and its application.

Abstract

This invention discloses a miniature temperature measuring device for ultrasonic surgical scalpels and its application. The device includes a packaging substrate, several miniature heat pipes, and several silicon chips. The miniature heat pipes are mounted in a honeycomb array on the back of the packaging substrate, and coolant is stored within each heat pipe on the back of the substrate. A silicon chip is mounted on the front of the packaging substrate corresponding to each heat pipe, enabling high-density spatial and temporal temperature measurement of the surface of the object being measured. This invention significantly improves the temporal and spatial precision of temperature measurement technology.

Description

Technical Field

[0001] This invention relates to the field of temperature measurement technology, and in particular to a miniature temperature measuring device for use in ultrasonic surgical scalpels and its application. Background Technology

[0002] Existing temperature measurement technologies include contact and non-contact methods. Contact measurement technologies use relatively large temperature sensing devices, making it difficult to deploy many on the surface of the object being measured, resulting in sparse sampling points and low spatial resolution. Since contact measurement relies on changes in the physical properties of the sensing device to measure temperature, it cannot perform measurements in real time. After each measurement, the device's physical properties must recover before the next measurement can be performed. This is particularly problematic in measurement spaces with unstable volumes and dynamically changing temperatures, leading to poor measurement accuracy. Furthermore, there is an unavoidable time delay in temperature measurement; for example, temperature conduction to the probe and subsequent temperature change within the probe result in poor spatial resolution. The time required for temperature conduction to change physical properties also contributes to low temporal resolution. Non-contact measurement technologies use optical techniques to measure the observable area of ​​the object being measured, but cannot measure the temperature of unobservable areas, thus presenting an insurmountable limitation. For example, the precision of optical acquisition directly limits the spatial resolution of the measurement. Since the measurement is performed on an image, the speed of optical acquisition and subsequent temperature conversion directly affects the temporal resolution of the measurement. This is due to two major drawbacks: the inability to measure unobservable areas and the low accuracy of measurements on materials that easily cause reflection within the measurement area. Furthermore, the effect of surface thermal conduction can lead to errors in single-point measurements, which affect both temporal and spatial resolution, indirectly reducing the measurement accuracy.

[0003] In current ultrasonic scalpels, when the scalpel head grips tissue and cuts it using mechanical energy, the tissue heats up rapidly and produces smoke, which can obstruct the surgeon's view, especially when the tissue is in a confined area. This increases the procedure time and may cause excessive tissue damage. Existing temperature measurement devices cannot get close enough to measure the temperature of the tissue during the ultrasonic scalpel's operation, and most temperature measuring devices cannot enter the scalpel's working area for measurement, nor do they meet the required dimensions for installation. Summary of the Invention

[0004] This application provides a miniature temperature measuring device for use in ultrasonic scalpels and its application, which solves the defects of existing temperature measuring technologies in terms of time and space. It adopts a honeycomb array for temperature measurement and heat dissipation to achieve high-density temperature measurement of the surface of the object being measured in both space and time.

[0005] In a first aspect, embodiments of this application provide a miniature temperature measuring device for use in ultrasonic surgical scalpels, including a packaging substrate, a plurality of miniature heat pipes, and a plurality of silicon chips;

[0006] The micro heat pipes are mounted in a honeycomb array structure on the back of the packaging substrate, and coolant is stored within each micro heat pipe on the back of the packaging substrate. A silicon chip is mounted on the front area of ​​each micro heat pipe on the packaging substrate to achieve high-density temperature measurement of the surface of the object under test in both space and time. The above technical features have the following advantages: high-density temperature measurement in space is achieved by arranging silicon chips in a honeycomb array; and high-density temperature measurement in time is achieved by configuring each silicon chip with coolant.

[0007] Furthermore, the silicon chip is encapsulated on the packaging substrate using a 2.5D packaging process, enabling high-density temperature measurement operations on the front side of the packaging substrate. The above technical features offer the following advantages: the 2.5D packaging process allows for a tighter interconnection between the silicon chip and the packaging substrate, resulting in smaller package size, lower power consumption, and fewer pins.

[0008] Furthermore, it also includes a thermally conductive pad, through which the silicon chip is encapsulated within the micro heat pipe, so that when the thermally conductive pad contacts the surface of the object being tested, the heat from the surface of the object is promptly conducted to the silicon chip for detection. The above technical features have the following advantages: the silicon chip can quickly measure temperature without direct contact with the surface being tested; from the perspective of aesthetics of the spatial structure and the user experience of the contact surface, it is more beneficial to the product's lifespan and user experience.

[0009] Furthermore, it also includes a circulation pump, which is installed on the micro heat pipe to enable unidirectional flow of the coolant within the micro heat pipe. This coolant removes heat absorbed by the silicon chip from the packaging substrate, thereby cooling the silicon chip, shortening the time interval between two consecutive temperature measurements, and simultaneously controlling the temperature of the silicon chip within the desired temperature range. The above technical features have the following advantages: First, by using a circulation pump to control the unidirectional flow of the coolant within the micro heat pipe, heat can be quickly removed, improving the cooling effect of the silicon chip, shortening the time interval between two consecutive temperature measurements, and increasing the measurement speed. Second, depending on different application scenarios, the type of coolant can be changed without replacing the product; simply replacing the coolant is sufficient, which helps to expand the application range of the micro temperature measuring device and extend its service life. Third, based on the heat absorption effect of different coolants and the safe temperature range of the measured object, the flow rate of the coolant is controlled by the circulation pump, effectively maintaining the temperature of the silicon chip within the optimal temperature range for measurement accuracy.

[0010] Furthermore, the thermally conductive pad is made of a material with high thermal conductivity, high temperature resistance, and wear resistance. Teflon material is preferred. Using Teflon material provides the following technical advantages: the temperature-measuring working surface of the miniature temperature-measuring device used in ultrasonic scalpels exhibits beneficial effects such as high temperature resistance, low temperature resistance, corrosion resistance, weather resistance, high lubricity, non-adhesion, non-toxicity, aging resistance, non-flammability, acid and alkali resistance, oxidation resistance, insulation, and neutral acid and alkali properties. This facilitates the application of miniature temperature-measuring devices in aerospace, military manufacturing, wire and cable, chemical corrosion protection, electronics, bridge construction, automobile manufacturing, machinery manufacturing, medical devices, and other fields.

[0011] Furthermore, the micro heat pipes are made of heat-insulating material, so that when several micro heat pipes are mounted on the encapsulation substrate in a honeycomb array structure, heat only propagates within the pipes, and the pipes do not affect each other due to heat insulation. The above technical features have the following technical effects: because the micro heat pipes are made of heat-insulating material and arranged in a honeycomb array structure, all micro heat pipes form a porous, multiphase structure, and heat can only propagate within the pipes, preventing transfer to adjacent micro heat pipes through the pipe walls.

[0012] Furthermore, a frequency generator is provided on the packaging substrate. This frequency generator drives all the silicon chips on the packaging substrate to synchronously perform temperature measurement operations. The frequency generator also adjusts the temporal resolution of the temperature measurement operations of the silicon chips, enabling high-density temperature measurement of the surface of the object under test over time. The above technical features have the following advantages: synchronous temperature acquisition of all silicon chips is achieved through the same frequency generator; and by adjusting the trigger frequency of the frequency generator, the temperature acquisition speed can be increased, thereby improving the measurement temporal resolution.

[0013] Furthermore, the silicon chip is fabricated using a bare die. The above technical features have the following advantages: they are more conducive to reducing the overall size of the device and improving the sensitivity and accuracy of temperature measurement.

[0014] Furthermore, the method by which the silicon chip achieves high-density temperature measurement of the surface of the object under test in both space and time is as follows:

[0015] S1: Obtain relevant parameters of the coolant and the temperature measurement value of the surface of the object being tested; wherein, some relevant parameters of the coolant are associated with the circulation pump, and the flow rate of the coolant in the micro heat pipe is controlled by the circulation pump;

[0016] S2: Calculate the actual temperature value of the object to be processed using a temperature restoration algorithm; wherein, the temperature restoration algorithm adopts the formula:

[0017]

[0018] in, The thermal conductivity of the coolant. It is the flow rate of the coolant. The temperature measurement value detected by the miniature temperature measuring device. The actual temperature value of the object to be processed. The heat dissipation coefficient is the efficiency of heat dissipation by the coolant from the micro heat pipe. The above technical features have the following advantages: because the temperature restoration algorithm developed to address measurement distortion, real-time temperature measurement can be achieved based on parameters such as the coolant's thermal conductivity, flow rate, and heat dissipation efficiency, without waiting for heat transfer time, thus improving the temporal resolution of high-density temperature measurement.

[0019] Secondly, this embodiment provides a system that uses the miniature temperature measuring device for ultrasonic scalpels as described in any one of the first aspects. The system includes a control terminal, an execution terminal, and the miniature temperature measuring device for ultrasonic scalpels. The miniature temperature measuring device is installed on the execution terminal, and the control terminal is electrically connected to the execution terminal and the miniature temperature measuring device.

[0020] The control terminal controls the execution terminal to process the object by measuring the actual temperature value of the object to be processed through the miniature temperature measuring device. The above technical features have the following technical effects: Based on the miniature temperature measuring device of the first aspect, this system can achieve the beneficial effect of real-time monitoring of the object to be processed during actual operation; for some objects to be processed that are sensitive to abnormal temperatures, the processing method and temperature can be adjusted to ensure that excessively high temperatures do not cause excessive damage to the object to be processed or related electronic components; based on the real-time measurement data of the miniature temperature measuring device, the structure and materials of the execution terminal can be optimized, facilitating the provision of raw data for cost reduction and efficiency improvement. Attached Figure Description

[0021] Figure 1 This is a cross-sectional schematic diagram of a single temperature measuring point in Embodiment 1 of this application;

[0022] Figure 2 This is a top view of the assembly of a miniature temperature measuring device applied to an ultrasonic scalpel according to Embodiment 1 of this application;

[0023] Figure 3 This is a schematic diagram of the ultrasonic cutting tool structure in the application example of this application;

[0024] Figure 4 This is a schematic diagram of the temperature-time heat conduction stage in an application example of this application.

[0025] Reference numerals in the attached figures: Miniature temperature measuring device 100, packaging substrate 110, miniature heat pipe 120, silicon chip 130, thermal pad 140, clamping component 200, cutting component 300, positioning hole 111. Detailed Implementation

[0026] To better understand the above technical solutions, the following will provide a detailed explanation of the technical solutions in conjunction with the accompanying drawings and specific implementation methods.

[0027] Example 1

[0028] This embodiment provides a miniature temperature measuring device for use in ultrasonic surgical scalpels. This miniature temperature measuring device can solve the spatial and temporal accuracy defects of existing temperature measuring devices. For example, it addresses the shortcomings of deploying large-volume temperature measuring devices on the surface of the object being measured, the sparse placement of temperature measuring points on the surface of the object leading to low spatial resolution, the impact of dynamic temperature changes on real-time measurement, and the inability to perform temperature measurement in some non-contact applications. The miniature temperature measuring device provided in this embodiment overcomes several shortcomings of existing temperature measuring devices through its advantages of small size, fast measurement speed, and dense temperature measuring points. By applying semiconductor fabrication technology to the miniature temperature measuring device of this embodiment, the resulting device effectively meets the temperature measurement needs of some special scenarios, such as the internal wound tissue temperature measurement requirements in minimally invasive surgery.

[0029] Reference Appendix Figure 1-2 As shown, the miniature temperature measuring device 100 provided in this embodiment includes a packaging substrate 110, a plurality of miniature heat pipes 120, and a plurality of silicon chips 130. The miniature heat pipes 120 are mounted in a honeycomb array structure on the back side of the packaging substrate 110, and coolant is stored within the miniature heat pipes 120 on the back side of the packaging substrate 110. A silicon chip 130 is mounted on the front side of the packaging substrate 110 where each miniature heat pipe 120 is located, enabling continuous high-density temperature measurement of the surface of the object being measured. Therefore, the miniature temperature measuring device applied to an ultrasonic scalpel in this embodiment achieves rapid heat dissipation of the silicon chips through coolant, solving the technical problem of insufficient temporal resolution in continuous temperature measurement. Furthermore, by using a honeycomb array structure to arrange the miniature heat pipes, high-density temperature measurement points are achieved simultaneously with high-density heat dissipation technology matching these high-density measurement points. Furthermore, the honeycomb array arrangement of the silicon chips achieves high-density temperature measurement in the measurement space, and each silicon chip is equipped with coolant, achieving high-density temperature measurement in the measurement time. The micro heat pipe 120 in this embodiment can be understood as a capillary heat pipe.

[0030] In this embodiment, a silicon chip 130 is used as the temperature sensing element. Leveraging the relatively high linearity of silicon chip material, the accuracy of temperature measurement is greatly improved, achieving high resolution and high precision. Since the size and accuracy of common temperature measuring devices such as thermocouples, RTDs, and thermistors cannot meet the measurement requirements, this embodiment uses a silicon chip as the temperature sensing element. In most scenarios, the silicon chip can provide analog and digital outputs without cold junction temperature compensation or linearization, and based on a pre-calibrated algorithm, the actual temperature value of the surface of the object being measured can be obtained.

[0031] To further explain, the silicon chip 130 in this embodiment includes transistors. When the silicon chip performs a temperature measurement operation, the transistors utilize... The temperature dependence, according to the Mohr equation, is expressed as follows: ,in, For collector current, This is the reverse saturation current of the transistor. The charge on the electron is 1.605 * 2 - 19 coulombs. Here, is the Boltzmann constant (1.38 × 10⁻²³), and T is the absolute temperature. The expression for collector current also applies to the current in a diode; however, the current in a diode also includes the recombination current generated by electrons recombining with holes through the depletion region of the PN junction. This indicates that the diode current contains… The relationship between temperature and current is non-linear. Of course, this current also appears in bipolar transistors, but it flows into the base of the transistor and does not appear in the collector current, therefore the degree of non-linearity is much lower. Integrating the above factors, we can conclude... It can be seen according to The logarithmic change in the value is linear, if and Since K and q are also constants, then The temperature changes linearly. When a constant collector current is applied to the transistor, the temperature can be measured. With temperature changes. Furthermore, It is related to the geometry of the silicon chip and is highly temperature-dependent. For example, its value doubles for every 10°C increase in temperature. Although the ln function reduces the effect of current changes, it still has... The absolute value of the transistor varies with the transistor's temperature, thus requiring calculation and calibration of the actual temperature value. In this embodiment, all silicon chips 120 include two identical silicon bulk transistors, driving... The collector current enters a silicon bulk transistor. Entering another adjacent silicon transistor, an identical silicon transistor and a precisely ratio current are generated in the integrated circuit. A logarithmic change in the current will cause... A linear change occurs, then measurement is performed. The difference. This is achieved by passing different currents through each transistor and measuring... The difference eliminates nonlinearity. Items, different The effects of transistor geometry, and all other nonlinear effects.

[0032] In this embodiment, the silicon chip 120 is encapsulated on the packaging substrate 110 using a 2.5D packaging process, enabling high-density temperature measurement operations on the front surface of the packaging substrate 110. The 2.5D packaging process allows for tighter interconnection between the silicon chip and the packaging substrate, resulting in smaller package size, lower power consumption, and fewer pins. The 2.5D packaging process is a semiconductor packaging manufacturing process. In this embodiment, several silicon chips 130 are packaged into a high-density temperature measurement point array. Further, the 2.5D packaging process in conventional semiconductor packaging manufacturing involves placing processors, memory chips, or other types of chips side-by-side on a silicon interposer. These chips are first connected via microbumps, and then metal lines within the silicon interposer transmit signals from different chips. Next, through-silicon vias (TSVs) connect the metal bumps, and then external metal balls are connected via a lead carrier, achieving tighter interconnection between the chips and the packaging substrate. Therefore, when this 2.5D packaging process is applied to this embodiment, it can be understood that this embodiment arranges all silicon chips side by side on the packaging substrate, connects them through microbumps, transmits the acquisition signals of different silicon chips through the metal lines in the packaging substrate, and then connects to the external metal balls through through-hole metal bumps and wire carriers to achieve a tighter interconnection between silicon chips and the packaging substrate.

[0033] This embodiment, based on an encapsulation substrate 110, several micro heat pipes 120, and several silicon chips 130, also includes a thermal pad 140. The silicon chips 130 are encapsulated within the micro heat pipes 120 via the thermal pad 140, so that when the thermal pad 140 contacts the surface of the object under test, the heat from the surface of the object is promptly conducted to the silicon chip 130 for detection. It should be understood that the heat on the surface of the object under test is a measured temperature value, not the actual temperature value. In this embodiment, the thermal pad 140 is made of a material with high thermal conductivity, high temperature resistance, and wear resistance. Preferably, the thermal pad 140 is made of Teflon material. Furthermore, the use of Teflon material gives the temperature measuring surface of the miniature temperature measuring device used in ultrasonic scalpels beneficial effects such as high temperature resistance, low temperature resistance, corrosion resistance, weather resistance, high lubricity, non-adhesion, non-toxicity, aging resistance, non-flammability, acid and alkali resistance, oxidation resistance, insulation, and neutral acid and alkali properties. This facilitates the application of miniature temperature measuring devices in aerospace, military manufacturing, wire and cable, chemical corrosion protection, electronics, bridge construction, automobile manufacturing, machinery manufacturing, medical devices and other fields.

[0034] In this embodiment, the micro heat pipes 120 are made of heat-insulating material, so that when several micro heat pipes 120 are mounted on the packaging substrate 110 in a honeycomb array structure, heat only spreads inside the pipes, and the pipes do not affect each other due to heat insulation. Further, in this embodiment, the several micro heat pipes 120 are arranged in a honeycomb array structure. Since the packaging substrate 110 has pre-set positioning holes 111 for mounting the micro heat pipes, after the micro heat pipes 120 are mounted on the packaging substrate 110, they partially extend out of the positioning holes 111. The micro heat pipes extending out of the positioning holes 111 form a silicon chip mounting area. Therefore, it can be understood that the packaging substrate 110 divides the interior 120 of each micro heat pipe into two areas: one area for mounting the silicon chip 130, and the other area for storing the coolant. Furthermore, in this embodiment, the entire silicon chip mounting area of ​​the honeycomb array structure is encapsulated by a thermally conductive pad 140, and the thermally conductive pad 140 can directly contact the surface of the object under test. This improves the spatial measurement accuracy of the object's surface while, based on the thermal insulation performance of the micro heat pipes 120, enabling adjacent micro heat pipes 120 to form high-precision temperature measurement points through the thermally conductive pad 140, and ensuring that the silicon chips within adjacent micro heat pipes 120 do not interfere with each other. Further, it can be understood that the micro heat pipe 120 in this embodiment is a unidirectional conduit used to carry coolant. It is fixed to the encapsulation substrate 110 at the positioning hole 111 using a sealing material. The outer wall of the micro heat pipe 120 cannot transfer heat, while the coolant is a highly thermally conductive liquid that rapidly dissipates heat from the silicon chip 130, achieving rapid cooling and heat dissipation of the silicon chip 130.

[0035] Furthermore, to improve the temperature measurement effect of the silicon chip 130 within each micro heat pipe 120, this embodiment also fills the mounting area of ​​the silicon chip 130 within each micro heat pipe 120 with thermally conductive material. This avoids gaps around the silicon chip affecting thermal conductivity measurement, allowing heat from the surface of the object being measured to be conducted to the silicon chip 130 in an undirected manner through the thermal pad. Common thermally conductive filling materials include, but are not limited to, thermally conductive grease, thermally conductive silicone, and graphite.

[0036] This embodiment also includes a circulation pump, which is installed on the micro heat pipe 120 to enable unidirectional flow of the coolant within the micro heat pipe 120. This coolant carries away the heat absorbed by the silicon chip 130 from the packaging substrate 110, thereby cooling the silicon chip and shortening the time interval between two consecutive temperature measurements. Simultaneously, the circulation pump controls the temperature of the silicon chip 130 within the desired temperature range. The coolant within the micro heat pipe 120 also flows unidirectionally through an external circulation pump, carrying away the heat absorbed by the silicon chip 130 from the packaging substrate 110, thus cooling the silicon chip 130. In this embodiment, the coolant flows unidirectionally within the micro heat pipe 120, allowing for rapid circulation and heat dissipation via the external circulation pump. Furthermore, the micro heat pipe 120 has thermal insulation properties, preventing heat transfer through its outer wall, thus ensuring that each temperature measurement point is unaffected by heat from surrounding temperature measurement points or the surface of the object being measured.

[0037] The miniature temperature measuring device 100 in this embodiment can achieve high-density temperature measurement in both space and time. Therefore, to solve the problem of insufficient time resolution and to allow the heat absorbed by the silicon chip 130 and its surroundings to dissipate as quickly as possible for the next temperature measurement, a flowable coolant is filled inside the miniature heat pipe. This coolant can be, but is not limited to, Novec fluorinated liquid, gallium nitride (GaN), etc., and this embodiment does not limit the use of such coolant. In this embodiment, when the silicon chip 130 performs temperature measurement, the coolant inside the miniature heat pipe 120 is controlled by an external circulation pump to flow unidirectionally within the miniature heat pipe, continuously cooling and dissipating heat from the silicon chip 130. This greatly reduces the measurement interval time caused by the silicon chip 130's inability to dissipate heat in time.

[0038] To further explain, the silicon chip 130 in this embodiment can be understood as a chip structure formed by processing silicon wafers through integrated circuit fabrication. Based on the physical characteristics of silicon wafers, when the external temperature of the silicon wafer changes, the silicon chip 130 undergoes a change in its physical properties, which is ultimately converted into an electrical signal to achieve temperature measurement. In one embodiment, each silicon wafer integrates at least two transistors. Since the measurement accuracy of silicon wafers varies significantly across different temperature ranges due to their physical characteristics, after calibration, the silicon wafer can achieve high measurement accuracy within the temperature range of -10 to 85 degrees Celsius. Therefore, in this embodiment, a coolant is introduced to maintain the operating temperature of the silicon wafer within a safe range, tailored to the specific application scenario.

[0039] In this embodiment, the silicon chip 130 and the micro heat pipe 120 are combined to form a temperature measuring point. Various configurations, such as 3*3, 5*20*, and 6*18, can be achieved through design combinations. In one embodiment, this embodiment provides a specific micro temperature measuring device 100, in which... The packaging substrate 110 has 45 temperature measuring points, and the size of the silicon chip at each temperature measuring point is... It can be seen that, in The packaging substrate can accommodate 45 temperature sensing points, each with a corresponding micro heat pipe and a silicon chip. Each silicon chip is approximately [size missing]. .

[0040] To further explain, the silicon chip 130 in this embodiment is packaged as a bare die, which is more conducive to reducing the overall size of the device and improving the sensitivity and accuracy of temperature measurement.

[0041] Based on the relevant technical solutions in the embodiments of this application, at least the following technical effects are achieved: The miniature temperature measuring device for ultrasonic scalpels in this embodiment adopts a honeycomb array structure to arrange miniature heat pipes. All the miniature heat pipes are divided into two areas by the encapsulation substrate. One area is equipped with a silicon chip, which acquires local temperature data of the surface of the object being measured. The other area stores coolant, which dissipates heat from the silicon chip. This reduces the heat generated by the silicon chip during temperature measurement by cooling the coolant, thereby reducing the interval time of continuous temperature measurement by the silicon chip. Thus, high-density temperature measurement of the silicon chip is achieved in terms of time. At the same time, since the entire temperature measuring point is in a honeycomb array structure, high-density temperature measurement in space is achieved, which is more conducive to temperature measurement in small and hidden areas.

[0042] The method for achieving high-density spatial and temporal temperature measurement of the surface of the object under test using a silicon chip in this embodiment is as follows:

[0043] S1: Acquire relevant parameters of the coolant and temperature measurements of the surface of the object being tested; among them, some relevant parameters of the coolant are related to the circulation pump, and the flow rate of the coolant in the micro heat pipe is controlled by the circulation pump;

[0044] S2: Calculate the actual temperature value of the object to be processed using a temperature reduction algorithm; the temperature reduction algorithm uses the following formula:

[0045]

[0046] in, The thermal conductivity of the coolant. It is the flow rate of the coolant. Temperature measurements detected by miniature temperature measuring devices. The actual temperature value of the object to be processed. The heat dissipation coefficient is the efficiency of heat dissipation by the coolant from the micro heat pipe.

[0047] Example 2

[0048] This application provides a system that utilizes any of the miniature temperature measuring devices for ultrasonic surgical scalpels described in Embodiment 1. The system includes a control terminal, an execution terminal, and a miniature temperature measuring device. The miniature temperature measuring device is mounted on the execution terminal, and the control terminal is electrically connected to both the execution terminal and the miniature temperature measuring device.

[0049] This embodiment is based on an improved miniature temperature measuring device. The miniature temperature measuring device measures and acquires the actual temperature value of the object to be processed and transmits it to the control terminal; the control terminal controls the execution terminal to process the object to be processed based on the actual temperature value.

[0050] Application examples

[0051] This application provides an application example in Embodiment 2, which is an ultrasonic scalpel control system. An ultrasonic scalpel can be understood as a high-intensity focused ultrasound treatment device. The object to be treated in Embodiment 2 can be experimental biological tissue, such as blood vessels, liver, uterus, etc.

[0052] The ultrasonic scalpel control system uses ultrasonic energy to process soft tissue, simultaneously cutting and coagulating, ensuring minimal lateral thermal damage to the tissue. It is suitable for cutting soft tissue where bleeding needs to be controlled and minimal thermal damage minimized. Current ultrasonic scalpel control systems are used in various minimally invasive surgical procedures.

[0053] The main components of an ultrasonic scalpel include a control terminal, a drive handle and wiring, an ultrasonic blade, and a foot switch. Its working principle is to activate the ultrasonic blade by foot or hand. At this time, the control terminal outputs electrical energy at the resonant frequency of the vibration system to the drive handle, which converts the electrical energy into mechanical energy and outputs it to the blade head. The ultrasonic blade further amplifies this vibration to produce mechanical vibration, causing water vaporization in tissue cells, protein hydrogen bond breakage, cell disintegration, tissue cutting or coagulation, thereby achieving the purpose of cutting tissue and stopping bleeding.

[0054] In this application example, the ultrasonic scalpel control system includes a control terminal, an execution terminal, and a miniature temperature measuring device. The execution terminal can be understood as an ultrasonic scalpel. (See attached diagram.) Figure 3 As shown, the ultrasonic cutter includes a cutting component 300, a clamping component 200, and a miniature temperature measuring device 100 disposed inside the clamping component 200. The control terminal is electrically connected to the cutting component 300, the clamping component 200, and the miniature temperature measuring device 100 respectively. The control terminal improves the control of the ultrasonic vibration frequency based on the temperature data of the surface of the object being tested measured by the miniature temperature measuring device.

[0055] To further explain, the ultrasonic scalpel structure in this application example is based on the existing conventional rod-type ultrasonic scalpel structure, with improvements in layout and system control. Structurally, it includes a rod, a transducer, and an ultrasonic generator. The rod includes an inner tube and an outer tube. The front end of the inner tube is threadedly connected to the cutting element 300 and rotatably connected to the clamping element 200. During operation, the clamping element 200 is positioned above the cutting element 300. When the ultrasonic scalpel is working, the transducer and ultrasonic generator are connected, and the cutting element 300, located inside the inner tube, extends and generates ultra-high frequency vibrations to cut the object to be processed. The clamping element 200 holds the cutting part, thereby performing the corresponding operation. This embodiment does not limit how the ultrasonic scalpel cuts and clamps.

[0056] In this embodiment, the miniature temperature measuring device 100 collects the temperature measurement value of the surface of the object to be processed, calculates and reconstructs the actual temperature value of the object, and the control terminal controls the cutting vibration frequency of the cutting component 300 according to the actual temperature value. After the cutting component 300 clamps the object to be processed through the clamping component 200, the cutting component 300 is controlled to perform ultrasonic cutting and hemostasis on the clamped object by high-frequency unidirectional reciprocating vibration. Furthermore, the control terminal has a preset method for calculating the actual temperature value. The specific method for calculating and reconstructing the actual temperature value of the object to be processed based on the temperature measurement value includes:

[0057] The process involves acquiring coolant-related parameters, temperature measurements from a micro-temperature measuring device, and the ultrasonic cutting execution time associated with those temperature measurements. Coolant-related parameters include thermal conductivity based on coolant type, control parameters of the circulating pump, coolant flow rate, and heat dissipation efficiency of the coolant removing heat from the micro-heat pipe. A temperature reduction algorithm is then used to calculate the actual temperature of the object being processed; the temperature reduction algorithm uses the following formula: ,in, The thermal conductivity of the coolant. It is the flow rate of the coolant. Temperature measurements detected by miniature temperature measuring devices. The actual temperature value of the object to be processed. The heat dissipation coefficient is the efficiency by which the coolant removes heat from the micro heat pipe.

[0058] The technical solutions in the above embodiments of this application have at least the following technical effects: To address the problem of insufficient time resolution in temperature measurement operations, a coolant is introduced in this embodiment. This coolant can quickly dissipate the heat from the silicon chip and initiate the next temperature measurement. Therefore, based on improved testing efficiency, this embodiment correlates the heat dissipation time with the temperature measurement execution time, introducing a correlation algorithm. The specific rules of the correlation algorithm are not limited; in this embodiment, it is understood that the next temperature measurement operation can be executed without waiting for the heat conduction time during the heat dissipation process. Furthermore, during the operation of the ultrasonic scalpel in this embodiment, the maximum temperature of the scalpel head can reach approximately 170°C, which is far beyond the optimal temperature measurement range for the silicon wafer. The introduction of a coolant in this embodiment can maintain the working temperature of the silicon wafer below 85°C, thereby ensuring stable and accurate temperature measurement during the ultrasonic scalpel operation and avoiding distortion of measurement results in actual measurement processes. The temperature restoration algorithm developed in this embodiment, combined with parameters such as the thermal conductivity, flow rate, and heat dissipation efficiency of the coolant, enables real-time measurement of the surface temperature of the object being measured during ultrasonic scalpel operation, without waiting for the heat dissipation time of the silicon chip. (See attached figure) Figure 4 As shown in the diagram, point A indicates that the coolant is turned on for unidirectional heat conduction circulation. Before the coolant circulation is turned off, heat transfer is mainly through convection. Point B indicates that the surface temperature of the object being measured has reached a relatively stable state, at which point the difference between the measured temperature value and the actual temperature value is nearly equal. Point C indicates that a single ultrasonic scalpel operation has ended, excitation has stopped, and the temperature begins to drop. At this point, coolant circulation stops, and the system re-enters the heat conduction phase. Points A and C in the diagram show that the settings should be adjusted according to actual needs to maintain consistency with the working state of the ultrasonic scalpel.

[0059] Although preferred embodiments of the invention have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including both the preferred embodiments and all changes and modifications falling within the scope of the invention.

[0060] Obviously, those skilled in the art can make various modifications and variations to this invention without departing from the scope of the invention.

[0061] The spirit and scope of the invention are as follows: Thus, if these modifications and variations of the invention fall within the scope of the claims of the invention and their equivalents, the invention is also intended to include these modifications and variations.

Claims

1. A miniature temperature measuring device for use in ultrasonic surgical scalpels, characterized in that, It includes a packaging substrate, several micro heat pipes, and several silicon chips; The micro heat pipes are installed in a honeycomb array structure on the back of the packaging substrate, and the micro heat pipes on the back of the packaging substrate store coolant to remove the heat absorbed by the silicon chip by the packaging substrate, thereby achieving cooling and heat dissipation of the silicon chip. Each micro heat pipe is installed on the front area of ​​the packaging substrate, and a silicon chip is installed to achieve high-density temperature measurement of the surface of the object under test in space and time. The micro heat pipes are made of heat-insulating material, so that when several micro heat pipes are installed in a honeycomb array structure on the packaging substrate, heat only spreads inside the pipes, and the pipes do not affect each other due to heat insulation. The method by which the silicon chip achieves high-density temperature measurement of the surface of the object under test in both space and time is as follows: S1: Obtain relevant parameters of the coolant and the temperature measurement value of the surface of the object being tested; wherein, some relevant parameters of the coolant are associated with the circulation pump, and the flow rate of the coolant in the micro heat pipe is controlled by the circulation pump; S2: Calculate the actual temperature value of the object to be processed using a temperature restoration algorithm; wherein, the temperature restoration algorithm adopts the formula: in, The thermal conductivity of the coolant. It is the flow rate of the coolant. The temperature measurement value detected by the miniature temperature measuring device. The actual temperature value of the object to be processed. The heat dissipation coefficient is the efficiency by which the coolant removes heat from the micro heat pipe.

2. The miniature temperature measuring device for ultrasonic scalpels as described in claim 1, characterized in that, The silicon chip is encapsulated on the packaging substrate using a 2.5D packaging process, so that the front area of ​​the packaging substrate can achieve high-density temperature measurement in space.

3. The miniature temperature measuring device for use in ultrasonic surgical scalpels as described in claim 1, characterized in that, It also includes a thermal pad, through which the silicon chip is encapsulated within the micro heat pipe, so that when the thermal pad contacts the surface of the object under test, the heat from the surface of the object under test is promptly conducted to the silicon chip for detection.

4. The miniature temperature measuring device for ultrasonic scalpels as described in claim 1, characterized in that, It also includes a circulation pump, which is installed on the micro heat pipe to enable the coolant in the micro heat pipe to flow in one direction, carrying away the heat absorbed by the silicon chip by the packaging substrate, thereby cooling the silicon chip, shortening the time interval between two consecutive temperature measurements, and controlling the temperature of the silicon chip within the required temperature range through the circulation pump.

5. The miniature temperature measuring device for use in ultrasonic scalpels as described in claim 3, characterized in that, The thermal pad is made of a material with high thermal conductivity, high temperature resistance and wear resistance.

6. The miniature temperature measuring device for ultrasonic surgical scalpels as described in claim 1 or 2, characterized in that, The packaging substrate is equipped with a frequency generator, which drives all the silicon chips on the packaging substrate to synchronously perform temperature measurement operations. The frequency generator also adjusts the time resolution of the temperature measurement operations of the silicon chips to achieve high-density temperature measurement of the surface of the object under test in time.

7. The miniature temperature measuring device for use in ultrasonic scalpels as described in claim 1, characterized in that, The silicon chip is fabricated using a bare die.

8. A system using the miniature temperature measuring device according to any one of claims 1-7, characterized in that, The device includes a control terminal, an execution terminal, and a miniature temperature measuring device for use with an ultrasonic scalpel. The miniature temperature measuring device is installed on the execution terminal, and the control terminal is electrically connected to both the execution terminal and the miniature temperature measuring device. The control terminal measures the actual temperature value of the object to be processed using the miniature temperature measuring device, and then controls the execution terminal to process the object.

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