A method for preparing a toughened high temperature resistant epoxy resin prepreg

Abstract

The application relates to a preparation method of a toughened high-temperature-resistant epoxy resin prepreg, and particularly relates to a preparation method of a toughened high-temperature-resistant epoxy resin prepreg. The application aims to solve the problem that the toughness, modulus and heat resistance of the existing hot-melt prepreg high-temperature-resistant epoxy resin are contradictory to the high-modulus high-strength fiber, resulting in poor mechanical properties and interface properties of the composite material. The method comprises the following steps: S1, preparing a toughened high-temperature-resistant epoxy resin; and S2, preparing a prepreg. The toughened high-temperature-resistant epoxy resin prepared by the application has a relatively high glass transition temperature; the toughened high-temperature-resistant epoxy resin prepreg prepared by the application has good viscosity, coating property and mechanical property, and has a good application prospect in the fields of aviation, aerospace and ship. The application can obtain a toughened high-temperature-resistant epoxy resin prepreg.

Description

Technical Field

[0001] This invention relates to a method for preparing a prepreg, specifically a method for preparing a toughened, high-temperature resistant epoxy resin prepreg. Background Technology

[0002] Epoxy resins are widely used in composite materials due to their designable structure and properties. In recent years, with the development of the aerospace industry, the modulus and strength of domestically produced carbon fibers have continuously improved. However, the interfacial compatibility between these fibers and traditional epoxy resin toughening systems is poor, resulting in excessive stress concentration at the interface. This leads to premature debonding and failure of the composite material interface, thus affecting its mechanical properties. Therefore, the demand for strong, tough, and high-temperature resistant epoxy resins in composite products is becoming increasingly urgent.

[0003] However, traditional epoxy resin toughening methods (such as rubber elastomer toughening, interpenetrating polymer network toughening, inorganic nanoparticle toughening, core-shell particle toughening, and thermoplastic resin toughening) improve the toughness of the resin system, but most of them sacrifice the modulus and heat resistance of the resin system, thus limiting their application.

[0004] Therefore, it is necessary to conduct toughening research on high-temperature resistant epoxy resin systems to match them with high-modulus, high-strength fibers, thereby fully utilizing the fiber's performance and improving the mechanical and interfacial properties of the composite material. This will enhance the mechanical properties and structural load-bearing capacity of the composite material without sacrificing heat resistance. Summary of the Invention

[0005] The purpose of this invention is to solve the problem that the toughness, modulus, and heat resistance of existing hot-melt prepreg high-temperature resistant epoxy resins contradict the high-modulus and high-strength fibers, resulting in poor mechanical and interfacial properties of composite materials. Therefore, this invention provides a method for preparing a toughened and resilient high-temperature resistant epoxy resin prepreg.

[0006] Existing high-temperature resistant epoxy resins, after toughening, exhibit reduced modulus and heat resistance, resulting in insufficient compatibility with fibers and thus affecting the mechanical properties of the composite material. This invention provides a method for preparing a toughened high-temperature resistant epoxy resin prepreg. The resin and prepreg prepared by this method have simple processing, good adhesion and lay-up properties, and the composite material exhibits excellent mechanical properties, especially interlaminar shear strength, 90° tensile properties, and 90° compressive properties.

[0007] A method for preparing a toughened, high-temperature resistant epoxy resin prepreg is carried out according to the following steps:

[0008] I. Preparation of toughened, high-temperature resistant epoxy resin:

[0009] ① Add liquid epoxy resin and toughening modifier to a reaction vessel or three-necked flask, and stir for 3 to 6 hours at 80℃ to 160℃ to ensure that the toughening modifier is evenly dispersed in the liquid epoxy resin.

[0010] ② Cool the reaction vessel or three-necked flask to 50-130℃, then add molten epoxy resin, curing agent and reinforcing modifier, and stir at 80℃-100℃ for 0.5h-4h. Then add accelerator and stir at 80℃-100℃ for 0.1h-2h to obtain toughened high-temperature resistant epoxy resin.

[0011] The molten epoxy resin mentioned in step 1② is obtained by melting solid epoxy resin at 120℃~170℃ for 2h~6h;

[0012] The ratio of the mass of the toughening modifier mentioned in step 1① to the sum of the masses of liquid epoxy resin and molten epoxy resin is (1~25):100;

[0013] The mass ratio of the molten epoxy resin mentioned in step 1② to the liquid epoxy resin mentioned in step 1① is (15~60):(40~85), and the sum of the masses of the molten epoxy resin and the liquid epoxy resin is 100.

[0014] The mass ratio of the reinforcing modifier mentioned in step 1② to the sum of the masses of liquid epoxy resin and molten epoxy resin is (1~20):100;

[0015] The ratio of the mass of the curing agent and accelerator mentioned in step 1② to the sum of the masses of liquid epoxy resin and molten epoxy resin is (20~40):(0~5):100;

[0016] II. Preparation of prepreg:

[0017] ① Set the temperature of the coating machine's melting device to 50℃~85℃. The coating machine's melting device, which operates at a temperature of 50℃~85℃, will form a resin film from the toughened, high-temperature resistant epoxy resin.

[0018] ② Set the temperature of the hot roller of the prepreg machine to 50℃~100℃, and combine the resin film with the reinforcing material to obtain a toughened and high-temperature resistant epoxy resin prepreg.

[0019] The volume ratio of the toughened high-temperature resistant epoxy resin mentioned in step 2① to the reinforcing material mentioned in step 2② is (25~50):(50~75).

[0020] The beneficial effects of this invention are:

[0021] I. The process of this invention is simple, solvent-free, and can be used to prepare prepregs using a hot-melt process;

[0022] II. The toughened and high-temperature resistant epoxy resin prepared by this invention has a high glass transition temperature.

[0023] Third, the toughened and high-temperature resistant epoxy resin prepreg prepared by this invention has good adhesion, lay-up properties and mechanical properties, and has good application prospects in aerospace, shipbuilding and other fields.

[0024] IV. The areal density of the toughened, high-temperature resistant epoxy resin prepreg prepared by this invention is 100 g / m³. 2 ~300g / m 2 The fiber volume content is 55%–65%, and the gelation time is 20 min–50 min.

[0025] This invention provides a toughened, high-temperature resistant epoxy resin prepreg. Attached Figure Description

[0026] Figure 1 The figures are differential scanning calorimetry (DSC) spectra. Figure a is the dynamic mechanical thermal analysis spectrum of the untoughened high-temperature resistant epoxy resin prepared in Comparative Example 1, b is the dynamic mechanical thermal analysis spectrum of the toughened high-temperature resistant epoxy resin prepared in step one of Example 1, and c is the dynamic mechanical thermal analysis spectrum of the toughened high-temperature resistant epoxy resin prepared in step one of Example 2.

[0027] Figure 2 The figures show viscosity curves. Figure a is the viscosity-temperature curve of the untoughened high-temperature resistant epoxy resin prepared in Comparative Example 1, b is the viscosity-temperature curve of the toughened epoxy resin prepared in step one of Example 1, and c is the viscosity-temperature curve of the toughened epoxy resin prepared in step one of Example 2. Detailed Implementation

[0028] Specific Implementation Method 1: This implementation method describes a method for preparing a toughened, high-temperature resistant epoxy resin prepreg, which is completed according to the following steps:

[0029] I. Preparation of toughened, high-temperature resistant epoxy resin:

[0030] ① Add liquid epoxy resin and toughening modifier to a reaction vessel or three-necked flask, and stir for 3 to 6 hours at 80℃ to 160℃ to ensure that the toughening modifier is evenly dispersed in the liquid epoxy resin.

[0031] ② Cool the reaction vessel or three-necked flask to 50-130℃, then add molten epoxy resin, curing agent and reinforcing modifier, and stir at 80℃-100℃ for 0.5h-4h. Then add accelerator and stir at 80℃-100℃ for 0.1h-2h to obtain toughened high-temperature resistant epoxy resin.

[0032] The molten epoxy resin mentioned in step 1② is obtained by melting solid epoxy resin at 120℃~170℃ for 2h~6h;

[0033] The ratio of the mass of the toughening modifier mentioned in step 1① to the sum of the masses of liquid epoxy resin and molten epoxy resin is (1~25):100;

[0034] The mass ratio of the molten epoxy resin in step 1② to the liquid epoxy resin in step 1① is (15~60):(40~85), and the sum of the masses of the molten epoxy resin and the liquid epoxy resin is 100.

[0035] The mass ratio of the reinforcing modifier mentioned in step 1② to the sum of the masses of liquid epoxy resin and molten epoxy resin is (1~20):100;

[0036] The ratio of the mass of the curing agent and accelerator mentioned in step 1② to the sum of the masses of liquid epoxy resin and molten epoxy resin is (20~40):(0~5):100;

[0037] II. Preparation of prepreg:

[0038] ① Set the temperature of the coating machine's melting device to 50℃~85℃. The coating machine's melting device, which operates at a temperature of 50℃~85℃, will form a resin film from the toughened, high-temperature resistant epoxy resin.

[0039] ② Set the temperature of the hot roller of the prepreg machine to 50℃~100℃, and combine the resin film with the reinforcing material to obtain a toughened and high-temperature resistant epoxy resin prepreg.

[0040] The volume ratio of the toughened high-temperature resistant epoxy resin mentioned in step 2① to the reinforcing material mentioned in step 2② is (25~50):(50~75).

[0041] Specific Implementation Method Two: This implementation method differs from Specific Implementation Method One in that: the liquid epoxy resin mentioned in step one ① is one or more of phenolic epoxy resin, trifunctional epoxy resin, and polyfunctional epoxy resin; the solid epoxy resin mentioned in step one ② is one or more of phenolic epoxy resin, naphthyl epoxy resin, and biphenyl epoxy resin. The other steps are the same as in Specific Implementation Method One.

[0042] Specific Implementation Method Three: This implementation method differs from Specific Implementation Method One or Two in that the toughening modifier mentioned in step one ① is one or more of thermoplastic resin, core-shell nanoparticles, and self-assembled block copolymers. The other steps are the same as in Specific Implementation Method One or Two.

[0043] Specific Implementation Method Four: This implementation method differs from Specific Implementation Methods One to Three in that the thermoplastic resin is one or a mixture of several of the following: polyarylene ether sulfone, polyetherimide, polyether sulfone with active functional groups capped, polyarylene ether ketone, thermoplastic polyimide, polyetheramine-imide, and polyphenylene ether. The other steps are the same as in Specific Implementation Methods One to Three.

[0044] Specific Implementation Method Five: This implementation method differs from Specific Implementation Methods One to Four in that the self-assembled block copolymer has one or more of the following: the main chain is polybutyl acrylate, the side chain is polymethyl methacrylate copolymer, the main chain is butyl acrylate, and the side chain is polymethyl methacrylate copolymer with polar monomers. The other steps are the same as in Specific Implementation Methods One to Four.

[0045] Specific Implementation Method Six: This implementation method differs from Specific Implementation Methods One to Five in that: the reinforcing modifier mentioned in step one ② is an imidized polyimide resin or a low-melting-point bisphenol A type bismaleimide resin; the curing agent mentioned in step one ② is one or more of diaminodiphenylmethane, diaminodiphenyl sulfone, bis(p-aminophenyl)bisphenol A, and 1,3-bis(4-aminophenoxy)benzene. The other steps are the same as in Specific Implementation Methods One to Five.

[0046] Specific Implementation Method Seven: This implementation method differs from Specific Implementation Methods One to Six in that the accelerator mentioned in step one ② is one or more of imidazole accelerator, liquefied boron trifluoride, and boron trifluoride ethylamine. The other steps are the same as in Specific Implementation Methods One to Six.

[0047] Specific Implementation Method Eight: This implementation method differs from Specific Implementation Methods One to Seven in that: the toughened high-temperature resistant epoxy resin prepreg described in step two ② is cured to obtain a toughened high-temperature resistant epoxy resin composite material, wherein the curing temperature is 150℃~200℃ and the curing time is 4h~8h; the reinforcing material described in step two ② is reinforcing fiber or reinforcing fiber products. Other steps are the same as in Specific Implementation Methods One to Seven.

[0048] Specific Implementation Method Nine: This implementation method differs from Specific Implementation Methods One to Eight in that the reinforcing fiber is carbon fiber, glass fiber, quartz fiber, aramid fiber, boron fiber, basalt fiber, or polyimide fiber. The other steps are the same as in Specific Implementation Methods One to Eight.

[0049] Specific Implementation Method Ten: This implementation method differs from Specific Implementation Methods One to Nine in that the reinforcing fiber product is a reinforcing fiber fabric, continuous or discontinuous fiber felt. The other steps are the same as in Specific Implementation Methods One to Nine.

[0050] Example 1: A method for preparing a toughened, high-temperature resistant epoxy resin prepreg is carried out according to the following steps:

[0051] I. Preparation of toughened, high-temperature resistant epoxy resin:

[0052] ① Add 420g of high-temperature resistant epoxy resin MF-3285, 60g of AG-80 epoxy resin and 90g of polyetherimide to the reactor, and stir at 150℃ for 4h to uniformly disperse the polyetherimide in the epoxy resin.

[0053] ② Cool the reactor to 90℃, then add 120g of molten epoxy resin, 30g of imidized polyimide powder, 204g of 4,4'-diaminodiphenyl sulfone curing agent, and 36g of bis(p-aminophenyl)bisphenol A. Stir at 90℃ for 1 hour, then add 6g of imidazole accelerator and stir at 90℃ for 20 minutes to obtain a toughened, high-temperature resistant epoxy resin.

[0054] The molten epoxy resin mentioned in step 1② is obtained by melting F44 phenolic epoxy resin at 150°C for 2 hours;

[0055] II. Preparation of prepreg:

[0056] ① Set the temperature of the coating machine's melting device to 85℃. Use the coating machine's melting device at a temperature of 85℃ to make a resin film from the toughened, high-temperature resistant epoxy resin.

[0057] ② Set the temperature of the hot roller of the prepreg machine to 85℃, and combine the resin film with the fiber reinforcement material to obtain a toughened and high-temperature resistant epoxy resin prepreg.

[0058] The fiber reinforcement material mentioned in step 2② is SYT55G T800 grade carbon fiber;

[0059] The volume ratio of the toughened high-temperature resistant epoxy resin mentioned in step 2① to the reinforcing material mentioned in step 2② is 42.4:57.6;

[0060] ③ Curing the toughened high-temperature resistant epoxy resin prepreg to obtain a toughened high-temperature resistant epoxy resin prepreg unidirectional composite board;

[0061] The thickness of the toughened, high-temperature resistant epoxy resin prepreg unidirectional composite board mentioned in step 2③ is (0.1±0.02) mm;

[0062] The curing process described in step 2③ is as follows: cure at 150℃ for 2 hours, and then cure at 180℃ for 4 hours.

[0063] The high-temperature resistant epoxy resin MF-3285 described in Example 1 was purchased from Hubei Zhenzhengfeng New Materials Co., Ltd.

[0064] The AG-80 epoxy resin described in Example 1 was purchased from Shanghai Huayi Group Co., Ltd.

[0065] The imidized polyimide powder described in Example 1 was purchased from the Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences.

[0066] The imidazole accelerator described in Example 1 was purchased from: Lianyungang Bohua (Tianjin) Pharmaceutical Chemical Co., Ltd.;

[0067] The F44 phenolic epoxy resin described in Example 1 was purchased from Nantong Xingchen Synthetic Materials Co., Ltd.

[0068] The SYT55G T800 grade carbon fiber described in Example 1 was purchased from Zhongfu Shenying Carbon Fiber Co., Ltd.

[0069] Table 1 shows the physicochemical properties of the toughened high-temperature resistant epoxy resin prepared in step one of Example 1.

[0070] Table 1

[0071]

[0072]

[0073] Table 2 shows the mechanical properties of the toughened, high-temperature resistant epoxy resin prepreg unidirectional composite board prepared in step two of Example 1.

[0074] Table 2

[0075]

[0076] Example 2: A method for preparing a toughened, high-temperature resistant epoxy resin prepreg is carried out according to the following steps:

[0077] I. Preparation of toughened, high-temperature resistant epoxy resin:

[0078] ① Add 330g of epoxy resin S186, 30g of EBA-65 epoxy resin and 48g of polyarylether ketone to the reaction vessel, and stir at 150℃ for 4 hours to uniformly disperse the polyarylether ketone in the liquid epoxy resin.

[0079] ② Cool the reaction vessel to 100℃, then add 240g of molten epoxy resin, 60g of low-melting-point bismaleimide resin and 228g of diaminodiphenylmethane curing agent, and stir at 100℃ for 1 hour. Then add 3g of boron trifluoride ethylamine accelerator and stir at 100℃ for 10 minutes to obtain a toughened high-temperature resistant epoxy resin.

[0080] The molten epoxy resin mentioned in step 1② is obtained by melting F48 phenolic epoxy resin at 150°C for 2 hours;

[0081] II. Preparation of prepreg:

[0082] ① Set the temperature of the coating machine's melting device to 85℃. Use the coating machine's melting device at a temperature of 85℃ to make a resin film from the toughened, high-temperature resistant epoxy resin.

[0083] ② Set the temperature of the hot roller of the prepreg machine to 90℃, and combine the resin film with the fiber reinforcement material to obtain a toughened and high-temperature resistant epoxy resin prepreg.

[0084] The fiber reinforcement material mentioned in step 2② is SYT55G T800 grade carbon fiber;

[0085] The volume ratio of the toughened high-temperature resistant epoxy resin mentioned in step 2① to the fiber-reinforced material mentioned in step 2② is 41.3:58.7;

[0086] ③ Curing the toughened high-temperature resistant epoxy resin prepreg to obtain a toughened high-temperature resistant epoxy resin prepreg unidirectional composite board;

[0087] The thickness of the toughened, high-temperature resistant epoxy resin prepreg mentioned in step 2③ is (0.1±0.02) mm;

[0088] The curing process described in step 2③ is as follows: cure at 150℃ for 2 hours, and then cure at 180℃ for 4 hours.

[0089] The epoxy resin S186 described in Example 2 was purchased from Nantong Xinnaxi New Materials Co., Ltd.

[0090] The EBA-65 epoxy resin described in Example 2 was purchased from Shanghai Huayi (Group) Co., Ltd.

[0091] The low-melting-point bismaleimide resin structure described in Example 2 is as follows:

[0092]

[0093] The F48 phenolic epoxy resin described in Example 2 was purchased from Nantong Xingchen Synthetic Materials Co., Ltd.

[0094] The SYT55G T800 grade carbon fiber described in Example 2 was purchased from Zhongfu Shenying Carbon Fiber Co., Ltd.

[0095] Table 3 shows the physicochemical properties of the toughened high-temperature resistant epoxy resin prepared in step one of Example 2.

[0096] Table 3

[0097] Test Project <![CDATA[Areal density g / m 2 > Fiber volume content % gel time min Measured value 160.8 58.7 32

[0098] Table 4 shows the mechanical properties of the toughened, high-temperature resistant epoxy resin prepreg unidirectional composite board prepared in step two of Example 2.

[0099] Table 4

[0100]

[0101] Comparative Example 1: The preparation method of the untoughened high-temperature resistant epoxy resin prepreg is as follows: (The difference between this example and Example 2 is that the toughening modifier polyarylether ketone was not added, the reinforcing modifier low-melting-point bismaleimide resin was not added, and the accelerator boron trifluoride ethylamine was not added).

[0102] I. Preparation of untoughened high-temperature resistant epoxy resin:

[0103] 240g of F48 phenolic epoxy resin was melted at 150℃ for 2 hours and then added to a reactor. 330g of epoxy resin S186 and 30g of EBA-65 epoxy resin were then added and stirred at 100℃ for 1 hour. 228g of diaminodiphenylmethane curing agent was then added and stirred at 100℃ for 30 minutes to obtain untoughened high-temperature resistant epoxy resin.

[0104] II. Preparation of prepreg:

[0105] ① Set the temperature of the coating machine's melting device to 85℃. Use the coating machine's melting device at 85℃ to make a resin film from the untoughened high-temperature resistant epoxy resin.

[0106] ② Set the temperature of the hot roller of the prepreg machine to 90℃, and combine the resin film with the fiber reinforcement material to obtain untoughened high-temperature resistant epoxy resin prepreg;

[0107] The fiber reinforcement material mentioned in step 2② is SYT55G T800 grade carbon fiber;

[0108] The volume ratio of the untoughened high-temperature resistant epoxy resin mentioned in step 2① to the fiber-reinforced material mentioned in step 2② is 41.3:58.7;

[0109] ③ Curing the untoughened high-temperature resistant epoxy resin prepreg yields an untoughened high-temperature resistant epoxy resin prepreg unidirectional composite board.

[0110] The thickness of the high-temperature resistant epoxy resin prepreg mentioned in step 2③ is (0.1±0.02) mm;

[0111] The curing process described in step 2③ is as follows: cure at 150℃ for 2 hours, and then cure at 180℃ for 4 hours.

[0112] Table 5 shows the physicochemical properties of the untoughened high-temperature resistant epoxy resin pre-prepared in Comparative Example 1;

[0113] Table 5

[0114] Test Project <![CDATA[Areal density g / m 2 > Fiber volume content % gel time min Measured value 162.8 57.2 40

[0115] Table 6 shows the mechanical properties of the untoughened high-temperature resistant epoxy resin prepreg unidirectional composite board prepared in Comparative Example 1.

[0116] Table 6

[0117]

[0118] Figure 1 The figures are differential scanning calorimetry (DSC) spectra. Figure a is the dynamic mechanical thermal analysis spectrum of the untoughened high-temperature resistant epoxy resin prepared in Comparative Example 1, b is the dynamic mechanical thermal analysis spectrum of the toughened high-temperature resistant epoxy resin prepared in step one of Example 1, and c is the dynamic mechanical thermal analysis spectrum of the toughened high-temperature resistant epoxy resin prepared in step one of Example 2.

[0119] from Figure 1 It can be seen that the glass transition temperatures of curves a, b, and c are 207℃, 226℃, and 234℃, respectively. This indicates that the toughened epoxy resin system has a higher glass transition temperature than the untoughened epoxy resin system, and the heat resistance of the toughened epoxy resin system is improved.

[0120] Figure 2 The figures show viscosity curves. Figure a is the viscosity-temperature curve of the untoughened high-temperature resistant epoxy resin prepared in Comparative Example 1, b is the viscosity-temperature curve of the toughened epoxy resin prepared in step one of Example 1, and c is the viscosity-temperature curve of the toughened epoxy resin prepared in step one of Example 2.

[0121] from Figure 2 It can be seen that after toughening modification, the viscosity of the high-temperature resistant epoxy resin system increases significantly. For example, at 80℃, the viscosities of curves a, b, and c are 2155 mPa·s, 11873 mPa·s, and 11100 mPa·s, respectively; at 100℃, the viscosities of curves a, b, and c are 597 mPa·s, 3800 mPa·s, and 3400 mPa·s, respectively. The increase in viscosity can effectively control the problem of resin flow during the molding process of composite materials, ensure the resin content of the composite material, avoid the generation of interlayer defects, and thus further ensure the mechanical and structural stability of the composite material.

Claims

1. A method for preparing a toughened, high-temperature resistant epoxy resin prepreg, characterized in that... The preparation method is completed according to the following steps: I. Preparation of toughened, high-temperature resistant epoxy resin: ① Add liquid epoxy resin and toughening modifier to a reaction vessel or three-necked flask, and stir for 3 to 6 hours at 80℃ to 160℃ to ensure that the toughening modifier is evenly dispersed in the liquid epoxy resin. The toughening modifier mentioned in step 1① is polyarylether sulfone or polyetherimide; ② Cool the reaction vessel or three-necked flask to 50~130℃, then add molten epoxy resin, curing agent and reinforcing modifier, and stir at 80℃~100℃ for 0.5h~4h. Then add accelerator and stir at 80℃~100℃ for 0.1h~2h to obtain toughened high temperature resistant epoxy resin. The reinforcing modifier mentioned in step 1② is an imidized polyimide resin or a low-melting-point bisphenol A type bismaleimide resin; the structural formula of the low-melting-point bisphenol A type bismaleimide resin is: ； The molten epoxy resin mentioned in step 1② is obtained by melting solid epoxy resin at 120℃~170℃ for 2h~6h; The ratio of the mass of the toughening modifier mentioned in step 1① to the sum of the masses of liquid epoxy resin and molten epoxy resin is (1~25):100; The mass ratio of the molten epoxy resin mentioned in step 1② to the liquid epoxy resin mentioned in step 1① is (15~60):(40~85), and the sum of the masses of the molten epoxy resin and the liquid epoxy resin is 100. The mass ratio of the reinforcing modifier mentioned in step 1② to the sum of the masses of liquid epoxy resin and molten epoxy resin is (1~20):100; The ratio of the mass of the curing agent and accelerator mentioned in step 1② to the sum of the masses of liquid epoxy resin and molten epoxy resin is (20~40):(0~5):100; II. Preparation of prepreg: ① Set the temperature of the coating machine's melting device to 50℃~85℃. The coating machine's melting device, with a temperature of 50℃~85℃, will form a resin film from the toughened, high-temperature resistant epoxy resin. ② Set the temperature of the hot roller of the prepreg machine to 50℃~100℃, and combine the resin film with the reinforcing material to obtain a toughened and high-temperature resistant epoxy resin prepreg. The reinforcing material mentioned in step 2② is reinforcing fiber or reinforcing fiber product; The volume ratio of the toughened high-temperature resistant epoxy resin mentioned in step 2① to the reinforcing material mentioned in step 2② is (25~50):(50~75).

2. The method for preparing a toughened, high-temperature resistant epoxy resin prepreg according to claim 1, characterized in that... The liquid epoxy resin mentioned in step 1① is one or more of phenolic epoxy resin and multifunctional epoxy resin; the solid epoxy resin mentioned in step 1② is one or more of phenolic epoxy resin, naphthyl epoxy resin, and biphenyl epoxy resin.

3. The method for preparing a toughened, high-temperature resistant epoxy resin prepreg according to claim 1, characterized in that... The curing agent mentioned in step 1② is one or more of diaminodiphenylmethane, diaminodiphenyl sulfone, bis(p-aminophenyl)bisphenol A, and 1,3-bis(4-aminophenoxy)benzene.

4. The method for preparing a toughened, high-temperature resistant epoxy resin prepreg according to claim 1, characterized in that... The accelerator mentioned in step 1② is one or more of imidazole accelerator, liquefied boron trifluoride, and boron trifluoride ethylamine.

5. The method for preparing a toughened, high-temperature resistant epoxy resin prepreg according to claim 1, characterized in that... The reinforcing fiber is carbon fiber, glass fiber, quartz fiber, aramid fiber, boron fiber, basalt fiber, or polyimide fiber.

6. The method for preparing a toughened, high-temperature resistant epoxy resin prepreg according to claim 1, characterized in that... The reinforcing fiber product is a reinforcing fiber fabric, or a continuous or discontinuous fiber felt.

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