Panel tensioning method and apparatus for preventing sagging

Abstract

This application provides embodiments of a nozzle for use in a processing chamber and methods for reducing nozzle panel sagging. In some embodiments, a nozzle for use in a processing chamber includes: a panel having a plurality of gas distribution holes disposed through the panel; and one or more cables engaged with the panel and configured to apply prestress to the panel.

Description

Technical Field

[0001] Embodiments of this disclosure generally relate to semiconductor substrate processing equipment. Background Technology

[0002] Conventional nozzles used in semiconductor processing chambers (such as deposition chambers, etching chambers, or similar chambers) typically include a nozzle for introducing one or more process gases into the processing space of the chamber. The nozzle includes a faceplate having one or more through-holes for distributing the one or more process gases. The faceplate is typically supported along its outer edge. However, under thermal cycling, the faceplate may droop, resulting in uneven deposition across the substrate being processed.

[0003] Therefore, the inventors provided an improved implementation of the nozzle. Summary of the Invention

[0004] This application provides embodiments of a nozzle for use in a processing chamber and a method for reducing nozzle panel sagging. In some embodiments, a nozzle for use in a processing chamber includes: a panel having a plurality of gas distribution holes disposed through the panel; and one or more cables engaged with the panel and configured to apply prestress to the panel.

[0005] In some embodiments, a processing chamber includes: a chamber body coupled to a chamber cover to define an interior space within the chamber body; a substrate support disposed in the interior space; and a panel having an outer periphery abutting the chamber body, wherein the panel includes a plurality of gas distribution holes extending through the panel, the panel being disposed in the interior space and opposite the substrate support, wherein one or more cables are disposed adjacent to the outer periphery of the panel and configured to apply prestress to the panel.

[0006] In some embodiments, a method for reducing panel sagging for use in a processing chamber includes the step of applying a compressive force to the panel via one or more cables that are engaged with the panel at an outer periphery adjacent to the panel.

[0007] Other and further implementations of this disclosure are described below. Attached Figure Description

[0008] The embodiments of this disclosure have been briefly summarized above and discussed in more detail below. These embodiments of the disclosure can be understood by referring to the exemplary embodiments illustrated in the accompanying drawings. However, the accompanying drawings only illustrate typical embodiments of the disclosure, and since the disclosure allows for other equivalent embodiments, the accompanying drawings should not be considered as limiting the scope of the disclosure.

[0009] Figure 1 A schematic side view of a processing chamber according to some embodiments of the present disclosure is shown.

[0010] Figure 2 A schematic top view illustrating a panel according to some embodiments of this disclosure.

[0011] Figure 3 A side view of a panel according to some embodiments of this disclosure is shown.

[0012] Figure 4 An isometric top view of a panel according to some embodiments of this disclosure is shown.

[0013] Figure 5 A partial cross-sectional view of a panel according to some embodiments of the present disclosure is shown.

[0014] Figure 6 A schematic top view illustrating a panel according to some embodiments of this disclosure.

[0015] Figure 7 A schematic cross-sectional view of a panel according to some embodiments of the present disclosure is shown.

[0016] Figure 8 The illustration depicts methods for reducing panel sagging according to some embodiments of the present disclosure.

[0017] For ease of understanding, the same reference numerals are used to represent common elements in these figures where possible. For clarity, these figures are not drawn to scale and may be simplified. Elements and features in one embodiment may be advantageously incorporated into other embodiments without further explanation. Detailed Implementation

[0018] This application provides an embodiment of a nozzle for use in a processing chamber. The nozzle described herein includes a panel having one or more openings to allow one or more processing gases to flow into the processing space of the processing chamber to perform processing on a substrate disposed within the processing chamber. The panel may be supported at an outer edge region adjacent to the panel. Due to at least one of the panel's weight or thermal cycling, the panel may deform or sag in the central region. The apparatus and method provided in this application include one or more cables embedded within or otherwise coupled to the panel to apply prestress to the panel, advantageously reducing panel sagging (i.e., increasing panel flatness) when the panel is mounted in the processing chamber. A panel with increased flatness advantageously improves the uniformity of substrate processing.

[0019] Figure 1 A schematic side view of a processing chamber according to some embodiments of this disclosure is illustrated. Processing chamber 100 can be any chamber with a nozzle for performing any suitable process, such as etching, deposition, cleaning, or similar processes. In some embodiments, processing chamber 100 is configured to perform plasma-enhanced chemical vapor deposition (PECVD) processing.

[0020] The processing chamber 100 includes a chamber body 106 coupled to a cover assembly 104 for defining an interior space 120 within the chamber body. The chamber body 106 is typically made of a metal, such as aluminum. The chamber body 106 includes a slit valve opening 118 formed in a sidewall of the chamber body. The slit valve opening 118 is coupled to a slit valve 126 for selectively opening and closing the slit valve opening 118 to facilitate the transfer of a substrate 114 into and out of the interior space 120. The chamber body 106 may be coupled to ground 115.

[0021] The cover assembly 104 includes a nozzle 108 for supplying one or more process gases into the interior space 120. A substrate support 124 is disposed within the interior space 120 and opposite the nozzle 108 to support a substrate 114. The substrate support 124 and the nozzle 108 define a process space 122 therebetween. The nozzle 108 includes a panel 112 having an outer periphery that rests against a chamber body 106. The panel 112 includes a plurality of gas distribution holes 116 extending through the panel for supplying one or more process gases from a gas supply source 130 to the process space 122. The panel 112 may be made of a metal, such as aluminum.

[0022] The processing chamber 100 includes a vacuum port 142 coupled to an internal space 120. The vacuum port 142 is coupled to a vacuum system 138, which has a vacuum pump and a throttle valve to regulate the airflow through the processing chamber 100.

[0023] The substrate support 124 typically includes a base 109 disposed on a support shaft 105. The support shaft 105 may be coupled to a lifting mechanism 160. The lifting mechanism 160 may be flexibly sealed to the chamber body 106. The lifting mechanism 160 allows the base 109 to move vertically within the internal space 120 between a lower transfer section and multiple raised processing positions. Furthermore, one or more lifting rods (not shown) may be disposed through the base 109 to lift the substrate 114 away from the base 109 or lower the substrate 114 onto the base 109.

[0024] One or more cables (described in more detail below) are coupled to panel 112 to apply prestress to panel 112. In some embodiments, the one or more cables are disposed adjacent to the outer periphery of panel 112. In some embodiments, the one or more cables are coupled to a tensioning mechanism 140, which is configured to pull the one or more cables to apply prestress to panel 112. In some embodiments, tensioning mechanism 140 can be any suitable tensioner tool for applying tensile force to the one or more cables. In some embodiments, tensioning mechanism 140 is configured to pull the one or more cables when pushing against an outer wall of panel 112. In some embodiments, tensioning mechanism 140 is configured to pull the one or more cables without pushing against an outer wall of panel 112. In some embodiments, tensioning mechanism includes a pneumatic tensioning device. In some implementations, once tensioned by the tensioning mechanism 140, one or more cables are anchored, clamped, or otherwise locked before the tension of the tensioning mechanism is removed.

[0025] In some embodiments, the nozzle 108 includes a blocker plate 146 having a plurality of through-holes 156, the blocker plate 146 being coupled to the upper surface 158 of the panel 112. The blocker plate 146 is configured to distribute one or more processing gases more uniformly from the gas supply source 130 to the panel 112. In some embodiments, the flow path of one or more processing gases extends from the gas supply source 130 to the gas inlet 152 of the cover assembly 104, through the blocker plate 146, and through the panel 112 to the processing space 122. The blocker plate 146 may also provide a desired pressure drop for one or more processing gases between the gas supply source 130 and the panel 112.

[0026] In some embodiments, panel 112 is disposed on conductive ring 144 to provide an RF ground path. Conductive ring 144 may be made of aluminum. In some embodiments, chamber body 106 includes one or more pads surrounding substrate support 124 to protect the walls of chamber body 106. In some embodiments, one or more pads include a lower pad 132. In some embodiments, one or more pads include an upper pad 134 disposed between the lower pad 132 and nozzle 108. In some embodiments, panel 112 may also rest on ceramic isolation ring 136, which is disposed between processing space 122 and conductive ring 144 to provide additional edge support for panel 112. In some embodiments, ceramic isolation ring 136 extends from panel 112 to lower pad 132. In some embodiments, ceramic isolation ring 136 has an "L" shaped cross-section.

[0027] Cover assembly 104 is coupled to power supply 148, such as an RF power supply. In use, power supply 148 provides energy to one or more components of cover assembly 104 to form or sustain plasma in processing space 122. Ions from the plasma can be used to perform desired deposition, etching, or cleaning processes. In some embodiments, a second power supply 164 may be coupled to substrate support 124 to provide additional bias by increasing the potential from the plasma to substrate 114. The second power supply 164 may be a DC power supply, a pulsed DC power supply, an RF bias power supply, a pulsed RF source, or a bias power supply, or a combination thereof.

[0028] Figure 2 A schematic top view of panel 112 according to some embodiments of the present disclosure is shown. Figure 3 A schematic cross-sectional view of a panel 112 according to some embodiments of the present disclosure is shown. In some embodiments, one or more cables 208 are embedded in the panel 112. In some embodiments, the panel 112 includes one or more channels 204 for receiving one or more cables 208 disposed in the panel 112. In some embodiments, one or more cables 208 are disposed radially outside a plurality of gas distribution holes 116.

[0029] In some implementations, such as Figure 2As shown, one or more channels 204 are single channels. In some embodiments, one or more channels 204 include an annular portion 210 extending around the outer periphery of panel 112 and a radial portion 212 extending from the annular portion 210 to an outer sidewall 214 of panel 112. In some embodiments, one or more channels 204 are disposed on the upper surface 158 of panel 112. In some embodiments, one or more cover plates 306 are disposed over one or more cables 208 to cover one or more channels 204. One or more cover plates 306 may be welded to panel 112 or otherwise coupled to panel 112. In some embodiments, one or more channels 204 are disposed on the lower surface 302 of panel 112.

[0030] In some embodiments, one or more cables 208 are made of metal. In some embodiments, one or more cables 208 comprise metal bars or multiple interwoven metal strands. In some embodiments, one or more cables 208 comprise multiple interwoven stainless steel strands. One or more cables 208 may be coupled to a tensioning mechanism 220 configured to pull the ends of one or more cables 208 to apply stress to one or more cables 208 and thereby apply prestress to panel 112. Locking devices may be coupled to one or more cables 208 to hold panel 112 in a prestressed state. For example, the locking device may be an anchor 218 coupled to each end of one or more cables 208 and configured to hold one or more cables 208 in a stressed position to apply prestress to panel 112. The anchor 218 is typically larger than the width of one or more channels 204, such that the anchor 218 presses against the outer wall 214 of the panel 112, locking one or more cables 208 in a stressed position.

[0031] Figure 4 An isometric top view of panel 112 according to some embodiments of the present disclosure is shown. Figure 5 A partial side view of panel 112 according to some embodiments of the present disclosure is illustrated. In some embodiments, such as Figure 4 As shown, one or more channels 204 include two channels. In some embodiments, each of the two channels has an annular portion and a pair of radial portions. In some embodiments, the radial portions of each of the two channels are arranged at approximately 180 degrees to each other. In such embodiments, a tensioning mechanism (i.e., tensioning mechanism 220) is provided on both sides of the panel 112 to pull one or more cables 208.

[0032] In some embodiments, the upper surface 158 of panel 112 includes an annular sealing groove 410, which is radially inwardly disposed from one or more cables 208 to provide a seal between partition 146 and panel 112. In some embodiments, panel 112 includes one or more alignment features 402 for aligning panel 112 with a chamber component (e.g., partition 146). In some embodiments, the one or more alignment features 402 include three alignment features.

[0033] Figure 6 A schematic top view of panel 112 according to some embodiments of the present disclosure is shown. Figure 7 A schematic cross-sectional view of a panel 112 according to some embodiments of the present disclosure is shown. In some embodiments, a plurality of retaining members 604 are coupled to an outer side wall 214 of the panel 112. In some embodiments, the plurality of retaining members 604 are eyehooks or the like. The plurality of retaining members 604 facilitate the application of prestress to the panel 112 by one or more cables 208 extending through the retaining members 604. Anchors 218 are coupled to one or more cables 208 and press against the outer side wall 214 of the panel 112 or against a corresponding retaining member of the plurality of retaining members 604 to hold one or more cables 208 in a stressed position.

[0034] Figure 8A method 800 for reducing sagging of a panel used in a processing chamber, according to some embodiments of this disclosure, is illustrated. At 802, the method includes the step of applying a compressive force to a panel (i.e., panel 112) via one or more cables (i.e., one or more cables 208) engaged with the panel at an outer periphery adjacent to the panel. The one or more cables are engaged with the panel in any suitable manner to apply the compressive force, such as by being disposed in the panel, coupled to the panel, pressed against the panel, or otherwise contacting the panel. In some embodiments, the step of applying the compressive force includes the step of providing tension to the one or more cables. For example, the tension may be applied by a tensioning mechanism (i.e., tensioning mechanisms 140, 220). In some embodiments, the step of applying the compressive force includes the step of pulling at both ends of the one or more cables to apply prestress to the panel to reduce or prevent sagging of the panel (e.g., at the center of the panel). In some embodiments, the step of applying the compressive force includes the step of pulling at one end of the one or more cables while the other end is anchored, clamped, or otherwise secured. In some embodiments, prestressing of the panel is performed ex-situ before it is installed in the processing chamber (i.e., processing chamber 100). In some embodiments, prestressing of the panel is performed in-situ after it is installed in the processing chamber, advantageously reducing the time available for preventative maintenance. In some embodiments, after compressive force is applied to the panel, anchors (i.e., anchors 218) or other clamping or locking devices may be coupled to one or more cables to hold them in a tensile or stressed state. In some embodiments, anchors or other locking or clamping devices are coupled to one or more cables before the tensile force applied to them is released.

[0035] Over time, one or more cables may loosen, thereby reducing the prestress in the panel. Optionally, in 804, the method includes the step of subsequently reapplying compressive force to the panel via the one or more cables in the processing chamber after the panel has been installed in the processing chamber. In some embodiments, the reapplying compressive force step may be performed at regular intervals, for example, after performing a set number of processes or after a first time period. After reapplying compressive force to the panel, anchors or other locking devices may be repositioned to hold the one or more cables in a stressed state.

[0036] While the foregoing description pertains to implementation of this disclosure, other and further implementations of this disclosure may be designed without departing from the basic scope of this disclosure.

Claims

1. A nozzle for use in a processing chamber, comprising: A panel having a plurality of gas distribution holes disposed through the panel; and One or more cables are engaged with the panel and configured to apply prestress to the panel, wherein the panel includes one or more channels on the upper surface of the panel to accommodate the one or more cables, wherein the one or more channels include an annular portion and a plurality of radial portions, the annular portion extending around an outer periphery of the panel and the plurality of radial portions extending from the annular portion to an outer sidewall of the panel.

2. The nozzle of claim 1, further comprising one or more cover plates disposed on the panel to cover the one or more channels.

3. The nozzle of claim 1, wherein the one or more channels comprise two channels, and the plurality of radial portions of each of the two channels are arranged at approximately 180 degrees to each other.

4. The nozzle of claim 1, wherein one or more cables are disposed radially outside the plurality of gas distribution holes.

5. The nozzle of claim 1, wherein the one or more cables comprise a plurality of interwoven metal strands.

6. The nozzle of any one of claims 1 to 5, further comprising an anchor coupled to each end of the one or more cables and configured to hold the one or more cables in a stressed position to apply prestress to the panel.

7. The nozzle of any one of claims 1 to 5, further comprising a plurality of retaining members coupled to the outer sidewall of the panel, wherein one or more cables extend through the plurality of retaining members.

8. The nozzle of any one of claims 1 to 5, wherein the upper surface of the panel includes an annular sealing groove disposed radially inward from the one or more cables.

9. The nozzle of any one of claims 1 to 5, further comprising a partition plate having a plurality of through holes coupled to the upper surface of the panel.

10. The nozzle of claim 9, wherein the panel includes one or more alignment features for aligning the panel with the partition plate.

11. The nozzle as claimed in any one of claims 1 to 5, wherein the one or more cables are embedded in the panel.

12. A processing chamber, comprising: A chamber body coupled to a cover assembly to define an interior space within the chamber body; A substrate support member is disposed in the internal space; and The nozzle as claimed in any one of claims 1 to 5 is disposed in the internal space opposite to the substrate support, wherein the panel has an outer periphery resting against the chamber body.

13. The processing chamber of claim 12, further comprising an upper liner and a lower liner surrounding the substrate support.

14. A method for reducing panel sagging used in a processing chamber, comprising the steps of: A compressive force is applied to the panel via one or more cables that engage the panel at a peripheral location adjacent to the panel, wherein the panel includes one or more channels on the upper surface of the panel to accommodate the one or more cables, wherein the one or more channels include an annular portion and a plurality of radial portions, the annular portion extending around the peripheral location of the panel and the plurality of radial portions extending from the annular portion to an outer wall of the panel.

15. The method of claim 14, further comprising the following steps: After the panel is installed in the processing chamber, the panel is then recompressed via one or more cables in the processing chamber.

16. The method of claim 14, further comprising the following steps: After the compressive force is applied, anchors are used to hold the one or more cables in a stressed state.

17. The method of any one of claims 14 to 16, wherein the two ends of the one or more cables are adjacent to each other.

18. The method of any one of claims 14 to 16, wherein the two ends of the one or more cables are configured to be about 180 degrees to each other.

19. The method of any one of claims 14 to 16, wherein the step of applying the compressive force comprises the following steps: While the other end is anchored or clamped, pull on one end of the one or more cables.

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