Automated wire harness provisioning system and method

Abstract

An automatic wire harness assembly system for assembling a wire lead for a wiring connector includes a terminal delivery system configured to obtain a target terminal from among a plurality of different types of terminals for the wire lead, and a crimp press including a plurality of dies and configured to: obtain a wire having an exposed portion where an insulating portion of the wire has been removed, receive the target terminal from the terminal delivery system, engage a target die of the plurality of dies corresponding to the type of the target terminal, and crimp the target terminal to the exposed portion of the wire using the target die of the plurality of dies to assemble the wire lead.

Description

[0001] Cross-reference to related applications

[0002] This PCT application claims the benefits of U.S. Provisional Application No. 62 / 990,190, filed March 16, 2020, and U.S. Provisional Application No. 63 / 081,104, filed September 21, 2020. The disclosures of the above applications are incorporated herein by reference in their entirety. Technical Field

[0003] This disclosure generally relates to conductor matching, and more specifically, to automatic conductor matching systems and methods. Background Technology

[0004] Wire mating is a process in which wires are obtained, a portion of the insulation is stripped from the wires, and terminals are crimped onto the exposed portions of the wires to form wire leads. Wiring connectors or harnesses typically consist of multiple wire leads whose terminals are inserted into and secured within the corresponding terminal portions of the connector. During the assembly of wire connectors, human or robotic assemblers typically follow a set of instructions (wire diagrams, computer-executable instructions, etc.) to search for containers or bins of wire leads to identify the target wire lead, which is then installed by the assembler into the corresponding target terminal portion of the connector. This process can be expensive and time-consuming. Therefore, while these conventional wire mating systems and methods perform well for their intended purposes, opportunities for improvement remain in the related technology.

[0005] The background description provided herein is for the purpose of presenting the general context of this disclosure. The work of the currently designated inventors within the scope described in this background section, and the description which is not otherwise considered prior art at the time of filing, are neither explicitly nor implicitly acknowledged as prior art to this disclosure. Summary of the Invention

[0006] According to one aspect of this disclosure, an automated wire mating system for assembling wire leads for wiring connectors is provided. In one exemplary embodiment, the automated wire mating system includes: a plurality of terminal containers, each storing terminals of different types for wire leads; a first transport system configured to collect target terminals from target terminal containers of the plurality of terminal containers; and a second transport system configured to receive target terminals from the first transport system and deliver the target terminals to a crimping press, wherein the crimping press is configured to crimp the target terminals onto exposed portions of the wires to assemble the wire leads.

[0007] In some embodiments, the first transport system includes a first gripping device having first opposing gripping members configured to grip a target terminal and control movement of the target terminal. In some embodiments, the first gripping device or a separate sensor system is configured to identify opposing target gripping points on the target terminal and movably close the first opposing gripping members at the opposing target gripping points on the target terminal to control movement of the target terminal from the target terminal container. In some embodiments, the automated wire fitting system further includes a cutting system configured to cut different types of terminals stored in multiple terminal containers from corresponding carrier strips.

[0008] In some embodiments, the first gripping device is further configured to translate along a first axis parallel to the plurality of terminal containers to control the movement of target terminals from the target terminal containers, and to translate along a second axis perpendicular to the first axis to deliver and transfer the target terminals to a second transport system. In some embodiments, the second transport system includes a second gripping device having second opposing gripping members configured to grip and control the movement of the target terminals from the first gripping device. In some embodiments, the second gripping device is arranged approximately 180 degrees relative to the first gripping device.

[0009] In some embodiments, the second gripping device is further configured to translate along a second axis to control the movement of the target terminal from the first gripping device, and to translate along at least the second axis to deliver the target terminal to the crimping pressing portion. In some embodiments, the second gripping device is configured to control the movement of the target terminal from the first gripping device at a first position behind the crimping pressing portion, and to translate along at least the second axis to a second position in front of the crimping pressing portion.

[0010] According to another aspect of this disclosure, an automated wire mating method for assembling wire leads for wiring connectors is provided. In one exemplary embodiment, the automated wire mating method includes: storing different types of terminals for wires in each of a plurality of terminal containers; obtaining movable control of a target terminal from a target terminal container of the plurality of terminal containers via a first transport system; delivering the target terminal to a second transport system via the first transport system; obtaining movable control of the target terminal from the first transport system via the second transport system; and delivering the target terminal to a crimping press via the second transport system, wherein the crimping press is configured to crimp the target terminal onto an exposed portion of the wire to assemble the wire lead.

[0011] In some embodiments, the first transport system includes a first gripping device having first opposing gripping members configured to grip a target terminal and control the movement of the target terminal. In some embodiments, the automated wire-fitting method further includes identifying opposing target gripping points on the target terminal via the first gripping device or a separate sensor system, and controlling the movement of the target terminal from a target terminal container by movably closing the first opposing gripping members at the opposing target gripping points on the target terminal via the first gripping device. In some embodiments, the automated wire-fitting method further includes cutting different types of terminals stored in multiple terminal containers from corresponding carrier strips using a cutting system.

[0012] In some embodiments, the automated lead fitting method further includes translating a first gripping device along a first axis parallel to a plurality of terminal containers to control the movement of target terminals from the target terminal containers, and translating the first gripping device along a second axis perpendicular to the first axis to deliver and transfer the target terminals to a second transport system. In some embodiments, the second transport system includes a second gripping device having second opposing gripping members configured to grip and control the movement of the target terminals from the first gripping device. In some embodiments, the second gripping device is arranged approximately 180 degrees relative to the first gripping device.

[0013] In some embodiments, the automated lead fitting method further includes translating along a second axis via a second gripping device to obtain movable control of the target terminal from the first gripping device, and translating along at least a second axis via the second gripping device to deliver the target terminal to the crimping pressing portion. In some embodiments, the automated lead fitting method further includes obtaining movable control of the target terminal from the first gripping device at a first position behind the crimping pressing portion via the second gripping device, and translating along at least a second axis via the second gripping device to a second position in front of the crimping pressing portion.

[0014] According to another aspect of this disclosure, an automated wire mating apparatus for assembling wire leads for wiring connectors is provided. In one exemplary embodiment, the automated wire mating system apparatus includes: a storage device for storing a plurality of different types of terminals for the wire leads; and a transport device for controlling the movement of target terminals from the storage device and delivering the target terminals to a crimping device, wherein the crimping device is a means for crimping the target terminals onto exposed portions of the wires to assemble the wire leads.

[0015] In some embodiments, the transport device includes a first transport device for gripping the target device and controlling the movement of the target terminal from the storage device, and a second transport device for gripping and controlling the movement of the target terminal during delivery from the first transport device and delivering the target terminal to the crimping device.

[0016] According to another aspect of this disclosure, an automated wire mating system for assembling wire leads for wiring connectors is proposed. In one exemplary embodiment, the automated wire mating system includes: a terminal delivery system configured to receive target terminals from a plurality of different types of terminals for wire leads; and a crimping press comprising a plurality of molds, the crimping press being configured to: receive a wire having an exposed portion having its insulation removed; receive the target terminal from the terminal delivery system; engage a target mold from the plurality of molds corresponding to the type of the target terminal; and crimp the target terminal onto the exposed portion of the wire using the target mold from the plurality of molds to assemble the wire leads.

[0017] In some embodiments, multiple molds are arranged in a shuttle system capable of translation along a first axis to position a target mold for engagement. In some embodiments, the pressing unit includes eight molds. In some embodiments, the shuttle system further includes a fixing mechanism to hold any unengaged remaining molds among the multiple molds. In some embodiments, each of the multiple molds is also capable of vertical movement along a second axis perpendicular to the first axis, thereby engaging and disengaging with the target mold. In some embodiments, the pressing unit further includes a wedge mechanism configured to (i) temporarily insert under the bottom portion of the target mold during engagement to increase the rigidity of the target mold during pressing, and (ii) be removed from under the bottom portion of the target mold when disengaging.

[0018] In some embodiments, the target die for engagement receives the target terminal in initially vertically spaced first and second portions. The automated lead mating system further includes a lead delivery system configured to: deliver a lead to a forward portion of a crimping press such that the exposed portion of the lead aligns between the first and second portions of the target terminal; and, in response to the delivery, push the lead downwards such that the exposed portion of the lead engages or approaches the second portion of the target terminal. The crimping press then uses the engaged target die to crimp the target terminal onto the exposed portion of the lead by pressing the first portion of the target terminal downwards onto the exposed portion of the lead and the second portion of the target terminal, thereby obtaining a lead wire. In some embodiments, the crimping press further includes a single load sensor configured to engage with each of a plurality of dies. The single load sensor is configured to measure the crimping force when engaged with the target die as part of a crimping force monitoring (CFM) process.

[0019] In some embodiments, the terminal delivery system includes first and second transport systems disposed behind the crimping press portion. The first transport system is configured to (i) control the movement of a target terminal from a target terminal container in a plurality of terminal containers storing a plurality of different types of terminals, and (ii) deliver the target terminal to the second transport system. The second transport system is configured to (i) control the movement of the target terminal from the first transport system, and (ii) deliver the target terminal to the front portion of the crimping press portion.

[0020] According to another aspect of this disclosure, an automated wire mating method for assembling wire leads for wiring connectors is provided. In one exemplary embodiment, the automated wire mating method includes: obtaining target terminals from a plurality of different types of terminals for wire leads via a terminal delivery system; obtaining a wire having an exposed portion having insulation removed from the wire via a crimping press comprising a plurality of molds; receiving the target terminals from the terminal delivery system via the crimping press; engaging a target mold from the plurality of molds corresponding to the type of the target terminals via the crimping press; and crimping the target terminals onto the exposed portions of the wires using the target molds from the plurality of molds via the crimping press to assemble the wire leads.

[0021] In some embodiments, multiple molds are arranged in a shuttle system capable of translating along a first axis to position a target mold for engagement. In some embodiments, the crimping unit includes eight molds. In some embodiments, the shuttle system further includes a fixing mechanism to hold any unengaged remaining molds among the multiple molds. In some embodiments, each of the multiple molds is also capable of vertical movement along a second axis perpendicular to the first axis, thereby engaging and disengaging with the target mold. In some embodiments, the automated guide mating method further includes: during engagement, temporarily inserting a wedge mechanism under the bottom portion of the target mold via the crimping unit to increase the rigidity of the target mold during crimping; and when disengaging from the target mold, removing the wedge mechanism from under the bottom portion of the target mold via the crimping unit.

[0022] In some embodiments, the engaged target die receives the target terminal in initially vertically spaced first and second portions, and the method further includes delivering a wire to a front portion of the crimping press via a wire delivery system such that the exposed portion of the wire is aligned between the first and second portions of the target terminal, and, in response to the wire delivery, pushing the wire downward via the wire delivery system such that the exposed portion of the wire engages or approaches the second portion of the target terminal, wherein the crimping press then uses the engaged target die to crimp the target terminal onto the exposed portion of the wire by pressing the first portion of the target terminal downward onto the exposed portion of the wire and the second portion of the target terminal to obtain a wire lead. In some embodiments, the automated wire mating method further includes measuring the crimping force via a single load sensor of the crimping press engaged with the target die as part of the CFM process, wherein the single load sensor is configured to engage with each of a plurality of dies.

[0023] In some embodiments, the terminal delivery system includes first and second transport systems arranged behind the crimping pressing portion, and the method further includes: obtaining movable control of a target terminal from a target terminal container in a terminal container storing multiple different types of terminals through the first transport system; delivering the target terminal to a second transport system through the first transport system; obtaining movable control of the target terminal from the first transport system through the second transport system; and delivering the target terminal to the front portion of the crimping pressing portion through the second transport system.

[0024] According to another aspect of this disclosure, an automated wire mating apparatus for assembling wire leads for wiring connectors is provided. In one exemplary embodiment, the automated wire mating apparatus includes: a terminal delivery device for receiving target terminals from a plurality of different types of terminals for wire leads; and a crimping device including a plurality of molds for: receiving a wire with an exposed portion having its insulation removed; receiving a target terminal from the terminal delivery system; engaging a target mold from the plurality of molds corresponding to the type of the target terminal; and crimping the target terminal onto the exposed portion of the wire using the target mold from the plurality of molds to assemble the wire leads.

[0025] In some embodiments, multiple molds are arranged in a shuttle device that translates along a first axis to position a target mold for engagement. In some embodiments,

[0026] According to another aspect of this disclosure, an automated wire mating system for assembling wire leads for wiring connectors is provided. In one exemplary embodiment, the automated wire mating system includes: a wire lead assembly system configured to assemble a plurality of wire leads, each having a conductor and a terminal, the conductor having an exposed portion with its insulation stripped, the terminal being crimped onto the exposed portion; and a wire lead unification system including a base member and a plurality of individual unification devices attached to or defined by the base member, wherein each of the plurality of individual unification devices is configured to receive and temporarily secure one of the plurality of wire leads, wherein the wire lead assembly system is further configured to insert and temporarily secure the plurality of wire leads into the plurality of individual unification devices of the wire lead unification system.

[0027] In some embodiments, the multiple individual assemblies are spring-loaded metal gripping fingers. In some embodiments, the multiple individual assemblies are injection-molded plastic gripping fingers. In some embodiments, the wire lead assembly system is configured to insert and temporarily secure multiple wire leads into the multiple individual assemblies in a predetermined sequence or pattern. In some embodiments, the predetermined sequence or pattern corresponds to a specific installation sequence or pattern, i.e., during assembly, the multiple wire leads are inserted into the corresponding terminal portions of the wiring connector.

[0028] In some embodiments, the wire lead unification system is delivered to a wiring connector assembly station, whereby an assembler inserts multiple wire leads into the corresponding terminal portions of the wiring connector to assemble the connector. In some embodiments, the assembler is a robotic assembler with a set of installation instructions corresponding to a specific installation sequence or pattern. In some embodiments, the assembler is a human assembler. In some embodiments, the specific installation sequence or pattern is from left to right or from right to left.

[0029] According to another aspect of this disclosure, an automated wire mating method for assembling wire leads for wiring connectors is provided. In one exemplary embodiment, the automated wire mating method includes: assembling a plurality of wire leads, each wire lead having a conductor and a terminal, the conductor having an exposed portion with its insulation stripped, the terminal being crimped onto the exposed portion, and inserting and temporarily securing the plurality of wire leads into a plurality of independent sizing devices of a wire lead sizing system, wherein the wire lead sizing system includes a base member and a plurality of independent sizing devices attached to or defined by the base member, wherein each of the plurality of independent sizing devices is configured to receive and temporarily secure one of the plurality of wire leads.

[0030] In some embodiments, the multiple individual unitization devices are spring-loaded metal gripping fingers. In some embodiments, the multiple individual unitization devices are injection-molded plastic gripping fingers. In some embodiments, multiple wire leads are inserted into and temporarily secured in the multiple individual unitization devices by a wire lead assembly system, performed according to a predetermined sequence or pattern. In some embodiments, the predetermined sequence or pattern corresponds to a specific installation sequence or pattern in which the multiple wire leads will be inserted into the corresponding terminal portions of the wiring connector during assembly.

[0031] In some embodiments, the automated wire mating method further includes delivering the wire lead unification system to a wiring connector assembly station, wherein receiving the wire lead unification system enables an assembler to insert multiple wire leads into corresponding terminal portions of the wiring connector to assemble the wiring connector. In some embodiments, the assembler is a robotic assembler with a set of installation instructions corresponding to a specific installation sequence or pattern. In some embodiments, the assembler is a human assembler. In some embodiments, the specific installation sequence or pattern is from left to right or from right to left.

[0032] According to another aspect of this disclosure, an automated wire mating apparatus for assembling wire leads for wiring connectors is provided. In one exemplary embodiment, the automated wire mating apparatus includes: a wire lead assembly apparatus for assembling a plurality of wire leads, each having a conductor and a terminal, the conductor having an exposed portion with its insulation stripped, the terminal being crimped onto the exposed portion; and a wire lead unification apparatus including a base member apparatus and a plurality of individual unification devices attached to or defined by the base member, wherein each of the plurality of individual unification devices is used to receive and temporarily secure one of the plurality of wire leads, wherein a wire lead assembly system is also used to insert and temporarily secure the plurality of wire leads into the plurality of individual unification devices of the wire lead unification apparatus.

[0033] In some implementations, multiple independent, individualized devices are gripping finger devices.

[0034] According to another aspect of this disclosure, an automated wire mating system for assembling wire leads for wiring connectors is provided. In one exemplary embodiment, the automated wire mating system includes: a wire stripping system configured to remove at least a portion of the insulation of a wire to provide an exposed portion of the wire; a seal applicator system including a seal applicator assembly configured to translate along a first axis parallel to the assembly direction of the automated wire mating system to install a target seal near the exposed portion of the wire to obtain a sealed wire; and a seal unification assembly configured to receive target seals from at least one seal hopper, each seal hopper storing a specific type of seal, and to supply the target seals downward along a second axis substantially perpendicular to the first axis to the seal applicator assembly.

[0035] In some embodiments, the seal applicator assembly includes a chuck configured to receive a target seal and further configured to translate along a third axis substantially perpendicular to the first and second axes during installation of the target seal. In some embodiments, the seal unification system is configured to obtain the target seal from at least one seal hopper via a vacuum supply tube.

[0036] In some embodiments, at least one seal hopper includes multiple seal hoppers storing at least two different types of seals. In some embodiments, the seal applicator assembly includes eight seal applicator devices that are translatable together along a first axis and a third axis, and wherein the seal applicator assembly includes eight seal applicator devices, each of which is translatable along a second axis.

[0037] In some embodiments, the wire stripping system is configured to remove two opposing end portions of the insulation of the wire to provide first and second exposed end portions of the wire, and the seal applicator assembly is configured to translate along a first axis to attach first and second target seals to the first and second exposed end portions of the wire, respectively, to obtain a sealed wire. In some embodiments, the seal applicator system is further configured to provide the sealed wire to a crimping press configured to crimp a target terminal onto the exposed portion of the sealed wire to assemble the wire lead.

[0038] According to another aspect of this disclosure, an automated wire mating method for assembling wire leads for wiring connectors is provided. In one exemplary embodiment, the automated wire mating method includes: removing at least a portion of the insulation of the wire to provide an exposed portion of the wire; translating a seal applicator assembly of a seal applicator system along a first axis parallel to the assembly direction of the automated wire mating system; installing a target seal near the exposed portion of the wire through the seal applicator assembly to obtain a sealed wire; obtaining the target seal from at least one seal hopper through a seal sizing assembly of the seal applicator system, each seal hopper storing a specific type of seal; and supplying the target seal downward along a second axis substantially perpendicular to the first axis to the seal applicator assembly through the seal sizing assembly.

[0039] In some embodiments, the seal applicator assembly includes a chuck configured to receive a target seal, and the method further includes translating the target seal via the chuck along a third axis substantially perpendicular to the first and second axes during installation. In some embodiments, the method further includes obtaining the target seal from at least one seal hopper via a seal unification assembly through a vacuum supply tube.

[0040] In some embodiments, at least one seal hopper includes multiple seal hoppers storing at least two different types of seals. In some embodiments, the seal applicator assembly includes eight seal applicator devices that are translatable together along a first axis and a third axis, and wherein the seal applicator assembly includes eight seal applicator devices, each of which is translatable along a second axis.

[0041] In some embodiments, removing at least a portion of the insulation of the conductor includes removing two opposing end portions of the insulation of the conductor to provide first and second exposed end portions of the conductor, and translating the seal applicator assembly along a first axis includes translating along the first axis to attach first and second target seals, respectively, to the first and second exposed end portions of the conductor to obtain a sealed conductor. In some embodiments, the method further includes providing the sealed conductor to a crimping press via a seal applicator system, the crimping press being configured to crimp target terminals onto the exposed portions of the sealed conductor to assemble the conductor leads.

[0042] According to another aspect of this disclosure, an automated wire mating apparatus for assembling wire leads for wiring connectors is provided. In one exemplary embodiment, the automated wire mating system method includes: a wire stripping device for removing at least a portion of the insulation of a wire to provide an exposed portion of the wire; a seal applicator device for translating along a first axis parallel to the assembly direction of the automated wire mating system to install a target seal near the exposed portion of the wire to obtain a sealed wire; and a seal simplification device for obtaining a target seal from at least one seal hopper device, each seal hopper device storing a specific type of seal, and directing the target seal downward along a second axis substantially perpendicular to the first axis to the seal applicator device.

[0043] In some embodiments, the seal applicator includes a chuck device for receiving the target seal and translating along a third axis substantially perpendicular to the first and second axes during installation of the target seal. In some embodiments, the seal simplification assembly obtains the target seal from at least one seal hopper via a vacuum supply tube.

[0044] In some embodiments, at least one seal hopper device includes multiple seal hopper devices for storing at least two different types of seals. In some embodiments, the seal applicator device includes eight seal applicator devices that are capable of translating together along a first axis and a third axis, and wherein the seal simplification device includes eight seal simplification device devices, each capable of translating along a second axis.

[0045] In some embodiments, the wire stripping device removes two opposing end portions of the insulation of the wire to provide first and second exposed end portions of the wire, and the seal applicator device translates along a first axis to apply first and second target seals to the first and second exposed end portions of the wire, respectively, to obtain a sealed wire.

[0046] Further applicability of this disclosure will become apparent from the detailed description provided below. It should be understood that the detailed description and specific examples are intended for illustrative purposes only and are not intended to limit the scope of this disclosure. Attached Figure Description

[0047] This disclosure will be more fully understood from the detailed description and accompanying drawings, in which:

[0048] Figure 1A-1B Views are shown of example wire leads and example wiring connectors having multiple wire leads inserted therein, according to some embodiments of the present disclosure;

[0049] Figure 2 A functional block diagram of an exemplary automatic wire mating system and wiring connector assembly system according to some embodiments of the present disclosure is shown;

[0050] Figures 3A-3B A view is shown of a portion of an automated wire-matching system and a terminal preparation station and a terminal unification and delivery system according to some embodiments of the present disclosure;

[0051] Figures 4A-4B A view is shown of a portion of an automated wire fitting system according to some embodiments of the present disclosure, including a terminal unification and delivery system and a crimping system;

[0052] Figures 5A-5B A view of the crimping system of an automatic wire fitting system according to some embodiments of the present disclosure is shown;

[0053] Figures 6A-6C A view of a wire lead unification system of an automatic wire matching system according to some embodiments of the present disclosure is shown;

[0054] Figures 7A-7C A flowchart of an example automatic wire matching method according to some embodiments of the present disclosure is shown;

[0055] Figure 8A A functional block diagram of an example seal applicator system of an automated wire fitting system according to some embodiments of the present disclosure is shown;

[0056] Figure 9A-9O A side view of an example seal applicator system during operation is illustrated according to some embodiments of this disclosure;

[0057] Figures 10A-10C A top view of an example seal applicator system during sealing installation of the first and second exposed end portions of a wire, according to some embodiments of the present disclosure, is shown. Detailed Implementation

[0058] As described above, wiring connectors or wire harnesses typically comprise multiple wire leads whose terminals are inserted and secured within the corresponding terminal portions of the connector. During the assembly of wiring connectors, a human or robotic assembler typically follows a set of instructions (wire diagrams, computer-executable instructions, etc.) to search for containers or bins of wire leads to identify target wire leads, which are then installed by the assembler into the target terminal portions of the corresponding connectors. This process can be expensive and time-consuming, and may result in a large number of wire leads or wiring connectors failing tests, leading to a decrease in the first-pass yield (FTQ) and increased costs for repairing improperly assembled wire leads and / or wiring connectors. Therefore, while these conventional component systems and methods perform well for their intended purposes, there are opportunities for improvement in the related art. Therefore, this paper proposes improved wire lead and wiring connector component systems and methods.

[0059] These systems and methods employ automated wire-matching systems that robotically prepare wires and terminals and crimp (wrap) the terminals onto the corresponding wires. The assembled wire leads are then provided to a wire lead unification (separation) system, which delivers them to a wiring connector assembly station where a human or robotic installer can quickly and accurately assemble the wiring connector following a specific set of instructions (e.g., from left to right along a tray). Terminal preparation and unification allow for the unification and delivery of multiple different types of terminals (e.g., eight) to a crimping unit. The crimping unit also includes a shuttle system comprising multiple different dies (e.g., eight) to ensure that different types of terminals are properly crimped onto the prepared wires. During crimping, removable wedge-shaped features support the crimping unit and also allow for changes in the engagement die. These improved systems and methods can increase FTQ (Functionally Transfer Quotient) indicators and reduce the cost of repairing improperly assembled wiring connectors. Furthermore, less training / knowledge is required for human installers, which can further reduce costs and provide greater task flexibility for assembly plants or facilities.

[0060] Now for reference Figure 1A-1BThe diagram shows a view of an example wire lead 100 and an example wiring connector 116. The wire lead 100 includes a wire 104 with a portion of insulation 108 stripped to allow terminals 112 to be crimped thereon. It is understood that the term "insulation" can refer to any suitable insulating or shielding material protecting the wire 104. While the wire 104 is shown as a circular assembly of several thinner wires, it is understood that the wire 104 can be a single wire and / or can have different shapes or aggregate shapes. For the purposes of this disclosure, the wire 104 and insulation 108 are also collectively referred to as "insulated wires 104, 108" or "target wires 104, 108". The wiring connector 116 includes a plurality of wire leads with corresponding terminals 112 of which are seated or connected to corresponding terminal portions 124 of the connector 120. While many wiring connectors include multiple wire leads 100 seated in multiple corresponding terminal portions 124, it is understood that in some embodiments, wiring connector 116 may include a single wire lead 100 seated in a single corresponding terminal portion 124. As described above, the typical assembly method for wiring connector 116 is a "push-click-pull" procedure, in which each wire lead 100 is "push" into the corresponding terminal portion 124 until a "click" indication (sound, vibration, etc.) is observed, and the seat is subsequently tested and verified by "pulling" the wire. As previously stated and as Figure 1B As shown, a large number of wire leads 100 can be placed in the connector 120, which can be complex and time-consuming, especially for manual installers (e.g., following a visual wire diagram and searching in containers of different wire leads).

[0061] Now for reference Figure 2 And continue to refer to Figure 1A-1BThe diagram illustrates a functional block diagram of an example automated wire mating and wiring connector assembly system 200 according to some embodiments of the present disclosure. System 200 is generally divided into two main systems or subsystems: an automated wire mating system 204 that assembles and unifies wire leads 100, and a wiring connector assembly system 250 that uses the manufactured wire leads 100 to assemble wiring connectors 116. In one exemplary embodiment, the automated wire mating system 204 includes a wire preparation station 208, a terminal preparation station 212, a terminal unification and delivery system 216, a crimping system 220, and a wire lead unification system 224. It is understood that in this disclosure, the terms "station" and "system" are used interchangeably and have the same meaning (e.g., part of an assembly line). The wire preparation station 208 receives insulated wires 104, 108 and prepares the insulated wires 104, 108 for assembling wire leads 100. These insulated wires 104, 108 may be supplied, for example, from rollers or coils, each storing different types or sizes of insulated wires 104, 108. The preparation of the insulated wires 104, 108 may include (but is not limited to) unwinding, untwisting, measuring the desired length, cutting at the desired length, stripping a portion of the insulation, and attaching or installing seals. Each prepared insulated wire 104, 108 is then individualized and supplied to the crimping system 220, which is shown and described in more detail below.

[0062] Now for reference Figures 3A-3BReferring again to the figures discussed above, terminal preparation station 212 receives carrier strips of terminal 112 and prepares the terminal 112 for assembly of lead wire 100. These carrier strips may be provided, for example, from rollers or coils 304, each storing carrier strips of different types of terminals 112. The preparation of the terminal 112 may, for example, include cutting the carrier strips of terminal 112 using a cutting die 308 and storing the cut terminals 112 in corresponding terminal containers 312. In one exemplary embodiment, there are eight terminal containers 312, each storing different types of terminals 112. Terminal unification and delivery system 216 then unifies the target terminal 112 from one of the target terminal containers 312 using a first transport system 316a. In one exemplary embodiment, the first transport system 316a includes a first gripping device 320 having first opposing gripping members 324 configured to grip the target terminal 112 and control the movement of the target terminal 112. In one exemplary embodiment, a first gripping device 320 or a separate sensor system (e.g., a vision scanning system, not shown) is configured to identify opposing target gripping points on the target terminal and movably close a first opposing gripping member 324 at the opposing target gripping points on the target terminal 112 to control the movement of the target terminal 112 from the target terminal container 312. In one exemplary embodiment, a terminal unification and delivery system 216 is configured to translate along a first axis (A1) parallel to the plurality of terminal containers 312 (parallel to the roller strip shown) to control the movement of the target terminal 112 from the target terminal container 312, and to translate along a second axis (A2) perpendicular to the first axis A1 to deliver and transfer the target terminal 112 to a second transport system 316b.

[0063] Now for reference Figures 4A-4BReferring again to the other figures discussed above, the second transport system 316b is configured to receive the target terminal 112 from the first transport system 316a and deliver the target terminal to the crimping system 220. In one exemplary embodiment, the second transport system 316b includes a second gripping device 332 having second opposing gripping members (similar to opposing gripping members 324) configured to grip the target terminal 112 from the first gripping device 320 and control the movement of the target terminal 112. For example, the second gripping device 332 may be arranged at approximately 180 degrees relative to the first gripping device 320. This allows for a handover procedure, after which the target terminal can be prepared for proper delivery to the crimping system 220. More specifically, in this exemplary embodiment, the second gripping device 332 is further configured to translate along a second axis A2 to control the movement of the target terminal 112 from the first gripping device 320, and at least translate along the second axis A2 to deliver the target terminal 112 to the crimping system 220. In the illustrated example configuration, the second gripping device 332 is configured to control the movement of the target terminal 112 from the first gripping device 320 at a first position behind the pressing system 220, and subsequently translate along the second axis A2 to a second position in front of the pressing system 220, as shown. Figures 5A-5B As shown in the image.

[0064] Now for reference Figures 5A-5BReferring again to the figures discussed above, the crimping system 220 (also referred to herein as the "crimping part 220") includes a shuttle system 500 comprising a plurality of different molds 504 in which a target mold 508 is engaged, and the unengaged portions of the plurality of molds 504 are vertically held or secured by a fixing mechanism 506. In one exemplary embodiment, the shuttle system 500 includes eight different molds 504. The shuttle system 500 is translatable along a first axis A1 to position the target mold 508 for engagement along a third axis (vertical, not shown) perpendicular to the first and second axes, thereby engaging and disengaging the target mold 506. This third axis is also the direction in which crimping occurs. While these axes are described as being the same as the first and second axes in the previous figures for reference, it will be understood that there may be some differences in the orientation of the respective systems. The crimping system 220 obtains target wires 104, 108 after preparation by the wire preparation system 208. These target wires have been unified by a corresponding wire holder member 400, which can be translated back and forth along the second axis A2 via a drive system 404. It is understood that the gripping member 400 (e.g., and the drive system 404) can also be used as part of the wire preparation system 208. As shown, target terminals 112 are delivered to the crimping system 220 along with target wires 104, 108. The crimping system 220 then commands the pressing portion 512 to generate a force via the engagement or target mold 508, crimping the target terminals 112 onto the exposed wire portions 104 to assemble the wire leads 100. In one exemplary embodiment, the crimping system 220 further includes a wedge mechanism 516 configured to (i) temporarily insert below the bottom portion of the target mold 508 when engaged to increase the rigidity of the target mold during crimping, and (ii) remove from below the bottom portion of the target mold 508 when the target mold 508 is vertically disengaged along a third axis (vertical).

[0065] In one exemplary embodiment, the target mold 508 receives the target terminal 112 in initially vertically spaced first and second portions, and the wire gripping member 400 and the drive system 404 deliver the target wires 104, 108 to the front portion of the crimping system 220 such that the exposed wire portions 104 are aligned between the first and second portions of the target terminal 112. The wire gripping member 400 then pushes the wires downward along a third axis such that the exposed wire portions 104 engage or come into contact with the second portion of the target terminal 112, and the pressing portion 512 subsequently generates a crimping force via the target mold 508 to press the target terminal 112 onto the exposed wire portions 104. In one exemplary embodiment, the crimping system 220 further includes a single load sensor 520 configured to engage with each of the plurality of molds 504 (i.e., whichever mold 504 engages, or the target mold 508). When engaged with target mold 508, load sensor 520 is configured to measure the crimping force generated by pressing part 512 via target mold 508 as part of crimping force monitoring (CFM) process. For example, this load sensor 520 can engage with each of the molds 504 and is held vertically using a nail-head type connector or any other suitable type of temporary engagement mechanism. By being able to use a single load sensor 520 for all of the multiple molds 504, costs can be reduced (e.g., compared to requiring a separate, permanent load sensor 520 for each of the multiple molds 504). Each assembled lead wire 100 is then supplied to lead wire simplification system 524 via lead wire gripping member 400 and drive system 404.

[0066] Now for reference Figures 6A-6CReferring again to the figures discussed above, an example configuration of a wire lead unification system 600 according to some embodiments of the present disclosure is shown. The wire lead unification system 600 includes a base member 604 having a plurality of individual unification devices 608 attached to or defined by the base member 604, wherein each of the plurality of individual unification devices 608 is configured to receive and temporarily secure one of a plurality of wire leads 100. In one exemplary embodiment, the base member 604 is a tray-like device configured to be transported within or to an assembly facility. In one exemplary embodiment, a gripping member 400 is further configured to insert and temporarily secure the plurality of wire leads 100 into the plurality of individual unification devices 608 of the wire lead unification system 600. It will be understood that there may be another intermediate system that can obtain the wire leads 100 from the wire gripping member 400 and the drive system 404, and subsequently insert the wire leads 100 into the plurality of individual unification devices 100. This can be a robotic / automated system, or it can be performed manually by a person. In one exemplary embodiment, multiple wire leads 100 are inserted and temporarily fixed in multiple independent unit 608 according to a predetermined sequence or pattern.

[0067] This predetermined sequence or pattern may correspond, for example, to a specific installation sequence or pattern, in which multiple wire leads 100 are inserted into corresponding terminal portions 126 of the wiring connector 116 during assembly by the assembler 254 of the wiring connector assembly system 250. As previously described, the assembler 254 may be a robotic assembler or a human assembler that receives multiple wire leads 100 and, in response to such delivery via the wire lead unification system 600, positions the multiple wire leads 100 into corresponding terminal portions 124 of the target connector 120 provided by the connector preparation system 258 (e.g., a storage system for different connector types, where the target connector 120 is unified manually or robotically). In a robotic configuration of the assembler 254, the assembler 254 may operate according to a set of installation instructions corresponding to a specific installation sequence or pattern. In a manual or human configuration, the specific installation sequence or pattern is from left to right or from right to left (e.g., easily followed by any human installer, even one with little experience or training). This eliminates the need for complex guide lines that are difficult to follow.

[0068] The multiple independent individualizing devices 608 can have various different configurations. In one exemplary embodiment, the multiple independent individualizing devices 608 are spring-loaded metal gripping fingers. However, the metal fingers may be too rigid and therefore may damage the lead wire 100. Figures 6A-6BAs shown, in another exemplary embodiment, a plurality of independent, individualized devices 608 are plastic (e.g., injection-molded film) gripping fingers. Figure 6A The first example configuration 608a is illustrated, wherein the base portion 610a has four fingers 612a-612d extending therefrom. Wire leads 100 can then be inserted and temporarily secured between adjacent pairs of these fingers 612a-612d. Figure 6B A second configuration 608b is described, wherein the base portion has eight fingers extending therefrom, divided into four pairs: 620a-620b, 624a-624b, 628a-628b, and 632a-632b. The lead wire 100 can then be inserted and temporarily secured between each pair of fingers. For example, this configuration 608b can provide greater securing force compared to other configurations 608a. It is understood that these configurations are merely examples, and any type of temporary securing mechanism for the lead wire 100 can be used in the lead wire simplification system 600.

[0069] Now for reference Figures 7A-7B Example flowcharts of automatic wire mating methods 700, 730, and 760 according to the principles of this disclosure are shown. While these methods 700, 730, and 760 refer to components of the automatic wire mating and wiring connector assembly system 200, it is understood that these methods 700, 730, and 760 can be implemented using systems with different constructions or systems having more or fewer components than system 200. Figure 7A Method 700 begins at 704, where different types of terminals 112 are stored in different terminal containers 312. At 708, movable control of the target terminal 112 from the target terminal container 312 is obtained using a first transport system 316a. At 712, the first transport system 316a delivers the target terminal 112 to a second transport system 316b. At 716, the second transport system 316b obtains movable control of the target terminal 112 from the first transport system 316a. At 718, the second transport system 316b delivers the target terminal 112 to a crimping system 220 to crimp onto the exposed wire portion 104 to assemble the wire lead 100. Method 700 then ends or returns to 704.

[0070] Figure 7BMethod 730 begins at 734, where a target terminal 112 is obtained from multiple different types of terminals (e.g., terminal container 312) using a terminal unification and delivery system 216. At 738, a crimping system 220 obtains target wires 104, 108. At 742, the terminal unification and delivery system 216 supplies the target terminal 112 to the crimping system 220. At 746, a target die 508 among multiple dies 504 is engaged. At 750, the crimping system 220 uses the target die 508 to crimp the target terminal 112 onto the exposed portion 104 of the wire lead to assemble the wire lead 100. Method 730 then ends or returns to 734. Figure 7C Method 760 begins at 764, where multiple wire leads 100 are assembled (e.g., using an automatic mating system 204). At 768, the multiple wire leads 100 are temporarily inserted into and secured in multiple individual assemblies 608 of the wire lead assemblies 600. At 772, the wire lead assemblies 600 are delivered to the wiring connector assembly system 250. At 776, the wiring connectors 116 are assembled (e.g., by assembler 254) using instructions associated with the wire lead assemblies 600 (left-to-right, right-to-left, computer instructions, etc.). Method 760 then ends or returns to 764.

[0071] As previously described, conductor preparation station 208 receives insulated conductors 104, 108 and prepares them for assembling conductor leads 100. These insulated conductors 104, 108 may be supplied, for example, from rollers or coils, each storing conductors 104, 108 of different types or specifications. The preparation of insulated conductors 104, 108 may include (but is not limited to and without a specific order) unwinding, untwisting, measuring the desired length, cutting at the desired length, stripping a portion of the insulation, and attaching or installing seals.

[0072] Now for reference Figure 8A This diagram illustrates a functional block diagram of an example seal applicator system 800 according to some embodiments of the present disclosure. As previously described, the seal applicator system 800 is part of a wire preparation station 208 and also interacts with a wire stripping system 804, which is also part of the wire preparation station 208. The wire stripping system 804 is configured to remove at least a portion of the insulation of a target wire to provide an exposed portion of the target wire. In some embodiments, the wire stripping system 804 is configured to remove two opposing end portions of the insulation of a particular target wire to provide first and second exposed end portions of the target wire. The seal applicator system 800 may also be configured to provide a sealing wire to a crimping system 220 to subsequently crimp a target terminal onto the exposed portion of the sealing wire to assemble a wire lead as described in more detail earlier herein.

[0073] The seal applicator system 800 generally includes a frame 808 arranged generally parallel to the assembly direction 812 of the overall system 200 of this disclosure. This assembly direction 812 is also generally parallel to a first direction or axis 816, along which components of the seal applicator system 800 are movable, except for the perpendicular second and third directions / axises 820, 824. The seal applicator system 800 includes a seal applicator assembly 828 supported by the frame 808 and configured to translate along the first axis 816 to install a target seal near the exposed portion of the lead wire to obtain a sealed lead wire. The seal applicator system 800 further includes a seal sizing assembly 832 configured to receive a target seal from at least one seal hopper 836, each seal hopper storing a specific type of seal and supplying the target seal downwards along a second axis 820 to the seal applicator assembly 828. In some embodiments, the seal applicator assembly 828 includes one or more chucks 840, each chuck configured to receive a target seal and further configured to translate along a third axis 824 when the target seal is installed.

[0074] In some embodiments, the seal simplification assembly 832 is configured to obtain a target seal from at least one seal hopper 836 via one or more vacuum supply tubes 844. In some embodiments, the at least one seal hopper 836 comprises a plurality of seal hoppers storing at least two different types of seals. In one exemplary embodiment, the seal applicator assembly 828 includes eight seal applicator devices 830 that are collectively translatable along a first axis 816 and a third axis 824, and wherein the seal simplification assembly 832 includes eight seal simplification devices 848, each translatable along a second axis 820. When a particular target wire has two opposing exposed end portions, the seal applicator assembly 828 can be configured to translate along the first axis to apply first and second target seals, respectively, to the first and second exposed end portions of the wire to obtain a sealed wire. This process in… Figures 10A-10C This is shown in more detail below, and described in more detail below.

[0075] Now for reference Figure 9A-9O And continue to refer to Figure 8A A side view of an example seal applicator system 800 during operation is shown according to some embodiments of this disclosure. Figure 9A In this process, the target seal is supplied by the seal unification system 832 via the vacuum supply pipe 844. For a clearer view... Figure 9B-9O The component conversions in the drawings, reference numerals 844-852, have been excluded. Figure 9B In this configuration, the unifying device 848 can be rotatably translated to the right to a position close to the target seal provided via the vacuum supply pipe 844. Figure 9C In this process, the unifying device 848 moves downwards and at a certain angle to achieve movable control of the target seal. Figure 9D In the middle, the single-unit device 848 then retracts with its target seal. Figure 9E In the middle, the unification device 848 returns to its previous base position, and... Figure 9F In this process, the unifying device 848 then supplies the target seal downwards along the second axis 820 to the chuck 840 of the seal applicator assembly 828. Figure 9G In the middle, the unifying device 848 retracts to its base position, leaving the target seal inside the chuck 840. Figure 9H-9I In the middle, the chuck 840 rotates to the left to position the target seal in a better orientation for installation. Figure 9J In the middle, the chuck 840 translates along the third axis 824 to begin installing the target seal. Figure 9K-9O The image also shows an enlarged view illustrating the application of the target seal 860 to the target wire 856. Figure 9K In the middle, clip 852 closes or clamps to keep the target seal firmly in place, and Figure 9L-9M In the process, the target wire is supplied to the target seal, while the chuck 840 rotates to the right to return to its initial position. Figure 9N In the middle, clamp 852 opens or releases to release the sealed wire 864, and chuck 840 completes its rotation to its initial position. Finally, in Figure 9O At this point, the chuck 840 translates back to its base position along the third axis 824, and the process can continue.

[0076] Figures 10A-10C A top view of an example seal applicator system 800 during seal installation on the first and second exposed end portions of a conductor, according to some embodiments of this disclosure, is shown. Figure 10A In this configuration, the two conductors 1000 and 1004 have corresponding exposed end portions 1000a and 1000b, and 1004a and 1004b. Five different types of seals 1008a-1008e have also been preloaded by the seal application system 800 or pre-standardized. Figure 10B In this process, the seal applicator system 800 translates to the right along the first axis 816 to position seals 1008b and 1008d near the end portions 1000a and 1000b of the wires, and to position seals 1008a-2 and 1008a-3 near the end portions 1004a and 1004b of the wires. Figure 10CIn this process, a portion of the seal applicator system 800 translates downward along the third axis 824 to install seals 1008a-2 and 1008a-3 (seals of the same type 1008a) onto the wire end portions 1004a and 1004b. This allows various types of seals to be applied simultaneously to opposite wire end portions, thereby increasing speed and reducing costs.

[0077] The following method can be specifically applied to components of the seal applicator assembly 800 and other systems / components described herein. First, one or more portions of the target lead are removed to provide a target lead with an exposed portion. Next, the seal applicator assembly is translated along a first axis parallel to the assembly direction. Next, a target seal is obtained from one or more seal hoppers (e.g., via a vacuum supply tube). Subsequently, the target seal is supplied downwards to the seal applicator assembly along a second axis perpendicular to the first axis. Afterwards, the target seal is mounted close to the exposed portion of the target lead to obtain a sealed lead. Next, the sealed lead is provided to a crimping system for lead wire assembly. The method then ends or returns to the first step for one or more additional cycles.

[0078] According to one aspect of this disclosure, an automated wire mating system for assembling wire leads for wiring connectors is provided. In one exemplary embodiment, the automated wire mating system includes: a plurality of terminal containers, each storing terminals of different types for wire leads; a first transport system configured to collect target terminals from target terminal containers of the plurality of terminal containers; and a second transport system configured to receive target terminals from the first transport system and deliver the target terminals to a crimping press, wherein the crimping press is configured to crimp the target terminals onto exposed portions of the wires to assemble the wire leads.

[0079] In some embodiments, the first transport system includes a first gripping device having first opposing gripping members configured to grip a target terminal and control the movement of the target terminal, wherein the first gripping device or a separate sensor system is configured to identify opposing target gripping points on the target terminal and movably close the first opposing gripping members at the opposing target gripping points on the target terminal to control the movement of the target terminal from the target terminal container.

[0080] In some embodiments, the first transport system includes a first gripping device having first opposing gripping members configured to grip a target terminal and control the movement of the target terminal, and wherein the first gripping device is further configured to translate along a first axis parallel to a plurality of terminal containers to control the movement of the target terminal from the target terminal containers, and to translate along a second axis perpendicular to the first axis to deliver and transfer the target terminal to a second transport system.

[0081] In some embodiments, the second transport system includes a second gripping device having second opposing gripping members configured to grip a target terminal from the first gripping device and control the movement of the target terminal from the first gripping device, wherein the second gripping device is arranged at approximately 180 degrees relative to the first gripping device.

[0082] In some embodiments, the second transport system includes a second gripping device having second opposing gripping members configured to grip and control movement of a target terminal from the first gripping device, wherein the second gripping device is further configured to translate along a second axis to control movement of the target terminal from the first gripping device, translate along at least a second axis to deliver the target terminal to a crimping press, control movement of the target terminal from the first gripping device at a first position behind the crimping press, and translate along at least a second axis to a second position in front of the crimping press.

[0083] In some embodiments, the crimping press includes a plurality of molds, and wherein the crimping press is further configured to: obtain an exposed portion of a conductor with its insulation removed, receive a target terminal from a terminal delivery system, engage a target mold of the plurality of molds corresponding to the type of the target terminal, and crimp the target terminal onto the exposed portion of the conductor using the target mold of the plurality of molds to assemble the conductor lead.

[0084] In some embodiments, the automated lead fitting system further includes a lead stripping system configured to remove at least a portion of the insulation of the lead to provide an exposed portion of the lead; a seal applicator system including a seal applicator assembly configured to translate along a first axis parallel to the assembly direction of the automated lead fitting system to install a target seal near the exposed portion of the lead to obtain a sealed lead; and a seal sizing assembly configured to receive a target seal from at least one seal hopper, each seal hopper storing a specific type of seal, and to supply the target seal downward along a second axis substantially perpendicular to the first axis to the seal applicator assembly.

[0085] According to another aspect of this disclosure, an automated wire mating system for assembling wire leads for wiring connectors is proposed. In one exemplary embodiment, the automated wire mating system includes a terminal delivery system configured to receive a target terminal from a plurality of different types of terminals for the wire leads, and a crimping press comprising a plurality of molds configured to: receive a wire with an exposed portion having its insulation removed, receive the target terminal from the terminal delivery system, engage a target mold from the plurality of molds corresponding to the type of the target terminal, and crimp the target terminal onto the exposed portion of the wire using the target mold from the plurality of molds to assemble the wire leads.

[0086] In some embodiments, multiple molds are arranged in a shuttle system capable of translation along a first axis to position a target mold for engagement. In some embodiments, the pressing unit includes eight molds. In some embodiments, the shuttle system further includes a fixing mechanism to hold any unengaged remaining molds among the multiple molds. In some embodiments, each of the multiple molds is also capable of vertical movement along a second axis perpendicular to the first axis, thereby engaging and disengaging with the target mold. In some embodiments, the pressing unit further includes a wedge mechanism configured to (i) temporarily insert under the bottom portion of the target mold during engagement to increase the rigidity of the target mold during pressing, and (ii) be removed from under the bottom portion of the target mold when disengaging.

[0087] In some embodiments, the target die for engagement receives the target terminal in initially vertically spaced first and second portions. The automated lead mating system further includes a lead delivery system configured to: deliver a lead to a forward portion of a crimping press such that the exposed portion of the lead aligns between the first and second portions of the target terminal; and, in response to the delivery, push the lead downwards such that the exposed portion of the lead engages or approaches the second portion of the target terminal. The crimping press then uses the engaged target die to crimp the target terminal onto the exposed portion of the lead by pressing the first portion of the target terminal downwards onto the exposed portion of the lead and the second portion of the target terminal, thereby obtaining a lead wire. In some embodiments, the crimping press further includes a single load sensor configured to engage with each of a plurality of dies. The single load sensor is configured to measure the crimping force when engaged with the target die as part of a crimping force monitoring (CFM) process.

[0088] In some embodiments, the terminal delivery system includes first and second transport systems disposed behind the crimping press portion. The first transport system is configured to (i) control the movement of a target terminal from a target terminal container in a plurality of terminal containers storing a plurality of different types of terminals, and (ii) deliver the target terminal to the second transport system. The second transport system is configured to (i) control the movement of the target terminal from the first transport system, and (ii) deliver the target terminal to the front portion of the crimping press portion.

[0089] In some embodiments, the automated lead fitting system further includes a lead stripping system configured to remove at least a portion of the insulation of the lead to provide an exposed portion of the lead; a seal applicator system including a seal applicator assembly configured to translate along a first axis parallel to the assembly direction of the automated lead fitting system to install a target seal near the exposed portion of the lead to obtain a sealed lead; and a seal sizing assembly configured to receive a target seal from at least one seal hopper, each seal hopper storing a specific type of seal, and to supply the target seal downward along a second axis substantially perpendicular to the first axis to the seal applicator assembly.

[0090] According to another aspect of this disclosure, an automated wire mating system for assembling wire leads for wiring connectors is provided. In one exemplary embodiment, the automated wire mating system includes a terminal delivery system comprising: a plurality of terminal containers, each storing terminals of different types for wire leads; a first transport system configured to collect target terminals from target terminal containers of the plurality of terminal containers; and a second transport system configured to receive target terminals from the first transport system and deliver the target terminals to a crimping press, wherein the crimping press includes a plurality of molds and is configured to: obtain a wire with exposed portions of the wire insulation removed; receive the target terminals from the terminal delivery system; engage a target mold of the plurality of molds corresponding to the type of the target terminal; and use one of the plurality of molds... The system includes a target mold that presses a target terminal onto the exposed portion of a wire to assemble a wire lead; a wire stripping system configured to remove at least a portion of the insulation of the wire to provide the exposed portion of the wire; and a seal applicator system comprising: a seal applicator assembly configured to translate along a first axis parallel to the assembly direction of the automated wire fitting system to install a target seal near the exposed portion of the wire to obtain a sealed wire; and a seal unification assembly configured to obtain a target seal from at least one seal hopper, each seal hopper storing a specific type of seal and supplying the target seal downward along a second axis substantially perpendicular to the first axis to the seal applicator assembly.

[0091] In some embodiments, the claimed automated lead mating system further includes a lead delivery system that causes the lead to be delivered to the front portion of the crimping press such that the exposed portion of the lead is aligned between a first portion and a second portion of the target terminal, and, in response to the delivery of the lead, pushes the lead downward such that the exposed portion of the lead engages or approaches the second portion of the target terminal, wherein the crimping press then uses an engaged target mold to crimp the target terminal onto the exposed portion of the lead by pressing the first portion of the target terminal downward onto the exposed portion of the lead and the second portion of the target terminal to obtain a lead wire.

[0092] In some embodiments, the seal applicator assembly includes a chuck configured to receive a target seal and further configured to translate along a third axis substantially perpendicular to the first and second axes during installation of the target seal. The seal simplification system is configured to obtain the target seal from at least one seal hopper via a vacuum supply tube. The at least one seal hopper includes a plurality of seal hoppers storing at least two different types of seals. The seal applicator assembly includes a plurality of seal applicator devices capable of translating together along the first and third axes. The seal simplification assembly includes a plurality of corresponding seal simplification assemblies, each capable of translating along a second axis.

[0093] Example embodiments are provided so that this disclosure will be thorough and will fully convey its scope to those skilled in the art. Numerous specific details, such as examples of specific components, apparatuses, and methods, are set forth to provide a comprehensive understanding of embodiments of this disclosure. It will be apparent to those skilled in the art that the specific details are not necessary, and the example embodiments may be implemented in many different forms, and these different forms should not be construed as limiting the scope of this disclosure. In some example embodiments, well-known procedures, well-known apparatus structures, and well-known techniques are not described in detail.

[0094] The terminology used herein is for the purpose of describing particular exemplary embodiments only and is not intended to be limiting. As used herein, the singular forms “a,” “an,” and “the” may be intended to include plural referents unless the context expressly specifies otherwise. The term “and / or” includes any and all combinations of one or more of the associated listed items. The terms “comprises,” “comprising,” “including,” and “having” are inclusive and therefore indicate the presence of the stated features, integrals, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or combinations thereof. The method steps, processes, and operations described herein should not be construed as requiring performance in the particular order discussed or described unless specifically determined to be the order of performance. It should also be understood that additional or alternative steps may be employed.

[0095] Although the terms “first,” “second,” “third,” etc., may be used herein to describe various elements, components, regions, layers, and / or segments, these elements, components, regions, layers, and / or segments should not be limited by these terms. These terms may be used only to distinguish one element, component, region, layer, or segment from another. Terms such as “first,” “second,” and other numerical terms used herein do not imply order or sequence unless explicitly indicated by the context. Therefore, a first element, component, region, layer, or segment discussed below may be referred to as a second element, component, region, layer, or segment without departing from the teachings of the exemplary embodiments.

[0096] As used herein, the term "module" can refer to, be a part of, or include: application-specific integrated circuits (ASICs); electronic circuits; combinational logic circuits; field-programmable gate arrays (FPGAs); a distributed network of processors (shared, dedicated, or grouped) and storage that execute code or processes in a network cluster or data center; other suitable components that provide said functionality; or a combination of some or all of the foregoing, such as in a system-on-a-chip. The term "module" can also include memory (shared, dedicated, or grouped) that stores code executed by one or more processors.

[0097] As used above, the term "code" can include software, firmware, bytecode, and / or microcode, and can refer to programs, routines, functions, classes, and / or objects. As used above, the term "shared" means that some or all of the code from multiple modules can be executed using a single (shared) processor. Furthermore, some or all of the code from multiple modules can be stored in a single (shared) memory. As mentioned above, the term "grouped" means that some or all of the code from a single module can be executed using a group of processors. Furthermore, some or all of the code from a single module can be stored in grouped memory.

[0098] The techniques described herein can be executed by one or more computer programs executed by one or more processors. The computer program includes processor-executable instructions stored on a non-transitory tangible computer-readable medium. The computer program may also include stored data. Non-limiting examples of non-transitory tangible computer-readable media are non-volatile memory, magnetic storage, and optical storage.

[0099] Some parts of the above description introduce the techniques described herein by way of algorithms and notation for operations on information. These algorithmic descriptions and representations are means used by those skilled in the art of data processing to most effectively communicate their work to others skilled in the art. These operations, though described functionally or logically, can be understood as being performed by computer programs. Furthermore, it has been shown that it is sometimes convenient, without loss of generality, to refer to the arrangement of these operations as modules or by their functional names.

[0100] Unless explicitly stated otherwise in the foregoing discussion, it will be understood that throughout the description, discussions using terms such as “processing,” “computing,” “calculating,” “determining,” or “displaying” refer to the actions and processes of a computer system or similar electronic computing device that manipulates and transforms data into physical (electronic) quantities in the computer system’s memory or registers or other such information storage, transmission, or display devices.

[0101] Some aspects of the described technology include the process steps and instructions described herein in the form of algorithms. It should be noted that the described process steps and instructions can be implemented in software, firmware, or hardware, and when implemented in software, can be downloaded to, reside on, and operated from different platforms used by a real-time network operating system.

[0102] This disclosure also relates to an apparatus for performing the operations described herein. The apparatus may be specifically built for the desired purpose or may include a general-purpose computer selectively activated or reconfigured by a computer program stored on a computer-readable medium accessible by the computer. Such a computer program may be stored in a tangible computer-readable storage medium, such as, but not limited to, any type of disk, including floppy disks, optical disks, CD-ROMs, magneto-optical disks, read-only memory (ROM), random access memory (RAM), EPROM, EEPROM, magnetic cards or optical cards, application-specific integrated circuits (ASICs), or any type of medium suitable for storing electronic instructions, and each of these media may be coupled to a computer system bus. Furthermore, the computer mentioned in the specification may include a single processor or may be an architecture employing multiple processors to enhance computing power.

[0103] The algorithms and operations described herein are not inherently related to any particular computer or other device. Various general-purpose systems may also be used with programs conforming to the teachings herein, or it may prove convenient to construct more specialized devices to perform the required method steps. Various desired structures for these systems, and equivalent variations, will be apparent to those skilled in the art. Furthermore, this disclosure does not refer to any particular programming language. It is understood that various programming languages ​​can be used to perform the teachings of this disclosure as described herein, and any references to a particular language provided are for the purpose of disclosing the invention and best practices.

[0104] This disclosure is highly applicable to a wide variety of computer network systems with diverse topologies. In this field, the configuration and management of large networks involve storage devices and computers that are communicatively connected to different computers and storage devices via networks such as the Internet.

[0105] The foregoing description of the embodiments is provided for illustrative and descriptive purposes. It is not intended to be exhaustive or limiting. Individual elements or features of a particular embodiment are generally not limited to that particular embodiment, but are interchangeable where applicable and can be used in chosen embodiments, even if not specifically shown or described. Variations are also possible in many ways. Such variations should not be considered a departure from this disclosure, and all such modifications are intended to be included within the scope of this disclosure.

Claims

1. An automated wire fitting system for assembling wire leads for wiring connectors, the automated wire fitting system comprising: A terminal delivery system configured to obtain target terminals from multiple different types of terminals for wire leads; The pressing and pressing part includes multiple molds, and the pressing and pressing part is configured as follows: Obtain the exposed portion of the conductor with the insulation removed; Receive the target terminal from the terminal delivery system; Engage the target mold among the plurality of molds that corresponds to the type of the target terminal; as well as The target terminal is pressed onto the exposed portion of the wire using the target mold among the plurality of molds to assemble the wire lead. The terminal delivery system includes a first transport system and a second transport system. in: A first transport system is configured to (i) collect target terminals from target terminal containers in a plurality of terminal containers storing the plurality of different types of terminals, and (ii) deliver the target terminals to a second transport system; and A second transport system is configured to (i) receive the target terminal from the first transport system, and (ii) deliver the target terminal to the front portion of the crimping pressing part. The first transportation system includes a first gripping device having first opposing gripping members configured to grip the target terminal and control the movement of the target terminal. The first gripping device or a separate sensor system is configured to identify relative target gripping points on the target terminal and to movably close the first relative gripping member at the relative target gripping points on the target terminal to control the movement of the target terminal from the target terminal container.

2. The automatic wire harness provisioning system of claim 1, wherein, The first gripping device is further configured as follows: Translation along a first axis parallel to the plurality of terminal containers to control the movement of the target terminal from the target terminal container; as well as The target terminal is delivered and transferred to the second transport system by translating along a second axis perpendicular to the first axis.

3. The automatic wire harness provisioning system of claim 2, wherein, The second transport system includes a second gripping device having second opposing gripping members configured to grip the target terminal from the first gripping device and control the movement of the target terminal, wherein the second gripping device is arranged at approximately 180 degrees relative to the first gripping device.

4. The automatic wire harness provisioning system of claim 2, wherein, The second transport system includes a second gripping device having second opposing gripping members configured to grip the target terminal from the first gripping device and control the movement of the target terminal, wherein the second gripping device is further configured to: Translation along the second axis to control the movement of the target terminal from the first gripping device; The target terminal is delivered to the crimping portion by translating along at least the second axis. The movement of the target terminal from the first gripping device is controlled at a first position behind the pressing and pressing part; as well as It is translated along at least the second axis to a second position in front of the pressing part.

5. The automatic conductor matching system according to claim 1, characterized in that, Also includes: A wire stripping system configured to remove at least a portion of the insulation of a wire to provide an exposed portion of the wire; as well as A seal applicator system, the seal applicator system comprising: A seal applicator assembly configured to translate along a first axis parallel to the assembly direction of the automated lead fitting system to install a target seal close to the exposed portion of the lead wire to obtain a sealed lead wire; as well as A seal simplification assembly is configured to obtain the target seal from at least one seal hopper, each seal hopper storing a specific type of seal and supplying the target seal downward along a second axis substantially perpendicular to the first axis to the seal applicator assembly.

6. The automatic conductor matching system according to claim 1, characterized in that, The plurality of molds are arranged in a shuttle system, which can translate along a first axis to position the target mold for engagement.

7. The automatic conductor matching system according to claim 6, characterized in that, The pressing and pressing part includes eight molds.

8. The automatic conductor matching system according to claim 7, characterized in that, The shuttle system further includes a fixing mechanism to hold the remaining unengaged molds among the plurality of molds.

9. The automatic conductor matching system according to claim 7, characterized in that, Each of the plurality of molds can also move vertically along a second axis perpendicular to the first axis, thereby engaging and disengaging from the target mold.

10. The automatic conductor matching system according to claim 9, characterized in that, The pressing part further includes a wedge mechanism configured to (i) temporarily insert below the bottom portion of the target mold during engagement to increase the rigidity of the target mold during pressing, and (ii) remove from below the bottom portion of the target mold when disengaging from the target mold.

11. The automatic conductor matching system according to claim 1, characterized in that, The mating target mold receives the target terminals in a first and second portion, which are initially vertically spaced target terminals, wherein the automated wire mating system further includes a wire delivery system configured to: The wire is delivered to the front portion of the crimping press, such that the exposed portion of the wire is aligned between the first and second portions of the target terminal; and In response to delivering the wire, the wire is pushed downwards such that the exposed portion of the wire engages with or approaches the second portion of the target terminal. The crimping part then uses the engaged target mold to press the first part of the target terminal down onto the exposed part of the wire and the second part of the target terminal, thereby crimping the target terminal onto the exposed part of the wire to obtain a wire lead.

12. The automatic conductor matching system according to claim 11, characterized in that, The crimping and pressing part further includes a single load sensor configured to engage with each of the plurality of molds, wherein the single load sensor is configured to measure crimping force as part of a crimping force monitoring (CFM) process when engaged with the target mold.

13. The automatic conductor matching system according to claim 5, characterized in that: The seal applicator assembly includes a chuck configured to receive the target seal and further configured to translate along a third axis substantially perpendicular to the first and second axes during installation of the target seal. The sealing element assembly is configured to obtain the target sealing element from the at least one sealing element hopper via a vacuum supply tube; The at least one sealing element hopper includes multiple sealing element hoppers for storing at least two different types of sealing elements; as well as The seal applicator assembly includes a plurality of seal applicator devices that are capable of translating together along the first axis and the third axis, and wherein the seal applicator assembly includes a plurality of corresponding seal applicator devices, each of which can translate along the second axis.

14. A method for assembling wire leads of a wiring connector using an automatic wire mating system, the method comprising: A terminal delivery system is used to obtain target terminals from multiple different types of terminals used for wire leads; A wire with an exposed portion of insulation removed is obtained at a crimping and pressing part, the crimping and pressing part comprising a plurality of molds; The target terminal is received from the terminal delivery system at the crimping and pressing part; Engage the target mold among the plurality of molds that corresponds to the type of the target terminal; as well as The target terminal is pressed onto the exposed portion of the wire using the target mold among the plurality of molds to assemble the wire lead. The terminal delivery system includes a first transport system and a second transport system; The first transport system is configured to (i) collect the target terminal from a target terminal container among a plurality of terminal containers storing the plurality of different types of terminals, and (ii) deliver the target terminal to the second transport system; The second transport system is configured to (i) receive the target terminal from the first transport system and (ii) deliver the target terminal to the front portion of the crimping pressing part; The first transportation system includes a first gripping device having first opposing gripping members configured to grip the target terminal and control the movement of the target terminal. The first gripping device or a separate sensor system is configured to identify relative target gripping points on the target terminal and to movably close the first relative gripping member at the relative target gripping points on the target terminal to control the movement of the target terminal from the target terminal container.

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