Device and method for eliminating bubbles in electroplating workpiece

Abstract

The present application is applicable to the field of electroplating technology, and provides a device and method for eliminating bubbles in electroplated workpieces. The electroplating device includes: a power supply, a flying target, a travel switch, an electroplating tank, and an ultrasonic device and / or a knocking device; the power supply is connected to the flying target and the electroplating anode to provide power for the electroplating process and the ultrasonic device; the flying target is connected to the travel switch and the electroplating cathode to take out the electroplating cathode; the travel switch is connected to the ultrasonic device to control the opening and closing of the ultrasonic device; the ultrasonic device is used to emit ultrasonic waves; the knocking device is connected to the power supply to knock the hanger of the electroplating cathode; the electroplating tank is used to place the electroplating anode and the electroplating cathode. The method of the present application can interlock the process of eliminating bubbles with the process of electroplating, thereby improving the bubble removal rate.

Description

Technical Field

[0001] The present application belongs to the field of electroplating technology, and in particular relates to a device and method for eliminating bubbles in an electroplated workpiece. Background Art

[0002] The main functions of electroplating are decorative, protective and functional. In addition to the electrodeposition of metal ions, the reaction of hydrogen ions receiving electrons to generate hydrogen will also occur, 2H++2e-=H2. Therefore, the current efficiency of the electroplating process is not 100%.

[0003] If the generated hydrogen bubbles are not discharged in time, the solution will not be able to contact the surface of the plated component, resulting in pinhole coating or partial failure of coating. In addition, if the plated component has small gaps, holes and other parts, the solution cannot penetrate into them and the coating will be missing.

[0004] Usually, a pneumatic or electric hammer is used to generate high-frequency vibration to knock out the bubbles, but this method has less force and some bubbles will still remain, and the bubble removal rate needs to be improved. Summary of the invention

[0005] In order to overcome the problems existing in the related art, the embodiments of the present application provide a device and method for eliminating bubbles in an electroplated workpiece, thereby solving the problem that the bubble removal rate needs to be improved.

[0006] This application is implemented through the following technical solutions:

[0007] In a first aspect, an embodiment of the present application provides a device for eliminating bubbles in an electroplated workpiece, comprising: a power supply, a flying target, a travel switch, an electroplating tank, and an ultrasonic device and / or a knocking device;

[0008] The power supply is connected to the target and the electroplating anode to provide power for the electroplating process and the ultrasonic device;

[0009] The flying target is connected with the travel switch and the electroplating cathode and is used to take out the electroplating cathode;

[0010] The travel switch is connected to the ultrasonic device and is used to control the opening and closing of the ultrasonic device;

[0011] The ultrasonic device is used to emit ultrasonic waves;

[0012] The striking device is connected to a power source and is used to strike the hanger of the electroplating cathode;

[0013] The electroplating tank is used to place the electroplating anode and the electroplating cathode.

[0014] In a possible implementation, the travel switch is located above the edge of the electroplating tank and is at a first preset distance from the electroplating tank;

[0015] When the flying target is located above the edge of the electroplating tank and the distance to the edge of the electroplating tank is less than or equal to the first preset distance, the flying target is in contact with the travel switch, and the travel switch is in a closed state;

[0016] When the distance between the flying target and the edge of the electroplating tank is greater than the first preset distance, the flying target is not connected to the travel switch, and the travel switch is in an open state.

[0017] In a possible implementation, the ultrasonic device includes an ultrasonic vibration plate and an ultrasonic control module;

[0018] The ultrasonic control module is connected to the travel switch and the ultrasonic vibration plate, and is used to control the vibration frequency and vibration time of the ultrasonic vibration plate;

[0019] The ultrasonic vibration plate is placed in the electroplating solution in the electroplating tank, at a second preset distance from the electroplating cathode, and is used to emit ultrasonic waves.

[0020] In a possible implementation, the vibration frequency of the ultrasonic vibration plate is in the range of 20-50 kHz.

[0021] In a possible implementation, the ultrasonic control module is connected to the power supply via a first switch, and the first switch is used to control the on / off connection between the ultrasonic control module and the power supply.

[0022] In a possible implementation, the power source is connected to the striking device via a second switch, which is also used to provide power to the striking device;

[0023] The second switch is used to control the on-off between the striking device and the power supply;

[0024] The striking device is used to strike the hanger of the electroplating cathode.

[0025] In one possible implementation, the knocking device includes an electroplated vibration solenoid valve and a knocking module;

[0026] The electroplating vibration solenoid valve is connected to the second switch and the knocking module, and is used to control the knocking frequency and knocking time of the knocking module;

[0027] The knocking module is located in the electroplating tank, at a third preset distance from the electroplating cathode, and is used for knocking the hanger of the electroplating cathode.

[0028] In a possible implementation, the striking module includes a pneumatic cavity and a striking hammer; the pneumatic cavity is used to drive the striking hammer to strike the hanger of the electroplating cathode.

[0029] In a second aspect, an embodiment of the present application provides a method for eliminating bubbles in an electroplated workpiece, comprising:

[0030] Connect the power supply to the target and the electroplating anode to provide power for the electroplating process and the ultrasonic device;

[0031] Connect the flying target with the travel switch and the electroplating cathode, and use the flying target to remove the electroplating cathode;

[0032] Connect the travel switch to the ultrasonic device, and use the travel switch to control the opening and closing of the ultrasonic device;

[0033] When the flying target clamps the electroplating cathode and places it in the electroplating tank, the flying target presses the travel switch to control the ultrasonic device to start, and the ultrasonic device emits ultrasonic waves.

[0034] In a possible implementation, the method for eliminating bubbles in an electroplated workpiece further includes:

[0035] The power supply is connected to the striking device via a second switch, and the power supply provides electrical energy to the striking device;

[0036] After the second switch controls the connection between the knocking device and the power supply, the knocking device knocks the hanger of the electroplating cathode;

[0037] After turning off the knocking device, the ultrasonic vibration plate in the ultrasonic device is placed in the plating liquid in the plating tank. The ultrasonic control module in the ultrasonic device controls the ultrasonic vibration plate to emit ultrasonic waves to eliminate the bubbles in the plating cathode again; the ultrasonic control module is used to control the vibration frequency and vibration time of the ultrasonic vibration plate.

[0038] It can be understood that the beneficial effects of the second aspect mentioned above can be found in the relevant description of the first aspect mentioned above, and will not be repeated here.

[0039] Compared with the prior art, the embodiments of the present invention have the following beneficial effects:

[0040] In the embodiment of the present application, a travel switch for controlling the ultrasonic device is connected to the flying target. During the process of taking and placing the electroplating cathode on the flying target, the travel switch is opened and closed, thereby controlling the opening and closing of the ultrasonic device. This can interlock the process of eliminating bubbles and the process of electroplating, thereby improving the bubble removal rate.

[0041] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present specification. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0043] Figure 1It is a schematic structural diagram of a device for eliminating bubbles in an electroplated workpiece provided by an embodiment of the present application;

[0044] Figure 2 is a schematic diagram of a connection relationship including an ultrasonic device provided in an embodiment of the present application;

[0045] Figure 3 It is a schematic diagram of the connection relationship including the knocking device provided in one embodiment of the present application. DETAILED DESCRIPTION

[0046] In the following description, specific details such as specific system structures, technologies, etc. are provided for the purpose of illustration rather than limitation, so as to provide a thorough understanding of the embodiments of the present application. However, it should be clear to those skilled in the art that the present application may also be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted to prevent unnecessary details from obstructing the description of the present application.

[0047] It should be understood that when used in the present specification and the appended claims, the term "comprising" indicates the presence of described features, wholes, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components and / or combinations thereof.

[0048] It should also be understood that the term “and / or” used in the specification and appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0049] As used in the specification and appended claims of this application, the term "if" can be interpreted as "when" or "uponce" or "in response to determining" or "in response to detecting", depending on the context. Similarly, the phrase "if it is determined" or "if [described condition or event] is detected" can be interpreted as meaning "uponce it is determined" or "in response to determining" or "uponce [described condition or event] is detected" or "in response to detecting [described condition or event]", depending on the context.

[0050] In addition, in the description of the present application specification and the appended claims, the terms "first", "second", "third", etc. are only used to distinguish the descriptions and cannot be understood as indicating or implying relative importance.

[0051] References to "one embodiment" or "some embodiments" etc. described in the specification of this application mean that one or more embodiments of the present application include specific features, structures or characteristics described in conjunction with the embodiment. Therefore, the statements "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. that appear in different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways.

[0052] The present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0053] Figure 1 Schematic diagram of the structure of the device for eliminating bubbles in electroplating workpieces provided in one embodiment of the present application, referring to Figure 1 The device for eliminating bubbles from electroplating workpieces is described in detail as follows:

[0054] The embodiment of the present application provides a device for eliminating bubbles in an electroplated workpiece, including: a power supply 100 , a flying target 200 , a limit switch 300 , an electroplating tank 400 , and an ultrasonic device 500 and / or a knocking device 600 .

[0055] The target 200 is connected to the travel switch 300 and the electroplating cathode 700, and is used to take out the electroplating cathode 700. The travel switch 300 is connected to the ultrasonic device 500, and is used to control the opening and closing of the ultrasonic device 500. The power supply 100 is connected to the target 200 and the electroplating anode 800, and is used to provide power for the electroplating process and the ultrasonic device 500. The ultrasonic device 500 is used to emit ultrasonic waves. The knocking device 600 is connected to the power supply 100, and is used to knock the hanger of the electroplating cathode. The electroplating tank 400 is used to place the electroplating anode 800 and the electroplating cathode 700.

[0056] Exemplarily, the upper portion of the flying target 200 is convenient for the robot arm to grasp and realize the picking and placing of the electroplated workpiece.

[0057] For example, the electroplated workpiece is suspended on the hanger of the electroplating cathode 700. If there is a small gap in the electroplated workpiece, such as a gap of 0.1 mm, it is difficult for the gas inside to be discharged. Due to surface tension and other reasons, it is difficult for the solution to penetrate into the liquid. By vibrating the liquid, it is difficult to discharge the bubbles. The bubbles left in the gap of the electroplated workpiece lead to the loss of the gold plating layer. By adding ultrasound to the electroplating solution, the bubbles in the gap can be eliminated.

[0058] Specifically, the travel switch 300 is located above the edge of the electroplating tank 400 and is at a first preset distance from the electroplating tank 400. When the target 200 is located above the edge of the electroplating tank 400 and the distance to the edge of the electroplating tank 400 is less than or equal to the first preset distance, the target 200 is in contact with the travel switch 300, and the travel switch 300 is in a closed state. When the distance between the target 200 and the edge of the electroplating tank 400 is greater than the first preset distance, the target 200 is not connected to the travel switch 300, and the travel switch 300 is in an open state.

[0059] Exemplarily, the first preset distance may be a range, within which the target 200 and the travel switch 300 are in contact connection.

[0060] Exemplarily, the travel switch 300 and the target 200 are at a fixed distance in the vertical direction. When the robot arm grabs the target 200 and puts the target 200 into the electroplating tank 400, the fixed distance can ensure that the target 200 presses down the travel switch 300. At this time, when the power supply 100 is turned on, the ultrasonic device 500 also starts to work at the same time as the electroplating starts, eliminating the bubbles generated during the electroplating process and the bubbles brought into the solution by the plated workpiece, rather than just starting to remove the bubbles after the electroplating or after a period of electroplating, so as to achieve the purpose of linking the ultrasonic vibration process with the electroplating process, which can greatly reduce the bubbles in the workpiece.

[0061] Specifically, the ultrasonic device 500 may include an ultrasonic control module 501 and an ultrasonic vibration plate 502. Figure 2 shown.

[0062] The ultrasonic control module 501 is connected to the travel switch 300 and the ultrasonic vibration plate 502, and is used to control the vibration frequency and vibration time of the ultrasonic vibration plate 502. The ultrasonic vibration plate 502 is placed in the plating solution in the plating tank 400, and is at a second preset distance from the plating cathode 700, and is used to emit ultrasonic waves.

[0063] Exemplarily, the ultrasonic vibration plate 502 is at a second preset distance from the electroplating cathode 700 , and the distance may be a range, through which it is ensured that the ultrasonic waves emitted by the ultrasonic vibration plate 502 do not affect the electroplating process and achieve the best effect of removing bubbles.

[0064] Exemplarily, the vibration frequency of the ultrasonic vibration plate 502 ranges from 20 to 50 kHz. Through experiments and calculations, when the vibration frequency of the ultrasonic vibration plate 502 is a medium frequency non-standard ultrasonic vibration plate 502 frequency of 20 to 50 kHz, the bubble removal rate is higher.

[0065] In one embodiment, the ultrasonic control module 501 and the power supply 100 can be connected via a first switch, and the first switch is used to control the on-off between the ultrasonic control module 501 and the power supply 100. That is, the ultrasonic device 500 is connected to the backup circuit, and when the travel switch 300 has a problem and cannot be replaced in time, the first switch can be manually pressed so that the ultrasonic device 500 can continue to be used.

[0066] The first switch may also be integrated on the power supply 100 , and the ultrasonic device 500 may be turned on by simply pressing one button of the power supply 100 .

[0067] Specifically, the power source 100 is connected to the striking device 600 via a second switch 900, and is also used to provide electrical energy to the striking device 600. Figure 3 The second switch 900 is used to control the on-off between the knocking device 600 and the power source 100. The knocking device 600 is used to knock the hanger of the electroplating cathode 700.

[0068] Exemplarily, when the second switch 900 is normally closed, the knocking device 600 is automatically turned on at the beginning of the electroplating process, thereby achieving the purpose of linking the knocking vibration process with the electroplating process.

[0069] Specifically, the knocking device 600 includes an electroplated vibration solenoid valve and a knocking module.

[0070] The electroplating vibration solenoid valve is connected to the second switch 900 and the knocking module, and is used to control the knocking frequency and knocking time of the knocking module. The knocking module is located in the electroplating tank 400, at a third preset distance from the electroplating cathode 700, and is used to knock the hanger of the electroplating cathode 700.

[0071] Specifically, the striking module includes a pneumatic cavity and a striking hammer; the pneumatic cavity is used to drive the striking hammer to strike the hanger of the electroplating cathode 700.

[0072] Exemplarily, the pneumatic chamber is composed of a non-standard pneumatic device, which can complete the knocking action in a very short time, generally 0.1 seconds.

[0073] Exemplarily, the purpose of removing bubbles by ultrasonic wave can be achieved through the power supply 100, the target 200, the travel switch 300, the ultrasonic device 500 and the electroplating tank 400. The purpose of removing bubbles by knocking can be achieved through the power supply 100, the target 200, the second switch 900, the knocking device 600 and the electroplating tank 400. The purpose of removing bubbles by ultrasonic wave and knocking can be achieved through the power supply 100, the target 200, the travel switch 300, the ultrasonic device 500, the second switch 900, the bridge device and the electroplating tank 400.

[0074] Exemplary, the device for eliminating bubbles of electroplated workpieces of the present invention can be used in nickel plating or gold plating processes. By putting the device into production tests, bubbles in local hollow holes and local core corners of workpieces can be eliminated, thus avoiding the scrapping of tens of thousands of products.

[0075] It can be seen that the device for eliminating electroplated workpieces of the present invention connects the travel switch 300 that controls the ultrasonic device 500 to the flying target 200, and realizes the opening and closing of the travel switch 300 during the process of the flying target 200 taking and placing the electroplating cathode 700, thereby controlling the opening and closing of the ultrasonic device 500; and eliminates the bubbles generated in the electroplating process and the bubbles brought into the solution by the plated workpiece by driving the knocking hammer directly to knock the electroplating cathode 700 hanger through the pneumatic cavity; the above method can link the process of eliminating bubbles with the process of electroplating, thereby improving the bubble removal rate.

[0076] The embodiment of the present application provides a method for eliminating bubbles in an electroplated workpiece based on the above-mentioned device for eliminating bubbles in an electroplated workpiece, comprising: connecting a power supply 100 to a flying target 200 and an electroplating anode 800 to provide power for the electroplating process and an ultrasonic device 500. Connecting the flying target 200 to a travel switch 300 and an electroplating cathode 700, and using the flying target 200 to remove the electroplating cathode 700. Connecting the travel switch 300 to the ultrasonic device 500, and using the travel switch 300 to control the opening and closing of the ultrasonic device 500. When the flying target 200 clamps the electroplating cathode 700 and places it in the electroplating tank 400, the flying target 200 presses the travel switch 300 to control the ultrasonic device 500 to turn on, and the ultrasonic device 500 emits ultrasonic waves.

[0077] Specifically, the method for eliminating bubbles in the electroplating workpiece also includes: connecting the power supply 100 and the knocking device 600 through the second switch 900, and the power supply 100 provides power to the knocking device 600. After the second switch 900 controls the connection between the knocking device 600 and the power supply 100, the knocking device 600 knocks the hanger of the electroplating cathode 700. After the knocking device 600 is turned off, the ultrasonic vibration plate 502 in the ultrasonic device 500 is placed in the electroplating solution in the electroplating tank 400, and the ultrasonic control module 501 in the ultrasonic device 500 controls the ultrasonic vibration plate 502 to emit ultrasonic waves to eliminate the bubbles in the electroplating cathode 700 again; the ultrasonic control module 501 is used to control the vibration frequency and vibration time of the ultrasonic vibration plate 502.

[0078] Exemplarily, the knocking device 600 and the ultrasonic device 500 are combined to use knocking vibration to remove bubbles and ultrasonic vibration to remove bubbles successively or simultaneously, so that bubbles can be removed more thoroughly and the bubble removal rate can be improved.

[0079] It can be understood that the beneficial effects of the above method for eliminating bubbles in electroplated workpieces can be found in the relevant description in the above embodiment of the device for eliminating bubbles in electroplated workpieces, and will not be repeated here.

[0080] It should be understood that the size of the serial numbers of the steps in the above embodiments does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

[0081] The embodiments described above are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, a person skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. A device for eliminating bubbles from electroplated workpieces, characterized in that: include: Power supply, target, travel switch, electroplating tank, ultrasonic device and knocking device; The power supply is connected to the target and the electroplating anode, and is used to provide power for the electroplating process and the ultrasonic device; The flying target is connected to the travel switch and the electroplating cathode and is used for taking and placing the electroplating cathode; The travel switch is connected to the ultrasonic device and is used to control the opening and closing of the ultrasonic device; the travel switch is located above the edge of the electroplating tank and is at a first preset distance from the electroplating tank; When the target is located above the edge of the electroplating tank and the distance to the edge of the electroplating tank is less than or equal to the first preset distance, the target is in contact with the travel switch, and the travel switch is in a closed state; when the distance between the target and the edge of the electroplating tank is greater than the first preset distance, the target is not connected to the travel switch, and the travel switch is in an open state; The ultrasonic device is used to emit ultrasonic waves; The knocking device is connected to the power supply and is used to knock the hanger of the electroplating cathode; The electroplating tank is used for placing the electroplating anode and the electroplating cathode.

2. The device for eliminating bubbles from an electroplated workpiece as claimed in claim 1, characterized in that: The ultrasonic device includes an ultrasonic vibration plate and an ultrasonic control module; The ultrasonic control module is connected to the travel switch and the ultrasonic vibration plate, and is used to control the vibration frequency and vibration time of the ultrasonic vibration plate; The ultrasonic vibration plate is placed in the electroplating solution in the electroplating tank, at a second preset distance from the electroplating cathode, and is used to emit ultrasonic waves.

3. The device for eliminating bubbles from an electroplated workpiece as claimed in claim 2, characterized in that: The vibration frequency of the ultrasonic vibration plate is in the range of 20-50 kHz.

4. The device for eliminating bubbles from an electroplated workpiece as claimed in claim 2, characterized in that: The ultrasonic control module is connected to the power supply via a first switch, and the first switch is used to control the on / off between the ultrasonic control module and the power supply.

5. The device for eliminating bubbles from an electroplated workpiece as claimed in claim 1, characterized in that: The power source is connected to the striking device via a second switch, and is also used to provide electrical energy to the striking device; The second switch is used to control the on / off between the striking device and the power supply; The knocking device is used for knocking the hanger of the electroplating cathode.

6. The device for eliminating bubbles from an electroplated workpiece as claimed in claim 5, characterized in that: The knocking device includes an electroplated vibration solenoid valve and a knocking module; The electroplating vibration solenoid valve is connected to the second switch and the knocking module, and is used to control the knocking frequency and knocking time of the knocking module; The knocking module is located in the electroplating tank, at a third preset distance from the electroplating cathode, and is used to knock on the hanger of the electroplating cathode.

7. The device for eliminating bubbles from an electroplated workpiece as claimed in claim 6, characterized in that: The striking module comprises a pneumatic cavity and a striking hammer; the pneumatic cavity is used to drive the striking hammer to strike the hanger of the electroplating cathode.

8. A method for eliminating bubbles from an electroplated workpiece, applied to the device for eliminating bubbles from an electroplated workpiece as claimed in any one of claims 1 to 7, characterized in that: include: Connect the power supply to the target and the electroplating anode to provide power for the electroplating process and the ultrasonic device; Connecting the flying target with a travel switch and an electroplating cathode, and using the flying target to take and place the electroplating cathode; The travel switch is connected to the ultrasonic device, and the travel switch is used to control the opening and closing of the ultrasonic device; the travel switch is located above the edge of the electroplating tank and is at a first preset distance from the electroplating tank; When the target is located above the edge of the electroplating tank and the distance to the edge of the electroplating tank is less than or equal to the first preset distance, the target is in contact with the travel switch, and the travel switch is in a closed state; when the distance between the target and the edge of the electroplating tank is greater than the first preset distance, the target is not connected to the travel switch, and the travel switch is in an open state; When the flying target clamps the electroplating cathode and places it in the electroplating tank, the flying target presses the travel switch to control the ultrasonic device to start, and the ultrasonic device emits ultrasonic waves.

9. The method for eliminating bubbles from an electroplated workpiece as claimed in claim 8, wherein: Also includes: A power source is connected to the striking device via a second switch, and the power source provides electrical energy to the striking device; After the second switch controls the connection between the knocking device and the power supply, the knocking device knocks the hanger of the electroplating cathode; After turning off the knocking device, the ultrasonic vibration plate in the ultrasonic device is placed in the plating liquid in the plating tank, and the ultrasonic control module in the ultrasonic device controls the ultrasonic vibration plate to emit ultrasonic waves to eliminate the bubbles in the plating cathode again; the ultrasonic control module is used to control the vibration frequency and vibration time of the ultrasonic vibration plate.

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