Methods, devices, computer equipment, and storage media for monitoring the obsolescence of secondary power supply boards

Abstract

This application provides a method, apparatus, computer equipment, and storage medium for monitoring the scrapping status of secondary power supply boards. The method includes acquiring the open / short status value of the fork board edge reporting; performing open / short status normalization processing on the fork board edge reporting open / short status value and a preset open / short status value to obtain an edge reporting open / short normalization quantity; and sending a board inspection alarm signal to the power supply board manufacturing system based on the edge reporting open / short normalization quantity to adjust the board inspection status of the secondary power supply board. By sampling the open / short status value of the fork board edge reporting, the scrapping status of the fork board to be inspected in the secondary power supply board can be detected. Furthermore, by comparing the open / short status value of the fork board edge reporting with the preset open / short status value, the difference between the scrapping status of the fork board to be inspected and the standard scrapping status can be determined. Finally, based on the degree of difference, a precise alarm can be issued for the current scrapping status of the fork board to be inspected, effectively improving the detection accuracy of the fork board.

Description

Technical Field

[0001] This invention relates to the field of circuit board technology, and in particular to a method, apparatus, computer equipment, and storage medium for monitoring the scrapping of secondary power supply boards. Background Technology

[0002] In the process of circuit board production, quality problems often lead to the scrapping of circuit boards. When a circuit board is scrapped in the process before solder masking, the circuits in the unit are usually cut off with a blade. During electrical testing, the board containing the scrapped unit is retrieved through electrical testing.

[0003] However, when designing secondary power supply boards, the circuit design often involves parallel connection of the same winding and the same pattern on different layers, i.e., the same pattern is superimposed on multiple layers. In the electrical testing process, it is impossible to identify single-layer failures through open and short circuits. This can easily lead to the failure of the board being mistakenly identified as a good board, which can easily lead to the rework of the board and seriously affect the testing efficiency. Summary of the Invention

[0004] The purpose of this invention is to overcome the shortcomings of the prior art and provide a method, device, computer equipment, and storage medium for monitoring the scrapping of secondary power boards that effectively improves the detection accuracy of fork plates.

[0005] The objective of this invention is achieved through the following technical solution:

[0006] A method for monitoring the obsolescence of a secondary power supply board, the method comprising:

[0007] Obtain the open / short status value of the fork edge of the secondary power supply board;

[0008] The edge reporting open / short state value of the fork plate is normalized to the preset open / short state value to obtain the edge reporting open / short normalized value.

[0009] The system sends a board inspection alarm signal to the power board manufacturing system based on the side-reported short-circuit normalization value to adjust the board inspection status of the secondary power board.

[0010] In one embodiment, obtaining the open / short state value of the fork plate edge of the secondary power board includes: obtaining the open / short value of the middle plate of the fork plate of the secondary power board; and obtaining the open / short value of the plate edge of the fork plate of the secondary power board.

[0011] In one embodiment, obtaining the edge short value of the secondary power supply board includes: obtaining the series conduction value of the fork plate of the secondary power supply board.

[0012] In one embodiment, the step of normalizing the edge reporting open / short state value with the preset open / short state value to obtain the edge reporting open / short normalized amount includes: performing a first open / short processing on the middle plate open / short value and the preset open / short state value.

[0013] In one embodiment, the first shorting process of the middle plate opening value and the preset shorting state value includes: detecting whether the middle plate opening value matches the preset shorting state value; when the middle plate opening value matches the preset shorting state value, performing a second shorting process on the middle plate opening value and the plate edge series conduction value.

[0014] In one embodiment, the second shorting process for the middle plate opening value and the plate edge series conduction value includes: detecting whether the middle plate opening value and the plate edge series conduction value are equal; when the middle plate opening value and the plate edge series conduction value are not equal, calculating the difference between the middle plate opening value and the plate edge series conduction value to obtain the normalized value of the edge opening.

[0015] In one embodiment, the step of sending a board inspection alarm signal to the power board manufacturing system based on the edge reporting short normalization value to adjust the board inspection state of the secondary power board includes: detecting whether the edge reporting short normalization value is greater than a preset normalization value; when the edge reporting short normalization value is greater than the preset normalization value, sending a board check confirmation signal to the power board manufacturing system to adjust the board inspection state of the secondary power board to a board check state.

[0016] A secondary power board scrapping monitoring device includes: a power board data collector and a power board open / short detection main board; the power board data collector is used to acquire the edge-reported open / short status value of the secondary power board; the input terminal of the power board open / short detection main board is connected to the output terminal of the power board data collector, and the power board open / short detection main board is used to perform open / short normalization processing on the edge-reported open / short status value and a preset open / short status value to obtain an edge-reported open / short normalized value; and sends a board inspection alarm signal to the power board manufacturing system according to the edge-reported open / short normalized value to adjust the board inspection status of the secondary power board.

[0017] A computer device includes a memory and a processor, the memory storing a computer program, and the processor executing the computer program performing the following steps:

[0018] Obtain the open / short status value of the fork edge of the secondary power supply board;

[0019] The edge reporting open / short state value of the fork plate is normalized to the preset open / short state value to obtain the edge reporting open / short normalized value.

[0020] The system sends a board inspection alarm signal to the power board manufacturing system based on the side-reported short-circuit normalization value to adjust the board inspection status of the secondary power board.

[0021] A computer-readable storage medium having a computer program stored thereon, the computer program performing the following steps when executed by a processor:

[0022] Obtain the open / short status value of the fork edge of the secondary power supply board;

[0023] The edge reporting open / short state value of the fork plate is normalized to the preset open / short state value to obtain the edge reporting open / short normalized value.

[0024] The system sends a board inspection alarm signal to the power board manufacturing system based on the side-reported short-circuit normalization value to adjust the board inspection status of the secondary power board.

[0025] Compared with the prior art, the present invention has at least the following advantages:

[0026] By sampling the open / short state value reported by the fork plate edge, the scrap status detection of the fork plate to be tested in the secondary power supply board can be carried out. Then, by comparing the open / short state value reported by the fork plate edge with the preset open / short state value, the difference between the scrap status of the fork plate to be tested and the standard scrap status can be determined. Finally, based on the degree of the above difference, the scrap status of the current fork plate to be tested can be accurately alarmed, so as to determine the accuracy of the scrap detection of the current fork plate to be tested, effectively improving the detection accuracy of the fork plate. Attached Figure Description

[0027] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 This is a flowchart of a secondary power board scrapping monitoring method in one embodiment;

[0029] Figure 2 This is an internal structural diagram of a computer device in one embodiment. Detailed Implementation

[0030] To facilitate understanding of the present invention, a more complete description will be given below with reference to the accompanying drawings. Preferred embodiments of the invention are shown in the drawings. However, the invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of the invention.

[0031] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly attached to the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0032] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0033] This invention relates to a method for monitoring the scrapping status of secondary power supply boards. In one embodiment, the method includes acquiring the open / short status value of the fork board edge reporting on the secondary power supply board; performing open / short status normalization processing on the fork board edge reporting open / short status value and a preset open / short status value to obtain an edge reporting open / short normalization quantity; and sending a board inspection alarm signal to the power supply board manufacturing system based on the edge reporting open / short normalization quantity to adjust the board inspection status of the secondary power supply board. By sampling the fork board edge reporting open / short status value, the scrapping status detection of the fork board to be tested in the secondary power supply board can be facilitated. Furthermore, by comparing the fork board edge reporting open / short status value with the preset open / short status value, the difference between the scrapping status of the fork board to be tested and the standard scrapping status can be determined. Finally, based on the degree of difference, a precise alarm can be issued for the current scrapping status of the fork board to be tested, thereby accurately determining the scrapping detection accuracy of the current fork board to be tested and effectively improving the detection accuracy of the fork board.

[0034] Please see Figure 1 This is a flowchart of a secondary power board scrap monitoring method according to an embodiment of the present invention. The secondary power board scrap monitoring method includes some or all of the following steps.

[0035] S100: Obtain the short-circuit status value of the fork edge of the secondary power supply board.

[0036] In this embodiment, the open / short state value reported by the fork plate is the scrap status value of the fork plate on the secondary power supply board. That is, the open / short state value reported by the fork plate is the scrap status quantity of the fork plate to be detected in the secondary power supply board. In other words, the open / short state value reported by the fork plate corresponds to the scrap status of the fork plate to be detected in the secondary power supply board. Moreover, the open / short state value reported by the fork plate is detected by detecting the open and short circuit status of the fork plate to be detected in the secondary power supply board. Specifically, the open and short circuit status corresponding to different detection positions of the fork plate to be detected in the secondary power supply board facilitates the determination of the scrap status of the fork plate by examining the circuit path in the fork plate, thereby facilitating the subsequent determination of the scrap detection alarm for the fork plate and improving the detection accuracy of the fork plate.

[0037] S200: The opening and closing state value of the fork plate is normalized with the preset opening and closing state value to obtain the opening and closing normalized value of the fork plate.

[0038] In this embodiment, the open / short state value reported by the fork plate is the scrap status value of the fork plate on the secondary power supply board. That is, the open / short state value reported by the fork plate is the scrap status quantity of the fork plate to be detected in the secondary power supply board. In other words, the open / short state value reported by the fork plate corresponds to the scrap status of the fork plate to be detected in the secondary power supply board. Moreover, the open / short state value reported by the fork plate is detected by detecting the open and short circuit status of the fork plate to be detected in the secondary power supply board. Specifically, the open and short circuit status corresponding to different detection positions of the fork plate to be detected in the secondary power supply board facilitates the determination of the scrap status of the fork plate by examining the circuit path in the fork plate, thereby facilitating the subsequent determination of the scrap detection alarm for the fork plate and improving the detection accuracy of the fork plate. The preset open / short state value is the scrap state value of the standard fork plate on the secondary power supply board. In other words, the preset open / short state value is the standard scrap state quantity of the fork plate to be tested on the secondary power supply board, and corresponds to the specified scrap state of the fork plate to be tested on the secondary power supply board. By normalizing the open / short state value reported by the fork plate with the preset open / short state value, it is easier to determine the difference in the scrap detection state of the fork plate to be tested on the secondary power supply board. This facilitates the determination of the degree of difference in the open / short state of the scrap fork plate to be tested on the secondary power supply board, thereby improving the accuracy of scrap detection of the fork plate to be tested on the secondary power supply board.

[0039] S300: Send a board inspection alarm signal to the power board manufacturing system according to the side report short normalization quantity, so as to adjust the board inspection status of the secondary power board.

[0040] In this embodiment, the normalized value of the side-reported open / short state is obtained based on the side-reported open / short state value of the fork plate and the preset open / short state value. The side-reported open / short state value of the fork plate is the scrap state value of the fork plate on the secondary power supply board. That is, the side-reported open / short state value of the fork plate is the scrap state quantity of the fork plate to be detected in the secondary power supply board. In other words, the side-reported open / short state value of the fork plate corresponds to the scrap state of the fork plate to be detected in the secondary power supply board. Moreover, the side-reported open / short state value of the fork plate is detected by detecting the open and short circuit states of the fork plate to be detected in the secondary power supply board. Specifically, the side-reported open / short state value of the fork plate corresponds to the open and short circuit states of different detection positions of the fork plate to be detected in the secondary power supply board. This facilitates the determination of the scrap status of the fork plate by the circuit path in the fork plate, thereby facilitating the subsequent determination of the scrap detection alarm for the fork plate and improving the detection accuracy of the fork plate. The preset open / short state value is the scrap state value of the standard fork plate on the secondary power supply board. In other words, the preset open / short state value is the standard scrap state quantity of the fork plate to be tested on the secondary power supply board, and corresponds to the specified scrap state of the fork plate to be tested on the secondary power supply board. By normalizing the open / short state value reported by the fork plate with the preset open / short state value, it is easier to determine the difference in the scrap detection state of the fork plate to be tested on the secondary power supply board. This facilitates the determination of the degree of difference in the open / short state of the scrap fork plate to be tested on the secondary power supply board, thereby improving the accuracy of scrap detection of the fork plate to be tested on the secondary power supply board. In this way, after determining the normalized value of the side-reported open and short circuit, the difference between the open and short circuit state of the fork board to be tested in the secondary power supply board and the standard open and short circuit state is determined. This facilitates the judgment of the scrap test status of the fork board to be tested in the secondary power supply board, thereby enabling timely alarms to be issued when errors occur in the electrical testing of the fork board, so as to avoid the situation of the fork board being mistakenly judged as a good board and reworked, effectively improving the accuracy of scrap test of the fork board.

[0041] In the above embodiments, sampling the open / short state value of the fork plate edge is used to detect the scrap status of the fork plate to be tested in the secondary power supply board. Then, by comparing the open / short state value of the fork plate edge with the preset open / short state value, the difference between the scrap status of the fork plate to be tested and the standard scrap status can be determined. Finally, based on the degree of the difference, it is convenient to accurately alarm the current scrap status of the fork plate to be tested, so as to determine the accuracy of the scrap detection of the current fork plate to be tested, effectively improving the detection accuracy of the fork plate.

[0042] In one embodiment, obtaining the open / short state value of the fork plate edge of the secondary power supply board includes: obtaining the middle board open / short value of the fork plate of the secondary power supply board; and obtaining the board edge open / short value of the fork plate of the secondary power supply board. In this embodiment, the open / short state value of the fork plate edge is the scrap state value of the fork plate on the secondary power supply board, that is, the open / short state value of the fork plate edge is the scrap state quantity of the fork plate to be detected in the secondary power supply board. In other words, the open / short state value of the fork plate edge corresponds to the scrap state of the fork plate to be detected in the secondary power supply board. Moreover, the open / short state value of the fork plate edge is detected by detecting the open and short circuit states of the fork plate to be detected in the secondary power supply board. Specifically, the open / short state value of the fork plate edge corresponds to the open and short circuit states of different detection positions of the fork plate to be detected in the secondary power supply board. This facilitates the determination of the scrap state of the fork plate by the circuit path in the fork plate, thereby facilitating the subsequent determination of the scrap detection alarm for the fork plate and improving the detection accuracy of the fork plate. The open / short circuit status value of the fork board includes the open / short circuit value of the middle board and the open / short circuit value of the board edge. The open / short circuit value of the middle board corresponds to the open / short circuit status of the first detection position of the fork board, and the open / short circuit value of the board edge corresponds to the open / short circuit status of the second detection position of the fork board. Specifically, the open / short circuit value of the middle board corresponds to the open / short circuit detection position of the fork board in the electrical testing stage, and the open / short circuit value of the board edge corresponds to the open / short circuit status value of a series detection line of each layer of the fork board. That is, a series detection line of multi-layer boards is set on the board edge of the fork board, that is, two copper plating holes are opened on each layer, and a series detection copper line is set separately between the two copper plating holes. Then, the series detection copper lines of each layer are connected through the copper plating holes on each layer to form the board edge series detection line corresponding to the board edge open / short circuit value.

[0043] Further, obtaining the open / short value of the secondary power board includes: obtaining the series continuity value of the fork board at the edge of the secondary power board. In this embodiment, the reported open / short state value of the fork board is the scrap state value of the fork board on the secondary power board, that is, the reported open / short state value of the fork board is the scrap state quantity of the fork board to be detected in the secondary power board, that is, the reported open / short state value of the fork board corresponds to the scrap state of the fork board to be detected in the secondary power board. Moreover, the reported open / short state value of the fork board is detected by detecting the open and short circuit states of the fork board to be detected in the secondary power board. Specifically, the reported open / short state value of the fork board corresponds to the open and short circuit states of different detection positions of the fork board to be detected in the secondary power board. This facilitates the determination of the scrap state of the fork board by the circuit path in the fork board, thereby facilitating the subsequent determination of the scrap detection alarm for the fork board and improving the detection accuracy of the fork board. The open / short circuit status value of the fork plate includes the open / short circuit value of the middle plate and the open / short circuit value of the edge plate. The open / short circuit value of the middle plate is related to the open / short circuit status of the first detection position of the fork plate, and the open / short circuit value of the edge plate is related to the open / short circuit status of the second detection position of the fork plate. Specifically, the open / short circuit value of the middle plate is the continuity detection status of the open / short circuit detection position of the middle plate, and the open / short circuit value of the edge plate is the continuity detection status of the open / short circuit detection position of the edge plate. The open / short circuit value of the edge plate is specifically a series continuity value of the edge plate, that is, the open / short circuit value of the edge plate is the continuity status of the fork plate in the series circuit of the edge plate, which is also the open / short circuit status of the fork plate in the series detection circuit of the edge plate. This facilitates secondary detection of open / short circuits of the fork plate, thereby improving the accuracy of scrap detection of the fork plate.

[0044] Furthermore, the step of performing a normalization process on the edge reporting open / short state value and the preset open / short state value to obtain the normalized edge reporting open / short amount includes: performing a first open / short process on the middle plate open / short value and the preset open / short state value. In this embodiment, the open / short circuit state value of the fork board edge includes the open / short circuit value of the middle board and the open / short circuit value of the board edge. The open / short circuit value of the middle board corresponds to the open / short circuit state of the first detection position of the fork board, and the open / short circuit value of the board edge corresponds to the open / short circuit state of the second detection position of the fork board. Specifically, the open / short circuit value of the middle board corresponds to the open / short circuit detection position of the middle part of the fork board, and the open / short circuit value of the board edge corresponds to the open / short circuit detection position of the edge of the fork board. The secondary power supply board is a multilayer board, that is, the fork board is a multilayer board. The open / short circuit value of the middle board corresponds to the open / short circuit detection position of the fork board in the electrical testing stage. The open / short circuit value of the board edge corresponds to the open / short circuit state value of a series detection line of each layer of the fork board. That is, a series detection line of multilayer boards is set on the board edge of the fork board, that is, two copper plating holes are opened on each layer board, and a series detection copper line is set separately between the two copper plating holes. Then, the series detection copper lines of each layer are connected through the copper plating holes on each layer to form the board edge series detection line corresponding to the open / short circuit value of the board edge. The preset open / short state value is the standard open / short value of the middle plate on the fork plate, that is, the preset open / short state value is the specified open / short value of the middle plate on the fork plate. In other words, the preset open / short state value corresponds to the standard open / short circuit of the fork plate. The first open / short processing of the middle plate open / short value and the preset open / short state value is the scrap detection of the first open / short detection position of the fork plate to determine the scrap detection result of the fork plate in the electrical testing stage, so as to facilitate timely warning of misjudgment of the fork plate in the electrical testing stage.

[0045] Furthermore, the first shorting process of the middle plate opening value and the preset shorting state value includes: detecting whether the middle plate opening value matches the preset shorting state value; when the middle plate opening value matches the preset shorting state value, performing a second shorting process on the middle plate opening value and the plate edge series conduction value. In this embodiment, the open / short circuit state value of the fork board edge includes the open / short circuit value of the middle board and the open / short circuit value of the board edge. The open / short circuit value of the middle board corresponds to the open / short circuit state of the first detection position of the fork board, and the open / short circuit value of the board edge corresponds to the open / short circuit state of the second detection position of the fork board. Specifically, the open / short circuit value of the middle board corresponds to the open / short circuit detection position of the middle part of the fork board, and the open / short circuit value of the board edge corresponds to the open / short circuit detection position of the edge of the fork board. The secondary power supply board is a multilayer board, that is, the fork board is a multilayer board. The open / short circuit value of the middle board corresponds to the open / short circuit detection position of the fork board in the electrical testing stage. The open / short circuit value of the board edge corresponds to the open / short circuit state value of a series detection line of each layer of the fork board. That is, a series detection line of multilayer boards is set on the board edge of the fork board, that is, two copper plating holes are opened on each layer board, and a series detection copper line is set separately between the two copper plating holes. Then, the series detection copper lines of each layer are connected through the copper plating holes on each layer to form the board edge series detection line corresponding to the open / short circuit value of the board edge. The preset open / short state value is the standard open / short value of the middle plate on the fork plate, that is, the preset open / short state value is the specified open / short value of the middle plate on the fork plate, and the preset open / short state value corresponds to the standard open / short circuit of the fork plate. The matching of the middle plate open / short value with the preset open / short state value indicates that the middle detection state of the fork plate is a standard state. Specifically, the middle open / short circuit detection result of the fork plate is a good board, that is, the fork plate is in a short-circuit conduction state in the original electrical testing stage. At this time, the fork plate is prone to rework testing. In order to reduce rework, the middle plate open / short value and the series conduction value of the board edge are subjected to the second open / short processing to perform series scrap testing on the fork plate, thereby improving the accuracy of scrap testing of the fork plate.

[0046] Furthermore, the second short-circuit processing of the middle plate open-short value and the plate edge series conduction value includes: detecting whether the middle plate open-short value and the plate edge series conduction value are equal; when the middle plate open-short value and the plate edge series conduction value are not equal, calculating the difference between the middle plate open-short value and the plate edge series conduction value to obtain the edge reporting open-short normalization amount. In this embodiment, the fork plate edge reporting open-short state value includes the middle plate open-short value and the plate edge open-short value, the open-short circuit state of the middle plate open-short value and the first detection position of the fork plate, and the open-short circuit state of the plate edge open-short value and the second detection position of the fork plate. Specifically, the middle plate open-short value is the path detection state of the middle open-short circuit detection position of the fork plate, and the plate edge open-short value is the path detection state of the edge open-short circuit detection position of the fork plate. The "board edge open / short value" specifically refers to the board edge series continuity value, which represents the continuity state of the fork board in the board edge series circuit, and also the open / short circuit state of the fork board in the board edge series detection circuit. The difference between the middle board open / short value and the board edge series continuity value indicates that the board edge open / short circuit detection result of the fork board differs from the middle open / short circuit detection result. This means that the board edge series continuity state of the fork board differs from the middle continuity state, indicating that the board edge series circuit of the fork board is broken, while the middle circuit is continuous. In this case, the fork board is determined to be a normal fork board and will not be mistakenly identified as a good board, thus avoiding unnecessary rework testing. This effectively improves the accuracy of fork board scrap detection.

[0047] In one embodiment, the step of sending a board inspection alarm signal to the power board manufacturing system based on the edge reporting short normalization value to adjust the board inspection state of the secondary power board includes: detecting whether the edge reporting short normalization value is greater than a preset normalization value; when the edge reporting short normalization value is greater than the preset normalization value, sending a board check confirmation signal to the power board manufacturing system to adjust the board inspection state of the secondary power board to a board check state. In this embodiment, the normalized value of the side-reported open / short state is obtained based on the side-reported open / short state value of the fork plate and the preset open / short state value. The side-reported open / short state value of the fork plate is the scrap state value of the fork plate on the secondary power supply board. That is, the side-reported open / short state value of the fork plate is the scrap state quantity of the fork plate to be detected in the secondary power supply board. In other words, the side-reported open / short state value of the fork plate corresponds to the scrap state of the fork plate to be detected in the secondary power supply board. Moreover, the side-reported open / short state value of the fork plate is detected by detecting the open and short circuit states of the fork plate to be detected in the secondary power supply board. Specifically, the side-reported open / short state value of the fork plate corresponds to the open and short circuit states of different detection positions of the fork plate to be detected in the secondary power supply board. This facilitates the determination of the scrap status of the fork plate by the circuit path in the fork plate, thereby facilitating the subsequent determination of the scrap detection alarm for the fork plate and improving the detection accuracy of the fork plate. The preset open / short state value is the scrap state value of the standard fork plate on the secondary power supply board. In other words, the preset open / short state value is the standard scrap state quantity of the fork plate to be tested on the secondary power supply board, and corresponds to the specified scrap state of the fork plate to be tested on the secondary power supply board. By normalizing the open / short state value reported by the fork plate with the preset open / short state value, it is easier to determine the difference in the scrap detection state of the fork plate to be tested on the secondary power supply board. This facilitates the determination of the degree of difference in the open / short state of the scrap fork plate to be tested on the secondary power supply board, thereby improving the accuracy of scrap detection of the fork plate to be tested on the secondary power supply board. The preset normalization value is the degree of difference in the standard scrap open / short state of the fork boards to be tested in the secondary power supply board. If the side-reported open / short normalization value is greater than the preset normalization value, it indicates that the degree of scrap difference of the fork boards to be tested in the secondary power supply board is different. That is, the fork boards to be tested in the secondary power supply board are considered normal fork boards, rather than good boards, so as to determine the scrap status of the fork boards to be tested in the secondary power supply board and avoid misjudging scrapped fork boards as good boards.

[0048] In the actual electrical testing process of the fork board under test in the secondary power supply board, the layers are connected in series by copper vias and copper wires on each unit board of the secondary power supply board. With at least two copper vias energized, the continuity of the circuitry in the fork board can be determined, thus facilitating the identification of any misjudgments. The added copper vias only expose the copper foil circuitry on the fork board and do not damage the board structure. However, before electrical testing of each of the secondary power supply boards, surface mount packaging is required, which involves the use of solder paste. Solder paste can easily enter the fork slots and copper vias on the fork board, potentially leading to inaccurate acquisition of the conductivity state values ​​of the copper vias, and consequently, the rejection of the fork board due to misjudgment.

[0049] To facilitate determining the position of the fork plate in the secondary power supply board, the following steps are included before obtaining the open / short state value of the fork plate edge of the secondary power supply board:

[0050] Obtain the copper etching image of the board edge of the secondary power supply board;

[0051] The copper defect value at the edge of the board is obtained based on the copper corrosion image at the edge of the board.

[0052] Detect whether the copper defect value at the board edge matches the preset copper defect value;

[0053] When the copper deficiency value at the board edge matches the preset copper deficiency value, a board edge positioning acquisition signal is sent to the power board manufacturing system.

[0054] In this embodiment, the edge copper etching image is a side image of the secondary power supply board, that is, the edge copper etching image is an edge image of each unit board in the secondary power supply board, and also a real-time image of the side copper layer of each unit board in the secondary power supply board. The edge copper etching image is used to display the etching status of the edge copper layer of the unit boards in the secondary power supply board. By forming an image of the side etching degree of each unit board in the secondary power supply board, it is easy to determine the side etching status of each unit board in the secondary power supply board, thereby facilitating the determination of the amount of missing edge copper layer of each unit board in the secondary power supply board, i.e., the edge copper deficiency value. The preset copper deficiency value is the standard etching amount at the edge of the unit board of the secondary power supply board. Specifically, the preset copper deficiency value is the standard missing amount of copper layer at the edge of the unit board of the secondary power supply board, or the reduction amount of copper foil at the reference edge of the unit board of the secondary power supply board. Specifically, the preset copper deficiency value corresponds to the copper deficiency amount when there is no etching at the edge of the copper layer. If the preset copper deficiency value matches the preset copper deficiency value, it indicates that the etching amount at the edge of the current unit board of the secondary power supply board is lower than the standard etching amount, meaning that the etching of the copper layer at the edge of the current unit board of the secondary power supply board is less, and therefore, the copper layer at the edge of the current unit board of the secondary power supply board is complete. At this time, the sampled unit board is the fork board in the secondary power supply board. It sends an edge positioning acquisition signal to the power supply board manufacturing system to collect the open / closed state value of the fork board edge at each edge of the secondary power supply board, facilitating the determination of the specific position of the fork board in the secondary power supply board. In the actual production process, the fork board needs to undergo multiple functional tests. If a circuit problem occurs, the edge of its core board will not be etched for the final ground wire or gold finger interface. That is, the etching process completion of the fork board and the good board is different.

[0055] Further, the step of detecting whether the copper defect value at the board edge matches a preset copper defect value includes the following steps:

[0056] When the copper defect value at the board edge does not match the preset copper defect value, the average gray value of the copper defect at the board edge is obtained based on the copper corrosion image at the board edge.

[0057] Detect whether the uniform gray value of the copper defect at the board edge is less than the preset uniform gray value;

[0058] When the uniform gray value of the copper defect at the board edge is less than the preset uniform gray value, a board edge acquisition early warning signal is sent to the power board manufacturing system.

[0059] In this embodiment, the copper defect value at the board edge does not match the preset copper defect value. In this case, the copper layer at the board edge of the secondary power supply board may be missing. For example, excessive solder paste may obscure the board edge, easily leading to the board being mistakenly identified as a good board, i.e., a faulty board may be mistaken for a good board. The copper etching image at the board edge not only shows the defects caused by copper layer etching but also the grayscale reflected back from the copper layer, i.e., the average grayscale value of the copper defect at the board edge. The average grayscale value of the copper defect at the board edge is used to reflect the grayscale situation caused by defects in the unit board after the etching process, and can be distinguished from the grayscale corresponding to the solder paste. The preset average gray value is the average gray value of the copper layer at the edge of each unit board in the secondary power supply board. That is, the preset average gray value is the average gray value exhibited by each unit board in the secondary power supply board. If the average gray value of the copper gap at the edge is less than the preset average gray value, it indicates that the gray value at the edge of the unit board currently collected by the secondary power supply board is less than the standard average gray value. This indicates that the gray value at the edge of the unit board currently collected by the secondary power supply board is too small, which also indicates that there is solder paste obstruction at the edge of the secondary power supply board. At this time, a board edge collection early warning signal is sent to the power board manufacturing system to collect alarms on the side of the secondary power supply board, avoid mistaking the forked board as a good board, thereby avoiding misjudgment of the position of each board in the secondary power supply board, and thus avoiding damage caused by marking good boards with crosses.

[0060] All the aforementioned preset variables are set in the database for easy retrieval. Different preset variables are placed in different storage units, i.e., in different storage stacks. Furthermore, the short-state value of the fork edge and the copper corrosion image of the board edge can be acquired by the corresponding detector, for example, by the board acquisition device.

[0061] In one embodiment, this application also provides a secondary power board scrapping monitoring device, which is implemented using the secondary power board scrapping monitoring method described in any of the above embodiments. In one embodiment, the secondary power board scrapping monitoring device has functional modules for implementing each step of the secondary power board scrapping monitoring method. The secondary power board scrapping monitoring device includes a power board acquisition unit and a power board open / short detection main board; the power board acquisition unit is used to acquire the edge-reported open / short status value of the secondary power board; the input terminal of the power board open / short detection main board is connected to the output terminal of the power board acquisition unit, and the power board open / short detection main board is used to perform open / short normalization processing on the edge-reported open / short status value and a preset open / short status value to obtain an edge-reported open / short normalized value; and send a board inspection alarm signal to the power board manufacturing system according to the edge-reported open / short normalized value to adjust the board inspection status of the secondary power board.

[0062] In this embodiment, the circuit board data acquisition unit samples the reported open / short state value of the fork plate to facilitate the detection of the scrap status of the fork plate to be tested in the secondary power supply board. Then, the circuit board open / short detection main board compares the reported open / short state value of the fork plate with the preset open / short state value to determine the difference between the scrap status of the fork plate to be tested and the standard scrap status. Finally, based on the degree of the difference, the circuit board open / short detection main board can accurately alarm the current scrap status of the fork plate to be tested, so as to determine the accuracy of the scrap detection of the current fork plate to be tested, effectively improving the detection accuracy of the fork plate.

[0063] Each module in the aforementioned secondary power board scrapping monitoring device can be implemented entirely or partially through software, hardware, or a combination thereof. These modules can be embedded in the processor of a computer device in hardware form or independent of it, or stored in the memory of a computer device in software form, so that the processor can call and execute the corresponding operations of each module.

[0064] In one embodiment, a computer device is provided, which may be a server, and its internal structure diagram may be as follows: Figure 2 As shown, the computer device includes a processor, memory, and network interface connected via a system bus. The processor provides computing and control capabilities. The memory includes non-volatile storage media and internal memory. The non-volatile storage media stores the operating system, computer programs, and a database. The internal memory provides an environment for the operation of the operating system and computer programs stored in the non-volatile storage media. The database stores data such as short-circuit reporting status values, short-circuit reporting normalization values, and board inspection alarm signals. The network interface communicates with external terminals via a network connection. When executed by the processor, the computer program implements a method for monitoring the scrapping of secondary power supply boards.

[0065] Those skilled in the art will understand that Figure 2 The structure shown is merely a block diagram of a portion of the structure related to the present application and does not constitute a limitation on the computer device to which the present application is applied. Specific computer devices may include more or fewer components than those shown in the figure, or combine certain components, or have different component arrangements.

[0066] In one embodiment, this application also provides a computer device including a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to implement the steps in the above-described method embodiments.

[0067] In one embodiment, this application also provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the steps in the above-described method embodiments.

[0068] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a non-volatile computer-readable storage medium, and when executed, it can include the processes of the embodiments of the methods described above. Any references to memory, storage, databases, or other media used in the embodiments provided in this application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, or optical storage, etc. Volatile memory can include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM), etc.

[0069] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A method for monitoring the scrapping of secondary power supply boards, characterized in that, include: Obtain the open / short status value of the fork edge of the secondary power supply board; The edge reporting open / short state value of the fork plate is normalized to the preset open / short state value to obtain the edge reporting open / short normalized value. The board inspection alarm signal is sent to the power board manufacturing system according to the side report short normalization quantity, so as to adjust the board inspection status of the secondary power board; The process of obtaining the open / short state value of the fork edge of the secondary power supply board includes the following steps: Obtain the copper etching image of the board edge of the secondary power supply board; The copper defect value at the edge of the board is obtained based on the copper corrosion image at the edge of the board. Detect whether the copper defect value at the board edge matches the preset copper defect value; When the copper deficiency value at the board edge matches the preset copper deficiency value, a board edge positioning acquisition signal is sent to the power board manufacturing system.

2. The secondary power board scrapping monitoring method according to claim 1, characterized in that, The process of obtaining the open / short state value of the fork edge of the secondary power supply board includes: Obtain the middle plate opening value of the fork plate of the secondary power supply board; Obtain the shortest opening value of the fork plate of the secondary power supply board.

3. The secondary power supply board scrapping monitoring method according to claim 2, characterized in that, The step of obtaining the edge opening value of the secondary power supply board includes: Obtain the series continuity value of the fork plate of the secondary power supply board.

4. The secondary power supply board scrapping monitoring method according to claim 3, characterized in that, The step of performing edge report open-short state value and preset open-short state value open-short normalization processing to obtain edge report open-short normalization amount includes: The middle plate opening value and the preset opening state value are subjected to a first opening process.

5. The secondary power board scrapping monitoring method according to claim 4, characterized in that, The first shorting process of the middle plate opening value and the preset shorting state value includes: Detect whether the opening and closing value of the middle plate matches the preset opening and closing state value; When the middle plate opening value matches the preset opening state value, a second opening process is performed on the middle plate opening value and the plate edge series conduction value.

6. The secondary power supply board scrapping monitoring method according to claim 5, characterized in that, The second shorting process for the shorting value of the middle plate and the series conduction value of the plate edge includes: Detect whether the shorting value of the middle plate is equal to the series conduction value of the plate edge; When the opening value of the middle plate is not equal to the series conduction value of the plate edge, the difference between the opening value of the middle plate and the series conduction value of the plate edge is calculated to obtain the normalized value of the opening value of the edge.

7. The secondary power board scrapping monitoring method according to claim 1, characterized in that, The step of sending a board inspection alarm signal to the power board manufacturing system based on the edge reporting short normalization value to adjust the board inspection status of the secondary power board includes: Detect whether the normalized value of the edge report opening is greater than the preset normalized value; When the normalization value of the edge reporting is greater than the preset normalization value, a board check signal is sent to the power board manufacturing system to adjust the board inspection status of the secondary power board to the board check state.

8. A secondary power supply board scrapping monitoring device, characterized in that, include: The circuit board acquisition device is used to acquire the copper etching image of the edge of the secondary power board and to acquire the edge shorting status value of the secondary power board. A short circuit detection motherboard is provided, with its input connected to the output of the board acquisition unit. The motherboard is used to normalize the reported short circuit status value with a preset short circuit status value to obtain a normalized short circuit value. Based on this normalized value, it sends a board inspection alarm signal to the power board manufacturing system to adjust the board inspection status of the secondary power board. It also obtains the copper defect value from the board edge copper etching image, detects whether the copper defect value matches a preset copper defect value, and sends a board edge positioning acquisition signal to the power board manufacturing system when the copper defect value matches the preset copper defect value.

9. A computer device comprising a memory and a processor, wherein the memory stores a computer program, characterized in that, When the processor executes the computer program, it implements the steps of the method according to any one of claims 1 to 7.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by a processor, it implements the steps of the method according to any one of claims 1 to 7.

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