Masking device

Abstract

This application relates to a masking device, comprising: a first mask having multiple vapor deposition zones and a partition zone between the multiple vapor deposition zones, each vapor deposition zone having a vapor deposition opening; and a second mask disposed on one side of the first mask along its thickness direction, the second mask having a shielding portion and multiple shaping openings formed on the shielding portion, each shaping opening corresponding to one of the vapor deposition zones; wherein, along the thickness direction, the orthographic projection of the shielding portion covers at least a portion of the vapor deposition openings. The masking device provided in this application can meet the vapor deposition requirements of irregularly shaped areas, while alleviating the problem of severe vapor deposition spots affecting the display effect.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a mask device. Background Technology

[0002] Organic light-emitting diodes (OLEDs) have gradually become the mainstream in the display field due to their low power consumption, high color saturation, and wide viewing angle.

[0003] OLED display panels typically use photomasks to deposit film materials. As display technology continues to develop, the requirements for the shape of display panels vary, and there are often some irregular areas. If the shape requirements of irregular areas are achieved by changing the distribution or shape of the evaporation openings on the photomask, there will be serious problems with evaporation spots, which will affect the display effect. Summary of the Invention

[0004] This application provides a masking device that can meet the vapor deposition requirements of irregularly shaped areas and alleviate the problem of vapor deposition spots severely affecting the display effect.

[0005] On one hand, according to an embodiment of this application, a masking device is proposed, comprising: a first mask having a plurality of vapor deposition zones and a partition zone located between the plurality of vapor deposition zones, wherein each vapor deposition zone is provided with a vapor deposition opening; and a second mask disposed on one side of the first mask in its thickness direction, the second mask having a shielding portion and a plurality of shaping openings formed on the shielding portion, each shaping opening being provided corresponding to one of the vapor deposition zones; wherein, along the thickness direction, the orthographic projection of the shielding portion covers at least a portion of the vapor deposition opening.

[0006] According to one aspect of the present application, the shielding portion includes a first shielding ring and a second shielding ring disposed around the shaping opening. The second shielding ring is connected to the outer periphery of the first shielding ring away from the shaping opening and is disposed around the first shielding ring. Along the thickness direction, the first shielding ring is provided with a buffer cut facing the first mask plate, and the first shielding ring is disposed to cover at least a portion of the vapor deposition opening.

[0007] According to one aspect of the embodiments of this application, along the thickness direction, the end face of the first shielding ring facing away from the first mask plate and the end face of the second shielding ring facing away from the first mask plate are flush with each other, and the end face of the first shielding ring facing the first mask plate and the end face of the second shielding ring facing the first mask plate are spaced apart to form a buffer cut.

[0008] According to one aspect of the embodiments of this application, along the thickness direction, the end face of the first shielding ring facing the first mask plate is an inclined surface, and the thickness dimension of the side where the first shielding ring and the second shielding ring are connected is greater than the thickness dimension of the side of the first shielding ring facing the shaping opening.

[0009] According to one aspect of the embodiments of this application, the thickness dimension of the first shielding ring at each location is greater than one-third of the thickness dimension of the second shielding ring and less than the thickness dimension of the second shielding ring.

[0010] According to one aspect of the embodiments of this application, the shielding part further includes a third shielding ring surrounding the shaping opening. The third shielding ring is connected to the outer periphery of the second shielding ring away from the first shielding ring and is disposed around the second shielding ring. The third shielding ring is provided with a weight reduction slit.

[0011] According to one aspect of the embodiments of this application, along the thickness direction, the end face of the third shielding ring opposite to the first mask plate is recessed and forms a weight reduction cut on the side where the first mask plate is located.

[0012] According to one aspect of the embodiments of this application, along the thickness direction, the end face of the third shielding ring facing the first mask plate and the end face of the second shielding ring facing the first mask plate are flush with each other, and the end face of the third shielding ring away from the first mask plate and the end face of the second shielding ring away from the first mask plate have a height difference.

[0013] According to one aspect of the embodiments of this application, along the thickness direction, the thickness dimension of the third shielding ring is greater than one-third and less than two-thirds of the thickness dimension of the second shielding ring.

[0014] According to one aspect of the embodiments of this application, the partition region includes a thickness equal portion and a stress relief portion, the thickness equal portion being disposed near the shaping opening, and the stress relief portion being provided with a first notch.

[0015] According to one aspect of the embodiments of this application, the first mask plate further has a reinforcing region, the vapor deposition region is spaced apart from the edge of the first mask plate and forms the reinforcing region, the reinforcing region being formed between the vapor deposition region and the edge of the first mask plate.

[0016] According to one aspect of the embodiments of this application, the minimum distance between the vapor deposition area and the edge of the first mask plate ranges from 0.5mm to 1mm.

[0017] According to one aspect of the embodiments of this application, the number of vapor deposition openings in each vapor deposition zone is multiple, the vapor deposition openings are strip-shaped holes extending along a first direction, and the multiple vapor deposition openings in the same vapor deposition zone are distributed at intervals along a second direction, with the first direction and the second direction intersecting each other.

[0018] According to one aspect of the embodiments of this application, the length dimensions of each vapor deposition opening are the same along a first direction.

[0019] According to one aspect of the embodiments of this application, the shielding portion covers the end of the vapor deposition opening in a first direction.

[0020] According to one aspect of the embodiments of this application, the number of vapor deposition openings in each vapor deposition zone is multiple, and the vapor deposition openings are circular, elliptical or polygonal. In the same vapor deposition zone, two or more vapor deposition openings are distributed at intervals along a first direction, and two or more vapor deposition openings are distributed at intervals along a second direction. The first direction and the second direction are intersecting.

[0021] According to one aspect of the embodiments of this application, the orthographic projection of the shaped opening along the thickness direction is one of a circle, an ellipse, an oval, a teardrop shape, or a polygon with a rounded transition at the apex.

[0022] According to one aspect of the embodiments of this application, the masking device further includes a mask frame, and a first mask plate and a second mask plate are respectively connected to the mask frame.

[0023] According to one aspect of the embodiments of this application, along the thickness direction, the orthographic projection area of ​​the second mask is larger than the orthographic projection area of ​​the first mask, and there are multiple first masks, which are sequentially spliced ​​together and respectively connected to the mask frame.

[0024] The masking apparatus provided according to the embodiments of this application includes a first mask and a second mask. The first mask has multiple vapor deposition areas and a partition area located between the multiple vapor deposition areas. Each vapor deposition area is provided with a vapor deposition opening for forming a vapor deposition pattern of a corresponding shape. The second mask is disposed on one side of the first mask in its thickness direction. The second mask has a blocking portion and multiple shaped openings formed on the blocking portion. Each shaped opening is corresponding to one of the vapor deposition areas. Along the thickness direction, the orthogonal projection of the blocking portion covers at least a portion of the vapor deposition opening, so that when a predetermined material is vapor deposited into each vapor deposition opening of the vapor deposition area, the area corresponding to the covered vapor deposition opening can be blocked by the blocking portion. By setting the shape of the shaped opening to match the shape of the irregular area, the vapor deposition requirements can be guaranteed without changing the distribution or shape of the vapor deposition openings at the corresponding positions of the irregular area, thus alleviating the problem of vapor deposition spots severely affecting the display effect. Attached Figure Description

[0025] The features, advantages, and technical effects of exemplary embodiments of this application will now be described with reference to the accompanying drawings.

[0026] Figure 1 This is a schematic diagram of the structure of a mask device according to an embodiment of this application;

[0027] Figure 2 This is a schematic diagram of the structure of the first mask plate according to an embodiment of this application;

[0028] Figure 3 This is a schematic diagram of the structure of the second mask plate according to an embodiment of this application;

[0029] Figure 4 This is a partial structural schematic diagram of the enclosure and shaping opening position in the second mask plate according to an embodiment of this application;

[0030] Figure 5 yes Figure 4 A cross-sectional view along the AA direction;

[0031] Figure 6 This is a partial structural diagram of the enclosure and shaping opening position in the second mask plate according to another embodiment of this application;

[0032] Figure 7 yes Figure 6 A cross-sectional view along the BB direction;

[0033] Figure 8 This is a simulation analysis diagram of a mask device according to an embodiment of this application;

[0034] Figure 9 This is a schematic diagram of the structure of the first mask plate according to another embodiment of this application;

[0035] Figure 10 This is a schematic diagram of the structure of the second mask plate according to another embodiment of this application.

[0036] in:

[0037] 10-First mask; 11-Vapor deposition area; 111-Vapor deposition opening; 12-Separation area; 121-Equal thickness section; 122-Stress relief section; 122a-First notch; 13-Reinforcement area;

[0038] 20 - Second mask plate; 21 - First shielding ring; 211 - Buffer cut; 212 - Inclined surface; 22 - Second shielding ring; 23 - Third shielding ring; 231 - Weight reduction cut; 24 - Shaping opening; 25 - Shielding part;

[0039] 30 - Mask frame;

[0040] X - Thickness direction; Y - First direction; Z - Second direction.

[0041] In the accompanying drawings, the same parts use the same reference numerals. The drawings are not drawn to scale. Detailed Implementation

[0042] The features and exemplary embodiments of various aspects of this application will now be described in detail. Numerous specific details are set forth in the following detailed description to provide a comprehensive understanding of this application. However, it will be apparent to those skilled in the art that this application can be implemented without requiring some of these specific details. The following description of embodiments is merely intended to provide a better understanding of this application by illustrating examples. In the accompanying drawings and the following description, at least some well-known structures and techniques are not shown to avoid unnecessarily obscuring the application; and, for clarity, the dimensions of some structures may be exaggerated. Furthermore, the features, structures, or characteristics described below can be combined in any suitable manner in one or more embodiments.

[0043] The directional terms used in the following description refer to the directions shown in the figures and are not intended to limit the specific structure of the mask device of this application. It should also be noted in the description of this application that, unless otherwise explicitly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0044] With the continuous development of display technology, the demand for display panel performance is constantly increasing. Organic Light-Emitting Diode (OLED) has gradually become the mainstream in the display field due to its low power consumption, high color saturation, and wide viewing angle. OLED display panels typically use photomasks to deposit film layers. As display technology continues to evolve, the shape requirements for display panels vary, often resulting in irregularly shaped areas. If the shape requirements of these irregular areas are met by changing the distribution or shape of the evaporation openings on the photomask, the photomask is prone to wrinkles. This leads to severe evaporation spots in the finished display panel, negatively impacting the display quality.

[0045] Based on this, the present application provides a new mask device that can meet the vapor deposition requirements of irregular areas and alleviate the problem of vapor deposition spots severely affecting the display effect.

[0046] like Figures 1 to 3As shown, the masking apparatus provided in this application embodiment includes a first mask plate 10 and a second mask plate 20. The first mask plate 10 has a plurality of vapor deposition areas 11 and a partition area 12 located between the plurality of vapor deposition areas 11. Each vapor deposition area 11 is provided with a vapor deposition opening 111. The second mask plate 20 is disposed on one side of the first mask plate 10 in its thickness direction X. The second mask plate 20 has a blocking portion 25 and a plurality of shaping openings 24 formed on the blocking portion 25. Each shaping opening 24 is correspondingly disposed to one of the vapor deposition areas 11. In the thickness direction X, the orthographic projection of the blocking portion 25 covers at least a portion of the vapor deposition opening 111.

[0047] The number of vapor deposition areas 11 included on the first mask plate 10 can be two, three or even more. Multiple vapor deposition areas 11 can be distributed at intervals along the same direction on the first mask plate 10, or they can be distributed in an array.

[0048] The second mask 20 and the first mask 10 can be distributed at intervals in the thickness direction X. The number of shaping openings 24 on the second shielding part 25 can be multiple, and each shaping opening 24 is arranged opposite to one of the vapor deposition areas 11.

[0049] In the thickness direction X, the orthogonal projection of the shielding portion 25 can cover at least a portion of one vapor deposition opening 111, and of course, it can also cover at least a portion of multiple vapor deposition openings 111.

[0050] The masking apparatus provided in this application includes a first mask plate 10 and a second mask plate 20. The first mask plate 10 has a plurality of vapor deposition areas 11 and a partition area 12 located between the plurality of vapor deposition areas 11. Each vapor deposition area 11 is provided with a vapor deposition opening 111 for forming a vapor deposition pattern of a corresponding shape. The second mask 20 is disposed on one side of the first mask 10 in its thickness direction X. The second mask 20 has a shielding portion 25 and a plurality of shaping openings 24 formed on the shielding portion 25. Each shaping opening 24 is correspondingly disposed to one of the vapor deposition areas 11. Along the thickness direction X, the orthogonal projection of the shielding portion 25 covers at least a portion of the vapor deposition opening 111. This allows the shielding portion 25 to shield the corresponding area of ​​the covered vapor deposition opening 111 when a predetermined material is vapor deposited into each vapor deposition opening 111 of the vapor deposition area 11. By setting the shape of the shaping opening 24 to match the shape of the irregular area, the vapor deposition requirements can be guaranteed without changing the distribution or shape of the vapor deposition opening 111 at the corresponding position of the irregular area. This reduces the probability of wrinkles appearing in the mask device and alleviates the problem of vapor deposition spots seriously affecting the display effect.

[0051] Please refer to the following: Figures 1 to 5As shown, in some optional embodiments, the masking device provided in this application includes a shielding portion 25 comprising a first shielding ring 21 and a second shielding ring 22 disposed around the shaping opening 24. The second shielding ring 22 is connected to the outer periphery of the first shielding ring 21 away from the shaping opening 24 and is disposed around the first shielding ring 21. Along the thickness direction X, the first shielding ring 21 is provided with a buffer cutout 211 facing the first mask plate 10. The first shielding ring 21 covers at least a portion of the vapor deposition opening 111.

[0052] The masking apparatus provided in this application embodiment includes a shielding portion 25 comprising a first shielding ring 21 and a second shielding ring 22 surrounding the shaping opening 24. The second shielding ring 22 is designed to facilitate bonding with other components, such as a glass plate, ensuring the fixed position and stability of the second shielding ring 22 and improving the vapor deposition yield of the product. Furthermore, along the thickness direction X, the first shielding ring 21 has a buffer cutout 211 facing the first mask plate 10, and the first shielding ring 21 covers at least a portion of the vapor deposition opening 111. The buffer cutout 211 can be used to store wrinkles generated on the first mask plate 10, resulting in a smaller overall wrinkle amount in the masking apparatus, preventing the vapor deposition pattern formed in the corresponding area of ​​the shaping opening 24 from being affected by wrinkles, and improving the vapor deposition yield.

[0053] In some alternative embodiments, along the thickness direction X, the end face aa of the first shielding ring 21 facing away from the first mask plate 10 and the end face bb of the second shielding ring 22 facing away from the first mask plate 10 are flush with each other, and the end face cc of the first shielding ring 21 facing the first mask plate 10 and the end face dd of the second shielding ring 22 facing the first mask plate 10 are spaced apart to form a buffer cut 211.

[0054] The masking device provided in this application embodiment, by making the end face aa of the first shielding ring 21 facing away from the first mask plate 10 and the end face bb of the second shielding ring 22 facing away from the first mask plate 10 flush with each other, can ensure the total thickness requirement of the masking device and the depth requirement of the buffer cut 211, while ensuring the docking area between the first shielding ring 21 and the second shielding ring 22, improving the connection strength between the first shielding ring 21 and the second shielding ring 22, thereby improving the overall safety and stability of the masking device. Furthermore, this arrangement allows the size of the buffer cut 211 to be maximized when the maximum thickness value of the second mask plate 20 is fixed, increasing the storage capacity of the wrinkles of the first mask plate 10 and ensuring the evaporation yield.

[0055] As some optional embodiments, in the mask device provided in this application embodiment, the end face cc of the first shielding ring 21 facing the first mask plate 10 is an inclined surface along the thickness direction X, and the thickness dimension of the side of the first shielding ring 21 connected to the second shielding ring 22 is greater than the thickness dimension of the side of the first shielding ring 21 facing the shaping opening 24.

[0056] The masking device provided in this embodiment has an inclined surface on the end face cc of the first masking ring 21 facing the first mask plate 10, and the thickness of the side of the first masking ring 21 connected to the second masking ring 22 is greater than the thickness of the side of the first masking ring 21 facing the shaping opening 24. This configuration allows the cleaning solution to slide off the inclined surface during cleaning, preventing solution residue. This ensures the cleaning requirements of the masking device are met while preventing damage to the masking device due to long-term solution residue and avoiding impact on the quality of the vapor deposition pattern during the vapor deposition process.

[0057] In some optional embodiments, the masking device provided in this application has a thickness dimension of the first shielding ring 21 that is greater than one-third of the thickness dimension of the second shielding ring 22 and less than the thickness dimension of the second shielding ring 22.

[0058] Optionally, the second shielding ring 22 can be a ring-shaped structure of equal thickness.

[0059] The masking device provided in this embodiment facilitates the formation of the buffer cut 211 and ensures the storage of wrinkles by making the thickness of the first shielding ring 21 at each point greater than one-third of the thickness of the second shielding ring 22 and less than the thickness of the second shielding ring 22. Simultaneously, it ensures that the thickness of the first shielding ring 21 is moderate, guaranteeing its length requirements and the need to hold and cover the first mask plate 10.

[0060] like Figure 6 as well as Figure 7 As shown, in some optional embodiments, the masking device provided in this application embodiment further includes a third shielding ring 23 surrounding the shaping opening 24. The third shielding ring 23 is connected to the outer periphery of the second shielding ring 22 away from the first shielding ring 21 and is disposed around the second shielding ring 22. The third shielding ring 23 is provided with a weight reduction cut 231.

[0061] By setting a third shielding ring 23, the contact area between the second shielding ring 22 and other components, such as glass plates, can be increased, ensuring the position and stability of the second shielding ring 22 and improving the evaporation yield of the product.

[0062] Optionally, the weight-reducing cutout 231 can be formed on the third shielding ring 23 by removing material, thereby reducing the weight of the third shielding ring 23. In some optional embodiments, the weight-reducing cutout 231 may include a through hole extending along the thickness direction X, a blind hole extending along the thickness direction X, or a groove, etc.

[0063] In some alternative embodiments, the masking device provided in this application has a third shielding ring 23 recessed on the side facing away from the first mask plate 10 along the thickness direction X, forming a weight reduction cut 231.

[0064] The weight reduction cut 231 can be opened only on the side away from the first mask plate 10. Of course, this is an optional implementation. In some embodiments, the weight reduction cut 231 can also be opened on both the side away from the first mask plate 10 and the side away from the first shielding ring 21. That is to say, weight reduction can be achieved by reducing the thickness of the third shielding ring 23.

[0065] The masking device provided in this application embodiment has a weight reduction cutout 231 formed by recessing the end of the third shielding ring 23 facing away from the first mask plate 10 to the side where the first mask plate 10 is located. This not only meets the weight reduction requirement, but also effectively ensures the contact area between the third shielding ring 23 and the glass plate and other structures, thereby improving the overall stability of the masking device.

[0066] In some optional embodiments, the masking device provided in this application has the end face ff of the third blocking ring 23 facing the first mask plate 10 and the end face dd of the second blocking ring 22 facing the first mask plate 10 flush with each other along the thickness direction X, and the end face ee of the third blocking ring 23 away from the first mask plate 10 and the end face bb of the second blocking ring 22 away from the first mask plate 10 have a height difference.

[0067] In other words, along the thickness direction X, the thickness of the third shielding ring 23 is less than the thickness of the second shielding ring 22.

[0068] The masking device provided in this application embodiment ensures that, along the thickness direction X, the end face ff of the third shielding ring 23 facing the first mask plate 10 and the end face dd of the second shielding ring 22 facing the first mask plate 10 are flush. This guarantees that, during use, the second shielding ring 22 and the third shielding ring 23 can simultaneously abut against a structure such as a glass plate, avoiding insufficient contact area with the glass plate due to a height difference between them. Furthermore, this arrangement, while ensuring the total thickness requirement of the masking device and the depth requirement of the weight-reducing cut 231, guarantees the mating area between the second shielding ring 22 and the third shielding ring 23, improving the connection strength between the second shielding ring 22 and the third shielding ring 23, thereby enhancing the overall safety and stability of the masking device.

[0069] In some alternative embodiments, the masking device provided in this application has a thickness dimension of the third shielding ring 23 along the thickness direction X that is less than two-thirds of the thickness dimension of the second shielding ring 22.

[0070] The masking device provided in this application embodiment improves the stability of the masking device during operation by making the thickness dimension of the third shielding ring 23 along the thickness direction X less than two-thirds of the thickness dimension of the second shielding ring 22, while ensuring the weight requirements of the masking device, reducing material usage, and lowering costs.

[0071] In some alternative embodiments, the masking device provided in this application can have a third shielding ring 23 of uniform thickness along the thickness direction X, which can both ensure weight reduction requirements and facilitate processing.

[0072] Continue reading Figures 1 to 7 As shown, as some optional embodiments, the mask device provided in this application embodiment includes a separation region 12 including a thickness equalization portion 121 and a stress relief portion 122. The thickness equalization portion 121 is disposed near the shaping opening 24, and the stress relief portion 122 is provided with a first notch 122a.

[0073] The mask device provided in this embodiment of the application, by setting a partition region 12, can interrupt two adjacent vapor deposition regions 11, avoiding the risk of wire entanglement between the two adjacent vapor deposition regions 11 during the cleaning process caused by the setting of the vapor deposition opening 111. At the same time, by making the partition region 12 include a portion of equal thickness 121 and a stress relief portion 122, it avoids deformation and other phenomena caused by a large strength difference between the vapor deposition region 11 and the partition region 12, and the stress relief portion 122 can release stress, improving the safety performance of the mask device during use and cleaning.

[0074] In some optional embodiments, the mask device provided in this application has multiple first notches 122a, which are spaced apart from each other, and the stress relief section 122 is generally in the form of a mesh structure. This configuration reduces the strength difference between the vapor deposition zone 11 and the separation zone 12, while also ensuring uniform strength across the stress relief section 122, guaranteeing uniform load-bearing capacity, and reducing the probability of wire entanglement and deformation.

[0075] In some alternative embodiments, the mask device provided in this application may have a solid plate-shaped structure for the equal thickness portion 121, which can separate two adjacent vapor deposition areas 11 and provide sufficient support for the vapor deposition area 11 to prevent deformation or internal wire entanglement.

[0076] In some optional embodiments, the mask apparatus provided in this application provides that the first mask plate 10 further has a reinforcing region 13, and the vapor deposition region 11 is spaced apart from the edge of the first mask plate 10, wherein the reinforcing region 13 is formed between the vapor deposition region 11 and the edge of the first mask plate 10.

[0077] By setting the reinforcement zone 13, the strength of the edge area of ​​the vapor deposition zone 11 near the first mask plate 10 can be guaranteed, avoiding the risk of wire entanglement between two adjacent first mask plates 10 and improving safety performance.

[0078] In some optional embodiments, the minimum distance D between the edge of the vapor deposition area 11 and the first mask plate 10 is any value between 0.5mm and 1mm, including two extreme values ​​of 0.5mm and 1mm, and can be any value between 0.6mm and 0.9mm. For example, 0.7mm, 0.8mm, etc. can be used.

[0079] The mask device provided in this application embodiment allows the minimum distance between the edge of the vapor deposition area 11 and the first mask plate 10 to be any value between 0.5mm and 1mm, which can reserve space for the reinforcement area 13, facilitate the setting of the reinforcement area 13, and effectively reduce the risk of wire entanglement between two adjacent second mask plates 20.

[0080] In some optional embodiments, the mask device provided in the above embodiments of this application has a plurality of vapor deposition openings 111 in each vapor deposition zone 11. The vapor deposition openings 111 are strip-shaped holes extending along the first direction Y. The plurality of vapor deposition openings 111 in the same vapor deposition zone 11 are distributed at intervals along the second direction Z. The first direction Y and the second direction Z are intersected.

[0081] The mask device provided in this application embodiment, through the above-described configuration, can not only ensure the requirements of the vapor deposition pattern, but also increase the opening size of the mask device, thereby ensuring the aperture ratio of the display panel formed by vapor deposition using this mask as a shield.

[0082] Furthermore, the above configuration allows the masking device to be used when the first and second sub-pixels are in the same column or row, and the third sub-pixel is in a separate column or row. The first, second, and third sub-pixels can be red, green, or blue sub-pixels. When the third sub-pixel is blue, the formed display panel can reduce the color fringing effect while increasing the pixel aperture ratio.

[0083] In some optional embodiments, the mask device provided in this application has the same length dimension for each vapor deposition opening 111 along the first direction Y.

[0084] This application provides a masking device in which the length of each vapor deposition opening 111 is the same along the first direction Y.

[0085] like Figure 8As shown, aa represents the wrinkle amplitude curve of the first mask in the thickness direction when the length of the upper vapor deposition opening 111 in the first direction is the same. bb represents the wrinkle amplitude curve of the first mask in the thickness direction when the length of the upper vapor deposition opening 111 in the first direction is not the same. Simulation analysis shows that, compared with curve aa, curve bb, i.e., compared with the case where the length of the vapor deposition opening 111 in the first direction Y is the same, shows more peaks and troughs, and larger peak and trough float values, which is not conducive to vapor deposition bonding. However, the mask device provided in this embodiment shows fewer peaks and troughs, and smaller peak and trough float values, which is conducive to vapor deposition bonding, as indicated by the simulation result curve aa.

[0086] In some optional embodiments, the masking device provided in this application has a shielding portion 25 covering the end of the evaporation opening 111 in the first direction Y. This arrangement ensures sufficient storage capacity for wrinkles, resulting in fewer wrinkles overall in the masking device, better adhesion to the glass plate, and improved evaporation yield.

[0087] It is understood that the vapor deposition opening 111 is a strip-shaped hole extending along the first direction Y. Multiple vapor deposition openings 111 in the same vapor deposition area 11 are distributed at intervals along the second direction Z. The intersection of the first direction Y and the second direction Z is only an optional implementation method, but is not limited to the above method.

[0088] like Figure 9 As shown, in some embodiments, the mask device provided in this application has multiple evaporation openings 111 in each evaporation zone 11. The evaporation openings 111 are circular, elliptical, or polygonal. In the same evaporation zone 11, two or more evaporation openings 111 are distributed at intervals along the first direction Y and two or more evaporation openings 111 are distributed at intervals along the second direction Z. The first direction Y and the second direction Z are intersected.

[0089] With the above settings, it can also cooperate with the second mask 20 to meet the vapor deposition requirements and alleviate the problem of vapor deposition spots seriously affecting the display effect.

[0090] In some alternative embodiments, the mask device provided in this application has an orthographic projection of the shaped opening 24 along the thickness direction X, which is one of a circle, an ellipse, an oval, a teardrop shape, or a polygon with a rounded corner.

[0091] For example, such as Figures 2 to 5 As shown, the orthographic projection of the shaped opening 24 can be oval. Of course, this is one optional embodiment; in some embodiments, such as... Figure 10 As shown, the orthographic projection of the shaped opening 24 can also be elliptical.

[0092] By adopting the above-described shape for the shaping opening 24, the different display shapes of the display panel can be met, thereby improving the versatility of the mask device.

[0093] Continue reading Figure 1 As shown, in some optional embodiments, the masking device provided in this application further includes a mask frame 30, with the first mask plate 10 and the second mask plate 20 respectively connected to the mask frame 30.

[0094] The mask device provided in this application embodiment, by setting a mask frame 30 and defining the connection relationship between the first mask plate 10, the second mask plate 20 and the mask frame 30, can ensure that the relative positions of the first mask plate 10 and the second mask plate 20 are fixed, and at the same time facilitate the alignment of the first mask plate 10, the second mask plate 20 and the area to be vaporized 11, so as to meet the vapor deposition requirements of the display panel.

[0095] Optionally, the mask frame 30 can adopt a hollow polygonal frame structure, for example, a rectangular frame structure.

[0096] Optionally, each second mask 20 may correspond to one first mask 10. Of course, each second mask 20 may also correspond to two or more first masks 10.

[0097] Optionally, the first mask plate 10 and the second mask plate 20 can be connected to the mask frame 30 by welding or other means to ensure the connection strength requirements with the mask frame 30.

[0098] In some optional embodiments, the mask device provided in this application has a second mask plate 20 with a larger projected area than the first mask plate 10 along the thickness direction X. There are multiple first mask plates 10, which are sequentially spliced ​​together and connected to the mask frame 30 respectively.

[0099] Optionally, each second mask 20 may correspond to two or more first masks 10.

[0100] The mask device provided in this application embodiment, by setting multiple first mask plates 10, when the structure of the second mask plate 20 is large, allows multiple first mask plates 10 to be processed separately and then spliced, reducing the overall processing difficulty of the mask device, and ensuring the processing accuracy of the evaporation opening 111 in each evaporation zone 11, thereby improving the evaporation yield.

[0101] In some optional embodiments, the masking device provided in this application may have a first mask plate 10 with a strip-shaped structure, and two or more first mask plates 10 may be successively arranged and spliced ​​together along the same direction. This facilitates processing and reduces the size of the seams.

[0102] As some optional embodiments, the mask device provided in this application can be connected by welding between the first mask plate 10, the second mask plate 20 and the mask frame 30, or by fastening with fasteners, as long as the relative positions of the three can be fixed.

[0103] Although this application has been described with reference to preferred embodiments, various modifications can be made thereto and components can be replaced with equivalents without departing from the scope of this application. In particular, the technical features mentioned in the various embodiments can be combined in any manner, provided there is no structural conflict. This application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A masking device, characterized in that, include: The first mask has multiple vapor deposition zones and a partition zone located between the multiple vapor deposition zones. Each vapor deposition zone is provided with a vapor deposition opening. The first mask also has a reinforcing zone. The vapor deposition zones are spaced apart from the edge of the first mask. The reinforcing zone is formed between the vapor deposition zones and the edge of the first mask. The second mask is disposed on one side of the first mask in its own thickness direction. The second mask has a blocking portion and a plurality of shaping openings formed on the blocking portion. Each shaping opening is disposed corresponding to one of the vapor deposition areas. Wherein, along the thickness direction, the orthographic projection of the shielding portion covers at least a portion of the vapor deposition opening. The shielding portion includes a first shielding ring and a second shielding ring arranged around the shaping opening. The second shielding ring is connected to the outer peripheral side of the first shielding ring opposite to the shaping opening and is arranged around the first shielding ring. The shielding portion also includes a third shielding ring surrounding the shaping opening. The third shielding ring is connected to the outer peripheral side of the second shielding ring opposite to the first shielding ring and is arranged around the second shielding ring. The third shielding ring is provided with a weight reduction slit. Along the thickness direction, the first shielding ring is provided with a buffer cut facing the first mask plate, and the first shielding ring is provided to cover at least a portion of the vapor deposition opening; along the thickness direction, the end face of the first shielding ring away from the first mask plate and the end face of the second shielding ring away from the first mask plate are flush with each other, and the end face of the first shielding ring facing the first mask plate and the end face of the second shielding ring facing the first mask plate are spaced apart to form the buffer cut.

2. The masking device according to claim 1, characterized in that, Along the thickness direction, the end face of the first shielding ring facing the first mask plate is an inclined surface, and the thickness dimension of the side of the first shielding ring connected to the second shielding ring is greater than the thickness dimension of the side of the first shielding ring facing the shaping opening.

3. The masking device according to claim 2, characterized in that, The thickness of the first shielding ring at each point is greater than one-third of the thickness of the second shielding ring but less than the thickness of the second shielding ring.

4. The masking device according to claim 1, characterized in that, Along the thickness direction, the third shielding ring is recessed on the side opposite to the first mask plate and forms the weight reduction cut.

5. The masking device according to claim 4, characterized in that, Along the thickness direction, the end face of the third shielding ring facing the first mask plate is flush with the end face of the second shielding ring facing the first mask plate, and there is a height difference between the end face of the third shielding ring facing away from the first mask plate and the end face of the second shielding ring facing away from the first mask plate.

6. The masking device according to claim 4, characterized in that, Along the thickness direction, the thickness of the third shielding ring is greater than one-third and less than two-thirds of the thickness of the second shielding ring.

7. The masking device according to claim 1, characterized in that, The dividing area includes a uniform thickness portion and a stress relief portion. The uniform thickness portion is located near the shaping opening, and the stress relief portion has a first notch.

8. The masking device according to claim 1, characterized in that, The minimum distance between the vapor deposition area and the edge of the first mask plate ranges from 0.5mm to 1mm.

9. The masking device according to any one of claims 1 to 8, characterized in that, The number of vapor deposition openings in each vapor deposition zone is multiple. Each vapor deposition opening is a strip-shaped hole extending along a first direction. Multiple vapor deposition openings in the same vapor deposition zone are distributed at intervals along a second direction, and the first direction and the second direction are intersected.

10. The masking device according to claim 9, characterized in that, Along the first direction, the length of each of the vapor deposition openings is the same.

11. The masking device according to claim 9, characterized in that, The shielding portion covers the end of the vapor deposition opening in the first direction.

12. The masking device according to claim 9, characterized in that, The number of vapor deposition openings in each vapor deposition zone is multiple. The vapor deposition openings are circular, elliptical, or polygonal. In the same vapor deposition zone, two or more vapor deposition openings are distributed at intervals along the first direction and two or more vapor deposition openings are distributed at intervals along the second direction. The first direction and the second direction are intersected.

13. The masking device according to any one of claims 1 to 8, characterized in that, Along the thickness direction, the orthographic projection of the shaped opening is one of a circle, an ellipse, an oval, a teardrop shape, or a polygon with a rounded corner.

14. The masking device according to any one of claims 1 to 8, characterized in that, The masking device further includes a mask frame, and the first mask plate and the second mask plate are respectively connected to the mask frame.

15. The masking device according to claim 14, characterized in that, Along the thickness direction, the projected area of ​​the second mask is larger than the projected area of ​​the first mask. There are multiple first masks, which are sequentially spliced ​​together and connected to the mask frame respectively.

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