A Miniaturized and Highly Reliable Intensity Modulator Packaging Structure and Packaging Method

Abstract

The present invention discloses a miniaturized and highly reliable intensity modulator packaging structure, which includes: a packaging shell, an input metallized beveled fiber optic component, an input aspherical lens, an output metallized beveled fiber optic component, an output aspherical lens, a modulator chip, an SMPM RF connector, a ceramic resistor, a backlight monitoring chip, a ceramic circuit board, and a closely arranged glass insulator. The present invention uses an aspherical lens optical coupling system to replace the direct alignment coupling between the traditional optical fiber and the chip; among them, metallized optical fibers are used to replace the traditional capillary-reinforced optical fibers. In terms of the overall packaging shell structure, an SMPM RF connector is used to replace the traditional coaxial V-type female head RF connector; threaded holes are opened from the four corners of the bottom, and the bottom mounting method is used to replace the traditional front double-ear plus bottom double-hole mounting.

Description

Technical Field

[0001] The present invention relates to the field of modulator design and packaging, and particularly to a miniaturized and highly reliable directly modulated laser packaging structure and packaging method. Background Art

[0002] The Mach-Zehnder intensity modulator based on lithium niobate crystal has significant advantages such as low loss, high modulation bandwidth, and high extinction ratio. It modulates the input radio frequency electrical signal onto the optical signal output by the externally modulated light source to achieve electro-optical conversion, and is widely used in fields such as optical fiber communication and microwave photonics. The packaging design of the intensity modulator mainly assembles the modulator chip, input / output optical fiber, ceramic circuit board, radio frequency connector, and backlight monitoring chip in a sealed package to achieve internal and external interconnection of optical and electrical signals.

[0003] In the existing intensity modulator packaging structure, the coupling uses optical glue to connect and fix the modulation waveguide chip and the input / output optical fiber. To ensure thermal reliability, a section of bare optical fiber needs to be reserved inside the package to prevent stretching damage, and the fiber outlet of the package is sealed with glue.

[0004] This traditional packaging form has the following main disadvantages: (1) Large volume: At the input and output ends of the packaging structure, a section of bare optical fiber needs to be reserved, resulting in a total waste of about 30 mm of length space. The coaxial V-type female radio frequency connector is packaged at the cavity wall of the package, with a large volume and exposed outside. (2) Low reliability: The optical coupling is fixed with optical glue, and the coupling point is likely to fall off due to vibration and mechanical shock. (3) Poor airtightness: The fiber outlet is sealed by glue curing, which is not conducive to the sealing performance. Summary of the Invention

[0005] In view of the above-mentioned defects of the prior art, the purpose of the present invention is to provide a miniaturized and highly reliable intensity modulator packaging structure and packaging method, which has a smaller volume, higher reliability and airtightness, and a longer service life.

[0006] The purpose of the present invention is achieved through the following technical solutions:

[0007] A miniaturized and highly reliable intensity modulator packaging structure, comprising:

[0008] A packaging shell, with a front optical fiber fixing hole at the head end, a rear optical fiber fixing hole at the rear end, an electrical interface, a radio frequency signal input port, and a threaded mounting and fixing hole on the side; the front optical fiber fixing hole and the rear optical fiber fixing hole are facing each other;

[0009] An input metallized bevel optical fiber assembly, fixedly connected to the packaging shell, with the tail facing the front optical fiber fixing hole;

[0010] An input aspherical lens, welded and fixed inside the packaging shell, facing the front optical fiber fixing hole and closing the front optical fiber fixing hole;

[0011] The output metallized bevel fiber optic component is fixedly connected to the packaging housing, and its head is facing the rear fiber fixing hole.

[0012] The output aspherical lens is welded and fixed inside the packaging housing, facing the rear fiber fixing hole and closing the rear fiber fixing hole.

[0013] The modulator chip is arranged inside the packaging housing.

[0014] The SMPM RF connector is arranged inside the RF signal input port and is electrically connected to the RF input interface of the modulator chip.

[0015] The ceramic resistor is arranged inside the packaging housing and is electrically connected to the RF interruption matching interface of the modulator chip.

[0016] The backlight monitoring chip is arranged inside the packaging housing and is fixed on the modulator chip.

[0017] The ceramic circuit board is arranged inside the packaging housing and is electrically connected to the modulator chip and the backlight monitoring chip.

[0018] The closely spaced glass insulator passes through the electrical interface and is electrically connected to the ceramic circuit board.

[0019] Further, the packaging housing includes:

[0020] The housing cavity is in the shape of an open box, with a front fiber fixing hole at the head end, a rear fiber fixing hole at the rear end, an electrical interface and an RF signal input port on the side; the front fiber fixing hole is opposite to the rear fiber fixing hole.

[0021] The penetrating front tail tube is arranged at the head end of the housing cavity, facing the front fiber fixing hole; the tail end of the input metallized bevel fiber optic component is inserted into the front tail tube, and its outer surface is seamlessly fixedly connected to the inner wall of the front tail tube.

[0022] The penetrating rear tail tube is arranged at the tail end of the housing cavity, facing the rear fiber fixing hole; the head end of the output metallized bevel fiber optic component is inserted into the rear tail tube, and its outer surface is seamlessly fixedly connected to the inner wall of the rear tail tube.

[0023] The cover plate is arranged at the opening of the housing cavity to close the housing cavity.

[0024] Further, the outer surface of the input metallized bevel fiber optic component is welded and sealed and fixed together with the inner wall of the front tail tube; the outer surface of the output metallized bevel fiber optic component is welded and sealed and fixed together with the inner wall of the rear tail tube.

[0025] Further, it further includes:

[0026] The front tail sleeve is sleeved on the front tail tube and is fixedly connected to the front tail tube.

[0027] The rear tail sleeve is sleeved on the rear tail pipe and fixedly connected to the rear tail pipe.

[0028] Furthermore, the SMPM radio frequency connector is sintered in the radio frequency signal input port through AuSn solder, and the internal pin of the SMPM radio frequency connector is located directly above the radio frequency input interface of the modulator chip.

[0029] Furthermore, the ceramic resistor is fixed in the packaging shell by vacuum sintering, facing the radio frequency terminal matching interface of the modulator chip.

[0030] Furthermore, the ceramic circuit board is welded and fixed in the packaging shell, located directly below the closely arranged glass insulator, facing the electrode interface of the modulator chip.

[0031] Furthermore, the center conductor of the closely arranged glass insulator is made of Kovar alloy, and the insulating layer is BH-G / K glass. The insulating layer of the closely arranged glass insulator is sintered in the electrical interface through AuSn solder to seal the electrical interface.

[0032] A miniaturized and highly reliable intensity modulator packaging method includes the following steps:

[0033] S1. Integrally process the housing cavity, front tail pipe, and rear tail pipe. Process the front optical fiber fixing hole at the head end of the housing cavity, the rear optical fiber fixing hole at the rear end, and the electrical interface and radio frequency signal input port on the side.

[0034] S2. Process the cover plate, and perform nickel plating and gold plating on the surfaces of the integrally processed housing cavity, front tail pipe, and rear tail pipe.

[0035] S3. Sinter the SMPM radio frequency connector in the radio frequency signal input port of the housing cavity through AuSn solder, and seal the radio frequency signal input port.

[0036] S4. Sinter the closely arranged glass insulator with a center conductor made of Kovar alloy 4J29 and an insulating layer made of BH-G / K glass in the electrical interface of the housing cavity through AuSn solder, and seal the electrical interface.

[0037] S5. Gold-plate the bottom and electrical connection parts of the ceramic circuit board, and then fix it in the housing cavity by vacuum sintering.

[0038] S6. Gold-plate the bottom and electrical connection parts of the ceramic resistor, and then fix it in the housing cavity by vacuum sintering.

[0039] S7. Weld the input aspherical lens to the front optical fiber fixing hole of the housing cavity, and weld the output aspherical lens to the rear optical fiber fixing hole of the housing cavity.

[0040] S8. Bond the modulator chip in the housing cavity with electro-conductive adhesive and bake it for fixation, so that its RF input interface is directly below the inner pin of the RF connector. Eutectic weld the inner pin of the RF connector to the RF input interface of the modulator chip. Connect the ceramic resistor to the RF terminal matching interface of the modulator chip with a gold wire, and connect the ceramic circuit board to the electrode interface of the modulator chip with a gold wire.

[0041] S9. Insert the tail end of the input metallized bevel fiber optic component into the front tail tube, with the end facing the front fiber fixing hole; insert the head end of the output metallized bevel fiber optic component into the rear tail tube, with the end facing the rear fiber fixing hole; inject solder into the front tail tube and the rear tail tube by means of thermal resistance welding, and hermetically fix the metal tube of the input metallized bevel fiber optic component to the front tail tube and the metal tube of the output metallized bevel fiber optic component to the rear tail tube respectively;

[0042] S10. Connect the backlight monitoring chip to the output tail end of the modulator chip, and then connect the P pole and N pole of the backlight monitoring chip to the ceramic circuit board with gold wires;

[0043] S11. Evacuate the inside of the housing cavity, and then weld and fix the cover plate at its opening to seal its inside;

[0044] S12. Sheath the front tail sleeve on the front tail tube, and use glue to bond and fix the front tail sleeve and the front tail tube; sheath the rear tail sleeve on the rear tail tube, and use glue to bond and fix the rear tail sleeve and the rear tail tube.

[0045] Further, the ceramic circuit board and the housing cavity are sintered and fixed together with PbSn solder; the ceramic resistor and the housing cavity are sintered and fixed together with PbSn solder.

[0046] Due to the adoption of the above technical solutions, the present invention has the following advantages:

[0047] 1. An aspherical lens is adopted for optical system coupling. Compared with the traditional structure, the internal fiber length space is saved. The size in the length direction is reduced by 1 / 3, and the length is only about 30 mm. The SMPM RF connector is adopted to replace the traditional coaxial V-type female head RF connector for installation, which is encapsulated inside the wall of the tube shell cavity. And the threaded installation fixing holes are adopted, and the installation method at the bottom or on the side is used to replace the traditional front double ears plus bottom double holes installation. The size in the width direction is reduced by 1 / 2, and the width is only about 10 mm. Therefore, the structural size of the present invention is small, and it can be used in more environments and conditions.

[0048] 2. The present invention uses an aspherical lens for spatial coupling. The aspherical lens is fixed by welding. Compared with the traditional packaging method in which the optical fiber and the modulator chip are aligned and coupled and then fixed with ultraviolet glue, which is vulnerable to the detachment of the coupling point caused by mechanical vibration and shock, resulting in product scrapping, the present invention is not easily affected by vibration and shock to cause the deviation of the coupling optical path and lead to product failure.

[0049] 3. The present invention uses a metallized optical fiber, performs thermal resistance welding to inject solder, and forms a good airtight fixation. Compared with the traditional packaging method in which the optical fiber is fixed with glue at the tail tube, the airtightness is improved.

[0050] Other advantages, objectives, and features of the present invention will be described to some extent in the subsequent specification, and to some extent, will be obvious to those skilled in the art based on the study of the following text, or can be taught from the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] The brief description of the drawings of the present invention is as follows:

[0052] Figure 1 It is a front view structural schematic diagram of the miniaturized high-reliability directly modulated laser packaging structure without a cover plate in the embodiment.

[0053] Figure 2 It is Figure 1 The structural schematic diagram at the A-A section in

[0054] Figure 3 It is Figure 1 The structural schematic diagram at the B-B section in

[0055] Figure 4 It is Figure 1 The structural schematic diagram at the C-C section in

[0056] Figure 5 It is Figure 1 The structural schematic diagram at the D-D section in

[0057] Figure 6 It is Figure 5 The enlarged structural schematic diagram at the E position in

[0058] Figure 7 It is Figure 5 The enlarged structural schematic diagram at the F position in

[0059] Figure 8 It is Figure 1 The bottom view structural schematic diagram of

[0060] Figure 9 It is Figure 1 The top view structural schematic diagram of

[0061] Figure 10 is Figure 9 The enlarged structural schematic diagram at position G in

[0062] Figure 11 is Figure 9 The enlarged structural schematic diagram at position H in

[0063] Figure 12 is Figure 9 The enlarged structural schematic diagram at position J in

[0064] Figure 13 is Figure 1 The three - dimensional structural schematic diagram of

[0065] Figure 14 is the three - dimensional structural schematic diagram of the miniaturized high - reliability directly - modulated laser package structure in the embodiment.

[0066] In the figure: 11. Housing cavity; 111. Front optical fiber fixing hole; 112. Rear optical fiber fixing hole; 113. Electrical interface; 114. RF signal input port; 115. Threaded mounting and fixing hole; 12. Front tail tube; 13. Rear tail tube; 14. Cover plate; 2. Input metallized bevel optical fiber assembly; 3. Input aspherical lens; 4. Output metallized bevel optical fiber assembly; 5. Output aspherical lens; 6. Modulator chip; 7. SMPM RF connector; 8. Ceramic resistor; 9. Backlight monitoring chip; 100. Ceramic circuit board; 101. Densely - arranged glass insulator; 1011. Central conductor; 1012. Insulating layer; 102. Front tail sleeve; 103. Rear tail sleeve. Detailed implementation manners

[0067] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0068] Embodiment:

[0069] As Figures 1 to 14 shown, a miniaturized high - reliability intensity modulator package structure includes:

[0070] A housing cavity 11, in the shape of an open box, with a front optical fiber fixing hole 111 at the head end, a rear optical fiber fixing hole 112 at the rear end, and an electrical interface 113 and an RF signal input port 114 on the side; the front optical fiber fixing hole 111 and the rear optical fiber fixing hole 112 are opposite to each other; the housing cavity 11 is made of stainless steel 304 material;

[0071] A penetrating front tail tube 12, arranged at the head end of the housing cavity 11, opposite to the front optical fiber fixing hole 111; the tail end of the input metallized bevel optical fiber assembly 2 is inserted into the front tail tube 12, and its outer surface is seamlessly fixed to the inner wall of the front tail tube 12;

[0072] The penetrating rear tail pipe 13 is arranged at the tail end of the outer shell cavity 11 and faces the rear optical fiber fixing hole 112; the head end of the output metallized bevel optical fiber component is inserted into the rear tail pipe 13, and its outer surface is seamlessly fixedly connected with the inner wall of the rear tail pipe 13;

[0073] The cover plate 14 is arranged at the opening of the outer shell cavity 11 to close the outer shell cavity 11, and the cover plate 14 is made of kovar alloy material.

[0074] The input metallized bevel optical fiber component 2 is welded and hermetically fixed together with the inner wall of the front tail pipe 12, and the tail faces the front optical fiber fixing hole 111;

[0075] The input aspherical lens 3 is welded and fixed in the outer shell cavity 11, faces the front optical fiber fixing hole 111, and closes the front optical fiber fixing hole 111;

[0076] The output metallized bevel optical fiber component 4 is welded and hermetically fixed together with the inner wall of the rear tail pipe 13, and the head faces the rear optical fiber fixing hole 112;

[0077] The output aspherical lens 5 is welded and fixed in the outer shell cavity 11, faces the rear optical fiber fixing hole 112, and closes the rear optical fiber fixing hole 112;

[0078] The modulator chip 6 is arranged in the outer shell cavity 11;

[0079] The SMPM RF connector 7 is sintered in the RF signal input port 114 with AuSn solder. The internal pin of the SMPM RF connector 7 is located directly above the RF input interface of the modulator chip 6 and is electrically connected to the RF input interface of the modulator chip 6; The SMPM RF connector 7 specifically adopts the SMPM(M)-JPD-L type connector

[0080] The ceramic resistor 8 is fixed in the outer shell cavity 11 by vacuum sintering, faces the RF terminal matching interface of the modulator chip 6, and is electrically connected to the RF interruption matching interface of the modulator chip 6;

[0081] The backlight monitoring chip 9 is arranged in the outer shell cavity 11 and fixed on the modulator chip 6; The backlight monitoring chip 9 converts the light scattered and separated from the modulator into a current signal for output, performing the function of optical power feedback control.

[0082] The ceramic circuit board 100 is welded and fixed in the outer shell cavity 11, located directly below the closely arranged glass insulators 101, faces the electrode interface of the modulator chip 6, and is electrically connected to the modulator chip 6 and the backlight monitoring chip 9;

[0083] The closely-packed glass insulator 101 has a kovar alloy as the center conductor 1011 and a BH-G / K glass as the insulating layer 1012. The insulating layer 1012 of the closely-packed glass insulator 101 is sintered in the electrical interface 113 using an AuSn solder to seal the electrical interface 113 and is electrically connected to the ceramic circuit board 100, which is used to achieve the electrical signal interconnection between the inside and outside of the intensity modulator;

[0084] The front tail sleeve 102 is sleeved on the front tail pipe 12 and fixedly connected to the front tail pipe 12;

[0085] The rear tail sleeve 103 is sleeved on the rear tail pipe 13 and fixedly connected to the rear tail pipe 13.

[0086] A miniaturized and highly reliable intensity modulator packaging method includes the following steps:

[0087] S1. Integrally process the housing cavity 11, the front tail pipe 12, and the rear tail pipe 13. Process the front optical fiber fixing hole 111 at the head end of the housing cavity 11, the rear optical fiber fixing hole 112 at the rear end, and the electrical interface 113 and the RF signal input port 114 on the side;

[0088] S2. Process the cover plate 14, and perform nickel plating and gold plating on the surfaces of the integrally processed housing cavity 11, the front tail pipe 12, and the rear tail pipe 13;

[0089] S3. Sinter the SMPM RF connector in the RF signal input port 114 of the housing cavity using an AuSn solder and seal the RF signal input port 114;

[0090] S4. Sinter the closely-packed glass insulator 101 with a kovar alloy 4J29 as the center conductor 1011 and a BH-G / K glass as the insulating layer 1012 in the electrical interface 113 of the housing cavity 11 using an AuSn solder and seal the electrical interface 113;

[0091] S5. Gold-plate the bottom and electrical connection parts of the ceramic circuit board 100, and then vacuum sinter and fix it in the housing cavity 11 using a PbSn solder;

[0092] S6. Gold-plate the bottom and electrical connection parts of the ceramic resistor 8, and then vacuum sinter and fix it in the housing cavity 11 using a PbSn solder;

[0093] S7. Weld the input aspherical lens 3 to the front optical fiber fixing hole 111 of the housing cavity 11, and weld the output aspherical lens 5 to the rear optical fiber fixing hole 112 of the housing cavity 11;

[0094] S8. Bond the modulator chip 6 in the housing cavity 11 with electrically conductive adhesive and bake it for fixation, so that its RF input interface is directly below the internal pin of the RF connector. Eutectic weld the internal pin of the RF connector to the RF input interface of the modulator chip 6. Connect the ceramic resistor 8 to the RF terminal matching interface of the modulator chip 6 with a gold wire. Connect the ceramic circuit board 100 to the electrode interface of the modulator chip 6 with a gold wire.

[0095] S9. Insert the tail end of the input metallized bevel fiber optic component 2 into the front tail tube 12, with the end facing the front fiber fixing hole 111. Insert the head end of the output metallized bevel fiber optic component 4 into the rear tail tube 13, with the end facing the rear fiber fixing hole 112. Inject solder into the front tail tube 12 and the rear tail tube 13 by means of thermal resistance welding, and hermetically fix the metal tube of the input metallized bevel fiber optic component 2 to the front tail tube 12 and the metal tube of the output metallized bevel fiber optic component 4 to the rear tail tube 13 respectively.

[0096] S10. Connect the backlight monitoring chip 9 to the output tail end of the modulator chip 6, and then connect the P pole and N pole of the backlight monitoring chip to the ceramic circuit board 100 with gold wires.

[0097] S11. Evacuate the inside of the housing cavity 11, and then weld and fix the cover plate 14 at its opening to seal the inside.

[0098] S12. Sheath the front tail sleeve 102 over the front tail tube 12, and bond and fix the front tail sleeve 102 and the front tail tube 12 with glue. Sheath the rear tail sleeve 103 over the rear tail tube 13, and bond and fix the rear tail sleeve 103 and the rear tail tube 13 with glue.

[0099] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit them. Although the present invention has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present invention can be modified or equivalently replaced without departing from the spirit and scope of the technical solutions, and they should all be covered by the scope of the claims of the present invention.

Claims

1. A miniaturized and highly reliable intensity modulator packaging structure, characterized in that, Comprising: A packaging shell, with a shell cavity in the shape of an open box, having a front optical fiber fixing hole at the head end, a rear optical fiber fixing hole at the rear end, an electrical interface, a radio frequency signal input port, and a threaded mounting and fixing hole on the side; the front optical fiber fixing hole is aligned with the rear optical fiber fixing hole; a through front tail tube is provided at the head end of the shell cavity, facing the front optical fiber fixing hole; a through rear tail tube is provided at the tail end of the shell cavity, facing the rear optical fiber fixing hole; the threaded mounting and fixing hole adopts a bottom or side mounting method; solder is injected into the front tail tube and the rear tail tube by means of thermal resistance welding, and the metal tube of the input metallized bevel optical fiber component is hermetically fixed to the front tail tube, and the metal tube of the output metallized bevel optical fiber component is hermetically fixed to the rear tail tube respectively; An input metallized bevel optical fiber component, fixedly connected to the packaging shell, with its tail facing the front optical fiber fixing hole; the tail end of the input metallized bevel optical fiber component is inserted into the front tail tube, and its outer surface is seamlessly fixedly connected to the inner wall of the front tail tube; An input aspherical lens, welded and fixed inside the packaging shell, facing the front optical fiber fixing hole, and closing the front optical fiber fixing hole; An output metallized bevel optical fiber component, fixedly connected to the packaging shell, with its head facing the rear optical fiber fixing hole; the head end of the output metallized bevel optical fiber component is inserted into the rear tail tube, and its outer surface is seamlessly fixedly connected to the inner wall of the rear tail tube; An output aspherical lens, welded and fixed inside the packaging shell, facing the rear optical fiber fixing hole, and closing the rear optical fiber fixing hole; A modulator chip, provided inside the packaging shell; An SMPM radio frequency connector, provided inside the radio frequency signal input port, and electrically connected to the radio frequency input interface of the modulator chip; A ceramic resistor, provided inside the packaging shell, and electrically connected to the radio frequency termination matching interface of the modulator chip; A backlight monitoring chip, provided inside the packaging shell, and fixed on the modulator chip; A ceramic circuit board, provided inside the packaging shell, and electrically connected to the modulator chip and the backlight monitoring chip; A closely spaced glass insulator, passing through the electrical interface, and electrically connected to the ceramic circuit board.

2. The miniaturized and highly reliable intensity modulator packaging structure according to claim 1, characterized in that, The outer surface of the input metallized bevel optical fiber component is welded and hermetically fixed to the inner wall of the front tail tube; the outer surface of the output metallized bevel optical fiber component is welded and hermetically fixed to the inner wall of the rear tail tube.

3. The miniaturized and highly reliable intensity modulator packaging structure according to claim 1, characterized in that, Also comprising: A front tail sleeve, sleeved on the front tail tube, and fixedly connected to the front tail tube; A rear tail sleeve, sleeved on the rear tail tube, and fixedly connected to the rear tail tube.

4. The miniaturized and highly reliable intensity modulator packaging structure according to claim 1, characterized in that, The SMPM radio frequency connector is sintered in the radio frequency signal input port by AuSn solder, and the internal pin of the SMPM radio frequency connector is located directly above the radio frequency input interface of the modulator chip.

5. The miniaturized and highly reliable intensity modulator packaging structure according to claim 1, characterized in that, The ceramic resistor is fixed inside the packaging shell by means of vacuum sintering, facing the radio frequency termination matching interface of the modulator chip.

6. The miniaturized and highly reliable intensity modulator packaging structure according to claim 1, characterized in that, The ceramic circuit board is welded and fixed inside the packaging shell, located directly below the closely spaced glass insulator, and facing the electrode interface of the modulator chip.

7. The miniaturized and highly reliable intensity modulator packaging structure according to claim 1, characterized in that, The central conductor of the closely spaced glass insulator is Kovar alloy, and the insulating layer is BH-G / K glass. The insulating layer of the closely spaced glass insulator is sintered in the electrical interface by AuSn solder to seal the electrical interface.

8. A miniaturized and highly reliable intensity modulator packaging method, characterized in that, Including the following steps: S1. Integrally process the housing cavity, front tail pipe, and rear tail pipe. Machine a front optical fiber fixing hole at the head end of the housing cavity, a rear optical fiber fixing hole at the rear end, and an electrical interface and a radio frequency signal input port on the side. S2. Machine the cover plate and nickel-gold plate the surfaces of the integrally processed housing cavity, front tail pipe, and rear tail pipe. S3. Sinter the SMPM radio frequency connector in the radio frequency signal input port of the housing cavity using AuSn solder and seal the radio frequency signal input port. S4. Sinter the center conductor, the kovar alloy 4J29 insulation layer, and the close-packed glass insulator made of BH-G / K glass in the electrical interface of the housing cavity using AuSn solder and seal the electrical interface. S5. Gold-plate the bottom and electrical connection parts of the ceramic circuit board and then fix it in the housing cavity by vacuum sintering. S6. Gold-plate the bottom and electrical connection parts of the ceramic resistor and then fix it in the housing cavity by vacuum sintering. S7. Weld the input aspherical lens to the front optical fiber fixing hole of the housing cavity and weld the output aspherical lens to the rear optical fiber fixing hole of the housing cavity. S8. Bond the modulator chip in the housing cavity with electroadhesive and bake it for fixation so that its radio frequency input interface is directly below the internal pin of the radio frequency connector. Eutectically weld the internal pin of the radio frequency connector to the radio frequency input interface of the modulator chip. Connect the ceramic resistor to the radio frequency terminal matching interface of the modulator chip with a gold wire. Connect the ceramic circuit board to the electrode interface of the modulator chip with a gold wire. S9. Insert the tail end of the input metallized bevel optical fiber assembly into the front tail pipe with the end facing the front optical fiber fixing hole. Insert the head end of the output metallized bevel optical fiber assembly into the rear tail pipe with the end facing the rear optical fiber fixing hole. S10. Connect the backlight monitoring chip to the output tail end of the modulator chip, and then connect the P pole and N pole of the backlight monitoring chip to the ceramic circuit board with gold wires. S11. Evacuate the inside of the housing cavity and then weld and fix the cover plate at its opening to seal the inside. S12. Slip the front tail sleeve over the front tail pipe and bond and fix the front tail sleeve and the front tail pipe with glue. Slip the rear tail sleeve over the rear tail pipe and bond and fix the rear tail sleeve and the rear tail pipe with glue.

9. The miniaturized high-reliability intensity modulator packaging method according to claim 8, wherein, The ceramic circuit board and the housing cavity are sintered and fixed together with PbSn solder; the ceramic resistor and the housing cavity are sintered and fixed together with PbSn solder.

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