Pressure sensor device

Abstract

The pressure sensor device of the present invention includes a first substrate having external connection terminals, a second substrate laminated on the first substrate and having a first through-opening and a second through-opening formed therein, a pressure sensor element having a diaphragm structure and mounted on the upper surface of the second substrate so that the diaphragm structure blocks the first through-opening, and a cover mounted on the upper surface of the second substrate so as to cover the pressure sensor element and forming a first flow path for guiding a first fluid toward the upper surface of the diaphragm structure. A second flow path is formed between the first and second substrates, communicating from the second through-opening to the first through-opening and guiding the second fluid toward the lower surface of the diaphragm structure.

Description

[0001] This application is a divisional application; the application number of its parent application is "2019800075117", and the name of the invention is "Pressure sensor device". Technical Field

[0002] The present invention relates to a pressure sensor device including a semiconductor pressure sensor element. Background Art

[0003] A pressure sensor device comprises a semiconductor pressure sensor element, a pressure inlet for introducing a fluid to be measured, and an atmospheric inlet for introducing atmospheric air as a comparison, all packaged together. The semiconductor pressure sensor element is a chip that detects the pressure of a fluid relative to atmospheric pressure, with a piezoelectric element disposed on the surface of a diaphragm that deforms according to the pressure of the introduced fluid and the atmosphere.

[0004] As described above, when atmospheric pressure is used as a comparison pressure, atmospheric air is introduced into the atmospheric inlet port, and when a pressure other than atmospheric pressure is used as a comparison pressure, a fluid having the comparison pressure is introduced into the atmospheric inlet port.

[0005] In a pressure sensor device, the terminals of the piezoelectric element in the semiconductor pressure sensor element are connected to the external connection terminals of the pressure sensor device. These external connection terminals are soldered to terminals on the mounting surface of the base plate. In this manner, the pressure sensor device is mounted on the base plate for use.

[0006] Furthermore, as prior art documents related to a pressure sensor device including a semiconductor pressure sensor element, there are, for example, Patent Documents 1 and 2.

[0007] Prior art literature

[0008] Patent Literature

[0009] Patent Document 1: Japanese Patent Application Laid-Open No. 2012-233872

[0010] Patent Document 2: Japanese Patent Application Laid-Open No. 2012-52874 Summary of the Invention

[0011] Problems to be solved by the invention

[0012] The pressure sensor device disclosed in Patent Document 1 is formed by insert molding using a lead frame, with leads extending outward from the pressure sensor device package. This increases the area required for mounting the pressure sensor device on a baseboard due to the outward extension of the leads, making miniaturization of the pressure sensor device difficult.

[0013] The pressure sensor device disclosed in Patent Document 2 places a semiconductor pressure sensor element directly below the pressure inlet. Therefore, if dust, such as flux, enters the pressure inlet, the dust directly adheres to the semiconductor pressure sensor element, significantly affecting its operation and preventing it from functioning properly.

[0014] Therefore, an object of the present invention is to provide a pressure sensor device that can be downsized and can suppress the intrusion of dust into a pressure introduction port.

[0015] Solutions to Problems

[0016] To achieve the above-mentioned object, the pressure sensor device of the present invention includes a first substrate having external connection terminals, a second substrate laminated on the first substrate and having a first through-opening and a second through-opening formed therein, a pressure sensor element having a diaphragm structure and mounted on the upper surface of the second substrate so that the diaphragm structure blocks the first through-opening, and a cover mounted on the upper surface of the second substrate so as to cover the pressure sensor element and forming a first flow path for guiding a first fluid toward the upper surface of the diaphragm structure. A second flow path is formed between the first and second substrates, communicating with the first through-opening through the second through-opening and guiding the second fluid toward the lower surface of the diaphragm structure.

[0017] Effects of the Invention

[0018] According to the present invention, the pressure sensor device can be miniaturized and dust can be suppressed from entering the pressure introduction port of the pressure sensor device. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 1. The pressure sensor device of the first embodiment is shown in a top view (A), a side view (B), a side view (C), and a top view (D) of the bottom view.

[0020] Figure 2 1 and 2 are a plan view (A) of the upper surface side and a plan view (B) of the lower surface side of the substrate of the pressure sensor device according to the first embodiment.

[0021] Figure 3 1. A perspective view (A) of the upper surface side and a perspective view (B) of the lower surface side of the cover of the pressure sensor device according to the first embodiment.

[0022] Figure 4 It is a cross-sectional view of the pressure sensor device according to the first embodiment.

[0023] Figure 5 1. (A) is a cross-sectional view of a cover portion of the pressure sensor device according to the first embodiment, and (B) is a diagram illustrating the structure of the cover portion.

[0024] Figure 6 This is a cross-sectional view of an example of the pressure sensor device according to the first embodiment being mounted on a base plate.

[0025] Figure 7 This is a cross-sectional view of another example of attaching the pressure sensor device according to the first embodiment to a base plate.

[0026] Figure 8 1 and 2 are a top view (A), a side view (B), a side view (C), and a top view (D) of the bottom side of the pressure sensor device according to the second embodiment.

[0027] Figure 9 1 and 10 are a plan view (A) of the upper surface side and a plan view (B) of the lower surface side of the substrate of the pressure sensor device according to the second embodiment.

[0028] Figure 10 1 and 2 are a perspective view (A) of the upper surface and a perspective view (B) of the lower surface of the cover of the pressure sensor device according to the second embodiment.

[0029] Figure 11 It is a cross-sectional view of a pressure sensor device according to a second embodiment.

[0030] Figure 12 This is a cross-sectional view of an example of a case where the pressure sensor device according to the second embodiment is mounted on a base plate.

[0031] Figure 13 This is a cross-sectional view of another example in which the pressure sensor device according to the second embodiment is mounted on a base plate.

[0032] Figure 14 1. The pressure sensor device of the first modified example is shown in a top view (A), a side view (B), a perspective view (C), and a perspective view (D) of the top and bottom sides of the cover.

[0033] Figure 15 is a cross-sectional view of a pressure sensor device according to a second modified example.

[0034] Figure 16 4 are cross-sectional views of pressure sensor devices according to third to fifth modified examples.

[0035] Figure 17 1 and 2 are a top view (A), a side view (B), and a bottom view (C) of a pressure sensor device according to a third embodiment.

[0036] Figure 18 yes Figure 17 (B) is a cross-sectional view taken at AA'.

[0037] Figure 19 yes Figure 18 Cross-sectional view at BB' (A), cross-sectional view at CC' (B).

[0038] Figure 20 A top view of the upper surface of the first substrate (A) Figure 20 Cross-sectional view at DD' in (A) (B).

[0039] Figure 21 It is a top view (A) of the upper side of the second substrate and a top view (B) of the lower side.

[0040] Figure 22 yes Figure 21 Cross-sectional view at EE' in (A).

[0041] Figure 23 1 and 2. A cross-sectional view (A) of the first substrate and the second substrate before bonding and a cross-sectional view (B) of the second substrate after bonding.

[0042] Figure 24 1 and 2. A sectional view (A) of a substrate showing a first modified example of the third embodiment and a plan view (B) of a recessed portion of a first substrate.

[0043] Figure 25 1 and 2 are a top view (A), a side view (B), and a bottom view (C) of a pressure sensor device according to a second modified example of the third embodiment.

[0044] Figure 26 yes Figure 25 (B) is a cross-sectional view taken at F-F'.

[0045] Figure 27 yes Figure 26 Cross-sectional view at G-G'.

[0046] Figure 28 yes Figure 26 Cross-sectional view at H-H'.

[0047] Figure 29 1 and 2 are a top view (A), a side view (B), and a bottom view (C) of a pressure sensor device according to a third modified example of the third embodiment.

[0048] Figure 30 yes Figure 29 (B) is a cross-sectional view taken at II'.

[0049] Figure 31 yes Figure 30 Cross-sectional view at J-J'.

[0050] Figure 32 yes Figure 30 Cross-sectional view at K-K' in FIG.

[0051] Figure 33 1 and 2 are a top view (A), a side view (B), and a bottom view (C) of a pressure sensor device according to a fourth modified example of the third embodiment.

[0052] Figure 34 yes Figure 33 (B) is a cross-sectional view taken at LL'.

[0053] Figure 35 yes Figure 34 Cross-sectional view at M-M' in FIG.

[0054] Figure 36 yes Figure 34 Cross-sectional view at N-N'. DETAILED DESCRIPTION

[0055] <First embodiment>

[0056] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. Figure 1 (A) is a top view of the upper surface side of the pressure sensor device of this embodiment. Figure 1 (B) and Figure 1 (C) is a side view, Figure 1 (D) is a top view of the bottom side. Cover 20A is mounted on the top surface of substrate 10A, and lid 30 is mounted on the bottom surface of substrate 10A. Substrate 10A is a plate-like, rectangular shape in top view, with a plurality of terminals 12 arranged on two opposing sides.

[0057] The cover 20A is a resin molded product having a box-shaped portion 21 and a cylindrical portion 25. The cylindrical portion 25 has a cylindrical outer shape and a cylindrical upper end opening 26t at its distal end. The cover 30 has a plate-like shape and has a cover opening 32 formed in its side wall, serving as a second pressure inlet.

[0058] Figure 2 (A) is a plan view of the upper surface side of the substrate of the pressure sensor device of this embodiment. Figure 2 (B) is a top view of the bottom side. Substrate 10A is formed from epoxy glass resin or the like and has a base 11 as a main plate-shaped structure, on which are formed terminals 12 serving as external connection terminals. Terminals 12 are formed along the top, side, and bottom surfaces of base 11. Wiring 13, including a ground line, is formed on the top surface of base 11 and connected to terminals 12.

[0059] A through-opening 14 is formed in the base 11. A pressure sensor element 15 is mounted on the upper surface of the base 11, blocking the through-opening 14. A control chip 16 is mounted on the upper surface of the base 11, adjacent to the pressure sensor element 15. Bonding wires 17 connect the pressure sensor element 15 to the control chip 16, the pressure sensor element 15 to the ground of the wiring 13, and the control chip 16 to the ground of the wiring 13. A metal layer 31e is formed around the through-opening 14 on the lower surface of the base 11. The structure around the cover will be described later. The substrate 10A is constructed as described above.

[0060] The pressure sensor element 15 is an element formed with a diaphragm for detecting pressure. It may be a semiconductor strain gauge type element that detects diaphragm deformation as a change in resistance, a capacitance type element that detects diaphragm displacement as a change in capacitance, or an element that detects the pressure being measured using another detection method. The through-opening 14 of the substrate 10A is connected to one side of the diaphragm, and the through-opening 14 is sealed, so that the through-opening 14 is mounted on the upper surface of the substrate 10A using an adhesive such as silicone resin.

[0061] Figure 3 (A) is a perspective view of the upper surface side of the cover of the pressure sensor device according to the present embodiment. Figure 3 (B) is a perspective view from the bottom side. The cover 20A includes a box-shaped portion 21 and a cylindrical portion 25. A first recess 22 and a second recess 23 are formed on the side of the box-shaped portion 21 that is bonded to the substrate 10A, and a connecting portion 24 is formed to connect the first recess 22 and the second recess 23. When the cover 20A is mounted on the substrate 10A, a hollow structure (first hollow portion) is formed by the surface of the substrate 10A, the first recess 22, the second recess 23 of the cover 20A, and the inner surface of the connecting portion 24. The pressure sensor element 15 and the control chip 16 on the substrate 10A are housed in the space on the first recess 22 side of the first hollow portion. The cylindrical portion 25 is provided on the box-shaped portion 21 above the second recess 23. The cylindrical portion 25 has an upper end opening 26t of the cylindrical portion 25 as an opening that extends through the cylindrical portion 25 and the box-shaped portion 21 and reaches the second recess 23.

[0062] Figure 4 is a cross-sectional view of the pressure sensor device according to this embodiment. Figure 4 (A) Equivalent to Figure 2 The cross section at XA-XB in (A) is Figure 4 (B) is equivalent to Figure 2 (A) Cross section at YA-YB. As described above, the opening structure with the upper end opening 26t of the cylindrical portion 25 as the end portion reaches the second recess 23 through the cylindrical portion opening 26 and the box-shaped portion through-hole 21a inside the cylindrical portion 25. The second recess 23 is connected to the first recess 22 via the connecting portion 24.

[0063] Thus, a first flow path is formed that guides the first fluid toward the upper surface of the diaphragm structure of the pressure sensor element 15, from the cylindrical upper end opening 26t of the cylindrical portion 25 to the cylindrical opening 26, the box-shaped portion through-hole 21a, the second recess 23, the connecting portion 24, and the first recess 22. The black arrows indicate the flow of this fluid. The first fluid is, for example, the fluid to be measured for pressure. Arrows marked with a plus in the figure indicate flow in a direction perpendicular to the drawing.

[0064] A plate-shaped cover 30 is mounted below the substrate 10A at a predetermined distance from the substrate 10A in a manner covering the through-opening 14. The cover 30 is separated from the substrate 10A by the side wall 31, and a hollow structure (second hollow portion) is formed by the bottom of the substrate 10A, the cover 30, and the inner surface of the side wall 31. A portion of the side wall is removed to form the cover opening 32. The opening structure with the cover opening 32 as the end is connected to the through-opening 14 through the second hollow portion, forming a second flow path for guiding the second fluid to the bottom of the diaphragm structure of the pressure sensor element 15. The flow of the fluid is indicated by a white arrow. The second fluid is, for example, a fluid to be compared with the pressure measurement, such as the atmosphere. The arrows marked with a + in the figure indicate flow in a direction perpendicular to the paper surface.

[0065] In the pressure sensor device of this embodiment, substrate 10A has a rectangular shape in a plan view, and terminals 12 are formed along two opposing sides of this rectangular substrate 10A. Cover opening 32 opens toward a side different from the two opposing sides. This prevents solder flux generated near terminals 12 secured by solder from entering cover opening 32, compared to a case where cover opening 32 opens toward terminals 12 when the pressure sensor device is mounted on a base plate, as described later.

[0066] As described above, pressure sensor element 15 guides the first fluid on its upper surface and the second fluid on its lower surface. The deformation or displacement of the diaphragm changes according to the pressures of the first and second fluids. By detecting the deformation or displacement of the diaphragm as a change in resistance or capacitance, the pressure of the first fluid (the object of measurement) can be measured while the second fluid is used as a comparison object.

[0067] In the above structure, for example, substrate 10A has a thickness of approximately 0.1 mm to 1 mm and has a rectangular shape with sides of approximately 2 mm to 20 mm when viewed from above. The box-shaped portion 21 of cover 20A has a height of approximately 1 mm and is sized to not cover the terminals when mounted on substrate 10A. The cylindrical portion 25 has a diameter of approximately 0.5 mm, which corresponds to a fraction to half of a side of the rectangular shape of substrate 10A when viewed from above. The cover 30 has a plate-like shape with a thickness of approximately 0.1 mm to 1 mm.

[0068] Figure 5 (A) is a cross-sectional view of the cover portion of the pressure sensor device according to this embodiment. Sidewall 31 is formed to separate cover 30 from base 11 of substrate 10A by a predetermined distance. Sidewall 31 is composed of a stacked metal layer 31e of Cu, Ni, Au, etc., a resistance layer 31d, a bonding sheet 31c, an anti-etching layer 31b, and a metal layer 31a of copper, etc. Each layer has a thickness ranging from 0.1 μm to 200 μm, for a total thickness of approximately 10 μm to 500 μm. The distance corresponding to this thickness corresponds to the separation distance a between substrate 10A (base 11) and cover 30.

[0069] Figure 5 (B) is a diagram illustrating the structure of the cover. Figure 5 (B) The method for forming the cover portion will be described. A metal layer 31e is pattern-formed on the bottom surface of substrate 10A (base 11), and a resist layer 31d is pattern-formed on the top surface. Meanwhile, a metal layer 31a and a resist layer 31b are pattern-formed on the surface of cover 30 that faces substrate 10A. Next, resist layers 31b and 31d are attached to the top and bottom surfaces of bonding sheet 31c. This forms sidewall 31.

[0070] In this embodiment, a lid opening 32 is formed in the side wall 31 of the lid 30. The lid opening 32 can be formed in the side wall 31 by removing the regions that become the lid opening 32 and forming the metal layer 31e, resist layer 31d, bonding sheet 31c, resist layer 31b, and metal layer 31a. Figure 2 (B) shows a state where the metal layer 31 e is formed around the through-opening 14 on the lower surface of the substrate 10A. This is a structure where the metal layer 31 e is formed around the through-opening 14 except for the portion that becomes the lid opening 32 .

[0071] Figure 6 (A) and Figure 6 (B) is a cross-sectional view of an example of a case where the pressure sensor device of this embodiment is mounted on a base plate, and Figure 4 (A) and Figure 4 (B) corresponds to the cross section. Figure 6(A) and Figure 6 In (B), the cylindrical portion 25 is mounted on the base plate 100 so as to face upward relative to the base plate 100. The base plate 100 is a glass epoxy resin substrate such as FR-4, and terminals and wiring patterns (not shown) are formed on the surface.

[0072] An opening 100A is formed in the base plate 100. The pressure sensor device of this embodiment is mounted by inserting the cover 30 into the opening 100A, placing the pressure sensor device on the base plate 100, and then attaching the terminals 12 of the pressure sensor device to terminals (not shown) on the base plate 100 by welding. In this case, the bottom and side surfaces of the terminals 12 are connected by welding.

[0073] Figure 7 (A) and Figure 7 (B) is a cross-sectional view of another example of the pressure sensor device of this embodiment being mounted on a base plate. Figure 4 (A) and Figure 4 (B) corresponds to the cross section of the state of being reversed upside down. Figure 7 (A) and Figure 7 In (B), the cylindrical portion 25 is attached to the base plate 100 so as to face downward relative to the base plate 100 .

[0074] In this embodiment, the pressure sensor device has a cover 20A inserted into the opening 100A of the base plate 100. The pressure sensor device is mounted on the base plate 100, and the terminals 12 of the pressure sensor device are fixed to terminals (not shown) on the base plate 100 by welding. In this case, the top surface (the surface facing the cover 20A) and the side surface of the terminals 12 are connected by welding.

[0075] Since the terminals 12 are formed along the top, side, and bottom surfaces of the base 11 constituting the substrate 10A, the pressure sensor can be used in conjunction with the pressure sensor without changing the device structure. Figure 6 (A) and Figure 6 (B) The installation method shown and Figure 7 (A) and Figure 7 (B) corresponds to the installation method shown.

[0076] The substrate 10A has a rectangular shape in a plan view, and the terminals 12 are formed along two opposing sides of the rectangular substrate 10A. Figure 6 (A) and (B) and Figure 7 In the examples shown in (A) and (B), the lid opening 32 opens toward a side different from the two opposing sides. When a pressure sensor device with this structure is mounted on the base plate 100, compared to a case where the lid opening 32 opens toward the terminal 12, solder flux generated near the terminal 12 secured with solder is less likely to enter the lid opening 32.

[0077] In the pressure sensor device of this embodiment, a plate-shaped cover 30 is mounted on the underside of the cover plate 10A at a predetermined distance from the substrate 10A so as to cover the through-opening 14. Since the through-opening 14 is hidden from the outside, dust such as flux can be prevented from entering the pressure sensor element 15 through the through-opening 14.

[0078] Furthermore, the pressure sensor device of this embodiment does not use a lead frame, and the dedicated area when mounted on a base plate is equivalent to the area of ​​substrate 10A, enabling miniaturization of the pressure sensor device. Cost reduction is achieved by using inexpensive injection-molded components instead of expensive insert molding.

[0079] Furthermore, in the pressure sensor device of this embodiment, the pressure sensor element 15 is not positioned directly below the cylindrical portion upper end opening 26t. Even if dust enters through the cylindrical portion upper end opening 26t, it is collected in the portion of the second recess 23 located directly below the cylindrical portion upper end opening 26t, making it difficult for the dust to reach the pressure sensor element 15. The second recess 23 functions as a filter. A structure that functions as a filter can be easily implemented by providing the cover with the second recess 23 and a flow path communicating with the recess.

[0080] <Second embodiment>

[0081] In the description of this embodiment, description of the same parts as those of the first embodiment will be omitted. Figure 8 (A) is a top view of the upper surface side of the pressure sensor device of this embodiment. Figure 8 (B) and (C) are side views. Figure 8 (D) is a plan view of the lower surface side. The cover 20B is mounted on the upper surface of the substrate 10B, and the lid 30 is mounted on the lower surface of the substrate 10B.

[0082] The substrate 10B is a plate-shaped, rectangular shape when viewed from above, with multiple terminals 12 arranged along two opposing sides. The cover 20B is a resin molded product, comprising a box-shaped portion 21 and a cylindrical portion 25. A box-shaped portion opening 27 serving as a first pressure inlet port is formed at the upper corner (upper corner) of the box-shaped portion 21. The cylindrical portion 25 has a cylindrical outer shape and a cylindrical structure with an upper cylindrical portion opening 26t at the front end serving as a second pressure inlet port.

[0083] Figure 9 (A) is a plan view of the upper surface side of the substrate of the pressure sensor device of this embodiment. Figure 9(B) is a top view of the bottom side. In the substrate 10B, a through opening 14 and a second through opening 18 are formed on the base 11. In addition, a metal layer 31e is formed around the through opening 14 and the second through opening 18 on the bottom of the base 11. Except for the above, it has substantially the same structure as the substrate 10A of the first embodiment. Figure 9 As shown in (A), the through opening portion 14 and the second through opening portion 18 are located on the single-point chain line represented by ZA-ZB on the drawing, but are not limited to this. Either or both of the through opening portion 14 and the second through opening portion 18 may be located at a position deviated from the single-point chain line represented by ZA-ZB.

[0084] Figure 10 (A) is a perspective view of the upper surface side of the cover of the pressure sensor device according to the present embodiment. Figure 10 (B) is a perspective view from the bottom side. The cover 20B has a box-shaped portion 21 and a cylindrical portion 25. A first recess 22 and a second recess 23 are formed on the side of the box-shaped portion 21 that contacts the substrate 10B. When the cover 20B is mounted on the substrate 10B, a hollow structure (first hollow portion) is formed by the surface of the substrate 10B and the inner surface of the first recess 22 of the cover 20B. Separately, a hollow structure (second hollow portion) is formed by the surface of the substrate 10B and the inner surface of the second recess 23 of the cover 20B.

[0085] The pressure sensor element 15 and control chip 16 on substrate 10B are housed in the space within the first hollow portion. Second through-opening 18 is located directly below and communicates with the second hollow portion. A cylindrical portion 25 is provided on box-shaped portion 21 above second recess 23.

[0086] The cylindrical portion 25 has an upper end opening 26t as an opening structure that penetrates the cylindrical portion 25 and the box-shaped portion 21 to reach the second recess 23. Furthermore, a box-shaped portion opening 27 is formed at an upper corner of the box-shaped portion 21, extending through the first recess 22. The box-shaped portion opening 27 may be formed on the top or side of the box-shaped portion 21. Alternatively, it may be formed on the top or side, or, as mentioned above, at the upper corner of the box-shaped portion 21.

[0087] Figure 11 is a cross-sectional view of the pressure sensor device of this embodiment, which is equivalent to Figure 9 Cross-section at ZA-ZB in (A). As described above, the box-shaped portion opening 27 formed at the corner of the box-shaped portion 21 of the cover 20B extends through the first recess 22, forming a first flow path that guides the first fluid to the upper surface of the diaphragm structure of the pressure sensor element 15. The flow of this fluid is indicated by white arrows. The first fluid is, for example, the fluid to be compared with the pressure measurement.

[0088] Furthermore, a plate-shaped cover 30 is mounted on the bottom surface of the substrate 10A at a predetermined distance from the substrate 10A so as to cover the through-opening 14. The cover 30 is separated from the substrate 10A by side walls 31, and a hollow structure (third hollow portion) is formed by the bottom surface of the substrate 10A, the cover 30, and the inner surface of the side walls 31. The side walls 31 are the same as those of the first embodiment, except that the cover opening is not formed.

[0089] The opening structure, which ends at the cylindrical upper end opening 26t of the cylindrical portion 25, reaches the second recess 23 through the cylindrical opening 26 and the box-shaped portion through-portion 21a within the cylindrical portion 25. The second recess 23 communicates with the third hollow portion formed by the lower surface of the substrate 10A, the cover 30, and the inner surface of the sidewall 31 via the second through-opening 18. The third hollow portion communicates with the lower surface of the diaphragm structure of the pressure sensor element 15 via the through-opening 14.

[0090] In this manner, the opening structure, which ends at the cylindrical portion upper end opening 26t, communicates with the cylindrical portion opening 26, the box-shaped portion through-hole 21a, the second hollow portion, the second through-hole 18, the third hollow portion, and the through-hole 14, thereby forming a second flow path for guiding the second fluid toward the lower surface of the diaphragm structure of the pressure sensor 15. The flow of this fluid is indicated by black arrows. The second fluid is, for example, the fluid to be measured for pressure.

[0091] In the pressure sensor device of this embodiment, the substrate 10A has a rectangular shape in a plan view, and the terminals 12 are formed along two opposing sides of the rectangular substrate 10A. Figure 8 The box-shaped portion opening 27 shown in FIG. 1 is open to two opposing sides forming the terminals. If the box-shaped portion opening 27 is configured to open to sides different from the two opposing sides forming the terminals, it is possible to suppress the solder flux generated near the terminals 12 fixed with solder from entering the box-shaped portion opening 27 during mounting.

[0092] Figure 12 FIG. 1 is a cross-sectional view of an example of a case where the pressure sensor device of this embodiment is mounted on a base plate. Figure 12 In the embodiment, the cylindrical portion 25 is mounted on the base plate 100 with the cylindrical portion 25 facing upward relative to the base plate 100. The base plate 100 is a glass epoxy resin substrate such as FR-4, with terminals and wiring patterns (not shown) formed on its surface. An opening 100A is formed in the base plate 100. The cover 30 of the pressure sensor device of this embodiment is inserted into the opening 100A, the pressure sensor device is placed on the base plate 100, and the terminals 12 of the pressure sensor device are connected and fixed to the terminals (not shown) on the base plate 100 by soldering. In this case, the bottom and side surfaces of the terminals 12 are connected by solder.

[0093] Figure 13This is a cross-sectional view of another example of mounting the pressure sensor device of this embodiment on a base plate. Figure 11 The cross section corresponds to the state of up and down rotation. Figure 13 In the embodiment, the cylindrical portion 25 is mounted on the base plate 100 in a manner that the cylindrical portion 25 faces downward relative to the base plate 100. The cover 20B of the pressure sensor device of this embodiment enters the opening portion 100A of the base plate 100, the pressure sensor device is placed on the base plate 100, and the terminal 12 of the pressure sensor device is fixed to the unillustrated terminal of the base plate 100 by soldering for installation. In this case, the top (the surface on the cover 20A side) and the side of the terminal 12 are connected by solder. As in the first embodiment, since the terminal 12 is formed along the three surfaces of the top, side, and bottom of the base 11 constituting the substrate 10B, it can be connected to the pressure sensor device without changing the structure. Figure 12 The installation method shown and Figure 13 The installation method shown corresponds to

[0094] According to the pressure sensor device of this embodiment, a plate-shaped cover 30 is mounted on the lower surface of substrate 10B at a predetermined distance from substrate 10B so as to cover through-opening 14. Since through-opening 14 is shielded from the outside, dust such as flux can be prevented from entering pressure sensor element 15 through through-opening 14.

[0095] Furthermore, the pressure sensor device of this embodiment does not use a lead frame, and when mounted on a base plate, the dedicated area is equivalent to the area of ​​the substrate 10B, enabling miniaturization of the pressure sensor device. By eliminating the need for expensive insert molding and using inexpensive injection-molded components, costs can be reduced.

[0096] Furthermore, in the pressure sensor device of this embodiment, the pressure sensor element 15 is not positioned directly below the cylindrical portion upper end opening 26t. Even if dust enters through the cylindrical portion upper end opening 26t, it is collected in the portion of the second recess 23 or the third hollow portion located directly below the cylindrical portion upper end opening 26t, making it difficult for the dust to reach the pressure sensor element 15. The second recess 23 and the third hollow portion function as a filter. By providing a flow path in the cover connecting the second recess 23 and the third recess, for example, the filter function can be easily implemented.

[0097] <First Modification>

[0098] Figure 14 (A) is a top view of the upper surface side of the pressure sensor device of the first modified example. Figure 14 (B) is the side view (B), Figure 14 (C) is a perspective view of the upper side of the cover. Figure 14(D) is a perspective view of the bottom side. The cover 20C is mounted on the upper surface of the substrate 10C, and the lid 30 is mounted on the lower surface of the substrate 10C via the side wall 31. The cover 20C includes a box-shaped portion 21, a first cylindrical portion 25A, and a second cylindrical portion 25B.

[0099] The first tubular portion 25A has a cylindrical outer shape and a tubular structure with an upper opening 26A at its front end, serving as a second pressure inlet. The second tubular portion 25B has a cylindrical outer shape and a tubular structure with an upper opening 26B at its front end, serving as a first pressure inlet. The first tubular portion 25A is disposed on the box-shaped portion 21 above the second recess 23. Similar to the second embodiment, the upper opening 26A communicates with the lower surface of the diaphragm structure of the pressure sensor element 15 via the second and third hollow portions.

[0100] On the other hand, in this modification, instead of the box-shaped portion opening 27 in the second embodiment, a second cylindrical portion 25B is provided on the box-shaped portion 21 above the first recess 22. The cylindrical portion upper end opening 26B communicates with the upper surface of the diaphragm structure of the pressure sensor element 15 in the first hollow portion.

[0101] In the pressure sensor device of this embodiment, fluids other than the atmosphere are introduced from the first tubular portion 25A and the second tubular portion 25B to the pressure sensor element 15 , respectively, and the pressure difference between the two fluids can be obtained as information.

[0102] <Second Modification>

[0103] Figure 15 (A) is a cross-sectional view of a pressure sensor device according to a second modification. The pressure sensor device according to the first modification is mounted on a base plate 100. Here, the device is mounted with the first cylindrical portion 25A and the second cylindrical portion 25B facing downward relative to the base plate 100. The fluid to be measured for pressure (black arrow) is guided toward the first cylindrical portion 25A, while the fluid to be compared for pressure measurement (white arrow) is guided toward the second cylindrical portion 25B.

[0104] Figure 15 (B) is a cross-sectional view of another example of the pressure sensor device of the second modification. The pressure sensor device of the first modification is mounted on the base plate 100. Here, the first cylindrical portion 25A and the second cylindrical portion 25B are mounted with the first cylindrical portion 25A and the second cylindrical portion 25B facing upward relative to the base plate 100. The fluid to be measured for pressure (black arrow) is guided toward the first cylindrical portion 25A, while the fluid to be compared for pressure measurement (white arrow) is guided toward the second cylindrical portion 25B.

[0105] Figure 15(C) is a cross-sectional view of another example of the pressure sensor device of the second modification. The pressure sensor device of the first modification is mounted on the base plate 100. Here, the first cylindrical portion 25A and the second cylindrical portion 25B are mounted downward relative to the base plate 100. The fluid to be compared for pressure measurement (white arrow) is guided toward the first cylindrical portion 25A, and the fluid to be measured for pressure measurement (black arrow) is guided toward the second cylindrical portion 25B.

[0106] Figure 15 (D) is a cross-sectional view of another example of the pressure sensor device of the second modification. The pressure sensor device of the first modification is mounted on the base plate 100. Here, the first cylindrical portion 25A and the second cylindrical portion 25B are mounted with the first cylindrical portion 25A and the second cylindrical portion 25B facing upward relative to the base plate 100. The fluid to be compared for pressure measurement (white arrow) is guided toward the first cylindrical portion 25A, and the fluid to be measured for pressure measurement (black arrow) is guided toward the second cylindrical portion 25B.

[0107] <Third Modification>

[0108] Figure 16 (A) is a cross-sectional view of a pressure sensor device in one example of the third modification, mounted on base plate 100. Instead of the cylindrical first tubular portion 25A of the second modification, a first tubular portion 25C is formed with its distal end curved outward. Furthermore, instead of the cylindrical second tubular portion 25B of the second modification, a second tubular portion 25D is formed with its distal end curved outward. The first tubular portion 25C and the second tubular portion 25D are mounted on base plate 100 with their distal ends facing upward.

[0109] Either the fluid to be measured (black arrow) or the fluid to be compared (white arrow) in pressure measurement is guided to the first tubular portion 25C and the second tubular portion 25D. The shape of the recessed portion constituting the first hollow portion formed in the cover 20D is Figure 16 (A) shows a structure with two recessed parts and a structure communicating with the recessed parts, but the present invention is not limited to this and various structures are possible.

[0110] <Fourth Modification>

[0111] Figure 16 (B) is a cross-sectional view of a pressure sensor device according to a fourth modification example mounted on a base plate 100. The pressure sensor device of the third modification example has the first cylindrical portion 25C removed. Specifically, an opening 28 is formed on the upper surface of the box-shaped portion 21 of the cover 20E, creating a flow path that communicates with the lower surface of the diaphragm structure of the pressure sensor element 15. For example, a fluid to be measured for pressure (black arrow) is guided toward the second cylindrical portion 25D, while a fluid to be compared for pressure measurement (white arrow) is guided toward the upper surface of the box-shaped portion 21 and toward the opening 28.

[0112] <Fifth Modification>

[0113] Figure 16 (C) is a cross-sectional view of a pressure sensor device according to a fifth modification example mounted on base plate 100. In the pressure sensor device of the first embodiment, a cylindrical portion 25E, whose distal end is curved outward, is provided in place of cylindrical portion 25. Cylindrical portion 25E is mounted with the base plate 100 facing upward. The fluid to be measured (black arrow) is guided toward cylindrical portion 25E, while the fluid to be compared (white arrow) is guided toward the opening of cover 30.

[0114] According to the pressure sensor device of each of the above-described modified examples, a plate-shaped cover 30 is mounted on the bottom surface of the substrate at a predetermined distance from the substrate so as to cover the through-opening 14. Since the through-opening 14 is shielded from the outside, dust such as flux can be prevented from entering the pressure sensor element 15 through the through-opening 14.

[0115] Furthermore, the pressure sensor devices of each of the above-described variations do not use a lead frame, and when mounted on a base plate, the dedicated area is equivalent to the area of ​​the substrate, enabling miniaturization of the pressure sensor device. Cost reduction is achieved by using inexpensive injection-molded components instead of expensive insert molding.

[0116] <Third embodiment>

[0117] In the description of this embodiment, description of the same parts as those of the first embodiment will be omitted. Figure 17 (A) is a top view of the upper surface side of the pressure sensor device of this embodiment. Figure 17 (B) is a side view, Figure 17 (C) is a top view of the lower side.

[0118] A cover 20G is mounted on the substrate 10G. The substrate 10G is plate-shaped and has a rectangular shape when viewed from above. In this embodiment, a plurality of terminals 12 are arranged on the four sides of the substrate 10G. The cover 20G is a resin molded product and has a box-shaped portion 21 and a cylindrical portion 25. A box-shaped portion opening 27 serving as a first pressure inlet is formed at the upper corner (upper corner) of the box-shaped portion 21. The cylindrical portion 25 has a cylindrical shape and is a cylindrical structure with an upper end opening 26t of the cylindrical portion serving as a second pressure inlet provided at the front end.

[0119] In this embodiment, the substrate 10G comprises a first substrate 200 provided with a plurality of terminals 12 and a second substrate 300 laminated on the first substrate 200 to form a through opening described later. The first substrate 200 and the second substrate 300 are bonded together using a bonding sheet described later.

[0120] Furthermore, no through-opening is formed in the first substrate 200. In this embodiment, the first substrate 200 functions as a cover.

[0121] Furthermore, unlike the first and second embodiments, no metal layer other than the terminals 12 is formed on the lower surface of the first substrate 200 , and the area other than the terminals 12 is covered with a resist layer.

[0122] Figure 18 is a cross-sectional view of the pressure sensor device of this embodiment, which is equivalent to Figure 17 (B) Cross-section taken along line AA'. A first through-opening 14 and a second through-opening 18 are formed in the second substrate 300. Furthermore, a pressure sensor element 15 and a control chip 16 are mounted on the second substrate 300. The pressure sensor element 15 is mounted on the second substrate 300 using an adhesive such as silicone resin, so as to block the first through-opening 14.

[0123] Ground openings 301 are formed near the mounting portions of the pressure sensor element 15 and the control chip 16 on the second substrate 300 to expose the ground line 13a of the wiring 13 provided on the first substrate 200. Bonding wires 17 connect the pressure sensor element 15 and the control chip 16, the pressure sensor element 15 and the ground line 13a of the wiring 13, and the control chip 16 and the ground line 13a of the wiring 13, respectively.

[0124] Figure 19 2 is a cross-sectional view of the pressure sensor device according to the present embodiment. Figure 19 (A) Equivalent to Figure 18 The cross section at BB' in FIG. Figure 19 (B) is equivalent to Figure 18 Similar to the second embodiment, in this embodiment, a first recess 22 and a second recess 23 are formed on the bonding surface of the box-shaped portion 21 to the substrate 10G.

[0125] When the cover 20G is mounted on the substrate 10G, a hollow structure (first hollow portion) is formed by the surface of the substrate 10G and the inner surface of the first recess 22 of the cover 20G. Separately, a hollow structure (second hollow portion) is formed by the surface of the substrate 10G and the inner surface of the second recess 23 of the cover 20G.

[0126] The pressure sensor element 15 and control chip 16 on the substrate 10G are housed within the space of the first hollow portion. The second through-opening 18 is located directly below and communicates with the second hollow portion. A cylindrical portion 25 is provided on the box-shaped portion 21. An opening 26t at the upper end of the cylindrical portion 25 extends through the cylindrical portion 25 and the box-shaped portion 21, reaching the second recess 23.

[0127] The box-shaped opening 27 penetrates the first recess 22 and forms a first flow path for guiding the first fluid to the upper surface of the diaphragm structure of the pressure sensor element 15. Figure 19 The flow of the fluid is indicated by white arrows in (B). The first fluid is, for example, a fluid to be compared in pressure measurement.

[0128] Furthermore, a recess 302 is formed on the first substrate 200 side of the second substrate 300 constituting the substrate 10G. The recess 302 communicates with the first through-opening 14 and the second through-opening 18. A hollow structure (third hollow portion) is formed by the surface of the first substrate 200 and the inner surface of the recess 302 of the second substrate 300. Furthermore, as will be described later, a recess may also be provided on the surface of the first substrate 200 in an area opposite the recess 302.

[0129] The opening structure with the upper end opening 26t of the cylindrical portion as the end reaches the second recess 23 through the cylindrical portion opening 26 inside the cylindrical portion 25 and the box-shaped portion through-portion 21a. The second recess 23 is connected to the third hollow portion through the second through-opening 18. The third hollow portion is connected to the lower side of the diaphragm structure of the pressure sensor element 15 through the through-opening 14. In this way, the opening structure with the upper end opening 26t of the cylindrical portion as the end is connected to the cylindrical portion opening 26, the box-shaped portion through-portion 21a, the second hollow portion, the second through-opening 18, the third hollow portion and the through-opening 14, forming a second flow path that guides the second fluid to the lower side of the diaphragm structure of the pressure sensor element 15. Figure 19 The flow of the fluid is indicated by black arrows in (A). The second fluid is, for example, a fluid to be measured for pressure.

[0130] Hereinafter, the structures of the first substrate 200 and the second substrate 300 will be described. Figure 20 (A) is a plan view of the upper surface side of the first substrate 200 . Figure 20 (B) is a cross-sectional view of the first substrate 200, which is equivalent to Figure 20 Section at D-D' in (A).

[0131] The first substrate 200 is formed from epoxy glass resin or the like, and is formed as a base with a base 210, which serves as the main body of the plate-like structure. Metal layers such as Cu / Ni / Au and resist layers are laminated on the top and bottom sides of the base 210. On the top side of the base 210, the terminals 12, wiring 13, and ground wire 13a are formed by these metal layers. Furthermore, a Au plating layer is preferably formed on the surface of the ground wire 13a.

[0132] Furthermore, a resist layer 211 is formed on the upper surface of the base 210 so as to cover the metal layer. An opening 201 is formed in the resist layer 211 to expose the ground line 13a. The opening 201 has the same shape and size as the ground line opening 301 and is formed at a position corresponding to the ground line opening 301 provided in the second substrate 300.

[0133] Furthermore, the resist layer 211 removes the region corresponding to the recess 302 provided in the second substrate 300, thereby forming the recess 202. The recess 202 has the same shape and size as the recess 302. The recess 202 is not necessarily provided. When the recess 202 is provided, the recess 202 (first recess) and the recess 302 (second recess) are opposed to each other, forming a third hollow portion constituting the second flow path.

[0134] A frame-like portion 203 made of a metal layer (e.g., copper foil) is formed around the recess 202. The frame-like portion 203 is covered with an etching resist 211. Furthermore, an etching resist 212 is formed on the lower surface of the base 210 in the area excluding the terminals 12. Furthermore, an Au plating layer is preferably formed on the surface of the terminals 12.

[0135] Figure 21 (A) is a top view of the upper side of the second substrate 300, Figure 21 (B) is a plan view of the lower surface side of the second substrate 300 . Figure 22 is a cross-sectional view of the second substrate 300, which is equivalent to Figure 21 Section at E-E' in (A).

[0136] The second substrate 300 is formed of glass epoxy resin or the like, and has a base 310 serving as a main body of a plate-like structure as a base. The first through-opening 14 , the second through-opening 18 , and the ground opening 301 are formed in the second substrate 300 .

[0137] A resist layer 311 is formed on the lower side of the base 310 to cover a metal layer such as Cu. The recess 302 is formed by removing the region including the first through-opening 14 and the second through-opening 18 from the resist layer 311. A frame-like portion 303 made of a metal layer (e.g., copper foil) is formed around the recess 302. Furthermore, a frame-like portion 304 made of a metal layer (e.g., copper foil) is formed on the lower side of the base 310 along the outer periphery of the base 310.

[0138] The frame portion 303 and the frame portion 304 are covered with a resist layer 311. In addition, the region of the resist layer 311 corresponding to the ground opening portion 301 is removed.

[0139] Figure 23 2 is a diagram illustrating a method of bonding the first substrate 200 and the second substrate 300. Figure 23(A) shows the state before joining, Figure 23 (B) shows the state after joining. Figure 23 As shown in FIG. 2A , the second substrate 300 is bonded to the first substrate 200 via a bonding sheet 400 . In the bonding sheet 400 , openings are formed in regions corresponding to the ground opening 301 and the recess 302 .

[0140] The first substrate 200 and the second substrate 300 are bonded together using a bonding sheet 400 so that the opening 201 and the recess 202 of the first substrate 200 correspond to the ground opening 301 and the recess 302 of the second substrate 300 , thereby completing the substrate 10G.

[0141] Thus, according to this embodiment, the third hollow portion constituting the second flow path can be easily formed between the first substrate 200 and the second substrate 300. Figure 23 In the embodiment, the second flow path is formed by the recess 202 provided in the first substrate 200 and the recess 302 provided in the second substrate 300 , but the second flow path may be formed by either the recess 202 or the recess 302 .

[0142] Hereinafter, a modification of the pressure sensor device according to the third embodiment will be described.

[0143] <First Modification>

[0144] Figure 24 It is a diagram showing a substrate according to a first modified example of the third embodiment. Figure 24 (A) is a cross-sectional view. Figure 24 (B) is a top view of recess 202. In this variation, a protrusion 220 is formed within recess 202 of first substrate 200. Protrusion 220 is formed by patterning a metal layer and a resist layer formed on the upper surface of base 210. In this variation, two rectangular protrusions 220 are arranged within recess 202, but the shape and number of protrusions 220 are not limited to this.

[0145] In this way, by forming the protrusion 220 in the recess 202, even if the third hollow portion formed by the recess 302 and the recess 202 is flat, the base 210 and the base 310 can be prevented from contacting in the third hollow portion by applying a pressing force in the upward and downward directions (Z direction) on the first substrate 200 or the second substrate 300, thereby ensuring the second flow path.

[0146] Furthermore, the same protruding portion may be formed in the recess 302 of the second substrate 300. Alternatively, the protruding portion may be formed only in the recess 302 of the second substrate 300.

[0147] <Second Modification>

[0148] Figure 25 (A) is a top view of the upper surface side of a pressure sensor device according to a second modified example of the third embodiment. Figure 25 (B) is a side view, Figure 25 (C) is a top view of the lower side. Figure 26 is a cross-sectional view of a pressure sensor device according to a second modified example of the third embodiment, which corresponds to Figure 25 (B) Section at F-F'.

[0149] A cover 20H is mounted on the upper surface of the substrate 10G. The cover 20H includes a box-shaped portion 21, a first cylindrical portion 25A, and a second cylindrical portion 25B. The substrate 10G has the same structure as the substrate 10G of the third embodiment.

[0150] The first tubular portion 25A has a cylindrical outer shape and is a tubular structure with an upper opening 26A at its front end, which serves as a second pressure inlet. The second tubular portion 25B has a cylindrical outer shape and is a tubular structure with an upper opening 26B at its front end, which serves as a first pressure inlet. The first tubular portion 25A is provided on the box-shaped portion 21 above the second recess 23.

[0151] Figure 27 as well as Figure 28 3 is a cross-sectional view of the pressure sensor device according to this modification. Figure 27 Equivalent to Figure 26 The cross section at G-G' in . Figure 28 Equivalent to Figure 18 Similar to the third embodiment, in this embodiment, a first recess 22 and a second recess 23 are formed on the bonding surface of the box-shaped portion 21 to the substrate 10G.

[0152] like Figure 27 As shown, the cylindrical portion upper end opening 26A is connected to the lower surface of the diaphragm structure of the pressure sensor element 15 through the second hollow portion and the third hollow portion, similarly to the third embodiment, to form a second flow path.

[0153] On the other hand, in this modification, instead of the box-shaped portion opening portion 27 in the third embodiment, the second cylindrical portion 25B is provided on the box-shaped portion 21 at the upper portion of the first recess 22. Figure 28 As shown, the cylindrical portion upper end opening 26B communicates with the upper surface of the diaphragm structure of the pressure sensor element 15 in the first hollow portion, thereby constituting a first flow path.

[0154] In the pressure sensor device of this modified example, fluids other than the atmosphere are introduced from the first tubular portion 25A and the second tubular portion 25B to the pressure sensor element 15 , respectively, and the pressure difference between the two fluids can be obtained as information.

[0155] Furthermore, the substrate 10G can be modified in the same manner as in the third embodiment.

[0156] In addition, the first cylindrical portion 25A in this modification corresponds to the second cylindrical portion described in the claims, and the second cylindrical portion 25B corresponds to the first cylindrical portion described in the claims.

[0157] <Third Modification>

[0158] Figure 29 (A) is a top view of the upper surface side of a pressure sensor device in a third modified example of the third embodiment. Figure 29 (B) is a side view, Figure 29 (C) is a top view of the lower side. Figure 30 is a cross-sectional view of a pressure sensor device according to a third modified example of the third embodiment, which corresponds to Figure 29 (B) The cross section at I-I'.

[0159] A cover 20J is mounted on the substrate 10G. The cover 20J includes a box-shaped portion 21 and a second cylindrical portion 25B. In this modification, the cover 20J differs from the cover 20H of the second modification in that it does not include the first cylindrical portion 25A. In this modification, Figure 29 As shown in (A), an opening 26C serving as a pressure introduction port communicating with the second recess 23 is formed on the upper surface of the box-shaped portion 21. The substrate 10G has the same structure as the substrate 10G of the third embodiment.

[0160] Figure 31 as well as Figure 32 3 is a cross-sectional view of the pressure sensor device according to this modification. Figure 31 Equivalent to Figure 30 The cross section at J-J' in FIG. Figure 32 is equivalent to Figure 30 Similar to the second modification, in this modification, a first recess 22 and a second recess 23 are formed on the bonding surface of the box-shaped portion 21 to the substrate 10G.

[0161] like Figure 31 As shown, the opening 26C is connected to the bottom of the diaphragm structure of the pressure sensor element 15 through the second hollow part and the third hollow part, forming a second flow path. Figure 32 As shown, the cylindrical portion upper end opening 26B communicates with the upper surface of the diaphragm structure of the pressure sensor element 15 in the first hollow portion, thereby constituting a first flow path.

[0162] In the pressure sensor device of this modified example, fluids other than the atmosphere are introduced into the pressure sensor element 15 from the opening 26C and the second cylindrical portion 25B, respectively, and the pressure difference between the two fluids can be obtained as information.

[0163] <Fourth Modification>

[0164] Figure 33 (A) is a top view of the upper surface side of a pressure sensor device according to a fourth modified example of the third embodiment. Figure 33 (B) is a side view, Figure 33 (C) is a top view of the lower side. Figure 34 is a cross-sectional view of a pressure sensor device according to a fourth modified example of the third embodiment, which corresponds to Figure 33 (B) The cross section at L-L'.

[0165] A cover 20K is mounted on the substrate 10G. The cover 20K has a box-shaped portion 21 and a second cylindrical portion 25B. The cover 20K of this modification has a different position of the opening portion of the pressure inlet communicating with the second recess 23 than the cover 20J of the third modification. In this modification, Figure 33 As shown in (A), the opening 26C shown in the third modified example is not provided on the upper surface of the box-shaped portion 21 .

[0166] Figure 35 as well as Figure 36 3 is a cross-sectional view of the pressure sensor device according to this modification. Figure 35 Equivalent to Figure 34 The cross section at M-M' in . Figure 36 Equivalent to Figure 30 Similar to the third modification, in this modification, a first recess 22 and a second recess 23 are formed on the bonding surface of the box-shaped portion 21 to the substrate 10G.

[0167] like Figure 35 As shown, in this modification, an opening 29 is formed on the side of the box-shaped portion 21 as a pressure inlet communicating with the second recess 23. In addition, in this modification, the opening 29 is located between the box-shaped portion 21 and the second substrate 300 and is groove-shaped. The opening 29 is connected to the bottom of the diaphragm structure of the pressure sensor element 15 through the second hollow portion and the third hollow portion, forming a second flow path. In addition, as shown in FIG. Figure 36 As shown, the cylindrical portion upper end opening 26B communicates with the upper surface of the diaphragm structure of the pressure sensor element 15 in the first hollow portion, thereby constituting a first flow path.

[0168] In the pressure sensor device of this modified example, fluids other than the atmosphere are introduced into the pressure sensor element 15 from the opening 29 and the second cylindrical portion 25B, respectively, and the pressure difference between the two fluids can be obtained as information.

[0169] While preferred embodiments of the present invention have been described in detail above, the present invention is not limited to the aforementioned embodiments, and various modifications and substitutions may be made to the aforementioned embodiments without departing from the scope of the present invention. For example, the shape of the through-opening of the base is not limited to a circular shape, but may also be other shapes such as a rectangle.

[0170] This application claims priority based on basic application No. 2018-024647 filed with the Japan Patent Office on February 15, 2018, the entire contents of which are incorporated herein by reference.

[0171] Explanation of symbols

[0172] 10A, 10B, 10C, 10G—substrate, 11, 210, 310—base, 12—terminal, 13—wiring, 14—through-opening, 15—pressure sensor element, 16—control chip, 17—bonding wire, 18—second through-opening, 20A, 20B, 20C, 20D, 20E, 20G, 20H, 20J, 20K—cover, 21—box-shaped portion, 21a—box-shaped portion through-portion, 22—first recess, 23—second recess, 24—connecting portion, 25, 25E—cylindrical portion, 25A, 25C—first cylindrical portion, 25B, 25D—second cylindrical portion, 26—cylindrical portion opening , 26A, 26B, 26t—opening at the upper end of the cylindrical portion, 27—opening of the box-shaped portion, 28, 26C, 29—opening, 30—cover, 31—side wall, 31a, 31e—metal layer, 31b, 31d—anti-etching layer, 31c—bonding piece, 32—cover opening, 100—bottom plate, 100A—opening, 200—first substrate, 201—opening, 202—recess, 203—frame-shaped portion, 211, 212, 311—anti-etching layer, 220—protrusion, 300—second substrate, 301—ground wire opening, 302—recess, 303, 304—frame-shaped portion, 400—bonding piece.

Claims

1. A pressure sensor device, characterized in that: have: a first substrate having external connection terminals, the first substrate including a base body having a plate-like structure as a base, a metal layer and an anti-etching layer laminated on the upper and lower sides of the base body, the external connection terminals being formed by the metal layer, a resist layer being formed on the upper side of the base body so as to cover the metal layer, and a resist layer being formed on the lower side of the base body in areas other than the external connection terminals; a second substrate stacked on the first substrate and having a first through opening and a second through opening; a pressure sensor element mounted on the upper surface of the second substrate; and a cover mounted on the upper surface of the second substrate so as to cover the pressure sensor element and forming a first flow path for guiding the first fluid toward the upper surface of the pressure sensor element; A second flow path is formed between the first substrate and the second substrate, communicating from the second through-opening to the first through-opening and guiding a second fluid toward a lower surface of the pressure sensor element.

2. The pressure sensor device according to claim 1, wherein The cover includes a box-shaped portion forming a first hollow portion and a second hollow portion between the cover and the second substrate, and a first cylindrical portion formed on an upper surface of the second hollow portion. The pressure sensor element is disposed in the first hollow portion, and the second hollow portion is communicated with the second through-opening. The first flow path is connected to the first hollow portion from a first pressure introduction port provided at an upper corner of the first hollow portion and guides the first fluid toward the upper surface of the pressure sensor element. The second flow path communicates with the second hollow portion from a second pressure introduction port provided at the upper end of the first cylindrical portion and guides a second fluid toward a lower surface of the pressure sensor element.

3. The pressure sensor device according to claim 1, wherein The above cover has: A box-shaped portion forming a first hollow portion and a second hollow portion between the box-shaped portion and the second substrate; a first cylindrical portion formed on an upper surface of the first hollow portion; and A second cylindrical portion formed on the upper surface of the second hollow portion, The pressure sensor element is disposed in the first hollow portion, and the second hollow portion is communicated with the second through-opening. The first flow path communicates with the first hollow portion from a first pressure introduction port provided at the upper end of the first cylindrical portion and guides the first fluid toward the upper surface of the pressure sensor element. The second flow path communicates with the second hollow portion from a second pressure introduction port provided at the upper end of the second cylindrical portion and guides a second fluid toward a lower surface of the pressure sensor element.

4. The pressure sensor device according to claim 1, wherein The first substrate has a first recess on the upper side. The second substrate has a second recess on the bottom side. The first recess and the second recess form a third hollow portion that faces each other and constitutes the second flow path.

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