Integrated circuit for a fluid ejection device and fluid ejection device

Abstract

Integrated circuits and fluid ejection devices for fluid ejection devices are disclosed. An integrated circuit for driving a plurality of fluid actuation devices includes an interface, a digital circuit, an analog circuit, and control logic. The digital circuit outputs digital signals to the interface. The analog circuit outputs analog signals to the interface. The control logic enables the digital circuit or the analog circuit.

Description

[0001] This application is a divisional application of the Chinese Invention Patent Application with the application date of February 6, 2019, the application number of 2019800891929, and the invention name of “Integrated Circuit and Fluid Ejection Apparatus for Fluid Ejection Apparatus”. TECHNICAL FIELD

[0002] The present disclosure relates to an integrated circuit and a fluid ejection apparatus for a fluid ejection apparatus. BACKGROUND

[0003] As one example of a fluid ejection system, an inkjet printing system can include a printhead, an ink supply that supplies liquid ink to the printhead, and an electronic controller that controls the printhead. As one example of a fluid ejection apparatus, the printhead ejects drops of ink through a plurality of orifices or nozzles and ejects the drops of ink toward a print medium, such as a sheet of paper, in order to print onto the print medium. In some examples, the nozzles are arranged in at least one column or array such that ejection of ink in proper order from the nozzles as the printhead and print medium are moved relative to each other causes characters or other images to be printed onto the print medium. SUMMARY

[0004] An integrated circuit for a fluid ejection apparatus that includes a plurality of fluid actuation devices is disclosed, the integrated circuit comprising: an interface; an analog circuit to output an analog signal to the interface; and a timer to override the analog signal from the analog circuit on the interface in response to an elapse of the timer.

[0005] A fluid ejection apparatus is also disclosed, the fluid ejection apparatus including a plurality of fluid actuation devices and an integrated circuit according to an embodiment of the present disclosure to drive the plurality of fluid actuation devices. BRIEF DESCRIPTION OF DRAWINGS

[0006] Figure 1A is a block diagram illustrating one example of an integrated circuit to drive a plurality of fluid actuation devices.

[0007] Figure 1B is a block diagram illustrating another example of an integrated circuit to drive a plurality of fluid actuation devices.

[0008] Figure 2A is a block diagram illustrating another example of an integrated circuit to drive a plurality of fluid actuation devices.

[0009] Figure 2B is a block diagram illustrating another example of an integrated circuit to drive a plurality of fluid actuation devices.

[0010] Figure 3Ais a block diagram illustrating another example of an integrated circuit for driving a plurality of fluid actuation devices.

[0011] Figure 3B is a block diagram illustrating another example of an integrated circuit for driving a plurality of fluid actuation devices.

[0012] Figure 4 is a block diagram illustrating another example of an integrated circuit for driving a plurality of fluid actuation devices.

[0013] Figure 5 is a schematic diagram illustrating one example of a circuit coupled to an interface.

[0014] Figure 6A and 6B One example of a fluid ejection die is shown.

[0015] Figure 7 is a block diagram illustrating one example of a fluid ejection system. DETAILED DESCRIPTION

[0016] In the following detailed description, references are made to the accompanying drawings that form a part hereof, and in which are shown by way of illustration specific examples in which the disclosure can be practiced. It is to be understood that other examples can be utilized and structural or logical changes can be made without departing from the scope of the present disclosure. The following detailed description, therefore, is not to be taken in a limiting sense, and the scope of the present disclosure is defined by the appended claims. It should be understood that features of the many examples described herein can be combined with each other, in part, or in whole.

[0017] Fluid ejection dies, such as thermal inkjet (TIJ) dies, can be elongated silicon dies. To minimize the total number of contact pads on the die, it is desirable for at least some of the contact pads to provide multiple functions. Accordingly, the integrated circuits disclosed herein (e.g., fluid ejection dies) include multi-purpose contact pads (e.g., sense pads) that are coupled to memory, thermal sensors, internal test logic, timer circuits, crack detectors, and / or other circuits. The multi-purpose contact pads receive signals from each of the circuits (e.g., one at a time) that can be read by printer logic. By using a single contact pad for multiple functions, the number of contact pads on the integrated circuit can be reduced. In addition, the printer logic coupled to the contact pads can be simplified.

[0018] As used in the present disclosure, a "logic high" signal is a logic "1" or "on" signal, or a signal having a voltage approximately equal to the voltage supplied to the logic power supply of an integrated circuit (e.g., between 1.8V and 15V, such as 5.6V). As used in the present disclosure, a "logic low" signal is a logic "0" or "off" signal, or a signal having a voltage approximately equal to the voltage of the logic power ground return of the logic power supply supplied to an integrated circuit (e.g., approximately 0V).

[0019] Figure 1A is a block diagram illustrating one example of an integrated circuit 100 for driving a plurality of fluid actuation devices. The integrated circuit 100 includes an interface (e.g., a sense interface) 102, a digital circuit 104, an analog circuit 106, and control logic 108. The control logic 108 is electrically coupled with the interface 102, with the digital circuit 104 through a signal path 103, and with the analog circuit 106 through a signal path 105. The interface 102 can include contact pads, pins, bumps, or wires. In one example, the interface 102 is configured to contact a single printer-side contact to transmit signals to and from the single printer-side contact, such as the single printer-side contact of the fluid ejection system 700, which will be described below with reference to Figure 7 .

[0020] The digital circuit 104 outputs digital signals to the interface 102 through the control logic 108. In one example, the digital circuit 104 includes a memory. In another example, the digital circuit 104 includes a timer. In another example, the digital circuit 104 includes a configuration register. In yet another example, the digital circuit 104 includes a shift register.

[0021] The analog circuit 106 outputs analog signals to the interface 102 through the control logic 108. In one example, the analog circuit 106 includes a resistor wiring. The resistor wiring can be separate from and extend along at least a subset of the fluid driving devices (e.g., the fluid actuation devices 608, which will be described below with reference to Figure 6A and 6B In another example, the analog circuit 106 outputs analog signals representative of a state of the integrated circuit 100, where the state includes at least one of a crack (e.g., sensed by a crack detector) and a temperature (e.g., sensed by a temperature or thermal sensor). In another example, the analog circuit 106 includes a crack detector. In yet another example, the analog circuit 106 includes a thermal sensor.

[0022] The control logic 108 enables the digital circuit 104 or the analog circuit 106 such that the output of the digital circuit 104 or the analog circuit 106 can be read by the interface 102. In one example, the control logic 108 enables the digital circuit 104 or the analog circuit 106 based on data passed to the integrated circuit 100. The control logic 108 can include transistor switches, tri-state buffers, and / or other suitable logic circuits for controlling the operation of the integrated circuit 100.

[0023] Figure 1B is a block diagram illustrating another example of an integrated circuit 120 driving a plurality of fluid actuation devices. The integrated circuit 120 is similar to the previously described integrated circuit 100, except that the integrated circuit 120 also includes a configuration register 122. The configuration register 122 is electrically coupled to the control logic 108 by a signal path 121. The configuration register 122 can enable or disable the digital circuit 104 and enable or disable the analog circuit 106 based on data stored in the configuration register. Figure 1A

[0024] The configuration register 122 can be a memory device (e.g., non-volatile memory, a shift register, etc.) and can include any suitable number of bits (e.g., 4 bits to 24 bits, such as 12 bits). In some examples, the configuration register 122 can also store configuration data for testing the integrated circuit 120, detecting cracks within the substrate of the integrated circuit 120, enabling timers of the integrated circuit 120, setting analog delays of the integrated circuit 120, verifying operation of the integrated circuit 120, or other functions for configuring the integrated circuit 120.

[0025] Figure 2A is a block diagram illustrating another example of an integrated circuit 200 for driving a plurality of fluid actuation devices. The integrated circuit 200 includes an interface (e.g., a sense interface) 202, a timer 204, and an analog circuit 206. The interface 202 is electrically coupled to the timer 204 and the analog circuit 206. The analog circuit 206 outputs an analog signal to the interface 202. The timer 204 overrides the analog signal from the analog circuit 206 on the interface 202 in response to the timer expiring. In one example, the interface 202 and the analog circuit 206 are similar to the previously described interface 102 and analog circuit 106. Figure 1A 1B

[0026] Figure 2B ​​​is a block diagram illustrating another example of an integrated circuit 220 for driving a plurality of fluid actuation devices. The integrated circuit 220 includes an interface 202, an analog circuit 206, and a timer 204. In addition, the integrated circuit 220 includes control logic 208, a pull-down device 210, a digital circuit 214, and a configuration register 222. The control logic 208 is electrically coupled to the sensing interface 202, to the analog circuit 206 by a signal path 205, to the pull-down device 210 by a signal path 209, to the digital circuit 214 by a signal path 213, and to the configuration register 222 by a signal path 221. The pull-down device 210 is electrically coupled to the timer 204 by a signal path 212.

[0027] The digital circuit 214 outputs a digital signal to the interface 202. In one example, the digital circuit 214 is similar to the digital circuit 104 previously described and illustrated with reference to FIG. 1. Figure 1A and 1B The control logic 208 enables the digital circuit 214 or the analog circuit 206. In response to the timer expiring, the timer 204 overrides the analog signal from the analog circuit 206 on the interface 202, or the digital signal from the digital circuit 214 on the interface 202. In this example, the timer 204 overrides the analog signal from the analog circuit 206 on the interface 202 or the digital signal from the digital circuit 214 on the interface 202 by enabling the pull-down device 210. The pull-down device 210 pulls the interface 202 to a hard low (e.g., about 0 V or ground), which overrides any other signal on the interface 202. The configuration register 222 can enable or disable the analog circuit 206, enable or disable the digital circuit 214, and enable or disable the timer 204. In one example, the configuration register 222 is similar to the configuration register 122 previously described and illustrated with reference to FIG. 1. Figure 1B

[0028] Figure 3A is a block diagram illustrating another example of an integrated circuit 300 for driving a plurality of fluid actuation devices. The integrated circuit 300 includes an output (e.g., sensing) interface 302, a shift register 304, and a data interface 306. The shift register 304 shifts nozzle data into the integrated circuit 300 through the data interface 306 and shifts nozzle data out of the integrated circuit 300 through the output interface 302. In this way, the shift register 304 can be tested to ensure that the nozzle data input to the integrated circuit 300 matches the nozzle data output from the integrated circuit 300.

[0029] Figure 3B ​This is a block diagram illustrating another example of an integrated circuit 320 for driving multiple fluid actuation devices. The integrated circuit 320 includes an output (e.g., sensing) interface 302, a shift register 304, and a data interface 306. Furthermore, the integrated circuit 320 includes control logic 308, a delay circuit 310, a startup interface 312, analog circuitry 314, and a configuration register 322. The control logic 308 is electrically coupled to the output interface 302, to the shift register 304 via signal path 303, to the delay circuit 310 via signal path 309, to the analog circuit 314 via signal path 313, and to the configuration register 322 via signal path 321. The delay circuit 310 is electrically coupled to the startup interface 312.

[0030] The delay circuit 310 receives a start signal through the start interface 312 and outputs a delayed start signal through the output interface 302. In this way, the delay circuit 310 can be tested to ensure that the delay functions as expected. In one example, the configuration register 322 stores data to enable or deenable the shifting of nozzle data out of the integrated circuit 320 through the output interface 302. In another example, the configuration register 322 stores data to enable or deenable the output of the delayed start signal through the output interface 302. In yet another example, the configuration register 322 stores data to enable or deenable the analog circuit 314. In one example, the configuration register 322 is similar to the previously referenced... Figure 1B The configuration register 122 is described and shown.

[0031] Analog circuit 314 outputs an analog signal to output interface 302. In one example, analog circuit 314 is similar to the one previously referenced. Figure 1A and 1B The analog circuit 106 is described and shown. Control logic 308 enables analog circuit 314 to output analog signals to output interface 302, enables shift register 304 to shift nozzle data out of integrated circuit 320 through output interface 302, or enables delay circuit 310 to receive start signal through start interface 312 and output delayed start signal through output interface 302.

[0032] Output interface 302, data interface 306, and start interface 312 may each include contact pads, pins, bumps, or lines. In one example, each output interface 302, data interface 306, and start interface 312 is configured to contact a corresponding printer-side contact to transmit signals to and from the printer-side contact.

[0033] Figure 4is a block diagram illustrating another example of an integrated circuit 400 for driving a plurality of fluid actuation devices. The integrated circuit 400 includes a sense interface 402, a shift register 404, a data interface 406, control logic 408, a delay circuit 410, an enable interface 412, a crack detector 414, a thermal sensor 416, a memory 418, a configuration register 422, a timer 424, and a pull-down device 426. The control logic 408 is electrically coupled to the sense interface 402, to the shift register 404 by a signal path 403, to the delay circuit 410 by a signal path 409, to the crack detector 414 by a signal path 413, to the thermal sensor 416 by a signal path 415, to the memory 418 by a signal path 417, to the pull-down device 426 by a signal path 425, and to the configuration register 422 by a signal path 421. The shift register 404 is electrically coupled to the data interface 406. The delay circuit 410 is electrically coupled to the enable interface 412. The pull-down device 426 is electrically coupled to the timer 424 by a signal path 423.

[0034] The shift register 404 and the delay circuit 410 are similar to the shift register 304 and the delay circuit 310 previously described and illustrated with reference to Figure 3B The timer 424 and the pull-down device 426 are similar to the timer 204 and the pull-down device 210 previously described and illustrated with reference to Figure 2B The crack detector 414 outputs an analog signal to the sense interface 402 indicative of a crack state of the integrated circuit 400. In one example, the crack detector 414 includes a resistor trace that is separate from and extends along at least a subset of the fluid actuation devices (e.g., the fluid actuation devices 608 of FIG. 6). The thermal sensor 416 outputs an analog signal to the sense interface 402 indicative of a temperature state of the integrated circuit 400. In one example, the thermal sensor 416 includes a thermal diode or another suitable device for sensing temperature. The memory 418 can store data for the integrated circuit 400 or for a printer to which the integrated circuit 400 is connected. The memory 418 can be read or written through the sense interface 402. Figure 6A 6B The crack detector 414 outputs an analog signal to the sense interface 402 indicative of a crack state of the integrated circuit 400. In one example, the crack detector 414 includes a resistor trace that is separate from and extends along at least a subset of the fluid actuation devices (e.g., the fluid actuation devices 608 of FIG. 6). The thermal sensor 416 outputs an analog signal to the sense interface 402 indicative of a temperature state of the integrated circuit 400. In one example, the thermal sensor 416 includes a thermal diode or another suitable device for sensing temperature. The memory 418 can store data for the integrated circuit 400 or for a printer to which the integrated circuit 400 is connected. The memory 418 can be read or written through the sense interface 402.

[0035] ​Control logic 408 can enable or disable shift register 404, delay circuit 410, crack detector 414, thermal sensor 416, memory 418, and timer 424. In one example, control logic 408 can enable one of shift register 404, delay circuit 410, crack detector 414, thermal sensor 416, memory 418, and timer 424 at a time. In another example, control logic 408 can enable timer 424 and one of shift register 404, delay circuit 410, crack detector 414, thermal sensor 416, and memory 418. In one example, control logic 408 can enable or disable shift register 404, delay circuit 410, crack detector 414, thermal sensor 416, memory 418, and timer 424 according to data stored in configuration register 422. In one example, configuration register 422 is similar to configuration register 122 described and shown previously with respect to FIG. 1. In another example, control logic 408 can enable or disable shift register 404, delay circuit 410, crack detector 414, thermal sensor 416, memory 418, and timer 424 according to data passed to integrated circuit 400, such as data passed to integrated circuit 400 through data interface 406. Figure 1B configuration register 122 described and shown previously with respect to FIG. 1. In another example, control logic 408 can enable or disable shift register 404, delay circuit 410, crack detector 414, thermal sensor 416, memory 418, and timer 424 according to data passed to integrated circuit 400, such as data passed to integrated circuit 400 through data interface 406.

[0036] Figure 5 is a schematic diagram illustrating one example of a circuit 500 coupled to an interface (e.g., a sense pad) 502. Circuit 500 includes a plurality of memory cells 5121through 512 N where "N" is any suitable number of memory cells. Circuit 500 also includes a plurality of thermal sensors 5141through 514 M where "M" is any suitable number of thermal sensor cells. In addition, circuit 500 includes transistors 506, 510, 538, and 542, multiplexer 518, tri-state buffer 522, and crack detector 544. Each memory cell 5121through 512 N includes floating gate transistor 550 and transistors 552 and 556. Each thermal sensor 5141through 514 M includes transistor 570 and thermal diode 572.

[0037] Sense pad 502 is electrically coupled to one side of the source-drain path of transistor 506, each thermal sensor 5141through 514 Mone side of the source-drain path of the floating gate transistor 550. The gate of the transistor 552 is electrically coupled to the memory enable signal path 504. The other side of the source-drain path of the transistor 552 is electrically coupled to one side of the source-drain path of the transistor 556. The gate of the transistor 556 is electrically coupled to the bit enable signal path 558. The other side of the source-drain path of the transistor 556 is electrically coupled to the common or ground node 540. N The other side of the source-drain path of the floating gate transistor 550 is electrically coupled to one side of the source-drain path of the transistor 552. The gate of the transistor 552 is electrically coupled to the memory enable signal path 504. The other side of the source-drain path of the transistor 552 is electrically coupled to one side of the source-drain path of the transistor 556. The gate of the transistor 556 is electrically coupled to the bit enable signal path 558. The other side of the source-drain path of the transistor 556 is electrically coupled to the common or ground node 540.

[0038] Although the memory cell 5121 is shown and described herein, other memory cells 5122 through 512 N The other side of the source-drain path of the floating gate transistor 550 is electrically coupled to one side of the source-drain path of the transistor 552. The gate of the transistor 552 is electrically coupled to the memory enable signal path 504. The other side of the source-drain path of the transistor 552 is electrically coupled to one side of the source-drain path of the transistor 556. The gate of the transistor 556 is electrically coupled to the bit enable signal path 558. The other side of the source-drain path of the transistor 556 is electrically coupled to the common or ground node 540.

[0039] Although the thermal sensor 5141 is shown and described herein, other thermal sensors 5142 through 514 M The other side of the source-drain path of the floating gate transistor 550 is electrically coupled to one side of the source-drain path of the transistor 552. The gate of the transistor 552 is electrically coupled to the memory enable signal path 504. The other side of the source-drain path of the transistor 552 is electrically coupled to one side of the source-drain path of the transistor 556. The gate of the transistor 556 is electrically coupled to the bit enable signal path 558. The other side of the source-drain path of the transistor 556 is electrically coupled to the common or ground node 540.

[0040] The enable input of the tri-state buffer 522 is electrically coupled to the test enable signal path 524. The input of the tri-state buffer 522 is electrically coupled to the output of the multiplexer 518 through the signal path 520. The control input of the multiplexer 518 is electrically coupled to the test mode signal path 516. The first input of the multiplexer 518 is electrically coupled to the ejection column 530 through the signal path 526. The second input of the multiplexer 518 is electrically coupled to the ejection column 530 through the signal path 528. The ejection column 530 is electrically coupled to the initiation interface 532 and the data interface 534.

[0041] The gate of transistor 538 is electrically coupled with the timer elapsed signal path 536. The other side of the source-drain path of transistor 538 is electrically coupled with a common or ground node 540. The gate of transistor 542 is electrically coupled with the crack detector enable signal path 541. The other side of the source-drain path of transistor 542 is electrically coupled with one side of a crack detector 544. The other side of the crack detector 544 is electrically coupled with the common or ground node 540.

[0042] The memory enable signal on the memory enable signal path 504 determines whether the memory cells 5121-512 N may be accessed. In response to a logic high memory enable signal, transistors 506, 510, and 552 are turned on (i.e., conductive) to enable access to the memory cells 5121-512 N . In response to a logic low memory enable signal, transistors 506, 510, and 552 are turned off to disable access to the memory cells 5121-512 N . Using a logic high memory enable signal, a bit enable signal can be enabled to access a selected memory cell 5121-512 N . Using a logic high bit enable signal, transistor 556 is turned on to access the corresponding memory cell. Using a logic low bit enable signal, transistor 556 is turned off to prevent access to the corresponding memory cell. Using a logic high memory enable signal and a logic high bit enable signal, read and write operations can be performed on the corresponding memory cell by sensing the floating gate transistor 550 through the sense pad 502. In one example, the memory enable signal can be based on a data bit stored in a configuration register, such as the configuration register 422 of Figure 4 . In another example, the memory enable signal can be based on data communicated from a fluid ejection system to the circuit 500, such as the fluid ejection system 700 described below with reference to Figure 7 .

[0043] Each thermal sensor 5141-514 M may be enabled or disabled by a corresponding thermal sensor enable signal on the thermal sensor enable signal path 569. In response to a logic high thermal sensor enable signal, the transistor 570 for the corresponding thermal sensor 5141-514 M is turned on to enable the thermal sensor by electrically connecting the thermal diode 572 to the sense pad 502. In response to a logic low thermal sensor enable signal, the transistor 570 for the corresponding thermal sensor 5141-514 MThe transistor 570 is turned off to deactivate the thermal sensor by electrically disconnecting the thermal diode 572 from the sensing pad 502. When the thermal sensor is enabled, it can be read via the sensing pad 502, for example, by applying current to the sensing pad 502 and sensing a voltage on the sensing pad 502 indicating temperature. In one example, the thermal sensor enable signal can be based on a configuration register such as... Figure 4 The data in configuration register 422. In another example, the thermal sensor enable signal can be based on data transmitted from the fluid jet system to circuit 500.

[0044] The tri-state buffer 522 can be enabled or deenabled in response to a test enable signal on test enable signal path 524. A logic high test enable signal enables the tri-state buffer 522 to pass a signal from signal path 520 to sense pad 502. A logic low test enable signal deactivates the tri-state buffer 522 and outputs a high-impedance signal to sense pad 502. Nozzle array 530 may include delay circuitry and a shift register for initiating the fluid actuation device. A test mode signal on test mode signal path 516 determines whether to test the delay circuitry or shift register of nozzle array 530 and controls multiplexer 518 accordingly. To test the shift register of nozzle array 530, data is passed to nozzle array 530 via data interface 534 and shifted out of the shift register to signal path 528, through multiplexer 518 and tri-state buffer 522 to sense pad 502. To test the delay circuitry of nozzle array 530, a start signal from start interface 532 is transmitted to nozzle array 530. After passing through the delay circuitry, the delayed start signal is transmitted to signal path 526, and then through multiplexer 518 and tri-state buffer 522 to sense pad 502. In one example, the test enable signal and test mode signal can be based on data stored in configuration registers, such as... Figure 4 The data in configuration register 422. In another example, the test enable signal and test mode signal can be based on data passed from the fluid jet system to circuit 500.

[0045] Transistor 538 can provide a pull-down device that enables the pull-down device in response to a timer elapsed signal on the timer elapsed signal path 536. The timer elapsed signal is generated by a timer such as... Figure 4 Timer 424 is provided. In response to a logic low timer elapsed signal, transistor 538 is turned off. In response to a logic high timer elapsed signal, transistor 538 is turned on to pull the signal on contact pad 502 to the voltage of common or ground node 540. In one example, this can be determined based on data stored in a configuration register, such as... Figure 4The timer that generates the elapsed signal can be enabled or deenabled based on the data in configuration register 422. In another example, the timer that generates the elapsed signal can be enabled or deenabled based on data passed from the fluid jet system to circuit 500.

[0046] The crack detector 544 can be enabled or deenabled in response to a crack detector enable signal on crack detector enable signal path 541. In response to a logic high crack detector enable signal, transistor 542 is turned on to enable the crack detector 544 by electrically connecting it to the sensing pad 502. In response to a logic low crack detector enable signal, transistor 542 is turned off to deenable the crack detector 544 by electrically disconnecting it from the sensing pad 502. When the crack detector 544 is enabled, it can be read from the sensing pad 502, for example, by applying current or voltage to the sensing pad 502 and sensing the voltage or current on the sensing pad 502 indicating the state of the crack detector 544, respectively. In one example, the crack detector enable signal can be based on data stored in a configuration register, such as... Figure 4 The data in configuration register 422. In another example, the crack detector enable signal can be based on data passed from the fluid jetting system to circuit 500.

[0047] The startup interface 532 and data interface 534 may each include contact pads, pins, bumps, or lines. In one example, each startup interface 532, data interface 534, and sensing pad 502 is configured to contact a corresponding printer-side contact to transmit signals to and from the printer-side contact. Thus, through a single sensing pad 502, the printer can communicate with memory units 5121 to 512. N Thermal sensors 5141 to 514 M The nozzle array 530, transistor 538 and crack detector 544 are connected.

[0048] Figure 6A An example of a fluid jetting template 600 is shown, while Figure 6B An enlarged view of the end of the fluid jetting template 600 is shown. In one example, the fluid jetting template 600 includes... Figure 1A Integrated circuit 100, Figure 1B Integrated circuit 120, Figure 2A Integrated circuit 200, Figure 2B Integrated circuit 220, Figure 3A Integrated circuit 300, Figure 3B Integrated circuit 320, Figure 4 Integrated circuit 400 or Figure 5circuit 500. The die 600 includes a first column of contact pads 602, a second column of contact pads 604, and a column of fluid actuation devices 608.

[0049] The second column of contact pads 604 is aligned with the first column of contact pads 602 and is held at a distance from the first column of contact pads 602 (i.e., along the Y-axis). The column of fluid actuation devices 608 is arranged longitudinally with the first column of contact pads 602 and the second column of contact pads 604. The column of fluid actuation devices 608 is also arranged between the first column of contact pads 602 and the second column of contact pads 604. In one example, the fluid actuation devices 608 are nozzles or fluid pumps to eject fluid droplets.

[0050] In one example, the first column of contact pads 602 includes 6 contact pads. The first column of contact pads 602 can include, in order, the following contact pads: a data contact pad 610, a clock contact pad 612, a logic power ground return contact pad 614, a multipurpose input / output contact (e.g., sense) pad 616, a first high voltage power supply contact pad 618, and a first high voltage power ground return contact pad 620. Thus, the first column of contact pads 602 includes the data contact pad 610 at the top of the first column 602, the first high voltage power ground return contact pad 620 at the bottom of the first column 602, and the first high voltage power supply contact pad 618 directly above the first high voltage power ground return contact pad 620. Although the contact pads 610, 612, 614, 616, 618, and 620 are shown in a particular order, in other examples, the contact pads can be arranged in a different order.

[0051] In one example, the second column of contact pads 604 includes 6 contact pads. The second column of contact pads 604 can include, in order, the following contact pads: a second high voltage power ground return contact pad 622, a second high voltage power supply contact pad 624, a logic reset contact pad 626, a logic power contact pad 628, a mode contact pad 630, and a boot contact pad 632. Thus, the second column of contact pads 604 includes the second high voltage power ground return contact pad 622 at the top of the second column 604, the second high voltage power supply contact pad 624 directly below the second high voltage power ground return contact pad 622, and the boot contact pad 632 at the bottom of the second column 604. Although the contact pads 622, 624, 626, 628, 630, and 632 are shown in a particular order, in other examples, the contact pads can be arranged in a different order.

[0052] In one example, the data contact pad 610 can provide Figure 3A or the data interface 306 of FIGS. 3A or 3B, Figure 4data interface 406 of the Figure 5 data interface 534 of the Figure 1A sensing interface 102 of the Figure 2A sensing interface 202 of the Figure 3A sensing interface 302 of the Figure 4 sensing interface 402 of the Figure 5 sensing pad 502 of the Figure 3B activation interface 312 of the Figure 4 activation interface 412 of the Figure 5 activation interface 532 of the

[0053] The data contact pads 610 can be used to input serial data to the die 600 for selecting fluid actuation devices, memory bits, thermal sensors, configuration modes (e.g., through configuration registers), etc. The data contact pads 610 can also be used to output serial data from the die 600 for reading memory bits, configuration modes, status information (e.g., through status registers), etc. The clock contact pads 612 can be used to input a clock signal to the die 600 to shift serial data on the data contact pads 610 into the die, or to shift serial data from the die to the data contact pads 610. The logic power ground return contact pads 614 provide a ground return path for logic power (e.g., about 0 V) provided to the die 600. In one example, the logic power ground return contact pads 614 are electrically coupled with the semiconductor (e.g., silicon) substrate 640 of the die 600. The multipurpose input / output contact pads 616 can be used for digital test modes and / or analog sensing of the die 600.

[0054] The first high voltage power supply contact pads 618 and the second high voltage power supply contact pads 624 can be used to provide high voltage (e.g., about 32 V) to the die 600. The first high voltage power ground return contact pads 620 and the second high voltage power ground return contact pads 622 can be used to provide a power ground return (e.g., about 0 V) for the high voltage power supply. The high voltage power ground return contact pads 620 and 622 are not directly electrically connected with the semiconductor substrate 640 of the die 600. The particular contact pad order of the high voltage power supply contact pads 618 and 624 and the high voltage power ground return contact pads 620 and 622 as the innermost contact pads can improve power delivery to the die 600. Having the high voltage power ground return contact pads 620 and 622 at the bottom of the first column 602 and the top of the second column 604, respectively, can improve manufacturing reliability and can improve ink short protection.

[0055] The logic reset contact pad 626 can be used as a logic reset input to control the operational state of the die 600. The logic power contact pad 628 can be used to provide a logic power supply (e.g., between about 1.8 V and 15 V, such as 5.6 V) to the die 600. The mode contact pad 630 can act as a logic input to control access to an enable / disable configuration mode (i.e., a functional mode) of the die 600. The enable contact pad 632 can be used as a logic input to lock loaded data from the data contact pads 610 and enable a fluid actuation device or memory element of the die 600.

[0056] The die 600 includes an elongated substrate 640 having a length 642 (along the Y-axis), a thickness 644 (along the Z-axis), and a width 646 (along the X-axis). In one example, the length 642 is at least 20 times the width 646. The width 646 can be 1 millimeter or less, and the thickness 644 can be less than 500 microns. The fluid actuation device 608 (e.g., fluid actuation logic) and the contact pads 610-632 are provided on the elongated substrate 640 and arranged along the length 642 of the elongated substrate. The fluid actuation device 608 has a strip length 652 that is less than the length 642 of the elongated substrate 640. In one example, the strip length 652 is at least 1.2 cm. The contact pads 610-632 can be electrically coupled with the fluid actuation logic. A first column 602 of the contact pads can be arranged near a first longitudinal end 648 of the elongated substrate 640. A second column 604 of the contact pads can be arranged near a second longitudinal end 650 of the elongated substrate 640 opposite the first longitudinal end 648.

[0057] Figure 7 FIG. 7 is a block diagram illustrating one example of a fluid ejection system 700. The fluid ejection system 700 includes a fluid ejection assembly, such as a printhead assembly 702, and a fluid supply assembly, such as an ink supply assembly 710. In the illustrated example, the fluid ejection system 700 also includes a service station assembly 704, a carriage assembly 716, a print media transport assembly 718, and an electronic controller 720. While the following description provides examples of systems and assemblies for fluid handling with respect to ink, the disclosed systems and assemblies are also applicable to handling fluids other than ink.

[0058] The printhead assembly 702 includes at least one printhead 706 as previously referenced Figure 6A and 6BThe printhead or fluid ejection die 600 described and shown ejects drops of ink or fluid through a plurality of orifices or nozzles. In one example, the drops are directed toward a media, such as print media 724, for printing onto the print media 724. In one example, the print media 724 comprises any type of suitable sheet material, such as paper, cardstock, transparency film, Mylar, fabric, and the like. In another example, the print media 724 comprises media for three-dimensional (3D) printing, such as a powder bed, or media for bioprinting and / or drug discovery testing, such as a reservoir or container. In one example, the nozzles are arranged in at least one column or array such that ejection of ink in proper order from the nozzles as the printhead assembly 702 and the print media 724 are moved relative to each other results in characters, symbols, and / or other graphics or images being printed onto the print media 724.

[0059] The ink supply assembly 710 supplies ink to the printhead assembly 702 and includes a reservoir 712 for storing ink. Thus, in one example, ink flows from the reservoir 712 to the printhead assembly 702. In one example, the printhead assembly 702 and the ink supply assembly 710 are housed together in an ink ejection or fluid ejection print cartridge or pen. In another example, the ink supply assembly 710 is separate from the printhead assembly 702 and supplies ink to the printhead assembly 702 through an interface connection 713, such as a supply tube and / or valve.

[0060] The carriage assembly 716 positions the printhead assembly 702 relative to the print media transport assembly 718, and the print media transport assembly 718 positions the print media 724 relative to the printhead assembly 702. Thus, a print zone 726 is defined as the area between the printhead assembly 702 and the print media 724 adjacent the nozzles. In one example, the printhead assembly 702 is a scanning printhead assembly such that the carriage assembly 716 moves the printhead assembly 702 relative to the print media transport assembly 718. In another example, the printhead assembly 702 is a non-scanning printhead assembly such that the carriage assembly 716 fixes the printhead assembly 702 in a prescribed position relative to the print media transport assembly 718.

[0061] The service station assembly 704 provides for priming, wiping, capping, and / or priming of the printhead assembly 702 to maintain the functionality of the printhead assembly 702, and more specifically, the functionality of the nozzles. For example, the service station assembly 704 can include a rubber blade or wiper that periodically passes over the printhead assembly 702 to wipe and clean the nozzles of excess ink. In addition, the service station assembly 704 can include a cap that covers the printhead assembly 702 to protect the nozzles from drying out during periods of non-use. Furthermore, the service station assembly 704 can include a spittoon into which the printhead assembly 702 ejects ink during priming to ensure that the reservoir 712 maintains an appropriate level of pressure and fluidity and to ensure that the nozzles do not become clogged or leak. The functions of the service station assembly 704 can include relative motion between the service station assembly 704 and the printhead assembly 702.

[0062] The electronic controller 720 communicates with the printhead assembly 702 through a communication path 703, with the service station assembly 704 through a communication path 705, with the carriage assembly 716 through a communication path 717, and with the print media transport assembly 718 through a communication path 719. In one example, the electronic controller 720 and the printhead assembly 702 can communicate through the carriage assembly 716 through a communication path 701 when the printhead assembly 702 is installed in the carriage assembly 716. The electronic controller 720 can also communicate with the ink supply assembly 710, whereby in one embodiment, a new (or used) ink supply can be detected.

[0063] The electronic controller 720 receives data 728 from a host system, such as a computer, and can include a memory for temporarily storing the data 728. The data 728 can be transmitted to the fluid ejection system 700 along an electronic, infrared, optical, or other information transmission path. The data 728 represents, for example, a document and / or file to be printed. Thus, the data 728 forms a print job for the fluid ejection system 700 and includes at least one print job command and / or command parameter.

[0064] In one example, the electronic controller 720 provides control of the printhead assembly 702, including control of the timing of ejection of drops of ink from the nozzles. Thus, the electronic controller 720 defines a pattern of ejected drops of ink that forms characters, symbols, and / or other graphics or images on the print media 724. The timing and pattern of ejected drops of ink are thus determined by the print job instructions and / or command parameters. In one example, logic and drive circuitry that forms part of the electronic controller 720 is located on the printhead assembly 702. In another example, logic and drive circuitry that forms part of the electronic controller 720 is located off of the printhead assembly 702.

[0065] While specific examples of the disclosure have been shown and described, various alternatives and / or equivalents to the specific examples discussed herein are possible. The application is intended to cover any adaptations or variations of the specific examples discussed herein. Therefore, it is intended that the disclosure be limited only by the claims and their equivalents.

Claims

1. An integrated circuit for a fluid ejection device, the fluid ejection device comprising a plurality of fluid actuation devices, the integrated circuit comprising: a digital circuit for outputting digital signals to an interface, the digital circuit comprising a memory unit; an analog circuit comprising a temperature sensor, the analog circuit for outputting analog signals to the interface; the interface comprising pads, the interface for selectively coupling the pads with the memory unit and selectively coupling the pads with the temperature sensor; and a timer for overriding the analog signals from the analog circuit on the interface in response to an elapse of the timer.

2. The integrated circuit of claim 1, further comprising: a pull-down device coupled with the interface, wherein the timer overrides the analog signals from the analog circuit on the interface by enabling the pull-down device.

3. The integrated circuit of claim 1 or 2, wherein the analog circuit comprises a crack detector.

4. The integrated circuit of claim 1 or 2, further comprising: a digital circuit for outputting digital signals to the interface; and control logic for enabling the digital circuit or the analog circuit, wherein the timer is for overriding the analog signals from the analog circuit on the interface or the digital signals from the digital circuit on the interface in response to an elapse of the timer. the digital circuit further comprises a configuration register or a shift register. the configuration register is for enabling or disabling the analog circuit and for enabling or disabling the timer.

5. The integrated circuit of claim 4, wherein, 7. A fluid ejection device comprising a plurality of fluid actuation devices and the integrated circuit of any of claims 1-6 to drive the plurality of fluid actuation devices.

6. The integrated circuit of claim 5, wherein, 8. An integrated circuit for a fluid ejection device, the fluid ejection device comprising a plurality of fluid actuation devices, the integrated circuit comprising: a data interface comprising pads, the data interface for selectively coupling the pads with a memory unit and selectively coupling the pads with a temperature sensor; an output interface; and a shift register for shifting firing data into the integrated circuit through the data interface and out of the integrated circuit through the output interface.

9. The integrated circuit of claim 8, further comprising: a configuration register storing data for enabling or disabling the shifting of the firing data out of the integrated circuit through the output interface.

10. The integrated circuit of claim 8 or 9, further comprising: an enable interface; and a delay circuit for receiving an enable signal through the enable interface and outputting a delayed enable signal through the output interface.

11. The integrated circuit of claim 10, further comprising: ​ ​ ​ ​ a configuration register storing data for enabling or disabling outputting of the delayed start signal through the output interface.

12. The integrated circuit of claim 8 or 9, further comprising: an analog circuit for outputting an analog signal to the output interface, the analog circuit comprising the temperature sensor; and control logic for enabling the analog circuit or the shift register to shift the jet data out of the integrated circuit through the output interface.

13. A fluid ejection device comprising a plurality of fluid actuation devices and the integrated circuit of any of claims 8-12 to drive the plurality of fluid actuation devices.

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