Kit, microfluidic chip device, and methods of use thereof

Abstract

The present application relates to a kind of kit, microfluidic chip device and its use method, including flow assembly, flow channel is formed on flow assembly, first fluid connection hole is equipped on flow assembly, flow channel, first fluid connection hole are used to communicate with microfluidic chip;Positioning assembly is arranged on flow assembly, positioning assembly is located in the side of first fluid connection hole of flow assembly, limiting groove that is adapted to microfluidic chip is formed between positioning assembly and flow assembly;Cover plate assembly, cover plate assembly is arranged on flow assembly, positioning assembly is located between cover plate assembly and flow assembly.This application discloses a kind of kit for the use of microfluidic chip, the structure makes that microfluidic chip and external fluid between pipe connection structure more simple and convenient, without using traditional clamp to fix the fluid connection of microfluidic chip, not only reduce the use cost, make operation more simple, while greatly improve the use convenience and portability of microfluidic chip.

Description

Technical Field

[0001] This invention relates to the field of microfluidics, and in particular to a reagent kit, a microfluidic chip device, and a method of using the same. Background Technology

[0002] Microfluidics refers to the technology of manipulating minute amounts of fluid, often implemented using microfluidic chips. Among various microfluidic chips, flexible chips are particularly suitable for applications with numerous and complex microstructures that are difficult to process using plastic injection molding, as they can be fabricated using soft photolithography. When the volume of the fluid to be manipulated exceeds the chip's fluid storage capacity, it needs to be connected to an external fluid storage unit and flow path via a chip interface. For flexible chips, the earliest widely used connection method involved connecting a stainless steel capillary tube (steel needle) to a perforated flexible chip, utilizing the chip's elasticity to achieve a high-strength connection; however, drilling holes in flexible chips and connecting with steel needles carries a high risk of failure, and the cumbersome operation results in low efficiency.

[0003] Another popular connection method currently is to use a chip fixture to dock with a flexible chip. The connection is achieved through manual or automatic positioning and locking. The fixture scheme can be adjusted according to the needs to achieve a high-strength and high-efficiency chip connection. However, the fixture is expensive and complex to clean, and is only suitable for scenarios where cleaning fluid channels are not required or where the frequency of use is low. At the same time, the connection effect of the fixture is severely limited by the flatness of the flexible chip, and the high manufacturing cost of high-flatness flexible chips limits its widespread application. Summary of the Invention

[0004] Based on this, a microfluidic chip device is provided, which simplifies the structure of the connection between the microfluidic chip and the external fluid.

[0005] A reagent kit, characterized in that it comprises: a manifold assembly having a manifold channel formed thereon and a first fluid connection hole provided thereon, the manifold channel and the first fluid connection hole being for communicating with a microfluidic chip; a positioning assembly disposed on the manifold assembly, the positioning assembly being located on the side of the manifold assembly where the first fluid connection hole is located, a limiting groove being formed between the positioning assembly and the manifold assembly, the limiting groove being for adapting to the microfluidic chip; and a cover plate assembly disposed on the manifold assembly, the cover plate assembly and the manifold assembly surrounding each other to form a receiving cavity, the positioning assembly being located within the receiving cavity.

[0006] This application discloses a kit for use with microfluidic chips. The kit has a manifold assembly with a manifold channel and a first fluid connection hole. The microfluidic chip used in this kit has a corresponding second fluid connection hole. The kit is connected to the microfluidic chip through the first fluid connection hole, so that external fluid enters the manifold channel through the manifold assembly and then enters the microchannel of the microfluidic chip through the first and second fluid connection holes. The positioning component is mounted on the manifold, forming a limiting groove between them. This groove allows the microfluidic chip to be placed within the microfluidic chip. The positioning component engages with the fastening component, which can utilize screws and nuts. The combined use of the positioning, fastening, and manifold components ensures a more secure connection between the microfluidic chip and the manifold, resulting in a better seal for the fluid connection. This prevents leakage caused by excessive pressure during the introduction of external fluids into the microfluidic chip. This structure simplifies the tubing connection between the microfluidic chip and external fluids, eliminating the need for traditional clamps to fix the microfluidic chip. This not only reduces operating costs and simplifies operation but also significantly improves the ease of use and portability of the microfluidic chip. The kit boasts advantages such as small size, suitability for mass production, and significant implications for the application of microfluidic chips in clinical diagnostics, drug analysis, environmental monitoring, and food development.

[0007] In one embodiment, a sealing gasket assembly is further included, the sealing gasket assembly being adapted to the microfluidic chip and the first fluid interface, the sealing gasket assembly having an opening that is adapted to the first fluid connection hole.

[0008] By providing a sealing gasket between the first fluid connection hole of the manifold assembly and the second fluid connection hole of the microfluidic chip, with an opening on the sealing gasket that is adapted to the first fluid connection hole and the second fluid connection hole on the microfluidic chip respectively, the use of the sealing gasket assembly further improves the connection sealing between the fluid connection holes, enabling the manifold assembly and the microfluidic chip to achieve a better sealing state. This avoids the high pressure generated during the introduction of external fluid into the microfluidic chip, which could lead to liquid overflow, and further ensures the reliability and pressure resistance of the interface connection between the manifold assembly and the microfluidic chip.

[0009] In one embodiment, the manifold assembly includes a manifold element and a fluid interface assembly. The fluid interface assembly is disposed on the manifold element, and a manifold channel is formed on the manifold element. The manifold element has a first fluid connection hole, and the manifold channel leads to the first fluid connection hole. The fluid interface assembly has a liquid passage, and the liquid passage, the manifold channel, and the first fluid connection hole are in communication. By providing multiple fluid interface assemblies on the same side of the manifold assembly, each fluid interface assembly has a liquid passage that communicates with the manifold channel on the manifold element. External fluid enters the manifold channel through the liquid passage and then enters the microchannel of the microfluidic chip through the first fluid connection hole. By setting up fluid interface assemblies to interface with external fluids, the kit further improves the convenience of the microfluidic chip device.

[0010] In one embodiment, a sealing ring is further included, which is disposed on the fluid interface assembly and fitted onto the fluid interface assembly. Multiple sealing rings are present, and the fluid interface assembly includes multiple fluid interfaces, each with multiple sealing rings fitted onto it. By providing multiple sealing rings on the fluid interface assembly, specifically, the fluid interface assembly includes multiple fluid interfaces, each with three sealing rings fitted onto it, further enhancing the sealing effect and preventing air or liquid leakage due to excessive pipeline pressure, thus forming a multi-stage seal. The sealing gasket is an O-ring, which is assembled with the fluid interface assembly to form a quick-connect fitting. By providing an O-ring and assembling the fluid interface assembly into a quick-connect fitting, the reagent kit is fixed to the accompanying instrument via the quick-connect fitting. External fluid enters the reagent kit through the fluid interface assembly. The sealing ring improves the connection sealing between the fluid interface assembly and the accompanying instrument, further enhancing the reliability of external fluid flow into the microfluidic chip's tubing.

[0011] In one embodiment, the fluid interface assembly includes an inlet pipe and an outlet pipe, which are located on the same side or different sides of the manifold. The positions of the outlet pipe and the inlet pipe are not limited and can be located on the same side or different sides of the manifold, so that the positions of the outlet pipe and the inlet pipe can be adjusted according to the usage requirements, which facilitates subsequent instrument docking and makes the installation and use process more convenient and faster.

[0012] In one embodiment, the manifold is provided with a limiting hole, which is adapted to the positioning component. The limiting hole on the manifold corresponds one-to-one with the first adapting hole on the positioning component. After the microfluidic chip is adapted to the first fluid connection hole and sealing gasket assembly of the manifold, the positioning component and the microfluidic chip are abutted together and fixedly connected by a fastening component. The fastening component passes through the first adapting hole on the positioning component and is inserted into the limiting hole of the manifold, and is further fixed by a nut, so that the microfluidic chip is pressed tightly onto the manifold, ensuring the sealing of the tubing connection between the external fluid and the microfluidic chip and the pressure resistance of the reagent kit.

[0013] In one embodiment, a groove is formed on the manifold, and the first fluid connection hole is located at the groove, which is adapted to the sealing gasket assembly. The groove at the first fluid connection hole on the manifold is adapted to the size of the sealing gasket. By providing a groove on the manifold, a certain installation space is provided between the microfluidic chip and the manifold, allowing the sealing gasket assembly to be installed within the groove. This ensures that the sealing gasket assembly is in a specific position during placement and reduces production error efficiency. Its installation structure is more compact, further ensuring the reliability of the interface connection. By setting the groove, the overall weight and volume of the reagent kit are reduced, ensuring installation space for the sealing gasket, thereby improving the sealing performance between the manifold channel and the microfluidic channel.

[0014] In one embodiment, the positioning component has a first adapter hole and a second adapter hole. The first adapter hole is adapted to a fastening component, which passes through the first adapter hole and is disposed on the manifold. The second adapter hole is adapted to the microfluidic chip, and the microfluidic chip abuts against the sidewall of the second adapter hole. By providing a first adapter hole on the positioning component for adaptation to the fastening component, and further providing a corresponding limiting hole on the manifold, the fastening component passes through the first adapter hole and the limiting hole on the manifold, thus enabling the positioning component to be disposed on the manifold. The positioning component also has a second adapter hole adapted to the microfluidic chip, allowing the positioning component to abut against the microfluidic chip. This ensures sufficient installation space for the positioning component on the microfluidic chip, further improving the compactness of the connection structure between the microfluidic chip and the positioning component, achieving a high-strength connection between the microfluidic chip and the manifold, and improving the fluid connection sealing between the positioning component and the manifold.

[0015] In one embodiment, the cover assembly includes a cover body and a snap-fit ​​assembly. The snap-fit ​​assembly is disposed on the cover body, and the manifold assembly has a limiting hole. The snap-fit ​​assembly is adapted to and engages with the limiting hole. By providing a snap-fit ​​structure on the cover body and an engaging portion at a corresponding position on the manifold assembly, the cover body can be detachably mounted on the manifold assembly via a snap-fit ​​mechanism. Furthermore, the engaging portion on the manifold assembly is a snap-fit ​​hole, and the snap-fit ​​structure on the cover body can engage with the manifold assembly through the snap-fit ​​hole. Before using the reagent kit, the manifold assembly, sealing gasket assembly, microfluidic chip, and positioning assembly are assembled sequentially. After completing quality control steps through air passage, pressurization, and liquid passage tests, the cover body is snapped onto the manifold assembly via the snap-fit ​​structure to complete the configuration of the microfluidic chip device.

[0016] In one embodiment, the busbar assembly, the positioning assembly, and the cover assembly are manufactured using plastic injection molding. The use of plastic injection molding for the busbar assembly, positioning assembly, and cover assembly replaces traditional clamps, significantly reducing usage costs. Furthermore, the busbar consists of a busbar plate and a base plate, which are respectively manufactured using injection molding and then heat-sealed. Preferably, the sealing process of the busbar assembly uses laser welding. Because laser welding offers superior accuracy and control, it enables more precise welding, further improving the internal structural sealing of the busbar assembly.

[0017] In one embodiment, the busbar assembly and the cover assembly are made of one or more of PMMA, PS, PC, PP, ABS, COC, COP, and PEI. The busbar assembly, positioning assembly, and cover assembly are injection molded using one or more of PMMA, PS, PC, PP, ABS, COC, COP, and PEI. Using these organic polymer materials provides excellent mechanical properties with a balance of toughness, hardness, and rigidity, as well as superior chemical stability and weather resistance. Furthermore, they are low-cost and suitable for mass production.

[0018] The second aspect of this application provides a microfluidic chip device.

[0019] A microfluidic chip device includes a microfluidic chip and the aforementioned reagent kit. The microfluidic chip is disposed on the reagent kit and includes a flexible chip and a substrate. The flexible chip is disposed on the substrate, and the substrate has a second fluid connection hole. The first fluid connection hole is adapted to the second fluid connection hole. The microfluidic chip device is fabricated by combining the microfluidic chip with the aforementioned reagent kit. The microfluidic chip includes a microfluidic chip and a substrate. The substrate is made of glass, and the microfluidic chip is a flexible chip. The substrate is bonded to the microfluidic chip to form a closed channel, thereby ensuring the sealing of the microchannel. By creating a second fluid connection hole in the substrate, which connects to the microchannels on the microfluidic chip, the method replaces drilling holes in the microfluidic chip. This avoids the impact on the internal microchannel structure of the chip during the drilling process, as well as the deterioration of the connection between the external fluid and the chip due to drilling failure. The microfluidic chip device reduces the processing requirements of the microfluidic chip, has a simple and effective structure, is easy to use, and the connection between the manifold channel on the manifold assembly and the microfluidic chip has good sealing performance, further ensuring the stability of the experiment.

[0020] A third aspect of this application provides a method of using a microfluidic chip device, comprising:

[0021] S1: Assemble the microfluidic chip device as described above;

[0022] S2: The fluid interface components of the assembled microfluidic chip device are subjected to ventilation, liquid flow and pressure tests respectively. The microfluidic chip device with no fluid interface leakage is dried to remove the moisture introduced into the microfluidic chip due to the test.

[0023] S3: The manifold assembly works with the supporting instrument through the fluid interface assembly, and the control mechanism in the supporting instrument is connected to the microfluidic chip through the fluid interface assembly.

[0024] The third aspect of this application discloses a method for using a microfluidic chip device. First, the microfluidic chip device is assembled by inserting a nut into the limiting hole at the bottom of the manifold assembly. Then, the sealing gasket assembly is placed on the position of the first fluid connection hole of the manifold assembly. Next, the second fluid connection hole of the microfluidic chip is aligned with the opening on the sealing gasket and the position of the first fluid connection hole, and then placed on top of it. Next, the positioning assembly is placed on top of the microfluidic chip according to the position of the second adapter hole. Finally, a screw is passed through the positioning assembly and the manifold assembly and tightened with the nut. The second step involves... Quality control is performed, and air and liquid flow tests are conducted on each fluid interface component. Then, the qualified cover component is fastened to the manifold, and a vacuum drying oven is used to remove the moisture introduced into the chip during testing. Finally, after drying, the microfluidic chip device is obtained for use. When the microfluidic chip device needs to be used, the fluid interface component of the microfluidic chip device is manually inserted into the matching instrument to fix the microfluidic chip device. Fluid is input and output into the microfluidic chip device through the control mechanism in the matching instrument. After use, the microfluidic chip device is manually released and pulled out. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the reagent kit;

[0026] Figure 2 This is an exploded view of the reagent kit;

[0027] Figure 3 This is a schematic diagram of a busbar assembly;

[0028] Figure 4 This is a schematic diagram of the busbar channel of the busbar assembly;

[0029] Figure 5 A schematic diagram of the positioning component;

[0030] Figure 6 This is a schematic diagram of the assembly of the busbar assembly and the positioning assembly;

[0031] Figure 7 This is a schematic diagram of the flow channel connection of a microfluidic chip device.

[0032] The correspondence between the reference numerals and the component names is as follows:

[0033] 1. Manifold assembly; 101. Manifold channel; 102. First fluid connection hole; 103. Limiting hole; 104. Groove; 11. Manifold component; 12. Fluid interface assembly.

[0034] 2 positioning components, 201 limiting groove, 202 first adapter hole, 203 second adapter hole;

[0035] 3. Cover plate assembly; 31. Cover plate body; 32. Clip assembly;

[0036] 4. Sealing gasket assembly, 401 opening;

[0037] 5. Sealing rings;

[0038] 6 Microfluidic chip, 601 Second fluid connection hole, 61 Flexible chip, 62 Film. Detailed Implementation

[0039] To better understand the above-mentioned objectives, features, and advantages of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0040] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and therefore the scope of protection of the invention is not limited to the specific embodiments disclosed below.

[0041] The following describes a kit according to some embodiments of the present invention with reference to the accompanying drawings.

[0042] Example 1

[0043] like Figures 1 to 7 As shown, this embodiment discloses a reagent kit, including: a manifold assembly 1, on which a manifold channel 101 is formed, and a first fluid connection hole 102 is provided, the manifold channel 101 and the first fluid connection hole 102 being used to communicate with a microfluidic chip; a positioning assembly 2, which is disposed on the manifold assembly 1, located on the side where the first fluid connection hole 102 of the manifold assembly 1 is located, and a limiting groove 201 is formed between the positioning assembly 2 and the manifold assembly 1, the limiting groove 201 being used to adapt to the microfluidic chip; and a cover plate assembly 3, which is disposed on the manifold assembly 1, the cover plate assembly 3 and the manifold assembly 1 enclosing a receiving cavity, and the positioning assembly 2 being located within the receiving cavity.

[0044] This application discloses a kit for use with microfluidic chips. The kit includes a manifold 1 with a manifold channel 101 and a first fluid connection hole 102. A corresponding second fluid connection hole is provided on the microfluidic chip. The microfluidic chip is connected to the microfluidic chip through the first fluid connection hole 102, so that external fluid enters the manifold channel 101 through the manifold 1 and then enters the microchannel of the microfluidic chip through the first fluid connection hole 102 and the second fluid connection hole 201. Positioning component 2 is placed on manifold component 1, forming a limiting groove 201 between them. This allows the microfluidic chip to be placed in the limiting groove 201. Positioning component 2 is used to cooperate with fastening component, which can use screws and nuts. The cooperation of positioning component 2, fastening component, and manifold component 1 makes the connection between the microfluidic chip and manifold component 1 more stable and the fluid connection more airtight. This prevents liquid from overflowing due to high pressure generated during the process of introducing external fluid into the microfluidic chip. This structure simplifies the pipeline connection between the microfluidic chip and the external fluid, eliminating the need for traditional clamps to fix the microfluidic chip in the fluid connection. This not only reduces the cost of use and makes operation easier, but also greatly improves the convenience and portability of the microfluidic chip. This reagent kit has the advantages of small size and suitability for mass production. It is of great significance for the application of microfluidic chips in clinical diagnosis, drug analysis, environmental monitoring, food development, and other fields.

[0045] like Figure 2 , Figure 6 and Figure 7 As shown, in addition to the features of the above embodiments, this embodiment further includes a sealing gasket assembly 4, which is adapted to the microfluidic chip 6 and the first fluid interface 102. The sealing gasket assembly 4 has an opening 401 that is adapted to the first fluid connection hole 102. By providing a sealing gasket 4 between the first fluid connection hole 102 of the manifold 1 and the second fluid connection hole 201 of the microfluidic chip, and by providing an opening 401 on the sealing gasket 4 that is adapted to the first fluid connection hole 102 and the second fluid connection hole on the microfluidic chip respectively, the use of the sealing gasket assembly 4 further improves the connection sealing between the fluid connection holes, enabling the manifold 1 and the microfluidic chip to achieve a better sealing state. This avoids the generation of high pressure during the introduction of external fluid into the microfluidic chip, which could lead to liquid overflow, and further ensures the reliability and pressure resistance of the interface connection between the manifold 1 and the microfluidic chip.

[0046] like Figures 1 to 6As shown, in addition to the features of the above embodiments, this embodiment further defines: the manifold assembly 1 includes a manifold 11 and a fluid interface assembly 12, the fluid interface assembly 12 is disposed on the manifold 11, a manifold channel 101 is formed on the manifold 11, a first fluid connection hole 102 is provided on the manifold 11, the manifold channel 101 leads to the first fluid connection hole 102, the fluid interface assembly 12 is provided with a liquid passage, and the liquid passage, the manifold channel 101 and the first fluid connection hole 102 are in communication. By providing multiple fluid interface components 12 on the manifold 1, with the multiple fluid interface components 12 located on the same side of the manifold 1, and providing a liquid passage on the fluid interface component 12, which is connected to the manifold channel 101 on the manifold 11, external fluid enters the manifold channel 101 through the liquid passage, and then enters the microchannel of the microfluidic chip through the first fluid connection hole 102. The reagent kit connects with external fluid by setting the fluid interface components 12, which further improves the convenience of the microfluidic chip device.

[0047] In addition to the features of the above embodiments, this embodiment further specifies that: it also includes sealing rings 5, which are disposed on the fluid interface assembly 12. Multiple sealing rings 5 ​​are provided on the fluid interface assembly 12, which includes multiple fluid interfaces, each with multiple sealing rings. By providing sealing rings 5 ​​on the fluid interface assembly 12, and specifically, the fluid interface assembly 12 includes multiple fluid interfaces, each with three sealing rings 5, the sealing effect can be further increased, thereby preventing air and liquid leakage due to excessive pipeline pressure, thus forming a multi-stage seal. The sealing gasket 5 is an O-ring. The O-ring and the fluid interface assembly 12 are assembled into a quick-connect connector. By setting the O-ring and the fluid interface assembly 12 to form a quick-connect connector, the reagent kit is fixed to the matching instrument through the quick-connect interface. External fluid enters into the reagent kit through the fluid interface assembly 12. The setting of the sealing ring improves the connection sealing between the fluid interface assembly 12 and the matching instrument, and further improves the reliability of the flow of external fluid into the pipeline between the microfluidic chip.

[0048] In addition to the features of the above embodiments, this embodiment further specifies that: the fluid interface assembly 12 includes an inlet pipe and an outlet pipe, the inlet pipe and the outlet pipe are located on the same side or different sides of the manifold 11, the position of the outlet pipe and the inlet pipe is not limited, and they can be located on the same side or different sides of the manifold 11, so that the position of the outlet pipe and the inlet pipe can be adjusted according to the usage requirements, which facilitates subsequent instrument docking and makes the installation and use process more convenient and faster.

[0049] like Figure 2 and Figure 3As shown, in addition to the features of the above embodiments, this embodiment further specifies that: the manifold 11 is provided with a limiting hole 103, which is adapted to the positioning component 2. The manifold 11 is provided with a limiting hole, and the limiting hole 103 corresponds one-to-one with the first adapter hole 201 on the positioning component 2. After the microfluidic chip is adapted to correspond with the first fluid connection hole 102 and the sealing gasket component 4 of the manifold 1, the positioning component 2 and the microfluidic chip are abutted against each other and fixedly connected by a fastening component. The fastening component passes through the first adapter hole 202 on the positioning component 2 and is inserted into the limiting hole 103 of the manifold 1, and is further fixed by a nut, so that the microfluidic chip is pressed against the manifold 1, ensuring the sealing of the pipeline connection between the external fluid and the microfluidic chip and the pressure resistance of the reagent kit.

[0050] like Figure 3 As shown, in addition to the features of the above embodiments, this embodiment further specifies that: a groove 104 is formed on the manifold 11, and a first fluid connection hole 102 is located at the groove 104. The groove 104 is adapted to the sealing gasket assembly 4. A groove 104 is provided at the first fluid connection hole 102 on the manifold 11. The size of the groove 104 is adapted to the size of the sealing gasket 4. By providing a groove 104 on the manifold 11, there is a certain installation space between the microfluidic chip and the manifold 11, allowing the sealing gasket assembly 4 to be installed within the groove 104. This ensures that the sealing gasket assembly 4 is in a specific position during placement and reduces production error efficiency. Its installation structure is more compact, further ensuring the connection reliability of the interface. By setting the groove 104, the overall weight and volume of the reagent kit are reduced, ensuring the installation space for the sealing gasket 4, thereby improving the connection sealing between the manifold channel 101 and the microchannel.

[0051] like Figure 5As shown, in addition to the features of the above embodiments, this embodiment further specifies that: the positioning component 2 is provided with a first adapter hole 202 and a second adapter hole 203, the first adapter hole 202 is adapted to the fastening component, the fastening component passes through the first adapter hole 202 and is disposed on the busbar component 1, the second adapter hole 203 is adapted to the microfluidic chip, and the microfluidic chip abuts against the sidewall of the second adapter hole 203. By providing a first adapter hole 202 on the positioning component 2, which is used to adapt to the fastening component, and further, providing a corresponding limiting hole 103 on the manifold component 1, the fastening component passes through the first adapter hole 202 and the limiting hole 103 on the manifold component 1, so that the positioning component 2 is set on the manifold component 1; providing a second adapter hole 302 on the positioning component 2, which is adapted to the microfluidic chip, so that the positioning component 2 abuts against the microfluidic chip, ensuring the installation space of the positioning component 2 on the microfluidic chip, further improving the compactness of the connection structure between the microfluidic chip and the positioning component 2, realizing a high-strength connection between the microfluidic chip and the manifold component, and improving the fluid connection sealing between the positioning component 2 and the manifold component 1.

[0052] like Figure 1 and Figure 2 As shown, in addition to the features of the above embodiments, this embodiment further specifies that: the cover assembly 3 includes a cover body 31 and a snap-fit ​​assembly 32. The snap-fit ​​assembly 32 is disposed on the cover body 31, and the manifold 1 is provided with a limiting hole 103. The snap-fit ​​assembly 32 is adapted to and engaged with the limiting hole 103. By providing a snap-fit ​​structure 312 on the cover body 31 and a snap-fit ​​part at the corresponding position on the manifold 1, the cover body 31 can be detachably disposed on the manifold 1 by snap-fit. Further, the snap-fit ​​part on the manifold 1 is a snap-fit ​​hole, and the snap-fit ​​structure 312 on the cover body 31 can be engaged on the manifold 1 through the snap-fit ​​hole. Before using the reagent kit, the manifold 1, the sealing gasket assembly 4, the microfluidic chip, and the positioning assembly 2 are assembled together in sequence. After completing the quality control steps through the air and liquid flow tests, the cover body 31 is snapped onto the manifold 1 by the snap-fit ​​structure 312 to complete the configuration of the microfluidic chip device.

[0053] In addition to the features of the above embodiments, this embodiment further specifies that the busbar assembly 1, the positioning assembly 2, and the cover plate assembly 3 are manufactured by plastic injection molding. The use of plastic injection molding for the busbar assembly 1, the positioning assembly 2, and the cover plate assembly 3 replaces traditional clamps, significantly reducing usage costs. Furthermore, the busbar 1 consists of a busbar plate and a base plate, which are manufactured by injection molding and then heat-sealed. Preferably, the sealing process of the busbar assembly 1 uses laser welding. Because laser welding has superior accuracy and control, it enables more precise welding, further improving the internal structural sealing of the busbar assembly 1.

[0054] In addition to the features of the above embodiments, this embodiment further specifies that the materials of the busbar assembly 1 and the cover assembly 3 are one or more of PMMA, PS, PC, PP, ABS, COC, and COP. The busbar assembly 1, the positioning assembly 2, and the cover assembly 3 are injection molded using one or more of PMMA, PS, PC, PP, ABS, COC, and COP. Using the above-mentioned organic polymer materials, they possess excellent mechanical properties with a balance of toughness, hardness, and rigidity, and also have better chemical stability and weather resistance, low cost, and are suitable for mass production.

[0055] Example 2

[0056] like Figure 7 As shown, in addition to the features of the above embodiments, this embodiment further defines: it includes a microfluidic chip and the above-mentioned reagent kit. The microfluidic chip 6 is disposed on the reagent kit. The microfluidic chip 6 includes a flexible chip 61 and a substrate 62. The flexible chip 61 is disposed on the substrate 62, and the substrate 62 has a second fluid connection hole 601. The first fluid connection hole 102 is adapted to the second fluid connection hole 601. The microfluidic chip is combined with the above-mentioned reagent kit to form a microfluidic chip device. The microfluidic chip includes a microfluidic chip 61 and a substrate 62. The substrate 62 is made of glass, and the microfluidic chip 61 is a flexible chip. The glass substrate is bonded to the microfluidic chip 61 to form a closed channel, thereby ensuring the sealing of the microchannel. By providing a second fluid connection hole 601 on the substrate 62, which communicates with the microchannels on the microfluidic chip 61, the method replaces drilling holes in the microfluidic chip 61. This avoids the impact on the microchannel structure inside the chip during the drilling process, as well as the deterioration of the connection effect between the external fluid and the chip due to drilling failure. The microfluidic chip device reduces the processing requirements of the microfluidic chip, has a simple and effective structure, is easy to use, and the connection between the manifold 101 on the manifold assembly 1 and the microfluidic chip 61 is well sealed, further ensuring the stability of the experiment.

[0057] Example 3

[0058] The third embodiment of this application discloses a method of using a microfluidic chip device, including:

[0059] S1: Assemble a microfluidic chip device as described above;

[0060] S2: The fluid interface components of the assembled microfluidic chip device are subjected to ventilation, liquid flow and pressure tests respectively. The microfluidic chip device with no fluid interface leakage is dried to remove the moisture introduced into the microfluidic chip due to the test.

[0061] S3: The manifold assembly works with the supporting instrument through the fluid interface assembly, and the control mechanism in the supporting instrument is connected to the microfluidic chip through the fluid interface assembly.

[0062] The third aspect of this application discloses a method for using a microfluidic chip device. First, the microfluidic chip device is assembled. A nut is inserted into the limiting hole 103 at the bottom of the manifold 1. Then, the sealing gasket assembly 4 is placed on the first fluid connection hole 102 of the manifold 11. Next, the second fluid connection hole 601 of the microfluidic chip is aligned with the opening 401 on the sealing gasket 21 and the first fluid connection hole 102, and then placed on top of it. Next, the positioning assembly 2 is placed on top of the microfluidic chip 6 according to the position of the second adapter hole. Finally, a screw is passed through the positioning assembly 2 and the manifold 1 and tightened with a nut. The second step involves assembling the device as described above. The microfluidic chip device undergoes quality control, and air and liquid flow tests are performed on each fluid interface component 12. The qualified cover component 3 is then fastened to the manifold 1, and a vacuum drying oven is used to remove the moisture introduced into the chip during testing. Finally, after drying, the microfluidic chip device ready for use is obtained. When the microfluidic chip device needs to be used, the fluid interface component 12 of the microfluidic chip device is manually inserted into the matching instrument to fix the microfluidic chip device. Fluid is input and output to the microfluidic chip device through the control mechanism in the matching instrument. After use, the microfluidic chip device is manually released and pulled out.

[0063] To further illustrate this point, the present invention verifies the fluid interface connection strength between the microfluidic chip and the manifold assembly in the microfluidic chip device through pressure testing. The specific test method is as follows:

[0064] (1) Connection: First, connect the two inlet pipes in the fluid interface component 12 of the microfluidic chip to the liquid storage unit controlled by the pressure source, and connect the other two outlet pipes 12 to the atmosphere through the shut-off valve;

[0065] (2) Liquid flow: Use a pressure source to output 1.5 Bar pressure and control the liquid storage unit to input liquid into the inlet pipe of the fluid interface assembly 12 of the microfluidic chip device until liquid flows out of the outlet pipe and then use a shut-off valve to close the outlet.

[0066] (3) Pressure holding: Immerse the microfluidic chip device and fluid interface component 12 completely in pure water and maintain a pressure of 1.5 Bar for 10 min. Adjust the pressure to 2 Bar and 2.5 Bar and maintain for 10 min. Observe whether there are bubbles inside the microfluidic chip and at the interface of the fluid interface component. If no bubbles appear, it is considered that the strength meets the corresponding pressure requirements.

[0067] In this experiment, 10 assembled microfluidic chip devices were extracted according to the above method. After the extracted microfluidic chip devices were sampled and numbered, liquid flow and pressure holding tests were performed on each device. The results are shown in Table 1.

[0068] Table 1

[0069]

[0070] As can be seen from Table 1, the fluid interface component in the microfluidic chip device has a connection strength with the external fluid that remains leak-free after holding at 2.5 Bar for 10 minutes. The connection strength inside the microfluidic chip also meets the requirement of remaining leak-free after holding at 2 Bar for 10 minutes. In other words, the connection seal is good even when the pressure is below 2 Bar for 10 minutes. Therefore, the connection method of the microfluidic chip device provided by this invention is suitable for application scenarios where the strength requirement is no higher than 2 Bar for 10 minutes.

[0071] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0072] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A microfluidic chip device, characterized by, The application relates to a microfluidic chip and a kit, which comprises a flow converging assembly (1), a positioning assembly (2) and a cover plate assembly (3). The flow converging assembly (1) is provided with a flow converging channel (101) and a first fluid connecting hole (102), and the flow converging channel (101) and the first fluid connecting hole (102) are used for communicating with a microfluidic chip; the flow converging assembly (1) comprises a flow converging piece (11) and a fluid interface assembly (12), the fluid interface assembly (12) is arranged on the flow converging piece (11), the flow converging channel (101) is formed on the flow converging piece (11), the first fluid connecting hole (102) is arranged on the flow converging piece (11), the flow converging channel (101) is connected to the first fluid connecting hole (102), and the fluid interface assembly (12) is provided with a liquid passing channel, which is communicated with the flow converging channel (101) and the first fluid connecting hole (102). The positioning assembly (2) is arranged on the flow converging assembly (1), is located on the side of the flow converging assembly (1) where the first fluid connecting hole (102) is arranged, and forms a limiting groove (201) with the flow converging assembly (1), which is used for matching the microfluidic chip. The cover plate assembly (3) is arranged on the flow converging assembly (1) and forms a containing cavity together with the flow converging assembly (1), and the positioning assembly (2) is arranged in the containing cavity. The microfluidic chip (6) is arranged on the kit, and comprises a soft chip (61) and a bottom sheet (62), the soft chip (61) is arranged on the bottom sheet (62), the bottom sheet (62) is provided with a second fluid connecting hole (601), and the first fluid connecting hole (102) matches the second fluid connecting hole (601).

2. The microfluidic chip device of claim 1, wherein, The kit further comprises a sealing gasket assembly (4) which is used for matching the microfluidic chip (6) and the first fluid connecting hole (102), and is provided with an opening (401) which matches the first fluid connecting hole (102).

3. The microfluidic chip device of claim 1, wherein, The kit further comprises a sealing ring (5) which is arranged on the fluid interface assembly (12).

4. The microfluidic chip device of claim 3, wherein, The sealing ring (5) is provided in a plurality of numbers, the fluid interface assembly (12) comprises a plurality of fluid interfaces, and a plurality of sealing rings (5) are arranged on the fluid interfaces; and / or The fluid interface assembly (12) comprises an inlet pipe and an outlet pipe, and the inlet pipe is communicated with the outlet pipe.

5. The microfluidic chip device according to claim 2, wherein The flow converging piece (11) is provided with a limiting hole (103) which matches the positioning assembly (2); and / or The manifold (11) is formed with a groove (104), and the first fluid connection hole (102) is located at the groove (104), and the groove (104) is matched with the sealing gasket assembly (4).

6. The microfluidic chip device of claim 1, wherein, The positioning assembly (2) is provided with a first matching hole (202) and a second matching hole (203), the first matching hole (202) is matched with the fastening assembly, the fastening assembly is arranged on the manifold assembly (1) through the first matching hole (202), and the second matching hole (203) is matched with the microfluidic chip, and the microfluidic chip is in abutment with the side wall of the second matching hole (203).

7. The microfluidic chip device of claim 1, wherein, The cover plate assembly (3) comprises a cover plate body (31) and a buckle assembly (32), the buckle assembly (32) is arranged on the cover plate body (31), the manifold assembly (1) is provided with a clamping portion, and the buckle assembly (32) is matched and clamped with the clamping portion; and / or The manifold assembly (1), the positioning assembly (2) and the cover plate assembly (3) are made by plastic injection molding; and / or The materials of the manifold assembly (1) and the cover plate assembly (3) are one or more of PMMA, PS, PC, PP, ABS, COC and PEI.

8. A method of using a microfluidic chip device, comprising: Comprise: S1: assemble the microfluidic chip device as claimed in claim 1; S2: the fluid interface assembly of the assembled microfluidic chip device is respectively ventilated, fluidized and pressure tested, and the microfluidic chip device without leakage of the fluid interface is dried to remove the moisture introduced in the microfluidic chip due to testing; S3: the manifold assembly is matched with the matched instrument through the fluid interface assembly, and the control mechanism in the matched instrument is communicated with the microfluidic chip through the fluid interface assembly.

Images