Laser Marking Leakage Prevention Mechanism, Semiconductor Production Line, and Laser Marking Method

Abstract

The present invention belongs to the field of semiconductor technology, and discloses a laser marking anti-leakage mechanism, a semiconductor production line and a laser marking method. A substrate is placed on a processing table. The sealing assembly includes a first groove body and a second groove body both sealed by the processing table. The second groove body surrounds the first groove body and forms an isolation space with the first groove body. An inductor is placed in the isolation space. An air inlet pipe and an air outlet pipe can take away dust and gas in the first groove body. By placing an inductor in the vacuum isolation space, when external air enters the isolation space or air in the sealed space enters the isolation space, the inductor alarms, and the gas or dust generated by the first groove body enters the isolation space instead of entering the atmosphere, ensuring the personal safety and health of the operator. This semiconductor production line can completely prevent people from inhaling dust and gas, and guarantee personal safety and health. This laser marking method can monitor the sealed environment and provide secondary protection to prevent gas and dust from entering the atmosphere.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and particularly relates to a laser marking anti-leakage mechanism, a semiconductor production line, and a laser marking method. Background Art

[0002] In the semiconductor industry, in order to make the produced products traceable, wafer fabs will perform marking after substrate wire cutting; with the development of the industry, arsenic-doped silicon substrates are gradually in market demand. However, when laser processing is performed on the surface of arsenic-doped silicon wafers, arsenic-containing gases and dust will be generated, which will cause harm to human health after being inhaled by the human body. Although the existing laser marking anti-leakage mechanism seals the marking environment, if the sealing is poor or other situations occur, the sealing environment will no longer be sealed, and the staff cannot detect it either, resulting in the operator continuing to mark the substrate without knowing it, so that the operator inhales arsenic-containing dust and gases during work, which will affect human health and even cause irreversible damage to the body, which is absolutely not allowed in actual production.

[0003] Therefore, it is urgent to design a laser marking anti-leakage mechanism, a semiconductor production line, and a laser marking method to completely prevent the dust and gas generated during substrate marking from leaking and being inhaled by the human body. Summary of the Invention

[0004] An object of the present invention is to provide a laser marking anti-leakage mechanism, which can monitor the gas leakage from the sealed environment to the outside, and even if the sealed environment leaks, it still has a blocking effect on gases and dust and will not allow the gases and dust to leak into the atmosphere.

[0005] To achieve this purpose, the present invention adopts the following technical solutions:

[0006] A laser marking anti-leakage mechanism for assisting substrate marking, the laser marking anti-leakage mechanism includes:

[0007] A processing table for carrying the substrate;

[0008] A sealing component including a first groove body and a second groove body. The first groove body can be sealed by the processing table, and the substrate is located in the first groove body; the second groove body surrounds the outside of the first groove body, and the second groove body can be sealed by the processing table, and an isolation space is formed between the first groove body and the second groove body;

[0009] A vacuum pumping pipe penetrates through the second groove body, and the connection between the vacuum pumping pipe and the second groove body is sealed. One end of the vacuum pumping pipe is communicated with the isolation space, and one end of the vacuum pumping pipe is connected to a vacuum device to make the isolation space vacuum;

[0010] A sensor is arranged in the above-mentioned isolated space and alarms when the above-mentioned isolated space is in a non-vacuum state;

[0011] an air intake pipe connected to the interior of the first tank; and

[0012] The air outlet pipe is communicated with the interior of the first tank body, and gas can enter from the air inlet pipe and be blown out from the air outlet pipe.

[0013] As a preferred solution, the first trough body and the second trough body share a trough bottom, and the trough bottom material of the first trough body and the second trough body is a light-transmitting material.

[0014] As a preferred solution, the groove bottom is respectively bonded and sealed to the side wall of the first groove body and the side wall of the second groove body.

[0015] As a preferred embodiment, the laser marking anti-leakage mechanism further includes a driving member, and the sealing assembly or the processing table is transmission-connected to the output end of the driving member, and the driving member is used to drive the processing table to abut against the sealing assembly to seal the first trough body and the second trough body.

[0016] As a preferred solution, the first tank body and the second tank body are both cylindrical and coaxially arranged.

[0017] As a preferred solution, the processing table is made of rubber material.

[0018] As a preferred solution, the above processing platform includes:

[0019] A base capable of sealing the first tank body and the second tank body; and

[0020] The boss is convexly arranged on the base, and the substrate can be placed on the boss.

[0021] As a preferred solution, the sensor is an air pressure sensor.

[0022] Another object of the present invention is to provide a semiconductor production line that can completely prevent people from inhaling dust and gas, thereby ensuring personal safety and health.

[0023] To achieve this object, the present invention adopts the following technical solutions:

[0024] A semiconductor production line includes a marking machine, including the above-mentioned laser marking anti-leakage mechanism, and the laser of the marking machine can pass through the above-mentioned laser marking anti-leakage mechanism to mark the substrate.

[0025] Another object of the present invention is to provide a laser marking method that can monitor the sealed environment and provide secondary protection to completely prevent gas and dust from entering the atmosphere.

[0026] To achieve this purpose, the present invention adopts the following technical solutions:

[0027] A laser marking method, using the above-mentioned laser marking anti-leakage mechanism, the above-mentioned laser marking method includes:

[0028] S1: Place the substrate on the above-mentioned processing table;

[0029] S2: Use the above-mentioned processing table to seal the above-mentioned first tank body and the above-mentioned second tank body;

[0030] S3: Evacuate the above-mentioned isolation space and turn on the above-mentioned sensor;

[0031] S4: The above-mentioned air outlet pipe sucks air, and the above-mentioned air inlet pipe intakes air;

[0032] S5: Start marking, and the dust and gas in the above-mentioned first tank body are sucked away from the above-mentioned air outlet pipe.

[0033] The beneficial effects of the present invention are as follows:

[0034] The present invention provides a laser marking anti-leakage mechanism. By arranging a sealed second tank body outside the sealed first tank body, an isolation space is formed between the two. A sensor is placed in the isolation space. The isolation space is evacuated through a vacuum pipe, so that a vacuum space is set outside the sealed space of the first tank body to be completely isolated from the outside world. Once the outside air enters the isolation space or the air in the sealed space enters the isolation space, the sensor will immediately alarm. The operator can stop marking and take protective measures to deal with the laser marking anti-leakage mechanism. When the sensor alarms, the gas or dust generated by the first tank body enters the isolation space and does not enter the atmosphere, preventing the operator from inhaling and ensuring the personal safety and health of the operator.

[0035] The present invention also provides a semiconductor production line. By adopting the above-mentioned laser marking anti-leakage mechanism, it can completely prevent people from inhaling dust and gas and ensure personal safety and health.

[0036] The present invention also provides a laser marking method. By adopting the above-mentioned laser marking anti-leakage mechanism, it can monitor the sealed environment and provide secondary protection to completely prevent gas and dust from entering the atmosphere. Description of the Drawings

[0037] Figure 1 is a schematic structural diagram of a marking machine and a laser marking anti-leakage mechanism provided by an embodiment of the present invention;

[0038] Figure 2 is a schematic structural diagram of the laser marking anti-leakage mechanism provided by an embodiment of the present invention;

[0039] Figure 3 is Figure 2 a half-sectional view at A-A in

[0040] In the figure:

[0041] 10. Processing table; 11. Base; 12. Boss; 20. Sealing assembly; 21. First groove body; 22. Second groove body; 30. Vacuum extraction pipe; 40. Isolation space; 50. Air outlet pipe; 60. Air inlet pipe;

[0042] 200. Substrate; 300. Laser marker. Specific embodiments

[0043] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the present invention, rather than limiting the present invention. Additionally, it should be noted that for the convenience of description, only the parts related to the present invention are shown in the drawings, rather than all the structures.

[0044] In the description of the present invention, unless otherwise clearly defined and limited, the terms "connected", "connected to", and "fixed" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0045] In the present invention, unless otherwise clearly defined and limited, the first feature being "above" or "below" the second feature may include the direct contact between the first and second features, or may include the situation where the first and second features are not in direct contact but in contact through other features between them. Moreover, the first feature being "above", "above and to the right", and "above and on" the second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature has a higher horizontal height than the second feature. The first feature being "below", "below and to the left", and "below and on" the second feature includes the first feature being directly below and obliquely below the second feature, or simply indicating that the first feature has a lower horizontal height than the second feature.

[0046] In the description of this embodiment, the orientation or positional relationships such as "above", "below", "left", and "right" are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of description and simplifying the operation, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be understood as a limitation to the present invention. In addition, the terms "first" and "second" are only used for distinction in description and do not have special meanings.

[0047] In the semiconductor industry, it is necessary to mark the substrate to trace the information of the substrate. Due to the size differences of each substrate, it is convenient to make different treatments for different substrates according to the marking in the subsequent process to ensure the consistency of the products. With the development of the industry, technicians found that after doping arsenic into the substrate, the performance of the substrate has been improved. However, during the marking process, at high temperatures, arsenic elements will generate arsenic-containing dust and gas. If inhaled by the human body, it will affect human health and even cause irreversible damage to the body. Although the existing laser marking anti-leakage mechanism seals the marking environment, if the sealing is poor or other situations occur, the sealing environment will no longer be sealed, and the staff cannot find it, resulting in the operator continuing to mark the substrate without knowing it, causing the operator to inhale arsenic-containing dust and gas during work. Therefore, the existing laser marking anti-leakage mechanism cannot completely prevent gas and dust from flowing into the air during laser marking.

[0048] To solve the above problems, this embodiment provides a laser marking anti-leakage mechanism, which can monitor the gas leaking out of the sealed environment. Even if the sealed environment leaks, it still has a blocking effect on gas and dust, and will not allow gas and dust to leak into the atmosphere. Such as Figures 1 to 3As shown in the figure, the above-mentioned laser marking anti-leakage mechanism includes a processing table 10, a sealing assembly 20, a vacuum extraction pipe 30, a sensor, an air inlet pipe 60, and an air outlet pipe 50. The processing table 10 is used to carry a substrate 200. The sealing assembly 20 includes a first groove 21 and a second groove 22. Both the first groove 21 and the second groove 22 can be sealed by the processing table 10. After sealing, the substrate 200 is located inside the first groove 21. The second groove 22 surrounds the outer periphery of the first groove 21. An isolation space 40 is formed between the first groove 21 and the second groove 22. The vacuum extraction pipe 30 penetrates through the second groove 22, and the connection between the vacuum extraction pipe 30 and the second groove 22 is sealed. One end of the vacuum extraction pipe 30 communicates with the isolation space 40, and one end of the vacuum extraction pipe 30 is connected to a vacuum device (not shown in the figure) to make the isolation space 40 vacuum; the sensor is arranged inside the isolation space 40 and alarms when the isolation space 40 is in a non-vacuum state. The air inlet pipe 60 and the air outlet pipe 50 both communicate with the inside of the first groove 21, and gas can enter from the air inlet pipe 60 and blow out from the air outlet pipe 50. By arranging a sealed second groove 22 outside the sealed first groove 21, an isolation space 40 is formed between the two. A sensor is placed inside the isolation space 40, and the isolation space 40 is evacuated through the vacuum extraction pipe 30, so that a vacuum space is set outside the sealed space of the first groove 21 to be completely isolated from the outside world. Once the outside air enters the isolation space 40 or the air in the sealed space enters the isolation space 40, the sensor will alarm immediately. The operator can stop marking and take protective measures to deal with the laser marking anti-leakage mechanism. When the sensor alarms, the gas or dust generated by the first groove 21 enters the isolation space 40 instead of entering the atmosphere, preventing the operator from inhaling and ensuring the personal safety and health of the operator. Specifically, the sensor is a pressure sensor. When the isolation space 40 is in a vacuum state, it does not alarm. Once air enters the isolation space 40, causing the air pressure in the isolation space 40 to rise, the pressure sensor will alarm immediately, with high sensitivity and timely reminder. Optionally, the sensor can be wirelessly controlled.

[0049] Preferably, the first groove 21 and the second groove 22 share a common bottom. The groove materials of the first groove 21 and the second groove 22 are light-transmitting materials. Through the above settings, on the one hand, the laser of the marking machine 300 can pass through the groove to mark the substrate 200, and on the other hand, the first groove 21 and the second groove 22 form an integral body by sharing a common bottom, which facilitates the simultaneous sealing of the two by the processing table 10. Specifically, the shared bottom is adhesively sealed to the side walls of the first groove 21 and the second groove 22 respectively. Through the above method, the sealing of the first groove 21 and the second groove 22 is realized. Further, when the sealing assembly 20 is actually manufactured, two groove walls can be made first, and after the two groove walls are sleeved together, the bottom is adhesively bonded to the two groove walls at the same time. Optionally, the groove is a lens, which can not only be penetrated by the laser but also facilitate the operator to see the internal situation.

[0050] Preferably, the first trough body 21 and the second trough body 22 are both cylindrical and coaxially arranged. On the one hand, they match the shape of the substrate 200. On the other hand, the cylindrical end face and the processing table 10 are easier to seal, and it is less likely to leak at the sharp corners. The coaxial arrangement ensures the uniformity of the isolation space 40.

[0051] Optionally, the laser marking machine 300 also includes a driving member (not shown in the figure), and the sealing component 20 or the processing table 10 is connected to the output end of the driving member, and the driving member is used to drive the processing table 10 to abut against the sealing component 20 to seal the first trough body 21 and the second trough body 22. Through the above structure, the processing table 10 can be separated from the sealing component 20 and the substrate 200 can be placed on the processing table 10. After the processing table 10 abuts against the sealing component 20, the driving member provides a continuous thrust to keep the processing table 10 and the sealing component 20 abutting to ensure the sealing of the first trough body 21 and the second trough body 22. It should be noted that the designer can choose to fix one of the sealing component 20 and the processing table 10 according to actual conditions, and the other is connected to the output end of the driving member to ensure that it avoids the marking machine 300, which is not limited here.

[0052] Preferably, the processing table 10 is made of rubber material, which is soft and has a long service life, and increases the contact area with the sealing component 20 to improve the sealing effect.

[0053] Specifically, Figure 3 As shown, the processing table 10 includes a base 11 and a boss 12 protruding from the base 11, and the base 11 is used to seal the first trough body 21 and the second trough body 22. The substrate 200 can be placed on the boss 12 to prevent the base 11 with only one layer. If the substrate 200 is placed at an angle, the groove wall of the first trough body 21 will crush the substrate 200.

[0054] Optionally, the height of the air inlet pipe 60 is higher than that of the air outlet pipe 50, which is conducive to the gas entering the first tank body 21 to take away dust and arsenic-containing gas. It should be noted that the intersection of the air inlet pipe 60 and the air outlet pipe 50 with the first tank body 21 is sealed.

[0055] This embodiment also provides a semiconductor production line, including a marking machine 300 and the above-mentioned laser marking anti-leakage mechanism, and the laser of the marking machine 300 can pass through the laser marking anti-leakage mechanism to mark the substrate 200. By adopting the above-mentioned laser marking anti-leakage mechanism, people can be completely prevented from inhaling dust and gas, ensuring personal safety and health.

[0056] This embodiment also provides a laser marking method, using the above-mentioned laser marking anti-leakage mechanism, and the above-mentioned laser marking method includes:

[0057] S1: placing the substrate 200 on the processing table 10;

[0058] S2: Seal the first tank body 21 and the second tank body 22 with the processing table 10;

[0059] S3: Evacuate the isolation space 40 and turn on the inductor;

[0060] S4: Exhaust through the exhaust pipe 50 and intake air through the intake pipe 60;

[0061] S5: Start marking. The dust and gas in the first tank body 21 are drawn away from the exhaust pipe 50. By adopting the above laser marking anti-leakage mechanism, the sealed environment can be monitored and secondary protection can be provided, completely preventing gas and dust from entering the atmosphere.

[0062] Obviously, the above embodiments of the present invention are merely examples for clearly explaining the present invention, rather than limitations on the implementation manners of the present invention. For those of ordinary skill in the art, various obvious changes, re-adjustments and substitutions can be made without departing from the protection scope of the present invention. It is not necessary and impossible to enumerate all the implementation manners here. Any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention shall be included within the protection scope of the claims of the present invention.

Claims

1. Laser marking anti-leakage mechanism, used to assist in marking the substrate (200), characterized in that, The laser marking anti-leakage mechanism comprises: A processing table (10) for carrying the substrate (200); A sealing assembly (20), comprising a first trough body (21) and a second trough body (22), wherein the first trough body (21) can be sealed by the processing table (10), and the substrate (200) is located inside the first trough body (21); the second trough body (22) is arranged outside the first trough body (21), and the second trough body (22) can be sealed by the processing table (10), and an isolation space (40) is formed between the first trough body (21) and the second trough body (22); A vacuum tube (30) is inserted through the second tank body (22); the vacuum tube (30) and the second tank body (22) are sealed at their connection; one end of the vacuum tube (30) is in communication with the isolated space (40); and one end of the vacuum tube (30) is connected to a vacuum device to make the isolated space (40) evacuated; A sensor is disposed in the isolated space (40) and generates an alarm when the isolated space (40) is in a non-vacuum state; an air inlet pipe (60) communicating with the interior of the first tank body (21); and An air outlet pipe (50) is communicated with the interior of the first tank body (21), and gas can enter from the air inlet pipe (60) and be blown out from the air outlet pipe (50); The first trough body (21) and the second trough body (22) share a trough bottom, and the trough bottom material of the first trough body (21) and the second trough body (22) is a light-transmitting material; The first tank body (21) and the second tank body (22) are both cylindrical and coaxially arranged; The processing table (10) is made of rubber material.

2. The laser marking anti-leakage mechanism according to claim 1, characterized in that, The groove bottom is respectively bonded and sealed to the side wall of the first groove body (21) and the side wall of the second groove body (22).

3. The laser marking anti-leakage mechanism according to claim 2, characterized in that, The laser marking anti-leakage mechanism further comprises a driving member, the sealing assembly (20) or the processing table (10) being drivingly connected to an output end of the driving member, and the driving member being used to drive the processing table (10) to abut against the sealing assembly (20) to seal the first trough body (21) and the second trough body (22).

4. The laser marking anti-leakage mechanism according to any one of claims 1-3, characterized in that, The processing station (10) comprises: A base (11) capable of sealing the first trough body (21) and the second trough body (22); and The boss (12) is protrudingly arranged on the base (11), and the substrate (200) can be placed on the boss (12).

5. The laser marking anti-leakage mechanism according to any one of claims 1-3, characterized in that, The sensor is an air pressure sensor.

6. A semiconductor production line, including a marking machine (300), characterized in that, It comprises the laser marking anti-leakage mechanism as claimed in any one of claims 1 to 5, and the laser of the marking machine (300) can pass through the laser marking anti-leakage mechanism to mark the substrate (200).

7. A laser marking method, characterized in that, Using the laser marking anti-leakage mechanism as described in any one of claims 1 to 5, the laser marking method comprises: S1: placing a substrate (200) on the processing table (10); S2: using the processing table (10) to seal the first trough body (21) and the second trough body (22); S3: evacuating the isolation space (40) and turning on the sensor; S4: The air outlet pipe (50) sucks air, and the air inlet pipe (60) intakes air. S5: Marking starts, and the dust and gas in the first tank (21) are sucked away from the air outlet pipe (50).

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