Electronic device and method of manufacturing electronic device

Abstract

The electronic device of the present application is an electronic device used in the vicinity of a de-electrification target object, and has: an electric component; a wiring portion that supplies electric power of a high-voltage power supply to the electric component; and a housing that houses the electric component and the wiring portion, and has a cover portion having a surface resistivity of 10 4 Ω / □ or more and 10 11 Ω / □ or less, and a housing having a surface resistivity of 10 4 Ω / □ or more and 10 11 Ω / □ or less.

Description

Technical Field

[0001] This invention relates to electronic devices and methods for manufacturing electronic devices. Background Technology

[0002] To date, various countermeasures have been developed to address static electricity in electronic components, electronic devices, or their manufacturing processes. One such technology is described, for example, in Patent Document 1. Patent Document 1 describes an ionizer having a discharge needle that generates ions by producing corona discharge (claim 1 of Patent Document 1, etc.).

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent document 1: Japanese Patent Application Publication No. 2019-75349. Summary of the Invention

[0006] The problem the invention aims to solve

[0007] However, the results of the inventors' research show that, in the electronic devices such as ionizers described in Patent Document 1, there is room for improvement in mitigating the induced charging phenomenon present in nearby electronic components, electronic devices, and other objects requiring electrification when they are in use.

[0008] means for solving problems

[0009] Further research by the inventors revealed that, for electronic devices having electronic components, a frame, and driven by a high-voltage power supply, by appropriately controlling the surface resistivity of the cover covering the electrical components and / or the frame, the induced charging phenomenon generated in nearby objects can be mitigated when using the electronic device, thus completing the present invention.

[0010] According to the present invention, an electronic device is provided for use near an object subject to electrical discharge, comprising:

[0011] Electrical components;

[0012] The wiring section provides high-voltage power to the electrical components; and

[0013] The frame houses the electrical components and the wiring section.

[0014] The electronic device has at least a portion covering the electrical components and has a surface resistivity of 10. 4 Ω / □ or more and 10 11 The cap portion with a resistivity of Ω / □ or less and a surface resistivity of 10 4 Ω / □ or more and 10 11 At least one of the frames described below Ω / □.

[0015] Furthermore, according to the present invention, a method for manufacturing an electronic device is provided.

[0016] The electronic device has electrical components, wiring for supplying high-voltage power to the electrical components, and a frame for housing the electrical components and the wiring. The electronic device is used near an object to be de-energized. The manufacturing method includes:

[0017] The assembly process uses materials with a surface resistivity of 10. 4 Ω / □ or more and 10 11 A cover with a resistance of Ω / □ or less, covering at least a portion of the electrical component, and a surface resistivity of 10. 4 Ω / □ or more and 10 11 At least one of the frames of Ω / □ and below is used to assemble the constituent components of the electronic device to obtain the electronic device.

[0018] The effects of the invention

[0019] According to the present invention, an electronic device that effectively mitigates induced charging phenomena and a method for manufacturing the electronic device are provided. Attached Figure Description

[0020] Figure 1 This is a schematic diagram showing the connection of the measuring devices in the measuring system 10.

[0021] Figure 2 It means Figure 1 The equivalent circuit diagram showing the relationship between the electrostatic capacitances of various parts in the measurement system 10.

[0022] Figure 3 This is a diagram used to illustrate the method for measuring induced voltage.

[0023] Figure 4 It is a cross-sectional view schematically showing the structure of an ionizer (electrostatic removal device).

[0024] Figure 5 It means Figure 4 A magnified view of the α region.

[0025] Figure 6 It is a diagram schematically representing the structure of other ionizers.

[0026] Figure 7 It is a diagram schematically representing the structure of other ionizers. Detailed Implementation

[0027] Hereinafter, embodiments of the present invention will be described using the accompanying drawings. Furthermore, in all the drawings, the same reference numerals are used to denote the same constituent elements, and descriptions are omitted where appropriate. Also, the figures are schematic diagrams and do not conform to actual size ratios.

[0028] It should be noted that in this embodiment, the directions of front, back, left, right, up, and down are specified as shown in the figure. However, this is for the purpose of simply explaining the relative relationships of the constituent elements. Therefore, the direction in which the product implementing this invention is manufactured or used is not limited.

[0029] The electronic device of this embodiment will be described in general terms.

[0030] The electronic device of this embodiment includes: electrical components; wiring section for supplying power from a high-voltage power source to the electrical components; and a housing for housing the electrical components and wiring section, having at least a portion covering the electrical components and having a surface resistivity of 10. 4 Ω / □ or more and 10 11 The cap portion with a resistivity of Ω / □ or less and a surface resistivity of 10 4 Ω / □ or more and 10 11 At least one of the frames below Ω / □.

[0031] This type of electronic device is used near objects that are not subject to electricity, such as electronic components and electronic devices.

[0032] In the manufacturing and assembly processes of electronic components and electronic devices, various countermeasures are adopted to prevent damage to products caused by electrostatic discharge (ESD).

[0033] As a countermeasure against static electricity, static eliminators (ionizers) are widely used. Static eliminators suppress ESD generation by neutralizing the charged charges in electronic components and devices. Reasons for using static eliminators include their high safety, fewer restrictions on installation location, and ease of handling.

[0034] In recent years, with the miniaturization, high speed, low operating voltage, and high functionality of electronic components and devices, their durability against electrostatic discharge (ESD) may decrease. Therefore, it is necessary to set the ESD management voltage to a very low value of a few volts (V) to around ten volts (V). This issue is particularly prominent in applications highly sensitive to ESD, such as hard disk drive head slider processes, CMOS image sensors, SAW devices, high-frequency devices, inverters using SiC technology, laser diodes, white LEDs, and high-brightness LEDs.

[0035] In view of this background, the inventors conducted research and found that in the manufacturing process of electronic components and electronic devices with low electrostatic management voltage, when there is a charge in the electrostatic removal device and the object to be removed, the electric field caused by the high voltage power supply, etc., can induce a potential even if ions do not flow into the object to be removed, which may cause electrostatic disturbance.

[0036] In the development of current static electricity removal devices, no countermeasures against static electricity have been implemented for the devices themselves. This is because, to date, due to the high baseline setting of electrostatic management voltages, research has not focused on the induced charging of the object to be removed by the static electricity removal device. In other words, even excluding the induced charging caused by the static electricity removal device from the research scope, improving static electricity removal performance such as removal speed and ion balance could provide a static electricity removal device that is effective as a countermeasure against static electricity.

[0037] However, the electrostatic discharge (ESD) management voltage set at around a few volts (V) to a dozen volts (V) is a relatively low baseline. In this case, according to the inventors' understanding, the induced charge generated on the object to be charged by the electrostatic discharge device is not a negligible level of static electricity, and the target of the electrostatic discharge countermeasure is effective in suppressing ESD generation.

[0038] Further focused research revealed that by appropriately controlling the surface resistivity of the frame of the static electricity removal device and / or the surface resistivity of the cover covering the electrical components to be below the aforementioned upper limit and above the aforementioned lower limit, the induced charging phenomenon generated by objects near the static electricity removal device can be mitigated when using the static electricity removal device.

[0039] By setting the surface resistivity below the aforementioned upper limit, compared to a surface resistivity greater than 10... 11 Compared to insulating materials with a surface resistivity of Ω / □, charge movement is smoother, reducing the induced voltage generated on the object W during charge removal. Furthermore, by setting the surface resistivity to a value above the aforementioned lower limit, compared to less than 10... 4 Compared to conductive materials with an Ω / □ ratio, it is possible to suppress the increase in the amount of ions attracted from the electrode 130, and thus, it is possible to suppress the decrease in the charge removal performance of the ionizer 100.

[0040] According to this embodiment, by using an electronic device such as a static electricity removal device near the object to be statically removed, the induced voltage generated by electrostatic induction on the object to be statically removed can be reduced, that is, the phenomenon of induced charging can be alleviated.

[0041] Therefore, in the manufacturing process of electronic components and electronic devices, it is expected that the yield rate will be improved and the quality deviation will be reduced.

[0042] Furthermore, according to one embodiment of this invention, even at a relatively low electrostatic management voltage of around a few volts (V) to a dozen volts (V), it is possible to provide electronic devices such as static electricity removal devices that can suppress the generation of ESD.

[0043] The electronic device of this embodiment will now be described in detail.

[0044] Electronic devices include, for example, corona discharge type ionizers (ionizers) and light irradiation type ionizers. Corona discharge type ionizers have a discharge needle (electrode) that generates corona discharge, and can be implemented using voltage application or self-discharge methods. Depending on the type of radiation, light irradiation type ionizers can be implemented using ultraviolet light, soft X-rays, or alpha rays.

[0045] It should be noted that if an electronic device is used in the vicinity of an object that is not electrified during the manufacturing process of an electronic component, electronic device, or its manufacturing process, it can also be a typical electronic device other than an object that is not electrified.

[0046] "Nearby" can refer to the distance between the object to be electrified and the electrification device during the electrification process, and can mean that they are in the same room, on the same workbench, or on the same manufacturing line.

[0047] Stasis elimination devices can be either mounted or handheld. Types of stabilization devices include strip-type, top-mounted control console type, desktop type (blower type, fan type), nozzle type (point type), gun type, pen type, and box type.

[0048] Examples of voltage application methods for voltage removal devices include DC (direct current), pulsed DC, SSDC, AC (alternating current), high-frequency AC, pulsed AC, and HDC-AC.

[0049] The voltage of the high-voltage power supply can be, for example, 100V or higher, preferably 1kV or higher, or 2kV or higher. There is no particular upper limit to the voltage of the high-voltage power supply. Depending on the requirements, the high-voltage power supply can have various known conversion circuits.

[0050] It should be noted that in the current removal device, the output voltage applied to the electrode, which is one of the electrical components, is preferably 1kV or more, and more preferably 2kV or more.

[0051] High-voltage power supplies can use frequencies such as 50Hz or 60Hz (commercial frequency type), a few Hz to 30Hz (low frequency type), or about 20kHz to 80kHz (high frequency type).

[0052] High-voltage power supplies can be either built-in or external. Built-in power supplies are, for example, located inside a housing that contains electronic components. External power supplies are, for example, power supplies installed in facilities that use electronic devices, such as batteries.

[0053] For the electronic device of this embodiment, using Figure 4 , 5 An example of using a bar-type ionizer 100, which is one of the de-energizing devices that generates corona discharge, will be described.

[0054] Figure 4 This is a cross-sectional view schematically showing the structure of the ionizer 100.

[0055] Figure 5 It means Figure 4 A magnified view of the α region in the figure.

[0056] Figure 5 The ionizer 100 has: one or more electrodes 130 (electrical components), wiring portion 170 for supplying power to the electrodes 130 by a high-voltage power supply 120, and a frame 110 for housing the electrodes 130 and the wiring portion 170.

[0057] "Accommodation" refers to the state in which the interior space of the frame 110 includes part or all of the contents.

[0058] Electrode 130 is either an electrode that generates corona discharge or an electrode that generates glow discharge, and is composed of a needle-shaped metal rod, i.e., a discharge needle, whose front end gradually tapers in diameter.

[0059] The electrode 130 is made of materials such as tungsten, stainless steel, silicon, and glass.

[0060] Discharge needles made of metals such as tungsten and stainless steel, as well as non-metallic discharge needles made of silicon (polysilicon), can be constructed to contain each constituent material in high purity, with the possibility of containing small amounts of other materials as needed. Glass discharge needles can be used with discharge needles whose surface is coated with silicon.

[0061] The number of electrodes 130, the spacing between electrodes 130, and the length of the line with multiple electrodes 130 (electrode length) can be set by taking into account the installation location and the current removal capability.

[0062] When the high-voltage power supply 120 supplies power to the electrode 130 through the wiring section 170, ions 140 are emitted from the electrode 130. The emitted ions 140 can neutralize (eliminate) the charge on the surface of the object W to be electrified.

[0063] The voltage application method of the ionizer 100 can be selected from the above methods without any particular limitation. For example, AC (alternating current) mode, high frequency AC mode, pulse AC mode, HDC-AC mode, etc. can be used.

[0064] In the case of AC mode, an AC high-voltage power supply 120 can be used, or a power supply that combines an AC generating circuit with a DC high-voltage power supply 120 can be used.

[0065] Figure 4 The ionizer 100 has a high-voltage power supply 120 that is a built-in power supply housed in the housing 110, but is not limited to this method. According to this embodiment, even when the high-voltage power supply 120 is built into the housing 110, the induced charging phenomenon generated by the object to be charged can be mitigated.

[0066] Figure 4 The ionizer 100 has a cover (orifice 150, protective portion 160) covering at least a portion of the electrode 130.

[0067] In the ionizer 100, the cover may be composed of a cylindrical opening 150 and / or a protective portion 160. One example of the cylindrical opening 150 may be configured to be disposed on the frame 110 and cover the periphery of the electrode 130. Another example of the protective portion 160 may be configured to be detachably mounted on the cylindrical opening 150 and cover at least the front end 132 of the electrode 130.

[0068] Figure 5 It is Figure 4 The enlarged view of region α is schematically showing the electrode 130 disposed on the cover. Figure 5 (a) is a diagram showing the axial direction of electrode 130 as viewed from the front end 132 side. Figure 5 (b) is along Figure 5 (a) is a cross-sectional view of section AA. Figure 5 (c) is along Figure 5 (b) BB section view.

[0069] exist Figure 5 In (b), the cover portion has a surrounding area covering the front end 132 of the electrode 130 and a surface resistivity of 10. 4 Ω / □ or more and 10 11 The first cover structure (orifice 150) with a resistance of Ω / □ or less and the front end 132 of the cover electrode 130, and the surface resistivity is 10. 4 Ω / □ or more and 10 11 A second cover structure (protective part 160) with an Ω / □ or less.

[0070] The ionizer 100 with electrode 130 may have only the first cover structure, but preferably both the first cover structure and the second cover structure.

[0071] The nozzle 150 has a socket structure that supports a portion of the rear of the electrode 130, and can be freely installed in the mounting hole of the frame 110. When the electrode 130 is worn out, the nozzle 150 can be replaced with a new electrode 130, thus facilitating maintenance. Known methods such as mechanical connections can be used for installation and removal.

[0072] It should be noted that the nozzle 150 and the frame 110 can be composed of separate parts or as a single integrated part.

[0073] The port 150 has one or more holes 190 in the wall surrounding the electrode 130 in the axial direction. Air can be supplied through the holes 190, and the electrostatic discharge characteristics of the electrode 130 can be adjusted. Alternatively, air can be supplied from a compressor in the housing 110.

[0074] The nozzle portion 150 has a cover structure that covers at least a portion of the surface of the electrode 130 in the circumferential direction relative to the axial direction. Furthermore, it may also have a cylindrical first cover structure that covers the entire circumferential surface from the portion of the electrode 130 protruding from the socket structure to its front end 132.

[0075] Additionally, the protective portion 160 has a second cover structure that covers the opening 134 of the orifice portion 150 located in front of the front end 132 of the electrode 130. This protective portion 160 can prevent [damage / damage]. Figure 5 (a) The tip 132 of the electrode 130 in the opening 134 shown accidentally comes into contact with the operator, thus serving as a finger guard.

[0076] The protective part 160 is detachably mounted on the nozzle 150. Only the protective part 160 can be replaced. The disassembly and assembly can be performed using known methods such as mechanical connections.

[0077] It should be noted that the protective part 160 and the nozzle part 150 can be composed of separate components or as a single integrated component.

[0078] In the ionizer 100 of this embodiment, at least a portion of the cover electrode 130 (electrical component) constituting A is included, and the surface resistivity of the cover portion is 10. 4 Ω / □ or more and 10 11 The cover portion (or nozzle portion 150 and / or protective portion 160) with a surface resistivity of 10 Ω / □ or less, and component B: 4 Ω / □ or more and 10 11 At least one of the frames 110 of Ω / □ or less, preferably two.

[0079] The surface resistivity of components A and components B can be the same or different.

[0080] The ionizer 100 may have only configuration A or only configuration B, and preferably has both configuration A and configuration B.

[0081] Component A: The surface resistivity of the cover is 1.0 × 10⁻⁶. 4 Ω / □ or higher and 1.0 × 10 11 Ω / □ or less, preferably 1.0 × 10 4 Ω / □ or higher and 1.0 × 10 10 Ω / □ or less, more preferably 1.0×10 4 Ω / □ or higher and 1.0 × 10 9 Ω / □ or less, more preferably 1.0 × 10 5 Ω / □ or higher and 1.0 × 10 9 Below Ω / □.

[0082] Component B: The surface resistivity of the frame 110 can be the same or different, and is 1.0 × 10⁻⁶. 4 Ω / □ or higher and 1.0 × 10 11 Ω / □ or less, preferably 1.0 × 10 4 Ω / □ or higher and 1.0 × 10 10 Ω / □ or less, more preferably 1.0×10 4 Ω / □ or higher and 1.0 × 10 9 Ω / □ or less, more preferably 1.0 × 10 5 Ω / □ or higher and 1.0 × 10 9 Below Ω / □.

[0083] In this specification, surface resistivity refers to the value (Ω / □) that can be measured using a surface resistivity meter as defined by IEC 613405-1, 5-2 (applicable to the ESD Standards Association) in an environment of, for example, temperature: 22.5℃ ± 10% and humidity: 50% RH ± 5% RH, using a CR probe or a 2P probe.

[0084] By having at least one of the above-described configurations A and B, the electric field generated by the ionizer 100 can alleviate the induced charging phenomenon caused by the object W to be de-electrified.

[0085] Although the detailed mechanism is still uncertain, it is believed that due to the surface resistivity of the cover and frame, the movement of charge is smoother compared to insulating materials. On the other hand, compared to conductive materials, it can suppress the increase in the amount of ions attracted from the electrode 130. Therefore, it can reduce the induced voltage generated by the object W during de-electrolysis. On the other hand, it can suppress the reduction of the de-electrolysis performance of the ionizer 100.

[0086] When the surface resistivity of the frame 110 is set to A and the surface resistivity of the cover is set to B, A and B can satisfy, for example, 10. 3 / 10 12 ≤A / B<1, 10 is preferred 4 / 10 11 ≤A / B<1, more preferably 10 4 / 10 9 The ionizer 100 is configured such that ≤A / B<1. As a result, the reduction in charge removal capacity caused by the cover can be suppressed, and the charge can be smoothly moved from the cover to the frame 110.

[0087] It should be noted that, as an alternative approach, A and B can satisfy, for example, 1 < A / B ≤ 10. 3 / 10 12 The ionizer 100 is constructed in a manner that allows it to function properly.

[0088] In the ionizer 100, at least one of the frame 110 and the cover (orifice 150, protective part 160) may have an insulating or conductive layer, and at least a portion of the surface of the layer may have a surface resistivity of 10. 4 Ω / □ or more and 10 11 Electrostatic diffusion layer of 180 Ω / □ or less.

[0089] In the field of ionizer technology, the nozzle of the discharge needle and the protective cap of the nozzle are typically made of insulating material rather than conductive material. This is because conductive material attracts ions emitted from the discharge needle, thus reducing the ionizer's de-energizing capability. Consequently, the object to be de-energized, W, may not be adequately de-energized. However, when using conventional insulating material, as mentioned above, the induced voltage generated on the object to be de-energized, W, becomes higher, potentially leading to ESD (electrostatic discharge).

[0090] In response, by employing either a first stacked structure in which an electrostatic diffusion layer is stacked on an insulating layer or a second stacked structure in which an electrostatic diffusion layer is stacked on a conductive layer, the reduction in the ionizer's de-energizing capability can be suppressed, and the induced voltage generated in the object W to be de-energized during de-energization can be reduced.

[0091] This layered structure is formed in at least one of the following: the opening 150 surrounding the axial direction of the electrode 130, the protective portion 160 between the front end 132 of the electrode 130 and the object to be electrified W, and the frame 110 on which the electrode 130 is disposed, thereby mitigating the induced electrification phenomenon generated by the object to be electrified W.

[0092] Preferably, a laminated structure is formed on the protective portion 160, which is positioned to obstruct the forward direction of ions generated from the electrode 130. This further reduces the induced voltage. More preferably, a laminated structure is formed on the protective portion 160 and the nozzle portion 150, and even more preferably on the nozzle portion 150, the protective portion 160, and the frame 110. By forming the aforementioned laminated structure on the components in contact with the protective portion 160 and other components further in contact with it, the induced voltage generated in the object to be de-electrode W can be further reduced. Although the detailed mechanism is not yet certain, it is believed that the movement of ions generated from the electrode 130 proceeds smoothly through the protective portion 160; therefore, the induced voltage generated in the object to be de-electrode W during de-electrode removal can be reduced.

[0093] The surface resistivity of the electrostatically diffusing layer 180 in the laminated structure is not measured separately, but rather in a state where it is laminated on an insulating or conductive layer that serves as a base layer. For example, by using a conductive base layer, the surface resistivity value can be adjusted to be smaller than in the case of the layer alone.

[0094] The insulating layer in the first layered structure can be made of thermoplastic resins such as ABS, PC, PE, PP, PMMA, PS, PVC, POM, other elastomer resins, engineering resins, and polymer alloy resins containing two or more of these resins. Compared to metal materials, thermoplastic resins are lighter, have excellent moldability, and can produce the desired part shape.

[0095] In addition, the conductive layer in the second stacked structure can be made of metallic materials such as ferrous steel such as SUS, SPCC, SOOC alloy steel, Al alloy, Cu alloy, etc., and can be made of conductive resins in which conductive materials such as carbon and Ag are mixed into the above-mentioned thermosetting resins.

[0096] Although the detailed mechanism is still uncertain, it is believed that in the first layered structure, charges move in the electrostatically diffusing layer formed on the surface of the base layer. In contrast, in the second layered structure, charges that move not only in the electrostatically diffusing layer but also from the electrostatically diffusing layer to the conductive layer of the base layer can move in its conductive layer. Therefore, it is possible to more efficiently mitigate induced charging.

[0097] Methods for forming an electrostatic diffusion layer on an insulating or conductive layer include, for example, forming a coating using a paint, laminating a thin film, or molding using a molding material. The electrostatic diffusion layer can also be formed separately; by using methods such as two-color molding, a base layer of an insulating or conductive layer and an electrostatic diffusion layer can be formed simultaneously.

[0098] It should be noted that the frame 110, the nozzle 150, and the protective part 160 can each be made of an electrostatic diffusing material alone, or they can be made by combining conductive materials, electrostatic diffusing materials, insulating materials, and electrostatic diffusing materials in a stacked structure as described above.

[0099] In the frame 110, the nozzle 150, and the protective part 160, the same or different electrostatic diffusing materials, conductive materials, and insulating materials may also be used.

[0100] Examples include coated articles in which a coating film of an electrostatic diffusing material is formed on at least one of the outer and / or inner surfaces of a frame 110 made of insulating resin, and two-color molded articles in which a film of an electrostatic diffusing material is formed on at least one of the outer and / or inner surfaces of a frame 110 made of insulating resin.

[0101] The cover in the ionizer 100 can be configured as a cover structure (orifice 150) covering the periphery of the electrode 130 and / or a cover structure (protective portion 160) covering the front end 132 of the electrode 130, the surface resistivity of which is 10. 4 Ω / □ or more and 10 11 Below Ω / □. This mitigates the induced charging phenomenon from electrode 130.

[0102] Here, "front" refers to the front when viewed from the front end 132 of electrode 130 toward the object W to be electrified.

[0103] Furthermore, the numerical range of surface resistivity of the nozzle portion 150 and the protective portion 160 applies not only to the case where they are made of electrostatically diffusing material alone, but also to the case where they are configured with the above-mentioned layered structure.

[0104] Figure 5 (c) The protective portion 160 has an electrostatic diffusion layer 180 formed on the surface 162. The electrostatic diffusion layer 180 may cover at least a portion of the surface 162, or it may cover the entire surface. That is, an example of the protective portion 160 may be composed of an internal structure of insulating or conductive material and a coating layer of electrostatic diffusion material formed on the surface of the internal structure. This configuration can also be applied to the nozzle portion 150 and the frame 110.

[0105] The electrostatic diffusion layer 180 is, for example, a film (coating) made of an electrostatic diffusion coating. By applying the electrostatic diffusion coating to the surface 162 of the protective portion 160 and drying it, a dried film of the electrostatic diffusion coating, i.e., the electrostatic diffusion layer 180, is formed. By using the coating, the electrostatic diffusion layer 180 can be formed relatively uniformly and stably on the surface 162 of the protective portion 160, which has various shapes.

[0106] Furthermore, the grid shape of the protective part 160 is not particularly limited as long as it is the same shape as the front end 132 of the covering electrode 130. For example, it can be a radial pattern, a grid pattern, a slit pattern, a cross pattern, a concentric circle pattern, a plain weave, a twill weave, a twisted weave, a herringbone twill weave, or other fabric patterns. This can alleviate the induced charging phenomenon from the discharge electrode.

[0107] Alternatively, the ionizer 100 can be electrically connected to the cover. This can more effectively mitigate the phenomenon of induced charging.

[0108] Furthermore, in this embodiment, when the ionizer 100 has multiple electrodes 130, the ionizer 100 can also be configured to have at least a first electrode, a second electrode, a first cover covering the first electrode, and a second cover covering the second electrode, with the first cover and the second cover electrically connected. This allows for more efficient mitigation of induced charging phenomena.

[0109] The frame 110 can be grounded, or the cover (or port 150 and / or protective part 160) can be electrically connected to the grounded frame 110. This can more effectively mitigate induced charging.

[0110] The de-energizing device of this embodiment is applicable not only to the bar ionizer 100, but also to other ionizers. Figure 6 , Figure 7 It is a diagram schematically representing the structure of other ionizers.

[0111] Figure 6 (a) indicates a box-type ionizer 200. The ionizer 200 has an electrode 230, a wiring section 270 that supplies power to the electrode 230 from a high-voltage power supply 220, a frame 210 that houses the electrode 230 and the wiring section 270, and an orifice member 260 that covers at least a portion of the electrode 230.

[0112] Figure 6 (b) indicates a pistol-type ionizer 300. The ionizer 300 has an electrode 330, a wiring portion 370 that supplies power to the electrode 330 from a high-voltage power supply 320, a frame 310 that houses the electrode 330 and the wiring portion 370, a nozzle portion 360 that covers at least a portion of the electrode 330, and a handle portion 312 that serves as a handle for the operator.

[0113] Figure 6 (c) indicates a pen-type ionizer 400. The ionizer 400 has an electrode 430, a wiring section 470 that supplies power to the electrode 430 from a high-voltage power supply 420, a frame 410 that houses the electrode 430 and the wiring section 470, a port member 460 that covers at least a portion of the electrode 430, and a switch section 412 that serves as a trigger for ion emission from the electrode 430.

[0114] Figure 6 (d) indicates a nozzle-type ionizer 500. The ionizer 500 includes: an electrode 530, a wiring portion 570 that supplies power to the electrode 530 from a high-voltage power supply 520, a frame 510 that houses the electrode 530 and the wiring portion 570, a nozzle member 560 that covers at least a portion of the electrode 530, and a freely deformable tube portion 512.

[0115] Figure 7 This indicates an ionizer 600 of the blower (air supply) type. Figure 7 middle, Figure 7 (a) is a side view. Figure 7 (b) is a front view. The ionizer 600 has: a plurality of electrodes 630, a support portion 632 supporting the electrodes 630, a wiring portion 670 supplying power to the electrodes 630 from a high-voltage power supply 520, a frame 610 accommodating the electrodes 630 and the wiring portion 670, a ring portion 660 covering at least a portion of the front of the electrodes 630, and a fan portion 680 disposed behind the electrodes 630 and supplying air from the electrodes 630 to the ring portion 660.

[0116] Ionizers 200, 300, 400, 500, and 600 each have a port component 260, a port portion 360, a port portion 460, a port portion 560, and a ring portion 660, which serve as caps. These caps and frames can adopt the same configuration as the caps and frames of ionizer 100.

[0117] In this ionizer, similar to ionizer 100, the phenomenon of induced charging can also be mitigated.

[0118] The electronic device of this embodiment can be used on-site in the manufacturing and assembly processes of electrical components, electronic devices, and other objects that are not subject to electricity.

[0119] Furthermore, the electronic device of this embodiment can be used near or inside the equipment used in the pre-processing and post-processing steps of semiconductor manufacturing processes.

[0120] Examples of equipment used in semiconductor manufacturing processes include, for example, wire bonding equipment, chip bonding equipment, CVD, PVD, transport equipment (silicon wafers), IC testing machines, aging equipment, dicing equipment, polishing equipment, SMT equipment, LCD substrate cutting equipment, transport equipment (LCD substrates), and other LCD-related equipment.

[0121] One method for manufacturing an electronic device according to this embodiment is a method for manufacturing an electronic device having electrical components, a wiring section that supplies high-voltage power to the electrical components, and a frame that houses the electrical components and the wiring section, and used near an object to remove electrical charge. This method includes: an assembly step, using a surface resistivity of 10... 4 Ω / □ or more and 10 11 A cover with a resistance of Ω / □ or less and covering at least a portion of the electrical components, and a surface resistivity of 10. 4 Ω / □ or more and 10 11 At least one of the frames of Ω / □ or below is used to assemble the constituent parts of an electronic device, thereby obtaining an electronic device.

[0122] By assembling electronic devices using components with appropriate surface resistivity, it is possible to mitigate the induced charging phenomenon caused by nearby objects that are not subject to static electricity when using the electronic devices.

[0123] Furthermore, the manufacturing method of the electronic device according to this embodiment may also include a film forming process, wherein in at least one of the frame and the cover, a film forming process is performed on the surface of an insulating or conductive resin layer having a surface resistivity of 10. 4 Ω / □ or more and 10 11 A film composed of an electrostatically diffusing coating with a capacitance of Ω / □ or less. This reduces the induced voltage generated in the object W during electrostatic removal.

[0124] One method for assembling the current-removing device according to this embodiment includes: forming a surface resistivity of 10 on the surface of the cover portion such as the nozzle portion and the protective portion. 4 Ω / □ or more and 10 11 The process of forming an electrostatic diffusion layer of Ω / □ or less; and the process of installing a cover with the electrostatic diffusion layer formed thereon onto the static eliminator. This improves the ability to suppress electrostatic induction in the static eliminator.

[0125] In addition, the assembly process may include the process of removing the cover from the electrostatic discharge device. This allows each component to be replaced.

[0126] The electrostatic diffusion layer can be formed using the methods described above, or by applying an electrostatic diffusion coating. This improves workability and ease of maintenance.

[0127] In this embodiment, the cover (orifice, protective part, ring, etc.) is used for a static electricity removal device, specifically for an ionizer, and is configured such that its surface resistivity is 10. 4 Ω / □ or more and 10 11 Ω / □ or less. The cover can have a laminated structure as described above.

[0128] The following is a summary description of the electrostatic diffusion material of this embodiment.

[0129] According to the electrostatic diffusion material of this embodiment, the surface resistivity of the constituent parts of electronic components and electronic devices can be appropriately controlled, thus providing electronic components and electronic devices with excellent inductive charge resistance.

[0130] Among these, it can alleviate the induced charging phenomenon generated during the removal of static electricity using ionizers. Therefore, electrostatically diffusing materials are suitable for electronic components, electronic devices, and their manufacturing and assembly processes that require higher levels of induced voltage.

[0131] In this specification, a surface resistivity greater than 10 is considered. 11 The case of Ω / □ is defined as insulation, and 10 4 Ω / □ or more and 10 11 The value below Ω / □ is defined as electrostatic diffusion, and is less than 10. 4 The case of Ω / □ is defined as electrical conductivity.

[0132] Electrostatic diffusion materials can be molding materials used to form components of electronic parts and electronic devices, or coatings, films, etc., applied to the surface of components of electronic parts and electronic devices.

[0133] Molding materials can be molded using common molding methods such as injection molding, compression molding, insert molding, and two-color molding to form molded products that are part of or the whole of the components.

[0134] That is, the molded article can be made of electrostatic diffusing material alone, or it can be configured as a laminated structure having at least an electrostatic diffusing molding layer made of electrostatic diffusing material laminated on the surface of an insulating layer or a conductive layer.

[0135] In addition, coatings can form an electrostatically diffusing coating film on the surface of insulating or conductive components in the constituent parts by methods such as coating on the surface of the constituent parts.

[0136] In addition, the membrane material can form an electrostatic diffusion film on the surface of insulating or conductive components in the constituent parts by means of chemical and / or physical bonding on the surface of the constituent parts.

[0137] The surface resistivity of electrostatically diffusing layers such as electrostatically diffusing molding layers, electrostatically diffusing coatings, and electrostatically diffusing films in a layered structure is, for example, 10. 4 ~10 11 Ω / □, preferably 10 4 ~10 10 Ω / □, more preferably 10 5 ~10 9 The Ω / □ method constitutes an electrostatically diffusing material.

[0138] The surface resistivity of the electrostatically diffusing layer in a multilayer structure can be changed based on the resistance values ​​of the insulating and conductive layers that serve as the base layer.

[0139] As an example of an insulating layer, an ABS resin layer is used; as an example of a conductive layer, an SUS board is used. Using the surface resistivity of the electrostatic diffusion layer when they are used as base layers as a criterion, the resistance value of the electrostatic diffusion material is appropriately adjusted, thereby enabling the surface resistivity of the electrostatic diffusion layer in the laminated structure to be set within the desired range.

[0140] The composition of electrostatic diffusion materials will be explained below.

[0141] (Conductive component)

[0142] Electrostatically diffusing materials include conductive components.

[0143] Examples of conductive components include conductive resins. Conductive resins can be conductive resins made by using conductive additives as materials to impart functionality to polymer materials, or conductive polymers in which the resin itself is conductive.

[0144] The resistivity of the conductive resin is preferably 10 ohms. 4 ~10 10 Ω, more preferably 10 5 ~10 9 Ω.

[0145] For electrostatically diffusing materials, when used in molding materials, coatings, film materials, etc., commonly used components may also be included as needed.

[0146] Electrostatically diffusing molding materials may include conductive components and resin components such as thermoplastic resins and / or thermosetting resins. As an example of a method for manufacturing electrostatically diffusing molding materials, conductive components can be mixed into the resin components using methods such as compounding.

[0147] Electrostatic diffusion coatings may include conductive components and binder components. In addition to the above components, the coating may also include various additives and solvents.

[0148] The resistivity of the electrostatic diffusion coating after film formation is preferably 10. 4 ~10 10 Ω, more preferably 10 5 ~10 9 Ω.

[0149] (Adhesive components)

[0150] As an example of an adhesive component, adhesive resins can be used. Specifically, examples include synthetic resins such as polyurethane resins, polyester resins, (meth)acrylic resins, vinyl acetate resins, epoxy resins, fluororesins, phenolic resins, silicone resins, and amino alkyd resins, as well as other synthetic resins and natural resins. These can be used alone or in combination of two or more.

[0151] The adhesive component enables the coating to adhere to the substrate. Furthermore, as an adhesive component, one can choose an adhesive component with physical properties suitable for the application environment, or one that can be dispersed by additives.

[0152] In addition, the preferred adhesive resin is a polymer conductive material that is conductive in itself.

[0153] It is believed that, compared with coatings using adhesive resins as insulators, coatings using polymer conductive materials are formed in a state where conductive regions are more uniformly mixed in insulating regions from a microscopic perspective. Therefore, it is possible to improve adhesion, suppress deviations in conductivity in the coating, and form a stable electrostatic diffusion layer.

[0154] In addition, by using polymer conductive materials, the content ratio of additives can be adjusted to be lower as needed.

[0155] (additive)

[0156] Additives can be used to control the state of coatings or to impart film-forming properties.

[0157] Examples of additives include conductive additives, silicone-based additives, and silica powder, but the materials that can be added are not limited to these. These can be used alone or in combination of two or more.

[0158] Conductive additives can adjust the conductivity of a coating film. The material and amount of conductive additive are selected based on the target resistance value and the binder composition. Examples of conductive additives include, in addition to carbon-based, metal-based, metal oxide-based, and metal oxide film-based powdered or fibrous materials, ionic conductivity imparting materials and antistatic agents. These can be used as monomers or in combination, and their composition and materials are not limited.

[0159] Silicone-based additives can improve leveling and wetting properties.

[0160] Silica powder can impart thickening and matte finish.

[0161] (solvent)

[0162] Solvents used include those capable of dissolving or dispersing adhesive components and additives.

[0163] From an environmental performance perspective, water and ethanol are preferred solvents. Most organic solvents have high solubility for adhesive components, allowing for a wide range of adhesive component choices. Furthermore, from a coating performance perspective, organic solvents that improve adhesion to the substrate can also be selected.

[0164] Furthermore, the electrostatic diffusion coating can also be configured to be substantially free of carbon black. This suppresses particle generation, thus enabling the use of the electronic device of this embodiment in cleanrooms and semiconductor manufacturing processes.

[0165] In the ionizer of electronic devices, the surface of the cover can be coated with carbon black using a coating film made of an electrostatically diffusing paint. By configuring the coating film near the discharge electrode where corona discharge occurs to be carbon black-free, the generation of particles and dust can be further suppressed. It is also possible to configure the coating film on not only the cover but also the surface of the frame to be free of conductive particles such as carbon black. In electrostatically diffusing paints that are substantially free of conductive particles, polymer conductive materials can be used as the conductive component.

[0166] Depending on the requirements, electrostatically diffusing coatings may include pigments and / or dyes. This improves the operator's visual visibility by enabling the coloring of areas with electrostatic diffusivity, thereby enhancing the operability of electronic devices. The color can, for example, be a different color from that of the adhesive components such as insulating adhesive resins. Black is generally considered to be conductive and can be used, but is not limited to this.

[0167] (Antistatic agent)

[0168] In addition, antistatic agents can be used as electrostatic diffusion coatings.

[0169] By applying an antistatic agent to the surface of the component, antistatic properties can be easily imparted, and the surface resistivity of the surface can be appropriately controlled.

[0170] Typically, antistatic agents have weak adhesion to the substrate and may peel off due to friction or solvents such as water. However, they provide antistatic properties with each application, making maintenance easy. Furthermore, in environments where friction is minimal and solvents are not present, antistatic agents can maintain their antistatic properties for a longer period.

[0171] (Coating method)

[0172] For the application method of electrostatic diffusion coatings, there are no limitations as long as a coating film is formed, and known methods can be selected according to the type and shape of the substrate. Examples of such coating methods include brushing, dipping, spraying, and gravure printing.

[0173] The embodiments of the present invention have been described above, but these are merely examples, and various structures other than those described can be employed. Furthermore, the present invention is not limited to the embodiments described above, and modifications and alterations within the scope of achieving the objectives of the present invention are included in the present invention.

[0174] Below is an example of the reference method.

[0175] 1. An electronic device used near an object to be electrified, comprising:

[0176] Electrical components;

[0177] The wiring section provides high-voltage power to the electrical components; and

[0178] The frame houses the electrical components and the wiring section.

[0179] The electronic device has a cover that covers at least a portion of the electrical components, and the surface resistivity of the cover is 10. 4 Ω / □ or more and 10 11 The structure with a resistance of Ω / □ or less and the surface resistivity of the frame are 10. 4 Ω / □ or more and 10 11 At least one of the following configurations: Ω / □.

[0180] 2. The electronic device as described in 1,

[0181] At least one of the frame and the cover has:

[0182] Insulating or conductive layers; and

[0183] The surface resistivity formed on at least a portion of the surface of the layer is 10.4 Ω / □ or more and 10 11 Electrostatic diffusion layer with an Ω / □ or less.

[0184] 3. The electronic device as described in 2,

[0185] The electrostatic diffusion layer is composed of a film made of electrostatic diffusion coating.

[0186] 4. The electronic device as described in 3,

[0187] The electrostatic diffusion coating includes conductive components and adhesive components.

[0188] 5. The electronic device as described in any one of 1 to 4,

[0189] The high-voltage power supply has an AC generation circuit.

[0190] 6. The electronic device as described in any one of 1 to 5,

[0191] The surface resistivity of the cover is 10. 4 Ω / □ or more and 10 9 Compositions of Ω / □ and below.

[0192] 7. The electronic device as described in any one of 1 to 6,

[0193] When the surface resistivity of the frame is set as A and the surface resistivity of the cover is set as B, A and B satisfy 10. 3 / 10 12 ≤A / B<1.

[0194] 8. The electronic device as described in any one of 1 to 7,

[0195] The electrical components include electrodes that generate corona discharge or glow discharge.

[0196] 9. The electronic device as described in 8,

[0197] The cover has a cover structure covering the periphery of the electrode and / or a cover structure covering the front end of the electrode, the surface resistivity of the cover structure being 10. 4 Ω / □ or more and 10 11 Below Ω / □.

[0198] 10. The electronic device as described in 9,

[0199] It has at least a first electrode, a second electrode, a first cover portion covering the first electrode, and a second cover portion covering the second electrode.

[0200] The first cover portion and the second cover portion are electrically connected.

[0201] 11. The electronic device as described in any one of 8 to 10,

[0202] It has: a cylindrical opening portion disposed in the frame, configured to cover the periphery of the electrode; and

[0203] The protective part is detachably mounted to the cylindrical opening and is configured to cover at least the front end of the electrode.

[0204] The cover is composed of the cylindrical opening and the protective portion.

[0205] 12. The electronic device as described in 11,

[0206] The frame is electrically connected to the cover.

[0207] 13. The electronic device as described in any one of 1 to 12,

[0208] The frame is in a grounded state.

[0209] 14. The electronic device as described in any one of 1 to 13,

[0210] The object to be removed from electricity is an electronic component or electronic device, which is used on-site during the manufacturing and assembly process of the object.

[0211] 15. A method of manufacturing an electronic device, the electronic device having electrical components, wiring portion for supplying high-voltage power to the electrical components, and a frame housing the electrical components and the wiring portion and for use near an object to be de-energized, the manufacturing method comprising:

[0212] The assembly process uses materials with a surface resistivity of 10. 4 Ω / □ or more and 10 11 A cover with a resistance of Ω / □ or less, covering at least a portion of the electrical component, and a surface resistivity of 10. 4 Ω / □ or more and 10 11 At least one of the frames of Ω / □ and below is used to assemble the constituent components of the electronic device to obtain the electronic device.

[0213] 16. The method of manufacturing the electronic device as described in 15,

[0214] Includes: a film forming process, wherein in at least one of the frame and the cover, a layer with a surface resistivity of 10 is formed on the surface of an insulating or conductive layer. 4 Ω / □ or more and 10 11 A film composed of electrostatically diffusing coatings with an Ω / □ or lower.

[0215] Example

[0216] The present invention will now be described in detail with reference to embodiments, but the present invention is not limited to any of the embodiments described herein.

[0217] <Preparation of Electrostatic Diffusion Coatings>

[0218] (Manufacturing Example A)

[0219] 100 parts by weight of polyurethane resin (manufactured by Dainissei Chemical Co., Ltd., trade name: Resamine ME-44LP) as a binder, 3.5 parts by weight of Ketjen Black (manufactured by Lion Special Chemicals Co., Ltd., trade name: Ketjen Black EC-300J) as a conductive additive, 150 parts by weight of dimethylformamide as a solvent, and 500 parts by weight of methyl ethyl ketone were added and mixed to obtain electrostatic diffusion coating A.

[0220] The obtained electrostatic diffusion coating A was applied to an ABS resin sheet component using an air spray gun, forming a film on its surface with a dried thickness of 10 μm. The film was then dried in an oven at 60°C for 1 hour to obtain the electrostatic diffusion layer A.

[0221] The surface resistivity of electrostatically diffusive layer A was measured using the following method under controlled conditions of 22.5℃±10% temperature and 50%RH±5℃ humidity. The result showed a value of 1.0×10⁻⁶. 5 The value of (Ω / □).

[0222] For the method of measuring surface resistivity, a surface resistivity meter as defined by the IEC 613405-1, 5-2 standard (suitable for ESD standards associations) will be used, and the value measured using a CR probe or a 2P probe will be used as the surface resistivity (Ω / □).

[0223] (Manufacturing Example B)

[0224] After adding 100 parts by weight of polyurethane resin (manufactured by DIC Corporation, trade name CRYSBON ASPU-112) as a binder, 13 parts by weight of white conductive filler (manufactured by Otsuka Chemical Co., Ltd., trade name: Dentool WK-200B) as a conductive additive, and 750 parts by weight of isopropanol as a solvent, the mixture was stirred to obtain electrostatic diffusion coating B.

[0225] The obtained electrostatic diffusion coating B was applied to an ABS resin sheet component using an air spray gun, forming a film on its surface with a dried thickness of 10 μm. The film was then dried in an oven at 60°C for 2 hours to obtain the electrostatic diffusion layer B.

[0226] The surface resistivity of electrostatic diffusion layer B was measured in the same manner as that of electrostatic diffusion layer A, under controlled conditions of temperature 22.5℃±10% and humidity 50%RH±5℃. The results showed a value of 1.0×10⁻⁶. 6 The value of (Ω / □).

[0227] <Determination of induced voltage in an object without electricity>

[0228] Figure 1 A schematic diagram showing the connection of the measuring equipment in the measuring system 10.

[0229] Figure 2 An equivalent circuit diagram showing the relationship between the electrostatic capacitances of the various parts in the measurement system 10 is shown.

[0230] This Figure 1 The measurement system 10 is capable of measuring the induced voltage in the object W to be de-electrode by the ionizer 100 due to de-electrode.

[0231] The specific steps for measuring the induced voltage (1) to (3) are as follows.

[0232] (1) Figure 1 Preparation of the measurement system 10 shown

[0233] □ Use 150mm metal plates 22, 24, and 26 respectively to form a three-section structure in an insulated state, and prepare a capacitor voltage divider live board 20.

[0234] The metal plates 24 and 26 of the capacitor voltage divider charged plate 20 are connected to the electrometer 40 (KEITHLEY, 6517A) via a triple coaxial cable 30 (TEKTRONIX, 237-ALG-2). The analog OUT terminal of the electrometer 40 is connected to the monitor 50 (TEKTRONIX, TDS503B oscilloscope) via a cable.

[0235] An ionizer 100 is used as one of the current removal devices with a high-voltage power supply E. The ionizer 100 is positioned at a measured distance D above the metal plate 22, which is located at the top of the capacitive voltage divider charged plate 20.

[0236] Figure 1 In this context, G represents ground. Figure 1 Equivalent circuit diagram of measurement system 10 Figure 2 The capacitance is measured using a capacitance meter.

[0237] (2) V in capacitor voltage divider type live plate 20 out Calculation of partial pressure ratio (C2 / C1)

[0238] Figure 3This is a diagram used to illustrate the method for measuring induced voltage.

[0239] Electrically connect the voltage source E, the capacitor voltage divider charged plate 20 (similar to that in (1) above), and the electrometer 40 to prepare... Figure 3 The measurement system 12 shown. Figure 3 In this context, G represents grounding.

[0240] In the measuring system 12, a DC voltage source E calibrated to E0 (V) is connected to the metal plate 22, and the metal plate 24 is connected to the electrometer 40.

[0241] Here, the electrostatic capacitance between metal plates 22 and 24 is designated as C1, the electrostatic capacitance between metal plates 24 and 26 is designated as C2, and the output voltage measured by electrometer 40 is designated as V. out .

[0242] The connection circuit in the measuring system 12 satisfies equation 1: V out = [C1 / (C1+C2)]×E0.

[0243] Transforming equation 1, we obtain equation 2: C2 / C1=(E0 / V out According to Equation 2, the partial pressure ratio P defined by C2 / C1 can be calculated.

[0244] According to Equation 2, using Figure 3 The measuring system 12 measures V out According to the obtained V out The partial pressure ratio P is calculated from the measured value.

[0245] It should be noted that the combined capacitance Ci = (C1 × C2 / (C1 + C2)) observed from voltage source E is not within the range of 20pF ± 2pF; C1 is 20.4pF and C2 is 460pF. The capacitance was measured using a capacitance meter.

[0246] (3) Calculation of electrostatic voltage

[0247] By Figure 3 The voltage source E in the middle is replaced with the specified ionizer 100, for in Figure 1 The electrostatic induction voltage V in the uppermost metal plate 22 ei By combining the partial pressure ratio P obtained in (2) above with Figure 1 V measured in out The induced voltage V is calculated by accumulating the values. ei According to equation 3: V ei = Partial voltage ratio P × V out Find the answer.

[0248] The following measurements were conducted using the ionizers and environmental conditions shown in Examples 1-4. Figure 1V in out Using V out The induced voltage V is calculated according to equation 3. ei .

[0249] <Comparative Example>

[0250] (Experimental Example 1)

[0251] Under the conditions of temperature: 24℃, humidity: 38%RH, measurement distance D: 100mm, and air pressure: no wind, the measurements were performed according to the steps (1) to (3) above. Figure 1 V in the measurement system 10 out Find the induced voltage V in the uppermost metal plate 22 due to electrostatic induction. ei .

[0252] Will Figure 1 A schematic diagram of the structure of the ionizer 100 used in the measurement system 12 is shown in Figure 4 .

[0253] Figure 4 This is a cross-sectional view schematically showing the structure of the ionizer 100 used.

[0254] The ionizer (AC corona discharge method) used in Experiment Example 1 has a high-voltage power supply 120 (AC high-voltage power supply, output voltage: 10kV) housed in an ABS resin frame 110. 0-p ) and 10 electrodes 130 (tungsten discharge needles, electrode length: 600mm, electrode spacing: 250mm). Figure 5 yes Figure 4 A magnified view of the α region. (See image below.) Figure 5 As shown, an electrode 130 is disposed inside the tube of the ABS resin nozzle 150, and an ABS resin protective part 160 (nozzle protector) is installed at the front end of the nozzle 150 as a cover.

[0255] The induced voltage V in Experiment Example 1 ei 294V p-p .

[0256] It should be noted that the surface resistivity of the ABS resin frame 110, the nozzle 150, and the protective part 160 is 10 Ω·cm. 16 Ω / □.

[0257] <Example>

[0258] (Experimental Example 2)

[0259] In addition to Figure 4 The surface 112 of the frame 110 and Figure 5On the entire surface 152 of the nozzle 150, an electrostatic diffusion coating A is applied using an air spray gun to form a film with a dried thickness of 10 μm. The film is then dried in an oven at 60°C for 1 hour. Outside the ionizer forming the electrostatic diffusion layer A, the induced voltage V is calculated, similar to in Experimental Example 1. ei .

[0260] The induced voltage V in Experiment Example 1 ei 162V p-p .

[0261] (Experimental Example 3)

[0262] In addition to using the one with Figure 4 The surface 112 of the frame 110 and Figure 5 On the entire surface 152 of the nozzle 150, an electrostatic diffusion coating A is applied using an air spray gun to form a coating film with a dried thickness of 10 μm. This film is then dried in an oven at 60°C for 1 hour, forming the electrostatic diffusion layer A. Figure 5 On the entire surface 162 of the protective part 160, an electrostatic diffusion coating B is applied using an air spray gun to form a film with a thickness of 10 μm after drying. The film is then dried in an oven at 60°C for 2 hours, forming the electrostatic diffusion layer B. Apart from the ionizer where the electrostatic diffusion layer A on the frame 110 and the electrostatic diffusion layer B on the protective part 160 are electrically connected to ground using wiring, similar to Experimental Example 1, the induced voltage V is calculated. ei .

[0263] The induced voltage V in Experiment Example 1 ei 52V p-p .

[0264] (Experimental Example 4)

[0265] Except that the measurement distance D was set to 300 mm, the induced voltage V was calculated in the same manner as in Experiment 3. ei .

[0266] The induced voltage V in Experiment Example 1 ei 22V p-p .

[0267] By using the ionizers (electrostatic removal devices) of Experimental Examples 2 to 4 as examples, compared with Experimental Example 1 as a comparative example, it was shown that the induced voltage generated by the electrostatic induction of the object to be electrostatically removed due to the ionizer can be reduced.

[0268] Furthermore, it can be seen that in each of Experimental Examples 2 to 4, even when the surface resistivity of the protective part 160 is changed to 10... 4 Ω / □、105 Ω / □、10 7 Ω / □、10 8 Ω / □、10 9 In any case of Ω / □, compared with Experimental Example 1, it is possible to reduce the induced voltage of the object to be de-electrolyzed due to the electrostatic induction of the ionizer.

[0269] Furthermore, it can be seen that in the bar-type ionizer 100 (voltage-applied static eliminator) used in Experimental Examples 2 to 4, even if the electrode length is changed to 350 mm, 1600 mm, or 3100 mm, the electrode is changed to a silicon discharge needle, or the power supply specification is changed to DC, the induced voltage generated by the static eliminator on the target object can be reduced compared to Experimental Example 1, where the electrode length specification is changed to the same condition.

[0270] Furthermore, examples are prepared for box-type ionizers, gun-type ionizers, pen-type ionizers, or nozzle-type ionizers having a built-in electrostatic removal electrode and an ABS resin nozzle covering the front end of the electrode, including examples where an electrostatic diffusion layer B is formed on the surface of the nozzle and examples where an electrostatic diffusion layer B is not formed on the surface of the nozzle. It is evident that for ionizers with an electrostatic diffusion layer B, compared to cases where an electrostatic diffusion layer B is not formed on the surface of the nozzle, the induced voltage generated in the object to be electrostatically removed due to electrostatic induction by the ionizer can be reduced.

[0271] Examples are prepared for an air-blowing ionizer having a built-in electrostatic discharge electrode, an ABS resin front ring positioned in front of the electrode, and a fan positioned behind it. One example shows that an electrostatic diffusion layer B is formed on the surface of the front ring, and the other example shows that an electrostatic diffusion layer B is not formed on the surface of the front ring. It is known that for an air-blowing ionizer with an electrostatic diffusion layer, compared to the case where no electrostatic diffusion layer B is formed on the surface of the front ring, the induced voltage generated on the object to be charged due to electrostatic induction by the ionizer can be reduced.

[0272] The ionizer or other de-energizing device in the embodiment can mitigate the induced charging phenomenon generated during de-energization in electronic components, electronic devices, etc., that are present in the vicinity of the object to be de-energized during the manufacturing and assembly processes of the object to be de-energized.

[0273] This application claims priority based on Japanese Patent Application No. 2020-104857, filed on June 17, 2020, the entire contents of which are incorporated herein by reference.

[0274] Explanation of reference numerals in the attached figures

[0275] 10 Measurement System

[0276] 12 Measurement System

[0277] 20 Capacitor Voltage Divider Type Electric Board

[0278] 22, 24, 26 metal plates

[0279] 30 Triple coaxial cable

[0280] 40 Electrometer

[0281] 50 monitors

[0282] 100 Ionizer (Electrostatic Remover)

[0283] 110 Frame

[0284] 112 Surface

[0285] 120V high voltage power supply

[0286] 130 electrode

[0287] 132 Frontend

[0288] 134 Opening

[0289] 140 ions

[0290] 150 nozzle section

[0291] 152 Surface

[0292] 160 Protection Department

[0293] 162 surface

[0294] 170 Cabling Department

[0295] 180 Electrostatic Diffusion Layer

[0296] 190 Hole

[0297] 200 ionizer

[0298] 210 Frame

[0299] 220V high voltage power supply

[0300] 230 electrode

[0301] 260 nozzle components

[0302] 270 Cabling Department

[0303] 300 Ionizer

[0304] 310 frame

[0305] 312 Handle

[0306] 320V high voltage power supply

[0307] 330 electrode

[0308] 360° nozzle

[0309] 370 Cabling Department

[0310] 400 Ionizer

[0311] 410 Frame

[0312] 412 Switch section

[0313] 420V high voltage power supply

[0314] 430 electrode

[0315] 460 nozzle

[0316] 470 Cabling Department

[0317] 500 Ionizer

[0318] 510 frame

[0319] 512 Management Department

[0320] 520 High Voltage Power Supply

[0321] 530 electrode

[0322] 560 Pipe Nozzle

[0323] 570 Cabling Department

[0324] 600 Ionizer

[0325] 610 frame

[0326] 620 High Voltage Power Supply

[0327] 630 electrode

[0328] 632 Support Section

[0329] 660 Ring Section

[0330] 670 Cabling Department

[0331] 680 Fan Section

[0332] E Voltage Source

[0333] W - Electrostatic Discharge Object

Claims

1. An electronic device used in the vicinity of an object to be discharged, wherein An electronic device comprising: an electric component; a wiring portion that supplies electric power from a high-voltage power supply to the electric component; and a housing that houses the electric component and the wiring portion, the cover portion is provided to the housing, The electronic device has at least a portion covering the electrical components and has a surface resistivity of 10. 4 Ω / □ or more and 10 11 The cap portion with a resistivity of Ω / □ or less and a surface resistivity of 10 4 Ω / □ or more and 10 11 The frame described below Ω / □, 2. The electronic device according to claim 1, wherein When the surface resistivity of the frame is set to A and the surface resistivity of the cover portion is set to B, A and B satisfy 10 3 / 10 12 ≤ A / B < 1. at least one of the housing and the cover portion has: an insulating or conductive layer; and 3. The electronic device according to claim 2, wherein The surface resistivity of at least a part of the surface of the layer is 10 4 Ω / □ or more and 10 11 Ω / □ or less. the electrostatic diffusion layer is composed of a film composed of an electrostatic diffusion paint.

4. The electronic device according to claim 3, wherein the electrostatic diffusion paint includes a conductive component and a binder component.

5. The electronic device according to claim 1 or 2, wherein the high-voltage power supply has an alternating current generation circuit.

6. The electronic device according to claim 1 or 2, wherein 7. The electronic device according to claim 1 or 2, wherein The surface resistivity of the cover portion is 10 4 Ω / □ or more and 10 9 Ω / □ or less. the electric component includes an electrode that generates corona discharge or an electrode that generates glow discharge.

8. The electronic device according to claim 7, wherein the electronic device is an electronic device in the cover structure. The cover portion has a surface resistivity of 10 4 Ω / □ or more and 10 11 Ω / □ or less 4 Ω / □ or more and 10 11 Ω / □ or less 9. The electronic device according to claim 7, wherein at least a first electrode, a second electrode, a first cover portion that covers the first electrode, and a second cover portion that covers the second electrode are provided, the first cover portion and the second cover portion are electrically connected.

10. The electronic device according to claim 7, wherein a tubular port portion that is provided to the housing and that covers a periphery of the electrode is provided, and a protection portion that is freely attachable and detachable to the tubular port portion and that covers at least a front end of the electrode is provided, the cover portion is composed of the tubular port portion and the protection portion.

11. The electronic device according to claim 10, wherein the housing and the cover portion are electrically connected.

12. The electronic device according to claim 1 or 2, wherein the housing is grounded.

13. The electronic device according to claim 1 or 2, wherein the electrically charged object is an electronic component or an electronic device, and the electronic device is used on site in a manufacturing and assembly process of the electrically charged object. the manufacturing method includes:

14. A manufacturing method of an electronic device having an electrical component, a wiring portion that supplies electric power of a high voltage power source to the electrical component, and a frame that accommodates the electrical component and the wiring portion, the electronic device being used in the vicinity of a de-electrifying object, wherein 15. The manufacturing method of the electronic device according to claim 14, wherein Assembling process, using a frame having a surface resistivity of 10 4 Ω / □ or more and 10 11 Ω / □ or less and a cover portion covering at least a portion of the electrical component, and a surface resistivity of the cover portion being 10 4 Ω / □ or more and 10 11 Ω / □ or less, assembling the constituent components of the electronic device, thereby obtaining the electronic device, such that when a surface resistivity of the frame is A and a surface resistivity of the cover portion is B, A and B satisfy 10 3 / 10 12 ≤ A / B < 1. ​ includes: A film formation step of forming a film composed of an electrostatically diffusive paint having a surface resistivity of 10 4 Ω / □ or more and 10 11 Ω / □ or less on a surface of at least one of the layer of insulation or the layer of electrical conduction in the frame and the cover.

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