Computing device and memory tester

Abstract

The embodiment of the present application provides a kind of computing device and memory testing machine, wherein the computing device includes: mainboard, with installation board surface;Processor module is arranged in the installation board surface;Processing fan is suspendedly arranged in the installation board surface, and the processing fan is located in the side of the processor module;Air baffle is suspendedly arranged in the installation board surface, and the air baffle is communicated with the processing fan and the processor module.The embodiment of the present application provides a kind of memory testing machine, including: mainboard, with installation board surface;Processor module is arranged in the installation board surface;Processing fan is suspendedly arranged in the installation board surface, and the processing fan is located in the side of the processor module;Air baffle is suspendedly arranged in the installation board surface, and the air baffle is communicated with the processing fan and the processor module.The computing device and memory testing machine provided by the present application have the advantages of small size and good heat dissipation effect.

Description

Technical Field

[0001] This application relates to the field of computing device technology, and in particular to a computing device and a memory testing machine. Background Technology

[0002] In a broad sense, a server refers to a computer system on a network that can provide certain services to other machines. In a narrow sense, a server specifically refers to certain high-performance computers that can provide services to the outside world through a network.

[0003] In related technologies, a server may include a chassis, the interior of which houses a processing fan module, a control module, and a storage module. The main control module may include a motherboard and various electrical components mounted on the motherboard, such as the CPU (central processing unit). The processing fan module directs airflow toward the CPU or a heatsink attached to the CPU to reduce its temperature.

[0004] However, with the rapid development of technology, the number of electrical components on the motherboard has increased, the amount of information that the CPU needs to process has increased, the heat generated by the CPU has increased, and the number and size of the processing fans in the processing fan module have increased, which has severely restricted the development of miniaturization of the chassis size. Summary of the Invention

[0005] This application provides a computing device and a memory testing machine to address the problem that the miniaturization of computer chassis is severely restricted.

[0006] To achieve the above objectives, this application provides the following technical solution:

[0007] One aspect of this application provides a computing device, including: a motherboard having a mounting surface; a processor module disposed on the mounting surface; a processing fan suspended on the mounting surface and located to the side of the processor module; and an air guide shroud suspended on the mounting surface, the air guide shroud connecting the processing fan and the processor module.

[0008] The computing device provided in this application reduces the size of the computing device by setting a processor module on the mounting plate of the motherboard, setting a processing fan on one side of the processor module, and suspending the processing fan on the mounting plate. The processing fan is connected to the processor module by a duct to reduce air loss between the processing fan and the processor module, thereby facilitating air cooling of the processor module.

[0009] In one possible implementation, the top of the processing fan is higher than the top of the processor module.

[0010] The above method allows for centralized heat dissipation from the top of the processor module, thereby improving heat dissipation efficiency.

[0011] In one possible implementation, the air guide shroud includes a first section, a second section, and a third section connected in sequence; the first section surrounds the outside of the processing fan; the inner top wall of the second section is inclined toward the motherboard near the end of the third section; and the third section surrounds the outside of the processor module.

[0012] In this way, the air at the top of the first section is guided toward the top of the processor module through the second section of the air guide shroud to facilitate heat dissipation.

[0013] In one possible implementation, the top end of the second segment is provided with an air outlet communicating with the inner cavity of the second segment; and / or, the top end of the third segment is provided with an air outlet communicating with the inner cavity of the third segment.

[0014] By providing an vent at the top of the second section, heat can be dissipated to other devices when the processor module's cooling requirements are not high. Furthermore, positioning the vent at the angle of the second section facilitates the inflow and outflow of air within its interior.

[0015] By setting an vent at the top of the third section, heat can be dissipated when the computing device is turned off or when there is a power outage.

[0016] In addition, the air vents in the second and third sections can both have a vibration damping effect to reduce the transmission of vibration from the air guide shroud to the processor module.

[0017] In one possible implementation, the air guide shroud has an opening facing the mounting plate surface; the computing device further includes a support plate that supports the bottom of the processing fan and, together with the air guide shroud, encloses a space for accommodating the processing fan.

[0018] The above method facilitates the installation and removal of the fan.

[0019] In one possible implementation, the processing fan is mounted to the support plate; the air guide shroud has a window plate and a connecting plate, the window plate of the air guide shroud is located on the side of the processing fan away from the processor module and has a through hole for air to pass through, the connecting plate of the air guide shroud is connected to the bottom end of the window plate of the air guide shroud and bent relative to the window plate of the air guide shroud, and is connected to the support plate.

[0020] In this manner, both the processing fan and the air guide shroud are connected to the support plate, forming an integrated module that facilitates mass production and assembly, and also improves vibration resistance. Furthermore, the vibration generated by the processing fan is transmitted to the support plate, and a portion of the vibration from the support plate is transmitted to the connecting plate of the air guide shroud. The vibration from the connecting plate of the air guide shroud is then transmitted to the processor module via the window plate and the top plate of the air guide shroud. Because the window plate of the air guide shroud has through holes, the vibration transmitted to the processor module is weakened, thereby reducing the impact of the processing fan on the processor module.

[0021] In one possible implementation, at least a portion of the support plate extends beyond the end face of the processing fan near the processor module and covers at least a portion of the opening of the air guide shroud.

[0022] The above method helps to guide the air between the processing fan and the processor module, reducing airflow loss between them.

[0023] In one possible implementation, the support plate has a gap between itself and the processor module at one end near the processor module.

[0024] The above method is used to prevent the vibration of the support plate from being directly transmitted to the processor module.

[0025] In one possible implementation, the air guide shroud also has a side wall that is connected to the side end of the window panel and extends toward the processor module, with at least a portion of the side wall forming a predetermined gap with the support plate.

[0026] The above method is used to further reduce the transmission of vibration between the support plate and the side wall of the air guide shroud.

[0027] In one possible implementation, there is a gap between the support plate and the mounting plate surface; the computing device further includes a column and a chassis with an inner cavity, wherein the motherboard, the processor module, the processing fan, the air guide, the support plate and the column are all disposed in the inner cavity of the chassis, and the column is connected between the support plate and the top plate and / or the bottom wall of the chassis.

[0028] The above method facilitates the suspension of the support plate.

[0029] In one possible implementation, a connection component is also included, which includes an electrical cable, a first connector, and a second connector. The electrical cable electrically connects the processing fan to the first connector, and the second connector is disposed on the mounting plate and electrically connected to the first connector.

[0030] The above method facilitates communication between the fan and the motherboard.

[0031] Another aspect of this application provides a memory testing machine, including: a motherboard having a mounting surface; a processor module disposed on the mounting surface; a processing fan suspended on the mounting surface and located to the side of the processor module; and an air guide shroud suspended on the mounting surface and connecting the processing fan and the processor module.

[0032] The memory testing machine provided in this application embodiment reduces the size of the device by setting a processor module on the mounting plate of the motherboard, setting a processing fan on one side of the processor module, and suspending the processing fan on the mounting plate. The processing fan and the processor module are connected by a duct to reduce air loss between the processing fan and the processor module, thereby facilitating air cooling of the processor module.

[0033] In addition to the technical problems solved by the embodiments of this application, the technical features constituting the technical solutions, and the beneficial effects brought about by the technical features of these technical solutions as described above, other technical problems that can be solved by the embodiments of this application, other technical features included in the technical solutions, and the beneficial effects brought about by these technical features will be further explained in detail in the specific implementation. Attached Figure Description

[0034] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0035] Figure 1 A top view of a computing device provided in an embodiment of this application;

[0036] Figure 2 This is a partial schematic diagram of a computing device provided in an embodiment of this application;

[0037] Figure 3 A cross-sectional view of a computing device provided in an embodiment of this application;

[0038] Figure 4 A cross-sectional view of another partial computing device provided in an embodiment of this application;

[0039] Figure 5 This is a schematic diagram illustrating the installation of another fan provided in an embodiment of this application;

[0040] Figure 6 A schematic diagram illustrating the installation of another fan provided in an embodiment of this application;

[0041] Figure 7A partial schematic diagram of another computing device provided in an embodiment of this application;

[0042] Figure 8 for Figure 7 A partial cross-sectional view of the computing device is shown;

[0043] Figure 9 This is a top view of the memory testing machine provided in an embodiment of this application.

[0044] Explanation of reference numerals in the attached figures:

[0045] 100-Chassis;

[0046] 120 - Air Inlet;

[0047] 130 - Air outlet;

[0048] 140-bottom wall;

[0049] 150-Top wall;

[0050] 160-sidewall;

[0051] 200-Motherboard;

[0052] 210 - Mounting panel;

[0053] 300-Processor Module;

[0054] 310-processor;

[0055] 320-Radiator;

[0056] 400 - Handling the fan;

[0057] 500-total fan;

[0058] 600-Air Guide Cover;

[0059] 610 - First paragraph;

[0060] 611-Window Panel;

[0061] 612-Connecting plate;

[0062] 613 - Top Slab;

[0063] 614 - Side wall;

[0064] 620 - Second paragraph;

[0065] 630 - Third paragraph;

[0066] 640 - Vent;

[0067] 710 - Support plate;

[0068] 720 - Column;

[0069] 730 - Liner;

[0070] 800 - Connection Components;

[0071] 810-Electric flat cable;

[0072] 820 - First Connector;

[0073] 830 - Second connector.

[0074] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0075] As described in the background section, the miniaturization of computing devices in related technologies is severely limited. The inventors of this application have discovered that this problem arises because the fan module is located on one side of the motherboard. The fan module includes a fan and an adapter board, and the fan communicates with the motherboard through the adapter board. As the number of electrical components requiring air cooling increases, the number of fans also gradually increases, leading to an increase in the size of the fan module and consequently, the size of the chassis.

[0076] In view of this, the computing device provided in this application embodiment suspends the fan above the motherboard, so as to utilize the upper area of ​​the motherboard to install the fan and reduce the size of the chassis.

[0077] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are some embodiments of this application, but not all embodiments.

[0078] Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of this application. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0079] Figure 1 A top view of a computing device provided in an embodiment of this application, wherein, Figure 1 The arrows in the image indicate the direction of airflow. (Reference) Figure 1 The computing device provided in this application embodiment may include a chassis 100 with an internal cavity. The chassis 100 may have an annular sidewall 160, and the sidewall 160 of the chassis 100 may be provided with an air inlet 120 and an air outlet 130.

[0080] Among them, the air inlet 120 and the air outlet 130 can be as follows Figure 1 The air inlet 120 and air outlet 130 are respectively provided on two opposite side walls 160 of the chassis 100. Furthermore, the chassis 100 has a rectangular cross-section, and the longer side of the cross-section can be taken as the length direction of the chassis 100. The shorter side of the cross-section can be taken as the width direction of the chassis 100. To facilitate the layout of electrical components and air cooling within the chassis, the air inlet 120 and air outlet 130 can be located at both ends of the chassis 100 along its length. For example, Figure 1 In this configuration, the air inlet 120 and the air outlet 130 can be respectively located on two opposite side walls of the chassis 100 along its length. Furthermore, the computing device can be a server or other device capable of performing calculations, processing, and other operations.

[0081] Figure 2 This is a partial schematic diagram of a computing device provided in an embodiment of this application. Figure 3 This application provides a cross-sectional view of a computing device. Figure 4 A cross-sectional view of another partial computing device provided in an embodiment of this application. (See reference...) Figures 2-4 The motherboard 200 can be housed inside the chassis 100, and the motherboard 200 can be configured as follows: Figure 3 and Figure 4 The motherboard 200 is mounted on the bottom wall 140 of the chassis 100, or it can be suspended from the bottom wall 140 of the chassis 100. That is, there is a certain distance between the side of the motherboard 200 facing the bottom wall 140 of the chassis 100 and the bottom wall 140 of the chassis 100. Furthermore, the motherboard 200 may have a pair of opposing and parallel panels; the panel on which the electrical components are mounted can be referred to as the mounting panel 210. One of the pair of panels of the motherboard 200 may be the mounting panel 210, or both panels of the motherboard 200 may be mounting panels 210. Figures 2-4 For example, the motherboard 200 has a mounting surface 210, and the mounting surface 210 is far away from the bottom wall 140 of the chassis 100.

[0082] In addition, a processor module 300 may be mounted on the mounting plate 210 of the motherboard 200. A processing fan 400 may be provided on the side of the processor module 300, and the processing fan 400 may be suspended on the mounting plate 210 of the motherboard 200.

[0083] In cases where processor 310 is a high-performance processor such as a GPU, it may not require heatsink 320 for cooling. In this case, processor module 300 may consist only of processor 310. When processor 310 is a CPU, it may require heatsink 320 for cooling. In this case, processor module 300 may... Figure 3 and Figure 4The diagram shows a processor 310 and a heatsink 320. The following description uses a processor module 300 that includes both a processor 310 and a heatsink 320 as an example. If the processor module 300 only includes the processor 310 itself, the following simple derivation can be made, and will not be repeated here.

[0084] refer to Figure 3 and Figure 4 The processor 310 can be mounted on the mounting plate 210 of the motherboard 200. A heatsink 320 can be provided at the end of the processor 310 furthest from the motherboard 200 (top), and a processing fan 400 can be provided on the side of the heatsink 320. The heatsink 320 can directly contact the processor 310 for heat transfer, or a thermally conductive layer made of thermally conductive material can be laid between the heatsink 320 and the processor 310, allowing heat from the processor 310 to be quickly conducted to the heatsink 320 through the thermally conductive layer. The heatsink 320 can have multiple fins, which can be spaced apart perpendicular to the airflow direction, and each fin can extend in the airflow direction. Airflow over adjacent fins carries away heat from the fins.

[0085] Additionally, refer to Figures 1-3 The processing fan 400 can guide air into the inner cavity of the chassis 100 through the air inlet 120 and blow it onto the heat sink 320 to cool the heat sink 320, thereby cooling the processor 310, and then flowing out from the air outlet 130 of the chassis 100.

[0086] To simplify the airflow path, refer to Figure 1 and Figure 2 The air inlet 120, the processing fan 400, the heat sink 320, and the air outlet 130 can be spaced apart along the length of the chassis 100. The airflow direction can be as follows: Figure 1 and Figure 2 As shown: air inlet 120, processing fan 400, heat sink 320, air outlet 130. Of course, the heat sink 320 can also be located upstream of the processing fan 400, that is, the airflow direction can also be: air inlet 120, heat sink 320, processing fan 400, heat sink 320, air outlet 130.

[0087] Additionally, refer to Figure 2 and Figure 3 To prevent vibrations generated by the processing fan 400 from affecting the heatsink 320 and processor 310, a gap may be provided between the processing fan 400 and the sides of the heatsink 320. In this case, to reduce airflow loss, the processing fan 400 and the heatsink 320 can be connected by an air guide shroud 600. Thus, the air between the processing fan 400 and the heatsink 320 flows within the inner cavity of the air guide shroud 600.

[0088] It should be noted that the processor 310 is connected to the bottom of the heatsink 320, and the heat from the bottom of the heatsink 320 will be transferred away from the processor 310. Conversely, the heat from the top of the heatsink 320 will affect the bottom of the heatsink 320, and thus affect the processor 310. If the heat is concentrated on the top of the heatsink 320, the cooling efficiency of the processor fan 400 on the heatsink 320 can be improved.

[0089] In view of this, the top of the processing fan 400 provided in this application embodiment can be higher than the top of the heat sink 320, so that more air flows over the top of the heat sink 320, so as to reduce the temperature of the top of the heat sink 320, thereby reducing the temperature of the bottom of the heat sink 320, and thus reducing the temperature of the processor 310.

[0090] Furthermore, in order to guide the airflow from the top of the processing fan 400 toward the top of the heatsink 320, optionally, at least a portion of the top of the air shroud 600 may be tilted relative to the motherboard 200. Specifically, refer to Figure 2 and Figure 3 The air guide shroud 600 may include a first section 610, a second section 620, and a third section 630 connected in sequence, with the inner cavities of the first section 610, the second section 620, and the third section 630 sequentially connected. The first section 610 may surround the outer side of the processing fan 400; the inner top wall of the second section 620 near the third section 630 may be inclined towards the motherboard 200. The third section 630 may surround the outer side of the heat sink 320. Thus, when air at the top of the inner cavity of the first section 610 enters the inner cavity of the second section 620, it will be guided by the inner top wall of the second section 620 and move towards the motherboard 200. However, due to the viscosity of air, a large amount of air will flow tightly against the inner top wall of the second section 620, which results in a larger amount of air flowing towards the top of the heat sink 320, thereby facilitating heat dissipation at the top of the heat sink 320.

[0091] Optionally, the top end of the second segment 620 may be provided with an exhaust port 640 communicating with the inner cavity of the second segment 620. Specifically, by providing an exhaust port 640 at the top end of the second segment 620, when the required heat dissipation efficiency of the processor module 300 is not high, the exhaust port 640 at the top end of the second segment 620 can be used to dissipate heat for other components in the inner cavity of the chassis 100. In addition, opening the exhaust port 640 at the inclined part of the second segment 620 facilitates the inflow or outflow of air in the inner cavity of the second segment 620.

[0092] Alternatively, the top of the third segment 630 can be as follows: Figure 2The diagram shows an air outlet 640 communicating with the inner cavity of the third section 630. Specifically, by providing an air outlet 640 at the top of the third section 630, heat can be dissipated through the air outlet 640 when the computing device is powered off or during a power outage.

[0093] Optionally, the top end of the second section 620 may be provided with an air outlet 640 communicating with the inner cavity of the second section 620, and the top end of the third section 630 may also be provided with an air outlet 640 communicating with the inner cavity of the third section 630. This is to combine the advantages of both solutions.

[0094] It should be noted that the air outlet 640 can be set at any position on the air guide 600 to reduce the transmission of vibration of the air guide 600 to the processor module 300.

[0095] refer to Figure 3 and Figure 4 To facilitate the installation of the processing fan 400, the air guide shroud 600 may have an opening facing the mounting plate surface 210. The computing device provided in this embodiment may also include a support plate 710, which can be supported at the bottom of the processing fan 400 and can be combined with the air guide shroud 600 to form a space for accommodating the processing fan 400. Furthermore, the processing fan 400 can be mounted on the support plate 710.

[0096] In addition, the end face of the first section 610 of the air guide shroud 600 can be as follows: Figure 3 The end face shown is located no further than the processing fan 400 away from the heatsink 320. The first section 610 of the air guide shroud 600 is detachably connected to the processing fan 400 via fasteners. Of course, the end face of the first section 610 of the air guide shroud 600 can also be as shown... Figure 4 The end face of the processing fan 400, which is away from the heat sink 320, is shown and can be connected to the support plate 710. In this way, the processing fan 400 and the air guide shroud 600 are connected through the support plate 710 and can form an integrated module, which facilitates mass production and assembly, and also improves vibration resistance.

[0097] Figure 4 A cross-sectional view of another partial computing device provided in an embodiment of this application. (See reference...) Figure 2 and Figure 4Specifically, the first section 610 of the air guide shroud 600 may have a window panel 611, a connecting plate 612, and a top plate 613. The window panel 611 of the first section 610 may be located on the side of the processing fan 400 away from the radiator 320 and has through holes for air passage. The connecting plate 612 of the first section 610 may be connected to the bottom end of the window panel 611 of the first section 610 and bent relative to the window panel 611 of the first section 610, and may be connected to the support plate 710. The top wall of the first section 610 may be connected to the top end of the window panel of the first section 610 and bent relative to the window panel 611 of the first section 610, and may be connected to the second section 620.

[0098] Thus, the vibration generated by the processing fan 400 is transmitted to the support plate 710. Part of the vibration from the support plate 710 is transmitted to the connecting plate 612 of the first section 610, and another part can be transmitted to the chassis 100. The vibration from the connecting plate 612 of the first section 610 can be transmitted to the heat sink via the window plate 611 of the first section 610, the top plate 613 of the first section 610, the second section 620, and the third section 630. Because the window plate 611 of the first section 610 has through holes, the vibration transmitted to the heat sink 320 is weakened, thereby reducing the impact of the processing fan 400 on the processor 310. In addition, the distance between the connection point of the air guide shroud 600 and the support plate 710 (the bottom wall of the first section 610) and the heat sink 320 is relatively large, so the vibration weakens with increasing distance.

[0099] refer to Figure 2 The first segment 610 may further include a side wall 614. The side wall 614 of the first segment 610 may be connected to the side end of the window panel 611 of the first segment 610 and extend toward the radiator 320. To further reduce vibration, a predetermined gap may optionally be formed between the side wall 614 of the first segment 610 and the support plate 710.

[0100] Continue to refer to Figure 2 Optionally, the third section 630 of the air guide shroud 600 may be disposed around the outside of the heat sink 320 and may have an air outlet 640 communicating with the inner cavity of the air guide shroud 600, so as to reduce the vibration transmission between the air guide shroud 600 and the heat sink 320 by using the air outlet 640. In addition, the air in the inner cavity of the air guide shroud 600 can flow to the outside through the air outlet 640 to dissipate heat from other devices.

[0101] Optionally, at least a portion of the support plate 710 may extend beyond the end face of the processing fan 400 near the heatsink 320 and cover at least a portion of the opening of the air guide shroud 600 to prevent air from flowing toward the motherboard 200, so that the air is concentrated to flow toward the heatsink 320.

[0102] In addition, in order to further reduce the vibration transmitted to the radiator 320, the end of the support plate 710 near the radiator 320 may have a certain distance from the end face of the radiator 320.

[0103] As described above, the processing fan 400 module in the related technologies is located on one side of the motherboard 200, resulting in a larger chassis 100. Therefore, in order to reduce the internal space occupied by the processing fan 400 in the chassis 100, this embodiment of the application can place the processing fan 400 above the mounting plate surface 210 of the motherboard 200. That is, in the direction perpendicular to the normal of the mounting plate surface 210 of the motherboard 200, the projection of the processing fan 400 on the mounting plate surface 210 of the motherboard 200 is located within the mounting plate surface 210 of the motherboard 200. In addition, compared with the related technologies, the distance between the processing fan 400 and the heat sink 320 is closer, reducing airflow loss and improving heat dissipation.

[0104] In addition, in order to reduce the area of ​​the motherboard 200 occupied by the processing fan 400, both the processing fan 400 and the air guide shroud 600 can be suspended on the mounting plate surface 210 of the motherboard 200. That is to say, there can be a certain distance between the end face of the processing fan 400 and the mounting plate surface 210 of the motherboard 200 and the mounting plate surface 210 of the motherboard 200.

[0105] As mentioned above, the processing fan 400 can be supported by the support plate 710. If the support plate 710 is suspended (i.e., there is a gap between the support plate 710 and the mounting plate 210), then the processing fan 400 will also be suspended. The following examples illustrate the possible suspension methods of the support plate 710.

[0106] For example, refer to Figures 3-5 The chassis 100 may include a top wall 150 and a bottom wall 140 disposed opposite to each other. The computing device provided in this embodiment may also include a column 720, which may be connected between the support plate 710 and the bottom wall 140 and / or the top wall 150 of the chassis 100. That is, the column 720 may be as follows: Figure 3 and Figure 4 The connection shown is between the support plate 710 and the bottom wall 140 of the chassis 100. Alternatively, refer to... Figure 5 The column 720 can be connected between the support plate 710 and the top wall 150 of the chassis 100. Alternatively, at least a portion of the column 720 can be connected between the support plate 710 and the top wall 150 of the chassis 100, and at least a portion of the column 720 can be connected between the support plate 710 and the bottom wall 140 of the chassis 100.

[0107] The column 720 can be a stud with internal threads, which can be fixed to the support plate 710 or the wall of the chassis 100 by a threaded rod. Understandably, when the column 720 is connected to the bottom wall 140 of the chassis 100, the motherboard 200 can have a through hole for the column 720 to pass through. This allows the column 720 to pass through the through hole of the motherboard 200 and connect to the bottom wall 140 of the chassis 100.

[0108] Figure 6 This is a schematic diagram illustrating the installation of another processing fan 400 provided in an embodiment of this application. (See reference...) Figure 6 For example, the support plate 710 may be connected to the side wall 160 of the chassis 100.

[0109] In addition, the connection between the support plate 710 and the chassis 100 can be a combination of the above methods. That is, the support plate 710 can be connected to the bottom wall 140 and / or top wall 150 of the chassis 100 via the column 720, or the support plate 710 can be connected to the side wall 160 of the chassis 100 to achieve the purpose of suspension.

[0110] It is worth noting that the processing fan 400 is optional. Figure 3 and Figure 4 The first specification shown, or alternatively, the processing fan 400, can be selected. Figure 5 and Figure 6 The second specification is shown in the figure. (Reference) Figures 2-4 When the heatsink 320 requires high-power cooling from the processing fan 400, and the processing fan 400 can be of the first specification, its cross-section can be larger than that of the heatsink 320, and its bottom end can be flush with the bottom end of the heatsink 320, so that both the top and bottom ends of the heatsink 320 are in contact with the air for cooling. (Reference) Figure 7 and Figure 8 When the heat sink 320 requires low-power processing fan 400 for heat dissipation, the processing fan 400 can be of the second specification. The cross-section of the processing fan 400 can be smaller than the cross-section of the heat sink 320, and the bottom of the processing fan 400 can be higher than the bottom of the heat sink 320 in order to dissipate heat from the top of the heat sink 320.

[0111] refer to Figure 3 and Figure 4 When the first specification is selected for the fan 400, a first distance may be maintained between the support plate 710 and the mounting plate 210 of the main board 200. (Reference) Figure 7 and Figure 8When the processing fan 400 is selected according to the second specification, the computing device provided in this application embodiment may further include a liner 730, which may be parallel to the support plate 710 and located on the side of the support plate 710 away from the processing fan 400. Furthermore, a second distance may exist between the liner 730 and the mounting plate surface 210 of the motherboard 200. In addition, at least one column 720 is supported between the liner 730 and the bottom wall 140 of the chassis 100, and at least one column 720 is supported between the support plate 710 and the liner 730.

[0112] In order to facilitate the interchangeability of the first-specification processing fan 400 and the second-specification processing fan 400, the second distance can be equal to the first distance. Thus, when replacing the second-specification processing fan 400 with the first-specification processing fan 400 (from... Figure 8 Replace with Figure 3 or Figure 4 The support plate 710 can be removed, and the first-specification processing fan 400 can be placed on the liner 730, with the liner 730 supporting the first-specification processing fan 400. When replacing the first-specification processing fan 400 with the second-specification processing fan 400 (by... Figure 3 or Figure 4 Replace with Figure 8 A support plate 710 can be mounted on the side of the liner 730 away from the main board 200 via a column 720, and the second-specification processing fan 400 can be placed on the support plate 710, with the support plate 710 supporting the second-specification processing fan 400.

[0113] In summary, regardless of the suspension method adopted by the support plate 710, the support plate 710 is connected to the chassis 100. In this way, the air guide shroud 600, the processing fan 400, the support plate 710 and the chassis 100 can form a whole, so as to disperse the vibration generated by the fan and improve the overall vibration resistance.

[0114] refer to Figure 3 and Figure 8 To facilitate communication between the fan 400 and the motherboard 200, the computing device provided in this embodiment may optionally include a connection component 800. This connection component 800 may include an electrical cable 810, a first connector 820, and a second connector 830. The electrical cable 810 electrically connects the fan 400 and the first connector 820, and the second connector 830 may be disposed on the mounting plate 210 and electrically connected to the first connector 820.

[0115] The electrical connection can include the following: male-female engagement, screw-nut engagement, magnetic engagement, snap-fit ​​engagement, and electro-adhesive engagement. For example, when the first connector 820 and the second connector 830 are in a male-female engagement, the first connector 820 may have a protrusion, and the second connector 830 may have a groove, with the protrusion embedded in the inner cavity of the groove and making conductive contact; or, the first connector 820 may have a groove, and the second connector 830 may have a protrusion, with the protrusion embedded in the inner cavity of the groove and making conductive contact. For example, one of the first connector 820 and the second connector 830 may be a socket of a straight connector, and the other of the first connector 820 and the second connector 830 may be a plug of a straight connector.

[0116] In related technologies, the chassis of memory testing machines has limited space, and there is no room to place additional fan modules (fan modules include fans and fan adapter boards, through which the fans can be electrically connected to the motherboard) on the side of the motherboard. Furthermore, the CPU power consumption of memory testing machines is relatively high, resulting in significant cooling requirements.

[0117] Figure 9 This is a top view of the memory testing machine provided in an embodiment of this application. Figure 9 The arrows in the image indicate the direction of airflow. (Reference) Figure 9 This application embodiment can also provide a memory testing machine, which may include a chassis 100 with an inner cavity. The chassis 100 may have an annular sidewall 160, and the sidewall 160 of the chassis 100 may be provided with an air inlet 120 and an air outlet 130.

[0118] Among them, the air inlet 120 and the air outlet 130 can also be like Figure 9 The shown is located on the same side wall 160 of the chassis 100. Figure 9 Two sets of air inlets 120 and air outlets 130 are shown. The same set of air inlets 120 and air outlets 130 can be located on the same sidewall 160. Different sets of air inlets 120 and air outlets 130 can be located on different sidewalls. Furthermore, because... Figure 9 Two sets of air inlets 120 and air outlets 130 are set in the middle to facilitate the guidance of air along... Figure 9 The air flows in the direction of the arrow in the diagram, and each air inlet 120 and each air outlet 130 can be equipped with a main fan 500.

[0119] Furthermore, the chassis 100 has a rectangular cross-section, and the longer side of the cross-section can be taken as the length of the chassis 100. The shorter side of the cross-section can be taken as the width of the chassis 100. To facilitate the layout of electrical components and air cooling within the chassis, the air inlet 120 and the air outlet 130 can be located at both ends of the chassis 100 along its length. For example, Figure 9In the case, the air inlet 120 and air outlet 130 of the same group can be arranged on the same side wall of the chassis 100 in its width direction. And the air inlet 120 and air outlet 130 of the same group can be located at both ends of the side wall along the length direction of the chassis 100.

[0120] Continue to refer to Figure 9 The memory testing machine provided in this application embodiment may include a motherboard 200, a processor module 300, a processing fan 400, and a fan guide 600, all of which are disposed within the interior cavity of a chassis 100. The processor module 300 is disposed on the mounting plate 210 of the motherboard 200. The processing fan 400 is disposed to the side of the processor module 300 and suspended above the mounting plate 210 of the motherboard 200. The fan guide 600 connects the processing fan 400 and the processor module 300, thereby reducing the space of the chassis 100 of the memory testing machine while bringing the processing fan 400 closer to the processor module 300 to improve heat dissipation. Furthermore, the memory testing machine provided in this application embodiment does not require a fan adapter board, which saves processing costs and simplifies manufacturing.

[0121] It should be noted that the installation method of the processing fan 400, the assembly method of the processing fan 400 and the air guide 600, the relative positional relationship between the processing fan 400 and the processor module 300, and the setting method of the air guide 600 of the memory test machine can all be referred to the description of the computing device above for relevant settings, and will not be repeated here.

[0122] In summary, the computing device and memory testing machine provided in this application embodiment reduce the size of the device by setting the processor module 300 on the mounting plate 210 of the motherboard 200, setting the processing fan 400 on one side of the processor module 300, and suspending the processing fan 400 on the mounting plate 210. The processing fan 400 is connected to the processor module 300 by the air guide shroud 600 to reduce air loss between the processing fan 400 and the processor module 300, thereby facilitating the air cooling of the processor module 300.

[0123] The terms "upper" and "lower" are used to describe the relative positions of the various structures in the accompanying drawings. They are only for clarity of description and are not intended to limit the scope of implementation of this application. Any changes or adjustments to the relative positions without substantially altering the technical content shall also be considered within the scope of implementation of this application.

[0124] It should be noted that, in this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0125] Furthermore, in this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0126] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this disclosure. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0127] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A computing device, characterized in that, include: The motherboard has a mounting surface; The processor module is mounted on the mounting plate. The processing fan is suspended above the mounting plate and is located to the side of the processor module; An air guide shroud is suspended on the mounting plate surface, and the air guide shroud connects the processing fan and the processor module; The air guide shroud has an opening facing the mounting plate surface; The computing device also includes a support plate, which is supported at the bottom of the processing fan and together with the air guide shroud forms a space to accommodate the processing fan; The processing fan is mounted on the support plate; The air guide shroud has a window panel and a connecting plate. The window panel of the air guide shroud is located on the side of the processing fan away from the processor module and has a through hole for air to pass through. The connecting plate of the air guide shroud is connected to the bottom end of the window panel of the air guide shroud and is bent relative to the window panel of the air guide shroud, and is connected to the support plate. At least a portion of the support plate extends beyond the end face of the processing fan near the processor module and covers at least a portion of the opening of the air guide shroud; The air guide shroud also has a side wall, which is connected to the side end of the window panel and extends toward the processor module. At least a portion of the side wall and the support plate form a preset gap.

2. The computing device according to claim 1, characterized in that, The top of the processing fan is higher than the top of the processor module.

3. The computing device according to claim 2, characterized in that, The air guide shroud comprises a first section, a second section, and a third section connected in sequence; The first segment surrounds the outside of the processing fan; the inner top wall of the second segment is inclined toward the motherboard near the end of the third segment; the third segment surrounds the outside of the processor module.

4. The computing device according to claim 3, characterized in that, The top end of the second segment is provided with an air outlet communicating with the inner cavity of the second segment; and / or, the top end of the third segment is provided with an air outlet communicating with the inner cavity of the third segment.

5. The computing device according to any one of claims 1-4, characterized in that, The support plate has a gap between its end near the processor module and the processor module.

6. The computing device according to any one of claims 1-4, characterized in that, There is a gap between the support plate and the mounting plate surface; The computing device also includes a column and a chassis with an inner cavity. The motherboard, the processor module, the processing fan, the air guide, the support plate, and the column are all disposed in the inner cavity of the chassis. The column is connected between the support plate and the top wall and / or the bottom wall of the chassis.

7. The computing device according to any one of claims 1-4, characterized in that, It also includes a connection component, which includes an electrical cable, a first connector, and a second connector. The electrical cable electrically connects the processing fan to the first connector, and the second connector is disposed on the mounting plate and is electrically connected to the first connector.

8. A memory testing machine, characterized in that, include: The motherboard has a mounting surface; The processor module is mounted on the mounting plate. The processing fan is suspended above the mounting plate and is located to the side of the processor module; An air guide shroud is suspended on the mounting plate surface, and the air guide shroud connects the processing fan and the processor module; The air guide shroud has an opening facing the mounting plate surface; The memory testing machine also includes a support plate, which is supported at the bottom of the processing fan and together with the air guide shroud to form a space to accommodate the processing fan; The processing fan is mounted on the support plate; The air guide shroud has a window panel and a connecting plate. The window panel of the air guide shroud is located on the side of the processing fan away from the processor module and has a through hole for air to pass through. The connecting plate of the air guide shroud is connected to the bottom end of the window panel of the air guide shroud and is bent relative to the window panel of the air guide shroud, and is connected to the support plate. At least a portion of the support plate extends beyond the end face of the processing fan near the processor module and covers at least a portion of the opening of the air guide shroud; The air guide shroud also has a side wall, which is connected to the side end of the window panel and extends toward the processor module. At least a portion of the side wall and the support plate form a preset gap.

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