Automatic film tearing control method and device

Abstract

The present invention relates to an automatic film tearing control method and equipment, and relates to the field of PCB board detection technology, which includes the following steps: S1: finished workpiece loading, placing the PCB finished board on a vacuum suction table; S2: film tearing treatment, adjusting the adsorption device, adsorbing the PCB board small unit on the vacuum suction table; adjusting the film tearing device, the film tearing device is used to separate the PCB finished board into PCB board small units; S3: PCB board small unit loading treatment, adjusting the transfer device, placing the PCB board on the material rack, and fixing the electronic components to the corresponding PCB board small unit; S4: detection treatment, adjusting the material rack, moving the material rack to four stations, so that the four stations perform detection and treatment on the PCB board. The present invention solves the problem that it takes a long time to turn over, visually identify and turn the PCB board before the PCB board is detected, and improves the detection efficiency of the PCB board.

Description

Technical Field

[0001] The present invention relates to the field of PCB board detection technology, and in particular to an automatic film tearing control method and equipment. Background Art

[0002] PCB board, or printed circuit board, is also called printed circuit board. It is an important electronic component, a support for electronic components, and a carrier for electrical connections of electronic components. After various electronic components are installed on the PCB, an integrated circuit is formed and used in various electronic products.

[0003] In traditional processes, after the PCB board small units are purchased, they are placed together randomly. In order to facilitate the inspection of the PCB board, it is usually necessary to use inspection equipment to inspect the front and back and position of the PCB board, and then use a robotic arm to place the PCB board small units one by one on the inspection workpiece, place the inductor and capacitor on the PCB board small unit, and then use a four-station equipment to inspect the performance of the PCB board to ensure that the PCB board meets the use standards.

[0004] With respect to the above-mentioned related technologies, the inventors believe that after the material rack is purchased, the PCB boards are scattered small units. Using a robotic arm to place the PCB boards on a designated workpiece requires the robotic arm to spend a lot of time to perform operations such as turning over, visually identifying, and turning corners on the PCB boards. The operation process is cumbersome, takes a lot of working hours, and has low work efficiency. Summary of the invention

[0005] In order to solve the problem of reducing the time spent on operations such as turning over, visually identifying and turning corners of PCB boards before PCB board inspection, and improve the inspection efficiency of PCB boards, the present invention provides an automatic film tearing control method and equipment.

[0006] In a first aspect, the present invention provides an automatic film tearing control method, which adopts the following technical solution:

[0007] An automatic film tearing control method comprises the following steps:

[0008] S1: Loading finished workpieces, placing the finished PCB board on the adsorption table;

[0009] S2: film tearing process, adjusting the adsorption device to adsorb the PCB board small unit on the adsorption small table; adjusting the film tearing device, the film tearing device is used to separate the PCB finished board into PCB board small units;

[0010] S3: PCB board small unit loading processing, adjusting the transfer device, placing the PCB board on the material rack, and fixing the electronic components to the corresponding PCB board small unit;

[0011] S4: Inspection and processing, adjusting the material rack, moving the material rack to the fourth station, so that the fourth station can inspect and process the PCB board.

[0012] By adopting the above technical solution, the finished PCB board is directly placed on the vacuum suction table, and the adsorption device is adjusted so that the adsorption device can firmly adsorb all the small units of the PCB board on the vacuum suction table. The film tearing device is adjusted so that the film tearing device can tear the film of the finished PCB board and separate the PCB sheet from the finished PCB board. The transfer device is adjusted to place the small units of the PCB board on the designated material rack in turn, and then the electronic components are placed on the small units of the PCB board. The material rack is adjusted and transferred to the fourth station so that the fourth station can detect and process the small units of the PCB board.

[0013] By moving the entire PCB finished board to the vacuum suction cup to tear off the film and remove the PCB board sheet, the PCB board small unit is in an independent state, and the PCB board small unit can be kept in a positive upward state, and the angle of the PCB board small unit is also in a consistent state, which can reduce the tedious identification operations such as turning over, angle and positioning of the PCB board small unit, and can improve work efficiency. Under the action of the transfer device, the PCB board small unit can be quickly and efficiently transferred to the specified position on the material rack, and then the electronic components are fixed on the PCB board small unit. The material rack is moved as a whole, so that the material rack is transferred to the four-station as a whole, so that the four-station performs corresponding inspection and processing on the PCB board. The overall method has high continuity and high inspection efficiency.

[0014] Optionally, in step S3: the electronic components include capacitors and inductors, and the capacitors and inductors are fixed to corresponding PCB board small units in turn.

[0015] By adopting the above technical solution, the capacitor and the inductor are placed in the small unit of the PCB board in sequence, so that the small unit of the PCB board is in a state to be tested, which is convenient and efficient and can improve the detection efficiency of the small unit of the PCB board.

[0016] In the second aspect, the present application provides an automatic film tearing control device, which adopts the following technical solution:

[0017] An automated film-tearing control method as described in any one of claims 1 to 2 is adopted, wherein the film-tearing device comprises a film-tearing robot arm and a cutting robot arm;

[0018] The film-tearing robot arm and the cutting robot arm are both arranged on the adsorption platform. The film-tearing robot arm is used to tear off the film on the PCB board, and the cutting robot arm is used to cut and separate the small units of the PCB board. The film-tearing robot arm is also used to clean the material corners on the PCB board.

[0019] By adopting the above technical solution, when the finished PCB board is fixed on the vacuum suction table, the film tearing mechanical arm is adjusted so that the film tearing mechanical arm tears off the film on the finished PCB board; then the cutting mechanical arm is adjusted so that the cutting mechanical arm separates the sheet material of the PCB board from the small unit of the PCB board, and then the film tearing mechanical arm is further adjusted so that the film tearing mechanical arm takes the sheet material of the PCB board off the vacuum suction table. The film tearing device is set up to clean the film on the PCB board and the sheet material of the PCB board from the vacuum suction table, so that the small unit of the PCB board is placed independently on the vacuum suction table, so that the angle of the small unit of the PCB board is certain, the front and back are consistent, and the position is determined, so that the small unit of the PCB board is conveniently transferred to the material rack for subsequent operations.

[0020] Optionally, the adsorption device includes an adsorption fan;

[0021] The vacuum suction table is provided with an adsorption cavity, and the adsorption surface of the vacuum suction table is provided with a plurality of adsorption holes, and the adsorption holes are connected to the adsorption cavity;

[0022] The air inlet of the adsorption fan is connected to the adsorption chamber, and the adsorption fan is arranged on the vacuum suction table.

[0023] By adopting the above technical solution, the adsorption fan is adjusted, and the adsorption fan makes the adsorption chamber in a negative pressure state. Through the adsorption hole, the adsorption fan can firmly fix the PCB board small unit on the vacuum suction table. The set adsorption device can firmly fix the PCB board small unit on the vacuum suction table, which is convenient for separating the film and the PCB board sheet from the PCB board small unit, so that the PCB board is neatly arranged on the vacuum suction table, and the PCB board small unit is in a state to be transferred.

[0024] Optionally, the transfer device includes a transfer robot arm, a transfer platform located on the transfer robot arm, an adjustment mechanism, and a plurality of adsorption members;

[0025] The adsorption member is arranged on the adjustment mechanism, and the adsorption member is used to adsorb the small unit of the PCB board;

[0026] The adjusting mechanism is arranged on the transfer platform, and is used for adjusting the distance between the adsorption members.

[0027] By adopting the above technical solution, when it is necessary to transfer the PCB board small unit, the transfer robot arm is adjusted, the transfer robot arm drives the transfer platform to move, the transfer platform drives the adsorbent to move, so that the adsorbent adsorbs the PCB board, and then the adjustment mechanism is adjusted so that the adsorbent drives the distance between the PCB board small units to change. Under the action of the transfer robot arm, the PCB board small units are placed on the designated material rack in turn, so that the PCB board small units fall directly to the designated position. Through the transfer device, multiple PCB board small units can be transferred at the same time, which can improve the transfer efficiency, and under the action of the adjustment mechanism, the distance between the adsorbents can be changed, so that the distance between the PCB board small units changes, thereby facilitating the placement of the PCB board small units at the designated position on the material rack.

[0028] Optionally, the adsorption component includes an adsorption platform, an adsorption pump and a plurality of adsorption hoses;

[0029] A small adsorption hole is provided through the small adsorption platform, the air inlet of the small adsorption hole is used to adsorb the small unit of the PCB board, and the air outlet of the small adsorption hole is used to communicate with the adsorption hose;

[0030] One end of the adsorption hose away from the adsorption platform is communicated with the air inlet of the adsorption pump.

[0031] By adopting the above technical solution, when it is necessary to adsorb the small unit of the PCB board, the adsorption pump is adjusted, and the adsorption pump makes the adsorption hose and the adsorption hole both in a negative pressure state. When the adsorption hole is close to the small unit of the PCB board, the adsorption platform adsorbs the small unit of the PCB board in sequence, which is convenient for the transfer of the small unit of the PCB board. The adsorption piece is set up to adsorb multiple small units of the PCB board respectively, which is convenient for the transfer operation of the small unit of the PCB board.

[0032] Optionally, the adjustment mechanism includes a first adjustment component and two second adjustment components;

[0033] The first adjustment assembly includes a first adjustment motor, a first bidirectional screw, a first guide slide rod and four first slide blocks;

[0034] The adsorption platforms are respectively arranged on the second adjustment components, and the second adjustment components are arranged between the first bidirectional screw and the second guide slide rod;

[0035] The first bidirectional screw and the first guide sliding rod respectively pass through the two first sliding blocks, and the first bidirectional screw and the first guide sliding rod are arranged in parallel, both ends of the first bidirectional screw are rotatably connected to the transfer table, both ends of the first guide sliding rod are connected to the transfer table, one end of the first bidirectional screw extending out of the transfer table is connected to the first adjusting motor, and the first adjusting motor is used to drive the first bidirectional screw to rotate.

[0036] By adopting the above technical solution, when it is necessary to adjust the distance between the adsorption platforms, the first adjustment motor is adjusted, and the driving shaft of the first adjustment motor can drive the first bidirectional screw to rotate. Under the action of the first guide slide bar, the first adjustment motor can drive the first slider to move closer or farther from each other, thereby realizing the two second adjustment components to move closer or farther from each other, and changing the lateral distance between the PCB board small units. Then, the second adjustment component is adjusted, and the second adjustment component drives the PCB board small unit to move, so that the longitudinal distance between the PCB board small units changes, so that the PCB board small unit can match the corresponding position on the material rack. The set adjustment mechanism can realize the change of the lateral distance and the longitudinal distance between the PCB board small units under the action of the first adjustment component and the second adjustment component, so that the PCB board small unit can match different material racks, and then automatically place the PCB board small unit at the specified position, which can improve the detection efficiency.

[0037] Optionally, the second adjustment assembly includes two second drive motors, a second bidirectional screw, a second guide slide rod and four second slide blocks;

[0038] The two ends of the second bidirectional screw and the second guide slide rod are respectively passed through the two second sliding blocks, and the second bidirectional screw and the second guide slide rod are arranged in parallel;

[0039] The two ends of the second guide slide rod are respectively rotatably connected to the first slider, the two ends of the second guide slide rod are respectively connected to the first slider, one end of the second bidirectional screw rod is close to the first bidirectional screw rod, and the other end is close to the first guide slide rod;

[0040] One end of the second bidirectional screw extending out of the first slider is connected to a second drive motor, and the second drive motor is used to drive the second bidirectional screw to rotate;

[0041] The adsorption platforms are respectively arranged on the second sliding blocks.

[0042] By adopting the above technical solution, the second drive motor is adjusted respectively, and the drive shaft of the second drive motor drives the second bidirectional screw to rotate. Under the action of the second guide slide bar, the second bidirectional screw drives the second slider located thereon to move, so that the second slider drives the adsorption small platform to move, thereby realizing the change of the distance between the adsorption small platforms. The second drive component is set, and under the action of the second drive motor, the longitudinal distance between the adsorption small platforms can be changed, thereby causing the adsorption small platform to drive the position of the PCB board small unit to change, so that the PCB board small unit can be transferred to the position of the material rack.

[0043] In summary, the present invention includes at least one of the following beneficial technical effects:

[0044] 1. By moving the entire PCB finished board to the vacuum suction cup to tear off the film and remove the PCB board sheet, the PCB board small unit is in an independent state, and the PCB board small unit can be kept in a positive upward state, and the angle of the PCB board small unit is also in a consistent state, which can reduce the tedious identification operations of turning over, angle and positioning the PCB board small unit, and improve work efficiency. Under the action of the transfer device, the PCB board small unit can be quickly and efficiently transferred to the specified position on the material rack, and then the electronic components can be fixed on the PCB board small unit. The material rack is moved as a whole, so that the material rack is transferred to the four-station as a whole, and the four-station performs corresponding inspection and processing on the PCB board. The overall method has high continuity and high detection efficiency;

[0045] 2. The film tearing device can remove the film on the PCB board and the sheet material of the PCB board from the vacuum suction table, so that the small unit of the PCB board can be placed independently on the vacuum suction table, so that the angle of the small unit of the PCB board is certain, the front and back are consistent, and the position is determined, which is convenient for transferring the small unit of the PCB board to the material rack for subsequent operations;

[0046] 3. The adsorption device can firmly fix the PCB board small unit on the vacuum suction table, which is convenient for separating the film and the PCB board sheet from the PCB board small unit, so that the PCB board is neatly arranged on the vacuum suction table, and the PCB board small unit is in a state to be transferred;

[0047] 4. Through the transfer device, multiple PCB board small units can be transferred at the same time, which can improve the transfer efficiency. Under the action of the adjustment mechanism, the distance between the adsorption parts can be changed, so that the distance between the PCB board small units changes, thereby facilitating the placement of the PCB board small units at the designated position on the material rack;

[0048] 5. The adsorption parts are set up to adsorb multiple PCB board small units respectively, so as to facilitate the transfer operation of the PCB board small units;

[0049] 6. The adjustment mechanism is set, under the action of the first adjustment component and the second adjustment component, can realize the change of the lateral distance and the longitudinal distance between the PCB board small units, so that the PCB board small units can match different material racks, and then automatically place the PCB board small units at the specified position, which can improve the detection efficiency;

[0050] 7. The second driving assembly is set up, under the action of the second driving motor, can change the longitudinal distance between the adsorption small tables, so that the adsorption small tables drive the positions of the PCB board small units to change, so that the PCB board small units can be transferred to the position of the material rack. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] Figure 1 It is a schematic diagram of the overall structure of an automatic film tearing control device according to an embodiment of the present invention.

[0052] Figure 2 It is a cross-sectional view of an automatic film tearing control device according to an embodiment of the present invention.

[0053] Figure 3 FIG. 1 is a schematic diagram of a transfer platform according to an embodiment of the present invention.

[0054] 1. Adsorption table; 2. Adsorption chamber; 3. Adsorption hole; 4. Adsorption device; 5. Adsorption fan; 6. Film tearing device; 7. Film tearing robot; 8. Cutting robot; 9. Transfer device; 10. Transfer robot; 11. Transfer robot; 12. Transfer table; 13. Adjustment mechanism; 14. First adjustment component; 15. First adjustment motor; 16. First bidirectional screw; 17. First guide rod; 18. First slider; 19. Second adjustment component; 20. Second drive motor; 21. Second bidirectional screw; 22. Second guide rod; 23. Second slider; 24. Adsorption part; 25. Adsorption table; 26. Adsorption pump; 27. Adsorption hose; 28. Adsorption hole; 29. ​​Lifting device; 30. Loading robot; 31. First collection box; 32. Second collection box. DETAILED DESCRIPTION

[0055] The following is combined with Figure 1-3 The present invention is described in further detail.

[0056] The embodiment of the present invention discloses an automatic film tearing control method, referring to Figure 1 , including the following steps:

[0057] Adjust the lifting device 5 to raise the finished PCB board, and then use the loading robot arm 51 to move the finished PCB board to the vacuum suction table 1. Adjust the adsorption device 2 so that the adsorption device 2 firmly adsorbs all the small units of the PCB board on the vacuum suction table 1. Adjust the film tearing robot arm 31 so that the film tearing robot arm 31 tears the film of the finished PCB board, and then moves the torn film to the first collection box 6. Adjust the cutting robot arm 32 and separate the PCB board from the finished PCB board, and continue to adjust the film tearing robot arm 31 so that the film tearing robot arm 31 transfers the PCB board to the second collection box 7.

[0058] Adjust the transfer device 4 to adsorb the PCB board small unit, then place the PCB board small unit on the designated material rack in sequence, and then place the capacitor and inductor on the PCB board small unit respectively. Adjust the material rack and transfer the entire material rack to the fourth station so that the fourth station can detect and process the PCB board small unit. The overall detection process has a high degree of automation and strong continuity, which can improve the detection efficiency.

[0059] The present application also discloses an automatic film tearing control device. Figure 1 , Figure 2 and Figure 3 The automatic film tearing control device adopts an automatic film tearing control method as claimed in any one of claims 1-2.

[0060] Reference Figure 1 In order to facilitate the separation of the film and the PCB sheet from the PCB board small unit, the film tearing device 3 is provided, which includes a film tearing mechanical arm 31 and a cutting mechanical arm 32. The bases of the film tearing mechanical arm 31 and the cutting mechanical arm 32 are fixed on the vacuum suction table 1 by bolts. By adjusting the film tearing mechanical arm 31, the film tearing mechanical arm 31 can tear off the film on the PCB board. By adjusting the cutting mechanical arm 32, the cutting mechanical arm 32 can cut and separate the PCB board small unit, and then continue to operate the film tearing mechanical arm 31, and the film tearing mechanical arm 31 can transfer and clean the material corners on the vacuum suction table 1.

[0061] Reference Figure 2 In order to facilitate firmly fixing the PCB board small unit on the vacuum suction table 1, the provided adsorption device 2 includes an adsorption fan 21, an adsorption chamber 11 is provided on the vacuum suction table 1, and a plurality of adsorption holes 12 are provided on the adsorption surface of the vacuum suction table 1, and the adsorption holes 12 are connected with the adsorption chamber 11. The air inlet of the adsorption fan 21 is connected with the adsorption chamber 11, and the base of the adsorption fan 21 is fixed on the vacuum suction table 1 by bolts. By adjusting the adsorption fan 21, the adsorption fan 21 can make the adsorption chamber 11 in a negative pressure state, thereby firmly fixing the PCB board small unit on the vacuum suction table 1.

[0062] Reference Figure 2 In order to facilitate the transfer of the PCB board small unit to the corresponding material and improve the transfer efficiency. The transfer device 4 includes a transfer mechanical arm 41, a transfer platform 42 located on the transfer mechanical arm 41, an adjustment mechanism 43 and an adsorption member 44. The adsorption member 44 is arranged on the adjustment mechanism 43, and the adsorption member 44 can adsorb the PCB board small unit. The adjustment mechanism 43 is arranged on the transfer platform 42, and the adjustment mechanism 43 can adjust the distance between the adsorption members 44.

[0063] Reference Figure 2 and Figure 3In order to facilitate the transfer of the PCB board small unit, the adsorption member 44 includes four adsorption small platforms 441, an adsorption pump 442 and an adsorption hose 443. A small adsorption hole 444 is provided through the small adsorption platform 441. The air inlet of the small adsorption hole 444 can adsorb the small PCB board unit, and the air outlet of the small adsorption hole 444 is used to communicate with the adsorption hose 443. The end of the adsorption hose 443 away from the small adsorption platform 441 is connected to the air inlet of the adsorption pump 442.

[0064] Reference Figure 2 and Figure 3 In order to improve the efficiency of transferring the PCB board small unit to the material rack, the adjustment mechanism 43 includes a first adjustment component 431 and two second adjustment components 432. The first adjustment component 431 includes a first adjustment motor 4311, a first bidirectional screw 4312, a first guide slide 4313 and four first sliders 4314. The adsorption platform 441 is respectively arranged on the second adjustment component 432, and the second adjustment component 432 is arranged between the first bidirectional screw 4312 and the second guide slide 4323. The first bidirectional screw 4312 and the first guide slide 4313 are respectively arranged through the two first sliders 4314, and the first bidirectional screw 4312 and the first guide slide 4313 are axially parallel. The two ends of the first bidirectional screw 4312 are connected to the transfer platform 42 through bearings, the outer ring of the bearing is interference fit with the transfer platform 42, and the inner ring of the bearing is interference fit with the first bidirectional screw 4312. The bearings are not marked in this embodiment. The two ends of the first guide slide 4313 are integrally connected to the transfer platform 42. One end of the first bidirectional screw 4312 extending out of the transfer platform 42 is connected to the first adjusting motor 4311 through a coupling. The base of the first adjusting motor 4311 is fixed on the transfer platform 42 by bolts. By adjusting the first adjusting motor 4311, the first adjusting motor 4311 can drive the first bidirectional screw 4312 to rotate.

[0065] Reference Figure 3 , in order to improve the applicability of the adsorption small stage 441 and improve the efficiency of transferring the small unit of the PCB board. The second adjustment component 432 is provided, including two second driving motors 4321, a second bidirectional screw 4322, a second guide slide 4323 and four second sliders 4324. The two ends of the second bidirectional screw 4322 and the second guide slide 4323 are respectively arranged through the two second sliders 4324, and the axial direction between the second bidirectional screw 4322 and the second guide slide 4323 is parallel. The two ends of the second guide slide 4323 are respectively connected to the first slider 4314 through bearings. The two ends of the second guide slide 4323 are respectively connected to the first slider 4314 in one piece. One end of the second bidirectional screw 4322 is close to the first bidirectional screw 4312, and the other end is close to the first guide slide 4313.

[0066] One end of the second bidirectional screw 4322 extending out of the first slider 4314 is connected to the second drive motor 4321 through a coupling, and by adjusting the two second drive motors 4321 at the same time, the second drive motors 4321 can simultaneously drive the second bidirectional screw 4322 to rotate. The base of the adsorption platform 441 is fixed to the second slider 4324 by bolts.

[0067] The implementation principle of an automatic film tearing control method and device in the embodiment of the present application is:

[0068] The finished PCB board is lifted and lowered by the lifting device 5, and then the loading robot arm 51 is used to transfer the finished PCB board to the vacuum suction table 1. The adsorption fan 21 is adjusted, and the adsorption fan 21 makes the adsorption chamber 11 in a negative pressure state. Through the adsorption holes 12, the adsorption fan 21 can firmly fix the small unit of the PCB board on the vacuum suction table 1.

[0069] The film-tearing robot arm 31 is adjusted to tear off the film on the finished PCB board and transfer the film to the first collection box 6. Then, the cutting robot arm 32 is adjusted to separate the PCB board material from the PCB board small unit, and then the film-tearing robot arm 31 is further adjusted to remove the PCB board material from the vacuum suction table 1, and then transfer the PCB board material to the second collection box 7.

[0070] When it is necessary to transfer the PCB board small unit, the transfer mechanical arm 41 is adjusted, and the transfer mechanical arm 41 drives the transfer platform 42 to move, and the transfer platform 42 drives the adsorption small platform 441 to move, so that the adsorption surface of the adsorption small platform 441 is attached to the PCB board small unit. The adsorption pump 442 is adjusted, and the adsorption pump 442 makes the adsorption hose 443 and the adsorption small hole 444 both in a negative pressure state. When the adsorption small hole 444 is close to the PCB board small unit, the adsorption small platform 441 adsorbs the PCB board small unit in turn, and then adjusts the adsorption fan 21 so that the PCB board small unit is firmly adsorbed by the adsorption small platform 441, and then continues to adjust the transfer mechanical arm 41 to transfer the PCB board small unit.

[0071] When it is necessary to adjust the distance between the adsorption platforms 441, the first adjusting motor 4311 is adjusted. The driving shaft of the first adjusting motor 4311 can drive the first bidirectional screw 4312 to rotate. Under the action of the first guide rod 4313, the first adjusting motor 4311 can drive the first slider 4314 to move closer to or farther away from each other, thereby realizing the two second adjusting components 432 moving closer to or farther away from each other, and changing the lateral distance between the small units of the PCB board.

[0072] Then, the second drive motor 4321 is adjusted respectively, and the driving shaft of the second drive motor 4321 drives the second bidirectional screw 4322 to rotate. Under the action of the second guide slide bar 4323, the second bidirectional screw 4322 drives the second slider 4324 located thereon to move, so that the second slider 4324 drives the adsorption platform 441 to move, thereby realizing the change of the distance between the adsorption platforms 441, so that the four PCB board small units can match the corresponding positions on the material rack.

[0073] The first drive motor and the second drive motor 4321 are adjusted in sequence to restore the four adsorption platforms 441 to the previously set positions, and the PCB board small unit on the vacuum suction table 1 is continuously adsorbed, and then the distance between the four adsorption platforms 441 is continuously adjusted to place the PCB board small unit on the designated material rack. When the PCB board small unit on the material rack is full, the capacitor and the inductor are placed on the PCB board small unit, and the material rack is adjusted to move the entire material rack to the fourth station for inspection and processing.

[0074] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. An automatic film tearing control method, characterized in that: It comprises an automatic film-tearing control device, wherein the automatic film-tearing control device comprises a vacuum suction table (1), an adsorption device (2), a film-tearing device (3) and a transfer device (4); The film-tearing device (3) comprises a film-tearing mechanical arm (31) and a cutting mechanical arm (32); the film-tearing mechanical arm (31) and the cutting mechanical arm (32) are both arranged on the vacuum suction table (1); the film-tearing mechanical arm (31) is used to tear off the film on the PCB board, the cutting mechanical arm (32) is used to cut and separate small units of the PCB board, and the film-tearing mechanical arm (31) is also used to clean the material corners on the PCB board; The adsorption device (2) comprises an adsorption fan (21); an adsorption chamber (11) is provided on the vacuum suction table (1); a plurality of adsorption holes (12) are provided on the adsorption surface of the vacuum suction table (1); the adsorption holes (12) are connected to the adsorption chamber (11); an air inlet of the adsorption fan (21) is connected to the adsorption chamber (11), and the adsorption fan (21) is arranged on the vacuum suction table (1); The transfer device (4) comprises a transfer mechanical arm (41), a transfer platform (42) located on the transfer mechanical arm (41), an adjustment mechanism (43), and a plurality of adsorption members (44); the adsorption members (44) are arranged on the adjustment mechanism (43), and the adsorption members (44) are used to adsorb the small units of the PCB board; the adjustment mechanism (43) is arranged on the transfer platform (42), and the adjustment mechanism (43) is used to adjust the distance between the adsorption members (44); The adsorption member (44) comprises a plurality of adsorption platforms (441), an adsorption pump (442) and an adsorption hose (443); an adsorption hole (444) is provided through the adsorption platform (441); an air inlet of the adsorption hole (444) is used for adsorbing the PCB board small unit, and an air outlet of the adsorption hole (444) is used for communicating with the adsorption hose (443); an end of the adsorption hose (443) away from the adsorption platform (441) is communicated with the air inlet of the adsorption pump (442); The adjustment mechanism (43) includes a first adjustment component (431) and two second adjustment components (432); the first adjustment component (431) includes a first adjustment motor (4311), a first bidirectional screw (4312), a first guide slide (4313) and four first sliders (4314); the adsorption platform (441) is respectively arranged on the second adjustment component (432); the first bidirectional screw (4312) and the first guide slide (4313) are respectively arranged to penetrate the two first sliders (4314), and the first bidirectional screw (4312) and the first guide slide (4313) are axially parallel to each other, and the first bidirectional screw (4311) and the first guide slide (4313) are axially parallel to each other. 2) are rotatably connected to the transfer platform (42), the two ends of the first bidirectional screw (4312) are connected to the transfer platform (42) via bearings, the outer ring of the bearing is interference fit with the transfer platform (42), the inner ring of the bearing is interference fit with the first bidirectional screw (4312), one end of the first bidirectional screw (4312) extending out of the transfer platform (42) is connected to a first adjustment motor (4311), the first adjustment motor (4311) is used to drive the first bidirectional screw (4312) to rotate, and the first adjustment motor (4311) can drive the first slider (4314) to move closer to or farther away from each other, thereby changing the lateral distance between the small units of the PCB board; The second adjustment component (432) includes two second driving motors (4321), a second bidirectional screw (4322), a second guide slide rod (4323) and four second sliders (4324); the two ends of the second bidirectional screw (4322) and the second guide slide rod (4323) are respectively passed through the two second sliders (4324), and the second bidirectional screw (4322) and the second guide slide rod (4323) are arranged in parallel; the two ends of the second bidirectional screw (4322) are respectively rotatably connected to the first slider (4314), the two ends of the second guide slide rod (4323) are respectively connected to the first slider (4314), one end of the second bidirectional screw (4322) is close to the first bidirectional screw (4312), and the other end is close to the A first guide slide bar (4313) is provided; one end of the second bidirectional screw (4322) extends out of the first slider (4314) and is connected to the second drive motor (4321); the second drive motor (4321) is used to drive the second bidirectional screw (4322) to rotate; the second bidirectional screw (4322) drives the second slider (4324) located thereon to move, so that the second slider (4324) drives the adsorption platform (441) to move, thereby realizing the change of the distance between the adsorption platforms (441); the adsorption platforms (441) are respectively arranged on the second sliders (4324); the second adjustment component (432) is arranged between the first bidirectional screw (4312) and the second guide slide bar (4323); The following steps are also included: S1: Loading the finished workpiece, placing the finished PCB board on the vacuum suction table (1); S2: film tearing process, adjusting the adsorption device (2) to adsorb the PCB board small units on the vacuum suction table (1); adjusting the film tearing device (3), the film tearing device (3) is used to separate the PCB finished board into PCB board small units; S3: PCB board small unit loading processing, adjusting the transfer device (4), placing the PCB board on the material rack, and fixing the electronic components to the corresponding PCB board small unit; S4: Inspection and processing, adjusting the material rack, moving the material rack to the fourth station, so that the fourth station can inspect and process the PCB board.

2. The automatic film tearing control method according to claim 1, characterized in that: In step S3: the electronic components include capacitors and inductors, and the capacitors and inductors are fixed to corresponding PCB board small units in turn.

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